IBM EM78P259N, EM78P260N User Manual

EM78P259N/260N

8-Bit Microprocessor

with OTP ROM

Product

Specification

DOC. VERSION 1.2

ELAN

MICROELECTRONICS CORP.

May 2007

T rademark Acknowledgments:

IBM is a registered trademark and PS/2 is a trademark of IBM.
Windows is a trademark of Microsoft Corporation.

ELAN and ELAN logo

are trademarks of ELAN Microelectronics Corporation.

Copyright © 2005~2007 by ELAN Microelectronics Corporation

All Rights Reserved

Printed in Taiwan

The contents of this specification are subject to change without further notice. ELAN Microelectronics assumes no
responsibility concerning the accuracy, adequacy, or completeness of this specification. ELAN Microelectronics
makes no commitment to update, or to keep current the information and material contained in this specification.
Such information and material may change to conform to each confirmed order.

In no event shall ELAN Microelectronics be made responsible for any claims attributed to errors, omissions, or
other inaccuracies in the information or material conta ined in this specificati on. ELAN Microelectronics sha ll not
be liable for direct, indirect, special incide ntal, or conseque ntial dama ges arising from the use of s uch information
or material.

The software (if any) described in this specification is furnished under a license or nond isclosure agreement, and
may be used or copied only in accordance wi th the terms of such agreement.

ELAN Microelectronics products are not intended for use in life support appliances, devices, or systems. Use of
ELAN Microelectronics product in such applications is not sup porte d and is prohibite d.
NO P A RT OF THIS SPECIFICATION MAY BE REPRODUCED OR TRANSMI TTED IN ANY FORM OR BY
ANY MEANS WITHOUT THE EXPRESSED WRITTEN PERMISSION OF ELAN MICROELECTRONICS.

ELAN MICROELECTRONICS CORPORATION

Headquarters:

No. 12, Innovation Road 1
Hsinchu Science Park
Hsinchu, Taiwan 30077
Tel: [phone]
Fax: [phone]

http://www.emc.com.tw

Hong Kong:
Elan (HK) Microelectronics

Corporation, Ltd.

Flat A, 19F. , World T ech Centre 95
How Ming Street, Kwun Tong
Kowloon, HONG KONG
Tel: [phone]
Fax: [phone]

[e-mail]

Shenzhen:
Elan Microelectronics

Shenzhen, Ltd.

3F , SSME C Bldg., Gaoxin S . A ve. I
Shenzhen Hi-tech Industrial Park
(South Area) Shenzhen
CHINA 518057
Tel: [phone]
Fax: [phone]

USA:
Elan Information Technology

Group (USA)

1821 Saratoga Ave., Suite 250
Saratoga, CA 95070
USA
Tel: [phone]
Fax: [phone]

Shanghai:
Elan Microelectronics

Shanghai, Ltd.

#23, Zone 115, Lane 572, Bibo Rd.
Zhangjiang Hi-Tech Park
Shanghai, CHINA 201203
Tel: [phone]
Fax: [phone]

Contents

Contents

1 General Description.................................................................................................. 1

2 Features..................................................................................................................... 1

3 Pin Assignment.........................................................................................................2

4 Block Diagram........................................................................................................... 2

5 Pin Description.......................................................................................................... 3

5.1 EM78P259NP/M................................................................................................. 3

5.2 EM78P260NP/M/KM ......................................................................................... 4

6 Function Description ................................................................................................ 5

6.1 Operational Registers......................................................................................... 5

6.1.1 R0 (Indirect Address Register) .........................................................................5

6.1.2 R1 (Time Clock /Counter)..................................................................................5

6.1.3 R2 (Program Counter) and Stack ......................................................................5

6.1.3.1 Data Memory Configuration................................................................7

6.1.4 R3 (Status Register)..........................................................................................8

6.1.5 R4 (RAM Select Register).................................................................................8

6.1.6 R5 ~ R6 (Port 5 ~ Port 6) ..................................................................................9

6.1.7 R7 (Port 7).........................................................................................................9

6.1.8 R8 (AISR: ADC Input Select Register)............................................................. 10

6.1.9 R9 (ADCON: ADC Control Register) ............................................................... 11

6.1.10 RA (ADOC: ADC Offset Calibration Register)..................................................12

6.1.11 RB (ADDATA: Converted Value of ADC) ......................................................... 12

6.1.12 RC (ADDATA1H: Converted Value of ADC).....................................................13

6.1.13 RD (ADDATA1L: Converted Value of ADC) .....................................................13

6.1.14 RE (Interrupt Status 2 & Wake-up Control Register)........................................13

6.1.15 RF (Interrupt Status 2 Register).......................................................................14

6.1.16 R10 ~ R3F.......................................................................................................14

6.2 Special Purpose Registers ............................................................................... 15

6.2.1 A (Accumulator)...............................................................................................15

6.2.2 CONT (Control Register).................................................................................15

6.2.3 IOC50 ~ IOC70 (I/O Port Control Register) .....................................................16

6.2.4 IOC80 (Comparator and TCCA Control Register)............................................16

6.2.5 IOC90 (TCCB and TCCC Control Register) ....................................................17

6.2.6 IOCA0 (IR and TCCC Scale Control Register) ................................................18

6.2.7 IOCB0 (Pull-down Control Register)................................................................20

6.2.8 IOCC0 (Open-Drain Control Register).............................................................20

6.2.9 IOCD0 (Pull-high Control Register) .................................................................21

6.2.10 IOCE0 (WDT Control & Interrupt Mask Registers 2)........................................ 21

6.2.11 IOCF0 (Interrupt Mask Register) .....................................................................22

6.2.12 IOC51 (TCCA Counter) ...................................................................................23

Product Specification (V1.2) 05.18.2007 • iii

Contents

6.2.13 IOC61 (TCCB Counter) ...................................................................................23

6.2.14 IOC71 (TCCBH/MSB Counter)........................................................................24

6.2.15 IOC81 (TCCC Counter)...................................................................................24

6.2.16 IOC91 (Low Time Register)............................................................................. 25

6.2.17 IOCA1 (High Time Register)............................................................................25

6.2.18 IOCB1 High/Low Time Scale Control Register)...............................................25

6.2.19 IOCC1 (TCC Prescaler Counter)..................................................................... 26

6.3 TCC/WDT and Prescaler.................................................................................. 27

6.4 I/O Ports ........................................................................................................... 28

6.4.1 Usage of Port 5 Input Change Wake-up/Interrupt Function .............................31

6.5 Reset and Wake-up.......................................................................................... 31

6.5.1 Reset and Wake-up Operation ........................................................................31

6.5.1.1 Wake-Up and Interrupt Modes Operation Summary .........................34

6.5.1.2 Register Initial Values after Reset..................................................... 36

6.5.1.3 Controller Reset Block Diagram........................................................40

6.5.2 The T and P Status under STATUS (R3) Register ...........................................41

6.6 Interrupt ............................................................................................................ 41

6.7 Analog-To-Digital Converter (ADC) .................................................................. 44

6.7.1 ADC Control Register (AISR/R8, ADCON/R9, ADOC/RA)...............................44

6.7.1.1 R8 (AISR: ADC Input Select Register)..............................................44

6.7.1.2 R9 (ADCON: AD Control Register) ...................................................45

6.7.1.3 RA (ADOC: AD Offset Calibration Register)......................................46

6.7.2 ADC Data Register (ADDATA/RB, ADDATA1H/RC, ADDATA1L/RD)..............47

6.7.3 ADC Sampling Time ........................................................................................47

6.7.4 AD Conversion Time .......................................................................................47

6.7.5 ADC Operation during Sleep Mode .................................................................47

6.7.6 Programming Process/Considerations ............................................................48

6.7.6.1 Programming Process ...................................................................... 48

6.7.6.2 Sample Demo Programs ..................................................................49

6.8 Infrared Remote Control Application/PWM Waveform Generation................... 51

6.8.1 Overview .........................................................................................................51

6.8.2 Function Description........................................................................................ 52

6.8.3 Programming the Related Registers................................................................54

6.9 Timer/Counter................................................................................................... 55

6.9.1 Overview .........................................................................................................55

6.9.2 Function Description........................................................................................ 55

6.9.3 Programming the Related Registers................................................................57

6.10 Comparator ..................................................................................................... 57

6.10.1 External Reference Signal...............................................................................58

6.10.2 Comparator Output..........................................................................................58

6.10.3 Using a Comparator as an Operation Amplifier ...............................................59

6.10.4 Comparator Interrupt.......................................................................................59

6.10.5 Wake-up from Sleep Mode ..............................................................................59

iv • Product Specification (V1.2) 05.18.2007

Contents

6.11 Oscillator ......................................................................................................... 60

6.11.1 Oscillator Modes ............................................................................................. 60

6.11.2 Crystal Oscillator/Ceramic Resonators (Crystal) .............................................61

6.11.3 External RC Oscillator Mode...........................................................................62

6.11.4 Internal RC Oscillator Mode ............................................................................63

6.12 Power-on Considerations................................................................................ 64

6.12.1 Programmable WDT Time-out Period..............................................................64

6.12.2 External Power-on Reset Circuit .....................................................................64

6.12.3 Residual Voltage Protection ............................................................................65

6.13 Code Option ....................................................................................................66

6.13.1 Code Option Register (Word 0) .......................................................................66

6.13.2 Code Option Register (Word 1) .......................................................................67

6.13.3 Customer ID Register (Word 2) .......................................................................68

6.14 Instruction Set ................................................................................................. 68

7 Absolute Maximum Ratings................................................................................... 70

8 DC Electrical Characteristics................................................................................. 71

8.1 AD Converter Characteristics........................................................................... 73

8.2 Comparator (OP) Characteristics ..................................................................... 74

8.3 Device Characteristics...................................................................................... 74

9 AC Electrical Characteristic................................................................................... 75

10 Timing Diagrams..................................................................................................... 76

APPENDIX

A Package Types Summary....................................................................................... 77

B Packaging Configurations...................................................................................... 77

B.1 18-Lead Plastic Dual in line (PDIP) — 300 mil................................................. 77

B.2 18-Lead Plastic Small Outline (SOP) — 300 mil ..............................................78

B.3 20-Lead Plastic Shrink Small Outline (SSOP) — 209 mil ................................ 79

B.4 20-Lead Plastic Dual-in-line (PDIP) — 300 mil ................................................80

B.5 20-Lead Plastic Small Outline (SOP) — 300 mil ..............................................81

C Quality Assurance and Reliability......................................................................... 82

C.1 Address Trap Detect......................................................................................... 82

Product Specification (V1.2) 05.18.2007 • v

Contents

Specification Revision History

Doc. Version Revision Description Date

1.0 Initial official version 2005/06/16

1.1 Added the IRC drift rate in the feature 2006/05/29

1. Improved the contents and format of the Features
section, Fig.4-1 EM78P259N/260N Functional Block
Diagram, Fig.6-2 TCC and WDT Block Diagram and
Fig.6-11 IR/PWM System Block Diagram.

2. Modified Section 6.7 Analog-to-Digital Converter( ADC)

1.2

3. Modified Section 6.13.1 Code Option Register (Word 0)
and Section 6.13.2 Code Option Register (Word 1)

4. Added Internal RC Electrical Characteristics

5. Modified Section 8.1 AD Converter Characteristics,
Section 8.2 Comparator (OP) Characteristics and
Appendix A. Package Type.

2007/05/18

vi • Product Specification (V1.2) 05.18.2007

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

1 General Description

The EM78P259N and EM78P260N are 8-bit microprocessors designed and developed with low-power and
high-speed CMOS technology. The series has an on-chip 2K×13-bit Electrical One Time Programmable
Read Only Memory (OTP-ROM). It provides a protection bit to prevent intrusion of user’s code. Three Code
option words are also available to meet user’s requirements.

With its enhanced OTP-ROM feature, the EM78P259N and EM78P260N provide a convenient way of
developing and verifying user’s programs. Moreover, this OTP device offers the advantages of easy and
effective program updates, using development and programming tools. User can avail of the ELAN Writer to
easily program his development code.

2 Features

 CPU configuration

• 2K×13 bits on-chip ROM

• 80×8 bits on-chip registers (SRAM)

• 8-level stacks for subroutine nesting

• Less than 1.9 mA at 5V/4MHz

• Typically 15 μA, at 3V/32kHz

• Typically 1 μA, during Sleep mode

 I/O port configuration

• 3 bidirectional I/O ports : P5, P6, P7

• 17 I/O pins

• Wake-up port : P5

• 8 Programmable pull-down I/O pins

• 8 programmable pull-high I/O pins

• 8 programmable open-drain I/O pins

• External interrupt : P60

 Operating voltage range

• Operating voltage: 2.3V~5.5V (Commercial)

• Operating voltage: 2.5V~5.5V (Industrial)

 Operating temperature range

• Operating temperature: 0°C ~70°C (Commercial)

• Operating temperature: -40°C ~85°C (Industrial)

 Operating frequency range

• Crystal mode:

DC~20MHz/2clks @ 5V, DC~100ns inst. cycle @ 5V

DC~8MHz/2clks @ 3V, DC~250ns inst. cycle @ 3V

• ERC mode:

DC~16MHz/2clks @ 5V, DC~125ns inst. cycle @ 5V

DC~8MHz/2clks @ 3V, DC~250ns inst. cycle @ 3V

• IRC mode:
Oscillation mode : 4MHz, 8MHz, 1MHz, 455kHz

Internal RC

Frequency

4MHz ±10% ±5% ±4% ±19%

8MHz ±10% ±6% ±4% ±20%

1MHz ±10% ±5% ±4% ±19%

455MHz ±10% ±5% ±4% ±19%

Temperature

(-40°C+85°C)

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

Drift Rate

Voltage

(2.3V~5.5V)

Process Total

• 1

All these four main frequencies can be trimmed by

programming with four calibrated bits in the

ICE259N Simulator. OTP is auto trimmed by ELAN

Writer.

 Peripheral configuration

• 8-bit real time clock/counter (TCC) with
selective signal sources, trigger edges, and
overflow interrupt

• 8-bit real time clock/counter (TCCA, TCCC) and
16-bit real time clock/counter (TCCB) with
selective signal sources, trigger edges, and
overflow interrupt

• 4-bit channel Analog-to-Digital Converter with
12-bit resolution in Vref mode

• Easily implemented IR (Infrared remote control)
application circuit

• One pair of comparators or OP

 Six available interrupts:

• TCC, TCCA, TCCB, TCCC overflow interrupt

• Input-port status changed interrupt (wake-up

from sleep mode)

• External interrupt

• ADC completion interrupt

• Comparators status change interrupt

• IR/PWM interrupt

 Special features

• Programmable free running watchdog timer
(4.5ms:18ms)

• Power saving Sleep mode

• Selectable Oscillation mode

• Power-on voltage detector (2.0V ± 0.1V)

 Package type:

• 18-pin DIP 300mil : EM78P259NPS/NPJ

• 18-pin SOP 300mil : EM78P259NMS/NMJ

• 20-pin SOP 300mil : EM78P260NPS/NPJ

• 20-pin SOP 300mil : EM78P260NMS/NMJ

• 20-pin SSOP 209mil : EM78P260NKMS/NKMJ

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

3 Pin Assignment

(1) 18-Pin DIP/SOP

P52/ADC2
P53/ADC3

P54/TCC/VREF

/RESET

P60//INT

P61/TCCA
P62/TCCB
P63/TCCC

Vss

1
2
3
4
5
6
7
8
9

18
17
16

EM78P259NM

EM78P259NP

15
14
13
12

11
10

Fig. 3-1 EM78P259NP/M

4 Block Diagram

ROM

Instruction

P7

P70

P6

P60
P61
P62
P63

P64
P65
P66
P67

Register

Instruction

Decoder

ALU

P51/ADC1

P50/ADC0
P55/OSCI
P70/OSCO

VDD

P67/IR OUT
P66/CIN­P65/CIN+
P64/CO

8-level stack

(13 bit)

PC

P54/TCC/VREF

Ext.

OSC.

R4

(2) 20-Pin DIP/SOP/SSOP

EM78P260N

Start-up

timer

WDT

TCCA

TCCB

TCCC

Infrared

remote
control

circuit

TCC

20

19

18
17

16
15
14
13
12

11

P56 P57

P52/ADC2

P53/ADC3

1
2
3
4

Vss

5
6
7
8
9

10

/RESET

P60//INT
P61/TCCA
P62/TCCB
P63/TCCC

Fig. 3-2 EM78P260NP/M/KM

Ext.

Int.

RC

RC

Oscillation
Generation

Reset

Mux

P51/ADC1

P50/ADC0
P55/OSCI
P70/OSCO

VDD

P67/IR OUT
P66/CIN­P65/CIN+
P64/CO

TCCA

TCCB

TCCC

IR out

TCC

RAM

P5

P50
P51
P52
P53

P54
P55
P56
P57

ACC

R3 (Status

Reg.)

Interrupt

control
register

Interrupt

circuit

Ext INT

ADC

Ain0~3

Comparator

(CO) or OP

Cin+ Cin- CO

Fig. 4-1 EM78P259N/260N Functional Block Diagram

2 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

5 Pin Description

5.1 EM78P259NP/M

Symbol Pin No. Type Function

P70 15 I/O

P60~P67 6~13 I/O

P50~P55

CIN-, CIN+
CO

OSCI 16 I

OSCO 15 I/O

/RESET 4 I

TCC, TCCA,
TCCB, TCCC

ADC0~ADC3

IR OUT 13 O

VREF 3 I

/INT 6 I

VDD 14 – Power supply

VSS 5 – Ground

1~3

16~18

12, 11

10

3, 7,
8, 9

1, 2,

17, 18

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

General purpose input/output pin
Default value after a power-on reset

General purpose input/output pin
Open-drain
Default value after a power-on reset

General purpose input/output pin
Pull-high/pull-down

I/O

Default value after a power-on reset
Wake up from sleep mode when the status of the pin changes

“-“ : the input pin of Vin- of the comparator
“+” : the input pin of Vin+ of the comparator

I

O

Pin CO is the comparator output
Defined by IOC80 <4:3>

Crystal type: Crystal input terminal or external clock input pin
RC type: RC oscillator input pin

Crystal type: Crystal input terminal or external clock input pin.
RC type: clock output with a duration of one instruction cycle
External clock signal input

If set as /RESET and remains at logic low, the device will be
reset

Voltage on /RESET/Vpp must not exceed Vdd during normal
mode

External Counter input
TCC is defined by CONT <5>

I

TCCA is defined by IOC80 <1>
TCCB is defined by IOC90 <5>
TCCC is defined by IOC90 <1>

Analog to Digital Converter

I

Defined by ADCON (R9) <1:0>

IR mode output pin, capable of driving and sinking
current=20mA when the output voltage drops to 0.7Vdd and
rise to0.3Vdd at Vdd=5V.

External reference voltage for ADC
Defined by ADCON (R9) <7>

External interrupt pin triggered by a falling or rising edge
Defined by CONT <7>

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 3

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

5.2 EM78P260NP/M/KM

Symbol Pin No. Type Function

P70 16 I/O

P60~P67 7~14 I/O

P50~P57

CIN-, CIN+
CO

OSCI 17 I

OSCO 16 I/O

/RESET 5 I

TCC, TCCA,
TCCB, TCCC

ADC0~ADC3

IR OUT 14 O

VREF 4 I

/INT 7 I

VDD 15 – Power supply

VSS 6 – Ground

1~4

17~20

13, 12

11

4, 8,

9, 10

2, 3,

18, 19

General purpose input/output pin
Default value after a power-on reset

General purpose input/output pin
Open-drain
Default value after a power-on reset

General purpose input/output pin
Pull-high/pull-down

I/O

Default value after a power-on reset
Wake up from sleep mode when the status of the pin changes

“-“ : the input pin of Vin- of the comparator
“+” : the input pin of Vin+ of the comparator

I

O

Pin CO is the comparator output
Defined by IOC80 <4:3>

Crystal type: Crystal input terminal or external clock input pin
RC type: RC oscillator input pin

Crystal type: Crystal input terminal or external clock input pin.
RC type: clock output with a duration of one instruction cycle
External clock signal input

If set as /RESET and remains at logic low, the device will be
reset

Voltage on /RESET/Vpp must not exceed Vdd during normal
mode

External Timer/Counter input
TCC is defined by CONT <5>

I

TCCA is defined by IOC80 <1>
TCCB is defined by IOC90 <5>
TCCC is defined by IOC90 <1>

Analog to Digital Converter

I

Defined by ADCON (R9) <1:0>

IR mode output pin, capable of driving and sinking
current=20mA when the output voltage drops to 0.7Vdd and
rise to0.3Vdd at Vdd=5V.

External reference voltage for ADC
Defined by ADCON (R9) <7>

External interrupt pin triggered by a falling or rising edge
Defined by CONT <7>

4 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

6 Function Description

6.1 Operational Registers

6.1.1 R0 (Indirect Address Register)

R0 is not a physically implemented register. Its major function is to perform as an

indirect address pointer. Any instruction using R0 as a pointer, actually accesses the

data pointed by the RAM Select Register (R4).

6.1.2 R1 (Time Clock /Counter)

 Increased by an external signal edge which is defined by the TE bit (CONT-4)

through the TCC pin, or by the instruction cycle clock.

 Writable and readable as any other registers

 The TCC prescaler counter (IOCC1) is assigned to TCC

 The contents of the IOCC1 register is cleared –

• when a value is written to the TCC register.

• when a value is written to the TCC prescaler bits (Bits 3, 2, 1, 0 of the CONT

register)

• during power-on reset, /RESET, or WDT time out reset.

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.1.3 R2 (Program Counter) and Stack

R3

A9 A8 A10

00 PAGE0 0000~03FF

01 PAGE1 0400~07FF



R2 and hardware stacks are 12-bit wide. The structure is depicted in the table

A7 ~ A0

CALL
RET
RETL

RETI

Stack Level 1
Stack Level 2
Stack Level 3
Stack Level 4
Stack Level 5

Stack Level 6
Stack Level 7
Stack Level 8

Fig. 6-1 Program Counter Organization

Reset Vector

Hardware Interrupt Vector

On-chip Program

Memory

under Section 6.1.3.1, Data Memory Configuration (subsequent page).

 Generates 2K×13 bits on-chip ROM addresses to the relative programming

instruction codes. One program page is 1024 words long.

000H
003H

~

01EH

3FEH

7FFH

User Memory Space

 The contents of R2 are all set to "0"s when a reset condition occurs.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 5

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

 "JMP" instruction allows direct loading of the lower 10 program counter bits. Thus,

"JMP" allows PC to jump to any location within a page.

 "CALL" instruction loads the lower 10 bits of the PC, and then PC+1 is pushed into

the stack. Thus, the subroutine entry address can be located anywhere within a

page.

 "RET" ("RETL k", "RETI") instruction loads the program counter with the contents

of the top of stack.

 "ADD R2, A" allows a relative address to be added to the current PC, and the ninth

and above bits of the PC will increase progressively.

 "MOV R2, A" allows loading of an address from the "A" register to the lower 8 bits of

the PC, and the ninth and tenth bits (A8 ~ A9) of the PC will remain unchanged.

 Any instruction (except “ADD R2,A”) that is written to R2 (e.g., "MOV R2, A", "BC

R2, 6", etc.) will cause the ninth bit and the tenth bit (A8 ~ A9) of the PC to remain

unchanged.

 In the case of EM78P259N/260N, the most significant bit (A10) will be loaded with

the content of PS0 in the status register (R3) upon execution of a "JMP", "CALL", or

any other instructions set which write to R2.

 All instructions are single instruction cycle (fclk/2 or fclk/4) except for the

instructions that are written to R2. Note that these instructions need one or two

instructions cycle as determined by Code Option Register CYES bit.

6 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.1.3.1 Data Memory Configuration

Address R PAGE registers IOCX0 PAGE registers

00

01

02

03

04

05

06

07

08

09

0A

0B

0C

0D

0E

0F

R0

(Indirect Addressing Register)

R1

(Time Clock Counter)

R2

(Program Counter)

R3

(Status Register)

R4

(RAM Select Register)

R5

(Port 5)

R6

(Port 6)

R7

(Port 7)

(ADC Input Select Register

R8

R9

(ADC Control Register)

(ADC Offset Calibration

RA

Register)

(The converted value

RB

AD11~AD4 of ADC)
(The converted value

RC

AD11~AD8 of ADC)
(The converted value

RD

AD7~AD0 of ADC)

(Interrupt Status 2 and

RE

Wake-up Control Register

(Interrupt Status Register 1)

RF

Reserve

CONT

(Control Register)

Reserve

Reserve

Reserve

IOC50

(I/O Port Control Register)

IOC60

(I/O Port Control Register)

IOC70

(I/O Port Control Register)

(Comparator and TCCA

IOC80

Control Register)

(TCCB and TCCC

IOC90

Control Register)

(IR and TCCC Scale

IOCA0

Control Register)

(Pull-down Control

IOCB0

Register)

(Open-drain Control

IOCC0

Register)

IOCD0

(Pull-high Control Register)

(WDT Control Register and

IOCE0

Interrupt Mask Register 2)

IOCF0

(Interrupt Mask Register 1)

IOCX1 PAGE registers

Reserve

Reserve

Reserve

Reserve

Reserve

IOC51

IOC61

IOCA1

IOCB1

IOCC1

(TCCA Counter)

(TCCB LSB Counter)

IOC71

(TCCB HSB Counter)

IOC81

(TCCC Counter)

IOC91

(Low Time Register)

(High Time Register)

(High Time and Low Time

Scale control Register)

(TCC Prescaler Control)

Reserve

Reserve

Reserve

10

︰

1F

20

：

3F

General Registers

Bank 0 Bank 1

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 7

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.1.4 R3 (Status Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

RST IOCS PS0 T P Z DC C

Bit 7 (RST): Bit of reset type

Set to “1” if wake-up from sleep on pin change, comparator status

change, or AD conversion completed. Set to “0” if wake-up from other

reset types

Bit 6 (IOCS): Select the Segment of IO control register
0 = Segment 0 (IOC50 ~ IOCF0) selected
1 = Segment 1 (IOC51 ~ IOCC1) selected

Bit 5 (PS0): Page select bits. PS0 is used to select a program memory page. When

executing a "JMP," "CALL," or other instructions which cause the

program counter to change (e.g., MOV R2, A), PS0 is loaded into the

11th bit of the program counter where it selects one of the available

program memory pages. Note that RET (RETL, RETI) instruction does

not change the PS0 bit. That is, the return address will always be back

to the page from where the subroutine was called, regardless of the

current PS0 bit setting.

PS0 Program Memory Page [Address]

0 Page 0 [000-3FF]

1 Page 1 [400-7FF]

Bit 4 (T): Time-out bit. Set to “1” by the "SLEP" and "WDTC" commands or during

power on; and reset to “0” by WDT time-out (see Section 6.5.2, The T

and P Status under STATUS Register for more details).

Bit 3 (P): Power-down bit. Set to “1” during power-on or by a "WDTC" command

and reset to “0” by a "SLEP" command (see Section 6.5.2, The T and P

Status under STATUS Register for more details).

Bit 2 (Z): Zero flag. Set to "1" if the result of an arithmetic or logic operation is

zero.

Bit 1 (DC): Auxiliary carry flag
Bit 0 (C): Carry flag

6.1.5 R4 (RAM Select Register)

Bit 7: Set to “0” all the time
Bit 6: Used to select Bank 0 or Bank 1 of the register
Bits 5~0: Used to select a register (Address: 00~0F, 10~3F) in indirect addressing

mode

See the table under Section 6.1.3.1, Data Memory Configuration for data memory

configuration.

8 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.1.6 R5 ~ R6 (Port 5 ~ Port 6)

R5 & R6 are I/O registers

The upper 2 bits of R5 are fixed to “0” (if EM78P259N is selected).

Only the lower 6 bits of R5 are available (this applies to EM78P259N only as

EM78P260N can use all the bits)

6.1.7 R7 (Port 7)

Bit 7 6 5 4 3 2 1 0

EM78P259N/260N ‘0’ ‘0’ ‘0’ ‘0’ ‘0’ ‘0’ ‘0’ I/O

ICE259N C3 C2 C1 C0 RCM1 RCM0 ‘0’ I/O

Note: R7 is an I/O register

For EM78P259N/260N, only the lower 1 bit of R7 is available.

Bit 7 ~ Bit 2:
[With EM78P259N/260N]: Unimplemented, read as ‘0’.
[With Simulator (C3~C0, RCM1, & RCM0)]: are IRC calibration bits in IRC oscillator

mode. Under IRC oscillator mode of ICE259N simulator,

these are the IRC mode selection bits and IRC calibration bits.

Bit 7 ~ Bit 4 (C3 ~ C0): Calibrator of internal RC mode

C3 C2 C1 C0 Frequency (MHz)

0 0 0 0 (1-36%) x F

0 0 0 1 (1-31.5%) x F

0 0 1 0 (1-27%) x F

0 0 1 1 (1-22.5%) x F

0 1 0 0 (1-18%) x F

0 1 0 1 (1-13.5%) x F

0 1 1 0 (1-9%) x F

0 1 1 1 (1-4.5%) x F

1 1 1 1 F (default)

1 1 1 0 (1+4.5%) x F

1 1 0 1 (1+9%) x F

1 1 0 0 (1+135%) x F

1 0 1 1 (1+18%) x F

1 0 1 0 (1+22.5%) x F

1 0 0 1 (1+27%) x F

1 0 0 0 (1+31.5%) x F

1. Frequency values shown are theoretical and taken at an instance of
a high frequency mode. Hence, frequency values are shown for
reference only. Definite values depend on the actual process.

2. Similar way of calculation is also applicable to low frequency mode.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 9

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 3 & Bit 2 (RCM1, RCM0): IRC mode selection bits

6.1.8 R8 (AISR: ADC Input Select Register)

The AISR register individually defines the pins of Port 5 as analog input or as digital I/O.

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

– – – – ADE3 ADE2 ADE1 ADE0

Bit 7 ~ Bit 4: Not used
Bit 3 (ADE3): AD converter enable bit of P53 pin

0 = Disable ADC3, P53 functions as I/O pin
1 = Enable ADC3 to function as analog input pin

RCM 1 RCM 0 Frequency (MHz)

1 1 4 (default)

1 0 8

0 1 1

0 0 455kHz

Bit 2 (ADE2): AD converter enable bit of P52 pin
0 = Disable ADC2, P52 functions as I/O pin
1 = Enable ADC2 to function as analog input pin

Bit 1 (ADE1): AD converter enable bit of P51 pin
0 = Disable ADC1, P51 functions as I/O pin
1 = Enable ADC1 to function as analog input pin

Bit 0 (ADE0): AD converter enable bit of P50 pin.
0 = Disable ADC0, P50 functions as I/O pin
1 = Enable ADC0 to function as analog input pin

10 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.1.9 R9 (ADCON: ADC Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

VREFS CKR1 CKR0 ADRUN ADPD – ADIS1 ADIS0

Bit 7 (VREFS): Input source of the Vref of the ADC
0 = The Vref of the ADC is connected to Vdd (default value), and the

P54/VREF pin carries out the function of P54

1 = The Vref of the ADC is connected to P54/VREF

NOTE

 The P54/TCC/VREF pin cannot be applied to TCC and VREF at the same time.

If P54/TCC/VREF functions as VREF analog input pin, then CONT Bit 5 “TS”
must be “0.”

 The P54/TCC/VREF pin priority is as follows:

P53/TCC/VREF Pin Priority

High Medium Low

VREF TCC P54

Bit 6 & Bit 5 (CKR1 & CKR0): Prescaler of oscillator clock rate of ADC

00 = 1: 16 (default value)
01 = 1: 4
10 = 1: 64
11 = 1: WDT ring oscillator frequency

CKR1:CKR0 Operation Mode Max. Operation Frequency

00 Fosc/16 4 MHz

01 Fosc/4 1 MHz

10 Fosc/64 16 MHz

11 Internal RC –

Bit 4 (ADRUN): ADC starts to RUN.
0 = Reset upon completion of the conversion. This bit cannot be

reset through software

1 = AD conversion is started. This bit can be set by software.
Bit 3 (ADPD): ADC Power-down mode

0 = Switch off the resistor reference to conserve power even while the

CPU is operating

1 = ADC is operating

Bit 2: Not used

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 11

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 1 ~ Bit 0 (ADIS1 ~ADIS0): Analog Input Select

00 = ADIN0/P50

01 = ADIN1/P51

10 = ADIN2/P52

11 = ADIN3/P53

These bits can only be changed when the ADIF bit (see Section

6.1.14, RE (Interrupt Status 2 & Wake-up Control Register)) and the

ADRUN bit are both LOW.

6.1.10 RA (ADOC: ADC Offset Calibration Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

CALI SIGN VOF[2] VOF[1] VOF[0] “0” “0” “0”

Bit 7 (CALI): Calibration enable bit for ADC offset
0 = Calibration disable
1 = Calibration enable

Bit 6 (SIGN): Polarity bit of offset voltage
0 = Negative voltage
1 = Positive voltage

Bit 5 ~ Bit 3 (VOF[2] ~ VOF[0]): Offset voltage bits

VOF[2] VOF[1] VOF[0] EM78P259N/260N ICE259N

0 0 0 0LSB 0LSB

0 0 1 2LSB 1LSB

0 1 0 4LSB 2LSB

0 1 1 6LSB 3LSB

1 0 0 8LSB 4LSB

1 0 1 10LSB 5LSB

1 1 0 12LSB 6LSB

1 1 1 14LSB 7LSB

Bit 2 ~ Bit 0: Unimplemented, read as ‘0’

6.1.11 RB (ADDATA: Converted Value of ADC)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

AD11 AD10 AD9 AD8 AD7 AD6 AD5 AD4

When AD conversion is completed, the result is loaded into the ADDATA. The ADRUN

bit is cleared, and the ADIF (see Section 6.1.14, RE (Interrupt Status 2 & Wake-up

Control Register)) is set.

RB is read only.

12 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.1.12 RC (ADDATA1H: Converted Value of ADC)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

“0” “0” “0” “0” AD11 AD10 AD9 AD8

When AD conversion is completed, the result is loaded into the ADDATA1H. The

ADRUN bit is cleared, and the ADIF (see Section 6.1.14, RE (Interrupt Status 2 &

Wake-up Control Register)) is set.

RC is read only

6.1.13 RD (ADDATA1L: Converted Value of ADC)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0

When AD conversion is completed, the result is loaded into the ADDATA1L. The

ADRUN bit is cleared, and the ADIF (see Section 6.1.14, RE (Interrupt Status 2 &

Wake-up Control Register)) is set.

RD is read only

6.1.14 RE (Interrupt Status 2 & Wake-up Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

– – ADIF CMPIF ADWE CMPWE ICWE -

Note: RE <5, 4> can be cleared by instruction but cannot be set

IOCE0 is the interrupt mask register

Reading RE will result to "logic AND" of RE and IOCE0

Bit 7 & Bit 6: Not used
Bit 5 (ADIF): Interrupt flag for analog to digital conversion. Set when AD

conversion is completed. Reset by software

0 = no interrupt occurs
1 = with interrupt request
Bit 4 (CMPIF): Comparator interrupt flag. Set when a change occurs in the output of

Comparator. Reset by software.

0 = no interrupt occurs
1 = with interrupt request
Bit 3 (ADWE): ADC wake-up enable bit
0 = Disable ADC wake-up
1 = Enable ADC wake-up

When AD Conversion enters sleep mode, this bit must be set to

“Enable“.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 13

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 2 (CMPWE): Comparator wake-up enable bit

0 = Disable Comparator wake-up
1 = Enable Comparator wake-up

When Comparator enters sleep mode, this bit must be set to “Enable.“

Bit 1 (ICWE): Port 5 input change to wake-up status enable bit
0 = Disable Port 5 input change to wake-up status
1 = Enable Port 5 input change to wake-up status

When Port 5 change enters sleep mode, this bit must be set to

“Enable“.

Bit 0: Not implemented, read as ‘0’

6.1.15 RF (Interrupt Status 2 Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

LPWTIF HPWTIF TCCCIF TCCBIF TCCAIF EXIF ICIF TCIF

Note: “ 1 ” means with interrupt request “ 0 ” means no interrupt occurs

RF can be cleared by instruction but cannot be set.

IOCF0 is the relative interrupt mask register.

Reading RF will result to "logic AND" of RF and IOCF0.

Bit 7 (LPWTIF): Internal low-pulse width timer underflow interrupt flag for IR/PWM

function. Reset by software.

Bit 6 (HPWTIF): Internal high-pulse width timer underflow interrupt flag for IR/PWM

function. Reset by software.

Bit 5 (TCCCIF): TCCC overflow interrupt flag. Set when TCCC overflows. Reset by

software.

Bit 4 (TCCBIF): TCCB overflow interrupt flag. Set when TCCC overflows. Reset by

software.

Bit 3 (TCCAIF): TCCA overflow interrupt flag. Set when TCCC overflows. Reset by

software.

Bit 2 (EXIF): External interrupt flag. Set by falling edge on /INT pin. Reset by

software.

Bit 1 (ICIF): Port 5 input status change interrupt flag. Set when Port 5 input

changes. Reset by software.

Bit 0 (TCIF): TCC overflow interrupt flag. Set when TCC overflows. Reset by

software.

6.1.16 R10 ~ R3F

All of these are 8-bit general-purpose registers.

14 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

6.2 Special Purpose Registers

6.2.1 A (Accumulator)

Internal data transfer operation, or instruction operand holding usually involves the

temporary storage function of the Accumulator, which is not an addressable register.

6.2.2 CONT (Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

INTE INT TS TE PSTE PST2 PST1 PST0

Note: The CONT register is both readable and writable

Bit 6 is read only.

Bit 7 (INTE): INT signal edge
0 = interrupt occurs at the rising edge on the INT pin
1 = interrupt occurs at the falling edge on the INT pin

Bit 6 (INT): Interrupt enable flag
0 = masked by DISI or hardware interrupt
1 = enabled by the ENI/RETI instructions

This bit is readable only.

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 5 (TS): TCC signal source

0 = internal instruction cycle clock. P54 is bi-directional I/O pin.
1 = transition on the TCC pin

Bit 4 (TE): TCC signal edge
0 = increment if the transition from low to high takes place on the TCC

pin

1 = increment if the transition from high to low takes place on the TCC

pin.

Bit 3 (PSTE): Prescaler enable bit for TCC
0 = prescaler disable bit. TCC rate is 1:1.
1 = prescaler enable bit. TCC rate is set as Bit 2 ~ Bit 0.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 15

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 2 ~ Bit 0 (PST2 ~ PST0): TCC prescaler bits

PST2 PST1 PST0 TCC Rate

0 0 0 1:2

0 0 1 1:4

0 1 0 1:8

0 1 1 1:16

1 0 0 1:32

1 0 1 1:64

1 1 0 1:128

1 1 1 1:256

Note: Tcc time-out period [1/Fosc x prescaler x 256 (Tcc cnt) x 1 (CLK=2)]

Tcc time-out period [1/Fosc x prescaler x 256 (Tcc cnt) x 2 (CLK=4)]

6.2.3 IOC50 ~ IOC70 (I/O Port Control Register)

 "1" puts the relative I/O pin into high impedance, while "0" defines the relative I/O

pin as output.

 Only the lower 6 bits of IOC50 can be defined (this applies to EM78P259N only,

since EM78P260N can use all the bits).

 Only the lower 1 bit of IOC70 can be defined, the other bits are not available.
 IOC50, IOC60, and IOC70 registers are all readable and writable

6.2.4 IOC80 (Comparator and TCCA Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

– – CMPOUT COS1 COS0 TCCAEN TCCATS TCCATE

Note: Bits 4~0 of the IOC80 register are both readable and writable

Bit 5 of the IOC80 register is read only.

Bit 7 & Bit 6: Not used
Bit 5 (CMPOUT): Result of the comparator output

This bit is read only.

Bit 4 & Bit 3 (COS1 & COS0): Comparator/OP Select bits

COS1 COS0 Function Description

0 0

0 1 Acts as Comparator and P64 functions as normal I/O pin

1 0 Acts as Comparator and P64 functions as Comparator output pin (CO)

1 1 Acts as OP and P64 functions as OP output pin (CO)

Bit 2 (TCCAEN): TCCA enable bit
0 = disable TCCA
1 = enable TCCA as a counter

Comparator and OP are not used. P64, P65, and P66 function as
normal I/O pins.

16 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 1 (TCCATS): TCCA signal source

0 =: internal instruction cycle clock. P61 is a bi-directional I/O pin.
1 = transit through the TCCA pin

Bit 0 (TCCATE): TCCA signal edge
0 = increment if transition from low to high takes place on the

TCCA pin

1 = increment if transition from high to low takes place on the

TCCA pin

6.2.5 IOC90 (TCCB and TCCC Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

TCCBHE TCCBEN TCCBTS TCCBTE – TCCCEN TCCCTS TCCCTE

Bit 7 (TCCBHE): Control bit is used to enable the most significant byte of counter
0 = Disable the most significant byte of TCCBH (default value)

TCCB is an 8-bit counter

1 = Enable the most significant byte of TCCBH

TCCB is a 16-bit counter

Bit 6 (TCCBEN): TCCB enable bit
0 = disable TCCB
1 = enable TCCB as a counter

Bit 5 (TCCBTS) TCCB signal source
0 = internal instruction cycle clock. P62 is a bi-directional I/O pin.
1 = transit through the TCCB pin

Bit 4 (TCCBTE): TCCB signal edge
0 = increment if the transition from low to high takes place on the

TCCB pin

1 = increment if the transition from high to low takes place on the

TCCB pin

Bit 3: Not used.
Bit 2 (TCCCEN): TCCC enable bit

0 = disable TCCC
1 = enable TCCC as a counter

Bit 1 (TCCCTS) TCCC signal source
0 = internal instruction cycle clock. P63 is a bi-directional I/O pin.
1 = transit through the TCCC pin

Bit 0 (TCCCTE): TCCC signal edge

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 17

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

0 = increment if the transition from low to high takes place on the

TCCC pin

1 = increment if the transition from high to low takes place on the

TCCC pin

6.2.6 IOCA0 (IR and TCCC Scale Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

TCCCSE TCCCS2 TCCCS1 TCCCS0 IRE HF LGP IROUTE

Bit 7 (TCCCSE): Scale enable bit for TCCC

An 8-bit counter is provided as scaler for TCCC and IR-Mode. When

in IR-Mode, TCCC counter scale uses the low time segments of the

pulse generated by Fcarrier frequency modulation (see Fig. 6-11 in

Section 6.8.2, Function Description).

0 = scale disable bit, TCCC rate is 1:1
1 = scale enable bit, TCCC rate is set as Bit 6 ~ Bit 4

18 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 6 ~ Bit 4 (TCCCS2 ~ TCCCS0): TCCC scale bits

The TCCCS2 ~ TCCCS0 bits of the IOCA0 register are used to

determine the scale ratio of TCCC as shown below:

TCCCS2 TCCCS1 TCCCS0 TCCC Rate

0 0 0 1:2

0 0 1 1:4

0 1 0 1:8

0 1 1 1:16

1 0 0 1:32

1 0 1 1:64

1 1 0 1:128

1 1 1 1:256

Bit 3 (IRE): Infrared Remote Enable bit
0 = Disable IRE, i.e., disable H/W Modulator Function. IROUT pin

fixed to high level and the TCCC is an Up Counter.

1 = Enable IRE, i.e., enable H/W Modulator Function. Pin 67 is

defined as IROUT. If HP=1, the TCCC counter scale uses the

low time segments of the pulse generated by Fcarrier frequency

modulation (see Fig. 6-11 in Section 6.8.2, Function

Description). When HP=0, the TCCC is an Up Counter.

Bit 2 (HF): High Frequency bit
0 = PWM application. IROUT waveform is achieved according to

high-pulse width timer and low-pulse width timer which

determines the high time width and low time width respectively

1 = IR application mode. The low time segments of the pulse

generated by Fcarrier frequency modulation (see Fig. 6-11 in

Section 6.8.2, Function Description)

Bit 1 (LGP): Long Pulse.
0 = high time register and low time register is valid
1 = high time register is ignored. A single pulse is generated.

Bit 0 (IROUTE): Control bit to define the P67 (IROUT) pin function
0 = P67 is defined as bi-directional I/O pin
1 = P67 is defined as IROUT. Under this condition, the I/O control

bit of P67 (Bit 7 of IOC60) must be set to “0”

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 19

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.2.7 IOCB0 (Pull-down Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

/PD57 /PD56 /PD55 /PD54 /PD53 /PD52 /PD51 /PD50

Note: The IOCB0 register is both readable and writable

Bit 7 (/PD57): Control bit used to enable the pull-down function of the P57 pin

(applicable to EM78P260N only)

0 = Enable internal pull-down
1 = Disable internal pull-down
Bit 6 (/PD56): Control bit used to enable the pull-down function of the P56 pin

(applicable to EM78P260N only)

Bit 5 (/PD55): Control bit used to enable the pull-down function of the P55 pin
Bit 4 (/PD54): Control bit used to enable the pull-down function of the P54 pin
Bit 3 (/PD53): Control bit used to enable the pull-down function of the P53 pin
Bit 2 (/PD52): Control bit used to enable the pull-down function of the P52 pin
Bit 1 (/PD51): Control bit used to enable the pull-down function of the P51 pin
Bit 0 (/PD50): Control bit used to enable the pull-down function of the P50 pin.

6.2.8 IOCC0 (Open-Drain Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

/OD67 /OD66 /OD65 /OD64 /OD63 /OD62 /OD61 /OD60

Note: The IOCC0 register is both readable and writable

Bit 7 (/OD67): Control bit used to enable the open-drain output of the P67 pin

0 = Enable open-drain output
1 = Disable open-drain output

Bit 6 (/OD66): Control bit used to enable the open-drain output of the P66 pin
Bit 5 (/OD65): Control bit used to enable the open-drain output of the P65 pin
Bit 4 (/OD64): Control bit used to enable the open-drain output of the P64 pin

Bit 3 (/OD63): Control bit used to enable the open-drain output of the P63 pin
Bit 2 (/OD62): Control bit used to enable the open-drain output of the P62 pin
Bit 1 (/OD61): Control bit used to enable the open-drain output of the P61 pin
Bit 0 (/OD60): Control bit used to enable the open-drain output of the P60 pin

20 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.2.9 IOCD0 (Pull-high Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

/PH57 /PH56 /PH55 /PH54 /PH53 /PH52 /PH51 /PH50

Note: The IOCD0 register is both readable and writable

Bit 7 (/PH57): Control bit is used to enable the pull-high of the P57 pin (applicable to

EM78P260N only).

0 = Enable internal pull-high;
1 = Disable internal pull-high.
Bit 6 (/PH56): Control bit used to enable the pull-high function of the P56 pin

(applicable to EM78P260N only).

Bit 5 (/PH55): Control bit used to enable the pull-high function of the P55 pin.
Bit 4 (/PH54): Control bit used to enable the pull-high function of the P54 pin.
Bit 3 (/PH53): Control bit used to enable the pull-high function of the P53 pin.
Bit 2 (/PH52): Control bit used to enable the pull-high function of the P52 pin.
Bit 1 (/PH51): Control bit used to enable the pull-high function of the P51 pin.

Bit 0 (/PH50): Control bit used to enable the pull-high function of the P50 pin.

6.2.10 IOCE0 (WDT Control & Interrupt Mask Registers 2)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

WDTE EIS ADIE CMPIE PSWE PSW2 PSW1 PSW0

Bit 7 (WDTE): Control bit used to enable Watchdog Timer
0 = Disable WDT
1 = Enable WDT

WDTE is both readable and writable

Bit 6 (EIS): Control bit used to define the function of the P60 (/INT) pin
0 = P60, bi-directional I/O pin
1 = /INT, external interrupt pin. In this case, the I/O control bit of P60

(Bit 0 of IOC60) must be set to "1"

NOTE

■ When EIS is "0," the path of /INT is masked. When EIS is "1," the status of /INT pin
can also be read by way of reading Port 6 (R6). Refer to Fig. 6-4 (I/O Port and I/O
Control Register Circuit for P60 (/INT)) under Section 6.4 (I/O Ports).

■ EIS is both readable and writable.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 21

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 5 (ADIE): ADIF interrupt enable bit

0 = disable ADIF interrupt
1 = enable ADIF interrupt

Bit 4 (CMPIE): CMPIF interrupt enable bit.
0 = disable CMPIF interrupt
1 = enable CMPIF interrupt

Bit 3 (PSWE): Prescaler enable bit for WDT
0 = prescaler disable bit, WDT rate is 1:1
1 = prescaler enable bit, WDT rate is set as Bit 2 ~ Bit 0

Bit 2 ~ Bit 0 (PSW2 ~ PSW0): WDT prescaler bits

PSW2 PSW1 PSW0 WDT Rate

0 0 0 1:2

0 0 1 1:4

0 1 0 1:8

0 1 1 1:16

1 0 0 1:32

1 0 1 1:64

1 1 0 1:128

1 1 1 1:256

6.2.11 IOCF0 (Interrupt Mask Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

LPWTIE HPWTIE TCCCIE TCCBIE TCCAIE EXIE ICIE TCIE

NOTE

■ The IOCF0 register is both readable and writable

■ Individual interrupt is enabled by setting its associated control bit in the IOCF0 and

in IOCE0 Bit 4 & 5 to "1".

■ Global interrupt is enabled by the ENI instruction and is disabled by the DISI
instruction. Refer to Fig. 6-8 (Interrupt Input Circuit) under Section 6.6 (Interrupt).

Bit 7 (LPWTIE): LPWTIF interrupt enable bit
0 = Disable LPWTIF interrupt
1 = Enable LPWTIF interrupt

Bit 6 (HPWTIE): HPWTIF interrupt enable bit
0 = Disable HPWTIF interrupt
1 = Enable HPWTIF interrupt

22 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 5 (TCCCIE): TCCCIF interrupt enable bit

0 = Disable TCCCIF interrupt
1 = Enable TCCCIF interrupt

Bit 4 (TCCBIE): TCCBIF interrupt enable bit
0 = Disable TCCBIF interrupt
1 = Enable TCCBIF interrupt

Bit 3 (TCCAIE): TCCAIF interrupt enable bit
0 = Disable TCCAIF interrupt
1 = Enable TCCAIF interrupt

Bit 2 (EXIE): EXIF interrupt enable bit
0 = Disable EXIF interrupt
1 = Enable EXIF interrupt

Bit 1 (ICIE): ICIF interrupt enable bit
0 = Disable ICIF interrupt
1 = Enable ICIF interrupt

Bit 0 (TCIE): TCIF interrupt enable bit.
0 = Disable TCIF interrupt
1 = Enable TCIF interrupt

6.2.12 IOC51 (TCCA Counter)

The IOC51 (TCCA) is an 8-bit clock counter. It can be read, written, and cleared on

any reset condition and is an Up Counter.

NOTE

■ TCCA timeout period [1/Fosc x (256-TCCA cnt) x 1(CLK=2)]

■ TCCA timeout period [1/Fosc x (256-TCCA cnt) x 2(CLK=4)]

6.2.13 IOC61 (TCCB Counter)

The IOC61 (TCCB) is an 8-bit clock counter for the least significant byte of TCCBX
(TCCB). It can be read, written, and cleared on any reset condition and is an Up

Counter.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 23

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.2.14 IOC71 (TCCBH/MSB Counter)

The IOC71 (TCCBH) is an 8-bit clock counter for the most significant byte of TCCBX
(TCCBH). It can be read, written, and cleared on any reset condition.

When TCCBHE (IOC90) is “0,” then TCCBH is disabled. When TCCBHE is”1,” then

TCCB is a 16-bit length counter.

When TCCBH is Disabled:

■ TCCB time-out period [1/Fosc x ( 256 - TCCB cnt ) x 1(CLK=2)]

■ TCCB time-out period [1/Fosc x ( 256 - TCCB cnt ) x 2(CLK=4)]

When TCCBH is Enabled:

■ TCCB time-out period {1/Fosc x [ 65536 - (TCCBH * 256 + TCCB cnt)] x 1(CLK=2)}

■ TCCB time-out period {1/Fosc x [ 65536 - (TCCBH * 256 + TCCB cnt)] x 2(CLK=4)}

6.2.15 IOC81 (TCCC Counter)

NOTE

The IOC81 (TCCC) is an 8-bit clock counter that can be extended to 16-bit counter.

It can be read, written, and cleared on any reset condition.

If HF (Bit 2 of IOCA0) = 1 and IRE (Bit 3 of IOCA0) = 1, TCCC counter scale uses the

low time segments of the pulse generated by Fcarrier frequency modulation (see Fig.

6-12 in Section 6.8.2, Function Description). Then TCCC value will be TCCC predict

value.

When HP = 0 or IRE = 0, the TCCC is an Up Counter.

NOTE

In TCCC Up Counter mode:

■ TCCC time-out period [1/Fosc x scaler (IOCA0) x (256-TCCC cnt) x 1(CLK=2)]

■ TCCC time-out period [1/Fosc x scaler (IOCA0) x (256-TCCC cnt) x 2(CLK=4)]

When HP = 1 and IRE = 1, TCCC counter scale uses the low time segments of the

pulse generated by Fcarrier frequency modulation.

NOTE

In IR mode:

■ Fcarrier = FT/ 2 { [1+decimal TCCC Counter value (IOC81)] * TCCC Scale
(IOCA0) }

■ FT is system clock: FT = Fosc/1 (CLK=2)

FT = Fosc/2 (CLK=4)

24 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.2.16 IOC91 (Low Time Register)

The 8-bit Low time register controls the active or Low segment of the pulse.

The decimal value of its contents determines the number of oscillator cycles and

verifies that the IR OUT pin is active. The active period of IR OUT can be calculated as

follows:

NOTE

■ Low time width = { [1+decimal low time value (IOC91)] * Low time Scale(IOCB1) } /

FT

■ FT is system clock: FT = Fosc/1 (CLK=2)

FT = Fosc/2 (CLK=4)

When an interrupt is generated by the Low time down counter underflow (if enabled),

the next instruction will be fetched from Address 015H (Low time).

6.2.17 IOCA1 (High Time Register)

The 8-bit High time register controls the inactive or High period of the pulse.

The decimal value of its contents determine the number of oscillator cycles and verifies

that the IR OUT pin is inactive. The inactive period of IR OUT can be calculated as

follows:

NOTE

■ High time width = {[1+decimal high time value (IOCA1)] * High time Scale(IOCB1) }

/ FT

■ FT is system clock: FT=Fosc/1(CLK=2)

FT=Fosc/2(CLK=4)

When an interrupt is generated by the High time down counter underflow (if enabled),

the next instruction will be fetched from Address 012H (High time).

6.2.18 IOCB1 High/Low Time Scale Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

HTSE HTS2 HTS1 HTS0 LTSE LTS2 LTS1 LTS0

Bit 7 (HTSE): High time scale enable bit.
0 = scale disable bit, High time rate is 1:1
1 = scale enable bit, High time rate is set as Bit 6~Bit 4.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 25

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 6 ~ Bit 4 (HTS2 ~ HTS0): High time scale bits:

HTS2 HTS1 HTS0 High time Rate

0 0 0 1:2

0 0 1 1:4

0 1 0 1:8

0 1 1 1:16

1 0 0 1:32

1 0 1 1:64

1 1 0 1:128

1 1 1 1:256

Bit 3 (LTSE): Low time scale enable bit.
0 = scale disable bit, Low time rate is 1:1
1 = scale enable bit, Low time rate is set as Bit 2~Bit 0.

Bit 2 ~ Bit 0 (LTS2 ~ LTS0): Low time scale bits:

LTS2 LTS1 LTS0 Low time Rate

0 0 0 1:2

0 0 1 1:4

0 1 0 1:8

0 1 1 1:16

1 0 0 1:32

1 0 1 1:64

1 1 0 1:128

1 1 1 1:256

6.2.19 IOCC1 (TCC Prescaler Counter)

The TCC prescaler counter can be read and written to.

PST2 PST1 PST0 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0 0 0 - - - - - - - V 1:2

0 0 1 - - - - - - V V 1:4

0 1 0 - - - - - V V V 1:8

0 1 1 - - - - V V V V 1:16

1 0 0 - - - V V V V V 1:32

1 0 1 - - V V V V V V 1:64

1 1 0 - V V V V V V V 1:128

1 1 1 V V V V V V V V 1:256

V = valid value

The TCC prescaler counter is assigned to TCC (R1).

The contents of the IOCC1 register are cleared when one of the following occurs:

 a value is written to TCC register

 a value is written to TCC prescaler bits (Bits 3, 2, 1, 0 of CONT)

 power-on reset, /RESET

 WDT time-out reset

26 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

TCC
Rate

6.3 TCC/WDT and Prescaler

There are two 8-bit counters available as prescalers that can be extended to 16-bit

counter

register are used to determine the ratio of the TCC prescaler, and the PWR2 ~ PWR0

bits of the IOCE0 register are used to determine the WDT prescaler. The prescaler

counter is cleared by the instructions each time such instructions are written into TCC.

The WDT and prescaler will be cleared by the “WDTC” and “SLEP” instructions. Fig.

6-2 (next page) depicts the block diagram of TCC/WDT.

TCC (R1) is an 8-bit timer/counter. The TCC clock source can be an internal clock or

external signal input (edge selectable from the TCC pin). If TCC signal source is from

the internal clock, TCC will increase by 1 at every instruction cycle (without prescaler).

Referring to Fig. 6-2, CLK=Fosc/2 or CLK=Fosc/4 is dependent to the Code Option bit

<CLKS>. CLK=Fosc/2 if the CLKS bit is "0," and CLK=Fosc/4 if the CLKS bit is "1." If

TCC signal source is from an external clock input, TCC will increase by 1 at every

falling edge or rising edge of the TCC pin. The TCC pin input time length (kept in High

or Low level) must be greater than 1CLK.

for the TCC and WDT respectively. The PST2 ~ PST0 bits of the CONT

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

The internal TCC will stop running when sleep mode occurs. However, during AD
conversion, when TCC is set to “SLEP” instruction, if the ADWE bit of the RE register
is enabled, the TCC will keep on running

The watchdog timer is a free running on-chip RC oscillator. The WDT will keep on

running even when the oscillator driver has been turned off (i.e., in sleep mode).

During normal operation or sleep mode, a WDT time-out (if enabled) will cause the

device to reset. The WDT can be enabled or disabled at any time during normal mode

through software programming. Refer to WDTE bit of IOCE0 register (Section 6.2.10

IOCE0 (WDT Control & Interrupt Mask Registers 2). With no prescaler, the WDT

time-out period is approximately 18ms

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

1

VDD=5V, WDT time-out period = 16.5ms ± 30%

VDD=3V, WDT time-out period = 18ms ± 30%

2

VDD=5V, WDT time-out period = 4.2ms ± 30%

VDD=3V, WDT time-out period = 4.5ms ± 30%

• 27

NOTE

1

or or 4.5ms2.

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

1CLK (Fosc/1)

TCC Pin

TE (CONT)

WDTE

(IOCE0)

2 CLK (Fosc/2)

0

MUX

1

TS (CONT)

8-Bit counterWDT

WDT Time out

Fig. 6-2 TCC and WDT Block Diagram

8-Bit Counter (IOCC1)

8 to 1 MUX

Prescaler

PSR2~0

(CONT)

Prescaler8 to 1 MUX

PSW2~0

(IOCE0)

Data Bus

TCC (R1)

TCC overflow

interrupt

6.4 I/O Ports

The I/O registers (Port 5, Port 6, and Port 7) are bi-directional tri-state I/O ports. Port 5

is pulled-high and pulled-down internally by software. Likewise, P6 has its open-drain

output through software. Port 5 features an input status changed interrupt (or wake-up)

function. Each I/O pin can be defined as "input" or "output" pin by the I/O control

register (IOC5 ~ IOC7). The I/O registers and I/O control registers are both readable

and writable. The I/O interface circuits for Port 5, Port 6, and Port7 are illustrated in

Figures 6-3, 6-4, 6-5, & 6-6 (see next page).

28 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

PCRD

Q

_

Q

P

D

R

PCWR

CLK

C

L

PORT

0

M
U

1

X

Note: Open-drain is not shown in the figure.

Fig. 6-3 I/O Port and I/O Control Register Circuit for Port 6 and Port 7

PORT

Bit 6 of IOCE

P

D

Q

CLK

R

_

C

Q

L

0
1

P

Q

_

Q

D

R

C
L

CLK

PDWR

PDRD

IOD

PCRD

P

Q

D

R

_
Q

Q
_

Q

M
U
X

CLK

C

L

P
R

CLK

C
L

PCWR

IOD

D

PDWR

INT

Note: Open-drain is not shown in the figure.

Fig. 6-4 I/O Port and I/O Control Register Circuit for P60 (/INT)

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 29

PDRD

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

PCRD

_

Q

P
R

DQ

CLK

PCWR

C
L

P50 ~ P57

PORT

M

0

U
X

1

P
R

CLK

_

C

Q

L

P

DQ

R

CLK

_

C

Q

L

DQ

PDWR

PDRD

IOD

TI n

Note: Pull-high (down) is not shown in the figure.

Fig. 6-5 I/O Port and I/O Control Register Circuit for Port 50 ~ P57

TI 0
TI 1

….

IO CF.1

RF.1

TI 8

Fig. 6-6 Port 5 Block Diagram with Input Change Interrupt/Wake-up

30 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.4.1 Usage of Port 5 Input Change Wake-up/Interrupt Function

(1) Wake-up (2) Wake-up and Interrupt

(a) Before Sleep (a) Before Sleep

1. Disable WDT 1. Disable WDT

2. Read I/O Port 5 (MOV R5,R5) 2. Read I/O Port 5 (MOV R5,R5)

3. Execute "ENI" or "DISI" 3. Execute "ENI" or "DISI"

4. Enable wake-up bit (Set RE ICWE =1) 4. Enable wake-up bit (Set RE ICWE =1)

5. Execute "SLEP" instruction 5. Enable interrupt (Set IOCF0 ICIE =1)

(b) After wake-up 6. Execute "SLEP" instruction

→ Next instruction (b) After wake-up

(3) Interrupt

(a) Before Port 5 pin change

1. Read I/O Port 5 (MOV R5,R5)

2. Execute "ENI" or "DISI"

3. Enable interrupt (Set IOCF0 ICIE =1)

(b) After Port 5 pin changed (interrupt)

1. IF "ENI" → Interrupt vector (006H)

2. IF "DISI" → Next instruction

1. IF "ENI" → Interrupt vector (006H)

2. IF "DISI" → Next instruction

6.5 Reset and Wake-up

6.5.1 Reset and Wake-up Operation

A reset is initiated by one of the following events:

1. Power-on reset

2. /RESET pin input "low"

3. WDT time-out (if enabled).

The device is kept under reset condition for a period of approximately 18ms

LXT mode) after the reset is detected. When in LXT mode, the reset time is 500ms.

Two choices (18ms

occurs, the following functions are performed (the initial Address is 000h):

 The oscillator continues running, or will be started (if in sleep mode)
 The Program Counter (R2) is set to all "0"

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

3

VDD=5V, WDT Time-out period = 16.5ms ± 30%.

VDD=3V, WDT Time-out period = 18ms ± 30%.

4

VDD=5V, WDT Time-out period = 4.2ms ± 30%.

VDD=3V, WDT Time-out period = 4.5ms ± 30%.

3

or 4.5ms4) are available for WDT-time out period. Once a reset

• 31

3

(except in

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

 All I/O port pins are configured as input mode (high-impedance state)
 The Watchdog Timer and prescaler are cleared
 When power is switched on, the upper 3 bits of R3 is cleared
 The IOCB0 register bits are set to all "1"
 The IOCC0 register bits are set to all "1"
 The IOCD0 register bits are set to all "1"
 Bits 7, 5, and 4 of IOCE0 register is cleared
 Bit 5 and 4 of RE register is cleared
 RF and IOCF0 registers are cleared

Executing the “SLEP” instruction will assert the sleep (power down) mode. While

entering into sleep mode, the Oscillator, TCC, TCCA, TCCB, and TCCC are stopped.

The WDT (if enabled) is cleared but keeps on running.

During AD conversion, when “SLEP” instruction I set; the Oscillator, TCC, TCCA,

TCCB, and TCCC keep on running. The WDT (if enabled) is cleared but keeps on

running.

The controller can be awakened by:

Case 1 External reset input on /RESET pin

Case 2 WDT time-out (if enabled)

Case 3 Port 5 input status changes (if ICWE is enabled)

Case 4 Comparator output status changes (if CMPWE is enabled)

Case 5 AD conversion completed (if ADWE enable)

The first two cases (1 & 2) will cause the EM78P260N to reset. The T and P flags of R3

can be used to determine the source of the reset (wake-up). Cases 3, 4, & 5 are

considered the continuation of program execution and the global interrupt ("ENI" or

"DISI" being executed) decides whether or not the controller branches to the interrupt

vector following wake-up. If ENI is executed before SLEP, the instruction will begin to

execute from address 0x06 (Case 3), 0x0F (Case 4), and 0x0C (Case 5) after wake-up.

If DISI is executed before SLEP, the execution will restart from the instruction next to

SLEP after wake-up.

Only one of Cases 2 to 5 can be enabled before entering into sleep mode. That is:

Case [a] If WDT is enabled before SLEP, all of the RE bit is disabled. Hence, the

EM78P259N/260N can be awakened only with Case 1 or Case 2. Refer to

the section on Interrupt (Section 6.6 below) for further details.

Case [b] If Port 5 Input Status Change is used to wake -up EM78P259N/260N and the

ICWE bit of RE register is enabled before SLEP, WDT must be disabled.

Hence, the EM78P259N/260N can be awakened only with Case 3. Wake-up

time is dependent on oscillator mode. In RC mode, Wake-up time is 32

clocks (for stable oscillators). In High Crystal mode, Wake-up time is 2ms

and 32clocks (for stable oscillators); and in low Crystal mode, Wake-up time

is 500ms.

32 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

S

,

8-Bit Microprocessor with OTP ROM

Case [c] If Comparator output status change is used to wake-up the EM78P259N/

260N and CMPWE bit of the RE register is enabled before SLEP, WDT must

be disabled by software. Hence, the EM78P259N/260N can be awakened

only with Case 4. Wake-up time is dependent on the oscillator mode. In RC

mode the Wake-up time is 32 clocks (for stable oscillators). In High Crystal

mode, Wake-up time is 2ms and 32 clocks (for stable oscillators); and in low

Crystal mode, Wake-up time is 500ms.

Case [d] If AD conversion completed is used to wake-up the EM78P259N/260N and

ADWE bit of RE register is enabled before SLEP, WDT must be disabled by

software. Hence, the EM78P259N/260N can be awakened only with Case 5.

The wake-up time is 15 TAD (ADC clock period).

If Port 5 Input Status Change Interrupt is used to wake up the EM78P259N/260N (as in

Case [b] above), the following instructions must be executed before SLEP:

BC R3, 7
MOV A, @00xx1110b

; Select Segment 0
; Select WDT prescaler and Disable WDT

IOW IOCE0
WDTC
MOV R5, R5
ENI (or DISI)

; Clear WDT and prescaler
; Read Port 5
; Enable (or disable) global interrupt

MOV A, @xxxxxx1xb ; Enable Port 5 input change wake-up bit
MOV RE
MOV A, @xxxxxx1xb

; Enable Port 5 input change interrupt

IOW IOCF0
SLEP

; Sleep

Similarly, if the Comparator Interrupt is used to wake up the EM78P259N/260N (as in

Case [c] above), the following instructions must be executed before SLEP:

BC R3, 7
MOV A, @xxx10XXXb

IOW IOC80
MOV A, @00x11110b

IOW IOCE0
WDTC
ENI (or DISI)
MOV A, @xxx0x1xxb

MOV RE
SLEP

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 33

; Select Segment 0
;

elect a comparator and P64 act as CO

pin

; Select WDT prescaler and Disable WDT

and enable comparator output status
change interrupt

; Clear WDT and prescaler
; Enable (or disable) global interrupt
; Enable comparator output status

change wake-up bit

; Sleep

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.5.1.1 Wake-Up and Interrupt Modes Operation Summary

All categories under Wake-up and Interrupt modes are summarized below.

Signal Sleep Mode Normal Mode

DISI + IOCF0 (EXIE) Bit2=1

INT Pin

Port 5 Input
Status Change

TCC Over
Flow

N/A

RE (ICWE) Bit1=0, IOCF0 (ICIE) Bit1=0 IOCF0 (ICIE) Bit1=0

Oscillator, TCC, TCCX and IR/PWM are stopped.
Port5 input status changed wake-up is invalid.

RE (ICWE) Bit1=0, IOCF0 (ICIE) Bit1=1 N/A

Set RF (ICIF)=1,
Oscillator, TCC, TCCX and IR/PWM are stopped.
Port 5 input status changed wake-up is invalid.

RE (ICWE) Bit1=1, IOCF0 (ICIE) Bit1=0 N/A

Wake-up + Next Instruction
Oscillator, TCC, TCCX and IR/PWM are stopped.

RE (ICWE) Bit1=1, DISI + IOCF0 (ICIE) Bit1=1 DISI + IOCF0 (ICIE) Bit1=1

Wake-up + Next Instruction + Set RF (ICIF)=1
Oscillator, TCC, TCCX and IR/PWM are stopped.

RE (ICWE) Bit1=1, ENI + IOCF0 (ICIE) Bit1=1 ENI + IOCF0 (ICIE) Bit1=1

Wake-up + Interrupt Vector (006H) + Set RF (ICIF)=1
Oscillator, TCC, TCCX and IR/PWM are stopped.

N/A

RE (ADWE) Bit3=0, IOCE0 (ADIE) Bit5=0 IOCE0 (ADIE) Bit5=0

Clear R9 (ADRUN)=0, ADC is stopped,
AD conversion wake-up is invalid.
Oscillator, TCC, TCCX and IR/PWM are stopped.

RE (ADWE) Bit3=0, IOCE0 (ADIE) Bit5=1 N/A

Next Instruction + Set RF (EXIF)=1

ENI + IOCF0 (EXIE) Bit2=1

Interrupt Vector (003H) + Set RF (EXIF)=1

Port 5 input status change interrupted is invalid

Next Instruction + Set RF (ICIF)=1

Interrupt Vector (006H)+ Set RF (ICIF)=1

DISI + IOCF0 (TCIE) Bit0=1

Next Instruction + Set RF (TCIF)=1

ENI + IOCF0 (TCIE) Bit0=1

Interrupt Vector (009H) + Set RF (TCIF)=1

AD conversion interrupted is invalid

N/A

N/A

Set RF (ADIF)=1, R9 (ADRUN)=0, ADC is stopped,

N/A

N/A

AD Conversion

AD conversion wake-up is invalid.
Oscillator, TCC, TCCX and IR/PWM are stopped.

RE (ADWE) Bit3=1, IOCE0 (ADIE) Bit5=0 N/A

Wake-up + Next Instruction,
Oscillator, TCC, TCCX and IR/PWM keep on running.
Wake-up when ADC completed.

RE (ADWE) Bit3=1, DISI + IOCE0 (ADIE) Bit5=1 DISI + IOCE0 (ADIE) Bit5=1

Wake-up + Next Instruction + RE (ADIF)=1,
Oscillator, TCC, TCCX and IR/PWM keep on running.
Wake-up when ADC completed.

RE (ADWE) Bit3=1, ENI + IOCE0 (ADIE) Bit5=1 ENI + IOCE0 (ADIE) Bit5=1

Wake-up + Interrupt Vector (00CH)+ RE (ADIF)=1,
Oscillator, TCC, TCCX and IR/PWM keep on running.
Wake-up when ADC completed.

Next Instruction + RE (ADIF)=1

Interrupt Vector (00CH) + Set RE (ADIF)=1

34 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

Signal Sleep Mode Normal Mode

Comparator
(Comparator Output
Status Change)

IR/PWM underflow
interrupt

(High-pulse width
timer underflow
interrupt)

IR/PWM underflow
interrupt

(Low-pulse width
timer underflow
interrupt)

TCCA Over Flow

TCCB Over Flow

TCCC Over Flow

WDT Time-out
IOCE (WDTE) Bit7=1

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

RE (CMPWE) Bit2=0, IOCE0 (CMPIE) Bit4=0 IOCF0 (CMPIE) Bit4=0

Comparator output status changed wake-up is invalid.

Oscillator, TCC, TCCX and IR/PWM are stopped.

RE (CMPWE) Bit2=0, IOCE0 (CMPIE) Bit4=1 N/A

Set RE (CMPIF)=1,

Comparator output status changed wake-up is invalid.

Oscillator, TCC, TCCX and IR/PWM are stopped.

RE (CMPWE) Bit2=1, IOCE0 (CMPIE) Bit4=0 N/A

Wake-up + Next Instruction,

Oscillator, TCC, TCCX and IR/PWM are stopped.

RE (CMPWE) Bit2=1, DISI + IOCE0 (CMPIE) Bit4=1 DISI + IOCE0 (CMPIE) Bit4=1

Wake-up + Next Instruction + Set RE (CMPIF)=1,

Oscillator, TCC, TCCX and IR/PWM are stopped.

RE (CMPWE) Bit2=1, ENI + IOCE0 (CMPIE) Bit4=1 ENI + IOCE0 (CMPIE) Bit4=1

Wake-up + Interrupt Vector (00FH) + Set RE

(CMPIF)=1,Oscillator, TCC, TCCX and IR/PWM are

stopped.

N/A

N/A

N/A

N/A

N/A

Wake-up + Reset (Address 0x00) Reset (Address 0x00)

Comparator output status change

interrupted is invalid.

N/A

N/A

Next Instruction + Set RE (CMPIF)=1

Interrupt Vector (00FH) + Set RE

(CMPIF)=1

DISI + IOCF0 (HPWTIF) Bit6=1

Next Instruction + Set RF (HPWTIE)=1

ENI + IOCF0 (HPWTIF) Bit6 =1

Interrupt Vector (012H) + Set RF

(HPWTIE)=1

DISI + IOCF0 (LPWTIF) Bit7=1

Next Instruction + Set RF (LPWTIE)=1

ENI + IOCF0 (LPWTIF) Bit7 =1

Interrupt Vector (015H) + Set RF

(LPWTIE)=1

DISI + IOCF0 (TCCAIE) Bit3=1

Next Instruction + Set RF (TCCAIF)=1

ENI + IOCF0 (TCCAIE) Bit3=1

Interrupt Vector (018H) + Set RF

(TCCAIF)=1

DISI + IOCF0 (TCCBIE) Bit4=1

Next Instruction + Set RF (TCCBIF)=1

ENI + IOCF0 (TCCBIE) Bit4=1

Interrupt Vector (01BH) + Set RF

(TCCBIF)=1

DISI + IOCF0 (TCCCIE) Bit5=1

Next Instruction + Set RF (TCCCIF)=1

ENI + IOCF0 (TCCCIE) Bit5=1

Interrupt Vector (01EH) + Set RF

(TCCCIF)=1

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 35

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.5.1.2 Register Initial Values after Reset

The following summarizes the initialized values for registers.

Address Name Reset Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit Name C57 C56 C55 C54 C53 C52 C51 C50

Type

N/A IOC50

N/A IOC60

N/A IOC70

N/A IOC80

N/A IOC90

N/A

N/A

N/A

IOCA0

(IR CR)

IOCB0

(PDCR)

IOCC0

(ODCR)

Power-on 0 1 0 1 1 1 1 1 1 1

/RESET and WDT 0 1 0 1 1 1 1 1 1 1

Wake-up from Pin
Change

Bit Name C67 C66 C65 C64 C63 C62 C61 C60

Power-on 1 1 1 1 1 1 1 1

/RESET and WDT 1 1 1 1 1 1 1 1

Wake-up from Pin
Change

Bit Name X X X X X X X C70

Power-on 0 0 0 0 0 0 0 1

/RESET and WDT 0 0 0 0 0 0 0 1

Wake-up from Pin
Change

Bit Name X X CMPOUT COS1 COS0 TCCAEN TCCATS TCCATE

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name TCCBHE TCCBEN TCCBTS TCCBTE X TCCCEN TCCCTS TCCCTE

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name TCCCSE TCCCS2 TCCCS1 TCCCS0 IRE HF LGP IROUTE

Power-On 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name /PD57 /PD56 /PD55 /PD54 /PD53 /PD52 /PD51 /PD50

Power-on 1 1 1 1 1 1 1 1

/RESET and WDT 1 1 1 1 1 1 1 1

Wake-up from Pin
Change

Bit Name /OD67 /OD66 /OD65 /OD64 /OD63 /OD62 /OD61 /OD60

Power-on 1 1 1 1 1 1 1 1

/RESET and WDT 1 1 1 1 1 1 1 1

Wake-up from Pin
Change

259N 260N 259N 260

0 P 0 P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

– – – – – –

N

36 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Address Name Reset Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit Name /PH57 /PH56 /PH55 /PH54 /PH53 /PH52 /PH51 /PH50

N/A

N/A IOCE0

N/A IOCF0

N/A

N/A

N/A

N/A

N/A

IOCD0

(PHCR)

IOC51

(TCCA)

IOC61

(TCCB)

IOC71

(TCCBH)

IOC81

(TCCC)

IOC91

(LTR)

Power-on 1 1 1 1 1 1 1 1

/RESET and WDT 1 1 1 1 1 1 1 1

Wake-up from Pin
Change

Bit Name WDTC EIS ADIE CMPIE PSWE PSW2 PSW1 PSW0

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name LPWTIE HPWTIE TCCCIE TCCBIE TCCAIE EXIE ICIE TCIE

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name TCCA7 TCCA6 TCCA5 TCCA4 TCCA3 TCCA2 TCCA1 TCCA0

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name TCCB7 TCCB6 TCCB5 TCCB4 TCCB3 TCCB2 TCCB1 TCCB0

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name TCCBH7 TCCBH6 TCCBH5 TCCBH4 TCCBH3 TCCBH2 TCCBH1 TCCBH0

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name TCCC7 TCCC6 TCCC5 TCCC4 TCCC3 TCCC2 TCCC1 TCCC0

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name LTR7 LTR6 LTR5 LTR4 LTR3 LTR2 LTR1 LTR0

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 37

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Address Name Reset Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit Name HTR7 HTR6 HTR5 HTR4 HTR3 HTR2 HTR1 HTR0

N/A

N/A

N/A

N/A CONT

0x00 R0(IAR)

0x01 R1(TCC)

0x02 R2(PC)

0x03 R3(SR)

IOCA1

(HTR)

IOCB1

(HLTS)

IOCC1

(TCCPC)

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name HTSE HTS2 HTS1 HTS0 LTSE LTS2 LTS1 LTS0

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name TCCPC7 TCCPC6 TCCPC5 TCCPC4 TCCPC3 TCCPC2 TCCPC1 TCCPC0

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name INTE INT TS TE PSTE PST2 PST1 PST0

Power-on 1 0 1 1 0 0 0 0

/RESET and WDT 1 0 1 1 0 0 0 0

Wake-Up from Pin
Change

Bit Name – – – – – – – –

Power-on U U U U U U U U

/RESET and WDT P P P P P P P P

Wake-up from Pin
Change

Bit Name – – – – – – – –

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 00 0

Wake-up from Pin
Change

Bit Name – – – – – – – –

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name RST IOCS PS0 T P Z DC C

Power-on 0 0 0 1 1 U U U

/RESET and WDT 0 0 0 T t P P P

Wake-up from Pin
Change

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

Jump to address 0x06 or continue to execute next instruction

P P P T t P P P

38 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Address Name Reset Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit Name X BS X X X X X X

Power-on 0 0 U U U U U U

0x04 R4(RSR)

0x05 R5

0x06 R6

0x7 R7

0x8

0x9

0xA

0XB

(AISR)

(ADCON)

(ADOC)

(ADDATA)

/RESET and WDT 0 0 P P P P P P

Wake-up from Pin
Change

Bit Name P57 P56 P55 P54 P53 P52 P51 P50

Power-on 1 1 1 1 1 1 1 1

/RESET and WDT 1 1 1 1 1 1 1 1

Wake-up from Pin
Change

Bit Name P67 P66 P65 P64 P63 P62 P61 P60

Power-on 1 1 1 1 1 1 1 1

/RESET and WDT 1 1 1 1 1 1 1 1

Wake-up from Pin
Change

Bit Name – – – – – – – P70

Power-on 0 0 0 0 0 0 0 1

/RESET and WDT 0 0 0 0 0 0 0 1

Wake-up from Pin
Change

Bit Name – – – – ADE3 ADE2 ADE1 ADE0

Power-on 0 0 0 0 0 0 0 0

R8

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name VREFS CKR1 CKR0 ADRUN ADPD – ADIS1 ADIS0

Power-on 0 0 0 0 0 0 0 0

R9

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name CALI SIGN VOF[2] VOF[1] VOF[0] – – –

Power-on 0 0 0 0 0 0 0 0

RA

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name AD11 AD10 AD9 AD8 AD7 AD6 AD5 AD4

Power-on U U U U U U U U

RB

/RESET and WDT U U U U U U U U

Wake-up from Pin
Change

0 P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

0 0 0 0 P P P P

P P P P P 0 P P

P P P P P P P P

P P P P P P P P

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 39

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Address Name Reset Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit Name “0” “0” “0” “0” AD11 AD10 AD9 AD8

0XC

0XD

0xE

0xF

0x10~0x3F R10~R3F

Legend: ×: Not used U: Unknown or don’t care

RC

(ADDATA1H)

RD

(ADDATA1L0)

RE

(ISR2)

RF

(ISR1)

P: Previous value before reset

Power-on 0 0 0 0 U U U U

/RESET and WDT 0 0 0 0 U U U U

Wake-up from Pin
Change

Bit Name AD7 AD6 AD5 AD4 AD3 AD2 AD1 AD0

Power-on U U U U U U U U

/RESET and WDT U U U U U U U U

Wake-up from Pin
Change

Bit Name –- – ADIF CMPIF ADWE CMPWE ICWE –

Power-un 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name LPWTIF HPWTIF TCCCIF TCCBIF TCCAIF EXIF ICIF TCIF

Power-on 0 0 0 0 0 0 0 0

/RESET and WDT 0 0 0 0 0 0 0 0

Wake-up from Pin
Change

Bit Name – – – – – – – –

Power-on U U U U U U U U

/RESET and WDT P P P P P P P P

Wake-up from Pin
Change

0 0 0 0 P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

P P P P P P P P

t: Check table under Section 6.5.2.

6.5.1.3 Controller Reset Block Diagram

Voltage

/RESET

WDT

Oscillator

Power-on Reset

Detector

ENWDTB

Fig. 6-7 Controller Reset Block Diagram

40 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

WDT

Timeout

VDD

D Q

CLK

CLR

CLK

Setup

time

Reset

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.5.2 The T and P Status under STATUS (R3) Register

A reset condition is initiated by one of the following events:

1. Power-on reset

2. /RESET pin input "low"

3. WDT time-out (if enabled).

The values of RST, T, and P as listed in the table below, are used to check how the

processor wakes up.

Reset Type RST T P

Power-on 0 1 1
/RESET during Operating mode 0 *P *P

/RESET wake-up during Sleep mode 0 1 0

WDT during Operating mode 0 0 1

WDT wake-up during Sleep mode 0 0 0

Wake-up on pin change during Sleep mode 1 1 0

*P: Previous status before reset

The following shows the events that may affect the status of T and P.

Power-on 0 1 1
WDTC instruction *P 1 1
WDT time-out 0 0 *P
SLEP instruction *P 1 0

Wake-up on pin changed during Sleep mode 1 1 0

6.6 Interrupt

The EM78P259N/260N has six interrupts as listed below:

1. TCC, TCCA, TCCB, TCCC overflow interrupt

2. Port 5 Input Status Change Interrupt

3. External interrupt [(P60, /INT) pin]

4. Analog to Digital conversion completed

5. IR/PWM underflow interrupt

6. When the comparators status changes

Before the Port 5 Input Status Change Interrupt is enabled, reading Port 5 (e.g. "MOV

R5,R5") is necessary. Each Port 5 pin will have this feature if its status changes. The

Port 5 Input Status Change Interrupt will wake-up the EM78P259N/260N from the

sleep mode if it is enabled prior to going into the sleep mode by executing SLEP

instruction. When wake-up occurs, the controller will continue to execute program

in-line if the global interrupt is disabled. If enabled, the global interrupt will branch out to

the interrupt Vector 006H.

Event RST T P

*P: Previous value before reset

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 41

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

The external interrupt has an on-chip digital noise rejection circuit. Input pulse less

than 8 system clock time is eliminated as noise. However, in Low Crystal oscillator

(LXT) mode the noise rejection circuit is disabled. Edge selection is possible with INTE

of CONT. When an interrupt is generated by the External interrupt (when enabled), the

next instruction will be fetched from Address 003H. Refer to Word 1 Bits 9 & 8, Section

6.14.2, Code Option Register (Word 1) for digital noise rejection definition

RF and RE are the interrupt status register that records the interrupt requests in the

relative flags/bits. IOCF0 and IOCE0 are interrupt mask registers. The global interrupt

is enabled by the ENI instruction and is disabled by the DISI instruction. Once in the

interrupt service routine, the source of an interrupt can be determined by polling the flag

bits in RF. The interrupt flag bit must be cleared by instructions before leaving the

interrupt service routine to avoid recursive interrupts.

The flag (except for the ICIF bit) in the Interrupt Status Register (RF) is set regardless of

the ENI execution. Note that the result of RF will be the logic AND of RF and IOCF0

(refer to figure below). The RETI instruction ends the interrupt routine and enables the

global interrupt (the ENI execution).

When an interrupt is generated by the Timer clock/counter (if enabled), the next

instruction will be fetched from Address 009, 018, 01B, and 01EH (TCC, TCCA, TCCB,

and TCCC respectively).

When an interrupt generated by the AD conversion is completed (if enabled), the next

instruction will be fetched from Address 00CH.

When an interrupt is generated by the High time / Low time down counter underflow (if

enabled), the next instruction will be fetched from Address 012 and 015H (High time

and Low time respectively).

When an interrupt is generated by the Comparators (if enabled), the next instruction will

be fetched from Address 00FH (Comparator interrupt).

Before the interrupt subroutine is executed, the contents of ACC and the R3 and R4

registers will be saved by the hardware. If another interrupt occurs, the ACC, R3, and

R4 will be replaced by the new interrupt. After the interrupt service routine is completed,

the ACC, R3, and R4 registers are restored.

42 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

VCC

P

Q

/IRQn

D

RF

CLK

R

_
Q

C
L

RFRD

IRQn

IRQm

ENI/DISI

INT

/RESET

IOCF

Q
_

Q

P
R

CLK
C
L

IOCFRD

RFWR

D

IOCFWR

IOD

Fig. 6-8 Interrupt Input Circuit

Interrupt

occurs

RETI

STACKACC

STACKR3
STACKR4

Interrupt sources

ENI/
DISI

ACC

R3
R4

Fig. 6-9 Interrupt Backup Diagram

In EM78P259N/260N, each individual interrupt source has its own interrupt vector as

depicted in the table below.

Interrupt Vector Interrupt Status Priority *

003H External interrupt 1

006H Port 5 pin change 2

009H TCC overflow interrupt 3

00CH AD conversion complete interrupt 4

00FH Comparator interrupt 5

012H High-pulse width timer underflow interrupt 6

015H Low-pulse width timer underflow interrupt 7

018H TCCA overflow interrupt 8

01BH TCCB overflow interrupt 9

01EH TCCC overflow interrupt 10

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 43

*Priority: 1 = highest ; 10 = lowest priority

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.7 Analog-to-Digital Converter (ADC)

The analog-to-digital circuitry consist of a 4-bit analog multiplexer; three control

registers (AISR/R8, ADCON/R9, & ADOC/RA), three data registers (ADDATA/RB,

ADDATA1H/RC, & ADDATA1L/RD), and an ADC with 12-bit resolution as shown in the

functional block diagram below. The analog reference voltage (Vref) and the analog

ground are connected via separate input pins. Connecting to the external VREF is

more accurate than connecting to the internal VDD.

The ADC module utilizes successive approximation to convert the unknown analog

signal into a digital value. The result is fed to the ADDATA, ADDATA1H, and

ADDATA1L. Input channels are selected by the analog input multiplexer via the

ADCON register Bits ADIS1 and ADIS0.

ADC3
ADC2
ADC1
ADC0

AISR

8-1 Analog Switch

Power-Down

Start to Convert

ADCON

7 ~ 0

ADC

( successive approximation )

Fsco

4-1
MUX

Internal RC

01

ADCON

ADCON RF

DATA BUS

Fig. 6-10 Analog-to-Digital Conversion Functional Block Diagram

3

56

ADDATA1H

ADDATA1L

01234567891011

6.7.1 ADC Control Register (AISR/R8, ADCON/R9, ADOC/RA)

6.7.1.1 R8 (AISR: ADC Input Select Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

– – – – ADE3 ADE2 ADE1 ADE0

The AISR register individually defines the Port 5 pins as analog input or as digital I/O.

Vref

34

Bit 7 ~ 4: Not used
Bit 3 (ADE3): AD converter enable bit of P53 pin

0 = Disable ADC3, P53 acts as I/O pin
1 = Enable ADC3 acts as analog input pin

Bit 2 (ADE2): AD converter enable bit of P52 pin
0 = Disable ADC2, P53 acts as I/O pin
1 = Enable ADC2 acts as analog input pin

44 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 1 (ADE1): AD converter enable bit of P51 pin

0 = Disable ADC1, P51 acts as I/O pin
1 = Enable ADC1 acts as analog input pin

Bit 0 (ADE0): AD converter enable bit of P50 pin
0 = Disable ADC0, P50 acts as I/O pin
1 = Enable ADC0 acts as analog input pin

6.7.1.2 R9 (ADCON: AD Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

VREFS CKR1 CKR0 ADRUN ADPD - ADIS1 ADIS0

The ADCON register controls the operation of the AD conversion and determines

which pin should be currently active.

Bit 7(VREFS): Input source of the ADC Vref
0 = The ADC Vref is connected to Vdd (default value), and the

P54/VREF pin carries out the P54 function

1 = The ADC Vref is connected to P54/VREF

NOTE

The P54/TCC/VREF pin cannot be applied to TCC and VREF at the same time. IF
P54/TCC/VREF acts as VREF analog input pin, then CONT Bit 5 (TS) must be “0”.

The P54/TCC/VREF pin priority is as follows:

P54/TCC/VREF Pin Priority

High Medium Low

VREF TCC P54

Bit 6 ~ Bit 5 (CKR1 ~ CKR0): The ADC prescaler oscillator clock rate

00 = 1: 16 (default value)

01 = 1: 4

10 = 1: 64

11 = 1: WDT ring oscillator frequency

CKR1:CKR0 Operat ion Mode Max. Operation Frequency

00 Fosc/16 4 MHz

01 Fosc/4 1 MHz

10 Fosc/64 16 MHz

11 Internal RC –

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 45

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 4 (ADRUN): ADC starts to RUN.

0 = reset on completion of the conversion. This bit cannot be reset

1 = an AD conversion is started. This bit can be set by software.
Bit 3 (ADPD): ADC Power-down mode.

0 = switch off the resistor reference to save power even

while the CPU is operating.

1 = ADC is operating

Bit 2: Not used
Bit 1 ~ Bit 0 (ADIS1 ~ ADIS0): Analog Input Select

00 = ADIN0/P50

01 = ADIN1/P51

10 = ADIN2/P52

11 = A D I N3/P53

These bits can only be changed when the ADIF bit and the ADRUN bit

are both LOW.

though software.

6.7.1.3 RA (ADOC: AD Offset Calibration Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

CALI SIGN VOF[2] VOF[1] VOF[0] – – –

Bit 7 (CALI): Calibration enable bit for ADC offset
0 = Calibration disable
1 = Calibration enable

Bit 6 (SIGN): Polarity bit of offset voltage
0 = Negative voltage
1 = Positive voltage

Bit 5 ~ Bit 3 (VOF[2] ~ VOF[0]): Offset voltage bits.

VOF[2] VOF[1] VOF[0] EM78P259N/260N ICE259N

0 0 0 0LSB 0LSB

0 0 1 2LSB 1LSB

0 1 0 4LSB 2LSB

0 1 1 6LSB 3LSB

1 0 0 8LSB 4LSB

1 0 1 10LSB 5LSB

1 1 0 12LSB 6LSB

1 1 1 14LSB 7LSB

Bit 2 ~ Bit 0: Unimplemented, read as ‘0’.

46 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.7.2 ADC Data Register (ADDATA/RB, ADDATA1H/RC, ADDATA1L/RD)

When the AD conversion is completed, the result is loaded to the ADDATA, ADDATA1H

and ADDATA1L registers. The ADRUN bit is cleared, and the ADIF is set.

6.7.3 ADC Sampling Time

The accuracy, linearity, and speed of the successive approximation of AD converter are

dependent on the properties of the ADC and the comparator. The source impedance

and the internal sampling impedance directly affect the time required to charge the

sample holding capacitor. The application program controls the length of the sample

time to meet the specified accuracy. Generally speaking, the program should wait for

2μs for each KΩ of the analog source impedance and at least 2μs for the

low-impedance source. The maximum recommended impedance for analog source is

10KΩ at Vdd=5V. After the analog input channel is selected, this acquisition time must

be done before the conversion is started.

6.7.4 AD Conversion Time

CKR1 and CKR0 select the conversion time (Tct), in terms of instruction cycles. This

allows the MCU to run at a maximum frequency without sacrificing the AD conversion

accuracy. For the EM78P259N/260N, the conversion time per bit is about 4μs. The

table below shows the relationship between Tct and the maximum operating

frequencies.

CKR1:CKR0

00 Fosc/16 4 MHz 250kHz (4μs) 15*4μs=60μs (16.7kHz)

01 Fosc/4 1 MHz 250kHz (4μs) 15*4μs=60μs (16.7kHz)

10 Fosc/64 16 MHz 250kHz ( 4μs) 15*4μs=60μs (16.7kHz)

11 Internal RC – 14kHz (71μs) 15*71μs=1065μs (0.938kHz)

Operation

Mode

Max. Operation

Frequency

Max. Conversion

Rate/Bit

Max. Conversion Rate

NOTE

■ Pin not used as an analog input pin can be used as a regular input or output pin.

■ During conversion, do not perform output instruction to maintain precision for all of

the pins.

6.7.5 ADC Operation during Sleep Mode

In order to obtain a more accurate ADC value and reduce power consumption, the AD

conversion remains operational during sleep mode. As the SLEP instruction is

executed, all the MCU operations will stop except for the Oscillators TCC, TCCA,

TCCB, TCCC and AD conversion.

The AD Conversion is considered completed as determined by:

1. ADRUN bit of R9 register is cleared (“0” value).

2. ADIF bit of RE register is set to “1”.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 47

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

3. ADWE bit of the RE register is set to “1.” Wake-up from ADC conversion (where it
remains in operation during sleep mode).

4. Wake-up and executes the next instruction if ADIE bit of IOCE0 is enabled and the
“DISI” instruction is executed.

5. Wake-up and enters into Interrupt vector (Address 0x00C) if ADIE bit of IOCE0 is
enabled and the “ENI” instruction is executed.

6. Enters into Interrupt vector (Address 0x00C) if ADIE bit of IOCE0 is enabled and the

“ENI” instruction is executed.

The results are fed into the ADDATA, ADDATA1H, and ADDATA1L registers when the

conversion is completed. If the ADIE is enabled, the device will wake up. Otherwise,

the AD conversion will be shut off, no matter what the status of ADPD bit is.

6.7.6 Programming Process/Considerations

6.7.6.1 Programming Process

Follow these steps to obtain data from the ADC:

1. Write to the four bits (ADE3:ADE0) on the R8 (AISR) register to define the

characteristics of R5 (digital I/O, analog channels, or voltage reference pin)

2. Write to the R9/ADCON register to configure the AD module:

a) Select the ADC input channel (ADIS1:ADIS0)
b) Define the AD conversion clock rate (CKR1:CKR0)

c) Select the VREFS input source of the ADC

d) Set the ADPD bit to 1 to begin sampling

3. Set the ADWE bit, if the wake-up function is employed

4. Set the ADIE bit, if the interrupt function is employed

5. Write “ENI” instruction, if the interrupt function is employed

6. Set the ADRUN bit to 1

7. Write “SLEP” instruction or Polling.

8. Wait for wake-up, ADRUN bit is cleared (“0” value), interrupt flag (ADIF) to be set

“1,” or the ADC interrupt to occur.

9. Read the ADDATA or ADDATA1H and ADDATA1L conversion data registers. If the

ADC input channel changes at this time, the ADDATA, ADDATA1H, and

ADDATA1L values can be cleared to ‘0’.

10. Clear the interrupt flag bit (ADIF)

11. For the next conversion, go to Step 1 or Step 2 as required. At least 2 Tct is

required before the next acquisition starts.

48 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

NOTE

In order to obtain accurate values, it is necessary to avoid any data transition on the
I/O pins during AD conversion.

6.7.6.2 Sample Demo Programs

A. Define a General Register

R_0 == 0 ; Indirect addressing register
PSW == 3 ; Status register
PORT5 == 5
PORT6 == 6
R_E== 0XE ; Interrupt status register

B. Define a Control Register

IOC50 == 0X5 ; Control Register of Port 5
IOC60 == 0X6 ; Control Register of Port 6
C_INT== 0XF ; Interrupt Control Register

C. ADC Control Register

ADDATA == 0xB ; The contents are the results of ADC
AISR == 0x08 ; ADC input select register
ADCON == 0x9 ; 7 6 5 4 3 2 1 0

; VREFS CKR1 CKR0 ADRUN ADPD ADIS2 ADIS1 ADIS0

D. Define Bits in ADCON

ADRUN == 0x4 ; ADC is executed as the bit is set
ADPD == 0x3 ; Power Mode of ADC

E. Program Starts

ORG 0 ; Initial address
JMP INITIAL ;

ORG 0x0C ; Interrupt vector
JMP CLRRE

;
;
;(User program section)
;
;

CLRRE:
MOV A,RE
AND A, @0BXX0XXXXX ; To clear the ADIF bit, “X” by application
MOV RE,A
BS ADCON, ADRUN ; To start to execute the next AD conversion

if necessary

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 49

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

RETI
INITIAL:
MOV A,@0B00000001 ; To define P50 as an analog input
MOV AISR,A
MOV A,@0B00001000 ; To select P50 as an analog input channel, and

MOV ADCON,A ; To define P50 as an input pin and set clock

En_ADC:
MOV A, @0BXXXXXXX1 ; To define P50 as an input pin, and the others
IOW PORT5 ; are dependent on applications
MOV A, @0BXXXX1XXX ; Enable the ADWE wake-up function of ADC, “X”

MOV RE,A
MOV A, @0BXXXX1XXX ; Enable the ADIE interrupt function of ADC,

IOW C_INT
ENI ; Enable the interrupt function

BS ADCON, ADRUN ; Start to run the ADC

; If the interrupt function is employed, the following three lines
may be ignored

;If Sleep:
SLEP

;
;(User program section)
;

or
;If Polling:
POLLING:
JBC ADCON, ADRUN ; To check the ADRUN bit continuously;
JMP POLLING ; ADRUN bit will be reset as the AD conversion

;
;(User program section)
;

AD power on

rate at fosc/16

by application

“X” by application

is completed

50 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

8-Bit Microprocessor with OTP ROM

6.8 Infrared Remote Control Application/PWM Waveform Generation

6.8.1 Overview

This LSI can easily output infrared carrier or PWM standard waveform. As illustrated

below, the IR and PWM waveform generation function include an 8-bit down count

timer/counter, high time, low time, and IR control register. The IROUT pin waveform is

determined by IOCA0 (IR and TCCC scale control register), IOCB1 (high time rate, low

time rate control register), IOC81 (TCCC counter), IOCA1 (high time register), and

IOC91 (low time register).

FT:CLK(Fosc)

EM78P259N/260N

Scale

(IOCA0)

8 Bit counter

8-to-1 MUX

(High-time)(IOCA1)

8bit binary

down counter

8

Auto-reload buffer

(TCCC)(IOC81)

Details of the Fcarrier high time width and low time width are explained below:

Fcarrier = FT/ 2 { [1+decimal TCCC Counter value (IOC81)] * TCCC

High time width = { [1+decimal high time value (IOCA1)] * High time Scale

Low time width = { [1+decimal low time value (IOC91)] * Low time Scale

Where FT is the system clock FT=Fosc/1 (CLK=2)

Auto-reload buffer

Fcarrier

HF

Fig. 6-11 IR/PWM System Block Diagram

8 Bit counter

Scale

(IOCB1)

88

8-to-1 MUX

8bit binary

down counter

8

8 Bit counter

8-to-1 MUX

8bit binary

down counter

8

Scale

(IOCB1)

Auto-reload buffer

(Low-time)(IOC91)

H/W Modulator

IRE

LGP

Scale (IOCA0) }

(IOCB1) } / FT

(IOCB1) } / FT

FT=Fosc/2 (CLK=4)

IROUT
pin

NOTE

Underflow Interrupt

HPWTIF
LPWTIF

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 51

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

When an interrupt is generated by the High time down counter underflow (if enabled),

the next instruction will be fetched from Address 018 and 01BH (High time and Low

time, respectively).

6.8.2 Function Description

The following figure shows LGP=0 and HF=1. The IROUT waveform modulates the

Fcarrier waveform at low time segments of the pulse.

Fcarrier

IROUT

HF

start

IRE

high time widthlow time width high time width low time width

Fig. 6-12a LGP=0, HF=1, IROUT Pin Output Waveform

Fcarrier

HF

IRE

IROUT

The following figure shows LGP=0 and HF=0. The IROUT waveform cannot modulate

the Fcarrier waveform at low time segments of the pulse. So IROUT waveform is

determined by the high time width and low time width instead. This mode can produce

standard PWM waveform

high time widthlow time width high time width low time width

start

Fig. 6-12b LGP=0, HF=0, IROUT Pin Output Waveform

52 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

t

8-Bit Microprocessor with OTP ROM

The following figure shows LGP=0 and HF=1. The IROUT waveform modulates the

Fcarrier waveform at low time segments of the pulse. When IRE goes low from high,

the output waveform of IROUT will keep transmitting untill high time interrupt occurs.

Fcarrier

high time widthlow time width high time widthlow time width

HF

IRE

IROUT

star

Fig. 6-12c LGP=0, HF=1, When IRE goes Low from High, IROUT Pin Outputs Waveform

The following figure shows LGP=0 and HF=0. The IROUT waveform cannot modulate

the Fcarrier waveform at low time segments of the pulse. So IROUT waveform is

determined by high time width and low time width. This mode can produce standard

PWM waveform when IRE goes low from high. The output waveform of IROUT will

keep on transmitting till high time interrupt occurs.

EM78P259N/260N

IR disable

Always high- level

Fcarrier

HF

IRE

IROUT

high time widthlow time width high time width low time width

start

IR disable

Always high-level

Fig. 6-12d LGP=0, HF=0, When IRE goes Low from High, Irout Pin Output Waveform

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 53

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

The following figure shows LGP=1 and HF=1. When this bit is set to high level, the high

time segment of the pulse is ignored. So, IROUT waveform output is determined by

low time width.

Fcarrier

HF

IRE

IROUT

start

low time widthlow time width high time width low time width

IR disable

Always high-level

Fig. 6-12e LGP=1 and HF=1, IROUT Pin Output Waveform

6.8.3 Programming the Related Registers

When defining IR/PWM, refer to the operation of the related registers as shown in the

tables below.

IR/PWM Related Control Registers

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0x09 IOC90 TCCBHE/0 TCCBEN/0 TCCBTS/0 TCCBTE/0 0 TCCCEN/0 TCCCTS/0 TCCCTE/0

0X0A

0x0F

0X0B

IR CR

/IOCA0

IMR

/IOCF0

HLTS

/IOCB1

TCCCSE/0 TCCCS2/0 TCCCS1/0 TCCCS0/0 IRE/0 HF/0 LGP/0 IROUTE/0

LPWTIE/0 HPWTIE/0 TCCCIE/0 TCCBIE/0 TCCAIE/0 EXIE/0 ICIE/0 TCIE/0

HTSE/0 HTS2/0 HTS1/0 HTS0/0 LTSE/0 LTS2/0 LTS1/0 LTS0/0

IR/PWM Related Status/Data Registers

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0x0F ISR/RF LPWTIF/0 HPWTIF/0 TCCCIF/0 TCCBIF/0 TCCAIF/0 EXIF/0 ICIF/0 TCIF/0

0x06

0X09

0X0A

54 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

TCCC

/IOC81

LTR

/IOC91

HTR

/IOCA1

TCCC7/0 TCCC6/0 TCCC5/0 TCCC4/0 TCCC3/0 TCCC2/0 TCCC1/0 TCCC0/0

LTR7/0 LTR6/0 LTR5/0 LTR4/0 LTR3/0 LTR2/0 LTR1/0 LTR0/0

HTR7/0 HTR6/0 HTR5/0 HTR4/0 HTR3/0 HTR2/0 HTR1/0 HTR0/0

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 55

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.9 Timer/Counter

6.9.1 Overview

Timer A (TCCA) is an 8-bit clock counter. Timer B (TCCB) is a 16-bit clock counter.
Timer C (TCCC) is an 8-bit clock counter that can be extended to 16-bit clock counter
with programmable scalers. TCCA, TCCB, and TCCC can be read and written to, and
are cleared at every reset condition.

6.9.2 Function Description

Set predict value

TCCA

System clock or

External input

Set predict value Set predict value

TCCAEN

Overflow

Set TCCAIF

TCCB

System clock or

External inp ut

TCCBEN

Overflow

Set TCCBIF

TCCC

8-to-1 MUX

8 Bit

counter

System clock or

External inp ut

TCCCEN

Set TCCCIF

Overflow

TCCCS1 ~ TCCCS0

Fig. 6-13 Timer Block Diagram

Each signal and block of the above TIMER block diagram is described as follows:

TCCX: Timer A~C register. TCCX increases until it matches with zero, and then

reloads the predicted value. When writing a value to TCCX, the predicted

value and TCCX value become the set value. When reading from TCCX, the

value will be the TCCX direct value. When TCCXEN is enabled, the reload of

the predicted value to TCCX, TCCXIE is also enabled. TCCXIF will be set at

the same time. It is an Up Counter.

Under TCCA Counter (IOC51):

IOC51 (TCCA) is an 8-bit clock counter. It can be read, written to, and cleared

on any reset condition and is an Up Counter.

NOTE

■ TCCA time-out period [1/Fosc x (256-TCCA cnt) x 1 (CLK=2)]

■ TCCA time-out period [1/Fosc x (256-TCCA cnt) x 2 (CLK=4)]

Under TCCB Counter (IOC61):

TCCB (IOC61) is an 8-bit clock counter for the least significant byte of TCCBX

(TCCB). It can be read, written to, and cleared on any reset condition and is an

Up Counter.

56 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Under TCCBH / MSB Counter (IOC71):

TCCBH/MSB (IOC71) is an 8-bit clock counter is for the most significant byte of

TCCBX (TCCBH). It can be read, written to, and cleared on any reset

condition.

When TCCBHE (IOC90) is “0,” then TCCBH is disabled. When TCCBHE is”1,”

then TCCB is a 16-bit length counter.

NOTE

When TCCBH is Disabled:

TCCB time-out period [1/Fosc x ( 256 - TCCB cnt ) x 1(CLK=2)]

TCCB time-out period [1/Fosc x ( 256 - TCCB cnt ) x 2(CLK=4)]

When TCCBH is Enabled:

TCCB time-out period {1/Fosc x [ 65536 - (TCCBH * 256 + TCCB cnt)] x 1(CLK=2)}

TCCB time-out period {1/Fosc x [ 65536 - (TCCBH * 256 + TCCB cnt)] x 2(CLK=4)}

Under TCCC Counter (IOC81):

IOC81 (TCCC) is an 8-bit clock counter. It can be read, written, and cleared on

any reset condition.

If HF (Bit 2 of IOCA0) = 1 and IRE (Bit 3 of IOCA0) = 1, TCCC counter scale

uses the low time segments of the pulse generated by Fcarrier frequency

modulation (see Fig. 6-12 in Section 6.8.2, Function Description). Then the

TCCC value will be the TCCC predicted value.

When HF = 0 or IRE = 0, the TCCC is an Up Counter.

In TCCC Up Counter mode:

■ TCCC timeout period [1/Fosc x scaler (IOCA0) x (256-TCCC cnt) x 1(CLK=2)]

■ TCCC timeout period [1/Fosc x scaler (IOCA0) x (256-TCCC cnt) x 2(CLK=4)]

When HF = 1 and IRE = 1, the TCCC counter scale uses the low time

segments of the pulse generated by Fcarrier frequency modulation.

In IR mode:

■ Fcarrier = FT/ 2 { [1+decimal TCCC Counter value (IOC81)] * TCCC Scale (IOCA0) }

■ FT is system clock: FT = Fosc/1 (CLK=2)

FT = Fosc/2 (CLK=4)

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 57

NOTE

NOTE

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.9.3 Programming the Related Registers

When defining TCCX, refer to its related registers operation as shown in the tables

below.

TCCX Related Control Registers:

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0x08 IOC80 0 0 CPOUT/0 COS1/0 COS0/0 TCCAEN/0 TCCATS/0 TCCATE/0

0x09 IOC90 TCCBHE/0 TCCBEN/0 TCCBTS/0 TCCBTE/0 0 TCCCEN/0 TCCCTS/0 TCCCTE/0

0x0A

0x0F

IR CR

/IOCA0

IMR

/IOCF0

TCCCSE/0 TCCCS2/0 TCCCS1/0 TCCCS0/0 IRE/0 HF/0 LGP/0 IROUTE/0

LPWTE/0 HPWTE/0 TCCCIE/0 TCCBIE/0 TCCAIE/0 EXIE/0 ICIE/0 TCIE/0

Related TCCX Status/Data Registers:

Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0x0F ISR/RF LPWTF/0 HPWTF/0 TCCCIF/0 TCCBIF/0 TCCAIF/0 EXIF/0 ICIF/0 TCIF/0

0x05

0x06

0x07

0x08

TCCA

/IOC51

TCCB

/IOC61

TCCBH

/IOC71

TCCC

/IOC81

TCCA7/0 TCCA6/0 TCCA5/0 TCCA4/0 TCCA3/0 TCCA2/0 TCCA1/0 TCCA0/0

TCCB7/0 TCCB6/0 TCCB5/0 TCCB4/0 TCCB3/0 TCCB2/0 TCCB1/0 TCCB0/0

TCCBH7/0 TCCBH6/0 TCCBH5/0 TCCBH4/0 TCCBH3/0 TCCBH2/0 TCCBH1/0 TCCBH0/0

TCCC7/0 TCCC6/0 TCCC5/0 TCCC4/0 TCCC3/0 TCCC2/0 TCCC1/0 TCCC0/0

6.10 Comparator

EM78P259N/260N has

one comparator which

has two analog inputs and

one output. The

comparator can be

employed to wake-up

from the sleep mode.

Figure below shows the

circuit of the comparator.

58 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

Cin-

Cin+

Output

-

Cin

-

Cin+

30mV

Fig. 6-14 Comparator Operating Mode

CMP

+

CO

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.10.1 External Reference Signal

The analog signal that is presented at Cin– compares to the signal at Cin+. The digital

output (CO) of the comparator is adjusted accordingly by taking the following notes into

considerations:

NOTE

■ The reference signal must be between Vss and Vdd.

■ The reference voltage can be applied to either pin of the comparator.

■ Threshold detector applications may be of the same reference.

■ The comparator can operate from the same or different reference sources.

6.10.2 Comparator Output

 The compared result is stored in the CMPOUT of IOC80.

 The comparator outputs are sent to CO (P64) through programming Bit 4 &

Bit 3<COS1, COS0> of the IOC80 register to <1,0>. See table under Section 6.2.4,

IOC80 (Comparator and TCCA Control Registers) for Comparator/OP select bits

function description.

The following figure shows the Comparator Output block diagram.

To C0

From OP I/O

CMRD

ENEN

To CMPOUT

Q

CMRD

Fig. 6-15 Comparator Output Configuration

D

RESET

Q

From other

comparator

D

To CPIF

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 59

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.10.3 Using a Comparator as an Operation Amplifier

The comparator can be used as an operation amplifier if a feedback resistor is

externally connected from the input to the output. In this case, the Schmitt trigger can

be disabled for power saving purposes, by setting Bit 4, Bit 3<COS1, COS0> of the

IOC80 register to <1,1>. See table under Section 6.2.4, IOC80 (Comparator and TCCA

Control Registers) for Comparator/OP select bits function description.

Under Operation Amplifier:

■ The CMPIE (IOCE0.4), CMPWE (RE.2), and CMPIF (RE.4) bits are invalid.

■ The comparator interrupt is invalid.

■ The comparator wake-up is invalid.

6.10.4 Comparator Interrupt

 CMPIE (IOCE0.4) must be enabled for the “ENI” instruction to take effect

 Interrupt is triggered whenever a change occurs on the comparator output pin

 The actual change on the pin can be determined by reading the Bit CMPOUT,

IOC80<5>.

 CMPIF (RE.4), the comparator interrupt flag, can only be cleared by software

NOTE

6.10.5 Wake-up from Sleep Mode

 If the CMPWE bit of the RE register is set to “1,” the comparator remains active and

the interrupt remains functional, even under Sleep mode.

 If a mismatch occurs, the change will wake up the device from Sleep mode.

 The power consumption should be taken into consideration for the benefit of energy

conservation.

 If the function is unemployed during Sleep mode, turn off the comparator before

entering into sleep mode.

The Comparator is considered completed as determined by:

1. COS1 and COS0 bits of IOC80 register setting selects Comparator.

2. CMPIF bit of RE register is set to “1”.

3. CMPWE bit of RE register is set to “1”. Wakes-up from Comparator (where it

remains in operation during sleep mode)

4. Wakes-up and executes the next instruction, if CMPIE bit of IOCE0 is enabled and

the “DISI” instruction is executed.

5. Wake-up and enters into Interrupt vector (address 0x00F), if ADIE bit of IOCE0 is

enabled and the “ENI” instruction is executed

6. Enters into Interrupt vector (address 0x00F), if CMPIE bit of IOCE0 is enabled and

the “ENI” instruction is executed.

60 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

6.11 Oscillator

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.11.1 Oscillator Modes

The EM78P259N/260N can be operated in four different oscillator modes, such as High

Crystal oscillator mode (HXT), Low Crystal oscillator mode (LXT), External RC

oscillator mode (ERC), and RC oscillator mode with Internal RC oscillator mode (IRC).

You can select one of them by programming the OSC2, OCS1, and OSC0 in the Code

Option register.

The Oscillator modes defined by OSC2, OCS1, and OSC0 are described below.

Oscillator Modes OSC2 OSC1 OSC0

ERC1 (External RC oscillator mode); P70/OSCO acts as P70 0 0 0

ERC1 (External RC oscillator mode); P70/OSCO acts as OSCO 0 0 1

IRC2 (Internal RC oscillator mode); P70/OSCO acts as P70 0 1 0

IRC2 (Internal RC oscillator mode); P70/OSCO acts as OSCO 0 1 1

LXT3 (Low Crystal oscillator mode) 1 1 0

HXT3 High Crystal oscillator mode) (default) 1 1 1

1

In ERC mode, OSCI is used as oscillator pin. OSCO/P70 is defined by code option Word 0 Bit 6 ~ Bit 4.

2

In IRC mode, P55 is normal I/O pin. OSCO/P70 is defined by code option Word 0 Bit 6 ~ Bit 4.

3

In LXT and HXT modes; OSCI and OSCO are used as oscillator pins. These pins cannot and should not

be defined as normal I/O pins.

The transient point of the system frequency between HXT and LXY is around 400kHz.

The maximum operating frequency limit of crystal/resonator at different VDDs, are as

follows:

Conditions VDD Max. Freq. (MHz)

Two clocks

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 61

NOTE

2.3 4

3.0 8

5.0 20

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.11.2 Crystal Oscillator/Ceramic Resonators (Crystal)

The EM78P259N/260N can be driven by an external clock signal through the OSCI pin

as illustrated below.

In most applications, Pin OSCI and Pin OSCO can be connected with a crystal or

ceramic resonator to generate oscillation. Fig. 6-17 below depicts such a circuit. The

same applies to the HXT mode and the LXT mode.

OSCI

EM78P259N
EM78P260N

OSCO

Fig. 6-16 External Clock Input Circuit

C1

OSCI

EM78P259N
EM78P260N

OSCO

Crystal

RS

C2

Fig. 6-17 Crystal/Resonator Circuit

The following table provides the recommended values for C1 and C2. Since each
resonator has its own attribute, you should refer to the resonator specifications for the
appropriate values of C1 and C2. RS, a serial resistor, may be required for AT strip cut
crystal or low frequency mode.

Capacitor selection guide for crystal oscillator or ceramic resonators:

Oscillator Type Frequency Mode Frequency C1(pF) C2(pF)

455kHz 100~150 100~150

Ceramic Resonators HXT

LXT

Crystal Oscillator

HXT

2.0 MHz 20~40 20~40

4.0 MHz 10~30 10~30

32.768kHz 25 15

100kHz 25 25

200kHz 25 25

455kHz 20~40 20~150

1.0 MHz 15~30 15~30

2.0 MHz 15 15

4.0 MHz 15 15

62 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Circuit diagrams for serial and parallel modes Crystal/Resonator:

OSCI

EM78P259N
EM78P260N

Fig. 6-18 Serial Mode Crystal/Resonator Circuit Diagram

EM78 P259N
EM78 P260N

Fig. 6-19 Parallel Mode Crystal/Resonator Circuit Diagram

7404

7404

OSCI

10K

6.11.3 External RC Oscillator Mode

330 330

C

7404 7404

Crystal

10K4.7K

Vdd

7404

Crystal

C1

C2

10K

For some applications that do not require

precise timing calculation, the RC

oscillator (Fig. 6-20 right) could offer you

Vcc

Rext

with effective cost savings. Nevertheless,

it should be noted that the frequency of

the RC oscillator is influenced by the

supply voltage, the values of the resistor

EM78P259N
EM78P260N

OSCI

Cext

(Rext), the capacitor (Cext), and even by

the operation temperature. Moreover, the

frequency also changes slightly from one

Fig. 6-20 External RC Oscillator Mode Circuit

chip to another due to manufacturing

process variation.

In order to maintain a stable system frequency, the values of the Cext should be no less

than 20pF, and that of Rext should be no greater than 1MΩ. If the frequency cannot be

kept within this range, the frequency can be affected easily by noise, humidity, and

leakage.

The smaller the Rext in the RC oscillator is, the faster its frequency will be. On the

contrary, for very low Rext values, for instance, 1 KΩ, the oscillator will become

unstable because the NMOS cannot discharge the capacitance current correctly.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 63

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Based on the above reasons, it must be kept in mind that all supply voltage, the

operation temperature, the components of the RC oscillator, the package types, and

the way the PCB is layout, have certain effect on the system frequency.

The RC Oscillator frequencies:

Cext Rext Average Fosc 5V, 25°C Average Fosc 3V, 25°C

3.3k 3.5 MHz 3.2 MHz

20 pF

100 pF

300 pF

1

Note:

: Measured based on DIP packages.

2

: The values are for design reference only.

3

: The frequency drift is ± 30%.

5.1k 2.5 MHz 2.3 MHz

10k 1.30 MHz 1.25 MHz

100k 140kHz 140kHz

3.3k 1.27 MHz 1.21 MHz

5.1k 850kHz 820kHz

10k 450kHz 450kHz

100k 48kHz 50kHz

3.3k 560kHz 540kHz

5.1k 370kHz 360kHz

10k 196kHz 192kHz

100k 20kHz 20kHz

6.11.4 Internal RC Oscillator Mode

EM78P259N/260N offers a versatile internal RC mode with default frequency value of

4MHz. Internal RC oscillator mode has other frequencies (1MHz, 8MHz, and 455kHz)

that can be set by Code Option (Word 1), RCM1, and RCM0. The Table below

describes the EM78P259N/260N internal RC drift with voltage, temperature, and

process variation.

Internal RC Drift Rate (Ta=25°C, VDD=5V±5%, VSS=0V)

Internal

RC Frequency

4MHz ±10% ±5% ±4% ±19%

8MHz ±10% ±6% ±4% ±20%

1MHz ±10% ±5% ±4% ±19%

455MHz ±10% ±5% ±4% ±19%

Note: These are theoretical values provided for reference only. Actual values may vary depending on the

actual process.

Temperature

(-40°C ~ +85°C)

Voltage

(2.3V~5.5V)

Drift Rate

Process Total

64 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

6.12 Power-on Considerations

Any microcontroller is not warranted to start operating properly before the power supply

stabilizes in its steady state. The EM78P259N/260N POR voltage range is 1.9V ~ 2.1V.

Under customer application, when power is switched OFF, Vdd must drop below 1.9V

and remains at OFF state for 10μs before power can be switched ON again.

Subsequently, the EM78P259N/260N will reset and work normally. The extra external

reset circuit will work well if Vdd rises fast enough (50ms or less). However, under

critical applications, extra devices are still required to assist in solving power-on

problems.

6.12.1 Programmable WDT Time-out Period

The Option word (WDTPS) is used to define the WDT time-out period (18ms5 or

6

4.5ms

). Theoretically, the range is from 4.5ms or 18ms. For most crystal or ceramic

resonators, the lower the operation frequency is, the longer is the required set-up time.

6.12.2 External Power-on Reset Circuit

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

The circuits shown in the following figure implement an external RC to produce a reset

pulse. The pulse width (time constant) should be kept long enough to allow Vdd to

reach the minimum operating voltage. This circuit is used when the power supply has a

slow power rise time. Because the current leakage from the /RESET pin is about ±5μA,

it is recommended that R should not be greater than 40K. This way, the voltage at Pin

/RESET is held below 0.2V. The diode (D) acts as a short circuit at power-down. The

“C” capacitor is discharged rapidly and fully. Rin, the current-limited resistor, prevents

high current discharge or ESD (electrostatic discharge) from flowing into Pin /RESET.

Vdd

EM78P259N
EM78P260N

/RESET

Rin

R

D

C

Fig. 6-21 External Power-on Reset Circuit

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

5

VDD=5V, WDT time-out period = 16.5ms ± 30%.

VDD=3V, WDT time-out period = 18ms ± 30%.

6

VDD=5V, WDT time-out period = 4.2ms ± 30%.

VDD=3V, WDT time-out period = 4.5ms ± 30%.

• 65

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

6.12.3 Residual Voltage Protection

When the battery is replaced, device power (Vdd) is removed but the residual voltage

remains. The residual voltage may trip below Vdd minimum, but not to zero. This

condition may cause a poor power-on reset. Fig. 6-22 and Fig. 6-23 show how to

create a protection circuit against residual voltage.

Vdd

EM78P259N

33K

Vdd

EM78P260N

Q1

10K

/RESET

100K

1N4684

Fig. 6-22 Residual Voltage Protection Circuit 1

Vdd

EM78P259N
EM78P260N

/RESET

Q1

R3

R1

R2

Vdd

Fig. 6-23 Residual Voltage Protection Circuit 2

66 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

6.13 Code Option

EM78P259N/260N has two Code option words and one Customer ID word that are not

part of the normal program memory.

Bit12 ~ Bit0 Bit12 ~ Bit0 Bit12 ~ Bit0

6.13.1 Code Option Register (Word 0)

Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

– – – TYPE CLKS ENWDTB OSC2 OSC1 OSC0 HLP PR2 PR1 PR0

Bits 12 ~ 10: Not used (reserved). These bits are set to “1” all the time
Bit 9 (TYPE): Type selection for EM78P259N or EM78P260N

0 = EM78P260N
1 = EM78P259N (default)

8-Bit Microprocessor with OTP ROM

Word 0 Word1 Word 2

Word 0

EM78P259N/260N

Bit 8 (CLKS): Instruction period option bit

0 = two oscillator periods
1 = four oscillator periods (default)

Refer to Section 6.15 for Instruction Set

Bit 7 (ENWDTB): Watchdog timer enable bit
0 = Enable
1 = Disable (default)

Bits 6, 5 & 4 (OSC2, OSC1 & OSC0): Oscillator Mode Selection bits

Oscillator Modes OSC2 OSC1 OSC0

ERC1 (External RC oscillator mode); P70/OSCO acts as P70 0 0 0

ERC1 (External RC oscillator mode); P70/OSCO acts as OSCO 0 0 1

IRC2 (Internal RC oscillator mode); P70/OSCO acts as P70 0 1 0

IRC2 (Internal RC oscillator mode); P70/OSCO acts as OSCO 0 1 1

LXT3 (Low Crystal oscillator mode) 1 1 0

HXT3 High Crystal oscillator mode) (default) 1 1 1

1

In ERC mode, OSCI is used as oscillator pin. OSCO/P70 is defined by code option Word 0 Bit 6 ~ Bit 4.

2

In IRC mode, P55 is normal I/O pin. OSCO/P70 is defined by code option Word 0 Bit 6 ~ Bit 4.

3

In LXT and HXT modes; OSCI and OSCO are used as oscillator pins. These pins cannot and

should not be defined as normal I/O pins.

The transient point of the system frequency between HXT and LXY is around 400kHz.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 67

NOTE

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 3 (HLP): Power consumption selection

0 = Low power consumption, applies to working frequency

1 = High power consumption, applies to working frequency

Bit 2 ~ 0 (PR2 ~ PR0): Protect Bits
PR2 ~ PR0 are protect bits. Each protect status is as follows:

6.13.2 Code Option Register (Word 1)

Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

- - RCOUT NRHL NRE WDTPS CYES C3 C2 C1 C0 RCM1 RCM0

at or below 4MHz

above 4MHz

PR2 PR1 PR0 Protect

Others Enable

1 1 1 Disable

Word 1

Bits 12 ~ 11: Not used (reserved). These bits are set to “1” all the time
Bit 10 (RCOUT): Instruction clock output enable bit in IRC or ERC mode

0 = OSCO pin is open drain
1 = OSCO output instruction clock
Bit 9 (NRHL): Noise rejection high/low pulses define bit. INT pin is falling or

rising edge trigger

0 = Pulses equal to 8/fc [s] is regarded as signal
1 = Pulses equal to 32/fc [s] is regarded as signal (default)

NOTE

The noise rejection function is turned off under the LXT and sleep mode.

Bit 8 (NRE): Noise rejection enable
0 = disable noise rejection

1 = enable noise rejection (default), but under Low Crystal

oscillator (LXT) mode, the noise rejection circuit is always
disabled.

68 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Bit 7 (WDTPS): WDT Time-out Period Selection bit

WDT Time Watchdog Time*

1 18 ms

0 4.5 ms

*These are theoretical values provided for reference only

Bit 6 (CYES): Instruction cycle selection bit
0 = one instruction cycle.
1 = two instructions cycles (default)

Bits 5, 4, 3, & Bit 2 (C3, C2, C1, C0): Calibrator of internal RC mode

C3, C2, C1, & C0 must be set to “1” only (auto-calibration).

Bit 1 & Bit 0 (RCM1, RCM0): RC mode selection bits

RCM 1 RCM 0 Frequency (MHz)

1 1 4

1 0 8

0 1 1

0 0 455kHz

6.13.3 Customer ID Register (Word 2)

Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

X X X X X X X X X X X X X

Bit 12 ~ 0: Customer’s ID code

6.14 Instruction Set

Each instruction in the instruction set is a 13-bit word divided into an OP code and one

or more operands. Normally, all instructions are executed within one single instruction

cycle (one instruction consists of 2 oscillator periods), unless the program counter is

changed by instructions "MOV R2,A," "ADD R2,A," or by instructions of arithmetic or

logic operation on R2 (e.g., "SUB R2,A," "BS(C) R2,6," "CLR R2," etc.). In this case,

these instructions need one or two instruction cycles as determined by Code Option

Register CYES bit.

In addition, the instruction set has the following features:

1. Every bit of any register can be set, cleared, or tested directly.

2. The I/O registers can be regarded as general registers. That is, the same

instruction can operate on I/O registers.

Word 2

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 69

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Convention:
R = Register designator that specifies which one of the registers (including operation and general purpose

registers) is to be utilized by the instruction.

b = Bit field designator that selects the value for the bit located in the register R and which affects the

operation.

k = 8 or 10-bit constant or literal value

The following are the EM78P259N/260N instruction set

Instruction Binary HEX Mnemonic Operation Status Affected

0 0000 0000 0000 0000 NOP No Operation None

0 0000 0000 0001 0001 DAA Decimal Adjust A C

0 0000 0000 0010 0002 CONTW A → CONT None

0 0000 0000 0011 0003 SLEP 0 → WDT, Stop oscillator T, P

0 0000 0000 0100 0004 WDTC 0 → WDT T, P

0 0000 0000 rrrr 000r IOW R A → IOCR None1

0 0000 0001 0000 0010 ENI Enable Interrupt None

0 0000 0001 0001 0011 DISI Disable Interrupt None

0 0000 0001 0010 0012 RET [Top of Stack] → PC None

0 0000 0001 0011 0013 RETI [Top of Stack] → PC, Enable Interrupt None

0 0000 0001 0100 0014 CONTR CONT → A None

0 0000 0001 rrrr 001r IOR R IOCR → A None1

0 0000 01rr rrrr 00rr MOV R,A A → R None

0 0000 1000 0000 0080 CLRA 0 → A Z

0 0000 11rr rrrr 00rr CLR R 0 → R Z

0 0001 00rr rrrr 01rr SUB A,R R-A → A Z, C, DC

0 0001 01rr rrrr 01rr SUB R,A R-A → R Z, C, DC

0 0001 10rr rrrr 01rr DECA R R-1 → A Z

0 0001 11rr rrrr 01rr DEC R R-1 → R Z

0 0010 00rr rrrr 02rr OR A,R A ∨ VR → A Z

0 0010 01rr rrrr 02rr OR R,A A ∨ VR → R Z

0 0010 10rr rrrr 02rr AND A,R A & R → A Z

0 0010 11rr rrrr 02rr AND R,A A & R → R Z

0 0011 00rr rrrr 03rr XOR A,R A ⊕ R → A Z

0 0011 01rr rrrr 03rr XOR R,A A ⊕ R → R Z

0 0011 10rr rrrr 03rr ADD A,R A + R → A Z, C, DC

0 0011 11rr rrrr 03rr ADD R,A A + R → R Z, C, DC

0 0100 00rr rrrr 04rr MOV A,R R → A Z

0 0100 01rr rrrr 04rr MOV R,R R → R Z

0 0100 10rr rrrr 04rr COMA R /R → A Z

0 0100 11rr rrrr 04rr COM R /R → R Z

0 0101 00rr rrrr 05rr INCA R R+1 → A Z

70 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Instruction Binary HEX Mnemonic Operation Status Affected

0 0101 01rr rrrr 05rr INC R R+1 → R Z

0 0101 10rr rrrr 05rr DJZA R R-1 → A, skip if zero None

0 0101 11rr rrrr 05rr DJZ R R-1 → R, skip if zero None

0 0110 00rr rrrr 06rr RRCA R R(n) → A(n-1),R(0) → C, C → A(7) C

0 0110 01rr rrrr 06rr RRC R R(n) → R(n-1),R(0) → C, C → R(7) C

0 0110 10rr rrrr 06rr RLCA R R(n) → A(n+1),R(7) → C, C → A(0) C

0 0110 11rr rrrr 06rr RLC R R(n) → R(n+1),R(7) → C, C → R(0) C

0 0111 00rr rrrr 07rr SWAPA R R(0-3) → A(4-7),R(4-7) → A(0-3) None

0 0111 01rr rrrr 07rr SWAP R R(0-3) ↔ R(4-7) None

0 0111 10rr rrrr 07rr JZA R R+1 → A, skip if zero None

0 0111 11rr rrrr 07rr JZ R R+1 → R, skip if zero None

0 100b bbrr rrrr 0xxx BC R,b 0 → R(b) None2

0 101b bbrr rrrr 0xxx BS R,b 1 → R(b) None3

0 110b bbrr rrrr 0xxx JBC R,b if R(b)=0, skip None

0 111b bbrr rrrr 0xxx JBS R,b if R(b)=1, skip None

1 00kk kkkk kkkk 1kkk CALL k PC+1 → [SP],(Page, k) → PC None

1 01kk kkkk kkkk 1kkk JMP k (Page, k) → PC None

1 1000 kkkk kkkk 18kk MOV A,k k → A None

1 1001 kkkk kkkk 19kk OR A,k A ∨ k → A Z

1 1010 kkkk kkkk 1Akk AND A,k A & k → A Z

1 1011 kkkk kkkk 1Bkk XOR A,k A ⊕ k → A Z

1 1100 kkkk kkkk 1Ckk RETL k k → A,[Top of Stack] → PC None

1 1101 kkkk kkkk 1Dkk SUB A,k k-A → A Z, C, DC

1 1111 kkkk kkkk 1Fkk ADD A,k k+A → A Z, C, DC

1

This instruction is applicable to IOC50 ~ IOCF0, IOC51 ~ IOCC1 only.

2

This instruction is not recommended for RF operation.

3

This instruction cannot operate under RF.

7 Absolute Maximum Ratings

Items Rating

Temperature under bias -40°C to 85°C

Storage temperature -65°C to 150°C

Input voltage Vss-0.3V to Vdd+0.5V

Output voltage Vss-0.3V to Vdd+0.5V

Working Voltage 2.5V to 5.5V

Working Frequency DC to 20MHz

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 71

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

8 DC Electrical Characteristics

Ta=25 °C, VDD=5.0V±5%, VSS=0V

Symbol Parameter Condition Min Typ Max Unit

Crystal: VDD to 5V DC 20 MHz

Fxt

Crystal: VDD to 3V

ERC: VDD to 5V R: 5.1KΩ, C: 100 pF F±30% 830 F±30% kHz

VIHRC

VILRC

VIH1

VIL1

VIHT1

VILT1

VIHT2

VILT2

VIHX1 Clock Input High Voltage OSCI in crystal mode 3.5 V

VILX1 Clock Input Low Voltage OSCI in crystal mode 1.5 V

IOH1

IOH2

IOL1

IOL2

ISB1 Power down current

ISB2 Power down current

Input High Threshold

Voltage (Schmitt trigger)

Input Low Threshold

Voltage (Schmitt trigger)

Input Leakage Current for

IIL

input pins

Input High Voltage

(Schmitt trigger)

Input Low Voltage

(Schmitt trigger)

Input High Threshold

Voltage (Schmitt trigger)

Input Low Threshold

Voltage (Schmitt trigger)

Input High Threshold

Voltage (Schmitt trigger)

Input Low Threshold

Voltage (Schmitt trigger)

Output High Voltage

(Ports 5, P60~66, P70)

Output High Voltage

(IR OUT (Port67))

Output Low Voltage

(Ports 5, P60~66, P70)

Output Low Voltage

(IR OUT (Port 67))

IPH Pull-high current Pull-high active, input pin at VSS -70 -75 -80 μA

IPL Pull-low current Pull-low active, input pin at Vdd 35 40 45 μA

Two cycles with two clocks

OSCI in RC mode 3.5 V

OSCI in RC mode 1.5 V

VIN = VDD, VSS -1 0 1 μA

Ports 5, 6, 7 3.75 V

Ports 5, 6, 7 1.25 V

/RESET 2.0 V

/RESET 1.0 V

TCC, INT 3.75 V

TCC, INT 1.25 V

VOH = VDD-0.5V -3.7 mA

VOH = VDD-0.5V -10 mA

VOL = GND+0.5V 10 mA

VOL = GND+0.5V 15 mA

All input and I/O pins at VDD,

Output pin floating, WDT disabled

All input and I/O pins at VDD,

Output pin floating, WDT enabled

DC 8 MHz

1.0 2.0 μA

6.0 10 μA

72 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

Symbol Parameter Condition Min Typ Max Unit

/RESET= 'High', Fosc=32kHz

(Crystal type,CLKS="0"), output

pin floating, WDT disabled

/RESET= 'High', Fosc=32kHz

(Crystal type,CLKS="0"), output

pin floating, WDT enabled

/RESET= 'High', Fosc=4MHz

(Crystal type, CLKS="0"), output

pin floating, WDT enabled

/RESET= 'High', Fosc=10MHz

(Crystal type, CLKS="0"), output

pin floating, WDT enabled

°C. These data are for design reference only.

15 20 μA

15 25 μA

1.9 2.2 mA

3.0 3.5 mA

ICC1

ICC2

ICC3

ICC4

Operating supply current

at two clocks (VDD to 3V)

Operating supply current

at two clocks (VDD to 3V)

Operating supply current

at two clocks

Operating supply current

at two clocks

Note: These parameters are hypothetical, have not been tested and are provided for design reference only.

Data in the Minimum, Typical and Maximum (“Min”, Typ”, Max”) columns are based on hypothetical

results at 25

Internal RC Electrical Characteristics (Ta=25°C, VDD=5 V, VSS=0V)

Internal RC

4MHz 25°C 5V 3.84MHZ 4MHz 4.16MHz

8MHz 25°C 5V 7.68MHz 8MHz 8.32MHz

1MHz 25°C 5V 0.96MHz 1MHz 1.04MHz

455kHz 25°C 5V 436.8kHz 455kHz 473.2kHz

Temperature Voltage Min. Typ. Max.

Drift Rate

Internal RC Electrical Characteristics (Ta=-40 ~85°C, VDD=2.2~5.5 V, VSS=0V)

Internal RC

Temperature Voltage Min. Typ. Max.

4MHz -40°C ~85°C 2.2V~5.5 V 3.24MHZ 4MHz 4.76MHz

8MHz -40°C ~85°C 2.2V~5.5 V 6.4MHz 8MHz 9.6MHz

1MHz -40°C ~85°C 2.2V~5.5 V 0.81MHz 1MHz 1.19MHz

455kHz -40°C ~85°C 2.2V~5.5 V 368.55kHz 455kHz 541.45kHz

Drift Rate

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 73

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

8.1 AD Converter Characteristics

Vdd=2.5V to 5.5V, Vss=0V, Ta=25°C

Symbol Parameter Condition Min. Typ. Max. Unit

V

AREF

V

Analog reference voltage V

ASS

AREF

- V

≥ 2.5V

ASS

VAI Analog input voltage – V

Ivdd 750 850 1000 uA

IAI1

IAI2

Analog supply current

Ivref

Ivdd 500 600 820 uA

Analog supply current

IVref

IOP OP current

RN1 Resolution

RN2 Resolution

LN1 Linearity error Vdd = 2.5 to 5.5V Ta=25

LN2 Linearity error VDD= 2.5 to 5.5V Ta=25

DNL Differential nonlinear error Vdd = 2.5 to 5.5V Ta=25

FSE1 Full scale error Vdd=V

Vdd=V

AREF

=5.0V, V

ASS

=0.0V

(V reference from Vdd)

Vdd=V

AREF

=5.0V, V

ASS

=0.0V

(V reference from VREF)

Vdd=5.0V, OP used
Output voltage swing 0.2V to 4.8V

VREFS=0, Internal VDD
VDD=5.0V, VSS = 0.0V

VREFS=1, External VREF
VDD=VREF=5.0V, VSS = 0.0V

°

C

0 ±4 ±8 LSB

°

C

0 ±2 ±4 LSB

°

C

0 ±0.5 ±0.9 LSB

AREF

=5.0V, V

=0.0V ±0 ±4 ±8 LSB

ASS

FSE2 Full scale error VDD=VREF=5.0V, VSS = 0.0V ±0 ±2 ±4 LSB

OE Offset error Vdd=V

ZAI

Recommended impedance of
analog voltage source

TAD ADC clock period Vdd=V

TCN AD conversion time Vdd=V

ADIV ADC OP input voltage range Vdd=V

ADOV ADC OP output voltage swing

Vdd=V
=0.0V,RL=10KΩ

ADSR ADC OP slew rate Vdd=V

AREF

AREF

AREF

AREF

AREF

AREF

=5.0V, V

=0.0V ±0 ±2 ±4 LSB

ASS

– 0 8 10 KΩ

=5.0V, V

=5.0V, V

=5.0V, V

=5.0V, V

=5.0V, V

=0.0V 4 – – μs

ASS

=0.0V 15 – 15 TAD

ASS

=0.0V 0 – V

ASS

ASS

=0.0V 0.1 0.3 – V/us

ASS

TAD A/D clock period VDD=VREF=5.0V, VSS = 0.0V 4 − − µs

TCN A/D conversion time VDD=VREF=5.0V, VSS = 0.0V 15 − 15 TAD

PSR Power Supply Rejection Vdd=5.0V±0.5V ±0 – ±2 LSB

Note: 1. These parameters are hypothetical, have not been tested and are provided for design reference only.

2. There is no current consumption when ADC is off other than minor leakage current.

3. AD conversion result will not decrease when an increase of input voltage and no missing code will result.

2.5 – Vdd V

Vss – Vss V

– V

ASS

V

AREF

–10 0 +10 uA

200 250 300 uA

450 550 650 uA

− 9 10 Bits

− 11 12 Bits

V

AREF

0 0.2 0.3

4.7 4.8 5

V

74 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

8.2 Comparator (OP) Characteristics

Vdd = 5.0V, Vss=0V, Ta=25°C

Symbol Parameter Condition Min. Typ. Max. Unit

SR Slew rate - 0.1 0.2 - V/us

Vos Input offset voltage - - - 30 mV

IVR Input voltage range Vdd =5.0V, VSS =0.0V 0 5 V

OVS Output voltage swing

Iop Supply current of OP - 250 350 500 uA

Ico

PSRR

Vs Operating range - 2.5 - 5.5 V

Note: These parameters are hypothetical (not tested) and are provided for design reference only.

Supply current of
Comparator

Power-supply Rejection
Ration for OP

Vd =5.0V, V
RL=10KΩ

Vdd= 5.0V,

=0.0V

V

SS

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

=0.0V,

SS

- - 300 - uA

0 0.2 0.3

4.7 4.8 5

50 60 70 dB

V

8.3 Device Characteristics

The graphs below were derived based on a limited number of samples and they are

provided for reference only. Hence, the device characteristic shown herein cannot be

guaranteed as fully accurate. In these graphs, the data maybe out of the specified

operating warranted range.

9

8

7

6

5

4

3

Frequency (M Hz)

2

1

0

-40-200 25507085

Fig. 8-1 Internal RC OSC Frequency vs. Temperature, VDD=3V

IRC OSC Frequency (VDD=3V)

Temperature (℃)

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 75

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

I RC OSC Frequency (VDD=5V )

10

9

8

7

6

5

4

3

Frequency ( M Hz)

2

1

0

-40-20 0 25507085

Fig. 8-2 Internal RC OSC Frequency vs. Temperature, VDD=5V

T emper at ur e ( ℃ )

9 AC Electrical Characteristic

Ta=25°C, VDD=5V±5%, VSS=0V

Symbol Parameter Conditions Min Typ Max Unit

Dclk Input CLK duty cycle

Tins

Instruction cycle time
(CLKS="0")

Ttcc TCC input period

Tdrh Device reset hold time

Trst /RESET pulse width

Twdt Watchdog timer period

Tset Input pin setup time

Thold Input pin hold time

Tdelay Output pin delay time

Tdrc ERC delay time

Note: 1. N = selected prescaler ratio

2. Twdt1: The Option Word1 (WDTPS) is used to define the oscillator set-up time. WDT timeout length is

the same as set-up time (18ms).

3. Twdt2: The Option Word1 (WDTPS) is used to define the oscillator set-up time. WDT timeout length is

the same as set-up time (4.5ms).

4. These parameters are hypothetical (not tested) and are provided for design reference only.

5. Data under minimum, typical, & maximum (Min, Typ, & Max) columns are based on hypothetical results at 25

These data are for design reference use only.

6. The Watchdog timer duration is determined by Code Option Word1 (WDTPS).

45 50 55 %

Crystal type 100 DC ns

RC type 500 DC ns

(Tins+20)/N* ns

Ta = 25°C 11.3 16.2 21.6 ms

Ta = 25°C 2000 ns

Ta = 25°C 11.3 16.2 21.6 ms

0 ns

15 20 25 ns

Cload=20pF 45 50 55 ns

Ta = 25°C 1 3 5 ns

°

C.

76 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

10 Timing Diagrams

AC Test Input/Output Waveform

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

VDD-0.5V

GND+0.5V

AC Testing : Input is driven at VDD-0.5V for logic "1",and GND+0.5V for logic "0".Timing

measurements are made at 0.75VDD for logic "1",and 0.25VDD for logic "0".

0.75VDD

0.25VDD

TEST POINTS

0.75VDD

0.25VDD

RESET Timing (CLK="0")

NOP

CLK

/RESET

Tdrh

Instruction 1

Executed

TCC Input Timing (CLKS="0")

Tins

CLK

TCC

Ttcc

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 77

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

APPENDIX

A Package Type

OTP MCU Package Type Pin Count Package Size

EM78P259NPS/NPJ DIP 18 300mil

EM78P259NMS/NMJ SOP 18 300mil

EM78P260NPS/NPJ DIP 20 300mil

EM78P260NMS/NMJ SOP 20 300mil

EM78P260NKMS/NKMJ SSOP 20 209mil

B Package Information

B.1 18-Lead Plastic Dual in line (PDIP) — 300 mil

Min Normal Max

Symbal

A

A1

0.381

A2

3.175 3. 302 3. 429

c

0.203 0.254 0.356

D

22.610 22.860 23.110

E1

6.220 6. 438 6. 655

E

7.370 7. 620 7. 870

eB

8.510 9. 020 9. 530

B

0.356 0.457 0.559

B1

eB

θ

1.143 1.524 1.778

L

3.048

e

θ

TITL E:
PDI P-18L 300M IL PA CKA GE
OUTLINE DIMENSION

File :
D18

2.540(TYP)

015

4.450

3.302 3.556

Edtion: A
Unit : mm

Scale: Free
Material:
Sheet:1 of 1

78 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

8-Bit Microprocessor with OTP ROM

B.2 18-Lead Plastic Small Outline (SOP) — 300 mil

EM78P259N/260N

be

Symbal

c

Min Normal Max

A

2.350 2.650

A1

0.102 0.300

b
c
E
H
D
L
e

θ

0.406(TYP)

0.230 0.320

7.400 7.600

10.000 10. 650

11.350 11. 750

0.406 0.838 1. 270

1.27(TYP)

08

TITLE:
SOP-18L(300MIL) PACKAGE
OUTLINE DIMENSION

File :
SO18

Edtion: A
Unit : mm

Scale: Free
Material:
Sheet:1 of 1

Product Specification (V1.2) 05.18.2007

• 79

(This specification is subject to change without further notice)

EM78P259N/260N

048

8-Bit Microprocessor with OTP ROM

B.3 20-Lead Plastic Shrink Small Outline (SSOP) — 209 mil

Symbal

E

E1

be

c

A2

L1

Min Normal Max

A

A1

0.050 0. 250

A2

1.620 1. 750 1.880

b

0.220 0. 380

0.090

c

E

7.400 7. 800 8.200

E1

5.000 5. 300 5.600

D

6.900 7. 200 7.500

L

0.650 0. 750 0.850

L1

e

θ

1.250(REF )

0.650(TYP)

TITLE:
SSOP-20L(209MIL) OUTLINE
PACKAGE PACKA OUTLINE
DIMENSION

File :
SSOP20

Edtion: A
Unit : mm

Scale: Free
Material:
Sheet:1 of 1

2.130

0.200

80 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

8-Bit Microprocessor with OTP ROM

5

B.4 20-Lead Plastic Dual-in-line (PDIP) — 3 0 0 mil

E

A2

A1

EM78P259N/260N

Min Normal Max

Symbal

A

A1

0.381

A2

3.175 3. 302 3. 429

0.203 0.254 0.356

c

D

25.883 26.060 26.237

E1

6.220 6. 438 6. 655

E

7.370 7. 620 7. 870

eB

8.510 9. 020 9. 530

0.356 0.457 0.559

B

1.143 1.524 1.778

B1

L

3.048

e

θ

2.540(TYP)

01

4.450

3.302 3.556

TITLE:
PDIP-20L 300MIL PACKAGE
OUTLINE DIMENSION

File :
D20

Edtion: A
Unit : mm

Scale: Free
Material:
Sheet:1 of 1

Product Specification (V1.2) 05.18.2007

• 81

(This specification is subject to change without further notice)

EM78P259N/260N

0

8

8-Bit Microprocessor with OTP ROM

B.5 20-Lead Plastic Small Outline (SOP) — 300 mil

Symbal

be

c

Min Normal Max

A

2.350 2. 650

A1

0.102 0. 300

b
c
E
H
D
L
e

θ

0.406(TYP)

0.230 0. 320

7.400 7. 600

10.000 10. 650

12.600 12. 900

0.630 0. 838 1.100

1.27(TYP)

TITLE:
SOP-20L(300MIL) PACKAGE

OUTLINE DIMENSION
File :
SO20

Edtion: A
Unit : mm

Scale: Free
Material:
Sheet:1 of 1

82 •

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

EM78P259N/260N

8-Bit Microprocessor with OTP ROM

C Quality Assurance and Reliability

Test Category Test Conditions Remarks

Solderability

Pre-condition

Temperature cycle test -65℃ (15mins)~150°C (15mins), 200 cycles

Pressure cooker test

High temperature /
High humidity test

High-temperature
storage life

High-temperature
operating life

Latch-up TA=25°C, VCC=Max. operating voltage, 150mA/20V

ESD (HBM) TA=25°C, ≥∣± 3KV∣

ESD (MM) TA=25℃, ≥∣± 300V∣

Solder temperature=245±5°C, for 5 seconds up to the
stopper using a rosin-type flux

Step 1: TCT, 65°C (15mins)~150°C (15mins), 10 cycles

Step 2: Bake at 125°C, TD (durance)=24 hrs

Step 3: Soak at 30°C/60%，TD (durance)=192 hrs

Step 4: IR flow 3 cycles

(Pkg thickness ≥ 2.5mm or
Pkg volume ≥ 350mm3 ----225±5°C)

(Pkg thickness ≤ 2.5mm or
Pkg volume ≤ 350mm3 ----240±5°C )

TA =121°C, RH=100%, pressure=2 atm,
TD (durance)= 96 hrs

TA=85°C , RH=85%，TD (durance)=168 , 500 hrs

TA=150°C, TD (durance)=500, 1000 hrs

TA=125°C, VCC=Max. operating voltage,
TD (durance) =168, 500, 1000 hrs

For SMD IC (such as
SOP, QFP, SOJ, etc)

IP_ND,OP_ND,IO_ND

IP_NS,OP_NS,IO_NS

IP_PD,OP_PD,IO_PD,

IP_PS,OP_PS,IO_PS,

VDD-VSS(+),VDD_VSS
(-)mode

C.1 Address Trap Detect

An address trap detect is one of the MCU embedded fail-safe functions that detects

MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an

instruction from a certain section of ROM, an internal recovery circuit is auto started. If

a noise caused address error is detected, the MCU will repeat execution of the program

until the noise is eliminated. The MCU will then continue to execute the next program.

Product Specification (V1.2) 05.18.2007

(This specification is subject to change without further notice)

• 83