Integrated Device Technology Inc IDT49C465PQFB, IDT49C465AG, IDT49C465AGB, IDT49C465APQF, IDT49C465APQFB Datasheet

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Integrated Device Technology, Inc.
32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT
IDT49C465
IDT49C465A
FEATURES
• 32-bit wide Flow-thruEDC unit, cascadable to 64 bits
• Single-chip 64-bit Generate Mode
• Separate system and memory buses
• On-chip pipeline latch with external control
• Supports bidirectional and common I/O memories
• Corrects all single-bit errors
• Detects all double-bit errors, some multiple-bit errors
• Error Detection Time — 12ns
• Error Correction Time — 14ns
• On chip diagnostic registers.
• Parity generation and checking on system data bus
• Low power CMOS — 100mA typical at 20MH
Z
• 144-pin PGA and PQFP packages
• Military product compliant to MIL-STD 883, Class B
SIMPLIFIED FUNCTIONAL BLOCK DIAGRAM
MD0–31
MD
Latch
MLE
Memory
Checkbit
Generator
DESCRIPTION
The IDT49C465/A is a 32-bit, two-data bus, Flow-thruEDC unit. The chip provides single-error correction and two and three bit error detection of both hard and soft memory errors. It can be expanded to 64-bit widths by cascading 2 units, without the need for additional external logic. The Flow­thruEDC has been optimized for speed and simplicity of control.
The EDC unit has been designed to be used in either of two configurations in an error correcting memory system. The bidirectional configuration is most appropriate for systems using bidirectional memory buses. A second system configuration utilizes external octal buffers, and is well suited for systems using memory with separate I/O buses.
The IDT49C465/A supports partial word writes, pipelining and error diagnostics. It also provides parity protection for data on the system side.
Correct
Logic
0–7
CBI
PCBI0–7
SD0–31
SD
Latch
SLE PLE
Checkbit
Latch
Pipeline
Mux
CONTROL
Latch
Byte Mux
CONTROL
Generator
Syndrome
System
Checkbit
Generator
Detect
Logic
Logic
Expansion
CONTROL
Mux
CONTROL
ERR
MERR
0–7
CBO
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MILITARY AND COMMERCIAL TEMPERATURE RANGES AUGUST 1995
1995 Integrated Device Technology, Inc. 11.7 DSC-9028/7
1
IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATION
1
0
0
CC
V
4BE0
SD
SD3
2
SD
0
SD1SD
PCBI7PCBI6PCBI5PCBI4PCBI3PCBI2PCBI1PCBI
0
CODE ID
CODE ID
GND
GND
1
MODE
MODE
MERR
SYO7SYO6SY05SY0
ERR
4
3
GND
SY0
0
SYO2SYO1SYO
2
MD0MD1MD
CC
V
V
CC
SD SD
SD SD
SD SD SD GND
BE SD SD
SD SD
SLE PLE
SOE
GND SD
SD SD SD
BE SD SD SD
GND SD
SD SD
SD SD
BE SD
V
CC
V
CC
10 11
12 13 14 15
16 17
18 19
20 21 22
23 24 25 26 27
28
72 37
73
5 6
7 8 9
1
49C465Y
PQ144-2
2
3
108
36
V
CC
V
CC
MD MD
MD MD MD MD MD
3 4
5 6 7 8 9
GND MD
10
MD
11
MD
12
MD
13
MD
14
MD
15
MLE MOE GND MD
16
MD
17
MD
18
MD
19
MD
20
MD
21
MD
22
MD
23
GND MD
24
MD
25
MD
26
MD
27
MD
28
MD
29
MD
30
1
V
CC
144109
VCC
29
SD
31SD30
SD
0
CBO
2
1
CBO
CBO
3
CBO
4
CBO
CBOE
5
CBO
6
CBO
7
PSEL
CBO
3
P
PERR
TOP VIEW
GND
0P1
P
MODE 2
CLEAR
SYNCLK
SCLKEN
0
CBI
1
CBI
2
CBI
3
CBI
4
CBI
GND
5
CBI
6
CBI
7
CBI
31
CC
V
MD
2552 drw 02
2
P
GND
PQFP
11.7 2
IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN CONFIGURATION
15
14
13
12
11
10
9
8
7
6
5
VCC SD 2 SD 6 SD 4
SD 5
SD 9
SD 11
SD 7
SD 10SD 12
SD 15
SLE
SOE
BE 1 GND
SD 13
PLE GND
SD 19SD 17
SD 18
BE
PCBI 6 PCBI 5
BE 0 SD 3 SD 0
VCC
SD 8
SD 14
SD 16
2
SD 20
SD 25SD 22SD 21
PCBI PCBI 4PCBI 7
CODE
3
ID PCBI 1
PCBI 2
1
CODE
0
ID PCBI 0SD 1
MODE
1
MODE
0
G144-2
MERR ERR SYO 6 SYO 4
SYO 7
SYO 5
SYO 2
SYO 0
SYO 3
MD 0
VCCGNDGNDGND
SYO 1
MD 1
MD 2 VCC
MD 4 MD 8
MD 12
MD
GND
MD
MD 27
20
GND
MD 21
MD 23
MD 25
VCC
MD 5
MD
GND
MD 11MD 10MD 7
MD
14MOE MLE
MD 16MD 17
MD 18
MD 19
MD 22
9MD 6MD 3
15MD 13
4
SD 23
3
SD 27 SD 29
2
1
SD
GND
VCC
VCC SD 30
24 BE 3
SD 28SD 26
CB0 1 CB0 3
NC*
VCC
SD 31
CB0 0 CBOE
CB0 2
CB0 4
CB0 5
CB0 7
CB0 6 PERRPSEL
GND
P
3
P2
GND
MODE
2
P1
SCLK
EN
SYN­CLK
0
P
GND
CB1
CLEAR
0
CB1 6
CB1 3 CB1 1
VCC
CB1 7
CB1 4 CB1 2
MD 28
MD 30
MD 31 CB1 5 VCC
ABC DEFGHJ KLMNPR
*Tied to Vcc internally
PGA (CAVITY UP)
TOP VIEW
MD 24
MD 26
MD 29
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IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
DETAILED FUNCTIONAL BLOCK DIAGRAM
CBI0–7
MLE
8
MUX
8
8
BIT
LATCH
CHECK
MUX
8
MD
CHECKBIT
Dashed Line = Diagnostic path
8
0–7
SYNDROME
PCBI
8
GENERATOR
8
MD
LATCH
GENERATOR
8
ERROR
CORRECT
0–31
MD
CLEAR
INTERNAL SYNCLK
BYTE MUX
LATCHES
ERROR DATA LATCH
DIAGNOSTIC
MUX
MOE
4
BE 0–3
0–7
CBO
8 8
MUX
8
SD
CHECKBIT
GENERATOR
CBOE
SD
CHECKBIT
GENERATOR
8
PCBI0–7
8
ME
FINAL
SYNDRO
INTERNAL
MUX MUX
8
8
PIPE
LATCH
MUX
ERROR
DETECT
ERR
MERR
8
0–7
SYO
PLE
SOE
4
0–3
1 OF 4
BYTES
BE
SD0–31
SD
LATCH
SLE
PSEL
GEN
PARITY
4
4
0–3
P
CHECK
PARITY
4
INTERNAL SYNCLK
/ERR
PERR
CLEAR
SYNCLK
SCLKEN
LOGIC
CONTROL
2
3
0–2
MODE
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CODE ID 0,1
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IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
SYSTEM CONFIGURATIONS
The IDT49C465 EDC unit can be used in various configurations in an EDC system. The basic configurations are shown below.
Figure 1 illustrates a bidirectional configuration, which is most appropriate for systems using bidirectional memory buses. It is the simplest configuration to understand and use. During a correction cycle, the corrected data word can be simultaneously output on both the system bus and memory bus. Logically, no other parts are required for the correction function. During partial-word-write operations, the new bytes are internally combined with the corrected old bytes for checkbit generation and writing to memory.
CPU
I/O
SD MD
EDC
CBI
CBO
Figure 1. Common I/O Configuration
MEMORY
I/O
CHECKBITS
2552 drw 05
Figure 3 illustrates a third configuration which utilizes external buffers and is also well suited for systems using memory with separate I/O buses. Since data from memory does not need to pass through the part on every cycle, the EDC system may operate in “bus-watch” mode. As in the separate I/O configuration, corrected data is output on the SD outputs.
MEMORY
INPUT BUS
EXT. BUFFER
EXT.BUFFER
Figure 3. Bypassed Separate I/O Configuration
CHECKBIT
I/O
CBICBO
SD MD
EDC
CPU BUS
MEMORY
OUTPUT BUS
EXT. BUFFER
2552 drw 07
Figure 2 illustrates a separate I/O configuration. This is appropriate for systems using separate I/O memory buses. This configuration allows separate input and output memory buses to be used. Corrected data is output on the SD outputs for the system and for re-write to memory. Partial word-write bytes are combined externally for writing and checkbit generation.
CPU
EXT. BUFFER
EDC
SD
MD
CBI
CBO
MEMORY
INPUTS
MEMORY
OUTPUTS
CHECKBITS
2552 drw 06
Figure 4 illustrates the single-chip generate-only mode for very fast 64-bit checkbit generation in systems that use separate checkbit-generate and detect-correct units. If this is not desired, 64-bit checkbit generation and correction can be done with just 2 EDC units. 64-bit correction is also straight­forward, fast and requires no extra hardware for the expansion.
MEMORY
INPUT BUS
BUFFER
CHECK
BITS OUT
CBO
64-BIT
GEN.
ONLY
EDC
MEMORY
INPUT BUS
CHECK BITS IN
BUFFER BUFFER BUFFER
CPU BUS
MEMORY
OUTPUT BUS
CBI
LOWER
DATA
EDC EDC
UPPER
DATA
2552 drw 08
Figure 2. Separate I/O Configuration
Figure 4. Separate Generate/Correction Units
with 64-Bit Checkbit Generation
11.7 5
IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
FUNCTIONAL DESCRIPTION
The error detection/correction codes consist of a modified Hamming code; it is identical to that used in the IDT49C460.
32-BIT MODE (CODE ID 1,0=00)
VCC
8
PCBI CBI7
CHECKBITS–IN
0–6
CBI
Figure 5. 32-Bit Mode
64-BIT MODE (CODE ID 1,0=10 & 11)
The expansion bus topology is shown in Figure 6. This topology allows the syndrome bits used by the correction logic to be generated simultaneously in both parts used in the expansion. During a 64-bit detection or correction operation,
PARTIAL–CHECKBITS–OUT (11)
8
(CORRECTION ONLY)
CBO
SYO
PARTIAL–CHECKBITS–OUT (10)
PARTIAL–CHECKBITS–OUT (10)
8
(GENERATE ONLY)
(GENERATE ONLY)
PARTIAL–SYNDROME (DETECT/CORRECT ONLY)
Figure 6. 64-Bit Mode — 2 Cascaded IDT49C465 Devices
CHECKBITS–IN
PCBI
CBI
8 8
LOWER EDC
(CODE ID 1,0 = 10) (CODE ID 1,0 = 11)
CBO
SYO
EDC
7
77
SYNDROME–OUT
2552 drw 09
“Partial-Checkbit” data and “Partial-Syndrome” data is simul­taneously exchanged between the two EDC units in opposite directions on dedicated expansion buses. This results in very short 64-bit detection and correction times.
CHECKBITS–OUT
PCBI
CBI
UPPER EDC
CBO
SYO
ERR
8 FINAL
CHECKBITS–OUT
(DETECT AND CORRECT)
2552 drw 10
64-BIT GENERATE-ONLY MODE (CODE ID 1,0=01)
If the Identity pins CODE ID 1,0 = 01, a single EDC is placed in the 64-bit “Generate-only” mode. In this mode, the lower 32 bits of the 64-bit data word enter the device on the MD
0-31
inputs and the upper 32-bits of the 64 bit data word enter the
LOWER 32 BITS (0–31)
32
UPPER 32 BITS (32–63)
32
Figure 7. 64-Bit "Generate-Only" Mode (Single Chip)
device on the SD0-31 inputs. This provides the device with the full 64-bit word from memory. The resultant generated checkbits are output on the CBO
0-7
outputs. The generate
time is less than that resulting from using a 2-chip cascade.
CBOMD0–31
8
SD0–31
EDC
11.7 6
CHECKBITS–OUT
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IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN DESCRIPTIONS
Symbol I/O Name and Function
I/O Buses and Controls
0-7 I/O System Data Bus: Data from MD0-31 appears at these pins corrected if MODE 2-0 = x11, or uncor-
SD SD
8-15 rected in the other modes. The BEn inputs must be high and the
SD
16-23 output buffers during a read cycle. (Also, see diagnostic section.)
SD
24-31 Separate I/O memory systems: In a write or partial-write cycle, the byte not-to-be-modified is output on
SD
n to n+7 for re-writing to memory, if BEn is high and
are input on the SD
n pins, for writing checkbits to memory, if BEn is low.
SOE
Bi-directional memory systems: In a write or partial-write cycle, the byte not-to-be-modified is re-directed to the MD I/O pins, if BE
n is high, for checkbit generation and rewriting to memory via the MD I/O pins.
must be high to avoid enabling the output drivers to the system bus in this mode. The new bytes to be written are input on the SD
n pins for checkbit generation and writing to memory. BEn must be low to direct input
data from the System Data bus to the MD I/O pins for checkbit generation and writing to the checkbit memory.
SLE I System Latch Enable: SLE is an input used to latch data at the SD inputs. The latch is transparent when
SLE is high; the data is latched when SLE is low.
PLE
I Pipeline Latch Enable:
PLE
is an input which controls a pipeline latch, which controls data to be output on
the SD bus and the MD bus during byte merges. Use of this latch is optional. The latch is transparent when
PLE
SOE
is low; the data is latched when
I System Output Enable: When low, enables System output drivers and Parity output drivers if correspond-
PLE
is high.
ing Byte Enable inputs are high.
BE
0-3 I Byte Enables: In systems using separate I/O memory buses, BEn is used to enable the SD and Parity
outputs for byte n. The BE
n pins also control the “Byte mux”. When BEn is high, the corrected or uncorrected
data from the Memory Data latch is directed to the MD I/O pins and used for checkbit generation for byte n. This is used in partial-word-write operations or during correction cycles. When BE the System Data latch is directed to the MD I/O pins and used for checkbit generation for byte n.
BE
0 controls SD0-7 BE2 controls SD16-23
BE1 controls SD8-15 BE3 controls SD24-31
MD0-31 I/O Memory Data Bus: These I/O pins accept a 32-bit data word from main memory for error detection and/
or correction. They also output corrected old data or new data to be written to main memory when the EDC unit is used in a bi-directional configuration.
MLE I Memory Latch Enable: MLE is used to latch data from the MD inputs and checkbits from the CBI inputs.
The latch is transparent when MLE is high; data is latched when MLE is low. When identified as the upper slice in a 64-bit cascade, the checkbit latch is bypassed.
MOE
P
0-3 I/O Parity I/O: The parity I/O pins for Bytes 0 to 3. These pins output the parity of their respective bytes when
I Memory Output Enable:
MOE
enables Memory Data Bus output drivers when low.
that byte is being output on the SD bus. These pins also serve as parity inputs and are used in generating the Parity ERRor (
PERR
) signal under certain conditions (see Byte Enable definition). The parity is odd or
even depending on the state of the Parity SELect pin (PSEL).
PSEL I Parity SELect: If the Parity SELect pin is low, the parity is even.
If the Parity SELect pin is high, the parity is odd.
SOE
pin must be low to enable the SD
is low. The new bytes to be written to memory
SOE
n is low, the data from
Inputs
CBI
0-7 I CheckBits-In (00) CheckBits-In-1 (10) Partial-Syndrome-In (11):
In a single EDC system or in the lower slice of a cascaded EDC system, these inputs accept the checkbits from the checkbit memory. In the upper slice in a cascaded EDC system, these inputs accept the “Partial­Syndrome” from the lower slice (Detect/Correct path).
PCBI
0-7 I Partial-CheckBits-In (10) Partial-CheckBits-In (11):
In a single EDC system, these inputs are unused but should not be allowed to float. In a cascaded EDC system, the “Partial-Checkbits” used by the lower slice are accepted by these inputs (Correction path only). In the upper slice of a cascaded EDC system, “Partial-Checkbits” generated by the lower slice are accepted by these inputs (Generate path).
CODE ID
1,0 I CODE IDentity: Inputs which identify the slice position/ functional mode of the IDT49C465.
(00) Single 32-bit EDC unit (10) Lower slice of a 64-bit cascade (01) 64-bit “Checkbit-generate-only” unit (11) Upper slice of a 64-bit cascade
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IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
PIN DESCRIPTIONS (Con’t.)
Symbol I/O Name and Function
Inputs (Con’t.)
2-0 I MODE select: Selects one of four operating modes.
MODE
(x11) Normal” Mode: Normal EDC operation (Flow-thru correction and generation). (x10) Generate-Detect” Mode: In this mode, error correction is disabled. Error generation and detection are
normal.
(000) Error-Data-Output” Mode: Allows the uncorrected data captured from an error event by the Error-Data
Register to be read by the system for diagnostic purposes. The Error-Data Register is cleared by toggling
CLEAR
low. The Syndrome Register and Error-Data Register record the syndrome and uncorrected data from the first error that occurs after they are reset by the Register are updated when there is a positive edge on SYNCLK, an error condition is indicated ( and the Error Counter indicates zero. All-Zero-Data Source: In Error-Data-Output Mode, clearing the Error-Data Register provides a source of all-zero-data for hardware initialization of memory, if this desired.
(x01) Diagnostic-Output Mode: In this mode, the contents of the Syndrome Register , Error Counter and Error-
Type Register are output on the SD bus. This allows the syndrome bytes for an indicated error to be read by the system for error-logging purposes. The Syndrome Register and the Error-Data Register are updated when there is a positive edge on SYNCLK, an error condition is indicated and the Error Counter indicates zero errors. Thus, the Syndrome Register saves the syndrome that was present when the first error occurred after the Error Counter was cleared. The Syndrome Register and the Error Counter are cleared by toggling
CLEAR
low. The Error Counter lets the system tell if more than one error has occurred since the last time the Syndrome Register or Error-Data Register was read.
(100) Checkbit-Injection Mode: In the “Checkbit-Injection” Mode, diagnostic checkbits may be input on System
Data Bus bits 0-7 (see Diagnostic Features - Detailed Description).
CLEAR
I CLEAR: When the
CLEAR
pin is taken low, the Error-Data Register, the Syndrome Register, the Error
Counter and the Error-Type Register are cleared.
SYNCLK I SYNdrome CLocK: If
ERR
is low, and the Error Counter indicates zero errors, syndrome bits are clocked into the Syndrome Register and data from the outputs of the Memory Data input latch are clocked into the Error-Data Register on the low-to-high edge of SYNCLK. If the low-to-high edge of SYNCLK, unless the Error Counter indicates fifteen errors.
SCLKEN
I SynCLK ENable: The
SCLKEN
enables the SYNCLK signal. SYNCLK is ignored if
Outputs and Enables
CBO
0-7 O CheckBits-Out (00, 01) Partial-CheckBits-Out (10) Checkbits-Out (11):
In a single EDC system, the checkbits are output to the checkbit memory on these outputs. In the lower slice in a cascaded EDC system, the “Partial-checkbits” used by the upper slice are output by these outputs (Generate path only). In the upper slice in a cascade, the “Final-Checkbits” appear at these outputs (Generate path only).
CBOE
SYO
0-7 O SYndrome-Out (00) Partial-SYndrome-Out (10) Partial-Checkbits-Out (11):
I CheckBits Out Enable: Enables CheckBit Output drivers when low.
In a 32-bit EDC system, the syndrome bits are output on these pins. In the lower slice in a 64-bit cascaded system, the “Partial-Syndrome” bits appear at these outputs (Detect/ Correct path). In the upper slice in a cascaded EDC system, the “Partial-Checkbits” appear at these outputs (Correct path only). In a 64-bit cascaded system, the “Final-Syndrome” may be accessed in the “Diagnostic-Output” Mode from either the lower or the upper slice since the final syndrome is contained in both.
ERR
MERR
PERR
O ERROR: When in “Normal” and “Detect only” modes, a low on this pin indicates that one or more errors have
been detected.
ERR
is not gated or latched internally.
O Multiple ERRor: When in “Normal” and “Detect only” modes, a low on this pin indicates that two or more
errors have been detected.
MERR
is not gated or latched internally.
O Parity ERRor: A low on this pin indicates a parity error which has resulted from the active bytes defined by
the 4 Byte Enable pins. Parity ERRor (
PERR
) is not gated or latched internally (see Byte Enable definition).
Power Supply Pins
Vcc
1- 10 P +5 Volts
GND
1-12 P Ground
CLEAR
pin. The Syndrome Register and Error-Data
ERR
is low, the Error Counter will increment on
SCLKEN
ERR
= low),
is high.
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IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
DIAGNOSTIC DATA FORMAT (SYSTEM BUS)
Data Out (Unlatched)
Checkbits
Error Type
Re-
served
Latched Data
Error
Counter
Syndrome bits
Partial Checkbits
Byte 3 Byte 2 Byte 1 Byte 0
3
S M - - 2 2 2 2
30
2
27
01
76543210
7654321076543210
DIAGNOSTIC FEATURES — DETAILED DESCRIPTION
Mode 2-0
x11 “NORMAL” Mode
In this mode, operation is “Normal” or non-diagnostic.
x10 “GENERATE-DETECT” Mode
When the EDC unit is in the “Generate-Detect” Mode, data is not corrected or altered by the error correction network. (Also referred to as the “Detect-only” Mode.)
000 “ERROR-DATA-OUTPUT” Mode
In this mode, the 32-bit data from the Error-Data Register is output on the SD bus. Error Data Register: The uncorrected data from the Memory Data bus input latch is stored in the Error-Data Register
if the error counter contents indicates “0” and there is a positive transition on the SYNCLK input when the low. Thus, the Error-Data Register contains memory data corresponding to the first error to occur since the register was cleared. This register is cleared by pulling the the “Error-Data-Output” Mode and enabling the System Data bus output drivers.
All-Zero-Data: The Error-Data Register can be used as an “all-zero-data” data source for memory initialization in systems where the initialization process is to be done entirely by hardware.
x01 “DIAGNOSTIC-OUTPUT” Mode
In this mode, data from the diagnostic registers, the PCBI bus and the CBI bus is output on the SD bus. Direct Checkbit Readback: Internal data paths allow both the “Partial-CheckBit-Input” bus and the data in the “CheckBit-
Input” latch to be read directly by the system bus for diagnostic purposes. Both the Checkbit Input Bus and the Partial Checkbit Input Bus are read via the System Data bus by entering the “Diagnostic-Output” Mode and enabling the System Data bus output drivers. The checkbits are output on System Data bus bits 0-7; the Partial Checkbits are output on bits 8-15.
Syndrome Register: After an error has been detected, the syndrome bits generated are clocked into the internal Syndrome Register if the error counter contents indicates “0” and there is a positive transition on the SYNCLK input when the
ERR
signal is low. This register is cleared by pulling the bus by entering the “Diagnostic-Output” Mode and enabling the System Data bus outputs. This data is output on SD bits 16-23.
Error Counter: The 4-bit on-board error counter is incremented if the error counter contents do not indicate FF HEX, which corresponds to a count of 15, and there is a positive transition on the SYNCLK input when the counter is cleared by pulling the “Diagnostic-Output” Mode and enabling the System Data bus output drivers. This data is output on System Data bus bits 24-27.
Test Register: These 2 bits are reserved for factory diagnostics only and must not be used by system software. This data is output on System Data bus bits 28-29.
Error-Type Register: The Error-Type Register, clocked by the SYNCLK input, saves 2 bits which indicate whether a recorded error was a single or a multiple-bit error. This register holds only the first error type to occur after the last Clear operation. This data is output on System Data bus bits 30-31.
100 Direct Read-Path Checkbit Injection: In the “Checkbit-Injection” Mode, bits 0-7 of the System Data input latch are
presented to the inputs of the Checkbit Input latch. If MLE is strobed, the checkbit latch will be loaded with this value in place of the checkbits from memory. By inserting various checkbit values, operation of the correction function of the EDC can be verified “on-board”. Except for the “Checkbit-Injection” function, operation in this mode is identical to “Normal” Mode operation.
CLEAR
CLEAR
input low. The register is read via the System Data bus by entering
CLEAR
input low. The register is read via the System Data
ERR
signal is low. This
input low. The counter is read via the System Data bus by entering the
ERR
08 716 1524 2331
2552 drw 12
signal is
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IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
OPERATING MODE CHARTS SLICE IDENTIFICATION
CODE ID 1 CODE ID 0 Slice Definition
0 0 32-bit Flow-Thru EDC 0 1 64-bit GENERATE Only EDC 1 0 64-bit EDC- Lower 32 bits (0-31) 1 1 64-bit EDC- Upper 32 bits (32-63)
2552 tbl 04
SLICE POSITION CONTROL
Checkbit Buses
Slice Position/
CODE Functional Operation PCBI CBI CBO SYO P
ID
SOE
SOE
SD Bus
MOE
MOE
MD Bus Bus Bus Bus Bus Bus
1 0 Width = 32 32 8 8 8 8 4 1 0 0 Single 32-bit EDC unit
Generate
Detect/Correct
(1)
1 Sys. 0–31 0 Sys. Byte Mux CBs out P in active
(2)
0 Pipe. latch 1 MD 0–31 CBs in Syn. out P out — 0 1 “64-bit Generate-only” 1 Sys. 32–63 1 Sys. 0–31 CBs out — 1 0 Lower word, 64-bit bus
Generate
Detect/Correct
1 1 Upper word, 64-bit bus
Generate
Detect/Correct
NOTES: 2552 tbl 05
1. Checkbits generated from the data in the SD Latch.
2. Corrected data residing in the Pipe Latch.
(1)
1 Sys. 0–31 0 MD 0–31 PCBs out P in active
(2)
0 Pipe. latch 1 MD 0–31 U-SYOout CBs in Par.Synd P out
(1)
1 Sys. 32–63 0 MD 32–63 L-CBOout F.CBs out P in active
(2)
0 Pipe. latch 1 MD 32–63 L-SYOout Par.Cbits P out
PCBI CBI CBO SYO P
PERR
PERR
FUNCTIONAL MODE CONTROL
Checkbit Buses
Functional Mode
of SD Bus PCBI CBI CBO SYO P
MODE
2 1 0 Width = 32 32 8 8 8 8 4 1 x11 “Normal”
Generate 1 CPU Data 0 Pipe. latch CB out P in active
Correct 0 Pipe. latch 1 RAM Data CB in P out
x10 “Generate-Detect”
Generate 1 CPU Data 0 Pipe. latch CB out P in active
Detect 0 Pipe. latch 1 RAM Data CB in P out — 000 “Error-Data-Output” 0 Err. D. latch x01 “Diagnostic-Output” 0 CBin latch PCBI in CB in
100 “Checkbit-Injection”
Generate 1 SDin latch 0 Pipe. latch CB out P in active
Inject Checkbits 1 SD0–7 in 0 Pipe. latch
Correct 0 Pipe. latch 1 RAM Data CB in P out
SOE
SOE
SD Bus
PCBIin bus
Syn. register
Err. counter
Er. type reg.
MOE
MD Bus Bus Bus Bus Bus Bus
MOE
PERR
PERR
2552 tbl 06
11.7 10
IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
PRIMARY DATA PATH vs. MEMORY CONFIGURATION
SEPARATE I/O MEMORIES: COMMON I/O MEMORIES:
1. Checkbit Generation Write New Word to Memory
CPU
BUFFER
SD MD P
IDT49C465
2. Data Correction Read Memory Word
CPU
BUFFER
CORRECTED
SD MD P
IDT49C465
CBO
CBI
CBO
CBI
IN
D
MAIN
MEMORY
D
OUT
CHECKBIT
MEMORY
D
IN
MAIN
MEMORY
D
OUT
CHECKBIT
MEMORY
1. Checkbit Generation Write New Word to Memory
CPU
SD MD
P
CBO
IDT49C465
CBI
2. Data Correction Read Memory Word
CORRECTED
CPU
SD MD
P
CBO
IDT49C465
CBI
I/O
MAIN
MEMORY
CHECKBIT
MEMORY
I/O
MAIN
MEMORY
CHECKBIT
MEMORY
3. Memory Generation Re-write Corrected Word to Memory
CPU
BUFFER
CORRECTED
SD MD P
CBO
IDT49C465
CBI
D
IN
MAIN
MEMORY
D
OUT
CHECKBIT
MEMORY
3. Memory Generation Re-write Corrected Word to Memory
CORRECTED CORRECTED
CPU
SD MD
P
CBO
IDT49C465
CBI
I/O
MAIN
MEMORY
CHECKBIT
MEMORY
2552 drw 13
11.7 11
IDT49C465/A 32-BIT FLOW-THRU ERROR DETECTION AND CORRECTION UNIT MILITARY AND COMMERCIAL TEMPERATURE RANGES
PARTIAL-WORD-WRITE OPERATIONS
FOR COMMON I/O MEMORIES:
MD LATCH
CORRECTION
BLOCK
SD BUS
B3 = 1
2 = 1
B B
1 = 1 0 = 0
B
BYTE 3 BYTE 2 BYTE 1 BYTE 0
SD LATCHPIPE LATCH
8 8 8 8
B3 B2 B1 B0
BYTE
MUX
A3
A2
A1
A0
CHECKBIT
GENERATOR
IDT49C465
MD BUS
BYTE 3 BYTE 2 BYTE 1 BYTE 0
CBO
CBI
MAIN
MEMORY
CHECKBIT
MEMORY
2552 drw 14
In order to perform a partial-word-write operation, the complete word in question must be read from memory. This must be done in order to correct any error which may have occurred in the old word. Once the complete, corrected word is available, with all the bytes verified, the new word may be assembled in the byte mux and the new checkbits generated.
The example shown above illustrates the case of combin­ing 3 bytes from an old word with a new lower order byte to form a new word. The new word, along with the new checkbits, may now be written to memory.
In the separate I/O memory configuration, the situation is similar except that the new word is output on the SD Bus instead of the MD Bus (refer to previous page).
11.7 12
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