HP Z2 Mini G5 operation manual

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QuickSpecs
HP Z2 Mini G5 Workstation

Overview

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HP Z2 Mini G5 Workstation
Front-Side View
1.
Power button
3.
1 Type-C® SuperSpeed USB 10Gbps signaling rate port (charging supported)
2.
2 Type-A SuperSpeed USB 10Gbps signaling rate port (1 supports charging)
4.
Universal audio jack
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QuickSpecs
HP Z2 Mini G5 Workstation
Overview
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Rear View
1.
HDD Activity LED
8.
Flex IO modules, choice of: VGA, HDMI 2.0b, DisplayPort 1.43, Dual Type-A SuperSpeed USB 5Gbps signaling rate port, serial port, 2nd 1GbE LAN, Type-C® SuperSpeed USB 10Gbps signaling rate port (Alt Mode), Thunderbolt 3, 2.5GbE LAN2
2.
Power connector
3.
2 DisplayPort 1.43 1 DisplayPort (optional)
1,3
4.
Standard cable lock slot
9.
RJ-45
5.
Cover release latch
10.
2 Type-A SuperSpeed USB 10Gbps signaling rate port
6.
1 Type-C® SuperSpeed USB 10Gbps signaling rate port (charging supported) (optional)2
7.
Flex IO modules, choice of: Dual Type-A SuperSpeed USB 5Gbps signaling rate port, serial port2
1
Available only when a discrete graphic card is installed.
2
Available on selected configurations only.
3
All DisplayPort support DP1.4/HBR2 when video output is via Intel Graphics.
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QuickSpecs
HP Z2 Mini G5 Workstation
Overview
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Form Factor
Mini
Operating Systems
Preinstalled:
Windows 10 Pro 64
1
Windows 10 Pro 64 High End
1
Windows 10 Pro 64 Workstation Plus
1
Windows 10 Home 64 Plus
1
Windows 10 Home 64 Advanced
11
Linux-ready
2
1
Not all features are available in all editions or versions of Windows. Systems may require upgraded and/or separately purchased hardware, drivers, software or BIOS update to take full advantage of Windows functionality. Windows 10 is automatically updated, which is always enabled. ISP fees may apply, and additional requirements may apply over time for updates. See http://www.windows.com
2
For detailed Linux® OS/hardware support information, see:
http://www.hp.com/support/linux_hardware_matrix
NOTE: In accordance with Microsoft’s support policy, HP does not support the Windows® 7 operating system on products configured with Intel® 7th Generation and forward processors.
Processors*
Name
Cores
Clock
Speed
(GHz)
Cache
(MB)
Memory
Speed (MT/s)
Hyper-
Threading
Integrated
Graphics
Intel® Turbo
Boost
Technology2
Featuring
Intel® vPro™
Technology3
16GB Intel®
Optane™
memory
TDP
(W)
Intel® Core™ i9-10900K Processor5
10
3.7
20
2933
Y
Intel® UHD
Graphics 630
5.2 Y Y
125
Intel® Core™ i9-10900 Processor
10
2.8
20
2933
Y
Intel® UHD
Graphics 630
5.1 Y Y
65
Intel® Core™ i9-10900F Processor4
10
2.8
20
2933 Y N/A
5.1
N/A
Y
65
Intel® Core™ i7-10700K Processor5
8
3.8
16
2933
Y
Intel® UHD
Graphics 630
5.1 Y Y
125
Intel® Core™ i7-10700 processor
8
2.9
16
2933
Y
Intel® UHD
Graphics 630
4.8 Y Y
65
Intel® Core™ i5-10600K processor5
6
4.1
12
2666
Y
Intel® UHD
Graphics 630
4.8 Y Y
125
Intel® Core™ i5-10600 processor
6
3.3
12
2666
Y
Intel® UHD
Graphics 630
4.8 Y Y
65
Intel® Core™ i5-10500 processor
6
3.1
12
2666
Y
Intel® UHD
Graphics 630
4.5 Y Y
65
Intel® Core™ i5-10400 processor
6
2.9
12
2666
Y
Intel® UHD
Graphics 630
4.3
N/A
Y
65
Intel® Core™ i5-10400F Processor4
6
2.9
12
2666 Y N/A
4.3
N/A
Y
65
Intel® Core™ i3-10320 processor
4
4
3.8 8 2666
Y
Intel® UHD
Graphics 630
4.6
N/A
Y
65
Intel® Core™ i3-10300 processor
4
4
3.7 8 2666
Y
Intel® UHD
Graphics 630
4.4
N/A
Y
65
Intel® Core™ i3-10100 processor
4
3.60 6 2666
Y
Intel® UHD
Graphics 630
4.3
N/A
Y
65
Intel® Xeon® W-1290P processor
5
10
3.7
20
2933
Y
Intel® UHD
Graphics P630
5.2 Y Y
125
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QuickSpecs
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Overview
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Intel® Xeon® W-1290 processor
4
10
3.2
20
2933
Y
Intel® UHD
Graphics P630
5.1 Y Y
80
Intel® Xeon® W-1270P processor
4,5
8
3.8
16
2933
Y
Intel® UHD
Graphics P630
5.1 Y Y
125
Intel® Xeon® W-1270 processor
8
3.4
16
2933
Y
Intel® UHD
Graphics P630
5.0 Y Y
80
Intel® Xeon® W-1250P processor5
6
4.1
12
2666
Y
Intel® UHD
Graphics P630
4.8 Y Y
125
Intel® Xeon® W-1250 processor
6
3.3
12
2666
Y
Intel® UHD
Graphics P630
4.7 Y Y
80
1
Multicore is designed to improve performance of certain software products. Not all customers or software applications will necessarily benefit from use of this technology. Performance and clock frequency will vary depending on application workload and your hardware and software configurations. Intel’s numbering, branding and/or naming is not a measurement of higher performance.
2
The specifications shown in the Intel® Turbo Boost Technology column represent the maximum turbo frequency with one core active. Turbo boost stepping occurs in 100MHz increments. Processors that do not have turbo functionality are denoted as N/A. Intel® Turbo Boost performance varies depending on hardware, software and overall system configuration. See
http://www.intel.com/technology/turboboost for more information.
3
For full Intel® vPro™ functionality, Windows, a vPro™ supported processor, vPro enabled Q370 chipset or higher and vPro
enabled WLAN card are required. Some functionality, such as Intel Active management technology and Intel Virtualization technology, requires additional 3rd party software in order to run. Availability of future "virtual appliances" applications for Intel vPro technology is dependent on 3rd party software providers. Compatibility of this generation of Intel vPro technology-based hardware with future "virtual appliances" is yet to be determined.
4
Available in Q4, 2020
5
Configurable TDP-down 95W
Convertibility
Z2 Mini G5 can either be placed on a flat surface or mounted behind a display or under a desk. (Mounting sold separately)
Expansion Slots (see system board section for more details)
Custom PCIe Gen3 x16 for factory-integrated graphics module – if anything, should put JUST the M.2 slot here since that is a true “expansion slot”
Front I/O
Side I/O
2 Type-A SuperSpeed USB 10Gbps signaling rate port (upper port supports charging), 1 Type-C® SuperSpeed USB 10Gbps signaling rate port (charging supported), 1 Universal audio combo
Rear I/O
2 DisplayPort 1.41, 1 RJ-45 port, 2 Type-A SuperSpeed USB 10Gbps signaling rate port
Optional: 1 Type-C® SuperSpeed USB 10Gbps signaling rate port (optional, supports charging), 1 DisplayPort 1.41, 2 Flex IO modules
On-board RAID Support
NVMe RAID 0 Striped Array NVMe RAID 1 Mirrored Array
Chassis Dimensions (H x W x D)
H: 2.28" [58mm] (Standard desktop orientation) W: 8.5" [216mm] D: 8.5" [216mm]
Packaged Dimensions
H: 11.73'' (298mm) W: 6.69'' (170mm) D: 19.65'' (499mm)
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QuickSpecs
HP Z2 Mini G5 Workstation
Overview
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Rack Dimensions
5U
Weight
Exact weights depend upon configuration Minimum: 2.1kg (4.6lbs.) Maximum: 2.42kg (5.3lbs.)
Temperature
Operating: 5° to 35° C (40° to 95° F) Above 1524 m (5,000 feet) altitude, the maximum operating temperature is reduced by 1° C (1.8° F) for every 305 m (1,000 feet) increase in elevation Non-operating: -40° to 60° C (-40° to 140° F) Maximum rate of change: 10°C/hr
Humidity
Operating: 10% to 85% RH, non-condensing, 35° C maximum wet bulb Non-operating: 10% to 90% RH, non-condensing, 35° C maximum wet bulb
Maximum Altitude (non­pressurized)
Operating (with Rotational Hard Drives): 3,048 m (10,000 feet) Operating (with only Solid-State Drives): 5,000 m (16,404 feet) Non-operating: 12,192 m (40,000 feet) Maximum operating temperature is reduced as altitude increases. See Temperature for details.
Power Supply
Choice of: 180W 89% Average Efficiency. 280W 89% Average Efficiency.
NOTES: Customers placing their system in an enclosure should design their solution to accommodate the size of the external power supply for the Z2 Mini G5
Workstation ISV Certifications
See the latest list of certifications at
http://www.hp.com/united-states/campaigns/workstations/partnerships.html
Chipset
Intel® W480 chipset
Memory
2 SODIMM slots, supporting up to 64GB ECC/non-ECC, DDR4 2933 MT/s, speed depending on the CPU selection.
1
All DisplayPort support DP1.4/HBR2 when video output is via Intel Graphics. Discrete graphics
support DP1.4 / HBR3.
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QuickSpecs
HP Z2 Mini G5 Workstation

Supported Components

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Processors
Factory
Configured
Option Kit
Option Kit Part
Number
Support
Notes
10th Generation Intel Core Processors1
Intel® Core™ i9 10900K Processor
Y N
3
Intel® Core™ i9 10900 Processor
Y N
Intel® Core™ i9 10900F Processor
Y N
1
Intel® Core™ i7 10700K Processor
Y N
3
Intel® Core™ i7 10700 processor
Y N
Intel® Core™ i5 10600K processor
Y N
3
Intel® Core™ i5 10600 processor
Y N
Intel® Core™ i5 10500 processor
Y N
Intel® Core™ i5 10400 processor
Y N
Intel® Core™ i9 10400F Processor
Y N
1
Intel® Core™ i3 10320 processor
Y N
2
Intel® Core™ i3 10300 processor
Y N
2
Intel® Core™ i3 10100 processor
Y N
Intel Xeon W Processors
Intel® Xeon® W-1290P processor
Y N
3
Intel® Xeon® W-1290 processor
Y N
2
Intel® Xeon® W-1270P processor
Y N
2,3
Intel® Xeon® W-1270 processor
Y N
Intel® Xeon® W-1250P processor
Y N
3
Intel® Xeon® W-1250 processor
Y N
1These processors support only non-ECC memory
NOTE 1: No integrated graphics. A discrete graphics card must be purchased at the same time. Available
in Q4, 2020
NOTE 2: Available in Q4, 2020 NOTE 3: TDP configured down to 95W.
Storage / Hard Drives*
Factory
Configured
Option
Kit
Option Kit Part
Number
Support
Notes
SATA Hard Drives
500GB SATA 7200 rpm 6Gb/s SFF HDD (2.5")
Y Y T0K73AA
1TB SATA 7200 rpm 6Gb/s SFF HDD (2.5")
Y
Y
T0K74AA/AT
2 TB SATA 5400 rpm SFF HDD (2.5")
Y N
500GB SATA 7.2K SED SFF HDD
Y Y D8N29AA
SATA Solid State Drives
HP 256GB SATA 6Gb/s SSD
Y Y
HP 2TB SATA SSD PROMO
Y6P08AT
PCIe Solid State Drives
HP ZTurbo 1TB TLC Z2 G5 Mini SSD Kit
Y
Y
141L4AA/AT
HP ZTurbo 256GB SED Z2 G5 Mini SSD Kit
Y
Y
141L6AA/AT
HP ZTurbo 256GB TLC Z2 G5 Mini SSD Kit
Y
Y
141L9AA/AT
HP ZTurbo 2TB TLC Z2 G5 Mini SSD Kit
Y
Y
141M0AA/AT
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QuickSpecs
HP Z2 Mini G5 Workstation
Supported Components
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HP ZTurbo 2TB TLC Z2 G5 TWR/SFF SSD Kit
Y
Y
141M1AA/AT
HP ZTurbo 512GB SED Z2 G5 Mini SSD Kit
Y
Y
141M2AA/AT
HP ZTurbo 512GB SED Z2 G5 TWR/SFF SSD Kit
Y
Y
141M3AA/AT
HP ZTurbo 512GB TLC Z2 G5 Mini SSD Kit
Y
Y
141M4AA/AT
HP ZTurbo 512GB TLC Z2 G5 TWR/SFF SSD Kit
Y
Y
141M5AA/AT
NOTE1: SATA hardware-assisted RAID is not supported on Linux® systems. The Linux® kernel, with built-in software RAID, provides excellent functionality and performance. It is a good alternative to hardware-assisted RAID. All drives must be identical in type and capacity. Boot volume/RAID array must be less than 2 TB
NOTE2: 125W CPU SKU is not supported to install the SATA 2.5in HDD or SSD. NOTE3: 65W CPU and MXM GFX card SKU is not supported to install the SATA 2.5in HDD or SSD.
*For hard drives and solid state drives, GB = 1 billion bytes. TB = 1 trillion bytes. Actual formatted capacity is less. Up to 36 GB (for Windows 10) of system disk is reserved for the system recovery software.
Graphics
Factory
Configured
Option
Kit
Option Kit Part
Number
Support
Notes
Graphics Cable Adapters
HP DisplayPort To HDMI True 4k Adapter
Y Y 2JA63AA
HP DisplayPort To DVI-D Adapter
Y Y FH973AA
HP DisplayPort To VGA Adapter
Y Y AS615AA
HP USB-C to DisplayPort Adapter
Y Y 4SH08AA
HP USB-C to HDMI Adapter
Y Y 4SH07AA
HP USB-C to VGA Adapter
Y Y 4SH06AA
Entry 3D
AMD Radeon™ Pro WX 3200 4GB MXM Graphics
Y N
NVIDIA® Quadro® P620 4GB MXM Graphics
Y N
1
Mid-range 3D
NVIDIA® Quadro® T1000 4GB MXM Graphics
Y
NVIDIA® Quadro® T2000 4GB MXM Graphics
Y
NVIDIA® Quadro® RTX 3000 6GB MXM Graphics
Y N
2
NOTE 1: Available in Q4, 2020 NOTE 2: Available in Q1, 2021
Memory
Factory
Configured
Option
Kit
Option Kit Part
Number
Support
Notes
HP 4GB (1x4GB) DDR4-3200 nECC SO DIMM
Y
HP 8GB (2x4GB) DDR4-3200 nECC SO DIMM
Y
HP 8GB (1x8GB) DDR4-3200 nECC SO DIMM
Y
HP 8GB (1x8GB) DDR4-3200 ECC SO DIMM
Y
HP 16GB (2x8GB) DDR4-3200 nECC SO DIMM
Y
HP 16GB (2x8GB) DDR4-3200 ECC SO DIMM
Y
HP 16GB (1x16GB) DDR4-3200 nECC SO DIMM
Y
HP 16GB (1x16GB) DDR4-3200 ECC SO DIMM
Y
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Supported Components
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HP 32GB (2x16GB) DDR4-3200 nECC SO DIMM
Y
HP 32GB (2x16GB) DDR4-3200 ECC SO DIMM
Y
HP 32GB (1x32GB) DDR4-3200 nECC SO DIMM
Y
HP 32GB (1x32GB) DDR4-3200 ECC SO DIMM
Y
HP 64GB (2x32GB) DDR4-3200 nECC SO DIMM
Y
HP 64GB (2x32GB) DDR4-3200 ECC SO DIMM
Y
AMO
HP 4GB (1x4GB) DDR4-3200 nECC SO DIMM
N
141J0AA/AT
HP 8GB (1x8GB) DDR4-3200 nECC SO DIMM
N
141J5AA/AT
HP 8GB (1x8GB) DDR4-3200 ECC SO DIMM
N
141J2AA/AT
HP 16GB (1x16GB) DDR4-3200 nECC SO DIMM
N
141H5AA/AT
HP 16GB (1x16GB) DDR4-3200 ECC SO DIMM
N
141H4AA/AT
HP 32GB (1x32GB) DDR4-3200 nECC SO DIMM
N
141H8AA/AT
HP 32GB (1x32GB) DDR4-3200 ECC SO DIMM
N
141H6AA/AT
NOTES: The CPUs determine the speed at which the memory is clocked. If a 2666 MHz capable CPU is used in the system, the maximum speed the memory will run at is 2666 MHz regardless of the specified speed of the memory.
Intel® Xeon® W processors can support either ECC or non-ECC memory; Intel® Core™ i3/i5/i7 processors only support non-ECC memory.
Two channels of DDR4 memory are supported. To realize full performance at least one DIMM must be inserted into each channel.
Optical and Removable Storage
Factory
Configured
Option Kit
Option Kit Part
Number
HP Slim Tray Optical Drives
HP External Ultra-Slim DVD-RW Drive
N Y Y3T76AA
Actual speeds may vary. Does not permit copying of commercially available DVD movies or other copyright protected materials. Intended for creation and storage of your original material and other lawful uses. Double Layer discs can store more data than single layer discs. However, double-layer discs burned with this drive may not be compatible with many existing single-layer DVD drives and players.
Networking and Communications
Factory
Configured
Option Kit
Option Kit Part
Number
Integrated Intel® I219LM PCIe GbE Controller (Intel® vPro™ with Intel AMT 12.0)
Y
N
Intel Wi-Fi 6 AX201 (2x2) and Bluetooth 5 combo
Y N
HP 1GbE LAN Flex Port 2020
Y
Y
141J6AA/AT
HP 2.5GbE LAN Flex Port Z2 Mini
Y
Y
169K0AA/AT
NOTE 1: The integrated network connection is required to support Intel® vPro™ Technology. NOTE 2: If AMT is provisioned, then network teaming with the integrated LAN port is not possible. NOTE 3: "Gigabit" Ethernet indicates compliance with IEEE standard 802.3ab for Gigabit Ethernet, and
does not connote actual operating speed of 1 Gb/sec. For high speed transmission, connection to a Gigabit Ethernet server and network infrastructure is required.
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HP Z2 Mini G5 Workstation
Supported Components
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Racking and Physical Security
Factory
Configured
Option Kit
Option Kit Part
Number
HP Keyed Cable Lock 10mm
N Y T1A62AA
Z2 Mini ePSU Sleeve
N Y 3RW68AA
HP Z2 Mini Vertical Stand
N Y 3RW66AA
HP Z2 Mini VESA Sleeve
N Y Y7B61AA
HP Business PC Security Lock v3 Kit
N Y 3XJ17AA
HP Z2 Mini Rack Tray Support Kit
N Y 1A4W4AA
HP Z2 Mini and TWR/Z4/Z6 G4 Depth Adjustable Fixed Rail Rack Kit
N
Y
2HW42AA/AT
Z2 G5 Mini HDD Carrier Cage
Y
Y
1X5Q2AA/AT
Input Devices
Factory
Configured
Option Kit
Option Kit Part
Number
HP Premium Wireless Keyboard
Y
Y
Z9N41AA/AT
HP USB 320K Keyboard
Y Y 9SR37AA
HP USB Business Slim Wired Smartcard CCID Keyboard
Y N
HP Wireless Business Slim Keyboard and Mouse
Y Y
HP USB Premium Wired Keyboard
Y Y Z9N40AT
HP 320M Wired Mouse
Y Y 9VA80AA
HP USB Premium Mouse
Y Y 1JR32AA
HP Wireless Premium Mouse
Y Y 1JR31AA
3Dconnexion CAD Mouse
N Y M5C35AA
HP Wired Desktop 320MK Mouse and Keyboard
N Y 9SR36AA
Other Hardware
Factory
Configured
Option Kit
Option Kit Part
Number
HP Z2 Power Cord Kit
Y Y 1N1D5AA
HP DP Flex Port 2020
Y Y 141J7AA/AT
HP Dual USB-A 3.2 Gen1 Flex Port 2020
Y Y 141J8AA/AT
HP Dual USB-A 3.2 Gen1 Flex Port 2020 Mini
Y Y 141J9AA/AT
HP USB-C® 3.2 Gen2 Alt Flex Port 2020
Y Y 141K6AA/AT
HP HDMI Flex Port 2020
Y Y 141K1AA/AT
HP VGA Flex Port 2020
Y Y 141K7AA/AT
HP Mini Serial Upper Flex Port 2020 Mini
Y Y 141K2AA/AT
HP Thunderbolt 3 Flex Port 2020 Mini
Y Y 141K4AA/AT
Software
Factory
Configured
Option Kit
Support
Notes
HP Performance Advisor
Y N 1
HP PC Hardware Diagnostics UEFI (Windows OS only)
Y N 2
HP PC Hardware Diagnostics Windows
Y N
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HP Z2 Mini G5 Workstation
Supported Components
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ZCentral Remote Boost
Y N
HP Sure Sense
Y N
HP Notifications
Y N
HP Desktop Support Utility
Y N
HP Documentation
Y N
HP Image Assistant
N N
HP Support Assistant
N N
NOTE 1: Supports and preinstalled with Windows 10 only. Also available as a free download from
http://www.hp.com/go/performanceadvisor
NOTE 2: Windows OS only
Operating Systems
Windows 10 Pro 64
Windows 10 Pro 64 High End
Windows 10 Pro 64 Workstation Plus
Windows 10 Home 64 Plus
Windows 10 Home 64 Advanced
Linux Ready
NOTE: For detailed QS/hardware support information for Linux, see:
http://www.hp.com/support/linux_hardware_matrix
HP BIOS
Key features of the HP BIOS include:
Deployment and manageability – HP BIOS provides several technologies that help integrate
the HP Z2 G5 Workstation into the enterprise, such as PXE, remote recovery, remote configuration, remote control, and BIOS (F10) Setup support for 15 languages.
Network firmware updates – Update your BIOS via the cloud or standardize on a BIOS version
hosted on an Enterprise network.
Stability – HP BIOS supports the HP stable product roadmap by releasing only critical BIOS
changes to the factory and advanced change notification.
UEFI specification version 2.7
Absolute Persistence agent – For tracking and tracing services, available in select countries,
separate software and purchase of a subscription is required.
Thermal and power management – The HP BIOS provides and enables thermal and power
management technologies so component temperatures are managed for high reliability and to assist in operating the HP Workstation computer in any enterprise environment.
Acoustic performance – Industry leading acoustic emissions across the range of operating
conditions.
Serviceability – HP BIOS provides diagnostic and detailed service information.
Upgrades and recovery – HP BIOS provides numerous ways to upgrade HP Workstation
computers, including BIOS updates from within Windows (HP Firmware Update and Recovery), HP Client Manager, and fail-safe recovery. In addition, the HP BIOS Configuration Utility enables replication of BIOS settings within Windows while the Replicated Setup feature provides the same capability within BIOS (F10) Setup. The BIOS Configuration Utility is available from the HP support website.
HP BIOS uses PKI signing of the BIOS for trusted BIOS upgrades and recovery.
Additional HP BIOS Features:
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Supported Components
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Power-On password – Helps prevent an unauthorized user from powering on the system.
Administrator password – Also known as the BIOS Setup password, this helps prevent
unauthorized changes to the system configuration. If the administrator password is not known, the BIOS cannot be updated and changes cannot be made to BIOS settings using BIOS Setup or under the OS.
S4/S5 Maximum Power Savings setting supports EU Lot6 requirement and allows the
computer to power down below 0.5W in S4/S5 (when turned off). When S4/S5 Maximum Power Savings feature is enabled below features are turned off:
-Power to expansion connectors / slots
-Wake events other than power buttons (such as wake on LAN)
-USB charging ports
HP Sure Start Gen6 Start
BIOS Integrity checking – Sure Start protection ensures that only trusted BIOS code is executed
and not rootkits, viruses and malware. Verification is done upon boot up, shutdown and while the system is on.
Sure Start is set by default to automatically repair the BIOS if corrupted or compromised but is
policy driven for better manageability. Start is set by default to automatically repair the BIOS if corrupted or compromised but is policy driven for better manageability.
Protecting beyond BIOS – Integrity checking and repair is extended to other data that should
be protected such as network configuration parameters, platform specific information (i.e. system IDs), secure boot credentials, and other code the system needs to boot.
Audit enabled – System Audit via Sure Start Event Logs capture data such as incident, repair
date and time for troubleshooting and investigating.
SOFTWARE COMPONENTS AND APPLICATIONS WITH WINDOWS
BIOS
HP BIOSphere Gen6
10
BIOS Update via Network HP Secure Erase11 Absolute Persistence Module12 Pre-boot Authentication HP Wake on WLAN HP DriveLock & Automatic DriveLock 13
Software
HP Support Assistant HP Image Assistant HP Desktop Support Utility HP Documentation HP Notifications HP PC Hardware Diagnostics UEFI HP PC Hardware Diagnostics Windows HP Performance Advisor3 ZCentral Remote Boost14
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Supported Components
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Manageability Features
HP Driver Packs1 HP System Software Manager (SSM) HP BIOS Config Utility (BCU) HP Manageability Integration Kit Gen42
Client Security Software
HP Client Security Manager Gen64 HP Device Access Manager HP Power On Authentication Microsoft Defender5
Security Management
HP Sure Click9 HP Sure Start Gen66 HP Sure Run Gen37 HP Sure Sense15 HP Sure Recover Gen3
8
1. HP Driver Packs not preinstalled, however available for download at http://www.hp.com/go/clientmanagement.
2. HP Manageability Integration Kit can be downloaded from
http://www8.hp.com/us/en/ads/clientmanagement/overview.html
3. HP Performance Advisor Software - HP Performance Advisor is ready and waiting to help you get the most out of your HP Workstation from day oneand every day after. Learn more or download at: https://www8.hp.com/us/en/workstations/performance-advisor.html
4. HP Client Security Manager Gen6 requires Windows and is available on select HP Pro, Elite and Workstation PCs. See product specifications for details..
5. Microsoft Defender Opt in and internet connection required for updates.
6. HP Sure Start Gen6 is available on HP Workstation products equipped with Intel® 8th generation processors or later
7. HP Sure Run is available on HP Workstation products equipped with 8th generation Intel® or AMD® processors.
8. HP Sure Recover Gen3: See product specifications for availability. Requires an open, wired network connection. Not available on platforms with multiple internal storage drives. You must back up important files, data, photos, videos, etc. before using HP Sure Recover to avoid loss of data. Network based recovery using Wi-Fi is only available on PC’s with Intel Wi-Fi Module.
9. HP Sure Click requires Windows 10 Pro or Enterprise. See https://bit.ly/2PrLT6A_SureClick for complete details.
10. HP BIOSphere Gen6 is available on select HP Pro, Elite and Workstation PCs. See product specifications for details. Features may vary depending on the platform and configurations.
11. HP Secure Erase for the methods outlined in the National Institute of Standards and Technology Special Publication 800-88 "Clear" sanitation method. HP Secure Erase does not support platforms with Intel® Optane™.
12. Absolute agent is shipped turned off, and will be activated when customers activate a purchased subscription. Subscriptions can be purchased for terms ranging multiple years. Service is limited, check with Absolute for availability outside the U.S. The Absolute Recovery Guarantee is a limited warranty. Certain conditions apply. For full details visit: http://www.absolute.com/company/legal/agreements/computrace-agreement. Data Delete is an optional service provided by Absolute Software. If utilized, the Recovery Guarantee is null and void. In order to use the Data Delete service, customers must first sign a Pre-Authorization Agreement and either obtain a PIN or purchase one or more RSA SecurID tokens from Absolute Software.
13. Storage Drivelock does not work with Self Encrypting or Optane based storage.
14. HP Z Central Remote Boost Software does not come preinstalled on Z Workstations but can be downloaded and run on all Z desktop and laptops without license purchase. With non-Z sender devices, purchase of perpetual individual license or perpetual floating license per simultaneously executing versions and purchase of ZCentral Remote Boost Software Support is required. RGS requires Windows, RHEL (7 or 8), UBUNTU 18.04 LTS, or HP ThinPro 7 operating systems. MacOS (10.13 or newer) operating system is only supported on the receiver side. Requires network access. The software is available for download at hp.com/ZCentralRemoteBoost.
15. HP Sure Sense requires Windows 10 Pro or Enterprise. See product specifications for availability.
Page 13
QuickSpecs
HP Z2 Mini G5 Workstation

System Technical Specifications

c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 13
System Board
System Board Form Factor
202.2 x 198.5 mm (7.96 x 7.815 inch) Processor Socket
Single LGA-1200
CPU Bus Speed
DMI
Chipset
Intel® PCH W480
Super I/O Controller
Nuvoton SIO18
Memory Expansion Slots
2 DDR4 memory slots
Memory Type Supported
DDR4, SODIMM ECC & non-ECC
Memory Modes
Non-Interleaved for single channel. Interleaved when both channels are populated.
Memory Speed Supported
2933MT/s DDR4
Memory Protection
ECC available on data
Maximum Memory
64GB
Memory Configuration (Supported)
4GB, 8GB 16GB and 32GB non-ECC and 8GB, 16GB and 32GB ECC SO DIMMs are supported. ECC and non-ECC memory DIMMs cannot be mixed in the same system
PCI Express Connectors
• 1 MXM PCI Express Gen3 slot x1
• 2 M.2 Storage (PCIe Gen3 x4)
• 1 M.2 WLAN (PCIe Gen3 x1+ Intel CNVi)
Supported Drive Interfaces
SATA
Integrated (1) Serial ATA interfaces (6Gb/s SATA).
Network Controller
Integrated Ethernet PHY Connection I219LM. Management capabilities: WOL, PXE 2.1 and AMT 12
Serial
1 rear port (requires optional Serial Port Adapter Kit)
HD Integrated Audio
Yes
USB Connector(s)
Front
2 Type-A SuperSpeed USB 10Gbps signaling rate port (1 charge supports up to 5V/2.1A); 1 Type-C® SuperSpeed USB 10Gbps signaling rate port (charge supports up to 5V/3A)
Rear
2 Type-A SuperSpeed USB 10Gbps signaling rate port; 1 Type-C® SuperSpeed USB 10Gbps signaling rate port (optional); 1 Type-C® SuperSpeed USB 10Gbps signaling rate Alt mode port (optional via Flex)
Internal
2 Type-A SuperSpeed USB 5Gbps signaling rate port
HD Integrated Audio
Yes
Flash ROM
Yes
CPU Fan Header
Yes
Memory Fan Header
None
Chassis Fan Header
None
Front PCI Fan Header
1 GPU Fan (most)
Page 14
QuickSpecs
HP Z2 Mini G5 Workstation
System Technical Specifications
c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 14
Front Control Panel/Speaker Header
Yes
CMOS Battery Holder ­Lithium
Yes
Integrated Trusted Platform Module
Integrated TPM 2.0 Convertible to FIPS 140-2 Certified mode through firmware v7.85 The TPM module disabled where restricted by law, i.e. Russia.
Power Supply Headers
DC Jack for adapter
Power Switch, Power LED & Hard Drive LED Header
Yes
Clear Password Jumper
None
Keyboard/Mouse
USB
Operating Voltage Range
90-269 VAC
Rated Voltage Range
100–240 VAC
Rated Line Frequency
50-60 Hz
Operating Line Frequency Range
47–66 Hz Rated Input Current
6A@100-240V
Heat Dissipation
Typical: 444 btu/hr (112 kcal/hr) Maximum: 1484 btu/hr (374 kcal/hr)
ENERGY STAR® certified (Config Dependent)
Yes
CECP Compliant @ 220V
Yes
FEMP Standby Power Compliant
Yes, with Wake-on-LAN disabled: <2W in S5- Power Off
Built-in Self Test (BIST) LED
No
Surge Tolerant Full Ranging Power Supply (withstands power surges up to 2000V)
Yes
Z2 Mini G5 Configuration #1
ENERGY STAR CERTIFIED
Processor Info
CPU I Core i5-10400 2.9GHz 6C65W
Memory Info
8GB (1x 8GB) 2666 MHz DDR4 non-ECC
Graphics Info
Intel® UHD Integrated Graphics 630
Disks/Optical/Floppy
1x SATA 1TB 7.2k rpm
Power Supply
180W
Energy Consumption
115 VAC
230 VAC
100 VAC
Page 15
QuickSpecs
HP Z2 Mini G5 Workstation
System Technical Specifications
c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 15
(Watts)
LAN Enabled
LAN Disabled
LAN Enabled
LAN Disabled
LAN Enabled
LAN Disabled
Windows long Idle (S0)
7.38
8.76
7.03
Windows short Idle (S0)
10.74
12.02
9.96
Windows Busy Typ (S0)
90.37
99.52
88.23
Windows Busy Max (S0)
95.11
102.78
93.86
Sleep (S3)
0.78
0.45
0.82
0.51
0.73
0.41
Off (S5)
0.59
0.57
0.61
0.59
0.57
0.56
Zero Power Mode (ErP)
0.21
0.22
0.2
Heat Dissipation (Btu/hr)
115 VAC
230 VAC
100 VAC
LAN Enabled
LAN Disabled
LAN Enabled
LAN Enabled
LAN Disabled
LAN Enabled
Windows long Idle (S0)
25.181
29.889
23.986
Windows short Idle (S0)
36.645
41.012
33.984
Windows Busy Typ (S0)
308.342
339.562
301.041
Windows Busy Max (S0)
324.515
350.685
320.25
Sleep (S3)
2.661
1.535
2.798
1.74
2.491
1.399
Off (S5)
2.013
1.945
2.081
2.013
1.945
1.911
Zero Power Mode (ErP)
0.717
0.751
0.682
Z2 Mini G5 Configuration #2
Processor Info
CPU I Core i7-10700 2.9GHz 8C65W
Memory Info
16GB (2x 8GB) 2666 MHz DDR4 non-ECC
Graphics Info
T1000 Graphics
Disks/Optical/Floppy
1x SATA 256GB SSD
Power Supply
280W
Energy Consumption (Watts)
115 VAC
230 VAC
100 VAC
LAN Enabled
LAN Disabled
LAN Enabled
LAN Disabled
LAN Enabled
LAN Disabled
Windows long Idle (S0)
15.23
15.63
15.01
Windows short Idle (S0)
18.35
18.82
17.98
Windows Busy Typ (S0)
109.47
109.88
107.36
Windows Busy Max (S0)
140.9
142.95
138.56
Sleep (S3)
1.13
0.73
1.15
0.78
1.1
0.69
Off (S5)
0.62
0.61
0.63
0.61
0.61
0.6
Zero Power Mode (ErP)
0.21
0.23
0.2
Heat Dissipation (Btu/hr)
115 VAC
230 VAC
100 VAC
LAN Enabled
LAN Disabled
LAN Enabled
LAN Enabled
LAN Disabled
LAN Enabled
Windows long Idle (S0)
51.965
53.33
51.214
Windows short Idle (S0)
62.61
64.214
61.348
Windows Busy Typ (S0)
373.512
374.911
366.312
Windows Busy Max (S0)
480.751
487.745
472.767
Sleep (S3)
3.856
2.491
3.924
2.661
3.753
2.354
Off (S5)
2.115
2.081
2.15
2.081
2.081
2.047
Zero Power Mode (ErP)
0.717
0.785
0.682
Z2 Mini G5 Configuration #3
ENERGY STAR CERTIFIED
Processor Info
CPU I Core i9-10900K 3.7GHz 10C125W
Memory Info
64GB (2x 32GB) 2666 MHz DDR4 ECC
Graphics Info
T1000 Graphics
Page 16
QuickSpecs
HP Z2 Mini G5 Workstation
System Technical Specifications
c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 16
Disks/Optical/Floppy
1x SATA 512GB SSD
Power Supply
280W
Energy Consumption (Watts)
115 VAC
230 VAC
100 VAC
LAN Enabled
LAN Disabled
LAN Enabled
LAN Disabled
LAN Enabled
LAN Disabled
Windows long Idle (S0)
15.31
16.52
15.06
Windows short Idle (S0)
18.74
19.04
18.32
Windows Busy Typ (S0)
152.66
153.69
150.02
Windows Busy Max (S0)
191.14
197.91
189.96
Sleep (S3)
1.94
1.5
2.07
1.64
1.91
1.45
Off (S5)
0.62
0.6
0.63
0.61
0.61
0.6
Zero Power Mode (ErP)
0.23
0.24
0.22
Heat Dissipation (Btu/hr)
115 VAC
230 VAC
100 VAC
LAN Enabled
LAN Disabled
LAN Enabled
LAN Enabled
LAN Disabled
LAN Enabled
Windows long Idle (S0)
52.238
56.366
51.385
Windows short Idle (S0)
63.941
64.964
62.508
Windows Busy Typ (S0)
520.876
524.39
511.868
Windows Busy Max (S0)
652.17
675.269
648.144
Sleep (S3)
6.619
5.118
7.063
5.596
6.517
4.947
Off (S5)
2.115
2.047
2.15
2.081
2.081
2.047
Zero Power Mode (ErP)
0.785
0.819
0.751
Z2 Mini G5 Configuration #4
ENERGY STAR CERTIFIED
Processor Info
CPU Xeon W-1250 3.3GHz 6C80W
Memory Info
16GB (2x 8GB) 2666 MHz DDR4 ECC
Graphics Info
T2000 Graphics
Disks/Optical/Floppy
1x SATA 1TB SSD Z Turbo
Power Supply
280W
Energy Consumption (Watts)
115 VAC
230 VAC
100 VAC
LAN Enabled
LAN Disabled
LAN Enabled
LAN Disabled
LAN Enabled
LAN Disabled
Windows long Idle (S0)
15.48
15.94
15.25
Windows short Idle (S0)
19.47
19.5
19.13
Windows Busy Typ (S0)
120.03
123.49
118.69
Windows Busy Max (S0)
175.99
176.23
172.33
Sleep (S3)
1.21
1.09
1.23
1.11
1.18
1.06
Off (S5)
0.64
0.63
0.66
0.64
0.6
0.59
Zero Power Mode (ErP)
0.22
0.24
0.21
Heat Dissipation (Btu/hr)
115 VAC
230 VAC
100 VAC
LAN Enabled
LAN Disabled
LAN Enabled
LAN Enabled
LAN Disabled
LAN Enabled
Windows long Idle (S0)
52.818
54.387
52.033
Windows short Idle (S0)
66.432
66.534
65.272
Windows Busy Typ (S0)
409.542
421.348
404.97
Windows Busy Max (S0)
600.478
601.297
587.99
Sleep (S3)
4.129
3.719
4.197
3.787
4.026
3.617
Off (S5)
2.184
2.15
2.252
2.184
2.047
2.013
Zero Power Mode (ErP)
0.751
0.819
0.717
Page 17
QuickSpecs
HP Z2 Mini G5 Workstation
System Technical Specifications
c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 17
Declared Noise Emissions
System Configuration (Entry level)
Processor Info
W-1250P COMET LAKE WS P-1 6c LGA 125W WE1P 6(f)+2 vPro QSS / W­1250P COMET LAKE WS Q-0 6c LGA 4.1 GHz 125W QULG vPro Supplemental QS
Memory Info
Hynix (TG) 8GB 3200 DDR4 SODIMM ECC x2
Graphics Info
T2000
Disks/Optical/Floppy
SSD Z Turbo Drive 256GB 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SS
Power Supply
280W
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(LWAd, bels)
Deskside Sound Pressure
(LpAm, decibels)
Idle
TBD
TBD
Hard drive Operating (random reads)
SSD 512GB M.2 2280 PCIe NVMe
Three Layer Cell 3rd
System Configuration (Mid-level)
Processor Info
W-1290 COMET LAKE WS P-1 10c LGA 80W WE3 vPro QSK QS / W-1290 COMET LAKE WS Q-0 10c LGA 3.2 GHz 80W QUTJ vPro Supplemental QS
Memory Info
Samsung (TH) 8GB 3200 DDR4 SODIMM ECC x1
Graphics Info
T1000
Disks/Optical/Floppy
NA
Power Supply
280W
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(LWAd, bels)
Deskside Sound Pressure
(LpAm, decibels)
Idle
TBD
TBD
Hard drive Operating (random reads)
HDD 500GB 7200RPM SATA SFF Self
Encrypted Drive OPAL2
System Configuration (High-end)
Processor Info
I5-10400 COMET LAKE G-0 6c LGA 65W MS0 QS
Memory Info
Hynix (TG) 8GB 3200 DDR4 SODIMM ECC x1
Graphics Info
Intel UHD Graphics
Disks/Optical/Floppy
SSD Z Turbo Drive 512GB 2280 Three Layer Cell 2nd
Power Supply
280W
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(LWAd, bels)
Deskside Sound Pressure
(LpAm, decibels)
Idle
TBD
TBD
Hard drive Operating (random reads)
HDD 1TB 7200RPM 7mm SATA 2.5in
System Configuration (Mid-level)
Processor Info
I3-10320 COMET LAKE G-0 6c LGA 65W T3 4(f)+2 QS
Memory Info
Micron (TF) 8GB 3200 DDR4 SODIMM ECC x2
Graphics Info
Intel UHD Graphics
Disks/Optical/Floppy
SSD Z Turbo Drive 512GB 2280 Three Layer Cell 2nd
Power Supply
180W
Page 18
QuickSpecs
HP Z2 Mini G5 Workstation
System Technical Specifications
c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 18
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(LWAd, bels)
Deskside Sound Pressure
(LpAm, decibels)
Idle
TBD
TBD
Hard drive Operating (random reads)
HDD 1TB 7200RPM 7mm SATA 2.5in
System Configuration (High-end)
Processor Info
I3-10100 COMET LAKE G-0 6c LGA 65W T1 4(f)+2 QS
Memory Info
Micron (TF) 8GB 3200 DDR4 SODIMM ECC x2
Graphics Info
Intel UHD Graphics
Disks/Optical/Floppy
ZTRB HP Z Turbo Drive QX310 256GB SSD
Power Supply
180W
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(LWAd, bels)
Deskside Sound Pressure
(LpAm, decibels)
Idle
TBD
TBD
Hard drive Operating (random reads)
HDD 1TB 7200RPM 7mm SATA 2.5in
System Configuration (Mid-level)
Processor Info
I9-10900 COMET LAKE P-1 10c LGA 65W P2 vPro™ QS
Memory Info
Micron (TF) 4GB (1x4GB) 3200 DDR4 SODIMM NECC x2
Graphics Info
Intel UHD Graphics
Disks/Optical/Floppy
ZTRB HP Z Turbo Drive QX310 256GB SSD
Power Supply
180W
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(LWAd, bels)
Deskside Sound Pressure
(LpAm, decibels)
Idle
TBD
TBD
Hard drive Operating (random reads)
ZTRB HP Z Turbo Drive QX310 256GB
SSD
System Configuration (High-end)
Processor Info
I5-10500 COMET LAKE G-0 6c LGA 65W MS1 vPro™ QS
Memory Info
Samsung (TH) 4GB (1x4GB) 3200 DDR4 SODIMM NECC x2
Graphics Info
Intel UHD Graphics
Disks/Optical/Floppy
SSD Z Turbo Drive 512GB 2280 PCIe NVMe Self Encrypted OPAL2 Three Layer Cell SS
Power Supply
180W
Declared Noise Emissions (in accordance with ISO 7779 and ISO 9296)
Sound Power
(LWAd, bels)
Deskside Sound Pressure
(LpAm, decibels)
Idle
TBD
TBD
Hard drive Operating (random reads)
HDD 1TB 7200RPM 7mm SATA 2.5in
Environmental Requirements
Temperature
Operating: 5° to 35° C (40° to 95° F) Non-operating: -40° to 60° C (-40° to 140° F) Maximum rate of change: 10°C/hr
Humidity
Operating: 10% to 85% RH, non-condensing, 35° C maximum wet bulb Non-operating: 10% to 90% RH, non-condensing, 35° C maximum wet bulb
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QuickSpecs
HP Z2 Mini G5 Workstation
System Technical Specifications
c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 19
Maximum Altitude
Operating (with Rotational Hard Drives): 3,048 m (10,000 feet) Operating (with only Solid-State Drives): 5,000 m (16,404 feet) Non-operating: 12,192 m (40,000 feet) Maximum operating temperature is reduced as altitude increases. See Cooling for details.
Dynamic
Shock Operating: ½-sine: 40g, 2-3ms (~62 cm/sec) Non-operating: ½-sine: 160 cm/s, 2-3ms (~105g) square: 422 cm/s, 20g
Vibration Operating random: 0.5g (rms), 5-300 Hz, up to 0.0025g²/Hz Non-operating random: 2.0g (rms), 5-500 Hz, up to 0.0150 g²/Hz
Cooling
Above 1524 m (5,000 feet) altitude, the maximum operating temperature is reduced by 1° C (1.8° F) for every 305 m (1,000 feet) increase in elevation, up to 3048 m (10,000 feet)
Page 20
QuickSpecs
HP Z2 Mini G5 Workstation
System Technical Specifications
c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 20
Physical Security and Serviceability
Access Panel
Tool-less Has to remove Top panel before Bottom panel be removed.
Optical Drive
No
Hard Drives
HDD cage requires the use of a screwdriver to remove the HDD
Expansion Cards
M.2 module requires a screwdriver to service and replace. An option card requires a screwdriver to service and replace.
Processor Socket
Tool-less, except for the processor heatsink
Blue User Touch Points
Yes, on internal chassis mechanisms
Color-coordinated Cables and Connectors
Yes Memory
Tool-less
System Board
Screw-In
Dual Color Power and HD LED on Front of Computer
The Power LED is on the front of the system, but the HDD LED is located on the Rear of the system
Restore CD/DVD Set
Consists of an operating system DVD (OSDVD) and a driver DVD (DRDVD). OSDVD restores the original operating system. DRDVD will provide all drivers for the system. The DRDVD may also contain applications that originally shipped with the system for optional installation. Applications can also be obtained from HP.com. OSDVD and DRDVD are orderable with the system and available from HP Support.
Dual Function Front Power Switch
Yes, causes a fail-safe power off when held for 4 seconds (default) or 15 seconds (can be configured by F10 BIOS setup\Advanced\System Options\Power button override)
Padlock Support
No
Cable Lock Support
Yes, Kensington Cable Lock (optional): Locks top cover from being opened and secures chassis to furniture to prevent theft 3 mm x 7 mm slot at rear of system
Universal Chassis Clamp Lock Support
No
Solenoid Lock and Hood Sensor
Only Hood Sensor(optional)
Rear Port Control Cover
No
Serial, USB, Audio, Network, Enable/Disable Port Control
Yes, enables or disables serial, USB, audio, and network ports (parallel port is not supported on the Z2 Mini G5)
Power-On Password
No
3.3V Aux Power LED on System PCA
No
NIC LEDs (integrated) (Green & Amber)
Yes CPUs and Heatsinks
A T-15 Torx or flat blade screwdriver is needed to remove the CPU heatsink before the CPU can be removed. CPU removal is tool-less
Page 21
QuickSpecs
HP Z2 Mini G5 Workstation
System Technical Specifications
c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 21
Power Supply Diagnostic LED
Yes; this is located on the Rear of the chassis and combined with the HDD LED. When the PSU adapter is plugged in, and the unit is powered off, the Power OK LED will glow.
Front Power Button
Yes
Front Power LED
Yes, white (normal), red (fault)
Front Hard Drive Activity LED
HDD LED is located on the Rear of the chassis
Front ODD Activity LED
No
Internal Speaker
Yes
Cooling Solution
Air cooled forced convection
Power Supply Fans
No
Memory Heatsink Fan
No
Access Panel Key Lock
The Kensington lock slot on the chassis serves this purpose
Integrated Chassis Handles
No
Power Supply
No
Flash ROM
Yes
Diagnostic Power Switch LED on board
Yes Clear CMOS Button
Yes
CMOS Battery Holder
Yes
DIMM Connectors
Yes
BIOS
BIOS 32-bit Services
BIOS supports 64-bit Operating systems.
PCI 3.0 Support
Full BIOS support for PCI Express through industry standard interfaces.
ATAPI
ATAPI Removable Media Device BIOS Specification Version 1.0.
BBS
BIOS Boot Specification v1.01.
WMI Support
WMI is Microsoft's implementation of Web-Based Enterprise Management (WBEM) for Windows. WMI is fully compliant with the Distributed Management Task Force (DMTF) Common Information Model (CIM) and WBEM specifications.
BIOS Boot Spec 1.01+
Provides more control over how and from what devices the workstation will boot.
BIOS Power On
Users can define a specific date and time for the system to power on.
ROM Based Computer Setup Utility (F10)
Review and customize system configuration settings controlled by the BIOS.
System/Emergency ROM Flash Recovery with Video
Recovers system BIOS in corrupted Flash ROM.
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QuickSpecs
HP Z2 Mini G5 Workstation
System Technical Specifications
c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
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Replicated Setup
Saves BIOS settings to USB flash device in human readable file (HpSetup.txt). BiosConfigurationUtility.exe utility can then replicate these settings on machines being deployed without entering Computer Configuration Utility (F10 Setup).
SMBIOS
System Management BIOS 3.2, for system management information.
Boot Control
Disables the ability to boot from removable media on supported devices.
Memory Change Alert
Alerts management console if memory is removed or changed.
Thermal Alert
Monitors the temperature state within the chassis. Three modes:
• NORMAL - normal temperature ranges.
• ALERTED - excessive temperatures are detected. Raises a flag so action can be taken to avoid
shutdown or provide for a smoother system shutdown.
• SHUTDOWN - excessive temperatures are encountered. Automatically shuts down the computer without warning before hardware component damage occurs.
Remote ROM Flash
Provides secure, fail-safe ROM image management from a central network console.
ACPI (Advanced Configuration and Power Management Interface)
Allows the system to enter and resume from low power modes (sleep states). Enables an operating system to control system power consumption based on the dynamic workload. Makes it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system. Supports ACPI 6.0 for full compatibility with 64-bit operating systems.
Ownership Tag
A user-defined string stored in non-volatile memory that is displayed in the BIOS splash screen.
Remote Wakeup/Remote Shutdown
System administrators can power on, restart, and power off a client computer from a remote location.
Instantly Available PC (Suspend to RAM - ACPI sleep state S3)
Allows for very low power consumption with quick resume time.
Remote System Installation via F12 (PXE
2.1) (Remote Boot from Server)
Allows a new or existing system to boot over the network and download software, including the operating system.
ROM revision levels
Reports the system BIOS revision level in Computer Configuration Utility (F10 Setup). Version is available through an industry standard interface (SMBIOS and WMI) so that management SW applications can use and report this information.
System board revision level
Allows management SW to read revision level of the system board. Revision level is digitally encoded into the HW and cannot be modified.
Start-up Diagnostics (Power-on Self-Test)
Assesses system health at boot time with selectable levels of testing.
Auto Setup when new hardware installed
System automatically detects addition of new hardware.
Keyboard-less Operation
The system can be booted without a keyboard.
Localized ROM Setup
Common BIOS image supports System Configuration Utility (F10 Setup) menus in 14 languages with local keyboard mappings.
Asset Tag
The user or MIS to set a unique tag string in non-volatile memory.
Per-slot Control
Allows I/O slot parameters (option ROM enable/disable, bus latency) to be configured individually.
Adaptive Cooling
Control parameters are set according to detected hardware configuration for optimal acoustics.
Pre-boot Diagnostics
(Pre-video) critical errors are reported via beeps and blinks on the power LED.
Industry Standard
Revision Supported by the BIOS
UEFI Specification Revision
2.7
ACPI
Advanced Configuration and Power Management Interface, Version 6.0
ATA (IDE)
AT Attachment 6 with Packet Interface (ATA/ATAPI-6), Revision 3b
CD Boot
"El Torito" Bootable CD-ROM Format Specification Version 1.0
EDD
Enhanced Disk Drive Specification Version 1.1 BIOS Enhanced Disk Drive Specification Version 3.0
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QuickSpecs
HP Z2 Mini G5 Workstation
System Technical Specifications
c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 23
EHCI
Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0
PCI
PCI Local Bus Specification, Revision 2.3 PCI Power Management Specification, Revision 1.1 PCI Firmware Specification, Revision 3.0, Draft .7
PCI Express
PCI Express Base Specification, Revision 2.0 PCI Express Base Specification, Revision 3.0
SATA
Serial ATA Specification, Revision 1.0a Serial ATA 3 Gb/s: Serial ATA Specification, Revision 2.5 Serial ATA 6 Gb/s: Serial ATA Specification, Revision 3.0
SPD
PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2B
TPM
Trusted Computing Group TPM Specification Version 2.0 (Infineon SLB 9670). Common Criteria EAL4+ certified. FIPS 140-2 Certification TCG TPM Certified products list: http://www.trustedcomputinggroup.org/certification/tpm-certified-products/
UHCI
Universal Host Controller Interface Design Guide, Revision 1.1
USB
Universal Serial Bus Revision 1.1 Specification Universal Serial Bus Revision 2.0 Specification Universal Serial Bus Revision 3.1 Specification
SMBIOS
System Management BIOS Reference Specification, Version 3.2 External BIOS simulator found at: http://csrsml.itcs.hp.com/
Social and Environmental Responsibility
Eco-Label Certifications & Declarations
This product is low halogen except for power cords, cables and peripherals. Service parts obtained after purchase may not be Low Halogen.
ENERGY STAR® (energy-saving features available on selected configurations –Windows®
only)
US Federal Energy Management Program (FEMP)
China Energy Conservation Program (CECP)
IT ECO declaration
Batteries
The battery in this product complies with EU Directive 2006/66/EC Battery size: CR2032 (coin cell) Battery type: Lithium Metal
The battery in this product does not contain:
Mercury greater than 5ppm by weight
Cadmium greater than 10ppm by weight
Lead greater than 40ppm by weight
Restricted Material Usage
This product meets the material restrictions specified in HP's General Specification for the Environment. http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf HP Inc. is committed to compliance with all applicable environmental laws and regulations, including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide basis.
End-of-Life Management and Recycling
HP Inc. offers end-of-life HP product return and recycling programs in many geographic areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner. This product is greater than 90% recyclable by weight when properly disposed of at end of life.
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HP Z2 Mini G5 Workstation
System Technical Specifications
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HP Inc. Corporate Environmental Information
For more information about HP's commitment to the environment: Living Progress Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html
Additional Information
This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive - 2002/96/EC.
Plastic parts weighing over 25 grams used in the product are marked per ISO 11469 and
ISO1043.
This product is >90% recycle-able when properly disposed of at end of life
EPEAT®2019 Gold registered in the United States*
*Based on US EPEAT® registration according to IEEE 1680.1-2018 EPEAT®. EPEAT® status varies by country. Visit www.epeat.net for more information.
Packaging
HP Workstation product packaging meets the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/society/gen_specifications.html
Does not contain restricted substances listed in HP Standard 011-1 General Specification for
the Environment
Does not contain ozone-depleting substances (ODS)
Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess
of 100 ppm sum total for all heavy metals listed
Maximizes the use of post-consumer recycled content materials in packaging materials
All packaging material is recyclable
All packaging material is designed for ease of disassembly
Reduced size and weight of packages to improve transportation fuel efficiency
Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards
formatting
Packaging Materials
Internal
Cushions made from fabricated recycled expanded-polyethylene (EPE) or recycled expanded­polypropylene (EPP). May also be made from recycled molded paper-pulp (MPP).
External
Carton made from corrugated fiberboard with at least 35% recycled content.
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HP Z2 Mini G5 Workstation
System Technical Specifications
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Manageability
Remote Manageability Software Solutions
The HP Z2 G5 Workstation is supported on the following remote manageability software consoles:
LANDesk Management Suite (HP recommended solution)
Microsoft System Center Configuration Manager
For questions or support for manageability needs, please visit
http://www.hp.com/go/clientmanagement
HP Image Assistant
Visit: http://ftp.hp.com/pub/caps-softpaq/cmit/HPIA.html
System Software Manager
For questions or support for SSM, please visit: http://www.hp.com/go/ssm
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QuickSpecs
HP Z2 Mini G5 Workstation

Stable & Consistent Offerings

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As part of its commitment to hardware, software, and solution innovation, HP is proud to introduce this breakthrough platform configuration stability to HP Workstation customers. HP Stable & Consistent Offerings are built on the foundation of a carefully chosen set of hardware and software designed and tested to work with all HP Z Workstation platforms through their end of life. These components and their corresponding HP Workstation platform compatibility are outlined in this section.
HP Stable & Consistent Offerings are available worldwide to all HP Workstation customers-no special programs, no additional cost, no kidding. Simply select your hardware and software components when you customize your HP Workstation and be assured that you'll be able to buy that same configuration throughout the lifecycle of the product.
Processors
Product #
Offering
Intel Core i3-10100 3.6 4C 65W processor
Intel Core i5-10500 3.1 6C 65W processor
Intel Core i5-10600 3.3 6C 65W processor
Intel Core i7-10700 2.9 8C 65W processor
Intel Xeon W-1250 3.3 6C 80W processor
Intel Xeon W-1250P 4.1 6C 125W processor
Hard Drives Product #
Offering
1TB 7200RPM 9.5mm SATA 2.5 HDD
Graphics Product #
Offering
AMD Radeon™ Pro WX 3200 4GB
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HP Z2 Mini G5 Workstation

Technical Specifications - Processors

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10th Generation Intel Core Processors
Intel® Core™ i9-10900K Processor
Intel® Core™ i9-10900 Processor
Intel® Core™ i9-10900F Processor1
Intel® Core™ i7-10700K Processor
Intel® Core™ i7-10700 processor
Intel® Core™ i5-10600K processor
Intel® Core™ i5-10600 processor
Intel® Core™ i5-10500 processor
Intel® Core™ i5-10400 processor
Intel® Core™ i5-10400F Processor1
Intel® Core™ i3-10320 processor1
Intel® Core™ i3-10300 processor
1
Intel® Core™ i3-10100 processor
Intel Xeon W Processors
Intel® Xeon® W-1290P processor
Intel® Xeon® W-1290 processor1
Intel® Xeon® W-1270P processor1
Intel® Xeon® W-1270 processor
Intel® Xeon® W-1250P processor
Intel® Xeon® W-1250 processor
NOTE 1: Available in Q4, 2020
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HP Z2 Mini G5 Workstation

Technical Specifications - Hard Drives

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SATA Hard Drives for HP Workstations
500GB SATA 7200 rpm 6Gb/s 2.5" HDD
Capacity
500GB
Protocol
SATA
Form Factor
SFF (2.5")
Controller
AHCI
Rated for 24/7/365 operation
NO Physical Size (Height)
0.28 in; .7 cm
Physical Size (Width)
2.75 in; 6.99 cm
Media Diameter
2.5 in; 6.36 cm
Interface
Serial ATA (6Gb/s), NCQ enabled
Synchronous Transfer Rate (Maximum)
Up to 600MB/s* Operating Temperature
32° to 140° F (5° to 55° C)
*Actual performance may vary.
1TB SATA 7200 rpm 6Gb/s 2.5" HDD
Capacity
1TB
Protocol
SATA
Form Factor
SFF (2.5")
Controller
AHCI
Rated for 24/7/365 operation
NO Physical Size (Height)
0.28 in; .7 cm
Physical Size (Width)
2.75 in; 6.99 cm
Media Diameter
2.5 in; 6.36 cm
Interface
Serial ATA (6Gb/s), NCQ enabled
Synchronous Transfer Rate (Maximum)
Up to 600MB/s* *Actual performance may vary.
2TB SATA 7200 rpm 6Gb/s 2.5" HDD
Capacity
2TB
Protocol
SATA
Form Factor
SFF (2.5")
Controller
AHCI
Physical Size (Height)
0.28 in; .7 cm
Physical Size (Width)
2.75 in; 6.99 cm
Media Diameter
2.5 in; 6.36 cm
Operating Temperature
32° to 140° F (5° to 55° C)
*Actual performance may vary.
500GB SATA 7.2K SED
2.5" HDD
Capacity
500GB
Protocol
SATA
Form Factor
2.5"
Physical Size (Height)
0.275 in; 0.7 cm
Physical Size (Width)
2.5 in; 6.36 cm
Media Diameter
2.75 in; 6.99 cm
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HP Z2 Mini G5 Workstation
Technical Specifications - Hard Drives
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Interface
Serial ATA (6Gb/s), NCQ enabled
Synchronous Transfer Rate (Maximum)
Up to 600MB/s*
Buffer
64MB
Seek Time (typical reads, includes controller overhead, including settling)
Single Track
1ms*
Average
4.2ms*
Full Stroke
25ms (Typical)*
Rotational Speed
7,200 rpm
Operating Temperature
32° to 131° F (0° to 60° C)
Self-Encrypting Drive Support
Yes *Actual performance may vary.
HP 256GB SATA 6Gb/s SSD
Capacity
256GB
Protocol
SATA
Form Factor
2.5"
Physical Size (Height)
0.28 in; 0.7 cm
Physical Size (Width)
Physical Size
Synchronous Transfer Rate (Maximum)
Up to 550MB/s (Sequential Read)*
Operating Temperature
32° to 158° F (0° to 70° C)
*Actual performance may vary.
PCIe SSDs for HP Workstations
HP Z Turbo Drv 256GB TLC PCIe SSD (Z2G5)
Capacity
256GB
Protocol
PCIe
Form Factor
M.2 in native slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
75TBW (TB Written)
Reliability (MTBF)
1.5M hours
Interface
PCI Express 3.0 x4
Operating Temperature
32° to 158° F (0° to 70° C)
Performance
Sequential Read
2800 MB/s*
Sequential Write
1100MB/s*
Random Read
250K IOPS*
Random Write
180K IOPS*
*Actual performance may vary.
HP Z Turbo Drv 512GB TLC PCIe SSD (Z2G5)
Capacity
512GB
Protocol
PCIe
Form Factor
M.2 in native slot on motherboard
Controller
NVMe
NAND Type
3D TLC
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Technical Specifications - Hard Drives
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Endurance
150TBW (TB Written)
Reliability (MTBF)
1.5M hours
Interface
PCI Express 3.0 x4 electrical
Operating Temperature
32° to 158° F (0° to 70° C)
Performance
Sequential Read
2800 MB/s*
Sequential Write
1600MB/s*
Random Read
260K IOPS*
Random Write
260K IOPS*
*Actual performance may vary.
HP Z Turbo Drv 1TB TLC PCIe SSD (Z2G5)
Capacity
1TB
Protocol
PCIe
Form Factor
M.2 in native slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
300TBW (TB Written)
Reliability (MTBF)
1.5M hours
Interface
PCI Express 3.0 x4 electrical
Operating Temperature
32° to 158° F (0° to 70° C)
Performance
Sequential Read
3000 MB/s*
Sequential Write
1700MB/s*
Random Read
360K IOPS*
Random Write
330K IOPS*
*Actual performance may vary.
HP Z Turbo Drv 2TB TLC PCIe SSD (Z2G5)
Capacity
2TB
Protocol
PCIe
Form Factor
M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
600TBW (TB Written)
Reliability (MTBF)
1.5M hours
Interface
PCI Express 3.0 x4 electrical
Operating Temperature
32° to 158° F (0° to 70° C)
Performance
Sequential Read
3000 MB/s*
Sequential Write
2100MB/s*
Random Read
320K IOPS*
Random Write
265K IOPS*
*Actual performance may vary.
HP Z Turbo Drv 256GB TLC PCIe SED OPAL2 (Z2G5)
Capacity
256GB
Protocol
PCIe
Form Factor
M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
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Technical Specifications - Hard Drives
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Endurance
75TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 3.0 x4 electrical
Operating Temperature
32° to 158° F (0° to 70° C)
Performance
Sequential Read
2800MB/s*
Sequential Write
1100MB/s*
Random Read
250K IOPS*
Random Write
180K IOPS*
Self-Encrypting Drive Support
OPAL2
*Actual performance may vary.
HP Z Turbo Drv 512GB TLC PCIe SED OPAL2 (Z2G5)
Capacity
512GB
Protocol
PCIe
Form Factor
M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
150TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 3.0 x4 electrical
Operating Temperature
32° to 158° F (0° to 70° C)
Performance
Sequential Read
2800MB/s*
Sequential Write
1600MB/s*
Random Read
260K IOPS*
Random Write
260K IOPS*
Self-Encrypting Drive Support
OPAL2
*Actual performance may vary.
HP Z Turbo Drv 1TB TLC PCIe SED OPAL2 (Z2G5)
Capacity
1TB
Protocol
PCIe
Form Factor
M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
300TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 3.0 x4 electrical
Operating Temperature
32° to 158° F (0° to 70° C)
Performance
Sequential Read
3000MB/s*
Sequential Write
1700MB/s*
Random Read
360K IOPS*
Random Write
330K IOPS*
Self-Encrypting Drive Support
OPAL2
*Actual performance may vary.
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Technical Specifications - Hard Drives
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HP Z Turbo Drv 2TB TLC PCIe SED OPAL2 (Z2G5)
Capacity
2TB
Protocol
PCIe
Form Factor
M.2 in native Slot on motherboard
Controller
NVMe
NAND Type
3D TLC
Endurance
600TBW (TB Written)
Reliability (MTBF)
1.5M Hours
Interface
PCI Express 3.0 x4 electrical
Operating Temperature
32° to 158° F (0° to 70° C)
Performance
Sequential Read
3000MB/s*
Sequential Write
2100MB/s*
Random Read
320K IOPS*
Random Write
265K IOPS*
Self-Encrypting Drive Support
OPAL2
*Actual performance may vary.
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HP Z2 Mini G5 Workstation

Technical Specifications - Graphics

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AMD Radeon™ Pro WX
3200 4GB Graphics
Form Factor
Mobile PCI Express Custom Module
Power
35W
Bus Type
PCI Express 3.0 x8
Memory
4GB GDDR5
Connectors
3x DisplayPort™ 1.4 – HDR ready connectors with HBR3 and MST support.
Maximum Resolution
4096x2160 x 24 bpp @ 60Hz
Supported Graphics APIs
DirectX®12 OpenGL® 4.5
OpenCL™ 2.0 Vulkan™ 1.0
Available Graphics Drivers
Windows 10 64-bit Linux® 64-bit (selected Enterprise distributions)
HP qualified drivers may be preloaded or available from the HP support Web site: http://welcome.hp.com/country/us/en/support.html
Nvidia® Quadro® P620 4GB Graphics
Form Factor
Mobile PCI Express Custom Module
Power
35W
Bus Type
PCI Express 3.0 x16
Memory
4GB GDDR5
Connectors
3x DisplayPort™ 1.2 HDR ready connectors with HBR2 and MST support.
Maximum Resolution
4096x2160 x 24 bpp @ 60Hz
Supported Graphics APIs
DirectX®12 OpenGL® 4.5
OpenCL™ 2.0 Vulkan™ 1.0
Available Graphics Drivers
Windows 10 64-bit Linux® 64-bit (selected Enterprise distributions)
HP qualified drivers may be preloaded or available from the HP support Web site: http://welcome.hp.com/country/us/en/support.html
Nvidia® Quadro® T1000 4GB Graphics
Form Factor
Mobile PCI Express Custom Module
Power
50W
Bus Type
PCI Express 3.0 x16
Memory
4GB GDDR6
Connectors
3x DisplayPort™ 1.4 – HDR ready connectors with HBR3 and MST support.
Maximum Resolution
5120 x 3200 @ 60Hz
Supported Graphics APIs
DirectX®12 OpenGL® 4.5
OpenCL™ 2.0 Vulkan™ 1.0
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Technical Specifications - Graphics
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Available Graphics Drivers
Windows 10 64-bit Linux® 64-bit (selected Enterprise distributions)
HP qualified drivers may be preloaded or available from the HP support Web site: http://welcome.hp.com/country/us/en/support.html
Nvidia® Quadro® T2000 4GB Graphics
Form Factor
Mobile PCI Express Custom Module
Power
60W
Bus Type
PCI Express 3.0 x16
Memory
4GB GDDR6
Connectors
3x DisplayPort™ 1.4 – HDR ready connectors with HBR3 and MST support.
Maximum Resolution
5120 x 3200 @ 60Hz
Supported Graphics APIs
DirectX®12 OpenGL® 4.5
OpenCL™ 2.0 Vulkan™ 1.0
Available Graphics Drivers
Windows 10 64-bit Linux® 64-bit (selected Enterprise distributions)
HP qualified drivers may be preloaded or available from the HP support Web site: http://welcome.hp.com/country/us/en/support.html
Nvidia® Quadro® RTX 3000 6GB Graphics
Form Factor
Mobile PCI Express Custom Module
Power
60W
Bus Type
PCI Express 3.0 x16
Memory
6GB GDDR6
Connectors
3x DisplayPort™ 1.4 – HDR ready connectors with HBR3 and MST support.
Maximum Resolution
5120 x 3200 @ 60Hz*
*Requires 2 DisplayPorts to be plugged into a 5K monitor.
Supported Graphics APIs
DirectX®12 OpenGL® 4.5
OpenCL™ 2.0 Vulkan™ 1.0
Available Graphics Drivers
Windows 10 64-bit Linux® 64-bit (selected Enterprise distributions)
HP qualified drivers may be preloaded or available from the HP support Web site: http://welcome.hp.com/country/us/en/support.html
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HP Z2 Mini G5 Workstation

Technical Specifications - Networking and Communications

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Integrated Intel® I219LM PCIe GbE Controller
(Intel® vPro™ with Intel®
AMT 12.0)
Connector
RJ-45
Controller
Intel® I219LM GbE platform LAN connect networking controller
Memory
3 KB Tx and 3KB Rx FIFO packet buffer memory
Data Rates Supported
10/100/1000 Mbps
Compliance
802.1as/1588, 802.1p, 802.1Q, 802.3, 802.3ab, 802.3az, 802.3i, 802.3u,
802.3z
Bus Architecture
PCI Express and SMBus
Data Transfer Mode
PCIe-based interface for active state operation (S0 state) and SMBus for host and management traffic (Sx low power state)
Power Requirement
Requires 3.3V (integrated regulators for core Vdc)
Boot ROM Support
Yes
Network Transfer Mode
Full-duplex; Half-duplex (not supported for the 1000BASE-T transceiver)
Network Transfer Rate
10BASE-T (half-duplex) 10 Mbps 10BASE-T (full-duplex) 20 Mbps 100BASE-TX (half-duplex) 100 Mbps 100BASE-TX (full-duplex) 200 Mbps 1000BASE-T (full-duplex) 2000 Mbps
Management Capabilities
vPro, WOL, auto MDI crossover, PXE, Muti-port teaming, RSS, ACPI, Advanced cable diagnostic, loopback modes, AMT 12.0 support, Circuit Breaker, VLAN, Multicast Listener Discovery (MLD)
Intel® 9560 Wireless LAN (802.11ac) and Bluetooth 5 Module
Connector
M.2 (Supports 2230 form factor; E Key) Motherboard Interface
Controller
Intel® Dual Band Wireless-AC 9560
Compliance
Wireless LAN: IEEE 802.11abgn, 802.11ac, 802.11d, 802.11e, 802.11i,
802.11h, 802.11w, CCX 4.x/CCX Lite, WMM, WPA, WPA2, APS, WPS 2.0, Protected Management Frames Bluetooth®: Dual Mode Bluetooth® 2.1, 2.1+EDR, 3.0, 4.0, BLE, 4.2, and 5 Bus Architecture
PCI Express Gen3 x1 and USB 2.0
Power Requirement
Requires 3.3V; 1.65W TDP
Management Capabilities
Wake on WLAN (in all sleep states, excluding Max Power Savings mode), WFA Management Frame Protection (802.11w), vPro/WiAMT Not Currently Supported, F10 BIOS Menu option to disable/enable WLAN and Bluetooth® radios, supports seamless roaming between 802.11 wireless access points
Throughput
Max PHY throughput 1.73 Gbps (802.11ac) for WLAN
Allied Telesis 1GbE LC Fiber 2pc Module
Network Interface(s)
1 LC Fiber Connection
System Interface
PCI Express Gen1.1x1 (via WLAN M.2 interface)
Network Cable
1GbE over Multimode LC Fiber. Distance is dependent upon network cable: OM1 50/125um 500 MHz:km 550m OM2 62.5/125um 200 MHz:km 275m OM2 62.5/125um 160MHz:km 220m
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Technical Specifications - Networking and Communications
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Data Rates Supported
1 Gbps
LED Indicators
Link/Activity LED (Green): Off = No Link, Solid = Link, Blinking = Activity
Controller
Broadcom BCM57762
Compliance
IEE 802.3z Base1000SX
802.3x (Ethernet Flow Control)
802.1Q (VLANs)
802.1P (Quality of Service)
FCC B (USA) CE (European Union) ICES-003 B (Canada) BSMI (Taiwan) VCCI (Japan) KCC (Korea) CTICK (Australia/New Zealand)
UL (Safety) RoHS (Restricted or Hazardous Substances)
Power Requirement
2W (Typical)
Operating Temperature
32° to 122° F (0° to 50° C)
Physical Dimensions (LxW)
LC Fiber Board: 37mm x 45mm x 13mm (WxLxH, including connector) Cable: 200mm M.2 Board: 22mm x 30mm x 1.75mm (WxLxH)
Kit Contents
LC fiber board, M.2 board, connecting cable, and 2 screws for attaching the LC fiber board to the motherboard Product Warranty statement and the Installation Guide.
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HP Z2 Mini G5 Workstation

Technical Specifications – Miscellaneous Features

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MISCELLANEOUS FEATURES
Management Features
Advanced Configuration and Power Management Interface (ACPI). Allows the system to wake from a low power mode.
Controls system power consumption, making it possible to place individual cards and peripherals in a low-power or powered-off state without affecting other elements of the system.
Intel® Wired for Management support; industry wide initiative to make Intel® architecture based PCs, servers and mobile
computers more inherently manageable out-of-the-box and over the network PCs, servers and mobile computers more inherently manageable out-of-the-box and over the network PCs, servers and mobile computers more inherently manageable out-of-the-box and over the network
Dual State Power Button; acts as both an on/off button and a suspend-to-sleep button
Serviceability Features
Dual colored power LED on front of computer to indicate either normal or fault condition
Diagnostic LED Explanation Table:
o Power LED will blink red 2 to 5 times, then blink white 2 or more times, then repeat (with beep tones for each
blink initially):
2 red + 2 white User must provide file for BIOS recovery (USB storage typically) + 2 white User must
provide file for BIOS recovery (USB storage typically) + 2 white User must provide file for BIOS recovery (USB storage typically)
2 red + 3 white User must enter a key sequence to proceed with recovery by policy + 3 white User
must enter a key sequence to proceed with recovery by policy + 3 white User must enter a key sequence to proceed with recovery by policy
2 red + 4 white BIOS recovery is in progress + 4 white BIOS recovery is in progress + 4 white BIOS
recovery is in progress
3 red + 2 white Memory could not be initialized + 2 white Memory could not be initialized + 2 white
Memory could not be initialized
3 red + 3 white Graphics adaptor could not be found + 3 white Graphics adaptor could not be found +
3 white Graphics adaptor could not be found
3 red + 4 white Power supply failure / not connected + 4 white Power supply failure / not connected +
4 white Power supply failure / not connected
3 red + 5 white Processor not installed + 5 white Processor not installed + 5 white Processor not
installed
3 red + 6 white Current processor does not support an enabled feature + 6 white Current processor
does not support an enabled feature + 6 white Current processor does not support an enabled feature
4 red + 2 white Processor has exceeded its temperature threshold / system thermal shutdown + 2
white Processor has exceeded its temperature threshold / system thermal shutdown + 2 white Processor has exceeded its temperature threshold / system thermal shutdown
4 red + 3 white System internal temperature has exceeded its threshold + 3 white System internal
temperature has exceeded its threshold + 3 white System internal temperature has exceeded its threshold
5 red + 2 white System controller firmware is not valid 5 red + 3 white System controller detected BIOS is not executing 5 red + 4 white BIOS could not complete initialization / PCA failure 5 red + 5 white System controller rebooted the system after a health or recovery timer triggered
rebooted the system after a health or recovery timer triggered rebooted the system after a health or recovery timer triggered
HP PC Hardware Diagnostics UEFI: o This utility enables hardware level testing outside the operating system on many components. The diagnostics
can be invoked by pressing F2 at POST, and is available as a download from HP Support
System/Emergency ROM
Flash ROM
CMOS Battery Holder for easy replacement
Flash Recovery with Video Configuration Record Software5 Aux Power LED on System PCA
Processor ZIF Socket for easy Upgrade
Over-Temp Warning on Screen (Requires IM Agents)
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HP Z2 Mini G5 Workstation
Technical Specifications – Miscellaneous Features
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Clear Password Jumper
DIMM Connectors for easy Upgrade
Clear CMOS Button
NIC LEDs (integrated) (Green & Amber)
Color coordinated cables and connectors
Tool-less Hood Removal
Front power switch
System memory can be upgraded without removing the system board or any internal components
Tool-less Hard Drive, CD & Diskette Removal
Green Pull Tabs, and Quick Release Latches for easy Identification
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QuickSpecs
HP Z2 Mini G5 Workstation

Summary of Changes

c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
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Date of change:
Version History:
Description of change:
From v1 to v2
Page 40
QuickSpecs

HP Z2 Mini G5 Workstation

c06724012 DA – 16683 Worldwide Version 1 September 1, 2020
Page 40
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