Icom IC-F22SR, IC-F22S, IC-F22, IC-F21GM, IC-F21BR Service Manual

...
SERVICE MANUAL
UHF TRANSCEIVERS
DANGER
ORDERING PARTS
REPAIR NOTES
This service manual describes the latest service information for the
IC-F21/IC-F21S/IC-F21BR/IC-F21GM/IC-F22/IC-
F22S/IC-F22SR
at the time of publication.
NEVER connect the transceiver to an AC outlet or to a DC power supply that uses more than 8.6 V. Such a connection could cause a fire hazard and/or electric shock.
DO NOT expose the transceiver to rain, snow or any liquids. DO NOT reverse the polarities of the power supply when con-
necting the transceiver. DO NOT apply an RF signal of more than 20 dBm (100mW)
to the antenna connector. This could damage the transceiv­er’s front end.
Be sure to include the following four points when ordering replacement parts:
1. 10-digit order numbers
2. Component part number and name
3. Equipment model name and unit name
4. Quantity required <SAMPLE ORDER>
1130007020 S.IC TC7S66FU IC-F21 MAIN UNIT 1 piece 8810004860 Screw PH M 2 x 6 ZK IC-F21 Chassis 10 pieces
Addresses are provided on the inside back cover for your convenience.
1. Make sure a problem is internal before disassembling the transceiver.
2. DO NOT open the transceiver until the transceiver is disconnected from its power source.
3. DO NOT force any of the variable components. Turn them slowly and smoothly.
4. DO NOT short any circuits or electronic parts. An insulated turning tool MUST be used for all adjustments.
5. DO NOT keep power ON for a long time when the transceiver is defective.
6. DO NOT transmit power into a signal generator or a sweep generator.
7. ALWAYS connect a 40 dB to 50 dB attenuator between the transceiver and a deviation meter or spectrum analyzer when using such test equipment.
8. READ the instructions of test equipment thoroughly before connecting equipment to the transceiver.
To upgrade quality, all electrical or mechanical parts and internal circuits are subject to change without notice or oblig­ation.
IC-F21/IC-F21GM/ IC-F22/IC-F22SR
IC-F21S/IC-F21BR/ IC-F22S

TABLE OF CONTENTS

SECTION 1 SPECIFICATIONS
SECTION 2 INSIDE VIEWS
SECTION 3 DISASSEMBLY INSTRUCTIONS
SECTION 4 CIRCUIT DESCRIPTION
4-1 RECEIVER CIRCUITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-1
4-2 TRANSMITTER CIRCUITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-2
4-3 PLL CIRCUITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-3
4-4 POWER SUPPLY CIRCUITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-4
4-5 PORT ALLOCATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4-4
SECTION 5 ADJUSTMENT PROCEDURES
5-1 PREPARATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-1
5-2 PLL ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-4
5-3 SOFTWARE ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5-5
SECTION 6 PARTS LIST
SECTION 7 MECHANICAL PARTS AND DISASSEMBLY
SECTION 8 SEMI-CONDUCTOR INFORMATION
SECTION 9 BOARD LAYOUTS
9-1 IC-F22/F22S/F22SR MAIN UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-1
9-2 IC-F21/F21S/F21BR/F21GM MAIN UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-3
9-3 SW-AAND SW-B UNITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9-5
SECTION 10 BC-146 OPTIONAL DESKTOP CHARGER INFORMATION
10-1 PARTS LIST . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1
10-2 DISASSEMBLY INFORMATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-1
10-3 VOLTAGE DIAGRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-2
10-4 BOARD LAYOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10-2
SECTION 11 BLOCK DIAGRAM
SECTION 12 VOLTAGE DIAGRAM
12-1 MAIN UNIT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-1
12-2 SW-A AND SW-B UNITS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-2
1 - 1

SECTION 1 SPECIFICATIONS

All stated specifications are subject to change without notice or obligation.
Frequency coverage
Type of emission Number of channels Power supply requirement Antenna impedance Input impedance (Mic) Output impedance (Audio) Intermediate frequency Operating temperature range
High power Low power stand-by Rated audio
Dimensions (Projections not included)
Weight RF output power (at 7.2 V DC) Modulation system Max. permissible deviation External mic.connector Frequency error Spurious emissions Adjacent channel power Audio harmonics distortion FM Hum and noise Residual modulation Limiting charact of modulator Receive system Intermediate frequencies
Sensitivity
Audio output power (at 7.2 V) Adjacent channel selectivity
Spurious response Intermodulation FM Hum and noise (Typical) Squelch sensitivity
EIA-152-C/204D or TIA-603 ETS 300 086/300 296
RECEIVER TRANSMITTER GENERAL
440.000 MHz–470.000 MHz 440.000 MHz–470.000 MHz
462.550 MHz–469.550 MHz A 446.00625 MHz–446.09375 MHz C
462.550 MHz–467.725 MHz B
16K0F3E/8K50F3E (at 25 / 12.5 kHz: W/N-type), 8K50F3E (at 12.5 kHz: N-type)
2 ch. (IC-F21BR / F21S / F22S), 15 ch. (IC-F21GM / F22SR), 16 ch. (IC-F21 / F22)
7.2 V (negative ground) 50 normal
2.2 kΩ normal 8 normal
1st: 46.350 MHz, 2nd: 450 kHz
–30 ˚C to +60 ˚C (–22˚F to +140˚F) –25 ˚C to +55 ˚C (–13˚F to +131˚F)
1.6 A(4 W) except
A, C; 1.2 A (2 W) except C; 0.5 A (0.5 W ERP) C only
0.8 A (1 W)
70 mA
250 mA
54(W)
× 128(H) × 37(D) mm; 2
1
8(W) × 51⁄25(H) × 115⁄32(D) inch
310 g; 10.1 oz (with BP-209), 300 g; 10.6 oz (with BP-222)
High: 4.0 W (A: 2.0 W, C: 0.5 W), Low1: 2.0 W (except A, C), low2: 1.0 W (except C)
Variable reactance frequency modulation
± 5.0 kHz (25 kHz), ± 2.5 kHz (12.5 kHz) (
C: ± 2.5 kHz (12.5 kHz) only)
3-conductor 2.5 mm (
1
10 in) (2 k)
±2.5 ppm ±1.5 kHz
73 dBc (typical) 0.25 µW <= 1 GHz, 1.00 µW > 1 GHz
70 dB*
1
(25 kHz), 60 dB*1(12.5 kHz)
3 % typical at 1 kHz, 40 % deviation 5 % typical at 1 kHz 60 % deviation
46 dB typ. (25 kHz), 40 dB typ. (12.5 kHz)
45 dB typ. (25 kHz), 43 dB typ. (12.5 kHz)
70 % – 100 % of max. deviation
Double-conversion super heterodyne
1st: 46.350 MHz, 2nd: 450 kHz
0.25 µV (typical) for 12 dB SINAD
0.25 µV (typical) for 12 dB SINAD 0.63 µV EMF (typical) for 20 dB SINAD (
C: 26.5 dBµV/m for 20 dB SINAD)
0.5 W at 5 % distortion with an 8 load, 0.6 W at 5 % distortion with 6 load
70 dB typ. (25 kHz), 65 dB typ. (12.5 kHz) 70 dB (25 kHz), 60 dB (12.5 kHz)
81.29 dBµV/m
70 dB*
1
(C: 91.29 dBµV/m)
70 dB 65 dB (
C: 86.29 dBµV/m)
46 dB*2(25 kHz), 40 dB*2(12.5 kHz) 45 dB typ.*3(25 kHz), 43 dB typ.*3(12.5 kHz)
0.3 µV typical at threshold (C: 26.5 dBµV/m at threshold)
Current drain
(at 7.2 V)
Tx
Rx
*1EIA-152-C/204D or TIA-603 is typical value, *2EIA-152-C/204D only, *3With CCITT filter
A: [F21BR], B: [F21GM]], C: [F22SR]
2 - 1

SECTION 2 INSIDE VIEWS

• MAIN UNIT
Power amplifier
(Q1: 2SK2974)
Antenna switching circuit D1: 1SV307 D9, D10: MA77
TOP VIEW BOTT OM VIEW
RF amplifier (Q15: 3SK293)
VCO circuit
FM IF IC (IC3: TA31136FN)
Low-pass filter circuit
(IC12,16: NJM12904V)
Expander IC
(IC15: BU4094BCFV)
TX/RX switch
(D3, D4: MA77)
Analog switch (IC6: BU4066BCFV)
APC (IC2: TA75S01F)
AF amplifier (IC4: TA7368F)
1st mixer (Q19: 2SB1132 R)
CPU IC7: HD6433664A24FP
(F21/F21S/F21BR/ F21GM/F22/F22S)
: HD64F3664FP
(F22SR)
EEPROM (IC11: HN58X2416TI)
D/A converter (IC9: M62363FP-650C)
PLL reference oscillator
(X1: CR-671A)
Crystal filter (FI1: FL-335)
PLL IC (IC1: MB15A02PFV-1)
YGR amplifier Q3: 2SC3585 R44 Q4: 2SC5107 O
Pre-drive
(Q2 : 2SK2973)
()
()
()
3 - 1

SECTION 3 DISASSEMBLY INSTRUCTIONS

• REMOVING THE CHASSIS
¡ Unscrew 1 nut, A, and remove 2 knobs, B, C. ™ Unscrew 2 screws, D. £ Unscrew 2 screws, H, to separate the Jack panel and the
Front panel.
¢ Take off the chassis in the direction of the arrow.Unplug J6 to separate the front panel and the chassis.
• REMOVING THE MAIN UNIT
¡ Remove the searing rubber.Unsolder 2 points, E, and unscrew 2 nuts, F. £ Unscrew 9 screws, G, (silver, 2mm) to separate the chassis and the MAIN unit. ¢ Take off the MAIN unit in the direction of the arrow.
Front panel
J6 (Speaker connector)
Jack panel
Chassis
C
B
(Black, 2mm) x 2
D
A
(Black, 2mm) x 2
H
Guide holes
MAIN unit
Sealing rubber
Chassis
E
F
Side plate
([F21S], [F21BR], [F22S] only)
G
G
G
G
4 - 1

SECTION 4 CIRCUIT DESCRIPTION

4-1 RECEIVER CIRCUITS
4-1-1 ANTENNA SWITCHING CIRCUIT
The antenna switching circuit functions as a low-pass filter while receiving. However, its impedance becomes very high while D9 and D10 are turned ON. Thus transmit signals are blocked from entering the receiver circuits. The antenna switching circuit employs a λ⁄4 type diode switching system.
Received signals are passed through the low-pass filter (L1, L2, C3, C5, C6). The filtered signals are applied to the λ⁄4 type antenna switching circuit (D9, D10). The passed signals are then applied to the RF amplifier cir­cuit.
4-1-2 RF CIRCUIT
The RF circuit amplifies signals within the range of frequen­cy coverage and filters out-of-band signals.
The signals from the antenna switching circuit are amplified at the RF amplifier (Q15) after passing through the tunable bandpass filter (D12, L21, C104, C105). The amplified sig­nals are applied to the 1st mixer circuit (Q16) after out-of­band signals are suppressed at the 3 stages tunable band­pass filter (D13, L22, C111, C113, D14, L23, C116, C117, D15, L24, C120, C122).
Varactor diodes are employed at the bandpass filters that track the filters and are controlled by the CPU (IC7) via the D/A convertor (IC9) using T1–T4 signals. These diodes tune the center frequency of an RF passband for wide bandwidth receiving and good image response rejection.
4-1-3 1ST MIXER AND 1ST IF CIRCUITS
The 1st mixer circuit converts the received signal into a fixed frequency of the 1st IF signal with a PLL output frequency. By changing the PLL frequency, only the desired frequency will pass through a crystal filter at the next stage of the 1st mixer.
The signals from the RF circuit are mixed at the 1st mixer (Q16) with a 1st LO signal (393.65–423.65 MHz) coming from the VCO circuit to produce a 46.35 MHz 1st IF signal.
The 1st IF signal is applied to a crystal filter (FI1) to sup­press out-of-band signals. The filtered 1st IF signal is applied to the IF amplifier (Q17), then applied to the 2nd mixer circuit (IC3, pin 16).
4-1-4 2ND IF AND DEMODULATOR CIRCUITS
The 2nd mixer circuit converts the 1st IF signal into a 2nd IF signal. Adouble conversion superheterodyne system (which converts receive signals twice) improves the image rejection ratio and obtains stable receiver gain.
The 1st IF signal from the IF amplifier is applied to the 2nd mixer section of the FM IF IC (IC3, pin 16), and is mixed with the 2nd LO signal to be converted into a 450 kHz 2nd IF sig­nal.
The FM IF IC contains the 2nd mixer, limiter amplifier, quad­rature detector and active filter circuits. A 2nd LO signal (45.9 MHz) is produced at the PLL circuit by tripling it’s ref­erence frequency.
The 2nd IF signal from the 2nd mixer (IC3, pin 3) passes through a ceramic filter (FI2) to remove unwanted hetero­dyned frequencies. It is then amplified at the limiter amplifi­er (IC3, pin 5) and applied to the quadrature detector (IC3, pins 10, 11) to demodulate the 2nd IF signal into AF signals.
4-1-5 AF CIRCUIT
AF signals from the FM IF IC (IC3, pin 9) are applied to the analog switch (IC6, pin 1) after being passed through the high-pass filter (IC5B, pins 5, 7) via the “DET” signal. The signals pass through the low-pass filter (IC5D, pins 13, 14), and then applied to the analog switch (IC6, pins 9, 10) again. The output signals from the analog swtich (IC6, pin 11) are applied to the AF power amplifier (IC4, pin 4) after being passed through the [VOL] control (SW-A/SW-B unit; R143) via the “VOLIN” and “VOLOUT” signals.
2ND IF AND DEMODULATOR CIRCUITS
Mixer
16
Limiter amp.
2nd IF filter 450 kHz
PLL IC
IC1
X1
15.3 MHz
IC3 TA31136F
12
1st IF from the IF amplifier (Q17)
"RSSI" signal to the CPU pin 59
11109
87 5 3
AF signal "DET"
R5V
X2
R98
C155
C154
R100R99
R93
"SQLIN" signal to the D/A convertor (IC9, pin 23)
R92
C138 C139
C140
2
21
Active filter
FI2
Noise
detector
FM
detector
13
"NOIS" signal to the CPU pin 53
RSSI
Noise comp.
×3
R94
Q18
4 - 2
The applied AF signals are amplified at the AF power ampli­fier circuit (IC4, pin 4) to obtain the specified audio level. The amplified AF signals output from pin 10 as “AFOUT”signal are applied to the internal speaker (SP1) as the “SP” signal via the [SP] jack when no plug is connected to the jack.
4-1-6 SQUELCH CIRCUIT
Asquelch circuit cuts out AF signals when no RF signals are received. By detecting noise components in the AF signals, the squelch switches the AF mute switch.
A portion of the AF signals from the FM IF IC (IC3, pin 9) as “DET” signal are applied to the D/A convertor IC (IC9, pin
24). The signals from the D/A convertor (IC9, pin 23) as “SQLIN” signals are applied to the active filter section (IC3, pin 8) where noise components are amplified and detected with an internal noise detector.
The active filter section amplifies noise components. The fil­tered signals are rectified at the noise detector section and converted into “NOIS” (pulse type) signals at the noise com­parator section. The “NOIS” signal output from IC3, pin 13, and is applied to the CPU (IC7, pin 53).
The CPU detects the receiving signal strength from the number of the pulses, and outputs “EXST”, “SO”, “SCK” sig­nals. The signals are applied to the expander IC (IC15, pins 1, 2, 3), and then outputs “RMUT” signal from pin 4. This signal controls the analog switch (IC6, pin 13) to cut the AF signal line.
4-2 TRANSMITTER CIRCUITS
4-2-1 MICROPHONE AMPLIFIER CIRCUIT
The microphone amplifier circuit amplifies audio signals with +6 dB/octave pre-emphasis characteristics from the micro­phone to a level needed for the modulation circuit.
The AF signals from the microphone are applied to the microphone amplifier circuit (IC5c, pin 10) after being pass through the high-pass filter (C186, C187). The amplified AF signals are passed through the low-pass filter circuit (IC5d, pins 13, 14) via the mute switch (IC6, pins 2, 3, 4). The fil­tered AF signals are applied to the modulator circuit after being passed through the mute switch (IC6, pins 8, 9, 10).
4-2-2 MODULATION CIRCUIT
The modulation circuit modulates the VCO oscillating signal (RF signal) using the microphone audio signal.
The audio signals change the reactance of a diode (D6) to modulate an oscillated signal at the TX-VCO circuit (Q11). The oscillated signal is amplified at the buffer-amplifiers (Q5, Q7), then applied to the T/R switching circuit (D3, D4).
4-2-3 DRIVE/POWER AMPLIFIER CIRCUITS
The signal from the VCO circuit passes through the T/R switching circuit (D3) and is amplified at the YGR (Q4, Q3), pre-drive (Q2) and power amplifier (Q1) to obtain 4 W of RF power (at 7.2 V DC). The amplified signal passes through the antenna switching circuit (D1) via the power detector (D2), and low-pass filter and is then applied to the antenna connector.
The bias current of the pre-drive (Q2) and the power ampli­fier (Q1) is controlled by the APC circuit.
4-2-5 APC CIRCUIT
The APC circuit (IC2) protects the drive and the power amplifiers from excessive current drive, and selects HIGH or LOW output power.
The signal output from the power detector circuit (D2) is applied to the differential amplifier (IC2, pin 3), and the “T4” signal from the expander (IC9, pin 11), controlled by the CPU (IC7), is applied to the other input for reference.
When the driving current is increased, input voltage of the differential amplifier (pin 3) will be increased. In such cases, the differential amplifier output voltage (pin 4) is decreased to reduce the driving current.
APC CIRCUIT
Q1 Power amp.
Q2 Pre-driver amp.
IC2
+
VCC
RF signal from PLL
to antenna
T4
T5V
Q14
S5V
APC control circuit
Power detector circuit (D2)
D2
LPF
D1
ANT
SW
AF
amp.
LPF
HPF
"DET" signal from IC3, pin 9
"NWC" signal from IC15, pin 14
Q21
Analog
switch
IC6
IC5B
IC5D
AF VOL.
R1
SW-A/SW-B
unit
IC4
SP
111 9, 102, 3
AF CIRCUIT
4 - 3
4-3 PLL CIRCUIT
4-3-1 GENERAL
A PLL circuit provides stable oscillation of the transmit fre­quency and receive 1st LO frequency. The PLL output com­pares the phase of the divided VCO frequency to the refer­ence frequency. The PLL output frequency is controlled by a crystal oscillator and the divided ratio (N-data) of a pro­grammable divider.
The PLL circuit, using a one chip PLL IC (IC1), directly gen­erates the transmit frequency and divided ratio based on serial data from the CPU and compares the phases of VCO signals with the reference oscillator frequency. The PLL IC detects the out-of-step phase and output from pin 5.The ref­erence frequency (15.3 MHz) is oscillated by X1.
4-3-2 TX LOOP
The generated signal at the TX-VCO (Q11, D7) enters the PLL IC (IC1, pin 8) and is divided at the programmable divider section and is then applied to the phase detector section.
The phase detector compares the input signal with a refer­ence frequency, and then outputs the out-of-phase signal (pulse-type signal) from pin 5.
The pulse-type signal is converted into DC voltage (lock voltage) at the loop filter (R40–R42, C75–C77), and then applied to varactor diodes (D6) of the TX-VCO to stabilize the oscillated frequency.
4-3-3 RX LOOP
The generated signal at the RX-VCO (Q10, D5) enters the PLL IC (IC1, pin 8) and is divided at the programmable divider section and is then applied to the phase detector section.
The phase detector compares the input signal with a refer­ence frequency, and then outputs the out-of-phase signal (pulse-type signal) from pin 5.
The pulse-type signal is converted into DC voltage (lock voltage) at the loop filter (R40–R42, C74–C77), and then applied to varactor diodes (D5) of the RX-VCO to stabilize the oscillated frequency. The lock voltage is also used for the receiver circuit for the bandpass filter center frequency. The lock voltage from the loop filter is amplified at the buffer amplifier (Q13) and then applied to the CPU (IC7, pin 60). The signal is analyzed at the CPU, and then applied to the D/A convertor (IC9). The D/A convertor outputs “T1”, “T2”, “T3”, “T4” signals to RF bandpass filters D12–D15 to sup­press harmonic components.
4-3-4 VCO CIRCUIT
The VCO outputs from Q11 (TX) and Q10 (RX) are buffer amplified at Q7 and Q6, and are then sent to the T/R switch (D3, D4). The receive LO signal is applied to the 1st mixer circuit (Q16) through an attenuator, and the tramsmit signal is applied to the YGR amplifier (Q4). A portion of the VCO output is reapplied to the PLL IC (IC1, pin 8) via the buffer amplifier (Q6) and low-pass filter (L18, R53, C89–C91).
Shift register
Prescaler
Phase detector
Loop
filter
Programmable counter
Programmable divider
X1
15.2 MHz
45.9 MHz signal to the FM IF IC
Q11, D7
TX VCO
RX VCO
Buffer
Buffer
Buffer
Q5
Q6
Q7
11
9
10
P.STB
IC1 (PLL IC)
CK DATA
to transmitter circuit to 1st mixer circuit
D3
D4
2
1
5
8
Q10, D5
Crystal oscillator
×3
Q18
LPF
PLL CIRCUIT
4 - 4
4-4 POWER SUPPLY CIRCUITS
VOLTAGE LINE
LINE
HV
VCC
CPU5V
T5V
R5V
S5V
+5V
VCO5V
DESCRIPTION
The voltage from the attached battery pack. The same voltage as the HV line (battery volt-
age) which is controlled by the power swtich ([VOL] control).
Common 5 V converted from the VCC line by the +5 regulator circuit (IC10). The output voltage is applied to the CPU (IC7), reset circuit (IC8) and etc.
5 V for transmitter circuits regulated by the T5 regulator circuit (Q27).
5 V for receiver circuits regulated by the R5 reg­ulator circuit (Q26).
Common 5 V converted from the VCC line by the S5 regulator circuit (Q24, Q19).
The same voltage as the CPU5V line for the ana­log swtich (IC6), buffer amplifier (Q13), etc.
The same voltage as the +5V line for the TX­VCO (Q11), RX-VCO (Q10) and buffer amplifiers (Q5–Q7).
4-5 PORT ALLOCATIONS
4-5-1 CPU (IC7)
Pin
number
7
13 14 19 20
23 24 25
28
29 30
36
37
38
39
40
41
42
43
44 45
46 51
52
53
54
55 57
58 59
60
Port
name
RES
SENC0 SENC1 SENC2 SENC3
CENC0 CENC1 CENC2
SCK
SO
BEEP
PLST
DAST
EXST
PTT
TXC
RLED
TLED
AFON
ESDA
CLI
CLO
F1 F2
NOIS
UNLK
TEMP CDEC
SDEC
RSSI
LVIN
Description
Input port for RESET signal.
Outputs single tone encode signal.
Outputs CTCSS/DTCS data signal.
Outputs serial clock signal to the PLL IC (IC1), EEPROM (IC11), etc.
Outputs data signal to the PLL IC (IC1) and D/A convertor (IC9).
Outputs beep audio signal. I/O port for strobe signal from/to PLL
IC (IC9).
• Outputs strobe signal to the D/A con­vertor (IC9).
• Input port for the initial version sig­nal.
Outputs strobe signal for the expander IC (IC15).
Input port for [PTT] swtich signal.
High:While [PTT] switch is pushed.
Outputs TX mute control signal.
High:While transmitting
Outputs BUSY LED control signal.
High:While receiving.
Outputs TX LED control signal.
high: While transmitting.
Outputs control signal for the regulator circuit of AF power amplifier.
High:While squelch is open, etc.
I/O port for data signal from/to the EEPROM (IC11).
Input port for cloning signal. Outputs the cloning signal. Input ports for the customization key
signals. Input port for the noise pulse signal for
the squelch function. Input port for PLL unlock signal.
High:PLL is locked.
Input port for the transceiver’s internal tempereture detection.
Input port for CTCSS/DTCS signals. Input port for single tone decode sig-
nal. Input port for the RSSI voltage. Input port for the PLL lock voltage.
4 - 5
Pin
number
61 62
Port
name
BDET BATV
Description
Input port for the battery’s type detec­tion.
Input port for battely voltage detection.
4-5-3 D/A CONVERTOR IC (IC9)
Pin
number
2, 3,
10, 11
14 15
22
Port
name
T1–T4
REF
BAL
DEV
Description
Output tunable bandpass filters con­trol signals.
Outputs differential voltage for the ref­erence oscillator (Q31, D19, X1).
Outputs DTCS balance control signal. Outputs modulating signal for the
modulator circuit (D6).
CPU (IC7)–continued
4-5-2 OUTPUT EXPANDER IC (IC15)
Pin
number
4 5
6
7
11
12
13
14
Port
name
CSFT
RMUT
MMUT
DUSE
T5C
R5C
S5C
NWC
Description
Outputs clock shift control signal for CPU.
Outputs RX mute control signal. Outputs TX mute control signal. Outputs low-pass filter cut-off frequen-
cy control signal when DTCS is acti­vated.
Outputs T5 regulator control signal.
Low: While transmitting.
Outputs R5 regulator control signal.
Low: While receiving.
Outputs S5 regulator control signal.
Low: While power is ON.
Outputs Narrow/Wide of channel spacing control signal.
Low: While Narrow is selected.
5 - 1
5-1 PREPARATION
When you adjust the contents on page 5-5 or 5-6, SOFTWARE ADJUSTMENT, the optional CS-F21 ADJ ADJUSTMENTSOFTWARE (Rev. 1.0 or later), OPC-478 CLONING CABLE and a JIG CABLE (see illustration at page 5-2) are required.
REQUIRED TEST EQUIPMENT

SECTION 5 ADJUSTMENT PROCEDURES

EQUIPMENT
DC power supply
RF power meter (terminated type)
Frequency counter
FM deviation meter
Digital multimeter
GRADE AND RANGE
Output voltage : 7.2 V DC Current capacity : 5 Aor more
Measuring range : 1–10 W Frequency range : 300–600 MHz Impedance : 50 SWR : Less than 1.2 : 1
Frequency range : 0.1–600 MHz Frequency accuracy : ±1 ppm or better Sensitivity : 100 mV or better
Frequency range : DC–600 MHz Measuring range : 0 to ±5 kHz
Input impedance : 10 M/V DC or better
EQUIPMENT
Audio generator
Attenuator
Standard signal generator (SSG)
DC voltmeter
Oscilloscope
AC millivoltmeter
GRADE AND RANGE
Frequency range : 300–3000 Hz Output level : 1–500 mV
Power attenuation : 40 or 50 dB Capacity : 10 W or more
Frequency range : 120–600 MHz Output level : 0.1 µV–32 mV
(–127 to –17 dBm) Input impedance : 50 k/V DC or better Frequency range : DC–20 MHz
Measuring range : 0.01–20 V Measuring range : 10 mV–10 V
SYSTEM REQUIREMENTS
• IBM PC compatible computer with an RS -232C serial port (38400 bps or faster)
• Microsoft Windows 95 or Windows 98
• Intel i486DX processor or faster (Pentium 100 MHz or faster recommended)
• At least 16 MB RAM and 10 MB of hard disk space
• 640×480 pixel display (800×600 pixel display recommend­ed)
ADJUSTMENT SOFTWARE INSTALLATION
q Boot up Windows.
- Quit all applications when Windows is running.
w Insert the cloning software CD-ROM into the appropriate
CD-ROM drive.
e Select ‘Run’ from the [Start] menu. r Type the setup program name using the full path name,
then push the [Enter] key. (For example; D:\ setup)
t Follow the prompts. y Program group ‘CS-F21’ appears in the ‘Programs’ folder
of the [Start] menu.
STARTING SOFTWARE ADJUSTMENT
q Connect the transceiver and PC with the optional OPC-
478 and the JIG cable.
w Boot up Windows, and turn the transceiver power ON. e Click the program group ‘CS-F21 ADJ’ in the ‘Programs’
folder of the [Start] menu, then CS-21G ADJ’s window is appeared.
r Click ‘Connect’ on the CS-F21’s window, then appears
the transceiver’s up-to-date condition.
t Set or modify adjustment data as desired.
IBM is a registered trademark of International Bussiness Machines Corporation in the U.S.A. and other countries. Microsoft and Windows are registered trademarks of Microsoft Corporation in the U.S.A. and other countries. Screen shots produced with permission from Microsoft Corporation. All other products or brands are registered trademarks or trademarks of their respective holders.
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