BX400ii Interposer Board
User’s Manual
March 29, 2000
Order Number: 273224-003
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Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The BX400ii may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current
characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling
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Copyright © Intel Corporation, 2000
*Other brands and names are the property of their respective owners.
User’s Manual
BX400ii I nterposer Board
Contents
1.0 Introduction......................................................................................................................... 5
1.1 Key Terms.............................................................................................................5
1.2 Related Documents...............................................................................................5
1.3 Pentium
Low Power Pentium II Processor Module .............................................................6
1.4 BX400ii Interposer Board Features.......................................................................6
1.5 BX400ii Interposer Board Dim ens ions ..................................................................8
2.0 Getting Started...................................................................................................................9
2.1 Unpacking Instructions..........................................................................................9
2.1.1 ImportantStatic Electricity Precautions.................................................... 9
2.2 Installation.............................................................................................................9
2.2.1 BX 400ii.....................................................................................................9
2.2.2 Emulator/Logic Analyzer ........................................................................10
3.0 Hardware Reference........................................................................................................ 11
3.1 Connector Definitions..........................................................................................11
3.2 Jumper Settings..................................................................................................11
3.2.1 Voltage Regulator Settings.....................................................................11
3.3 Test Points .......................................................................................................... 12
® II Processor Mobile Module: Mobile Module Connector 2 or
Figures
Tables
1 Top V iew of BX400ii Interposer Board Assembly..................................................7
2 BX400ii Keepout Space Requirements.................................................................8
3 BX400ii Connector C learance...............................................................................8
4 BX400ii Interposer Board Stack Mounting ..........................................................10
5 BX400ii Board Layout Drawing ...........................................................................13
1 Related Documents............................................................................................... 5
2 Vendor Reference.................................................................................................5
3 Voltage Regulator Jumper Settings.....................................................................11
4 Power Measurement Header Desc riptions..........................................................12
User’s Manual 3
1.0 Introduction
This doc ument introduces the BX400ii Interposer Board and provides installation instructions.
The BX400ii Interposer Board with the Intel
functionality of the Intel
®
Pentium®II Processor Mobile Module to provide a bus interconnect for
emulation and logic analysis tools. This board is used for Intel Pentium II Processor Mobile
Module system designs.
Note: Due t o additional signal loading and trace lengths, the BX400ii Interposer Board may not function
in all system designs.
1.1 Key Terms
LPM refers to the Intel®Low Power Pentium®II Processor module. This m odule is identical to
the Intel Pentium II Processor Mobile Module Connector (MMC-2). A complete description of this
module is located in the Intel
®
2(MMC-2)datasheet (http://developer.intel.com/design/mobile/datashts).
82443BX refers to the Intel82443BX Host Bridge Controller.
1.2 Related Documents
Table 1. Related Documents
®
Intel
Pentium®II Processor Mobile Module: Mobile Module Connector2 (MMC-2) datasheet 243668
®
Pentium®II Processor at 233 MHz, 266 MHz and 300 MHz datasheet 243669
Intel
®
Mobile Pentium
®
440BX AGPset: 82443BX Host Bridge/Controller datasheet 290633
Intel
II Processor Specification Update 243887
®
Mobile Pentium®II Processor emulates the
Pentium®II Processor Mobile Module: Mobile Module Connector
Document Order #
Table 2. Vendor Reference
American Arium
Applied MicrosystemsCorporation
Hewlet Packard
Microtek International
Tektronix
Ironwood Electronics (for adapters only)
† Intel does not endorse or recommend third-party vendors.
†
Vendor Name Contact Information
(714) 731-1661
http://www.arium.com/aaprod.htm
(800) 426 3925
http:/www.amc.com
(800) 452-4844
http://www.tmo.hp.com
(800) 886-7333
http://www.microtekintl.com
(800) TEK-WIDE
http://www.tek.com
(800) 404-0204
http://www.ironwoodelectronics.com
BX400ii Interposer Board User’s Manual 5
Introduction
1.3 Pentium®II Processor Mobile Module: Mobile Module
Connector 2 or Low Power Pentium II Processor Module
The Pentium II Processor Mobile Module: Mobile Module Connector 2 (400-pin MMC-2) or Low
Power P entium II ProcessorModule (LPM) is a small, highly integrated assembly containing an
Intel Pentium II processor and its immediate system-level support. Specifically, the processor
module contains a power regulator, level 2 (L2) cache memory, and the c ore logic required to
bridge the processor to standard system buses. The module interfaces electrically to its host system
via a 3.3 V PCI bus, a 3.3 V memory bus and some Intel 82443BX Host Bridge Controller signals.
Refer to Table 1 for a list of related documents.
1.4 BX400ii Interposer Board Features
The BX4000ii Interposer Board c ontains t he same system level support provided by the Pentium II
processor mobile module with a few exceptions.
• It includes a 240-pin connector for the Mobile Pentium II processor in mini-cartridge
• It provides two additional interfaces for debug tools:
— 30-pin debug port connector
— 190-pin processor system bus connector
6 BX400iiInterposer Board User’s Manual
Figure 1. Top View of BX400ii Interposer Board Assembly
Mobile Pentium® II Processor in Minicartridge
30-Pin Debug Port Connector
190-Pin
System Bus
Connector
Introduction
82443BX Host
Bridge Controller
Dashed line
indicates
400-Pin LPM
Connector
on underside
A6366-01
The same 400-pin system interface is still provided to allow connection to the target system. In
addition, a top side 240-pin connection is added for the Intel Mobile Pentium II Processor in minicartridge. This processor, plus the BX400ii Interposer Board, provides compatible functionality
with the Pentium II processor Mobile Module.
The 30-pin debug port connector connects to the run control cable, or debug port, of the emulator
or logic analyzer. The 190-pin processorsystem bus connector connects directly to the e mulator or
logic analyzer bus preprocessor. This connection allows for full bus trace and triggering. Contact
your emulator or logic analyzer vendor for specific tool capabilities. See Table 2 for a reference list
of vendors.
BX400ii Interposer Board User’s Manual 7
Introduction
1.5 BX400ii Interposer Board Dimensions
This section provides the physical dimensions for the BX400ii Interposer Board.
Note: Notice in Fi gure 2 the mechanical clearance requirements for the BX400ii Interposer Board
comparedto the Low Power Module (LPM).
Figure 2. BX400ii Keepout Space Requirements
190-Pin Connector
5.25"
Figure 3. BX400ii Connector Clearance
Clearance ~ 3 mm
Top View
BX-400ii
LPM
4"
400-Pin Connector on the LPM
(Low Power Module)
2.5"
4"
A6372-01
Side View
BX400ii Interposer Board
OEM System Motherboard
A6869-01
The clearance between the BX400ii Interposer Board a nd the OEM system board is approximately
3mmasshowninFigure 3. If additional clearance is required, a socket saver can be used adding
approximately 8 mm of a dditional clearance. Contact your Intel Field Sales Representative or a
tools vendor to request a s ocket saver.
8 BX400iiInterposer Board User’s Manual
2.0 Getting Started
The BX400ii Interposer Board requires a Mobile Pentium II Processor in mini-cartridge at a
frequency corresponding to the mobile module that is being emulated.
2.1 Unpacking Instructions
Carefully unpack the contents of the box and verify that all of the items in the packing list are
present. If items are m issing or damaged, contact Intel or your authorized distributor.
2.1.1 Important Static Electricity Precautions
Take appropriate measures to prevent static electricity damage when removing the Interposer
Board from the antistatic bag. This board should only be handled in a static free area.
• Before handling any components or touching any other system units, discharge your body’s
static electric charge by touching a grounded surface.
• Wear a grounded wrist strap if one is available.
• Remove the board from the antistatic bag only when you are ready to install it.
Getting Started
• Do not lay the board or other components on the bag, only the insides are antistatic.
• When handling the board or other components, hold them by their edges or metal mounting
brackets.
• Never slide the board or other components over any surface.
2.2 Installation
Pay careful attention when installing the 400-pin high density connectors. Successful module
insertionand extraction consists of 3 major elements:
1. Alignment - Rough alignment is required before applying forces to reduce the possibility of
contact damage. Fine alignment is provided by the connector housing. Rough alignment is
achieved by visually aligning the connector housing and mounting holes.
2. Insertion - Insertion forces must be applied only on the board surface. Do not apply force to
any component. Best results and lower insertion forces are achieved when using a 2-step
rolling or "zippering" process. Align the connector length wise from one end of the connector,
roll the connector on until the board/module/mini-cartridge is parallel, and then apply force
straight down to secure the c onnector.
3. Extraction - E xtraction forces must be applied while securely controlling the board. Rolling
out the connector opposite of the insertion process is recommended. Twisting the board or
excessivelytilting it while removing can result in connector damage.
2.2.1 BX400ii
The BX400ii Interposer Board, with the processor securely mounted on top of the it, replaces the
mobile module in the system. First, remove the mobile module and its associated mounting
hardware, then carefully install the BX400ii Interposer Board on the 400-pin connector.
BX400ii Interposer Board User’s Manual 9
Getting Started
Note: Please consider the thermal requirements of your Mobile Pentium II processor and ensure that the
proper thermal management solution is in place.
2.2.2 Emulator/Logic Analyzer
Connect the 30-pin cable from the emulator or logic analyzer to the debug port connector on the
BX400iiInterposer Board. If you have a debug port designed into your system, only the debug port
on the BX400ii InterposerBoard will function. The port on the system board will not function with
the BX400ii in place.
Connect the probe from the Mobile Pentium II processor logic analyzer to the 190-pin connector.
Contact your logic analyzer vendor for specific details. A list of some third-partyvendors is
available in Table 2 on page 5.
Figure 4. BX400ii Interposer Board Stack Mounting
OEM System
Board
PCI Slot
(optional)
APG Slot
(optional)
Mobile Pentium® II Processor
in Mini-cartidge
190-Pin System Bus Connector
BX400ii Interposer Board
30-Pin Debug Port
Connector
240-Pin Connector
400-Pin LPM Connector
A6367-01
10 BX400ii Interposer Board User’s Manual
3.0 Hardware Refe rence
For a hardware layout of the BX400ii Interposer Board, refer to Figure5onpage13. For board
dimensions and keepout space requirements, refer to Figure 2 and Figure3onpage8.
3.1 Connector Definitions
Hardware Reference
Changes to the hardware are not required for the BX400ii Interposer Board. If necessary, you can
refer to the Mobile Pentium
®
II Processor at 233 MHz, 266 M Hz and 300 MHz datasheet (order
number 243669), Intel® Pentium® II Processor Mobile Module: Mobile Module Connector 2
(MMC-2) datasheet (order number 243668) for connector definitions.
3.2 Jumper Settings
Changes to the jumper settings are not required for normal operation of the BX400ii Interposer
Board.
3.2.1 Voltage Regulator Settings
The voltage setting for the VCCcore is determined by the VID pins, which are signal outputs of the
Mobile Pentium II processor. Jumper settings are available to vary the V
these should only be used for va lidation/debug purposes. For reference purposes, the jumper
settings for the voltage regulator are provided in Table 3.
Table 3. Voltage Regulator Jumper Settings
JP1 JP2 JP3 JP4 +VCC_CPU
NS NS NS NS 1.25 V
NS NS NS 1-2 1.30 V
NS NS 1-2 NS 1.35 V
NS NS 1-2 1-2 1.40 V
NS 1-2 NS NS 1.45 V
NS 1-2 NS 1-2 1.50 V
NS 1-2 1-2 NS 1.55 V
NS 1-2 1-2 1-2 1.60 V
1-2NSNSNS 1.65V
1-2 NS NS 1-2 1.70V
1-2 NS 1-2 NS 1.75 V
1-2 NS 1-2 1-2 1.80 V
1-2 1-2 NS NS 1.85 V
1-2 1-2 NS 1-2 1.90 V
1-2 1-2 1-2 NS 1.95 V
1-2 1-2 1-2 1-2 2.00 V
NOTE: 1-2 = Populate Jumper, NS = No Shunt.
core voltage, however,
CC
BX400ii Interposer Board User’s Manual 11
Hardware Reference
3.3 Test Points
Power m easurement header descriptions are provided in Table 4.
Table 4. Power Measuremen t Header Descriptions
Header VoltageR ail Resistor
P1 +VGTLREF_BX (5/9 VTT) R28 0.01 GTL reference voltage for 440BX
P2 +V3_AGPREF (3.3V) R45 0.01
P5, P6 +V3_BX (3.3V) R57 0.01 3.3 V rail for BX core
P7 +V3_PU (3.3V) R58 0.01 3.3 V rail for pull-ups
P8 +V3_VR (3.3V) R59 0.01
P15 +VTT MPII (1.6V) R10, R117 0.0005 Core Processor Voltage
P16 + VTT_BX R90 0.01
P17 +V CPUIO (2.5V) R97 0.01
P19 +VTT_GTL_PU R101 0.01
P20 + V5_VTT (5V) R75 1.0
P21 + VIN (4.75V - 21V) R17 0.025
Effective
Resistance (Ω)
3.3 V rail for 440BX AGPset:
82443BX reference
3.3 V railfor voltage regulator
subsystems
Low Power GTL+voltage rail for
443BX Host Bus interface pins
2.5Vused for clock on system
electronics and pullup voltage for
CPU cmos compatibility signals
Low Power GTL+voltage rail for all
GTL termination resistors and
443BX GTL reference
5 V input to Voltage Regulator
subsystem generating core VTT to
the CPU
Primary DC system power supply
[4.75V-21V]fromsystem
electronics board
Description
12 BX400ii Interposer Board User’s Manual
Figure 5. BX400ii Board Layout Drawing
Hardware Reference
BX400ii Interposer Board User’s Manual 13
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