IBM RS/6000 7044 Model 170 Technical Overview And Introduction

© Copyright IBM Corp. 2000

RS/6000 7044 Model 170

Technical Overview and Introduction

February 24, 2000

Volker Haug

Jeanine Indest

Scott Vetter

Internationa l Techn ical Su ppor t Organ iza tion

Austin, TX

IBM

RS/6000 7044 Model 1 70 Te chnic al Overv iew

© Copyright IBM Corp. 2000 1

RS/6000 7044 Model 170 Technical Overview

The IBM RS/6000 family is a scalable, software-compatible line of RISC UNIX
workstations, servers, and supercomputers powered by IBMs AIX operating
system. On February 7, 2000, IBM announced two exciting additions to this
family, the 44P Models 170 and 270.

This paper provides a brief history, a general description, and a technical
overview of the 44P Model 170 including: the 64-bit copper technology of the
POWER3-II processor, the error checking and correcting (ECC) memory
subsystem, the advanced packaging design, the built-in service processor, the
sophisticated graphics support, and other selected features.

History

The original 43P Model 140 graphics workstation and entry-level workgroup
server was introduced on October 8, 1996. This uniprocessor system offered a
variety of processing speeds and features. The 43P Model 240, introduced at the
same time, was the first RS/6000 workstation/workgroup server to offer
expandability to 2-way symmetric multiprocessing (SMP). On October 5, 1998,
IBM introduced both the 43P Model 150 and the Model 260. The Model 150
offered enhanced performance over the Model 140. The Model 260 is a 1- or
2-way SMP system utilizing the 64-bit 200 MHz POWER3 processor.

General Description

The RS/6000 44P Models 170 and 270 extend the IBM line of powerful and
affordable workstation/workgroup servers with state-of-the-art, 64-bit, copper
POWER3-II processors. The 44P server family, manufactured in Rochester,
Minnesota, USA and Santa Palomba, Italy, offers ideal solutions for both
high-performance 2D or 3D CAD/CAM users and companies that require a
compact system for commercial computing solutions, such as Lotus Notes,
business intelligence, Web server applications, software development, and
firewall applications.

Minimum Configuration and Optional Features

The Model 170 minimum configuration includes a single POWER3-II 64-bit
processor with a choice of either a 333 MHz processor with 1 MB of Level 2 (L2)
cache or a 400 MHz processor with 4 MB of L2 cache. Currently, the 400 MHz
processor option is the fastest POWER3-II processor available in the RS/6000
product family. Each processor is equipped with 64 KB of data and 32 KB of
instruction Level 1 (L1) cache. A 10/100 Mbps Ethernet controller, one Ultra SCSI
controller, one external Ultra2 SCSI controller, and the service processor are
integrated on the system planar.

In addition, the Model 170 has 256 MB of ECC synchronous dynamic random
access memory (SDRAM), three disk bays, three media bays, a 9.1 GB 1” Ultra
SCSI disk drive, six PCI slots, a 32X CD-ROM drive, a 1.44 MB 3.5-inch dis kette
drive, and an operator panel. The operator panel has a 2 x 16 backlit LCD for
system status and diagnostic information. Microphone and headphone jacks are
built into the operator panel. The following ports are included: keyboard, mouse,

2 RS/6000 7044 Model 170 Techni ca l Overview

Ethernet (AUI and RJ45), parallel, two serial (9-pin D-shell), tablet (for use with
legacy input devices), Ultra2 SCSI VHDC, and stereo/audio.

To connect external SCSI devices to the Ultra2 SCSI adapter’s VHDC, order
# 2118 (mini-68 pin VHDC to 68 pin). This 0.3 m long cable (P/N 76H0518) is not
included with the minimum system configuration.

The Model 170 offers many optional features. The media bay can hold a second
CD-ROM device, a 4 mm or 8 mm tape drive, or a SCSI disk drive. A media bay
mounting kit is required to install a SCSI disk drive in the media bay. A variety of
optional input devices are offered including: keyboard, mouse, Spaceball 3D
input device, and a Magellan 3D (Spacemouse) input device.

Physical Package

The 44P Model 170 has an elegant and compact mini-tower design that was
originally created for the PC IntelliStation deskside mini-tower, then revised for
RS/6000 duty. The system dimensions are 19.25” H x 7.9” W x 20.25” D (490 mm
x 200 mm x 515 mm). The system weight ranges from 39 lbs to 45 lbs (17.7 kg to

20.4 kg). This system is not available in a desktop or rack mounted package.
Operating environment requirements are available in announcement information.

Figure 1 shows an internal view of the system with the side cover and cover
support bridge removed. The CD-ROM drive, diskette drive, and one disk drive
are preinstalled with each system. The remaining 5.25” media bay and two 3.5”
disk bays are available for system expansion. Also, a keylock is located on the
back of each system.

To open the side cover, unlock, pull the cover detent away from the rear of the
unit, then slide the cover toward the front of the system unit to release the tabs.

Figure 1. 7044 170 - M echa nical V iew

Power
Supply

CPU
Card

Memory
Cards

PCI
Cards

Operator
Panel

Diskette

2nd Media
Bay

CD-ROM

Three Di sk
Bays

RS/6000 7044 Model 170 Technical Overview 3

System Upgrade

There are no system model upgrade conversions available for the 44P Model

170. Processor and memory expansion options are available for this system. The
Model 170 is designed for customer setup of the machine and for the subsequent
addition of most features (adapters and devices).

Architecture and Technical Information

A diagram of the system architecture and logic flow for a 400 MHz system is
shown in Figure 2. The 333 MHz system differences and a general discussion of
this diagram is provided in the following sections.

Figure 2. Model 170 - System Logic Flow Diag ra m

Processor and C ache

The 44P Model 170 is the most affordable 64-bit system that IBM has introduced
and uses the POWER3-II processor. The POWER3-II processor is designed for
high-performance commercial and graphical computing applications. The
processor allows for concurrent operation of up to ei ght ins tructions per c ycle
(three fixed-point instructions, two floating point instructions, two load/store
instructions, and one branch instruction). Increasing the number of
simultaneously executed instructions results in better system performance
especially with applications that are optimized to take advantage of this
capability.

Figure 3 is a diagram of the functional components of this processor, shown
attached to the cache and bus configuration of a 400 MHz Model 170.

Integrated Service

Processor

PCI Brid

g

e

PCI Bridge

Ultra-SCSI

Internal
Ultra

10/100
Ethernet

Audio

Super

I/O

4 PCI Slot s
32-bit
33 MHz

5.0v

2 PCI Slots
64-bit
50 MHz

3.3v

System Planar

Data

Addr/Cntl

Memory Data Bus 16 Bytes @ 100 Mhz

Memory
Address

6xx Data Bus 16 Bytes @ 100 MHz

6xx Address Bus 100 MHz

Memory Modules

256 MB -2 GB Total

Processor Card

POWER3-II

400 MHz

32 Bytes
@ 200 MHz

4 MB L2

S2

S1

System
Clock

S6

S5

S4

S3

ISA Bridge

External
Ultra2

SP

Interface

Boot

ROM

Arbiter

4 RS/6000 7044 Model 170 Techni ca l Overview

Figure 3. Model 170 - POW ER3 -II 400 MHz Blo ck Diagr am

POWER3 Versus POWER3-II Processors

The processor functional diagram of the POWER3 and the POWER3-II are
similar; however, the use of copper in the POWER3-II represents a new
generation of processing power. A single POWER3-II chip contains about 400
meters of copper wiring. Table 1 lists some of the differences between the
POWER3 and the POWER3-II processors. Also, the chart indicates the direction
being taken by this technology.

Table 1. Differences between POWER3 versus POWER3-II

Description POWER3 POWER3-II

Chip Die Size 270 mm

2

163 mm

2

Transistors 15 million 23 million
Power Avg/Max 39/46W@200 MHz 28W/36W@400 MHz
CMOS Technology 6S2, 5 layers metal 7S, 6 layers metal, copper

interconnect

Lithography 0.25

µm 0.22 µm

Floating

Point

Unit

FPU1

Floating

Point

Unit

FPU2

Fixed
Point

Unit

FXU1

Fixed
Point

Unit

FXU2

Fixed
Point

Unit

FXU3

LD/ST

Unit

LS1

LD/ST

Unit

LS2

Branch/Dispatch

Memory Mgmt Uni t

Instruction Cache

IU

Memory Mgmt Unit

Data Cache

DU

BIU

Bus Interface Unit L2 Control, Clock

Branch history table 2048 entries
Branch target cache 256 entries

32 KB, 128-way 64 KB, 128-way

32
Bytes

32
Bytes

32 Bytes
@ 200 MHz= 6.4 GB/s

16 Bytes
@ 100 MHz=1.6 GB/s

L2 Cache

4 MB

6XX Bus

CPU registers:
32 x 64-bit integer
(Fixed Point)
32 x 64-bit FP
(Floating Point)

Register buffers for
register renaming:
24 FP
16 Integer

Direct
Mapped

RS/6000 7044 Model 170 Technical Overview 5

Copper and CMOS Technology

The use of copper in chip design addresses several or the aspects that inhibit
performance: power load, generated heat, clock signal distribution, and chip size.

The complexity of the chip design (roughly equated to the number of transistors)
when combined with the lithography process determines the size of the die. The
maze of interconnects between the circuitry over a large die, the voltage required
to drive the circuits, and the clock speed of the chip (how often a circuit changes
state) determines the power load and the heat generated. Heat affects the life of
the chip. Specific areas of a chip, for example, an execution unit, can become
hotter than other areas that operate less frequently and require extensive cooling.
Also, the larger the chip, the more difficult it is to strobe a clock signal over the
entire chip (electricity travels at the fixed speed of light). Because larger chips
also require more area on a wafer, they are more expensive to produce.

Copper is a superior conductor of electricity, compared with the standard
aluminum used previously. This equates to lower electrical resistance (40 percent
less) and allows a smaller wire (interconnects) to handle the same electrical load.
The smaller interconnects within the chip decrease the distance between
components, reduce the heat generated, and decrease the clock skew over the
chip making it possible to raise the clock speed without affecting reliability. This is
particularly useful on the POWER3-II which is an advanced and complex chip
with twice the number of transistors as in a Pentium II.

However, copper does not work well with silicon, the base material of
semiconductor chips. If copper is put directly on silicon, copper atoms migrate
into the silicon, making it virtually useless. IBM researchers found a way to put a
microscopic barrier between the copper and silicon in a way that keeps the
copper from contaminating the silicon, while actually reduces the number of steps
needed to complete a chip. With this development, IBM is able to reduce the
widths of copper wires to about 0.2-microns from the current 0.35-micron width ­a feat far more difficult to achieve with aluminum.

This technology, called CMOS 7S, is the first to use copper instead of aluminum
to create the circuitry on silicon wafers. This translates into an increased speed of
up to 15 percent in processors that contain copper wires.

CPU Clock Rate

The different processor cards and the processor speeds can be identified by the
SMS Display Configuration menu or by the following AIX command:

lscfg -vp | more

Page down to the Processor Card entry and search for the Prod uct Specificatio n

(ZC) entry. This gives detailed information about:

PS Processor Clock Speed in Hz, ASCII coded hexadecimal
LB L2 Bus Speed in Hz, ASCII coded hexadecimal
SB System Bus Speed in Hz, ASCII coded hexadecimal
NP Number of Processors on Card, ASCII coded hexadecimal
L2 L2 Size in number of Kilobytes, ASCII coded hexadecimal

6 RS/6000 7044 Model 170 Techni ca l Overview

Following is an example of the processor card information for a 333 MHz Model
170:

Processor Card :

Part Number.................11K0857

EC Level....................D72830

Serial Number...............L200016008

FRU Number.... .... ... .... .. .00P 2180

Manufacture ID .... ... .... .. .198 0

Version..... .... .... ... .. ...R S6K

Product Specific.(ZC).......PS=0013D92D40,LB=0009EC96A0,

SB=0005ABC3C9,NP=01,L2=01024,

PF=711,SV=3,VR=2,ER=0000

Product Specific.(ZB).......BC=30602,SG=

Physical Location: P1-C1

PS shows the processor speed in hex-number digit (0x0013D92D40 =
333000000 Hz = 333 MHz).

Following is an example of the processor card information for a 400 MHz Model
170:

Processor Card :

Part Number.................11K0864

EC Level....................D72830

Serial Number...............L200016010

FRU Number.... .... ... .... .. .00P 2181

Manufacture ID .... ... .... .. .198 0

Version..... .... .... ... .. ...R S6K

Product Specific.(ZC).......PS=0017D78400,LB=000BEBC200,

SB=0005F5E100,NP=01,L2=04096,

PF=7D4,SV=3,VR=2,ER=0000

Product Specific.(ZB).......BC=30602,SG=

Physical Location: P1-C1

PS shows the processor speed in hex-number digit (0x0017D78400 = 400000000
Hz = 400 MHz).

Level 1 Cache

The Model 170 uses a 64 KB data and 32 KB instruction 128-way set associative
L1 cache. The size of both data and instruction cache reduces the number of
cache misses, results in more cache hits, and maximizes performance. Both data
and instruction cache are parity protected.

Level 2 Cache

The 44P Model 170 processor card has either 1 MB (333 MHz) or 4 MB
(400 MHz) of L2 cache located on the processor card. L2 cache is used to lower
the time spent accessing memory data and increase perfor mance. The L2 cache
extends L1 cache benefits by adding more cache to the memory pipeline.

The speed of the L2 cache is dependent upon the processor speed. The L2
cache speed for the 333 MHz processor is 167 MHz (2:1 ratio) and for the 400
MHz processor is 200 MHz (2:1 ratio).

The L2 cache uses a direct mapped cache methodology. There is a dedicated
external interface to the L2 cache not shared with the 6XX bus. This allows
concurrent access to both the L2 cache and the 6XX bus.

RS/6000 7044 Model 170 Technical Overview 7

Memory

The system supports from 256 MB to 2 GB of ECC SDRAM using a 128-bit wide
memory bus. Memory bus speed varies dependent upon processor selection. The
enhanced memory controller uses a 95.1 MHz memory bus speed on the 333
MHz system and a 100 MHz memory bus speed on the 400 MHz system.

There are four memory slots available in the 44P Model 170. The Dual Inline
Memory Modules (DIMMs) are ordered and installed in pairs. The following
options are currently available:

• 256 MB (2 X 128 MB) SDRAM DIMMs (# 4110)

• 512 MB (2 X 256 MB) SDRAM DIMMs (# 4119)

• 1024 MB (2 X 512 MB) SDRAM DIMMs (# 4121)
SDRAM DIMMs are used in most of the RS/6000 systems currently available.

Reference current feature codes and part numbers to determine if DIMMs may be
interchanged between systems. Figure 4 shows the memory slot location for this
system.

Figure 4. 7044 170 - M emo ry Location Di agr am

Memory modules must be installed in pairs using the correct slot configuration.
Slots J1 and J2 are a pair and slots J9 and J10 are a pair.

J10
J2
J9
J1

8 RS/6000 7044 Model 170 Techni ca l Overview

Memory Boot Time Deconfiguration

Memory boot time deconfiguration is a function implemented in the service
processor firmware to remove a memory segment or DIMM from the system
configuration at boot time. The objective is to minimize system failures or data
integrity exposure due to faulty memory hardware.

The memory segment or DIMMs that are deconfigured remain offline for
subsequent reboots until the faulty memory hardware is replaced. This requires
powering off the system. Then, this function gives the user the option to manually
deconfigure or re-enable a previously deconfigured memory segment/DIMM
using the service processor menus.

Memory can also be decreased through AIX using the

rmss command. This is

useful for certain benchmark simulations.

System Buses

The system bus is controlled by a highly specialized set of custom chips. One
handles addressing and synchronization, the other moves data to and from the
processor (the 6XX bus), memory (memory bus), and the I/O (I/O bus). The 6XX
bus is a 128-bit bus running at a clock speed of either 100 MHz, a 4:1 ratio, when
featured with a 400 MHz processor (which results in a peak data throughput of
1600 MB per second) or 95.1 MHz, a 7:2 ratio, when featured with a 333 MHz
processor.

The 6XX bus is optimized for high-performance and multiprocessing
performance. The bus is fully parity checked and each memory request is range
checked and positively acknowledged for error detection. Any error will cause a
machine check condition and is logged in the AIX error log.

The 6XX and memory buses operate at the same speed, 128-bit width, and have
the same throughput. Their speed is automatically determined by the speed of
the processor installed. Data and address buses operate independently in true
split transaction mode and are pipelined so that new requests may be issued
before previous requests are completed.

PCI Bus, Slots, and Adapters

The Model 170 is compliant with Revision 2.1 of the peripheral component
interconnect (PCI) specifications and implements dual PCI bridge chips in a peer
configuration. One PCI bridge chip provides a 32-bit interface operating at 33
MHz for four PCI slots and the other PCI bridge chip implements a 64-bit bus
operating at 50 MHz for two PCI slots. Slots one and two are 64-bit, 50 MHz, 3.3v
slots and slots three, four, five, and six are 32-bit, 33 MHz, 5.0v slots. All slots in
the Model 170 accept full-sized PCI adapters. The 64-bit slots are physically
keyed to accept either universal or 3.3v cards only. 5.0v cards will not seat in the
card slots. Detailed information is available in the announcement information for
this system.

Memory cards should be physically removed only when the power is turned off
to the entire system.

Note

RS/6000 7044 Model 170 Technical Overview 9

A variety of PCI adapter, controller, graphics accelerator, SCSI, LAN, WAN,
asynchronous, and SSA cards, to name a few, may be installed in the 44P Model

170. Specific information on selected adapters is provided in the following
sections:

LAN Adapters

The Model 170 can be connected through the LAN. It supports the following types
of PCI adapters, which are all supported for NIM installations (use

chrp as

platform type):

• 25/155 Mbps ATM

• Gigabit Ethernet

• 10/100 Mbps Ethernet

• 4/16 Mbps token ring (100 Mbps token ring is not available at time of
publication)

Graphics Accelerators

A choice of four graphics accelerators are offered for the Model 170. The
GXT130P is an entry-price 2D adapter suitable for business graphics or Internet
applications. The GXT300P is a high-performance, 24-bit color, 2D graphics
accelerator with 3D capability via Softgraphics functions found in the graPHIGS
and OpenGL APIs.

The GXT2000P and GXT3000P are full 24-bit capable accelerators and support
the simultaneous execution of both graPHIGS and OpenGL applications.
Currently, the GXT3000P is the most powerful graphics accelerator available.

The maximum number of graphics accelerators supported in this system is four
(the GXT3000P is limited to a maximum of two). Refer to the limitations section of
the announcement for details on limitations associated with graphic accelerators
for this system.

A graphics accelerator is not required in the minimum configuration. In order to
attach an ASCII display, either # 3926 or both # 2934 and # 3925 must be
ordered to provide connection. A 9-25 pin serial connector is not included by
default. Determine if the ASCII display you wish to install requires an interposer,
adapter, or both to avoid installation problems.

SSA Adapters

The Advanced SerialRaid Plus Adapter (# 6230) is available for the Model 170.
Optional features include the 128 MB DRAM Option Card (# 6231) and the 32 MB
Fast-Write Cache Option Card (# 6235).

Hot Plug PCI Adapters Capabiliti es

Hot plug PCI adapter capabilities are not supported on the Model 170.
Hot plug PCI capabilities are, however, available within the RS/6000 product line.

The RS/6000 SP Expansion I/O Units support hot plug for selected PCI adapters.
This function enables the maintenance of these adapters without powering of f the
SP Expansion I/O Unit or the associated SP POWER3 SMP High Node. This
function requires AIX Version 4.3.3 with APAR IY06844.

10 RS/6000 7044 Model 17 0 Techn ical Over view

Internal Disk Bays and Media Bays

The disk bays provide from 9.1 GB to 72.8 GB of internal storage space and are
populated with a combination of the following disk drives:

• 9.1 GB 1" Ultra SCSI Hard Disk Drive (# 2908)

• 18.2 GB 1" Ultra SCSI Hard Disk Drive (# 2909)

• 9.1 GB 10 K RPM Ultra SCSI Hard Disk Drive (# 3027)

• 18.2 GB 10 K RPM Ultra SCSI Hard Disk Drive (# 3102)

Service Processor

The Model 170 includes an integrated service processor that is designed to
provide an immediate means to diagnose, check status, and sense operational
conditions of a remote system, even when the main processor is unavailable.

The service processor is a Motorola 68307 microprocessor. The flash memory
used for the storage of the service processor programs is 1 MB and 512 KB of
SRAM memory is used for program execution.

Selected Service Processor Functions

Additional informational is provided for the following selected functions:

Fast Boot

Selecting Fast Boot results in several diagnostic tests being skipped and reduces the
time for booting. This function has to be activated through the Service Processor
menu. (The SXX series of enterprise servers use the operator panel to
enable/disable Fast Boot.)

There is a easy way to check if Fast Boot is enabled without entering the Service
Processor menu. If Fast Boot is enabled no spinner will appear at the Service
Processor checkpoint E0B0. With the Slow Boot enabled, a spinner appears at
E0B0. A spinner is a single text position on the operator LCD that cycles through
the characters

|,/,-, and \ symbolically representing the passage of time.

Memory Boot Time Deconfiguration

Memory Boot Time Deconfiguration gives you the option of deconfiguring
memory without removing it physically. For more detailed information, see the
section on “Memory Boot Time Deconfiguration” on page 8.

Boot Mode Menu

The Boot Mode menu allows selection of the following boot options:

• Boot to SMS Menu

• Service Mode Boot from Saved List

• Service Mode Boot from Default List

• Boot to Open Firmware

The 18.2 GB 10 K RPM Ultra SCSI disk drive is not supported for installation in
the media bay, but is allowed in the disk bay.

Note

RS/6000 7044 Model 170 Technical Overview 11

Miscellaneous

The following general information is included for convenience:

DVD Support

Currently, Digital Versatile Disc (DVD) drives are not supported in RS/6000
systems.

ISA Support

The Model 170 does not support industry standard architecture (ISA) adapters.

USB Support

The Model 170 does not have integrated Universal Serial Bus (USB) support and
no USB adapters are currently available for use in RS/6000s.

Boot Options and Limitations

Detailed information about boot options for internal and external storage devices
is included in the subsequent sections:

Internal Devices

Boot support is available for every internal SCSI disk.

External Device s

Table 2 provides a map that enables you to determine if boot is supported in
external storage devices.

Table 2. Boot Support - Exte rnal De vice s

Boot Support and Limitations of Storage Adapters for the Model 170

The following adapters support external boot capabilities for the Model 170:

• PCI Universal Differential Ultra SCSI Adapter (# 6204)

• PCI Dual Channel Ultra2 SCSI Adapter (# 6205)

• PCI Single-Ended Ultra SCSI Adapter (# 6206)

• Advanced SerialRAID Plus Adapter (# 6230)

1

1

SSA boot is possible from an Advanced SerialRAID Plus Adapter (# 62 30), provided a non-RAID SSA disk is included as part of the
configuration. Other disks as sociated w ith the adapter can be R AID but at least one disk m ust b e a non-RA ID S SA disk . The n on-R AI D
SSA disk can be located under the covers of a processor unit or in an external SSA stor age unit. If your system is runn ing with AIX 4.3.3
or later software, native boot capability is supported.

For factory system orders with AIX preload requested, an internal SCSI disk drive will be preloaded as the native boot disk even if internal
SSA disk drive(s) are present.

Does the PCI card have RAI D functio nality?
yes no
Card is seen as a controller

no boot support

Card is seen as a adapter
Does the external device have RAID functionality?

yes no
no boot support (except

Advanced SerialRAID Plus
Adapter

1

)

boot support

12 RS/6000 7044 Model 17 0 Techn ical Over view

The RS/6000 PCI 3-Channel Ultra2 SCSI RAID Adapter (# 2494) does not
provide boot support from external devices.

Fast Boot

The Model 170 offers a Fast Boot option. For more detailed information, refer to
“Selected Service Processor Functions” on page 10.

Security

To prevent the system from unauthorized booting from a CD-ROM device, a
power-on-password (POP) or a privileged-access password (PAP) may be used.
The keylock on the back of the Model 170 may be used to protect the system
from unauthorized removal of the battery (which deletes both the POP and the
PAP).

Software Requirements

AIX 4.3.3 plus APAR IY06844 (AIX 4330-02 Recommended Maintenance Level
for AIX 4.3.3) is required for the Model 170. The GA date is February 18, 2000.

If you are purchasing new RS/6000 systems, the AIX update should be phased in
to new systems starting February 14, 2000. It will be available for download at:

http://techsupport .services.ibm.co m/rs6k/fixes.htm l

In North America, you can order CDs by calling [phone] or by ordering on
the Web at

http://service2.bo ulder.ibm.com/swdeli very/. In other geographies,

ask your IBM Business Partner or IBM Representative to place a single refresh
System Program Order for 5692-AIX.

For select customer requirements, there is a limited availability of AIX Version

4.3.2 support on the Model 170: PRPQ P91183,

AIX 4.3.2 Workstation Support

.

Reference

The following sections provide lists of additional resources useful for further
research.

System Documentation

For more detailed information, refer to the following documents:

•

44P Series Model 170 Setup Instructions

, SA38-0561

•

44P Series Model 170 User’s Guide

, SA38-0559

•

44P Series Model 170 Service Guide

, SA38-0560

•

RS/6000 Diagnostics Information for Multiple Bus Systems

, SA38-0509

•

RS/6000 Adapters, Devices and Cables information for Multiple Bus Systems

,

SA38-0516

•

PCI Adapter Placement Reference Guide

, SA38-0538

IBM Redbooks

The following redbooks are available for additional information:

•

RS/6000 Systems Handbook

, SG24-5120

RS/6000 7044 Model 170 Technical Overview 13

•

RS/6000 43P 7043 Models 150 and 260 Handbook

, SG24-5144

•

RS/6000 SMP Enterprise Servers Architecture and Implementation

,

SG24-2583

•

AIX 4.3 Differences Guide

, SG24-2014

•

Understanding IBM RS/6000 Performance and Sizing

, SG24-4810

Internet Links

For more detailed information, see the following Web sites:

http://www.rs6000. ibm.com/
http://www.rs6000. ibm.com/hardware /workstations/
http://www.rs6000. ibm.com/resource /hardware_docs/i ndex.html
http://www.rs6000. ibm.com/cgi-bin/ ds_form
http://www.rs6000. ibm.com/support/ micro/
http://www.ibm.com /servers/aix/
http://www.chips.i bm.com/
http://www.researc h.ibm.com/topics /serious/chip/
http://www.storage .ibm.com/
http://www.hursley .ibm.com/~ssa/rs 6k/
http://www.redbook s.ibm.com/

Sources

The following materials were used in the creation of this publication:

• IBM RS/6000 7044 Model 170 - Announcement Letter

• IBM RS/6000 44P Model 170 Workstation - Spec Sheet (G221-7126-01)

• IBM RS/6000 44P Model 170 Server - Spec Sheet (G221-7130-01)

• Blue Logic - CMOS 5SF Technology (G522-0269)

• Blue Logic - CMOS 6SF Technology (G522-0261)

• Blue Logic - CMOS 7SF Technology (G522-0357)

Acknowledgments

Assistance creating this white paper came from the following individuals and was
appreciated. Thank you!

Arroyo, Ron IBM Austin
Cocco, Cathy IBM Austin
King, Ken IBM Austin
Peter Lenk IBM Austin
Nguyen, Thoi IBM Austin
Vaden, Mike IBM Austin
Walton, Scott D. IBM Austin

14 RS/6000 7044 Model 17 0 Techn ical Over view

Biographies

Volker Haug is an Advisory I/T Specialist. He has more than 13 years of

experience in the I/T industry, the last 10 of which he has devoted to RS/6000
and AIX systems. He holds a degree in Business Management from the
Berufsakademie in Stuttgart. Volker is the technical leader supporting IBM sales,
Business Partners, and customers with pre-sales consultation and
implementation of client/server environments. His areas of expertise include
RS/6000 workstations and workgroup servers, graphics, MCAD applications, and
AIX systems management. Based in Stuttgart, Germany, he is currently working
for the Web Server Sales RS/6000 and NUMA-Q technical support organization
covering the IBM Europe, Middle East, and Africa Central Region.

Jeanine Indest is an I/T Specialist with the Techline RS/6000 Sales Support
Team, part of the Web Server Sales Americas Organization. She has more than
six years of experience in the I/T industry, the last four of which she has devoted
to RS/6000 and AIX systems. She holds a B.S. degree and a M.A. degree in
Economics from the University of New Orleans. Her current area of expertise is
technical marketing support for Business Partners in the United States for
RS/6000 and NUMA-Q systems.

RS/6000 7044 Model 170 Technical Overview 15

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16 RS/6000 7044 Model 17 0 Techn ical Over view

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