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Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP EliteDesk 705 G3 Small Form Factor Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Quantity
Item Description Notes
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
Batteries All types including standard alkaline and lithium coin
Mercury-containing components For example, mercury in lamps, display backlights,
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
External electrical cables and cords 1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
Components and parts containing toner and ink, Include the cartridges, print heads, tubes, vent
With a surface greater than 10 sq cm 2
or button style batteries
scanner lamps, switches, batteries
Includes background illuminated displays with gas
discharge lamps
Acbel STD 3
of items
included
in product
1
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including liquids, semi-liquids (gel/paste) and toner chambers, and service station s.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description Tool Size (if
applicable)
Screwdriver T-15
Micro shear 170II
Screwdriver PH1
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Loose the screw and remove access panel.(see Figure 1 below)
2.
3.
4.
5.
6. Remo
otate the driver cage form the hook on slide rail.(see Figure 2 below)
R
D
isconnect FIO cables from the MB.(see Figure 3-5 below)
Disconnect SATA cables from the MB.(see Figure 6 below)
isconnect other PSU cables from the MB.(see Figure 7-11 below)
D
ve HDD/ODD from chassis.(see Figure 12-20 below)
7. Remove the heatsink from MB.(see Figure 21-24 below)
Separate the fan from CPU heatsink.（see Figure 25-26 below）
8.
Remove the CPU from the MB.(see Figure 27-28 below)
9.
10. Remove the Memory card from the MB.(see Figure 29 below)
11. Remove the battery from the MB .(see Figure 30 below)
12
Remove M/B from chassis.(see Figure 31-32 below)
.
13
. Remo
ve front panel from chassis.(see Figure 33 below)
14.Remove FIO/Speaker/LED holder from chassis.(see Figure 34-36 below)
15
. Remo
16
. Dis
ve PSU cover.(see Figure 37-43 below)
connect all the cables and remove the Electrolytic Capacitors.(see Figure 44-47 below)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
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Figure1pullthehandleandremoveaccesspanel Figure2Rotatethedrivercagefromthehook
Figure 3 Disconnect FIO Audio cables from MB Figure 4 Disconnect FIO USB3.0 cables from MB
Figure 5 Disconnect FIO USB2.0 cables from MB Figure 6 Disconnect SATA cables from the MB
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ure 8 Disconnect ODD/HDD PSU cables from the MB
Figure 7 Disconnect Speaker cable from the MB
Figure 9 Disconnect MB PSU cable from the MB Figure 10 Disconnect other PSU cables from the MB
Fig
Figure 11 Disconnect CPU Power cable from the MB
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Fig
ure 12 Disconnect HDD Power cable from HDD
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Figure 13 Disconnect SATA cable from HDD
Figure 15 Press the HDD’s latch on HDD cage Figure 16 Remove the HDD from HDD cage
Figure 14 Remove the cables from the chassis clip
Figure 17 Disconnect ODD power cable from ODD
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Figure 18 Disconnect SATA cable from ODD
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Figure 19 Press the ODD’s latch on ODD cage
Figure 21 Rotate the Fan duct 01 and remove it
Figure 20 Remove the ODD from ODD cage
Figure 22 press the ho ok and remove fan duct 02
Figure 23 Disconnect heat sink fan cable from MB
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Figure 24 Loose the screws and remove heat sink
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Figure 25 Loose the screws and remove the fan
Figure 27 Rotate the handle and open it up
Figure 26 Separate the fan from CPU heat sink
Figure 28 Remove the CPU from the board
Figure 29 Remove the Memory card from the board Figure 30 Remove the battery from the system board
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Figure 31 Loose the screws of MB from board
Figure 33 Remove front panel from chassis
Figure 32 Remove MB from chassis
Figure 34 Loose the screws of FIO and remove it
Figure 35 Loose the screws of speaker and remove it
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Figure 36 Remove the holder of LED power cable from
chassis
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Figure 37 Remove the screws on the PSU chassis
Figure 39 Remove the Power supply from chassis
Figure 38 Press the PSU’s latch on chassis
Figure 40 Remove screw for top
Figure 41 Remove the screw form the bottom
Figure 42
Release screw of Fan and remove the fan from case
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Figure 43 Remove the screw and open case Figure 44 Disconnect the cable-wire from product
Figure 45 Remove the thin-film plastic sheet. Figure 46 Unscrew and re move PCB from case
Figure 47 Remove cap from PCB.
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Template Revision B
PSG instructions for this template are available at EL-MF877-01
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