Intel G35 Express Chipset, 82G35 Design Manuallines
Intel® G35 Express Chipset
Thermal and Mechanical Design Guidelines
— For the Intel® 82G35 Graphics and Memory Controller Hub
(GMCH)
August 2007
Document Number: 317609-001
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR
IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT
AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY
WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL
PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY,
OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended
for use in medical, life saving , or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel
reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from
future changes to them.
The Intel 82G35 Graphics and Memory Controller Hub (GMCH) may contain design defects or errors known as errata which may
cause the product to deviate from published specifications. Current characterized errata are available on request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product o rder.
Intel, Pentium, and the Intel logo are trademarks or regist ered trademarks of Intel Corporation or its subsidiaries in the United
States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2007, Intel Corporation. All rights reserved.
2 Thermal and Mechanical Design Guidelines
Contents
1 Introduction.....................................................................................................7
1.1 Terminology ..........................................................................................8
1.2 Reference Documents .............................................................................9
2 Product Specifications......................................................................................11
2.1 Package Description..............................................................................11
2.1.1 Non-Grid Array Package Ball Placement......................................11
2.2 Package Loading Specifications...............................................................12
2.3 Thermal Specifications ..........................................................................13
2.4 Thermal Design Power (TDP)..................................................................13
2.4.1 Definition...............................................................................13
2.4.2 Methodology...........................................................................14
2.4.3 Specifications .........................................................................14
2.4.4 T
2.5 Non-Critical to Function Solder Balls........................................................15
Limit..........................................................................14
CONTROL
3 Thermal Metrology..........................................................................................17
3.1 Case Temperature Measurements...........................................................17
3.1.1 Thermocouple Attach Methodology.............................................17
3.2 Airflow Characterization ........................................................................19
4 Reference Thermal Solution..............................................................................21
4.1 Operating Environment .........................................................................21
4.1.1 ATX Form Factor Operating Environment ....................................21
4.1.2 Balanced Technology Extended (BTX) Form Factor Operating
Environment...........................................................................
4.2 Reference Design Mechanical Envelope....................................................23
4.3 Thermal Solution Assembly....................................................................23
4.4 Environmental Reliability Requirements...................................................25
Appendix A Enabled Suppliers ...........................................................................................27
Appendix B Mechanical Drawings.......................................................................................29
22
Thermal and Mechanical Design Guidelines 3
Figures
Figure 1. GMCH Non-Grid Array ........................................................................12
Figure 2. Nominal Package Height ....................................................................13
Figure 3. Non-Critical to Function Solder Balls.....................................................15
Figure 4. 0° Angle Attach Methodology (top view, not to scale)..............................18
Figure 5. 0° Angle Attach Heatsink Modifications (generic heatsink side and
bottom view shown, not to scale) ......................................................
Figure 6. Airflow andTemperature Measurement Locations....................................19
Figure 7. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink
on an ATX Platform ............................................................................
Figure 8. Processor Heatsink Orientation to Provide Airflow to GMCH Heatsink
on a Balanced Technology Extended (BTX) Platform................................
Figure 9. ATX GMCH Heatsink - Installed on Board...............................................24
Figure 10. Balanced Technology Extended (BTX) GMCH Heatsink - Installed on Board25
Figure 11. GMCH Package Drawing....................................................................30
Figure 12. GMCH Keep-Out Restrictions for ATX Platforms.....................................31
Figure 13. GMCH Keep-Out Restrictions for Balanced Technology Extended (BTX)
Platforms........................................................................................
Figure 14. GMCH Reference Heatsink for ATX Platforms – Sheet 1..........................33
Figure 15. GMCH Reference Heatsink for ATX Platforms – Sheet 2..........................34
Figure 16. GMCH Heatsink for ATX Platforms – Anchor .........................................35
Figure 17. GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 1 ....36
Figure 18. GMCH Reference Heatsink for ATX Platforms – Ramp Retainer Sheet 2 ....37
Figure 19. GMCH Reference Heatsink for ATX Platforms – Wire Preload Clip.............38
Figure 20. GMCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms .......................................................................................
Figure 21. GMCH Reference Heatsink for Balanced Technology Extended (BTX)
Platforms – Clip ..............................................................................
18
22
23
32
39
40
Tables
Table 1. Package Loading Specifications............................................................12
Table 2. Thermal Specifications.......................................................................14
Table 3. ATX Reference Thermal Solution Environmental Reliability Requirements
(Board Level) ...................................................................................
Table 4. Balanced Technology Extended (BTX) Reference Thermal Solution
Environmental Reliability Requirements (System Level) ..........................
Table 5. ATX Intel Reference Heatsink Enabled Suppliers for Intel® G35
Express Chipset ................................................................................
Table 6. Balanced Technology Extended (BTX) Intel® Reference Heatsink
Enabled Suppliers for Intel
Table 7. Supplier Contact Information ..............................................................28
4 Thermal and Mechanical Design Guidelines
®
G35 Express Chipset ..................................27
25
26
27
Revision History
Revision
Number
-001 • Initial release. August 2007
Description Date
§
Thermal and Mechanical Design Guidelines 5
6 Thermal and Mechanical Design Guidelines
Introduction
1 Introduction
As the complexity of computer systems increases, so do power dissipation
requirements. The additional power of next generation systems must be properly
dissipated. Heat can be dissipated using improved system cooling, selective use of
ducting, and/or passive heatsinks.
The objective of thermal management is to ensure that the temperatures of all
components in a system are maintained within functional limits. The functional
temperature limit is the range within which the electrical circuits can be expected to
meet specified performance requirements. Operation outside the functional limit can
degrade system performance, cause logic errors, or cause component and/or system
damage. Temperatures exceeding the maximum operating limits may result in
irreversible changes in the operating characteristics of the component.
This document is for the following device:
®
• Intel
G35 Express Chipset GMCH (82G35 GMCH)
This document presents the conditions and requirements to properly design a cooling
solution for systems that implement the GMCH. Properly designed solutions provide
adequate cooling to maintain the GMCH case temperature at or below thermal
specifications. This is accomplished by providing a low local-ambient temperature,
ensuring adequate local airflow, and minimizing the case to local-ambient thermal
resistance. By maintaining the GMCH case temperature at or below those
recommended in this document, a system designer can ensure the proper
functionality, performance, and reliability of this component.
Note: Unless otherwise specified the information in this document applies to all
configurations of the Intel
®
G35 Express Chipset. The Intel® G35 Express Chipset will
be available with integrated graphics and associated SDVO and analog display ports.
The Intel® G35 Express Chipset is a Graphics Memory Controller Hub (GMCH) targeted
for use with the Intel
processor family in the LGA775 Land Grid Array Package and the Intel
®
Core™2 Duo processor family and Intel® Core™2 Quad
®
ICH8 in
desktop platforms.
Note: In this document the use of the term chipset refers to the combination of the GMCH
and the Intel ICH8. For the ICH8 thermal details, refer to the Intel
®
I/O Controller Hub
8 (ICH8) Thermal Design Guidelines.
Thermal and Mechanical Design Guidelines 7
1.1 Terminology
Term Description
FC-BGA Flip Chip Ball Grid Array. A package type defined by a plastic substrate where a
die is mounted using an underfill C4 (Controlled Collapse Chip Connection)
attach style. The primary electrical interface is an array of solder balls attached
to the substrate opposite the die. Note that the device arrives at the customer
with solder balls attached.
Intel® ICH8 Intel® I/O Controller Hub 8. The chipset component that contains the primary
PCI interface, LPC interface, USB, ATA, and/or other legacy functions.
GMCH Graphic Memory Controller Hub. The chipset component that contains the
processor and memory interface and integrated graphics core.
TA The local ambient air temperature at the component of interest. The ambient
temperature should be measured just upstream of airflow for a passive
heatsink or at the fan inlet for an active heatsink.
TC The case temperature of the GMCH component. The measurement is made at
the geometric center of the die.
Introduction
T
The maximum value of T
C-MAX
T
The minimum valued of T
C-MIN
TDP Thermal Design Power is specified as the maximum sustainable power to be
dissipated by the GMCH. This is based on extrapolations in both hardware and
software technology. Thermal solutions should be designed to TDP.
TIM Thermal Interface Material: thermally conductive material installed between
two surfaces to improve heat transfer and reduce interface contact resistance.
Ψ
Case-to-ambient thermal solution characterization parameter (Psi). A measure
CA
of thermal solution performance using total package power. Defined as
– TA) / Total Package Power. Heat source size should always be specified for
(T
C
Ψ measurements.
.
C
.
C
8 Thermal and Mechanical Design Guidelines
Introduction
1.2 Reference Documents
Document Location
Intel® G35 Express Chipset Datasheet http://www.intel.com/
Intel® I/O Controller Hub 8 (ICH8) Family Thermal Design Guidelines http://www.intel.com/
design/chipsets/datas
hts/317607.htm
design/chipsets/desig
nex/313058.htm
Intel® Core™2 Duo Processor and Intel® Pentium® Dual Core Processor
Thermal and Mechanical Design Guidelines
Intel® Core™2 Extreme Quad-Core Processor and Intel® Core™2 Quad
Processor Thermal and Mechanical Design Guidelines
Balanced Technology Extended (BTX) Interface Specification http://www.formfacto
Various System Thermal Design Suggestions http://www.formfacto
Various Chassis Thermal and Mechanical Design Suggestions http://www.formfacto
http://www.intel.com
/design/processor/spe
cupdt/313279.htm
http://www.intel.com
/design/processor/des
ignex/315594.htm
rs.org
rs.org
rs.org
§
Thermal and Mechanical Design Guidelines 9
Introduction
10 Thermal and Mechanical Design Guidelines
Product Specifications
2 Product Specifications
2.1 Package Description
The GMCH is available in a 34 mm [1.34 in] x 34 mm [1.34 in] Flip Chip Ball Grid
Array (FC-BGA) package with 1226 solder balls. The die size is currently 11.83 mm
[0.466in] x 10.52 mm [0.414in] and is subject to change. A mechanical drawing of
the package is shown in
2.1.1 Non-Grid Array Package Ball Placement
The GMCH package uses a “balls anywhere” concept. Minimum ball pitch is 0.8 mm
[0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers should
ensure correct ball placement when designing for the non-grid array pattern. For exact
ball locations relative to the package, contact your Intel Field Sales Representative.
Figure 11.
Thermal and Mechanical Design Guidelines 11
Figure 1. GMCH Non-Grid Array
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Product Specifications
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AL42
AK43
AJ42
AH43 AH
AG
AG42
AF43
AE42
AD43
AC42
AB43
AA42
Y43
W42
W
V43
U42
U
T43
R
R42
P43
N
M43
L
L42
K43
J42
G
G43
F42
E43
E
D42
C43
C
B43
A43
A
434241
BB
AY
AV
AT
AR
AP
AN
AM
AL
AK
AJ
AF
AE
AD
AC
AB
AA
Y
V
T
P
M
K
J
H
F
D
B
2.2 Package Loading Specifications
Table 1 provides static load specifications for the package. This mechanical maximum
load limit should not be exceeded during heatsink assembly, shipping conditions, or
standard use condition. Also, any mechanical system or component testing should not
exceed the maximum limit. The package substrate should not be used as a mechanical
reference or load-bearing surface for the thermal and mechanical solution.
Table 1. Package Loading Specifications
Parameter Maximum Notes
Static
NOTES:
1. These specifications apply to uniform compressive loading in a direction normal to the
package.
2. This is the maximum force that can be applied by a heatsink retention clip. The clip must
also provide the minimum specified load on the package.
3. These specif ications are based on limited testing for design characterization. Loading limits
are for the package only.
12 Thermal and Mechanical Design Guidelines
15 lbf
1,2,3
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