Huawei U8185 Maintenance Manual

U8185

Maintenance Manual

Issue

1.0

Date

2012-03-23

HUAWEI TECHNOLOGIES CO., LTD.

Issue 1.0 (2012-03-23)

Huawei Proprietary and Confidential

i

No part of this document may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd.

Trademarks and Permissions

and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.

All other trademarks and trade names mentioned in this document are the property of their respective holders.

Notice

The purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specified in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied.

The information in this document is subject to change without notice. Every effort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.

Huawei Technologies Co., Ltd.

Address:

Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China

Website:

http://www.huawei.com

Email:

support@huawei.com

U8185 Maintenance Manual

About This Document

Issue 1.0 (2012-03-23)

Huawei Proprietary and Confidential

ii

Purpose

Prepared by

R&D

Date

2012-03-20

Reviewed by

Maintenance support team

Date

2012-03-23

Approved by

Service representative

Date

2012-03-23

Date

Version

Change Reason

Section

Description

Author

2012-03-20

V1.0

Released the first issue.

R&D

About This Document

Change History

U8185 Maintenance Manual

Contents

Issue 1.0 (2012-03-23)

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Contents

About This Document.................................................................................................................... ii

1 Product Introduction ...................................................................................................................... 1

1.1 Appearance..........................................................................................................................................................................1

1.2 Specifications .....................................................................................................................................................................1

2 Applicable Scope and Precautions ................................................................................................. 4

2.1 Applicable Scope ...............................................................................................................................................................4

2.2 Precautions ..........................................................................................................................................................................4

2.3 How to Obtain Product and Repair Information ..........................................................................................................4

3 Exploded View ................................................................................................................................. 5

4 Components on the PCBA.............................................................................................................. 7

5 Software Upgrade ......................................................................................................................... 10

5.1 Upgrade Preparation........................................................................................................................................................10

5.2 Upgrade Procedure ..........................................................................................................................................................10

5.3 Troubleshooting................................................................................................................................................................11

6 Maintenance Tools ........................................................................................................................ 12

7 Disassembly Procedure ................................................................................................................. 14

8 Assembly Procedure ...................................................................................................................... 16

9 Principles and Failure Analysis ................................................................................................... 18

9.1 Block Diagram .................................................................................................................................................................18

9.2 Baseband Unit ..................................................................................................................................................................19

9.2.1 Power-on Management Circuits..........................................................................................................................19

9.2.2 Charging Management Circuits ..........................................................................................................................24

9.2.3 Clock Circuit ..........................................................................................................................................................31

9.2.4 Memory Circuit......................................................................................................................................................32

9.3 RF Unit ..............................................................................................................................................................................34

9.3.1 GSM Quad Band Transception Circuit ..............................................................................................................36

9.3.2 WCDMA2100/1900 Transception Circuit ........................................................................................................39

9.3.3 W900/850 Transception Circuit ..........................................................................................................................43

9.4 Peripheral Circuits ...........................................................................................................................................................48

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9.4.1 Display ....................................................................................................................................................................48

9.4.2 Keypad.....................................................................................................................................................................50

9.4.3 Vibration..................................................................................................................................................................53

9.4.4 Voice Reception .....................................................................................................................................................54

9.4.5 Voice Transmission................................................................................................................................................58

9.4.6 Headset ....................................................................................................................................................................60

9.4.7 SIM Card.................................................................................................................................................................63

9.4.8 I/O Connector.........................................................................................................................................................65

9.4.9 microSD Card Connector .....................................................................................................................................66

9.4.10 FM..........................................................................................................................................................................67

9.4.11 Bluetooth...............................................................................................................................................................70

9.4.12 Wi-Fi......................................................................................................................................................................73

10 Solder Points on the PCB and BGA Chip ................................................................................. 75

11 Functional Tests........................................................................................................................... 81

11.1 Keys .................................................................................................................................................................................81

11.2 MMI Test .........................................................................................................................................................................82

11.3 Voice Call Test................................................................................................................................................................83

U8185 Maintenance Manual

1 Product Introduction

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1.1 Appearance

Category

Description

Dimensions (H x W x D)

106.5 mm x 56 mm x 10.9 mm

Technical standard

WCDMA/GSM

Figure 1-1 U8185

1 Product Introduction

1.2 Specifications

U8185 Maintenance Manual

1 Product Introduction

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Category

Description

Frequency bands

U8185-1:



WCDMA 900MHz: 880–915 MHz (UL), 925–960 MHz (DL)



WCDMA 2100 MHz: 1920–1980 MHz (UL), 2110–2170 MHz (DL)



GSM 850 MHz: 824–849 MHz (UL), 869–894 MHz (DL)



GSM 900 MHz: 880–915 MHz (UL), 925–960 MHz (DL)



GSM 1800 MHz: 1710–1785 MHz (UL), 1805–1880 MHz (DL)



GSM 1900 MHz: 1850–1910 MHz (UL), 1930–1990 MHz (DL)

U8185-5:



WCDMA 850MHz: 824–849 MHz (UL), 869–894 MHz (DL)



WCDMA 1900MHz: 1850–1910 MHz (UL), 1930–1990 MHz (DL)



GSM 850 MHz: 824–849 MHz (UL), 869–894 MHz (DL)



GSM 900 MHz: 880–915 MHz (UL), 925–960 MHz (DL)



GSM 1800 MHz: 1710–1785 MHz (UL), 1805–1880 MHz (DL)



GSM 1900 MHz: 1850–1910 MHz (UL), 1930–1990 MHz (DL)

U8185-7:



WCDMA 850MHz: 824–849 MHz (UL), 869–894 MHz (DL)



WCDMA 2100 MHz: 1920–1980 MHz (UL), 2110–2170 MHz (DL)



GSM 850 MHz: 824–849 MHz (UL), 869–894 MHz (DL)



GSM 900 MHz: 880–915 MHz (UL), 925–960 MHz (DL)



GSM 1800 MHz: 1710–1785 MHz (UL), 1805–1880 MHz (DL)



GSM 1900 MHz: 1850–1910 MHz (UL), 1930–1990 MHz (DL)

Weight

About 100 g with battery

Form factor

Bar

Antenna

Built-in

UIM

Support for the USIM card

Charger



5 V, 500 mA



5 V, 400 mA

Battery

1050 mAH Li-ion



Talk time: up to 200 minutes



Standby time: up to 280 hours

Display

Resolution

240 RGB x 320 pixel

Type

TFT-LCD

Color

262 k

Size

2.83 inches

Connectors

Charging port

Micro USB connector

USB port

Micro USB connector

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1 Product Introduction

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Category

Description

microSD card slot

Headset jack

3.5 mm headset jack

Maximum transmit power



WCDMA: +24 dBm (Power Class 3)



GSM/GPRS 850/900 MHz: +33 dbm (Power Class 4)



GSM/GPRS 1800/1900 MHz: +30 dbm (Power Class 1)

Static sensitivity



WCDMA 850 MHz: better than –104.7 dBm/3.84 MHz



WCDMA 900 MHz: better than –103.7 dBm/3.84 MHz



WCDMA 1900 MHz: better than –104.7 dBm/3.84 MHz



WCDMA 2100 MHz: better than –106.7 dBm/3.84 MHz



GSM 850/900/1800/1900 MHz: better than –102 dBm/200 kHz

Temperature



Operating temperature: –10°C to +55°C



Storage temperature: –40°C to +70°C

Humidity

Operating humidity: 5% to 95% RH

U8185 Maintenance Manual

2 Applicable Scope and Precautions

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2 Applicable Scope and Precautions

ESD is the main cause of damage to electrostatic-sensitive components. Each ASC must exercise caution to avoid ESD damage and comply with the ESD protection requirements in this manual.

2.1 Applicable Scope

This document provides repair instructions for technicians at service centers authorized by Huawei. This maintenance manual is confidential and accessible to authorized service centers (ASCs) and authorized service providers (ASPs) only. While every effort has been made to ensure the accuracy of this document, errors may still exist. If you find any errors or have any suggestions, please contact Huawei's customer service.

2.2 Precautions



Only qualified technicians are allowed to perform repair and calibration.



Perform all operations in electrostatic discharge (ESD) rooms and wear ESD wrist straps throughout the operations.



Ensure that all the components, screws, and insulators are properly installed after repair and calibration. Ensure that all cables and wires are installed and connected correctly.



Ensure that the soldering is lead-free and compliant with eco-friendly requirements.

2.3 How to Obtain Product and Repair Information

To obtain product and maintenance information, visit Huawei website at:

http://www.huaweidevice.com/cn/technicaIndex.do

U8185 Maintenance Manual

3 Exploded View

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3 Exploded View

No.

Description

Quantity

1

Touch panel (TP)

1

2

Front cover assembly

1

3

LCM

1

4

Printed circuit board assembly (PCBA)

1

5

Rear cover assembly

1

Note: The components listed in the following table are structural parts of the phone, and cannot be used as reference when requesting spare parts.

Table 3-1 List of components in the exploded view drawing

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3 Exploded View

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No.

Description

Quantity

6

Battery

1

7

Battery cover

1

U8185 Maintenance Manual

4 Components on the PCBA

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4 Components on the PCBA

U1204 Accelerometer chip

Failure of this component can cause:

Accelerometer failure

J1301 card holder connector-LCD

Failure of this

component can cause:

No display on the LCD

U3302 RF power module

Failure of this

component can cause:

Transmit failure

U3202 RF switch

Failure of this component can cause:

Signal receive or transmit

failure

U3401 RF power module

Failure of this

component can cause:

Transmit failure-

U3501 RF power module

Failure of this

component can cause:

Transmit failure

U3304duplexer

Failure of this

component can cause:

No signal; weak signal; registration failure

U3901 baseband dual mode RF transception

Failure of this component can cause:

RF failure

MIC1501 MIC

Failure of this component can cause:

No sound is picked or

transmitted

U1301 backlight chip

Failure of this

component can cause:

No backlight on the LCD

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4 Components on the PCBA

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U6000Bluetooth & FM

chip

Failure of this component can cause:

Bluetooth and FM failure

J901 USB connector

Failure of this component can cause:

Charging failure; data

communication failure

J1601 TP port

Failure of this

component can cause:

TP does not respond

J902 battery connector

Failure of this

component can cause:

Power-on failure; charging failure

J1401 SIM/TF card slot

Failure of this

component can cause:

SIM card not identified; TF card failure

U6100 Wi-Fi chip

Failure of this component can cause:

Wi-Fi failure

U3101 19.2 MHz clock

Failure of this component can cause:

No clock; power-on

failure

J1101 headset jack

Failure of this

component can cause:

Headset failure

U601 MCP chip

Failure of this

component can cause:

Power-on failure; software failure

J1001 camera

connector

Failure of this component can cause:

Photo or video capture failure

U6202 RF switch

Failure of this component can cause:

No Wi-Fi signal

U401 MSM7225A chip

Failure of this component can cause:

Power-on failure; system

halt; RF failure

U201 PM8029 power chip

Failure of this component can cause:

No power output; power-

on failure

BOM

Description

Location

15010251

Schottky diode

D1401, D301, D302

15040311

Transient voltage suppression diode

D1101, D1102, D1103, D1104, D1501, D1502, D1503, D1504, D1600, D1601, D1605, D1606, D901

15020111

Light emitting diode

D1200

19040121

Fuse suite-fast acting fuse

F901

10100150

Terminal dedicated EMI bead

LB1601, LB301, LB302

The following list of components is provided for reference only. This list is subject to change without notice. The latest component list is available on Huawei's ITEM information system. If you have any questions, please contact your local technical support.

Table 4-1 Components on the PCBA

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4 Components on the PCBA

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BOM

Description

Location

10100084

Terminal dedicated EMI bead

LB1102, LB1103, LB1104, LB1106

22050053

Microphone

MIC1501

15060228

MOSFET-P channel

Q201

15060238

MOSFET-N channel

Q1601

40060329

MCP

U601

38020055

Analog switch-P-channel MOSFET

U1001

38140023

Accelerometer

U1204

39110581

LDO

U1301

12070034

Temperature compensated oscillator-19.2 MHz

U3101 14240004

RF connector

U3201

47140048

RF switch

U3202

13010186

SAW filter

U3301

47100397

RF power module

U3302

13080065

Duplexer

U3304

47100387

RF power module

U3401

13010189

SAW filter

U3402

13080104

Duplexer

U3404

47100377

RF power module

U3501

13010262

SAW filter

U3702

39200333

Terminal dedicated baseband IC

U3901

13010180

SAW filter

U4102, U4103

47090042

RF low-noise amplifier

U5002

39210040

Bluetooth & FM chip

U6000

39210039

WLAN chip

U6100

47140101

RF switch

U6202

12020125

Crystal resonator

X301

U8185 Maintenance Manual

5 Software Upgrade

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5.1 Upgrade Preparation

Category

Item

Description

Upgrade environment

Computer

To copy upgrade software

microSD card

With more than 512 MB free space

Battery

With at least 30% power remaining

Upgrade file Main upgrade pack

dload/UPDATE.APP

Vendor upgrade pack

vendor_XXX_XXX/UPDATE.APP

Upgrade method

microSD card upgrade

Normal upgrade

Forcible upgrade

5 Software Upgrade

5.2 Upgrade Procedure

1. Format the microSD card.

2. Create a folder named dload in the root directory of the microSD card.

3. Copy the upgrade file to the dload folder.

4. Install the microSD card to the phone. Power the phone on, and enter *#*#2846579#*#*

in the idle screen.

5. Select SD card upgrade, and then touch Confirm to start the upgrade. Before the upgrade, NV items backup is performed (if the phone's NV items has not been

backed up before). Then the phone restarts and the upgrade starts. The upgrade progress is displayed on the LCD.

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5 Software Upgrade

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Failure

Solution

The port cannot be found in USB cable upgrade mode.



Check that there is no other driver conflicting with the USB driver for the upgrade.



Check that the USB driver has been installed properly.



Check that the USB cable has been properly connected.

The phone fails to be upgraded in USB cable upgrade mode.



Check that the USB cable has been properly connected.



Perform the upgrade again.

The phone fails to be upgraded in microSD card upgrade mode.



Check that the upgrade file is correct.



Check that the upgrade method is correct.



Check that the microSD card functions properly.



Perform the upgrade again.

After the upgrade is completed, the phone restarts and the NV items are restored.

6. After the phone is upgraded using the main upgrade pack, upgrade the phone using the

vendor upgrade pack in the same way.

If the phone cannot be properly powered on, use one of the following two methods to forcibly upgrade the phone:



Install the battery on the phone (if the screen is jittering, remove the battery and wait for 5 seconds before installing the battery again). Press and hold the Volume+ and Volume– keys, and press the Power key. The phone enters the SD forcible upgrade mode in which the upgrade process is similar to the normal upgrade.



While the phone has no battery installed, press and hold the Volume+ and Volume– keys, and connect the charger to the phone. The phone enters the SD forcible upgrade. This method is recommended. If the forcible upgrade still fails, use another microSD card and try forcible upgrade again.

5.3 Troubleshooting

U8185 Maintenance Manual

6 Maintenance Tools

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6 Maintenance Tools

Name: constant-temperature heat gun Usage: to heat components

Name: soldering iron Usage: to maintain and solder components

Name: DC power supply Usage: to supply DC current

Name: soldering table Usage: to secure the PCBA

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Name: pb-free solder wire Usage: to solder components

Name: digital multimeter Usage: to measure during repair

Name: toolkit Usage: to assemble and disassemble components

Name: electric screwdriver Usage: to fasten and remove screws

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7 Disassembly Procedure

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7 Disassembly Procedure

4. Remove the four screws from rear cover.

3. Remove the battery cover.

2. U8185 before disassembly

1. Wear an ESD wrist strap, and ensure that the strap is grounded properly.

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7 Disassembly Procedure

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10. Remove the LCD. The phone is then disassembled.

9. Open the LCD connector.

8. Remove the PCBA from the front cover.

7. Use tweezers to release the TP connector, Volume key dome, and Power key dome.

6. Remove the rear cover.

5. Release the latches between front and rear covers.

U8185 Maintenance Manual

8 Assembly Procedure

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8 Assembly Procedure

4. Install the TP connector, Volume key dome, and Power key dome, and then snap latch between the PCBA and front cover in place.

3. Install the PCBA on the front cover. Do not cover the TP connector FPC under the PCBA.

2. Install the LCD connector.

1. Wear an ESD wrist strap, and ensure that the strap is grounded properly.

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8 Assembly Procedure

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8. The phone is now assembled.

7. Install the battery cover.

6. Install the four screws into the rear cover.

5. Install the Power key and Volume key, and snap the front and rear covers.

U8185 Maintenance Manual

9 Principles and Failure Analysis

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9 Principles and Failure Analysis

HD1U8185M.pdf

Before repairing a phone, ensure that the failure of the phone is not caused by environmental factors or incorrect functional settings. It is recommended that you restore the phone to its factory settings.

9.1 Block Diagram

Figure 9-1 U8185 block diagram

U8185 Maintenance Manual

9 Principles and Failure Analysis

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The MSM7X2XA (the U8185 uses the MSM7225A) is the baseband signal processing chip, mainly responsible for processing the input and output of IMAGE, VIDEO, AUDIO, RF INTERFACES, and CONECTIVITY signals. The baseband chip provides keypad, LCD, microSD card, Wi-Fi, camera, and microphone interfaces.

The PM8029 provides analog multi-channel switch, real-time clock circuit, TCXO clock circuit, motor driver circuit, and programmable current source.

The RTR6285A is the RF signal processing chip, responsible for converting uplink/downlink RF signals.

The PCBA can be divided into four sub-systems: baseband, RF, power supply, and user interfaces.

9.2 Baseband Unit

9.2.1 Power-on Management Circuits

Figure 9-2 Circuit schematic diagram

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9 Principles and Failure Analysis

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Analysis

After the Power key is pressed, the phone powers on. VHP_PWR (main power voltage) powers the PM8029. The power management chip then provides the voltages listed in the

following table.

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9 Principles and Failure Analysis

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Troubleshooting Process

Fault symptom: power-on failure To troubleshoot the power-on failure, firstly check whether the I/O connector (battery

connector) is damaged. If the I/O connector (battery connector) is not damaged, use a DC regulated power supply to supply power to the phone, and test the phone's current.

The power-on failure may be caused by any of the following conditions:



No current

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9 Principles and Failure Analysis

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Replace J902

N

Power-on failure:

no current

Is the battery

connector J902

normal?

Replace Q201

N

Is Q201 normal?

Y

Re-solder or replace

U201

Y

End

Y

Power-on failure:

weak current

Re-install the phone's

software. Is the problem

solved?

Is U201's output

voltage normal?

Replace U201

N

Replace U401

N

Does X301 have

32.768 kHz output?

Replace U601 and re-install the phone's software. Is the

problem solved?

Y

Replace X301

N

End

Y



Weak current

Huawei U8185 Maintenance Manual

Specifications and Main Features

Frequently Asked Questions

User Manual