IBM System x3750 M4, E5-4600 Product Manual
I B M ®
IBM System x3750 M4
IBM Redbooks Product Guide
The IBM® System x3750 M4 is a 4-socket server featuring a streamlined design, optimized for price and
performance, with best-in-class flexibility and expandability. Models of the x3750 M4 are powered with
Intel Xeon E5-4600 processors, up to 8 cores each, for an entry-level 4-socket solution. The x3750 M4
provides maximum storage density, with flexible PCI and 10 Gb Ethernet networking options in a 2U form
factor.
Suggested uses
small to medium databases requiring fast I/O; applications that require 4-socket performance without
needing the scalability that the IBM eX5 systems provide.
Figure 1. The IBM System x3750 M4
: High performance computing (HPC), workloads with floating-point computations, and
Did you know
The x3750 M4 has outstanding memory performance that is achieved by supporting
three-RDIMM-per-channel configurations at speeds up to 25% faster than the Intel specification, while still
maintaining world-class IBM reliability. LR-DIMM speeds are also 25% beyond the Intel specification for
1.35 V DIMMs, and this speed improve not only performance, but reduces overall system power at the
same time.
The x3750 M4 offers a flexible, scalable design and simple upgrade path to 16 hard-disk drives (HDDs) or
32 IBM eXFlash solid-state drives (SSDs), with up to eight PCIe Gen 3 slots and up to 1.5 TB of memory.
The flexible embedded Ethernet solution provides two standard Gigabit Ethernet ports onboard, along
with a dedicated 10 GbE slot that allows for a choice of either two copper or two fiber optic connections.
Comprehensive systems management tools with the next-generation Integrated Management Module II
(IMM2) make it easy to deploy, integrate, service, and manage.
IBM System x3750 M4 1
Key features
The IBM System x3750 M4 blends outstanding flexibility and expandability. The x3750 M4 2+2 socket
design enables pay-as-you-grow processing with the new Intel Xeon E5-4600 series processors and
memory scalability to help lower cost and manage growth. The 5+3 PCIe socket design allows you to pay
for PCIe capabilities as needed.
With the capability to support up to 48 DIMMs, four sockets, mix and match internal storage with up to 16
HDDs or 32 eXFlash SSD drives, 6 hot-swap dual rotor fans, two power supplies, and integrated 10 GbE
networking with options for fiber or copper, the x3750 M4 provides unmatched features and capabilities in
a dense 2U design.
Scalability and performance
The x3750 M4 offers numerous features to boost performance, improve scalability, and reduce costs:
The Intel Xeon processor E5-4600 product family improves productivity by offering superior system
performance with 8-core processors and up to 2.9 GHz core speeds, up to 20 MB of L3 cache, and up
to two 8 GTps QPI interconnect links.
The x3750 M4 2+2 processor socket design enables pay-as-you-grow processing with the Intel new
Xeon E5-4600 series processors and memory scalability to help lower cost and manage growth.
Up to four processors, 32 cores, and 64 threads maximize the concurrent execution of multithreaded
applications.
Intelligent and adaptive system performance with Intel Turbo Boost Technology 2.0 allows processor
cores to run at maximum speeds during peak workloads by temporarily going beyond processor TDP.
Intel Hyper-Threading Technology boosts performance for multithreaded applications by enabling
simultaneous multithreading within each processor core, up to two threads per core.
Intel Virtualization Technology integrates hardware-level virtualization hooks that allow operating
system vendors to better use the hardware for virtualization workloads.
Intel Advanced Vector Extensions (AVX) improve floating-point performance for compute-intensive
technical and scientific applications compared to Intel Xeon 5600 series processors.
The outstanding RDIMM memory performance of the x3750 M4 is achieved by supporting three
DIMMs per channel configurations at speeds up to 25% faster than the Intel specification.
48 Load Reduced DIMMs (LRDIMMs) of 1333 MHz DDR3 ECC memory provide speed, high
availability, and a memory capacity of up to 1.5 TB.
LR-DIMM speeds implemented in the x3750 M4 are also 25% beyond the Intel specification at 1.35 V
for one, two, and three DIMM per channel configurations. This configuration improves performance
and reduces overall system power at the same time, all while maintaining reliability
The use of IBM eXFlash solid-state drives (SSDs) instead of, or along with, traditional spinning drives
(HDDs), can improve I/O performance. An SSD can support up to 100 times more I/O operations per
second (IOPS) than a typical HDD.
Up to 16 HDDs or 32 eXFlash SSDs, together with an optical drive at the same time, provide a
flexible and scalable all-in-one platform to meet your increasing demands.
The server offers a SAS switch backplane option (88Y7421) to allow up to 16 SFF devices to attach
to a single controller.
The server has two integrated Gigabit Ethernet ports and two optional 10 Gb Ethernet ports that do
not consume PCIe slots.
The 5+3 PCI Express socket design of the server allows you to pay for PCIe capabilities as needed.
IBM System x3750 M4 2
The server offers PCI Express 3.0 I/O expansion capabilities that improve the theoretical maximum
bandwidth by almost 100% (8 GTps per link using 128b/130b encoding) compared to the previous
generation of PCI Express 2.0 (5 GTps per link using 8b/10b encoding).
With Intel Integrated I/O Technology, the PCI Express 3.0 controller is integrated into the Intel Xeon
processor E5 family. This integration reduces I/O latency and increases overall system performance.
Availability and serviceability
The x3750 M4 provides many features to simplify serviceability and increase system uptime:
The server offers Chipkill, memory mirroring and memory rank sparing for redundancy in the event of
a memory failure.
The server provides restart recovery for any failed processor. In the event of a failure of processor 1,
the server connects the southbridge to processor 2 for reboot.
Tool-less cover removal provides easy access to upgrades and serviceable parts, such as the
processor, memory, and adapter cards.
The server offers hot-swap drives, supporting RAID redundancy for data protection and greater
system uptime.
The server has up to two redundant hot-swap power supplies and six hot-swap dual-rotor N+N
redundant fans to provide availability for business-critical applications.
The power source independent light path diagnostics panel and individual light path LEDs lead the
technician to failed (or failing) components, which simplifies servicing, speeds up problem resolution,
and helps improve system availability.
The x3750 M4 provides error checking and/or Predictive Failure Analysis (PFA) on the following
components. Alerts are generated in advance of a possible failure, therefore increasing uptime.
Memory ECC correction (Chipkill technology)
Microprocessor built-in self test (BIST) and internal error checking
PCIe Bus parity checking
SAS Bus Parity
HDD and SSD drive CRC checking
Diskette CRC checking
USB CRC checking
Over temperature detection
Over/under voltage detection
Power supply error checking
Fan failure detection
Serial interface parity, overrun, and frame checking
Solid-state drives (SSDs) offer more reliability than traditional mechanical HDDs for greater uptime.
The built-in Integrated Management Module Version II (IMM2) continuously monitors system
parameters, triggers alerts, and performs recovery actions in case of failures to minimize downtime.
Built-in diagnostics, using Dynamic Systems Analysis (DSA) Preboot, speed up troubleshooting tasks
to reduce service time.
Three-year customer-replaceable unit and on-site limited warranty, 9 x 5 next business day. Optional
service upgrades are available.
IBM System x3750 M4 3
Manageability and security
Powerful systems management features simplify local and remote management of the x3750 M4:
The server includes an Integrated Management Module II (IMM2) to monitor server availability and
perform remote management. Remote presence support is standard.
The integrated industry-standard Unified Extensible Firmware Interface (UEFI) enables improved
setup, configuration, and updates, and simplifies error handling.
Integrated Trusted Platform Module (TPM) 1.2 support enables advanced cryptographic functionality,
such as digital signatures and remote attestation.
Industry-standard Advanced Encryption Standard (AES) NI support for faster, stronger encryption.
IBM Systems Director is included for proactive systems management. It offers comprehensive
systems management tools that increases uptime, reduces costs, and improves productivity through
advanced server management capabilities.
Intel Execute Disable Bit functionality can prevent certain classes of malicious buffer overflow attacks
when combined with a supported operating system.
Intel Trusted Execution Technology provides enhanced security through hardware-based resistance
to malicious software attacks, allowing an application to run in its own isolated space, protected from
all other software running on a system.
Energy efficiency
The x3750 M4 offers the following energy-efficiency features to save energy, reduce operational costs,
increase energy availability, and contribute to a green environment:
Energy-efficient planar components help lower operational costs.
Highly efficient 750 W DC, 900 W AC, and 1400 W AC power supplies. 80 PLUS Platinum
certification at high voltage AC.
The Intel Xeon processor E5-4600 product family offers better performance over the previous
generation while fitting into the same thermal design power (TDP) limits.
Intel Intelligent Power Capability powers individual processor elements on and off as needed, to
reduce power draw.
Low-voltage Intel Xeon processors draw less energy to satisfy the demands of power and thermally
constrained data centers and telecommunication environments.
Low-voltage 1.35 V DDR3 memory RDIMMs consume 19% less energy compared to 1.5 V DDR3
RDIMMs.
Solid-state drives (SSDs) consume as much as 80% less power than traditional spinning 2.5-inch
HDDs.
The server uses hexagonal ventilation holes, which is a part of IBM Calibrated Vectored Cooling™
technology. Hexagonal holes can be grouped more densely than round holes, providing more efficient
airflow through the system.
IBM Systems Director Active Energy Manager™ provides advanced data center power notification and
management to help achieve lower heat output and reduced cooling needs.
IBM System x3750 M4 4
Locations of key components and connectors
The following figure shows the front of the server.
Figure 2. Front view of the IBM System x3750 M4
The following figure shows the rear of the server.
Figure 3. Rear view of the IBM System x3750 M4
IBM System x3750 M4 5
The following figure shows the locations of key components inside the server.
Figure 4. Inside view of the IBM System x3750 M4
IBM System x3750 M4 6
Standard specifications
The following table lists the standard specifications.
Table 1. Standard specifications (part 1)
Components Specification
Form factor 2U rack.
Processor Up to four Intel Xeon processor E5-4600 product family processors, each with eight cores (up to
2.7 GHz), six cores (up to 2.9 GHz), or four cores (up to 2.0 GHz). Two processor sockets on
the system board and two processors on the processor and memory expansion tray (standard
on most models). Two QPI links up to 8.0 GTps each. Up to 1600 MHz memory speed. Up to 20
MB L3 cache per processor.
Chipset Intel C600 series.
Memory Up to 48 DIMM sockets (12 DIMMs per processor). RDIMMs and LRDIMMs (Load Reduced
DIMMs) are supported, but memory types cannot be intermixed. The memory speed is up to
1600 MHz. There are 24 DIMM sockets on the system board. There are an additional 24 DIMM
sockets on the processor and memory expansion tray (standard on most models).
Memory
maximums
Memory
With RDIMMs: Up to 768 GB with 48x 16 GB RDIMMs and four processors,
With LRDIMMs: Up to 1.5 TB with 48x 32 GB LRDIMMs and four processors.
ECC, Chipkill (for x4-based memory DIMMs), memory mirroring, and memory sparing.
protection
Disk drive bays Up to 16 2.5-inch hot-swap SAS/SATA bays or up to 32 1.8-inch hot-swap solid-state drive
(SSD) eXFlash bays. Drive bays can be in any combination of four 2.5-inch drives or eight
1.8-inch eXFlash SSD drives.
Maximum
internal storage
Up to 14.4 TB with 900 GB 2.5-inch SAS HDDs, up to 16 TB with 1 TB 2.5-inch NL SAS/SATA
HDDs, or up to 16 TB of SSDs using 512 GB 1.8-inch drives. An intermix of SAS/SATA is
supported.
RAID support RAID 0, 1, 10 with integrated ServeRAID M5110e with LSI SAS2208 6 Gbps RAID on Chip
(ROC) controller. Optional upgrades to RAID 5 and 50 are available (zero-cache is 512 MB and
battery-backed cache is 512 MB or 1 GB flash-backed cache). There is an optional upgrade to
RAID 6 and 60 for a 512 MB or 1 GB cache.
Optical drive
There is one bay for an optional Multiburner drive.
bays
Tape drive bays None internal. Use a supported external tape drive.
Network
interfaces
Emulex BE3 controller with two standard integrated Gigabit Ethernet 1000BASE-T ports (RJ-45)
and two optional 10 Gb ports through an adapter in a dedicated slot. The 10 GbE options are
10Base-T dual port (copper) or SFP+ dual port (fiber).
PCI Expansion
slots
Up to eight slots, five on the system board, three on an optional riser card. The slots are as
follows:
Slot 1: PCIe 3.0 x8; full-height, half-length (optional with riser card, requires processor 2)
Slot 2: PCIe 3.0 x8; full-height, half-length (optional with riser card, requires processor 2)
Slot 3: PCIe 3.0 x8; full-height, half-length (optional with riser card, requires processor 2)
Slot 4: PCIe 3.0 x8; low profile (requires processor 2)
Slot 5: PCIe 3.0 x8; low profile (requires processor 2)
Slot 6: PCIe 3.0 x8; low profile
Slot 7: PCIe 3.0 x8; low profile
Slot 8: PCIe 3.0 x8; low profile
Slots 1, 2, and 3 are physically x16 slots.
IBM System x3750 M4 7
Table 1. Standard specifications (part 2)
Components Specification
Ports Front: Two USB 2.0 and one DB-15 video on front. Rear: Two USB 2.0, one DB-15 video, one
DB-9 serial, one RJ-45 systems management ports, two RJ-45 1 GbE network ports, two
optional RJ-45 or SFP+ 10 GbE network ports. Internal: Two internal USB ports (for the
embedded hypervisor).
Cooling IBM Calibrated Vectored Cooling with up to six N+N redundant hot swap fans (all six standard);
each fan has two rotors.
Power supply Up to two hot-swap redundant 1400 W AC power supplies (80 PLUS Platinum certification). 900
W AC and 750W DC power supplies also available through CTO or Special Bid. A second power
supply requires that the processor expansion tray (88Y7365) or the power interposer card
(88Y7367) be installed.
Video Matrox G200eR2 with 16 MB memory integrated into the IMM2. Maximum resolution is
1600x1200 at 75 Hz with 16 M colors.
Hot-swap parts Hard drives, power supplies, and fans.
Systems
management
Security
features
Operating
systems
supported
Limited
warranty
Service and
support
Dimensions Height: 86 mm (3.4 in.), width: 445 mm (17.5 in.), depth: 746 mm (29.4 in.)
Weight Minimum configuration: 25 kg (55 lb.), maximum: 30 kg (65 lb.)
UEFI, IBM Integrated Management Module II (IMM2), Predictive Failure Analysis, Light Path
Diagnostics, Automatic Server Restart, IBM Systems Director and Active Energy Manager, and
the IBM ServerGuide. IMM Advanced Upgrade software feature for remote presence are
standard with the x3750 M4.
Power-on password, administrator's password, Trusted Platform Module (TPM).
Microsoft Windows Server 2008 R2 and 2008, Red Hat Enterprise Linux 5 and 6, SUSE Linux
Enterprise Server 10 and 11, VMware ESX 4.1 and VMware ESXi 4.1 embedded hypervisor,
and VMware vSphere 5.
Three-year customer-replaceable unit and on-site limited warranty with 9x5 next business day
(NBD).
Optional service upgrades are available through IBM ServicePac® offerings: Four-hour or
two-hour response time, eight-hour fix time, one-year or two-year warranty extension, remote
technical support for IBM hardware and some IBM and third-party applications.
The x3750 M4 servers are shipped with the following items:
Statement of Limited Warranty
Important Notices
Rack Installation Instructions
Documentation CD that contains the
IBM Systems Director 6.3 Base for x86 DVD-ROM
IBM System x® Gen-III Slides Kit
IBM System x Gen-III Cable Management Arm (CMA)
2.8 m (9.2 ft.) C13-C14 power cord (one for models with one power supply, and two for models with
Installation and User's Guide
two power supplies)
IBM System x3750 M4 8
Standard models
The following table lists the standard models.
Table 2. Standard models
Model Intel Xeon processor†
(four maximum)*
Models announced May 2012
8722-A1x 2x E5-4617 6C 2.9 GHz
15 MB 1600 MHz 130W
8722-A2x 1x E5-4603 4C 2.0 GHz
10 MB 1066 MHz 95W*
8722-A3x 2x E5-4607 6C 2.2 GHz
12 MB 1066 MHz 95W
8722-B1x 2x E5-4610 6C 2.4 GHz
15 MB 1333 MHz 95W
8722-B2x 2x E5-4620 8C 2.2 GHz
16 MB 1333 MHz 95W
8722-C1x 2x E5-4640 8C 2.4 GHz
20 MB 1600 MHz 95W
8722-C2x 2x E5-4650 8C 2.7 GHz
20 MB 1600 MHz 130W
8722-D1x 4x E5-4610 6C 2.4 GHz
15 MB 1333 MHz 95W
8722-D2x 4x E5-4650 8C 2.7 GHz
20 MB 1600 MHz 130W
Memory RAID controller Hot-swap
2x 8 GB RDIMM
1600 MHz
1x 8 GB RDIMM
1333 MHz
2x 8 GB RDIMM
1333 MHz
2x 8 GB RDIMM
1333 MHz
2x 8 GB RDIMM
1333 MHz
2x 8 GB RDIMM
1333 MHz
2x 8 GB RDIMM
1333 MHz
24x 8 GB RDIMM
1333 MHz
24x 16GB
LRDIMM
1333 MHz
M5110e 4x 2.5"
M5110e Open Open 5 / 8 2 1x
M5110e 4x 2.5"
M5110e 4x 2.5"
M5110e 8x 1.8"
M5110e
(1 GB,F,R5)‡
M5110e
(1 GB,F,R5)‡
M5110e +
1xM5110
(512,B,R5,SSD)§
M5110e +
3xM5110
(512,B,R5,SSD)§
disk bays
16 max
16 max
16 max
32 max
4x 2.5"
16 max
4x 2.5"
16 max
16x 1.8"
32 max
32x 1.8"
32 max
Disks PCIe GbE Power
Open 5 / 8 2 1x
Open 5 / 8 2 1x
Open 5 / 8 2 1x
Open 8 / 8 2 1x
Open 8 / 8 2 1x
Open 5 / 8 2 1x
16x
200G
SSD
32x
200G
SSD
8 / 8 2 2x
8 / 8 2 2x
supply
1400W
1400W
1400W
1400W
1400W
1400W
1400W
1400W
1400W
† Processor detail: Processor quantity and model, cores, core speed, L3 cache, memory speed, and power
consumption.
* All models except for 8722-A2x include the processor and memory expansion tray containing sockets for
processors 3 and 4 and 24 DIMMs. For model A2x, order part number 88Y7365.
‡ Models C1x and C2x include the 1 GB Flash/RAID 5 Upgrade (part number 81Y4559) which is a 1 GB
flash-backed cache with support for RAID 5.
§ Model D1x has two RAID controllers, D2x has four RAID controllers total. D1x and D2x include the 512 MB
Cache/RAID 5 Upgrade (81Y4484), plus the Battery Kit (81Y4508), plus the SSD Performance Key (90Y4273) for
each controller.
Refer to the Standards specifications section for information about the standard features of the server.
IBM System x3750 M4 9
Processor options
The x3750 M4 supports the processor options listed in the following table. The server supports up to four
processors. Two processors are installed in sockets on the system board. Processors 3 and 4 are
installed on the processor and memory expansion tray. Most models (with the exception of A2x, as listed
in Table 2) have the expansion tray installed as standard. For model A2x, order part number 88Y7365 for
the processor and memory expansion tray.
The following processor quantities are supported:
One processor, installed in socket 1
Two processors, installed in sockets 1 and 2
Four processors, installed in all four sockets
The following table also shows which server models have each processor standard. If there is no
corresponding
Table 3. Processor options
Part number Description Standard models
88Y7365 IBM System x3750 M4 processor and memory expansion tray All except A2x
88Y7446 Intel Xeon E5-4603 4C 2.0 GHz 10 MB 1066 MHz 95 W A2x
88Y7342 Intel Xeon E5-4607 6C 2.2 GHz 12 MB 1066 MHz 95 W A3x
where-used
model for a particular processor, this processor is only available through CTO.
where used
88Y7336 Intel Xeon E5-4610 6C 2.4 GHz 15 MB 1333 MHz 95 W B1x and D1x
88Y7354 Intel Xeon E5-4617 6C 2.9 GHz 15 MB 1600 MHz 130 W A1x
88Y7330 Intel Xeon E5-4620 8C 2.2 GHz 16 MB 1333 MHz 95 W B2x
88Y7348 Intel Xeon E5-4640 8C 2.4 GHz 20 MB 1600 MHz 95 W C1x
88Y7324 Intel Xeon E5-4650 8C 2.7 GHz 20 MB 1600 MHz 130 W C2x and D2x
88Y7458 Intel Xeon E5-4650L 8C 2.6 GHz 20 MB 1600 MHz 115 W -
Memory options
IBM DDR3 memory is compatibility tested and tuned for optimal System x performance and throughput.
IBM memory specifications are integrated into the light path diagnostics for immediate system
performance feedback and optimum system uptime. From a service and support standpoint, IBM memory
automatically assumes the IBM system warranty, and IBM provides service and support worldwide.
The IBM System x3750 M4 supports DDR3 memory. The server supports up to 48 DIMMs when four
processors are installed, with 12 DIMMs for each processor. 24 DIMM sockets (for processors 1 and 2)
are located on the system board. The remaining DIMM sockets (for processors 3 and 4) are located on the
processor and memory expansion tray. Each processor has four memory channels, and there are three
DIMMs per channel.
The x3750 M4 memory system has been carefully tuned so that the server supports higher memory
frequencies than the Intel processor specification. You can, for example, use low-voltage DIMMs but still
operate them at the rated speed.
IBM System x3750 M4 10
The following rules apply when selecting the memory configuration:
The server supports RDIMMs and LRDIMMs. UDIMMs are not supported.
Mixing different types of memory (RDIMMs and LRDIMMs) is not supported.
Mixing 1.5 V and 1.35 V DIMMs in the same server is supported; in such a case, all DIMMs operate at
1.5 V.
The maximum number of ranks per one channel is eight (with the exception of Load Reduced DIMMs,
where more than eight ranks are supported, because one quad-rank LRDIMM provides the same
electrical load on a memory bus as a single-rank RDIMM).
The maximum quantity of DIMMs that can be installed in the server depends on the number of
processors installed. The table shows the maximum when all four processors are installed. When two
processors are installed, the maximum quantity supported is a half of the quantity that is shown.
All DIMMs in the server operate at the same speed, which is determined as the lowest value of:
Memory speed that is supported by the specific processor.
Lowest of maximum operating speeds for selected memory configuration that depends on rated
speed, operating voltage, and quantity of DIMMs per channel, as shown under "Max. operating
speed" section in the table.
Table highlighting:
The entries highlighted in red text indicate that the IBM System x3750 M4 supports higher memory
frequencies than the Intel processor specification. In some instances, this configuration also results
larger memory capacity that the specification recommends.
Tables cells highlighted with a grey background indicate when the specific combination of DIMM
voltage and number of DIMMs per channel still allows the DIMMs to operate at rated speed
Table 4. Maximum memory speeds
DIMM specification RDIMM LRDIMM
Ranks Single-rank DIMMs Dual-rank DIMMs Quad-rank LRDIMMs
Part numbers 49Y1406 (4 GB) 49Y1559
Rated speed 1333 MHz 1600 MHz 1333 MHz 1600 MHz 1333 MHz
Rated voltage 1.35 V 1.5 V 1.35 V 1.5 V 1.35 V
Operating voltage 1.35 V 1.5 V 1.5 V 1.35 V 1.5 V 1.5 V 1.35 V 1.5 V
Max. qty supported* 48 48 48 48 48 48 48 48
Max. DIMM capacity 4 GB 4 GB 4 GB 16 GB 16 GB 16 GB 32 GB 32 GB
Max. mem. capacity 192 GB 192 GB 192 GB 768 GB 768 GB 768 GB 1.5 TB 1.5 TB
Max memory at
maximum speed
Max operating speed (MHz)
1 DIMM per channel 1333 MHz 1333 MHz 1600 MHz 1333 MHz 1333 MHz 1600 MHz 1333 MHz 1333 MHz
2 DIMMs per channel 1333 MHz 1333 MHz 1600 MHz 1333 MHz 1333 MHz 1600 MHz 1333 MHz 1333 MHz
128 GB 128 GB 128 GB 512 GB 768 GB 512 GB 1.5 TB 1.5 TB
(4 GB)
49Y1397 (8 GB)
49Y1563 (16 GB)
90Y3109 (8 GB)
00D4968 (16 GB)
49Y1567 (16 GB)
90Y3105 (32 GB)
3 DIMMs per channel 1066 MHz 1066 MHz 1066 MHz 1066 MHz 1333 MHz 1333 MHz 1333 MHz 1333 MHz
* Maximum quantity supported is shown for four processors installed. When two processors are installed, the
maximum quantity supported is a half of the quantity that is shown. When one processor is installed, the quantity is
one quarter of that shown.
IBM System x3750 M4 11
The following memory protection technologies are supported:
ECC
Chipkill (for x4-based memory DIMMs -- look for "x4" in the DIMM description)
Memory mirroring
Memory rank sparing
If memory mirroring is used, then DIMMs must be installed in pairs (minimum of one pair per CPU), and
both DIMMs in a pair must be identical in type and size.
If memory rank sparing is used, then a minimum of one quad-rank DIMM or two single-rank or dual-rank
DIMMs must be installed per populated channel (the DIMMs do not need being identical). In rank sparing
mode, one rank of a DIMM in each populated channel is reserved as spare memory. The size of a rank
varies depending on the DIMMs installed.
The following table lists the memory options that are available for the x3750 M4 server.
Table 5. Memory options
Part
number
RDIMMs
49Y1406 8941 4 GB (1x 4 GB, 1Rx4, 1.35 V) PC3L-10600 CL9 ECC DDR3
49Y1559 A28Z 4 GB (1x 4 GB, 1Rx4, 1.5 V) PC3-12800 CL11 ECC DDR3
49Y1397 8923 8 GB (1x 8 GB, 2Rx4, 1.35 V) PC3L-10600 CL9 ECC DDR3
90Y3109 A292 8 GB (1x 8 GB, 2Rx4, 1.5 V) PC3-12800 CL11 ECC DDR3
49Y1563 A1QT 16 GB (1x 16 GB, 2Rx4, 1.35 V) PC3L-10600 CL9 ECC DDR3
00D4968 A2U5 16 GB (1x 16 GB, 2Rx4, 1.5 V) PC3-12800 CL11 ECC DDR3
LRDIMMs
49Y1567 A290 16 GB (1x 16 GB, 4Rx4, 1.35 V) PC3L-10600 CL9 ECC DDR3
90Y3105 A291 32 GB (1x 32 GB, 4Rx4, 1.35 V) PC3L-10600 CL9 ECC DDR3
Feature
code
Description Maximum
1333 MHz LP RDIMM
1600 MHz LP RDIMM
1333 MHz LP RDIMM
1600 MHz LP RDIMM
1333 MHz LP RDIMM
1600 MHz LP RDIMM
1333 MHz LP LRDIMM
1333 MHz LP LRDIMM
supported
48 (12 per
CPU)
48 (12 per
CPU)
48 (12 per
CPU)
48 (12 per
CPU)
48 (12 per
CPU)
48 (12 per
CPU)
48 (12 per
CPU)
48 (12 per
CPU)
Models
where
used
-
-
All other
models
A1x
-
-
D2x
-
IBM System x3750 M4 12
Internal storage
The server can support up to 16x 2.5-inch drives, up to 32x 1.8-inch drives, or a combination of both
2.5-inch and 1.8-inch hot-swap drives, using the supported SAS/SATA backplane configurations. The
server supports 2.5-inch hot-swap SAS or hot-swap SATA hard disk drives, 2.5-inch hot-swap SATA
solid-state drives, or 1.8-inch hot-swap SATA solid-state drives. You can mix drives in the same server as
long as you do not mix drives on the same array.
Backplanes
IBM System x3750 M4 server supports a variety of internal storage configurations based on four different
backplanes:
4-drive backplane for 2.5-inch drives: Up to four backplanes can be installed, each requiring one SAS
connection to a supported controller. One RAID controller can connect to two of these backplanes.
8-drive backplane for 2.5-inch drives: Up to two backplanes can be installed, each requiring two SAS
connections. One RAID controller per backplane.
8-drive backplane with a SAS expander for 2.5-inch drives: Use in conjunction with the other 2.5-inch
drive backplanes (8-drive or one 4-drive or two 4-drive backplanes) which will result in being able to
connect up to 16 2.5-inch drive bays to the one RAID controller.
8-drive backplane for 1.8-inch solid-state drives (eXFlash Pack): Up to four backplanes can be
installed, each requiring two SAS connections. One RAID controller per backplane. Cannot be
connected to the 8-drive backplane with a SAS expander.
When building drive backplane configurations, all 1.8-inch SSD drive backplanes must be installed to the
right of all 2.5-inch HDD or 2.5-inch SSD drive backplanes (when looking at the front of the server). Every
four drives uses a SAS signal cable except when the 8-drive backplane with SAS expander is used. When
the 8-drive backplane with SAS expander is used, the other backplanes connect to the SAS expander
backplane with the supplied cables and then the SAS expander backplane is connected to the single
RAID controller with two cables. All backplane options include the necessary cables.
See the
IBM System x3750 M4 Installation and Service Guide
for a description of all supported backplane
combinations.
Standard models (all models except A2x) ship with at least one backplane; see Table 2 for details. The
following table shows the backplane options that are available for a x3750 M4 server.
Table 6. Internal storage expansion options
Part number Feature
code
88Y7418 A2A3 IBM 4x 2.5-in. HS SAS HDD Backplane 4
88Y7419 A2A4 IBM 8x 2.5-in. HS SAS HDD Backplane 2
88Y7421 A2A2 IBM 8x 2.5-in. HS SAS HDD Backplane
88Y7422 A2XR IBM eXFlash 8x 1.8-in. HS SAS SSD Backplane 4
* Only one backplane with SAS expander (88Y7421) can be installed in a server and can be used connected to a
single 8-drive backplane (88Y7419), a single 4-drive backplane (88Y7418), or two 4-drive backplanes (88Y7418).
The SAS expander backplane cannot be used with the eXFlash backplane.
Name Maximum
supported
1*
with RAID expansion (SAS expander)
IBM System x3750 M4 13
Controllers for internal storage
The following table lists the RAID controllers and SAS HBAs used for the internal disk storage of the
x3750 M4 server.
Table 7. RAID controllers for internal storage
Part number Feature
code
Integrated A2N2 ServeRAID M5110e SAS/SATA Controller 1 (integrated) All
81Y4481
81Y4448
46M0912 3876 IBM 6Gb Performance Optimized HBA 3 -
46C8988 A3MW N2115 SAS/SATA HBA for IBM System x 3 -
A347
A1MZ
Description Maximum
supported
ServeRAID M5110 SAS/SATA Controller 3 D1x (1 standard)
ServeRAID M1115 SAS/SATA Controller 1 -
Models
where used
D2x (3 standard)
The integrated ServeRAID M5110e SAS/SATA Controller is a chip on the system board. The ServeRAID
M5110 is a PCIe low-profile, half-length (MD2) form factor adapter. Both controllers have the following
specifications:
Two Mini-SAS internal connectors.
6 Gbps throughput per port.
PCIe x8 2.0 host interface.
Based on the LSI SAS2208 6 Gbps ROC controller.
Supports RAID levels 0, 1, and 10.
Supports RAID levels 5 and 50 with optional M5100 Series RAID 5 upgrades (see below).
Supports RAID 6 and 60 with the optional M5100 Series RAID 6 Upgrade (see below).
Supports 512 MB battery-backed cache or 512 MB or 1 GB flash-backed cache (see below).
The ServeRAID M1115 offers a low-cost RAID 0/1/10 solution that can be upgraded to a cacheless RAID
5 with a Features-on-Demand license upgrade. It has the following specifications:
PCI Low Profile, Half-length - MD2 form factor
Two internal Mini-SAS connectors (SFF-8087)
Eight internal 6 Gbps SAS/SATA ports
6 Gbps throughput per port
533 MHz IBM PowerPC® processor with LSI SAS2008 6 Gbps RAID on Chip (ROC) controller
PCI Express 2.0 x8 host interface
Support for RAID levels 0, 1, and 10 standard; support for RAID 5 and 50 with an optional upgrade
(81Y4542)
Zero Controller Cache, no battery/flash backup
For more information, see the list of IBM Redbooks Product Guides in the RAID adapters category:
http://www.redbooks.ibm.com/portals/systemx?Open&page=pg&cat=raid
Note: The supported adapters for internal storage need to be installed in slots 1, 2 and 3 because of cable
routing requirements. The IBM x3750 M4 PCIe 3x8 riser (88Y7371) must be installed. These slots also
require that Processor 2 be installed.
IBM System x3750 M4 14
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