HUAWEI ME906s LTE M.2 Module
Hardware Guide
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HUAWEI ME906s LTE M.2 Module
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Revision History
Updated dimensions in Table 2-1
Features
Updated the maximum value of the pullup resistor
Updated the test instrument
Updated Table 4-4 Conducted Tx power
Updated Table 5-4 Requirements for
input current
Updated test duration of temperature
cycle in Table 5-10 Test conditions and
results of the reliability
Updated section 9.13.1 EU
Regulatory Conformance
About This Document
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Contents
1 Introduction.................................................................................................................................... 7
2 Overall Description ...................................................................................................................... 8
2.1 About This Chapter ........................................................................................................................... 8
2.2 Function Overview............................................................................................................................ 8
2.3 Circuit Block Diagram ....................................................................................................................... 9
3 Description of the Application Interfaces .............................................................................. 11
3.1 About This Chapter .......................................................................................................................... 11
3.2 75-pin Gold Finger........................................................................................................................... 11
3.3 Power Interface .............................................................................................................................. 19
3.3.1 Overview ................................................................................................................................ 19
3.3.2 Power Supply 3.3V Interface ................................................................................................. 19
3.3.3 USIM Power Output USIM_PWR .......................................................................................... 21
3.4 Signal Control Interface .................................................................................................................. 21
3.4.1 Overview ................................................................................................................................ 21
3.4.2 Power_On_Off Control Pin .................................................................................................... 23
3.4.3 RESET# Pin .......................................................................................................................... 28
3.4.4 LED# Pin ............................................................................................................................... 30
3.4.5 W_DISABLE# Pin .................................................................................................................. 30
3.4.6 GPS_DISABLE# Pin .............................................................................................................. 31
3.4.7 Wake_On_WWAN# Pin ......................................................................................................... 32
3.4.8 BodySAR_N Pin .................................................................................................................... 32
3.4.9 USIM_DET Pin ...................................................................................................................... 33
3.5 USB Interface ................................................................................................................................. 35
3.6 USIM Card Interface ...................................................................................................................... 36
3.6.1 Overview ................................................................................................................................ 36
3.6.2 Circuit Recommended for the USIM Card Interface .............................................................. 37
3.7 Tunable Antenna Control ................................................................................................................ 38
3.8 Config Pins ..................................................................................................................................... 39
3.9 Reserved Pins ................................................................................................................................ 40
3.10 NC Pins ........................................................................................................................................ 41
3.11 RF Antenna Interface.................................................................................................................... 41
3.11.1 RF Connector location ......................................................................................................... 41
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3.11.2 Coaxial RF Connector Guidelines ....................................................................................... 42
4 RF Specifications ......................................................................................................................... 45
4.1 About This Chapter ......................................................................................................................... 45
4.2 Operating Frequencies ................................................................................................................... 45
4.3 Conducted RF Measurement ......................................................................................................... 46
4.3.1 Test Environment ................................................................................................................... 46
4.3.2 Test Standards ....................................................................................................................... 46
4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 46
4.4.1 Conducted Receive Sensitivity .............................................................................................. 46
4.4.2 Conducted Transmit Power ................................................................................................... 48
4.5 Antenna Design Requirements ...................................................................................................... 49
4.5.1 Antenna Design Indicators..................................................................................................... 49
4.5.2 Interference ........................................................................................................................... 51
4.5.3 Antenna Requirements .......................................................................................................... 51
5 Electrical and Reliability Features ........................................................................................... 53
5.1 About This Chapter ......................................................................................................................... 53
5.2 Absolute Ratings ............................................................................................................................ 53
5.3 Operating and Storage Temperatures ............................................................................................ 53
5.4 Power Supply Features .................................................................................................................. 54
5.4.1 Input Power Supply ............................................................................................................... 54
5.4.2 Power Consumption .............................................................................................................. 55
5.5 Reliability Features ......................................................................................................................... 60
5.6 EMC and ESD Features ................................................................................................................. 63
6 Mechanical Specifications ......................................................................................................... 65
6.1 About This Chapter ......................................................................................................................... 65
6.2 Dimensions ..................................................................................................................................... 65
6.3 Packing System.............................................................................................................................. 66
7 Installation.................................................................................................................................... 67
7.1 About This Chapter ......................................................................................................................... 67
7.2 Connect ME906s to board ............................................................................................................. 67
7.3 Thermal Management .................................................................................................................... 68
7.4 Antenna Plug .................................................................................................................................. 68
8 Certifications ................................................................................................................................ 70
9 Safety Information ...................................................................................................................... 71
9.1 Interference .................................................................................................................................... 71
9.2 Medical Device ............................................................................................................................... 71
9.3 Area with Inflammables and Explosives ......................................................................................... 71
9.4 Traffic Security ................................................................................................................................ 72
9.5 Airline Security ................................................................................................................................ 72
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9.6 Safety of Children ........................................................................................................................... 72
9.7 Environment Protection .................................................................................................................. 72
9.8 WEEE Approval .............................................................................................................................. 72
9.9 RoHS Approval ............................................................................................................................... 72
9.10 Laws and Regulations Observance ............................................................................................. 73
9.11 Care and Maintenance ................................................................................................................. 73
9.12 Emergency Call ............................................................................................................................ 73
9.13 Regulatory Information ................................................................................................................. 73
9.13.1 EU Regulatory Conformance .............................................................................................. 73
9.13.2 FCC Statement .................................................................................................................... 74
10 Appendix A Circuit of Typical Interface .............................................................................. 76
11 Appendix B Acronyms and Abbreviations .......................................................................... 77
HUAWEI ME906s LTE M.2 Module
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1 Introduction
This document describes the hardware application interfaces and air interfaces that
are provided when HUAWEI ME906s LTE M.2 Module (hereinafter referred to as the
ME906s module) is used.
M.2 is the new name for NGFF (Next Generation Form Factor), which is the
specification of PCI-SIG (Peripheral Component Interconnect Special Interest
Group).
This document helps you to understand the interface specifications, electrical
features and related product information of the ME906s module.
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2.1 About This Chapter
Dimensions (L × W × H): 42 mm × 30 mm × 2.22 mm
Weight: about 6 g
FDD LTE: Band 1, Band 2, Band 3, Band 5, Band 7, Band 8,
Band 20, Band 28, all bands with diversity
WCDMA/HSDPA/HSUPA/HSPA+: Band 1, Band 2, Band 5, Band
8, all bands with diversity
GSM/GPRS/EDGE: 850 MHz/900 MHz/1800 MHz/1900 MHz
GPS/GLONASS: L1
Normal operating temperature: –10°C to +55°C
Extended operating temperature
[1]
: –20°C to +70°C
–40°C to +85°C
Power Voltage
3.135 V to 4.4 V (3.3 V is typical)
Application
Interface (75pin Gold
Finger)
USIM_DET pin (USIM Hot Swap Detection)
This chapter gives a general description of the ME906s module and provides:
Function Overview
Circuit Block Diagram
2 Overall Description
2.2 Function Overview
Table 2-1 Features
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Tunable Antenna control (4 GPIOs)
MAIN and AUX (supports Diversity and GPS simultaneously)
Supports MO and MT
Supports formats of PDU
Point-to-point and cell broadcast
GPRS: DL 85.6 kbit/s; UL 85.6 kbit/s
EDGE: DL 236.8 kbit/s; UL 236.8 kbit/s
WCDMA CS: DL 64 kbit/s; UL 64 kbit/s
WCDMA PS: DL 384 kbit/s; UL 384 kbit/s
HSPA+: DL 21.6 Mbit/s; UL 5.76 Mbit/s
DC-HSPA+: DL 42 Mbit/s; UL 5.76 Mbit/s
LTE FDD: DL 150 Mbit/s; UL 50 Mbit/s @20M BW cat3
Windows 7/8/8.1/10, Android 4.0 or later
[1]: When the ME906s module works at –20°C to –10°C or +55°C to +70°C , NOT all its RF
specifications comply with the 3GPP specifications.
2.3 Circuit Block Diagram
The ME906s module is developed based on Huawei's Balong Hi6921M platform.
Figure 2-1 shows the circuit block diagram of the ME906s module. The application
block diagram and major functional units of the ME906s module contain the following
parts:
Baseband controller
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Power manager
Nand Flash
Radio Frequency (RF) transceiver
RF Front End
Figure 2-1 Circuit block diagram
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3 Description of the Application Interfaces
3.1 About This Chapter
This chapter mainly describes the application interfaces of the ME906s module,
including:
75-pin Gold Finger
Power Interface
Signal Control Interface
USB Interface
USIM Card Interface
Tunable Antenna Control
Config Pins
Reserved Pins
NC Pins
RF Antenna Interface
3.2 75-pin Gold Finger
The ME906s module uses a 75-pin Gold Finger as its external interface. For details
about the module dimensions, see 6.2 Dimensions.
Figure 3-1 shows the sequence of pins on the 75-pin signal interface of the ME906s
module.
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Figure 3-1 TOP view of gold finger interface pins
Table 3-1 shows the definitions of the 75-pin interface (67 for signals and 8 for notch)
of the ME906s module.
As M.2 Nomenclature, ME906s is Type 3042-S3-B (30 mm × 42 mm, Max.
Component Height on Top is 1.5 mm and single-sided, Key ID is B).
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Table 3-1 Definitions of pins on the M.2 interface
Connected to Ground
internally.
The
module is
configured
as WWANSSIC 0.
A single control to turn
On/Off WWAN.
When it is Low, WWAN is
powered off.
When it is High, WWAN is
powered on.
It is internally pulled to
Low.
It is 3.3 V tolerant but can
be driven by either 1.8 V or
3.3 V GPIO.
The
module is
pulled
down
inside by a
1 MΩ
resistor.
USB Data + defined in the
USB 2.0 specification
WWAN disable function
When it is High, WWAN
function is determined by
software AT command.
Default enabled.
When it is Low, WWAN
function will be turned off.
USB Data - defined in the
USB 2.0 specification
It is an open drain, active
low signal, used to allow
the M.2 card to provide
status indicators via LED
devices that will be
provided by the host.
The
maximum
IOL is 40
mA.
11
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Reserved for future use,
please keep it not
connected in the host side.
Not Connected internally.
The
module is
configured
as WWANSSIC 0.
Reserved for future use,
please keep it not
connected in the host side.
It is open drain and active
low.
WWAN to wake up the
host.
The
maximum
IOL is 40
mA.
Reserved for future use,
please keep it not
connected in the host side.
Hardware pin for BodySAR
detection.
When it is High, No TX
power backoff (default).
When it is Low, TX power
backoff.
GPS disable function
When it is High, GPS
function is determined by
software AT command.
When it is Low, GPS is
turned off.
Reserved for future use,
please keep it not
connected in the host side.
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USIM_PW
R=1.8 V or
3.0 V
VOL 0 -
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The
current
firmware
does not
support
this
function.
The
current
firmware
does not
support
this
function.
Interrupt signal to wake up
the module.
The
current
firmware
does not
support
this
function.
System clock output for
external GNSS module.
The
current
firmware
does not
support
this
function.
TX blanking signal for
external GNSS module.
The
current
firmware
does not
support
this
function.
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Tunable antenna control
signal, bit 0.
It is a push-pull type GPIO.
The
current
firmware
does not
support
this
function.
Tunable antenna control
signal, bit 1.
It is a push-pull type GPIO.
UART transmit signal from
other wireless coexistence
solution to the module.
Tunable antenna control
signal, bit 2.
It is a push-pull type GPIO.
UART transmit signal from
the module to other
wireless coexistence
solution.
Tunable antenna control
signal, bit 3.
It is a push-pull type GPIO.
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USIM hot swap detection
pin.
Rising edge for insertion;
falling edge for removal.
When it is High, USIM is
present.
When it is Low, USIM is
absent.
The
module is
pulled up
inside.
VIL
System reset, active low.
VIH
The
module is
pulled up
inside.
Connected to Ground
internally.
The
module is
configured
as WWANSSIC 0.
Connected to Ground
internally.
The
module is
configured
as WWANSSIC 0.
I indicates pins for digital signal input; O indicates pins for digital signal output; PI indicates
power input pins; PO indicates power output pins.
V IL: Low-level Input voltage; V IH: High-level Input voltage; V OL: Low-level Output voltage; V OH:
High-level Output voltage.
The NC pins are not connected, therefore, before you deal with these pins, please refer to
the corresponding hardware guide.
The Reserved pins are internally connected to the module. Therefore, these pins should
not be used, otherwise they may cause problems. Please contact with us for more details
about this information.
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3.3 Power Interface
3, 5, 11, 27,
33, 39, 45, 51,
57, 71, 73
3.3.1 Overview
The power supply part of the ME906s module contains:
3.3V pin for the power supply
USIM_PWR pin for USIM card power output
Table 3-2 lists the definitions of the pins on the power supply interface.
Table 3-2 Definitions of the pins on the power supply interface
3.3.2 Power Supply 3.3V Interface
The ME906s module power is supplied through the 3.3V pins and the voltage ranges
from 3.135 V to 4.4 V (typical value is 3.3 V). The ME906s provides 5 power pins and
11 GND pins. To ensure that the ME906s module works normally, all the pins must be
connected. The M.2 connector pin is defined as that should support 500 mA/Pin
continuously.
When the ME906s module works at GSM mode, the module transmits at the
maximum power, the transient peak current may reach 2.5 A@3.3 V. In this case, the
power pin voltage will drop. Make sure that the voltage does not drop below 3.135 V
in any case.
The traces of the power supply should be as short and wide as possible. It is
recommended that at least one 220 μ F capacitance is added onto the 3.3V power
rails and as close to the M.2 connector as possible. Customers can reduce the
capacitance if it can be guaranteed that the 3.3V pin does not drop below 3.135 V in
any case.
Figure 3-2 shows the recommended power circuit of ME906s module.
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Figure 3-2 Recommended power circuit
Module
(Modem)
3.3V
+
3.3V
330 pF
100 nF 1 μF 22 μF
220 μF
Time
3.135V
3.3V
4.4V
Voltage
Do not drop below 3.135 V during 2G Tx.
The maximum current may be 2.5 A@3.3 V.
3.135 V is the minimum voltage supplied to ME906s by the host, and 3.3V pin must never be
under 3.135 V in any case, which is shown as the following figure.
If the customer wants to power cycle ME906s, the 3.3V pin must stay below 1.8 V for
more than 100 ms. Figure 3-3 shows the power supply timing sequence between
power cycling.
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Figure 3-3 Power supply timing sequence between power cycling
3.3.3 USIM Power Output USIM_PWR
Through the USIM_PWR power supply interface, the ME906s module can supply 1.8
V or 3.0 V power to USIM card. The transient current can reach 200 mA, so special
attention should be taken on PCB design at the host side.
3.4 Signal Control Interface
3.4.1 Overview
The signal control part of the interface in the ME906s module consists of the
following:
Power On/Off (Power_On_Off) pin
Module reset (RESET#) pin
LED control (LED#) pin
WWAN disable control (W_DISABLE#) pin
GPS disable control (GPS_DISABLE#) pin
Wake signal out from module (Wake_On_WWAN#) pin
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A single control to turn
On/Off WWAN.
When it is Low, WWAN is
powered off.
When it is High, WWAN is
powered on.
It is internally pulled to Low.
It is 3.3 V tolerant but can be
driven by either 1.8 V or 3.3
V GPIO.
The
module is
pulled
down
inside by a
1MΩ
resistor.
System reset, active low.
VIH
The
module is
pulled up
inside.
It is an open drain, active low
signal, used to allow the M.2
card to provide status
indicators via LED devices
that will be provided by the
host.
The
maximum
IOL is 40
mA.
WWAN disable function
When it is High, WWAN
function is determined by
software AT command.
Default enabled.
When it is Low, WWAN
function will be turned off.
GPS disable function
When it is High, GPS
function is determined by
software AT command.
When it is Low, GPS is
turned off.
It is open drain and active
low.
WWAN to wake up the host.
The
maximum
IOL is 40
mA.
BodySAR detection (BodySAR_N) pin
USIM detection (USIM_DET) pin
Table 3-3 lists the pins on the signal control interface.
Table 3-3 Pins on the signal control interface
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Hardware pin for BodySAR
Detection.
When it is High, No TX
power backoff (default).
When it is Low, TX power
backoff.
USIM hot swap detection
pin.
Rising edge for insertion;
falling edge for removal.
When it is High, USIM is
present.
When it is Low, USIM is
absent.
The
module is
pulled up
inside.
The module is powered on.
NOTE: If the module needs to be powered on
automatically, the Power_On_Off pin must be pulled up
to 3.3 V.
The module is powered off.
It is internally pulled low with a weak pull-down resistor.
3.4.2 Power_On_Off Control Pin
The ME906s module can be controlled to be powered on/off by the Power_On_Off
pin.
Table 3-4 Two States of Power_On_Off
If the module is powered by the regulator with 3.3 V
If ME906s is powered by 3.3 V voltage regulator (such as notebook or Ultrabook),
Power_On_Off should be pulled up to 3.3 V through a resistor.
The pull-up resistor should be not greater than 47 kΩ .
Following is the power on/off sequence:
1. The module gets 3.3 V when supply for the module is switched on.
2. The module is turned on since Power_On_Off is pulled up to 3.3 V by the host.
3. Host cuts off 3.3 V supply to power off the module.
The recommended circuit is shown as in Figure 3-4 .
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Figure 3-4 Recommended connections of Power_On_Off pin (auto power)
ME906s
Pin2, 4, 70, 72, 74
Power on sequence
Do not toggle RESET# during power on sequence. Pulling RESET# low will extend
time for module startup. Recommended power on timing sequence is shown as
Figure 3-5 .
Figure 3-5 Recommended power on timing sequence
Power off sequence
Cutting off 3.3 V will power off the module.