HP DL380Z Gen8 Virtual Workstation Maintenance and Service Guide

Page 1

HP DL380Z Gen8 Virtual Workstation

Maintenance and Service Guide

bstract

This guide describes identification and maintenance procedures, diagnostic tools, specifications, and requirements for hardware components and software. This guide is for an experienced service technician. HP assumes you are qualified in the servicing of computer equipment, trained in recognizing hazards in products, and are familiar with weight and stability precautions.

Part Number: 768530-001

une 2014

Edition: 1

Page 2

The information contained herein is subject to change without notice. The only warranties for HP products and services are set forth in the express warranty statements accompanying such products and services. Nothing herein should be construed as constituting an additional warranty. HP shall not be liable for technical or editorial errors or omissions contained herein.

Intel® Xeon® is a trademark of Intel Corporation in the U.S. and other countries.

While some of the documentation that supports this product contains the HP Proliant and the DL380p Gen8 Server product names, most of the information in those documents is relevant to this workstation product. Since this product is supported on VMware and Citrix operating systems only, information specific to Microsoft Windows and Linux may not apply.

Page 3

Contents

Customer self repair ...................................................................................................................... 5

Parts only warranty service ......................................................................................................................... 5

Illustrated parts catalog ............................................................................................................... 15

Mechanical components ........................................................................................................................... 15

System components ................................................................................................................................. 18

Removal and replacement procedures ........................................................................................... 23

Required tools ......................................................................................................................................... 23

Preparation procedures ............................................................................................................................ 23

Power down the server ................................................................................................................... 23

Extend the server from the rack ........................................................................................................ 24

Remove the server from the rack ...................................................................................................... 25

Access the product rear panel ......................................................................................................... 26

Access the Systems Insight Display ................................................................................................... 27

Release the full-length expansion board retainer ................................................................................ 27

Safety considerations ............................................................................................................................... 28

Preventing electrostatic discharge .................................................................................................... 28

Symbols on equipment ................................................................................................................... 28

Server warnings and cautions ......................................................................................................... 29

Access panel .......................................................................................................................................... 30

Air baffle ............................................................................................................................................... 30

2U rack bezel ......................................................................................................................................... 31

PCIe riser blank ....................................................................................................................................... 32

PCIe riser cage (primary) .......................................................................................................................... 32

PCI riser cage (secondary) ........................................................................................................................ 33

PCIe riser board ...................................................................................................................................... 34

Drive blank ............................................................................................................................................. 35

Hot-plug drive ......................................................................................................................................... 36

Power supply blank ................................................................................................................................. 36

AC power supply .................................................................................................................................... 37

Optical drive .......................................................................................................................................... 37

Power supply backplane .......................................................................................................................... 40

Hot-plug fan ........................................................................................................................................... 41

Fan cage ................................................................................................................................................ 42

FlexibleLOM ........................................................................................................................................... 43

SFF hard drive cage ................................................................................................................................ 45

Systems Insight Display ............................................................................................................................ 45

Front panel assembly ............................................................................................................................... 46

Flash-backed write cache procedures ......................................................................................................... 48

Flash-backed write cache module .................................................................................................... 48

Flash-backed write cache capacitor pack .......................................................................................... 50

Recovering data from the flash-backed write cache ............................................................................ 51

Expansion slot blanks ............................................................................................................................... 52

Expansion boards ................................................................................................................................... 54

Half-length expansion board ........................................................................................................... 54

Full length expansion board ............................................................................................................ 55

Contents 3

Page 4

Heatsink ................................................................................................................................................. 56

Processor ............................................................................................................................................... 58

DIMMs ................................................................................................................................................... 62

System battery ........................................................................................................................................ 63

System board ......................................................................................................................................... 64

150W PCIe power cable option ............................................................................................................... 70

225W PCIe power cable option ............................................................................................................... 70

Chipset SATA cable option ....................................................................................................................... 71

HP Trusted Platform Module ...................................................................................................................... 71

Cabling ..................................................................................................................................... 72

SAS hard drive cabling ............................................................................................................................ 72

Optical drive cabling ............................................................................................................................... 73

FBWC cabling ........................................................................................................................................ 73

Diagnostic tools .......................................................................................................................... 75

Troubleshooting resources ........................................................................................................................ 75

HP ROM-Based Setup Utility ..................................................................................................................... 75

Integrated Management Log ..................................................................................................................... 76

USB support and functionality ................................................................................................................... 76

USB support .................................................................................................................................. 76

Internal USB functionality ................................................................................................................ 76

External USB functionality ............................................................................................................... 76

Component identification ............................................................................................................. 77

Front panel components ........................................................................................................................... 77

Front panel LEDs and buttons .................................................................................................................... 77

Systems Insight Display LEDs ..................................................................................................................... 78

Systems Insight Display LED combinations ................................................................................................... 79

Rear panel components ............................................................................................................................ 80

Rear panel LEDs and buttons ..................................................................................................................... 81

Non-hot-plug PCI riser board slot definitions ................................................................................................ 81

System board components ........................................................................................................................ 83

System maintenance switch ............................................................................................................. 84

NMI functionality ........................................................................................................................... 85

DIMM slot locations ....................................................................................................................... 85

SAS and SATA device numbers ................................................................................................................. 85

Hot-plug drive LED definitions .................................................................................................................... 86

PCI riser cage LED ................................................................................................................................... 86

FBWC module LEDs (P222, P420, P421) ................................................................................................... 87

Hot-plug fans .......................................................................................................................................... 88

Storage and expansion diagram ............................................................................................................... 89

Specifications ............................................................................................................................. 90

Environmental specifications ..................................................................................................................... 90

Mechanical specifications ........................................................................................................................ 90

Power supply specifications ...................................................................................................................... 90

HP 1200W Common Slot Platinum Plus Hot Plug Power Supply (94% efficiency) ................................... 91

Acronyms and abbreviations ........................................................................................................ 92

Documentation feedback ............................................................................................................. 94

Index ......................................................................................................................................... 95

Contents 4

Page 5

Customer self repair

HP products are designed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flexibility in performing defective parts replacement. If during the diagnosis period HP (or HP service providers or service partners) identifies that the repair can be accomplished by the use of a CSR part, HP will ship that part directly to you for replacement. There are two categories of CSR parts:

• Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts,

you will be charged for the travel and labor costs of this service.

• Optional—Parts for which customer self repair is optional. These parts are also designed for customer

self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

NOTE: Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Based on availability and where geography permits, CSR parts will be shipped for next business day delivery. Same day or four-hour delivery may be offered at an additional charge where geography permits. If assistance is required, you can call the HP Technical Support Center and a technician will help you over the telephone. HP specifies in the materials shipped with a replacement CSR part whether a defective part must be returned to HP. In cases where it is required to return the defective part to HP, you must ship the defective part back to HP within a defined period of time, normally five (5) business days. The defective part must be returned with the associated documentation in the provided shipping material. Failure to return the defective part may result in HP billing you for the replacement. With a customer self repair, HP will pay all shipping and part return costs and determine the courier/carrier to be used.

For more information about HP's Customer Self Repair program, contact your local service provider. For the North American program, refer to the HP website (http://www.hp.com/go/selfrepair).

Parts only warranty service

Your HP Limited Warranty may include a parts only warranty service. Under the terms of parts only warranty service, HP will provide replacement parts free of charge.

For parts only warranty service, CSR part replacement is mandatory. If you request HP to replace these parts, you will be charged for the travel and labor costs of this service.

Réparation par le client (CSR)

Les produits HP comportent de nombreuses pièces CSR (Customer Self Repair = réparation par le client) afin de minimiser les délais de réparation et faciliter le remplacement des pièces défectueuses. Si pendant la période de diagnostic, HP (ou ses partenaires ou mainteneurs agréés) détermine que la réparation peut être effectuée à l'aide d'une pièce CSR, HP vous l'envoie directement. Il existe deux catégories de pièces CSR:

Customer self repair 5

Page 6

Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Facultatif - Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

REMARQUE: Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention "Non" dans le Catalogue illustré.

Les pièces CSR sont livrées le jour ouvré suivant, dans la limite des stocks disponibles et selon votre situation géographique. Si votre situation géographique le permet et que vous demandez une livraison le jour même ou dans les 4 heures, celle-ci vous sera facturée. Pour bénéficier d'une assistance téléphonique, appelez le Centre d'assistance technique HP. Dans les documents envoyés avec la pièce de rechange CSR, HP précise s'il est nécessaire de lui retourner la pièce défectueuse. Si c'est le cas, vous devez le faire dans le délai indiqué, généralement cinq (5) jours ouvrés. La pièce et sa documentation doivent être retournées dans l'emballage fourni. Si vous ne retournez pas la pièce défectueuse, HP se réserve le droit de vous facturer les coûts de remplacement. Dans le cas d'une pièce CSR, HP supporte l'ensemble des frais d'expédition et de retour, et détermine la société de courses ou le transporteur à utiliser.

Pour plus d'informations sur le programme CSR de HP, contactez votre Mainteneur Agrée local. Pour plus d'informations sur ce programme en Amérique du Nord, consultez le site Web HP (http://www.hp.com/go/selfrepair).

Service de garantie "pièces seules"

Votre garantie limitée HP peut inclure un service de garantie "pièces seules". Dans ce cas, les pièces de rechange fournies par HP ne sont pas facturées.

Dans le cadre de ce service, la réparation des pièces CSR par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Riparazione da parte del cliente

Per abbreviare i tempi di riparazione e garantire una maggiore flessibilità nella sostituzione di parti difettose, i prodotti HP sono realizzati con numerosi componenti che possono essere riparati direttamente dal cliente (CSR, Customer Self Repair). Se in fase di diagnostica HP (o un centro di servizi o di assistenza HP) identifica il guasto come riparabile mediante un ricambio CSR, HP lo spedirà direttamente al cliente per la sostituzione. Vi sono due categorie di parti CSR:

Obbligatorie – Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

Opzionali – Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

NOTA: alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Catalogo illustrato dei componenti.

Customer self repair 6

Page 7

In base alla disponibilità e alla località geografica, le parti CSR vengono spedite con consegna entro il giorno lavorativo seguente. La consegna nel giorno stesso o entro quattro ore è offerta con un supplemento di costo solo in alcune zone. In caso di necessità si può richiedere l'assistenza telefonica di un addetto del centro di supporto tecnico HP. Nel materiale fornito con una parte di ricambio CSR, HP specifica se il cliente deve restituire dei componenti. Qualora sia richiesta la resa ad HP del componente difettoso, lo si deve spedire ad HP entro un determinato periodo di tempo, generalmente cinque (5) giorni lavorativi. Il componente difettoso deve essere restituito con la documentazione associata nell'imballo di spedizione fornito. La mancata restituzione del componente può comportare la fatturazione del ricambio da parte di HP. Nel caso di riparazione da parte del cliente, HP sostiene tutte le spese di spedizione e resa e sceglie il corriere/vettore da utilizzare.

Per ulteriori informazioni sul programma CSR di HP contattare il centro di assistenza di zona. Per il programma in Nord America fare riferimento al sito Web HP (http://www.hp.com/go/selfrepair).

Servizio di garanzia per i soli componenti

La garanzia limitata HP può includere un servizio di garanzia per i soli componenti. Nei termini di garanzia del servizio per i soli componenti, HP fornirà gratuitamente le parti di ricambio.

Per il servizio di garanzia per i soli componenti è obbligatoria la formula CSR che prevede la riparazione da parte del cliente. Se il cliente invece richiede la sostituzione ad HP, dovrà sostenere le spese di spedizione e di manodopera per il servizio.

Customer Self Repair

HP Produkte enthalten viele CSR-Teile (Customer Self Repair), um Reparaturzeiten zu minimieren und höhere Flexibilität beim Austausch defekter Bauteile zu ermöglichen. Wenn HP (oder ein HP Servicepartner) bei der Diagnose feststellt, dass das Produkt mithilfe eines CSR-Teils repariert werden kann, sendet Ihnen HP dieses Bauteil zum Austausch direkt zu. CSR-Teile werden in zwei Kategorien unterteilt:

Zwingend – Teile, für die das Customer Self Repair-Verfahren zwingend vorgegeben ist. Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

Optional – Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

HINWEIS: Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

CSR-Teile werden abhängig von der Verfügbarkeit und vom Lieferziel am folgenden Geschäftstag geliefert. Für bestimmte Standorte ist eine Lieferung am selben Tag oder innerhalb von vier Stunden gegen einen Aufpreis verfügbar. Wenn Sie Hilfe benötigen, können Sie das HP technische Support Center anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materialien, die mit einem CSR-Ersatzteil geliefert werden, können Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss. Wenn es erforderlich ist, das defekte Teil an HP zurückzuschicken, müssen Sie dies innerhalb eines vorgegebenen Zeitraums tun, in der Regel innerhalb von fünf (5) Geschäftstagen. Das defekte Teil muss mit der zugehörigen Dokumentation in der Verpackung zurückgeschickt werden, die im Lieferumfang enthalten ist. Wenn Sie das

Customer self repair 7

Page 8

defekte Teil nicht zurückschicken, kann HP Ihnen das Ersatzteil in Rechnung stellen. Im Falle von Customer Self Repair kommt HP für alle Kosten für die Lieferung und Rücksendung auf und bestimmt den Kurier-/Frachtdienst.

Weitere Informationen über das HP Customer Self Repair Programm erhalten Sie von Ihrem Servicepartner vor Ort. Informationen über das CSR-Programm in Nordamerika finden Sie auf der HP Website unter (http://www.hp.com/go/selfrepair).

Parts-only Warranty Service (Garantieservice ausschließlich für Teile)

Ihre HP Garantie umfasst möglicherweise einen Parts-only Warranty Service (Garantieservice ausschließlich für Teile). Gemäß den Bestimmungen des Parts-only Warranty Service stellt HP Ersatzteile kostenlos zur Verfügung.

Für den Parts-only Warranty Service ist das CSR-Verfahren zwingend vorgegeben. Wenn Sie den Austausch dieser Teile von HP vornehmen lassen, werden Ihnen die Anfahrt- und Arbeitskosten für diesen Service berechnet.

Reparaciones del propio cliente

Los productos de HP incluyen muchos componentes que el propio usuario puede reemplazar (Customer Self Repair, CSR) para minimizar el tiempo de reparación y ofrecer una mayor flexibilidad a la hora de realizar sustituciones de componentes defectuosos. Si, durante la fase de diagnóstico, HP (o los proveedores o socios de servicio de HP) identifica que una reparación puede llevarse a cabo mediante el uso de un componente CSR, HP le enviará dicho componente directamente para que realice su sustitución. Los componentes CSR se clasifican en dos categorías:

• Obligatorio: componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a

HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

• Opcional: componentes para los que la reparación por parte del usuario es opcional. Estos

componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

NOTA: Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra "No" en el catálogo ilustrado de componentes.

Según la disponibilidad y la situación geográfica, los componentes CSR se enviarán para que lleguen a su destino al siguiente día laborable. Si la situación geográfica lo permite, se puede solicitar la entrega en el mismo día o en cuatro horas con un coste adicional. Si precisa asistencia técnica, puede llamar al Centro de asistencia técnica de HP y recibirá ayuda telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componentes CSR, HP especificará si los componentes defectuosos deberán devolverse a HP. En aquellos casos en los que sea necesario devolver algún componente a HP, deberá hacerlo en el periodo de tiempo especificado, normalmente cinco días laborables. Los componentes defectuosos deberán devolverse con toda la documentación relacionada y con el embalaje de envío. Si no

Customer self repair 8

Page 9

enviara el componente defectuoso requerido, HP podrá cobrarle por el de sustitución. En el caso de todas sustituciones que lleve a cabo el cliente, HP se hará cargo de todos los gastos de envío y devolución de componentes y escogerá la empresa de transporte que se utilice para dicho servicio.

Para obtener más información acerca del programa de Reparaciones del propio cliente de HP, póngase en contacto con su proveedor de servicios local. Si está interesado en el programa para Norteamérica, visite la página web de HP siguiente (http://www.hp.com/go/selfrepair).

Servicio de garantía exclusivo de componentes

La garantía limitada de HP puede que incluya un servicio de garantía exclusivo de componentes. Según las condiciones de este servicio exclusivo de componentes, HP le facilitará los componentes de repuesto sin cargo adicional alguno.

Para este servicio de garantía exclusivo de componentes, es obligatoria la sustitución de componentes por parte del usuario (CSR). Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Customer Self Repair

Veel onderdelen in HP producten zijn door de klant zelf te repareren, waardoor de reparatieduur tot een minimum beperkt kan blijven en de flexibiliteit in het vervangen van defecte onderdelen groter is. Deze onderdelen worden CSR-onderdelen (Customer Self Repair) genoemd. Als HP (of een HP Service Partner) bij de diagnose vaststelt dat de reparatie kan worden uitgevoerd met een CSR-onderdeel, verzendt HP dat onderdeel rechtstreeks naar u, zodat u het defecte onderdeel daarmee kunt vervangen. Er zijn twee categorieën CSR-onderdelen:

Verplicht: Onderdelen waarvoor reparatie door de klant verplicht is. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

Optioneel: Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

OPMERKING: Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Afhankelijk van de leverbaarheid en de locatie worden CSR-onderdelen verzonden voor levering op de eerstvolgende werkdag. Levering op dezelfde dag of binnen vier uur kan tegen meerkosten worden aangeboden, indien dit mogelijk is gezien de locatie. Indien assistentie gewenst is, belt u een HP Service Partner om via de telefoon technische ondersteuning te ontvangen. HP vermeldt in de documentatie bij het vervangende CSR-onderdeel of het defecte onderdeel aan HP moet worden geretourneerd. Als het defecte onderdeel aan HP moet worden teruggezonden, moet u het defecte onderdeel binnen een bepaalde periode, gewoonlijk vijf (5) werkdagen, retourneren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meegeleverde verpakkingsmateriaal. Als u het defecte onderdeel niet terugzendt, kan HP u voor het vervangende onderdeel kosten in rekening brengen. Bij reparatie door de klant betaalt HP alle verzendkosten voor het vervangende en geretourneerde onderdeel en kiest HP zelf welke koerier/transportonderneming hiervoor wordt gebruikt.

Customer self repair 9

Page 10

Neem contact op met een Service Partner voor meer informatie over het Customer Self Repair programma van HP. Informatie over Service Partners vindt u op de HP website (http://www.hp.com/go/selfrepair).

Garantieservice "Parts Only"

Het is mogelijk dat de HP garantie alleen de garantieservice "Parts Only" omvat. Volgens de bepalingen van de Parts Only garantieservice zal HP kosteloos vervangende onderdelen ter beschikking stellen.

Voor de Parts Only garantieservice is vervanging door CSR-onderdelen verplicht. Als u HP verzoekt deze onderdelen voor u te vervangen, worden u voor deze service reiskosten en arbeidsloon in rekening gebracht.

Reparo feito pelo cliente

Os produtos da HP são projetados com muitas peças para reparo feito pelo cliente (CSR) de modo a minimizar o tempo de reparo e permitir maior flexibilidade na substituição de peças com defeito. Se, durante o período de diagnóstico, a HP (ou fornecedores/parceiros de serviço da HP) concluir que o reparo pode ser efetuado pelo uso de uma peça CSR, a peça de reposição será enviada diretamente ao cliente. Existem duas categorias de peças CSR:

Obrigatória – Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Opcional – Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

OBSERVAÇÃO: Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca "No" (Não), no catálogo de peças ilustrado.

Conforme a disponibilidade e o local geográfico, as peças CSR serão enviadas no primeiro dia útil após o pedido. Onde as condições geográficas permitirem, a entrega no mesmo dia ou em quatro horas pode ser feita mediante uma taxa adicional. Se precisar de auxílio, entre em contato com o Centro de suporte técnico da HP para que um técnico o ajude por telefone. A HP especifica nos materiais fornecidos com a peça CSR de reposição se a peça com defeito deve ser devolvida à HP. Nos casos em que isso for necessário, é preciso enviar a peça com defeito à HP dentro do período determinado, normalmente cinco (5) dias úteis. A peça com defeito deve ser enviada com a documentação correspondente no material de transporte fornecido. Caso não o faça, a HP poderá cobrar a reposição. Para as peças de reparo feito pelo cliente, a HP paga todas as despesas de transporte e de devolução da peça e determina a transportadora/serviço postal a ser utilizado.

Para obter mais informações sobre o programa de reparo feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o programa norte-americano, visite o site da HP (http://www.hp.com/go/selfrepair).

Customer self repair 10

Page 11

Serviço de garantia apenas para peças

A garantia limitada da HP pode incluir um serviço de garantia apenas para peças. Segundo os termos do serviço de garantia apenas para peças, a HP fornece as peças de reposição sem cobrar nenhuma taxa.

No caso desse serviço, a substituição de peças CSR é obrigatória. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Customer self repair 11

Page 12

Customer self repair 12

Page 13

Customer self repair 13

Page 14

Customer self repair 14

Page 15

Illustrated parts catalog

Mechanical components

Item Description Spare part number Customer self repair

(on page 5)

2 3

ccess panel 662534-001 Mandatory1

Fan cage 662518-001 Mandatory SFF front panel assembly — — a) 8 bay, with cables, left and right ears, no

backplane b) 25 bay, with cables, left and right ears, with backplane* PCI riser cage — —

a) PCI riser cage, standard 662526-001 Mandatory1

b) PCI riser cage, double-wide* 709860-001 Mandatory1

c) PCI riser cage, NEBS* 709859-001 Mandatory1

ir baffle 662527-001 Mandatory1

675602-001 Optional2

696958-001 Optional2

Illustrated parts catalog 15

Page 16

Item Description Spare part number Customer self repair

(on page 5)

7 8

9 10

11 12 13 14

16 17 18 19

* Not shown

charged for the travel and labor costs of this service.

however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Hard drive blank* — — a) Hard drive blank, SFF 667276-001 Mandatory1

b) Hard drive blank, LFF 667279-001 Mandatory1

Heatsink blank* 662522-001 Mandatory

DIMM blank* 716110-001 Mandatory1

Processor cage* 662537-001 Optional

Hardware blank kit* 662519-001 Mandatory1 a) Optical device blank ——

b) Fan blank ——

c) FlexibleLOM blank ——

d) PCI riser cage blank ——

e) Expansion slot blank ——

Power supply blank 699833-001 Mandatory1 2U rack bezel* 662529-001 Mandatory1 Plastic battery holder (12 LFF/25 SFF)* 687957-001 Mandatory1 Miscellaneous hardware kit* 662523-001 Mandatory1 a) Fan bracket, left — —

b) Fan bracket, right — —

c) DVD cable routing guide — —

d) DIMM guard — —

e) Basepan cable retention clip — —

Miscellaneous hardware kit 2* 700383-001 Mandatory1 a) Processor blank air deflector assembly — —

b) Fan bracket, left (12 LFF/25 SFF) — —

c) PCIe riser cage divider — —

Rack mounting hardware ——

Ball bearing rail kit, SFF 662535-001 Mandatory Ball bearing rail kit, LFF 692480-001 Mandatory Friction rail kit* 662536-001 Mandatory Cable management arm (not supported with

675606-001 Mandatory

the friction rail kit)*

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be

Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If,

No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that

Illustrated parts catalog 16

Page 17

Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de

remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Optional: Facultatif—Pièces pour lesquelles la réparation par le client est facultative. Ces pièces sont également conçues pour permettre au client d'effectuer lui-même la réparation. Toutefois, si vous demandez à HP de remplacer ces pièces, l'intervention peut ou non vous être facturée, selon le type de garantie applicable à votre produit.

No: Non—Certaines pièces HP ne sont pas conçues pour permettre au client d'effectuer lui-même la réparation. Pour que la garantie puisse s'appliquer, HP exige que le remplacement de la pièce soit effectué par un Mainteneur Agréé. Ces pièces sont identifiées par la mention “Non” dans le Catalogue illustré.

Mandatory: Obbligatorie—Parti che devono essere necessariamente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedizione e di manodopera per il servizio.

Optional: Opzionali—Parti la cui riparazione da parte del cliente è facoltativa. Si tratta comunque di componenti progettati per questo scopo. Se tuttavia il cliente ne richiede la sostituzione ad HP, potrebbe dover sostenere spese addizionali a seconda del tipo di garanzia previsto per il prodotto.

No: Non CSR—Alcuni componenti HP non sono progettati per la riparazione da parte del cliente. Per rispettare la garanzia, HP richiede che queste parti siano sostituite da un centro di assistenza autorizzato. Tali parti sono identificate da un “No” nel Catalogo illustrato dei componenti.

Mandatory: Zwingend—Teile, die im Rahmen des Customer Self Repair Programms ersetzt werden müssen. Wenn Sie diese Teile von HP ersetzen lassen, werden Ihnen die Versand- und Arbeitskosten für diesen Service berechnet.

Optional: Optional—Teile, für die das Customer Self Repair-Verfahren optional ist. Diese Teile sind auch für Customer Self Repair ausgelegt. Wenn Sie jedoch den Austausch dieser Teile von HP vornehmen lassen möchten, können bei diesem Service je nach den für Ihr Produkt vorgesehenen Garantiebedingungen zusätzliche Kosten anfallen.

No: Kein—Einige Teile sind nicht für Customer Self Repair ausgelegt. Um den Garantieanspruch des Kunden zu erfüllen, muss das Teil von einem HP Servicepartner ersetzt werden. Im illustrierten Teilekatalog sind diese Teile mit „No“ bzw. „Nein“ gekennzeichnet.

Mandatory: Obligatorio—componentes para los que la reparación por parte del usuario es obligatoria. Si solicita a HP que realice la sustitución de estos componentes, tendrá que hacerse cargo de los gastos de desplazamiento y de mano de obra de dicho servicio.

Optional: Opcional— componentes para los que la reparación por parte del usuario es opcional. Estos componentes también están diseñados para que puedan ser reparados por el usuario. Sin embargo, si precisa que HP realice su sustitución, puede o no conllevar costes adicionales, dependiendo del tipo de servicio de garantía correspondiente al producto.

No: No—Algunos componentes no están diseñados para que puedan ser reparados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveedor de servicios autorizado realice la sustitución de estos componentes. Dichos componentes se identifican con la palabra “No” en el catálogo ilustrado de componentes.

Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.

Optional: Optioneel—Onderdelen waarvoor reparatie door de klant optioneel is. Ook deze onderdelen zijn ontworpen voor reparatie door de klant. Als u echter HP verzoekt deze onderdelen voor u te vervangen, kunnen daarvoor extra kosten in rekening worden gebracht, afhankelijk van het type garantieservice voor het product.

No: Nee—Sommige HP onderdelen zijn niet ontwikkeld voor reparatie door de klant. In verband met de garantievoorwaarden moet het onderdeel door een geautoriseerde Service Partner worden vervangen. Deze onderdelen worden in de geïllustreerde onderdelencatalogus aangemerkt met "Nee".

Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Optional: Opcional—Peças cujo reparo feito pelo cliente é opcional. Essas peças também são projetadas para o reparo feito pelo cliente. No entanto, se desejar que a HP as substitua, pode haver ou não a cobrança de taxa adicional, dependendo do tipo de serviço de garantia destinado ao produto.

No: Nenhuma—Algumas peças da HP não são projetadas para o reparo feito pelo cliente. A fim de cumprir a garantia do cliente, a HP exige que um técnico autorizado substitua a peça. Essas peças estão identificadas com a marca “No” (Não), no catálogo de peças ilustrado.

Illustrated parts catalog 17

Page 18

System components

Illustrated parts catalog 18

Page 19

Item Description Spare part number Customer self repair (on

page 5)

System components

26 27

29 30

Hot-plug fan 662520-001 Mandatory1

Power supply, hot-plug — — 1200 W, Platinum Plus, 94%* 660185-001 Mandatory1

Boards

System board assembly — —

System board assembly-IVB 732143-001 Optional2

Riser boards — — a) PCIe riser board, standard 3-slot 662524-001 Optional2

b) PCIe riser board, optional 2-slot* 662525-001 Optional2

Power supply backplane 662528-001 Mandatory1 Systems Insight Display subassembly, LFF, with

cables Systems Insight Display subassembly, SFF, with cables* HP Trusted Platform Module* 505836-001 No3

FlexibleLOM — — a) HP 1GbE 4-port, 331FLR Adapter FIO Kit 634025-001 Mandatory1

b) HP 10GbE 2-port, 530FLR Adapter FIO Kit* 649869-001 Mandatory1

Memory

DIMMs — — a) 8-GB, PC3-14900R, dual-rank x4* 715273-001 Mandatory1

b) 16-GB, PC3-14900R, quad-rank x4* 715274-001 Mandatory1

Processors** — — a) 2.6-GHz Intel Xeon processor E5-2630v2,

80W* b) 2.6-GHz Intel Xeon processor E5-2650v2, 95W* c) 2.5-GHz Intel Xeon processor E5-2670v2, 115W* d) 2.8-GHz Intel Xeon processor E5-2680v2, 115W* e) 2.4-GHz Intel Xeon processor E52695v2, 115W* Drives

Hot-plug SATA — — a) 500-GB, 7,200-rpm, SFF, 6G* 656107-001 Mandatory1

b) 1-TB, 7,200-rpm, SFF, 6G* 656108-001 Mandatory1

Hot-plug SAS* — — a) 300-GB, 10,000-rpm, SFF, 6G, dual port 653955-001 Mandatory1

b) 450-GB, 10,000-rpm, SFF, 6G, dual port 653956-001 Mandatory1

662515-001 Optional2

662516-001 Optional2

730240-001 Optional2

730238-001 Optional2

730236-001 Optional2

730235-001 Optional2

730246-001 Optional2

Illustrated parts catalog 19

Page 20

Item Description Spare part number Customer self repair (on

page 5)

37 38 39 40

48 50 51 52

*Not shown

c) 600-GB, 10,000-rpm, SFF, 6G, dual port 653957-001 Mandatory1

d) 900-GB, 10,000-rpm, SFF, 6G, dual port 653971-001 Mandatory1

e) 72-GB, 15,000-rpm, SFF, 6G, dual port 653949-001 Mandatory1

f) 146-GB, 15,000-rpm, SFF, 6G, dual port 653950-001 Mandatory1

g) 300-GB, 15,000-rpm, SFF, 6G, dual port 653960-001 Mandatory1

h) 500-GB, 7,200-rpm, SFF, 6G, dual port 653953-001 Mandatory1

i) 1-TB, 7,200-rpm, SFF, 6G, dual port 653954-001 Mandatory1

Hot-plug solid state SATA* — — a) 100-GB, SFF, MLC, 3G 653965-001 Mandatory1

b) 200-GB, SFF, MLC, 3G 653966-001 Mandatory1

c) 400-GB, SFF, MLC, 3G 653967-001 Mandatory1

Hot-plug solid state SAS* — — a) 200-GB, SFF, SLC 653961-001 Mandatory1

b) 400-GB, SFF, SLC 653962-001 Mandatory1

c) 400-GB, SFF, MLC 653963-001 Mandatory1

d) 800-GB, SFF, MLC 653964-001 Mandatory1

Optical drives

Optical drive module 675601-001 Mandatory1 Slimline 8x/24x DVD-ROM drive 652294-001 Mandatory1 Slimline 8x DVD+R/RW drive* 652295-001 Mandatory1 Optical drive bracket 532475-001 Mandatory1 Cables

8 or 16 SFF ribbon Mini-SAS storage cable* 675610-001 Mandatory1

8 or 16 SFF Mini-SAS hard drive backplane to

675611-001 Mandatory1 storage card* 8 or 16 SFF drive cage data cable kit* 733719-001 Mandatory1

8 SFF power cable* 675613-001 Mandatory Slim SATA cable* 675614-001 Mandatory

FBWC cable* 681908-001 Mandatory1

——

Batter

System battery, 3.3-V, lithium* 153099-001 Mandatory

Heatsin

——

Standard efficiency heatsink 662522-001 Optional

Controller option ——

FBWC cache module — — 1-GB cache* 633542-001 Optional2

FBWC capacitor pack, with cable 660093-001 Optional

Illustrated parts catalog 20

Page 21

**All processors in this HP ProLiant server must have the same cache size, speed, number of cores, and rated maximum power consumption.

Mandatory—Parts for which customer self repair is mandatory. If you request HP to replace these parts, you will be

charged for the travel and labor costs of this service.

Optional—Parts for which customer self repair is optional. These parts are also designed for customer self repair. If, however, you require that HP replace them for you, there may or may not be additional charges, depending on the type of warranty service designated for your product.

No—Some HP parts are not designed for customer self repair. In order to satisfy the customer warranty, HP requires that an authorized service provider replace the part. These parts are identified as "No" in the Illustrated Parts Catalog.

Mandatory: Obligatoire—Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplacement et main d'œuvre du service vous seront facturés.

Mandatory: Verplicht—Onderdelen waarvoor Customer Self Repair verplicht is. Als u HP verzoekt deze onderdelen te vervangen, komen de reiskosten en het arbeidsloon voor uw rekening.

Illustrated parts catalog 21

Page 22

Mandatory: Obrigatória—Peças cujo reparo feito pelo cliente é obrigatório. Se desejar que a HP substitua essas peças, serão cobradas as despesas de transporte e mão-de-obra do serviço.

Illustrated parts catalog 22

Page 23

Removal and replacement procedures

Required tools

You need the following items for some procedures:

• T-10/T-15 Torx screwdriver

Preparation procedures

To access some components and perform certain service procedures, you must perform one or more of the following procedures:

• Extend the server from the rack (on page 24).

If you are performing service procedures in an HP, Compaq branded, telco, or third-party rack cabinet, you can use the locking feature of the rack rails to support the server and gain access to internal components.

For more information about telco rack solutions, refer to the RackSolutions.com website (http://www.racksolutions.com/hp).

• Power down the server (on page 23).

If you must remove a server from a rack or a non-hot-plug component from a server, power down the server.

• Remove the server from the rack (on page 25).

If the rack environment, cabling configuration, or the server location in the rack creates awkward conditions, remove the server from the rack.

• Access the product rear panel (on page 25).

• Access the Systems Insight Display (on page 27).

• Release the full-length expansion board retainer (on page 27).

Power down the server

Before powering down the server for any upgrade or maintenance procedures, perform a backup of critical server data and programs.

IMPORTANT: When the server is in standby mode, auxiliary power is still being provided to the

To power down the server, use one of the following methods:

• Press and release the Power On/Standby button.

system.

This method initiates a controlled shutdown of applications and the OS before the server enters standby mode.

Removal and replacement procedures 23

Page 24

• Press and hold the Power On/Standby button for more than 4 seconds to force the server to enter

standby mode.

This method forces the server to enter standby mode without properly exiting applications and the OS. If an application stops responding, you can use this method to force a shutdown.

• Use a virtual power button selection through HP iLO.

This method initiates a controlled remote shutdown of applications and the OS before the server enters standby mode.

Before proceeding, verify the server is in standby mode by observing that the system power LED is amber.

Extend the server from the rack

1. Pull down the quick release levers on each side of the server.

2. Extend the server from the rack.

WARNING: To reduce the risk of personal injury or equipment damage, be sure that the rack is

adequately stabilized before extending a component from the rack.

3. After performing the installation or maintenance procedure, slide the server back into the rack, and then

press the server firmly into the rack to secure it in place.

WARNING: To reduce the risk of personal injury, be careful when pressing the server rail-release

latches and sliding the server into the rack. The sliding rails could pinch your fingers.

Removal and replacement procedures 24

Page 25

Remove the server from the rack

To remove the server from an HP, Compaq branded, telco, or third-party rack:

1. Power down the server (on page 23).

2. Extend the server from the rack (on page 24).

3. Disconnect the cabling and remove the server from the rack. For more information, refer to the

documentation that ships with the rack mounting option.

4. Place the server on a sturdy, level surface.

Removal and replacement procedures 25

Page 26

Access the product rear panel

Opening the cable management arm

IMPORTANT: The cable management arm is not supported with the friction rail kit.

To access the server rear panel:

1. Release the cable management arm.

2. Open the cable management arm. Note that the cable management arm can be right-mounted or

left-mounted.

Removal and replacement procedures 26

Page 27

Access the Systems Insight Display

To access the HP Systems Insight Display in a server with a LFF configuration:

1. Press and release the panel.

2. After the display fully ejects, rotate the display downward to view the LEDs.

Release the full-length expansion board retainer

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

Removal and replacement procedures 27

Page 28

5. Release the full-length expansion board retainer.

To replace the component, reverse the removal procedure.

Safety considerations

Preventing electrostatic discharge

Symbols on equipment

Before performing service procedures, review all the safety information.

To prevent damaging the system, be aware of the precautions you need to follow when setting up the system or handling parts. A discharge of static electricity from a finger or other conductor may damage system boards or other static-sensitive devices. This type of damage may reduce the life expectancy of the device.

To prevent electrostatic damage:

• Avoid hand contact by transporting and storing products in static-safe containers.

• Keep electrostatic-sensitive parts in their containers until they arrive at static-free workstations.

• Place parts on a grounded surface before removing them from their containers.

• Avoid touching pins, leads, or circuitry.

• Always be properly grounded when touching a static-sensitive component or assembly.

The following symbols may be placed on equipment to indicate the presence of potentially hazardous conditions.

This symbol indicates the presence of hazardous energy circuits or electric shock hazards. Refer all servicing to qualified personnel.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this

enclosure. Refer all maintenance, upgrades, and servicing to qualified personnel.

Removal and replacement procedures 28

Page 29

This symbol indicates the presence of electric shock hazards. The area contains no user or field serviceable parts. Do not open for any reason.

WARNING: To reduce the risk of injury from electric shock hazards, do not open this

enclosure.

This symbol on an RJ-45 receptacle indicates a network interface connection.

WARNING: To reduce the risk of electric shock, fire, or damage to the equipment, do

not plug telephone or telecommunications connectors into this receptacle.

This symbol indicates the presence of a hot surface or hot component. If this surface is contacted, the potential for injury exists.

WARNING: To reduce the risk of injury from a hot component, allow the surface to

cool before touching.

This symbol indicates that the component exceeds the recommended weight for one individual to handle safely.

WARNING: To reduce the risk of personal injury or damage to the equipment,

observe local occupational health and safety requirements and guidelines for manual material handling.

27.66 kg

61.0 lb

These symbols, on power supplies or systems, indicate that the equipment is supplied by multiple sources of power.

WARNING: To reduce the risk of injury from electric shock, remove all power cords

to completely disconnect power from the system.

Server warnings and cautions

Before installing a server, be sure that you understand the following warnings and cautions.

WARNING: To reduce the risk of electric shock or damage to the equipment:

• Do not disable the power cord grounding plug. The grounding plug is an important safety

feature.

• Plug the power cord into a grounded (earthed) electrical outlet that is easily accessible at all

times.

• Unplug the power cord from the power supply to disconnect power to the equipment.

• Do not route the power cord where it can be walked on or pinched by items placed against it.

Pay particular attention to the plug, electrical outlet, and the point where the cord extends from the server.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: Do not operate the server for long periods with the access panel open or removed.

Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

Removal and replacement procedures 29

Page 30

Access panel

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

To remove the component:

1. Power down the server (on page 23).

2. Extend the server from the rack (on page 24).

To replace the component:

1. Place the access panel on top of the server with the hood latch open. Allow the panel to extend past the

2. Push down on the hood latch. The access panel slides to a closed position.

3. Tighten the security screw on the hood latch.

internal system components to cool before touching them.

CAUTION: Do not operate the server for long periods with the access panel open or removed.

Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

Open or unlock the locking latch, slide the access panel to the rear of the chassis, and remove the access panel.

rear of the server approximately 1.25 cm (0.5 in).

Air baffle

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

5. If any full-length expansion boards are installed, do one of the following:

o Remove the primary PCIe riser cage ("PCIe riser cage (primary)" on page 32) o Remove the secondary PCIe riser cage ("PCIe riser cage (secondary)" on page 33)

CAUTION: For proper cooling, do not operate the server without the access panel, baffles,

expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.

IMPORTANT: It is necessary to remove the PCI riser cage only if there is a full-length expansion

board installed.

Removal and replacement procedures 30

Page 31

6. Remove the air baffle.

To replace the component, reverse the removal procedure.

2U rack bezel

To remove the component:

Unlock the 2U rack bezel, press the latch on the 2U rack bezel, and then remove the 2U rack bezel.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 31

Page 32

PCIe riser blank

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

4. Remove the access panel ("Access panel" on page 29).

5. Remove the PCIe riser blank.

all PCI slots have either an expansion slot cover or an expansion board installed.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

page 25) the server from the rack.

To replace the component, reverse the removal procedure.

PCIe riser cage (primary)

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

circuitry remain active until AC power is removed.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

Removal and replacement procedures 32

Page 33

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

5. Disconnect any external cables that are connected to the expansion board.

6. Disconnect any internal cables that are connected to the expansion board.

7. If any full-length expansion boards are installed, release the full-length expansion board retainer (on

page 27).

8. Remove the PCIe riser cage.

To replace the component, reverse the removal procedure.

PCI riser cage (secondary)

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

4. Remove the access panel ("Access panel" on page 29).

5. Disconnect any external cables that are connected to the expansion board.

circuitry remain active until AC power is removed.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

page 25) the server from the rack.

6. Disconnect any internal cables that are connected to the expansion board.

Removal and replacement procedures 33

Page 34

7. If any full-length expansion boards are installed, release the full-length expansion board retainer (on

page 27).

8. Remove the secondary PCI riser cage.

IMPORTANT: Component appearance may vary.

To replace the component, reverse the removal procedure.

PCIe riser board

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

5. If any full-length expansion boards are installed, release the full-length expansion board retainer (on

page 27).

6. Remove the PCIe riser cage ("PCIe riser cage (primary)" on page 32).

7. Remove any expansion boards from the PCIe riser cage ("Expansion boards" on page 53).

Removal and replacement procedures 34

Page 35

8. Remove the PCIe riser board.

To replace the component, reverse the removal procedure.

Drive blank

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

Remove the drive blank.

To replace the component, slide the component into the bay until it clicks.

all bays are populated with either a component or a blank.

Removal and replacement procedures 35

Page 36

Hot-plug drive

CAUTION: For proper cooling, do not operate the server without the access panel, baffles,

expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize

1. Determine the status of the drive from the hot-plug drive LED definitions (on page 86).

2. Back up all server data on the drive.

3. Remove the drive.

To replace the component, reverse the removal procedure.

the amount of time the access panel is open.

Power supply blank

Remove the blank.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 36

Page 37

AC power supply

CAUTION: To prevent improper cooling and thermal damage, do not operate the server unless

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

3. Access the product rear panel (on page 25).

4. Remove the power supply.

all bays are populated with either a component or a blank.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

WARNING: To reduce the risk of personal injury from hot surfaces, allow the power supply or

power supply blank to cool before touching it.

To replace the component, reverse the removal procedure.

Optical drive

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

5. Remove the air baffle ("Air baffle" on page 30).

6. Remove the fan cage ("Fan cage" on page 42).

Removal and replacement procedures 37

Page 38

7. Disconnect the optical drive cable.

8. Remove the optical drive.

Removal and replacement procedures 38

Page 39

9. Remove the optical drive bracket, for use with the replacement optical drive.

10. Before replacing the component, install the optical drive bracket, retained from the optical drive you are

replacing.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 39

Page 40

Power supply backplane

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Remove all power supplies ("AC power supply" on page 36).

4. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

5. Remove the access panel ("Access panel" on page 29).

6. Disconnect the SATA cable.

7. Remove the power supply backplane.

Removal and replacement procedures 40

Page 41

To replace the component, reverse the removal procedure.

Hot-plug fan

The server supports variable fan speeds. The fans operate at minimum speed until a temperature change requires a fan speed increase to cool the server.

The server shuts down in the following temperature-related scenarios:

• At POST:

o The BIOS suspends the server for 5 minutes if it detects a cautionary temperature level. If the

cautionary temperature level is still detected after 5 minutes, the BIOS performs an orderly shutdown and enters Standby mode.

o The BIOS performs an orderly shutdown if two or more fans have failed. o The server performs an immediate shutdown if it detects a critical temperature level.

IMPORTANT: An immediate shutdown is a hardware-controlled function and it overrides any

• In the operating system:

firmware or software actions.

o The Health Driver performs an orderly shutdown if it detects a cautionary temperature level. If the

server detects a critical temperature level before the orderly shutdown occurs, the server performs an immediate shutdown. Additionally, the Health Driver performs an orderly shutdown if more than one fan is failed or removed.

o When Thermal Shutdown is disabled in RBSU, the server performs an immediate shutdown if it

detects a critical temperature level.

IMPORTANT: An immediate shutdown is a hardware-controlled function and it overrides any

firmware or software actions.

To remove the component:

1. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

2. Remove the access panel ("Access panel" on page 29).

Removal and replacement procedures 41

Page 42

3. Remove the fan.

To replace the component, reverse the removal procedure.

Fan cage

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

5. Remove the air baffle ("Air baffle" on page 30).

CAUTION: Do not operate the server for long periods with the access panel open or removed.

Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

Removal and replacement procedures 42

Page 43

6. Remove the fan cage.

CAUTION: Do not operate the server for long periods with the access panel open or removed.

Operating the server in this manner results in improper airflow and improper cooling that can lead to thermal damage.

IMPORTANT: For optimum cooling, install fans in all primary fan locations. For more

information, refer to the fan locations table ("Hot-plug fans" on page 88).

To replace the component, reverse the removal procedure.

FlexibleLOM

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal

1. Power down the server (on page 23).

2. Remove all power:

circuitry remain active until AC power is removed.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Remove any attached network cables.

4. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

5. Remove the access panel ("Access panel" on page 29).

6. Remove the primary PCIe riser cage ("PCIe riser cage (primary)" on page 32).

7. Loosen the thumbscrew.

8. Remove the existing FlexibleLOM.

Removal and replacement procedures 43

Page 44

Pull the FlexibleLOM toward the front of the server while removing it, to avoid catching it on the rear chassis.

To replace the component:

1. Firmly seat the FlexibleLOM in the slot, and then tighten the thumbscrew.

2. Install the PCIe riser cage ("PCIe riser cage (primary)" on page 32).

3. Install the access panel ("Access panel" on page 29).

4. Slide the server into the rack.

5. Connect the LAN segment cables.

6. Connect each power cord to the server.

7. Connect each power cord to the power source.

8. Power up the server.

Removal and replacement procedures 44

Page 45

SFF hard drive cage

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

5. Remove all hot-plug hard drives ("Hot-plug drive" on page 35).

6. Remove the air baffle ("Air baffle" on page 30).

7. Remove the fan cage ("Fan cage" on page 42).

8. Disconnect all cables from the hard drive backplane.

9. Remove the hard drive cage.

To replace the component, reverse the removal procedure.

Systems Insight Display

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

Removal and replacement procedures 45

Page 46

5. Remove the air baffle ("Air baffle" on page 30).

6. Remove the fan cage ("Fan cage" on page 42).

7. Remove the Systems Insight Display:

a. Remove the screw from the rear of the Systems Insight Display. b. Disconnect the Systems Insight Display cable and the USB cable from the system board, and

disconnect the USB cable from the front of the Systems Insight Display.

c. Remove the Systems Insight Display.

To replace the component, reverse the removal procedure.

Front panel assembly

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Remove the server from the rack (on page 25).

4. Remove the access panel ("Access panel" on page 29).

Removal and replacement procedures 46

Page 47

5. Remove the serial label pull tab (if it is an 8 LFF, 8 SFF, or 16 SFF configuration), and retain it for the new

front panel assembly.

6. Remove the air baffle ("Air baffle" on page 30).

7. Remove all drives ("Hot-plug drive" on page 35).

8. If installed, remove the optical drive ("Optical drive" on page 37).

9. Remove the fan cage ("Fan cage" on page 42).

10. Disconnect all cables from the front panel assembly.

IMPORTANT: If any cables in the front panel assembly need replacing, the entire front panel

assembly must be replaced.

11. Remove the four T-10 Torx screws from each side, and then remove the front panel assembly.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 47

Page 48

Flash-backed write cache procedures

Two types of procedures are provided for the FBWC option:

• Removal and replacement of failed components:

o Removing the cache module ("Flash-backed write cache module" on page 48) o Removing the capacitor pack ("Flash-backed write cache capacitor pack" on page 49)

• Recovery of cached data from a failed server ("Recovering data from the flash-backed write cache" on

page 51)

CAUTION: Do not detach the cable that connects the battery pack or capacitor pack to the cache

Flash-backed write cache module

To remove the component:

1. Back up all data.

module. Detaching the cable causes all data in the cache module to be lost.

CAUTION: The cache module connector does not use the industry-standard DDR3 mini-DIMMs.

Do not use the controller with cache modules designed for other controller models, because the controller can malfunction and you can lose data. Also, do not transfer this cache module to an unsupported controller model, because you can lose data.

2. Close all applications.

3. Power down the server (on page 23).

4. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

CAUTION: In systems that use external data storage, be sure that the server is the first unit to be

powered down and the last to be powered back up. Taking this precaution ensures that the system

5. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

does not erroneously mark the drives as failed when the server is powered up.

page 25) the server from the rack.

6. Remove the access panel ("Access panel" on page 29).

7. If it is populated with expansion boards, remove the PCIe riser cage for better access ("PCIe riser cage

(primary)" on page 32).

8. If the existing cache module is connected to a capacitor pack, observe the FBWC module LEDs:

o If the amber LED is flashing, data is trapped in the cache. Restore system power, and restart this

procedure from step 1.

o If the amber LED is not illuminated, remove the controller from the server, and then continue with the

next step.

Removal and replacement procedures 48

Page 49

9. Open the ejector latches on each side of the cache module connector. Normally, the cache module is

ejected from the cache module connector. If the module is not ejected automatically, remove the cache module.

10. If the cache module is connected to a capacitor pack, disconnect the capacitor pack cable from the

connector on the top of the cache module.

To replace the component, reverse the removal procedure.

CAUTION: To prevent damage to the cache module during installation, be sure the cache

module is fully inserted before pressing down.

Removal and replacement procedures 49

Page 50

Flash-backed write cache capacitor pack

To remove the component:

1. Back up all data.

2. Close all applications.

3. Power down the server (on page 23).

4. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

CAUTION: In systems that use external data storage, be sure that the server is the first unit to be

powered down and the last to be powered back up. Taking this precaution ensures that the system

5. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

6. Remove the access panel ("Access panel" on page 29).

7. If it is populated with expansion boards, remove the PCIe riser cage for better access ("PCIe riser cage

does not erroneously mark the drives as failed when the server is powered up.

page 25) the server from the rack.

(primary)" on page 32).

8. If the capacitor pack is connected to the cache module, disconnect the capacitor pack cable from the

connector on the top of the cache module.

9. Disconnect the SAS hard drive backplane ribbon cable, and then remove the right fan bracket.

10. Remove the capacitor pack

Removal and replacement procedures 50

Page 51

o 8 or 16 drive SFF

o Secondary location for 12 drive LFF or 25 drive SFF

To replace the component, reverse the removal procedure.

Recovering data from the flash-backed write cache

If the server fails, use the following procedure to recover data temporarily stored in the FBWC.

CAUTION: Before starting this procedure, read the information about protecting against

1. Perform one of the following:

electrostatic discharge ("Preventing electrostatic discharge" on page 28).

o Set up a recovery server using an identical server model. Do not install any internal drives or FBWC

in this server. (HP recommends this option.)

Removal and replacement procedures 51

Page 52

o Find a server that has enough empty drive bays to accommodate all the drives from the failed server

and that meets all the other requirements for drive and array migration.

2. Power down the failed server ("Power down the server" on page 23).

3. Transfer the drives from the failed server to the recovery server.

4. Perform one of the following:

o If the array controller has failed, remove the cache module and capacitor pack from the failed array

controller, and install the cache module and capacitor pack on an identical array controller model in the recovery server.

o If the server has failed, remove the controller ("Half-length expansion board" on page 54), cache

module, and capacitor pack from the failed server, and install the controller, cache module, and capacitor pack in the recovery server.

5. Power up the recovery server. If there was data in the cache at the time of the controller or server failure,

a 1792 POST message appears, stating that valid data was flushed from the cache. This data is now stored on the drives in the recovery server. You can now transfer the drives (and controller, if one is used) to another server.

If the drives are migrated to different drive positions or there are volumes present in the recovery server, a 1724 POST message appears, stating that logical drive configuration has been updated automatically.

Expansion slot blanks

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

4. Remove the access panel ("Access panel" on page 29).

5. Disconnect any external cables that are connected to the expansion board.

6. Disconnect any internal cables that are connected to the expansion board.

circuitry remain active until AC power is removed.

CAUTION: For proper cooling, do not operate the server without the access panel, baffles,

expansion slot covers, or blanks installed. If the server supports hot-plug components, minimize the amount of time the access panel is open.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

page 25) the server from the rack.

7. Remove the PCIe riser cage ("PCIe riser cage (primary)" on page 32).

Removal and replacement procedures 52

Page 53

8. Remove the three torx screws (1) that secure the PCI card cage cover, and then remove the cage cover

(2).

9. Remove the expansion slot blank.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 53

Page 54

Expansion boards

Half-length expansion board

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

4. Remove the access panel ("Access panel" on page 29).

5. Disconnect any external cables that are connected to the expansion board.

6. Disconnect any internal cables that are connected to the expansion board.

7. Remove the PCIe riser cage ("PCIe riser cage (primary)" on page 32).

8. Remove the expansion board.

circuitry remain active until AC power is removed.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

page 25) the server from the rack.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 54

Page 55

Full length expansion board

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

4. Remove the access panel ("Access panel" on page 29).

5. Disconnect any external cables that are connected to the expansion board.

6. Disconnect any internal cables that are connected to the expansion board.

7. Release the full-length expansion board retainer, and then remove the PCIe riser cage.

circuitry remain active until AC power is removed.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

page 25) the server from the rack.

8. Remove the full-length expansion board.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 55

Page 56

Heatsink

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

5. Remove the air baffle ("Air baffle" on page 30).

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the

heatsink is removed from the processor after it has been installed.

CAUTION: To avoid thermal shutdown, all fans must be installed in a dual processor

configuration.

6. Loosen the four captive screws (1), and then remove the heatsink (2).

Removal and replacement procedures 56

Page 57

To replace the component:

1. Remove the thermal interface protective cover from the heatsink.

2. Install the heatsink.

3. Install the air baffle ("Air baffle" on page 30).

4. Install the access panel ("Access panel" on page 29).

5. Slide the server into the rack.

6. Connect each power cord to the server.

7. Connect each power cord to the power source.

8. Power up the server.

Removal and replacement procedures 57

Page 58

Processor

To remove the processor:

1. Power down the server (on page 23).

WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the

internal system components to cool before touching them.

CAUTION: To prevent possible server malfunction and damage to the equipment, multiprocessor

configurations must contain processors with the same part number.

CAUTION: The heatsink thermal interface media is not reusable and must be replaced if the

heatsink is removed from the processor after it has been installed.

CAUTION: To prevent possible server overheating, always populate processor socket 2 with a

processor and a heatsink or a processor socket cover and a heatsink blank.

CAUTION: To avoid thermal shutdown, all fans must be installed in a dual processor

configuration.

IMPORTANT: Processor socket 1 must be populated at all times or the server does not function.

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

5. Remove the air baffle ("Air baffle" on page 30).

6. Remove the heatsink ("Heatsink" on page 55).

Removal and replacement procedures 58

Page 59

7. Open each of the processor locking levers in the order indicated, and then open the processor retaining

bracket.

8. Remove the processor from the processor retaining bracket.

CAUTION: To avoid damage to the processor, do not touch the bottom of the processor,

especially the contact area.

Removal and replacement procedures 59

Page 60

To replace the component:

1. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by

visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To

avoid damage to the system board, do not touch the processor or the processor socket contacts.

2. Close the processor retaining bracket. When the processor is installed properly inside the processor

retaining bracket, the processor retaining bracket clears the flange on the front of the socket.

CAUTION: Do not press down on the processor. Pressing down on the processor may cause

damage to the processor socket and the system board. Press only in the area indicated on the processor retaining bracket.

Removal and replacement procedures 60

Page 61

3. Press and hold the processor retaining bracket in place, and then close each processor locking lever.

Press only in the area indicated on the processor retaining bracket.

4. Clean the old thermal grease from the heatsink with the alcohol swab. Allow the alcohol to evaporate

before continuing.

5. Apply all the grease to the top of the processor in the following pattern to ensure even distribution.

Removal and replacement procedures 61

Page 62

6. Install the heatsink.

7. Install the air baffle ("Air baffle" on page 30).

8. Install the access panel ("Access panel" on page 29).

9. Slide the server into the rack.

10. Connect each power cord to the server.

11. Connect each power cord to the power source.

12. Power up the server.

DIMMs

To identify the DIMMs installed in the server, see "DIMM slot locations (on page 85)."

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

IMPORTANT: This server does not support mixing RDIMMs and UDIMMs. Attempting to mix

these two types causes the server to halt during BIOS initialization.

5. Remove the air baffle ("Air baffle" on page 30).

Removal and replacement procedures 62

Page 63

6. Remove the DIMM.

To replace the component, reverse the removal procedure.

For DIMM configuration information, see the server user guide.

System battery

If the server no longer automatically displays the correct date and time, you may need to replace the battery that provides power to the real-time clock.

WARNING: The computer contains an internal lithium manganese dioxide, a vanadium

pentoxide, or an alkaline battery pack. A risk of fire and burns exists if the battery pack is not properly handled. To reduce the risk of personal injury:

• Do not attempt to recharge the battery.

• Do not expose the battery to temperatures higher than 60°C (140°F).

• Do not disassemble, crush, puncture, short external contacts, or dispose of in fire or water.

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

• Replace only with the spare designated for this product.

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

5. If installed, remove the secondary PCIe riser cage ("PCIe riser cage (secondary)" on page 33).

6. Locate the battery ("System board components" on page 82).

Removal and replacement procedures 63

Page 64

7. Remove the battery.

To replace the component, reverse the removal procedure.

For more information about battery replacement or proper disposal, contact an authorized reseller or an authorized service provider.

System board

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Remove the server from the rack (on page 25).

4. Remove all power supplies ("AC power supply" on page 36).

5. Remove the access panel ("Access panel" on page 29).

6. Remove the air baffle ("Air baffle" on page 30).

7. Remove the PCIe riser cage ("PCIe riser cage (primary)" on page 32).

8. If installed, remove the secondary PCIe riser cage ("PCIe riser cage (secondary)" on page 33).

9. If installed, remove the FBWC capacitor pack ("Flash-backed write cache capacitor pack" on page

49).

10. If installed, remove the cache module ("Flash-backed write cache module" on page 48).

11. Remove the FlexibleLOM ("FlexibleLOM" on page 43).

12. Remove all DIMMs ("DIMMs" on page 62).

13. Remove the fan cage ("Fan cage" on page 42).

14. Remove the power supply backplane ("Power supply backplane" on page 40).

15. Disconnect all cables connected to the system board.

Removal and replacement procedures 64

Page 65

16. Remove the heatsink ("Heatsink" on page 55).

17. Remove the processor ("Processor" on page 57).

18. Remove left and right fan cage brackets.

19. Loosen the system board thumbscrews.

20. Remove the system board, using the handle to lift it out of the chassis.

Removal and replacement procedures 65

Page 66

To replace the component:

1. Install the spare system board.

2. Open each of the processor locking levers in the order indicated, and then open the processor retaining

bracket.

Removal and replacement procedures 66

Page 67

3. Remove the clear processor socket cover. Retain the processor socket cover for future use.

4. Install the processor. Verify that the processor is fully seated in the processor retaining bracket by

visually inspecting the processor installation guides on either side of the processor. THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED.

CAUTION: THE PINS ON THE SYSTEM BOARD ARE VERY FRAGILE AND EASILY DAMAGED. To

avoid damage to the system board, do not touch the processor or the processor socket contacts.

5. Close the processor retaining bracket. When the processor is installed properly inside the processor

retaining bracket, the processor retaining bracket clears the flange on the front of the socket.

Removal and replacement procedures 67

Page 68

CAUTION: Do not press down on the processor. Pressing down on the processor may cause

damage to the processor socket and the system board. Press only in the area indicated on the

6. Press and hold the processor retaining bracket in place, and then close each processor locking lever.

processor retaining bracket.

Press only in the area indicated on the processor retaining bracket.

7. Install the processor socket cover onto the processor socket of the failed system board.

8. Clean the old thermal grease from the heatsink and the top of the processor with the alcohol swab.

Allow the alcohol to evaporate before continuing.

9. Apply all the grease to the top of the processor in the following pattern to ensure even distribution.

Removal and replacement procedures 68

Page 69

10. Install the heatsink.

IMPORTANT: Install all components with the same configuration that was used on the failed

system board.

11. Install all components removed from the failed system board.

12. Install the access panel.

13. Install the power supplies ("AC power supply" on page 36).

14. Power up the server.

After you replace the system board, you must re-enter the server serial number and the product ID.

1. During the server startup sequence, press the F9 key to access RBSU.

2. Select the Advanced Options menu.

3. Select Service Options.

4. Select Serial Number. The following warning appears:

Warning: The serial number should ONLY be modified by qualified service personnel. This value should always match the serial number located on the chassis.

5. Press the Enter key to clear the warning.

6. Enter the serial number and press the Enter key.

7. Select Product ID. The following warning appears:

Warning: The Product ID should ONLY be modified by qualified service personnel. This value should always match the Product ID located on the chassis.

8. Enter the product ID and press the Enter key.

9. Press the Esc key to close the menu.

10. Press the Esc key to exit RBSU.

11. Press the F10 key to confirm exiting RBSU. The server automatically reboots.

Removal and replacement procedures 69

Page 70

150W PCIe power cable option

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal

Disconnect the cable as indicated.

circuitry remain active until AC power is removed.

To replace the component, reverse the removal procedure.

225W PCIe power cable option

WARNING: To reduce the risk of personal injury, electric shock, or damage to the equipment,

remove the power cord to remove power from the server. The front panel Power On/Standby button does not completely shut off system power. Portions of the power supply and some internal

Disconnect the cable as indicated.

circuitry remain active until AC power is removed.

To replace the component, reverse the removal procedure.

Removal and replacement procedures 70

Page 71

Chipset SATA cable option

To remove the component:

1. Power down the server (on page 23).

2. Remove all power:

a. Disconnect each power cord from the power source. b. Disconnect each power cord from the server.

3. Extend ("Extend the server from the rack" on page 24) or remove ("Remove the server from the rack" on

page 25) the server from the rack.

4. Remove the access panel ("Access panel" on page 29).

5. Remove the air baffle ("Air baffle" on page 30).

6. Remove the fan cage ("Fan cage" on page 42).

7. Disconnect the Chipset SATA cable from the system board and the hard drive backplane and remove

from the cable guide.

To replace the component, reverse the removal procedure.

HP Trusted Platform Module

The TPM is not a customer-removable part.

CAUTION: Any attempt to remove an installed TPM from the system board breaks or disfigures

the TPM security rivet. Upon locating a broken or disfigured rivet on an installed TPM, administrators should consider the system compromised and take appropriate measures to ensure

If you suspect a TPM board failure, leave the TPM installed and remove the system board. Contact an HP authorized service provider for a replacement system board and TPM board.

the integrity of the system data.

Removal and replacement procedures 71

Page 72

Cabling

SAS hard drive cabling

• Hard drive cabling: 8 SFF, 25 SFF, 12 LFF

• Hard drive cabling: 16 SFF (8 SFF, with optional drive cage)

Cabling 72

Page 73

Optical drive cabling

FBWC cabling

• 8 or 16 drive SFF

• PCIe option

Cabling 73

Page 74

Depending on the server configuration, you may need to remove the primary PCI riser cage ("PCIe riser

cage (primary)" on page 32) before cabling to a PCIe expansion board.

Cabling 74

Page 75

Diagnostic tools

Troubleshooting resources

The HP ProLiant Gen8 Troubleshooting Guide, Volume I: Troubleshooting provides procedures for resolving common problems and comprehensive courses of action for fault isolation and identification, issue resolution, and software maintenance on ProLiant servers and server blades. To view the guide, select a language:

• English (http://www.hp.com/support/ProLiant_TSG_v1_en)

• French (http://www.hp.com/support/ProLiant_TSG_v1_fr)

• Spanish (http://www.hp.com/support/ProLiant_TSG_v1_sp)

• German (http://www.hp.com/support/ProLiant_TSG_v1_gr)

• Japanese (http://www.hp.com/support/ProLiant_TSG_v1_jp)

• Simplified Chinese (http://www.hp.com/support/ProLiant_TSG_v1_sc)

The HP ProLiant Gen8 Troubleshooting Guide, Volume II: Error Messages provides a list of error messages and information to assist with interpreting and resolving error messages on ProLiant servers and server blades. To view the guide, select a language:

• English (http://www.hp.com/support/ProLiant_EMG_v1_en)

• French (http://www.hp.com/support/ProLiant_EMG_v1_fr)

• Spanish (http://www.hp.com/support/ProLiant_EMG_v1_sp)

• German (http://www.hp.com/support/ProLiant_EMG_v1_gr)

• Japanese (http://www.hp.com/support/ProLiant_EMG_v1_jp)

• Simplified Chinese (http://www.hp.com/support/ProLiant_EMG_v1_sc)

HP ROM-Based Setup Utility

RBSU is a configuration utility embedded in HP ProLiant servers that performs a wide range of configuration activities that can include the following:

• Configuring system devices and installed options

• Enabling and disabling system features

• Displaying system information

• Selecting the primary boot controller

• Configuring memory options

• Language selection

For more information on RBSU, see the HP ROM-Based Setup Utility User Guide on the Documentation CD or the HP website (http://www.hp.com/support/rbsu).

Diagnostic tools 75

Page 76

Integrated Management Log

The IML records hundreds of events and stores them in an easy-to-view form. The IML timestamps each event with 1-minute granularity.

You can view recorded events in the IML in several ways, including the following:

• From within HP SIM

• From within the HP iLO user interface

USB support and functionality

USB support

HP provides both standard USB 2.0 support and legacy USB 2.0 support. Standard support is provided by the OS through the appropriate USB device drivers. Before the OS loads, HP provides support for USB devices through legacy USB support, which is enabled by default in the system ROM.

Legacy USB support provides USB functionality in environments where USB support is not available normally. Specifically, HP provides legacy USB functionality for the following:

• POST

• RBSU

• Diagnostics

• DOS

Internal USB functionality

• Operating environments which do not provide native USB support

An internal USB connector is available for use with security key devices and USB drive keys. This solution provides for use of a permanent USB key installed in the internal connector, avoiding issues of clearance on the front of the rack and physical access to secure data.

External USB functionality

HP provides external USB support to enable local connection of USB devices for server administration, configuration, and diagnostic procedures.

For additional security, external USB functionality can be disabled through RBSU.

Diagnostic tools 76

Page 77

Component identification

Front panel components

• SFF model (8-drive)

Item Description

1 2 3 4 5

Video connector SATA optical drive bay Drive bays Systems Insight Display USB connectors (2)

Front panel LEDs and buttons

Component identification 77

Page 78

Item Description Status

Power On/Standby button and system power LED

Health LED Solid green = Normal

Solid green = System on Flashing g reen (1 H z/cycl e per se c ) = Perfo r ming po w er on se quence Solid amber = System in standby Off = No power present*

Flashing amber = System degraded Flashing red (1 Hz/cycle per sec) = System critical Fast-flashing red (4 Hz/cycles per sec) = Power fault**

NIC status LED Solid green = Link to network

Flashing green (1 Hz/cycle per sec) = Network active Off = No network activity

UID button/LED Solid blue = Activated

Flashing blue (1 Hz/cycle per sec) = Remote management or firmware upgrade in progress Off = Deactivated

*Facility power is not present, power cord is not attached, no power supplies are installed, power supply failure has occurred, or the power button cable is disconnected. **To identify components in a degraded or critical state, see the Systems Insight Display LEDs ("Systems Insight Display" on page 45), check iLO/BIOS logs, and reference the server troubleshooting guide.

Systems Insight Display LEDs

The HP Systems Insight Display LEDs represent the system board layout. The display enables diagnosis with the access panel installed.

Component identification 78

Page 79

Item Description Status

Power cap Off = System is in standby, or no cap is set.

Solid green = Power cap applied

—

NIC link/activity Off = No link to network. If the power is off,

view the rear panel RJ-45 LEDs for status ("Rear panel LEDs and buttons" on page

81).

Flashing green = Network link and activity Solid green = Network link

MP status Off = AMP modes disabled

Solid green = AMP mode enabled Solid amber = Failover Flashing amber = Invalid configuration

Over temp Off = Normal

Solid amber = High system temperature detected

ll other LEDs Off = Normal

Amber = Failure For more information on the activation of these LEDs, see "Systems Insight Display LED combinations (on page 79)."

Systems Insight Display LED combinations

When the health LED on the front panel illuminates either amber or red, the server is experiencing a health event. Combinations of illuminated Systems Insight Display LEDs, the system power LED, and the health LED indicate system status.

Systems Insight Display LED and color

Processor (amber)

Health LED System power

LED

Red

mber One or more of the following conditions may

Status

exist:

• Processor in socket X has failed.

• Processor X is not installed in the socket.

• Processor X is unsupported.

• ROM detects a failed processor during

POST

Processor (amber)

DIMM (amber) DIMM (amber) Overtemperature (amber)

Overtemperature (amber)

Fan (amber) Fan (amber)

mber Green Processor in socket X is in a pre-failure

condition.

Red Green One or more DIMMs have failed.

mber Green DIMM in slot Xis in a pre-failure condition. mber Green The Health Driver has detected a cautionary

temperature level.

Red

mber Green One fan has failed or has been removed.

Red Green Two or more fans have failed or been

mber The server has detected a hardware critical

temperature level.

removed.

Component identification 79

Page 80

Systems Insight Display LED and color

Power supply (amber)

Health LED System power

LED

Red

mber

Status

• Only one power supply is installed and

that power supply is in standby.

• Power supply fault

• System board fault

Power supply (amber)

mber Green

• Redundant power supply is installed and

only one power supply is functional.

• AC power cord is not plugged into

redundant power supply.

• Redundant power supply fault

• Power supply mismatch at POST or

power supply mismatch through hot-plug addition.

Power cap (off) Power cap (green) Power cap (flashing

amber) Power cap (green)

IMPORTANT: If more than one DIMM slot LED is illuminated, further troubleshooting is required.

— — Flashing green Waiting for power —

— Green Power is available

mber Standby

mber Power cap has been exceeded

Test each bank of DIMMs by removing all other DIMMs. Isolate the failed DIMM by replacing each DIMM in a bank with a known working DIMM.

Rear panel components

Item Description

1 2 3 4 5 6 7 8

PCIe slots 1–3 (top to bottom) PCIe slots 4–6 (top to bottom) Power supply 1 (PS1) PS1 power connector PS2 power connector Power supply 2 (PS2) USB connectors (4) Video connector

Component identification 80

Page 81

9 10

iLO connector Serial connector

FlexibleLOM ports (Shown: 4x1Gb/Optional: 2x10Gb); port 1 on right side

Rear panel LEDs and buttons

Item Description Status

UID LED/button Off = Deactivated

Solid blue = Activated Flashing blue = System being managed remotely

Power supply 2 LED

Power supply 1 LED

Off = System is off or power supply has failed. Solid green = Normal

NIC link LED Off = No network link

Green = Network link

NIC activity LED Off = No network activity

Solid green = Link to network Flashing green = Network activity

Non-hot-plug PCI riser board slot definitions

• Primary riser cage connector, connected to processor 1 or the southbridge

PCIe slot descriptions

1 - FL/FH

2 - HL/FH 3 - HL/FH

• Secondary riser cage connector, connected to processor 2 (Processor 2 must be installed)

---

PCIe2 or PCIe3 x16 (16, 8, 4, 2, 1) PCIe2 x8 (4, 2, 1)*†

Component identification 81

Page 82

PCIe slot descriptions

4 - FL/FH 5 - HL/FH 6 - HL/FH

PCIe2 or PCIe3 x16 (16, 8, 4, 2, 1) PCIe2 or PCIe3 x16 (16, 8, 4, 2, 1)

---

*For PCIe slot power capabilities, riser board installation instructions, and riser cage installation instructions, see the user guide.

†PCIe slot 3 is connected to the southbridge and runs at the Gen2 signaling rate.

Notes:

• "Primary" denotes the riser cage is installed in the primary riser connector.

• "Secondary" denotes the riser cage is installed in the secondary riser connector.

• Slots can generally run at 8 GT/s signaling rate in either PCIe2 or PCIe3 mode, depending on the

capability of the installed processor.

• Installing the riser cages listed in the table above in either the primary or secondary riser connectors

determines the form factor of the PCI cards supported by those riser cages.

• FL/FH denotes full-length, full-height. HL/FH denotes half-length, full-height. LP denotes low profile.

Component identification 82

Page 83

System board components

IMPORTANT: System board appearance and component location may vary.

Item Description

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19

Fan connector 6

Systems Insight Display connector Fan connector 5 Processor 1 DIMM slots Fan connector 4 Front I/O connector Front USB connector Fan connector 3 First drive cage, box 2 power connector Fan connector 2 Processor 2 DIMM slots Second drive cage, box 1 power connector Fan connector 1 Discovery services connector Front video connector USB connector Power supply backplane connector SATA optical drive connector NMI jumper

Component identification 83

Page 84

Item Description

20 21 22 23 24 25 26 27 28 29 30 31 32

System battery SD card slot Secondary (processor 2) PCI riser connector System maintenance switch Processor 2 socket TPM connector Primary (processor 1) PCI riser connector FlexibleLOM SAS connector 1 SAS connector 2 Cache module connector Processor 1 socket RDX power connector

System maintenance switch

Position Default Function

S3 S4 S5

S7 S8 S9 S10 S11 S12

Off Off = HP iLO security is enabled.

On = HP iLO security is disabled.

Off Off = System configuration can be

changed.

On = System configuration is locked. Off Reserved Off Reserved Off Off = Power-on password is enabled.

On = Power-on password is disabled. Off Off = No function

On = ROM reads system configuration

as invalid. — Reserved — Reserved — Reserved — Reserved — Reserved — Reserved

To access the redundant ROM, set S1, S5, and S6 to on.

When the system maintenance switch position 6 is set to the On position, the system is prepared to erase all system configuration settings from both CMOS and NVRAM.

CAUTION: Clearing CMOS and/or NVRAM deletes configuration information. Be sure to

properly configure the server or data loss could occur.

Component identification 84

Page 85

NMI functionality

An NMI crash dump enables administrators to create crash dump files when a system is hung and not responding to traditional debug mechanisms.

Crash dump log analysis is an essential part of diagnosing reliability problems, such as hangs in operating systems, device drivers, and applications. Many crashes freeze a system, and the only available action for administrators is to cycle the system power. Resetting the system erases any information that could support problem analysis, but the NMI feature preserves that information by performing a memory dump before a hard reset.

To force the OS to invoke the NMI handler and generate a crash dump log, the administrator can use the iLO Virtual NMI feature.

For more information, see the white paper on the HP website (http://h20000.www2.hp.com/bc/docs/support/SupportManual/c00797875/c00797875.pdf).

DIMM slot locations

DIMM slots are numbered sequentially (1 through 12) for each processor. The supported AMP modes use the letter assignments for population guidelines.

SAS and SATA device numbers

• SFF 8-device bay numbering

Component identification 85

Page 86

Hot-plug drive LED definitions

Item LED Status Definition

Locate Solid blue The drive is being identified by a host application.

Flashing blue The drive carrier firmware is being updated or requires an update.

ctivity ring Rotating green Drive activity

Off No drive activity

Do not remove Solid white Do not remove the drive. Removing the drive causes one or more of

the logical drives to fail.

Off Removing the drive does not cause a logical drive to fail.

Drive status Solid green The drive is a member of one or more logical drives.

Flashing green The drive is rebuilding or performing a RAID migration, strip size

migration, capacity expansion, or logical drive extension, or is erasing.

Flashing amber/green

Flashing amber The drive is not configured and predicts the drive will fail.

Solid amber The drive has failed.

Off The drive is not configured by a RAID controller.

The drive is a member of one or more logical drives and predicts the drive will fail.

PCI riser cage LED

CAUTION: To prevent damage to the server or expansion boards, power down the server and

remove all AC power cords before removing or installing the PCI riser cage.

Component identification 86

Page 87

Status

On = AC power is connected.

Off = AC power is disconnected.

FBWC module LEDs (P222, P420, P421)

The FBWC module has three single-color LEDs (one amber and two green). The LEDs are duplicated on the reverse side of the cache module to facilitate status viewing.

1 - Amber 2 - Green 3 - Green Interpretation

Off Off

Off

Off Off The cache module is not powered. Flashing 0.5 Hz Flashing 0.5 Hz The cache microcontroller is executing from within its

boot loader and receiving new flash code from the host controller.

Flashing 1 Hz Flashing 1 Hz The cache module is powering up, and the capacitor

pack is charging.

Off Flashing 1 Hz The cache module is idle, and the capacitor pack is

charging.

Component identification 87

Page 88

1 - Amber 2 - Green 3 - Green Interpretation

Off

Off Off Flashing 1 Hz Flashing 1 Hz

Flashing 1 Hz Flashing 2 Hz Flashing 2 Hz

Off On The cache module is idle, and the capacitor pack is

charged.

On On The cache module is idle, the capacitor pack is charged,

and the cache contains data that has not yet been written to the drives.

Flashing 1 Hz Off

backup is in progress. On Off The current backup is complete with no errors. Flashing 1 Hz Off The current backup failed, and data has been lost. Flashing 1 Hz On

power error occurred during the previous or current

boot. Data may be corrupt.

On Off

n overtemperature condition exists. Flashing 2 Hz Off The capacitor pack is not attached. Flashing 2 Hz On The capacitor has been charging for 10 minutes, but

has not reached sufficient charge to perform a full backup.

On Off The current backup is complete, but power fluctuations

occurred during the backup.

On On The cache module microcontroller has failed.

Hot-plug fans

CAUTION: To avoid damage to server components, fan blanks must be installed in fan bays 1

The only two valid fan configurations are listed in the following table.

Configuration Fan bay 1 Fan bay 2 Fan bay 3 Fan bay 4 Fan bay 5 Fan bay 6

1 processor

2 processors

and 2 in a single-processor configuration.

Fan blank Fan blankFan Fan Fan Fan

Fan Fan Fan Fan Fan Fan

Component identification 88

Page 89

For a single-processor configuration, four fans and two blanks are required in specific fan bays for redundancy. A fan failure or missing fan causes a loss of redundancy. A second fan failure or missing fan causes an orderly shutdown of the server.

Installing more than the required number of fans in a single-processor configuration is not a supported configuration.

For a dual-processor configuration, six fans are required for redundancy. A fan failure or missing fan causes a loss of redundancy. A second fan failure or missing fan causes an orderly shutdown of the server.

The server supports variable fan speeds. The fans operate at minimum speed until a temperature change requires a fan speed increase to cool the server. The server shuts down during the following temperature-related scenarios:

• At POST and in the OS, HP iLO performs an orderly shutdown if a cautionary temperature level is

detected. If the server hardware detects a critical temperature level before an orderly shutdown occurs, the server performs an immediate shutdown.

• When the Thermal Shutdown feature is disabled in RBSU, HP iLO does not perform an orderly shutdown

when a cautionary temperature level is detected. Disabling this feature does not disable the server hardware from performing an immediate shutdown when a critical temperature level is detected.

CAUTION: A thermal event can damage server components when the Thermal Shutdown feature

is disabled in RBSU.

Storage and expansion diagram

Component identification 89

Page 90

Specifications

Environmental specifications

Specification Value

Temperature range*

Operating Non-operating

Relative humidity (noncondensing)

Operating

Non-operating

* All temperature ratings shown are for sea level. An altitude derating of 1°C per 304.8 m (1.8°F per 1,000 ft) to 3048 m (10,000 ft) is applicable. No direct sunlight allowed.

— 10°C to 35°C (50°F to 95°F)

-30°C to 60°C (-22°F to 140°F) —

10% to 90% 28°C (82.4°F), maximum wet bulb temperature

5% to 95%

38.7°C (101.7°F), maximum wet bulb temperature

Mechanical specifications

Specification Value

Height Depth, SFF Depth, LFF Width Weight (maximum—all LFF

drives) Weight (minimum—one SFF

drive)

8.73 cm (3.44 in)

69.85 cm (27.54 in)

74.93 cm (29.5 in)

44.54 cm (17.54 in)

27.66 kg (61.0 lb)

18.59 kg (41 lb)

Power supply specifications

For detailed power supply specifications, see the server QuickSpecs on the HP website (http://h18000.www1.hp.com/products/quickspecs/14209_div/14209_div.html).

Specifications 90

Page 91

HP 1200W Common Slot Platinum Plus Hot Plug Power Supply (94% efficiency)

Specification Value

Input requirements

Rated input voltage

Rated input frequency Rated input current

Maximum rated input power

Btus per hour

Power supply output

Rated steady-state power

Maximum peak power

100 to 120 VAC, 200 to 240 VAC

50 Hz to 60 Hz

9.1 A at 100 VAC

6.7 A at 200 VAC 897 W at 100V AC input

1321 W at 200V AC input 3408 at 120V AC input

4433 at 200V to 240V AC input

800 W at 100V AC input 900 W at 120V AC input 1200 W at 200V to 240V AC input

Specifications 91

Page 92

Acronyms and abbreviations

AMP

Advanced Memory Protection

FBWC

flash-backed write cache

FDR

fourteen data rate

FIO

Factory Integrated Option

FLR

FlexibleLOM for rack servers

FLR-SFP

FlexibleLOM for rack servers with an SFP+ connector

HP SIM

HP Systems Insight Manager

iLO

Integrated Lights-Out

IML

Integrated Management Log

LFF

large form factor

NEBS

Network Equipment-Building System

NMI

nonmaskable interrupt

Acronyms and abbreviations 92

Page 93

NVRAM

nonvolatile memory

PCIe

Peripheral Component Interconnect Express

POST

Power-On Self Test

QDR

quad data rate

RBSU

ROM-Based Setup Utility

SAS

serial attached SCSI

SATA

serial ATA

SFF

small form factor

SFP

small form-factor pluggable

TPM

Trusted Platform Module

UID

unit identification

USB

universal serial bus

Acronyms and abbreviations 93

Page 94

Documentation feedback

HP is committed to providing documentation that meets your needs. To help us improve the documentation, send any errors, suggestions, or comments to Documentation Feedback (mailto:docsfeedback@hp.com). Include the document title and part number, version number, or the URL when submitting your feedback.

Documentation feedback 94

Page 95

Index

150W PCIe power cable 70

expansion boards 54, 55 expansion slot blanks 52, 54 extending server from rack 24 external USB functionality 76

AC power supply 37, 91 access panel 30 air baffle 30

battery 63 blue screen event 85 buttons 23, 77

cable management arm 26 cables 72 cabling 72, 73 cautions 29 chipset SATA cable 71 components 15, 77 components, identification 15, 77 connectors 77 crash dump analysis 85 CSR (customer self repair) 5, 15 customer self repair (CSR) 5, 15

data recovery 51 diagnostic tools 75 diagram, storage and expansion 89 DIMM slot locations 85 DIMMs 62, 85 drive LEDs 86 drives 36, 86

electrostatic discharge 28 environmental specifications 90 error messages 75 expansion board retainers 27

fan cage 42 fans 41 FBWC cabling 73 FBWC module 87 FBWC procedures 48, 51 features 77 flash-backed write cache capacitor pack 50 flash-backed write cache module 48 flash-backed write cache procedures 48, 51 FlexibleLOM 43 front panel assembly 46 front panel buttons 77 front panel components 77 front panel LEDs 77 full-length expansion board 27, 55

hard drive bays 77 hard drive blanks 35 hard drive cage 45 hard drive LEDs 86 hard drives, determining status of 86 health LEDs 77 heatsink 56 hot-plug fans 26, 88 HP technical support 5

illustrated parts catalog 15 iLO (Integrated Lights-Out) 76 IML (Integrated Management Log) 76 Integrated Lights-Out (iLO) 76 Integrated Management Log (IML) 76 internal USB functionality 76

Index 95

Page 96

LEDs 79, 86 LEDs, front panel 86 LEDs, hard drive 86 LEDs, SAS hard drive 86 LEDs, troubleshooting 86

maintenance 23 management tools 75 mechanical components 15 mechanical specifications 90 memory dump 85

NMI header 85 non-hot-plug PCI riser board slot definitions 81

operating system crash 85 optical drive 37, 77 optical drive cable 73

rear panel, accessing 26 recovering the data from the cache 51 removal and replacement procedures 23 removing server from rack 25

safety considerations 28 SAS and SATA device numbers 85 spare part numbers 15, 18 specifications 90, 91 specifications, environmental 90 specifications, mechanical 90 specifications, power 90, 91 specifications, server 90 static electricity 28 storage overview 89 switches 85 symbols on equipment 28 system battery 63 system board components 83 system board replacement 64 system components 18, 77 system maintenance switch 84, 85 system power LED 77 Systems Insight Display 45, 78, 79 Systems Insight Display LEDs 78, 79

part numbers 15 PCI riser board definitions 81 PCIe riser blank 32 PCIe riser board 34 PCIe riser cage 32, 33 plastics kit 15 POST error messages 75 power cables 70 power supply 37 power supply backplane 40 power supply blank 36 power supply LEDs 81 power supply specifications 90, 91 powering down 23 preparation procedures 23 processors 58

rack bezel 31 RBSU (ROM-Based Setup Utility) 75 rear panel buttons 81 rear panel components 80 rear panel LEDs 81

technical support 5 tools 23 TPM (Trusted Platform Module) 71 troubleshooting 75

UID LED 85 USB connector 77 USB support 76 utilities 75 utilities, deployment 75

video connector 77

warnings 29

Index 96

HP DL380Z Gen8 Virtual Workstation Maintenance and Service Guide

Specifications and Main Features

Frequently Asked Questions

User Manual