INFINEON IPB06N03LA, IPI06N03LA, IPP06N03LA User Manual
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IPB06N03LA
IPI06N03LA, IPP06N03LA
OptiMOS®2 Power-Transistor
Product Summary
Features
• Ideal for high-frequency dc/dc converters
• N-channel
• Logic level
• Excellent gate charge x R
• Very low on-resistance R
product (FOM)
DS(on)
DS(on)
• Superior thermal resistance
• 175 °C operating temperature
• dv /dt rated
Type Package Ordering Code Marking
IPB06N03LA P-TO263-3-2 Q67042-S4146 06N03LA
V
DS
R
DS(on),max
I
D
25 V
(SMD version) 5.9
50 A
P-TO220-3-1P-TO262-3-1P-TO263-3-2
mΩ
IPI06N03LA P-TO262-3-1 Q67042-S4147 06N03LA
IPP06N03LA P-TO220-3-1 Q67042-S4148 06N03LA
Maximum ratings, at T
Parameter Symbol Conditions Unit
Continuous drain current
Pulsed drain current
Avalanche energy, single pulse
Reverse diode dv /dt dv /dt
Gate source voltage
Power dissipation
Operating and storage temperature
=25 °C, unless otherwise specified
j
I
D
TC=25 °C
T
I
D,pulse
E
AS
TC=25 °C
ID=45 A, RGS=25 Ω
I
di /dt =200 A/µs,
T
3)
V
GS
P
tot
T
, T
j
TC=25 °C
stg
1)
=100 °C
C
2)
=50 A, VDS=20 V,
D
=175 °C
j,max
Value
50 A
50
350
225 mJ
6 kV/µs
±20 V
83 W
-55 ... 175 °C
IEC climatic category; DIN IEC 68-1 55/175/56
Rev. 1.3 page 1 2003-12-18
IPB06N03LA
IPI06N03LA, IPP06N03LA
Parameter Symbol Conditions Unit
Values
min. typ. max.
Thermal characteristics
Thermal resistance, junction - case
SMD version, device on PCB
Electrical characteristics, at T
=25 °C, unless otherwise specified
j
R
thJC
R
thJA
minimal footprint - - 62
6 cm
2
cooling area
4)
- - 1.8 K/W
--40
Static characteristics
Drain-source breakdown voltage
Gate threshold voltage
Zero gate voltage drain current
V
(BR)DSSVGS
V
GS(th)
I
DSS
=0 V, ID=1 mA
VDS=VGS, ID=40 µA
VDS=25 V, VGS=0 V,
T
=25 °C
j
25 - - V
1.2 1.6 2
- 0.1 1 µA
V
=25 V, VGS=0 V,
DS
T
=125 °C
j
Gate-source leakage current
Drain-source on-state resistance
I
R
GSS
DS(on)
VGS=20 V, VDS=0 V
VGS=4.5 V, ID=30 A
V
=4.5 V, ID=30 A,
GS
SMD version
V
=10 V, ID=30 A
GS
V
=10 V, ID=30 A,
GS
SMD version
Gate resistance
Transconductance
1)
Current is limited by bondwire; with an R
2)
See figure 3
3)
T
=150 °C and duty cycle D <0.25 for VGS<-5 V
j,max
4)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
R
G
g
thJC
fs
|VDS|>2|ID|R
I
=30 A
D
=1.8 K/W the chip is able to carry 91 A.
DS(on)max
,
- 10 100
- 10 100 nA
- 7.9 9.9
- 7.6 9.5
- 5.2 6.2
- 4.9 5.9
- 1.2 -
26 52 - S
mΩ
Ω
Rev. 1.3 page 2 2003-12-18
IPB06N03LA
y
g
IPI06N03LA, IPP06N03LA
Parameter Symbol Conditions Unit
Values
min. typ. max.
namic characteristics
D
Input capacitance
Output capacitance
Reverse transfer capacitance
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate Char
e Characteristics
Gate to source charge
Gate charge at threshold
C
iss
V
=0 V, VDS=15 V,
C
oss
C
rss
t
d(on)
t
r
t
d(off)
t
f
5)
Q
gs
Q
g(th)
GS
f =1 MHz
V
=15 V, VGS=10 V,
DD
I
=25 A, RG=2.7 Ω
D
- 1995 2653 pF
- 848 1128
- 124 186
-1116ns
-2538
-3045
- 7.0 10
-79nC
- 3.2 4.2
Gate to drain charge
Switching charge
Gate charge total
Gate plateau voltage
Gate charge total, sync. FET
Output charge
Reverse Diode
Diode continous forward current
Diode pulse current
Diode forward voltage
Reverse recovery charge
Q
gd
Q
sw
Q
g
V
plateau
Q
g(sync)
Q
oss
I
S
I
S,pulse
V
SD
Q
rr
V
=15 V, ID=25 A,
DD
V
=0 to 5 V
GS
VDS=0.1 V,
V
=0 to 5 V
GS
VDD=15 V, VGS=0 V
TC=25 °C
VGS=0 V, IF=50 A,
T
=25 °C
j
VR=15 V, IF=IS,
di
/dt =400 A/µs
F
-57
-812
-1622
- 3.3 - V
-1419nC
-1822
- - 50 A
- - 350
- 0.94 1.2 V
- - 10 nC
5)
See figure 16 for gate charge parameter definition
Rev. 1.3 page 3 2003-12-18
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