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DL2x170h
Introduction Manual
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Introduction Manual
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HP ProLiant DL160se, DL2x170h, ML150, ProLiant 100 G6 Introduction Manual

HP ProLiant 100-series Intel-based G6 server technology
Technology brief, 3
rd
edition
Abstract.............................................................................................................................................. 3
Introduction......................................................................................................................................... 3
Intel Xeon 5500 Series processor technology .......................................................................................... 3
Multi-level caches............................................................................................................................. 4
QuickPath Interconnect controller ....................................................................................................... 4
Hyper Threading.............................................................................................................................. 5
Turbo Boost technology..................................................................................................................... 5
Intel Xeon 3400 Series processor technology .......................................................................................... 6
Memory.............................................................................................................................................. 8
DDR-3............................................................................................................................................. 8
I/O technologies ............................................................................................................................... 11
PCI Express technology................................................................................................................... 11
HP Smart Array and SAS/SATA technology ...................................................................................... 11
Networking technologies ................................................................................................................ 14
Power and thermal technologies .......................................................................................................... 14
Efficient power delivery................................................................................................................... 14
Improved thermal sensors and fan control ......................................................................................... 16
Phase shedding ............................................................................................................................. 16
Managing processor technologies.................................................................................................... 17
Managing memory technologies ...................................................................................................... 17
Managing I/O technologies............................................................................................................ 18
Power Efficiency Mode ................................................................................................................... 18
Power Performance Benchmarks .......................................................................................................... 18
Security ............................................................................................................................................ 18
Trusted Platform Module.................................................................................................................. 18
BitLocker Drive Encryption ............................................................................................................... 19
Server management and deployment ................................................................................................... 19
Systems management and monitoring...............................................................................................19
Remote management and control ..................................................................................................... 20
IPMI 2.0 and DCMI 1.0.................................................................................................................. 23
Server deployment ......................................................................................................................... 23
OS support ....................................................................................................................................... 23
DL1000 Multi Node server design for scale out computing ..................................................................... 24
Chassis design............................................................................................................................... 24
Fans and fan control....................................................................................................................... 25
Power supply support ..................................................................................................................... 26
Advanced Power Management........................................................................................................ 26
Summary .......................................................................................................................................... 27
For more information.......................................................................................................................... 28
Call to action .................................................................................................................................... 29
Abstract
This technology brief describes the key technologies implemented in Intel-based HP ProLiant 100-series G6 servers. The 100-series family includes the ProLiant DL100-series, the ML100-series, and the DL1000 Multi Node architecture. As of this writing, the Intel-based 100-series G6 servers include the ProLiant DL120, DL160, DL180, ML110, ML150, DL170h, DL2x170h, and DL4x170h. Links to the QuickSpecs for each of these servers are listed in the “For more information” section at the end of this technology brief.
Introduction
HP ProLiant G6 servers have been the focus of extensive engineering and development. Characterized by increased performance, better power efficiency, and more powerful management tools, the servers include these new technologies:
• The Intel® Xeon® Processor 5500 Series
• The Intel Xeon Processor 3400 Series
• Double Data Rate-3 (DDR-3) memory DIMMs
• Thermal sensors incorporated throughout the ProLiant100-series G6 servers
• ProLiant Onboard Administrator Powered by Lights-Out 100i (LO 100i)
• I/O technologies such as PCIe generation 2 (PCIe 2.0) and faster Smart Array controllers that
incorporate common form factor components
• ”Right Size” Common Slot power supplies in multiple sizes to provide the required amount of power
and improve power efficiency
• Management options accessed from the BIOS setup utility that can reduce power and thermal use
by power supplies, I/O, processors, and memory
The technologies discussed in this paper are implemented in all Intel-based ProLiant 100-series G6 servers. Exceptions are noted where different levels of technology implementation or service exist among individual ProLiant 100-series G6 platforms.
For complete specifications of all ProLiant 100-series servers, see the HP website:
www.hp.com/products/servers/platforms
.
Intel Xeon 5500 Series processor technology
Some ProLiant Intel-based 100-series G6 servers contain the Xeon 5500 Series processors. The processors include an integrated memory controller and Intel QuickPath technology to boost bandwidth between processors, memory, and I/O subsystems. Three memory channels from each integrated memory controller to its dedicated memory provide a total bandwidth of 32 gigabytes per second.
The Xeon 5500 Series microarchitecture is built on hafnium-based, 45 nanometer high-k metal gate silicon technology to reduce electrical leakage. These small, energy-efficient, high-performance processors support distributed shared memory, Intel Hyper-Threading technology, and Intel Turbo Boost Technology with Intelligent Power Technology.
1
For additional information about Intel processors, see the HP technology brief titled “The Intel processor roadmap for industry-standard servers”:
http://h20000.www2.hp.com/bc/docs
/support/SupportManual/c00164255/c00164255.pdf.
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Multi-level caches
Xeon 5500 Series processors have a three-level cache hierarchy (Figure 1):
• An on-core, 64-kilobyte, Level 1 cache, split into two 32 kilobyte caches: one for data and one for
instructions
• 256-kilobyte, Level 2 cache for each core to reduce latency
• A Level 3 cache of up to 8 megabytes shared by all cores
Figure 1. Blo
ck diagram of three-level cache hierarchy for Intel Xeon 5500 Series processors
The Level 3 cache is shared and inclusive, which means that it du 1 and Level 2 caches of each core. This guarantees that data is stored outside the cores and minimizes latency by eliminating unnecessary core snoops to the Level 1 and Level 2 caches. Flags in the Level 3 cache track which core’s cache supplied the original data. Therefore, if one core modifies another core’s data in Level 3 cache, the Level 1 and Level 2 caches are updated as well. This eliminates excessive inter-core traffic and ensures multi-level cache coherency.
plicates the data stored in the Level
QuickPath Interconnect controller
Xeon 5500 Series processors attain their performance potential through the Intel QuickPath Architecture (Figure 2); high-speed, point-to-point interconnects directly connect the processors with each other. The Intel QuickPath architecture also connects each processor to distributed shared memory and to the I/O chipset.
Each QuickPath Interconnect consists of two unidirectional links that operate simultaneously in each direction using differential signaling. Unlike a typical serial bus, the QuickPath interconnects transmit data packets in parallel across multiple lanes and packets are broken into multiple parallel transfers.
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Each link is comprised of 20, one-bit lanes. A maximum of 16 bits are used to transfer data; the remaining 4 bits are used for the protocol and error correction. The interconnect performs a maximum of 6.4 gigatransfers per second and has a bandwidth of 12.8-gigabytes per second in each direction, for a total bandwidth of 25.6 gigabytes per second.
If an application requests data from the memory of another processor, the QuickPath interconnect uses high-bandwidth inter-processor communication to retrieve the data.
Figure 2. Bloc
k diagram of QuickPath architecture
Hyper Threading
Simultaneous Multi-threading Technology, or SMT, is an enhanced version of Intel’s Hyper-Threading technology. SMT lets each core execute two computational threads at the same time. A single processor can execute up to eight threads simultaneously. In addition, the high-bandwidth memory subsystem supplies data faster to the two computational processes than traditional front side buses, and the low-latency cache hierarchy allows more instructions to be processed simultaneously. Hyper­Threading improves performance per watt, allowing Intel-based ProLiant G6 servers to accomplish more using the same, or less, power than servers based on previous-generation Intel processors.
Turbo Boost technology
Intel’s Turbo Boost technology complements SMT by increasing the performance of both multi­threaded and single-threaded workloads. For workloads and applications that do not benefit from multi-threading, Turbo Boost technology can provide better performance. Turbo Boost is engaged by default and automatically increases the clock frequency of active cores operating below power and thermal design points determined by the processor. The maximum frequency depends on the number of active cores and varies based on the specific configuration on a per-processor-number basis. Turbo Boost technology is OS independent, and Advanced Configuration and Power Interface (ACPI)
-aware operating systems require no changes to support Turbo Boost technology.
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Intel Xeon 3400 Series processor technology
The Intel Xeon 3400 Series are four core processors used with the Intel 5 series 3400 and 3420 chipsets. The Intel Xeon 3400 series microarchitecture is based on 45 nanometer core technology with an integrated memory controller and PCI Express graphics interface. Xeon 3400 series processors are used in the ProLiant ML110 and DL120 G6 servers.
The Xeon 3400 Series processors and chipsets can accommodate up to three DIMMs per channel with registered DIMMs and up to two DIMMs per channel with unbuffered DIMMs. Figure 3 shows the features available with the Intel 3400 chipset.
Figure 3. Intel X
6 SATA ports
6 SATA ports
12 USB 2.0 ports
12 USB 2.0 ports
eon processor 3400 series and Intel 3400 series chipset architecture
Dual channel DDR3
memory
3 GB/s each
680 Mb/s
PCI 32/33PCI 32/33
Intel Xeon
3400 Series
processor
2 GB/s
Intel Xeon
Intel Xeon
3400 Series
3400 Series
Chipset
Chipset
PCI Express X1
8 GB/s
8 GB/s
bi-directional
bi-directional
8 GB/s
8 GB/s
bi-directional
bi-directional
2 GB/s
2 GB/s
bi-directional
bi-directional
500 MB/s
500 MB/s
500 MB/s
bi-directional
bi-directional
bi-directional
Integrated 10/100/1000 MAC
Integrated 10/100/1000 MAC
8X PCI Express
8X PCI Express
8X PCI Express
8X PCI Express
PCI Express X4 ports
PCI Express X4 ports
2 PCI Express X1 ports
2 PCI Express X1 ports
2 PCI Express X1 ports
2 PCI Express X1 ports
Gigabit
Gigabit
Ethernet
Ethernet
controller
controller
Gigabit Ethernet
Gigabit Ethernet
LAN connection
LAN connection
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The ProLiant ML110 and DL120 G6 servers are single-processor platforms which means that the Xeon 3400 Series processors used in these servers do not support the QuickPath architecture found in the Xeon 5500 Series processors. Otherwise, the Xeon 3400 processors support the same architecture found in the Xeon 5500 processors, including distributed shared memory, Intel Hyper-Threading technology, and Intel Turbo Boost technology with Intelligent Power technology. Table 1 shows the ML110 G6 and DL120 G6 servers’ implementation of Hyper-Threading and Turbo Boost technologies for the various processor frequencies. All processors in the 3400 Series family are quad core, have 8 MB L3 caches, and operate at 95W.
Table 1. Processor technologies supported on the ML110 G6 and DL120 G6 servers
Intel Xeon Processor
Processor 3430 2.40
Processor 3440 2.53
Processor 3450 2.66
Processor 3460 2.80
Processor 3470 2.93
CPU Frequency
GHz
GHz
GHz
GHz
GHz
Supported ML and DL G6 platforms
ML110 No n=1 n=1 n=2 n=3
DL120 No n=1 n=1 n=2 n=3
ML110 Yes n=1 n=1 n=2 n=3
DL120 Yes n=1 n=1 n=2 n=3
ML110 Yes n=1 n=1 n=4 n=4
DL120 Yes n=1 n=1 n=4 n=4
ML110 Yes n=1 n=1 n=4 n=5
DL120 Yes n=1 n=1 n=4 n=5
ML110
(3470 not supported)
Intel HT Technology
NA NA NA NA NA
Max Turbo Boost frequency increment (n)*
Active cores
4 3 2 1
DL120 Yes n=1 n=1 n=4 n=5
*“n” indicates the multiplier used to calculate the maximum potential frequency increment supported by Intel Turbo Boost
technology for each processor model and given number of active cores. This number (n) is multiplied by bus clock frequency
(BCLK) to get the actual frequency. The standard bus clock frequency is 133.33 MHz.
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Memory
Xeon 3400 and 5500 Series processors connect directly to memory rather than through a chipset. They support only DDR-3 dual inline memory modules (DIMMs). In the ProLiant 100-series G6 servers, HP manages all processor functionality options, including memory mirroring and memory channel interleaving, through the G6 server BIOS and BIOS Setup Utility (BSU).
DDR-3
DDR-3 has several key enhancements including an 8-bit prefetch buffer for storing data before it is requested. By comparison, DDR-2 has a 4-bit buffer. For DDR-3, the data signal rate can increase to 1333 Megatransfers per second (MT/s). While this is commonly referred to as having a speed of 1333 MHz, the maximum clock speed for the DIMMs is actually 667 MHz and the signal is double­pumped to achieve the data rate of 1333 MT/s. DDR3-1333 DIMMs can operate at clock speeds of 667 MHz, 533 MHz, and 400 MHz with corresponding data rates of 1333, 1066, and 800 MT/s. The three memory channels between each processor’s integrated memory controller and its dedicated DDR-3 memory provide a total bandwidth of 32 gigabytes per second.
HP DDR-3 DIMM modules incorporate an integrated thermal sensor that signals the chipset to throttle memory traffic to the DIMM if its temperature exceeds a programmable critical trip point. Using the data from these thermal sensors, ProLiant G6 servers can reduce fan speed when memory is idle, which reduces power consumption. The BIOS in ProLiant G6 servers verifies the presence of the thermal DIMM sensor during POST. Some third-party DIMMs may not include this thermal sensor. If it is absent, a POST message will warn that the DIMM does not have a thermal sensor, and the fans will be forced to run at higher speeds (requiring more power).
DIMM Choices
DDR
-3 is available as both Unbuffered Dual In-line Memory Modules (UDIMMs) and Registered (buffered) Dual In-line Memory Modules (RDIMMs). Both RDIMMs and UDIMMs support error correcting code (ECC).
There are three types of DDR-3 available for ProLiant G6 servers:
• PC3-8500R (RDIMM, ECC compliant) —1066 or 800 MT/s data rate, depending on memory
configuration and processor installed.
• PC3-10600E (UDIMM, ECC compliant) —1333, 1066, or 800 MT/s data rate, depending on
memory configuration and processor installed.
• PC3-10600R (RDIMM, ECC compliant) —1333, 1066, or 800 MT/s data rate, depending on
memory configuration and processor installed.
Administrators can configure ProLiant 100-series G6 servers using either RDIMMs or UDIMMs but RDIMM and UDIMM memory cannot be mixed within a single server
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. ProLiant 100-series G6 servers have up to 18 DIMM slots, allowing larger memory capacities than with platforms that used DDR-2. ProLiant G6 servers optimize memory performance by operating DDR-3 memory at the maximum rate possible based on the memory configuration and the processor that is installed.
When choosing memory configurations for ProLiant 100-series G6 systems, the following guidelines should prove helpful:
• UDIMM configurations are limited to a maximum of two UDIMMs per memory channel because the
memory controller must drive the address and command signals to each DRAM chip on a channel. This results in a 24 GB maximum configuration in ProLiant 100-series G6 servers. Because they require fewer components, UDIMMs are typically less expensive than RDIMMs.
2
The ProLiant ML110 G6 server does not support RDIMM memory, only the PC3-10600E UDIMM
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• RDIMM configurations can provide larger memory capacity configuration because the memory
controller only drives the address and command signals to a single register chip, thereby reducing the electrical load on the memory controller. Users requiring large memory footprints can install three 8-GB RDIMMs per channel for a total of 144 GB.
• For smaller memory configurations, installing only one or two DIMMs per memory channel can
potentially increase memory performance. In many instances this allows administrators to clock the memory channel at a higher data rate.
Processor SKU determines the ability of ProLiant G6 servers to run DDR-3 memory at a top speed of 1333 MT/s. The processor SKU also dictates the range of speeds possible in different DIMM per channel (DPC) configurations. DIMM operating speeds are also subject to memory slot configuration and to the number of slots (4, 6, 12, 16, or 18). Table 2 displays DIMM speeds possible in 100­series G6 servers with a Xeon X5500 (95W), W5500 (130W), or 3400 (95W) processor.
Table 2. DDR-3 memory options on 100-series G6 servers supporting Xeon 5500 or 3400 Series processors running at 95W or 130W
DIMM Type
PC3-8500R RDIMM 4 quad
PC3-8500R RDIMM 8 dual
PC3-
10600R
PC3-
10600R
PC3-
10600R
PC3-
10600E
PC3-
10600E
*
UDIMMs will not run at 1333 MT/s data rates with two DIMMs per channel on systems that support three DIMM sockets per
channel. Support for 1333 MT/s data rate with two DIMMs may require a ROM upgrade.
** Applies to half-width system boards with 16 slots like the G6 DL170h
RDIMM 2 dual
RDIMM 4 dual
RDIMM 8 dual
UDIMM 1 single
UDIMM 2 dual
Capacity
(GB)
1 DPC
Rank
1066
1066
1333
1333
1333
1333
1333
2 DPC in
4 slots
N/A 1066 N/A 800 800 N/A
N/A N/A N/A 1066 1066 800
1333 1333 800 1333 1333 800
1333 1333 800 1333 1333 800
N/A N/A N/A 1333 1333 800
1333 1333 N/A 1066 1333
1333 1333 N/A 1066 1333
Max. data rate in MT/s
DIMMs per channel (DPC)
2 DPC in
6 slots
3 DPC in
6 slots
2 DPC in
16** and
18 slots
2 DPC in
12 slots
*
*
3 DPC in
16** and
18 slots
N/A
N/A
A BIOS setting on select ProLiant 100-series G6 servers allows the PC3-10600R memory modules to run at 1333 MT/s with two DIMMs per channel. HP design and testing have produced system boards with signal integrity that can operate at 1333 speeds in this configuration without degradation.
Only HP branded DIMMs have been fully validated to operate at this speed. Therefore, HP does not recommend configuring the BIOS setting for 1333 MT/s data rates with two DIMMs per channel when using third-party DIMMs, because they may not meet HP’s stringent design requirements.
Operating the memory at 1333 MT/s is supported only on select 100-series G6 servers using Xeon 3400 or 5500 Series processors operating at 95W or 130W.
For help configuring DDR-3 memory in ProLiant G6 servers, use the DDR-3 Memory Configuration Tool found at http://h18004.www1.hp.com/products/servers/options/tool/hp_memtool.html
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