HP DC71XX User Manual

Technical Reference Guide

HP Compaq dc71xx and dx61xx Series Business Desktop Computers

Document Part Number: 361834-002

January 2005

This document provides information on the design, architecture, function, and capabilities of the HP Compaq dc71xx and dx61xx Series Business Desktop Computers. This information may be used by engineers, technicians, administrators, or anyone needing detailed information on the products covered.

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WARNING: Text set off in this manner indicates that failure to follow directions could result in bodily

harm or loss of life.

CAUTION: Text set off in this manner indicates that failure to follow directions could result in damage to

equipment or loss of information.

Technical Reference Guide

HP Compaq dc71xx and dx61xx Series Business Desktop Computers

Second Edition (January 2005) First Edition (April 2004)

Document Part Number: 361834-002

Contents

1 Introduction

1.1 About this Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.1.1 Online Viewing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.1.2 Hardcopy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.2 Additional Information Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

1.3 Model Numbering Convention . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

1.4 Serial Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5 Notational Conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.1 Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.2 Ranges . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.3 Register Notation and Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.5.4 Bit Notation and Byte Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

1.6 Common Acronyms and Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

2 System Overview

2.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

2.2 Features And Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

2.2.1 Standard Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

2.2.2 Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

2.3 Mechanical Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

2.3.1 Cabinet Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5

2.3.2 Chassis Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7

2.3.3 Board Layouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–13

2.4 System Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–15

2.4.1 Intel Pentium 4 Processor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–17

2.4.2 Chipset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–18

2.4.3 Support Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–19

2.4.4 System Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–19

2.4.5 Mass Storage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–19

2.4.6 Serial and Parallel Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–20

2.4.7 Universal Serial Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–20

2.4.8 Network Interface Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–20

2.4.9 Graphics Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–21

2.4.10Audio Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–21

2.5 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–22

3 Processor/Memory Subsystem

3.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

3.2 Pentium 4 Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

3.2.1 Processor Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

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Contents

3.2.2 Processor Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

3.3 Memory Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

3.4 Subsystem Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9

4 System Support

4.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

4.2 PCI Bus Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

4.2.1 PCI Bus Transactions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

4.2.2 PCI Bus Master Arbitration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8

4.2.3 Option ROM Mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8

4.2.4 PCI Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8

4.2.5 PCI Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9

4.2.6 PCI Sub-Busses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9

4.2.7 PCI Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–9

4.3 AGP Bus Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–11

4.3.1 Bus Transactions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–11

4.3.2 AGP Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–14

4.4 System Resources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–15

4.4.1 Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–15

4.4.2 Direct Memory Access . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–20

4.5 System Clock Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–23

4.6 Real-Time Clock and Configuration Memory. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–23

4.6.1 Clearing CMOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–24

4.6.2 CMOS Archive and Restore. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–24

4.6.3 Standard CMOS Locations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–25

4.7 System Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–25

4.7.1 Security Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–26

4.7.2 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–27

4.7.3 System Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–28

4.7.4 Thermal Sensing and Cooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–29

4.8 Register Map and Miscellaneous Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–30

4.8.1 System I/O Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–31

4.8.2 LPC47B397 I/O Controller Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–32

5 Input/Output Interfaces

5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

5.2 Enhanced IDE/SATA Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

5.2.1 EIDE Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

5.3 Diskette Drive Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7

5.3.1 Diskette Drive Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7

5.3.2 Diskette Drive Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–11

5.4 Serial Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–12

5.4.1 Serial Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–12

5.4.2 Serial Interface Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–12

5.5 Parallel Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–14

5.5.1 Standard Parallel Port Mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–14

5.5.2 Enhanced Parallel Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–14

5.5.3 Extended Capabilities Port Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–15

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5.5.4 Parallel Interface Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–15

5.5.5 Parallel Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–17

5.6 Keyboard/Pointing Device Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–18

5.6.1 Keyboard Interface Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–18

5.6.2 Pointing Device Interface Operating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–20

5.6.3 Keyboard/Pointing Device Interface Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–20

5.6.4 Keyboard/Pointing Device Interface Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–24

5.7 Universal Serial Bus Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–25

5.7.1 USB Data Formats . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–26

5.7.2 USB Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–27

5.7.3 USB Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–28

5.7.4 USB Cable Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–29

5.8 Audio Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–29

5.8.1 Functional Analysis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–30

5.8.2 AC97 Audio Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–31

5.8.3 AC97 Link Bus. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–31

5.8.4 Audio Codec. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–32

5.8.5 Audio Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–33

5.8.6 Audio Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–35

5.9 Network Interface Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–36

5.9.1 Wake-On-LAN Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–37

5.9.2 Alert Standard Format Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–37

5.9.3 Power Management Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–37

5.9.4 NIC Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–38

5.9.5 NIC Connector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–38

5.9.6 NIC Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–39

6 Integrated Graphics Subsystem

6.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

6.2 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

6.2.1 Video Memory Allocation Reporting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

6.3 Display Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5

6.4 Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6

6.5 Upgrading 845G-Based Graphics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6

6.6 VGA Monitor Connector. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7

7 Power and Signal Distribution

7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

7.2 Power Supply Assembly/Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

7.2.1 Power Supply Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

7.2.2 Power Control. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

7.2.3 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–7

7.3 Power Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8

7.3.1 3.3/5/12 VDC Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–8

7.3.2 Low Voltage Production/Distribution . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–11

7.4 Signal Distribution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–12

Technical Reference Guide 361834-002 v

Contents

8 BIOS ROM

8.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–1

8.2 ROM Flashing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

8.2.1 Upgrading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–2

8.2.2 Changeable Splash Screen . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

8.3 Boot Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

8.3.1 Boot Device Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–3

8.3.2 Network Boot (F12) Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

8.3.3 Memory Detection and Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–4

8.3.4 Boot Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–5

8.4 Setup Utility. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–6

8.5 Client Management Functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–14

8.5.1 System ID and ROM Type . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–16

8.5.2 EDID Retrieve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–16

8.5.3 Temperature Status. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–17

8.5.4 Drive Fault Prediction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–17

8.6 PnP Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–18

8.6.1 SMBIOS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–19

8.7 Power Management Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–19

8.7.1 Independent PM Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–20

8.8 USB Legacy Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1–21

A Error Messages and Codes

B ASCII Character Set

C Keyboard

Index

vi 361834-002 Technical Reference Guide

1.1 About this Guide

This guide provides technical information about HP Compaq dx71xx and dc61xx series personal computers that feature the Intel Pentium 4 processor and the Intel 915G chipset. This document describes in detail the system's design and operation for programmers, engineers, technicians, and system administrators, as well as end-users wanting detailed information.

The chapters of this guide primarily describe the hardware and firmware elements and primarily deal with the system board and the power supply assembly. The appendices contain general data such as error codes and information about standard peripheral devices such as keyboards, graphics cards, and communications adapters.

This guide can be used either as an online document or in hardcopy form.

1.1.1 Online Viewing

Online viewing allows for quick navigating and convenient searching through the document. A color monitor will also allow the user to view the color shading used to highlight differential data. A softcopy of the latest edition of this guide is available for downloading in .pdf file format at the URL listed below:

www.hp.com

Introduction

Viewing the file requires a copy of Adobe Acrobat Reader available at no charge from Adobe Systems, Inc. at the following URL:

www.adobe.com

When viewing with Adobe Acrobat Reader, click on the ( ) icon or “Bookmarks” tab to display the navigation pane for quick access to particular places in the guide.

1.1.2 Hardcopy

A hardcopy of this guide may be obtained by printing from the .pdf file. The document is designed for printing in an 8 ½ x 11-inch format. Note that printing in black and white will lose color shading properties.

1.2 Additional Information Sources

For more information on components mentioned in this guide refer to the indicated manufacturers' documentation, which may be available at the following online sources:

■ HP Corporation: www.hp.com

■

Intel Corporation: www.intel.com

■

Standard Microsystems Corporation: www.smsc.com

■

USB user group: www.usb.org

Technical Reference Guide 361834-002 1-1

Introduction

1.3 Model Numbering Convention

The model numbering convention or HP systems is as follows:

1-2 361834-002 Technical Reference Guide

1.4 Serial Number

The unit's serial number is located on a sticker placed on the exterior cabinet. The serial number is also written into firmware and may be read with HP Diagnostics or Insight Manager utilities.

1.5 Notational Conventions

The notational guidelines used in this guide are described in the following subsections.

1.5.1 Values

Hexadecimal values are indicated by a numerical or alpha-numerical value followed by the letter “h.” Binary values are indicated by a value of ones and zeros followed by the letter “b.” Numerical values that have no succeeding letter can be assumed to be decimal unless otherwise stated.

1.5.2 Ranges

Ranges or limits for a parameter are shown using the following methods:

Example A: Bits <7..4> = bits 7, 6, 5, and 4.

Introduction

Example B: IRQ3-7, 9 = IRQ signals 3 through 7, and IRQ signal 9

1.5.3 Register Notation and Usage

This guide uses standard Intel naming conventions in discussing the microprocessor's (CPU) internal registers. Registers that are accessed through programmable I/O using an indexing scheme are indicated using the following format:

03C5.17h

In the example above, register 03C5.17h is accessed by writing the index port value 17h to the index address (03C4h), followed by a write to or a read from port 03C5h.

1.5.4 Bit Notation and Byte Values

Bit designations are labeled between brackets (i.e., “bit <0 >”). Binary values are shown with the most significant bit (MSb) on the far left, least significant bit (LSb) at the far right. Byte values in hexadecimal are also shown with the MSB on the left, LSB on the right.

Index port Data port

Technical Reference Guide 361834-002 1-3

Introduction

1.6 Common Acronyms and Abbreviations

Table 1-1 lists the acronyms and abbreviations used in this guide.

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

Aampere

AC alternating current

ACPI Advanced Configuration and Power Interface

A/D analog-to-digital

ADC Analog-to-digital converter

ADD or ADD2 Advanced digital display (card)

AGP Accelerated graphics port

API application programming interface

APIC Advanced Programmable Interrupt Controller

APM advanced power management

AOL Alert-On-LAN™

ASIC application-specific integrated circuit

ASF Alert Standard Format

AT 1. attention (modem commands) 2. 286-based PC architecture

ATA AT attachment (IDE protocol)

ATAPI ATA w/packet interface extensions

AVI audio-video interleaved

AVGA Advanced VGA

AWG American Wire Gauge (specification)

BAT Basic assurance test

BCD binary-coded decimal

BIOS basic input/output system

bis second/new revision

BNC Bayonet Neill-Concelman (connector type)

bps or b/s bits per second

BSP Bootstrap processor

BTO Built to order

CAS column address strobe

CD compact disk

CD-ROM compact disk read-only memory

CDS compact disk system

CGA color graphics adapter

1-4 361834-002 Technical Reference Guide

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

Ch Channel, chapter

cm centimeter

CMC cache/memory controller

CMOS complimentary metal-oxide semiconductor (configuration memory)

Cntlr controller

Cntrl control

codec 1. coder/decoder 2. compressor/decompressor

CPQ Compaq

CPU central processing unit

CRIMM Continuity (blank) RIMM

CRT cathode ray tube

CSM 1. Compaq system management 2. Compaq server management

Introduction

DAC digital-to-analog converter

DC direct current

DCH DOS compatibility hole

DDC Display Data Channel

DDR Double data rate (memory)

DIMM dual inline memory module

DIN Deutche IndustriNorm (connector type)

DIP dual inline package

DMA direct memory access

DMI Desktop management interface

dpi dots per inch

DRAM dynamic random access memory

DRQ data request

DVI Digital video interface

dword Double word (32 bits)

EDID extended display identification data

EDO extended data out (RAM type)

EEPROM electrically eraseable PROM

EGA enhanced graphics adapter

EIA Electronic Industry Association

EISA extended ISA

EPP enhanced parallel port

EIDE enhanced IDE

Technical Reference Guide 361834-002 1-5

Introduction

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

ESCD Extended System Configuration Data (format)

EV Environmental Variable (data)

ExCA Exchangeable Card Architecture

FIFO first in/first out

FL flag (register)

FM frequency modulation

FPM fast page mode (RAM type)

FPU Floating point unit (numeric or math coprocessor)

FPS Frames per second

ft Foot/feet

GB gigabyte

GMCH Graphics/memory controller hub

GND ground

GPIO general purpose I/O

GPOC general purpose open-collector

GART Graphics address re-mapping table

GUI graphic user interface

hhexadecimal

HW hardware

hex hexadecimal

Hz Hertz (cycles-per-second)

ICH I/O controller hub

IDE integrated drive element

IEEE Institute of Electrical and Electronic Engineers

IF interrupt flag

I/F interface

IGC integrated graphics controller

in inch

INT interrupt

I/O input/output

IPL initial program loader

IrDA Infrared Data Association

IRQ interrupt request

ISA industry standard architecture

1-6 361834-002 Technical Reference Guide

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

Kb/KB kilobits/kilobytes (x 1024 bits/x 1024 bytes)

Kb/s kilobits per second

kg kilogram

KHz kilohertz

kV kilovolt

lb pound

LAN local area network

LCD liquid crystal display

LED light-emitting diode

LPC Low pin count

LSI large scale integration

LSb/LSB least significant bit/least significant byte

Introduction

LUN logical unit (SCSI)

m Meter

MCH Memory controller hub

MMX multimedia extensions

MPEG Motion Picture Experts Group

ms millisecond

MSb/MSB most significant bit/most significant byte

mux multiplex

MVA motion video acceleration

MVW motion video window

n variable parameter/value

NIC network interface card/controller

NiMH nickel-metal hydride

NMI non-maskable interrupt

NRZI Non-return-to-zero inverted

ns nanosecond

NT nested task flag

NTSC National Television Standards Committee

NVRAM non-volatile random access memory

OS operating system

PAL 1. programmable array logic 2. phase alternating line

PATA Parallel ATA

Technical Reference Guide 361834-002 1-7

Introduction

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

PC Personal computer

PCA Printed circuit assembly

PCI peripheral component interconnect

PCI-E PCI Express

PCM pulse code modulation

PCMCIA Personal Computer Memory Card International Association

PEG PCI express graphics

PFC Power factor correction

PIN personal identification number

PIO Programmed I/O

PN Part number

POST power-on self test

PROM programmable read-only memory

PTR pointer

RAM random access memory

RAS row address strobe

rcvr receiver

RDRAM (Direct) Rambus DRAM

RGB red/green/blue (monitor input)

RH Relative humidity

RMS root mean square

ROM read-only memory

RPM revolutions per minute

RTC real time clock

R/W Read/Write

SATA Serial ATA

SCSI small computer system interface

SDR Singles data rate (memory)

SDRAM Synchronous Dynamic RAM

SDVO Serial digital video output

SEC Single Edge-Connector

SECAM sequential colour avec memoire (sequential color with memory)

SF sign flag

SGRAM Synchronous Graphics RAM

1-8 361834-002 Technical Reference Guide

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

SIMD Single instruction multiple data

SIMM single in-line memory module

SMART Self Monitor Analysis Report Technology

SMI system management interrupt

SMM system management mode

SMRAM system management RAM

SPD serial presence detect

SPDIF Sony/Philips Digital Interface (IEC-958 specification)

SPN Spare part number

SPP standard parallel port

SRAM static RAM

SSE Streaming SIMD extensions

Introduction

STN super twist pneumatic

SVGA super VGA

SW software

TAD telephone answering device

TAFI Temperature-sensing And Fan control Integrated circuit

TCP tape carrier package

TF trap flag

TFT thin-film transistor

TIA Telecommunications Information Administration

TPE twisted pair ethernet

TPI track per inch

TTL transistor-transistor logic

TV television

TX transmit

UART universal asynchronous receiver/transmitter

UDMA Ultra DMA

URL Uniform resource locator

us/µs microsecond

USB Universal Serial Bus

UTP unshielded twisted pair

Vvolt

VAC Volts alternating current

Technical Reference Guide 361834-002 1-9

Introduction

Table 1-1

Acronyms and Abbreviations

Acronym or Abbreviation Description

VDC Volts direct current

VESA Video Electronic Standards Association

VGA video graphics adapter

VLSI very large scale integration

VRAM Video RAM

Wwatt

WOL Wake - On-LAN

WRAM Windows RAM

ZF zero flag

ZIF zero insertion force (socket)

1-10 361834-002 Technical Reference Guide

2.1 Introduction

The HP Compaq dc71xx and dx61xx Series Business Desktop Computers (Figure 2-1) deliver an outstanding combination of manageability, serviceability, and compatibility for enterprise environments. Based on the Intel Pentium 4 processor with the Intel 915G Chipset, these systems emphasize performance along with industry compatibility. These models feature architectures incorporating the PCI bus. All models are easily upgradeable and expandable to keep pace with the needs of the office enterprise.

System Overview

HP Compaq dc7100 USDT

HP Compaq dx61xx ST HP Compaq dx61xx MT

Figure 2-1. HP Compaq dx61xx and dc71xx Series Business Desktop Computers

This chapter includes the following topics:

■ Features (2.2), page 2-2

■ Mechanical design (2.3), page 2-4

■ System architecture (2.4), page 2-22

■ Specifications (2.5), page 2-29

HP Compaq dc7100 SFF

HP Compaq dc7100 CMT

Technical Reference Guide 361834-002 2-1

System Overview

2.2 Features And Options

This section describes the standard features.

2.2.1 Standard Features

The following standard features are included on all series inless otherwise indicated:

■ Intel Pentium 4 processor in LGA775 (Socket T) package

■ Integrated graphics controller

■ PC2700 and PC3200 DIMMs support on dx6100 and dc7100 models

■ PC2-4300 DIMM support on dx6120 models

■ IDE controller providing serial and parallel ATA support

■ Hard drive fault prediction

■ Eight USB 2.0 ports

■ Audio processor with one headphone output, one microphone input, and one line input

■ Network interface controller providing 10/100/1000Base T support

■ Plug 'n Play compatible (with ESCD support)

■ Intelligent Manageability support

■ Energy Star compliant

■ Security features including:

❏ Flash ROM Boot Block

❏ Diskette drive disable, boot disable, write protect

❏ Power-on password

❏ Administrator password

❏ Serial/parallel port disable

■ PS/2 enhanced keyboard

■ PS/2 scroll mouse

2-2 361834-002 Technical Reference Guide

System Overview

Table 2-1 shows the differences in features between the different PC series based on form factor:

Table 2-1

Difference Matrix by Form Factor

USDT SFF ST MT CMT

Series dc7100 dc7100 dx6100 / dx6120 dx6100 / dx6120 dc7100

System Board Type custom custom custom µATX µATX

Serial and parallel ports Optional [1] Standard Standard Standard Standard

Memory:

# of sockets Maximum memory

Memory type

Drive bays:

Externally accessible

Internal

PCI Express slots:

x16 graphics x1

PCI 2.3 slots 1full-height 2 half-height

MultiBay Standard Optional [7] Optional [7] not supported Optional [7]

Smart Cover Sensor / Lock Sensor only Both No No Both

Power Supply:

Power ra ting PFC Auto-ranging

NOTE: [1] Supported on system board. Requires optional cable/bracket assembly. [2] Accepts low-profile, reversed-layout ADD2/SDVO card: height = 2.5 in., length = 6.6 in. [3] Slot not accessible in configuration using PCI riser card. [4] Accepts standard height, normal (non-reversed) layout ADD2/SDVO card: height = 4.2 in., length = 10.5 in. [5] Riser card configuration is a field option. Full-height PCI slots provided with configuration using PCI riser card.

Half-height dimensions: height = 2.5 in., length = 6.6 in. Full-hieght dimensions: height = 4.2 in., length = 6.875 in

[6] PCI expansion board required for 4-slot support.

Full-height dimensions: [7] Requires adapter. [8] Some MT SKUs shipped with 340-watt power supplies.

3 GB

DDR

1 1

0 0

200-watt

Active PFC

Yes

4 GB

DDR

2 1

1 [2] [3]

1 [3]

2 full-height [5]

240 -wat t

Active PFC

Yes

4 GB

DDR / DDR2

2 1

1 [2] [3]

1 [3]

2 half-height

2 full-height [5]

240-wat t

Active PFC

Yes

4 GB

DDR / DDR2

3 2

1 [4]

2 full-height 2 full-height

300-watt [8]

Passive PF C

4 GB

DDR

4 2

1 [4]

4 full-height [6]

340-watt

Active PFC

Yes

Technical Reference Guide 361834-002 2-3

System Overview

2.3 Mechanical Design

This guide covers six form factors:

■ Ultra Slim Desktop (USDT)—Very slim design that can be used in a tradition desktop

(horizontal) orientation or as a small tower mounted in the supplied tower stand.

■ Small Form Factor (SFF)—A small-footprint desktop requiring minimal desk space.

■ Slim Tower (ST)—Slim design that can be used in a tradition desktop (horizontal)

orientation or as a small tower mounted in the supplied tower stand.

■ Microtower (MT)- A low-height tower that requires less vertical space than a minitower.

■ Convertible Minitower (CMT) —an ATX-type unit providing the most expandability and

being adaptable to desktop (horizontal) or floor-standing (vertical) placement.

The following subsections describe the mechanical (physical) aspects of models.

CAUTION: Voltages are present within the system unit whenever the unit is plugged into a live AC outlet,

regardless of the system's “Power On” condition. Always disconnect the power cable from the power outlet and/or from the system unit before handling the system unit in any way.

The following information is intended primarily for identification purposes only. Before servicing these systems, refer to the applicable Service Reference Guide. Service personnel should review training materials also

✎

available on these products.

2-4 361834-002 Technical Reference Guide

2.3.1 Cabinet Layouts

Front Views

Figure 2-2 shows the front panel components of the Ultra Slim Desktop (USDT) format factor.

System Overview

Item Description Item Decription

1 MultiBay device bay 5 USB ports 7, 8

2 MultiBay device eject lever 6 Power LED

3 Microphone audio In jack 7 MultiBay device / HD activity LED

4 Headphone audio Out jack 8 Power button

Figure 2-2. HP Compaq dc7100 USDT Front View

Technical Reference Guide 361834-002 2-5

System Overview

Figure 2-3 shows the front panel components of the Small Form Factor (SFF).

Item Description Item Decription

1 Diskette drive activity LED 7 Microphone audio In jack

2 Diskette drive media door 8 Headphone audio Out jack

3 CD-ROM drive acitvity LED 9 USB ports 7, 8

4 Diskette drive eject button 10 Hard drive activity LED

5 CD-ROM media tray 11 Power LED

6 CD-ROM drive open/close button 12 Power button

Figure 2-3. HP Compaq dc7100 SFF Front View

2-6 361834-002 Technical Reference Guide

Figure 2-4 shows the front panel components of the Slim Tower (ST) form factor.

System Overview

Item Description Item Decription

1 Micorphone audio In jack 7 Diskette drive activity LED

2 Headphone audio Out jack 8 Diskette media door

3 USB ports 7, 8 9 CD-ROM drive acitvity LED

4 hard drive activity LED 10 Diskette drive eject button

5 Power LED 11 CD-ROM media tray

6 Power button 12 CD-ROM drive open/close button

Figure 2-4. HP Compaq dx6100 ST Front View

Technical Reference Guide 361834-002 2-7

System Overview

Figure 2-5 shows the front panel components of the microtower (uT) form factor.

Item Description Item Decription

1 CD-ROM drive 7 CD-ROM drive open/close button

2 CD-ROM drive activity LED 8 Power button

3 Diskette drive media door 9 Power LED

4 Diskette drive activity LED 10 Hard drive activity LED

5 Diskette drive eject button 11 Headphone audio Out jack

6 USB ports 7, 8 12 Microphone audio In jack

Figure 2-5. HP Compaq dx6100 MT Front View

2-8 361834-002 Technical Reference Guide

System Overview

Figure 2-6 shows the front panel components of the Convertable Minitower (CMT) form factor.

Item Description Item Decription

1 CD-ROM drive 7 CD-ROM drive open/close button

2 CD-ROM drive activity LED 8 Power button

3 Diskette drive media door 9 Power LED

4 Diskette drive activity LED 10 USB ports 7, 8

5 Diskette drive eject button 11 Headphone audio Out jack

6 Hard drive activity LED 12 Microphone audio In jack

Figure 2-6. HP Compaq dc7100 CMT Front View

Technical Reference Guide 361834-002 2-9

System Overview

Rear Views

Figure 2-7 shows the rear view of the USDT form factor.

Item Description Item Description

1 NIC (LAN) connector (RJ-45) 6 Mouse connector (PS/2)

2 VGA monitor connector (DB-15) 7 Keyboard connector (PS/2)

3 AC input connector 8 Line audio In

4 USB ports 1, 2 9 Headphone / Speaker audio Out

5USB ports 3 - 6 -- --

Figure 2-7. HP Compaq dc7100 USDT, Rear View

2-10 361834-002 Technical Reference Guide

System Overview

Figure 2-8 shows the rear views of the SFF form factor. Two configurations are available:

■ Without cardcage - Accepts two half-height PCI 2.3 cards, two half-height PCI Express cards

■ With card cage - Accepts two full-height PCI 2.3 cards only

SFF chassis without card cage

SFF Chassis with card cage

Item Description Item Description

1 NIC (LAN) connector (RJ-45) 7 VGA monitor connector (DB-15)

2 USB ports 3 - 6 8 Mouse connector (PS/2)

3 Parallel port (DB-25) 9 Keyboard connector (PS/2)

4 Serial port (DB-9) 10 Line audio In

5 AC input connector 11 Headphone / Speaker audio Out

6USB ports 1, 2 -- --

Figure 2-8. HP Compaq dc7100 SFF, Rear Views

Technical Reference Guide 361834-002 2-11

System Overview

Figure 2-9 shows the rear views of the ST form factor. Two configurations are available:

■ Without cardcage - Accepts two half-height PCI 2.3 cards, two half-height PCI Express cards

■ With card cage - Accepts two full-height PCI 2.3 cards only

ST chassis without card cage

Item Description Item Description

1 AC input connector 7 Line audio In

2 Parallel port (DB-25) 8 Keyboard connector (PS/2)

3 USB ports 3 - 6 9 Mouse connector (PS/2)

4 NIC (LAN) connector (RJ-45) 10 VGA monitor connector (DB-15)

5 Serial port (DB-9) 11 USB ports 1, 2

6 Headphone / Speaker audio Out -- --

ST chassis with card cage

Figure 2-9. HP Compaq dc7100 ST, Rear Views

2-12 361834-002 Technical Reference Guide

Figure 2-10 shows the rear view of the MT form factor.

System Overview

Item Description Item Description

1 AC voltage select switch [1] 8 Mouse connector (PS/2)

2 AC line connector Microphone In jack 9 Parallel port connctor (DB-25)

3 Keyboard connector (PS/2) 10 USB ports 1 - 4

4 Serial port connector (DB-9) 11 Line audio Out jack

5 VGA monitor connector (B-15) 12 Line audio In jack

6 Microphone In jack 13 NIC (LAN) connector (RJ-45)

7USB ports 5, 6 -- --

NOTE:

[1] Switch not present on SKUs that feature auto-ranging power supply.

Figure 2-10. HP Compaq dx6100 MT, Rear View

Technical Reference Guide 361834-002 2-13

System Overview

Figure 2-11 shows the rear view of the CMT form factor.

Item Description Item Description

1 USB ports 5, 6 7 Mouse connector (PS/2)

2 Microphone audio In 8 Parallel port connector (DB-25)

3 VGA monitor connector (DB-15) 9 USB ports 1-4

4 Serial port connector (DB-9) 10 Line audio Out jack

5 Keyboard connector (PS/2)) 11 Line audio In jack

6 AC line connector 12 NIC (LAN) connector (RJ-45)

Figure 2-11. HP Compaq dc7100 CMT, Rear View

2-14 361834-002 Technical Reference Guide

2.3.2 Chassis Layouts

This section describes the internal layouts of the chassis. For detailed information on servicing the chassis refer to the multimedia training and/or the maintenance and service guide for these systems.

UIltra Slim Desktop Chassis

The Ultra Slim Desktop (USDT) chassis used for the HP Compaq dc7100 models uses a compact, space-saving form factor.

System Overview

Item Description Item Description

1 Power supply assembly 5 Chassis fan

2 DIMM sockets (3) 6 MultiBay device

3 PCI card cage 7 Hard drive

4 Processor socket -- --

Figure 2-12. USDT Chassis Layout, TopView

Technical Reference Guide 361834-002 2-15

System Overview

Small Form Factor / Slim Tower Chassis

The chassis layouts for the Small Form Factor (SFF) used for the HP Compaq dc7100 models and the Slim Tower (ST) used for the HP Comapq dx6100 models are shown in Figure 2-13. Features include:

■ Tilting drive cage assembly for easy access to processor and memory sockets

■ Two configurations:

❏ Without card cage:

◆ Two half-height, full length PCI 2.3 slots

◆ One PCI Express x16 graphics/SDVO slot

◆ One PCI Express x1 slot

❏ With card cage:

◆ Two full-height, full-length PCI 2.3 slots

Chassis without card cage

Item Description Item Description

1 Power supply assembly 6 Card cage

2 DIMM sockets (4) 7 Processor socket

3 PCI Express x1 slot 8 Chassis fan

4 PCI Express x16 graphics/reverse-layout slot [1] 9 Diskette drive bay

5 PCI 2.3 slots (2) 10 CD-ROM drive bay

Chassis with card cage

NOTE:

[1] Accepts PCI-E graphics or reversed-layout ADD2 card.

Figure 2-13. SFF / ST Chassis Layout, Top / Right Side Views

2-16 361834-002 Technical Reference Guide

System Overview

Microtower Chassis

Figure 2-14 shows the layout for the Microtower (MT) chassis used for the HP Compaq dx6100 models. Features include:

■ Externally accessible drive bay assembly.

■ Easy access to expansion slots and all socketed system board components.

9 8

Item Description Item Description

1 Power supply assembly 7 Speaker

2 Processor socket 8 PCI 2.3 slots

3 DIMM sockets (4) 9 PCI Express x1 slot

4 DriveLock 10 PCI Express x16 graphics/normal-layout SDVO slot [1]

5 Externally accessible drive bays 11 Chassis fan

6 Internally accessible drive bays -- --

NOTE:

[1] Accepts PCI-E graphics or normal-layout ADD2 card.

Figure 2-14. MT Chassis Layout, Left Side View

Technical Reference Guide 361834-002 2-17

System Overview

Convertible Minitower

Figure 2-15 shows the layout for the Convertible Minitower (CMT) chassis in the minitower configuration used for HP Compaq dc7100 models. Features include:

■ Externally accessible drive bay assembly may be configured for minitower (vertical) or

■ Easy access to expansion slots and all socketed system board components.

desktop (horizontal) position.

9 8

Item Description Item Description

1 Power supply assembly 7 Speaker (inside card guide assembly)

2 Processor socket 8 Expansion board area

3 DIMM sockets (4) 9 PCI 2.3 slots

4 DriveLock 10 PCI Express x1 slot

5 Externally accessible drive bays 11 PCI Express x16 graphics/normal-layout SDVO slot [1]

6 Internally accessible drive bays 12 Chassis fan

NOTE:

[1] Accepts PCI-E graphics or normal-layout ADD2 card.

Figure 2-15. CMT Chassis Layout, Left Side View (Minitower configuration)

2-18 361834-002 Technical Reference Guide

2.3.3 Board Layouts

Figures 2-16 through 2-18 show the system and expansion boards for these systems.

System Overview

o i

y t

r e

NOTE: See USDT rear chassis illustrations for externally accessible I/O connectors.

Item Description Item Description

1 Hood sense header 11 Power button, power LED, HD LED header

2 Battery 12 Front panel audio connector

3 Parallel port option header 13 Front panel USB port connector

4 Serial port A header 14 Chassis fan, secondary connector

5 Password clear jumper header 15 Chassis fan, primary connector

6 SATA #0 header 16 DIMM sockets (3)

7 PCI 2.3 slot 17 MultiBay riser connector

8 Intenal speaker header 18 Power supply connector

9 Power supply (VccP) connector 19 Auxiliary audio input connector

10 Processor socket -- --

Figure 2-16. USDT System Board

Technical Reference Guide 361834-002 2-19

System Overview

g f

s a

p o

Item Description Item Description

1 Serial port B header 14 Front panel audio header

2 Battery 15 Chassis speaker connector

3 SATA #1 header 16 Front panel USB port connector

4 SATA #0 header 17 MultiBay connector

5Password jumper 18DIMM sockets (4)

6 PCI Express x1 slot 19 CD-Audio input connector

7 PCI Express x16 graphics/reversed-layout SDVO slot 20 Diskette drive connector

8 PCI 2.3 slots 21 PATA (primary IDE) connector

9 Power supply (VccP) connector 22 Auxiliary audio input connector

10 Processor socket 23 Power supply connector

11 Chassis fan, primary connector 24 Cover lock (solenoid) connector

12 Chassis fan, secondary conenctor 25 Cover sensor connector

13 Power button, power LED, HD LED header -- --

NOTE:

See SFF and ST rear chassis illustrations for externally accessible I/O connectors.

Figure 2-17. SFF / ST System Board

2-20 361834-002 Technical Reference Guide

System Overview

z l k

j h

g f

PCI Expansion Board [1]

Item Description Item Description

1PCI 2.3 slots 16Serial ATA #2 connector [2]

2 Battery 17 Serial ATA #0 connector

3 PCI Express x1 slot 18 Hood lock header [2]

4 PCI Express x16 graphics/normal-layout SDVO slot 19 Hood sense header [2]

5 Chassis fan header 20 Password clear jumper header

6 Power supply (VccP) connector 21 Power LED/button, HD LED header

7 Serial port B header [2] 22 Serial ATA #1 connector

8 Processor socket 23 CMOS clear switch

9 Processor fan connector 24 Internal speaker connector

10 DIMM sockets (4) 25 Auxiliary audio inpout connector

11 MultiBay conector [2] 26 CD audio input connector

12 Diskette drive connector 27 Front panel USB port connector

13 Parallel ATA connector 28 PCI expansion board connector [2]

14 Power supply connector 29 Front panel audio connector

15 Serial ATA #3 connector [2] -- --

System Board

NOTES:

See MT and CMT rear chassis illustrations for externally accessible I/O connectors. [1] Applicable to CMT chassis only. [2] Not included on MT system boards.

Figure 2-18. MT / CMT System Board and CMT PCI Expansion Board

Technical Reference Guide 361834-002 2-21

System Overview

2.4 System Architecture

The systems covered in this guide feature an architecture based on the Intel Pentium 4 processor and the Intel 915G chipset (Figure 2-11). These systems allow processor upgrading with the Intel Pentium 4 family and offer flexibility in expansion capabilities.

All systems covered in this guide include the following key components:

■ Intel Pentium 4 with Hyper-Threading technology, 32-KB L1 cache and 1-MB L2 cache.

■ Intel 915G/GV chipset - Includes 82915G or 82915GV GMCH north bridge and 82801

ICH6 south bridge including an integrated graphics controller, dual-channel DDR1 or DDR2 SDRAM controller, serial and parallel ATA controllers, USB 2.0 controller, and PCI controller supporting PCI 2.3 devices.

■ SMC 47B397 super I/O controller supporting PS/2 keyboard and mouse peripherals

■ AD1981B audio controller supporting line in, speaker out, and headphone out

■ Broadcom BCM5751 10/100/1000 network interface controller

The 915G/GV chipset provides a major portion of system functionality. Designed to compliment the latest Intel Pentium 4 processors, the chipset serves the processor through a 800-MB Front-Side Bus (FSB). Communication between the GMCH and ICH6 components occurs through the Direct Media Interface (DMI). The SFF, ST, MT, and CMT form factors use the integrated graphics controller of the 82915G that may be upgraded through a PCI Express x16 graphics slot. All systems include a PCI 2.3 slot, and feature as standard a serial ATA (SATA) hard drive with support for legacy parallel ATA 100 devices including a MultiBay device.

Table 2-2 lists the differences between models.

Table 2-2.

Architectural Differences By Form Factor

Model USDT SFF ST MT CMT

Chipset 915GV 915G 915G 915G 915G

Memory sockets 3 4 4 4 4

DDR2 models? No Yes Yes Yes Yes

Graphics upgrade PCI 2.3 card

only

PCI Express x16 graphics slot?

PCI Express x1 slot? No Yes [1] Yes [1] Yes Yes

Serial / parallel ports Optional [2] Standard [3] Standard [3] Standard [3] Standard [3]

SATA interfaces 1 2 2 4 4

Notes:

[1] Slot not accessible if PCI 2.3 full-height riser is installed. [2] Requires adapter. [3] 2nd serial port requires adapter.

No Yes [1] Yes [1] Yes Yes

PCI-E or

PCI 2.3 card

PCI-E or

PCI 2.3 card

PCI-E or

PCI 2.3 card

PCI-E or

PCI 2.3 card

2-22 361834-002 Technical Reference Guide

Pentium 4

Processor

915G/GV Chipset

System Overview

Monitor

PCI Express

x16 slot (PEG)[1]

SATA

Hard Drive

MultiBay Device

CD-ROM

AC97 Audio Subsystem

RGB

Graphics

Cntlr.

PCI Exp.

PEG I/F [1]

SATA

I/F

PATA

I/F

AC97 I/F

915 [2] GMCH

DMI

82801

ICH6

PCI Cntlr.

PCI 2.3 slot(s)

SDRAM

Cntlr

USB

I/F

LPC I/F

Ch A DDR/DDR2

SDRAM

Ch B DDR/DDR2

SDRAM

USB Ports 1-8

Serial I/F [1]

Kybd-Mouse I/F

Keyboard

Parallel I/F [1]

LPC47B397

I/O Cntlr.

Mouse

Diskette I/F

Floppy

NIC

I/F

Note:

[1] SFF, ST, MT, and CMT form factors only. [2] 82915GV for USDT form factor

82915G for SFF. ST. MT, and CMT form factors

PCI Express x1 slot [1]

Power Supply

Figure 2-19 System Architecture, Block diagram

Technical Reference Guide 361834-002 2-23

System Overview

2.4.1 Intel Pentium 4 Processor

The models covered in this guide feature the Intel Pentium 4 processor with Hyper-Threading technology. This processor is backward-compatible with software written for the Pentium III, Pentium II, Pentium MMX, Pentium Pro, Pentium, and x86 microprocessors. The processor architecture includes a floating-point unit, 32-KB first and 1-MB secondary caches, and enhanced performance for multimedia applications through the use of multimedia extension (MMX) instructions. Also included are streaming SIMD extensions (SSE and SSE2) for enhancing 3D graphics and speech processing performance. The Pentium 4 processor features Net-Burst Architecture that uses hyper-pipelined technology and a rapid-execution engine that runs at twice the processor's core speed.

These systems employ a zero-insertion-force (ZIF) Socket-T designed for mounting an LGA775 processor package (Figure 2-20).

Figure 2-20. Processor Socket and Processor Package

To remove the processor:

1. Remove the processore heat sink/fan assembly (not shown).

2. Release the locking lever (1) by first pushing down, then out and up.

3. Pull up the securing frame (2).

4. Grasp the processor (3) by the edges and lift straight up from the socket.

The processor heatsink/fan assembly mounting differs between form factors. Always use the

✎

same assembly or one of the same type when replacing the processor. Refer to the applicable Service Reference Guide for detailed removal and replacement procedures of the heatsink/fan assembly and the processor.

2-24 361834-002 Technical Reference Guide

2.4.2 Chipset

The chipset consists of a Graphics Memory Controller Hub (GMCH), an enhanced I/O controller hub (ICH), and a firmware hub (FWH). Table 2-3 compares the functions provided by the chipsets.

Components Function

82915G/GV GMCH Intel Graphics Media Accelerator 900 (integrated graphics controller)

82801EB ICH6 PCI 2.3 bus I/F

System Overview

Table 2-3

Chipset Components

PCI Express x16 graphics interface (915G only) SDRAM controller supporting unbuffered, non-ECC PC2700/PC3200

DDR or PC2-3200/PC2-4300 DDR2 DIMMs (depending on model) 533-, or 800-MHz FSB

PCI Express x1 LPC bus I/F SMBus I/F IDE I/F with SATA and PATA support AC ’97 controller RTC/CMOS IRQ controller Power management logic USB 1.1/2.0 controllers supporting eight (8) ports

82802 FWH [1] Loaded with HP/Compaq BIOS

NOTE:

[1] Or equivalent component.

Technical Reference Guide 361834-002 2-25

System Overview

2.4.3 Support Components

Input/output functions not provided by the chipset are handled by other support components. Some of these components also provide “housekeeping” and various other functions as well. Table 2-4 shows the functions provided by the support components.

Support Component Functions

Component Name Function

Table 2-4

LPC47B397 I/O Controller Keyboard and pointing device I/F

BCM5751 Ethernet Controller 10/100/1000 Fast Ethernet network interface controller.

AD1981B Audio Codec Audio mixer

2.4.4 System Memory

These systems implement a dual-channel Double Data Rate (DDR) memory architecture. All dx6100 and dc7100 models support PC2700 (333- MHz) and PC3200 (400-MHz) DIMMs. Only dx6120 models support DDR2, PC2-4300 (533-MHz) DIMMs.

DDR and DDR2 DIMMs are NOT interchangeable. Memory type is defined by the system

✎

board.

Diskette I/F Serial I/F (COM1and COM2) Parallel I/F (LPT1, LPT2, or LPT3) PCI reset generation Interrupt (IRQ) serializer Power button and front panel LED logic GPIO ports Processor over tempurature monitoring Fan control and monitoring Power supply voltage monitoring SMBus and Low Pin Count (LPC) bus I/F

Digital-to-analog converter Analog-to-digital converter Analog I/O 6-channel audio support

The USDT system provides three DIMM sockets supporting up to 3 GB of memory while all other form factors provide four DIMM sockets and support a total of four gigabytes of memory.

The maximum memory amounts stated above are with 1-GB memory modules using 1-Gb

✎

technology DIMMs.

2-26 361834-002 Technical Reference Guide

2.4.5 Mass Storage

All models support at least two mass storage devices, with one being externally accessible for removable media. These systems provide one, two, or four SATA interfaces and one PATA interface. These systems may be preconfigured or upgraded with a 40-, 80-, or 160-GB SATA hard drive and one removable media drive such as a CD-ROM drive. Some systems also provide one MultiBay interface.

2.4.6 Serial and Parallel Interfaces

All models except those that use the USDT form factor include a serial port and a parallel port, both of which are accessible at the rear of the chassis. The USDT form factor may be upgraded with an adapter to provide serial and parallel ports. The SFF, ST, MT, and CMT form factors may be upgraded with an optional second serial port.

The serial interface is RS-232-C/16550-compatible and supports standard baud rates up to 115,200 as well as two high-speed baud rates of 230K and 460K. The parallel interface is Enhanced Parallel Port (EPP1.9) and Enhanced Capability Port (ECP) compatible, and supports bi-directional data transfers.

2.4.7 Universal Serial Bus Interface

System Overview

All models provide eight Universal Serial Bus (USB) ports, with two ports accessible at the front of the unit and six ports accessible on the rear panel. The USB interface provides hot plugging/unplugging functionality. These systems support USB 1.1 and 2.0 functionality on all ports.

2.4.8 Network Interface Controller

All models feature a Broadcom NetXtreme Gigabit Network Interface Controller (NIC) integrated on the system board. The controller provides automatic selection of 10BASE-T, 100BASE-TX, or 1000BASE-T operation with a local area network and includes power-down, wake-up, and Alert-On-LAN (AOL), and Alert Standard Format (ASF) features. An RJ-45 connector with status LEDs is provided on the rear panel.

Technical Reference Guide 361834-002 2-27

System Overview

2.4.9 Graphics Subsystem

These systems use the 82915G or 82915GV GMCH component that integrates an Intel graphics controller that can drive an external VGA monitor. The integrated graphics controller (IGC) features a 333-MHz core processor and a 400-MHz RAMDAC. The controller implements Dynamic Video Memory Technology (DVMT 3.0) for video memory. Table 2-5 lists the key features of the integrated graphics subsystem.

Integrated Graphics Subsystem Statistics

Recommended for: Hi 2D, Entry 3D

Bus Type Int. PCI Express

Memory Amount 8 MB pre-allocated

Memory Type DVMT 3.0

DAC Speed 400 MHz

Table 2-5

82915G or GV GMCH

Integrated Graphics Controller

Maximum 2D Res. 2048x1536 @ 85 Hz

Software Compatibility Quick Draw,

Outputs 1 RGB

The IGC of the 82915G used in the SFF, ST, MT, and CMT form factors supports upgrading through a PCI Express x16 graphics slot. The IGC of the 82915GV used in the USDT form factor does not support a PCI Express x16 graphic slot and may only be upgraded through the PCI 2.3 slot.

2.4.10 Audio Subsystem

These systems use the integrated AC97 audio controller of the chipset and the ADI 1981B audio codec. These systems include microphone and line inputs and headphone and line outputs and include a 3-watt output amplifier driving an internal speaker. All models feature front panel-accessible microphone in and headphone out audio jacks as standard.

DirectX 9.0, Direct Draw, Direct Show,

Open GL 1.4,

MPEG 1-2,

Indeo

2-28 361834-002 Technical Reference Guide

2.5 Specifications

This section includes the environmental, electrical, and physical specifications for the systems covered in this guide. Where provided, metric statistics are given in parenthesis. Specifications are subject to change without notice.

Environmental Specifications (Factory Configuration)

Parameter Operating Non-operating

System Overview

Table 2-6

Ambient Air Temperature 50

to 95o F (10o to 35o C, max.

rate of change < 10°C/Hr)

-24o to 140o F (-30o to 60o C, max. rate of change < 20°C/Hr )

Shock (w/o damage) 5 Gs [1] 20 Gs [1]

Vibration 0.000215 G

Humidity 10-90% Rh @ 28

wet bulb temperature

/Hz, 10-300 Hz 0.0005 G2/Hz, 10-500 Hz

C max.

5-95% Rh @ 38.7o C max.

wet bulb temperature

Maximum Altitude 10,000 ft (3048 m) [2] 30,000 ft (9144 m) [2]

NOTE:

[1] Peak input acceleration during an 11 ms half-sine shock pulse. [2] Maximum rate of change: 1500 ft/min.

Table 2-7

Electrical Specifications

Parameter U.S. International

Input Line Voltage: Nominal: Maximum:

100–240 VAC

90–264 VAC

100–240 VAC

90–264 VAC

Input Line Frequency Range: Nominal: Maximum:

50–60 Hz

47–63 H z

50–60 Hz 47–63 H z

Power Supply: Maximum Continuous Power:

USDT ST or SFF MT CMT

200 watts 240 watts

300 watts [1]

340 watts

200 watts

240 watts

300 watts [1]

340 watts

Maximum Line Current Draw:

USDT SF or SFF MT CMT

NOTES:

[1] Some MT SKUs shpped with 340-watt power supplies.

4 A @ 100 VAC 5 A @ 100 VAC 8 A @ 100 VAC 6 A @ 100 VAC

2 A @ 200 VAC

2.5 A @ 200 VAC 4 A @ 200 VAC

3.0 A @ 200 VAC

Technical Reference Guide 361834-002 2-29

System Overview

Parameter USDT ST SFF MT CMT [3]

Table 2-8

Physical Specifications

Height 2.95 in

(7.49 cm)

Width 12.4 in

(31.5 cm)

Depth 13.18 in

(33.48 cm)

Weight [1] 13.2 lb [2]

(6.0 kg) [2]

Load-bearing ability of chassis [4]

NOTES:

[1] System weight may vary depending on installed drives/peripherals. [2] Without MultiBay device installed. [3] Minitower configuration. For desktop configuration, swap Height and Width dimensions. [4] Applicable To unit in desktop orientation only and assumes reasonable type of load such

100 lb (45.4 kg)

as a monitor.

3.95 in (10.03 cm)

13.3 in (33.78 cm)

14.9 in (37.85 cm)

19.5 lb (8.8 kg)

100 lb (45.4 kg)

3.95 in (10.03 cm)

13.3 in (33.78 cm)

14.9 in (37.85 cm)

19.5 lb (8.8 kg)

100 lb (45.4 kg)

14.5 in (36.8 cm)

6.88 in

17.5 cm)

16.31 in (41.1 cm)

23.8 lb (10.8 kg)

n/a 100 lb

17.65 in (44.8 cm)

6.60 in (16.8 cm)

17.8 in (45.21 cm)

32.5 lb (14.7 kg)

(45.4 kg)

2-30 361834-002 Technical Reference Guide

Table 2-9

Diskette Drive Specifications

Parameter Measurement

Media Type 3.5 in 1.44 MB/720 KB diskette

Height 1/3 bay (1 in)

Bytes per Sector 512

Sectors per Track:

High Density

Low Density

Tracks per Side:

High Density

Low Density

Read/Write Heads 2

Average Access Time:

Track-to-Track (high/low)

Average (high/low)

Settling Time

Latency Average

80 80

3 ms/6 ms

94 ms/169 ms

15 ms

100 ms

System Overview

Technical Reference Guide 361834-002 2-31

System Overview

Parameter 48x CD-ROM 48/24/28x CD-RW Drive

Interface Type IDE IDE

Table 2-10

Optical Drive Specifications

Media Type (reading)

Media Type (writing) N/a CD-R, CD-RW

Transfer Rate (Reads) 4.8 Kb/s (max sustained) CD-ROM, 4.8 Kb/s;

Transfer Rate (Writes): N/a CD-R, 2.4 Kbps (sustained);

Capacity: Mode 1, 12 cm Mode 2, 12 cm 8 cm

Center Hole Diameter 15 mm 15 mm

Disc Diameter 8/12 cm 8/12 cm

Disc Thickness 1.2 mm 1.2 mm

Track Pitch 1.6 um 1.6 um

Laser Beam Divergence Output Power Type Wave Length

Mode 1,2, Mixed Mode, CD-DA,

Photo CD, Cdi, CD-XA

550 MB 640 MB 180 MB

+/- 1.5 °

0.14 mW GaAs

790 +/- 25 nm

Mode 1,2, Mixed Mode, CD-DA,

Photo CD, Cdi, CD-XA

CD-ROM/CD-R, 1.5-6 Kb/s

CD-RW, 1.5 Kbps (sustained);

650 MB @ 12 cm

53.5 + 1.5°

53.6 0.14 mW GaAs

790 +/- 25 nm

Average Access Time: Random Full Stroke

Audio Output Level 0.7 Vrms 0.7 Vrms

Cache Buffer 128 KB 128 KB

2-32 361834-002 Technical Reference Guide

<100 ms <150 ms

<120 ms <200 ms

Table 2-11

Hard Drive Specifications

Parameter 40 GB 80 GB 160 GB

Drive Size 3.5 in 3.5 in 3.5 in

Interface SATA SATA SATA

Transfer Rate 150 MB/s 150 MB/s 150 MB/s

System Overview

Drive Protection System Support?

Typical Seek Time (w/settling) Single Track Average Full Stroke

Disk Format (logical blocks) 78,165,360 156,301,488 320,173,056

Rotation Speed 5400/7200 5400/7200 7200 RPM

Drive Fault Prediction SMART III SMART III SMART III

Yes Yes Yes

1.2 ms

8.0 ms 18 ms

0.8 ms

9.0 ms 17 ms

0.8 ms 9 ms

17 ms

Technical Reference Guide 361834-002 2-33

System Overview

2-34 361834-002 Technical Reference Guide

3.1 Introduction

This chapter describes the processor/memory subsystem. These systems feature the Intel Pentium 4 processor and the 915G chipset (Figure 3-1). The dx6100 and dc7100 models support PC2700 or PC3200 DDR memory and come standard with PC3200 DIMMs installed. The dx6120 models support PC2-4300 DDR2 DIMMs only.

Processor/Memory Subsystem

Pentium 4 Processor

FSB I/F

82915G

GMCH

Note:

[1] SFF, ST, MT, and CMT models only.

Figure 3-1. Processor/Memory Subsystem Architecture

SDRAM

Cntrl

XMM1

Ch A

DIMM

Ch B

DIMM

XMM3

XMM2 [1]

Ch A

DIMM

Ch B

DIMM

XMM4

This chapter includes the following topics:

■ Pentium 4 processor (3.2), page 3-2

■ Memory subsystem (3.3), page 3-4

Technical Reference Guide 361834-002 3-1

Processor/Memory Subsystem

3.2 Pentium 4 Processor

These systems each feature an Intel Pentium 4 processor in a FC-LGA775 package mounted with a passive heat sink in a zero-insertion force socket. The mounting socket allows the processor to be easily changed for servicing and/or upgrading.

3.2.1 Processor Overview

The Intel Pentium 4 processor represents the latest generation of Intel's IA32-class of processors. Featuring Intel's NetBurst architecture and Hyper-Threading technology, the Pentium 4 processor is designed for intensive multimedia and internet applications of today and the future while maintaining compatibility with software written for earlier (Pentium III, Pentium II, Pentium, Celeron, and x86) microprocessors. Key features of the Pentium 4 processor include:

■ Hyper-Threading Technology—The main processing loop has twice the depth (20 stages) of

earlier processors allowing for increased processing frequencies.

■ Execution Trace Cache— A new feature supporting the branch prediction mechanism, the

trace cache stores translated sequences of branching micro-operations ( ops) and is checked when suspected re-occurring branches are detected in the main processing loop. This feature allows instruction decoding to be removed from the main processing loop.

■ Rapid Execution Engine—Arithmetic Logic Units (ALUs) run at twice (2x) processing

frequency for higher throughput and reduced latency.

■ 1-MB Advanced transfer L2 cache—Using 32-byte-wide interface at processing speed, the

large L2 cache provides a substantial increase.

■ Advanced dynamic execution—Using a larger (4K) branch target buffer and improved

prediction algorithm, branch mis-predictions are reduced by an average of 33 % over the Pentium III.

■ Enhanced Floating Point Processor —With 128-bit integer processing and deeper pipelining

the Pentium 4's FPU provides a 2x performance boost over the Pentium III.

■ Additional Streaming SIMD extensions (SSE2)—In addition to the SSE support provided by

previous Pentium processors, the Pentium 4 processor includes an additional 144 MMX instructions, further enhancing:

❏ Streaming video/audio processing

❏ Photo/video editing

❏ Speech recognition

❏ 3D processing

❏ Encryption processing

■ Quad-pumped Front Side Bus (FSB)—The FSB uses a 200-MHz clock for qualifying the

buses' control signals. However, address information is transferred using a 2x strobe while data is transferred with a 4x strobe, providing a maximum data transfer rate that is four times that of earlier processors.

3-2 361834-002 Technical Reference Guide

Processor/Memory Subsystem

Figure 3-2 illustrates the internal architecture of the Intel Pentium 4 processor.

Pentium 4 Processor

Branch

Prediction

Rapid Exe. Eng.

ALUs

Core speed

Pentium Type Core Speed ALU Speed FSB Speed L2 Cache Size

P4 560 P4 550 P4 540 P4 530 P4 520

16-K Execution

Trace Cache

CPU

Out-of-Order

Core

ALU Speed (Core speed x2)

3.60 GHz 7. 2 G Hz 800 MHz 1 MB

3.40 GHz 6.8 GHz 800 MHz 1 MB

3.20 GHz 6.4 GHz 800 MHz 1 MB

3.00 GHz 6.0 GHz 800 MHz 1 MB

2.80 GHz 5.6 GHz 800 MHz 1 MB

128-bit Integer

FPU

FSB

I/F

Cache

FSB speed (max. data transfer rate)

8-K

Data

1-MB

Adv..

Transfer

Cache

Figure 3-2. Pentium 4 Processor Internal Architecture

The Intel Pentium 4 increases processing speed by using higher clock speeds with hyper-pipelined technology, therefore handling significantly more instructions at a time. The Pentium 4 features a branch prediction mechanism improved with the addition of an execution trace cache and a refined prediction algorithm. The execution trace cache can store 12 kilobytes of micro-ops (decoded instructions dealing with branching sequences) that are checked when re-occurring branches are processed. Code that is not executed (bypassed) is no longer stored in the L1 cache as was the case in the Pentium III.

The front side bus (FSB) of the Pentium 4 uses a 200-MHz clock but provides bi- and quad-pumped transfers through the use of 2x- and 4x-MHz strobes. The Pentium 4 processor is compatible with software written for x86 processors.

3.2.2 Processor Upgrading

All units use the LGA775 ZIF (Socket T) mounting socket. These systems require that the processor use an integrated heatsink/fan assembly. A replacement processor must use the same type heatsink/fan assembly as the original to ensure proper cooling.

The processor uses a PLGA775 package consisting of the processor die mounted “upside down” on a PC board. This arrangement allows the heat sink to come in direct contact with the processor die. The heat sink and attachment clip are specially designed provide maximum heat transfer from the processor component.

CAUTION: Attachment of the heatsink to the processor is critical on these systems. Improper attachment

of the heatsink will likely result in a thermal condition. Although the system is designed to detect thermal conditions and automatically shut down, such a condition could still result in damage to the processor component. Refer to the applicable Service Reference Guide for processor installation instructions.

CAUTION: Installing a processor that is not supported by the system board may cause damage to the

system board and/or the processor.

Technical Reference Guide 361834-002 3-3

Processor/Memory Subsystem

3.3 Memory Subsystem

The dx6100 and dc7100 models support PC2700 or PC3200 DDR memory and come standard with PC3200 DIMMs installed. The dx6120 models support PC2-4300 DDR2 memory only.

The DDR SDRAM “PCxxxx” reference designates bus bandwidth (i.e., a PC2700 DIMM can,

✎

operating at a 333-MHz effective speed, provide a throughput of 2700 MBps (8 bytes × 333MHz)). Memory speed types may be mixed within a system, although the system BIOS will set the memory controller to work at speed of the slowest DIMM.

The system board provides three or four DIMM sockets depending on form factor:

■ XMM1 (black connector), channel A (all form factors

■ XMM2 (DDR, blue connector; DDR2, white connector), channel A (SFF, ST, MT, and CMT

form factors only)

■ XMM3 (black connector), channel B (all form factors)

■ XMM4 (DDR, blue connector; DDR2, white connector), channel B (all form factors)

DIMMs do not need to be installed in pairs although installation of pairs (an equal DIMM for each channel) provides the best performance. The BIOS will detect the DIMM population and set the system accordingly as follows:

■ Single-channel mode - DIMMs installed for one channel only

■ Dual-channel asymetric mode - DIMMs installed for both channels but of unequal channel

capacities.

■ Dual-channel interleaved mode (recommended)- DIMMs installed for both channels and

offering equal channel capacities, proving the highest performance.

These systems require DIMMs with the following parameters:

■ Unbuffered, compatible with SPD rev. 1.0

■ 256-Mb, 512-Mb, and 1-Gb memory technology

■ x8 and x16 DDR devices

■ CAS latency (CL) of 2.5 or 3

■ Single or double-sided

■ Non-ECC memory only

The SPD format supported by these systems complies with the JEDEC specification for 128-byte EEPROMs. This system also provides support for 256-byte EEPROMs to include additional HP-added features such as part number and serial number. The SPD format as supported in this system (SPD rev. 1) is shown in Table 3-1.

If BIOS detects an unsupported DIMM, a “memory incompatible” message will be displayed and the system will halt. These systems are shipped with non-ECC DIMMs only. Refer to chapter 8 for a description of the BIOS procedure of interrogating DIMMs.

An installed mix of DIMM types (i.e., PC2700 and PC3200, CL 2 and CL 3) is acceptable but operation will be constrained to the level of the DIMM with the lowest (slowest) performance specification.

If an incompatible DIMM is detected the NUM LOCK will blink for a short period of time during POST and an error message may or may not be displayed before the system hangs.

3-4 361834-002 Technical Reference Guide

Processor/Memory Subsystem

Table 3-1 shows suggested memory configurations for these systems.

NOTE: Table 3-1 does not list all possible configurations. Balanced-capacity, dual-channel loading yields best performance.

Table 3-1.

DIMM Socket Loading

Channel A Channel B

Socket 1 Socket 2 [1] Socket 3 Socket 4 Total

128-MB none none none 128-MB 128-MB none 128-MB none 256-MB (dual-channel) 128-MB 128-MB 128-MB none 384-MB (dual-channel) 128-MB 128-MB 128-MB 128-MB 512-MB (dua- channel) 256-MB none none none 256-MB 256-MB none 256-MB none 512-MB (dual-channel) 512-MB none none none 512-MB 512-MB none 512-MB none 1-GB (dual-channel)

1-GB none none none 1-GB 1-GB none 1-GB none 2-GB (dual-channel) 1-GB 1-GB 1-GB none 3-GB (dual-channel) 1-GB 1-GB 1-GB 1-GB 4-GB (dual-channel)

NOTE: [1] SFF, ST, MT, and CMT form factors only.

DDR and DDR2 DIMMs are NOT interchangeable. Memory type is defined by the system

✎

board.

Technical Reference Guide 361834-002 3-5

Processor/Memory Subsystem

The SPD address map is shown in Table 3-2.

Byte Description Notes Byte Description Notes

0 No. of Bytes Written Into EEPROM [1] 25 Min. CLK Cycle Time at CL X-2 [7]

1 Total Bytes (#) In EEPROM [2] 26 Max. Acc. Time From CLK @ CL X-2 [7]

2 Memory Type 27 Min. Row Prechge. Time [7]

3 No. of Row Addresses On DIMM [3] 28 Min. Row Active to Delay [7]

4 No. of Column Addresses On DIMM 29 Min. RAS to CAS Delay [7]

5 No. of Module Banks On DIMM 30-31 Reserved

6, 7 Data Width of Module 32-61 Superset Data [7]

8 Voltage Interface Standard of DIMM 62 SPD Revision [7]

9 Cycletime @ Max CAS Latency (CL) [4] 63 Checksum Bytes 0-62

10 Access From Clock [4] 64-71 JEP-106E ID Code [8]

11 Config. Type (Parity, Nonparity...) 72 DIMM OEM Location [8]

12 Refresh Rate/Type [4][5] 73-90 OEM’s Part Number [8]

13 Width, Primary DRAM 91-92 OEM’s Rev. Code [8]

14 Error Checking Data Width 93-94 Manufacture Date [8]

15 Min. Clock Delay [6] 95-98 OEM’s Assembly S/N [8]

16 Burst Lengths Supported 99-

17 No. of Banks For Each Mem. Device [4] 126 Intel frequency check

18 CAS Latencies Supported [4] 127 Reserved

19 CS# Latency [4] 128 - 131 Compaq header “CPQ1” [9]

20 Write Latency [4] 132 Header checksum [9]

21 DIMM Attributes 133 - 145 Unit serial number [9][10]

22 Memory Device Attributes 146 DIMM ID [9][11]

23 Min. CLK Cycle Time at CL X-1 [7] 147 Checksum [9]

24 Max. Acc. Time From CLK @ CL X-1 [7] 148 Reserved [9]

Table 3-2

SPD Address Map (SDRAM DIMM)

125

OEM Specific Data [8]

NOTES:

[1] Programmed as 128 bytes by the DIMM OEM [2] Must be programmed to 256 bytes. [3] High order bit defines redundant addressing: if set (1), highest order RAS# address must be re-sent as highest order CAS#

address. [4] Refer to memory manufacturer’s datasheet [5] MSb is Self Refresh flag. If set (1), assembly supports self refresh. [6] Back-to-back random column addresses. [7] Field format proposed to JEDEC but not defined as standard at publication time. [8] Field specified as optional by JEDEC but required by this system. [9] HP usage. This system requires that the DIMM EEPROM have this space available for reads/writes. [10] Serial # in ASCII format (MSB is 133). Intended as backup identifier in case vender data is invalid. Can also be used to indicate s/n mismatch and flag system adminstrator of possible system Tampering. [11]Contains the socket # of the module (first module is “1”). Intended as backup identifier (refer to note [10]).

3-6 361834-002 Technical Reference Guide

Figure 3-3 shows the system memory map.

Processor/Memory Subsystem

Main Memory Area

DOS Compatibilty Area

FFFF FFFFh

FFE0 0000h

F000 0000h

0100 0000h

00FF FFFFh

0010 0000h

000F FFFFh

0000 0000h

High BIOS Area

DMI/APIC

Area

PCI

Memory

Area

IGC (1-32 MB)

TSEG

Main

Memory

Main

Memory

BIOS

Extended BIOS

Expansion Area

Legacy Video

Base Memory

4 GB

Top of DRAM

16 MB

1 MB

640 KB

All locations in memory are cacheable. Base memory is always mapped to DRAM. The next 128

✎

KB fixed memory area can, through the north bridge, be mapped to DRAM or to PCI space. Graphics RAM area is mapped to PCI or AGP locations.

Figure 3-3. System Memory Map

Technical Reference Guide 361834-002 3-7

Processor/Memory Subsystem

3-8 361834-002 Technical Reference Guide

4.1 Introduction

This chapter covers subjects dealing with basic system architecture and covers the following topics:

■ PCI bus overview (4.2), page 4-1

■ System resources (4.3), page 4-11

■

Real-time clock and configuration memory (4.4

■ System management (4.5), page 4-21

■

This chapter covers functions provided by off-the-shelf chipsets and therefore describes only basic aspects of these functions as well as information unique to the systems covered in this guide. For detailed information on specific components, refer to the applicable manufacturer's documentation.

System Support

), page 4-19

), page 4-26

4.2 PCI Bus Overview

This section describes the PCI bus in general and highlights bus implementation in this particular

✎

system. For detailed information regarding PCI bus operation, refer to the appropriate PCI specification or the PCI web site: www.pcisig.com.

These systems implement the following types of PCI buses:

■ PCI 2.3 - Legacy parallel interface operating at 33-MHz

■ PCI Express - High-performance interface capable of using multiple TX/RX high-speed

lanes of serial data streams

The PCI bus handles address/data transfers through the identification of devices and functions on the bus. A device is typically defined as a component or slot that resides on the PCI bus (although some components such as the GMCH and ICH6 are organized as multiple devices). A function is defined as the end source or target of the bus transaction. A device may contain one or more functions. In the standard configuration these systems use a hierarchy of three PCI buses (Figure 4-1). The PCI bus #0 is internal to the chipset components and is not physically accessible. The Direct Media Interface (DMI) links the GMCH and ICH6 components and operates as a subset of the PCI bus. All PCI slots and the NIC function internal to the ICH6 reside on PCI bus #2.

Technical Reference Guide 361834-002 4-1

System Support

82915G/GV [1]

Memory

Cntlr

Function

Host-DMI Bridge

DMI Link

DMI

PCI 2.3

Bridge

Function

Notes:

[1] USDT form factor; 82915GV; SFF, ST, MT, and CMT form factors, 82915G [2] SFF. ST, MT, and CMT form factors only.

GMCH

PCI Bus 0

PCI Exp.

Por t 1

Function

PCI 2.3 slot(s)

Integrated

Graphics

Controller

Host-PCI Exp.

Bridge

82801 ICH6

PCI Exp.

Por t 2

Function

PCI Express x1 slot [1]

PCI Bus 1

IDE

Cntlr

Function

NIC

Cntlr

RGB Monitor

PCI Express x16 graphics slot [2]

SATA Cntlr

Function

USB I/F

Cntlr

Function

LPC

Bridge

Function

AC97

Cntlr

Function

Figure 4-1. PCI Bus Devices and Functions

4.2.1 PCI 2.3 Bus Operation

The PCI 2.3 bus consists of a 32-bit path (AD31-00 lines) that uses a multiplexed scheme for handling both address and data transfers. A bus transaction consists of an address cycle and one or more data cycles, with each cycle requiring a clock (PCICLK) cycle. High performance is realized during burst modes in which a transaction with contiguous memory locations requires that only one address cycle be conducted and subsequent data cycles are completed using auto-incremented addressing. Four types of address cycles can take place on the PCI bus; I/O, memory, configuration, and special. Address decoding is distributed (left up to each device on the PCI bus).

I/O and Memory Cycles

For I/O and memory cycles, a standard 32-bit address decode (AD31..0) for byte-level addressing is handled by the appropriate PCI device. For memory addressing, PCI devices decode the AD31..2 lines for dword-level addressing and check the AD1,0 lines for burst (linear-incrementing) mode. In burst mode, subsequent data phases are conducted a dword at a time with addressing assumed to increment accordingly (four bytes at a time).

4-2 361834-002 Technical Reference Guide

System Support

Configuration Cycles

Devices on the PCI bus must comply with PCI protocol that allows configuration of that device by software. In this system, configuration mechanism #1 (as described in the PCI Local Bus specification Rev. 2.3) is employed. This method uses two 32-bit registers for initiating a configuration cycle for accessing the configuration space of a PCI device. The configuration address register (CONFIG_ADDRESS) at 0CF8h holds a value that specifies the PCI bus, PCI device, and specific register to be accessed. The configuration data register (CONFIG_DATA) at 0CFCh contains the configuration data.

PCI Configuration Data Register

I/O Port 0CFCh, R/W, (8-, 16-, 32-bit access)

Bit Function Bit Function

31 Configuration Enable

0 = Disabled 1 = Enable

30..24 Reserved—read/write 0s

23..16 Bus Number. Selects PCI bus

15..11 PCI Device Number. Selects PCI device for access

10..8 Function Number. Selects function of selected PCI device.

7..2 Register Index. Specifies config. reg.

1,0 Configuration Cycle Type ID.

00 = Type 0 01 = Type 1

PCI Configuration Address Register I/O Port 0CF8h, R/W, (32-bit access only)

31..0 Configuration Data.

Two types of configuration cycles are used. A Type 0 (zero) cycle is targeted to a device on the PCI bus on which the cycle is running. A Type 1 cycle is targeted to a device on a downstream PCI bus as identified by bus number bits <23..16>. With three or more PCI buses, a PCI bridge may convert a Type 1 to a Type 0 if it's destined for a device being serviced by that bridge or it may forward the Type 1 cycle unmodified if it is destined for a device being serviced by a downstream bridge. Figure 4-2 shows the configuration cycle format and how the loading of 0CF8h results in a Type 0 configuration cycle on the PCI bus. The Device Number (bits <15..11> determines which one of the AD31..11 lines is to be asserted high for the IDSEL signal, which acts as a “chip select” function for the PCI device to be configured. The function number (CF8h, bits <10..8>) is used to select a particular function within a PCI component.

Results in:

(w/Type 00

Config. Cycle)

NOTES:

32211118

Reserved

AD31..0

[1] Bits <1,0> : 00 = Type 0 Cycle, 01 = Type 1 cycle Type 01 cycle only. Reserved on Type 00 cycle.

IDSEL (only one signal line asserted)

Bus

Number

Device

Number

Function Number

7 2 1 0 [1]

Index

Figure 4-2. Configuration Cycle

Technical Reference Guide 361834-002 4-3

System Support

Table 4-1 shows the standard configuration of device numbers and IDSEL connections for components and slots residing on a PCI 2.3 bus.

PCI Component Notes Function # Device #

82915G GMCH:

PCI Express x16 graphics slot [1] 0 0 32 --

82801EB ICH6

PCI 2.3 slot 1 0 4 8 AD20

Host/DMI Bridge Host/PCI Expr. Bridge Integrated Graphics Cntlr.

PCI Bridge LPC Bridge

IDE Controller Serial ATA Controller SMBus Controller USB I/F #1 USB I/F #2 USB I/F #3

USB I/F #4

USB 2.0 Controller AC97 Audio Controller AC97 Modem Controller Network Interface Controller

PCI Express port 1 PCI Express port 2

Table 4-1

PCI Component Configuration Access

[1] [1]

0 1 0

0 0 1 2 3 0 1 2 3 7 2 3 0 0 1

28 28

30 31 31 31 31 29 29 29 29 29 30 30

0 28 28

PCI Bus

0 0 0

0 0 0 0 0 0 0 0 0 0 0 0

0 0

IDSEL

Wired to:

PCI 2.3 slot 2 [2] 0 9 8 AD25

PCI 2.3 slot 3 [3] 0 10 8 AD27

PCI 2.3 slot 4 [3] 0 11 8 AD29

NOTES: [1] Not used in these systems. [2] SFF, ST, MT, & CMT form factors only. [3] CMT form factor with PCI expansion board.

4-4 361834-002 Technical Reference Guide

System Support

The register index (CF8h, bits <7..2>) identifies the 32-bit location within the configuration space of the PCI device to be accessed. All PCI devices can contain up to 256 bytes of configuration data (Figure 4-3), of which the first 64 bytes comprise the configuration space header.

Configuration

Space

Header

31 24 23 16 15 8 7 0

Device-Specific Area

Reserved Reserved

Expansion ROM Base Address

Subsystem Vendor IDSubsystem ID

Card Bus CIS Pointer

Base Address Registers

BIST Hdr. Type

Status

Device ID

Int. LineInt. Pin Min. GNT Min. Lat.

Line SizeLat. Timer

Command Vendor ID

Index

FCh

40h

3Ch

38h 34h 30h

2Ch

28h

10h

0Ch

08h 04h

00h

PCI Configuration Space Type 0

Data required by PCI protocol

Figure 4-3. PCI Configuration Space Mapping

PCI 2.3 Bus Master Arbitration

Not required

31 24 23 16 15 8 7 0

Device-Specific Area

Bridge Control

Expansion ROM Base Address

Prefetchable Limit Upper 32 Bits Prefetchable Base Upper 32 Bits

Prefetch. Mem. Limit Prefetch. Mem. Base

Lat.Tmr

BIST Hdr. Type

Status

Device ID

Reserved

I/O Base Upper 16 Bits

Memory BaseMemory Limit

Base Address Registers

Int. LineInt. Pin

I/O BaseI/O Limit Secondary Status

Pri. Bus #Sec. Bus # Sub. Bus # 2

Line SizeLat. Timer

Command Vendor ID

PCI Configuration Space Type 1

Index

FCh

40h

3Ch

38h 34h 30h

2Ch 28h

24h 20h

1Ch

18h

10h

0Ch 08h

04h 00h

The PCI bus supports a bus master/target arbitration scheme. A bus master is a device that has been granted control of the bus for the purpose of initiating a transaction. A target is a device that is the recipient of a transaction. The Request (REQ), Grant (GNT), and FRAME signals are used by PCI bus masters for gaining access to the PCI bus. When a PCI device needs access to the PCI bus (and does not already own it), the PCI device asserts it's REQn signal to the PCI bus arbiter (a function of the system controller component). If the bus is available, the arbiter asserts the GNTn signal to the requesting device, which then asserts FRAME and conducts the address phase of the transaction with a target. If the PCI device already owns the bus, a request is not needed and the device can simply assert FRAME and conduct the transaction. Table 4-3 shows the grant and request signals assignments for the devices on the PCI bus.

Technical Reference Guide 361834-002 4-5

System Support

Device REQ/GNT Line Note

PCI Connector Slot 1 REQ0/GNT0

PCI Connector Slot 2 REQ1/GNT1 [1]

PCI Connector Slot 3 REQ2/GNT2 [2]

PCI Connector Slot 4 REQ3/GNT3 [2]

PCI bus arbitration is based on a round-robin scheme that complies with the fairness algorithm specified by the PCI specification. The bus parking policy allows for the current PCI bus owner (excepting the PCI/ISA bridge) to maintain ownership of the bus as long as no request is asserted by another agent. Note that most CPU-to-DRAM and AGP-to-DRAM accesses can occur concurrently with PCI traffic, therefore reducing the need for the Host/PCI bridge to compete for PCI bus ownership.

Table 4-3.

PCI Bus Mastering Devices

NOTE: [1]SFF, ST, MT, and CMT form factors only. [2] CMT form factor with PCI expansion board

4.2.2 PCI Express Bus Operation

The PCI Express bus is a high-performace extension of the legacy PCI bus specification. The PCI Express bus uses the following layers:

■ Software/driver layer

■ Transaction protocol layer

■ Link layer

■ Physical layer

Software/Driver Layer

The PCI Express bus maintains software compatibility with PCI 2.3 and earlier versions so that there is no impact on existing operating systems and drivers. During system intialization, the PCI Express bus uses the same methods of device discovery and resource allocation that legacy PCI-based operating systems and drivers are designed to use. The use of PCI configuration space and the programmability of I/O devices are also used in the same way as for legacy PCI buses. The software/driver layer provides read and write requests to the transaction layer for handling a data transfer.

Transaction Protocol Layer

The transaction protocol layer processes read and write requests from the software/driver layer and generates request packets for the link layer. Each packet includes an identifier allowing any required responcse packets to be directed to the originator.

PCI Express protocol supports the three legacy PCI address spaces (memory, I/O, configuration) as well as a new message space. The message space allows in-band processing of interrupts through use of the Message Signal Interrupt (MSI) introduced with the PCI 2.2 specification. The MSI method eliminates the need for hard-wired sideband signals by incorporating those functions into packets.

4-6 361834-002 Technical Reference Guide

System Support

Link Layer

The link layer provides data integrity by adding a sequence information prefix and a CRC suffix to the packet created by the transaction layer. Flow-control methods ensure that a packet will only be transferred if the receiving device is ready to accomodate it. A corrupted packet will be automatically re-sent.

Physical Layer

The PCI Express bus uses a point-to-point, high-speed TX/RX serial lane topology. that can be scalable as to the the end point’s requirements. One or more full-duplex lanes transfer data serially. Each lane consists of two differential pairs of signal paths (Figure 4-4), one for transmit, one for receive.

System Board

Device A

PCI Express Card

Device B

Figure 4-4. PCI Express Bus Lane

Each byte is transferred using 8b/10b encoding. which embeds the clock signal with the data. Operating at a 2.5 Gigabit transfer rate, a single lane can provide a data flow of 200 MBps. The bandwidth is increased if additional lanes are available for use. During the initialization process, two PCI Express devices will negotiate for the number of lanes available and the speed the link can operate at.

In a x1 (single lane) interface, all data bytes are transferred serially over the lane. In a multi-lane interface, data bytes are distributed across the lanes using a multiplex scheme as shown in Table 4-4:

Table 4-4.

PCI Express Byte Transfer

x1 Transfer

Byte #

00 0 0 10 1 1 20 2 2 30 3 3 40 0 4 50 1 5 60 2 6 70 3 7

Lane #

x4 Transfer Lane #

x8 Transfer Lane #

Technical Reference Guide 361834-002 4-7

System Support

For a PCI Express x16 transfer, a lane will be re-used every17th byte of a transfer. The mux-demux process provided by the physical layer is transparent to the other layers and to software/drivers.

The SFF, ST, MT MT, and CMT forma factors provide two PCI Express slots: a PCI Express x16 (16-lane) slot specifically designed for a graphics controller, and a general purpose PCI Express x1 (1-lane) slot.

4.2.3 Option ROM Mapping

During POST, the PCI bus is scanned for devices that contain their own specific firmware in ROM. Such option ROM data, if detected, is loaded into system memory's DOS compatibility area (refer to the system memory map shown in chapter 3).

4.2.4 PCI Interrupts

Eight interrupt signals (INTA- thru INTH-) are available for use by PCI devices. These signals may be generated by on-board PCI devices or by devices installed in the PCI slots. For more information on interrupts including PCI interrupt mapping refer to the “System Resources” section 4.3.

4.2.5 PCI Power Management Support

This system complies with the PCI Power Management Interface Specification (rev 1.0). The PCI Power Management Enable (PME-) signal is supported by the chipset and allows compliant PCI peripherals to initiate the power management routine.

4-8 361834-002 Technical Reference Guide

4.2.6 PCI Connectors

PCI 2.3 Connector

System Support

A49

B49

A52

B52

A62

B62

Figure 4-5. PCI 2.3 Bus Connector (32-Bit, 5.0-volt Type)

PCI 2.3 Bus Connector Pinout

Pin B Signal A Signal Pin B Signal A Signal Pin B Signal A Signal

01 -12 VDC TRST- 22 GND AD28 43 +3.3 VDC PAR

02 TCK +12 VDC 23 AD27 AD26 44 C/BE1- AD15

03 GND TMS 24 AD25 GND 45 AD14 +3.3 VDC

04 TDO TDI 25 +3.3 VDC AD24 46 GND AD13

05 +5 VDC +5 VDC 26 C/BE3- IDSEL 47 AD12 AD11

06 +5 V DC INTA- 27 AD23 +3.3 VDC 48 AD10 GN D

07 INT B- INTC - 28 G ND AD 22 49 GND AD 09

08 INTD- +5 VDC 29 AD21 AD20 50 Key Key

09 PRSNT1- Reserved 30 AD19 GND 51 Key Key

10 RSVD +5 VDC 31 +3.3 VDC AD18 52 AD08 C/BE0-

11 PRSNT2- Reserved 32 AD17 AD16 53 AD07 +3.3 VDC

12 GND GND 33 C/BE2- +3.3 VDC 54 +3.3 VDC AD06

13 GND GND 34 GND FRAME- 55 AD05 AD04

14 RSVD +3.3 AUX 35 IRDY- GND 56 AD03 GND

15 GND RST- 36 +3.3 VDC TRDY- 57 GND AD02

16 CLK +5 VDC 37 DEVSEL- GND 58 AD01 AD00

17 GND GNT- 38 GND STOP- 59 +5 VDC +5 VDC

18 REQ- GND 39 LOCK- +3.3 VDC 60 ACK64- REQ64-

19 +5 VDC PME- 40 PERR- SDONE n 61 +5 VDC +5 VDC

20 AD31 AD30 41 +3.3 VDC SBO- 62 +5 VDC +5 VDC

21 AD29 +3.3 VDC 42 SERR- GND

Table 4-5.

Technical Reference Guide 361834-002 4-9

System Support

PCI Express Connectors

A11

A12

A18

x1 Connector

x16 Connector

B11

B12

Figure 4-6. PCI Express Bus Connectors

Table 4-6.

PCI Express Bus Connector Pinout

Pin B Signal A Signal Pin B Signal A Signal Pin B Signal A Signal

01 +12 VDC PRSNT1# 29 GND PERp3 57 GND PERn9

02 +12 VDC +12 VDC 30 RSVD PERn3 58 PETp10 GND

03 RSVD +12 VDC 31 PRSNT2# GND 59 PETn10 GND

04 GND GND 32 GND RSVD 60 GND PERp10

05 SMCLK +5 VDC 33 PETp4 RSVD 61 GND PERn10

06 +5 VDC JTAG2 34 PETn4 GND 62 PETp11 GND

07 GND JTAG4 35 GND PERp4 63 PETn11 GND

08 +3.3 VDC JTAG5 36 GND PERn4 64 GND PERp11

09 JTAG1 +3.3 VDC 37 PETp5 GND 65 GND PERn11

10 3.3 Vaux +3.3 VDC 38 PETn5 GND 66 PETp12 GND

11 WAKE PERST# 39 GND PERp5 67 PETn12 GND

12 RSVD GND 40 GND PERn5 68 GND PERp12

13 GND REFCLK+ 41 PETp6 GND 69 GND PERn12

14 PETp0 REFCLK- 42 PETn6 GND 70 PETp13 GND

15 PETn0 GND 43 GND PERp6 71 PETn13 GND

16 GND PERp0 44 GND PERn6 72 GND PERp13

17 PRSNT2# PERn0 45 PETp7 GND 73 GND PERn13

18 GND GND 46 PETn7 GND 74 PETp14 GND

19 PETp1 RSVD 47 GND PERp7 75 PETn14 GND

20 PETn1 GND 48 PRSNT2# PERn7 76 GND PERp14

21 GND PERp1 49 GND GND 77 GND PERn14

22 GND PERn1 50 PET p8 RSV D 78 PETp15 G ND

23 PETp2 GND 51 PETn8 GND 79 PETn15 GND

24 PETn2 GND 52 GND PERp8 80 GND PERp15

25 GND PERp2 53 GND PERn8 81 PRSNT2# PERn15

26 GND PE Rn2 54 PET p9 GND 82 RSVD GND

27 PETp3 GND 55 PETn9 GND

28 PETn3 GND 56 GND PERp9

A82

B82

4-10 361834-002 Technical Reference Guide

4.3 System Resources

This section describes the availability and basic control of major subsystems, otherwise known as resource allocation or simply “system resources.” System resources are provided on a priority basis through hardware interrupts and DMA requests and grants.

4.3.1 Interrupts

The microprocessor uses two types of hardware interrupts; maskable and nonmaskable. A maskable interrupt can be enabled or disabled within the microprocessor by the use of the STI and CLI instructions. A nonmaskable interrupt cannot be masked off within the microprocessor, although it may be inhibited by hardware or software means external to the microprocessor.

Maskable Interrupts

The maskable interrupt is a hardware-generated signal used by peripheral functions within the system to get the attention of the microprocessor. Peripheral functions produce a unique INTA-H (PCI) or IRQ0-15 (ISA) signal that is routed to interrupt processing logic that asserts the interrupt (INTR-) input to the microprocessor. The microprocessor halts execution to determine the source of the interrupt and then services the peripheral as appropriate.

Most IRQs are routed through the I/O controller of the super I/O component, which provides the serializing function. A serialized interrupt stream is then routed to the ICH component.

System Support

Interrupts may be processed in one of two modes (selectable through the F10 Setup utility):

■ 8259 mode

■ APIC mode

These modes are described in the following subsections.

Technical Reference Guide 361834-002 4-11

System Support

8259 Mode

The 8259 mode handles interrupts IRQ0-IRQ15 in the legacy (AT-system) method using 8259-equivalent logic. Table 4-7 lists the standard source configuration for maskable interrupts and their priorities in 8259 mode. If more than one interrupt is pending, the highest priority (lowest number) is processed first.

Table 4-7.

Maskable Interrupt Priorities and Assignments

Priority Signal Label Source (Typical)

1 IRQ0 Interval timer 1, counter 0

2 IRQ1 Keyboard

3 IRQ8- Real-time clock

4 IRQ9 Unused

5 IRQ10 PCI devices/slots

6 IRQ11 Audio codec

7 IRQ12 Mouse

8 IRQ13 Coprocessor (math)

9 IRQ14 Primary IDE controller

10 IRQ15 Sec. IDE I/F controller (not available on SATA units)

11 IRQ3 Serial port (COM2)

12 IRQ4 Serial port (COM1)

13 IRQ5 Network interface controller

14 IRQ6 Diskette drive controller

15 IRQ7 Parallel port (LPT1)

-- IRQ2 NOT AVAILABLE (Cascade from interrupt controller 2)

4-12 361834-002 Technical Reference Guide

System Support

APIC Mode

The Advanced Programmable Interrupt Controller (APIC) mode provides enhanced interrupt processing with the following advantages:

■ Eliminates the processor's interrupt acknowledge cycle by using a separate (APIC) bus

■ Programmable interrupt priority

■ Additional interrupts (total of 24)

The APIC mode accommodates eight PCI interrupt signals (INTA-..INTH-) for use by PCI devices. The PCI interrupts are evenly distributed to minimize latency and wired as follows:

PCI Slot 1

INTA-

INTB- —

INTC- INTB-

INTD- —

INTE- —

INTF- INTC-

INTG- INTD-

INTH- —

NOTES: [1] Connection internal to the ICH. Will be reported by BIOS as using INTA but is NOT shared with

other functions using INTA.

Wired to

MT, CMT form factors only. SFF, ST, MT, CMT form factors only.

INTA-

PCI Slot 2

INTD- INTB- INTD-

— — —

INTA- INTC- INTA-

— — —

INTB- INTD- INTB-

INTC- INTA- INTC-

— — —

PCI Slot 3

PCI Slot 4

The PCI interrupts can be configured by PCI Configuration Registers 60h..63h to share the standard ISA interrupts (IRQn).

The APIC mode is supported by the Windows NT, Windows 2000, and Windows XP operating

✎

systems. Systems running the Windows 95 or 98 operating system will need to run in 8259 mode.

Technical Reference Guide 361834-002 4-13

System Support

Maskable Interrupt processing is controlled and monitored through standard AT-type I/O-mapped registers. These registers are listed in Table 4-8.

I/O Port Register

020h Base Address, Int. Cntlr. 1 021h Initialization Command Word 2-4, Int. Cntlr. 1 0A0h Base Address, Int. Cntlr. 2 0A1h Initialization Command Word 2-4, Int. Cntlr. 2

The initialization and operation of the interrupt control registers follows standard AT-type protocol.

Non-Maskable Interrupts

Non-maskable interrupts cannot be masked (inhibited) within the microprocessor itself but may be maskable by software using logic external to the microprocessor. There are two non-maskable interrupt signals: the NMI- and the SMI-. These signals have service priority over all maskable interrupts, with the SMI- having top priority over all interrupts including the NMI-.

Table 4-8.

Maskable Interrupt Control Registers

NMI- Generation

The Non-Maskable Interrupt (NMI-) signal can be generated by one of the following actions:

■ Parity errors detected on a PCI bus (activating SERR- or PERR-).

■ Microprocessor internal error (activating IERRA or IERRB)

The SERR- and PERR- signals are routed through the ICH6 component, which in turn activates the NMI to the microprocessor.

4-14 361834-002 Technical Reference Guide

System Support

The NMI Status Register at I/O port 061h contains NMI source and status data as follows:

NMI Status Register 61h

Bit Function

7NMI Status:

0 = No NMI from system board parity error. 1 = NMI requested, read only

6 IOCHK- NMI:

0 = No NMI from IOCHK-

1 = IOCHK- is active (low), NMI requested, read only 5 Interval Timer 1, Counter 2 (Speaker) Status 4 Refresh Indicator (toggles with every refresh) 3 IOCHK- NMI Enable/Disable:

0 = NMI from IOCHK- enabled

1 = NMI from IOCHK- disabled and cleared (R/W) 2 System Board Parity Error (PERR/SERR) NMI Enable:

0 = Parity error NMI enabled

1 = Parity error NMI disabled and cleared (R/W) 1 Speaker Data (R/W) 0 Inteval Timer 1, Counter 2 Gate Signal (R/W)

0 = Counter 2 disabled

1 = Counter 2 enabled

Functions not related to NMI activity

After the active NMI has been processed, status bits <7> or <6> are cleared by pulsing bits <2> or <3> respectively.

The NMI Enable Register (070h, <7>) is used to enable/disable the NMI signal. Writing 80h to this register masks generation of the NMI-. Note that the lower six bits of register at I/O port 70h affect RTC operation and should be considered when changing NMI- generation status.

SMI- Generation

The SMI- (System Management Interrupt) is typically used for power management functions. When power management is enabled, inactivity timers are monitored. When a timer times out, SMI- is asserted and invokes the microprocessor's SMI handler. The SMI- handler works with the APM BIOS to service the SMI- according to the cause of the timeout.

Although the SMI- is primarily used for power management the interrupt is also employed for the QuickLock/QuickBlank functions as well.

Technical Reference Guide 361834-002 4-15

System Support

4.3.2 Direct Memory Access

Direct Memory Access (DMA) is a method by which a device accesses system memory without involving the microprocessor. Although the DMA method has been traditionally used to transfer blocks of data to or from an ISA I/O device, PCI devices may also use DMA operation as well. The DMA method reduces the amount of CPU interactions with memory, freeing the CPU for other processing tasks.

This section describes DMA in general. For detailed information regarding DMA operation, refer

✎

to the data manual for the Intel 82801 I/O Controller Hub.

The 82801 ICH6 component includes the equivalent of two 8237 DMA controllers cascaded together to provide eight DMA channels, each (excepting channel 4) configurable to a specific device. Table 4-9 lists the default configuration of the DMA channels.

Table 4-9.

Default DMA Channel Assignments

DMA Channel Device ID

Controller 1 (byte transfers) 0 1 2 3 Controller 2 (word transfers) 4 5 6 7

Spare Audio subsystem Diskette drive Parallel port

Cascade for controller 1 Spare Spare Spare

All channels in DMA controller 1 operate at a higher priority than those in controller 2. Note that channel 4 is not available for use other than its cascading function for controller 1. The DMA controller 2 can transfer words only on an even address boundary. The DMA controller and page register define a 24-bit address that allows data transfers within the address space of the CPU.

In addition to device configuration, each channel can be configured (through PCI Configuration Registers) for one of two modes of operation:

■ LPC DMA

■ PC/PCI DMA

The LPC DMA mode uses the LPC bus to communicate DMA channel control and is implemented for devices using DMA through the LPC47B397 I/O controller such as the diskette drive controller.

The PC/PCI DMA mode uses the REQ#/GNT# signals to communicate DMA channel control and is used by PCI expansion devices.

The DMA logic is accessed through two types of I/O mapped registers; page registers and controller registers.

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System Support

DMA Page Registers

The DMA page register contains the eight most significant bits of the 24-bit address and works in conjunction with the DMA controllers to define the complete (24-bit) address for the DMA channels. Table 4-10 lists the page register port addresses.

Table 4-10.

DMA Page Register Addresses

DMA Channel Page Register I/O Port

Controller 1 (byte transfers) Ch 0 Ch 1 Ch 2 Ch 3 Controller 2 (word transfers) Ch 4 Ch 5 Ch 6 Ch 7 Refresh 08Fh [see note]

087h 083h 081h 082h

n/a 08Bh 089h 08Ah

NOTE: The DMA memory page register for the refresh channel

must be programmed with 00h for proper operation.

The memory address is derived as follows:

24-Bit Address—Controller 1 (Byte Transfers)

8-Bit Page Register 8-Bit DMA Controller A23..A16 A15..A00

24-Bit Address—Controller 2 (Word Transfers)

8-Bit Page Register 16-Bit DMA Controller A23..A17 A16..A01, (A00 = 0)

Note that address line A16 from the DMA memory page register is disabled when DMA controller 2 is selected. Address line A00 is not connected to DMA controller 2 and is always 0 when word-length transfers are selected.

By not connecting A00, the following applies:

■ The size of the the block of data that can be moved or addressed is measured in 16-bits

(words) rather than 8-bits (bytes).

■ The words must always be addressed on an even boundary.

DMA controller 1 can move up to 64 Kbytes of data per DMA transfer. DMA controller 2 can move up to 64 Kwords (128 Kbytes) of data per DMA transfer. Word DMA operations are only possible between 16-bit memory and 16-bit peripherals.

The RAM refresh is designed to perform a memory read cycle on each of the 512 row addresses in the DRAM memory space. Refresh operations are used to refresh memory on the 32-bit memory bus and the ISA bus. The refresh address is provided on lines SA00 through SA08. Address lines LA23..17, SA18,19 are driven low.

Technical Reference Guide 361834-002 4-17

System Support

The remaining address lines are in an undefined state during the refresh cycle. The refresh operations are driven by a 69.799-KHz clock generated by Interval Timer 1, Counter 1. The refresh rate is 128 refresh cycles in 2.038 ms.

DMA Controller Registers

Table 4-11 lists the DMA Controller Registers and their I/O port addresses. Note that there is a set of registers for each DMA controller.

Table 4-11.

DMA Controller Registers

Status 008h 0D0h R

Command 008h 0D0h W

Mode 00Bh 0D6h W

Write Single Mask Bit 00Ah 0D4h W

Write All Mask Bits 00Fh 0DEh W

Software DRQx Request 009h 0D2h W

Base and Current Address—Ch 0 000h 0C0h W

Current Address—Ch 0 000h 0C0h R

Base and Current Word Count—Ch 0 001h 0C2h W

Current Word Count—Ch 0 001h 0C2h R

Base and Current Address—Ch 1 002h 0C4h W

Current Address—Ch 1 002h 0C4h R

Base and Current Word Count—Ch 1 003h 0C6h W

Current Word Count—Ch 1 003h 0C6h R

Base and Current Address—Ch 2 004h 0C8h W

Current Address—Ch 2 004h 0C8h R

Base and Current Word Count—Ch 2 005h 0CAh W

Current Word Count—Ch 2 005h 0CAh R

Base and Current Address—Ch 3 006h 0CCh W

Current Address—Ch 3 006h 0CCh R

Base and Current Word Count—Ch 3 007h 0CEh W

Current Word Count—Ch 3 007h 0CEh R

Temporary (Command) 00Dh 0DAh R

Reset Pointer Flip-Flop (Command) 00Ch 0D8h W

Master Reset (Command) 00Dh 0DAh W

Reset Mask Register (Command) 00Eh 0DCh W

4-18 361834-002 Technical Reference Guide

4.4 Real-Time Clock and Configuration Memory

The Real-time clock (RTC) and configuration memory (also referred to as “CMOS”) functions are provided by the 82801 component and is MC146818-compatible. As shown in the following figure, the 82801 ICH6 component provides 256 bytes of battery-backed RAM divided into two 128-byte configuration memory areas. The RTC uses the first 14 bytes (00-0Dh) of the standard memory area. All locations of the standard memory area (00-7Fh) can be directly accessed using conventional OUT and IN assembly language instructions through I/O ports 70h/71h, although the suggested method is to use the INT15 AX=E823h BIOS call.

System Support

0Dh 0Ch

0Bh

0Ah

09h 08h 07h 06h 05h 04h 03h 02h 01h 00h

Figure 4 11. Configuration Memory Map

A lithium 3-VDC battery is used for maintaining the RTC and configuration memory while the system is powered down. During system operation a wire-Ored circuit allows the RTC and configuration memory to draw power from the power supply. The battery is located in a battery holder on the system board and has a life expectancy of four to eight years. When the battery has expired it is replaced with a Renata CR2032 or equivalent 3-VDC lithium battery.

4.4.1 Clearing CMOS

Year

Month

Date of Month

Day of Week

Hours (Alarm)

Hours (Timer) Minutes (Alarm) Minutes (Timer)

Seconds (Alarm) Seconds (Timer)

82801

Extended Config.

Memory Area

(128 bytes)

Standard Config.

Memory Area

(114 bytes)

RTC Area (14 bytes)

FFh

80h 7Fh

0Eh 0Dh

00h

The contents of configuration memory (including the Power-On Password) can be cleared by the following procedure:

1. Turn off the unit.

2. Disconnect the AC power cord from the outlet and/or system unit.

3. Remove the chassis hood (cover) and insure that no LEDs on the system board are illuminated.

4. On the system board, press and hold the CMOS clear button for at least 5 seconds.

5. Replace the chassis hood (cover).

6. Reconnect the AC power cord to the outlet and/or system unit.

7. Turn the unit on.

To clear only the Power-On Password refer to section 4.5.1.

Technical Reference Guide 361834-002 4-19

System Support

4.4.2 CMOS Archive and Restore

During the boot sequence the BIOS saves a copy of NVRAM (CMOS contents, password(s) and other system variables) in a portion of the flash ROM. Should the system become un-usable, the last good copy of NVRAM data can be restored with the Power Button Override function. This function is invoked with the following procedure:

1. With the unit powered down, press and release the power button.

2. Immediately after releasing the power button in step 1, press and hold the power button until the unit powers down. This action will be recorded as a Power Button Override event.

With the next startup sequence the BIOS will detect the occurrence of the Power Button Override event and will load the backup copy of NVRAM from the ROM to the CMOS.

The Power Button Override feature does not allow quick cycling of the system (turning on then

✎

off). If the power cord is disconnected during the POST routine, the splash screen image may become corrupted, requiring a re-flashing of the ROM (refer to chapter 8, BIOS ROM).

4-20 361834-002 Technical Reference Guide

4.4.3 Standard CMOS Locations

Table 4-12 describes standard configuration memory locations 0Ah-3Fh. These locations are accessible through using OUT/IN assembly language instructions using port 70/71h or BIOS function INT15, AX=E823h.

Table 4-12.

Configuration Memory (CMOS) Map

Location Function Location Function

00-0Dh Real-time clock 24h System board ID 0Eh Diagnostic status 25h System architecture data 0Fh System reset code 26h Auxiliary peripheral configuration 10h Diskette drive type 27h Speed control external drive 11h Reserved 28h Expanded/base mem. size, IRQ12 12h Hard drive type 29h Miscellaneous configuration 13h Security functions 2Ah Hard drive timeout 14h Equipment installed 2Bh System inactivity timeout 15h Base memory size, low byte/KB 2Ch Monitor timeout, Num Lock Cntrl 16h Base memory size, high byte/KB 2Dh Additional flags 17h Extended memory, low byte/KB 2Eh-2Fh Checksum of locations 10h-2Dh 18h Extended memory, high byte/KB 30h-31h Total extended memory tested 19h Hard drive 1, primary controller 32h Century 1Ah Hard drive 2, primary controller 33h Miscellaneous flags set by BIOS 1Bh Hard drive 1, secondary controller 34h International language 1Ch Hard drive 2, secondary controller 35h APM status flags 1Dh Enhanced hard drive support 36h ECC POST test single bit 1Eh Reserved 37h-3Fh Power-on password 1Fh Power management functions 40-FFh Feature Control/Status

System Support

NOTES: Assume unmarked gaps are reserved. Higher locations (>3Fh) contain information that should be accessed using the INT15, AX=E845h BIOS function (refer to Chapter 8 for BIOS function descriptions).

4.5 System Management

This section describes functions having to do with security, power management, temperature, and overall status. These functions are handled by hardware and firmware (BIOS) and generally configured through the Setup utility.

4.5.1 Security Functions

These systems include various features that provide different levels of security. Note that this subsection describes only the hardware functionality (including that supported by Setup) and does not describe security features that may be provided by the operating system and application software.

Technical Reference Guide 361834-002 4-21

System Support

Power-On / Setup Password

These systems include a power-on and setup passwords, which may be enabled or disabled (cleared) through a jumper on the system board. The jumper controls a GPIO input to the 82801 ICH6 that is checked during POST. The password is stored in configuration memory (CMOS) and if enabled and then forgotten by the user will require that either the password be cleared (preferable solution and described below) or the entire CMOS be cleared (refer to section 4.4.1).

To clear the password, use the following procedure:

1. Turn off the system and disconnect the AC power cord from the outlet and/or system unit.

2. Remove the cover (hood) as described in the appropriate User Guide or Maintainance And

3. Locate the password clear jumper (header is labeled E49 on these systems) and move the

4. Replace the cover.

5. Re-connect the AC power cord to the AC outlet and/or system unit.

6. Turn on the system. The POST routine will clear and disable the password.

7. To re-enable the password feature, repeat steps 1-6, replacing the jumper on pins 1 and 2 of

Service Reference Guide. Insure that all system board LEDs are off (not illuminated).

jumper from pins 1 and 2 and place on (just) pin 2 (for safekeeping).

header E49.

Setup Password

The Setup utility may be configured to be always changeable or changeable only by entering a password. Refer to the previous procedure (Power On / Setup Password) for clearing the Setup password.

Cable Lock Provision

These systems include a chassis cutout (on the rear panel) for the attachment of a cable lock mechanism.

I/O Interface Security

The serial, parallel, USB, and diskette interfaces may be disabled individually through the Setup utility to guard against unauthorized access to a system. In addition, the ability to write to or boot from a removable media drive (such as the diskette drive) may be enabled through the Setup utility. The disabling of the serial, parallel, and diskette interfaces are a function of the LPC47B397 I/O controller. The USB ports are controlled through the 82801.

Chassis Security

Some systems feature Smart Cover (hood) Sensor and Smart Cover (hood) Lock mechanisms to inhibit unauthorized tampering of the system unit.

Smart Cover Sensor

Some systems include a plunger switch that, when the cover (hood) is removed, closes and grounds an input of the 82801 component. The battery-backed logic will record this “intrusion” event by setting a specific bit. This bit will remain set (even if the cover is replaced) until the system is powered up and the user completes the boot sequence successfully, at which time the bit will be cleared. Through Setup, the user can set this function to be used by Alert-On-LAN and or one of three levels of support for a “cover removed” condition:

4-22 361834-002 Technical Reference Guide

Level 0—Cover removal indication is essentially disabled at this level. During POST, status bit is cleared and no other action is taken by BIOS.

Level 1—During POST the message “The computer's cover has been removed since the last system start up” is displayed and time stamp in CMOS is updated.

Level 2—During POST the “The computer's cover has been removed since the last system start up” message is displayed, time stamp in CMOS is updated, and the user is prompted for the administrator password. (A Setup password must be enabled in order to see this option).

Smart Cover Lock (Optional)

Some systems support an optional solenoid-operated locking bar that, when activated, prevents the cover (hood) from being removed. The GPIO ports 44 and 45 of the LPC47B397 I/O controller provide the lock and unlock signals to the solenoid. A locked hood may be bypassed by removing special screws that hold the locking mechanism in place. The special screws are removed with the Smart Cover Lock Failsafe Key.

4.5.2 Power Management

This system provides baseline hardware support of ACPI- and APM-compliant firmware and software. Key power-consuming components (processor, chipset, I/O controller, and fan) can be placed into a reduced power mode either automatically or by user control. The system can then be brought back up (“wake-up”) by events defined by the ACPI specification. The ACPI wake-up events supported by this system are listed as follows:

System Support

ACPI Wake-Up Event System Wakes From

Power Button Suspend or soft-off

RTC Alarm Suspend or soft-off

Wake On LAN (w/NIC) Suspend or soft-off

PME Suspend or soft-off

Serial Port Ring Suspend or soft-off

USB Suspend only

Keyboard Suspend only

Mouse Suspend only

Technical Reference Guide 361834-002 4-23

System Support

4.5.3 System Status

These systems provide a visual indication of system boot and ROM flash status through the keyboard LEDs and operational status using bi-colored power and hard drive activity LEDs as indicated in Tables 4-13 and 4-14 respectively.

The LED indications listed in Table 4-13 are valid only for PS/2-type keyboards. A USB

✎

keyboard will not provide LED status for the listed events, although audible (beep) indications will occur.

PS/2 Keyboard System Boot/ROM Flash Status LED Indications

Event

System memory failure [1] Blinking Off Off Graphics controller failure [2] Off Blinking Off System failure prior to graphics cntlr. initialization [3] Off Off Blinking ROMPAQ diskette not present, faulty, or drive prob. On Off Off Password prompt Off On Off Invalid ROM detected—flash failed Blinking [4] Blinking [4] Blinking [4] Keyboard locked in network mode Blinking [5] Blinking [5] Blinking [5] Successful boot block ROM flash On [6] On [6] On [6]

NOTES: [1]Accompanied by 1 short, 2 long audio beeps [2]Accompanied by 1 long, 2 short audio beeps [3]Accompanied by 2 long, 1 short audio beeps [4]All LEDs will blink in sync twice, accompanied by 1 long and three short audio beeps [5]LEDs will blink in sequence (NUM Lock, then CAPs Lock, then Scroll Lock) [6]Accompanied by rising audio tone.

Badkdd

Table 4-14 lists the audible and visible indications provided by system status conditions. .

Table 4-13.

NUM Lock

LED

CAPs Lock

LED

Scroll Lock

LED

Table 4-14.

System Operational Status LED Indications

System Status PowerLED Beeps [2] Action Required

S0: System on (normal operation) Steady green None none S1: Suspend Blinks green @ .5 Hz None none S3: Suspend to RAM Blinks green @ .5 Hz None none S4: Suspend to disk Off – clear None none S5: Soft off Off – clear None none Processor thermal shutdown Blinks red 2 times @ I Hz [1] 2 [2] Check air flow, fans, heatsink Processor not seated / installed Blinks red 3 times @ I Hz [1] 3 [2] Check processor presence/seating Power supply overload failure Blinks red 4 times @ I Hz [1] 4 [2] Check voltage selector, devices, sys. bd Memory error (pre-video) Blinks red 5 times @ I Hz [1] 5 [2] Check DIMMs, system board Video error Blinks red 6 times @ I Hz [1] 6 [2] Check graphics card or system board PCA failure detected by BIOS (pre-video) Blinks red 7 times @ I Hz [1] 7 [2] Replace system board Invalid ROM checksum error Blinks red 8 times @ I Hz [1] 8 [2] Reflash BIOS ROM Boot failure (after power on) Blinks red 9 times @ I Hz [1] 9 [2] Check power supply, processor, sys. bd Bad option card Blinks red 10 times @ I Hz [1] 10 [2] Replace option card

[1] Repeated after 2 second pause. [2] Beeps are produced by the on-board piezo speaker, NOT the chassis speaker. [3] Beeps are repeated for 5 cycles, after which only blinking LED indication continues.

4-24 361834-002 Technical Reference Guide

4.5.4 Thermal Sensing and Cooling

All systems feature a variable-speed fan mounted as part of the processor heatsink assembly. All systems also provide or support an auxiliary chassis fan. All fans are controlled through temperature sensing logic on the system board and/or in the power supply. There are some electrical differences between form factors and between some models, although the overall functionally is the same. Typical cooling conditions include the following:

1. Normal—Low fan speed.

2. Hot processor—ASIC directs Speed Control logic to increase speed of fan(s).

3. Hot power supply—Power supply increases speed of fan(s).

4. Sleep state—Fan(s) turned off. Hot processor or power supply will result in starting fan(s).

The RPM (speed) of all fans is the result of the temperature of the CPU as sensed by speed control circuitry. The fans are controlled to run at the slowest (quietest) speed that will maintain proper cooling.

Units using chassis and CPU fans must have both fans connected to their corresponding headers

✎

to ensure proper cooling of the system.

System Support

Technical Reference Guide 361834-002 4-25

System Support

4.6 Register Map and Miscellaneous Functions

This section contains the system I/O map and information on general-purpose functions of the ICH6 and I/O controller.

4.6.1 System I/O Map

Table 4-15 lists the fixed addresses of the input/output (I/O) ports.

Table 4-15

System I/O Map

I/O Port Function

0000..001Fh DMA Controller 1

0020..002Dh Interrupt Controller 1 002E, 002Fh Index, Data Ports to LPC47B397 I/O Controller (primary)

0030..003Dh Interrupt Controller

0040..0042h Timer 1 004E, 004Fh Index, Data Ports to LPC47B397 I/O Controller (secondary)

0050..0052h Timer / Counter

0060..0067h Microcontroller, NMI Controller (alternating addresses)

0070..0077h RTC Controller

0080..0091h DMA Controller 0092h Port A, Fast A20/Reset Generator

0093..009Fh DMA Controller 00A0..00B1h Interrupt Controller 2 00B2h, 00B3h APM Control/Status Ports 00B4..00BDh Interrupt Controller 00C0..00DFh DMA Controller 2 00F0h Coprocessor error register

0170..0177h IDE Controller 2 (active only if standard I/O space is enabled for primary drive) 01F0..01F7h IDE Controller 1 (active only if standard I/O space is enabled for secondary drive)

0278..027Fh Parallel Port (LPT2) 02E8..02EFh Serial Port (COM4) 02F8..02FFh Serial Port (COM2)

0370..0377h Diskette Drive Controller Secondary Address 0376h IDE Controller 2 (active only if standard I/O space is enabled for primary drive)

0378..037Fh Parallel Port (LPT1) 03B0..03DFh Graphics Controller 03BC..03BEh Parallel Port (LPT3) 03E8..03EFh Serial Port (COM3) 03F0..03F5h Diskette Drive Controller Primary Addresses 03F6h IDE Controller 1 (active only if standard I/O space is enabled for sec. drive) 03F8..03FFh Serial Port (COM1) 04D0, 04D1h Interrupt Controller

0678..067Fh Parallel Port (LPT2)

0778..077Fh Pa rallel Por t (L PT1 ) 07BC. .07 BEh Parall el Port (LPT3) 0CF8h PCI Configuration Address (dword access only ) 0CF9h Reset Control Register 0CFCh PCI Configuration Data (byte, word, or dword access)

NOTE: Assume unmarked gaps are unused, reserved, or used by functions that employ variable I/O

address mapping. Some ranges may include reserved addresses.

4-26 361834-002 Technical Reference Guide

4.6.2 LPC47B397 I/O Controller Functions

The LPC47B397 I/O controller contains various functions such as the keyboard/mouse interfaces, diskette interface, serial interfaces, and parallel interface. While the control of these interfaces uses standard AT-type I/O addressing (as described in chapter 5) the configuration of these functions uses indexed ports unique to the LPC47B397. In these systems, hardware strapping selects I/O addresses 02Eh and 02Fh at reset as the Index/Data ports for accessing the logical devices within the LPC47B397. Table 4-16 lists the PnP standard control registers for the LPC47B397.

Table 4-16.

LPC47B397 I/O Controller Control Registers

Index Function Reset Value

02h Configuration Control 00h 03h Reserved 07h Logical Device (Interface) Select:

00h = Diskette Drive I/F 01h = Reserved 02h = Reserved 03h = Parallel I/F 04h = Serial I/F (UART 1/Port A) 05h = Serial I/F (UART 2/Port B) 06h = Reserved 07h = Keyboard I/F 08h = Reserved 09h = Reserved 0Ah = Runtime Registers (GPIO Config.)

0Bh = SMBus Configuration 20h Super I/O ID Register (SID) 56h 21h Revision -22h Logical Device Power Control 00h 23h Logical Device Power Management 00h 24h PLL / Oscillator Control 04h 25h Reserved 26h Configuration Address (Low Byte) 27h Configuration Address (High Byte) 28-2Fh Reserved

System Support

00h

NOTE: For a detailed description of registers refer to appropriate SMC documentation.

Technical Reference Guide 361834-002 4-27

System Support

The configuration registers are accessed through I/O registers 2Eh (index) and 2Fh (data) after the configuration phase has been activated by writing 55h to I/O port 2Eh. The desired interface (logical device) is initiated by firmware selecting logical device number of the 47B347 using the following sequence:

1. Write 07h to I/O register 2Eh.

2. Write value of logical device to I/O register 2Fh.

3. Write 30h to I/O register 2Eh.

4. Write 01h to I/O register 2Fh (this activates the interface).

Writing AAh to 2Eh deactivates the configuration phase.

The systems covered in this guide utilize the following specialized functions built into the LPC 47B397 I/O Controller:

■ Power/Hard drive LED control—The I/O controller provides color and blink control for the

■ Intruder sensing—The battery-backed D-latch logic internal to the LPC47B397 is connected

■ Hood lock/unlock—Supported on SFF, ST, and CMT form factors, logic internal to the

front panel LEDs used for indicating system events (refer to Table 4-14).

to the hood sensor switch to record hood (cover) removal.

LPC47B397 controls the lock bar mechanism.

■ I/O security—The parallel, serial, and diskette interfaces may be disabled individually by

software and the LPC47B397's disabling register locked. If the disabling register is locked, a system reset through a cold boot is required to gain access to the disabling (Device Disable) register.

■ Processor present/speed detection—One of the battery-back general-purpose inputs (GPI26)

of the LPC47B397 detects if the processor has been removed. The occurrence of this event is passed to the ICH6 that will, during the next boot sequence, initiate the speed selection routine for the processor.

■ Legacy/ACPI power button mode control—The LPC47B397 receives the pulse signal from

the system's power button and produces the PS On signal according to the mode (legacy or ACPI) selected. Refer to chapter 7 for more information regarding power management.

4-28 361834-002 Technical Reference Guide

5.1 Introduction

This chapter describes the standard (i.e., system board) interfaces that provide input and output (I/O) porting of data and specifically discusses interfaces that are controlled through I/O-mapped registers. The following I/O interfaces are covered in this chapter:

■ PATA/SATA interface (5.2), page 5-1

■ Diskette drive interface (5.3), page 5-7

■ Serial interfaces (5.4), page 5-12

■ Parallel interface (5.5), page 5-14

■ Keyboard/pointing device interface (5.6), page 5-18

■ Universal serial bus interface (5.7), page 5-25

■ Audio subsystem (5.8), page 5-29

■ Network interface controller (5.9), page 5-36

Input/Output Interfaces

5.2 PATA/SATA Interfaces

These systems provide both legacy EIDE (i.e., parallel ATA or PATA) and serial ATA (SATA) interfaces. All systems are shipped configured with SATA hard drives.

One 40-pin IDE connector is included on the system board. The controller can be configured for the following modes of operation:

■ Programmed I/O (PIO) mode—CPU controls drive transactions through standard I/O

mapped registers of the IDE drive.

■ 8237 DMA mode—CPU offloads drive transactions using DMA protocol with transfer rates

up to 16 MB/s.

■ Ultra ATA/100 mode—Preferred bus mastering source-synchronous protocol providing

transfer rates of 100 MB/s.

IDE Programming

The IDE interface is configured as a PCI device during POST and controlled through I/O-mapped registers at runtime. Non-DOS (non-Windows) operating systems may require using Setup (F10) for drive configuration.

Technical Reference Guide 361834-002 5-1

Input/Output Interfaces

IDE Configuration Registers

The IDE controller is configured as a PCI device with bus mastering capability. The PCI configuration registers for the IDE controller function (PCI device #31, function #1) are listed in Table 5-1.

Table 5-1.

EIDE PCI Configuration Registers (82801)

PCI Conf. Address Register

00-01h Vender ID 8086h 0F..1Fh Reserved 0’s

02-03h Device ID [1] 20-23h BMIDE Base Address 1

04-05h PCI Command 0000h 2C, 2Dh Subsystem Vender ID 0000h

06-07h PCI Status 0280h 2E, 2Fh Subsystem ID 0000h

08h Revision ID 00h 30..3Fh Reserved 0’s

09h Programming 80h 40-43h Pri./Sec. IDE Timing 0’s

0Ah Sub-Class 01h 44h Slave IDE Timing 00h

0Bh Base Class Code 01h 48h Sync. DMA Control 00h

0Dh Master Latency Timer 00h 4A-4Bh Sync. DMA Timing 0000h

0Eh Header Type 00h 54h EIDE I/O Config.Register 00h

NOTE: [1] ICH6 = 244Bh; ICH6 = 24CBh

Reset

Value

PCI Conf. Addr. Register

Reset Value

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Input/Output Interfaces

IDE Bus Master Control Registers

The IDE interface can perform PCI bus master operations using the registers listed in Table 5-2. These registers occupy 16 bytes of variable I/O space set by software and indicated by PCI configuration register 20h in the previous table.

Table 5-2.

IDE Bus Master Control Registers

I/O

Address

Offset

00h 1 Bus Master IDE Command (Primary) 00h

02h 1 Bus Master IDE Status (Primary) 00h

04h 4 Bus Master IDE Descriptor Pointer (Pri.) 0000 0000h

08h 1 Bus Master IDE Command (Secondary) 00h

0Ah 2 Bus Master IDE Status (Secondary) 00h

Size

(Bytes) Register

Default

Value

0Ch 4 Bus Master IDE Descriptor Pointer (Sec.) 0000 0000h

NOTE: Unspecified gaps are reserved, will return indeterminate data, and should not be written to.

IDE (PATA) Connector

These systems provide a standard 40-pin connector for a primary IDE device and in most factory configurations connects to a optical drive (CD or DVD). Some signals are re-defined for UATA/33 and higher modes. Device power is supplied through a separate connector.

Figure 5-1. 40-Pin IDE (PATA) Connector.

Technical Reference Guide 361834-002 5-3

Input/Output Interfaces

Pin Signal Description Pin Signal Description

1 RESET- Reset 21 DRQ DMA Request

2 GND Ground 22 GND Ground

3 DD7 Data Bit <7> 23 IOW- I/O Write [1]

4 DD8 Data Bit <8> 24 GND Ground

5 DD6 Data Bit <6> 25 IOR- I/O Read [2]

6 DD9 Data Bit <9> 26 GND Ground

7 DD5 Data Bit <5> 27 IORDY I/O Channel Ready [3]

8 DD10 Data Bit <10> 28 CSEL Cable Select

9 DD4 Data Bit <4> 29 DAK- DMA Acknowledge

10 DD11 Data Bit <11> 30 GND Ground

11 DD3 Data Bit <3> 31 IRQn Interrupt Request [4]

Table 5-3.

40-Pin IDE (PATA) Connector Pinout

12 DD12 Data Bit <12> 32 IO16- 16-bit I/O

13 DD2 Data Bit <2> 33 DA1 Address 1

14 DD13 Data Bit <13> 34 DSKPDIAG Pass Diagnostics

15 DD1 Data Bit <1> 35 DA0 Address 0

16 DD14 Data Bit <14> 36 DA2 Address 2

17 DD0 Data Bit <0> 37 CS0- Chip Select

18 DD15 Data Bit <15> 38 CS1- Chip Select

19 GND Ground 39 HDACTIVE- Drive Active (front panel LED) [5]

20 -- Key 40 GND Ground

NOTES: [1] On UATA/33 and higher modes, re-defined as STOP. [2] On UATA/33 and higher mode reads, re-defined as DMARDY-. On UATA/33 and higher mode writes, re-defined as STROBE. [3] On UATA/33 and higher mode reads, re-defined as STROBE-. On UATA/33 and higher mode writes, re-defined as DMARDY-. [4] Primary connector wired to IRQ14, secondary connector wired to IRQ15. [5] Pin 39 is used for spindle sync and drive activity (becomes SPSYNC/DACT-) when synchronous drives are connected.

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Input/Output Interfaces

SATA Interfaces

These systems provide one, two, or four serial ATA (SATA) interfaces that can provide certain advantages over legacy EIDE (PATA) interface including:

■ Higher transfer rates: up to 1.5 Gb/s (150 MB/s)

■ Reduced wiring (smaller cable assemblies)

The SATA interface duplicates most of the functionality of the EIDE interface through a register interface that is equivalent to that of the legacy IDE host adapter.

SATA Programming

The SATA interface is configured as a PCI device during POST and controlled through I/O-mapped registers at runtime. Non-DOS (non-Windows) operating systems may require using Setup (F10) for drive configuration.

SATA Configuration Registers

The SATA controller is configured as a PCI device with bus mastering capability. The PCI configuration registers for the SATA controller function (PCI device #31, function #2) are listed in Table 5-4.

Table 5-4.

SATA PCI Configuration Registers (82801, Device 31/Function 2)

PCI Conf.

Addr. Register

00-01h Vender ID 8086h 0F..1Fh Reserved 0’s

02-03h Device ID 24D1h 10-17h Pri. Cmd, Cntrl.

04-05h PCI Command 0000h 18-1Fh Sec. Cmd, Cntrl.

06-07h PCI Status 02B0h 20-23h BMstr Base Address 1

08h Revision ID 00h 2C, 2Dh Subsystem Vender ID 0000h

09h Programming 8Ah 2E, 2Fh Subsystem ID 0000h

0Ah Sub-Class 01h 34h Capabilities pointer 80h

0Bh Base Class Code 01h 3Ch Interrupt Line 00h

0Dh Master Latency Timer 00h 3Dh Interrupt Pin 01h

0Eh Header Type 00h 40-57h Timing, Control All 0’s

Reset

Value

PCI Conf.

Addr. Register

Addrs.

Reset

Value

1 (both)

Technical Reference Guide 361834-002 5-5

Input/Output Interfaces

SATA Bus Master Control Registers

The SATA interface can perform PCI bus master operations using the registers listed in Table 5-5. These registers occupy 16 bytes of variable I/O space set by software and indicated by PCI configuration register 20h in the previous table. As indicated, these registers are virtually a copy of those used by EIDE operations discussed in the EIDE section.

Table 5-5.

IDE Bus Master Control Registers

I/O Addr. Offset

00h 1 Bus Master IDE Command (Primary) 00h

02h 1 Bus Master IDE Status (Primary) 00h

04h 4 Bus Master IDE Descriptor Pointer (Primary) 0000 0000h

08h 1 Bus Master IDE Command (Secondary) 00h

0Ah 2 Bus Master IDE Status (Secondary) 00h

0Ch 4 Bus Master IDE Descriptor Pointer (Secondary 0000 0000h

Size

(Bytes) Register Default Value

SATA Connector

The 7-pin SATA connector is shown in the figure below.

Pin 1

Pin 7

Figure 5-2. 7-Pin SATA Connector (on system board).

Table 5-6.

7-Pin SATA Connector Pinout

Pin Description Pin Description

1Ground 6RX positive

2TX positive 7Ground

3 TX negative A Holding clip

4 Ground B Holding clip

5 RX negative -- --

5-6 361834-002 Technical Reference Guide

5.3 Diskette Drive Interface

The diskette drive interface in these systems support one diskette drive connected to a standard 34-pin diskette drive connector. Selected models come standard with a 3.5-inch 1.44-MB diskette drive installed as drive A.

The diskette drive interface function is integrated into the LPC47B397 super I/O component. The internal logic of the I/O controller is software-compatible with standard 82077-type logic. The diskette drive controller has three operational phases in the following order:

■ Command phase—The controller receives the command from the system.

■ Execution phase—The controller carries out the command.

■ Results phase—Status and results data is read back from the controller to the system.

The Command phase consists of several bytes written in series from the CPU to the data register (3F5h/375h). The first byte identifies the command and the remaining bytes define the parameters of the command. The Main Status register (3F4h/374h) provides data flow control for the diskette drive controller and must be polled between each byte transfer during the Command phase.

The Execution phase starts as soon as the last byte of the Command phase is received. An Execution phase may involve the transfer of data to and from the diskette drive, a mechnical control function of the drive, or an operation that remains internal to the diskette drive controller.

Input/Output Interfaces

Data transfers (writes or reads) with the diskette drive controller are by DMA, using the DRQ2 and DACK2- signals for control.

The Results phase consists of the CPU reading a series of status bytes (from the data register (3F5h/375h)) that indicate the results of the command. Note that some commands do not have a Result phase, in which case the Execution phase can be followed by a Command phase.

During periods of inactivity, the diskette drive controller is in a non-operation mode known as the Idle phase.

5.3.1 Diskette Drive Programming

Programming the diskette drive interface consists of configuration, which occurs typically during POST, and control, which occurs at runtime.

Diskette Drive Interface Configuration

The diskette drive controller must be configured for a specific address and also must be enabled before it can be used. Address selection and enabling of the diskette drive interface are affected by firmware through the PnP configuration registers of the 47B397 I/O controller during POST.

The configuration registers are accessed through I/O registers 2Eh (index) and 2Fh (data) after the configuration phase has been activated by writing 55h to I/O port 2Eh. The diskette drive I/F is initiated by firmware selecting logical device 0 of the 47B397 using the following sequence:

1. Write 07h to I/O register 2Eh.

2. Write 00h to I/O register 2Fh (this selects the diskette drive I/F).

3. Write 30h to I/O register 2Eh.

4. Write 01h to I/O register 2Fh (this activates the interface).

Writing AAh to 2Eh deactivates the configuration phase. The diskette drive I/F configuration registers are listed in the following table:

Technical Reference Guide 361834-002 5-7

Input/Output Interfaces

Table 5-7.

Diskette Drive Interface Configuration Registers

Index

Address Function R/W

30h Activate R/W 01h

60-61h Base Address R/W 03F0h

70h Interrupt Select R/W 06h

74h DMA Channel Select R/W 02h

F0h DD Mode R/W 02h

F1h DD Option R/W 00h

F2h DD Type R/W FFh

F4h DD 0 R/W 00h

F5h DD 1 R/W 00h

Reset

Value

For detailed configuration register information refer to the SMSC data sheet for the LPC47B397 I/O component.

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Input/Output Interfaces

Diskette Drive Interface Control

The BIOS function INT 13 provides basic control of the diskette drive interface. The diskette drive interface can be controlled by software through the LPC47B397's I/O-mapped registers listed in Table 5-8. The diskette drive controller of the LPC47B397 operates in the PC/AT mode in these systems.

Table 5-8.

Diskette Drive Interface Control Registers

Primary Address

3F0h 370h Status Register A:

3F1h 371h Status Register B:

3F2h 372h Digital Output Register (DOR):

Second.

Address Register R/W

<7> Interrupt pending <6> Reserved (always 1) <5> STEP pin status (active high) <4> TRK 0 status (active high) <3> HDSEL status (0 = side 0, 1 = side 1) <2> INDEX status (active high) <1> WR PRTK status (0 = disk is write protected) <0> Direction (0 = outward, 1 = inward)

<7,6> Reserved (always 1’s) <5> DOR bit 0 status <4> Write data toggle <3> Read data toggle <2> WGATE status (active high) <1,0> MTR 2, 1 ON- status (active high)

<7,6> Reserved <5,4> Motor 1, 0 enable (active high) <3> DMA enable (active high) <2> Reset (active low) <1,0> Drive select (00 = Drive 1, 01 = Drive 2, 10 = Reserved, 11 =

Tape drive)

R/W

3F3h 373h Tape Drive Register (available for compatibility) R/W

Technical Reference Guide 361834-002 5-9

Input/Output Interfaces

Table 5-8. (Continued)

Diskette Drive Interface Control Registers

Primary Address

3F4h 374h Main Status Register (MSR):

3F5h 375h Data Register:

3F6h 376h Reserved --

3F7h 377h Digital Input Register (DIR):

Second.

Address Register R/W

<7> Request for master (host can transfer data) (active high) <6> Transfer direction (0 – write, 1 = read) <5> non-DMA execution (active high) <4> Command busy (active high) <3,2> Reserved <1,0> Drive 1, 2 busy (active high) Data Rate Select Register (DRSR): <7> Software reset (active high) <6> Low power mode enable (active high) <5> Reserved (0) <4..2> Precompensation select (default = 000) <1,0> Data rate select (00 = 500 Kb/s, 01 = 300 Kb/s, 10 = 250

Kb/s, 11 = 2/1 Mb/s)

<7..0> Data

<7> DSK CHG status (records opposite value of pin)

<6..0> Reserved (0’s)

Configuration Control Register (CCR):

<7..2> Reserved

<1,0> Data rate select (00 = 500 Kb/s, 01 = 300 Kb/s, 10 = 250

Kb/s, 11 = 2/1 Mb/s)

R/W

NOTE: The most recently written data rate value to either DRSR or CCR will be in effect.

5-10 361834-002 Technical Reference Guide

5.3.2 Diskette Drive Connector

This system uses a standard 34-pin connector (refer to Figure 5-3 and Table 5-9 for the pinout) for diskette drives. Drive power is supplied through a separate connector.

2 4 1

Figure 5-3. 34-Pin Diskette Drive Connector.

Pin Signal Description Pin Signal Description

1 GND Ground 18 DIR- Drive head direction control

2 LOW DEN- Low density select 19 GND Ground

3 --- (KEY) 20 STEP- Drive head track step cntrl.

4 MEDIA ID- Media identification 21 GND Ground

8 910111213141516171819202122232425262728

34-Pin Diskette Drive Connector Pinout

Table 5-9.

Input/Output Interfaces

5 GND Ground 22 WR DATA- Write data

6 DRV 4 SEL- Drive 4 select 23 GND Ground

7 GND Ground 24 WR ENABLE- Enable for WR DATA-

8 INDEX- Media index is detected 25 GND Ground

9 GND Ground 26 TRK 00- Heads at track 00 indicator

10 MTR 1 ON- Activates drive motor 27 GND Ground

11 GND Ground 28 WR PRTK- Media write protect status

12 DRV 2 SEL- Drive 2 select 29 GND Ground

13 GND Ground 30 RD DATA- Data and clock read off disk

14 DRV 1 SEL- Drive 1 select 31 GND Ground

15 GND Ground 32 SIDE SEL- Head select (side 0 or 1)

16 MTR 2 ON- Activates drive motor 33 GND Ground

17 GND Ground 34 DSK CHG- Drive door opened indicator

Technical Reference Guide 361834-002 5-11

Input/Output Interfaces

5.4 Serial Interface

Systems covered in this guide may include one RS-232-C type serial interface to transmit and receive asynchronous serial data with external devices. Some systems may allow the installation of a second serial interface through an adapter that consists of a PCI bracket and a cable that attaches to header P52 on the system board. The serial interface function is provided by the LPC47B397 I/O controller component that includes two NS16C550-compatible UARTs.

The UART supports the standard baud rates up through 115200, and also special high speed rates of 239400 and 460800 baud. The baud rate of the UART is typically set to match the capability of the connected device. While most baud rates may be set at runtime, baud rates 230400 and 460800 must be set during the configuration phase.

5.4.1 Serial Connector

The serial interface uses a DB-9 connector as shown in the following figure with the pinout listed in Table 5-10.

Figure 5-4. Serial Interface Connector (Male DB-9 as viewed from rear of chassis)

Table 5-10.

DB-9 Serial Connector Pinout

Pin Signal Description Pin Signal Description

1CD Carrier Detect 6DSR Data Set Ready

2 RX Data Receive Data 7 RTS Request To Send

3 TX Data Transmit Data 8 CTS Clear To Send

4 DTR Data Terminal Ready 9 RI Ring Indicator

5 GND Ground -- -- --

The standard RS-232-C limitation of 50 feet (or less) of cable between the DTE (computer) and DCE (modem) should be followed to minimize transmission errors. Higher baud rates may require shorter cables.

5.4.2 Serial Interface Programming

Programming the serial interfaces consists of configuration, which occurs during POST, and control, which occurs during runtime.

Serial Interface Configuration

The serial interface must be configured for a specific address range (COM1, COM2, etc.) and also must be activated before it can be used. Address selection and activation of the serial interface are affected through the PnP configuration registers of the LPC47B397 I/O controller.

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Input/Output Interfaces

The serial interface configuration registers are listed in the following table:

Table 5-11.

Serial Interface Configuration Registers

Index Address Function R/W

30h Activate R/W

60h Base Address MSB R/W

61h Base Address LSB R/W

70h Interrupt Select R/W

F0h Mode Register R/W

Serial Interface Control

The BIOS function INT 14 provides basic control of the serial interface. The serial interface can be directly controlled by software through the I/O-mapped registers listed in Table 5-12.

Table 5-12.

Serial Interface Control Registers

COM1

Addr.

3F8h 2F8h Receive Data Buffer

3F9h 2F9h Baud Rate Divisor Register 1 (when bit 7 of Line Control Reg. Is set)

3FAh 2FAh Interrupt ID Register

3FBh 2FBh Line Control Register R/W

3FCh 2FCh Modem Control Register R/W

3FDh 2FDh Line Status Register R

3FEh 2FEh Modem Status R

COM2

Addr. Register R/W

Transmit Data Buffer Baud Rate Divisor Register 0 (when bit 7 of Line Control Reg. Is set)

Interrupt Enable Register

FIFO Control Register

R/W

R W W

R W

Technical Reference Guide 361834-002 5-13

Input/Output Interfaces

5.5 Parallel Interface

Systems covered in this guide may include a parallel interface for connection to a peripheral device with a compatible interface, the most common being a printer. The parallel interface function is integrated into the LPC47B397 I/O controller component and provides bi-directional 8-bit parallel data transfers with a peripheral device. The parallel interface supports three main modes of operation:

■ Standard Parallel Port (SPP) mode

■ Enhanced Parallel Port (EPP) mode

■ Extended Capabilities Port (ECP) mode

These three modes (and their submodes) provide complete support as specified for an IEEE 1284 parallel port.

5.5.1 Standard Parallel Port Mode

The Standard Parallel Port (SPP) mode uses software-based protocol and includes two sub-modes of operation, compatible and extended, both of which can provide data transfers up to 150 KB/s. In the compatible mode, CPU write data is simply presented on the eight data lines. A CPU read of the parallel port yields the last data byte that was written.

The following steps define the standard procedure for communicating with a printing device:

1. The system checks the Printer Status register. If the Busy, Paper Out, or Printer Fault signals are indicated as being active, the system either waits for a status change or generates an error message.

2. The system sends a byte of data to the Printer Data register, then pulses the printer STROBE signal (through the Printer Control register) for at least 500 ns.

3. The system then monitors the Printer Status register for acknowledgment of the data byte before sending the next byte.

In extended mode, a direction control bit (CTR 37Ah, bit <5>) controls the latching of output data while allowing a CPU read to fetch data present on the data lines, thereby providing bi-directional parallel transfers to occur.

The SPP mode uses three registers for operation: the Data register (DTR), the Status register (STR) and the Control register (CTR). Address decoding in SPP mode includes address lines A0 and A1.

5.5.2 Enhanced Parallel Port Mode

In Enhanced Parallel Port (EPP) mode, increased data transfers are possible (up to 2 MB/s) due to a hardware protocol that provides automatic address and strobe generation. EPP revisions 1.7 and 1.9 are both supported. For the parallel interface to be initialized for EPP mode, a negotiation phase is entered to detect whether or not the connected peripheral is compatible with EPP mode. If compatible, then EPP mode can be used. In EPP mode, system timing is closely coupled to EPP timing. A watchdog timer is used to prevent system lockup.

Five additional registers are available in EPP mode to handle 16- and 32-bit CPU accesses with the parallel interface. Address decoding includes address lines A0, A1, and A2.

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Frequently Asked Questions

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