Hp ISS Technology Volume 6, Number 7
ISS Technology Update
Volume 6, Number 7
Keeping you informed of the latest ISS technology
Using HP Onboard Administrator as an alternative method for accessing power consumption information
for HP BladeSystem c-Class servers .........................................................................................................1
Using HP Lights-Out XML Scripting as an alternative method for accessing power consumption
information for HP BladeSystem p-Class servers......................................................................................4
Recovering memory that is invisible to the Microsoft® Windows® operating system ................................ 9
Basic power control for HP BladeSystem p-Class and c-Class servers .....................................................10
Cabling stacked HP 1/10G Virtual Connect Ethernet Modules................................................................. 13
Adjustable fan speeds in the HP BladeSystem c7000 enclosure.............................................................. 16
ProLiant management tip of the month..................................................................................................18
Recently published industry standard server technology papers ............................................................20
Contact us .............................................................................................................................................20
Using HP Onboard Administrator as an alternative method for accessing power
consumption information for HP BladeSystem c-Class servers
HP Onboard Administrator Command Line Interface (CLI) commands can be used (and scripted) to view power consumption
information for HP BladeSystem c-Class server blades or the c-Class power enclosure.
How to make a request for server blade information
The HPONCFG command sends a Remote Insight Board Command Language (RIBCL) script to the specified BladeSystem
c-Class server blades. You can send the same RIBCL script to one or more of the server blades in the enclosure, such as in the
following examples:
• HPONCFG ALL returns power consumption information for all server blades in the enclosure.
• HPONCFG 1, 3, 5 returns power consumption information for server blades in Bays 1, 3, and 5.
• HPONCFG returns power consumption information for server blades in Bay 2 (Figure 1-1 shows the sample output).
ISS Technology Update Volume 6, Number 7
NOTE
The HPONCFG command is supported with Onboard Administrator Version 2.00 (or greater).
OA-12345678> HPONCFG ALL tftp://some/power/ribcl/script.xml
Figure 1-1. Sample output from HPONCFG ALL command
2
ISS Technology Update Volume 6, Number 7
How to make a request for power enclosure information
To return information about the power enclosure, use the SHOW POWER and SHOW ENCLOSURE STATUS commands.
The SHOW POWER command displays the current power configuration (Figure 1-2).
OA-12345678> SHOW POWER
Figure 1-2. Sample output from SHOW POWER command
The SHOW ENCLOSURE STATUS command displays the enclosure health, Onboard Administrator health, and unit
identification LED in the “Enclosure” section. The “Power Subsystem” section displays the power status and capacity
(Figure 1-3).
OA-12345678> SHOW ENCLOSURE STATUS
3
ISS Technology Update Volume 6, Number 7
Figure 1-3. Sample output from SHOW ENCLOSURE STATUS command
Using HP Lights-Out XML Scripting as an alternative method for accessing power consumption information for HP BladeSystem p-Class servers
HP Systems Insight Manager (HP SIM) 5.1 or later is the easiest tool to use to acquire power consumption information for HP
BladeSystem p-Class servers. HP SIM allows you to determine power consumption levels from an individual power supply or
from a group of servers. However, if you choose to group information using scripts and analyze data using other methods, HP
Lights-Out XML Scripting is an alternative way to collect the same power consumption data that HP SIM can provide.
Using HP Lights-Out XML Scripting to gather power consumption information for HP BladeSystem p-Class servers requires
making two requests to iLO. One request identifies the power supplies in each HP BladeSystem p-Class Enclosure. The second
request obtains detailed power enclosure information. Each request must be executed in sequence to determine the
approximate power used by each power supply and the total power used in the rack.
NOTE
Both requests return information in an XML format as shown in Figures 2-1 and 2-2.
4
ISS Technology Update Volume 6, Number 7
How to make a request for power supply information
To return topology information about the respective enclosure where iLO is located:
1. Execute the first request:
http://<ilo_ip_address_or_dns_name>/xmldata?item=all
2. Once the request completes, examine the output to identify the power supplies in the topology:
• Look for a PROD_ID of 0x0003 or 0x0005 in the output (see the yellow highlight in Figure 2-1).
• Use the ICMB address located next to the PROD_ID as an input into the second request template (see the “How to make
a request for power enclosure information” section).
Figure 2-1. Sample output from the first request
<?xml version="1.0" ?>
<RIMP>
<HSI>
<SPN>ProLiant BL35p G1</SPN>
<SBSN>M00SNC2146</SBSN>
<UUID />
</HSI>
<MP>
<ST>1</ST>
<PN>Integrated Lights-Out (iLO)</PN>
<FWRI>1.91</FWRI>
<BBLK>3; Oct 2 2006</BBLK>
<HWRI>ASIC: 2</HWRI>
<SN>ILOM00SNC2146</SN>
<UUID>ILO</UUID>
</MP>
<INFRA>
<RACK>TestMyRack</RACK>
<ENCL>CPQEnclosure222</ENCL>
<ICMB_ADDR>A6BB</ICMB_ADDR>
<ENCL_SN>SERIAL0004</ENCL_SN>
<UUID>07SERIAL0004</UUID>
<MAX_NUMBER_SLOTS_X>8</MAX_NUMBER_SLOTS_X>
<MAX_NUMBER_SLOTS_Y>2</MAX_NUMBER_SLOTS_Y>
<BLADE CNT="1">
<SLOT>2</SLOT>
<NUM_SLOTS_X>1</NUM_SLOTS_X>
<NUM_SLOTS_Y>1</NUM_SLOTS_Y>
<HMM>119</HMM>
<WMM>43</WMM>
<DMM>477</DMM>
<BSN>M00SNC2146</BSN>
<UUID />
</BLADE>
</INFRA>
<RK_TPLGY CNT="6">
<RUID>D232KJP3D008</RUID>
<ICMB ADDR="A6BB" MFG="232" PROD_ID="0x0007" SER="SERIAL0004" UUID="07SERIAL0004">
<LEFT ADDR="CCE1" SER="SERIAL0001" UUID="07SERIAL0001" />
<RIGHT />
</ICMB>
<ICMB ADDR="54BC" MFG="232" PROD_ID="0x0003" SER="D303JTK5D103">
<LEFT ADDR="AA5E" SER="D242JTK7D021" />
<RIGHT ADDR="CCE1" SER="SERIAL0001" UUID="07SERIAL0001" />
</ICMB>
<ICMB ADDR="CEA" MFG="232" PROD_ID="0x0002" SER="D230JTK7D008">
<LEFT ADDR="4CBB" SER="D232KJP3D008" />
<RIGHT ADDR="AA5E" SER="D242JTK7D021" />
5
ISS Technology Update Volume 6, Number 7
</ICMB>
<ICMB ADDR="AA5E" MFG="232" PROD_ID="0x0002" SER="D242JTK7D021">
<LEFT ADDR="CEA" SER="D230JTK7D008" />
<RIGHT ADDR="54BC" SER="D303JTK5D103" />
</ICMB>
<ICMB ADDR="CCE1" MFG="232" PROD_ID="0x0007" SER="SERIAL0001" UUID="07SERIAL0001">
<LEFT ADDR="54BC" SER="D303JTK5D103" />
<RIGHT ADDR="A6BB" SER="SERIAL0004" UUID="07SERIAL0004" />
</ICMB>
<ICMB ADDR="4CBB" MFG="232" PROD_ID="0x0003" SER="D232KJP3D008">
<LEFT />
<RIGHT ADDR="CEA" SER="D230JTK7D008" />
</ICMB>
</RK_TPLGY>
</RIMP>
How to make a request for power enclosure information
an gather power enclosure information by Using the ICMB address information collected from the first request output, you c
executing a second request. A template for the second request is as follows:
http://<ilo_ip_address_or_dns_name>/xmldata?item=icmb&addr=<addr>
Where <addr> is the ICMB address of the power enclosure to be viewed.
Th in the <powerComponent> tag (see the
e data returned contains information about the current generated by each supply
yellow highlight in Figure 2-2). This value can be used to calculate power produced. The power supplies are 51.4 volt.
Figure 2-2 is an example of the second request output. This request examines the power enclosures for only the first pow
er
supply identified in Figure 2-1.
Figure 2-2. Sample output from the second request
<?xml version="1.0" ?>
<RIMP>
<Enclosure>
<ENCL>D303JTK5D103</ENCL>
<ICMB_ADDR>54BC</ICMB_ADDR>
<ENCL_SN>D303JTK5D103</ENCL_SN>
<UUID>D303JTK5D103</UUID>
<FWRI>2.30</FWRI>
<HWRI>5</HWRI>
<MAX_NUMBER_SLOTS_X>6</MAX_NUMBER_SLOTS_X>
<MAX_NUMBER_SLOTS_Y>1</MAX_NUMBER_SLOTS_Y>
<pwrZone>4</pwrZone>
<uidStatus>On</uidStatus>
<Temperature>33</Temperature>
<TemperatureA>31</TemperatureA>
<TemperatureB>30</TemperatureB>
<RedundancyBits>0000</RedundancyBits>
<LoadBalWire>Not Present</LoadBalWire>
<PowerComponents>
<PowerComponent>
<Location>1</Location>
<FWRI>1.70</FWRI>
<acInput>Good</acInput>
<Current>14.973</Current>
<MaxCurrent>57.000</MaxCurrent>
<InputTemp>26</InputTemp>
<InputTempTrip>35</InputTempTrip>
6
Loading...