
Overview
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USB 3.0 (2 ports, upper charging, lower standard)
Thunderbolt™ 2* (2 ports)
*Thunderbolt is new technology. Thunderbolt cable and Thunderbolt device (sold separately) must be compatible with Windows.
To determine whether your device is Thunderbolt Certified for Windows, see https://thunderbolttechnology.net/products.
Thunderbolt™ 2.0 is planned to be available via an optional add-in card in early 2014.
Windows 8.1 Pro 64-bit
Windows 8.1 Pro Downgrade to Windows 7 Professional 64-bit
Windows 8.1 64-bit
Windows 8.1 Simplified Chinese Edition 64-bit
Windows 8.1 Emerging Markets 64-bit
Windows 7 Professional 64-bit
HP Linux Installer Kit (includes drivers for 64-bit OS versions of RHEL 6, SUSE Linux Enterprise
Desktop 11, Ubuntu 14.04)

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SUSE Linux Enterprise Desktop 11 (90 day license)
Red Hat Enterprise Linux Desktop/Workstation (Paper license with 1 year support; no
reinstalled OS)
Supported:
Windows 8/8.1 Enterprise 64-bit
Windows 7 Enterprise 64-bit
NOTE: For detailed OS/hardware support information for Linux, see:
http://www.hp.com/support/linux_hardware_matrix.
Intel® Turbo
Boost
Technology1
Featuring
Intel® vPro™
Technology
Intel® Xeon®
processor
E3-1281v3
Intel® Xeon®
processor
E3-1246v3
Intel® Xeon®
processor
E3-1226v3
Intel® Core™ i74790 processor
Intel® Core™ i54590 processor
Intel® Core™ i34150 processor
Intel® Xeon®
processor
E3-1280v3
Intel® Xeon®
processor
E3-1245v3
Intel® Xeon®
processor
E3-1225v3
Intel® Core™ i54570 processor
Intel® Core™ i34130 processor
1
The specifications shown in this column represent the maximum frequency (GHz) of one processor
core when accelerated with Intel Turbo Boost Technology. Turbo boost stepping occurs in 100MHz
increments. Processors that do not have turbo functionality are denoted as N/A.
Available Processor
Disclaimers
Intel Xeon E3 and Intel Core i3 processors can support either ECC or non-ECC memory.
Intel's numbering is not a measurement of higher performance. Processor numbers differentiate
features within each processor family, not across different processor families. See:

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http://www.intel.com/products/processor_number/ for details.
64-bit computing on Intel® 64 architecture requires a computer system with a processor, chipset, BIOS,
operating system, device drivers and applications enabled for Intel 64 architecture. Processor will not
operate (including 32-bit operation) without an Intel 64 architecture-enabled BIOS. Performance will
vary depending on your hardware and software configurations. See: http://www.intel.com/info/em64t
for more information.
Dual-Core and Quad-Core technologies are designed to improve performance of multithreaded
software products and hardware-aware multitasking operating systems and may require appropriate
operating system software for full benefits; check with software provider to determine suitability; Not
all customers or software applications will necessarily benefit from use of these technologies.
See below for detailed information
Panel
Type: IPS (in-plane switching) LED Backlit LCD
Viewable Image Area: 68.5 cm, (27 in.) widescreen; diagonally measured
Screen Opening (W x H): 59.8 x 33.6 cm, (23.5 x 13.3 in.)
Optimal Resolution: 2560 x 1440 @ 60 Hz; 3.7MP
Aspect Ratio: 16:9 Widescreen
Viewing Angle (typical): Up to 178° horizontal / 178° vertical
Maximum Brightness (typical)*: 380 nits cd/m
2
Minimum Brightness (typical)*: 50 nits cd/m
2
Contrast Ratio (typical)*: 1000:1
Dynamic Contrast Ratio (typical)*: N/A
Response Time (typical)*: 14 ms (gray to gray)
Pixel Pitch: 0.2331 mm x 0.2331 mm
Backlight LED Life Time: 30,000 hours minimum
Color Gamut Area vs. NTSC: 77% (CIE 1931)
Color Gamut Coverage of sRGB: 100% (CIE 1931)
Color Support **: Up to 16.7 Million colors
Notes: *All performance specifications represent the typical specifications provided by HP's component
manufacturers; actual performance may vary either higher or lower.
Notes: Color Support **: Up to 16.7 Million colors
Signal Interface/Performance
Horizontal Frequency: 90 kHz
Vertical Frequency: 60 H
Native Resolution: 2560 x 1440 @ 60 Hz; 3.7MP
Preset VESA Graphic Modes (non-interlaced): 2560 x 1440 @ 60 Hz
Maximum Pixel Clock Speed: 250 MHz
User Programmable Modes: None
Default Color Temperature: 6500 K
Touch: 10 finger touch as CTO option (no pen ability)
Z1 G2 Touch Technology:
o Sensor Panel: 27"Glass on Glass
o Multi-Touch: 10 points
o Technology: Projected Capacitive Touch
o Input: Finger or Capacitive Stylus
o Resolution: 25 pixels-per-inch minimum (Win8)
o Accuracy: 1 mm to each target & 10% jitter limit on moving (Win 8)

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Anti-glare: No glass, anti-glare as CTO option
The Z1 can either be placed on the desktop in the traditional display method or mounted on a wall with
the industry standard VESA mount. The VESA mount on the Z1 uses a 100x100 VESA mount pattern.
Expansion Slots (see
system board section for
more details)
1 MXM 3.1 (dedicated for graphics)
2 miniPCIe/mSATA full-length
Expansion Bays (see
storage section for more
details)
1 internal 3.5" bay, or
2 internal 2.5" bays
1 USB 3.0, 1 USB 3.0 Charging Data Port, 2 ThunderboltTM 2 ports (Optional**),1 SD 4.0 Media Card
Reader, 1 Headphone, 1 Microphone
** An Optical drive cannot be configured if the Thunderbolt option is selected.
1 USB 2.0 Type A on Rear IO board, 2 internal on 9-pin header (not available on touch capable option)
1 DisplayPort v1.1, 4 USB 2.0, 1 RJ45 LAN, 1 Subwoofer Output, 1 optical S/PDIF Output, 1 Audio Linein, and 1 Audio Line-out
Chassis Dimensions
(HxWxD)
Vertical display orientation WITH stand: 530.0mm x 660.4mm x 419.1mm (20.8in. x 26in. x 16.5in.);
Standard display orientation WITHOUT stand: 457.2mm x 660.4mm x 81.28mm (18in. x 26in. x 3.2in.)
Service/Shipping orientation: 116mm x 660mm x 510mm
Exact weights depend upon configuration;
Max system weight WITH stand: 21.32 kg (47 lbs);
Stand weight 5.9 kg (13 lbs)
-40° to 140°F (-40° to 60°C)
Maximum Altitude (nonpressurized)
400 watts wide-ranging, active Power Factor Correction, 90% Efficient
The Power Supply Efficiency Report for this product may be found at these links:
http://www.plugloadsolutions.com/psu_reports/HEWLETT%20PACKARD_650503001_ECOS%202720.1_400W_Report.pdf
4 DIMM slots, supporting up to 32GB ECC or 16GB non-ECC Unbuffered DDR3 1866 MT/s Components.
Actual Memory speed is determined by the processor.
The CPU determines the speed at which the memory is clocked. If a 1600MT/s capable CPU is used in
the system, the maximum speed the memory will run at is 1600MT/s regardless of the specified speed
of the memory.
Workstation ISV
Certifications
See the latest list of certifications at:
http://www.hp.com/united-states/campaigns/workstations/partnerships.html

Supported Components
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Intel® Xeon® processor E3-1200 v3 family (Z230/Z1G2)
Intel® Xeon® processor E3-1280v3, Quad-Core, 8 MB
cache, 3.6 GHz, up to 4.0 GHz with Intel Turbo Boost
Technology
Intel® Xeon® processor E3-1245v3, Quad-Core, 8 MB
cache, 3.4 GHz, up to 3.8 GHz with Intel Turbo Boost
Technology
Intel® Xeon® processor E3-1225v3, Quad-Core, 8 MB
cache, 3.2 GHz, up to 3.6 GHz with Intel Turbo Boost
Technology
Intel® Xeon® processor E3-1246v3, Quad-Core, 8 MB
cache, 3.5 GHz, up to 3.9 GHz with Intel Turbo Boost
Technology
Intel® Xeon® processor E3-1226v3, Quad-Core, 8 MB
cache, 3.3 GHz, up to 3.7 GHz with Intel Turbo Boost
Technology
4th generation Intel® Core™ processor family
Intel® Core™ i3-4130 processor, Dual-Core, 4 MB cache,
3.4 GHz
Intel® Core™ i5-4570 processor, Quad-Core, 6 MB cache,
3.2 GHz, up to 3.6 GHz with Intel Turbo Boost Technology
Intel® Core™ i3-4150 processor, Dual-Core, 4 MB cache,
3.5 GHz
Intel® Core™ i5-4590 processor, Quad-Core, 6 MB cache,
3.3 GHz, up to 3.7 GHz with Intel Turbo Boost Technology
Intel® Core™ i7-4790 processor, Quad-Core, 8 MB cache,
3.6 GHz, up to 4.0 GHz with Intel Turbo Boost Technology
NOTE 1: These processors support either ECC or non-ECC memory
NOTE 2: Intel HD Graphics P4600 provides improved desktop performance and supports workstation-
specific graphics drivers for improved compatibility and performance on select professional
applications compared to Intel HD Graphics 4600 or Intel HD Graphics 4400.
NOTE 3: These processors support only non-ECC memory
HP DreamColor LP2480zx Professional Display
HP Z Display Z30i 30-inch IPS LED Backlit Monitor
HP Z Display Z27i 27-inch IPS LED Backlit Monitor
HP Z Display Z24i 24-inch IPS LED Backlit Monitor
HP Z Display Z23i 23-inch IPS LED Backlit Monitor
HP Z Display Z22i 21.5-inch IPS LED Backlit Monitor
NOTES:
Supported by all Operating Systems available from HP
Screen Size Diagonally Measured

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SATA Hard Drives for HP Workstations
500GB SATA 7200 rpm 6Gb/s 3.5" HDD
1TB SATA 7200 rpm 6Gb/s 3.5" HDD
2.0TB SATA 7200 rpm 6Gb/s 3.5" HDD
3.0TB SATA 7200 rpm 6Gb/s 3.5" HDD
500GB SATA 10K rpm SFF HDD
HP Solid State Drive for Workstations
Intel Pro 1500 180GB SATA SSD
HP 256GB SATA 6Gb/s SED SSD
Samsung Enterprise 240GB SATA SSD
Samsung Enterprise 480GB SATA SSD
Sub-Section
Description/Notes
Note 1:
The 256GB Self-Encrypting Drive (SED) version has similar performance to the standard 256GB SSD. It is
also available in Opal 1.0 and Opal 2.0 versions
Factory integrated RAID on motherboard for SATA drives
RAID 0 Configuration - Striped Array
RAID 1 Configuration - Mirrored Array
SATA hardware RAID is not supported on Linux systems. The Linux kernel, with built-in software RAID,
provides excellent functionality and performance. It is a good alternative to hardware-based RAID. Please
visit http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00060684/c00060684.pdf for RAID
capabilities with Linux.
All drives must be identical in type and capacity
All RAID arrays must be less than 2 TB
NOTE 1: Requires identical hard drives (speeds, capacity, interface).
Integrated Intel HD Graphics (Z230/Z1G2)
NOTE 1.
Supported on
Intel Xeon E3-
12x5v3
processors

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NOTE 1.
Supported on
Intel Core i5-
4xxx and Core
i7-4xxx
processors
only.
NOTE 1.
Supported on
Intel Core i3-
4xxx
processors
only
NVIDIA Quadro K610M 1GB Graphics
NVIDIA Quadro K2100M 2GB Graphics
NVIDIA Quadro K3100M 4GB Graphics
NVIDIA Quadro K4100M 4GB Graphics
NOTE 1:
If a discrete graphics card is installed, Intel integrated graphics is disabled.
DDR3-1866 ECC Unbuffered DIMMs - CTO
HP 32GB (4x8GB) DDR3-1866 ECC RAM
HP 16GB (2x8GB) DDR3-1866 ECC RAM
HP 16GB (4x4GB) DDR3-1866 ECC RAM
HP 8GB (2x4GB) DDR3-1866 ECC RAM
HP 8GB (4x2GB) DDR3-1866 ECC RAM
HP 4GB (2x2GB) DDR3-1866 ECC RAM
HP 4GB (1x4GB) DDR3 1866 ECC RAM
DDR3-1866 nECC Unbuffered DIMMs CTO
HP 16GB (4x4GB) DDR3-1866 nECC RAM
HP 8GB (2x4GB) DDR3-1866 nECC RAM
HP 4GB (1x4GB) DDR3-1866 nECC RAM
Sub-Section Description/Notes
Intel® Xeon E3 and Intel Core i3 processors can support either ECC or non-ECC memory; Intel® Core
i5/i7 processors only support non-ECC memory.
Two channels of DDR3 memory are supported. To realize full performance at least one DIMM must be
inserted into each channel.
The CPU determines the speed at which the memory is clocked. If a 1333MT/s capable CPU is used in
the system, the maximum speed the memory will run at is 1333MT/s regardless of the specified speed
of the memory.

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Only unbuffered DDR3 DIMMs are supported.
DDR3-1866 ECC Unbuffered DIMMs - AMO
HP 8GB (1x8GB) DDR3-1866 ECC RAM
HP 4GB (1x4GB) DDR3-1866 ECC RAM
HP 2GB (1x2GB) DDR3-1866 ECC RAM
DDR3-1866 nECC Unbuffered DIMMs AMO
HP 4GB (1x4GB) DDR3-1866 nECC RAM
Sub-Section Description/Notes
The CPU determines the speed at which the memory is clocked. If a 1600MT/s capable CPU is used in
the system, the maximum speed the memory will run at is 1600MHz regardless of the specified speed
of the memory.
Multimedia and Audio
Devices
Integrated HP Digital Mic Array
Optical and Removable
Storage
HP Slim SuperMulti DVDRW SATA Drive
Actual speeds may vary. Does not permit copying of commercially available DVD movies or other
copyright protected materials. Intended for creation and storage of your original material and other
lawful uses. Double Layer discs can store more data than single layer discs. However, double-layer
discs burned with this drive may not be compatible with many existing single-layer DVD drives and
players.
As Blu-ray is a new format containing new technologies, certain disc, digital connection, compatibility
and/or performance issues may arise, and do not constitute defects in the product. Flawless playback
on all systems is not guaranteed. In order for some Blu-ray titles to play, they may require a DVI or
HDMI digital connection and your display may require HDCP support. HD-DVD movies cannot be played
on this workstation.
HP Thunderbolt 2-port AiO Module
Networking and
Communications
Integrated Intel I217LM PCIe GbE Controller
(Intel vPro with Intel AMT 9.0)
Integrated Intel Dual Band Wireless-AC 7260, Dual
Band with dual antenna TX/RX streams at 867Mbps
802.11ac Wireless LAN & Bluetooth®4 Combo Card
NOTE 1: Card is factory installed into miniPCIe slot 1.

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Racking and Physical
Security
HP Chassis Intrusion Sensor
HP USB CCID SmartCard Keyboard
HP Wireless Keyboard and Mouse
HP ENERGY STAR Qualified Configuration
HP Remote Graphics Software (RGS) 6.0
PDF Complete - Corporate Edition
MS Office Home & Business 2013
NOTE 1: Available as a free download here: www.hp.com/go/performanceadvisor
NOTE 2: Supports both 32 and 64 bit versions of Windows 7 Professional and Enterprise, Windows XP
Professional and Enterprise, and RHEL V6
NOTE 3: Available CTO as a "Drop in the Box" addition.
SUSE Linux Enterprise Desktop 11
Genuine Windows® 7 Professional 64-bit
Red Hat Enterprise Linux (RHEL) Workstation - Paper License (1yr)
Windows 8.1 Pro Downgrade to Windows 7 Professional 64-bit
Windows 8.1 Pro Downgrade to Windows 7 Professional 64-bit (National
Academic)
Windows 8.1 Simplified Chinese Edition 64-bit
Windows 8.1 Emerging Markets Single-Language 64-bit OS
Microsoft Windows 7 Professional 64-bit (National Academic)
NOTE 1: See http://www.microsoft.com/windows/windows-7/ for support details.
NOTE 2: For detailed OS/hardware support information for Linux, see:

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http://www.hp.com/support/linux_hardware_matrix.
NOTE 3: This second OS must be ordered with the HP Linux Installer Kit as the first OS.

System Technical Specifications
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Custom Motherboard, Custom Rear IO board, Custom Side IO board
Processor Socket
DDR3, UDIMM (Unbuffered), ECC & non-ECC
Non-interleaved for single channel.
Interleaved when both channels are populated.
Up to 1600MT/s DDR3
Maximum Memory
Memory Configuration
(Supported)
4GB non-ECC/ 2GB, 4GB and 8GB ECC unbuffered DIMMs are supported.
ECC and non-ECC memory DIMMs cannot be mixed on the same system.
NOTES: * Maximum memory capacities assume 64-bit operating systems, such as genuine Genuine
Windows® 7 Professional 64-Bit or Red Hat Linux 64-bit. 32-bit Windows Operating Systems support
up to 4 GB.
1 MXM 3.1 slot (PCIe Gen2 x16, DP x 2) for graphics
2 miniPCIe/mSATA slots (PCIe Gen2 x1 or SATA 6Gbps x1, USB 2.0), full length
NOTE: the Z1 G2 ships with an Intel WLAN/BT card installed in slot 1.
Supported Drive
Interfaces
Integrated Serial ATA interfaces:
2 x 6Gb/s SATA, 1 x 6Gb/s SATA for ODD
2 x mSATA/miniPCIe slots
NOTE: the Z1 supports a maximum of two SATA SFF/SSD
drives only. RAID 0 and 1 supported. (Factory integrated RAID
is Microsoft Windows only).
NOTE: the Z1 G2 ships with an Intel WLAN/BT card installed in
slot 1.
NOTE: Requires identical hard drives (speeds, capacity,
interface)
Intel HD Graphics P4600 (on Intel Xeon E3-12x5v3
processors)
Intel HD Graphics 4600 (on Core i5-4570 processor)
Intel HD Graphics 4400 (on Core i3-4130 processor)
Unified Memory Architecture (UMA)- A region of system
memory is reserved and dedicated to the graphics display.
DirectX 11.1 compliant and OpenGL 4.0.
Integrated Graphics can support up to 3 displays: embedded
display, external display via Rear IO and external display via
optional add-in TBT module.
Integrated Ethernet PHY Connection I217LM. Management
capabilities: WOL, PXE 2.1 and AMT 9

System Technical Specifications
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Side (not Front):
1 USB 3.0, 1 USB 3.0 Charging Data Port
1 USB 2.0 Type A, 2 USB 2.0 across one 9-pin header (9-pin
header is not available when the touch display option is
selected)
Intel HD / IDT 92HD68 codec
Front Control
Panel/Speaker Header
CMOS Battery Holder Lithium
Integrated Trusted
Platform Module
Integrated TPM 1.2.
TPM module disabled where restricted by law.
Power Switch, Power LED
& Hard Drive LED Header
Yes
Clear Password Jumper
400W 90% Efficient, Custom PSU
(Wide Ranging, Active PFC)
Operating Line Frequency Range
Heat Dissipation
(Configuration and software
dependent)
Typical: 570 btu/hr (144 kg-cal/hr)
Maximum: 1365 btu/hr (344 kg-cal/hr)
(2) 40x20 mm variable speed
ENERGY STAR Qualified
(Configuration dependent)
The Z1 400W power supply efficiency report can be found at this link:
http://www.plugloadsolutions.com/psu_reports/HEWLETT%20PACKARD_650503-
001_ECOS%202720.1_400W_Report.pdf
FEMP Standby Power Compliant
@115V
ErP LOT6 Compliant @ 230V
(<0.5 W in S5 - Power Off)
CECP Compliant @ 220V
(<4W in S3 - Suspend to RAM)
Power Consumption in sleep mode

System Technical Specifications
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(as defined by ENERGY STAR) Suspend to RAM (S3) (Instantly
Available PC)
Surge Tolerant Full Ranging Power
Supply
(withstands power surges up to
2000V)
Processor Info
Memory Info
Graphics Info
Disks/Optical/Floppy
Power Supply
Other
1xIntel Core i3-4130
HP 8GB (2x4GB) DDR3 1866 ECC RAM
1xNVIDIA K610M Graphics
1x500GB SATA/1xDVD-ROM SATA
400W 90% Custom PSU
-
Energy Consumption
(Watts)
Heat Dissipation**
(Btu/hr)
Processor Info
Memory Info
Graphics Info
Disks/Optical/Floppy
Power Supply
Other
1xIntel Xeon E3-1280v3
HP 8GB (2x4GB) DDR3 1866 ECC RAM
1xNVIDIA K3100M Graphics
1x1TB SATA/1xDVD+-RW SATA
400W 90% Custom PSU
-
Energy Consumption
(Watts)

System Technical Specifications
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Processor Info
Memory Info
Graphics Info
Disks/Optical/Floppy
Power Supply
Other
1xIntel Xeon E5-1280v3
HP 16GB (4x4GB) DDR3 1866 ECC RAM
1xNVIDIA K4100M
2x1TB SATA 10K SFF/1xDVD+-RW SATA
400W 90% Custom PSU
-
Energy Consumption
(Watts)
Heat Dissipation**
(Btu/hr)
Declared Noise Emissions (Entry-level and High-end configurations)
System Configuration
(Entry level)
Intel Core i3-4130 2-core 3.4 GHz
1 x 2TB 7200 RPM SATA / Slim SuperMulti DVDRW SATA
Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Desktop Sound Pressure (LpAm,
decibels)
Hard drive Operating
(random reads)
DVD-ROM Operating
(sequential reads)
System Configuration
(Entry level)
Intel i3-4130 2-core 3.4 GHz

System Technical Specifications
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2 x 480 GB SSD SATA / Slim SuperMulti DVDRW SATA
Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Desktop Sound Pressure (LpAm,
decibels)
Hard drive Operating
(random reads)
DVD-ROM Operating
(sequential reads)
System Configuration
(High-end)
Intel Xeon E3-1280 V3 4-core 3.6 GHz
2 x 500 GB 10K RPM SATA / Slim SuperMulti DVDRW SATA
Declared Noise Emissions
(in accordance with ISO
7779 and ISO 9296)
Desktop Sound Pressure (LpAm,
decibels)
Hard drive Operating
(random reads)
DVD-ROM Operating
(sequential reads)
Environmental
Requirements
Operating: 40° to 95° F (5° to 35° C)
Non-operating: -40° to 140° F (-40° to 60° C)
Operating: 8% to 85% RH, non-condensing
Non-operating: 8% to 90% RH, non-condensing
Operating: 10,000 feet (3,000 m)
Non-operating: 30,000 feet (9,100 m)
Shock
Operating: ½-sine: 40g, 2-3ms (~62 cm/sec)
Non-operating:
½-sine: 160 cm/s, 2-3ms (~105g)
square: 422 cm/s, 20g
Vibration
Operating random: 0.5g (rms), 5-300 Hz, up to 0.0025 g²/Hz
Non-operating random: 2.0g (rms), 5-500 Hz, up to 0.0150 g²/Hz
Values represent individual shock events and do not indicate repetitive
shock events. Values do not indicate continuous vibration.
Above 5,000 ft (1524 m) altitude, maximum operating temperature is derated by 1.8° F (1° C) per 1,000 ft (305 m) elevation increase.
Physical Security and Serviceability

System Technical Specifications
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Includes system board and memory information
MXM graphics assembly is tool-less.
MiniPCIe cards are screw-in.
Tool-less, except for the processor heatsink.
On tool-free internal chassis mechanisms
Color-coordinated Cables
and Connectors
Screw-In for motherboard, Rear IO and Side IO boards.
Over-Temp Warning on
Screen
Restores the computer to its original factory shipping operating system. Orderable with the
workstation, or available from Support.
Dual Function Side Power
Switch
Power on/off
Causes a fail-safe power off when held for 4 seconds
Yes, Kensington Cable Lock (optional): Locks side cover and secures chassis from theft
3mm x 7mm slot at rear of system
Solenoid Lock and Hood
Sensor
No Solenoid Lock
Hood Sensor - The Sensor Kit detects when the access panel has been opened.
Serial, Parallel, USB,
Audio, Network,
Enable/Disable Port
Control
Enables or disables USB, audio, and network ports
Yes, prevents an unauthorized person from booting up the workstation
Yes, prevents an unauthorized person from changing the workstation configuration
3.3V Aux Power LED on
System PCA
NIC LEDs (integrated)
(Green & Amber)
A T-15 Torx or flat blade screwdriver is needed to remove the CPU heatsink before the CPU can be
removed. CPU removal is tool-less
Power Supply Diagnostic
LED
Blue (normal), red (fault)
Side Hard Drive Activity
LED
Present on an Optical Device
System/Emergency ROM
Flash Recovery
Recovers corrupted system BIOS.
Air cooled forced convection
Two 40 mm x 40 mm x 20 mm 4-wire PWM (not serviceable separately from the power supply)

System Technical Specifications
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One 110 mm blower with MXM graphics assembly
HP Advanced System
Diagnostics Offline
Edition
HP Vision Diagnostics utility must be booted from USB or CD, and enables you to perform testing and to
view critical computer hardware and software configuration information from various sources.
Advanced Configuration and Power Management Interface (ACPI).
Allows the system to wake from a low power mode.
Controls system power consumption, making it possible to place individual cards and
peripherals in a low-power or powered-off state without affecting other elements of the
system
Trusted Platform Module
Chip
Integrated Chassis
Handles
One on top-rear of system
Diagnostic Power Switch
LED on board
Standard BIOS 32-bit Service Directory Proposal v0.4
ATAPI Removable Media Device BIOS Specification Version 1.0.
BIOS Boot Specification v1.01.
WMI is Microsoft's implementation of Web-Based Enterprise Management (WBEM) for Windows. WMI is
fully compliant with the Distributed Management Task Force (DMTF) Common Information Model (CIM)
and WBEM specifications.
Provides more control over how and from what devices the workstation will boot.
Users can define a specific date and time for the system to power on.
ROM Based Computer
Setup Utility (F10)
Review and customize system configuration settings controlled by the BIOS.
System/Emergency ROM
Flash Recovery with
Video
Recovers system BIOS in corrupted Flash ROM.
Saves BIOS settings to USB flash device in human readable file. Repset.exe utility can then replicate
these settings on machines being deployed without entering Computer Configuration Utility (F10
Setup).
System Management BIOS 2.7.1, for system management information.
Disables the ability to boot from removable media on supported devices.
Alerts management console if memory is removed or changed.

System Technical Specifications
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Monitors the temperature state within the chassis. Three modes:
NORMAL - normal temperature ranges.
ALERTED - excessive temperatures are detected. Raises a flag so action can be taken to avoid
shutdown or provide for a smoother system shutdown.
SHUTDOWN - excessive temperatures are encountered. Automatically shuts down the
computer without warning before hardware component damage occurs.
Provides secure, fail-safe ROM image management from a central network console.
ACPI (Advanced
Configuration and Power
Management Interface)
Allows the system to enter and resume from low power modes (sleep states).
Enables an operating system to control system power consumption based on the dynamic workload.
Makes it possible to place individual cards and peripherals in a low-power or powered-off state without
affecting other elements of the system.
Supports ACPI 4.0 for full compatibility with 64-bit operating systems.
A user-defined string stored in non-volatile memory that is displayed in the BIOS splash screen.
Remote Wakeup/
Remote Shutdown
System administrators can power on, restart, and power off a client computer from a remote location.
Instantly Available PC
(Suspend to RAM - ACPI
sleep state S3)
Allows for very low power consumption with quick resume time.
Remote System
Installation via F12 (PXE
2.1) (Remote Boot from
Server)
Allows a new or existing system to boot over the network and download software, including the
operating system.
Reports the system BIOS revision level in Computer Configuration Utility (F10 Setup). Version is
available through an industry standard interface (SMBIOS) so that management SW applications can
use and report this information.
System board revision
level
Allows management SW to read revision level of the system board.
Revision level is digitally encoded into the HW and cannot be modified.
Start-up Diagnostics
(Power-on Self-Test)
Assesses system health at boot time with selectable levels of testing.
Auto Setup when new
hardware installed
System automatically detects addition of new hardware.
The system can be booted without a keyboard.
Common BIOS image supports System Configuration Utility (F10 Setup) menus in 12 languages with
local keyboard mappings.
Enables the user or IT administrator to set a unique tag string in non-volatile memory.
Allows I/O slot parameters (option ROM, enable/disable, bus latency) to be configured individually.
Control parameters are set according to detected hardware configuration for optimal acoustics.
(Pre-video) critical errors are reported via beeps and blinks on the power LED.
Intel® Active
Management Technology
(AMT)
AMT 7.0; Allows workstation status to be monitored on a remote console
Digitally and
Cryptographically Signed
BIOS
Helps to prevent the installation of unauthorized versions of a BIOS (a rogue BIOS) from a virus,
malware, or other code that could lead to compromised system security, data access, physical service,
or even system board replacement.
Master Boot Record
Protection
A feature in the HP BIOS that prevents changes and/or infections to the Master Boot Record. Useful in
protecting from viruses
Boot Block Emergency
Recovery Mode (BIOS
The HP BIOS offers a write-protected boot block ROM that provides recovery from a failed flashing of
the computer BIOS. This special recovery mode prevents the system from becoming unusable or

System Technical Specifications
c04111346 — DA – 14798 Worldwide — Version 8 — April 1, 2015
"bricked" when a BIOS update is interrupted.
Industry Standard
Specification Support
Revision Supported by the BIOS
UEFI Specification
Revision
Advanced Configuration and Power Management Interface, Version 4.0
AT Attachment 6 with Packet Interface (ATA/ATAPI-6), Revision 3b
"El Torito" Bootable CD-ROM Format Specification Version 1.0
- Enhanced Disk Drive Specification Version 1.1
- BIOS Enhanced Disk Drive Specification Version 3.0
Enhanced Host Controller Interface for Universal Serial Bus, Revision 1.0
- PCI Express Mini Card Electromechanical Specification Revision 1.2
- PCI Express Base Specification, Revision 2.0
- PCI Express Base Specification, Revision 3.0
- MXM Graphics Module Mobile PCI Express Module Electromechanical
Specification Version 3.0, Revision 3.1
POST Memory Manager Specification, Version 1.01
- Serial ATA Specification, Revision 1.0a
- Serial ATA II: Extensions to Serial ATA 1.0, Revision 2.6
- Serial ATA II Cables and Connectors Volume 2 Gold
- SATA-IO SATA Revision 3.0 Specification
PC SDRAM Serial Presence Detect (SPD) Specification, Revision 1.2B
Trusted Computing Group TPM Specification Version 1.2
- Universal Serial Bus Revision 1.1 Specifiation
- Universal Serial Bus Revision 2.0 Specification
- Universal Serial Bus Revision 3.0 Specification
Social and Environmental Responsibility
Eco-Label Certifications
& Declarations
This product has received or is in the process of being certified to the following approvals and may be
labeled with one or more of these marks:
ENERGY STAR® (energy-saving features available on selected configurations-Windows only)
US Federal Energy Management Program (FEMP)
IT ECO declaration
The battery in this product complies with EU Directive 2006/66/EC
Battery size: CR2032 (coin cell)
Battery type: Lithium Metal
The battery in this product does not contain:
Mercury greater than 5ppm by weight
Cadmium greater than 10ppm by weight
Lead greater than 40ppm by weight
Restricted Material Usage
This product meets the material restrictions specified in HP's General Specification for the
Environment. http://www.hp.com/hpinfo/globalcitizenship/environment/pdf/gse.pdf

System Technical Specifications
c04111346 — DA – 14798 Worldwide — Version 8 — April 1, 2015
Hewlett-Packard is committed to compliance with all applicable environmental laws and regulations,
including the European Union Restriction of Hazardous Substances (RoHS) Directive. HP's goal is to
exceed compliance obligations by meeting the requirements of the RoHS Directive on a worldwide
basis.
This product is low halogen except for power cords, cables and peripherals. Service parts obtained after
purchase may not be Low Halogen.
End-of-Life Management
and Recycling
Hewlett-Packard offers end-of-life HP product return and recycling programs in many geographic
areas. To recycle your product, please go to: http://www.hp.com/recycle or contact your nearest HP
sales office. Products returned to HP will be recycled, recovered or disposed of in a responsible manner.
This product is greater than 90% recyclable by weight when properly disposed of at end of life.
Hewlett-Packard
Corporate Environmental
Information
For more information about HP's commitment to the environment:
Global Citizenship Report http://www.hp.com/hpinfo/globalcitizenship/gcreport/index.html
Eco-label certifications
http://www.hp.com/hpinfo/globalcitizenship/environment/productdesign/ecolabels.html
ISO 14001 certificates:
http://www.hp.com/hpinfo/globalcitizenship/environment/operations/envmanagement.html
This HP product is designed to comply with the Waste Electrical and Electronic Equipment
(WEEE) Directive – 2002/96/EC.
Plastic parts weighing over 25 grams used in the product are marked per ISO 11469 and
ISO1043.
This product is >90% recycle-able when properly disposed of at end of life.
EPEAT Gold - ENERGY STAR qualified configurations of this product are in compliance with the IEEE
1680 (EPEAT) standard at the Gold level where HP registers workstation products. See
http://ww2.epeat.net/CompanyDetail.aspx?CompanyID=24 for registration status in your country.
HP Workstation product packaging meets the HP General Specification for the Environment at
http://www.hp.com/hpinfo/globalcitizenship/society/gen_specifications.html
Does not contain restricted substances listed in HP Standard 011-1 General Specification for
the Environment
Does not contain ozone-depleting substances (ODS)
Does not contain heavy metals (lead, mercury, cadmium or hexavalent chromium) in excess of
100 ppm sum total for all heavy metals listed
Maximizes the use of post-consumer recycled content materials in packaging materials
All packaging material is recyclable
All packaging material is designed for ease of disassembly
Reduced size and weight of packages to improve transportation fuel efficiency
Plastic packaging materials are marked according to ISO 11469 and DIN 6120 standards
formattin
Cushions and plastic bags made of low density polyethylene (LDPE).
Outer carton, accessories carton, and insert made of corrugated paper board.
Industry Standard
Specifications
This product meets the following industry standard specifications for manageability functionality:
DASH 1.1 required functionalities via integrated Intel LAN

System Technical Specifications
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Intel Active Management
Technology (AMT)
Intel Active Management Technology (Intel® AMT) 9.0
An advanced set of remote management features and functionality which provides network
administrators the latest and most effective tools to remotely discover, heal, and protect networked
client systems regardless of the system's health or power state. AMT 9.0 includes the following
advanced management functions:
Power Management (on, off, reset, graceful shutdown, sleep and hibernate)
Hardware Inventory (includes BIOS and firmware revisions)
Hardware Alerting
Agent Presence
System Defense Filters
Serial Over LAN (SOL)
IDE Redirect
Remote Configuration
TLS-PSK Setup and Configuration
TLS-PKI Setup and Configuration
Cisco NAC/SDN Support
ME Wake-on-LAN
DASH 1.1 compliance
IPv6 Support
Fast Call for Help - a client inside or outside the firewall may initiate a call for help via BIOS
screen, periodic connections, or alert triggered connection
Remote Scheduled Maintenance - pre-schedule when the PC connects to the IT or service
provider console for maintenance. Remote PCs can get required patches, be inventoried, etc by
connecting to their IT console or Service Provider when it's convenient
Remote Alerts - automatically alert IT or service provider if issues arise
Access Monitor - Provides oversight into Intel® AMT actions to support security requirements
PC Alarm Clock
Microsoft NAP Support
Host Base set-up and configuration
Management Engine (ME) firmware roll back
Enhanced KVM resolution
KVM Remote Control
Local Time Sync to UTC
Remote Memory Dump Command - Creates memory dump for debug
Wireless Management in Sleep States
Desktop Wireless Manageability
The HP Z1 G2 Workstation supports Intel vPro technology when configured with a processor branded
"featuring Intel vPro Technology"
Remote Manageability
Software Solutions
The HP Z1 Workstation is supported on the following remote manageability software consoles:
LANDesk Management Suite (PSG recommended solution)
Microsoft System Center Configuration Manager
HP Client Automation Enterprise
For questions or support for manageability needs, please visit http://www.hp.com/go/easydeploy
For questions or support for SSM, please visit: http://www.hp.com/go/ssm
Service, Support, and
Warranty
On-site Warranty and Service (Note 1): One, Three, Four & Five -years (options available), limited
warranty and service offering delivers on-site, next business-day (Note 2) service for parts and labor

System Technical Specifications
c04111346 — DA – 14798 Worldwide — Version 8 — April 1, 2015
and includes free telephone support (Note 3) 8am - 5pm. Global coverage (Note 2) ensures that any
product purchased in one country and transferred to another, non-restricted country will remain fully
covered under the original warranty and service offering.
NOTE 1: Terms and conditions may vary by country. Certain restrictions and exclusions apply.
NOTE 2: On-site service may be provided pursuant to a service contract between HP and an authorized
HP third-party provider, and is not available in certain countries. Global service response times are
based on commercially reasonable best effort and may vary by country.
NOTE 3: Technical telephone support applies only to HP-configured, HP and HP-qualified, third-party
hardware and software. Toll-free calling and 24x7 support service may not be available in some
countries.
HP Care Pack Services extend service contracts beyond the standard warranties. Service starts from
date of hardware purchase. To choose the right level of service for your HP product, use the HP Care
Pack Services Lookup Tool at http://www.hp.com/go/lookuptool. Additional HP Care Pack Services
information by product is available at http://www.hp.com/hps/carepack. Service levels and response
times for HP Care Packs may vary depending on your geographic location.
Product Change
Notification
Program to proactively communicate Product Change Notifications (PCNs) and Customer
Advisories by email to customers, based on a user-defined profile.
PCNs provide advance notification of hardware and software changes to be implemented in
the factory providing time to plan for transition.
Customer Advisories provide concise, effective problem resolution, greatly reducing the need
to call technical support.

Technical Specifications - Processors
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Intel® Xeon® processor E3-1280v3, Quad-Core, 8 MB cache, 3.6 GHz, up to 4.0 GHz with Intel Turbo
Boost Technology
Intel® Xeon® processor E3-1246v3, Quad-Core, 8 MB cache, 3.5 GHz, up to 3.9 GHz with Intel Turbo
Boost Technology
Intel® Xeon® processor E3-1245v3, Quad-Core, 8 MB cache, 3.4 GHz, up to 3.8 GHz with Intel Turbo
Boost Technology
Intel® Xeon® processor E3-1226v3, Quad-Core, 8 MB cache, 3.3 GHz, up to 3.7 GHz with Intel Turbo
Boost Technology
Intel® Xeon® processor E3-1225v3, Quad-Core, 8 MB cache, 3.2 GHz, up to 3.6 GHz with Intel Turbo
Boost Technology
Intel® Core™ i7-4790 processor, Quad-Core, 8 MB cache, 3.6 GHz, up to 4.0 GHz with Intel Turbo Boost
Technology
Intel® Core™ i5-4590 processor, Quad-Core, 6 MB cache, 3.3 GHz, up to 3.7 GHz with Intel Turbo Boost
Technology
Intel® Core™ i5-4570 processor, Quad-Core, 6 MB cache, 3.2 GHz, up to 3.6 GHz with Intel Turbo Boost
Technology
Intel® Core™ i3-4150 processor, Dual-Core, 4 MB cache, 3.5 GHz
Intel® Core™ i3-4130 processor, Dual-Core, 4 MB cache, 3.4 GHz

Technical Specifications - Hard Drives
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SATA Hard Drives for HP
Workstations
500GB SATA 10K rpm SFF
HDD
Synchronous Transfer
Rate (Maximum)
Seek Time (typical reads,
includes controller
overhead, including
settling)
41° to 131° F (5° to 55° C)
Synchronous Transfer
Rate (Maximum)
Seek Time (typical reads,
includes controller
overhead, including
settling)
41° to 131° F (5° to 55° C)
500GB SATA 7200 rpm
6Gb/s 3.5" HDD
Serial ATA (6.0Gb/s), NCQ enabled
Synchronous Transfer
Rate (Maximum)
Seek Time (typical reads,
includes controller
overhead, including
settling)

Technical Specifications - Hard Drives
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41° to 131° F (5° to 55° C)
1TB SATA 7200 rpm
6Gb/s 3.5" HDD
Serial ATA (6.0Gb/s), NCQ enabled
Synchronous Transfer
Rate (Maximum)
Seek Time (typical reads,
includes controller
overhead, including
settling)
41° to 131° F (5° to 55° C)
2.0TB SATA 7200 rpm
6Gb/s 3.5" HDD
Serial ATA (6.0Gb/s), NCQ enabled
Synchronous Transfer
Rate (Maximum)
Seek Time (typical reads,
includes controller
overhead, including
settling)
41° to 131° F (5° to 55° C)
3.0TB SATA 7200 rpm
6Gb/s 3.5" HDD
Serial ATA (6.0Gb/s), NCQ enabled
Synchronous Transfer
Rate (Maximum)
Seek Time (typical reads,
includes controller
overhead, including
settling)

Technical Specifications - Hard Drives
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41° to 131° F (5° to 55° C)
SATA SSDs for HP
Workstations
Synchronous Transfer
Rate (Maximum)
Up to 500MB/s (Sequential Read)
32° to 158° F (0° to 70° C)
HP 256GB SATA 6Gb/s
SED SSD
Synchronous Transfer
Rate (Maximum)
Up to 500MB/s (Sequential Read)
32° to 158° F (0° to 70° C)
32° to 158° F (0° to 70° C)
Synchronous Transfer
Rate (Maximum)
Up to 500MB/s (Sequential Read)
32° to 158° F (0° to 70° C)
Synchronous Transfer
Rate (Maximum)
Up to 550MB/s (Sequential Read)
32° to 158° F (0° to 70° C)
Samsung Enterprise
240GB SATA SSD
Synchronous Transfer
Rate (Maximum)
Samsung Enterprise
480GB SATA SSD

Technical Specifications - Hard Drives
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Synchronous Transfer
Rate (Maximum)
Intel Pro 1500 180GB
SATA SSD
Synchronous Transfer
Rate (Maximum)
32° to 158° F (0° to 70° C)

Technical Specifications - Graphics
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Integrated Intel HD
Graphics (Z230/Z1G2)
Integrated in select Intel Xeon E3, Intel Core i7, and Intel Core i5
processors.
Check specific platform specifications for selections.
Unified Memory Architecture (UMA) frame buffer. Graphics memory is
shared with system memory. Size selectable between 64 MB to 512 MB via
BIOS setting. Default size is 64 MB. Additional memory is allocated for
graphics as needed using Intel's Dynamic Video Memory Technology (Intel
DVMT 5.0), to provide an optimal balance between graphics and system
memory use.
Check system platform specifications where Intel HD Graphics are
available.
Display Port: 2560 x 1600
DVI: 1920x1200
VGA: 2048x1536
NOTE: For DVI and VGA outputs, separate adapters may be required.
Available Graphics
Drivers
NVIDIA Quadro K610M
1GB Graphics
MXM v3.1 Type A (82mm x 70mm)
N15M-Q3, 954MHz core clock
192 CUDA cores
PCI Express Gen 3 x16 (part of MXM v3.1 connector)
1GB GDDR5
64 bit wide interface
2600MHz,
20.8 GB/s
One MXM v3.1 connector (285-pin)
2 x 3840x2160 @ 60Hz digital displays
In Z1 G2 application:
- Internal Display: 2560x1440
- External Display via DP connector: 2560x1600
- External Display via optional Thunderbolt module: Two 3840x2160
Each color component can be processed at up to 32-bit floating point
precision and displayed at up to 12-bit precision.
Advanced FXAA and TXAA antialiasing.
16K Texture and Render Processing.
MPEG-2 HD and WMV HD video playback (1920x1080p).
H.264 hardware decode acceleration.
Nvidia Scalable Geometry Engine.
Full IEEE 764-2008 32-bit
DirectX 11.1 Shader Model 5.0
OpenGL 4.3

Technical Specifications - Graphics
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Compute API support for NVIDIA CUDA C, CUDA C++, DirectCompute 5.0,
OpenCL, Java, Python and Fortran
Available Graphics
Drivers
Windows 7 64-bit
Windows 8.1 64-bit
SUSE Linux Enterprise Desktop 11 64-bit
Red Hat Enterprise Linux 6 Workstation 64-bit
See www.hp.com/go/support for HP supported NVIDIA graphics drivers
NVIDIA Quadro K2100M
2GB Graphics
MXM v3.1 Type A (82mm x 70mm)
N15P-Q3, 665MHz core clock
576 CUDA cores
PCI Express Gen 3 x16 (part of MXM v3.1 connector)
2GB GDDR5
128 bit wide interface
3000MHz,
48 GB/s
One MXM v3.1 connector (285-pin)
2 x 3840x2160 @ 60Hz digital displays
In Z1 G2 application:
- Internal Display: 2560x1440
- External Display via DP connector: 2560x1600
- External Display via optional Thunderbolt module: Two 3840x2160
Each color component can be processed at up to 32-bit floating point
precision and displayed at up to 12-bit precision.
Advanced FXAA and TXAA antialiasing.
16K Texture and Render Processing.
MPEG-2 HD and WMV HD video playback (1920x1080p).
H.264 hardware decode acceleration.
Nvidia Scalable Geometry Engine.
AES-128 CTR/CBC/ECB decryption modes supported.
Nvidia 3D Vision Pro
Full IEEE 764-2008 32-bit
DirectX 11.1 Shader Model 5.0
OpenGL 4.3
Compute API support for NVIDIA CUDA C, CUDA C++, DirectCompute 5.0,
OpenCL, Java, Python and Fortran
Available Graphics
Drivers
Windows 7 64-bit
Windows 8.1 64-bit
SUSE Linux Enterprise Desktop 11 64-bit
Red Hat Enterprise Linux 6 Workstation 64-bit
See www.hp.com/go/support for HP supported NVIDIA graphics drivers
NVIDIA Quadro K3100M
4GB Graphics
MXM v3.1 Type B (82mm x 105mm)
N15E-Q1, 705MHz core clock
768 CUDA cores
PCI Express Gen 3 x16 (part of MXM v3.1 connector)
4GB GDDR5
256 bit wide interface

Technical Specifications - Graphics
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One MXM v3.1 connector (285-pin)
2 x 3840x2160 @ 60Hz digital displays
In Z1 G2 application:
- Internal Display: 2560x1440
- External Display via DP connector: 2560x1600
- External Display via optional Thunderbolt module: Two 3840x2160
Each color component can be processed at up to 32-bit floating point
precision and displayed at up to 12-bit precision.
Advanced FXAA and TXAA antialiasing.
16K Texture and Render Processing.
MPEG-2 HD and WMV HD video playback (1920x1080p).
H.264 hardware decode acceleration.
Nvidia Scalable Geometry Engine.
AES-128 CTR/CBC/ECB decryption modes supported.
Nvidia 3D Vision Pro
Full IEEE 764-2008 32-bit
DirectX 11.1 Shader Model 5.0
OpenGL 4.3
Compute API support for NVIDIA CUDA C, CUDA C++, DirectCompute 5.0,
OpenCL, Java, Python and Fortran
Available Graphics
Drivers
Windows 7 64-bit
Windows 8.1 64-bit
SUSE Linux Enterprise Desktop 11 64-bit
Red Hat Enterprise Linux 6 Workstation 64-bit
See www.hp.com/go/support for HP supported NVIDIA graphics drivers
NVIDIA Quadro K4100M
4GB Graphics
MXM v3.1 Type B (82mm x 105mm)
N15E-Q3, 705MHz core clock
1152 CUDA cores
PCI Express Gen 3 x16 (part of MXM v3.1 connector)
4GB GDDR5
256 bit wide interface
3200MHz,
102.4 GB/s
One MXM v3.1 connector (285-pin)
Maximum number of active displays: 4
In Z1 G2 application:
- Internal Display: 2560x1440
- External Display via DP connector: 2560x1600
- External Display via optional Thunderbolt module: Two 3840x2160
Each color component can be processed at up to 32-bit floating point
precision and displayed at up to 12-bit precision.
Advanced FXAA and TXAA antialiasing.
16K Texture and Render Processing.
MPEG-2 HD and WMV HD video playback (1920x1080p).
H.264 hardware decode acceleration.

Technical Specifications - Graphics
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Nvidia Scalable Geometry Engine.
AES-128 CTR/CBC/ECB decryption modes supported.
Nvidia 3D Vision Pro
Full IEEE 764-2008 32-bit
DirectX 11.1 Shader Model 5.0
OpenGL 4.3
Compute API support for NVIDIA CUDA C, CUDA C++, DirectCompute 5.0,
OpenCL, Java, Python and Fortran
Available Graphics
Drivers
Windows 7 64-bit
Windows 8.1 64-bit
SUSE Linux Enterprise Desktop 11 64-bit
Red Hat Enterprise Linux 6 Workstation 64-bit
See www.hp.com/go/support for HP supported NVIDIA graphics drivers

Technical Specifications - Optical and Removable Storage
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Either horizontal or vertical
Single layer: Up to 4.7 GB
Double layer: Up to 8.5 GB
5 VDC ± 5%-100 mV ripple p-p
5 VDC - <800mA typical, < 1600 mA maximum
Operating Environmental
(all conditions noncondensing)
41° to 122° F (5° to 50° C)
Maximum Wet Bulb
Temperature
Operating Systems
Supported
Windows 8 32-bit and 64-bit, Windows 7 Professional 32-bit and 64-bit,
Windows Vista Business 64*, Windows Vista Business 32*, Windows Vista
Home Basic 32*, Windows 2000, Windows XP Professional or Windows XP
Home 32*.
Red Hat Enterprise Linux(RHEL) WS4**, 5, 6 Desktop/Workstation,
Removed reference to "Novell" because of acquisition and changed product
reference to "SUSE Linux Enterprise Desktop 10 & 11",
No driver is required for this device. Native support is provided by the
operating system.
HP Slim SuperMulti
DVDRW SATA Drive
Either horizontal or vertical
DVD-RAM
DVD+R
DVD+RW
DVD+R DL
DVD-R DL
DVD-R
DVD-RW
CD-R
CD-RW
8.5 GB DL or 4.7 GB standard
Access Times
Full Stroke DVD
Maximum Data Transfer
Rates
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
DVD-RAM Up to 8X
DVD+RW Up to 8X
DVD-RW Up to 8X

Technical Specifications - Optical and Removable Storage
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DVD+R DL Up to 8X
DVD-R DL Up to 8X
DVD-ROM Up to 8X
DVD-ROM DL Up to 8X
DVD+R Up to 8X
DVD-R Up to 8X
5 VDC ± 5%-100 mV ripple p-p
5 VDC -< 800 mA typical, <1600 mA maximum
Operating Environmental
(all conditions noncondensing)
41° to 122° F (5° to 50° C)
Maximum Wet Bulb
Temperature
Operating Systems
Supported
Windows 8 32-bit and 64-bit, Windows 7 Professional 32-bit and 64-bit,
Windows Vista Business 64*, Windows Vista Business 32*, Windows Vista
Home Basic 32*, Windows 2000, Windows XP Professional or Windows XP
Home 32*.
Red Hat Enterprise Linux(RHEL) WS4**, 5, 6 Desktop/Workstation
SUSE Linux Enterprise Desktop 10 & 11
No driver is required for this device. Native support is provided by the
operating system.
HP SATA SuperMulti DVD Writer drive, Cyberlink Power2Go Software,
Cyberlink PowerDVD Software, installation guide, and DVD+R media.
© Copyright 2013 Hewlett-Packard Development Company, L.P.
The only warranties for HP products and services are set forth in the
express warranty statements accompanying such products and services.
Nothing herein should be construed as constituting an additional warranty.
HP shall not be liable for technical or editorial errors or omissions contained
herein. The information contained herein is subject to change without
notice.
BD-ROM
BD-R
BD-RE
DVD-RAM
DVD+R
DVD+RW
DVD+R DL
DVD-R DL
DVD-R
DVD-RW
CD-R
CD-RW
8.5 GB DL or 4.7 GB standard
650MB CD-ROM (Read Only)
800/700/650MB CD-Recordable (Read & Write)

Technical Specifications - Optical and Removable Storage
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700/650MB CD-Rewritable (Read & Write)
700/650MB High Speed CD-Rewritable (Read &
Write)
700/650MB Ultra & Ultra+ Speed CD-Rewritable
(Read & Write)
50 GB DL or 25 GB standard
(Time to drive ready from tray loading)
BD-ROM (SL/DL) 25S / 28S
BD-R (SL/DL) 25S / 28S
BD-RE (SL/DL) 25S / 28S
DVD-ROM (SL/DL) 18S / 18S
DVD-R (SL/DL) 25S / 25S
DVD-RW 25S
DVD+R (SL/DL) 25S / 25S
DVD+RW 25S
DVD-RAM 45S
CD-ROM 15S
Maximum Data Transfer
Rates
CD-ROM, CD-R Up to 24X
CD-RW Up to 24X
DVD-RAM Up to 8X
DVD+RW Up to 8X
DVD-RW Up to 8X
DVD+R DL Up to 8X
DVD-R DL Up to 8X
DVD-ROM Up to 8X
DVD-ROM DL Up to 8X
DVD+R Up to 8X
DVD-R Up to 8X
BD-ROM Up to 6X
BD-ROM DL Up to 6X
BD-R Up to 6X
BD-R DL Up to 6X
BD-R Up to 6X
BD-RE SL/DL Up to 6X
BD-RE TL 4.8x
5 VDC ± 5%-100 mV ripple p-p
5 VDC -900 mA typical, 2000mA maximum
Operating Environmental
(all conditions noncondensing)
41° to 122° F (5° to 50° C)
Maximum Wet Bulb
Temperature
Operating Systems
Supported
Windows 8 32-bit and 64-bit, Windows 7 Professional 32-bit and 64-bit,
Windows Vista Business 64*, Windows Vista Business 32*, Windows Vista
Home Basic 32*, Windows 2000, Windows XP Professional or Windows XP
Home 32*.
Red Hat Enterprise Linux(RHEL) WS4, 5, 6 Desktop/Workstation,
SUSE Linux Enterprise Desktop 10 & 11

Technical Specifications - Optical and Removable Storage
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* No driver is required for this device. Native support is provided by the
operating system.
HP Blue Laser RW Drive, Cyberlink Power2Go Software, Cyberlink PowerDVD
Software, installation guide.
As Blu-Ray is a new format containing new technologies, certain disc, digital
connection, compatibility and/or performance issues may arise, and do not
constitute defects in the product. Flawless playback on all systems is not
guaranteed. In order for some Blu-Ray titles to play, they may require a DVI
or HDMI digital connection and your display may require HDCP support. HDDVD movies cannot be played on this workstation.

Technical Specifications - Controller Cards
c04111346 — DA – 14798 Worldwide — Version 8 — April 1, 2015
HP Thunderbolt 2-port
AiO Module
Supports up to 20 Gb/s (20,000 Mb/s)
Thunderbolt™ certified devices
Two (2) Thunderbolt™ 2 external 20-Pin output connectors (Side)
Genuine Windows 7 Professional 64-bit, Genuine Windows 8.1 64-bit, Intel
i5 series or higher processor, 128-MB RAM, 1-GB Hard Drive, available PCIe
slot.
50° to 131° F (10° to 55° C)
-22° to 140° F (-30° to 60° C)
Relative Humidity Operating
FCC Part 15B, cULus 60950, CE Mark EN55022B(1995)/EN55024-1998
STD, Taiwan BSMI CNS13438, Korea MIC
Operating Systems
Supported
Genuine Windows 7 Professional 64-bit, Genuine Windows 8.1 64-bit.
HP Thunderbolt™ 2 Module, user documentation and warranty card.
The HP Thunderbolt™ 2 Module has a one-year Limited Warranty or the
remainder of the warranty of the HP supported product in which it is
installed. Technical support is available seven days a week, 24 hours a day,
by phone, as well as online support forums. Certain restrictions and
exclusions apply.

Technical Specifications - Networking and Communications
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Integrated Intel I217LM
PCIe GbE Controller
Intel I217LM GbE platform LAN connect networking controller
3 KB Tx and 3KB Rx FIFO packet buffer memory
802.1as/1588, 802.1p, 802.1Q, 802.3, 802.3ab, 802.3az, 802.3i, 802.3u,
802.3z
PCIe-based interface for active state operation (S0 state) and SMBus for
host and management traffic (Sx low power state)
Requires 3.3V (integrated regulators for core Vdc)
Full-duplex; Half-duplex (not supported for the 1000BASE-T transceiver)
10BASE-T (half-duplex) 10 Mbps
10BASE-T (full-duplex) 20 Mbps
100BASE-TX (half-duplex) 100 Mbps
100BASE-TX (full-duplex) 200 Mbps
1000BASE-T (full-duplex) 2000 Mbps
vPro, WOL, auto MDI crossover, PXE, iSCSI Boot, Muti-port teaming, RSS,
ACPI, Advanced cable diagnostic, loopback modes,
AMT 9.0 support, Circuit Breaker, VLAN, Multicast Listener Discovery (MLD)

Summary of Changes
c04111346 — DA – 14798 Worldwide — Version 8 — April 1, 2015
1 USB 3.0, 1 USB 3.0 Charging Data Port, and note from Side I/O’s
Overview
Operative Systems support from Overview and Supported
Components sections
Memory nomenclature in Overview, Supported components, and
System technical Specifications.

c04111346 — DA – 14798 Worldwide — Version 8 — April 1, 2015
© 2014 Hewlett-Packard Development Company, L.P. The information contained herein is subject to change without notice. The
only warranties for HP products and services are set forth in the express warranty statements accompanying such products and
services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial
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