HP rp5400 User Manual

Site Preparation Guide

rp5400 Family of Servers

First Edition

Manufacturing Part Number :

Sept 2002

USA

© Copyright 2002

Legal Notices

The information in this document is subject to change without notice.

Hewlett-Packard makes no warranty of any kind with regard to this manual, including, but not limited to, the
implied warranties of merchantability and fitness for a particular purpose. Hewlett-Packard shall not be held

liable for errors contained herein or direct, indirect, special, incidental or consequential damages in
connection with the furnishing, performance, or use of this material.

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Software Restricted Rights clause at FAR 52.227-19 for other agencies.

HEWLETT-PACKARD COMPANY 3000 Hanover Street Palo Alto, California 94304 U.S.A.

Copyright Notices. ©copyright 1983-2002 Hewlett-Packard Company, all rights reserved.

Reproduction, adaptation, or translation of this document without prior written permission is prohibited,
except as allowed under the copyright laws.

ii

1. General Site Preparation Guidelines

Electrical Factors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Computer Room Safety. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Electrical Load Requirements (Circuit Breaker Sizing). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Power Quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Distribution Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Grounding Systems. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

System Installation Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

Environmental Elements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Computer Room Preparation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Cooling Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Humidity Level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Dust and Pollution Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Metallic Particulate Contamination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Electrostatic Discharge (ESD) Prevention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Acoustics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Facility Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Floor Loading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

Windows . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Space Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Delivery Space Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Operational Space Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Floor Plan Grid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Typical Installation Schedule . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Site Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Delivery Survey . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Contents

Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

iii

Contents

iv

Tables

Table 1-1. Effect of Humidity on ESD Charge Levels . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Table 1-2. Floor Loading Term Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Table 1-3. Typical Raised Floor Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14

Table 1-4. Customer and Hewlett-Packard Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 1-5. Site Inspection Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

v

Tables

vi

Figures

Figure 1-1. Raised Floor Metal Strip Ground System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

Figure 1-2. Delivery Survey (Part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Figure 1-3. Delivery Survey (Part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

vii

Figures

viii

1 General Site Preparation Guidelines

The following information provides general principles and practices to consider before the installation or
operation of an hp server.

Chapter 1

1

General Site Preparation Guidelines

Electrical Factors

Electrical Factors

Proper design and installation of a power distribution system for an hp server requires specialized skills.
Those responsible for this task must have a thorough knowledge and understanding of appropriate electrical
codes and the limitations of the power systems for computer and data processing equipment.

In general, a well-designed power distribution system exceeds the requirements of most electrical codes. A
good design, when coupled with proper installation practices, produces the most trouble-free operation.

A detailed discussion of power distribution system design and installation is beyond the scope of this
information. However, electrical factors relating to power distribution system design and installation must be
considered during the site preparation process.

The electrical factors discussed in this section are:

• Computer room safety

• Power Consumption

• Electrical load requirements (circuit breaker sizing)

• Power quality

• Distribution hardware

• System installation guidelines

Computer Room Safety

Inside the computer room, fire protection and adequate lighting (for equipment servicing) are important
safety considerations. Federal and local safety codes govern computer installations.

Fire Protection

The National Fire Protection Association’s Standard for the Protection of Electronic Computer Data
Processing Equipment, NFPA 75, contains information on safety monitoring equipment for computer rooms.

Most computer room installations are equipped with the following fire protection devices:

• Smoke detectors

• Fire and temperature alarms

• Fire extinguishing system

Additional safety devices are:

• Circuit breakers

• An emergency power cutoff switch

• Devices specific to the geographic location i.e., earthquake protection

Lighting Requirements for Equipment Servicing

Adequate lighting and utility outlets in a computer room reduce the possibility of accidents during equipment
servicing. Safer servicing is also more efficient and, therefore, less costly.

For example, adequate lighting reduces the chances of connector damage when cables are installed or
removed.

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Electrical Factors

The minimum recommended illumination level is 70 foot-candles (756 lumens per square meter) when the
light level is measured at 30 inches (76.2 cm) above the floor.

Power Consumption

When determining power requirements, you must consider any peripheral equipment that will be installed
during initial installation or as a later update. Refer to the applicable documentation for such devices to
determine the power required to support these devices.

Electrical Load Requirements (Circuit Breaker Sizing)

NOTE Local authority has jurisdiction [LAHJ] and should make the final decision regarding

adherence to country- specific electrical codes and guidelines.

It is good practice to derate power distribution systems for one or more of the following reasons:

• To avoid nuisance tripping from load shifts or power transients, circuit protection devices should never be
run above 80% of their root-mean-square (RMS) current ratings.

• Safety agencies derate most power connectors to 80% of their RMS current ratings.

Power Quality

The hp server is designed to operate over a wide range of voltages and frequencies. The server is tested and
shown to comply with EMC Specification EN50082. However, damage can occur if these ranges are exceeded.
Severe electrical disturbances can exceed the design specifications of the equipment.

Sources of Voltage Fluctuations

Voltage fluctuations, sometimes called glitches, affect the quality of electrical power. Common sources of these
disturbances are:

• Fluctuations occurring within the facility’s distribution system

• Utility service low-voltage conditions (such as sags or brownouts)

• Wide and rapid variations in input voltage levels

• Wide and rapid variations in input power frequency

• Electrical storms

• Large inductive sources (such as motors and welders)

• Faults in the distribution system wiring (such as loose connections)

• Microwave, radar, radio, or cell phone transmissions

Chapter 1

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General Site Preparation Guidelines

Electrical Factors

Power System Protection

The hp server can be protected from the sources of many of these electrical disturbances by using:

• A dedicated power distribution system

• Power conditioning equipment

• Over- and under-voltage detection and protection circuits

• Screening to cancel out the effects of undesirable transmissions

• Lightning arresters on power cables to protect equipment against electrical storms

Precautions have been taken during power distribution system design to provide immunity to power outages
of less than one cycle. However, testing cannot conclusively rule out loss of service. Therefore, adherence to
the following guidelines provides the best possible performance of power distribution systems for hp computer
equipment:

• Dedicated power source—Isolates an hp server power distribution system from other circuits in the
facility.

• Missing-phase and low-voltage detectors—Shuts equipment down automatically when a severe power
disruption occurs. For peripheral equipment, these devices are recommended but optional.

• Online uninterruptible power supply (UPS)—Keeps input voltage to devices constant and should be
considered if outages of one-half cycle or more are common. Refer to qualified contractors or consultants
for each situation.

Distribution Hardware

This section describes wire selection and the types of raceways (electrical conduits) used in the distribution
system.

Wire Selection

Use copper conductors instead of aluminum, as aluminum’s coefficient of expansion differs significantly from
that of other metals used in power hardware. Because of this difference, aluminum conductors can cause
connector hardware to work loose, overheat, and fail.

Raceway Systems (electrical conduits) [LAHJ]

Raceways (electrical conduits) form part of the protective ground path for personnel and equipment.
Raceways protect the wiring from accidental damage and also provide a heatsink for the wires.

Any of the following types may be used:

• Electrical metallic tubing (EMT) thin-wall tubing

• Rigid (metal) conduit

• Liquidtight with RFI shield grounded (most commonly used under raised floors)

Building Distribution

All building feeders and branch circuitry should be in rigid metallic conduit with proper connectors (to
provide ground continuity) Conduit that is exposed and subject to damage should be constructed of rigid
galvanized steel.

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Electrical Factors

Grounding Systems

An hp server requires two methods of grounding:

• Power distribution safety grounding

• High frequency intercabinet grounding

Power Distribution Safety Grounding [LAHJ]

The power distribution safety grounding system consists of connecting various points in the power
distribution system to earth ground using green (green/yellow) wire ground conductors. Having these ground
connections tied to metal chassis parts that may be touched by computer room personnel protects them
against shock hazard from current leakage and fault conditions.

Power distribution systems consist of several parts. Hewlett-Packard recommends that these parts be solidly
interconnected to provide an equipotential ground to all points.

Main Building Electrical Ground The main electrical service entrance equipment should have an earth
ground connection, as required by applicable codes. Connections such as a grounding rod, building steel, or a
conductive type cold water service pipe provide an earth ground.

Electrical Conduit Ground All electrical conduits should be made of rigid metallic conduit that is securely
connected together or bonded to panels and electrical boxes, so as to provide a continuous grounding system.

Power Panel Ground Each power panel should be grounded to the electrical service entrance with green
(green/yellow) wire ground conductors. The green (green/yellow) wire ground conductors should be sized per
applicable codes (based on circuit over current device ratings).

NOTE The green wire ground conductor mentioned above may be a black wire marked with green

tape. [LAHJ]

Computer Safety Ground Ground all computer equipment with the green (green/yellow) wire included in
the branch circuitry. The green (green/yellow) wire ground conductors should be connected to the appropriate
power panel and should be sized per applicable codes (based on circuit over current device ratings).

Cabinet Performance Grounding (High Frequency Ground)

Signal interconnects between system cabinets require high frequency ground return paths. Connect all
cabinets to site ground.

NOTE In some cases power distribution system green (green/yellow) wire ground conductors are too

long and inductive to provide adequate high frequency ground return paths. Therefore, a
ground strap (customer-supplied) should be used for connecting the system cabinet to the site
grounding grid (customer-supplied). When connecting this ground, ensure that the raised floor
is properly grounded for high frequency.

Power panels located in close proximity to the computer equipment should also be connected to the site
grounding grid. Methods of providing a sufficiently high frequency ground grid are described in the next
sections.

Chapter 1

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General Site Preparation Guidelines

Electrical Factors

Raised Floor “High Frequency Noise” Grounding

If a raised floor system is used, install a complete signal grounding grid for maintaining equal potential over
a broad band of frequencies. The grounding grid should be connected to the equipment cabinet and electrical
service entrance ground at multiple connection points using a minimum #6 AWG (16mm2) wire ground
conductor. The following figure illustrates a metallic strip grounding system.

Hewlett-Packard recommends the following approaches:

• Excellent—Add a grounding grid to the subfloor. The grounding grid should be made of copper strips
mounted to the subfloor. The strips should be 0.032 in. (0.08 cm) thick and a minimum of 3.0 in. (8.0 cm)
wide.

Connect each pedestal to four strips using 1/4 in. (6.0 mm) bolts tightened to the manufacturer’s torque
recommendation.

• Better - A grounded #6 AWG minimum copper wire grid mechanically clamped to floor pedestals and
properly bonded to the building/site ground.

• Good—Use the raised floor structure as a ground grid. In this case, the floor must be designed as a ground
grid with bolted down stringers and corrosion resistive plating (to provide low resistance and attachment
points for connection to service entrance ground and hp computer equipment). The use of conductive floor
tiles with this style of grid further enhances ground performance.

Figure 1-1 Raised Floor Metal Strip Ground System

Floor panel

Ground wire

to power panel

Grounding grid element

Grounding clamp

Hex bolt

Band and pedestal Grounding braid

6

to computer equipment

60SP010A

11/30/99

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Electrical Factors

Equipment Grounding Implementation Details

Connect all Hewlett-Packard equipment cabinets to the site ground grid as follows:

Step 1. Attach one end of each ground strap to the applicable cabinet ground lug.

Step 2. Attach the other end to the nearest pedestal base (raised floor) or cable trough ground point

(nonraised floor).

Step 3. Check that the braid contact on each end of the ground strap consists of a terminal and connection

hardware (a 1/4-in. (6.0-mm) bolt, nuts, and washers).

Step 4. Check that the braid contact connection points are free of paint or other insulating material and

treated with a contact enhancement compound (similar to Burndy Penetrox).

System Installation Guidelines

This section contains information about installation practices. Some common pitfalls are highlighted. Both
power cable and data communications cable installations are discussed.

NOTE In domestic installations, the proper receptacles should be installed prior to the arrival of

Hewlett-Packard equipment. Refer to the appropriate installation guide for installation
procedures.

Wiring Connections

Expansion and contraction rates vary among different metals. Therefore, the integrity of an electrical
connection depends on the restraining force applied. Connections that are too tight compress or deform the
hardware and causes it to weaken. This usually leads to high impedance preventing circuit breakers from
tripping when needed or can contribute to a buildup of high frequency noise.

CAUTION Connections that are too loose or too tight can have a high impedance that cause serious

problems, such as erratic equipment operation. A high impedance connection overheats and
sometimes causes fire or high temperatures that can destroy hard-to-replace components such
as distribution panels or system bus bars.

Wiring connections must be properly torqued. Many equipment manufacturers specify the proper connection
torque values for their hardware.

Ground connections must only be made on a conductive, nonpainted surface. When equipment vibration is
present, lock washers must be used on all connections to prevent connection hardware from working loose.

Data Communications Cables

Power transformers create high-energy fields in the form of electromagnetic interference (EMI). Heavy foot
traffic can create electrostatic discharge (ESD) that can damage electronic components. Route data
communications cables away from these areas. Use shielded data communications cables that meet approved
industry standards to reduce the effects of external fields.

Chapter 1

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General Site Preparation Guidelines

Environmental Elements

Environmental Elements

The following environmental elements can affect an hp server installation:

• Computer room preparation

• Cooling requirements

• Humidity level

• Air conditioning ducts

• Dust and pollution control

• Electrostatic discharge (ESD) prevention

• Acoustics (noise reduction)

Computer Room Preparation

The following guidelines are recommended when preparing a computer room for an hp server:

• Locate the computer room away from the exterior walls of the building to avoid the heat gain from
windows and exterior wall surfaces.

• When exterior windows are unavoidable, use windows that are double or triple glazed and shaded to
prevent direct sunlight from entering the computer room.

• Maintain the computer room at a positive pressure relative to surrounding spaces.

• Use a vapor barrier installed around the entire computer room envelope to restrain moisture migration.

• Caulk and vapor seal all pipes and cables that penetrate the envelope.

• Use at least a 12-inch raised floor system for minimum favorable room air distribution system (underfloor
distribution).

• Ensure a minimum clearance of 12 inches between the top of the hp server cabinet and the ceiling to
allow for return air flow and ensure that all ceiling tiles are in place.

• Allow 18 inches (or local code minimum clearance) from the top of the hp server cabinet to the fire
sprinkler heads.

Cooling Requirements

Air conditioning equipment requirements and recommendations are described in the following sections.

Basic Air Conditioning Equipment Requirements

The cooling capacity of the installed air conditioning equipment for the computer room should be sufficient to
offset the computer equipment dissipation loads, as well as any space envelope heat gain. This equipment
should include:

• Air filtration

• Cooling or dehumidification

• Humidification

• Reheating

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Chapter 1

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Environmental Elements

• Air distribution

• System controls adequate to maintain the computer room within specified operating ranges.

Lighting and personnel must also be included. For example, a person dissipates about 450 BTUs per hour
while performing a typical computer room task.

At altitudes above 10,000 feet (3048 m), the lower air density reduces the cooling capability of air conditioning
systems. If your facility is located above this altitude, the recommended temperature ranges may need to be
modified. For each 1000 feet (305 m) increase in altitude above 10,000 feet (up to a maximum of 15,000 feet),
subtract 1.5° F (0.83° C) from the upper limit of the temperature range.

Air Conditioning System Guidelines

The following guidelines are recommended when designing an air conditioning system and selecting the
necessary equipment:

• The air conditioning system that serves the computer room should be capable of operating 24 hours a day,
365 days a year. It should also be independent of other systems in the building.

• Consider the long-term value of hp server availability, redundant air conditioning equipment or capacity.

• The system should be capable of handling any future hp server expansion.

• Air conditioning equipment air filters should have a minimum rating of 45% (based on “ASHRAE
Standard 52-76, Dust Spot Efficiency Test”).

• Introduce only enough outside air into the system to meet building code requirements (for human
occupancy) and to maintain a positive air pressure in the computer room.

Air Conditioning System Types

The following three air conditioning system types are listed in order of preference:

• Complete self-contained package unit(s) with remote condenser(s). These systems are available with up or
down discharge and are usually located in the computer room.

• Chilled water package unit with remote chilled water plant. These systems are available with up or down
discharge and are usually located in the computer room.

• Central station air handling units with remote refrigeration equipment. These systems are usually
located outside the computer room.

Basic Air Distribution Systems

A basic air distribution system includes supply air and return air.

An air distribution system should be zoned to deliver an adequate amount of supply air to the cooling air
intake vents of the hp server equipment cabinets. Supply air temperature should be maintained within the
following parameters:

• Ceiling supply system—From 55° F (12.8° C) to 60° F (15.6° C)

• Floor supply system—At least 60° F (15.6° C)

If a ceiling plenum return air system or a ducted ceiling return air system is used, the return air grill(s) in the
ceiling should be above the exhaust area or the exhaust row.

The following three types of air distribution system are listed in order of recommendation:

• Underfloor air distribution system—Downflow air conditioning equipment located on the raised floor of
the computer room uses the cavity beneath the raised floor as plenum for the supply air.

Chapter 1

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General Site Preparation Guidelines

Environmental Elements

Perforated floor panels (available from the raised floor manufacturer) should be located around the front
of the system cabinets. Supply air emitted though the perforated floor panels is then available near the
cooling air intake vents of the hp server cabinets.

• Ceiling plenum air distribution system—Supply air is ducted into the ceiling plenum from upflow air
conditioning equipment located in the computer room or from an air handling unit (remote).

The ceiling construction should resist air leakage. Place perforated ceiling panels (with down discharge
air flow characteristics) around the front of the system cabinets. The supply air emitted downward from
the perforated ceiling panels is then available near the cooling air intake vents of the hp server cabinets.

Return air should be ducted back to the air conditioning equipment though the return air duct above the
ceiling.

• Above ceiling ducted air distribution system—Supply air is ducted into a ceiling diffuser system from
upflow air conditioning equipment located in the computer room or from an air handling unit (remote).

Adjust the supply air diffuser system grilles to direct the cooling air downward around the front of the hp
server cabinets. The supply air is then available near the cooling air intake vents of the hp server
cabinets.

Air Conditioning System Installation

All air conditioning equipment, materials, and installation must comply with any applicable construction
codes. Installation of the various components of the air conditioning system must also conform to the air
conditioning equipment manufacturer’s recommendations.

Air Conditioning Ducts

Use separate computer room air conditioning duct work. If it is not separate from the rest of the building, it
might be difficult to control cooling and air pressure levels. Duct work seals are important for maintaining a
balanced air conditioning system and high static air pressure. Adequate cooling capacity means little if the
direction and rate of air flow cannot be controlled because of poor duct sealing. Also, the ducts should not be
exposed to warm air, or humidity levels may increase.

Humidity Level

Maintain proper humidity levels at 40 to 60% RH. High humidity causes galvanic actions to occur between
some dissimilar metals. This eventually causes a high resistance between connections, leading to equipment
failures. High humidity can also have an adverse affect on some magnetic tapes and paper media.

CAUTION Low humidity contributes to undesirably high levels of electrostatic charges. This increases the

electrostatic discharge (ESD) voltage potential. ESD can cause component damage during
servicing operations. Paper feed problems on high-speed printers are usually encountered in
low-humidity environments.

Low humidity levels are often the result of the facility heating system and occur during the cold season. Most
heating systems cause air to have a low humidity level, unless the system has a built-in humidifier.

Dust and Pollution Control

Computer equipment can be adversely affected by dust and microscopic particles in the site environment.

Specifically, disk drives, tape drives, and some other mechanical devices can have bearing failures resulting
from airborne abrasive particles. Dust may also blanket electronic components like printed circuit boards
causing premature failure due to excess heat and/or humidity build up on the boards. Other failures to power

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Environmental Elements

supplies and other electronic components can be caused by metallically conductive particles, including zinc
whiskers. These metallic particles are conductive and can short circuit electronic components. Use every
effort to ensure that the environment is as dust and particulate free as possible. See the following heading
titled “Metallic Particulate Contamination” for additional details.

Smaller particles can pass though some filters and over a period of time, cause problems in mechanical parts.
Small dust particles can be prevented from entering the computer room by maintaining the air conditioning
system at a high static air pressure level.

Other sources of dust, metallic, conductive, abrasive, and/or microscopic particles can be present. Some
sources of these particulates are:

• Subfloor shedding

• Raised floor shedding

• Ceiling tile shedding

These particulates are not always visible to the naked eye. A good check to determine their possible presence
is to check the underside of the tiles. The tile should be shiny, galvanized, and free from rust.

The computer room should be kept clean. The following guidelines are recommended:

• Smoking—Establish a no-smoking policy. Cigarette smoke particles are eight times larger than the
clearance between disk drive read/write heads and the disk surface.

• Printer—Locate printers and paper products in a separate room to eliminate paper particulate problems.

• Eating or drinking—Establish a no-eating or drinking policy. Spilled liquids can cause short circuits in
equipment such as keyboards.

• Tile floors—Use a dust-absorbent cloth mop rather than a dry mop to clean tile floors.

Special precautions are necessary if the computer room is near a source of air pollution. Some air pollutants,
especially hydrogen sulfide (H2S), are not only unpleasant but corrosive as well. Hydrogen sulfide damages
wiring and delicate sound equipment. The use of activated charcoal filters reduces this form of air pollution.

Metallic Particulate Contamination

Metallic particulates can be especially harmful around electronic equipment. This type of contamination may
enter the data center environment from a variety of sources, including but not limited to raised floor tiles,
worn air conditioning parts, heating ducts, rotor brushes in vacuum cleaners or printer component wear.
Because metallic particulates conduct electricity, they have an increased potential for creating short circuits
in electronic equipment. This problem is exaggerated by the increasingly dense circuitry of electronic
equipment.

Over time, very fine whiskers of pure metal can form on electroplated zinc, cadmium, or tin surfaces. If these
whiskers are disturbed, they may break off and become airborne, possibly causing failures or operational
interruptions. For over 50 years, the electronics industry has been aware of the relatively rare but possible
threat posed by metallic particulate contamination. During recent years, a growing concern has developed in
computer rooms where these conductive contaminants are formed on the bottom of some raised floor tiles.

Although this problem is relatively rare, it may be an issue within your computer room. Since metallic
contamination can cause permanent or intermittent failures on your electronic equipment, Hewlett-Packard
strongly recommends that your site be evaluated for metallic particulate contamination before installation of
electronic equipment.

Chapter 1

11

General Site Preparation Guidelines

Environmental Elements

Electrostatic Discharge (ESD) Prevention

Static charges (voltage levels) occur when objects are separated or rubbed together. The voltage level of a
static charge is determined by the following factors:

• Types of materials

• Relative humidity

• Rate of change or separation

Table 1-1 Effect of Humidity on ESD Charge Levels

Personnel Activity

a

Humidityband Charge Levels (voltages)

c

26% 32% 40% 50%

Person walking across a

linoleum floor

Person walking across a carpeted

6,150 V 5,750 V 4,625 V 3,700 V

18,450 V 17,250 V 13,875 V 11,100 V

floor

Person getting up from a plastic

24,600 V 23,000 V 18,500 V 14,800 V

chair

a. Source: B.A. Unger, Electrostatic Discharge Failures of Semiconductor Devices

(Bell Laboratories, 1981)

b. For the same relative humidity level, a high rate of airflow produces higher

static charges than a low airflow rate.

c. Some data in this table has been extrapolated.

Static Protection Measures

Follow these precautions to minimize possible ESD-induced failures in the computer room:

• Maintain recommended humidity level and airflow rates in the computer room.

• Install conductive flooring (conductive adhesive must be used when laying tiles).

• Use conductive wax if waxed floors are necessary.

• Ensure that all equipment and flooring are properly grounded and are at the same ground potential.

• Use conductive tables and chairs.

• Use a grounded wrist strap (or other grounding method) when handling circuit boards.

• Store spare electronic modules in antistatic containers.

Acoustics

Computer equipment and air conditioning blowers cause computer rooms to be noisy. Ambient noise level in a
computer room can be reduced as follows:

• Dropped ceiling—Cover with a commercial grade of fire-resistant, acoustic rated, fiberglass ceiling tile.

• Sound deadening—Cover the walls with curtains or other sound deadening material.

• Removable partitions—Use foam rubber models for most effectiveness.

12

Chapter 1

General Site Preparation Guidelines

Facility Characteristics

Facility Characteristics

This section contains information about facility characteristics that must be considered for the installation or
operation of an hp server. Facility characteristics are:

• Floor loading

• Windows

• Altitude effects

Floor Loading

The computer room floor must be able to support the total weight of the installed hp server as well as the
weight of the individual cabinets as they are moved into position.

Floor loading is usually not an issue in nonraised floor installations. The information presented in this section
is directed toward raised floor installations.

NOTE An appropriate floor system consultant should verify any floor system under consideration for

an hp server installation.

Raised Floor Loading

Raised floor loading is a function of the manufacturer’s load specification and the positioning of the
equipment relative to the raised floor grid. While Hewlett-Packard cannot assume responsibility for
determining the suitability of a particular raised floor system, it does provide information and illustrations
for the customer or local agencies to determine installation requirements.

The following guidelines are recommended:

• Because many raised floor systems do not have grid stringers between floor stands, the lateral support for
the floor stands depends on adjacent panels being in place. To avoid compromising this type of floor
system while gaining under floor access, remove only one floor panel at a time.

• Larger floor grids (bigger panels) are generally rated for lighter loads.

CAUTION Do not position or install any equipment cabinets on the raised floor system until you have

carefully examined it to verify that it is adequate to support the appropriate installation.

Floor Loading Terms

Table 1-2 Floor Loading Term Definitions

Term Definition

Dead load The weight of the raised panel floor system, including the

understructure. Expressed in lb/ft2 (kg/m2).

Live load The load that the floor system can safely support. Expressed

in lb/ft2 (kg/m2).

Chapter 1

13

General Site Preparation Guidelines

Facility Characteristics

Table 1-2 Floor Loading Term Definitions (Continued)

Term Definition

Concentrated load The load that a floor panel can support on a 1-in2 (6.45 cm2)

area at the panel’s weakest point (typically the center of the
panel), without the surface of the panel deflecting more than
a predetermined amount.

Ultimate load The maximum load (per floor panel) that the floor system can

support without failure. Failure expressed by floor panel(s)
breaking or bending.

Ultimate load is usually stated as load per floor panel.

Rolling load The load a floor panel can support (without failure) when a

wheel of specified diameter and width is rolled across the
panel.

Average floor load Computed by dividing total equipment weight by the area of

its footprint. This value is expressed in lb/ft2 (kg/m2).

Average Floor Loading

The average floor load value is not appropriate for addressing raised floor ratings at the floor grid spacing
level. However, it is useful for determining floor loading at the building level, such as the area of solid floor or
span of raised floor tiles covered by the hp server footprint.

Typical Raised Floor Site

This section contains an example of a computer room raised floor system that is satisfactory for the
installation of an hp server.

Based on specific information provided by Hewlett-Packard, Tate Access Floors has approved its Series 800
all-steel access floor with bolt-together stringers and 24 in. (61.0 cm) by 24 in. (61.0 cm) floor panels.

In the event that the flooring is being replaced or a new floor is being installed, Tate Access Floors
recommends its Series 1250 all-steel access floor with bolt-together stringers and 24 in. (61.0 cm) by 24 in.
(61.0 cm) floor panels be used to support the hp installation.

NOTE If the specific floor being evaluated or considered is other than a Tate Series 800 floor, the

specific floor manufacturer must be contacted to evaluate the floor being used.

The following table lists specifications for the Tate Access Floors Series 800 raised floor system.

Table 1-3 Typical Raised Floor Specifications

Item

a

Rating

Dead load 7 lb/ft 2 (34.2 kg/m2)

Live load 313 lb/ft 2 (1528.3 kg/m2)

Concentrated load

b

14

1250 lb (567 kg)

Chapter 1

Table 1-3 Typical Raised Floor Specifications (Continued)

General Site Preparation Guidelines

Facility Characteristics

Item

a

Rating

Ultimate load 4000 lb (1814 kg) per

panel

Rolling load 400 lb (181 kg)

Average floor load 500 lb (227 kg)

a. From Table 1-2 on page 13
b. With 0.08 in (0.2 cm) of span maximum deflection

Windows

Avoid housing computers in a room with windows. Sunlight entering a computer room may cause problems.
Magnetic tape storage media is damaged if exposed to direct sunlight. Also, the heat generated by sunlight
places an additional load on the cooling system.

Chapter 1

15

General Site Preparation Guidelines

Space Requirements

Space Requirements

This section contains information about space requirements for an hp server. This data should be used as the
basic guideline for space plan developments. Other factors, such as airflow, lighting, and equipment space
requirements must also be considered.

Delivery Space Requirements

There should be enough clearance to move equipment safely from the receiving area to the computer room.
Permanent obstructions, such as pillars or narrow doorways, can cause equipment damage.

Delivery plans should include the possible removal of walls or doors.

Operational Space Requirements

Other factors must be considered along with the basic equipment dimensions. Reduced airflow around
equipment causes overheating, which can lead to equipment failure. Therefore, the location and orientation of
air conditioning ducts, as well as airflow direction, are important. Obstructions to equipment intake or
exhaust airflow must be eliminated.

The locations of lighting fixtures and utility outlets affect servicing operations. Plan equipment layout to take
advantage of lighting and utility outlets. Do not forget to include clearance for opening and closing equipment
doors.

Clearance around the cabinets must be provided for proper cooling airflow through the equipment.

If other equipment is located so that it exhausts heated air near the cooling air intakes of the hp server
cabinets, larger space requirements are needed to keep ambient air intake to the hp server cabinets within
the specified temperature and humidity ranges.

Space planning should also include the possible addition of equipment or other changes in space
requirements. Equipment layout plans should also include provisions for the following:

• Channels or fixtures used for routing data cables and power cables

• Access to air conditioning ducts, filters, lighting, and electrical power hardware

• Power conditioning equipment

• Cabinets for cleaning materials

• Maintenance area and spare parts

Floor Plan Grid

A floor plan grid is used to plan the location of equipment in the computer room. In addition to its use for
planning, the floor plan grid should also be used when planning the locations of the following items:

• Air conditioning vents

• Lighting fixtures

• Utility outlets

• Doors

• Access areas for power wiring, air conditioning filters and equipment cable routing.

16

Chapter 1

General Site Preparation Guidelines

Typical Installation Schedule

Typical Installation Schedule

The following schedule lists the sequence of events for a typical system installation:

• 60 days before installation

— Floor plan design completed and mailed to Hewlett-Packard (if required to be an HP task)

• 30 days before installation

— Primary power and air conditioning installation completed

— Telephone and data cables installed

— Fire protection equipment installed

— Major facility changes completed

— Special delivery requirements defined

— Site inspection survey completed

— Delivery survey completed

— A signed copy of the site inspection and delivery survey mailed to Hewlett-Packard

— Site inspection and predelivery coordination meeting arranged with a Hewlett-Packard

representative to review the inspection checklist and arrange an installation schedule.

• 7 days before installation

— Final check made with an Hewlett-Packard site preparation specialist to resolve any last minute

problems

NOTE Not all installations follow a schedule like the one noted above. Sometimes, an hp server is

purchased through another vendor which can preclude a rigid schedule. Other conditions could
also prevent following this schedule. For those situations, consider a milestone schedule.

• Site Preparation - schedule with the customer as soon as possible after the order is placed.

• Site Verification - schedule with the customer a minimum of one to two days before the hp
server is scheduled to be installed.

Chapter 1

17

General Site Preparation Guidelines

Site Inspection

Site Inspection

Table 1-4 Customer and Hewlett-Packard Information

Customer Information

Name: Phone No:

Street Address: City

or
Town:

State or Province: Country

Zip or postal code:

Primary customer contact: Phone No.:

Secondary customer contact: Phone No.:

Traffic coordinator: Phone No.:

Hewlett-Packard information

Sales representative Order No:

Representative making survey Date:

Scheduled delivery date

18

Chapter 1

Table 1-5 Site Inspection Checklist

General Site Preparation Guidelines

Site Inspection

Please check either Yes or No. If No, include comment# or date

Computer room

No. Area or condition Yes No

1. Is there a completed floor plan?

2. Is there adequate space for maintenance needs?
Front 36 in (91.4 cm) minimum, Rear 36 in
(91.4 cm) minimum are recommended
clearances.

3. Is access to the site or computer room
restricted?

4. Is the computer room structurally complete?
Expected date of completion?

5. Is a raised floor installed and in good condition?

6. Is the raised floor adequate for equipment
loading?

7. Are there channels or cutouts for cable routing?

8. Is there a remote console telephone line
available with an RJ11 jack?

Comment

or Date

9. Is a telephone line available?

10. Are customer supplied peripheral cables and
LAN cables available and of the proper type?

11. Are floor tiles in good condition and properly
braced?

12. Is floor tile underside shiny or painted? If
painted, judge the need for particulate test.

Power and lighting

No. Area or condition Yes No

13. Are lighting levels adequate for maintenance?

14. Are there AC outlets available for servicing
needs? (i.e. vacuuming)

15. Does the input voltage correspond to equipment
specifications?

15A Is dual source power used? If so, identify type(s)

and evaluate grounding.

Chapter 1

19

General Site Preparation Guidelines

Site Inspection

Table 1-5 Site Inspection Checklist (Continued)

Please check either Yes or No. If No, include comment# or date

16 Does the input frequency correspond to

equipment specifications?

17. Are lightning arrestors installed inside the
building?

18. Is power conditioning equipment installed?

19. Is there a dedicated branch circuit for
equipment?

20. Is the dedicated branch circuit less than 250
feet (72.5 meters)?

21. Are the input circuit breakers adequate for
equipment loads?

Safety

No. Area or condition Yes No

22. Is there an emergency power shut-off switch?

23. Is there a telephone available for emergency
purposes?

Comment

or Date

24. Is there a fire protection system in the
computer room?

25. Is antistatic flooring installed?

26. Are there any equipment servicing hazards
(loose ground wires, poor lighting, etc.)?

Cooling

No. Area or condition Yes No

27. Can cooling be maintained between 20 °C and
55 °C (up to 5000 ft.)? Derate 1 °C/1000 ft.
above 5000 ft. and up to 10,000 ft.

28. Can temperature changes be held to 10 °C per
hour with tape media? Can temperature
changes be held to 20 °C per hour without tape
media?

29. Can humidity level be maintained at 40% to
60% at 35 °C noncondensing?

30. Are air conditioning filters installed and clean?

Storage

20

Chapter 1

Table 1-5 Site Inspection Checklist (Continued)

General Site Preparation Guidelines

Site Inspection

Please check either Yes or No. If No, include comment# or date

No. Area or condition Yes No

31. Are cabinets available for tape and disc media?

32. Is shelving available for documentation?

Training

No. Area or Condition

33 Are personnel enrolled in the System

Administrator’s Course?

34 Is on-site training required?

Comment

or Date

Chapter 1

21

General Site Preparation Guidelines

Delivery Survey

Delivery Survey

The delivery survey forms list delivery or installation requirements. If any of the items on the list apply, enter
the appropriate information in the areas provided on the form.

Special instructions or recommendations should be entered on the special instructions or recommendations
form. The following list gives examples of special instructions or issues:

• Packaging restrictions at the facility, such as size and weight limitations

• Special delivery procedures

• Special equipment required for installation, such as tracking or hoists

• What time the facility is available for installation (after the equipment is unloaded)

• Special security requirements applicable to the facility, such as security clearance

22

Chapter 1

Figure 1-2 Delivery Survey (Part 1)

DELIVERY CHECKLIST

DOCK DELIVERY

General Site Preparation Guidelines

Delivery Survey

Is dock large enough for a semitrailer?

Circle the location of the dock and give street name if different than address.

North

West

South

Yes

East

STREET DELIVERY

Circle the location of access door and list street name if different than address.

North

West

South

List height

List special permits (if required) for street delivery.

and width

of access door.

East

No

Chapter 1

Permit type: Agency obtained from:

60SP018A

12/7/99

23

General Site Preparation Guidelines

Delivery Survey

Figure 1-3 Delivery Survey (Part 2)

Fill in the following information if an elevator is required to move equipment.

Capacity (lb or kg)

Depth

Height

Width

Please list number of flights and stairway dimensions.

ELEVATOR

Height

Depth

Width

STAIRS

Number of flights

Width

Width

Width

Number of flights

Width

Width

Width

60SP019A

11/24/99

24

Chapter 1

Index

C

Cabinet Performance Grounding (High Frequency

Ground), 5

D

Data Communications Cables

E

electrical and environmental guidelines

electrical conduit ground, 5
lighting requirements, 2
main building electrical ground, 5
power panel grounds, 5

Electrical Conduit Ground, 5
Electrical Factors, 2
electrical load requirements, 3
Environment Elements

Acoustics

Environmental Elements, 8

Computer Room Preparation, 8
Cooling Requirements, 8

Air Conditioning Ducts, 10
Air Conditioning System Guidelines, 9
Air Conditioning System Installation, 10
Air Conditioning System Types, 9
Basic Air Conditioning Equipment Requirements,

Basic Air Distribution Systems, 9
Delivery Survey, 22
Dust and Pollution Control, 10
Electrostatic Discharge (ESD) Prevention, 12
Facility Characteristics, 13

Floor Loading, 13

, 12

8

, 7

Average Floor Loading, 14
Floor Loading Terms, 13
Raised Floor Loading, 13
Typical Raised Floor Site, 14

Windows, 15
Humidity Level, 10
Metallic Particulate Contamination, 11
Site Inspection, 18
Space Requirements, 16

Delivery Space Requirements, 16

Floor Plan Grid, 16

Operational Space Requirements, 16
Typical Installation Schedule, 17

environmental elements

electrostatic discharge

prevention, 12
static protection measures, 12

Equipment Grounding Implementation Details, 7

L

Power Distribution Safety Grounding
Site Preparation

Distribution Hardware

Raceway Systems (electrical conduits), 4

lighting requirements, 3

P

Power Panel Ground, 5

R

raised floor

ground system, illustrated, 6

Raised Floor “High Frequency Noise” Grounding, 6

S

Site Preparation

Computer Room Safety, 2

Fire Protection, 2
Lighting Requirements for Equipment Servicing,

2

Distribution Hardware, 4

Building Distribution, 4
Wire Selection, 4

Electrical Factors, 2
Electrical Load Requirements (Circuit Breaker

Sizing), 3
Grounding Systems, 5
Power Consumption, 3
Power Quality, 3

Power System Protection, 4
Sources of Voltage Fluctuations, 3

System Installation Guidelines, 7

W

Wiring Connections, 7

, 5

G

grounding systems

electrical conduit ground, 5

25