Intel Braswell Series Technical Manual
Technical Manual
Of
Intel Braswell Series CPU
Based IPC M/B
NO.G03-NU941-F
Revision: 1.0
Release date: June 19, 2019
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
ii
TABLE OF CONTENT
ENVIRONMENTAL SAFETY INSTRUCTION ........................................................................ iv
USER’S NOTICE .................................................................................................................. v
MANUAL REVISION INFORMATION ................................................................................... v
ITEM CHECKLIST ................................................................................................................ v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD............................................................................. 1
1-2 SPECIFICATION ..................................................................................................... 2
1-3 LAYOUT DIAGRAM ................................................................................................ 3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING ................................................................................................. 7
2-2 CONNECTORS AND HEADERS ............................................................................ 11
2-2-1 CONNECTORS ......................................................................................... 11
2-2-2 HEADERS ................................................................................................. 13
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP ................................................................................................. 14
3-2 BIOS MENU SCREEN ............................................................................................ 15
3-3 FUNCTION KEYS ................................................................................................... 15
3-4 GETTING HELP ...................................................................................................... 16
3-5 MEMU BARS .......................................................................................................... 16
3-6 MAIN MENU ........................................................................................................... 17
3-7 ADVANCED MENU ................................................................................................. 18
3-8 CHIPSET MENU ..................................................................................................... 29
3-9 SECURITY MENU ................................................................................................... 31
3-10 BOOT MENU .......................................................................................................... 32
3-11 SAVE & EXIT MENU ............................................................................................... 33
iii
Environmental Safety Instruction
l Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
l 0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
l Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
l The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
l Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
iv
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition June 19, 2019
Item Checklist
R
Motherboard
R
User’s Manual
R
DVD for motherboard utilities
R
Cable(s)
v
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
n Onboard Intel® Braswell series SoC Processor, with low power consumption
never denies high performance
n Support 1* DDR3L 1600MHz SO-DIMM, maximum capacity up to 8GB
n Support onboard eMMC
n Support 4 * RJ-45 gigabit Ethernet LAN port & 1* RJ-45 type COM port
n Support1* HDMI port, 2*USB 3.0
n Onboard 1* full-size Mini-PCIE slot & 1* SIM card slot
n Onboard 1* M.2 M-key slot (type-2242 SATA interface for SSD device)
n Support Intel AES NI and TPM 2.0 to secure customers’ data
n Compliance with ErP standard
n Support Watchdog function
n Solution for Firewall & IoT
1
Spec
Description
l Intel
®
Braswell
SoC
CPU
*
1-2 Specification
Design
l Non-standard form factor; PCB size: 114.6 mm x 103.6 mm
Embedded
CPU
Memory Slot
Expansion Slot
Storage
LAN Chip
BIOS
Front Panel I/O
Rear Panel I/O
Internal I/O
*CPU model varies from different IPC options. Please consult
your dealer for more information of onboard CPU.
l 1 * DDR3L SO-DIMM slot
l Support 1* DDR3L 1600 MHz SO-DIMM up to 8GB
l 1* full-size USB 2.0 interface slot (MPE)
l 1* SIM card slot
l 1* M.2 Slot (Socket 3, M-key, support type-2242 SSD)
l 32GB onboard eMMC (default)
l Integrated with 4* Intel I211AT PCI-E Gigabit LAN chips
l Support Fast Ethernet LAN function of providing
10/100/1000Mbps Ethernet data transfer rate
l AMI Flash ROM
l 1* HDMI port
l 2* USB 3.0 port
l 1* power button & 1* reset knob
l 1* 12V DC-in power jack
l 4* RJ-45 LAN port
l 1* RJ-45 COM port for console (RJ45_COM1)
l 1* 2-pin internal 12V DC-in power connector
l 1* GPIO header
l 1* SMBUS header
* Note: Many PCs now include XHCI USB controllers which allow for the support of USB 3.0 and higher
USB speeds. This inclusion of XHCI controllers has lessened the need for EHCI USB controllers within
platforms. However, legacy operating systems (OS) may not natively recognize XHCI controllers. You
might need to pre-install XHCI driver while desiring to install a non-XHCI OS on Intel platforms which do
not include EHCI controllers. Please contact your representative for more details.
2
HDMI
Port
Power
Jack
1-3 Layout Diagram
Front IO Panel Diagram:
Reset Knob
Rear IO Panel Diagram:
USB 3.0 Ports
Power Switch/LED
Button
RJ-45 LAN Ports
(LAN1/2/3/4)
12V DC-in
3
RJ-45 COM Port
for Console
*
DDR3L
JP
COM
1
Reset Knob
*Full-size
Port
Header
JP1
Internal Diagram-Front Side:
Internal 12V
DC-In
Power Connector
USB 2.0 Interface Slot
(MPE)
GPIO
MPE_PWR
12V DC-in
Power Jack
RJ-45
LAN Ports
(LAN1/2/3/4)
COM Port
RJ-45
*SIM Card
Socket
SODIMM Slot
M.2
SATA Slot
(M2M)
Power
Switch/LED
HDMI Port
USB 3.0
Ports
AT_COPEN
*Note: 1. SODIMM module should be 1.35V DDRIII SODIMM and not exceeding 8GB total capacity.2. SIM card
slot only work when compatible SIM card installed & 3G LAN card installed in full-size MPE(Support USB 2.0
specification only) slot.
4
SMBUS Header
Intel
CPU
32GB
Internal Diagram-Back Side:
eMMC
Note: CPU is the most important part of the board and very fragile to any possible harm. Make sure
that there is no damage to the CPU during any installation procedures!
5
Connector
Connectors
DCIN1 12V DC–in System Power Jack
LAN1/2/3/4 RJ-45 LAN Port Connector x4
RJ45_COM1 RJ-45 COM Port Connector for Console
HDMI HDMI Port Connector
USB1 USB 3.0 Port Connector x2
DCIN2 Internal 12V DC–in System Power Connector
MPE Full-size USB Interface Slot
M2M M.2 SATA Slot
SIMCARD SIM Card Socket
Headers
GPIO GPIO Header 10-pin Block
SMBUS SMBUS Header 5-pin Block
Jumpers
Jumper Name Description
JP1 Pin (1-2): Clear CMOS
JPCOM1 RJ45_COM1 Port Pin5 VCC Select 4-Pin Block
AT_ COPEN Pin(1-3): ATX/AT Mode Select
MPE_PWR
Header Name Description
Name
6-Pin Block
Pin (3-4): RTC Reset
Pin (5-6): Flash Override
5-Pin Block
Pin(4-5): for Case Open Message Display
MPE Slot VCC Select
3-Pin Block
6
Clear CMOS
Setting
s
1-2
Open:
Normal;
1
Pin
12
4
3-4 Closed:
RTC RESET
.
4 2
Pin12
Chapter 2
Hardware Installation
2-1 Jumper Setting
Pin (1-2) of JP1 (6-pin): Clear CMOS RAM Setting
JP1
Pin 1&2 of JP1→
2
Pin
1-2 Closed: Clear CMOS.
Pin (3-4) of JP1(6-pin): RTC RESET Select
Pin 3&4 of JP1→RTC RESET
3-4 Open: Normal；
JP1
7
Pin1
3
3
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