A Significant Step Forward In Processor Graphics Performance
The Intel® Xeon® processor E3-1200 v3 product family is built on
Intel’s 22nm process using 3D Tri-Gate transistors. The new Intel® HD
Graphics P4600
1
is considered to be an advancement of the previousgeneration Intel® HD Graphics technologies that were first introduced
in 2010. Each version including the new Intel HD graphics P4600 represents not a copy of the previous design, but an improvement, and
today represents a new high-end offering of processor-based graphics
for entry-level workstations. It offers an integrated ring bus technology that connects all CPU components (computational cores, L3 cache,
graphics, and system agent with the memory controller) to enable an
optimized approach of communicating with the system memory –
via the fast L3 cache. The Intel HD Graphics P4600 processor-based
graphics will support Microsoft DirectX11.1,* OpenGL* 4.0, OpenCL* 1.2
and DirectCompute 5.0 standards. In addition to improvements in
both 2D and 3D graphics performance, Intel® Quick Sync Video 2.0
technology almost doubles the H.264 transcoding speed of its
predecessors and now supports up to 4K display resolutions. The
graphics core microarchitecture improvements have produced
noticeable improvement in 3D performance, of as much as 25%
2
via 20 execution units and L3 cache.
If your systems are to be employed by users of applications like
the Autodesk AutoCAD*/Inventor*/Revit*; Adobe Premiere,* Adobe
Photoshop,* After Effects,* SolidWorks* and other similar volume
professional software applications, the Intel Xeon processor E3-1200
v3 product family with Intel HD Graphics P4600 offers competitive
performance to entry-level professional discrete graphics cards.
The Intel Xeon processor E3-1200 v3 product family with Intel HD
Graphics P4600 represents a significant evolution for graphics and
media capabilities. Updates to processor graphics include:
• Significant 3D enhancements include Microsoft DirectX11, hardware
tessellation, two programmable stages (HS and DS) and one fixedfunction Tessellator as well as new compressed texture format
support for BC6H/7.
• More key changes include:
– Increased number of Execution Units
– Enhanced compute shader support for data parallelism, UAVs,
atomics, barriers
– Improved shared local memory for compute shaders
– Support for scatter gather
– Provision for shader model 5.1 (new DX11 instructions)
– Improved geometry performance
– Increase in Hi-Z performance
Core
Core
Core
Core
Processor
LLC
LLC
LLC
LLC
Graphics
• A scalable architecture partitioned into 5 domains consisting of:
– Global assets: Includes geometry front-end up to setup
– Slice common: Includes rasterizer, L3$ and pixel back-end
– Slice: shaders (EUs), IC$, samplers, Addrs Gen
– CODEX and media
– Displays
Media Block
VDBOX
VEBOX
Processor Graphics Components
EU
EU
EU
EU
EU
EU
…
EU
EU
EU
EU
EU
EU
Sampler
Sampler
Sampler
…
…
…
…
…
Table 1. Graphics Comparison Table
SPECIFICATIONSINTEL® HD GRAPHICS P4600
Processor Support
Intel® Xeon® processor E3-1200 v3 family
(12X5 series)
3
Processor BasedYesYes
ECC Memory Support YesNo
Optimized and certied for professional applicationsYesNo
Processor Clock SpeedUp to 4.0 GHzUp to 3.9 GHz
Intel® Turbo Boost Technology 2.0
4
SupportYesYes
Execution Units2020/16
Shared L3 CacheYesYe s
Graphics Frequency (MAX)Up to 1300 MHzUp to 1200 MHz
Max Dynamic Video Memory (Vista*/Windows* 7
for 1 GB/2 GB/>4 GB System Memory)256 MB/>783 MB/1692 MB256 MB/>783 MB/1692 MB
Intel® HD P460 0 introduces 4 a dditional exec ution units go ing from 16 in the In tel® HD P400 0 to 20 in the Intel H D P4600. Opti mized Intel® HD Grap hics P4600 on ly available on se lect models of t he Intel® Xeon® processor E3-1200 v3 product
family. For more information, visit http://www.intel.com/content/www/us/en/architecture-and-technology/hd- graphics/hd-graphicsdeveloper.
2
There are 25% m ore execution un its associate d with the new Int el® HD Grap hics P4600.
3
Optimized Intel® HD Grap hics P4600 on ly available on se lect models of t he Intel® Xeon® proce ssor E3 family. To lear n more about Inte l® Xeon® processors for workstation visit www.intel.com/go/workstation.
4
Requires a syst em with Intel® Turbo Boos t Techn ology. Intel Turbo Bo ost Technology an d Intel Turbo Boost Techn ology 2.0 are on ly available on se lect Intel® processors. Consult your system manufacturer. Performance varies depending on
hardwar e, software, and syst em conguration. For more inf ormation, visit http://www.intel.co m/go/turbo.
5
Available on select Intel® Core™ and Intel® Xeon® processors. Requires an Intel® HT Technology enabled sys tem, check with your PC man ufacturer. Perfo rmance will vary depending on the specic hardw are and software us ed. Not available on
®
Core™ i5-750. For more information including details on which processors support HT Technology, visit http://www.intel.com/info/hyperthreading.
Intel
Performanc e tests an d rati ngs are measured using speci c comp uter systems and/or co mponents and ree ct the approximate perfor mance of Intel produc ts as measured by those tests. Any dif ference in system har dware or softwar e desi gn or
cong uration may affec t actual performanc e. Buyers should con sult other source s of infor mation to evaluate the pe rformance of sys tems or component s they are conside ring purchasing. For more info rmation on performanc e tests and on the
performance of Intel products, reference www.intel.com/software/products.
Software and wor kloads used in perf ormance tests may have been optim ized for perform ance only on Intel micr oprocessor s. Per formance tests , such as SYSm ark and MobileMa rk, are measured usin g spec ic computer systems, component s,
soft ware, operati ons and functi ons. Any change t o any of those fact ors may cause the r esults to var y. You shoul d consult othe r informatio n and perform ance tests to as sist you in fully ev aluating your c ontemplated pu rchases, inc luding the
perf ormance of that p roduct when c ombined with o ther product s.
Intel may make changes to specications and product de scriptions at any tim e, without notice. Designe rs must not rely on the absenc e or character istics of any feature s or instr uctions marked “reser ved”
or “unde ned.” Intel reserves these for fut ure denition and sh all have no responsibility what soever for conic ts or incompatibi lities arising fr om future changes to th em. The informati on here is subject
to change wi thout notice. Do not nalize a desig n with th is information. The produc ts described in thi s docu ment may contain desi gn defects or errors known as errata which may cause the product
to deviate fr om published specicat ions. Current char acterized errata are availa ble on request. Cont act your local Intel sales ofce or your dist ributor to obtain the la test specicat ions and before
placin g your product or der. Copies of doc uments which h ave an order numbe r and are referenc ed in this docu ment, or other In tel literature, m ay be obtained by c alling 1-80 0-548 -4725, or by
visiti ng Intel’s Web Site w ww.intel.co m/.