INGENICO GPRS Users Manual

GSM/GPRS
Embedded Data/Fax/Voice Wireless Modem
MTMMC-G-F1 MTMMC-G-F2
Developer’s Guide
ModemModule Developer’s Guide MTMMC-G-F1 and MTMMC-G-F2 PN S000295A, Version A 07/15/03
Copyright
This publication may not be reproduced, in whole or in part, without prior expressed written permission from Multi-Tech Systems, Inc. All rights reserved. Copyright © 2003, by Multi-Tech Systems, Inc.
Multi-Tech Systems, Inc. makes no representations or warranties with respect to the contents hereof and specifically disclaims any implied warranties of merchantability or fitness for any particular purpose. Furthermore, Multi-Tech Systems, Inc. reserves the right to revise this publication and to make changes from time to time in the content hereof without obligation of Multi-Tech Systems, Inc. to notify any person or organization of such revisions or changes.
Revisions
Revision Level Date Description
A 07/15/03 First release.
Patents
This device is covered by patent number 5,673,268.
Trademarks
Trademarks of Multi-Tech Systems, Inc. are ModemModule and the Multi-Tech logo. MNP and Microcom Network Protocol are registered trademarks of Microcom, Inc. Microsoft, Windows, Windows 95, and Windows NT are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.
World Headquarters
Multi-Tech Systems, Inc. 2205 Woodale Drive Mounds View, Minnesota 55112 Phone: 763-785-3500 or 800-328-9717 Fax: 763-785-9874
Technical Support Country By Email By Phone
France: support@multitech.fr (33) 1-64 61 09 81 India: support@multitechindia.com 91 (124) 6340778 U.K.: support@multitech.co.uk (44) 118 959 7774 U.S. and Canada: oemsales@multitech.com (800) 972-2439 Rest of the World: oemsales@multitech.com (763) 717-5863
Internet Address: http://www.multitech.com
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 2
Table of Contents
CHAPTER 1 – PRODUCT DESCRIPTION AND SPECIFICATIONS ................................................................5
I
NTRODUCTION ...........................................................................................................................................................5
Scope of the Developer Guide ................................................................................................................................5
G
ENERAL CHARACTERISTICS......................................................................................................................................6
General...................................................................................................................................................................6
Electrical ................................................................................................................................................................6
Mechanical .............................................................................................................................................................6
F
EATURE DETAILS ......................................................................................................................................................6
Telephony ...............................................................................................................................................................6
Short Message Service (GSM and GPRS mode).....................................................................................................6
GSM Circuit Data Features ...................................................................................................................................7
GPRS Packet Data Features ..................................................................................................................................7
GSM Supplementary Services.................................................................................................................................7
Other Features .......................................................................................................................................................7
Interfaces................................................................................................................................................................7
F
EATURE DESCRIPTIONS .............................................................................................................................................8
A
PPLICATIONS ............................................................................................................................................................9
ECHANICAL DESIGN OVERVIEW ............................................................................................................................10
M
CHAPTER 2 – MECHANICAL SPECIFICATIONS............................................................................................11
M
ECHANICAL DIMENSIONS.......................................................................................................................................11
C
LIMATIC AND MECHANICAL ENVIRONMENT TESTING COMPLIANCE ......................................................................12
CHAPTER 3 – ELECTRICAL CHARACTERISTICS.........................................................................................13
I
NTRODUCTION .........................................................................................................................................................13
IN CONNECTOR INTERFACES..............................................................................................................................14
50-P
50-Pin Connector Description..............................................................................................................................14
Power Supply........................................................................................................................................................17
Serial Link ............................................................................................................................................................19
ON / ~OFF Interface ............................................................................................................................................20
BOOT ...................................................................................................................................................................22
Reset Signal (~RST)..............................................................................................................................................22
Flashing LED .......................................................................................................................................................23
General Purpose Input/Output.............................................................................................................................24
Analog to Digital Converter.................................................................................................................................24
Audio Interface.....................................................................................................................................................25
SIM interface ........................................................................................................................................................29
SPI Bus .................................................................................................................................................................31
Keypad Interface ..................................................................................................................................................31
CHAPTER 4 – INTERFACES.................................................................................................................................32
F
LASHING LED.........................................................................................................................................................32
SIM I
NTERFACE........................................................................................................................................................32
NTERFACE..........................................................................................................................................................33
RF I
RF Connector .......................................................................................................................................................33
RF Performances..................................................................................................................................................33
DTE/DCE I
NTERFACE RATES...................................................................................................................................33
CHAPTER 5 – TEST BOARD .................................................................................................................................34
S
ERIAL TEST/DEMO BOARD COMPONENTS...............................................................................................................34
ERIAL TEST/DEMO BOARD BLOCK DIAGRAM .........................................................................................................35
S
SIM Schematic (5V)..............................................................................................................................................36
CHAPTER 6 – APPLICATION CONSIDERATIONS..........................................................................................37
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 3
GENERAL GUIDELINES FOR THE USE OF THE MODEMMODULE.................................................................................37
Hardware and RF.................................................................................................................................................37
The Antenna..........................................................................................................................................................37
Firmware Upgrade...............................................................................................................................................37
Initial Configuration Using Mobile PhoneTools..................................................................................................37
Getting Started .....................................................................................................................................................38
R
EFERENCE DOCUMENTS..........................................................................................................................................39
R
ELATED MANUALS .................................................................................................................................................39
DDITIONAL INFORMATION......................................................................................................................................40
A
APPENDIX A – SAFETY PRECAUTIONS & REGULATORY STANDARDS COMPLIANCE....................41
S
AFETY PRECAUTIONS..............................................................................................................................................41
RF Safety ..............................................................................................................................................................41
General Safety ......................................................................................................................................................42
Safety Standards...................................................................................................................................................42
RF Exposures .......................................................................................................................................................43
Instructions to OEMs............................................................................................................................................43
R
EGULATORY STANDARDS COMPLIANCE .................................................................................................................44
GSM compliance ..................................................................................................................................................44
FTA Compliance...................................................................................................................................................45
APPENDIX B – SOURCING GUIDE FOR CONNECTORS AND PERIPHERAL DEVICES........................46
W
HERE TO FIND SMD CONNECTORS........................................................................................................................46
GSM A SIM C
NTENNA........................................................................................................................................................47
ARD HOLDER..................................................................................................................................................47
APPENDIX C – AT COMMAND LIST ..................................................................................................................48
APPENDIX D – ACRONYMS AND ABBREVIATIONS .....................................................................................53
INDEX ........................................................................................................................................................................54
LIST OF TABLES...................................................................................................................................................57
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 4
Chapter 1 – Product Description & Specification
Chapter 1 – Product Description and Specifications

Introduction

ModemModule GSM/GPRS integrated wireless modems provide a quick and easy way to insert GSM and GPRS functionality into systems and terminals. Available in dual-band configurations, this fully type approved integrated modem constitutes a self-contained, fully integrated implementation of the GSM/GPRS standard. Thanks to standard interfaces, it can be integrated into any system. It is ready for voice, SMS, data and fax. ModemModule GSM/GPRS is a product with a single connector, which puts together all interface signals in order to facilitate its integration. It has an integrated SIM connector as well as a standard RF connector type MMCX. For system integrators, ModemModule GSM/GPRS is the fast track to the wireless world.
Figure 1-1: MultiTech’s Wireless ModemModule GSM/GPRS
Product Description Region
MTMMC-G-F1 GSM/GPRS Class 10, 900/1800 MHz Global MTMMC-G-F2 GSM/GPRS Class 10, 850/1900 MHz Global
The MTMMC-G-F1 and MTMMC-G-F2 ModemModules are used to integrate wIreless data and fax communications in numerous embedded applications.
Scope of the Developer Guide
This document describes the hardware interface and the technical specifications of the ModemModule GSM/GPRS wireless modems. The integrated modem is referred to as ModemModule GSM/GPRS according to the GSM/GPRS 900 standard, the GSM/GPRS 1800 standard and the GSM/GPRS 1900 standard. This product is based on a Dual Band RF module G900/1800 includes a GSM 900/1800 MHz module and every integrated modem referenced ModemModule GSM/GPRS-G850/1900 includes a GSM 850/1900 MHz module. These two dual-band modems have the same specifications unless otherwise specified.
: every integrated modem referenced ModemModule GSM/GPRS-
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 5

General Characteristics

General
· GPRS Class 10
· Dual Band GSM/GPRS modem E-GSM 900/1800 or GSM 850/1900
· 2W at 850MHz
· 1W at 1800/1900 MHz
· GSM Class 1 and Class 2 Group 3 FAX
· Small size and low power consumption
· Voice and Short Message Services (SMS)
· Fax and data transmission without extra hardware
· Serial interface supports DTE speeds up to 115.2K
· MMCX connector and SIM socket
· 14.4K GSM circuit-switched data
· Tricodec (FR/EFR/HR)
· Internal 3V SIM interface
· Easy remote control by AT commands for dedicated applications
· Fully Type Approved according to GSM Phase 2+ specifications
· Board-to-board or board-to-cable mounting
· Fully shielded and ready-to-use
Chapter 1 – Product Description & Specification
Electrical
· Power supply: 5 VDC +/- 5% 1A
Mechanical
· Absolute maximum dimension: 46 x 64 x 12 mm
· Weight: 79 g
· Casing: Complete shielding-stainless steel/zinc
· Mounting: 4 screw holes
· Operating temperature range: -30°C to + 60°C
· Storage temperature: -35°C to +85°C

Feature Details

Telephony
· Telephony (TCH/FS) & Emergency calls
· Full Rate, Enhanced Full Rate and Half Rate
· Dual Tone Multi Frequency function (DTMF)
Short Message Service (GSM and GPRS mode)
· Text and PDU
· Point to point MT & MO
· SMS Cell Broadcast
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 6
Chapter 1 – Product Description & Specification
GSM Circuit Data Features
· Data circuit asynchronous, transparent and non transparent up to 14,400
· bits/s
· Automatic fax group 3 (Class 1 & 2)
· Alternate speech and fax
· MNP2, V.42bis data compression
GPRS Packet Data Features
· GPRS Class 10
· Coding Schemes: C1S1 to CS4
GSM Supplementary Services
· Call Forwarding
· Call Barring
· Multiparty
· Call Waiting and Call Hold
· Calling Line Identity
· Advice of Charge
· USSD
· Closed User Group
· Explicit Call Transfer
Other Features
· ME+SIM phone book management
· Fixed Dialing Number
· SIM Toolkit Class 2
· SIM, network and service provider locks
· Real Time Clock
· Alarm management
· Software upgrade through Xmodem protocol
· UCS2 character set management
Interfaces
Single antenna interface Internal SIM interface: 3V only External SIM interface: 3V or 5V
For Data Operation:
Serial link Remote control by AT commands (GSM 07.07 and 07.05) Baud rate from 300 to 115,200 bits/s From 300 up to 38400 bits/s with autobauding
The integrated modem has a sole 50-pin connector, which gathers all the interface signals in order to facilitate its integration. It has an integrated SIM card holder as well as a standard RF connector type MMCX. The concept of the integrated modem has been defined to integrate on a sole device:
· a single connector has been used that is standard and easy to find (it is supplied worldwide); this connector includes all of the modem’s analog and digital connections
· One standard easy to find RF connector. See RF connector section in Chapter 3: Electrical Characteristics;
· One SIM card holder. See SIM section in Chapter 3: Electrical Characteristics.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 7
Chapter 1 – Product Description & Specification

Feature Descriptions

Integration Reduces Space, Power and Cost. The ModemModule GSM/GPRS integrates the controller, RF transceiver, and antenna interface in one compact unit. This integration requires low power, occupies very little space, and provides an overall reduction in costs.
Reduces Development Time. The ModemModule GSM/GPRS can make your existing and next generation device, machine, or system, communication-ready without requiring significant hardware changes to its design. It actually provides faster time-to-market because it relieves the burden and expense of obtaining network and RF approvals. This complete, ready-to-integrate wireless module allows you to enhance your product while you focus on developing its core features.
Voice Features. The ModemModule GSM/GPRS provides telephony and Dual Tone Multi Frequency (DTMF) functionality. It also allows for emergency calls as well as full rate, enhanced Full Rate and Half Rate (FR/EFR/HR).
Short Message Services. The ModemModule GSM/ GPRS offers SMS features such as text and PDU, point­to-point (MT/MO) and cell broadcast.
Compatible Supplementary Services. The ModemModule GSM/GPRS is compatible with supplementary services such as call forwarding, call barring, multiparty, call waiting and call hold, calling line identification, advice of charge, USSD, closed user group and explicit call transfer.
Management Features. The ModemModule GSM/ GPRS provides advanced management features including phone book management, fixed dialing number, real time clock and alarm management.
Industry-standard Modem Commands. The ModemModule GSM/GPRS provides industry-standard AT-style commands for ease of integration into your existing software application.
ModemModule Pin-Out. The ModemModule GSM/ GPRS interfaces easily with existing products through a standard serial communication channel. The complete on-board RF transceiver interfaces with an antenna for direct connection to wireless SMS, circuit-switched dial-up, or packet data networks. The ModemModule is a Data Terminal Equipment (DTE) device with serial asynchronous protocol support. The serial DTE channel is capable of transfer speeds to 115.2K bps and can be interfaced directly to a UART or microcontroller. It can be board-to-board or board-to-cable mounted.
Network and RF Approved. The ModemModule GSM/ GPRS has been tested and certified with wireless telecom network providers worldwide. In addition, it has successfully completed worldwide compliance
Developer’s Kit. The ModemModule GSM/GPRS Developer’s Kit allows you to plug in the ModemModule and use it for testing, programming and resolving application issues.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 8
Chapter 1 – Product Description & Specification

Applications

With circuit switched data rates up to 14.4K bps, the MultiModem GSM/GPRS is targeted at applications that periodically need to send or receive data over a wireless network. It is an ideal device for:
Appliances Remote Diagnostics
ATM Terminals Remote Metering
Automotive Security Systems
Data Collection Vending/Gaming
Machines
Gas Pumps Other devices requiring
wireless connectivity.
Industrial and Medical Remote Monitoring Systems
Note: The Wireless MultiModem must be mounted with at least 8 inches (20 cm) of clearance from the human body.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 9
Chapter 1 – Product Description & Specification

Mechanical Design Overview

The ModemModule is encased as shown in the figure below. It includes a RF module, a 50-pin connector, a SIM holder and a RF connector.
Interface Connector
Figure 1-2: Mechanical Description A
Holes for Mounting
Screws (4)
Hole dia. = 0.087”
Antenna Connector
(MMCX type)
SIM ejection button
SIM Reader
Figure 1-3: Mechanical Description B
Four screw holes allow the ModemModule to be fixed on the mother PCB. The ModemModule can be mounted indifferently on both sides (top or bottom). For further details see Chapter 2: Mechanical Specifications.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 10
Chapter 2 – Mechanical Specifications
Chapter 2 – Mechanical Specifications

Mechanical Dimensions

Figure 2-1: ModemModule Dimensions
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 11
Chapter 2 – Mechanical Specifications

Climatic and Mechanical Environment Testing Compliance

Table 2-1 : Climatic and Mechanical Environment Testing Compliance
G900/G1800
Environmental
Type of Test Standards Storage
Class 1.2
Cold IEC 68-2.1
-25O C; 72 hours -40O C; 72 hours -20O C (GSM); 16 hours
Ab test
Dry Heat IEC 68-2.2
+70O C; 72 hours +70O C; 72 hours +55O C; 16 hours
Bb test
Change of Temperature
Damp Heat Cyclic
IEC 68-2.14;
Na/Nb test
IEC 68-2.30;
Db test
O
+30
C; 2 cycles 90% - 100% RH variant 1
Damp Heat
IEC 68-2.56
O
+30
C; 4 days +40O C; 4 days +40O C; 4 days
Cb test
Sinusoidal Vibration
IEC 68-2.6 Fc test
5 - 62 Hz : 5 mm/s 62 – 200 Hz: 2 m/s 3 x 5 sweep cycles
Random Vibration
IEC 68-3.36
Fdb test
Transportation Class 2.3
O
/+30O C; 5 cycles
-40 t1 = 3 hours
+40O C; 2 cycles 90% - 100% RH variant 1
2
5 – 20 Hz: 0.96 m
2/s3
20 – 500 Hz: -3 dB/ oct 3 x 10 min
Operating (Port Use) Class 7.3
O
C (DCS) 16 hours
-10
-20O/+30O C (GSM); 3 cycles
O
/+30O C (DCS); 3 cycles
-10 t1 = 3 hours
+40O C; 2 cycles 90% - 100% RH variant 1
10 – 12 Hz: 0.96 m2/s
3
12 – 150 Hz: -3 dB/ oct 3 x 30 min
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 12
Chapter 3 – Electrical Characteristics
Chapter 3 – Electrical Characteristics

Introduction

This chapter describes the ModemModule’s electrical interfaces. These are:
· interfaces on the 50-pin general purpose connector (power and data/signaling)
· RF interface
· SIM interface
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 13

50-Pin Connector Interfaces

50-Pin Connector Description
Table 3-1. 50-pin Connector Description
Pin # Name I/O I/O Type Description Comment
1 GND GROUND High current
2 GND GROUND High current
3 +5V Supply High current
4 +5V Supply High current
5 CT109/DCD O CMOS/2X Data Carrier Detect
6 GND GROUND High current
7 GPI04 I/O CMOS/2X General Purpose I/O
8 SPK2N O Analog Speaker 2 negative output
9 CT125/RI O CMOS/2X Ring Indicator
10 SPK2P O Analog Speaker 2 positive output
11 Flashing LED I/O CMOS/2X Working mode indication
12 SPK1P O Analog Speaker 1 positive output
13 CT106/CTS O 1X Clear to Send
14 SPK1N O Analog Speaker 1 negative output
15 ON/~OFF I Power ON/OFF control ON = Vcc
16 MIC2P I Analog Microphone 2 positive
17 AUXV0 I Analog Auxiliary ADC input
18 MIC2N I Analog Microphone 2 negative
19 ~RST I Reset active low Open Collector
20 MIC1P I Analog Microphone 1 positive
21 GND I Ground
22 MIC1N I Analog Microphone 1 negative
23 BOOT I BOOT Open Collector
24 GND GROUND High Current
25 CT103/TX I Transmit Data Pull up with
Chapter 3 – Electrical Characteristics
Driven by
LED
input
input
input
input
module
100K-ohm when not used
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 14
Chapter 3 – Electrical Characteristics
Table 3-1. 50-Pin Connector Description (Continued)
Pin # Name I/O I/O Type Description Comment
26 GPIO0 I/O CMOS/2X General Purpose I/O 27 CT107/DSR O 1X Data Set Ready 28 CT104/RX O 1X Receive Data 29 CT108-2/DTR I Data Terminal Ready
30 CT105/RTS I Request to Send Pull up with
31 COL3 I/O 1X Keypad column 32 COL4 I/O 1X Keypad column 33 COL1 I/O 1X Keypad column 34 COL2 I/O 1X Keypad column 35 ROW4 I/O 1X Keypad row 36 COL0 I/O 1X Keypad column 37 ROW2 I/O 1X Keypad row 38 ROW3 I/O 1X Keypad row 39 ROW0 I/O 1X Keypad row 40 ROW1 I/O 1X Keypad row 41 NC Not Connected 42 SPI_EN O 1X SPI enable 43 SPI_IO I/O 1X I2C Data or SPI Data 44 SPI_CLK O 2X I2C Clock or SPI Clock 45 SIMCLK O 2X Clock for SIM interface 3V mode 46 SIMRST O 2X Reset for SIM interface 3V mode 47 SIMVCC O SIM card supply 3V mode
48 SIMPRES I SIM card detect Connected to
49 SIMDATA I/O 3X I/O for SIM interface 3V mode 50 GPO0 General purpose I/O
* See SIM socket diagram in SIM interface section
** GPO0 is a general purpose output for selection of external SIM, 3V or 5V.
Pull up with 100K-ohm when not used
100K-ohm when not used
6mA max.
SIM connector pin 8. Pin 4 of SIM connector must be pulled down to GND with 1 K-Ohm*
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 15
Chapter 3 – Electrical Characteristics
Table 3-2. Operating Conditions
Parameter I/O Type Min Max Condition
V
input low
V
input high
V
output low
V
output high
CMOS -0.5V 0.8V
CMOS 2.1V 3.0V
1X 0.2V IOL = -1mA
2X 0.2V IOL = -2mA
3X 0.2V IOL = -3mA
1X 2.6V IOH = 1mA
2X 2.6V IOH = 2mA
3X 2.6V IOH = 3mA
Figure 3-1: 50-Pin Connector
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 16
Chapter 3 – Electrical Characteristics
50
2
Figure 3-2: Pin Numbering – Bottom View
49
1
Power Supply
The main power supply is provided through a double connection. These connections are respectively pins 3 and 4 for the +5V and the pins 1 and 2 for the ground (GND). The pins 6, 21, and 24 are also ground connection in order to produce a proper ground plane.
A 5V +/-5% - 1A power is strictly required to supply the modem. Otherwise, serious dysfunctions may appear. However, the modem does not have to constantly deliver 1A current at 5V on this power supply.
This power supply is internally regulated to a nominal value VBATT.
Table 3-3: Power Supply Pin Description
Pin Number Name Description Comment
1 GND Ground High Current
2 GND Ground High Current
3 +5V Ground High Current
4 +5V Ground High Current
6 GND Ground High Current
21 GND Ground High Current
24 GND Ground High Current
Table 3-4: Power Consumption in EGSM-only mode @25 degrees C
+5V
+5V
+5V
+5V
Conditions I
During TX bursts @2W 810 mA 1 A
Average @ 2W 310 mA 370 mA
Average @ ).5W 185 mA 200 mA
Average idle mode 22 mA 25 mA
NOM
I
MAX
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 17
Chapter 3 – Electrical Characteristics
Table 3-5: Power Consumption in GSM-only 1800 & 1900 MHz modes @25 degrees C
+5V
+5V
+5V
+5V
Conditions I
During TX bursts @1W 635 mA 800 mA
Average @1W 260 mA 280 mA
Average @ 0.25W 150 mA 170 mA
Average idle mode 20 mA 22 mA
NOM
I
MAX
Table 3-6: Power Consumption in EGSM/GPRS 900 MHz and GSM/GRPS 850 MHz Mode
Class 10
+5V
+5V
+5V
+5V
+5V
+5V
+5V
+5V
Conditions I
During TX bursts @PcI5 1.7 A peak 2.0 A peak
During RX bursts 75 mA peak 80 mA peak
Average 1Rx/1Tx @PcI5 270 mA 320 mA
Average 1Rx/1Tx@PcI8 180 mA 200 mA
Average idle mode
Average GPRS CI 10 (3Rx/2Tx) @PcI5
Average GPRS CI 10 (3Rx/2Tx) @PcI8
Average Idle mode 2,2 mA 3 Ma
NOM
100 mA 300 mA
540 mA 640 mA
360 mA 400 ma
I
MAX
Power Control Level: PcI5=2W typ.; PcI8=0,5W typ.
Table 3-7: Power Consumption in GSM/GRPS 1800 MHz and GSM/GRPS 1900 MHz
Class 10
Conditions I
+5V
+5V
+5V
+5V
+5V
+5V
+5V
+5V
Power Control Level: PcI0=1W typ; PcI3=0,25W typ
During TX bursts @PcI0 1.3 A peak 1.7 A peak
During RX bursts 75 mA peak 80 mA peak
Average 1Rx/1Tx @PcI5 240 mA 270 mA
Average 1Rx/1Tx@PcI8 150 mA 180 mA
Average idle mode
Average GPRS CI 10 (3Rx/2Tx) @PcI5
Average GPRS CI 10 (3Rx/2Tx) @PcI8
Average Idle mode 2,2 mA 3 Ma
NOM
100 mA 300 mA
480 mA 540 mA
300 mA 360 Ma
I
MAX
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 18
Chapter 3 – Electrical Characteristics
Serial Link
A serial link interface is available complying with V24 protocol signaling but not with V28 (electrical interface) due to a 2.8 Volts interface. TX, RTS and DTR can be either 5V or 3V.
The signals are Tx data (CT103/TX), Rx data (CT104/RX), Request To Send (CT105/RTS), Clear To Send (CT106/CTS), Data Terminal Ready (CT108-2/DTR) and Data Set Ready (CT107/DSR).
The set of RS232 signals can be required for GSM DATA services application. The 2 additional signals are Data Carrier Detect (CT109/DCD) and Ring Indicator (CT125/RI).
Table 3-8: Serial Link Pin Description
Signal Pin Number I/O I/O Type* Description
CT103 / TX 25 I CMOS Transmit serial data
CT104 / RX 28 O 1X Receive serial data
CT105 / RTS 30 I CMOS Ready to send
CT106 / CTS 13 O 1X Clear to send
CT107 / DSR 27 O 1X Data set ready
CT108-2 / DTR 29 I CMOS Data terminal ready
CT109 / DCD 5 O CMOS / 2X Data carrier detect
CT125 / RI 9 O CMOS / 2X Ring indicator
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 19
Chapter 3 – Electrical Characteristics
Vcc
Modem
RI
DCD
RX
CTS
DSR
DTR
TX
RTS
Vcc
28
25
1
3
24
23
22
19
17
16
21
20
18
13
C1+
C1­C2+
C2-
T1IN
T2IN
T3IN
T4IN
T5IN
R1OUTB
R2OUT
R3OUT
R4OUT
ON
T1OUT
T2OUT
T3OUT
T4OUT
T5OUT
R1IN
R2IN
R3IN
ERROR
OFF
27
2 26 4
5
6
7
10
12
8
9
11
15
14
Te rm in alLevel Shifter
GND
S_RI
S_DCD
S_RX
S_CTS
S_DSR
S_DT R
S_TX
S_RTS
Vcc
MAX 3238
*T h is ap pli catio n n ot e is va li d f or V c c> 3. 0 Vo lt (se e MAX 32 38 speci ficatio n s ) Auto sh ut d ow n mo de i s not used in th is examp le.
Figure 3-3: Level Shifter Application Diagram for Serial Link
Vcc
Vcc
GND
ON / ~OFF Interface
This input is used to switch ON or OFF the ModemModule. A high level signal has to be provided on the ON/~OFF pin to switch on the modem. The level of the voltage of this signal has to be maintained to VCC during a minimum time of 1 second. When powered off, the shutdown current is roughly 60 microAmperes.
Table 3-9: ON / OFF Pin Description
Signal Pin Number I/O I/O Type* Description
ON / ~OFF 15 I CMOS Module Power ON/OFF
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 20
Chapter 3 – Electrical Characteristics
Power OFF Procedure
In order to power OFF the ModemModule, switch it OFF both via software (AT+CPOF; see AT Command Manual for more details) and via hardware line. See the diagrams below.
ON/~OFF
Serial Link to ModemModule
Serial Link from Mode m Module
Mo de mMod ule Stat us
___ ON OFF___
ON /~O FF
Seria l Li nk to ModemMo dule
Seria l Li nk from ModemModule
AT + C PO F
OK r e s po nse
Figure 3-4: Power-Off Procedure 1
AT+ C PO F
OK response
About 500 ms
About 500 ms
About 500 ms
ModemModule
___
Sta tus
ON OF F_ __
Figure 3-5: Power-Off Procedure 2
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 21
Chapter 3 – Electrical Characteristics
BOOT
This input is used to switch the ModemModule into download mode (backup procedure). The internal boot procedure is started when this pin is low during the power ON of the module. In normal mode, this pin has to be left open. If used, this input has to be driven by an open collector or an open drain. See below an example of application diagram. See also the “Firmware Upgrade” section of Chapter 5: Application Considerations.
BOOT : Pin 23
Switch BOOT
Figure 3-6: Boot Procedure
If Switch Boot = 1, Boot pin 23 = 0, to download mode If Switch Boot = 0, Boot pin 23 = 1, to normal mode
Table 3-10: BOOT Pin Description
Signal Pin Number I/O I/O Type* Description
BOOT 23 I CMOS SW downloading
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Reset Signal (~RST)
This signal is used to force a reset of the ModemModule. It has to be used by providing low level during approximately 2ms. This signal has to be considered as an emergency reset only. A reset procedure is already driven by an internal hardware during the power-up sequence.
This signal can also be used to provide a reset to an external device. If no external reset is necessary this input can be left open. If used (emergency reset), it has to be driven by an open collector or an open drain. See below an example of application diagram.
Reset : Pin 23
Switch Reset
Figure 3-7: Reset Procedure
If switch Reset = 1, Reset pin 19 = 0 If switch Reset = 0, Reset pin 19 = 1
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 22
Chapter 3 – Electrical Characteristics
Table 3-11: Reset Signal Pin Description
Signal Pin Number I/O I/O Type* Description
~RST 19 I/O Module reset
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Table 3-12: Reset Signal Electrical Characteristics
Parameter Min Max Unit
Input Impedance ( R ) 4.7 kilo-ohms
Input Impedance ( C ) 10 nanofarads
Table 3-13: Reset Signal Operating Conditions
Parameter Min Max Condition
*V
T-
*V
T+
V
OL
V
OH
VT-, VT+ hysteresis level
1.1 V 1.2 V
1.7 V 1.9 V
0.4 V I
2.0 V I
= -50 microamperes
OL
= -50 microamperes
OH
Flashing LED
The flashing LED signal is used to indicate the working mode of the ModemModule.
Table 3-14 : Flashing LED Pin Description
Signal Pin Number I/O I/O Type* Description
Flashing LED 11 I/O CMOS/2X Working mode
indication LED
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Table 3-15 : LED and ModemModule Status
LED Indication ModemModule Status
OFF Download mode or switched OFF.
Permanent Switched ON, not registered on the network.ON
Flash Switched ON, registered on the network.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 23
Chapter 3 – Electrical Characteristics
General Purpose Input/Output
The ModemModule provides two General Purpose I/O connections. They can be used to control any external device.
Table 3-16 : General Purpose I/O Pin Description
Signal Pin Number I/O I/O Type* Description Default Value
GPIO0 26 I/O CMOS / 2X General Purpose I/O 0
GPIO4 7 I/O CMOS / 2X General Purpose I/O 0
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
All digital I/O complies with 3Volts CMOS.
You can access (write or read) the GPIO value via AT+WIOW and AT+WIOR. See AT Command manual for more details.
Analog to Digital Converter
The ModemModule has an Analog to Digital converter (ADC) input. This converter is a 10 bits one, ranging from 0 to 2.5V. You can see the measurements via AT+ADC. See AT Command manual for more details.
Table 3-17: A/D Converter Pin Description
Signal Pin Number I/O I/O Type* Description
AUXV0 17 I Analog A/D converter
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Table 3-18: A/D Converter Electrical Characteristics
Parameter Min Max Unit
Resolution 10 bits
Sampling Rate 90.3 Ksps
Input Signal Range 0 2.5V Volts
ADC Reference Accuracy 0.5 %
Integral Accuracy +/- 1 LSB
Differential Accuracy +/- 1 LSB
Input Impedance ( R ) 10 mega-
Input Impedance ( C ) 50 pico-
Ohms
Farads
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 24
Chapter 3 – Electrical Characteristics
Audio Interface
Two different microphone inputs and two different speaker outputs are supported. The connection can be either differential or single-ended but using a differential connection in order to reject common mode noise and TDMA noise is recommended.
Microphone 2 Inputs
The MIC2 inputs are differential ones. They already include the convenient biasing for an electret microphone (0,5 mA and 2 Volts). This electret microphone can be directly connected on these inputs. The impedance of the microphone 2 has to be around 2K. These inputs are the standard ones for a handset design while MIC1 inputs can be connected to an external headset or a hands-free kit.
The gain of MIC2 inputs is internally adjusted. The gain can be tuned from 30dB to 51dB. The connection to the microphone is direct. The gain can be tuned using the AT+VGR command. See Appendix B: Sourcing Guide for Connectors and Peripheral Devices.
MIC2P
C1 = 22pF to 100 pF
C1
33 pF recommended
MIC2N
Figure 3-8: Microphone 2 Input
C1 has to be the nearest as possible to the microphone. Microphone manufacturers provide this capacitor directly soldered on the microphone.
Table 3-19: Microphone 2 Input Pin Description
Signal Pin Number I/O I/O Type* Description
MIC2P 16 I Analog Microphone 2 positive input
MIC2N 18 I Analog Microphone 2 negative input
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 25
Chapter 3 – Electrical Characteristics
Microphone 1 Inputs
The MIC1 inputs are differential and do not include internal bias. To use these inputs with an electret microphone, bias has to be generated outside the ModemModule according to the characteristic of this electret microphone. These inputs are the standard ones used for an external headset or a hands-free kit. When using a single-ended connection, be sure to have a very good ground plane, a very good filtering as well as shielding in order to avoid any disturbance on the audio path. The gain of MIC1 inputs is internally adjusted. The gain can be tuned from 30dB to 51dB.
The gain can be tuned using the AT+VGR command.
Differential Connection
Vcc analog power supply
2.8 V
R1
R2
MIC1P
C2
C1
MIC1N
R3
R4
Figure 3-9: Microphone 1 Input
R1 = R4 = from 100 to 330 . R2 = R3 = usually between 1K and 3.3K as per the
microphone characteristics C1 = 22pF to 100pF C2 = 47µF
R1 and R4 are used as a voltage supply filter with C2. C1 has to be the nearest possible to the microphone. Microphone manufacturers provide this capacitor directly soldered on the microphone.
Table 3-20: Microphone 1 Input Pin Description
Signal Pin Number I/O I/O Type* Description
MIC1P 20 I Analog Microphone 1 positive input
MIC1N 22 I Analog Microphone 1 negative input
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 26
Chapter 3 – Electrical Characteristics
Speaker 2 Outputs
Speaker outputs SPK2 are push-pull amplifiers and can be loaded down to 50 Ohms and up to 1nF. These outputs are differential and the output power can be adjusted by step of 2dB. The output can be directly connected to a speaker. When using a single-ended connection, be sure to have a very good ground plane, a very good filtering as well as shielding in order to avoid any disturbance on the audio path.
Differential Connection
SPK2P
SPK2N
Single-Ended Connection
C1
SPK2P
+
Figure 3-10: Speaker 2 Output
C1 = from 100nF to 47µF as per the speaker characteristics and the output power.
Using a single-ended connection also includes losing half of the output power compared to a differential connection.
Table 3-21: Speaker 2 Output Pin Description
Signal Pin Number I/O I/O Type* Description
SPK2P 10 O Analog Speaker 2 positive output
SPK2N 8 O Analog Speaker 2 negative output
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 27
Chapter 3 – Electrical Characteristics
Speaker 1 Outputs
Speaker outputs SPK1 are push-pull amplifiers and can be loaded down to 50 Ohms and up to 1nF. These outputs are differential and the output power can be adjusted by step of 2dB. The output can be directly connected to a speaker. When using a single-ended connection, be sure to have a very good ground plane, a very good filtering as well as a shielding in order to avoid any disturbance on the audio path.
Differential Connection
SPK1P
SPK1N
Single-Ended Connection
C1
SPK1P
+
Figure 3-11: Speaker 1 Output
C1 = from 100nF to 47µF as per the speaker characteristics. Using a single-ended connection also includes losing half of the output power compared to a differential connection.
Table 3-22: Speaker 1 Output Pin Description
Signal Pin Number I/O I/O Type* Description
SPK1P 12 O Analog Speaker 1 positive output
SPK1N 13 O Analog Speaker 1 negative output
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 28
Chapter 3 – Electrical Characteristics
SIM interface
The external SIM interface is available through the 50-pin connector in order to use a stand-alone SIM cardholder. 5V SIMs can be driven using an external level shifter.
SIM line must not exceed 15 cm. See also the “Hardware and RF” section of Chapter 5: Application Considerations.
Five signals are available: SIMVCC: SIM power supply. SIMRST: reset. SIMCLK: clock. SIMDATA: I/O port. SIMPRES1 SIM card detect. This signal is connected to the external SIM connector on pin 8. Pin 4 of SIM connector must be pulled down to GND with 1 K.
This interface is fully compliant with GSM 11.11 recommendations concerning the SIM functionality.
Transient Voltage Suppressor diodes are internally added on the signals connected to the SIM socket in order to prevent any Electro-Static Discharge. TVS diodes with low capacitance (less than 10pF) are connected on SIMCLK and SIMDATA to avoid any disturbance of the rising and falling edge.
Table 3-23: SIM Interface Pin Description
Signal Pin Number I/O I/O Type* Description
SIMCLK 45 O 2X SIM Clock
SIMRST 46 O 2X SIM Reset
SIMDATA 49 I/O CMOS/2X SIM Data
SIMVCC 47 O SIM Power Supply
SIMPRES1 48 I CMOS SIM Card Detect
GPO0 50 O 2X SIM 3V or 5V
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
The SIM schematic appears later in this chapter.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 29
Chapter 3 – Electrical Characteristics
Table 3-24: SIM Interface Electrical Characteristics
Parameter Conditions Min Typ Max Unit
SIMDATA V
SIMDATA V
IH
IL
SIMRST, SIMDATA SIMCLK V
OH
SIMRST, SIMDATA SIMCLK V
OL
SIMVCC Output
IIH = +/- 20mA
IIL = 1 mA 0.3xSIMVCC V
Source current = 20mA
Sink current = -200mA
I
<= 6mA 2.70 2.80 2.85 V
SIMVCC
0.7xSIMVCC V
SIMVCC – 0.1V V
Voltage
SIMCLK Rise/Fall Time
SIMRST, SIMDATA
Loaded with 30pF
Loaded with 30pF
Rise/Fall Time
SIMCLK Frequency
Loaded with 30pF
Table 3-25: SIM Socket Pin Description
Signal Pin Number Description
0.1
50 ns
1
ms
3.25 MHz
Vcc 1 SIMVCC
RST 2 SIMRST
CLK 3 SIMCLK
CC4 4 R10 to Ground
GND 5 Ground
VPP 6 not connected
I/O 7 SIMDATA
CC8 8 SIMPRES1
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 30
Chapter 3 – Electrical Characteristics
GND
SIMVCC
SIMRST
SIMCLK
IK
SIMDATA
SIMPRES1 8
1
VCC
2
RST
3
CLK
CC4
GND VPP
7
I/O
CC8
Figure 3-12: SIM Socket
SPI Bus
The SPI bus includes a CLK signal, an I/O signal and an EN signal complying with SPI bus standard. The maximum speed transfer is 3.25Mb/s.
Table 3-26 : SPI Bus Pin Description
Signal Pin Number I/O I/O Type* Description
SPI_CLK 44 O 1X SPI Serial Clock
SPI_IO 43 I/O CMOS/1X SPI Data
SPI_EO 42 O 1X SPI Enable
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Keypad Interface
This interface provides 10 connections: 5 rows (R0 to R4) and 5 columns (C0 to C4).
The scanning is a digital one, and the de-bouncing is done in the integrated modem. No discrete components like R, C (Resistor, Capacitor) are needed. It is possible to scan the column and rows using the AT+CMER command. See AT Command manual for more details.
Table 3-27: Keypad Interface Pin Description
Signal Pin Number I/O I/O Type* Description
ROW0 39 I/O CMOS / 1X Row scan
ROW1 40 I/O CMOS / 1X Row scan
ROW2 37 I/O CMOS / 1X Row scan
ROW3 38 I/O CMOS / 1X Row scan
ROW4 35 I/O CMOS / 1X Row scan
COL0 36 I/O CMOS / 1X Column scan
COL1 33 I/O CMOS / 1X Column scan
COL2 34 I/O CMOS / 1X Column scan
COL3 31 I/O CMOS / 1X Column scan
COL4 32 I/O CMOS / 1X Column scan
* See “Table 3-2: Operating Conditions” in section on the 50-pin Connector Description.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 31
Chapter 4 – Interfaces
This chapter describes the ModemModule interfaces.
· Flashing LED
· SIM Interface
· RF Interface
· DTE/DCE Interface Rates

Flashing LED

The flashing LED signal is used to indicate the working mode of the ModemModule.
LED and ModemModule Status
Signal ModemModule Status
OFF Download mode or switched OFF>
Continuously lit Switched ON (not registered on the network)ON Flashing Switched ON (registered on the network)
Chapter 4 – Interfaces

SIM Interface

The internal SIM interface of the SocketModule supports 3V SIMs only.
Note: This interface is fully compliant with GSM 11.11 recommendations concerning the SIM functionality.
Five Signals Are Available
SIMVCC: SIM power supply. SIMRST: reset. SIMCLK: clock. SIMDATA: I/O port. SIMPRES1 SIM card detect.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 32
Chapter 4 – Interfaces

RF Interface

The impedance is 50 Ohms nominal.
RF Connector
The RF connector is MMCX standard type. An antenna can be directly connected through the matting connector or using a small adapter.
RF Performances
RF performances are compliant with the ETSI recommendation 05.05 and 11.10. The main parameters are:
Receiver:
· EGSM Sensitivity : < -104 dBm
· GSM 1800/GSM 1900 Sensitivity : < -102 dBm
· Selectivity @ 200 kHz : > +9 dBc
· Selectivity @ 400 kHz : > +41 dBc
· Dynamic range : 62 dB
· Intermodulation : > -43 dBm
· Co-channel rejection : + 9 dBc
Transmitter:
· Maximum output power (EGSM) : 33 dBm +/- 2 dB
· Maximum output power (DCS/PCS) : 30 dBm +/- 2 dB
· Minimum output power (EGSM): 5 dBm +/- 5 dB
· Minimum output power (DCS/PCS): 0 dBm +/- 5 dB
· H2 level : < -30 dBm
· H3 level : < -30 dBm
· Noise in 925 - 935 MHz : < -67 dBm
· Noise in 935 - 960 MHz : < -79 dBm
· Noise in 1805 - 1880 MHz : < -71 dBm
· Phase error at peak power : < 5 ° RMS
· Frequency error : +/- 0.1 ppm max

DTE/DCE Interface Rates

The table below indicates the anticipated modem-to-computer interface rates for both the 7.2 bits-per-sample rate and the 8 bits-per-sample rate.
Projected DTE/DCE Interface Rates for 7.2/8K Hz Sample Rates
Projected DTE/DCE I/F
Bits per Sample
0.50 4800 9600 1 9600 19200 2 19200 19200 3 38400 38400 4 38400 57600 5 57600 57600 6 57600 115200 7 115200 115200 8 115200 115200 9 115200 115200 10 115200 115200 11 115200 115200 12 115200 Fast 13 Fast Fast
Rate @ 7.2K Hz
Projected DTE/DCE I/F Rate @ 8K Hz Sample Rate
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 33
Chapter 5 – Test Board

Serial Test/Demo Board Components

Chapter 5 – Test Board
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 34

Serial Test/Demo Board Block Diagram

Chapter 5 – Test Board
Block Diagram for the ModemModule GSM/GPRS
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 35
SIM Schematic (5V)
Chapter 5 – Test Board
SIM interfac e from Modem Module .
SIMDA TA
SIMRST
SIMCLK
C_GPO0
2
3
4
47K47K
10K
4.7K
UMC5NT1
1
GND
U4
5
VCC = 2.8V
GND
SIMV CC R23 0
VIN
SIMPRES1
VIN = 5V
R20, R21, R22 and R23 are used to shunt LTC1555.
R20 0
R21 0
R12 100K
R22 0
R14 100K
U6
CLKCIN
2 15
RIN RST
3
DA TA
4
VCC
VCC
GND GND
6 7 8
LTC1555
DDRV
VINDV CC
SSM1C1+
M0
GND
C1-
LTC1555 SIM 3V/5V Level shifter.
GND
GND
161
14
I/O
13 125 11 10 9
C28 .1uF
GND
R15 1 K
C43 2.2 uFR13 100K
C30 33uF
+
Place C30 near pin 13 of U6.
C17 2.2 uF
GND
GND
3 2 7 1 6 4 8 5
J2
CLK RST I/0 VCC VPP CC4 CC8 GND
SIM_6 P
SIM Schematic
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 36
Chapter 6 – Application Considerations
Chapter 6 – Application Considerations

General Guidelines for the Use of the ModemModule

Hardware and RF
· Ground plane: MultiTech recommends having a common ground plane for analog, digital and RF grounds.
· Length of the SIM interface lines (15 cm maximum)
· Bias of the Microphone inputs must be properly adjusted when using audio connectors (mic + speaker) 1.
· EMC protection on audio input/output (filters against 900 MHz)
· ESD protection on serial link, …
· Possible spurious emission radiated by the application to the RF receiver in the receiver band
The Antenna
The antenna sub-system and integration in the application is a major issue. It is a major issue in the choice of the antenna cable (type, length, performances, thermal resistance, etc.)
These elements could affect GSM performances such as sensitivity and emitted power.
The antenna should be isolated as much as possible from the digital circuitry including the interface signals.
MultiTech recommends shielding the terminal. On terminals including the antenna, a poor shielding could dramatically affect the sensitivity of the terminal. Subsequently, the power emitted through the antenna could affect the application.
Firmware Upgrade
The ModemModule firmware is stored in flash memory, and it can easily be upgraded. Contact the factory for details.
Initial Configuration Using Mobile PhoneTools
For Initial configuration of your wireless device, Multi-Tech offers a Windows-based mobile PhoneTools application. To load Mobile PhoneTools, click on the Mobile PhoneTools icon on the system CD and follow the on-screen prompts.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 37
Chapter 6 – Application Considerations
Getting Started
Minimum Hardware Interface Required To Get Started
At a minimum, it is necessary to connect the following signals too properly operate the ModemModule:
Table 5-1: Minimum Signals to Operate the ModemModule
Pin Number Name Description
1 GND Ground
2 GND Ground
3 +5V Power Supply
4 +5V Power Supply
6 GND Ground
13 CT106/CTS Clear to Send
15 ON/OFF Power On/Off *
21 GND Ground
24 GND Ground
25 CT103/TX Transmit
28 CT104/RX Receive
30 CT105/RTS Request to Send
* Connected to +5V for example
The serial link signals must be used through the implementation of the serial link level shifter. See “Figure 3-3: Level Shifter Application Diagram for Serial Link.”
Terminal Emulator Setup
Here below is an example based on the Windows TM Hyperterminal application (terminal emulator program).
Setup:
1. Go to START – PROGRAMS – ACCESSORIES – HYPERTERMINAL.
2. Start the Hyperterminal software.
3. Give the name of your choice, click on the icon of your choice, and click “OK.”
4. Choose these operating parameter values:
Connect using: direct to COM1 Properties: 115200 bps; 8 bits data; no parity; 1 stop bit; hardware flow control.
5. Click “OK.”
Once Hyperterminal is open and configured, it can be used to send AT commands to the ModemModule.
For assistance in testing your ModemModule, see the examples in the AT Command manual for MultiTech’s GSM/GPRS wireless modem products (GSM/GPRS AT Commands Reference Guide).
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 38

Reference Documents

Table 5-2: GSM ETSI Recommendations for Phase I and Phase II
Specification Reference Title
GSM ph2 Radio ETSI GSM 05.05 and GT 01 v4.2.1
DCS ph2 Radio ETSI GSM05.05 and GT01 v4.2.1
GSM ph2 Link-Management ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 an
GT 01 v4.2.1
GSM ph2 Link-Management ETSI GSM 03.06, 04.08, 05.05, 05.08, 05.10, 07.01 an
GT 01 v4.2.1
GSM ph2 Layer 2 ETSI GSM 04.06 and GT 01 v4.2.1
GSM ph2 Layer 3 ETSI GSM 04.08 and GT 01 v4.2.1
DCS ph2 Layer 3 ETSI GSM 04.08 and GT 01 v4.2.1
GSM/DCS Multiband ETSI GSM 02.07, 03.22, 04.08, 04.13, 05.05, 05.08 an
GT 01 v4.2.1
GSM ph2 SIM ETSI GSM 11.11 and GT 01 v4.2.1
GSM ph2 Teleservices ETSI GSM 03.50 and GT 01 v4.2.1
GSM ph2 Miscellaneous ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11,
06.10, 06.11, 06.12, 06.31, 06.32, 07.01, 09.07 and G 01 v4.2.1
DCS ph2 Miscellaneous ETSI GSM 02.07, 03.40, 03.41, 04.08, 04.10, 04.11,
06.10, 06.11, 06.12, 06.31, 06.32, 07.01, 09.07 and G 01 v4.2.1
Chapter 6 – Application Considerations
You can find the documents on ETSI Contacts: ETSI Secretariat F-06921 Sophia Antipolis cedex, France 06921 Sophia Antipolis cedex, France 06921 Sophia Antipolis cedex, France 06921 Sophia Antipolis cedex, France e-mail: secretariat@etsi.fr
http://www.etsi.org

Related Manuals

For information on Multi-Tech modem installation, AT commands, S-Registers, and testing; refer to the applicable user manual that came with your Multi-Tech modem. Multi-Tech manuals and other resources are on the Multi-Tech web page at http://www.multitech.com.
For additional Multi-Tech information, contact:
http://www.multitech.com for News, Products, Solutions, Support, Documents and more.
ftp://ftp.multitech.com/ for Modem Firmware, Modem INFs, Manuals, Utilities, etc.
email oemsales@multitech.com for email technical support.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 39
Chapter 6 – Application Considerations

Additional Information

European Telecommunications Standards Institute (ETSI) - Contact the ETSI at: 650, route des Lucioles 06921 Sophia-Antipolis Cedex France Tel: +33 (0)4 92 94 42 00 Fax: +33 (0)4 93 65 47 16
Global Engineering Documents manages a collection of more than one million documents from over 460 organizations worldwide:
http://global.ihs.com
Phone: 800-854-7179 Fax: 303-792-2192
The ITU is the leading publisher of telecommunication technology, regulatory and standard information, with over 4,000 titles in printed form, on CD-ROM and Online at
http://www.itu.int/publications/ .
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 40
Appendix A – Safety Precautions & Regulatory Standards Compliance
Appendix A – Safety Precautions & Regulatory Standards Compliance

Safety Precautions

IMPORTANT!
FOR THE EFFICIENT AND SAFE OPERATION OF YOUR GSM INTEGRATED MODEM READ THIS INFORMATION BEFORE USE.
RF Safety
General
Your ModemModule is based on the GSM standard for cellular technology. The GSM standard is spread all over the world. It covers Europe, Asia and some parts of America and Africa. This is the most used telecommunication standard. Your modem is actually a low power radio transmitter and receiver. It sends out and receives radio frequency energy. When you use your ModemModule integrated modem, the cellular system that handles your calls controls both the radio frequency and the power level of your cellular modem.
Exposure to RF Energy
There has been some public concern about possible health effects of using GSM modems. Although research on health effects from RF energy has focused on the current RF technology for many years, scientists have begun research regarding newer radio technologies, such as GSM. After existing research had been reviewed, and after compliance to all applicable safety standards had been tested, it has been concluded that the product was fitted for use. If you are concerned about exposure to RF energy there are things you can do to minimize exposure. Obviously, limiting the duration of your calls will reduce your exposure to RF energy. In addition, you can reduce RF exposure by operating your cellular modem efficiently by following the below guidelines.
Efficient Modem Operation
For your modem to operate at the lowest power level, consistent with satisfactory call quality:
· If your modem has an extendible antenna, extend it fully. Some models allow you to place a call with the antenna retracted. However your modem operates more efficiently with the antenna fully extended.
· Do not hold the antenna when the modem is « IN USE ». Holding the antenna affects call quality and may cause the modem to operate at a higher power level than needed.
Antenna Care and Replacement
Do not use the modem with a damaged antenna. If a damaged antenna comes into contact with the skin, a minor burn may result. Replace a damaged antenna immediately. Consult your manual to see if you may change the antenna yourself. If so, use only a manufacturer-approved antenna. Otherwise, have your antenna repaired by a qualified technician. Use only the supplied or approved antenna. Unauthorized antennas, modifications or attachments could damage the modem and may contravene local RF emission regulations or invalidate type approval.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 41
Appendix A – Safety Precautions & Regulatory Standards Compliance
General Safety
Driving
Check the laws and the regulations regarding the use of cellular devices in the area where you have to drive as you always have to comply with them. When using your modem while driving, please: give full attention to driving, pull off the road and park before making or answering a call if driving conditions so require.
Electronic Devices
Most electronic equipment, for example in hospitals and motor vehicles is shielded from RF energy. However RF energy may affect some improperly shielded electronic equipment.
Vehicle Electronic Equipment
Check your vehicle manufacturer representative to determine if any on-board electronic equipment is adequately shielded from RF energy.
Medical Electronic Equipment
Consult the manufacturer of any personal medical devices (such as pacemakers, hearing aids, etc...) to determine if they are adequately shielded from external RF energy. Turn your modem OFF in health care facilities when any regulations posted in the area instruct you to do so. Hospitals or health care facilities may be using RF monitoring equipment.
Aircraft
Turn your modem OFF before boarding any aircraft.
· Use it on the ground only with crew permission.
· Do not use it in the air.
To prevent possible interference with aircraft systems, Federal Aviation Administration (FAA) regulations require you to have permission from a crewmember to use your modem while the aircraft is on the ground. To prevent interference with cellular systems, local RF regulations prohibit using your modem while airborne.
Children
Do not allow children to play with your modem. It is not a toy. Children could hurt themselves or others (by poking themselves or others in the eye with the antenna, for example). Children could damage the modem, or make calls that increase your modem bills.
Blasting Areas
To avoid interfering with blasting operations, turn your unit OFF when in a « blasting area » or in areas posted: « turn off two-way radio ». Construction crews often use remote control RF devices to set off explosives.
Potentially Explosive Atmospheres
Turn your modem OFF when in any area with a potentially explosive atmosphere. It is rare, but your modem or its accessories could generate sparks. Sparks in such areas could cause an explosion or fire resulting in bodily injuries or even death. Areas with a potentially explosive atmosphere are often, but not always, clearly marked. They include fueling areas such as petrol stations; below decks on boats; fuel or chemical transfer or storage facilities; and areas where the air contains chemicals or particles, such as grain, dust, or metal powders. Do not transport or store flammable gas, liquid, or explosives, in the compartment of your vehicle that contains your modem or accessories. Before using your modem in a vehicle powered by liquefied petroleum gas (such as propane or butane) ensure that the vehicle complies with the relevant fire and safety regulations of the country in which the vehicle is to be used.
Safety Standards
THIS WIRELESS MODEMMODULE COMPLIES WITH ALL APPLICABLE RF SAFETY STANDARDS. This cellular modem meets the standards and recommendations for the protection of public exposure to RF electromagnetic energy established by governmental bodies and other qualified organizations, such as the following:
· Directives of the European Community,
· Directorate General V in Matters of Radio Frequency Electromagnetic Energy
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 42
Appendix A – Safety Precautions & Regulatory Standards Compliance
RF Exposures
Pursuant to 47 CFR § 24.52 of the FCC Rules and Regulations, personal communications services (PCS) equipment is subject to the radio frequency radiation exposure requirements specified in § 1.1307(b), § 2.1091 and § 2.1093 as appropriate.
The MultiTech ModemModule is a GSM (PCS 1900) terminal which operates in the US licensed PCS frequency spectrum. The device transmits over the 1850-1910 MHz band and receives over the 1930-1990 MHz Band. Mult-Tech Systems, Inc. certifies that it has determined that the Modem complies with the RF hazard requirements applicable to broadband PCS equipment operating under the authority of 47 CFR Part 24, Subpart E of the FCC Rules and Regulations. This determination is dependent upon installation, operation and use of the equipment in accordance with all instructions provided.
The Modem is designed for and intends to be used in fixed and mobile applications. "Fixed" means that the device is physically secured at one location and is not able to be easily moved to another location. "Mobile" means that the device is designed to be used in other than fixed locations and generally in such a way that a separation distance of at least 20cm is normally maintained between the transmitter's antenna and the body of the user or nearby persons. The Modem is not designed for or intends to be used in portable applications (within 20 cm of the body of the user) and such uses are strictly prohibited. To ensure that the unit complies with current FCC regulations limiting both maximum RF output power and human exposure to radio frequency radiation, a separation distance of at least 20cm must be maintained between the unit's antenna and the body of the user and any nearby persons at all times and in all applications and uses. Additionally, in mobile applications, maximum antenna gain must not exceed 3 dBi (to comply with Section 24.232(b) and is limited to 7 dBi for fixed applications. Finally, the tune-up procedure for the O9EM2113 ensures that the maximum RF output power of the device does not exceed 30.0 dBm within the variations that can be expected due to quantity production and testing on a statistical basis.
Instructions to OEMs
The MultiTech product manual includes specific warnings and cautions in order to ensure that OEMs are aware of their responsibilities, with regards to RF exposure compliance, for products into which the modem is integrated. With this guidance, the OEM will be able to incorporate into their documentation the necessary operating conditions and warnings.
OEMs need to provide a manual with the ‘’final’’ product that clearly states the operating requirements and conditions and that these must be observed to ensure compliance with current FCC RF exposure requirements / MPE limits (see the “RF Exposures” section above). This will enable the OEM to generate (and provide the end­user with) the appropriate operating instructions, warnings and cautions, and/or markings for their product.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 43
Appendix A – Safety Precautions & Regulatory Standards Compliance

Regulatory Standards Compliance

GSM compliance
Reference regulations: TBR 19, TBR 20, TBR 31, TBR 32.
Table B-1: ModemModule Acceptance Test
Tests Applied Standard Acceptance Criteria
Performance Test
Cooking Test The test continues even after the Cooking Test
Stress Test Thermal shocks,
Vibration Test Sinusoidal vibration,
Vibration Test Random vibration,
Shock Test IEC 68-2-27. No performance degradation or mechanical
Bump Test IEC 68-2-29. No performance degradation or mechanical
Humidity Test Corrosion test,
Warehouse Test
Warehouse Test
Dust Test MIL-STD-810D,
Light Test UV radiation and
Fall Test IEC 68-2-32. Only minor casing degradation is allowed, with a
Electro Static Discharge Test Salt Mist Test Atmosphere Test Marking Test EN 60 950 After the test, visual inspection on the unit. No
ETSI recommendation for GSM/DCS communication
IEC 68-2-14.
IEC 68-2-6.
IEC 68-2-36.
IEC68-2-3.
Low temperature IEC 68-2-1.
High temperature IEC 68-2-2.
method 510-3.
temperature EDF HN60E03.
IEC 100-4-2. No performance degradation allowed after the test.
IEC 68-2-11. After the test, visual inspection on the unit.
Flowing mixed gas corrosion. IEC 68-2-60.
Full conformity to the recommendation regarding the main RF parameters.
milestone has been reached. Full conformity to the recommendation regarding the main parameters. No performance degradation or mechanical degradation is allowed after test. No performance degradation or mechanical degradation is allowed after test.
degradation is allowed after test.
degradation is allowed after test. No visible degradation of the product, both visual and functional. The unit is tested at room temperature and must be fully operative for the main RF parameters. Under normal conditions (room temperature) after the test, the unit must behave in full conformity with the main RF parameters. Under normal conditions (room temperature) after the test, the unit must behave in full conformity with the main RF parameters. No visible dust in the visible areas. No more than 50 dust particles in the cabinet of the product. The unit, tested at room temperature, must be fully operative. Visual inspection on the discoloration and other degradation effects such as cracks I the material of the unit after test.
maximum dimension change of 1mm. The unit must remain fully operative and fully meet specifications for the main RF parameters.
After the test, visual inspection on the unit and inside.
degradation is allowed on the marking.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 44
Appendix A – Safety Precautions & Regulatory Standards Compliance
FTA Compliance
The ModemModule has received a Full-Type Approval (according to normal MS requirements) in the configuration using the internal SIM interface.
IMEI Number
GSM 900/1800: TAC: 5 000 64 FAC: 11 Serial Numbers: 000000 to 999999
GSM 900/1900: TAC: 500 100 FAC: 11 Serial Number: 000000 to 999999
GSM/GPRS 900/1800: TAC: 500161 FAC: 11 Serial Numbers: 000000 to 999999
GSM/GPRS 900/1900: TAC: 500167 FAC: 11 Serial Number: 000000 to 999999
CE Label
The Wireless ModemModule is CE compliant which implies that the modem is in conformity with the European Community directives and it bears the CE label.
Carrying out tests: Electro-magnetic field immunity EN 61000-4-3 ETS 300-342—1
Radiated emission EN 55022 ETS 300-342
ESD immunity EN 61000-4-2 ETS 300-342-1
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 45
Appendix B – Sourcing Guide for Connectors/Peripherals
Appendix B – Sourcing Guide for Connectors and Peripheral Devices

Where to Find SMD Connectors

The ModemModule matting interface connector is made by SAMTEC France (http://www.samtec.com/). Many SAMTEC products are available via SAMTEC dealers throughout the world. Connector data sheets are presented later in this appendix.
Figure B-1: High- and Low-Profile Connectors
SAMTEC Reference Number for High-Profile Connector:
FLE-125-01-G-DV
Figure B-2: Flexible Flat Cable
Reference Number for Flexible Flat Cable: SD 25 01 N
Figure B-3: Flexible Cable Receptacle
SAMTEC Reference Number for Flex Cable Connector: FTS-125-01-L-DV-A
SAMTEC Reference Number for Low-Profile Connector:
CLP-125-02-L-D
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 46
Appendix B – Sourcing Guide for Connectors/Peripherals

GSM Antenna

The integrated modem antenna connector is a MMCX connector. The MMCX connector incorporates a 'Snap On' latching action in order to make the connection easier with an excellent RF performance. An additional advantage is its small physical size which is 50% of the standard MCX connector.
This type of connector is suitable for the standard ranges of flexible and semi-rigid cables. The characteristic impedance of the MMCX coaxial connector is 50 ohm. The antenna manufacturer must guarantee that the antenna will be working according to the radio characteristics presented in the table below.
Table B-1: Radio Characteristics
GSM 850 EGSM 900 DCS 1800 PCS 1900
Frequency
869 to 894 MHz 925 to 960 MHz 1805 to 1880 MHz 1930 to 990 MHz
RX
Frequency
824 to 849 MHz 880 to 915 MHz 1710 to 1875 MHz 1850 to 910 MHz
TX
RF Power Stand
Impedance
VSWR
Typical
2W at 12.5% duty cycle
2W at 12.5% duty cycle
1W at 12.5% duty cycle
50 ohms
<2
0 dBi on azimuth plane
Radiated Gain
The ModemModule requires an MMCX plug to connect to an antenna.
Figure B-6: MMCX Connector Example (right angle type)
An antenna with matting connector can be ordered, for example, from :
IMS Connectors Systems GMBH http://www.imscs.com/
1W at 12.5% duty cycle
A small MMCX / SMA adapter can be ordered, for example, from :
Amphenol http://www.amphenol.com/ Order No: 908-31100

SIM Card Holder

The SIM card holder used in the integrated modem is a MOLEX connector. Part number connector: 99228. Part number holder : 91236. For more information about this connector:
http://www.molex.com/
It is possible to use a stand-alone SIM cardholder through the 50-pin connector but the length of the SIM line must not exceed 15 cm.
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 47
Appendix C – AT Command List
Appendix C – AT Command List
For comprehensive information about AT Commands, please read the AT Command Manual.
Table C-1a : AT Command List
General Commands
+CGMI Manufacturer Identification
+CGMM Request Model Identification
+CGMR Request Revision Identification
+CGSN Product Serial Number
+CSCS Select TE Character Set
+CIMI Request IMSI
+CCID Card Identification
+GCAP Capabilities List
A/ Repeat Last Command
+CPOF Power Off
+CFUN Set Phone Functionality
+CPAS Phone Activity Status
+CMEE Report Mobile Equipment Errors
+CKPD Keypad Control
+CCLK Clock management
+CALA Alarm management
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 48
Table C-1b : AT Command List (cont’d)
Call Control Commands
D Dial command
H Hang-up Command
A Answer a Call
+CEER Extended Error Report
+VTD, +VTS DTMF Signals
ATDL Redial Last Telephone Number
AT%Dn Automatic Dialing (or SMS send) with DTR
ATSO Automatic Answer
+CICB Incoming Call Bearer
+VGR, +VGT Gain Control
+CMUT Microphone Mute Control
+SPEAKER Speaker and Microphone Selection
+ECHO Echo Cancellation
+SIDET Side Tone Modification
+VIP Initialize Voice Parameters
+CSNS Single Numbering Scheme
Appendix C – AT Command List
Network Service Commands
+CSQ Signal Quality
+COPS Operator Selection
+CREG Network Registration
+WOPN Read Operator Name
+CPOL Preferred Operator List
Security Commands
+CPIN Enter PIN
+CPIN2 Enter PIN2
+CPINC PIN Remaining Attempt Number
+CLCK Facility Lock
+CPWD Change Password
Phone Book Commands
+CPBS Select Phone Book Memory Storage
+CPBR Read Phone Book Entries
+CPBF Find Phone Book Entries
+CPBW White Phone Book Entry
+CPBP Phone Book Phone Search
+CPBN Move Action in Phone Book
+CNUM Subscriber Number
+WAIP Avoid Phone Book Init
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 49
Table C-1c: AT Command List (cont’d)
Short Message Commands
+CSMS Select Message Service +CNMA New Message Acknowledgement +CPMS Preferred Message Storage +CMGF Preferred Message Format +CSAS Save Settings +CRES Restore Settings +CSDH Show Text Mode parameters +CNMI New Message Indication +CMGR Read Message +CMGL List Message +CMGS Send Message +CMGW Write Message to Memory +CMSS Send Message from Storage +CSMP Set Text Mode Parameters +CMGD Delete Message +CSCA Service Center Address +CSCB Select Cell Broadcast Message Types +WCBM Cell Broadcast Message Identifiers +WMSC Message Status Modification +WMGO Message Overwriting
Supplementary Services Commands
Appendix C – AT Command List
+CCFC Call Forwarding +CLCK Call Barring +CPWD Modify SS Password +CCWA Call Waiting +CLIR Calling Line Identification Restriction +CLIP Calling Line Identification Presentation +COLP Connected Line Identification Presentation +CAOC Advice Of Charge +CACM Accumulated Call Meter +CAMM Accumulated Call Meter Maximum +CPUC Price Per Unit and Currency Table +CHLD Call Related Supplementary Services +CLCC List Current Calls +CSSN Supplementary Service Notifications +CUSD Unstructured Supplementary Service Data +CCUG Closed User Group
Data Commands
+CBST Bearer Type Selection +FCLASS Select Mode +CR Service Reporting Control +CRC Cellular Result Codes +ILRR DTE-DCE Local Rate Reporting +CRLP Radio Link Protocol Parameters +DOPT Others Radio Link Parameters %C Select Data Compression +DS V42 bis Data Compression +DR V42 bis Data Compression Report \N Select Data Error Correcting Mode
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 50
Table C-1d: AT Command List (cont’d)
Fax Commands
+FTM Transmit Speed +FRM Receive Speed +FTH HDLC Transmit Speed +FRH HDLC Receive Speed +FTS Stop Transmission and Wait +FRS Receive Silence
Fax Class 2 Commands
+FDT Transmit Data +FDR Receive Data +FET Transmit Page Punctuation +FPTS Page Transfer Status Parameters +FK Terminate Session +FBOR Page Transfer Bit Order +FBUF Buffer Size Report +FCQ Copy Quality Checking +FCR Capability to Receive +FDIS Current Sessions Parameters +FDCC DCE Capabilities Parameters +FLID Local ID String +FPHCTO Page Transfer Timeout Parameter
V24 - V25 Commands
Appendix C – AT Command List
+IPR Fixed DTE Rate +ICF DTE-DCE Character Framing +IFC DTE-DCE Local Flow Control &C Set DCD Signal &D Set DTR Signal &S Set DSR Signal O Back to Online Mode Q Result Code Suppression V DCE Response Format Z Default Configuration &W Save Configuration &T Auto-Tests EEcho &F Restore Factory Settings &V Display Configuration I Request Identification Information
SIM Toolkit Commands
+STSF SIM Toolkit Set Facilities +STIN SIM Toolkit Indication +STGI SIM Toolkit Get Information +STCR SIM Toolkit Control Response +STGR SIM Toolkit Give Response
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 51
Table C-1e: AT Command List (cont’d)
Specific AT Commands
+CCED Cell Environment Description
+CCED Automatic RxLev Indication
+WIND General Indications
+ADC Analog Digital Converters Measurements
+CMER Mobile Equipment Event Reporting
+WLPR Read Language Preference
+WLPW Write Language Preference
+WIOR Read GPIO Value
+WIOW Write GPIO Value
+WAC Abort Command
+WTONE Play Tone
+WDTMF Play DTMF Tone
+WDWL MultiTech Downloading
+WVR MultiTech Voice Rate
+WDR Data Rate
+WHWV Hardware Version
+WDOP Date Of Production
+WSVG MultiTech Select Voice Gain
+WSTR MultiTech Status Request
+WSCAN MultiTech Scan
+WRIM Ring Indicator Mode
+W32K Power saving mode
Appendix C – AT Command List
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 52
Appendix D – Acronyms and Abbreviations
Appendix D – Acronyms and Abbreviations
ADC : Analog Digital Converter ASIC : Application Specific Integrated Circuit BCCH : Broadcast Control Channel CE : Communauté Européenne CLK : Clock CTS : Clear To send dB : decibel DCD : Data Carrier Detect DCE : Data Circuit Terminating Equipment DSR : Data Set Ready DTE : Data Terminal Equipment DTR : Data Terminated Ready EFR : Enhanced Full Rate E-GSM : Extended- GSM EMC : Electromagnetic Conformity EN : Enable ETSI : European Telecommunications Standards Institute FAC : Final Assembly Code FR : Full-Rate FTA : Full Type Approval GND : Ground GPIO : General Purpose Input Output GPRS : General Packet Radio Service GSM : Global System for Mobile Communication HR : Half-Rate IMEI : International Mobile Equipment Identity MO : Mobile Originated MT : Mobile Terminated OEM : Original Equipment Manufacturer PDA : Personal Digital Assistant PCB : Printed Circuit Board PRES : Presence RI : Ring Indicator RTS : Request To Send SIM : Subscriber Identity Module SMD : Surface Mounted Design SMS : Short Message Service TAC : Type Approval Code TDMA : Time Code Multiple Access TE : Terminal Equipment VSWR : Voltage Standing Wave Ratio WAP : Wireless Application Protoc
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 53
Index
Appendix D – Acronyms and Abbreviations
1
1X ....................................................14, 15, 16, 19, 31
2
2X ........................................14, 15, 16, 19, 23, 24, 29
3
3X ......................................................................15, 16
A
advice of charge.........................................................8
Advice of Charge.......................................................7
Advice Of Charge....................................................50
analog ............................................................7, 37, 53
antenna...............................7, 8, 33, 37, 41, 42, 43, 47
antenna cable ...........................................................37
asynchronous .........................................................7, 8
AT command ...................................................6, 7, 39
autobauding ...............................................................7
AUXV0..............................................................14, 24
B
baud rate ....................................................................7
BOOT ................................................................14, 22
bursts..................................................................17, 18
C
Call Barring .........................................................7, 50
Call Forwarding...................................................7, 50
Call Hold ...................................................................7
Call Waiting.........................................................7, 50
Calling Line Identity..................................................7
casing.......................................................................44
CE......................................................................45, 53
Cell Broadcast .....................................................6, 50
Class 1 .........................................................5, 6, 7, 12
Class 10 .................................................................5, 6
Closed User Group ..............................................7, 50
CMOS................ 14, 15, 16, 19, 20, 22, 23, 24, 29, 31
column ...............................................................15, 31
connector .................5, 6, 7, 10, 13, 15, 29, 33, 46, 47
converter..................................................................24
D
data ....................................5, 6, 7, 8, 9, 13, 19, 38, 46
Data Carrier Detect............................................19, 53
dB ................................................................12, 33, 53
DCS .......................................................12, 33, 39, 44
digital.......................................................7, 24, 31, 37
DTE/DCE Interface Rates .......................................33
dual-band ...................................................................5
E
EFR..................................................................6, 8, 53
Electrical Characteristics .........................................13
EMC protection .......................................................37
emergency calls .........................................................8
ESD protection ........................................................37
ETSI.......................................................33, 39, 44, 53
Explicit Call Transfer ................................................7
F
fax..........................................................................5, 7
fixed dialing number..................................................8
FR ....................................................................6, 8, 53
G
gain ..............................................................25, 26, 43
general purpose..................................................13, 15
GND ....................................14, 15, 17, 29, 30, 38, 53
GPIO............................................................24, 52, 53
GPRS ................................... 1, 5, 6, 7, 8, 9, 18, 45, 53
ground plane .................................... 17, 26, 27, 28, 37
GSM1, 5, 6, 7, 8, 9, 12, 19, 29, 32, 33, 37, 39, 41, 43,
44, 45, 47, 53
H
handset.....................................................................25
hardware ..........................................5, 6, 8, 21, 22, 38
HR ...................................................................6, 8, 53
I
I/O14, 15, 16, 19, 20, 22, 23, 24, 25, 26, 27, 28, 29,
30, 31, 32
idle .....................................................................17, 18
idle mode ...........................................................17, 18
interface ... 5, 6, 7, 8, 13, 15, 19, 29, 31, 32, 37, 45, 46
M
MIC1N...............................................................14, 26
MIC1P ...............................................................14, 26
MIC2N...............................................................14, 25
MIC2P ...............................................................14, 25
microphone........................................................25, 26
MMCX (Miniature Micro Connector).......6, 7, 33, 47
MNP2 ........................................................................7
MO.............................................................6, 8, 42, 53
modem ......... 5, 6, 7, 17, 20, 31, 39, 41, 42, 43, 45, 47
module ................................................. 5, 8, 10, 14, 22
mounting....................................................................6
MT ...................................................................6, 8, 53
multiparty ..................................................................8
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 54
Index
N
nominal value ..........................................................17
O
OFF............................................ 14, 20, 21, 23, 38, 42
ON/~OFF...........................................................14, 20
operating conditions ................................................43
P
PCB ...................................................................10, 53
PCS....................................................................33, 43
phone book ............................................................7, 8
power6, 8, 13, 17, 21, 22, 27, 28, 29, 32, 33, 37, 41,
43
power supply................................................17, 29, 32
R
radio....................................................... 41, 42, 43, 47
real time clock ...........................................................8
RF ................ 5, 7, 8, 10, 13, 33, 37, 41, 42, 43, 44, 47
RST........................................................14, 22, 23, 30
S
serial link .................................................7, 19, 37, 38
signal..........................................20, 22, 23, 29, 31, 32
SIM5, 6, 7, 10, 13, 15, 29, 30, 31, 32, 36, 37, 39, 45,
47, 51, 53
SIM Toolkit .........................................................7, 51
SIMCLK................................................15, 29, 30, 32
SIMDATA.............................................15, 29, 30, 32
SIMPRES ................................................................15
SIMRST.................................................15, 29, 30, 32
SIMVCC................................................15, 29, 30, 32
SMS ....................................................... 5, 6, 8, 49, 53
socket.............................................................6, 15, 29
speaker...................................................25, 27, 28, 37
Specifications
technical ...............................................................10
SPI .....................................................................15, 31
SPK1N...............................................................14, 28
SPK1P ...............................................................14, 28
T
Technical specifications...........................................10
telephony ...................................................................8
terminal..................................................19, 37, 38, 43
U
UCS2 .........................................................................7
USSD.....................................................................7, 8
V
V.42bis ......................................................................7
Vcc.....................................................................14, 30
voice ..........................................................................5
W
WAP ........................................................................53
X
Xmodem ....................................................................7
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 55
Index
LIST OF FIGURES
Figure 1-1: MultiTech’s Wireless ModemModule GSM/GPRS 5 Figure 1-2: Mechanical Description A 10 Figure 1-3: Mechanical Description B 10 Figure 2-1: ModemModule Dimensions 11 Figure 3-1: 50-Pin Connector 16 Figure 3-2: Pin Numbering – Bottom View 17 Figure 3-3: Level Shifter Application Diagram for Serial Link 20 Figure 3-4: Power-Off Procedure 1 21 Figure 3-5: Power-Off Procedure 2 21 Figure 3-6: Boot Procedure 22 Figure 3-7: Reset Procedure 22 Figure 3-8: Microphone 2 Input 25 Figure 3-9: Microphone 1 Input 26 Figure 3-10: Speaker 2 Output 27 Figure 3-11: Speaker 1 Output 28 Figure 3-12: SIM Socket 31 Figure 3-13: SIM Schematic 36 Figure 4-1: ModemModule Test SM Card Layout Error! Bookmark not defined. Figure 4-2: ModemModule Test SM Board Block Diagram Error! Bookmark not defined. Figure B-1: High- and Low-Profile Connectors 46 Figure B-2: Flexible Flat Cable 46 Figure B-3: Flexible Cable Receptacle 46 Figure B-4: Samtec Low-Profile Sockets Error! Bookmark not defined. Figure B-5: Samtec Cable Strips Error! Bookmark not defined. Figure B-6: MMCX Connector Example (right angle type) 47
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 56
Index

LIST OF TABLES

Table 2-1 : Climatic and Mechanical Environment Testing Compliance 12 Table 3-1a. 50-pin Connector Description 14 Table 3-1b. 50-Pin Connector Description 15 Table 3-2. Operating Conditions 16 Table 3-3: Power Supply Pin Description 17 Table 3-4: Power Consumption in EGSM-only mode @25 degrees C 17 Table 3-5: Power Consumption in GSM-only 1800 & 1900 MHz modes @25 degrees C 18 Table 3-6: Power Consumption in EGSM/GPRS cl2 mode @25 degrees C 18 Table 3-7: Power Consumption in EGSM-only mode @25 degrees C 18 Table 3-8: Serial Link Pin Description 19 Table 3-9: ON / OFF Pin Description 20 Table 3-10: BOOT Pin Description 22 Table 3-11: Reset Signal Pin Description 23 Table 3-12: Reset Signal Electrical Characteristics 23 Table 3-13: Reset Signal Operating Conditions 23 Table 3-14 : Flashing LED Pin Description 23 Table 3-15 : LED and ModemModule Status 23 Table 3-16 : General Purpose I/O Pin Description 24 Table 3-17: A/D Converter Pin Description 24 Table 3-18: A/D Converter Electrical Characteristics 24 Table 3-19 : Microphone 2 Input Pin Description 25 Table 3-20 : Microphone 1 Input Pin Description 26 Table 3-21 : Speaker 2 Output Pin Description 27 Table 3-22 : Speaker 1 Output Pin Description 28 Table 3-23: SIM Interface Pin Description 29 Table 3-24: SIM Interface Electrical Characteristics 30 Table 3-25: SIM Socket Pin Description 30 Table 3-26 : SPI Bus Pin Description 31 Table 3-27 : Keypad Interface Pin Description 31 Table 5-1: Minimum Signals to Operate the ModemModule 38 Table 5-2: GSM ETSI Recommendations for Phase I and Phase II 39 Table B-1 : ModemModule Acceptance Test 44 Table B-1: Radio Characteristics 47 Table C-1a : AT Command List 48 Table C-1b : AT Command List (cont’d) 49 Table C-1c: AT Command List (cont’d) 50 Table C-1d: AT Command List (cont’d) 51 Table C-1e: AT Command List (cont’d) 52
Wireless ModemModule MTMMC-G-F1 and MTMMC-G-F2 Developer’s Guide 57
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