HP EliteDisplay P224 Disassembly Instructions Manual

EL-MF877-00 Page 1
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Monitors and DisplaysExternal Options

Marketing Name / Model
[List multiple models if applicable.]

HP EliteDisplay P224 Monitor
HP EliteDisplay P224 21.5-inch Monitor
HP P224
HSD-0024-Q

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for
the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive
2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on
the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.

Item Description

Notes

Quantity of
items
included in
product

Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)

With a surface greater than 10 sq cm

I/F Board*1, Control Board*1, SPS Board*1

3

Batteries, excluding Li-Ion batteries.

All types including standard alkaline, coin or button
style batteries

0

Li-Ion batteries. Include all Li-Ion batteries if more
than one is provided with the product (such as a
detachable notebook keyboard battery, RTC coin cell,
etc.)

Battery(ies) are attached to the product by (check all
that apply with an “x” inside the “[ ]”):
[ ] screws
[ ] snaps
[ ] adhesive
[ ] other. Explain
NOTE: Add detailed removal procedures including
required tools in the sections 3.1 and 3.2.

0

Mercury-containing components

For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries

0

Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm

Includes background illuminated displays with gas
discharge lamps panel*1

1
Cathode Ray Tubes (CRT)

0

Capacitors / condensers (Containing PCB/PCT)

0

Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height

C605 in SPS board

1
External electrical cables and cords

HDMI cable*1, DP cable*1, VGA cable*1, Power

4

EL-MF877-00 Page 2
Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description

Notes

Quantity of
items
included in
product

cord*1

Gas Discharge Lamps

0

Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)

0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent
chambers, and service stations.

0
Components and waste containing asbestos

0

Components, parts and materials containing
refractory ceramic fibers

0

Components, parts and materials containing
radioactive substances

0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and
materials requiring selective treatment can be removed.

Tool Description

Tool Size (if
applicable)

Screwdriver

2

Slothead screwdriver

1

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment
including the required steps to remove the external enclosure:

1. Push the button of stand to unlock the stand, then pull out the stand form the monitor head.

2. Use screwdriver to separate the RC from the monitor head through the tear down slots which on the bottom side.

3. Remove the adhesive tape on the panel and unlock the back light wire*1 and LVDS*1 from the panel.

4. Disconnect FFC*1 from the interface board.

5. Pull out the control board and privacy board from the mid frame by hand.

6. Remove screws *9 on the panel and mid frame and screw*1 on the usb board.

7. Disconnect FFC from the board

8. Remove the mylar from the SHD

9. Remove screws *7 on the power board and interface board

10. Disconnect the wire to separate power board and interface board

11. Disconnect the LVDS from interface board.

12. Disconnect the wire from power board.