HP Z VR Backpack G1 Disassembly Instructions Manual
Product End-of-Life Disassembly Instructions
Marketing Name / Model
[List multiple models if applicabl e.]
HP Z VR Backpack G1 Workstation
1.0 Items Requiring Selective Treatment
Quantity
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB/dock borad
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries Main battery/RTC
2
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
0
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords
POWER CORD/ dock cable
2
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
already listed as a separate item above)
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Product Category: Desktop PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
weighing > 25 grams (not including PCBs or PCAs
of items
included
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PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Description
Tool Size (if
applicable)
Description #1 Screwdriver
#1, #0, T8
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Proc ess
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove screw rubber foot and screw *6 pcs
2. Disassemble the rear cover from the top cover
3. Remove the top FFC cable
4. Remove battery cable and DC-in cable from MB connector
5. Remove CPU Fan ,connector and screw *3
6. Remove GPU Fan ,connector and screw *3
7. Remove Thermal module and screw *8
8. Remove antenna support L lower and screw *2
9. Remove Main and Aux
10. Remove Waln card and screw *1
11. Remove lower holder BKT and screw *2
12. Remove internal battery and screw *3 /Remove RTC battery
13. Remove external battery BKT L / R and screw *4
14. Remove DC-in BKT and screw *1
15. Remove DC-in cable
16. Remove Antenna support R upper and screw *1
17. Remove Antenna support L upper and screw *1
18. Remove Absorber on top IO holder BKT
19. Remove top IO holder BKT and screw *2
20. Remove sheilding can
21. Remove fan screw nut *2
22. Remove power board and screw *2
23. Remove VR DC-out cable
24. Remove MB and screw *2
25. Remove power button BLM
26. Remove MB
27. Remove VR DC-out BKT and screw *2
28. Remove screw rubber foot and screw *6 pcs
29. Remove bottom door from the Dock cover
30. Remove left / right cover from the Dock cover
31. Remove Dock cover from Dock inside
32. Remove DC cable*2
33. Remove Docking MB and screw *6.
34. Remove DC holder BKT and screw*2
35. Remove DC cable and Dock DC PCB.
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Template Revision B
PSG instructions for this template are available at EL-MF877-01
36.
37.
38.
39.
40.
41.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
1. Remove screw rubber foot and screw *6 pcs
2. Disassemble the rear cover from the top cover
3. Remove the top FFC cable
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
4. Remove battery cable and DC-in cable from MB connector
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Remove External battery cable.
Remove DC-in cable.
5. Remove CPU Fan ,connector and screw *3
6. Remove GPU Fan ,connector and screw *3
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
7. Remove Thermal module and screw *8
8. Remove antenna support L lower and screw *2
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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