HP HSSR-7110, HSSR-8060, HSSR-8200, HSSR-8400 Datasheet
1-441
60 V/0.7 Ohm,
General Purpose, 1 Form A,
Solid State Relay
Technical Data
HSSR-8060
• Telecommunication
Switching Equipment
• Reed Relay Replacement
• 28 Vdc, 24 Vac, 48 Vdc Load
Driver
• Industrial Relay Coil Driver
Description
The HSSR-8060 consists of a
high-voltage circuit, optically
coupled with a light emitting
diode (LED). This device is a
solid-state replacement for singlepole, normally-open (1 Form A)
electromechanical relays used for
general purpose switching of
signals and low-power loads. The
relay turns on (contact closes)
with a minimum input current, IF,
of 5 mA through the input LED.
The relay turns off (contact
opens) with an input voltage, VF,
of 0.8 V or less. The detector
contains a high speed photosensitive FET driver circuit and two
high voltage MOSFETs.
This relay’s logic level input control and very low typical output
on-resistance of 0.4 Ω makes it
suitable for both ac and dc loads.
Connection A, as shown in the
schematic, allows the relay to
switch either ac or dc loads.
Connection B, with the polarity
and pin configuration as indicated
in the schematic, allows the relay
to switch dc loads only. The
advantage of Connection B is that
the on-resistance is significantly
reduced, and the output current
capability increases by a factor of
two.
The electrical and switching characteristics of the HSSR-8060 are
specified from -40°C to +85°C.
Features
• Compact Solid-State
Bidirectional Switch
• Normally-Off Single-Pole
Relay Function (1 Form A)
• 60 V Output Withstand
Voltage in Both Polarities at
25°C
• 0.75/1.5 Amp Current
Ratings (See Schematic for
Connections A & B)
• Low Input Current; CMOS
Compatibility
• Very Low On-resistance:
0.4 Ω Typical at 25°C
• ac/dc Signal and Power
Switching
• Input-to-Output Momentary
Withstand Insulation
Voltage: 2500 Vac, 1 Minute
• 16-kV ESD Immunity: MILSTD-883, Method 3015
• IEEE Surge Withstand
Capability (IEEE STD
472-1974)
• CSA Approved
• UL 508 Approved
Applications
• Programmable Logic
Controllers
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to
prevent damage and/or degradation which may be induced by ESD.
Functional Diagram
TRUTH TABLE
(POSITIVE LOGIC)
LED
ON
OFF
OUTPUT
L
H
H
5965-3575E
1-442
Selection Guide
Maximum Maximum Maximum
6-Pin DIP 4-Pin DIP Maximum ON Output Output Hermetic
(300 Mil) (300 Mil) Speed Resistance Voltage Current Minimum 8-Pin
Single Dual t(ON) R(ON) VO(off) Io(ON) Input Single
Channel Channel msec
Ω V mA Current Channel
Package Package 25
°C25°C25°C25°C mA Packages
HSSR-8400
[1]
0.95 10 400 150 5
HSSR-8060 1.4 0.7 60 750 5
HSSR-8200
[1]
1.5 200 200 40 1
6 1 90 800 5 HSSR-7110
[1]
Note:
1. Technical data are on separate HP publication.
Ordering Information
Specify part number followed by Option Number (if desired).
HSSR-8060#XXX
300 = Gull Wing Surface Mount Lead Option
500 = Tape/Reel Package Option (1 k min.)
Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for
information.
Schematic
I
F
V
F
1
2
+
–
6
SWITCH
DRIVER
5
4
1-443
Outline Drawing
6-pin DIP Package (HSSR-8060)
9.40 (0.370)
9.90 (0.390)
PIN
ONE
DOT
HP RXXXX
YYWW
TYPE
NUMBER
DATE CODE
2.16 (0.085)
2.54 (0.100)
2.28 (0.090)
2.80 (0.110)
0.51 (0.020) MIN.
0.45 (0.018)
0.65 (0.025)
4.70 (0.185) MAX.
2.92 (0.115) MIN.
6.10 (0.240)
6.60 (0.260)
0.20 (0.008)
0.33 (0.013)
5° TYP.
7.36 (0.290)
7.88 (0.310)
DIMENSIONS IN MILLIMETERS AND (INCHES).
56
321
1.78 (0.070) MAX.
4
1-444
240
∆T = 115°C, 0.3°C/SEC
0
∆T = 100°C, 1.5°C/SEC
∆T = 145°C, 1°C/SEC
TIME – MINUTES
TEMPERATURE – °C
220
200
180
160
140
120
100
80
60
40
20
0
260
123 456789101112
6-Pin Device Outline Drawing Option #300 (Gull Wing Surface Mount)
Thermal Profile (Option #300)
Regulatory Information
The HSSR-8060 has been
approved by the following
organizations:
UL
Recognized under UL 508,
Component Recognition Program,
Industrial Control Switches, File
E142465.
CSA
Approved under CAN/CSA-C22.2
No. 14-95, Industrial Control
Equipment, File LR 87683.
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
4.19
(0.165)
2.29
(0.090)
2.54
(0.100)
TYP.
0.635 ± 0.130
(0.025 ± 0.005)
9.65 ± 0.25
(0.380 ± 0.010)
7.62 ± 0.25
(0.300 ± 0.010)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
0.20 (0.008)
0.30 (0.013)
1.78
(0.070)
MAX.
9.65 ± 0.25
(0.380 ± 0.010)
6.35 ± 0.25
(0.250 ± 0.010)
DIMENSIONS IN mm (INCHES)
TOLERANCES: xx.xx = 0.01
xx.xxx = 0.001
(unless otherwise specified)
LEAD COPLANARITY
MAXIMUM: 0.102 (0.004)
[3] [5]
1.194 (0.047)
1.778 (0.070)
4.826
(0.190)
TYP.
9.398 (0.370)
9.906 (0.390)
MAX.
PAD LOCATION (FOR REFERENCE ONLY)
0.381 (0.015)
0.635 (0.025)
HP RXXXX
YYWW
TYPE NUMBER
DATE CODE
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