HP OMNI100 User Manual
Product End-of-Life Disassembly Instructions
Marketing Name / Model
[List multiple models if applicable.]
Product Category
HP Omni
100
PC
Integrated PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove
components and materials requiring selective treatment.
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description
Notes
Quantity of items
included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
With a surface greater than 10 sq cm
10
Batteries
All types including standard alkaline and lithium coin or button style
batteries
1
Mercury-containing components
For example, mercury in lamps, display backlights, scanner lamps,
switches, batteries
4
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm
Includes background illuminated displays with gas discharge lamps
1
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB / PCT)
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm
in diameter or height
External electrical cables and cords
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
Components and parts containing toner and ink, including liquids,
semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent chambers, and service
stations.
Components and waste containing asbestos
Components, parts and materials containing refractory ceramic fibers
Components, parts and materials containing radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be
removed.
Tool Description
Tool Size (if applicable)
screw driver
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Place the system
2. Disassemble hinge cover & access door
3. Disassemble stand
4. Remove ODD&TOP Perf
5. Disassemble rear cover
6. Disassemble HDD
7. Disassemble CPU&I/O Shielding
8. Disassemble speaker
9. Disassemble stand support
10. Disassemble CPU H/S
11. Disassemble FAN
12. Unplug cable
13. Disassemble WLAN
14. Disassemble INVERTER
15. Disassemble MB
16. Remove power switch card
17. Disassemble webcam & antenna cable
18. Separate BASE pan& bezel
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective
treatment (with descriptions and arrows identifying locations).
1
2
3
456
Do cosmetic check then place unit on work table.
19. Disassemble hinge cover & access door
1
Disassemble hinge cover & R/L access door.
2
3
20. Disassemble stand
Remove 3 screws for fixing stand.
Place stand to specified area.
1
1
2
3
2
21. Remove ODD&TOP Perf
Remove 2 screws for fixing top perf.
Take top perf.
1
2
Remove one screw for fixing ODD, Put ODD to specified area.
453
22. Disassemble rear cover
1
Remove 5 screws for locking rear cover.
2
345
2
1
1
2
2
3
Remove rear cover as sequence shows in pic3
3
6) Disassemble HDD
2
1
Hold unit with right hand, remove HDD
with left hand, Put HDD to specified
1.Remove 1pcs screw for
fixing HDD
7) Disassemble CPU&I/O Shielding
1
2
5
4
3
7
6
1
2
Remove CPU shiedling.
Remove I/O shiedling.
5
Remove 7 screws for fixing CPU shielding & I/O
3
Remove DDR cover.
4
8) Disassemble speaker
Unplug speaker cable.
2
3
Remove 4pcs screws for fixing speaker.
123
4
1
Take R/L speaker out.
4
9) Disassemble stand support
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