HP Elite Display E240e Disassembly Instructions Manual

Product End-of-Life Disassembly Instructions
Product Category: Monitors and Displays
Marketing Name / Model [List multiple models if applicable.]
1.0 Items Requiring Selective Treatment
Item Description
Notes
Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
With a surface greater than 10 sq cm
4
Batteries
All types including standard alkaline and lithium coin or button style batteries
0
Mercury-containing components
For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm
Includes background illuminated displays with gas discharge lamps
1 Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
25
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height
1 External electrical cables and cords
4
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)
0 Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent chambers, and service stations.
0 Components and waste containing asbestos
0
Components, parts and materials containing refractory ceramic fibers
0
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
EL-MF877-00 Page 1 Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
Tool Description
Tool Size (if applicable)
Description #1 SCREW DRIVER(Plum flower head)
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
and materials requiring selective treatment can be removed.
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Dismantle the hinge assy.
2. Dismantle the back cover of monitor.
3. Dismantle the screws from Mainframe.
4. Pull out the PIN of cables, separate the mainframe and Panel.
5. Dismantle the PCBA screws and disconnect the connecters.
6. Take off board.
7. Dismantle the bezel of monitor.
8.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2 Template Revision B
PSG instructions for this template are available at EL-MF877-01
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