HP (Hewlett-Packard) ML100 User Manual
HP ProLiant ML100 Series Server
User Guide
For HP ProLiant ML110 G6 Servers and HP ProLiant ML150 G6 Servers
Part Number 501528-003
October 2009 (Third Edition)
© Copyright 2009 Hewlett-Packard Development Company, L.P.
The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express
warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP
shall not be liable for technical or editorial errors or omissions contained herein.
Microsoft, Windows, and Windows Server are U.S. registered trademarks of Microsoft Corporation.
Intended audience
This document is for the person who installs, administers, and troubleshoots servers and storage systems.
HP assumes you are qualified in the servicing of computer equipment and trained in recognizing hazards
in products with hazardous energy levels.
Contents
Operations................................................................................................................................... 7
Power up the server................................................................................................................................... 7
Power down the server............................................................................................................................... 7
Remove the access panel............................................................................................................................ 7
Remove the tower bezel (ML110 G6 servers)................................................................................................8
Remove the tower bezel (ML150 G6 servers)................................................................................................8
Setup........................................................................................................................................... 9
Optional installation services ......................................................................................................................9
Rack planning resources............................................................................................................................. 9
Optimum environment................................................................................................................................ 9
Space and airflow requirements ...................................................................................................... 10
Temperature requirements............................................................................................................... 11
Power requirements .......................................................................................................................11
Electrical grounding requirements .................................................................................................... 11
Rack warnings ........................................................................................................................................ 12
Installing hardware options....................................................................................................................... 12
Powering up and configuring the server .....................................................................................................12
Installing the operating system................................................................................................................... 12
Registering the server............................................................................................................................... 13
Hardware options installation....................................................................................................... 14
Introduction ............................................................................................................................................ 14
Processor option...................................................................................................................................... 14
SAS and SATA hard drive options............................................................................................................. 17
Hard drive LED cable (ML150 G6 servers).................................................................................................. 17
Removable media device option (ML110 G6 servers) .................................................................................. 18
Removable media device option (ML150 G6 servers) .................................................................................. 20
Memory options (ML110 G6 servers)......................................................................................................... 21
Memory subsystem architecture (ML110 G6 servers) .......................................................................... 21
Single- and dual-rank DIMMs (ML110 G6 servers)............................................................................. 22
DIMM identification (ML110 G6 servers).......................................................................................... 22
UDIMM maximum memory configurations (ML110 G6 servers) ........................................................... 23
General DIMM slot population guidelines (ML110 G6 servers)............................................................ 23
Memory options (ML150 G6 servers)......................................................................................................... 24
Memory subsystem architecture ....................................................................................................... 24
Single-, dual-, and quad-rank DIMMs ............................................................................................... 24
DIMM identification....................................................................................................................... 25
Memory configurations................................................................................................................... 25
General DIMM slot population guidelines.........................................................................................26
Installing DIMMs ..................................................................................................................................... 28
Expansion board options.......................................................................................................................... 29
Installing a storage controller .................................................................................................................... 32
Battery-backed write cache battery pack option........................................................................................... 32
HP Trusted Platform Module option ............................................................................................................ 35
Installing the Trusted Platform Module board ..................................................................................... 35
Retaining the recovery key/password .............................................................................................. 37
Enabling the Trusted Platform Module............................................................................................... 37
Software and configuration utilities ............................................................................................... 38
ROM-Based Setup Utility .......................................................................................................................... 38
Using RBSU .................................................................................................................................. 38
Auto-configuration process.............................................................................................................. 38
Boot options ................................................................................................................................. 39
BIOS Serial Console ...................................................................................................................... 39
Array Configuration Utility........................................................................................................................ 39
Option ROM Configuration for Arrays ....................................................................................................... 40
HP Insight Diagnostics.............................................................................................................................. 40
Management tools................................................................................................................................... 40
ROMPaq utility.............................................................................................................................. 40
Lights-Out 100i technology ............................................................................................................. 41
HP Integrated Lights-Out Virtual Floppy and CD-ROM drives................................................................ 41
USB support.................................................................................................................................. 41
Remote support and analysis tools.............................................................................................................41
HP Insight Remote Support software ................................................................................................. 41
Keeping the system current ....................................................................................................................... 42
Drivers ......................................................................................................................................... 42
Operating System Version Support .................................................................................................. 42
Subscriber's choice........................................................................................................................ 42
Embedded SATA RAID feature .................................................................................................................. 43
Configuring the SATA RAID feature.................................................................................................. 43
Enabling the SATA RAID feature in RBSU.......................................................................................... 43
Creating a RAID volume.................................................................................................................43
Installing the embedded SATA RAID driver .................................................................................................44
Required hardware........................................................................................................................ 44
USB diskette and CD-ROM drives .................................................................................................... 44
Creating a diskette image............................................................................................................... 45
Installing the Embedded SATA RAID driver with a USB diskette drive.................................................... 45
Installing the Embedded SATA RAID driver using Virtual Floppy........................................................... 45
Installing an operating system ................................................................................................................... 46
Installing a supported Microsoft® Windows® OS.............................................................................. 46
Installing a supported Linux OS ....................................................................................................... 46
Troubleshooting.......................................................................................................................... 47
Pre-diagnostic steps ................................................................................................................................. 47
Important safety information............................................................................................................ 47
Symptom information ..................................................................................................................... 49
Preparing the server for diagnosis.................................................................................................... 49
Common problem resolution ...........................................................................................................50
Troubleshooting flowcharts .......................................................................................................................52
Start diagnosis flowchart ................................................................................................................52
General diagnosis flowchart ........................................................................................................... 53
Power-on problems flowchart ..........................................................................................................55
POST problems flowchart ............................................................................................................... 57
OS boot problems flowchart ...........................................................................................................59
Server fault indications flowchart ..................................................................................................... 60
Hardware problems................................................................................................................................. 62
Power problems ............................................................................................................................63
General hardware problems........................................................................................................... 64
Internal system problems................................................................................................................. 66
System open circuits and short circuits.............................................................................................. 73
External device problems................................................................................................................ 73
Audio problems............................................................................................................................. 74
Printer problems ............................................................................................................................ 75
Mouse and keyboard problems....................................................................................................... 75
Modem problems .......................................................................................................................... 75
Network controller problems........................................................................................................... 77
Software problems .................................................................................................................................. 79
Operating system problems ............................................................................................................ 79
Operating system updates .............................................................................................................. 80
Restoring to a backed-up version ..................................................................................................... 80
When to reconfigure or reload software........................................................................................... 80
Linux operating systems.................................................................................................................. 81
Application software problems ........................................................................................................ 81
Firmware maintenance............................................................................................................................. 82
Types of ROM............................................................................................................................... 82
ROMPaq utility diskette or USB drive key.......................................................................................... 83
Current firmware versions............................................................................................................... 83
Updating firmware ........................................................................................................................ 83
Drivers ......................................................................................................................................... 84
Contacting HP ........................................................................................................................................ 84
Contacting HP technical support or an authorized reseller................................................................... 84
Server information you need ........................................................................................................... 84
Operating system information you need ........................................................................................... 85
Battery....................................................................................................................................... 87
Regulatory compliance notices ..................................................................................................... 89
Regulatory compliance identification numbers............................................................................................. 89
Federal Communications Commission notice............................................................................................... 89
FCC rating label............................................................................................................................ 89
Class A equipment......................................................................................................................... 89
Class B equipment......................................................................................................................... 89
Declaration of conformity for products marked with the FCC logo, United States only....................................... 90
Modifications.......................................................................................................................................... 90
Cables................................................................................................................................................... 90
Canadian notice (Avis Canadien).............................................................................................................. 91
European Union regulatory notice .............................................................................................................91
Disposal of waste equipment by users in private households in the European Union......................................... 91
Japanese notice ...................................................................................................................................... 92
BSMI notice............................................................................................................................................ 93
Korean notice ......................................................................................................................................... 93
Chinese notice........................................................................................................................................ 93
Laser compliance .................................................................................................................................... 93
Battery replacement notice........................................................................................................................ 94
Taiwan battery recycling notice................................................................................................................. 94
Power cord statement for Japan................................................................................................................. 94
Acoustics statement for Germany (Geräuschemission) .................................................................................. 95
Electrostatic discharge................................................................................................................. 96
Preventing electrostatic discharge..............................................................................................................96
Grounding methods to prevent electrostatic discharge.................................................................................. 96
Technical support........................................................................................................................ 97
HP contact information............................................................................................................................. 97
Before you contact HP.............................................................................................................................. 97
Customer Self Repair ...............................................................................................................................97
Acronyms and abbreviations...................................................................................................... 105
Index....................................................................................................................................... 108
Operations
Power up the server
To power up the server, press the Power On/Standby button.
Power down the server
WARNING: To reduce the risk of personal injury, electric shock, or damage to the
equipment, remove the power cord to remove power from the server. The front panel Power
On/Standby button does not completely shut off system power. Portions of the power supply
1. Back up the server data.
2. Shut down the operating system as directed by the operating system documentation.
3. Press the Power On/Standby button to place the server in standby mode. When the server activates
and some internal circuitry remain active until AC power is removed.
IMPORTANT: If installing a hot-plug device, it is not necessary to power down the server.
standby power mode, the system power LED changes to amber.
4. Disconnect the power cords.
The system is now without power.
Remove the access panel
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
1. Power down the server (on page 7).
internal system components to cool before touching them.
CAUTION: Do not operate the server for long periods with the access panel open or
removed. Operating the server in this manner results in improper airflow and improper
cooling that can lead to thermal damage.
2. Extend the server from the rack.
3. Loosen the thumbscrew on the access panel.
4. Slide the access panel back.
5. Lift and remove the access panel.
To replace the component, reverse the removal procedure.
For server-specific information, see the installation sheet that ships with the server.
Operations 7
Remove the tower bezel (ML110 G6 servers)
1. Remove the access panel (on page 7).
2. To release the bezel, push the left side of the bezel.
3. Release the tabs, then turn the bezel counter-clockwise to remove it.
To replace the component, reverse the removal procedure.
For server-specific information, see the installation sheet that ships with the server.
Remove the tower bezel (ML150 G6 servers)
1. Insert the key provided with the server and turn clockwise to unlock the bezel.
The key is provided for the service person using model HSTNS-7105 with the HP RPS enablement kit.
2. Open the tower bezel.
3. Lift up the tower bezel and remove it from the chassis.
To replace the component, reverse the removal procedure.
For server-specific information, see the installation sheet that ships with the server.
Operations 8
Setup
Optional installation services
Delivered by experienced, certified engineers, HP Care Pack services help you keep your servers up and
running with support packages tailored specifically for HP ProLiant systems. HP Care Packs let you
integrate both hardware and software support into a single package. A number of service level options
are available to meet your needs.
HP Care Pack Services offer upgraded service levels to expand the standard product warranty with easyto-buy, easy-to-use support packages that help you make the most of your server investments. Some of the
Care Pack services are:
• Hardware support
o 6-hour call-to-repair
o 4-hour 24x7 same day
o 4-hour same business day
• Software support
o Microsoft®
o Linux
• Integrated hardware and software support
o Critical Service
o Proactive 24
o Support Plus
o Support Plus 24
• Startup and implementation services for both hardware and software
For more information on Care Packs, refer to the
http://www.hp.com/hps/carepack/servers/cp_proliant.html).
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Rack planning resources
The rack resource kit ships with all HP branded or Compaq branded 9000, 10000, and H9 series racks.
For more information on the content of each resource, refer to the rack resource kit documentation.
If you intend to deploy and configure multiple servers in a single rack, refer to the white paper on highdensity deployment at the
HP website (http://www.hp.com/products/servers/platforms).
HP website
Optimum environment
When installing the server, select a location that meets the environmental standards described in this
section.
Setup 9
Space and airflow requirements
Tower server
In a tower configuration, leave at least a 7.6-cm (3.0-in) clearance space at the front and back of the
server for proper ventilation.
Rack server
To allow for servicing and adequate airflow, observe the following space and airflow requirements when
deciding where to install a rack:
• Leave a minimum clearance of 63.5 cm (25 in) in front of the rack.
• Leave a minimum clearance of 76.2 cm (30 in) behind the rack.
• Leave a minimum clearance of 121.9 cm (48 in) from the back of the rack to the back of another
rack or row of racks.
• Leave a minimum clearance of 4.4 cm (1.75 in) from the top of the side panel.
HP servers draw in cool air through the front door and expel warm air through the rear door. Therefore,
the front and rear rack doors must be adequately ventilated to allow ambient room air to enter the
cabinet, and the rear door must be adequately ventilated to allow the warm air to escape from the
cabinet.
CAUTION: To prevent improper cooling and damage to the equipment, do not block the
When vertical space in the rack is not filled by a server or rack component, the gaps between the
components cause changes in airflow through the rack and across the servers. Cover all gaps with
blanking panels to maintain proper airflow.
The 9000 and 10000 Series Racks provide proper server cooling from flow-through perforations in the
front and rear doors that provide 64 percent open area for ventilation.
ventilation openings.
CAUTION: Always use blanking panels to fill empty vertical spaces in the rack. This
arrangement ensures proper airflow. Using a rack without blanking panels results in improper
cooling that can lead to thermal damage.
CAUTION: When using a Compaq branded 7000 Series rack, you must install the high
airflow rack door insert [P/N 327281-B21 (42U) or P/N 157847-B21 (22U)] to provide
proper front-to-back airflow and cooling.
CAUTION: If a third-party rack is used, observe the following additional requirements to
ensure adequate airflow and to prevent damage to the equipment:
• Front and rear doors—If the 42U rack includes closing front and rear doors, you must
allow 5,350 sq cm (830 sq in) of holes evenly distributed from top to bottom to permit
adequate airflow (equivalent to the required 64 percent open area for ventilation).
• Side—The clearance between the installed rack component and the side panels of the rack
must be a minimum of 7 cm (2.75 in).
Setup 10
Temperature requirements
To ensure continued safe and reliable equipment operation, install or position the system in a wellventilated, climate-controlled environment.
The maximum recommended ambient operating temperature (TMRA) for most server products is 35°C
(95°F). The temperature in the room where the rack is located must not exceed 35°C (95°F).
CAUTION: To reduce the risk of damage to the equipment when installing third-party options:
• Do not permit optional equipment to impede airflow around the server or to increase the
internal rack temperature beyond the maximum allowable limits.
• Do not exceed the manufacturer’s TMRA.
Power requirements
Installation of this equipment must comply with local and regional electrical regulations governing the
installation of information technology equipment by licensed electricians. This equipment is designed to
operate in installations covered by NFPA 70, 1999 Edition (National Electric Code) and NFPA-75, 1992
(code for Protection of Electronic Computer/Data Processing Equipment). For electrical power ratings on
options, refer to the product rating label or the user documentation supplied with that option.
WARNING: To reduce the risk of personal injury, fire, or damage to the equipment, do not
overload the AC supply branch circuit that provides power to the rack. Consult the electrical
When installing more than one server, you may need to use additional power distribution devices to
safely provide power to all devices. Observe the following guidelines:
authority having jurisdiction over wiring and installation requirements of your facility.
CAUTION: Protect the server from power fluctuations and temporary interruptions with a
regulating uninterruptible power supply (UPS). This device protects the hardware from
damage caused by power surges and voltage spikes and keeps the system in operation
during a power failure.
• Balance the server power load between available AC supply branch circuits.
• Do not allow the overall system AC current load to exceed 80 percent of the branch circuit AC
current rating.
• Do not use common power outlet strips for this equipment.
• Provide a separate electrical circuit for the server.
Electrical grounding requirements
The server must be grounded properly for proper operation and safety. In the United States, you must
install the equipment in accordance with NFPA 70, 1999 Edition (National Electric Code), Article 250,
as well as any local and regional building codes. In Canada, you must install the equipment in
accordance with Canadian Standards Association, CSA C22.1, Canadian Electrical Code. In all other
countries, you must install the equipment in accordance with any regional or national electrical wiring
codes, such as the International Electrotechnical Commission (IEC) Code 364, parts 1 through 7.
Furthermore, you must be sure that all power distribution devices used in the installation, such as branch
wiring and receptacles, are listed or certified grounding-type devices.
Setup 11
Because of the high ground-leakage currents associated with multiple servers connected to the same
power source, HP recommends the use of a PDU that is either permanently wired to the building’s branch
circuit or includes a nondetachable cord that is wired to an industrial-style plug. NEMA locking-style plugs
or those complying with IEC 60309 are considered suitable for this purpose. Using common power outlet
strips for the server is not recommended.
Rack warnings
WARNING: To reduce the risk of personal injury or damage to the equipment, be sure that:
• The leveling jacks are extended to the floor.
• The full weight of the rack rests on the leveling jacks.
• The stabilizing feet are attached to the rack if it is a single-rack installation.
• The racks are coupled together in multiple-rack installations.
• Only one component is extended at a time. A rack may become unstable if more than one
component is extended for any reason.
WARNING: To reduce the risk of personal injury or equipment damage when unloading a
rack:
• At least two people are needed to safely unload the rack from the pallet. An empty 42U
rack can weigh as much as 115 kg (253 lb), can stand more than 2.1 m (7 ft) tall, and
may become unstable when being moved on its casters.
• Never stand in front of the rack when it is rolling down the ramp from the pallet. Always
handle the rack from both sides.
Installing hardware options
Install any hardware options before initializing the server. For options installation information, refer to the
option documentation. For server-specific information, refer to "
14)."
Hardware options installation (on page
Powering up and configuring the server
To power up the server, press the Power On/Standby button.
For detailed information on configuring the server, see the server installation sheet.
Installing the operating system
To operate properly, the server must have a supported operating system. For the latest information on
supported operating systems, refer to the
To install an operating system on the server, insert the operating system CD into the CD-ROM drive and
reboot the server. This process may require you to obtain additional drivers from the Easy Set-up CD
shipped with the server, or the CD that shipped with the option. The drivers may have updates that are
available on the
Follow the on-screen instructions to begin the installation process.
HP website (http://www.hp.com/support).
HP website (http://www.hp.com/go/supportos).
Setup 12
Registering the server
To register the server, refer to the HP Registration website (http://register.hp.com).
Setup 13
Hardware options installation
Introduction
If more than one option is being installed, read the installation instructions for all the hardware options
and identify similar steps to streamline the installation process.
WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the
Processor option
internal system components to cool before touching them.
CAUTION: To prevent damage to electrical components, properly ground the server before
beginning any installation procedure. Improper grounding can cause electrostatic discharge.
The server uses embedded PPMs as DC-to-DC converters to provide the proper power to each processor.
CAUTION: To prevent possible server malfunction, do not mix processors of different speeds
or cache sizes. Refer to the label on the processor heatsink for a description of the processor.
CAUTION: To avoid damage to the processor and system board, only authorized personnel
should attempt to replace or install the processor in this server.
CAUTION: To avoid damage to the processor:
• Handle the processor only by the edges.
• Do not touch the bottom of the processor, especially the contact area.
IMPORTANT: Processor socket 1 must be populated at all times or the server does not
function.
To install the component:
1. Power down the server (on page 7).
2. For the ML110 G6 server, extend the server from the rack.
3. For the ML150 G6 server, do one of the following:
o Unlock and remove the bezel ("Remove the tower bezel (ML150 G6 servers)" on page 8).
o Extend the server from the rack.
4. Remove the access panel (on page 7).
5. Open the processor retaining latch and the processor socket retaining bracket.
Hardware options installation 14
6.
Remove the processor socket protective cover.
IMPORTANT: Be sure the processor remains inside the processor installation tool.
7. If the processor has separated from the installation tool, carefully re-insert the processor in the tool.
Hardware options installation 15
8.
Align the processor installation tool with the socket and install the processor.
9. Press down firmly until the processor installation tool clicks and separates from the processor, and
then remove the processor installation tool.
Hardware options installation 16
10.
Close the processor socket retaining bracket and the processor retaining latch.
11. Install the heatsink. See the server installation sheet on the HP website
http://www.hp.com/go/bizsupport).
(
12. Install the access panel.
13. For ML110 G6 servers, slide the server back into the rack.
14. For ML150 G6 servers, do one of the following:
o Close or install the tower bezel, as needed.
o Slide the server back into the rack.
15. Power up the server (on page 7).
SAS and SATA hard drive options
The HP ProLiant ML110 G6 Server supports up to four hard drives and the HP ProLiant ML150 G6 Server
support up to eight hard drives:
• SATA hard drives only with the embedded SATA controller
• SAS or SATA hard drives with an optional SAS controller
For optimal performance, avoid mixing SAS and SATA hard drives.
To install a hard drive, see the server installation sheet on the
http://www.hp.com/go/bizsupport).
(
HP website
Hard drive LED cable (ML150 G6 servers)
An optional hard drive LED cable is required for hot-plug hard drive LED functionality with an optional
storage controller.
To connect the hard drive LED cable:
1. Power down the server (on page 7).
2. Do one of the following:
Hardware options installation 17
o
Unlock and remove the bezel ("Remove the tower bezel (ML150 G6 servers)" on page 8).
o Extend the server from the rack.
3. Remove the access panel (on page 7).
4. Install the storage controller card.
For more information, see the documentation that ships with the option and see "
options
5. Connect the LED cable to the storage controller card.
6. Secure the cable with the cable clamp.
7. Connect the LED cable to the system board.
(on page 29)."
Expansion board
For more information, see the label attached to the server access panel.
8. Install the access panel.
9. Do one of the following:
o Close or install the tower bezel, as needed.
o Slide the server back into the rack.
10. Power up the server (on page 7).
Removable media device option (ML110 G6 servers)
This process only represents one installation method. For instructions for installing the media device into a
specific server, see the installation sheet that ships with the server or the
http://www.hp.com/go/bizsupport).
(
HP website
To install the component:
1. Power down the server (on page 7).
2. Extend the server from the rack.
3. Remove the access panel (on page 7).
4. Remove the tower bezel ("Remove the tower bezel (ML110 G6 servers)" on page 8).
5. Using a Phillips screwdriver, press the release tab on the bezel blank, then remove the shield.
Hardware options installation 18
HP recommends that you remove all bezel blanks to facilitate drive installation.
6. Install the four screws into the top screw holes on the media device.
7. Slide the media device part into the bay.
8. Connect the data and power cables.
9. Connect the cables to the system board or to an expansion board, as directed by the option
documentation.
10. Slide the server back into the rack.
11. Install the access panel.
12. Install the tower bezel.
13. Power up the server (on page 7).
Hardware options installation 19
Removable media device option (ML150 G6 servers)
This process represents only one installation method. For instructions for installing the media device into a
specific server, see the installation sheet that ships with the server or the
http://www.hp.com/go/bizsupport).
(
To install the component:
1. Power down the server (on page 7).
2. Do one of the following:
o Unlock and remove the bezel ("Remove the tower bezel (ML150 G6 servers)" on page 8).
o Extend the server from the rack.
3. Remove the access panel (on page 7).
4. Press the fan holder release tab, and then remove the fan holder.
HP website
5. Remove the bezel blank.
HP recommends that you remove all bezel blanks to facilitate drive installation.
Hardware options installation 20
6.
Slide the media device part of the way into the bay.
7. Connect the SATA power cable to the media drive.
8. Connect the device cable to the device and the system board or to an expansion board, as directed
by the option documentation.
9. Slide the media drive fully into the bay until it is seated securely.
10. Install the fan holder.
11. Install the access panel.
12. Do one of the following:
o Close or install the tower bezel, as needed.
o Slide the server back into the rack.
13. Power up the server (on page 7).
Memory options (ML110 G6 servers)
The memory subsystem in this server supports UDIMMs. In this section, the term "DIMM" is used. When
specified as UDIMM, the information applies to that type only. All memory installed in the server must be
the same type.
The server supports the following DIMM speeds:
• Single- and dual-rank PC3-10600E (DDR-1333) DIMMs operating at 1333 and 1066 MHz
• Single- and dual-rank PC3-8500E (DDR3) ,DIMMs operating at 1066 MHz
Depending on the processor model, the number of DIMMs installed, the memory clock speed may be
reduced to 1066 or 800 MHz. For more information on the effect of DIMM slot population, see "
DIMM slot population guidelines
(on page 26)."
General
Memory subsystem architecture (ML110 G6 servers)
The memory subsystem in this server is divided into channels. Each processor supports two channels, and
each channel supports two DIMM slots, as shown in the following table.
Hardware options installation 21
Channel Slot Slot number
1 C A 1
2
2 D B 3
4
This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecture
also enables the Mirrored Memory and Lockstep memory modes. This server supports Unbuffered DIMMs
(UDIMMs).
DIMM slots in this server are identified by number and by letter. Letters identify the slots to populate for
specific AMP modes. Slot numbers are reported by ROM messages during boot and for error reporting.
Single- and dual-rank DIMMs (ML110 G6 servers)
To understand and configure memory protection modes properly, an understanding of single-, dual-, and
quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.
A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the
memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only
one rank accessible at a time. A quad-rank DIMM is, effectively, two dual-rank DIMMs on the same
module. Only one rank is accessible at a time. The server memory control subsystem selects the proper
rank within the DIMM when writing to or reading from the DIMM.
Dual-rank DIMMs provide the greatest capacity with the existing memory technology. For example, if
current DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4-GB.
DIMM identification (ML110 G6 servers)
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix
these two types causes the server to halt during BIOS initialization.
Hardware options installation 22
The memory subsystem may be populated with either RDIMMs or UDIMMs, but mixing the two types is not
supported. To determine DIMM characteristics, use the label attached to the DIMM and the following
illustration and table.
Item Description Definition
1 Size —
2 Rank 1R = Single-rank
2R = Dual-rank
4R = Quad-rank
3 Data width x4 = 4-bit
x8 = 8-bit
4 Memory speed 10600 = 1333-MHz
8500 = 1067-MHz
5 DIMM type R = RDIMM (registered)
E = UDIMM (unbuffered with ECC)
For the latest supported memory information, see the QuickSpecs on the HP website
http://www.hp.com).
(
UDIMM maximum memory configurations (ML110 G6 servers)
The server supports a maximum of 8 GB using 2-GB single- or dual-rank UDIMMs.
General DIMM slot population guidelines (ML110 G6 servers)
Observe the following guidelines when populating DIMMs:
• Populate DIMM slots for a processor only if the processor is installed.
• Do not mix Unbuffered and Registered PC3 DIMMs.
• Each channel supports up to two Unbuffered DIMMs.
• Single DIMM (non-interleaving) must be installed in slot 2.
• Two DIMMs (interleaving) install in slot 2 and slot 4 for optimal performance.
Hardware options installation 23
Memory options (ML150 G6 servers)
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix
these two types causes the server to halt during BIOS initialization.
The memory subsystem in this server can support RDIMMs or UDIMMs. Both types are referred to as
DIMMs when the information applies to both types. When specified as RDIMM or UDIMM, the
information applies to that type only. All memory installed in the server must be the same type.
The server supports the following DIMM speeds:
• Single- and dual-rank PC3-10600 (DDR-1333) DIMMs operating at 1333 and 1066 MHz
• Quad-rank PC3-8500 (DDR-1067) DIMMs operating at 1066 MHz
Depending on the processor model, the number of DIMMs installed, and whether UDIMMs or RDIMMs
are installed, the memory clock speed may be reduced to 1066 or 800 MHz. For more information on
the effect of DIMM slot population, see "
Memory subsystem architecture
The memory subsystem in this server is divided into channels. Each processor supports three channels,
and each channel supports two DIMM slots, as shown in the following table.
Channel Slot Slot number
1 D A 1
2 E B 3
3 F C 5
General DIMM slot population guidelines (on page 26)."
2
4
6
This multi-channel architecture provides enhanced performance in Advanced ECC mode. This architecture
also enables the Mirrored Memory and Lockstep memory modes. This server supports both Registered
PC3 DIMMs (RDIMMs) and Unbuffered DIMMs (UDIMMs).
DIMM slots in this server are identified by number and by letter. Letters identify the slots to populate for
specific AMP modes. Slot numbers are reported by ROM messages during boot and for error reporting.
Single-, dual-, and quad-rank DIMMs
To understand and configure memory protection modes properly, an understanding of single-, dual-, and
quad-rank DIMMs is helpful. Some DIMM configuration requirements are based on these classifications.
A single-rank DIMM has one set of memory chips that is accessed while writing to or reading from the
memory. A dual-rank DIMM is similar to having two single-rank DIMMs on the same module, with only
one rank accessible at a time. A quad-rank DIMM is, effectively, two dual-rank DIMMs on the same
module. Only one rank is accessible at a time. The server memory control subsystem selects the proper
rank within the DIMM when writing to or reading from the DIMM.
Dual- and quad-rank DIMMs provide the greatest capacity with the existing memory technology. For
example, if current DRAM technology supports 2-GB single-rank DIMMs, a dual-rank DIMM would be 4GB, and a quad-rank DIMM would be 8-GB.
Hardware options installation 24
DIMM identification
IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix
The memory subsystem may be populated with either RDIMMs or UDIMMs, but mixing the two types is not
supported. To determine DIMM characteristics, use the label attached to the DIMM and the following
illustration and table.
these two types causes the server to halt during BIOS initialization.
Item Description Definition
1 Size —
2 Rank 1R = Single-rank
2R = Dual-rank
4R = Quad-rank
3 Data width x4 = 4-bit
x8 = 8-bit
4 Memory speed 10600 = 1333-MHz
8500 = 1067-MHz
5 DIMM type R = RDIMM (registered)
E = UDIMM (unbuffered with ECC)
For the latest supported memory information, see the QuickSpecs on the HP website
http://www.hp.com).
(
Memory configurations
To optimize server availability, the server supports the following AMP modes:
• Advanced ECC—provides the greatest memory capacity for a given DIMM size, while providing up
to 8-bit error correction, depending on the specific DIMM type. This mode is the default option for
this server.
Hardware options installation 25
• Lockstep—provides enhanced protection while making all installed memory available to the
operating system. The server can continue to function if a single- or mulit-bit memory failure within a
single DRAM device occurs.
Advanced Memory Protection options are configured in RBSU. If the requested AMP mode is not
supported by the installed DIMM configuration, the server boots in Advanced ECC mode. For more
information, see "
HP ROM-Based Setup Utility ("ROM-Based Setup Utility" on page 38)."
For the latest memory configuration information, see the QuickSpecs on the
http://www.hp.com).
(
RDIMM maximum memory configurations
The following table lists the maximum memory configuration possible with 4-GB RDIMMs.
Rank Single-processor Dual-processor
Single-rank 24 GB 48 GB
Dual-rank 24 GB 48 GB
Quad-rank 24 GB 48 GB
UDIMM maximum memory configurations
The server supports a maximum of 12 GB with one processor and 24 GB with two processors using 2-GB
single- or dual-rank UDIMMs.
Advanced ECC memory configuration
Advanced ECC memory is the default memory protection mode for this server. Standard ECC can correct
single-bit memory errors and detect multi-bit memory errors. When multi-bit errors are detected using
Standard ECC, the error is signaled to the server and causes the server to halt.
HP website
Advanced ECC protects the server against some multi-bit memory errors. Advanced ECC can correct both
single-bit memory errors and 4-bit memory errors if all failed bits are on the same DRAM device on the
DIMM.
Advanced ECC provides additional protection over Standard ECC because it is possible to correct certain
memory errors that would otherwise be uncorrected and result in a server failure. The server provides
notification that correctable error events have exceeded a pre-defined threshold rate.
Lockstep memory configuration
Lockstep mode provides protection against multi-bit memory errors that occur on the same DRAM device.
Lockstep mode can correct any single DRAM device failure on x4 and x8 DIMM types. The DIMMs in
each channel must have identical HP part numbers.
Lockstep mode uses channel 1 and channel 2. Channel 3 is not populated. Because channel 3 cannot be
populated when using Lockstep mode, the maximum memory capacity is lower than Advanced ECC
mode. Memory performance with Advanced ECC is also slightly higher.
General DIMM slot population guidelines
Observe the following guidelines for all AMP modes:
Hardware options installation 26
• Populate DIMM slots for a processor only if the processor is installed.
• To maximize performance in multi-processor configurations, distribute the total memory capacity
between all processors as evenly as possible.
• Do not mix Unbuffered and Registered PC3 DIMMs.
• Each channel supports up to two Unbuffered DIMMs.
• If quad-rank DIMMs are installed for a processor, a maximum of two DIMMs can be installed on
each channel for that processor.
If a channel contains quad-rank DIMMs, the quad-rank DIMM must be installed first on that channel.
DIMM speeds are supported as indicated in the following table.
Populated slots
(per channel)
1 Single- or dual-rank 800, 1333, 1066
1 Quad-rank 800, 1066
2 Single- or dual-rank 800, 1066
2 Single-, dual-, or quad-rank 800
Rank Speeds supported
(MHz)
Advanced ECC population guidelines
For Advanced ECC mode configurations, observe the following guidelines:
• Observe the general DIMM slot popula
Lockste
• DIMMs may be installed individually.
Single-processor Advanced ECC population order
For Adv
order:
anced ECC mode configurations with a single processor, populate the DIMM slots in the following
• RDIMM: Sequentially in alphabetical order (A through F)
• UDIMM: Sequentially in alphabetical order (A through F).
Multi-processor Advanced ECC population order
For Advanced ECC mode configu
processor in the following order:
rations with multiple processors, populate the DIMM slots for each
• RDIMM: Sequentially in alphabetical order (A through F)
• gh F).
UDIMM: Sequentially in alphabetical order (A throu
p Memory population guidelines
tion guidelines (on page 26).
For Lockstep memory mode configurations, observe the following guideline
• Observe the general DIMM slot population guidelines (on page 26).
• Always install DIMMs in channels 1 and 2 for each ins
talled processor.
• Do not install DIMMs in channel 3 for any processor.
s:
Hardware options installation 27
• DIMM configuration on channel 1 and channel 2 of a processor must be identical.
In multi-processo• r configurations, each processor must have a valid Lockstep Memory configuration.
• In multi-processor configurations, each processo
configuration.
Single-processo
For Lockst e configurations with a single processor, populate the DIMM slots in the
follow g
• I
•
ep memory mod
in order:
RD MM
o First: A and B
o Next:
o Do not populat
UDIMM
o First: A and B
o Last: D and E
o Do not populate slots C or F.
r Lockstep population order
D and E
e slots C or F.
After installing the DIMMs, use RBSU to configure the system for Lockstep memory support.
Mult ssor Lockstep populatioi-proce
For L de configurations with multiple processors, populate the DIMM slots for each
ockstep memory mo
processor in t g order:
he followin
n order
r may have a different valid Lockstep Memory
• MM
RDI
o First: A and B
o Next: D and E
o Do not populate slots
•
UDIMM
o First: A and B
o
Last: D and E
o Do not populate slot
After installing the DIMMs, u
Installing
1.
Power down the server (on page 7).
2. rver from the rack.
For ML110 G6 servers, extend the se
3. For ML150 G6 servers, do one of the fo
C or F.
s C or F.
se RBSU to configure the system for Lockstep memory support.
DIMMs
CAUTION: To avoid damage to the hard drives, memory, and other system components, the
air baffle, drive blanks, and access panel must be installed when the server is powered up.
llowing:
o Unlock and remove
the bezel ("Remove the tower bezel (ML150 G6 servers)" on page 8).
Hardware options installation 28
o
Extend the server from the rack.
4.
Remove the access panel (on page 7).
5. Remove the air baffle.
For more informati
http://www.hp.com/go/bizsupport).
(
6. Open the DIMM slot latches.
7. Install the DIMM.
8. Install the air baffle.
on, see the server installation sheet on the
HP website
9.
Install the access panel.
10. back into the rack.
For ML110 G6 servers, slide the server
11. For ML150 G6 servers, do one of the following:
o Close or insta
o Slide the server back into the rack.
ll the tower bezel, as needed.
If you are installing DIMMs in lock-step configuration, c
" on page 38).
Utility
For more information about LEDs and troublesh
HP website (http://www.hp.com/go/bizsupport).
the
Expansion board options
For server s with
the server.
To install the component:
1.
-specific expansion board installation instructions, refer to the installation sheet that ship
CAUTION: To prevent damage to the server or expansion boards, power down the server
Power down the server (on page 7).
onfigure this mode in
RBSU ("ROM-Based Setup
ooting failed DIMMs, see the server installation sheet on
alling the expansion boards. and remove all AC power cords before removing or inst
2. rver from the rack.
For ML110 G6 servers, extend the se
Hardware options installation 29
3.
For ML150 G6 servers, do one of the following:
o Unlock and remove the be
o Extend the server from the rack.
zel ("Remove the tower bezel (ML150 G6 servers)" on page 8).
4. Remove the access panel (on page 7).
5. Open the slot cover retainer:
o HP ProLiant ML110 G6 server
o HP ProLiant ML150 G6 server
CAUTION: To prevent improper cooling and thermal damage, do not operate the server
unless all PCI slots have either an expansion slot cover or an expansion board installed.
Hardware options installation 30
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