Huawei ME906S-158 Users Manual

HUAWEI ME906s LTE M.2 Module
Hardware Guide
Issue
04
Date
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No part of this manual may be reproduced or transmitted in any form or by any means without prior written consent of Huawei Technologies Co., Ltd. and its affiliates ("Huawei"). The product described in this manual may include copyrighted software of Huawei and possible licensors. Customers shall not in any manner reproduce, distribute, modify, decompile, disassemble, decrypt, extract, reverse engineer, lease, assign, or sublicense the said software, unless such restrictions are prohibited by applicable laws or such actions are approved by respective copyright holders.
Trademarks and Permissions
, , and are trademarks or registered trademarks of Huawei Technologies Co., Ltd. LTE is a trade mark of ETSI. Other trademarks, product, service and company names mentioned may be the property of their respective owners.
Notice
Some features of the product and its accessories described herein rely on the software installed, capacities and settings of local network, and therefore may not be activated or may be limited by local network operators or network service providers. Thus, the descriptions herein may not exactly match the product or its accessories which you purchase. Huawei reserves the right to change or modify any information or specifications contained in this manual without prior notice and without any liability.
DISCLAIMER
ALL CONTENTS OF THIS MANUAL ARE PROVIDED “AS IS”. EXCEPT AS REQUIRED BY APPLICABLE
LAWS, NO WARRANTIES OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE, ARE MADE IN RELATION TO THE ACCURACY, RELIABILITY OR CONTENTS OF THIS MANUAL. TO THE MAXIMUM EXTENT PERMITTED BY APPLICABLE LAW, IN NO EVENT SHALL HUAWEI BE LIABLE FOR ANY SPECIAL, INCIDENTAL, INDIRECT, OR CONSEQUENTIAL DAMAGES, OR LOSS OF PROFITS, BUSINESS, REVENUE, DATA, GOODWILL SAVINGS OR ANTICIPATED SAVINGS REGARDLESS OF WHETHER SUCH LOSSES ARE FORSEEABLE OR NOT. THE MAXIMUM LIABILITY (THIS LIMITATION SHALL NOT APPLY TO LIABILITY FOR PERSONAL INJURY TO THE EXTENT APPLICABLE LAW PROHIBITS SUCH A LIMITATION) OF HUAWEI ARISING FROM THE USE OF THE PRODUCT DESCRIBED IN THIS MANUAL SHALL BE LIMITED TO THE AMOUNT PAID BY CUSTOMERS FOR THE PURCHASE OF THIS PRODUCT.
Import and Export Regulations
Customers shall comply with all applicable export or import laws and regulations and be responsible to obtain all necessary governmental permits and licenses in order to export, re-export or import the product mentioned in this manual including the software and technical data therein.
HUAWEI ME906s LTE M.2 Module Hardware Guide
About This Document
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Revision History
Document Version
Date
Chapter
Descriptions
01
Creation
02
2.2
Updated dimensions in Table 2-1 Features
3.4.2
Updated the maximum value of the pull­up resistor
4.3.1
Updated the test instrument
4.4.2
Updated Table 4-4 Conducted Tx power
5.4.1
Updated Table 5-4 Requirements for input current
5.5
Updated test duration of temperature cycle in Table 5-10 Test conditions and results of the reliability
6.2
Updated the dimensions
03
9.13.1
Updated section 9.13.1 EU Regulatory Conformance
04
Deleted privacy policy
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About This Document
HUAWEI ME906s LTE M.2 Module Hardware Guide
Contents
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Contents
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1 Introduction.................................................................................................................................... 7
2 Overall Description ...................................................................................................................... 8
2.1 About This Chapter ........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram ....................................................................................................................... 9
3 Description of the Application Interfaces .............................................................................. 11
3.1 About This Chapter .......................................................................................................................... 11
3.2 75-pin Gold Finger........................................................................................................................... 11
3.3 Power Interface .............................................................................................................................. 19
3.3.1 Overview ................................................................................................................................ 19
3.3.2 Power Supply 3.3V Interface ................................................................................................. 19
3.3.3 USIM Power Output USIM_PWR .......................................................................................... 21
3.4 Signal Control Interface .................................................................................................................. 21
3.4.1 Overview ................................................................................................................................ 21
3.4.2 Power_On_Off Control Pin .................................................................................................... 23
3.4.3 RESET# Pin .......................................................................................................................... 28
3.4.4 LED# Pin ............................................................................................................................... 30
3.4.5 W_DISABLE# Pin .................................................................................................................. 30
3.4.6 GPS_DISABLE# Pin .............................................................................................................. 31
3.4.7 Wake_On_WWAN# Pin ......................................................................................................... 32
3.4.8 BodySAR_N Pin .................................................................................................................... 32
3.4.9 USIM_DET Pin ...................................................................................................................... 33
3.5 USB Interface ................................................................................................................................. 35
3.6 USIM Card Interface ...................................................................................................................... 36
3.6.1 Overview ................................................................................................................................ 36
3.6.2 Circuit Recommended for the USIM Card Interface .............................................................. 37
3.7 Tunable Antenna Control ................................................................................................................ 38
3.8 Config Pins ..................................................................................................................................... 39
3.9 Reserved Pins ................................................................................................................................ 40
3.10 NC Pins ........................................................................................................................................ 41
3.11 RF Antenna Interface.................................................................................................................... 41
3.11.1 RF Connector location ......................................................................................................... 41
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3.11.2 Coaxial RF Connector Guidelines ....................................................................................... 42
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4 RF Specifications ......................................................................................................................... 45
4.1 About This Chapter ......................................................................................................................... 45
4.2 Operating Frequencies ................................................................................................................... 45
4.3 Conducted RF Measurement ......................................................................................................... 46
4.3.1 Test Environment ................................................................................................................... 46
4.3.2 Test Standards ....................................................................................................................... 46
4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 46
4.4.1 Conducted Receive Sensitivity .............................................................................................. 46
4.4.2 Conducted Transmit Power ................................................................................................... 48
4.5 Antenna Design Requirements ...................................................................................................... 49
4.5.1 Antenna Design Indicators..................................................................................................... 49
4.5.2 Interference ........................................................................................................................... 51
4.5.3 Antenna Requirements .......................................................................................................... 51
5 Electrical and Reliability Features ........................................................................................... 53
5.1 About This Chapter ......................................................................................................................... 53
5.2 Absolute Ratings ............................................................................................................................ 53
5.3 Operating and Storage Temperatures ............................................................................................ 53
5.4 Power Supply Features .................................................................................................................. 54
5.4.1 Input Power Supply ............................................................................................................... 54
5.4.2 Power Consumption .............................................................................................................. 55
5.5 Reliability Features ......................................................................................................................... 60
5.6 EMC and ESD Features ................................................................................................................. 63
6 Mechanical Specifications ......................................................................................................... 65
6.1 About This Chapter ......................................................................................................................... 65
6.2 Dimensions ..................................................................................................................................... 65
6.3 Packing System.............................................................................................................................. 66
7 Installation.................................................................................................................................... 67
7.1 About This Chapter ......................................................................................................................... 67
7.2 Connect ME906s to board ............................................................................................................. 67
7.3 Thermal Management .................................................................................................................... 68
7.4 Antenna Plug .................................................................................................................................. 68
8 Certifications ................................................................................................................................ 70
9 Safety Information ...................................................................................................................... 71
9.1 Interference .................................................................................................................................... 71
9.2 Medical Device ............................................................................................................................... 71
9.3 Area with Inflammables and Explosives ......................................................................................... 71
9.4 Traffic Security ................................................................................................................................ 72
9.5 Airline Security ................................................................................................................................ 72
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9.6 Safety of Children ........................................................................................................................... 72
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9.7 Environment Protection .................................................................................................................. 72
9.8 WEEE Approval .............................................................................................................................. 72
9.9 RoHS Approval ............................................................................................................................... 72
9.10 Laws and Regulations Observance ............................................................................................. 73
9.11 Care and Maintenance ................................................................................................................. 73
9.12 Emergency Call ............................................................................................................................ 73
9.13 Regulatory Information ................................................................................................................. 73
9.13.1 EU Regulatory Conformance .............................................................................................. 73
9.13.2 FCC Statement .................................................................................................................... 74
10 Appendix A Circuit of Typical Interface .............................................................................. 76
11 Appendix B Acronyms and Abbreviations .......................................................................... 77
HUAWEI ME906s LTE M.2 Module Hardware Guide
Introduction
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1 Introduction
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This document describes the hardware application interfaces and air interfaces that are provided when HUAWEI ME906s LTE M.2 Module (hereinafter referred to as the ME906s module) is used.
M.2 is the new name for NGFF (Next Generation Form Factor), which is the specification of PCI-SIG (Peripheral Component Interconnect Special Interest Group).
This document helps you to understand the interface specifications, electrical features and related product information of the ME906s module.
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Overall Description
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2.1 About This Chapter
Feature
Description
Physical Features
Dimensions (L × W × H): 42 mm × 30 mm × 2.22 mm Weight: about 6 g
Operating Bands
FDD LTE: Band 1, Band 2, Band 3, Band 5, Band 7, Band 8, Band 20, Band 28, all bands with diversity
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5, Band 8, all bands with diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz GPS/GLONASS: L1
Operating Temperature
Normal operating temperature: –10°C to +55°C Extended operating temperature
[1]
: –20°C to +70°C
Storage Temperature
–40°C to +85°C Power Voltage
3.135 V to 4.4 V (3.3 V is typical)
Application Interface (75­pin Gold Finger)
USIM (3.0 V or 1.8 V)
USIM_DET pin (USIM Hot Swap Detection)
USB 2.0 (High-Speed)
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This chapter gives a general description of the ME906s module and provides:
Function Overview
Circuit Block Diagram
2 Overall Description
2.2 Function Overview
Table 2-1 Features
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Overall Description
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Feature
Description
Power_On_Off pin
RESET# pin
LED# pin
W_DISABLE# pin
GPS_DISABLE# pin
Tunable Antenna control (4 GPIOs)
Wake_On_WWAN# pin
BodySAR_N pin
Power supply (5 pins)
Antenna Connectors
MAIN and AUX (supports Diversity and GPS simultaneously)
SMS
Supports MO and MT Supports formats of PDU Point-to-point and cell broadcast
Data Services
GPRS: DL 85.6 kbit/s; UL 85.6 kbit/s
EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s
WCDMA CS: DL 64 kbit/s; UL 64 kbit/s
WCDMA PS: DL 384 kbit/s; UL 384 kbit/s
HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s
DC-HSPA+: DL 42 Mbit/s; UL 5.76 Mbit/s
LTE FDD: DL 150 Mbit/s; UL 50 Mbit/s @20M BW cat3
Operating System
Windows 7/8/8.1/10, Android 4.0 or later
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[1]: When the ME906s module works at –20°C to –10°C or +55°C to +70°C , NOT all its RF specifications comply with the 3GPP specifications.
2.3 Circuit Block Diagram
The ME906s module is developed based on Huawei's Balong Hi6921M platform. Figure 2-1 shows the circuit block diagram of the ME906s module. The application block diagram and major functional units of the ME906s module contain the following parts:
Baseband controller
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Power manager
Nand Flash
Radio Frequency (RF) transceiver
RF Front End
Figure 2-1 Circuit block diagram
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Description of the Application Interfaces
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3 Description of the Application Interfaces
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3.1 About This Chapter
This chapter mainly describes the application interfaces of the ME906s module, including:
75-pin Gold Finger
Power Interface
Signal Control Interface
USB Interface
USIM Card Interface
Tunable Antenna Control
Config Pins
Reserved Pins
NC Pins
RF Antenna Interface
3.2 75-pin Gold Finger
The ME906s module uses a 75-pin Gold Finger as its external interface. For details about the module dimensions, see 6.2 Dimensions.
Figure 3-1 shows the sequence of pins on the 75-pin signal interface of the ME906s module.
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Description of the Application Interfaces
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Figure 3-1 TOP view of gold finger interface pins
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Table 3-1 shows the definitions of the 75-pin interface (67 for signals and 8 for notch) of the ME906s module.
As M.2 Nomenclature, ME906s is Type 3042-S3-B (30 mm × 42 mm, Max. Component Height on Top is 1.5 mm and single-sided, Key ID is B).
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Description of the Application Interfaces
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Table 3-1 Definitions of pins on the M.2 interface
Pin No.
Pin Name
Pad Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
Comments
1
CONFIG_3
O
Connected to Ground internally.
- - 0
-
The module is configured as WWAN­SSIC 0.
2
3.3V
PI
Power supply
-
3.135
3.3
4.4 - 3
Ground
PI
Ground
- - 0 - - 4 3.3V
PI
Power supply
-
3.135
3.3
4.4 - 5
Ground
PI
Ground
- - 0 - -
6
Power_On_Off
I
A single control to turn On/Off WWAN.
When it is Low, WWAN is powered off.
When it is High, WWAN is powered on.
It is internally pulled to Low.
It is 3.3 V tolerant but can be driven by either 1.8 V or
3.3 V GPIO.
VIH
1.26
-
3.6
The module is pulled down inside by a 1 MΩ resistor.
VIL
–0.3
-
0.3
7
USB_D+
I/O
USB Data + defined in the USB 2.0 specification
- - - - -
8
W_DISABLE#
I
WWAN disable function When it is High, WWAN
function is determined by software AT command. Default enabled.
When it is Low, WWAN function will be turned off.
VIH
1.26
-
3.6
-
VIL
–0.3
-
0.3 9
USB_D-
I/O
USB Data - defined in the USB 2.0 specification
- - - - -
10
LED#
O
It is an open drain, active low signal, used to allow the M.2 card to provide status indicators via LED devices that will be provided by the host.
VOL 0 -
0.48
The maximum IOL is 40 mA. 11
Ground
PI
Ground
- - 0 - -
12
Notch
- - - - - - -
13
Notch
- - - - - - -
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Pin No.
Pin Name
Pad Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
Comments
14
Notch
- - - - - - -
15
Notch
- - - - - - -
16
Notch
- - - - - - -
17
Notch
- - - - - - -
18
Notch
- - - - - - -
19
Notch
- - - - - - -
20
Reserved
-
Reserved for future use, please keep it not connected in the host side.
- - - - -
21
CONFIG_0
O
Not Connected internally.
- - -
-
The module is configured as WWAN­SSIC 0.
22
Reserved
-
Reserved for future use, please keep it not connected in the host side.
- - - - -
23
Wake_On_W WAN#
O
It is open drain and active low.
WWAN to wake up the host.
VOL 0 -
0.48
The maximum IOL is 40 mA.
24
Reserved
-
Reserved for future use, please keep it not connected in the host side.
- - - - -
25
BodySAR_N
I
Hardware pin for BodySAR detection.
When it is High, No TX power backoff (default).
When it is Low, TX power backoff.
VIH
1.26
-
3.6
-
VIL
–0.3
-
0.3
26
GPS_DISABL E#
I
GPS disable function When it is High, GPS
function is determined by software AT command.
When it is Low, GPS is turned off.
VIH
1.26
-
3.6
-
VIL
–0.3
-
0.3 27
Ground
PI
Ground
- - 0 - -
28
Reserved
-
Reserved for future use, please keep it not connected in the host side.
- - - - -
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Description of the Application Interfaces
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Pin No.
Pin Name
Pad Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
Comments
29
NC - Not Connected
- - - - -
30
USIM_RESET
O
USIM Reset
VOH
0.7 x USIM _PW R
-
3.3
USIM_PW R=1.8 V or
3.0 V VOL 0 -
0.2 x USIM _PW R
31
NC - Not Connected
- - - - -
32
USIM_CLK
O
USIM Clock
VOH
0.7 x USIM _PW R
-
3.3
USIM_P WR=1.8 V or 3.0 V
VOL 0 -
0.2 x USIM _PW R
33
Ground
PI
Ground
- - 0 - -
34
USIM_DATA
I/O
USIM DATA
VOH
0.7 x USIM _PW R
-
3.3
USIM_PW R=1.8 V or
3.0 V
VOL 0 -
0.2 x USIM _PW R
VIH
0.7 x USIM _PW R
-
3.3
VIL 0 -
0.2 x USIM _PW R
35
NC - Not Connected
- - - - -
36
USIM_PWR
PO
USIM POWER
-
1.75
1.8
1.98
USIM_PW R=1.8 V
-
2.75
3
3.3
USIM_PW R=3.0 V
37
NC - Not Connected
- - - - -
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Description of the Application Interfaces
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Pin No.
Pin Name
Pad Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
Comments
38
NC - Not Connected
- - - - -
39
Ground
PI
Ground
- - 0 - -
40
I2C_SCL
I/O
I2C clock, slave.
VIH
1.26
1.8
2.1
The current firmware does not support this function.
VIL
–0.3
-
0.63 41
NC - Not Connected
- - - - -
42
I2C_SDA
I/O
I2C data, slave.
VOH
1.35
1.8
-
The current firmware does not support this function.
VOL 0 -
0.45
VIH
1.26
1.8
2.1
VIL
–0.3
-
0.63
43
NC - Not Connected
- - - - -
44
I2C_IRQ
I
Interrupt signal to wake up the module.
VIH
1.26
1.8
2.1
The current firmware does not support this function.
VIL
–0.3
-
0.63 45
Ground
PI
Ground
- - 0 - -
46
SYSCLK
O
System clock output for external GNSS module.
VOH
1.6
1.8
-
The current firmware does not support this function.
VOL 0 -
0.45 47
NC - Not Connected
- - - - -
48
TX_BLANKIN G
O
TX blanking signal for external GNSS module.
VOH
1.6
1.8
-
The current firmware does not support this function.
VOL 0 -
0.45 49
NC - Not Connected
- - - - -
50
NC - Not Connected
- - - - -
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Pin No.
Pin Name
Pad Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
Comments
51
Ground
PI
Ground
- - 0 - -
52
NC - Not Connected
- - - - -
53
NC - Not Connected
- - - - -
54
NC - Not Connected
- - - - -
55
NC - Not Connected
- - - - -
56
NC - Not Connected
- - - - -
57
Ground
PI
Ground
- - 0 - -
58
NC - Not Connected
- - - - -
59
ANTCTL0
O
Tunable antenna control signal, bit 0.
It is a push-pull type GPIO.
VOH
1.37
1.8
2.1
-
VOL 0 -
0.45
-
60
COEX3
I/O
For coexistence.
VOH
1.35
1.8
1.9
The current firmware does not support this function.
VOL 0 -
0.45
VIH
1.26
1.8
2.1
VIL
–0.3
-
0.63
61
ANTCTL1
O
Tunable antenna control signal, bit 1.
It is a push-pull type GPIO.
VOH
1.37
1.8
2.1
-
VOL 0 -
0.45
-
62
COEX_UART_ RXD
I/O
UART transmit signal from other wireless coexistence solution to the module.
VOH
1.35
1.8
1.9 - VOL 0 -
0.45
-
VIH
1.26
1.8
2.1 - VIL
–0.3
-
0.63
-
63
ANTCTL2
O
Tunable antenna control signal, bit 2.
It is a push-pull type GPIO.
VOH
1.37
1.8
2.1
-
VOL 0 -
0.45
-
64
COEX_UART_ TXD
I/O
UART transmit signal from the module to other wireless coexistence solution.
VOH
1.35
1.8
1.9 - VOL 0 -
0.45
-
VIH
1.26
1.8
2.1 - VIL
–0.3
-
0.63
-
65
ANTCTL3
O
Tunable antenna control signal, bit 3.
It is a push-pull type GPIO.
VOH
1.37
1.8
2.1
-
VOL 0 -
0.45
-
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Pin No.
Pin Name
Pad Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
Comments
66
USIM_DET
I
USIM hot swap detection pin.
Rising edge for insertion; falling edge for removal.
When it is High, USIM is present.
When it is Low, USIM is absent.
VIH
1.26
1.8
2.1
The module is pulled up inside. VIL
–0.3
-
0.3
67
RESET#
I
System reset, active low. VIH
1.26
-
2.1
The module is pulled up inside.
VIL
–0.3
-
0.3 68
NC - Not Connected
- - - - -
69
CONFIG_1
O
Connected to Ground internally.
- - 0
-
The module is configured as WWAN­SSIC 0.
70
3.3V
PI
Power supply
-
3.135
3.3
4.4 - 71
Ground
PI
Ground
- - 0 - -
72
3.3V
PI
Power supply
-
3.135
3.3
4.4 - 73
Ground
PI
Ground
- - 0 - -
74
3.3V
PI
Power supply
-
3.135
3.3
4.4
-
75
CONFIG_2
O
Connected to Ground internally.
- - 0
-
The module is configured as WWAN­SSIC 0.
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I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates power input pins; PO indicates power output pins.
VIL: Low-level Input voltage; VIH: High-level Input voltage; VOL: Low-level Output voltage; VOH: High-level Output voltage.
The NC pins are not connected, therefore, before you deal with these pins, please refer to the corresponding hardware guide.
The Reserved pins are internally connected to the module. Therefore, these pins should not be used, otherwise they may cause problems. Please contact with us for more details about this information.
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Description of the Application Interfaces
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3.3 Power Interface
Pin No.
Pin Name
Pad Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
Comments
2, 4, 70, 72, 74
3.3V
PI
Power supply
-
3.135
3.3
4.4
-
36
USIM_PWR
PO
USIM POWER
-
1.75
1.8
1.98
USIM_PW R=1.8 V
-
2.75
3
3.3
USIM_PW R=3.0 V
3, 5, 11, 27, 33, 39, 45, 51, 57, 71, 73
Ground
PI
Ground
- - 0 - -
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3.3.1 Overview
The power supply part of the ME906s module contains:
3.3V pin for the power supply
USIM_PWR pin for USIM card power output
Table 3-2 lists the definitions of the pins on the power supply interface.
Table 3-2 Definitions of the pins on the power supply interface
3.3.2 Power Supply 3.3V Interface
The ME906s module power is supplied through the 3.3V pins and the voltage ranges from 3.135 V to 4.4 V (typical value is 3.3 V). The ME906s provides 5 power pins and 11 GND pins. To ensure that the ME906s module works normally, all the pins must be connected. The M.2 connector pin is defined as that should support 500 mA/Pin continuously.
When the ME906s module works at GSM mode, the module transmits at the maximum power, the transient peak current may reach 2.5 A@3.3 V. In this case, the power pin voltage will drop. Make sure that the voltage does not drop below 3.135 V in any case.
The traces of the power supply should be as short and wide as possible. It is recommended that at least one 220 μF capacitance is added onto the 3.3V power rails and as close to the M.2 connector as possible. Customers can reduce the capacitance if it can be guaranteed that the 3.3V pin does not drop below 3.135 V in any case.
Figure 3-2 shows the recommended power circuit of ME906s module.
HUAWEI ME906s LTE M.2 Module Hardware Guide
Description of the Application Interfaces
Issue 04 (2017-12-11)
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Figure 3-2 Recommended power circuit
Module (Modem)
3.3V
+
3.3V
330 pF
100 nF 1 μF 22 μF
220 μF
Time
3.135V
3.3V
4.4V
Voltage
Do not drop below 3.135 V during 2G Tx. The maximum current may be 2.5 A@3.3 V.
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3.135 V is the minimum voltage supplied to ME906s by the host, and 3.3V pin must never be under 3.135 V in any case, which is shown as the following figure.
If the customer wants to power cycle ME906s, the 3.3V pin must stay below 1.8 V for more than 100 ms. Figure 3-3 shows the power supply timing sequence between power cycling.
HUAWEI ME906s LTE M.2 Module Hardware Guide
Description of the Application Interfaces
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Figure 3-3 Power supply timing sequence between power cycling
Parameter
Remarks
Time (Min.)
Unit
T
off
Power off time
100
ms
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3.3.3 USIM Power Output USIM_PWR
Through the USIM_PWR power supply interface, the ME906s module can supply 1.8 V or 3.0 V power to USIM card. The transient current can reach 200 mA, so special attention should be taken on PCB design at the host side.
3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the interface in the ME906s module consists of the following:
Power On/Off (Power_On_Off) pin
Module reset (RESET#) pin
LED control (LED#) pin
WWAN disable control (W_DISABLE#) pin
GPS disable control (GPS_DISABLE#) pin
Wake signal out from module (Wake_On_WWAN#) pin
HUAWEI ME906s LTE M.2 Module Hardware Guide
Description of the Application Interfaces
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Pin No.
Pin Name
Pad Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
Comments
6
Power_On_ Off
I
A single control to turn On/Off WWAN.
When it is Low, WWAN is powered off.
When it is High, WWAN is powered on.
It is internally pulled to Low. It is 3.3 V tolerant but can be
driven by either 1.8 V or 3.3 V GPIO.
VIH
1.26
-
3.6
The module is pulled down inside by a 1MΩ resistor.
VIL
–0.3
-
0.3
67
RESET#
I
System reset, active low. VIH
1.26
-
2.1
The module is pulled up inside.
VIL
–0.3
-
0.3
10
LED#
O
It is an open drain, active low signal, used to allow the M.2 card to provide status indicators via LED devices that will be provided by the host.
VOL 0 -
0.48
The maximum IOL is 40 mA.
8
W_DISABLE #
I
WWAN disable function When it is High, WWAN
function is determined by software AT command. Default enabled.
When it is Low, WWAN function will be turned off.
VIH
1.26
-
3.6
-
VIL
–0.3
-
0.3
26
GPS_DISAB LE#
I
GPS disable function When it is High, GPS
function is determined by software AT command.
When it is Low, GPS is turned off.
VIH
1.26
-
3.6
­VIL
–0.3
-
0.3
23
Wake_On_ WWAN#
O
It is open drain and active low.
WWAN to wake up the host.
VOL 0 -
0.48
The maximum IOL is 40 mA.
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BodySAR detection (BodySAR_N) pin
USIM detection (USIM_DET) pin
Table 3-3 lists the pins on the signal control interface.
Table 3-3 Pins on the signal control interface
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Description of the Application Interfaces
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Pin No.
Pin Name
Pad Type
Description
Parameter
Min. (V)
Typ. (V)
Max. (V)
Comments
25
BodySAR_N
I
Hardware pin for BodySAR Detection.
When it is High, No TX power backoff (default).
When it is Low, TX power backoff.
VIH
1.26
-
3.6
­VIL
–0.3
-
0.3
66
USIM_DET
I
USIM hot swap detection pin.
Rising edge for insertion; falling edge for removal.
When it is High, USIM is present.
When it is Low, USIM is absent.
VIH
1.26
1.8
2.1
The module is pulled up inside.
VIL
–0.3
-
0.3
Item.
Pin state
Description
1
High
The module is powered on.
NOTE: If the module needs to be powered on automatically, the Power_On_Off pin must be pulled up to 3.3 V.
2
Low
The module is powered off.
It is internally pulled low with a weak pull-down resistor.
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3.4.2 Power_On_Off Control Pin
The ME906s module can be controlled to be powered on/off by the Power_On_Off pin.
Table 3-4 Two States of Power_On_Off
If the module is powered by the regulator with 3.3 V
If ME906s is powered by 3.3 V voltage regulator (such as notebook or Ultrabook), Power_On_Off should be pulled up to 3.3 V through a resistor.
The pull-up resistor should be not greater than 47 kΩ. Following is the power on/off sequence:
1. The module gets 3.3 V when supply for the module is switched on.
2. The module is turned on since Power_On_Off is pulled up to 3.3 V by the host.
3. Host cuts off 3.3 V supply to power off the module. The recommended circuit is shown as in Figure 3-4 .
HUAWEI ME906s LTE M.2 Module Hardware Guide
Description of the Application Interfaces
Issue 04 (2017-12-11)
Huawei Proprietary and Confidential
Copyright © Huawei Technologies Co., Ltd.
24
Figure 3-4 Recommended connections of Power_On_Off pin (auto power)
Pin6
47 kΩ
Power_On_Off
3.3V
3.3V
RESET#
Power on
Power_On_Off
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ME906s
Pin2, 4, 70, 72, 74
Power on sequence
Do not toggle RESET# during power on sequence. Pulling RESET# low will extend time for module startup. Recommended power on timing sequence is shown as Figure 3-5 .
Figure 3-5 Recommended power on timing sequence
Power off sequence
Cutting off 3.3 V will power off the module.
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