IBM EM78P221/2N Specification

Download

EM78P221/2N

8-Bit Microcontroller

with OTP ROM

Product

Specification

DOC. VERSION 1.0

ELAN

MICROELECTRONICS CORP.

October 2007

T rademark Acknowledgments:

IBM is a registered trademark and PS/2 is a trademark of IBM. Windows is a trademark of Microsoft Corporation.

ELAN and ELAN logo are trademarks of ELAN Microelectronics Corporation.

Printed in Taiwan

The contents of this specification are subject to change without further notice. ELAN Microelectronics assumes no responsibility concerning the accuracy, adequacy, or completeness of this specification. ELAN Microelectronics makes no commitment to update, or to keep current the information and material contained in this specification. Such information and material may change to conform to each confirme d order.

In no event shall ELAN Microelectronics be made responsible for any claims attributed to errors, omissions, or other inaccuracies in the informati on or material containe d in this specifica tion. ELAN Microel ectronics shall not be liable for direct, indirect, special incidental, or cons equentia l damages ari sing fr om the use of such in formati on or material.

The software (if any) described in this specification is furnished under a license or nondisclosure agreement, and may be used or copied only in accordance with the terms of such agreement.

ELAN Microelectronics products are not intended for use in life support appliances, devices, or systems. Use of ELAN Microelectronics product in such applications is not supported and is prohibited . NO PART OF THIS SPECIFICATION MAY BE REPRODUCED OR TRANSMITTED IN ANY FORM OR BY ANY MEANS WITHOUT THE EXPRESSED WRITTEN PERMISSION OF ELAN MICROELECTRONICS.

ELAN MICROELECTRONICS CORPORATION

Headquarters:

No. 12, Innovation Road 1 Hsinchu Science Park Hsinchu, TAIWAN 308 Tel: +886 3 563-9977 Fax: +886 3 563-9966

http://www.emc.com.tw

Hong Kong: Elan (HK) Microelectronics

Corporation, Ltd.

Flat A, 19F., World Tech Centre 95 How Ming Street, Kwun Tong Kowloon, HONG KONG Tel: +852 2723-3376 Fax: +852 2723-7780

elanhk@emc.com.hk

USA: Elan Information

Technology Group (U.S.A.)

P.O. Box 601 Cupertino, CA 95015 U.S.A. Tel: +1 408 366-8225 Fax: +1 408 366-8225

Shenzhen: Elan Microelectronics

Shenzhen, Ltd.

3F, SSMEC Bldg., Gaoxin S. Ave. I Shenzhen Hi-tech Industrial Park (South Area), Shenzhen CHINA 518057 Tel: +86 755 2601-0565 Fax: +86 755 2601-0500

Shanghai: Elan Microelectronics

Shanghai, Ltd.

#23, Zone 115, Lane 572, Bibo Rd. Zhangjiang Hi-Tech Park Shanghai, CHINA 201203 Tel: +86 21 5080-3866 Fax: +86 21 5080-4600

Contents

Product Specification (V1.0) 10.19.2007 • iii

(This specification is subject to change without further notice)

Contents

EM78P221/2N-V Package version.................................................................................... 1

EM78P221/2N-U Package version ................................................................................... 1

1 General Description.................................................................................................. 2

2 Features ..................................................................................................................... 2

3 Pin Assignment......................................................................................................... 3

4 Pin Description.......................................................................................................... 4

4.1 EM78P222N ....................................................................................................... 4

4.2 EM78P221N ....................................................................................................... 5

5 Block Diagram........................................................................................................... 6

6 Function Description ................................................................................................ 7

6.1 Register Configuration........................................................................................ 7

6.2 Registers Description ......................................................................................... 8

6.2.1 A (Accumulator)...................................................................................................8

6.2.2 CONT (Control Register).....................................................................................8

6.2.3 R0 (Indirect Addressing Register) ......................................................................9

6.2.4 R1 (Memory Switch Register) .............................................................................9

6.2.5 R2 (Program Counter and Stack)........................................................................9

6.2.6 R3 (Status Register)..........................................................................................10

6.2.7 R4 (Select Indirect Address) ............................................................................. 11

6.2.8 Bank 0-R5 (Port 5) ............................................................................................11

6.2.9 Bank 0-R6 (Port 6) ............................................................................................11

6.2.10 Bank 0-R7 (Port 7) ............................................................................................11

6.2.11 Bank 0-R8 (Port 8) ............................................................................................11

6.2.12 Bank 0-R9~RD (Reserve) .................................................................................11

6.2.13 Bank 0-RE (WUCR: Wake-up Control Register)...............................................12

6.2.14 Bank 0-RF (Interrupt Status Register)...............................................................12

6.2.15 Bank 1-R5 ~R7 (I/O Port Control Register).......................................................13

6.2.16 Bank 1-R8 (I/O Port Control Register) ..............................................................13

6.2.17 Bank 1-R9 (Reserve).........................................................................................14

6.2.18 Bank 1-RA (CMPCON: Comparator Control Register) .....................................14

6.2.19 Bank 1-RB (Pull-down Control Register)...........................................................15

6.2.20 Bank 1-RC (Open-Drain Control Register) .......................................................15

6.2.21 Bank 1-RD (Pull-high Control Register) ............................................................16

6.2.22 Bank 1-RE (WDT Control Register) ..................................................................16

6.2.23 Bank 1-RF (Interrupt Mask Register) ................................................................17

6.2.24 Bank 2-R5 (HDCR: High Drive Control Register for Port 6)..............................18

6.2.25 Bank 2-R6 (HSCR1: High Sink Control Register for Port 5) .............................18

6.2.26 Bank 2-R7 (HSCR2: High Sink Control Register for Port 6) .............................19

Contents

iv •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.2.27 Bank 2-R8 (Operating Mode Control Register).................................................19

6.2.28 Bank 2-R9~RF (Reserve)..................................................................................19

6.2.29 Bank 3-R5 (Timer Clock/Counter).....................................................................19

6.2.30 Bank 3-R6 (IRC Control)-only for ICE ...............................................................20

6.2.31 Bank 3-R7 (Noise and LVR Control) - only for ICE...........................................21

6.2.32 Bank 3-R8~RF (Reserve)..................................................................................21

6.2.33 R10 ~ R1F .........................................................................................................21

6.2.34 Banks 0~3 - R20 ~ R3F ....................................................................................21

6.3 TCC/WDT and Prescaler.................................................................................. 22

6.4 I/O Ports ........................................................................................................... 23

6.4.1 Usage of Port 6 Input Change Wake-up/Interrupt Function..............................25

6.5 Reset and Wake-up.......................................................................................... 26

6.5.1 Reset and Wake-up Operation..........................................................................26

6.5.1.1 Wake-up and Interrupt Modes Operation Summary ..........................28

6.5.1.2 Register Initial Values after Reset ......................................................30

6.5.1.3 Controller Reset Block Diagram........................................................34

6.5.2 The T and P Status under Status Register........................................................35

6.6 Interrupt ............................................................................................................ 36

6.7 Comparator ...................................................................................................... 38

6.7.1 External Reference Signal ................................................................................38

6.7.2 Comparator Outputs..........................................................................................38

6.7.3 Using a Comparator as an Operation Amplifier.................................................39

6.7.3.1 Bank 0-RE (WUCR: Wake-up Control Register)................................39

6.7.3.2 Bank 1-RA (CMPCON: Comparator Control Register) ......................40

6.7.3.3 Bank 1-RE (WDT Control Register) ...................................................40

6.7.4 Comparator Interrupt.........................................................................................40

6.7.5 Wake-up from Sleep Mode................................................................................40

6.8 Oscillator .......................................................................................................... 41

6.8.1 Oscillator Modes................................................................................................41

6.8.2 Crystal Oscillator/Ceramic Resonators (Crystal)...............................................41

6.8.3 External RC Oscillator Mode .............................................................................44

6.8.4 Internal RC Oscillator Mode ..............................................................................45

6.9 Power-on Considerations ................................................................................. 45

6.9.1 External Power-on Reset Circuit .......................................................................45

6.9.2 Residual Voltage Protection ..............................................................................46

6.10 Low Voltage Reset ........................................................................................... 46

6.11 Code Option ..................................................................................................... 47

6.11.1 Code Option Register (Word 0).........................................................................47

6.11.2 Code Option Register (Word 1).........................................................................49

6.11.3 Customer ID Register (Word 2).........................................................................50

6.12 Instruction Set .................................................................................................. 50

Contents

Product Specification (V1.0) 10.19.2007 • v

(This specification is subject to change without further notice)

7 Absolute Maximum Ratings................................................................................... 53

8 DC Electrical Characteristics................................................................................. 53

8.1 Comparator (OP) Characteristic....................................................................... 55

9 AC Electrical Characteristic................................................................................... 55

10 Timing Diagrams..................................................................................................... 56

APPENDIX

A Package Type........................................................................................................... 57

B Packaging Configuration........................................................................................ 58

B.1 24-Lead Plastic Skinny Dual in line (SDIP) — 300 mil ..................................... 58

B.2 24-Lead Plastic Small Outline (SOP) — 300 mil .............................................. 59

B.3 24-Lead Plastic Shrink Small Outline (SSOP) — 209 mil ................................ 60

B.4 28- Lead Plastic Skinny Dual in line (SDIP) — 300 mil .................................... 61

B.5 28-Lead Plastic Small Outline (SOP) — 300 mil .............................................. 62

B.6 28- Lead Plastic Shrink Small Outline (SSOP) — 209 mil ............................... 63

C Quality Assurance and Reliability ........................................................................ 64

C.1 Address Trap Detect......................................................................................... 64

Contents

vi •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

Specification Revision History

Doc. Version Revision Description Date

0.9 Preliminary version 2007/03/20

1.0 Initial released version 2007/10/19

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 1

(This specification is subject to change without further notice)

Read Me First !

Comparison between V-Package and U-Package version

This series of microcontrollers comprise of the older V-package version and the newer

U-package version. In the newer U-package version, a Code Option NRM is added

and various features such as Crystal mode Operating frequency range, IRC mode

wake-up time, WDT Time-out time, Comparator function and Pins function have been

modified to favorably meet users’ requirements. The following table is provided for

quick comparison between the two package version and for user convenience in the

choice of the most suitable product for their application.

EM78P221/222N-V EM78P221/222N-U

Crystal mode Operating

frequency range at 0°C~ 70°C

DC ~ 12MHz, 4.0V

DC ~ 8MHz, 3.0V

DC ~ 4MHz, 2.1V

DC ~ 16MHz, 4.5V

DC ~ 8MHz, 3.0V

DC ~ 4MHz, 2.1V

IRC mode wake-up time

Sleep mode → Normal mode

Condition: 5V, 4MHz

64μs 10μs

P52, P53 Function Output only Input / Output

Comparator Function Comparator only Comparator / OPA

WDT Time-out time

(Prescaler = 1 : 1)

Condition: VDD = 5V

16.5 ms ± 30 % 15.2 ms ± 30 %

Code Option

Added a Code Option NRM

EM78P221/2N-V Package version EM78P221/2N-U Package version

EM78P221/2N

8-Bit Microcontroller with OTP ROM

2 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

1 General Description

EM78P221N and EM78P222N are 8-bit microprocessors designed and developed with low-power and high-speed CMOS technology. Each device in the series has as an on-chip 4K×13-bit Electrical One Time Programmable Read Only Memory (OTP-ROM). Each provides a protection bit to prevent intrusion of user’s OTP memory code. Two Code option bits are also available to meet user’s requirements.

With its enhanced OTP-ROM features, each device provides a convenient way of developing and verifying user’s programs. Moreover, this OTP devices offer the advantages of easy and effective program updates, using development and programming tools. User can avail of the ELAN Writer to easily program his development code.

2 Features

 CPU configuration

• 4K×13 bits on-chip OTP-ROM

• 144×8 bits on-chip registers (SRAM)

• 8-level stacks for subroutine nesting

• 3 programmable Level Voltage Reset

(LVR) : 4.0V, 3.0V, 2.5V

• Less than 1.5 mA at 5V/4MHz

• Typically 15 μA, at 3V/32kHz

• Typically 2 μA, during sleep mode

 I/O port configuration

• 4 bidirectional I/O ports: P5, P6, P7 and P8

• Wake-up port : P6

• 26 I/O pins

• 8 programmable pull-down I/O pins

• 8 programmable pull-high I/O pins

• 8 programmable open-drain I/O pins

• 16 Programmable high sink current I/O pins

• 8 Programmable high drive current I/O pins

• External interrupt : P77, P71

 Operating voltage range:

• OTP version:

Operating voltage range: 2.1V~5.5V (commercial)

Operating voltage range: 2.3V~5.5V (industrial)

 Operating temperature range:

Operating temperature range: 0°C~70°C

(commercial)

Operating temperature range: -40°C~85°C

(industrial)

 Operating frequency range

• Crystal mode:

DC~16MHz/2 clks @ 4.5V; DC~125ns inst. cycle @ 4.5V

DC ~ 8MHz/2 clks @ 3V; DC~250ns inst. Cycle @ 3V

• ERC mode:

DC ~ 16MHz/2 clks @ 4.5V; DC~125ns inst. cycle @ 5V

DC ~ 8MHz/2 clks @ 3V; DC ~ 250ns inst. Cycle @ 3V

• IRC mode:

Oscillation mode: 16MHz, 4 MHz, 1 MHz, 455kHz

Process deviation: Typ ± 3%, Max. ± 5%

Temperature deviation: ± 5% (-40°C~85°C)

Drift Rate

Internal RC

Frequency

Temperature

(-40°C+85°C)

Voltage

(2.1V~5.5V)

Process Total

4MHz ±5% ±5% ±4% ±14%

16MHz ±5% ±5% ±4% ±14%

1MHz ±5% ±5% ±4% ±14%

455kHz ±5% ±5% ±4% ±14%

All these four main frequencies can be trimmed by

programming with four calibrated bits in the ICE220N

Simulator. OTP is auto trimmed by ELAN Writer

(DWTR).

 Fast set-up time requires only 800μs (VDD:5V,

Crystal: 4MHz, C1/C2: 30pF) in HXT2 mode and 10μs in IRC mode (VDD:5V IRC:4MHz)

 Peripheral configuration

• 8-bit real time clock/counter (TCC) with selective signal sources, trigger edges, and overflow interrupt

• One comparator (can act as an OP). (offset voltage is smaller than 10mV)

 Five available interrupts

• TCC overflow interrupt

• Input-port status changed interrupt (wake up from

sleep mode)

• Two External interrupts

• Comparator high/low interrupt

 Special Features

• Programmable free running Watchdog Timer

• Two clocks per instruction cycle

• Power-on voltage detector available (1.8 V± 0.1V)

• High EFT immunity (better performance at 4MHz or

below

• Power saving Sleep mode

• Selectable Oscillation mode

• Package Type:

• 24-pin skinny DIP 300mil : EM78P221NKJ/NKS

• 24 pin SOP 300mil : EM78P221NMJ/NMS

• 24 pin SSOP 209mil : EM78P221NAMJ/NAMS

• 28-pin skinny DIP 300mil : EM78P222NKJ/NKS

• 28 pin SOP 300mil : EM78P222NMJ/NMS

• 28 pin SSOP 209mil : EM78P222NAMJ/NAMS

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 3

(This specification is subject to change without further notice)

3 Pin Assignment

(1) 28-Pin DIP/SOP/SSOP

P70

VSS

P67

P57

P56/TCC

P53/OSCI

P52/OSCOVDD

P81//RESET

P72/CIN+ P73/CIN-

P71/CO/INT1

P64

P65

P66

P55

P54

P50

P77/INT0

EM78P222N

P61 P62

P63

P60

P51

P74 P75

P80

P76

Fig. 3-1 EM78P222NK/AK/M/AM

(2) 24-Pin DIP/SOP/SSOP

P70

VSS

P67

P57

P56/TCC

P53/OSCI P52/OSCOVDD

P81//RESET

P72/CIN+

P73/CIN-

P71/CO/INT1

P64

P65

P66

P55

P54

P50

P77/INT0

EM78P221N

P61

P62 P63

P60

P51

Fig. 3-2 EM78P221NK/M/AM

EM78P221/2N

8-Bit Microcontroller with OTP ROM

4 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

4 Pin Description

4.1 EM78P222N

Symbol Pin No. Type Function

P50~P57

1~2 11~12 17~18 26~27

I/O

8-bit General purpose input/output pins Default value at power-on reset

P60~P67

6 ~ 10

19 ~21

I/O

8-bit General purpose input/output pins Default value at power-on reset

P70~ P77

14 ~ 16

22~25

I/O

8-bit General purpose input/output pins Default value at power-on reset.

P72 and P73 are open drain pins when used as output pins in ICE220N simulator.

P80, P81

13, 28 I/O

2-bit General purpose input or output pin Default value at power-on reset

P81 is define as General purpose input or output open-drain pin.

CINCIN+ CO

22 23 24

I I

“-“ : input pin of Vin- of the comparator “+” : input pin of Vin+ of the comparator Pin CO is the comparator output Defined by CMPCON (Bank 1-RA) <3 : 4>

OSCI

27 I

Crystal type: Crystal input terminal RC type: RC oscillator input pin

OSCO

26 O

Crystal type: Output terminal for crystal oscillator. RC type: Clock output with a duration of one instruction cycle

time.

External clock signal input.

/RESET

28 I

If it remains at a logic low, the device will be reset Wake-up from sleep mode when pin status changes Voltage on /RESET must not exceed Vdd during normal mode

INT0~INT1

5, 24 I

External interrupt pin

VDD

3 -

Power supply

VSS

4 -

Ground

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 5

(This specification is subject to change without further notice)

4.2 EM78P221N

Symbol Pin No. Type Function

P50~P57

1~2 11~14 22~23

I/O

8-bit General purpose input/output pins Default value at power-on reset.

P60~P67

6 ~ 10 15~17

I/O

8-bit General purpose input/output pins Default value at power-on reset

P70~P73 P77

21 ~ 18

I/O

5-bit General purpose input/output pins Default value at power-on reset

P72 and P73 are open drain pins when used as output pins of the ICE220N simulator.

P81

24 I/O

1-bit General purpose input or output open-drain pin Default value at power-on reset

CINCIN+ CO

18 19 20

I I

“-“ : input pin of Vin- of the comparator “+” : input pin of Vin+ of the comparator Pin CO is the comparator output Defined by CMPCON (Bank 1-RA) <3 : 4>

OSCI

23 I

Crystal type: Crystal input terminal RC type: RC oscillator input pin

OSCO

22 O

Crystal type: Output terminal for crystal oscillator RC type: Clock output with a duration of one instruction cycle

time.

External clock signal input.

/RESET

24 I

If it remains at logic low, the device will be reset Wake-up from sleep mode when pin status changes Voltage on /RESET must not exceed Vdd during normal mode

INT0~INT1

5, 20 I

External interrupt pin

VDD

3 -

Power supply

VSS

4 -

Ground

EM78P221/2N

8-Bit Microcontroller with OTP ROM

6 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

5 Block Diagram

ROM

R3 (Status

Reg.)

ACC

Instruction

Decoder

Instruction

ALU

Interrupt

Circuit

8-level stack

(13 bit)

Interrupt

Control

Oscillation

Generation

RAM

Mux

Ext.

OSC.

Ext.

Int. RC

Comparator

LVR

Cin+ Cin- CO

P50

P57

P56

P55

P54

P53

P52

P51

Ext INT

Reset

P60

P67

P66

P65

P64

P63

P62

P61

P70

P74

P73

P72

P71

P81

WDT

TCC

Port

change

TCC

Port 6

P77

P75 P76

P80

Fig. 5-1 EM78P221/2N Functional Block Diagram

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 7

(This specification is subject to change without further notice)

6 Function Description

6.1 Register Configuration

Address Bank 0 Registers Bank 1 Registers Bank 2 Registers Bank 3 Registers

00 R0 (Indirect Addressing Register) 01 R1 (Memory switch register) 02 R2 (Program Counter) 03 R3 (Status Register) 04 R4 (Select Indirect Address)

05 R5 (Port 5)

R5 (I/O Port Control Register)

R5 (High Drive Control

R5 (Timer Clock /

Counter)

06 R6 (Port 6)

R6 (I/O Port Control Register)

R6 (High Sink Control

Reserve*

07 R7 (Port 7)

R7 (I/O Port Control

R7 (High Sink Control

Reserve*

08 R8 (Port 8)

R8 (I/O Port Control

Reserve Reserve

09 Reserve Reserve Reserve Reserve

0A Reserve

RA (Comparator Control

Reserve Reserve

0B Reserve

RB (Pull-down Control

Reserve Reserve

0C Reserve

RC (Open-drain Control

Reserve Reserve

0D Reserve

RD (Pull-high Control

Reserve Reserve

RE (Wake-up Control

RE (WDT Control

Reserve Reserve

RF (Interrupt Status

RF (Interrupt Mask

Reserve Reserve

General Registers (16×8 bits)

General Registers

(32×8 bits)

General Registers

(32×8 bits)

General Registers

(32×8 bits)

General Registers

(32×8 bits)

Note: 1. All registers are 8 bits.

2. When using ICE, some registers code options are set. Refer to Section 6.2 for detailed Registers Description.

3. Registers with * can only be used in ICE220N simulator.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

8 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.2 Registers Description

6.2.1 A (Accumulator)

Internal data transfer operation, or instruction operand holding usually involves the

temporary storage function of the Accumulator. The Accumulator is not an

addressable register.

6.2.2 CONT (Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

INTE INT TS TE PSTE PST2 PST1 PST0

Bit 7 (INTE): INT signal edge 0 = interrupt occurs at the rising edge on the INT0 and INT1 pin 1 = interrupt occurs at the falling edge on the INT0 and INT1 pin

Bit 6 (INT): Interrupt enable flag 0 = masked by DISI or hardware interrupt 1 = enabled by the ENI/RETI instructions

This bit is readable only. Bit 5 (TS): TCC signal source

0 = internal instruction cycle clock. If P56 is used as I/O pin, TS must be 0. 1 = transition on the TCC pin

Bit 4 (TE): TCC signal edge 0 = increment if the transition from low to high takes place on the TCC pin 1 = increment if the transition from high to low takes place on the TCC pin.

Bit 3 (PSTE): Prescaler enable bit for TCC 0 = prescaler disable bit. TCC rate is 1:1 1 = prescaler enable bit. TCC rate is set as Bit 2 ~ Bit 0.

Bit 2 ~ Bit 0 (PST2 ~ PST0): TCC prescaler bits

PST2 PST1 PST0 TCC Rate

0 0 0 1:2 0 0 1 1:4 0 1 0 1:8 0 1 1 1:16 1 0 0 1:32 1 0 1 1:64 1 1 0 1:128 1 1 1 1:256

Note: Tcc time-out period [1/Fosc x prescaler x (256 -Tcc cnt) x 1] Fosc: Oscillator (Crystal, ERC, IRC) frequency

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 9

(This specification is subject to change without further notice)

6.2.3 R0 (Indirect Addressing Register)

R0 is not a physically implemented register. Its major function is to perform as an

indirect address pointer. Any instruction using R0 as a pointer, actually accesses the

data pointed by the RAM Select Register (R4).

6.2.4 R1 (Memory Switch Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

“0” “0” “0” “0” “0” “0” BS1 BS0

Bits 7~2: not used bits, fixed to 0 all the time. Bits 1~0: used to select Banks 0 ~ 3 for R20~R3F and select Banks 0 ~ 3 for the

control register.

See the table under Section 6.2 Registers Description for the data memory

configuration.

6.2.5 R2 (Program Counter and Stack)

On-chip Program

Memory

000H

FFFH

008H

Interrupt Vector

User Memory Space

Reset Vector

A11 A10

Stack Level 1

Stack Level 3

Stack Level 2

Stack Level 4 Stack Level 5

CALL

00 PAGE0 0000~03FF

01 PAGE1 0400~07FF

10 PAGE2 0800~0BFF

11 PAGE3 0C00~0FFF

RET RETL

RETI

A9 ~ A0

Stack Level 6 Stack Level 7 Stack Level 8

R1(5,4)

Fig. 6-1 Program Counter Organization

R2 and hardware stacks are 12-bit wide. The structure is depicted in the table under

Section

6.1 Register Configuration.

Generates 4K×13 bits on-chip ROM addresses to the relative programming instruction

codes. One program page is 1024 words long.

The contents of R2 are all set to "0"s when a reset condition occurs.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

10 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

"JMP" instruction allows direct loading of the lower 10 program counter bits. Thus,

"JMP" allows PC to jump to any location within a Page (1K).

"CALL" instruction loads the lower 10 bits of the PC, and then PC+1 is pushed into the

stack. Thus, the subroutine entry address can be located anywhere within a page (1K).

"LJMP" instruction allows direct loading of the lower 11 program counter bits.

Therefore, "LJMP" allows PC to jump to any location within 2K (2

"LCALL" instruction loads the lower 11 bits of the PC, and then PC+1 are pushed onto

the stack. Thus, the subroutine entry address can be located anywhere within 2K (2

"RET" ("RETL k", "RETI") instruction loads the program counter with the contents of the

top of stack.

"ADD R2, A" allows a relative address to be added to the current PC, and the ninth and

above bits of the PC will increase progressively.

"MOV R2, A" allows loading of an address from the "A" register to the lower 8 bits of the

PC, and the ninth and above bits of the PC will remain unchanged.

Any instruction (except “ADD R2,A”) that is written to R2 (e.g., "MOV R2, A", "BC R2, 6"

etc.) will cause the ninth bit and above bits of the PC to remain unchanged.

All instructions are single instruction cycle (fclk/2) except “LCALL” and “LJMP”

instructions. The “LCALL” and “LJMP” instructions need two instructions cycle.

6.2.6 R3 (Status Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

- - - T P Z DC C

Bits 7~5: not used, fixed to 0 all the time. Bit 4 (T): Time-out bit. Set to 1 by the "SLEP" and "WDTC" commands or during

power on and reset to 0 by WDT time-out.

Bit 3 (P): Power-down bit. Set to 1 during power on or by a "WDTC" command

and reset to 0 by a "SLEP" command.

NOTE

Bit 4 & Bit 3 (T & P) are read only.

Bit 2 (Z): Zero flag. Set to "1" if the result of an arithmetic or logic operation is

zero.

Bit 1 (DC): Auxiliary carry flag Bit 0 (C): Carry flag

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 11

(This specification is subject to change without further notice)

6.2.7 R4 (Select Indirect Address)

Bits 7~6: not used, fixed to 0 all the time. Bit 5 ~ Bit 0: used to select registers (Address: 00 ~ 3F) in indirect addressing mode.

6.2.8 Bank 0-R5 (Port 5)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

P57 P56 P55 P54 P53 P52 P51 P50

Bits 7 ~ 0 (P57 ~ P50): I/O data bits

6.2.9 Bank 0-R6 (Port 6)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

P67 P66 P65 P64 P63 P62 P61 P60

Bits 7 ~ 0 (P67 ~ P60): I/O data bits

6.2.10 Bank 0-R7 (Port 7)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

P77 P76 P75 P74 P73 P72 P71 P70

Bits 7 ~ 0 (P77 ~ P70): I/O data bits [With Simulator]: P73 ~ P72 are input or open-drain output pins. [With EM78P221/2N]: P73 ~ P72 are general input or output pins.

6.2.11 Bank 0-R8 (Port 8)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0 0 NREN 0 0 0 P81 P80

Bits 7~6, 4~2, 0: not used, fixed to 0 all the time. Bit 5 (NREN): Noise rejection enable

0 = disable noise rejection (Default) 1 = enable noise rejection. However in crystal oscillator mode

(LXT2), the noise rejection circuit is always disabled.

Bits 1 ~0 (P81~P80): I/O data bit.

6.2.12 Bank 0-R9~RD (Reserve)

Bits 7~0: not used, fixed to "0" all the time.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

12 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.2.13 Bank 0-RE (WUCR: Wake-up Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

EX1IF 0 0 ICWE 0 CMPWE 0 CMPIF

Bit 7 (EX1IF): External interrupt flag. Set by INT1 pin, reset by software. 0 = no interrupt occurs 1 = with interrupt request

Bits 6~5, 3, 1: not used bits, fixed to 0 all the time Bit 4 (ICWE): Port 6 input change to wake-up status enable bit

0 = Disable Port 6 input change to wake-up status 1 = Enable Port 6 input change wake-up status

When the Port 6 Input Status Change is used to enter interrupt vector or

to wake-up EM78P221N//2N from sleep, the ICWE bit must be set to

“Enable“. Bit 2 (CMPWE): Comparator wake-up enable bit

0 = Disable Comparator wake-up 1 = Enable Comparator wake-up

When the Comparator output status change is used to enter interrupt

vector or to wake-up from sleep, the CMPWE bit must be set to

“Enable“.

Bit 0 (CMPIF): Comparator interrupt flag. Set when a change occurs in the output of

Comparator. Reset by software.

0 = no interrupt occurs 1 = with interrupt request

NOTE

■ Bank 0-RE <7, 0> can be cleared by instruction but cannot be set.

■ Bank1-RE <0> is an interrupt mask register.

■ Interrupt results from "logic AND" of Bank 0-RE <7, 0> and Bank 1-RE <0>, with

instruction “ENI”.

6.2.14 Bank 0-RF (Interrupt Status Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0 0 0 0 0 EX0IF ICIF TCIF

Bits 7~3: not used bits, fixed to 0 all the time Bit 2 (EX0IF): External interrupt flag. Set by INT0 pin. Reset by software.

0 = no interrupt occurs 1 = with interrupt request

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 13

(This specification is subject to change without further notice)

Bit 1 (ICIF): Port 6 input status change interrupt flag. Set when Port 6 input changes.

Reset by software.

0 = no interrupt occurs 1 = with interrupt request

Bit 0 (TCIF): TCC overflow interrupt flag. Set when TCC overflows. Reset by software.

0 = no interrupt occurs 1 = with interrupt request

NOTE

■ Bank 0-RF <2, 1, 0> can be cleared by instruction but cannot be set.

■ Bank1-RF <2, 1, 0> is an interrupt mask register.

■ Interrupt results from "logic AND" of Bank 0-RF <2, 1, 0> and Bank 1-RF <2, 1, 0>

with instruction “ENI”.

6.2.15 Bank 1-R5 ~R7 (I/O Port Control Register)

Bits 7~0: 0 = defines the relative I/O pin as output 1 = puts the relative I/O pin into high impedance Bank 1-R5, R6 and R7 registers are all readable and writable.

6.2.16 Bank 1-R8 (I/O Port Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0 0 0 0 0 0 C81 C80

Bits 7~2: not used, fixed to 0 all the time Bits 1~0 (C81~C80): 0 = defines the relative I/O pin as output 1 = puts the relative I/O pin into high impedance

With Simulator]: P80 and P81 are General I/O pins [With EM78P221/2N]: P80 is General input or output, but P81 is input or open-drain

output pin.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

14 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.2.17 Bank 1-R9 (Reserve)

Bits 7~0: not used, fixed to 0 all the time

6.2.18 Bank 1-RA (CMPCON: Comparator Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

EIS1 EIS0 CMPOUT CMPCOS1 CMPCOS0 0 0 0

Bit 7 (EIS1): Control bit used to define the function of the P71 (/INT1) pin

0 = P71, normal I/O pin 1 = /INT1, external interrupt pin. In this case, the I/O control bit of P71

(Bit 1 of Bank 1-R7) must be set to "1"

Bit 6 (EIS0): Control bit used to define the function of the P77 (/INT0) pin

0 = P77, normal I/O pin 1 = /INT0, external interrupt pin. In this case, the I/O control bit of P77

(Bit 7 of Bank 1-R7) must be set to "1"

NOTE

 When EIS is "0," the path of /INT is masked. When EIS is "1," the status of /INT

pin can also be read by way of reading Port 7 (Bank 0-R7). Refer to Fig. 6-4 (I/O Port and I/O Control Register Circuit for P77 (/INT0) and P71 (/INT1) under Section 6.4 (I/O Ports).

 EIS0 and EIS1 are both readable and writable.

 The highest priority of P71/INT1/CO2 is INT1. When EIS1=0, the working type

of P71/INT1/CO is determined by CMPCOS1 and CMPCOS0.

Bit 5 (CMPOUT): The result of the comparator output Bit 4 ~ Bit 3 (CMPCOS1 ~ CMPCOS0): Comparator Select bits

CMPCOS1 CMPCOS0 Function Description

0 0

Comparator is not used. P72, P73 and P71 are normal I/O pins

0 1

P72 and P73 are Comparator input pins and P71 is normal I/O pin

1 0

P72 and P73 are Comparator input pins and P71 is Comparator output pin (CO)

1 1 Used as OP and P71 is OP output pin (CO)

Bits 2~0: not used, fixed to 0 all the time

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 15

(This specification is subject to change without further notice)

6.2.19 Bank 1-RB (Pull-down Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

/PD7 /PD6 /PD5 /PD4 /PD3 /PD2 /PD1 /PD0

Bank 1-RB register is both readable and writable Bit 7 (/PD7): Control bit used to enable the pull-down function of the P67 pin

0 = Enable internal pull-down function 1 = Disable internal pull-down function

Bit 6 (/PD6): Control bit used to enable the pull-down function of the P66 pin. Bit 5 (/PD5): Control bit used to enable the pull-down function of the P65 pin. Bit 4 (/PD4): Control bit used to enable the pull-down function of the P64 pin. Bit 3 (/PD3): Control bit used to enable the pull-down function of the P63 pin. Bit 2 (/PD2): Control bit used to enable the pull-down function of the P62 pin. Bit 1 (/PD1): Control bit used to enable the pull-down function of the P61 pin. Bit 0 (/PD0): Control bit used to enable the pull-down function of the P60 pin.

6.2.20 Bank 1-RC (Open-Drain Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

/OD7 /OD6 /OD3 /OD2 /OD5 /OD4 /OD1 /OD0

Bank 1-RC register is both readable and writable. Bit 7 (OD7): Control bit used to enable the open-drain output of the P57 pin.

0 = Enable open-drain output

1 = Disable open-drain output

Bit 6 (OD6): Control bit used to enable the open-drain output of the P56 pin. Bit 5 (OD5): Control bit used to enable the open-drain output of the P55 pin. Bit 4 (OD4): Control bit used to enable the open-drain output of the P54 pin. Bit 3 (OD3): Control bit used to enable the open-drain output of the P53 pin. Bit 2 (OD2): Control bit used to enable the open-drain output of the P52 pin. Bit 1 (OD1): Control bit used to enable the open-drain output of the P51 pin. Bit 0 (OD0): Control bit used to enable the open-drain output of the P50 pin.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

16 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.2.21 Bank 1-RD (Pull-high Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

/PH7 /PH6 /PH5 /PH4 /PH3 /PH2 /PH1 /PH0

Bank 1-RD register is both readable and writable. Bit 7 (/PH7): Control bit used to enable the pull-high function of the P67 pin.

0 = Enable internal pull-high 1 = Disable internal pull-high

Bit 6 (/PH6): Control bit used to enable the pull-high function of the P66 pin. Bit 5 (/PH5): Control bit used to enable the pull-high function of the P65 pin. Bit 4 (/PH4): Control bit used to enable the pull-high function of the P64 pin. Bit 3 (/PH3): Control bit used to enable the pull-high function of the P53 pin. Bit 2 (/PH2): Control bit used to enable the pull-high function of the P52 pin. Bit 1 (/PH1): Control bit used to enable the pull-high function of the P51 pin. Bit 0 (/PH0): Control bit used to enable the pull-high function of the P50 pin.

6.2.22 Bank 1-RE (WDT Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

WDTE 0 PSWE PSW2 PSW1 PSW0 0 CMPIE

NOTE

 Bank 1-RE <0> register is both readable and writable

 Individual interrupt is enabled by setting its associated control bit in the

Bank 1-RF <0 > to "1."

 Global interrupt is enabled by the ENI instruction and is disabled by the DISI

instruction. Refer to Fig. 6-8 (Interrupt Input Circuit) under Section 6.6 (Interrupt).

Bit 7 (WDTE): Control bit is used to enable Watchdog Timer 0 = Disable WDT 1 = Enable WDT

WDTE is both readable and writable.

Bits 6, 1: not used, fixed to 0 all the time Bit 5 (PSWE): Prescaler enable bit for WDT

0 = prescaler disable bit. WDT rate is 1:1 1 = prescaler enable bit. WDT rate is set as Bit 4~Bit 2

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 17

(This specification is subject to change without further notice)

Bit 4 ~ Bit 2 (PSW2 ~ PSW0): WDT prescaler bits

PSW2 PSW1 PSW0 WDT Rate

0 0 0 1:2 0 0 1 1:4 0 1 0 1:8 0 1 1 1:16 1 0 0 1:32 1 0 1 1:64 1 1 0 1:128 1 1 1 1:256

Bit 0 (CMPIE): CMPIF interrupt enable bit

0 = Disable CMPIF interrupt 1 = Enable CMPIF interrupt

When the Comparator output status change is used to enter an

interrupt vector or to enter next instruction, the CMPIE bit must be set

to “Enable“. But actually the output of the comparator must be read to

latch the status first. Then the output of the comparator is compared

to this latch to produce the information of output status change.

6.2.23 Bank 1-RF (Interrupt Mask Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0 0 0 0 0 EXIE ICIE TCIE

NOTE

 RF register is both readable and writable.

 Individual interrupt is enabled by setting its associated control bit in the RF to "1."

 Global interrupt is enabled by the ENI instruction and is disabled by the DISI

instruction. Refer to Fig. 6-8 (Interrupt Input Circuit) under Section 6.6 (Interrupt).

Bits 7~3: not used bits, fixed to 0 all the time Bit 2 (EXIE): EX0IF and EX1IF interrupts enable bit

0 = Disable EX0IF and EX1IF interrupts 1 = Enable EX0IF and EX1IF interrupts

Bit 1 (ICIE): ICIF interrupt enable bit 0 = Disable ICIF interrupt 1 = Enable ICIF interrupt

If Port 6 Input Status Change Interrupt is used to enter an interrupt

vector or to enter next instruction, the ICIE bit must be set to “Enable“.

Bit 0 (TCIE): TCIF interrupt enable bit 0 = Disable TCIF interrupt 1 = Enable TCIF interrupt

EM78P221/2N

8-Bit Microcontroller with OTP ROM

18 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.2.24 Bank 2-R5 (HDCR: High Drive Control Register for Port 6)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

HD67 HD66 HD65 HD64 HD63 HD62 HD61 HD60

[With Simulator]: function nonexistent [With EM78P221/2N]: General I/O pins Bit 7 (HD67): Output High Drive Current Select for P67 Bit 6 (HD66): Output High Drive Current Select for P66 Bit 5 (HD65): Output High Drive Current Select for P65 Bit 4 (HD64): Output High Drive Current Select for P64 Bit 3 (HD63): Output High Drive Current Select for P63 Bit 2 (HD62): Output High Drive Current Select for P62 Bit 1 (HD61): Output High Drive Current Select for P61 Bit 0 (HD60): Output High Drive Current Select for P60

HDxx VDD = 5V, Drive Current

0 9mA (in 0.9VDD)

1 27mA (in 0.7VDD)

6.2.25 Bank 2-R6 (HSCR1: High Sink Control Register for Port 5)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

HS57 HS56 HS55 HS54 HS53 HS52 HS51 HS50

[With Simulator]: function nonexistent [With EM78P221/2N]: General I/O pins Bit 7 (HS57): Output High Sink Current Select for P57 Bit 6 (HS56): Output High Sink Current Select for P56 Bit 5 (HS55): Output High Sink Current Select for P55 Bit 4 (HS54): Output High Sink Current Select for P54 Bit 3 (HS53): Output High Sink Current Select for P53 Bit 2 (HS52): Output High Sink Current Select for P52 Bit 1 (HS51): Output High Sink Current Select for P51 Bit 0 (HS50): Output High Sink Current Select for P50

HDxx VDD = 5V, Sink Current

0 18mA (in 0.1VDD)

1 75mA (in 0.3VDD)

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 19

(This specification is subject to change without further notice)

6.2.26 Bank 2-R7 (HSCR2: High Sink Control Register for Port 6)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

HS67 HS66 HS65 HS64 HS63 HS62 HS61 HS60

[With Simulator]: function nonexistent [With EM78P221/2N]: General I/O pins. Bit 7 (HS67): Output High Sink Current Select for P67 Bit 6 (HS66): Output High Sink Current Select for P66 Bit 5 (HS65): Output High Sink Current Select for P65 Bit 4 (HS64): Output High Sink Current Select for P64 Bit 3 (HS63): Output High Sink Current Select for P63 Bit 2 (HS62): Output High Sink Current Select for P62 Bit 1 (HS61): Output High Sink Current Select for P61 Bit 0 (HS60): Output High Sink Current Select for P60

HDxx VDD = 5V, Sink Current

0 18 mA (in 0.1VDD)

1 75 mA (in 0.3VDD)

6.2.27 Bank 2-R8 (Operating Mode Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0 1 1 0 0 0 0 0

Bits 7, 4~0: not used, fixed to "0" all the time. Bits 6~5: not used, fixed to "1" all the time.

NOTE

■ If user wants the MCU to work normally, user must set Bit 6 and Bit 5 of the R8 register to “1” and clear Bit 4 of R8 register to “0”.

6.2.28 Bank 2-R9~RF (Reserve)

Bits 7~0: not used, fixed to "0" all the time

6.2.29 Bank 3-R5 (Timer Clock/Counter)

 Incremented by an external signal edge through the TCC pin, or by the instruction

cycle clock.

 External signal of TCC trigger pulse width must be greater than one instruction.

 The signals to increase the counter are determined by Bit 4 and Bit 5 of the CONT

 Writable and readable as any other registers.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

20 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.2.30 Bank 3-R6 (IRC Control)-only for ICE

Bit 7 6 5 4 3 2 1 0

EM78P221/2N ‘0’ ‘0’ ‘0’ ‘0’ ‘0’ ‘0’ ‘0’ ‘0’

ICE220N C3 C2 C1 C0 RCM1 RCM0 ‘0’ ‘0’

Bits 7 ~ 2: [With Simulator (C3~C0, RCM1~RCM0)]: IRC calibration bits in IRC oscillator mode.

In IRC oscillator mode of ICE220N simulator, these are the

IRC mode selection bits and IRC calibration bits.

[With EM78P221/2N]: Unimplemented, read as ‘0’. Bits 7 ~ 4 (C3 ~ C0): Calibrator of internal RC mode

C3 C2 C1 C0 Frequency (MHz)

0 0 0 0 (1-36%) × F

0 0 0 1 (1-31.5%) × F

0 0 1 0 (1-27%) × F

0 0 1 1 (1-22.5%) × F

0 1 0 0 (1-18%) × F

0 1 0 1 (1-13.5%) × F

0 1 1 0 (1-9%) × F

0 1 1 1 (1-4.5%) × F

1 1 1 1 F (default)

1 1 1 0 (1+4.5%) × F

1 1 0 1 (1+9%) × F

1 1 0 0 (1+135%) × F

1 0 1 1 (1+18%) × F

1 0 1 0 (1+22.5%) × F

1 0 0 1 (1+27%) × F

1 0 0 0 (1+31.5%) × F

1. Frequency values shown are theoretical and taken at an instance of a high frequency mode. Hence, frequency values are shown for reference only. Definite values depend on the actual process.

2. Similar way of calculation is also applicable to low frequency mode.

Bits 3 ~ 2 (RCM1 ~ RCM0): IRC mode selection bits

RCM 1 RCM 0 Frequency (MHz)

1 1 4 (default)

1 0 16

0 1 1

0 0 455kHz

Bits 1 ~ 0: are not used, fixed to "0" all the time.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 21

(This specification is subject to change without further notice)

6.2.31 Bank 3-R7 (Noise and LVR Control) - only for ICE

Bit 7 6 5 4 3 2 1 0

EM78P221/2N ‘0’ ‘0’ ‘0’ ‘0’ ‘0’ ‘0’ ‘0’ ‘0’

ICE220N “0” “0” “0” “0” NRHL NRE LVR1 LVR0

Bits 7 ~ 4: not used, fixed to "0" all the time. Bits 3 ~ 0: [With EM78P221/2N]: Unimplemented, read as ‘0’. [With Simulator]: Bit 3 (NRHL): Noise rejection high/low pulses define bit. The INT pin is a falling

edge trigger

0 = Pulses equal to 8/fc [s] are regarded as signal. 1 = Pulses equal to 32/fc [s] are regarded as signal (default)

NOTE

The noise rejection function is turned off in the LXT2 and sleep mode.

Bit 2 (NRE): Noise rejection enable

0 = disable noise rejection 1 = enable noise rejection (default). However in Low Crystal

oscillator (LXT) mode, the noise rejection circuit is always

disabled.

Bits 1 ~ 0 (LVR1 ~ LVR0): Low Voltage Reset enable bits. If Vdd has crossover at

Vdd reset level as Vdd changes, the system will be reset.

LVR1, LVR0 VDD Reset Level VDD Release Level

11 NA (Power-on Reset) (default)

10 2.5V 2.7V

01 3.0V 3.2V

00 4.0V 4.2V

6.2.32 Bank 3-R8~RF (Reserve)

Bits 7~0: not used, fixed to "0" all the time.

6.2.33 R10 ~ R1F

All of these are 8-bit general-purpose registers.

6.2.34 Banks 0~3 - R20 ~ R3F

All of these are 8-bit general-purpose registers.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

22 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.3 TCC/WDT and Prescaler

There are two 8-bit counters available as prescalers for the TCC and WDT. The

PST0~PST2 bits of the CONT register are used to determine the ratio of the TCC

prescaler, and the PWR0~PWR2 bits of the Bank 1-RE register are used to determine

the WDT prescaler. The prescaler counter is cleared by the instructions each time

such instructions are written into TCC. The WDT and prescaler are cleared by the

“WDTC” and “SLEP” instructions. Fig. 6-2 depicts the block diagram of TCC/WDT.

TCC (Bank 3-R5) is an 8-bit timer/counter. The TCC clock source can be internal clock

(Fosc) or external signal input (edge selectable from the TCC pin). If the TCC signal

source is from an external clock input, TCC will be incremented by 1 at every falling

edge or rising edge of the TCC pin. The TCC pin input time length (kept at High or Low

level) must be greater than 1CLK. 1 CLK is always Fosc/2..Refer to Fig. 6-2.

NOTE

The internal TCC will stop running when in sleep mode.

The watchdog timer is a free running on-chip RC oscillator. The WDT will keep on

running even when the oscillator driver has been turned off (i.e., in sleep mode).

During normal operation or sleep mode, a WDT time-out (if enabled) will cause the

device to reset. The WDT can be enabled or disabled at any time during normal mode

through software programming. Refer to WDTE bit of Bank 1-RE register (Section

6.2.10 Bank 1-RE (WDT Control Register). With no prescaler, the WDT time-out

duration is approximately 18ms.

VDD=5V, WDT Time-out period = 15.2ms ± 30%.

VDD=3V, WDT Time-out period = 18ms ± 30%.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 23

(This specification is subject to change without further notice)

8-bit CounterWDT

Prescaler8 to 1 MUX

WDT Time out

WDTE (Bank 1-RE)

TCC Pin

MUX

CLK (Fosc)

8-bit Counter

8 to 1 MUX

TE (CONT)

Data Bus

TCC overflow

Interrupt

TS (CONT)

TCC (R1)

PSW2~0

(Bank 1-RE)

Prescaler

PSR2~0 (CONT)

Fig. 6-2 TCC and WDT Block Diagram

6.4 I/O Ports

The I/O registers (Port 5, Port 6, Port 7, and Port 8) are bidirectional tri-state I/O ports. The Pull-high, Pull-down, and Open-drain functions can be set internally by Bank 1-RB, Bank 1-RC, and Bank 1-RD respectively. The High Drive, and High Sink functions can be set internally by Bank 2-R5, Bank 2-R6, and Bank 2-R7 respectively. Port 6 features an input status change interrupt (or wake-up) function. Most I/O pin can be defined as "input" or "output" pin by the I/O control registers (P52, P53 are only used as output pins). The I/O registers and I/O control registers are both readable and writable. However, the initial states of these I/O ports (Port 5, Port 6, Port 7 and Port 8) are unknown input (high impedance). Then, if the I/O pin is pulled to a level at external circuit, the pin must induce a voltage. Hence, user must take into consideration whether the induced voltage causes a wrong action in the system. The I/O interface circuits for Port 5, Port 6, Port 7, and Port 8 are illustrated in Figures 6-3, 6-4, & 6-5 respectively. Port 6 with Input Change Interrupt/Wake-up is shown in Fig. 6-6.

M U X

PORT

PCWR

PDWR

IOD

PDRD

PCRD

DDQ

C L

P R

CLK

P R

Note: Pull-high and Open-drain are not shown in the figure.

Fig. 6-3 I/O Port and I/O Control Register Circuit for Port 5 , Port 7 and Port 8

EM78P221/2N

8-Bit Microcontroller with OTP ROM

24 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

PCRD

M U X

IOD

INT

PDRD

P77, /INT0 P71, /INT1

EIS1,EIS0

PCWR

CLK

P R

PDWR

CLK

P R

C L

CLK

PORT

Note: CO2, Pull-high and Open-drain are not shown in the figure.

Fig. 6-4 I/O Port and I/O Control Register Circuit for P77 (/INT0) and P71 (/INT1)

PCRD

M U X

IOD

PDRD

P60 ~ P67

PCWR

CLK

C L

PDWR

CLK

P R

C L

P R

C L

CLK

TI n

PORT

Note: Pull-high (down) and Open-drain are not shown in the figure.

Fig. 6-5 I/O Port and I/O Control Register Circuit for Port 6

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 25

(This specification is subject to change without further notice)

/SLEP

T17

T10 T11

ICIE

Interrupt

ENI Instruction

DISI Instruction

Interrupt

(Wake-up from

SLEEP)

Next Instruction

(Wake-up from

SLEEP)

CLK

RE.1

ICWE

Fig. 6-6 Port 6 Block Diagram with Input Change Interrupt/Wake-up

6.4.1 Usage of Port 6 Input Change Wake-up/Interrupt Function

Usage of Port 6 Input Status Change Wake-up/Interrupt

(1) Wake-up (2) Wake-up and Interrupt

(a) Before Sleep (a) Before Sleep

1. Disable WDT 1. Disable WDT

2. Read I/O Port 6 (MOV R6,R6) 2. Read I/O Port 6 (MOV R6,R6)

3. Execute "ENI" or "DISI" 3. Execute "ENI" or "DISI"

4. Enable wake-up bit (Set Bank 0-RE ICWE =1)

5. Execute "SLEP" instruction

5. Enable interrupt (Set BANK1-RF ICIE =1)

(b) After wake-up 6. Execute "SLEP" instruction

→ Next instruction (b) After wake-up

1. IF "ENI" → Interrupt vector (008H)

2. IF "DISI" → Next instruction

(3) Interrupt

(a) Before Port 6 pin change

1. Read I/O Port 6 (MOV R6,R6)

2. Execute "ENI" or "DISI"

3. Enable interrupt (Set BANK1-RF ICIE =1)

(b) After Port 6 pin changed (interrupt)

1. IF "ENI" → Interrupt vector (008H)

2. IF "DISI" → Next instruction

EM78P221/2N

8-Bit Microcontroller with OTP ROM

26 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.5 Reset and Wake-up

6.5.1 Reset and Wake-up Operation

A reset is initiated by one of the following events:

1. Power-on reset

2. /RESET pin input "low"

3. WDT time-out (if enabled)

A device is kept in a reset condition for a duration of approximately 18ms

after the

reset is detected. When in LXT mode, the reset time is 500ms. Once a reset occurs,

the following functions are performed (the initial address is 000h):

 The oscillator continues running, or will be started (if in sleep mode)

 The Program Counter (R2) is set to all "0"

 All I/O port pins are configured as input mode (high-impedance state)

 The Watchdog Timer and prescaler are cleared

 When power is switched On, the Memory switch register (R1) is set to 0

 The CONT register bits are set to all "0" except for Bit 6 (INT flag)

 The Bank 0-RF register bits are set to all "0"

 The Bank 1-RB register bits are set to all "1"

 The Bank 1-RC register bits are set to all "1"

 The Bank 1-RD register bits are set to all "1"

 The Bank 1-RE register bits are set to all "0"

 The Bank 1-RF register bits are set to all "0"

Executing the “SLEP” instruction will assert the sleep (power down) mode. While

entering sleep mode, the Oscillator and TCC are stopped. The WDT (if enabled) is

cleared but keeps on running.

The controller can be awakened by:

Case 1 External reset input on /RESET pin

Case 2 WDT time-out (if enabled)

Case 3 Port 6 input status changes (if ICWE is enabled)

Case 4 Comparator output status changes (if CMPWE is enabled)

VDD=5V, Setup time period = 16.5ms ± 30%.

VDD=3V, Setup time period = 18ms ± 30%.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 27

(This specification is subject to change without further notice)

The first two cases (1 & 2) will cause the EM78P221/2N to reset. The T and P flags of

R3 can be used to determine the source of the reset (wake-up). Cases 3 & 4 are

considered the continuation of program execution and the global interrupt ("ENI" or

"DISI" being executed) decides whether or not the controller branches to the interrupt

vector following a wake-up. If ENI is executed before SLEP, the instruction will begin to

execute from Address 0x8 after wake-up. If DISI is executed before SLEP, the

execution will restart from the instruction next to SLEP after wake-up. All sleep mode

wake up time is dependent on the oscillator mode, no matter what the oscillator type or

mode is (except when it’s in LXT2 mode). In LXT2 mode, wake-up time is 2 ~ 3 sec.

Only one of Cases 1 to 4 can be enabled before entering into sleep mode. That is:

Case [a] If WDT is enabled before SLEP, all of the RE bit is disabled. Hence, the

EM78P221/2N can be awakened only with Case 1 or Case 2. Refer to the

section on Interrupt (Section 6.6) for further details.

Case [b] If Port 6 Input Status Change is used to wake -up EM78P221/2N and ICWE

bit of Bank 0-RE register is enabled before SLEP, WDT must be disabled.

Hence, the EM78P221/2N can be awakened only with Case 3. Wake-up

time is dependent on the oscillator mode. In RC mode (VDD: 5V, IRC:

4MHz), wake-up time is 10 μs (for stable oscillators). In HXT2 mode (VDD:

5V, Crystal: 4MHz, C1/C2: 30pF), wake-up time is 800μs (for stable

oscillators), and in LXT2 mode, wake-up time is 2 ~ 3 sec.

Case [c] If the Comparator output status change is used to wake-up the EM78P221/ 2N

and the CMPWE bit of the RE register is enabled before SLEP, WDT must be

disabled by software. Hence, the EM78P221/2N can be awakened only with

Case 4.

Wake-up time is dependent on the oscillator mode. In RC mode (VDD: 5V,

IRC: 4MHz), wake-up time is 10μs (for stable oscillators). In HXT2 mode

(VDD: 5V, Crystal: 4MHz, C1/C2: 30 pF), wake-up time is 800μs (for stable

oscillators), and in LXT2 mode, wake-up time is 2 ~ 3 sec.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

28 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

If Port 6 Input Status Change Interrupt is used to wake up the EM78P221/2N (as in

Case b above), the following instructions must be executed before SLEP:

MOV A, @000110xxb ; Select WDT prescaler and disable WDT BANK 1 MOV RE, A WDTC ; Clear WDT and prescaler BANK 0 MOV R6, R6 ; Read Port 6 ENI (or DISI) ; Enable (or disable) global interrupt MOV A, @xxx1xxxxb ; Enable Port 6 input change wake-up bit MOV RE MOV A, @00000x1xb ; Enable Port 6 input change interrupt BANK 1 MOV RF, A SLEP ; Sleep

Similarly, if the Comparator Interrupt is used to wake up the EM78P221/2N (as in Case

[c] above), the following instructions must be executed before SLEP:

MOV A, @xxx01xxxb

; Select Comparator and P71 funct ions as ; general I/O pin

BANK 1 MOV RA, A MOV A, @000110xxb ; Select WDT prescaler and Disabl e WDT MOV RE, A WDTC ; Clear WDT and prescaler ENI (or DISI) ; Enable (or disable) global interrupt MOV A, @00000100b

;

Enable comparator output status change

; wake-up bit

BANK 0 MOV RE, A BANK 1 MOV A, @0x00000001b

; Enable Comparator 1

utput status change

; interrupt

MOV RE, A SLEP ; Sleep

6.5.1.1 Wake-up and Interrupt Modes Operation Summary

All categories under Reset, Wake-up and Interrupt modes are summarized below.

Wake-up Signal Sleep Mode Normal Mode

External interrupt

Interrupt (if interrupt enable) or next instruction

Port 6 pin change

If enable ICWE bit Wake-up + interrupt (if interrupt enable)+ next instruction

Interrupt (if interrupt enable) or next instruction

TCC overflow interrupt

Interrupt (if interrupt enable) or next instruction

Comparator interrupt

If enable CMPWE bit Wake-up + interrupt (if interrupt enable) + next instruction

Interrupt (if interrupt enable) or next instruction

WDT Time out

Reset to Normal mode Reset to Normal mode

Low Voltage Reset

Reset to Normal mode Reset to Normal mode

After wake up:

1. If interrupt enable → interrupt+ next instruction

2. If interrupt disable → next instruction

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 29

(This specification is subject to change without further notice)

The controller can be awakened from sleep mode and idle mode. The wake-up signals are listed as follows:

Signal Sleep Mode Normal Mode

DISI + Bank 1-RF (EXIE) Bit 2 = 1 Next Instruction+ Set Bank 0-RF (EX0IF) = 1 or Set Bank 0-RE (EX1IF) = 1 ENI + Bank 1-RF (EXIE) Bit 2 = 1

INT0 INT1

N/A

Interrupt Vector (0x08)+ Set Bank 0-RF

(EX0IF) = 1 Bank 0-RE (ICWE) Bit 4 = 0, Bank 1-RF (ICIE) Bit 1 = 0

Bank 1-RF (ICIE) Bit 1 = 0

Oscillator, TCC and TCC are stopped. Port 6 input status changed wake-up is invalid.

Port 6 input status change interrupt is invalid

Bank 0-RE (ICWE) Bit 4 = 0, Bank 1-RF (ICIE) Bit 1 = 1

N/A

Set Bank 0-RF (ICIF) = 1, Oscillator and TCC are stopped. Port 6 input status changed wake-up is invalid.

N/A

Bank 0-RE (ICWE) Bit 4 = 1, Bank 1-RF (ICIE) Bit 1 = 0

N/A

Wake-up+ Next Instruction Oscillator and TCC are stopped.

N/A

Bank 0-RE (ICWE) Bit 4 = 1, DISI + Bank 1-RF (ICIE) Bit 1 = 1

DISI + Bank 1-RF (ICIE) Bit 1 = 1

Wake-up+ Next Instruction+ Set Bank 0-RF (ICIF) = 1 Oscillator and TCC are stopped.

Next Instruction+ Set Bank 0-RF (ICIF) = 1

Bank 0-RE (ICWE) Bit 4 = 1, ENI + Bank 1-RF (ICIE) Bit 1 = 1

ENI + Bank 1-RF (ICIE) Bit 1 = 1

Port 6 Input Status Change

Wake-up+ Interrupt Vector (0x08)+ Set Bank 0-RF (ICIF) = 1 Oscillator, TCC and TIMERX are stopped.

Interrupt Vector (0x08)+ Set Bank 0-RF

(ICIF) = 1

DISI + Bank 1-RF (TCIE) Bit 0 = 1

Next Instruction+ Set Bank 0-RF (TCIF) = 1

ENI + Bank 1-RF (TCIE) Bit 0=1

TCC Overflow N/A

Interrupt Vector (0x08)+ Set Bank 0-RF

(TCIF) = 1

Bank 0-RE (CMPWE) Bit 2 = 0 Bank 1-RE (CMPIE) Bit 0 = 0

Bank 1-RE (CMPIE) Bit 0 = 0

Comparator output status changed wake-up is invalid. Oscillator and TCC are stopped.

Comparator output status change interrupt is invalid.

Bank 0-RE (CMPWE) Bit 2 = 0, } Bank 1-RE (CMPIE) Bit 0 = 1 Set Bank 0-RE (CMPIF) = 1, Comparator output status changed wake-up is invalid. Oscillator and TCC are stopped. Bank 0-RE (CMPWE) Bit 2 = 1, Bank 1-RE (CMPIE) Bit 0 = 0 Wake-up+ Next Instruction, Oscillator and TCC are stopped. Bank 0-RE (CMPWE) Bit 2 = 1, DISI + Bank 1-RE (CMPIE) Bit 0 =1

DISI + Bank 1-RE (CMPIE) Bit 0 = 1

Wake-up+ Next Instruction+ Set Bank 0-RE (CMPIF) Bit 0 =1, Oscillator and TCC are stopped.

Next Instruction+ Set Bank 0-RE (CMPIF) Bit 0 = 1

Bank 0-RE (CMPWE) Bit 2 = 1, ENI + Bank 1-RE (CMPIE) Bit 0 = 1

ENI + Bank 1-RE (CMPIE) Bit 0 = 1

Comparator (Comparator Output Status Change)

Wake-up+ Interrupt Vector (0x08)+ Set Bank 0RE (CMPIF) Bit 0 = 1, Oscillator and TCC are stopped.

Interrupt Vector (0x08)+ Bank 0-RE (CMPIF) Bit 0 = 1

WDT Time-out Bank 1-RE (WDTE) Bit 7=1

Wake-up+ Reset (Address 0x00) Reset (Address 0x00)

Low Voltage Reset

Wake-up+ Reset (Address 0x00) Reset (Address 0x00)

EM78P221/2N

8-Bit Microcontroller with OTP ROM

30 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.5.1.2 Register Initial Values after Res et

The following table summarizes the registers initialized values.

Address Name Reset Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit Name INTE INT TS TE PSTE PST2 PST1 PST0

Power-on 0 0 0 0 0 0 0 0

/RESET & WDT 0 0 0 0 0 0 0 0

N/A CONT

Wake-up from Pin Change

P P P P P P P P

Bit Name - - - - - - - -

Power-on U U U U U U U U

/RESET & WDT P P P P P P P P

0x00 R0 (IAR)

Wake-up from Pin Change

P P P P P P P P

Bit Name - - - - - - BS1 BS

Power-on 0 0 0 0 0 0 0 0

/RESET & WDT 0 0 0 0 0 0 0 0

0x01 R1 (MSR)

Wake-up from Pin Change

P P P P P P P P

Bit Name - - - - - - - -

Power-on 0 0 0 0 0 0 0 0

/RESET & WDT 0 0 0 0 0 0 0 0

0x02 R2 (PC)

Wake-up from Pin Change

Jump to Address 0x08 or continue to execute next instruction

Bit Name - - - T P Z DC C

Power-on 0 0 0 1 1 U U U

/RESET & WDT 0 0 0 t t P P P

0x03 R3 (SR)

Wake-up from Pin Change

P P P t t P P P

Bit Name - - - - - - - -

Power-on 0 0 U U U U U U

/RESET & WDT 0 0 P P P P P P

0x04 R4 (RSR)

Wake-up from Pin Change

P P P P P P P P

Bit Name P57 P56 P55 P54 P53 P52 P51 P50

Power-on U U U U U U U U

/RESET & WDT U U U U U U U U

0x05 Bank 0-R5

Wake-up from Pin Change

P P P P P P P P

Bit Name P67 P66 P65 P64 P63 P62 P61 P60

Power-on U U U U U U U U

/RESET & WDT U U U U U U U U

0x06 Bank 0-R6

Wake-up from Pin Change

P P P P P P P P

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 31

(This specification is subject to change without further notice)

Address Name

Reset Type

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit Name

P77 P76 P75 P74 P73 P72 P71 P70

Power-on

U U U U U U U U

/RESET & WDT

U U U U U U U U

0x07 Bank 0-R7

Wake-up from Pin Change

P P P P P P P P

Bit Name

- - NREN - - - P81 P80

Power-on

0 0 0 0 0 0 U U

/RESET & WDT

0 0 0 0 0 0 U U

0x8 Bank 0-R8

Wake-up from Pin Change

P P P P P P P P

Bit Name

- - - - - - - -

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0x9

0XD

Bank 0R9~RD

(Reserve)

Wake-up from Pin Change

P P P P P P P P

Bit Name

EX1IF - - ICWE - CMPWE - CMPIF

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0xE

Bank 0-

(WUCR)

Wake-up from Pin Change

P P P P P P P P

Bit Name

- - - - - EX0IF ICIF TCIF

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0xF

Bank 0-

RF (ISR)

Wake-up from Pin Change

P P P P P P P P

Bit Name

C57 C56 C55 C54 C53 C52 C51 C50

Power-on

1 1 1 1 1 1 1 1

/RESET & WDT

1 1 1 1 1 1 1 1

0x05 Bank 1-R5

Wake-up from Pin Change

P P P P P P P P

Bit Name

C67 C66 C65 C64 C63 C62 C61 C60

Power-on

1 1 1 1 1 1 1 1

/RESET & WDT

1 1 1 1 1 1 1 1

0x06 Bank 1-R6

Wake-up from Pin Change

P P P P P P P P

Bit Name

C77 C76 C75 C74 C73 C72 C71 C70

Power-on

1 1 1 1 1 1 1 1

/RESET & WDT

1 1 1 1 1 1 1 1

0x07 Bank 1-R7

Wake-up from Pin Change

P P P P P P P P

EM78P221/2N

8-Bit Microcontroller with OTP ROM

32 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

Address Name Reset Type Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit Name

- - -

ICE

220N

211N

212N

ICE

220N

211N

212N

ICE

220N

211N

212N

C81 C80

Power-on

0 0 0 1 0 1 0 1 0 1 1

/RESET & WDT

0 0 0 1 0 1 0 1 0 1 1

0x8 Bank 1-R8

Wake-up from Pin Change

P P P P P P P P P P P

Bit Name

- - - - - - - -

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0x9

Bank 1-R9

(Reserve)

Wake-up from Pin Change

P P P P P P P P

Bit Name

EIS1 EIS0

CMP OUT

CMP

COS1

CMP

COS0

- - -

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0xA

Bank 1-RA

(CMPCON)

Wake-up from Pin Change

P P P P P P P P

Bit Name

/PD7 /PD6 /PD5 /PD4 /PD3 /PD2 /PD1 /PD0

Power-on

1 1 1 1 1 1 1 1

/RESET & WDT

1 1 1 1 1 1 1 1

0xB Bank 1-RB

Wake-up from Pin Change

P P P P P P P P

Bit Name

/OD7 /OD6 /OD5 /OD4 /OD3 /OD2 /OD1 /OD0

Power-on

1 1 1 1 1 1 1 1

/RESET & WDT

1 1 1 1 1 1 1 1

0xC Bank 1-RC

Wake-up from Pin Change

P P P P P P P P

Bit Name

/PH7 /PH6 /PH5 /PH4 /PH3

/PH2 /PH1 /PH0

Power-on

1 1 1 1 1 1 1 1

/RESET & WDT

1 1 1 1 1 1 1 1

0xD Bank 1-RD

Wake-up from Pin Change

P P P P P P P P

Bit Name

WDTE - PSWE PSW2 PSW1 PSW0 - CMPIE

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0xE Bank 1-RE

Wake-up from Pin Change

P P P P P P P P

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 33

(This specification is subject to change without further notice)

Address Name

Reset Type

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit Name

- - - - EXIE ICIE TCIE

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0xF Bank 1-RF

Wake-up from Pin Change

P P P P P P P P

Bit Name

HD67 HD66 HD65 HD64

HD63 HD62 HD61 HD60

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0x05

Bank 2-R5

(HDCR)

Wake-up from Pin Change

P P P P P P P P

Bit Name

HS57 HS56 HS55 HS54

HS53 HS52 HS51 HS50

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0x06

Bank 2-R6

(HSCR1)

Wake-up from Pin Change

P P P P P P P P

Bit Name

HS67 HS66 HS65 HS64

HS63 HS62 HS61 HS60

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0x07

Bank 2-R7

(HSCR2)

Wake-up from Pin Change

P P P P P P P P

Bit Name

- - - -

Power-on

U 1 1 1 U U U U

/RESET & WDT

P 1 1 1 P P P P

0x8

Bank 2-R8

(OMCR)

Wake-up from Pin Change

P P P P P P P P

Bit Name

- - - -

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0x9

0xF

Bank 2-R9

(RF)

Wake-up from Pin Change

P P P P P P P P

Bit Name

TCC7 TCC6 TCC5 TCC4 TCC3 TCC2 TCC1 TCC0

Power-on

0 0 0 0 0 0 0 0

/RESET & WDT

0 0 0 0 0 0 0 0

0x05

Bank 3-R5

(TCC)

Wake-up from Pin Change

P P P P P P P P

Bit Name

C3 C2 C1 C0 RCM1 RCM0 - -

Power-on

1 1 1 1 1 1 U U

/RESET & WDT

1 1 1 1 1 1 P P

0x06

Bank 3-R6

(IRC)

(only for

ICE) Wake-up from

Pin Change

P P P P P P P P

EM78P221/2N

8-Bit Microcontroller with OTP ROM

34 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

Address Name

Reset Type

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

Bit Name

- - - - NRHL NRE LVR1 LVR0-

Power-on

U U U U 1 1 1 1

/RESET & WDT

P P P P 1 1 1 1

0x07

Bank 3-R7

(only for

ICE)

Wake-up from Pin Change

P P P P P P P P

Bit Name

- - - - - - - -

Power-on

U U U U U U U U

/RESET & WDT

P P P P P P P P

0x10 ~ 0x1F

R10 ~ R1F

Wake-up from Pin Change

P P P P P P P P

Bit Name

- - - - - - - -

Power-on

U U U U U U U U

/RESET & WDT

P P P P P P P P

0x20 ~ 0x3F

Bank 0~3

R20 ~ R3F

Wake-up from Pin Change

P P P P P P P P

Legend: “×” = not used “P” = previous value before reset “u” = unknown or don’t care “t” = check “Reset Type” Table in Section 6.5.2

6.5.1.3 Controller Reset Block Diagram

WDT Timeout

Oscillator

D Q

CLK

CLR

WDT

VDD

Setup time

Reset

CLK

/RESET

Power-on Reset

Voltage Detector

WTE

Fig. 6-7 Controller Reset Block Diagram

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 35

(This specification is subject to change without further notice)

6.5.2 The T and P Status under Status Register

A reset condition is initiated by one of the following events:

1. Power-on reset

2. /RESET pin input "low"

3. WDT time-out (if enabled)

The values of T and P as listed in the table below, are used to check how the processor

wakes up.

Reset Type T P

Power-on 1 1

/RESET during Operating mode *P *P

/RESET wake-up during Sleep mode 1 0 LVR during Operating mode, *P *P

LVR wake-up during SLEEP mode 1 0

WDT during Operating mode 0 *P

WDT wake-up during Sleep mode 0 0

Wake-up on pin change during Sleep mode 1 0

* P: Previous status before reset

The following shows the events that may affect the status of T and P.

Event T P

Power-on 1 1

WDTC instruction 1 1

WDT time-out 0 *P

SLEP instruction 1 0

Wake-up on pin changed during Sleep mode 1 0

* P: Previous value before reset

EM78P221/2N

8-Bit Microcontroller with OTP ROM

36 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.6 Interrupt

The EM78P221/2N has four interrupts as listed below:

1. TCC overflow interrupt

2. Port 6 Input Status Change Interrupt

3. External interrupt INT0, INT1

4. When the Comparator 1 output status changes

Before the Port 6 Input Status Change Interrupt is enabled, reading Port 6 (e.g., "MOV

R6, R6") is necessary. Each Port 6 pin will have this feature if its status changes. Port 6

Input Status Change Interrupt will wake up the EM78P221/2N from sleep mode if it is

enabled prior to going into sleep mode by executing SLEP. When wake-up occurs, the

controller will continue to execute the succeeding program if the global interrupt is

disabled. If enabled, it will branch out to the interrupt vector 008H.

The external interrupt has a built-in digital noise rejection circuit (if the input pulse is

less than 8-system clock time, it is eliminated as noise. Edge selection is possible with

/INT. Refer to Word 1 Bits 8~7 (Section 6.13.2, Code Option Register (Word 1)) for

digital noise rejection definition.

During a power source unstable situation, like during external power noise interference

or EMS test condition, it will cause the power to vibrate fiercely. While Vdd is still

unsettled, the supply voltage may be below working voltage. When the system supply

voltage Vdd is below the working voltage, the IC kernel must automatically keep all

Bank 0-RE and Bank 0-RF are the interrupt status register that records the interrupt

requests in the relative flags/bits. Bank 1-RE and Bank 1-RF are interrupt mask

registers. The global interrupt is enabled by the ENI instruction and is disabled by the

DISI instruction. When one of the interrupts (when enabled) occurs, the next instruction

will be fetched from Address 008H. Once in the interrupt service routine, the source of an

interrupt can be determined by polling the flag bits in Bank 0-RE and Bank 0-RF. The

interrupt flag bit must be cleared by instructions before leaving the interrupt service

routine to avoid recursive interrupts.

When interrupt mask bits is “Enable”, the flag in the Interrupt Status Register (RF) is set

regardless of the ENI execution. Note that the result of Bank 0-RE/RF will be the logic

AND of BANK 0-RE/RF and Bank 1-RE/RF (refer to Fig. 6-8). The RETI instruction

ends the interrupt routine and enables the global interrupt (the ENI execution).

When any interrupt occurs, the contents of ACC, R1 (Bits 5, 4, 1, 0), R3 (Bits 2 ~0), R4

registers are pushed to the corresponding stack (Fig 6-9). After the RETI instruction is

executed, the content of the corresponding stack are popped to ACC, R1 (Bits 5, 4, 1, 0),

R3 (Bits 2 ~0), R4 registers.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 37

(This specification is subject to change without further notice)

BANK0-RE/RF

BANK0-RE/RF RD

BANK0-RE/RF WR

BANK1-RE/RF RD

BANK1-RE/RF WR

BANK1-RE/RF

Fig. 6-8 Interrupt Input Circuit

Interrupt Sources

Interrupt

occurs

ENI/DISI

Stack ACC

Stack R3

RETI

ACC

R3 (2 ~0)

Stack R4

R1 (5, 4 ,1 ,0)

Stack R1

Fig. 6-9 Interrupt Backup Diagram

EM78P221/2N

8-Bit Microcontroller with OTP ROM

38 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.7 Comparator

The EM78P221/2N has one comparator comprising of two analog inputs and one

output. The comparator can be utilized to wake up the EM78P221/2N from sleep

mode. The comparator circuit diagram is depicted in the figure below.

Cin

CMP

Cin+

Cin

Output

10mV

Fig. 6-10 Comparator Circuit Diagram & Operating Mode

6.7.1 External Reference Signal

The analog signal presented at Cin– compares to the signal at Cin+, and the digital

output (CO) of the comparator is adjusted accordingly by taking the following notes into

considerations:

NOTE

■ The reference signal must be between Vss and Vdd.

■ The reference voltage can be applied to either pin of the comparator.

■ Threshold detector applications may be of the same reference.

■ The comparator can operate from the same or different reference sources.

6.7.2 Comparator Outputs

 The compared result is stored in the CMPOUT of Bank 1-RA.

 Bits 3 ~ 4 <CMPCOS1, CMPCOS0> of the Bank 1-RA register. See Section 6.2.18,

Bank 1-RA (CMPCON: Comparator Control Register) for Comparator select bits

function description.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 39

(This specification is subject to change without further notice)

NOTE

■ The highest priority of P71/INT1/CO is INT1. When EIS1=0, the working type of P71/INT1/CO is determined by CMPCOS1 and CMPCOS2.

■ The CO and P71of the P71/CO pins cannot be used at the same time.

■ The P71/CO pin priority is as follows:

The following figure shows the Comparator Output block diagram.

ENEN

To C0

CMPIF

To CMPOUT

CMRD

From

other

comparator

RESET

From OP I/

Fig. 6-11 Comparator Output Configuration

6.7.3 Using a Comparator as an Operation Amplifier

6.7.3.1 Bank 0-RE (WUCR: Wake-up Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

EX1IF 0 0 ICWE 0 CMPWE 0 CMPIF

Bit 2 (CMPWE): Comparator wake-up enable bit 0 = Disable Comparator wake-up 1 = Enable Comparator wake-up

When the Comparator output status change is used to enter an

interrupt vector or to wake-up the EM78P221/2N from sleep, the

CMPWE bit must be set to “Enable“.

Bit 0 (CMPIF): Comparator interrupt flag. Set when a change occurs in the

Comparator output. Reset by software

P71/INT1/CO Pin Priority

High Medium Low

/INT1 CO P71

EM78P221/2N

8-Bit Microcontroller with OTP ROM

40 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.7.3.2 Bank 1-RA (CMPCON: Comparator Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

EIS1 EIS0 CMPOUT CMPCOS1 CMPCOS0 0 0 0

Bit 5 (CMPOUT): The result of the Comparator output Bit 4 ~ Bit 3 (CMPCOS1 ~ CMPCOS0): Comparator Select bits

CMPCOS1 CMPCOS0 Function Description

0 0 Comparator is not used. P72, P73 and P71 are normal I/O pins

0 1 P72 and P73 are Comparator input pins and P71 is normal I/O pin

1 0

P72 and P73 are Comparator input pins and P71 is Comparator output pin (CO)

1 1 Used as OP and P71 is OP output pin (CO)

6.7.3.3 Bank 1-RE (WDT Control Register)

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

WDTE 0 PSWE PSW2 PSW1 PSW0 0 CMPIE

Bit 0 (CMPIE): CMPIF interrupt enable bit 0 = Disable CMPIF interrupt 1 = Enable CMPIF interrupt

When the Comparator output status change is used to enter an

interrupt vector or to enter the next instruction, the CMPIE bit must

be set to “Enable“. But actually the comparator output must be read

to latch the status at first. Then the comparator output is compared

to this latch to produce the information of output status change.

6.7.4 Comparator Interrupt

 CMPIE must be enabled for the “ENI” instruction to take effect

 Interrupt is triggered whenever a change occurs on the comparator output pin

 The actual change on the pin can be determined by reading the Bit CMPOUT

 CMPIF the comparator interrupt flag, can only be cleared by software

6.7.5 Wake-up from Sleep Mode

 If enabled, the comparator remains active and the interrupt remains functional, even

in Sleep mode.

 If a mismatch occurs, the interrupt will wake up the device from Sleep mode.

 The power consumption should be taken into consideration for the benefit of energy

conservation.

 If the function is unemployed during Sleep mode, turn off the comparator before

entering sleep mode.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 41

(This specification is subject to change without further notice)

6.8 Oscillator

6.8.1 Oscillator Modes

The EM78P221/2N can be operated in six different oscillator modes, such as High

Crystal oscillator mode (HXT 1, 2), Low Crystal oscillator mode (LXT 1, 2), External RC

oscillator mode (ERC), and RC oscillator mode with Internal RC oscillator (IRC). Select

one of such modes by programming the OSC2, OCS1, and OSC0 in the Code Option

The Oscillator modes defined by OSC2, OCS1, and OSC0 are described below.

Oscillator Modes OSC2 OSC1 OSC0

ERC1 (External RC oscillator mode); P52/OSCO act as P52 0 0 0 ERC1 (External RC oscillator mode); P52/OSCO act as OSCO 0 0 1 IRC2 (Internal RC oscillator mode); P52/OSCO act as P52 0 1 0 IRC2 (Internal RC oscillator mode); P52/OSCO act as OSCO 0 1 1 LXT13 (Frequency range of XT mode is 1MHz~100kHz) 1 0 0 HXT13 (Frequency range of XT mode is 16MHz~6MHz) 1 0 1 LXT23 (Frequency range of XT mode is 32kHz) 1 1 0 HXT23 (Frequency range of XT mode is 6MHz~1MHz) (Default) 1 1 1

In ERC mode, OSCI is used as oscillator pin. OSCO/P52 is defined by code option Word 0 Bit 6 ~ Bit 4.

In IRC mode, P53 is normal I/O pin. OSCO/P52 is defined by code option Word 0 Bit 6 ~ Bit 4.

In LXT1, LXT2, HXT1 and HXT2 modes; OSCI and OSCO are used as oscillator pins. These pins cannot and should not be defined as normal I/O pins.

The maximum operating frequency limit of the crystal/resonator at different VDDs, are

as follows:

Conditions VDD Max. Freq. (MHz)

2.1 4

3.0 8

Two clocks

4.5 16

6.8.2 Crystal Oscillator/Ceramic Resonators (Crystal)

The EM78P221/2N can be driven by an external clock signal through the OSCO pin as

illustrated below.

OSCI

OSCO

Ext.

Clock in

Clock out

Fig. 6-12 External Clock Input Circuit

EM78P221/2N

8-Bit Microcontroller with OTP ROM

42 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

In most applications, Pin OSCI and Pin OSCO can be connected with a crystal or

ceramic resonator to generate oscillation. Fig. 6-13 below depicts such a circuit. The

same applies to the HXT 1, 2 modes and the LXT 1, 2 modes.

OSCI

OSCO

Crystal

Fig. 6-13 Crystal/Resonator Circuit

The following table provides the recommended values for C1 and C2. Since each

resonator has its own attribute, user should refer to the resonator specifications for

appropriate values of C1 and C2. RS, a serial resistor, may be required for AT strip cut

crystal or low frequency mode. Fig 6-13-1 is a recommended PCB layout. When the

system works in Crystal mode (16MHz), a 10KΩ is connected between OSCI and

OSCO.

Capacitor selection guide for crystal oscillator or ceramic resonators:

Oscillator Type Frequency Mode Frequency C1 (pF) C2 (pF)

100kHz 67pF 67pF

200kHz 30pF 30pF

455kHz 30pF 30pF

LXT

(100K~1MHz)

1MHz 30pF 30pF

1.0 MHz 30pF 30pF

2.0 MHz 30pF 30pF

Ceramic Resonators

HXT

(1M~6MHz)

4.0 MHz 30pF 30pF

LXT2 (32.768kHz) 32.768kHz 20pF 20pF

100kHz 67pF 67pF

200kHz 30pF 30pF

455kHz 30pF 30pF

LXT1

(100K~1MHz)

1MHz 30pF 30pF 455kHz 30pF 30pF

1.0 MHz 30pF 30pF

2.0 MHz 30pF 30pF

4.0 MHz 30pF 30pF

HXT2

(1~6MHz)

6.0 MHz 30pF 30pF

8.0 MHz 30pF 30pF

12.0 MHz 30pF 30pF

Crystal Oscillator

HXT1

(6~16MHz)

16.0 MHz 15pF 15pF

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 43

(This specification is subject to change without further notice)

Fig. 6-13-1 Parallel Mode Crystal/Resonator Circuit Diagram

EM78P221/2N

8-Bit Microcontroller with OTP ROM

44 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.8.3 External RC Oscillator Mode

For some applications that do not require

precise timing calculation, the RC

oscillator (Fig. 6-14) could offer a

cost-effective oscillator configuration.

Nevertheless, it should be noted that the

frequency of the RC oscillator is

influenced by the supply voltage, the

values of the resistor (Rext), the capacitor

(Cext), and even by the operation

temperature. Moreover, the frequency

also changes slightly from one chip to

another due to manufacturing process

variations.

OSCI

Vcc

Rext

Cext

Fig. 6-14 External RC Oscillator Mode Circuit

In order to maintain a stable system frequency, the values of the Cext should not be

less than 20pF, and the value of Rext should not be greater than 1MΩ. If the frequency

cannot be kept within this range, the frequency can be easily affected by noise,

humidity, and leakage.

The smaller the Rext in the RC oscillator, the faster its frequency will be. On the

contrary, for very low Rext values, for instance, 1 KΩ, the oscillator will become

unstable because the NMOS cannot discharge the capacitance current correctly.

Based on the above reasons, it must be kept in mind that all the supply voltage, the

operation temperature, the components of the RC oscillator, the package types, and

the PCB is layout, have certain effect on the system frequency.

The RC Oscillator frequencies:

Cext Rext Average Fosc 5V, 25 °C Average Fosc 3V, 25°C

3.3k 3.5 MHz 3.2 MHz

5.1k 2.5 MHz 2.3 MHz

10k 1.30 MHz 1.25 MHz

20 pF

100k 140 kHz 140 kHz

3.3k 1.27 MHz 1.21 MHz

5.1k 850 kHz 820 kHz

10k 450 kHz 450 kHz

100 pF

100k 48 kHz 50 kHz

3.3k 560 kHz 540 kHz

5.1k 370 kHz 360 kHz

10k 196 kHz 192 kHz

300 pF

100k 20 kHz 20 kHZ

Note:

: Measured based on DIP packages.

: The values are for design reference only.

: The frequency drift is ± 30%

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 45

(This specification is subject to change without further notice)

6.8.4 Internal RC Oscillator Mode

The EM78P221/2N offers a versatile internal RC mode with default frequency value of

4MHz. Internal RC oscillator mode has other frequencies (1MHz, 16MHz, and 455kHz)

that can be set by Code Option (Word 1), RCM1, and RCM0. The Table below

describes the EM78P221/2N internal RC drift with the variations on voltage,

temperature, and process.

Internal RC Drift Rate (Ta=25°C, VDD=5.0V ± 5%, VSS=0V)

Drift Rate

Internal

RC Frequency

Temperature

(-40°C~+85°C)

Voltage

(2.1V~5.5V)

Process Total

4MHz ±5% ±5% ±4% ±14%

16MHz ±5% ±5% ±4% ±14%

1MHz ±5% ±5% ±4% ±14%

455kHz ±5% ±5% ±4% ±14%

Theoretical values are for reference only. Actual values may vary depending on actual process.

6.9 Power-on Considerations

Any microcontroller is not warranted to start operating properly before the power supply

stabilizes to a steady state. EM78P221/2N has a built-in Power-on Voltage Detector

(POVD) with detection level range of 1.7V to 1.9V. The circuitry eliminates the extra

external reset circuit. It will work well if Vdd rises quickly enough (50 ms or less).

However, under critical applications, extra devices are still required to assist in solving

power-on problems.

6.9.1 External Power-on Reset Circuit

The circuit shown in the

following figure

implements an external

RC to produce a reset

pulse. The pulse width

(time constant) should

be kept long enough to

allow Vdd to reach the

minimum operating

voltage. This circuit is

used when the power

/RESET

VDD

Rin

Fig. 6-15 External Power on Reset Circuit

supply has a slow power rise time. Since the current leakage from the /RESET pin is

about ±5μA, it is recommended that R should not be greater than 40K. This way, the

voltage at Pin /Reset is held below 0.2V. The diode (D) functions as a short circuit at

power-down. The “C” capacitor is discharged rapidly and fully. Rin, the current-limited

resistor, prevents high current discharge or ESD (electrostatic discharge) from flowing

into Pin /RESET.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

46 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

6.9.2 Residual Voltage Protection

When the battery is replaced, device power Vdd is removed but residual voltage

remains. The residual voltage may trip below Vdd minimum, but not to zero. This

condition may cause a poor power-on reset. Fig. 6-16 and Fig. 6-17 show how to

create a protection circuit against residual voltage.

/RESET

VDD

100K

1N4684

10K

33K

VDD

Fig. 6-16 Residual Voltage Protection Circuit 1

/RESET

VDD

Fig. 6-17 Residual Voltage Protection Circuit 2

6.10 Low Voltage Reset

Low voltage reset (LVR) is designed for unstable power situation, such as external

power noise interference or in EMS test condition.

When LVR is enabled, the system supply voltage (Vdd) drops below Vdd reset level

RESET) and remains at 10μs, system reset will occur and the system will remain at

reset status. The system will remain at reset status until Vdd voltage rises above Vdd

release level. Refer to Fig 6-18.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 47

(This specification is subject to change without further notice)

LVR characteristics are set at Code Option Word 0, Bits 10 and 9. Detailed operation

mode is as follows:

Word 0

Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

TYPE1 TYPE0 L V R 1 LV R 0 C L K S ENWDTB OSC2 O S C 1 OSC0 - PR2 P R 1 P R0

Bits 10~9 (LVR1 ~ LVR0): Low Voltage Reset enable bits. If Vdd has crossover at Vdd

reset level as Vdd changes, the system will reset.

LVR1, LVR0 VDD Reset Level VDD Release Level

11 NA (Power-on Reset) (default)

10 2.5V 2.7V

01 3.0V 3.2V

00 4.0V 4.2V

Vdd

Internal Reset

RESET

Vdd < Vreset not longer than 10us, the system still keeps on opera ti ng

<L VR V ol tage drop

18ms

System occur reset

>LVR Voltage drop

Fig. 6-18 LVR Waveform Situation

6.11 Code Option

EM78P221/2N has two Code Option Words and one Customer ID word that are not a

part of the normal program memory.

Word 0 Word 1 Word 2

Bit 12 ~ Bit 0 Bit 12 ~ Bit 0 Bit 12 ~ Bit 0

6.11.1 Code Option Register (Word 0)

Word 0

Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

TYPE1 TYPE0 LVR1 LVR0 CLKS ENWDTB OSC2 OSC1 OSC0 - PR2 PR1 PR0

EM78P221/2N

8-Bit Microcontroller with OTP ROM

48 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

Bits 12 ~ 11 (Type 1, Type 0): Type selection for EM78P221N or EM78P222N

Type 1, Type 0 MCU Type

00 Not for use 01 Not for use 10 EM78P221N (24 pins) 11 EM78P222N (28 pins)

Note: LVR1 and LVR0 are at Bank 3-R7, when using ICE.

Bits 10 ~ 9 (LVR1 ~ LVR0): Low Voltage Reset control bits

LVR1, LVR0 VDD Reset Level VDD Release Level

11 NA (Power-on Reset) (Default) 10 2.5V 2.7V 01 3.0V 3.2V 00 4.0V 4.2V

Bit 8 (CLKS): Instruction time period option bit

0 = two oscillator time periods 1 = four oscillator time periods (Default)

Refer to Section 6.12 for Instruction Set Bit 7 (ENWDTB): Watchdog timer enable bit

0 = Enable 1 = Disable (default)

Bits 6, 5 & 4 (OSC2, OSC1 & OSC0): Oscillator Mode Selection bits

Oscillator Modes OSC2 OSC1 OSC0

In ERC mode, OSCI is used as oscillator pin. OSCO/P52 is defined by code option Word 0 Bit 6 ~ Bit 4.

In IRC mode, P53 is normal I/O pin. OSCO/P52 is defined by code option Word 0 Bit 6 ~ Bit 4.

In LXT1, LXT2, HXT1 and HXT2 modes; OSCI and OSCO are used as oscillator pins. These pins cannot and should not be defined as normal I/O pins.

Bit 3: Not used (Reserved). This bit is set to 0 all the time Bits 2 ~ 0 (PR2 ~ PR0): Protect Bits

PR2 ~ PR0 are protect bits. Each protect status is as follows:

PR2 PR1 PR0 Protect

0 0 0 Enable 1 1 1 Disable (Default)

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 49

(This specification is subject to change without further notice)

6.11.2 Code Option Register (Word 1)

Word 1

Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

- -

RESET

ENB

RCOUT NRHL NRE - C3 C2 C1 C0 RCM1 RCM0

Bit 12: Not used (reserved), fixed to “1” all the time. Bit 11: Not used (reserved), fixed to “0” all the time. Bit 10 (RESETENB): P81/RESET pin select bit

0 = P81 set as /RESET pin 1 = P81 is general purpose input pin or open drain for output port

(Default)

Bit 9 (RCOUT): System clock output enable bit in IRC or ERC mode

0 = OSCO pin is open drain 1 = OSCO output instruction clock (Default)

Bit 8 (NRHL): Noise rejection high/low pulse define bit. INT pin has a falling edge

trigger.

0 = Pulses equal to 8/fc are regarded as signal

1 = Pulses equal to 32/fc are regarded as signal (Default)

NOTE

NRHL and NRE are at Bank 3-R7, when using ICE.

Bit 7 (NRE): Noise rejection enable

0 = disable noise rejection 1 = enable noise rejection (default). However in Low Crystal oscillator

(LXT2) mode, the noise rejection circuit is always disabled.

NOTE

The noise rejection function is turned off in LXT2 and sleep mode.

Bit 6: Not used (Reserved). This bit is set to “1” all the time.

NOTE

C3, C2, C1, C0, RCM1 and RCM0 are at Bank 3-R6, when using ICE.

Bits 5~2 (C3~C0): Internal RC mode Calibration bits. These bits must always be set

to “1” only (auto calibration)

EM78P221/2N

8-Bit Microcontroller with OTP ROM

50 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

Bit 1 & Bit 0 (RCM1 & RCM0): RC mode selection bits

RCM 1 RCM 0 Frequency (MHz)

1 1 4 (Default)

1 0 16

0 1 1

0 0 455kHz

6.11.3 Customer ID Register (Word 2)

Word 2

Bit 12 Bit 11 Bit 10 Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

- NRM - - ID8 ID7 ID6 ID5 ID4 ID3 ID2 ID1 ID0

Bit 12: Not used (reserved), fixed to “0” all the time Bit 11 (NRM):

0 = Noise reject Mode 2. For multi-time circuit use, such as key scan

and LED output.

1 = Noise reject Mode 1. For General input or output use. (Default)

Bits 10~9: Not used (reserved), fixed to “1” all the time Bits 8 ~ 0: Customer’s ID code

6.12 Instruction Set

Each instruction in the instruction set is a 13-bit word divided into an OP code and one

or more operands. Normally, all instructions are executed within one single instruction

cycle (one instruction consists of 2 oscillator time periods). Note the program counter is

changed by instructions "MOV R2,A," "ADD R2,A," or by instructions of arithmetic or

logic operation on R2 (e.g., "SUB R2,A," "BS(C) R2,6," "CLR R2," etc.). In this case,

these instructions only need one instruction cycles

In addition, the instruction set has the following features:

1. Every bit of any register can be set, cleared, or tested directly.

2. The I/O registers can be regarded as general registers. That is, the same

instruction can operate on I/O registers.

Convention: R = Register designator that specifies which one of the registers (including operation and general purpose

registers) is to be utilized by the instruction.

b = Bit field designator that selects the value for the bit located in the register R and which affects the

operation.

k = 8 or 10-bit constant or literal value

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 51

(This specification is subject to change without further notice)

Binary Instruction HEX Mnemonic Operation

Status

Affected

0 0000 0000 0000 0000 NOP No Operation None

0 0000 0000 0001 0001 DAA Decimal Adjust A C

0 0000 0000 0010 0002 CONTW A → CONT None

0 0000 0000 0011 0003 SLEP 0 → WDT, Stop oscillator T, P

0 0000 0000 0100 0004 WDTC 0 → WDT T, P

0 0000 0001 0000 0010 ENI Enable Interrupt None

0 0000 0001 0001 0011 DISI Disable Interrupt None

0 0000 0001 0010 0012 RET [Top of Stack] → PC None

0 0000 0001 0011 0013 RETI [Top of Stack] → PC, Enable Interrupt None

0 0000 0001 0100 0014 CONTR CONT → A None

0 0000 01rr rrrr 00rr MOV R,A A → R None

0 0000 1000 0000 0080 CLRA 0 → A Z

0 0000 11rr rrrr 00rr CLR R 0 → R Z

0 0001 00rr rrrr 01rr SUB A,R R-A → A Z, C, DC

0 0001 01rr rrrr 01rr SUB R,A R-A → R Z, C, DC

0 0001 10rr rrrr 01rr DECA R R-1 → A Z

0 0001 11rr rrrr 01rr DEC R R-1 → R Z

0 0010 00rr rrrr 02rr OR A,R A ∨ VR → A Z

0 0010 01rr rrrr 02rr OR R,A A ∨ VR → R Z

0 0010 10rr rrrr 02rr AND A,R A & R → A Z

0 0010 11rr rrrr 02rr AND R,A A & R → R Z

0 0011 00rr rrrr 03rr XOR A,R A ⊕ R → A Z

0 0011 01rr rrrr 03rr XOR R,A A ⊕ R → R Z

0 0011 10rr rrrr 03rr ADD A,R A + R → A Z, C, DC

0 0011 11rr rrrr 03rr ADD R,A A + R → R Z, C, DC

0 0100 00rr rrrr 04rr MOV A,R R → A Z

0 0100 01rr rrrr 04rr MOV R,R R → R Z

0 0100 10rr rrrr 04rr COMA R /R → A Z

0 0100 11rr rrrr 04rr COM R /R → R Z

0 0101 00rr rrrr 05rr INCA R R+1 → A Z

EM78P221/2N

8-Bit Microcontroller with OTP ROM

52 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

Binary Instruction HEX Mnemonic Operation

Status

Affected

0 0101 01rr rrrr 05rr INC R R+1 → R Z

0 0101 10rr rrrr 05rr DJZA R R-1 → A, skip if zero None

0 0101 11rr rrrr 05rr DJZ R R-1 → R, skip if zero None

0 0110 00rr rrrr 06rr RRCA R R(n) → A(n-1), R(0) → C, C → A(7) C

0 0110 01rr rrrr 06rr RRC R R(n) → R(n-1), R(0) → C, C → R(7) C

0 0110 10rr rrrr 06rr RLCA R R(n) → A(n+1), R(7) → C, C → A(0) C

0 0110 11rr rrrr 06rr RLC R R(n) → R(n+1), R(7) → C, C → R(0) C

0 0111 00rr rrrr 07rr SWAPA R R(0-3) → A(4-7), R(4-7) → A(0-3) None

0 0111 01rr rrrr 07rr SWAP R R(0-3) ↔ R(4-7) None

0 0111 10rr rrrr 07rr JZA R R+1 → A, skip if zero None

0 0111 11rr rrrr 07rr JZ R R+1 → R, skip if zero None

0 100b bbrr rrrr 0xxx BC R,b 0 → R(b) None1

0 101b bbrr rrrr 0xxx BS R,b 1 → R(b) None2

0 110b bbrr rrrr 0xxx JBC R,b if R(b)=0, skip None

0 111b bbrr rrrr 0xxx JBS R,b if R(b)=1, skip None

1 00kk kkkk kkkk 1kkk CALL k

PC+1 → SP, (lower 10 bits of k ) → PC

None

1 01kk kkkk kkkk 1kkk JMP k (lower 10 bits of k) → PC None

1 1000 kkkk kkkk 18kk MOV A,k k → A None

1 1001 kkkk kkkk 19kk OR A,k A ∨ k → A Z

1 1010 kkkk kkkk 1Akk AND A,k A & k → A Z

1 1011 kkkk kkkk 1Bkk XOR A,k A ⊕ k → A Z

1 1100 kkkk kkkk 1Ckk RETL k k → A, [Top of Stack] → PC None

1 1101 kkkk kkkk 1Dkk SUB A,k k-A → A Z,C,DC

1 1110 1001 kkkk 1E9k BANK k k → R1(1:0) None

1 1110 1010 kkkk

k kkkk kkkk kkkk

1EAk

LCALL k

Next instruction: k kkkk kkkk kkkk;

PC+1 → [SP], k → PC

None

1 1110 1011 kkkk

k kkkk kkkk kkkk

1EBk

LJMP k

Next instruction: k kkkk kkkk kkkk;

k → PC

None

1 1111 kkkk kkkk 1Fkk ADD A,k k+A → A Z, C, DC

Note:

This instruction is not recommended for RF operation

This instruction cannot operate under RF.

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 53

(This specification is subject to change without further notice)

7 Absolute Maximum Ratings

Items Rating

Temperature under bias -40°C to 85°C

Storage temperature -65°C to 150°C

Input voltage Vss-0.3V to Vdd+0.5V

Output voltage Vss-0.3V to Vdd+0.5V

Working Voltage 2.3V to 5.5V

Working Frequency DC to 16MHz

8 DC Electrical Characteristics

Ta= 25°C, VDD= 5.0V, VSS= 0V

Symbol Parameter Condition Min. Typ. Max. Unit

Crystal: VDD to 5V Two cycles with two clocks DC − 16 MHz

FXT

ERC: VDD to 5V R: 5.1KΩ, C: 100 pF F±30% 850 F±30% kHz

VIHRC

Input High Threshold Voltage (Schmitt Trigger)

OSCI in RC mode −

3.75

− V

VILRC

Input Low Threshold Voltage (Schmitt Trigger)

OSCI in RC mode −

1.25

− V

IIL

Input Leakage Current for input pins

VIN = VDD, VSS –1.0

1.0 μA

VIH1

Input High Voltage (Schmitt Trigger)

Ports 5, 6, 7, 8 −

3.75

− V

VIL1

Input Low Voltage (Schmitt Trigger)

Ports 5, 6, 7, 8 −

1.25

− V

VIHT1

Input High Threshold Voltage (Schmitt Trigger)

/RESET −

1.9

− V

VILT1

Input Low Threshold Voltage (Schmitt Trigger)

/RESET −

1.2

− V

VIHT2

Input High Threshold Voltage (Schmitt Trigger)

TCC, INT −

3.75

− V

VILT2

Input Low Threshold Voltage (Schmitt Trigger)

TCC, INT −

1.25

− V

VIHX1 Clock Input High Voltage OSCI in crystal mode −

3.75

− V

VILX1 Clock Input Low Voltage OSCI in crystal mode −

1.25

− V

IOH1

Output High Voltage (Ports 5, 6, 7, 8)

VOH = 0.9VDD − -9 − mA

IOH2

Output High Voltage (Ports 6)

VOH = 0.7VDD − -27 − mA

IOL1

Output Low Voltage (Ports 5, 6, 7, 8 )

VOL = 0.1VDD − 16.8 − mA

IOL2

Output Low Voltage (Ports 5, 6)

VOL = 0.3VDD − 67.2 − mA

EM78P221/2N

8-Bit Microcontroller with OTP ROM

54 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

Symbol Parameter Condition Min. Typ. Max. Unit

IPH

Pull-high current (Ports 50~53, 64~67)

Pull-high active, input pin at VSS

50 − 90 μA

IPL

Pull-low current (Ports 60~67)

Pull-low active, input pin at Vdd

20 − 60 μA

ISB1 Power down current

All input and I/O pins at VDD, Output pin floating, LVR disabled WDT disabled,

− 2 − μA

ISB2 Power down current

All input and I/O pins at VDD, Output pin floating, LVR Disabled WDT enabled,

− 10 − μA

ISB3 Power down current

All input and I/O pins at VDD, Output pin floating, LVR enabled WDT disabled

− 4.0 − μA

ICC1

Operating supply current at two clocks (VDD=3V)

/RESET= 'High', Fosc=32kHz (Crystal type, CLKS="0"), Output pin floating, WDT disabled, LVR disabled

− 15 20 μA

ICC2

Operating supply current at two clocks (VDD=3V)

/RESET= 'High', Fosc=32kHz (Crystal type, CLKS="0"), Output pin floating, WDT enabled, LVR disabled

− 15 25 μA

ICC3

Operating supply current at two clocks (VDD=5V)

/RESET= 'High', Fosc=4MHz (Crystal type, CLKS="0"), Output pin floating, WDT enabled, LVR disabled

− 1.5 1.7 mA

ICC4

Operating supply current at two clocks (VDD=5V)

/RESET= 'High', Fosc=10MHz (Crystal type, CLKS="0"), Output pin floating, WDT enabled, LVR disabled

− 2.8 3.0 mA

Internal RC Electrical Characteristics (Ta=25°C, VDD=5 V, VSS=0V)

Drift Rate

Internal RC

Temperature Voltage Min. Typ. Max.

4MHz 25°C 5V 3.84MHZ 4MHz 4.16MHz

16MHz 25°C 5V 15.36MHz 16MHz 16.64MHz

1MHz 25°C 5V 0.96MHz 1MHz 1.04MHz

455kHz 25°C 5V 436.8kHz 455kHz 473.2kHz

Internal RC Electrical Characteristics (Ta=-40 ~85°C, VDD=2.1~5.5 V, VSS=0V)

Drift Rate

Internal RC

Temperature Voltage Min. Typ. Max.

4MHz -40~85°C 2.1~5.5V 3.44MHz 4MHz 4.56MHz

16MHz -40~85°C 2.1~5.5V 13.76MHz 16MHz 18.24MHz

1MHz -40~85°C 2.1~5.5V 0.86MHz 1MHz 1.14MHz

455kHz -40~85°C 2.1~5.5V 391.3kHz 455kHz 518.7kHz

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 55

(This specification is subject to change without further notice)

8.1 Comparator (OP) Characteristic

Vdd = 5.0V, Vss=0V, Ta=25°C

Symbol Parameter Condition Min. Typ. Max. Unit

VOS Input Offset Voltage RL = 5.1K Note1 − − 10 mV

Vcm

Input Common-Mode Voltage Range

Note 2 GND − VDD-1 V

IOS Input Offset Current − − − 50 nA

IBS Input Bias Current − − 25 250 nA

ICO Supply Current of Comparator − − 300 − μA

TRS Response Time

VREF=1.4V,VRL = 5V, RL = 5.1k, CL=15p, Note

0.5 1.3 3.5

μs

TLRS Large Signal Response Time VRL = 5V, RL = 5.1k

−

300

−

IOL Output Sink Current

Vi (-) =1V, Vi (+) =0V, Vo = GND+0.5V

−

VSAT Saturation Voltage Vi (-) =1V, Vi (+) =0V, IOL ≤ 4mA

−

0.2 0.4 V

VS Operating Range − 2.5 − 5.5 V

Note:

. The output voltage is in the unit gain circuitry and over the full input common-mode range.

. The input common-mode voltage or either input signal voltage should not be allowed to go negative by more than 0.3V.

The upper end of the common-mode voltage range is VDD-1.

. The response time specified is a 100mV input step with 5mV overdrive.

9 AC Electrical Characteristic

Ta=25°C, VDD=5V±5%, VSS=0V

Symbol Parameter Conditions Min Type Max Unit

Dclk Input CLK Duty Cycle − 45 50 55 %

Crystal type 100 − DC ns

Tins

Instruction Cycle Time (CLKS="0")

RC type 500 − DC ns

Ttcc TCC Input Time Period − (Tins+20) × N* − − ns

Tdrh Device Reset Hold Time Ta = 25°C 11.3 16.2 21.6 ms

Trst /RESET Pulse Width Ta = 25°C 2000 − − ns

Twdt Watchdog Timer Duration Ta = 25°C 11.3 16.2 21.6 ms

Tset Input Pin Setup Time − − 0 ns

Thold Input Pin Hold Time − 15 20 25 ns

Tdelay Output Pin Delay Time Cload=20pF 45 50 55 ns

Tdrc ERC Delay Time Ta = 25°C 1 3 5 ns

Note: *N = selected prescaler ratio

EM78P221/2N

8-Bit Microcontroller with OTP ROM

56 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

10 Timing Diagrams

RESET Timing (CLK="0")

CLK

/RESET

NOP

Instruction 1

Executed

Tdrh

TCC Input Timing (CLKS="0")

CLK

TCC

Ttcc

Tins

AC Testing : Input is driven at VDD-0.5V for logic "1",and GND+0.5V for logic "0".Timing

measurements are mad e at 0.75VDD for logic "1",and 0.25VDD for logic "0".

AC Test Input/Output Waveform

VDD-0.5V

GND+0.5V

0.75VDD

0.25VDD

TEST POINTS

0.75VDD

0.25VDD

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 57

(This specification is subject to change without further notice)

APPENDIX

A Package Type

OTP MCU Package Type Pin Count Package Size

EM78P221NKS/NKJ Skinny DIP 24 pins 300mil

EM78P221NMS/NMJ SOP 24 pins 300mil

EM78P221NAMS/NAMJ SSOP 24 pins 209mil

EM78P222NKS/NKJ Skinny DIP 28 pins 300mil

EM78P222NMS/NMJ SOP 28 pins 300mil

EM78P222NAMS/NAMJ SSOP 28 pins 209mil

Green products do not contain hazardous substances.

The third edition of Sony SS-00259 standard.

Pb contents should be less than 100ppm

Pb contents comply with Sony specs.

Part No. EM78P221/222/NxS/xJ

Electroplate Type Pure Tin

Ingredient (%) Sn: 100%

Melting Point (°C) 232°C

Electrical Resistivity (µΩ-cm)

11.4

Hardness (hv) 8~10

Elongation (%) >50%

EM78P221/2N

8-Bit Microcontroller with OTP ROM

58 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

B Packaging Configuration

B.1 24-Lead Plastic Skinny Dual in line (SDIP) — 300 mil

TITLE: PDIP-24L SKINNY 300MIL PACKAGE OUTLINE DIMENSION

Unit : mm

Scal e: F r ee

File :

K24

Material:

Edtion: A

Sheet:1 of 1

Min Normal Max

5.334

0.381

3.175 3.302 3.429

0.203 0.254 0.356

31.750 31.801 31. 852

6.426 6.628 6.830

7.370 7.620 7.870

8.380 8.950 9.520

0.356 0.457 0.559

1.470

1.520

1.630

3.048

3.302 3.556

2.540(TYP)

Symbal

A A1 A2

D E1

E e

B B1

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 59

(This specification is subject to change without further notice)

B.2 24-Lead Plastic Small Outline (SOP) — 300 mil

TITL E: SOP-24L (300MI L ) PA CKA GE OUTLINE DI MENSION

Unit : mm Scale: Free

File : SO24

Material:

Edtion: A

Sheet:1 of 1

Symbal

b c

E H D

Min Normal Max

2.350 2.650

0.102 0.300

0.406(TYP)

0.230 0.320

7.400 7.600

10.000 10. 650

15.200 15. 600

0.630 0. 838 1.100

1.27(TYP)

EM78P221/2N

8-Bit Microcontroller with OTP ROM

60 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

B.3 24-Lead Plastic Shrink Small Outline (SSOP) — 209 mil

TITL E: SSOP-24L( 209MI L) PACK AGE OUTLINE DIMENSION

Unit : mm Scale: Free

File : SSO24

Material:

Edtion: A

Sheet:1 of 1

Symbal Min Normal Max

2.00

0.05

1.65 1.75 1. 85

0.22 - 0.38

0.09 -

0.25

7.90

8.20 8.50

7.400

7.80

8.200

5.00

5.30

5.60

-0.65-

0.55

0.75

0.95

-1.25-

0°

8°

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 61

(This specification is subject to change without further notice)

B.4 28- Lead Plastic Skinny Dual in line (SDIP) — 300 mil

TITLE: PDIP-28L SKINNY 300MIL PACKAGE OUTLINE DIMENSION

Unit : mm Scale: Free

File : K28

Material:

Edtion: A

Sheet:1 of 1

Symbal

A A1 A2

B B1

Min Normal Max

5.334

0.381

3.175 3. 302 3.429

0.152

0.254

0.356

35.204 35. 255 35. 306

7.213 7. 315 7.417

7.620 7. 874 8.128

8.382 8. 890 9.398

0.356

0.457

0.559

1.422

1.524

1.626

3.251 3. 302 3.353

2.540(TYP)

010

EM78P221/2N

8-Bit Microcontroller with OTP ROM

62 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

B.5 28-Lead Plastic Small Outline (SOP) — 300 mil

TITLE: SOP-28L(300MIL) PACKAGE OUTLINE DIMENSION

Unit : mm Scale: Free

File : SO28

Material:

Edtion: A

Sheet:1 of 1

Symbal

b c E

Min Normal Max

2.370 2. 500 2.630

0.102 0.300

0.350 0. 406 0.500

0.254(TYP)

7.410 7. 500 7.590

10.000 10. 325 10.650

17.700 17. 900 18.100

0.678 0. 881 1.084

1.194 1. 397 1.600

1.27(TYP)

EM78P221/2N

8-Bit Microcontroller with OTP ROM

Product Specification (V1.0) 10.19.2007 • 63

(This specification is subject to change without further notice)

B.6 28- Lead Plastic Shrink Small Outline (SSOP) — 209 mil

TITLE: SSOP-28L(209MIL) OUTLINE PACKAGE PACKA OUTLINE DIMENSION

Unit : mm Scale: Free

File : SSO28

Material:

Edtion: A

Sheet:1 of 1

Min Normal Max

2.130

0.050 0.250

1.620 1. 750 1.880

0.220 0.380

0.090

0.200

7.400 7. 800 8.200

5.000 5. 300 5.600

9.900 10. 200 10.500

0.630 0. 900 1.030

0.650(TYP)

Symbal

A1 A2

D L

EM78P221/2N

8-Bit Microcontroller with OTP ROM

64 •

Product Specification (V1.0) 10.19.2007

(This specification is subject to change without further notice)

C Quality Assurance and Reliability

Test Category Test Conditions Remarks

Solderability

Solder temperature=245±5°C, for 5 seconds up to the stopper using a rosin-type flux

−

Step 1: TCT, 65°C (15 mins)~150°C (15 mins), 10 cycles

Step 2: Bake at 125°C, TD (endurance)=24 hrs

Step 3: Soak at 30°C/60% , TD (endurance)=192 hrs

Pre-condition

Step 4: IR flow 3 cycles (Pkg thickness: 2.5mm or

Pkg volume: 350mm

----225±5°C)

(Pkg thickness: 2.5mm or Pkg volume: 350mm

----240±5°C)

For SMD IC (such as SOP, QFP, SOJ, etc)

Temperature cycle test

-65°C (15 mins) ~ 150°C (15 mins), 200 cycles −

Pressure cooker test

TA =121°C, RH=100%, pressure=2 atm, TD (endurance)= 96 hrs

−

High temperature / High humidity test

TA=85°C, RH=85% , TD (endurance)=168, 500 hrs −

High-temperature storage life

TA=150°C, TD (endurance)=500, 1000 hrs −

High-temperature operating life

TA=125°C, VCC=Max. Operating Voltage, TD (endurance) =168, 500, 1000 hrs

−

Latch-up

TA=25°C, VCC=Max. operating voltage, 150mA/20V −

ESD (HBM)

TA=25°C, ± 3KV

ESD (MM)

TA=25°C, ± 300V

IP_ND,OP_ND,IO_ND IP_NS,OP_NS,IO_NS IP_PD,OP_PD,IO_PD, IP_PS,OP_PS,IO_PS, VDD-VSS(+),VDD_VS

S (-) mode

C.1 Address Trap Detect

An address trap detect is one of the MCU embedded fail-safe functions that detects

MCU malfunction caused by noise or the like. Whenever the MCU attempts to fetch an

instruction from a certain section of ROM, an internal recovery circuit is auto started. If

a noise caused address error is detected, the MCU will repeat execution of the program

until the noise is eliminated. The MCU will then continue to execute the next program.

IBM EM78P221/2N Specification

Specifications and Main Features

Frequently Asked Questions

User Manual