Conversion Loss: 12 to 17 dB
Fo, 3Fo, 4Fo Isolation: 32 dB
Passive: No Bias Required
General Description
The HMC205 is a passive miniature frequency doubler in a MMIC die. Suppression of undesired fundamental and higher order harmonics is 32 dB typical
with respect to input signal level. The doubler utilizes the same GaAs Schottky diode/balun technology found in Hittite MMIC mixers. It features small
size, no DC bias, and no measurab le additive phase
noise onto the multiplied signal.
Electrical Specifi cations,T
ParameterMin.Typ. Max. Min.Typ. Max.Min.Typ. Max. Units
FREQ. MULTIPLIERS - CHIP
4 - 16
Frequency Range, Input7.0 - 12.06.0 - 12.06.0 - 12.0GHz
Frequency Range, Output14.0 - 24.012.0 - 24.012.0 - 24.0GHz
Conversion Loss182117201518dB
FO Isolation
(with respect to input level)
3FO Isolation
(with respect to input level)
4FO Isolation
(with respect to input level)
= +25° C, As a Function of Drive Level
A
Input = +10 dBmInput = +12 dBmInput = +15 dBm
2832dB
3640dB
2632dB
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
4 - 17
MICROWAVE CORPORATION
v02.1201
HMC205
GaAs MMIC FREQUENCY
4
Conversion Gain @ 25°C vs. Drive Level
0
-5
-10
-15
-20
-25
-30
CONVERSION GAIN (dB)
-35
-40
6789101112
+12 dBm
+15 dBm
+10 dBm
+8 dBm
INPUT FREQUENCY (GHz)
Conversion Gain @ -55°C vs. Drive Level
0
-5
-10
-15
-20
-25
-30
CONVERSION GAIN (dB)
-35
-40
6789101112
+12 dBm
+15 dBm
+10 dBm
+8 dBm
INPUT FREQUENCY (GHz)
DOUBLER, 6 - 12 GHz INPUT
Output Return Loss with 6 GHz Input
0
+10 dBm
-5
-10
+12 dBm
-15
OUTPUT RETURN LOSS (dB)
-20
12141618202224
Output Return Loss with 10 GHz Input
0
+10 dBm
-5
-10
+12 dBm
-15
OUTPUT RETURN LOSS (dB)
-20
12141618202224
+8 dBm
+14 dBm
OUTPUT FREQUENCY (GHz)
+8 dBm
+14 dBm
OUTPUT FREQUENCY (GHz)
FREQ. MULTIPLIERS - CHIP
Conversion Gain @ +85°C vs. Drive Level
0
-5
+15 dBm
-10
-15
-20
-25
-30
CONVERSION GAIN (dB)
-35
-40
6789101112
4 - 18
Output Return Loss with 12 GHz Input
+12 dBm
+10 dBm
+8 dBm
INPUT FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
0
+10 dBm
-5
-10
-15
OUTPUT RETURN LOSS (dB)
-20
12141618202224
+12 dBm
+8 dBm
+14 dBm
OUTPUT FREQUENCY (GHz)
MICROWAVE CORPORATION
v02.1201
HMC205
GaAs MMIC FREQUENCY
Absolute Maximum Ratings
Input Drive+27 dBm
Storage Temperature-65 to +150 °C
Operating Temperature-55 to +85 °C
Outline Drawing
DOUBLER, 6 - 12 GHz INPUT
4
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM]
2. BOND PADS ARE .004” SQUARE
3. TYPICAL BOND PAD SPACING CENTER TO
CENTER IS .006” EXCEPT AS SHOWN.
4. BACKSIDE METALLIZATION: GOLD
5. BACKSIDE METAL IS GROUND.
6. BOND PAD METALLIZATION: GOLD
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
FREQ. MULTIPLIERS - CHIP
4 - 19
MICROWAVE CORPORATION
v02.1201
HMC205
GaAs MMIC FREQUENCY
4
DOUBLER, 6 - 12 GHz INPUT
Handling Precautions
Follow these precautions to avoid permanent damage.
Cleanliness: Handle the chips in a clean environment. DO NO T attempt to clean the chip using liquid cleaning systems.
Static Sensitivity: Follow ESD precautions to protect against > ± 250V ESD strikes.
Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and
bias cables to minimize inductive pick-up.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent
tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet,
tweezers, or fi ngers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and fl at.
Epoxy Die Attach:
Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fi llet is observed around
the perimeter of the chip once it is placed into position.
Cure epoxy per the manufacturer’s schedule.
Wire Bonding
Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding wiht a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams
is recommended. Use the minimum level of ultrasonic energry to achieve reliable wirebonds. Wirebonds
should be started on the chip and terminated on the package. RF bonds should be as short as possible.
FREQ. MULTIPLIERS - CHIP
4 - 20
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
MICROWAVE CORPORATION
v02.1201
HMC205
GaAs MMIC FREQUENCY
Notes:
DOUBLER, 6 - 12 GHz INPUT
4
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
12 Elizabeth Drive, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order Online at www.hittite.com
FREQ. MULTIPLIERS - CHIP
4 - 21
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