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Holtek Semiconductor Inc
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HT1621D
Datasheet
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Holtek Semiconductor Inc HT1621D, HT1621, HT1621B Datasheet

HT1621
RAM Mapping 32´4 LCD Controller for I/O mC
Selection Table
HT162X HT1620 HT1621 HT1622 HT16220 HT1623 HT1625 HT1626 HT1627 HT16270
COM 4 4 8888161616
SEG 32 32 32 32 48 64 48 64 64
Built-in Osc.
Ö
Crystal Osc.
Ö
Ö
Ö ÖÖÖ Ö
1 April 21, 2000
Features
·
Operating voltage : 2.4V~5.2V
·
Built-in 256kHz RC oscillator
·
External 32.768kHz crystal or 256kHz frequency source input
·
Selection of 1/2 or 1/3 bias, and selection of 1/2 or 1/3 or 1/4 duty LCD applications
·
Internal time base frequency sources
·
Two selectable buzzer frequencies (2kHz/4kHz)
·
Power down command reduces power consumption
·
Built-in time base generator and WDT
·
Time base or WDT overflow output
·
8 kinds of time base/WDT clock sources
·
32´4 LCD driver
·
Built-in 32´4 bit display RAM
·
3-wire serial interface
·
Internal LCD driving frequency source
·
Software configuration feature
·
Data mode and command mode instructions
·
R/W address auto increment
·
Three data accessing modes
·
VLCD pin for adjusting LCD operating voltage
General Description
The HT1621 is a 128 pattern (32´4), memory mapping, and multi-function LCD driver. The S/W configuration feature of the HT1621 makes it suitable for multiple LCD applica
-
tions including LCD modules and display sub-
systems. Only three or four lines are required for the interface between the host controller and the HT1621. The HT1621 contains a power down command to reduce power consumption.
Block Diagram
Note: CS: Chip selection
BZ, BZ
: Tone outputs
WR
,RD, DATA: Serial interface
COM0~COM3, SEG0~SEG31: LCD outputs
IRQ
: Time base or WDT overflow output
HT1621
2 April 21, 2000
W atchdog Tim er
and
Tim e B ase G enerator
D ispla y R A M
LCD Driver/ Bias Circuit
C ontrol
and Tim ing Circuit
DATA
WR
OSCO
OSCI
CS
RD
COM 0
COM 3
SEG0
SEG31
Tone F requency
G enerator
BZ
BZ
IR Q
VSS
VDD
VLCD
Pin Assignment
HT1621
3 April 21, 2000
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
CS
RD
WR
DATA
VSS
OSCO
NC
OSCI
VDD /VLCD
IR Q
BZ
BZ
COM 0
COM 1
COM 2
COM 3
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
H T 1621
-
48 S S O P
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
CS
RD
WR
DATA
VSS
OSCO
OSCI
VLCD
VDD
IR Q
BZ
BZ
COM 0
COM 1
COM 2
COM 3
SEG8
SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
H T 1621B
-
4 8 S S O P /D IP
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
SEG5
SEG3
SEG1
CS
RD
WR
DATA
VSS
VLCD
VDD
IR Q
BZ
COM 0
COM 1
H T 1621D
-
28 S kinny
SEG7
SEG9
SEG11
SEG13
SEG15
SEG17
SEG19
SEG21
SEG23
SEG25
SEG27
SEG29
SEG31
COM 2
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Pad Assignment
Chip size: 127 ´ 129 (mil)
2
* The IC substrate should be connected to VDD in the PCB layout artwork.
HT1621
4 April 21, 2000
IR Q
BZ
CS
1
2
3
4
5
6
7
8
9
10
11
12 13
14 15 16 17 18 19
20
21
22
23
24
25
26
27
28
29
30
31
32
3334353637383940
41
4243
44
45464748
(0 ,0 )
RD
WR
DATA
VSS
OSCO
OSCI
VLCD
VDD
BZ
COM 0
COM 1
COM 2
COM 3
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0
Pad Coordinates Unit:mil
Pad No. X Y Pad No. X Y
1
-55.04
59.46 25 58.14
-25.29
2
-58.52
22.18 26 58.14
-18.66
3
-58.52
15.56 27 58.14
-11.94
4
-58.52
5.36 28 58.14
-5.31
5
-58.52 -4.51
29 58.14 1.32
6
-58.52 -11.14
30 58.14 7.95
7
-58.52 -34.76
31 58.14 14.58
8
-58.52 -41.90
32 58.14 21.21
9
-58.52 -49.13
33 55.55 59.46
10
-58.52 -59.08
34 48.92 59.46
11
-44.07 -59.08
35 42.29 59.46
12
-31.58 -59.08
36 35.66 59.46
13
-20.70 -59.08
37 29.03 59.46
14
-13.98 -59.08
38 22.40 59.46
15
-7.05 -59.08
39 15.77 59.46
16
-0.34 -59.08
40 9.14 59.46
17 6.33
-59.08
41 2.42 59.46
18 12.96
-59.08
42
-4.21
59.46
19 19.59
-59.08
43
-10.84
59.46
20 58.14
-58.44
44
-17.47
59.46
21 58.14
-51.81
45
-24.10
59.46
22 58.14
-45.18
46
-30.73
59.46
23 58.14
-38.55
47
-38.17
59.46
24 58.14
-31.92
48
-45.39
59.46
HT1621
5 April 21, 2000
Pad Description
Pad No. Pad Name I/O Function
1CS
I
Chip selection input with pull-high resistor When the CS
is logic high, the data and command read from or written to the HT1621 are disabled. The serial interface circuit is also reset. But if CS
is at logic low level and is input to the CS
pad, the data and command transmission between the host con
-
troller and the HT1621 are all enabled.
2RD
I
READ clock input with pull-high resistor Data in the RAM of the HT1621 are clocked out on the falling edge of the RD signal. The clocked out data will appear on the DATA line. The host controller can use the next rising edge to latch the clocked out data.
3WR
I
WRITE clock input with pull-high resistor Data on the DATA line are latched into the HT1621 on the ris
-
ing edge of the WR
signal.
4 DATA I/O Serial data input/output with pull-high resistor
5 VSS
¾
Negative power supply, ground
7 OSCI I The OSCI and OSCO pads are connected to a 32.768kHz crystal
in order to generate a system clock. If the system clock comes from an external clock source, the external clock source should be connected to the OSCI pad. But if an on-chip RC oscillator is selected instead, the OSCI and OSCO pads can be left open.
6 OSCO O
8 VLCD I LCD power input
9 VDD
¾
Positive power supply
10 IRQ
O Time base or WDT overflow flag, NMOS open drain output
11, 12 BZ, BZ
O 2kHz or 4kHz tone frequency output pair
13~16 COM0~COM3 O LCD common outputs
48~17 SEG0~SEG31 O LCD segment outputs
Absolute Maximum Ratings
Supply Voltage.................................-0.3V~5.5V
Storage Temperature....................-50
o
C~125oC
Input Voltage ....................V
SS
-0.3V~VDD+0.3V
Operating Temperature..................-25
o
C~75oC
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maxi
-
mum Ratings may cause substantial damage to the device. Functional operation of this de
­vice at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliability.
HT1621
6 April 21, 2000
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