Huawei FusionServer Pro XH321 V5 V100R005 Maintenance And Service Manual

FusionServer Pro XH321 V5 Server Node V100R005
Maintenance and Service Guide
Issue 07 Date 2019-12-20
HUAWEI TECHNOLOGIES CO., LTD.
Copyright © Huawei Technologies Co., Ltd. 2019. All rights reserved.
Trademarks and Permissions
and other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd. All other trademarks and trade names mentioned in this document are the property of their respective holders.
Notice
The purchased products, services and features are stipulated by the contract made between Huawei and the customer. All or part of the products, services and features described in this document may not be within the purchase scope or the usage scope. Unless otherwise specied in the contract, all statements, information, and recommendations in this document are provided "AS IS" without warranties, guarantees or representations of any kind, either express or implied.
The information in this document is subject to change without notice. Every eort has been made in the preparation of this document to ensure accuracy of the contents, but all statements, information, and recommendations in this document do not constitute a warranty of any kind, express or implied.
Huawei Technologies Co., Ltd.
Address: Huawei Industrial Base
Bantian, Longgang Shenzhen 518129 People's Republic of China
Website: https://e.huawei.com
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide About This Document

About This Document

Purpose
This document describes the physical structure, parts installation and removal procedures, appearance, and
Intended Audience
specications of the XH321 V5 server node.
This document is intended for:
Huawei technical support engineers
Technical support engineers from channel partners
Enterprise administrators
Symbol Conventions
The symbols that may be found in this document are dened as follows.
Symbol
Description
Indicates a hazard with a high level of risk which, if not avoided, will result in death or serious injury.
Indicates a hazard with a medium level of risk which, if not avoided, could result in death or serious injury.
Indicates a hazard with a low level of risk which, if not avoided, could result in minor or moderate injury.
Indicates a potentially hazardous situation which, if not avoided, could result in equipment damage, data loss, performance deterioration, or unanticipated results.
NOTICE is used to address practices not related to personal injury.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide About This Document
Symbol Description
Supplements the important information in the main text.
NOTE is used to address information not related to personal injury, equipment damage, and environment deterioration.
Change History
Issue Date Description
07 2019-12-20 ● This issue is the seventh ocial release.
06 2019-08-10 ● Added the support for the Cascade Lake
processors.
05 2019-01-04 ● Added the description about X722 LOMs
and PCIe slots.
● Updated the technical specications.
● Added the description of the NC-SI feature.
04 2018-08-02 ● Added the temperature restrictions when
the M.2 is used with a PCIe RAID controller card.
● Added information about the Avago SAS3004 iMR RAID controller card.
03 2018-05-21 Rened the document for easy use.
02 2018-01-22 ● Optimized the processor installation
procedure.
01 2017-12-29 ● This issue is the rst ocial release.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide Contents

Contents

About This Document................................................................................................................ ii
1 Overview....................................................................................................................................1
1.1 Overview.................................................................................................................................................................................... 1
1.2 Physical Structure.................................................................................................................................................................... 2
1.3 Logical Structure......................................................................................................................................................................3
2 Hardware Description.............................................................................................................5
2.1 Front Panel................................................................................................................................................................................ 5
2.1.1 Appearance............................................................................................................................................................................ 5
2.1.2 Indicators and Buttons....................................................................................................................................................... 6
2.1.3 Ports..........................................................................................................................................................................................9
2.1.4 Installation Positions........................................................................................................................................................ 11
2.2 Processor.................................................................................................................................................................................. 11
2.3 Memory.................................................................................................................................................................................... 12
2.3.1 Memory Identier............................................................................................................................................................. 12
2.3.2 Memory Subsystem Architecture................................................................................................................................. 13
2.3.3 Memory Compatibility..................................................................................................................................................... 14
2.3.4 Memory Installation Guidelines................................................................................................................................... 16
2.3.5 Memory Installation Positions...................................................................................................................................... 16
2.3.6 Memory Protection Technologies................................................................................................................................ 18
2.4 Storage..................................................................................................................................................................................... 18
2.4.1 Drive Congurations.........................................................................................................................................................18
2.4.2 Drive Numbering............................................................................................................................................................... 19
2.4.3 RAID Controller Card........................................................................................................................................................19
2.5 I/O Expansion......................................................................................................................................................................... 20
2.5.1 PCIe Cards............................................................................................................................................................................ 20
2.5.2 PCIe Slots..............................................................................................................................................................................20
2.5.3 PCIe Slot Description........................................................................................................................................................ 20
2.6 Boards....................................................................................................................................................................................... 21
2.6.1 Mainboard............................................................................................................................................................................21
3 Product
3.1 Technical Specications...................................................................................................................................................... 23
3.2 Environmental Specications............................................................................................................................................27
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Specications.......................................................................................................... 23
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide Contents
3.3 Physical Specications.........................................................................................................................................................28
4 Software and Hardware Compatibility............................................................................ 29
5 Safety Instructions................................................................................................................ 30
6 ESD............................................................................................................................................ 34
6.1 Preventing Electrostatic Discharge ................................................................................................................................ 34
6.2 Grounding Methods to Prevent Electrostatic Discharge......................................................................................... 35
7 Internal Cabling..................................................................................................................... 36
7.1 TPM Cabling........................................................................................................................................................................... 36
7.2 Screw-in RAID Controller Card Cabling.........................................................................................................................37
7.3 Cabling of the SATA Controller Integrated in the Southbridge............................................................................ 38
7.4 PCIe Card Cabling................................................................................................................................................................. 39
8 Parts Replacement................................................................................................................ 40
8.1 Spare Parts Description.......................................................................................................................................................40
8.2 Obtaining Tools..................................................................................................................................................................... 41
8.3 Basic Operations....................................................................................................................................................................42
8.3.1 Power-On Procedure........................................................................................................................................................ 42
8.3.2 Power-O Procedure........................................................................................................................................................43
8.3.3 Removing an XH321 V5.................................................................................................................................................. 44
8.3.4 Installing an XH321 V5....................................................................................................................................................47
8.4 Field Replaceable Units.......................................................................................................................................................50
8.4.1 Removing an M.2 SSD..................................................................................................................................................... 51
8.4.2 Installing an M.2 SSD.......................................................................................................................................................52
8.4.3 Removing the Screw-in RAID Controller Card......................................................................................................... 54
8.4.4 Installing the Screw-in RAID Controller Card.......................................................................................................... 56
8.4.5 Removing the Supercapacitor....................................................................................................................................... 58
8.4.6 Installing the Supercapacitor.........................................................................................................................................60
8.4.7 Removing the Avago SAS3004iMR PCIe RAID Control Card.............................................................................. 63
8.4.8 Installing the Avago SAS3004iMR PCIe RAID Control Card................................................................................64
8.4.9 Removing an M.2 FRU on the Avago SAS3004iMR PCIe RAID Controller Card..........................................64
8.4.10 Installing an M.2 FRU on the Avago SAS3004iMR PCIe RAID Controller Card......................................... 65
8.4.11 Removing a Processor................................................................................................................................................... 67
8.4.12 Installing a Processor.....................................................................................................................................................71
8.4.13 Removing a Memory Module..................................................................................................................................... 77
8.4.14 Installing a Memory Module.......................................................................................................................................78
8.4.15 Removing the TPM......................................................................................................................................................... 81
8.4.16 Installing the TPM...........................................................................................................................................................83
8.4.17 Removing the Battery....................................................................................................................................................86
8.4.18 Installing the Battery..................................................................................................................................................... 87
8.4.19 Removing a PCIe Card...................................................................................................................................................88
8.4.20 Installing a PCIe Card.................................................................................................................................................... 89
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide Contents
8.4.21 Removing the PCIe Riser Module.............................................................................................................................. 91
8.4.22 Installing the PCIe Riser Module................................................................................................................................93
8.4.23 Removing the Air Duct..................................................................................................................................................96
8.4.24 Installing the Air Duct................................................................................................................................................... 97
8.4.25 Removing the Mainboard and Server Node Case................................................................................................98
8.4.26 Installing the Mainboard and Server Node Case...............................................................................................100
9 Troubleshooting...................................................................................................................103
10 Common Operations........................................................................................................ 104
10.1 Querying the iBMC IP Address.................................................................................................................................... 104
10.2 Logging In to the iBMC WebUI................................................................................................................................... 105
10.3 Logging In to the Desktop of a Server..................................................................................................................... 109
10.3.1 Using the Remote Virtual Console......................................................................................................................... 109
10.3.1.1 iBMC.............................................................................................................................................................................. 109
10.3.2 Using the Independent Remote Console..............................................................................................................111
10.3.2.1 Windows.......................................................................................................................................................................111
10.3.2.2 Ubuntu.......................................................................................................................................................................... 113
10.3.2.3 macOS........................................................................................................................................................................... 115
10.4 Logging In to the CLI...................................................................................................................................................... 117
10.4.1 Logging In to the CLI Using PuTTY over a Network Port...............................................................................118
10.4.2 Logging In to the CLI Using PuTTY over a Serial Port..................................................................................... 120
10.5 Accessing the BIOS.......................................................................................................................................................... 121
10.5.1 Accessing the BIOS (Skylake)...................................................................................................................................122
10.5.2 Accessing the BIOS (Cascade Lake)....................................................................................................................... 123
11 More Information............................................................................................................. 126
11.1 Technical Support.............................................................................................................................................................126
11.2 Product Information........................................................................................................................................................127
11.3 Product
11.4 Maintenance Tools...........................................................................................................................................................128
12 Software and
12.1 iBMC..................................................................................................................................................................................... 130
12.2 BIOS...................................................................................................................................................................................... 131
12.3 FusionServer Tools SmartKit.........................................................................................................................................132
Conguration Resources............................................................................................................................... 128
Conguration Utilities........................................................................... 130
A Appendix............................................................................................................................... 135
A.1 Product SN............................................................................................................................................................................135
A.2 Operating Temperature Limitations............................................................................................................................ 136
A.2.1 Operating Temperature Limitations (Supercapacitor for the RAID Controller Card
A.2.2 Operating Temperature Limitations (Optical Modules Congured)............................................................ 138
A.2.3 Operating Temperature Limitations (Avago SAS3004iMR RAID Controller Card + M.2 FRU
Congured).................................................................................................................................................................................. 140
A.2.4 Operating Temperature Limitations
A.3 RAS Features........................................................................................................................................................................143
(Dierent Models of Processors)........................................................142
Congured)...... 136
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide Contents
B Glossary................................................................................................................................. 146
B.1 A-E........................................................................................................................................................................................... 146
B.2 F-J.............................................................................................................................................................................................147
B.3 K-O.......................................................................................................................................................................................... 147
B.4 P-T............................................................................................................................................................................................ 147
B.5 U-Z...........................................................................................................................................................................................148
C Acronyms and Abbreviations........................................................................................... 149
C.1 A-E........................................................................................................................................................................................... 149
C.2 F-J............................................................................................................................................................................................ 150
C.3 K-O.......................................................................................................................................................................................... 151
C.4 P-T............................................................................................................................................................................................ 152
C.5 U-Z.......................................................................................................................................................................................... 154
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 1 Overview

1 Overview

1.1 Overview

1.2 Physical Structure
1.3 Logical Structure
1.1 Overview
The XH321 V5 is a server node designed for Huawei X6000 servers. An X6000 can house up to four XH321 V5 server nodes in a 2U chassis.
The XH321 V5 delivers supreme performance and high storage density in limited space through innovative design. It is easy to manage and maintain.
The XH321 V5 supports six 2.5-inch SAS/SATA drives or NVMe drives, up to 16 DDR4 memory modules, and two PCIe cards.
The XH321 V5 is ideal for data center, cloud computing, Big Data, and Internet applications.
● Intel SoftRAID is supported if no RAID controller card is congured.
● The OSs supporting Intel SoftRAID include RHEL 7.3, RHEL 7.4, Windows Server 2012 R2, and Windows Server 2016.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 1 Overview
Figure 1-1 XH321 V5

1.2 Physical Structure

Figure 1-2 XH321 V5 physical structure
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 1 Overview
1 Air duct 2 Air duct for the
supercapacitor
3 RAID controller card/PCIe
card
5 Narrow conjoined heat
sinks
7 Battery 8 Mainboard
9 Processors 10 PCIe riser module
11 PCIe cards 12 Memory modules
13 Node case 14 M.2 SSD cards
15 TPM (with M.2 ports) - -

1.3 Logical Structure

Figure 1-3 XH321 V5 logical structure
4 Supercapacitor
6 Wide conjoined heat sinks
The server supports one or two Intel® Xeon® Scalable processors.
The server supports up to 16 memory modules.
The CPUs (processors) interconnect with each other through two UPI links at a speed of up to 10.4 GT/s.
The PCIe cards connected to the processors provide service ports.
The RAID controller card connects to the mainboard using a SAS cable and connects to the system backplane through a connector.
The BMC chipset interconnects with the PCH through PCIe and LPC buses to provide a management interface.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 1 Overview
The BMC integrates the graphics card, video compression, and virtual media component to provide device management functions, such as power control, slot ID acquisition, power supply detection, and KVM over IP.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description

2 Hardware Description

2.1 Front Panel

2.2 Processor
2.3 Memory
2.4 Storage
2.5 I/O Expansion
2.6 Boards
2.1 Front Panel

2.1.1 Appearance

Figure 2-1 Front view
1
3 Slide-out label plate (with
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PCIe card (RAID controller card not congured)
an SN label)
2 PCIe cards
- -
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description

2.1.2 Indicators and Buttons

Positions
Figure 2-2 Indicators and buttons on the front panel
1 Data transmission rate
indicator for a 10GE optical port
3 Power button/indicator 4 Health status indicator
5 UID button/indicator 6 Data transmission status
7 Connection status
indicator for a GE electrical port
9 Connection status
indicator for the management network port
2 Connection status
indicator/Data transmission status indicator for a 10GE optical port
indicator for a GE electrical port
8 Data transmission status
indicator for the management network port
- -
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
Indicator and Button Description
Table 2-1 Indicators and buttons on the front panel
Silkscreen Indicator/
Button
Power button/ indicator
Description
Power indicator:
O: The device is not powered on.
● Steady green: The device is powered on.
● Blinking yellow: The power button is locked. The power button is locked when the iBMC is starting.
● Steady yellow: The device is ready to power on.
Power button:
● When the device is powered on, you can press this button to gracefully shut down the OS.
● When the device is powered on, holding down this button for 6 seconds will forcibly power
● When the power indicator is steady green, you can press this button to power on the device.
o the device.
Health status indicator
O: The device is powered o or is faulty.
● Blinking red at 1 Hz: A major alarm has been generated on the system.
● Blinking red at 5 Hz: A critical alarm has been generated on the system.
● Steady green: The device is operating properly.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
Silkscreen Indicator/
Button
UID button/ indicator
- Data transmission rate indicator for a 10GE optical port
Description
The UID button/indicator helps identify and locate a device.
UID indicator:
O: The device is not being located.
● Blinking blue: The device has been located and is
dierentiated from other devices that
have also been located.
● Steady blue: The device is being located.
UID button:
● You can turn on or
o the UID indicator by pressing the UID button on the panel or by using the iBMC CLI or WebUI.
● You can press this button to turn on or
o
the UID indicator.
● You can press and hold down this button for 4 to 6 seconds to reset the iBMC.
O: The network port is not connected.
● Steady green: The data transmission rate is 10 Gbit/s.
● Steady yellow: The data transmission rate is 1 Gbit/s.
- Connection status indicator/ Data transmission status indicator for a 10GE optical port
- Data transmission status indicator for a GE electrical port
- Connection status indicator for a GE electrical port
O: The network port is not connected.
● Blinking green: Data is being transmitted.
● Steady green: The network port is properly connected.
O: The network port is not connected.
● Steady yellow: The network port is in active status.
● Blinking yellow: Data is being transmitted.
O: The network port is not connected.
● Steady green: The network port is properly connected.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description

2.1.3 Ports

Port Positions
Silkscreen Indicator/
Button
- Data transmission status indicator for the management network port
- Connection status indicator for the management network port
Description
O: No data is being transmitted.
● Blinking yellow: Data is being transmitted.
O: The network port is not connected.
● Steady green: The network port is properly connected.
Ports on the front panel
Figure 2-3 Ports on the front panel
1
3 LOM port 2 (10GE
5 LOM port 4 (GE
Ports on the multi-port cable
Universal connector port 2 LOM port 1 (10GE
optical port)
electrical port)
optical port)
4 LOM port 3 (GE
electrical port)
6 Management network
port
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
Figure 2-4 Multi-port cable
1 VGA port 2 Two USB ports
3 Serial port 4 One USB port
5 Multi-port connector - -
Port Description
Table 2-2 Ports on the front panel
Port
Universal connector port
Management network port
Type Quantity Description
- 1 Used to connect a multi-port cable, which provides one DB-15 VGA port, three USB
2.0 ports, and one RJ45 serial port.
RJ45 1 Used for server management.
NOTE
The management network port is a GE port that supports 100 Mbit/s and 1000 Mbit/s auto­negotiation.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
Table 2-3 LOM ports
Chip Model Port Type Rate
Negotiation Mode
X722 10GE optical
port
GE electrical port
● Use Intelligent Computing Compatibility Checker to obtain information about the cables and optical modules supported by the LOM ports.
● The LOM ports do not support forced rates.
● The electrical LOM ports cannot be connected to power over Ethernet (PoE) devices (such as a switch with PoE enabled). Connecting a LOM port to a PoE device may cause link communication failure or even damage the NIC.
● The electrical LOM ports do not support SR-IOV.
● Forcibly powering and disable the Wake on LAN (WOL) function of the LOM ports. To restore the NC-SI connection, refresh the iBMC WebUI.
o a server will cause intermittent NC-SI disconnection
Auto­negotiation 10000 Mbit/s (full duplex)
Auto­negotiation 1000 Mbit/s (full duplex)
Supported Rates
10000M 10/100/1000
1000M 10/100M
Rates Not Supported
M

2.1.4 Installation Positions

An X6000 can house a maximum of four XH321 V5 nodes in a 2U chassis.
Figure 2-5 Installation positions

2.2 Processor

The server supports one or two processors.
If only one processor is required: – Install it in socket CPU1. – NVMe SSDs are not supported.
The processor heat sink varies depending on the processor power: – If the maximum processor power is 165 W, use a narrow conjoined heat
sink.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
If the processor power is higher than 165 W, use a wide conjoined heat
sink.
The same model of processors must be used in a server.
Contact your local Huawei sales representative or use the Intelligent
Computing Compatibility Checker to determine the components to be used.
Figure 2-6 Processor positions

2.3 Memory

2.3.1 Memory Identier
You can determine the memory module properties based on the label attached to the memory module.
Figure 2-7 Memory identier
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
callout Description Denition
1 Capacity of the memory
module
2 Number of ranks of the
memory module
3 Data width on the DRAM ● X4: 4-bit
4 Type of the memory interface ● PC3: DDR3
5 Maximum memory speed ● 2133 MT/S
● 8 GB
● 16 GB
● 32 GB
● 64 GB
● 128 GB
● 1R: single-rank
● 2R: dual-rank
● 4R: quad-rank
● 8R: octal-rank
● X8: 8-bit
● PC4: DDR4
● 2400 MT/S
● 2666 MT/S
● 2933 MT/S
6 Column Access Strobe (CAS)
latency
7 DIMM type ● R: RDIMM

2.3.2 Memory Subsystem Architecture

The XH321 V5 provides 16 memory slots. Each processor integrates six memory channels.
Install memory modules in primary memory channels channel is not populated, the memory modules in secondary memory channels cannot be used.
Table 2-4 Memory channels
CPU
CPU 1 1A (primary) DIMM000(A)
Memory Channel Memory Slot
● P: 15
● T: 17
● L: LRDIMM
rst. If the primary memory
1A DIMM001(G)
1B DIMM010(B)
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
CPU Memory Channel Memory Slot
1C DIMM020(C)
1D (primary) DIMM030(D)
1D DIMM031(H)
1E DIMM040(E)
1F DIMM050(F)
CPU 2 2A (primary) DIMM100(A)
2A DIMM101(G)
2B DIMM110(B)
2C DIMM120(C)
2D (primary) DIMM130(D)
2D DIMM131(H)

2.3.3 Memory Compatibility

Observe the following rules when conguring DDR4 memory modules:
● A server must use the same model of DDR4 memory modules, and all the
memory modules operate at the same speed, which is the smallest value of:
Memory speed supported by a processor
Maximum operating speed of a memory module
● The DDR4 memory modules of
specications (capacity, bit width, rank, and height) cannot be used together.
● Contact your local Huawei sales representative or use the Intelligent
Computing Compatibility Checker to determine the components to be used.
2E DIMM140(E)
2F DIMM150(F)
dierent types (RDIMM and LRDIMM) and
The memory can be used with Intel® Xeon® Scalable Skylake and Cascade Lake processors. The maximum memory capacity supported varies depending on the processor model.
Skylake processors
n M processors: 1.5 TB/socket n Other processors: 768 GB/socket
Cascade Lake processors
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
n L processors: 4.5 TB/socket n M processors: 2 TB/socket n Other processors: 1 TB/socket
The total memory capacity is the sum of the capacity of all DDR4 memory modules.
The total memory capacity cannot exceed the maximum memory capacity supported by the CPUs.
Use the Intelligent Computing Compatibility Checker to determine the capacity type of a single memory module.
The maximum number of memory modules supported by a server varies depending on the CPU type, memory type, rank quantity, and operating voltage.
Each memory channel supports a maximum of 8 ranks. The number of memory modules supported by each channel varies depending on the number of ranks supported by each channel:
Number of memory modules supported by each channel ≤ Number of ranks supported by each memory channel/Number of ranks supported by each memory module
A memory channel supports more than eight ranks for LRDIMMs.
A quad-rank LRDIMM generates the same electrical load as a single-rank RDIMM on a memory bus.
Table 2-5 DDR4 memory specications
Parameter
Specications
Maximum capacity per DDR4 memory module (GB) 64
Rated speed (MT/s) 2933
Operating voltage (V) 1.2
Maximum number of DDR4 memory modules in a
a
node
Maximum DDR4 memory capacity of the node
b
(GB)
16
1024
Maximum operating
1DPC
c
2933
d
speed (MT/s)
2DPC 2666
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
Parameter Specications
● a: The maximum number of DDR4 memory modules is based on dual­processor conguration. The value is halved for a server with only one processor.
● b: The maximum DDR4 memory capacity varies depending on the processor type. The value listed in this table is based on the assumption that memory modules are fully
congured.
● c: DPC (DIMM per channel) indicates the number of DIMMs per channel.
● d: If the Cascade Lake processor is used, the maximum operating speed of a memory module can reach 2933 MT/s. If the Skylake processor is used, the maximum operating speed of a memory module can reach 2666 MT/s only.

2.3.4 Memory Installation Guidelines

Observe the following when conguring DDR4 memory modules: – Install memory modules only when corresponding processors are
installed. – Do not install LRDIMMs and RDIMMs in the same server. – Install
Observe the following when operating mode:
Memory sparing mode
n Comply with the general installation guidelines. n Each memory channel must have a valid online spare n The channels can have dierent online spare congurations. n Each populated channel must have a spare rank.
Memory mirroring mode
n Comply with the general installation guidelines. n Install memory modules for channels 1 and 2 or channels 3 and 4.
n For a multi-processor
Memory scrubbing mode
n Comply with the general installation guidelines.
ller memory modules in vacant slots.
conguring DDR4 memory modules in specic
conguration.
The memory modules installed must be identical in size and organization.
conguration, each processor must have a
valid memory mirroring conguration.

2.3.5 Memory Installation Positions

An XH321 V5 supports a maximum of 16 DDR4 memory modules. Balanced memory
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conguration is recommended for optimal memory performance.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
At least one DDR4 memory module must be installed in the memory slots corresponding to CPU 1.
Figure 2-8 Memory slots
Figure 2-9 DDR4 memory installation guidelines (1 processor)
Figure 2-10 DDR4 memory installation guidelines (2 processors)
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description

2.3.6 Memory Protection Technologies

The following memory protection technologies are supported:
ECC
Full mirroring
Address range mirroring
Rank sparing mode
Faulty DIMM isolation
Memory thermal throttling
Memory address parity protection
Adaptive double device data correction (ADDDC)
Memory demand/patrol scrubbing
Data Scrambling
ADDDC+1

2.4 Storage

2.4.1 Drive
Congurations
Table 2-6 Drive conguration
Conguration
Built-in drive 2
● a: The M.2 SSDs come in two sizes 2242 and 2280, and support the SATA interface.
● Contact your local Huawei sales representative or use the Intelligent
Computing Compatibility Checker to determine the components to be
used.
Maximum Drives Drive Management
Mode
-
● Slots 1 and 2 support only M.2 SSDsa.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 18
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description

2.4.2 Drive Numbering

Figure 2-11 Drive numbering

2.4.3 RAID Controller Card

The RAID controller card supports RAID conguration, RAID level migration, and drive roaming.
Contact your local Huawei sales representative or use the Intelligent
Computing Compatibility Checker to determine the components to be used.
Table 2-7 RAID levels supported by the XH321 V5
RAID Level
RAID 0 Low High High 1 100%
RAID 1 High Low Low 2 1/N
RAID 5 Relatively
RAID 6 Relatively
Reliability Read
high
high
Write Performan ce
High Medium 3 (N – 1)/N
High Medium 4 (N – 2)/N
Performan
ce
Minimum Number of Drives
Drive Utilization
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 19
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
RAID Level Reliability Read
RAID 10 High Medium Medium 4 M/N
RAID 50 High High Relatively
RAID 60 High High Relatively
● M indicates the number of spans in a RAID array.
● N indicates the number of member drives in a RAID array.

2.5 I/O Expansion

2.5.1 PCIe Cards

PCIe cards provide ease of expandability and connection.
Performan ce
Write
Performan
ce
high
high
Minimum Number of Drives
6 (N – M)/N
8 (N – M x
Drive Utilization
2)/N
Contact your local Huawei sales representative or use the Intelligent
Computing Compatibility Checker to determine the components to be used.

2.5.2 PCIe Slots

Figure 2-12 PCIe Slot

2.5.3 PCIe Slot Description

The PCIe slots mapping to a vacant CPU socket are unavailable.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 20
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
Table 2-8 PCIe slot description
PCIe Slot
RAID controll er card
LOM CPU 1 PCIe 3.0 - x8 Port1A 17/00/0 -
Slot 1 CPU 1 PCIe 3.0 x16 x16 Port3A 5d/00/0 HHHL
Slot 2 CPU 1 PCIe 3.0 x16 x16 Port2A 3a/00/0 HHHL
● The B/D/F (Bus/Device/Function Number) values are the default values when the server is fully congured with PCIe devices. The values may vary if the server is not fully congured with PCIe devices or if a PCIe card with a PCI bridge is congured.
● The PCIe x16 slots are backward compatible with PCIe x8, PCIe x4, and PCIe x1 cards. The PCIe cards are not forward compatible. That is, the PCIe slot width cannot be smaller than the PCIe card link width.
CPU PCIe
Standa rds
CPU 1 PCIe 3.0 x8 x8 Port1C 1c/00/0 -
Connec tor Width
Bus Width
Port No.
B/D/F Slot
Size

2.6 Boards

2.6.1 Mainboard

Figure 2-13 XH321 V5 mainboard
1
3 RAID controller card
PCIe slot 1 2 Southbridge
4 Slimline connector
connector
5 CPU 1 6 DIMM050 connector
7 DIMM040 connector 8 DIMM030 connector
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 2 Hardware Description
9 DIMM031 connector 10 CPU 2
11 DIMM150 connector 12 DIMM140 connector
13 DIMM130 connector 14 DIMM131 connector
15 Left guide sleeve 16 Slimline connector
17 Power connector 18 Power connector
19 Signal connector 20 Signal connector
21 Signal connector 22 Right guide sleeve
23 DIMM101 connector 24 DIMM100 connector
25 DIMM110 connector 26 DIMM120 connector
27 DIMM001 connector 28 DIMM000 connector
29 DIMM010 connector 30 DIMM020 connector
31 M.2 connector port 0 32 OPA signal connector
33 M.2 connector port 1 34 TPM signal connector
35 PCIe slot 2 36 NC-SI connector
37 SoftRAID key connector 38 Battery
39 iBMC management
40 LOM GE port 4
network port
41 LOM GE port 3 42 UID button/indicator
43 Power button/indicator 44 2 x 10GE optical ports
45 Optical port indicator 46 Universal connector port
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 22
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 3 Product Specications
3 Product Specications
3.1 Technical Specications
3.2 Environmental Specications
3.3 Physical Specications
3.1 Technical Specications
Table 3-1 Technical specications
Category
Form factor 2U4 server node
Chipset
Processors Supports one or two processors.
Specications
Intel® C622
● Intel® Xeon® Scalable (Skylake and Cascade Lake) processors
● Built-in memory controller and six memory channels
● Built-in PCIe controller, supporting PCIe 3.0 and 48 lanes per processor
● Two UPI buses between processors, providing up to
10.4GT/s transmission per channel
● Up to 28 cores (2.5 GHz)
● Max. 3.8 GHz (four cores)
● Min. 1.375 MB L3 cache per core
● Max. 205 W TDP
NOTE
The preceding information is for reference only. Use the
Intelligent Computing Compatibility Checker to obtain
specic information.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 23
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 3 Product Specications
Category Specications
Memory Supports 16 memory modules of the following types:
● Up to 16 DDR4 memory modules
● Max. 2933 MT/s memory speed
● RDIMM and LRDIMM support
● The DDR4 memory modules of dierent types (RDIMM and LRDIMM) and
specications (capacity, bit width, rank, and height) cannot be used together.
NOTE
The preceding information is for reference only. Use the
Intelligent Computing Compatibility Checker to obtain
specic information.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 24
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 3 Product Specications
Category Specications
Storage Supports a variety of drive congurations. For details,
see 2.4.1 Drive Congurations.
● Supports two M.2 SSDs.
NOTE
● The M.2 SSD module is used only as the boot device when the OS is installed. Small-capacity (32 GB or 64 GB) M.2 SSDs do not support logging due to poor endurance. If a small-capacity M.2 SSD is used as the boot device, a dedicated log drive or log server is required for logging. For example, you can dump VMware logs in either of the following ways:
● Redirect /scratch. For details, see https://
kb.vmware.com/s/article/1033696.
Congure syslog. For details, see https://
kb.vmware.com/s/article/2003322.
● The M.2 SSD cannot be used to store data due to poor endurance. In write-intensive applications, the M.2 SSD will wear out in a short time. Use enterprise-level high endurance (HE) SSDs or HDDs for data storage.
● The M.2 SSD is not recommended for write-intensive service software due to poor endurance.
● Do not use the M.2 SSD as the cache.
● Supports hot swap of SAS/SATA drives.
● Supports a variety of RAID controller cards. Use the
Intelligent Computing Compatibility Checker to
obtain information about the
specic RAID
controller cards supported. – The RAID controller card supports RAID
conguration, RAID level migration, and drive roaming.
– The RAID controller card does not occupy a
standard PCIe slot.
For details about the RAID controller card, see
Huawei V5 Server RAID Controller Card User Guide.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 25
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 3 Product Specications
Category Specications
Network Supports LOM.
● Supports two 10GE optical ports and two GE electrical ports via the NIC chip integrated on the mainboard.
● The LOM ports support NC-SI, WOL, and PXE.
NOTE
● The electrical LOM ports cannot be connected to PoE devices (such as a switch with PoE enabled). Connecting a LOM port to a PoE device may cause link communication failure or even damage the NIC.
● Forcibly powering o a server will cause intermittent NC-SI disconnection and disable the WOL function of the LOM ports. To restore the NC-SI connection, refresh the iBMC WebUI.
I/O expansion 3 PCIe 3.0 slots:
● One slot dedicated for a RAID controller card and two for standard PCIe cards. For details, see 2.5.2 PCIe Slots and 2.5.3 PCIe Slot
Description.
● Support Huawei proprietary PCIe SSD cards to bolster I/O performance for applications such as searching, caching, and download services.
NOTE
The preceding information is for reference only. Use the
Intelligent Computing Compatibility Checker to obtain
specic information.
Ports Supports a variety of ports.
● Ports on the front panel: – One universal connector port – One system management port – Two GE electrical ports – Two 10GE optical ports
● Built-in ports: – 2 SATADOM ports
Video card An SM750 video chip with 32 MB display memory is
integrated on the mainboard. The maximum display resolution is 1920 x 1200 at 60 Hz with 16 M colors.
NOTE
The integrated video card can provide the maximum display resolution (1920 x 1200) only after the video card driver matching the operating system version is installed. Otherwise, only the default resolution supported by the operating system is provided.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 26
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 3 Product Specications
Category Specications
System management ● UEFI
● iBMC
● NC-SI
● Integration with third-party management systems
Security features ● Power-on password
● Administrator password
● TPM (only outside China)
● Secure boot
3.2 Environmental Specications
Table 3-2 Environmental specications
Category Specications
Temperature ● Operating temperature: 5°C to 35°C (41°F to 95°F)
(ASHRAE Class A2 compliant)
● Storage temperature: –40°C to +65°C (–40°F to +149°F)
● Long-term storage temperature: 21°C to 27°C (69.8°F to 80.6°F)
● Maximum temperature change rate: 20°C/h (36°F/h)
NOTE
● If a single fan is faulty:
● The highest operating temperature supported is 30°C (86°F).
● If the power consumption of the processor is 125 W or
aected or a
Relative humidity (RH, non-condensing)
higher, the system performance may be temperature alarm may be generated.
● The highest operating temperature varies depending on conguration. For details, see A.2 Operating
the
Temperature Limitations.
● Operating humidity: 8% to 90%
● Storage humidity: 5% to 95%
● Long-term storage humidity: 30% to 69%
● Maximum change rate: 20%/h
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 27
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 3 Product Specications
Category Specications
Altitude ● Operating altitude ≤ 3050 m (10006.44 ft)
When the server conguration complies with ASHRAE Class A2 standards and the altitude is above 900 m (2952.76 ft), the highest operating temperature decreases by 1°C (1.8°F) for every increase of 300 m (984.24 ft).
● HDDs cannot be used at an altitude of over 3000 m (9842.4 ft).
● Titanium PSUs are required for the altitude higher than 3000 m (9842.4 ft).
Corrosive gaseous contaminant
Particle contaminant ● The equipment room environment meets the
3.3 Physical
Table 3-3 Physical specications
Category
Maximum corrosion product thickness growth rate:
● Copper corrosion rate test: 300 Å/month (meeting level G1 requirements of the ANSI/ISA-71.04-2013 standard on gaseous corrosion)
● Silver corrosion rate test: 200 Å/month
requirements of ISO 14664-1 Class 8.
● There is no explosive, conductive, magnetic, or corrosive dust in the equipment room.
NOTE
It is recommended that the particulate pollutants in the equipment room be monitored by a professional organization.
Specications
Description
Dimensions (H x W xD)40.5 mm x 177.9 mm x 545.5 mm (1.59 in. x 7.00 in. x
17.89 in.)
Weight in full
conguration
Power consumption The power consumption parameters vary with the
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 28
● Net weight: 4.2 kg (9.26 lb)
● Packing material weight: 2.73 kg (6.02 lb)
conguration. Use the Huawei Server Power
Calculator to obtain specic information.
NO TICE
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 4 Software and Hardware Compatibility

4 Software and Hardware Compatibility

Use the Intelligent Computing Compatibility Checker to obtain information about the operating systems and hardware supported.
Do not use incompatible components. Otherwise, the server may fail to work properly. The technical support and warranty do not cover faults caused by incompatible components.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 29
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 5 Safety Instructions

5 Safety Instructions

General Instructions
Comply with all local laws and regulations when installing the hardware. The safety instructions in this document are only supplemental to local laws and regulations.
The "DANGER", "WARNING", and "CAUTION" information in this document does not represent all the safety instructions, but supplements to the safety instructions.
To ensure safety when installing hardware, follow all safety instructions provided on the device labels and in this document.
Only
Take protective measures if a Class A product is used in residential areas as it
qualied personnel are allowed to perform special tasks, such as
performing high-voltage operations and driving a forklift.
is likely to cause radio interference.
Personal Safety
Only personnel hardware.
Stop any operation that may cause personal injury or equipment damage, report the problem to a project supervisor immediately, and take protective measures.
Do not operate the product or handle cables during thunderstorms.
Before carrying devices, note the following points: – Do not carry more weight than is permitted by local laws or regulations. – Ensue that there are enough people to carry the devices.
Wear clean protective gloves, ESD clothing, a protective hat, and protective shoes, as shown in Figure 5-1.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 30
certied or authorized by Huawei are allowed to install the
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 5 Safety Instructions
Figure 5-1 Protective clothing
Before touching a device, ensure that you are wearing ESD clothing and ESD gloves (or wrist strap), and remove any conductive objects (such as watches and jewelry). Figure 5-2 shows conductive objects that must be removed before you touch a device.
Figure 5-2 Conductive objects to be removed
Figure 5-3 shows how to wear an ESD wrist strap.
a. Secure the ESD wrist strap around your wrist. b. Fasten the strap buckle and ensure that the ESD wrist strap is in contact
with your skin.
c. Insert the ground terminal attached to the ESD wrist strap into the jack
on the grounded rack or chassis.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 31
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 5 Safety Instructions
Figure 5-3 Wearing an ESD wrist strap
Exercise caution when using tools that could cause personal injury.
If the installation position of the device is above shoulder height, use a stacker to lift it. This will prevent it from falling.
To prevent electric shock, do not touch high-voltage cables directly or indirectly. A high-voltage power supply may be powering the device.
Properly ground a device before powering it on.
Do not use a ladder alone. Have someone else hold the ladder steady to prevent accidents.
To avoid damaging your eyes when installing, testing, or replacing optical cables, do not look into optical ports without eye protection.
Equipment Safety
Use the recommended power cables at all times.
Always use the power cables delivered with the devices.
Wear ESD clothing and gloves before handling a device. This prevents electrostatic damage.
When moving a device, hold the bottom of the device. Do not hold the handles of the installed modules, such as the PSUs, fan modules, drives, and the mainboard. Handle the equipment with care.
Exercise caution when using tools that could cause personal injury.
Connect the primary and secondary power cables to distribution units (PDUs) to ensure reliable system operation.
Properly ground a device before powering it on.
Transportation Precautions
Improper transportation may damage equipment. Contact the manufacturer for precautions before attempting transportation.
dierent power
Exercise caution when transporting equipment.
The logistics company engaged to transport the equipment must be reliable and comply with international standards for transporting electronics. Ensure that the equipment being transported is always upright. Take necessary precautions to prevent collisions, corrosion, package damage, damp conditions and pollution.
Transport the equipment in its original packaging.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 32
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 5 Safety Instructions
If the original packaging is unavailable, package heavy, bulky parts (such as chassis and blades) and fragile parts (such as PCIe GPUs and SSDs) separately.
Use Intelligent Computing Compatibility Checker to obtain information abut the components supported by a node or server.
Ensure that all devices are powered o before transportation.
Limits for the Maximum Weight Carried Per Person
To reduce the risk of personal injury, comply with local regulations with regard to the maximum weight one person is permitted to carry.
Table 5-1 lists the maximum weight one person is permitted to carry as stipulated
by a number of organizations.
Table 5-1 Maximum weight one person is permitted to carry
Organization
European Committee for
Weight (kg/lb)
25/55.13
Standardization (CEN)
International Organization for
25/55.13
Standardization (ISO)
National Institute for Occupational
23/50.72
Safety and Health (NIOSH)
Health and Safety Executive (HSE) 25/55.13
General Administration of Quality Supervision, Inspection and Quarantine
● Men: 15/33.08
● Women: 10/22.05
of the People's Republic of China (AQSIQ)
For more information about security instructions, see Huawei Server Safety
Information.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 33
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 6 ESD

6 ESD

6.1 Preventing Electrostatic Discharge

6.2 Grounding Methods to Prevent Electrostatic Discharge
6.1 Preventing Electrostatic Discharge
The static electricity on the human body or other electrical conductors may damage the mainboard or other electrostatic-sensitive devices and shorten the product life.
To minimize ESD damage, observe the following precautions:
Lay ESD chairs. The equipment room is equipped with ESD clapboards, ESD screens, and ESD curtains.
All the equipment room must be directly grounded. All electric meters or tools on a workbench must be connected to the common ground point of the workbench.
Monitor the temperature and humidity in the equipment room. The heating system reduces indoor humidity and increases ESD.
Place unused products into ESD bags to prevent direct contact with humans during transportation and storage.
Before products arrive at an ESD area, store them in their own packages.
Place the product package on a grounded surface before taking out the product.
oors or ESD cushions in the entire equipment room, and use ESD
oor-standing electric devices, metal frames, and metal chassis shells in
Wear an ESD wrist strap when installing or removing a server component. Ensure that the ground terminal of the ESD wrist strap is inserted into the ESD jack in the chassis.
During parts replacement, keep new server components in ESD bags before installation, and place removed server components on ESD mats for temporary storage.
Do not touch pins, wires, or integrated circuits.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 34
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 6 ESD

6.2 Grounding Methods to Prevent Electrostatic Discharge

Use one or more of the following grounding methods when handling or installing electrostatic-sensitive components:
Use a wrist strap that connects to a grounded workplace or server chassis. The wrist strap must be be at least 1 megohm (±10%). To provide proper grounding, wear the strap snug against the skin.
Use heel straps, toe straps, or boot straps in standing workplaces. Wear the straps on both feet when standing on conductive mats.
Use conductive eld service tools.
Use a portable
eld service kit with a folding static-dissipating work mat.
exible and the resistance of the ground cable must
oors or dissipating oor
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 35
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 7 Internal Cabling

7 Internal Cabling

7.1 TPM Cabling

7.2 Screw-in RAID Controller Card Cabling
7.3 Cabling of the SATA Controller Integrated in the Southbridge
7.4 PCIe Card Cabling
7.1 TPM Cabling
Figure 7-1 TPM cabling
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 36
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 7 Internal Cabling
Table 7-1 TPM cabling
No. Huawei BOM
Code
1 04051409-003Signal cable for connecting the TPM to the M.2
2 04080547 Signal cable for connecting the TPM to the TPM
3 04051409-004Signal cable for connecting the TPM to the M.2
Description
connector on the mainboard
connector on the mainboard
connector on the mainboard

7.2 Screw-in RAID Controller Card Cabling

Figure 7-2 Screw-in RAID controller card cabling
Table 7-2 Screw-in RAID controller card cabling
No.
1 04052070 Signal cable for connecting the screw-in RAID
2 04052070 Signal cable for connecting the screw-in RAID
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 37
Huawei BOM Code
Description
controller card (Port A) to the Slimline connector
controller card (Port B) to the Slimline connector
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 7 Internal Cabling

7.3 Cabling of the SATA Controller Integrated in the Southbridge

Figure 7-3 Internal cabling for the SATA controller integrated in the southbridge
Table 7-3 Cabling of the SATA Controller Integrated in the Southbridge
No.
1 04052068 Signal cable for connecting the southbridge to the
Huawei BOM Code
Description
Slimline connector
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 38
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 7 Internal Cabling

7.4 PCIe Card Cabling

Figure 7-4 PCIe card cabling
Table 7-4 PCIe card cabling
No.
1 04080606 Signal cable for connecting the PCIe card to the
This cable is required only when the PCIe card is an SP380 NIC (BOM code: 02312JBD).
Huawei BOM Code
Description
NC-SI connector
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 39
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 8 Parts Replacement

8 Parts Replacement

8.1 Spare Parts Description

8.2 Obtaining Tools
8.3 Basic Operations
8.4 Field Replaceable Units
8.1 Spare Parts Description
Table 8-1 Spare parts description
Category
Regular Spare Part (RSP) Regular spare
Non-Regular Spare Part (NRSP) Mechanical parts,
Property Application
Scenarios
Stored in the parts include boards and modules. Safety stock is recommended.
accessories, and cables. Generally, safety stock is not kept for NRSPs. NRSPs are provided on demand; however, the lead time is not committed.
warehouses near
sites based on the
contract service
type, Service Level
Agreement (SLA),
and service sites.
Stored in a
country's
warehouses based
on the contract
service type.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 40
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 8 Parts Replacement
Category Property Application
Scenarios
Non-Spare Part (NSP) NSPs are not
spare parts and do not have replaceable units at lower levels.
RSP&SUB (Sub-Part) It is classied as a
type of RSP and has RSPs or NRSPs at lower levels.
NRSP&SUB It is classied as a
type of NRSP and has RSPs or NRSPs at lower levels.
Not supplied or
stored.
Stored in the
warehouses near
sites based on the
contract service
type, SLA, and
service sites.
Lower-level parts
vary with actual
demands.
Stored in a
country's
warehouses based
on the contract
service type.
Lower-level parts
vary with actual
demands.
NSP&SUB It is not a spare

8.2 Obtaining Tools

Ensure that the following tools are available:
ESD wrist strap or ESD gloves
Protective gloves
ESD bags
Box cutter
M3 Phillips screwdriver
PH1 screwdriver
Flat-head screwdriver
Die-casting pliers
part, but has RSPs or NRSPs at lower levels.
This part is not
stored. Lower-
level parts vary
with actual
demands.
Used to remove LC optical network cables.
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 41
bers, pluggable optical modules, and unshielded
NO TICE
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 8 Parts Replacement
Figure 8-1 Die-casting pliers

8.3 Basic Operations

8.3.1 Power-On Procedure

● Before powering on a server node, ensure that the PSUs are switched o, all cables are connected correctly, and the power supply voltage meets service requirements.
● During the power-on process, do not remove and insert drives or disconnect and connect network cables or Console port cables.
● If a server node is powered o, wait for at least one minute before powering it on again.
The server node can be powered on in any of the following ways:
If the server node is installed but the chassis is not yet powered on, power on
the chassis. The server node will be powered on along with the chassis.
If the chassis is powered on but the server node is not installed, install the
server node. The server node will be automatically powered on after it is installed.
If the chassis is powered on but the server node is not running properly, hold
the power button the front panel for six seconds to power node forcibly, and then press the power button to power it on.
If the chassis is powered on and the server node is in standby state (the
power indicator is steady yellow), you can use any of the following methods to power on the server node:
Use the iBMC WebUI.
i. Log in to the iBMC WebUI.
For details, see 10.2 Logging In to the iBMC WebUI.
ii. Choose Power > Power Control.
The Power Control page is displayed.
iii. Click Power On.
A
conrmation message is displayed.
o the service
Issue 07 (2019-12-20) Copyright © Huawei Technologies Co., Ltd. 42
FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 8 Parts Replacement
iv. Click Yes.
Use the iBMC CLI.
i. Log in to the iBMC CLI.
For details, see 10.4 Logging In to the CLI.
ii. Run the following command:
ipmcset -d powerstate -v 1
iii. Type y or Y and press Enter.
Use the Remote Virtual Console.
i. Log in to the Remote Virtual Console.
For details, see 10.3 Logging In to the Desktop of a Server.
8.3.2
ii. On the KVM screen, click iii. Select Power On.
A dialog box is displayed.
iv. Click Yes.
Power-O Procedure
● Powering o a server node will interrupt all services and programs running on it. Therefore, before powering o a server node, ensure that all services and programs have been stopped or migrated to other server nodes.
● The "power-o" mentioned here is an operation performed to change the server node to the standby state (the power indicator is steady yellow).
● After a server node is powered o forcibly, wait for more than 10 seconds for the server node to power o completely. Do not power on the server node again before it is completely powered o.
● Forced power-o may damage user programs or unsaved data. Exercise caution when performing this operation.
The server node can be powered o in any of the following ways:
Power o the chassis. The server node will be powered o along with the chassis.
When the server node is in power-on state, pressing the power button on the server node front panel can power o the server node gracefully.
or on the toolbar.
If the server node OS is running, shut down the OS according to the onscreen instructions.
For details, see 2.1.2 Indicators and Buttons.
When the server node is in power-on state, holding down the power button on the server node front panel for six seconds can power o the server node forcibly.
For details, see 2.1.2 Indicators and Buttons.
Use the iBMC WebUI. a. Log in to the iBMC WebUI.
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For details, see 10.2 Logging In to the iBMC WebUI.
b. Choose Power > Power Control.
The Power Control page is displayed.
c. Click Power O or Forced Power O.
A conrmation message is displayed.
d. Click Yes.
Use the iBMC CLI.
a. Log in to the iBMC CLI.
For details, see 10.4 Logging In to the CLI.
b. Run the following command:
ipmcset -d powerstate -v 1
c. Type y or Y and press Enter.
Use the Remote Virtual Console.
a. Log in to the Remote Virtual Console.
For details, see 10.3 Logging In to the Desktop of a Server.
b. On the KVM screen, click c. Choose Power
A dialog box is displayed.
d. Click Yes.
O or Forced Power O.

8.3.3 Removing an XH321 V5

Procedure
Step 1 Determine the position of the server node in the chassis.
Figure 8-2 Positions and slot numbers of the XH321 V5 server nodes
or on the toolbar.
Step 2 Power o the server node.
For details, see 8.3.2
Step 3 Remove the multi-port cable.
1. Press the two tabs on the multi-port cable connector. See (1) in Figure 8-3.
2. Remove the multi-port cable from the universal connector port (UCP) on the server. See (2) in Figure 8-3.
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Figure 8-3 Removing the multi-port cable
Step 4 Remove the optical cables and modules.
● Replacing the optical cable, network cable, or optical module will interrupt
services.
● Wear ESD gloves or an ESD wrist strap when using die-casting pliers to replace
optical or network cables or optical modules.
● Do not exert too much force when using the die-casting pliers to prevent
damage to the optical or network cables or optical modules.
1. Use the die-casting pliers to clamp the optical cable connector and remove it from the port.
Figure 8-4 Removing optical cables using die-casting pliers
2. Use the die-casting pliers to clamp the optical module, unlock the security pin, and remove the optical module.
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Figure 8-5 Removing an optical module using die-casting pliers
Step 5 Remove the server node.
● When removing a device, wear protective gloves to avoid burns.
● To prevent device damage or personal injury, hold the bottom of the device
with both hands when removing it.
1. Press the ejector release button on the server node. See (1) in Figure 8-6.
2. Fully open the ejector lever. See (2) in Figure 8-6.
3. Holding the ejector lever, pull the server node out of the chassis horizontally. See (3) in Figure 8-6.
4. Close the ejector lever.
Figure 8-6 Removing the server node
Step 6 Place the removed server node in an ESD bag.
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Place only one server node in an ESD bag.
Step 7 Install ller modules.
Install ller panels in vacant slots. Otherwise, the ventilation, heat dissipation, electromagnetic shielding, and dustproof eects of the chassis will be aected.
----End

8.3.4 Installing an XH321 V5

Procedure
Step 1 Determine the position of the server node in the chassis.
Figure 8-7 Positions and slot numbers of the XH321 V5 server nodes
Install the lower server nodes and then the upper server nodes.
Step 2 Remove ller modules.
Perform this operation only when ller modules are installed.
1. Press the ejector release button on the ller module. See (1) in Figure 8-8.
2. Fully open the ejector lever. See (2) in Figure 8-8.
3. Holding the ejector lever, pull the
Figure 8-8.
ller module from the chassis. See (3) in
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Figure 8-8 Removing a ller panel
4. Close the ejector lever.
5. Place the ller module in an accessory recycle bin.
Step 3 Install the server node.
To prevent device damage or personal injury, hold the bottom of the device with both hands when installing it.
1. Press the ejector release button on the server node. See (1) in Figure 8-9.
2. Fully open the ejector lever. See (2) in Figure 8-9.
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Figure 8-9 Opening the ejector lever
3. Slide the server node into the chassis horizontally. See (1) in Figure 8-10.
4. Close the ejector lever. See (2) in Figure 8-10.
Figure 8-10 Installing a server node
Step 4 Connect the multi-port cable as required.
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1. Press the two tabs on the multi-port cable connector. See (1) in Figure 8-11.
2. Connect the multi-port cable to the UCP on the server. See (2) in Figure 8-11.
Figure 8-11 Connecting a multi-port cable
Step 5 Install optical modules and optical cable as required.
Replacing the optical cable, network cable, or optical module will interrupt services.
1. Close the security pin on the optical module, use die-casting pliers to clamp the optical module, and insert it into the optical port until you hear a click.
2. Use die-casting pliers to clamp the optical connector, and insert it into the optical port of an optical module until you hear a click.
Step 6 Power on the server node.
For details, see 8.3.1 Power-On Procedure.
Step 7 Check indicator status.
For details, see 2.1.2 Indicators and Buttons.
----End

8.4 Field Replaceable Units

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8.4.1 Removing an M.2 SSD

Procedure
Step 1 Power o the server node.
For details, see 8.3.2 Power-O Procedure.
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Remove the air duct.
For details, see 8.4.23 Removing the Air Duct.
Step 5 Determine the position of the M.2 SSD.
Figure 8-12 Positions of M.2 SSDs
Step 6 Remove the TPM.
For details, see 8.4.15 Removing the TPM.
Step 7 Remove the M.2 SSD.
1. Use an M2.5 Phillips screwdriver to loosen the screw that secures the M.2 SSD. See (1) in Figure 8-13.
2. Tilt the M.2 SSD 20° to 30° upwards, and pull it out. See (2) in Figure 8-13.
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Figure 8-13 Removing an M.2 SSD
Step 8 Place the removed component in an ESD bag.
----End

8.4.2 Installing an M.2 SSD

Procedure
Step 1 Power
For details, see 8.3.2 Power-O Procedure.
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Remove the air duct.
For details, see 8.4.23 Removing the Air Duct.
Step 5 Determine the position of the M.2 SSD.
o the server node.
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Figure 8-14 Positions of M.2 SSDs
Step 6 Remove the TPM.
For details, see 8.4.15 Removing the TPM.
Step 7 Take the spare part out of its ESD bag.
Step 8 Install the M.2 SSD.
1. Tilt the M.2 SSD 20° to 30°, install it in the slot, and press it
Figure 8-15.
2. Use an M2.5 Phillips screwdriver to tighten the screw to secure the M.2 SSD. See (2) in Figure 8-15.
rmly. See (1) in
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Figure 8-15 Installing an M.2 SSD
Step 9 Install the TPM.
For details, see 8.4.16 Installing the TPM.
Step 10 Install the air duct.
For details, see 8.4.24 Installing the Air Duct.
Step 11 Install the server node.
For details, see 8.3.4 Installing an XH321 V5.
Step 12 Power on the server node.
For details, see 8.3.1 Power-On Procedure.
----End

8.4.3 Removing the Screw-in RAID Controller Card

Procedure
Step 1 Power
For details, see 8.3.2
Step 2 Remove the server node.
o the server node.
Power-O Procedure.
For details, see 8.3.3 Removing an XH321 V5.
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Step 3 Place the server node on the ESD workstation.
Step 4 Determine the position of the screw-in RAID controller card.
Figure 8-16 Position of the screw-in RAID controller card
Step 5 Check whether a supercapacitor is congured.
If yes, go to Step 6.
If no, go to Step 7.
Step 6 Remove the supercapacitor.
For details, see 8.4.5 Removing the Supercapacitor.
Step 7 Remove the cable from the RAID controller card.
For details, see 7 Internal Cabling.
Step 8 Remove the RAID controller card.
1. Loosen the screws that secure the RAID controller card. See (1) in Figure
8-17.
2. Remove the RAID controller card from the connector on the mainboard. See (2) in Figure 8-17.
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Figure 8-17 Removing the screw-in RAID controller card
Step 9 Place the removed component in an ESD bag.
----End

8.4.4 Installing the Screw-in RAID Controller Card

Procedure
Step 1 Power
For details, see 8.3.2
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Take the spare part out of its ESD bag.
Step 5 Check whether a supercapacitor is
If yes, go to Step 6.
If no, go to Step 7.
o the server node.
Power-O Procedure.
congured.
Step 6 Install the supercapacitor.
For details, see 8.4.6 Installing the Supercapacitor.
Step 7 Determine the position of the screw-in RAID controller card.
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Figure 8-18 Position of the screw-in RAID controller card
Step 8 Install the RAID controller card.
1. Insert the RAID controller card vertically into the connector on the mainboard. See (1) in Figure 8-19.
2. Tighten the screws to secure the RAID controller card. See (2) in Figure 8-19.
Figure 8-19 Installing a screw-in RAID controller card
Step 9 Connect the cable to the RAID controller card.
For details, see 7 Internal Cabling.
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Step 10 Install the server node.
For details, see 8.3.4 Installing an XH321 V5.
Step 11 Power on the server node.
For details, see 8.3.1 Power-On Procedure.
Step 12 Congure the RAID controller card.
For details, see Huawei V5 Server RAID Controller Card User Guide.
----End

8.4.5 Removing the Supercapacitor

Procedure
Step 1 Power
For details, see 8.3.2
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Determine the position of the supercapacitor.
Step 5 Remove the air duct for the supercapacitor.
Step 6 Remove the supercapacitor holder.
1. Loosen the screws on the server node panel. See (1) in Figure 8-20.
2. Remove the panel. See (2) in Figure 8-20.
3. Loosen the screws that secure the supercapacitor holder and remove the
Figure 8-20 Removing the supercapacitor holder
o the server node.
Power-O Procedure.
supercapacitor holder. See (3) in Figure 8-20.
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Step 7 Check whether the supercapacitor is congured with a TFM.
If yes, go to Step 8.
If no, go to Step 9.
Step 8 Remove the TFM.
1. Remove the screw-in RAID controller card. For details, see 8.4.3 Removing the Screw-in RAID Controller Card.
2. Loosen the screws that secure the TFM. See (1) in Figure 8-21.
3. Remove the TFM from the screw-in RAID controller card. See (2) in Figure
8-21.
Figure 8-21 Removing a TFM
4. Go to Step 10.
Step 9 Remove the cable between the supercapacitor and the RAID controller card.
Step 10 Remove the supercapacitor from the holder.
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Figure 8-22 Removing the supercapacitor
Step 11 Place the removed component in an ESD bag.
----End

8.4.6 Installing the Supercapacitor

Procedure
Step 1 Power o the server node.
Step 2 Remove the server node.
Step 3 Place the server node on the ESD workstation.
Step 4 Take the spare part out of its ESD bag.
Step 5 Determine the position of the supercapacitor.
Step 6 Vertically insert the supercapacitor into the holder until the supercapacitor is
For details, see 8.3.2 Power-O Procedure.
For details, see 8.3.3 Removing an XH321 V5.
locked.
Figure 8-23 Installing the supercapacitor
Step 7 Check whether the supercapacitor is congured with a TFM.
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If yes, go to Step 8.
If no, go to Step 9.
Step 8 Install the TFM.
1. Remove the screw-in RAID controller card. a. Remove the cable from the RAID controller card.
For details, see 7 Internal Cabling.
b. Loosen the screws that secure the RAID controller card. See (1) in Figure
8-24.
c. Remove the RAID controller card from the connector on the mainboard.
See (2) in Figure 8-24.
Figure 8-24 Removing the screw-in RAID controller card
2. Insert the TFM card into the screw-in RAID controller card. See (1) and (2) in
Figure 8-25.
3. Tighten the screws to secure the TFM card. See (3) in Figure 8-25.
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Figure 8-25 Installing a TFM
4. Install the screw-in RAID controller card. For details, see 8.4.4 Installing the Screw-in RAID Controller Card.
5. Go to Step 10.
Step 9 Connect the cable between the supercapacitor and the screw-in RAID controller
card.
Step 10 Install the supercapacitor holder.
1. Install the supercapacitor holder into the node panel and tighten the screws to secure the supercapacitor holder. See (1) in Figure 8-26.
2. Install the node panel. See (2) in Figure 8-26.
3. Tighten the screws to secure the panel. See (3) in Figure 8-26.
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Figure 8-26 Installing the supercapacitor holder
Step 11 Install the air duct for the supercapacitor.
Step 12 Install the server node.
For details, see 8.3.4 Installing an XH321 V5.
Step 13 Power on the server node.
For details, see 8.3.1 Power-On Procedure.
----End

8.4.7 Removing the Avago SAS3004iMR PCIe RAID Control Card

Procedure
Step 1 Power o the server node.
For details, see 8.3.2 Power-O Procedure.
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Determine the position of the Avago SAS3004iMR RAID controller card.
Step 5 Remove the M.2 FRU from the Avago SAS3004iMR RAID controller card.
For details, see 8.4.9 Removing an M.2 FRU on the Avago SAS3004iMR PCIe
RAID Controller Card.
Step 6 Remove the Avago SAS3004iMR RAID controller card.
For details, see 8.4.19 Removing a PCIe Card.
Step 7 Place the removed component in an ESD bag.
----End
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8.4.8 Installing the Avago SAS3004iMR PCIe RAID Control Card

Procedure
Step 1 Power o the server node.
For details, see 8.3.2 Power-O Procedure.
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Take the spare part out of its ESD bag.
Step 5 Determine the position of the Avago SAS3004iMR RAID controller card.
Step 6 Install the Avago SAS3004iMR RAID controller card.
For details, see 8.4.20 Installing a PCIe Card.
Step 7 Install the M.2 FRU on the Avago SAS3004iMR RAID controller card.
For details, see 8.4.10 Installing an M.2 FRU on the Avago SAS3004iMR PCIe
RAID Controller Card.
Step 8 Install the server node.
For details, see 8.3.4 Installing an XH321 V5.
Step 9 Power on the server node.
For details, see 8.3.1 Power-On Procedure.
----End

8.4.9 Removing an M.2 FRU on the Avago SAS3004iMR PCIe RAID Controller Card

The M.2 FRU on the Avago SAS3004iMR RAID controller card is hot swappable.
Procedure
Step 1 Determine the positions and slots of the M.2 FRUs on the Avago SAS3004iMR
RAID controller card.
Determine the position of the M.2 FRU to be removed. Do not remove the M.2 FRU running an OS. Otherwise, all services on the server node will be aected.
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Figure 8-27 Positions and slots of the M.2 FRUs
Step 2 Remove the M.2 FRU from the Avago SAS3004iMR RAID controller card.
1. Open the handle of the M.2 FRU. See (1) in Figure 8-28.
2. Remove the M.2 FRU. See (2) in Figure 8-28.
Figure 8-28 Removing an M.2 FRU
Step 3 Place the removed component in an ESD bag.
Step 4 Install an M.2 FRU ller module to shield the EMC.
Perform this step only when an M.2 FRU is not installed immediately.
----End

8.4.10 Installing an M.2 FRU on the Avago SAS3004iMR PCIe RAID Controller Card

The M.2 FRU on the Avago SAS3004iMR RAID controller card is hot swappable.
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Procedure
Step 1 Determine the positions and slots of the M.2 FRUs on the Avago SAS3004iMR
RAID controller card.
Figure 8-29 Positions and slots of the M.2 FRUs
Step 2 Remove the M.2 FRU ller module.
Perform this step only when you congure an M.2 FRU ller module.
Step 3 Install an M.2 FRU on the Avago SAS3004iMR PCIe RAID controller card.
1. Take a spare M.2 FRU out of its ESD bag.
2. Open the handle of the M.2 FRU and push the M.2 FRU into the slot of the Avago SAS3004iMR RAID control card. See (1) in Figure 8-30.
3. Close the handle of the M.2 FRU. See (2) in Figure 8-30.
Figure 8-30 Installing an M.2 FRU
Step 4 Check the status of the M.2 FRU indicator on the Avago SAS3004iMR RAID
controller card.
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Figure 8-31 M.2 FRU indicators
Table 8-2 Indicator status
Indicator Description
M.2 FRU fault indicator
M.2 FRU activity indicator
----End
O: The M.2 FRU is running properly.
● Blinking yellow: The M.2 FRU is being located, or
● Steady yellow: The M.2 FRU is faulty or not
O: The M.2 FRU is not in position or is faulty.
● Blinking green: Data is being read, written, or
● Steady green: The M.2 FRU is inactive.

8.4.11 Removing a Processor

● Only Huawei technical support or personnel authorized by Huawei can remove
the processors from Huawei servers.
RAID is being rebuilt.
detected.
synchronized.
● Do not wear ESD gloves during processor replacement. The gloves may catch
on pins on the processor socket and damage it.
Procedure
Step 1 Power
For details, see 8.3.2 Power-O Procedure.
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Remove the air duct.
For details, see 8.4.23 Removing the Air Duct.
Step 5 Determine the position of the processor.
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FusionServer Pro XH321 V5 Server Node Maintenance and Service Guide 8 Parts Replacement
Figure 8-32 Positions of processors
Step 6 Remove the conjoined heat sink and processor carrier.
1. Use a Phillips screwdriver to loosen the four screws (marked 2 in the label) in the middle of the heat sink in a diagonal sequence. See (1) in Figure 8-33.
2. Use a Phillips screwdriver to loosen the two diagonal screws (marked 1 in the label) on the heat sink. See (2) in Figure 8-33.
3. Lift the heat sink and place it upside down on the ESD desk.
4. Insert a
at-head screwdriver into the groove of the processor carrier, and
twist it to pry up one side of the carrier. See (3) in Figure 8-33.
Insert only the tip of the at-head screwdriver. Do not apply excessive force.
5. Holding the other end of the carrier, remove the carrier and processor in the arrow direction. See (4) and (5) in Figure 8-33.
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Figure 8-33 Removing the heat sink and processor carrier
Step 7 Remove the processor.
● When removing a processor, hold the processor and its carrier to prevent the processor from falling o.
● To prevent damage to the pins, do not touch the pins of the processor socket or the corresponding area on the processor.
● Keep the processor away from the chassis to prevent thermal compound from falling
o.
1. Bend the edge of the carrier with the triangular hole to release the processor from the carrier.
Figure 8-34 Removing a processor (1)
2. Hold the two sides of the processor and lift it.
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Figure 8-35 Removing a processor (2)
Step 8 Place the removed component in an ESD bag.
Clean the removed processor and put it into an ESD bag.
Step 9 Install a processor socket cover.
● Perform this operation only when a processor is not installed immediately.
● The processor socket cannot be exposed and must be covered by a processor or cover during transportation and storage.
1. Aligning the processor socket cover with the guide pin on the processor socket, place the cover on the processor socket. See (1) in Figure 8-36.
2. Press the positions shown by (2) in Figure 8-36 until you hear a click.
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Figure 8-36 Installing a CPU socket cover
----End

8.4.12 Installing a Processor

● Only Huawei technical support or personnel authorized by Huawei can install
the processors from Huawei servers.
● Do not wear ESD gloves during processor replacement. The gloves may catch
on pins on the processor socket and damage it.
● The same model of processors must be used in a server.
● Before installing a processor, clean the surface of the processor, the heat sink,
and the processor carrier. If there is residual thermal compound, use a tissue to clean it.
Procedure
Step 1 Power o the server node.
For details, see 8.3.2 Power-O Procedure.
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Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Remove the air duct.
For details, see 8.4.23 Removing the Air Duct.
Step 5 Take the spare part out of its ESD bag.
Step 6 Determine the position of the processor.
Figure 8-37 Positions of processors
Step 7 Install the processor on the carrier.
1. Take a processor carrier out of an ESD bag.
2. Aligning the notch in one edge of the processor with the protrusion on the processor carrier, secure it.
Ensure that the processor corner with a triangle mark is in the corner of the processor carrier with a notched triangle.
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Figure 8-38 Installing one end of the processor
3. Bend the other edge of the processor carrier in the arrow direction.
Figure 8-39 Installing the other end of the processor
4. Release the processor carrier so that the other edge of the processor clips into place.
5. Check that the processor and the carrier are level and the processor is secured. If the processor is tilted, press the tilted part to fasten it.
Step 8 Apply thermal compound.
1. Determine the area on the processor that will be in contact with the heat sink, and evenly apply 0.4 ml of thermal compound on the area.
rmly
– When applying thermal compound, place the processor carrier on the desktop. – The thermal compound injector has volume marks.
The two-line, ve-dot, s-shape, and X-shape patterns are recommended.
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Figure 8-40 Pasting patterns
2. Use a clean card or blade to smear the thermal compound over the entire center of the CPU.
The thickness of the thermal compound is about that of a piece of ordinary paper. Ensure that the thermal compound is evenly and fully coated.
Figure 8-41 Smeared thermal compound layer
Step 9 Install the processor carrier to the conjoined heat sink.
1. Aligning the processor corner with a triangle mark with the corner of the heat sink with a notched triangle, buckle the processor carrier on the heat sink.
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Figure 8-42 Installing the processor carrier
2. Place the assembled processor and heat sink upside down on the desk, and check that the processor carrier and the heat sink are processor carrier is not rmly buckled with the heat sink, press the processor carrier to secure it.
Step 10 Install the processor and conjoined heat sink.
1. Remove the processor socket cover.
When removing the socket cover, keep it parallel with the board to prevent damage to pins.
2. Shine a light at various angles onto the processor socket to check for twisted pins, foreign matter, and pad damage.
If bent pins or foreign matters are found or the bonding pad is damaged, stop the operation and contact Huawei technical support.
rmly secured. If the
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3. Horizontally holding the processor and heat sink, align the notched corner on the heat sink with the notched corner on the processor socket, and place the processor and heat sink downwards on the socket along the guide sleeves.
Keep the processor and heat sink parallel with the mainboard to prevent damage to processor socket pins.
4. Use a Phillips screwdriver to tighten the two diagonal screws (marked 1 on the label) on the heat sink. See (1) in Figure 8-43.
5. Use a Phillips screwdriver to tighten the four screws (marked 2 in the label) in the middle of the heat sink in a diagonal sequence. See (2) in Figure 8-43.
Figure 8-43 Installing the heat sink
Step 11 Install the air duct.
For details, see 8.4.24 Installing the Air Duct.
Step 12 Install the server node.
For details, see 8.3.4 Installing an XH321 V5.
Step 13 Power on the server node.
For details, see 8.3.1 Power-On Procedure.
----End
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8.4.13 Removing a Memory Module

Procedure
Step 1 Power o the server node.
For details, see 8.3.2 Power-O Procedure.
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Remove the air duct.
For details, see 8.4.23 Removing the Air Duct.
Step 5 Determine the position of the memory module.
Figure 8-44 Memory slots
Step 6 Remove the memory module.
1. Open the memory module ejectors on the memory slot. See (1) in Figure
8-45.
2. Remove the memory module from the slot. See (2) in Figure 8-45.
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Figure 8-45 Removing a memory module
Step 7 Place the removed memory module in a memory box.
Step 8 Install memory modules.
Perform this operation only when a memory module is not installed immediately.
----End

8.4.14 Installing a Memory Module

If the processor power is 200 W or 205 W, a wide conjoined heat sink is required, which occupy memory channels DIMM001 and DIMM031.
Procedure
Step 1 Power o the server node.
For details, see 8.3.2 Power-O Procedure.
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Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Remove the air duct.
For details, see 8.4.23 Removing the Air Duct.
Step 5 Take a spare memory module.
Step 6 Check the positions and installation guidelines of the memory modules.
For details, see 2.3.5 Memory Installation Positions.
Figure 8-46 Memory slots
Step 7 Install the memory module.
1. Open the two memory module ejectors on the memory slot.
Figure 8-47 Opening the memory module ejectors
2. Align the edge connector of the memory module with the alignment key of the memory slot, and insert the memory module in the slot.
The two memory ejectors are closed automatically after the memory module
rmly seated.
is
Do not touch the edge connector on a memory module with bare hands. Before installing a memory module, ensure that the edge connector is not contaminated.
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Figure 8-48 Installing a memory module
Step 8 Install the air duct.
For details, see 8.4.24 Installing the Air Duct.
Step 9 Install the server node.
For details, see 8.3.4 Installing an XH321 V5.
Step 10 Power on the server node.
For details, see 8.3.1 Power-On Procedure.
Step 11 Check whether the memory module is replaced successfully.
1. Log in to the iBMC WebUI. For details, see 10.2 Logging In to the iBMC WebUI.
2. Choose Information > System Info > Memory, and check the memory information.
If information about the new memory module is displayed, the
replacement is successful.
If information about the original memory module is displayed, access the
BIOS and check memory information. For details, see Huawei Server Purley Platform BIOS Parameter
Reference.
----End
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8.4.15 Removing the TPM

● If the private key of the TPM interface board is used to encrypt data, back up
the data before removing the TPM. If the data is not backed up, the encrypted data cannot be decrypted after the
TPM is replaced.
● If the TPM function has been set on the BIOS, record the settings before
removing the TPM. After replacing the TPM, the BIOS again.
For details, see the
Reference
● If a broken or disgured screw is found on a TPM, take appropriate measures
to protect data.
.
Huawei Server Purley Platform BIOS Parameter
congure the related settings on
Procedure
Step 1 Power o the server node.
Step 2 Remove the server node.
Step 3 Place the server node on the ESD workstation.
Step 4 Remove the air duct.
Step 5 Determine the position of the TPM.
For details, see 8.3.2
For details, see 8.3.3 Removing an XH321 V5.
For details, see 8.4.23 Removing the Air Duct.
Power-O Procedure.
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Figure 8-49 TPM position
Step 6 Remove the PCIe card.
For details, see 8.4.19 Removing a PCIe Card.
Step 7 Remove the TPM.
1. Remove the cables from the TPM. For details, see 7.1 TPM Cabling.
2. Release the buckle on the TPM in the arrow direction, and push the TPM backwards until it cannot move forward. See (1) in Figure 8-50.
3. Remove the TPM from the dowel pins on the side wall of the server node and take it out upwards. See (2) in Figure 8-50.
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Figure 8-50 Removing a TPM
Step 8 Remove the M.2 SSD.
For details, see 8.4.1 Removing an M.2 SSD.
Step 9 Place the removed component in an ESD bag.
----End

8.4.16 Installing the TPM

Procedure
Step 1 Power
For details, see 8.3.2
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Remove the air duct.
For details, see 8.4.23 Removing the Air Duct.
Step 5 Determine the position of the TPM.
o the server node.
Power-O Procedure.
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Figure 8-51 TPM position
Step 6 Take the spare part out of its ESD bag.
Step 7 Remove the PCIe card.
For details, see 8.4.19 Removing a PCIe Card.
Step 8 Install the M.2 SSD.
For details, see 8.4.2 Installing an M.2 SSD.
Step 9 Install the TPM.
1. Align the TPM with the dowel pins on the side wall of the server node, and insert the TPM in the arrow direction.
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Figure 8-52 Installing a TPM
2. Connect the cables to the TPM. For details, see 7.1 TPM Cabling.
Step 10 Install the PCIe card.
For details, see 8.4.20 Installing a PCIe Card.
Step 11 Install the air duct.
For details, see 8.4.24 Installing the Air Duct.
Step 12 Install the server node.
For details, see 8.3.4 Installing an XH321 V5.
Step 13 Power on the server node.
For details, see 8.3.1 Power-On Procedure.
Step 14 Enable TPM.
1. Access the BIOS interface. For details, see Huawei Server Purley Platform BIOS Parameter Reference.
2. Select Security.
3. Select TPM Operation and press Enter.
4. Select Enable.
5. Press F10. The system displays "Exit Saving changes?" dialog box is displayed.
6. Select Yes. The settings are saved.
7. Restart the server.
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The TPM settings take eect after the server is restarted.
----End

8.4.17 Removing the Battery

Procedure
Step 1 Power o the server node.
For details, see 8.3.2
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Determine the position of the battery.
Figure 8-53 Position of the battery
Power-O Procedure.
Step 5 Remove the PCIe card.
For details, see 8.4.19 Removing a PCIe Card.
Step 6 Press and hold the two latches outwards until the battery ejects, and remove the
battery vertically. See (1) and (2) in Figure 8-54.
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Figure 8-54 Removing the battery
Step 7 Place the removed component in an ESD bag.
----End

8.4.18 Installing the Battery

Procedure
Step 1 Power o the server node.
For details, see 8.3.2 Power-O Procedure.
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation. Step 4 Take the spare part out of its ESD bag. Step 5 Determine the position of the battery.
Figure 8-55 Position of the battery
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Step 6 Remove the PCIe card.
For details, see 8.4.19 Removing a PCIe Card.
Step 7 Holding the battery with the text side facing upwards, insert the left end of the
battery into the slot, and gently press down the whole battery into the slot.
Figure 8-56 Installing the battery
Step 8 Install the PCIe card.
For details, see 8.4.20 Installing a PCIe Card.
Step 9 Install the server node.
For details, see 8.3.4 Installing an XH321 V5.
Step 10 Power on the server node.
For details, see 8.3.1 Power-On Procedure.
----End

8.4.19 Removing a PCIe Card

Procedure
Step 1 Power
For details, see 8.3.2 Power-O Procedure.
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Determine the position of the PCIe card.
o the server node.
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Figure 8-57 Position of the PCIe card
Step 5 Remove the PCIe riser modules.
For details, see 8.4.21 Removing the PCIe Riser Module.
Step 6 Hold the PCIe riser module and remove the PCIe card in the arrow direction. See
(5) in Figure 8-58.
Figure 8-58 Remove a PCIe card.
Step 7 Place the removed component in an ESD bag.
----End

8.4.20 Installing a PCIe Card

Procedure
Step 1 Power o the server node.
For details, see 8.3.2 Power-O Procedure.
Step 2 Remove the server node.
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For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Take the spare part out of its ESD bag.
Step 5 Determine the position of the PCIe card.
Figure 8-59 Position of the PCIe card
Step 6
Hold the PCIe riser module and insert the PCIe card module into the PCIe riser module in the arrow direction. See (1) in Figure 8-60.
Figure 8-60 Installing a PCIe card
Step 7 Install the PCIe riser modules.
For details, see 8.4.22 Installing the PCIe Riser Module.
Step 8 Install the server node.
For details, see 8.3.4 Installing an XH321 V5.
Step 9 Power on the server node.
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For details, see 8.3.1 Power-On Procedure.
----End

8.4.21 Removing the PCIe Riser Module

Procedure
Step 1 Power o the server node.
For details, see 8.3.2 Power-O Procedure.
Step 2 Remove the server node.
For details, see 8.3.3 Removing an XH321 V5.
Step 3 Place the server node on the ESD workstation.
Step 4 Determine the position of the PCIe riser module.
Step 5 Remove the PCIe riser modules.
1. Use a Phillips screwdriver to loosen the screws on the cover of the server node. See (1) in Figure 8-61.
2. Remove the cover from the server node in the arrow direction. See (2) in
Figure 8-61.
3. Use a Phillips screwdriver to loosen the screw that secures the PCIe riser module. See (3) in Figure 8-61.
4. Lift the PCIe riser module in the arrow direction. See (4) in Figure 8-61.
Figure 8-61 Removing the PCIe riser module
Step 6 Disconnect the cable between the PCIe card and the NC-SI port.
For details, see 7.4 PCIe Card Cabling.
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This operation is required only when the PCIe card is an SP380 NIC (BOM code: 02312JBD).
Step 7 Remove the PCIe card.
For details, see 8.4.19 Removing a PCIe Card.
Step 8 Place the removed PCIe riser module and PCIe card in dierent ESD bags.
Step 9 Install a
Perform this operation only when a PCIe riser module is not installed immediately.
ller panel.
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