Hitachi HVP 300 User Manual

Embedded Computing Platform

HVP300

Embedded Computing Platform

User Manual

Rev 1.1

Date: January 24th, 2017

Embedded Computing Platform

Revision History

Revision	Date	Description

0.1	August 3, 2016	Preliminary

1.0	August 22, 2016	Official release

1.1	January 24, 2017	Added LTE module installation
		Modified power input voltage
		Modified operating temperature
		Added PoE configuraiton description
		Added warning statement in the installation
		precaution
		Added wall mounting section

This document contains proprietary information of Lanner Electronics Inc. –and is not to be disclosed or used except in accordance with applicable agreements.

Copyright© 2017 Lanner Electronics Inc. All rights reserved. The information in this document is proprietary and confidential to Lanner Electronics Inc. No part of this document may be reproduced in any form or by any means or used to make any derivative work (such as translation, transformation, or adaptation) without the express written consent of Lanner Electronics Inc. Lanner Electronics Inc. reserves the right to revise this document and to make changes in content from time to time without obligation on the part of Lanner Electronics Inc. to provide notification of such revision or change.

The information in this document is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by Lanner Electronics Inc. Lanner Electronics Inc. assumes no responsibility or liability for any errors or inaccuracies that may appear in this document or any software that may be provided in association with this document.

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Online Resources

The listed websites are links to the on-line product information and technical support.

Resource	Website

Lanner	www.lannerinc.com
Product Resources	www.lannerinc.com/support/download-center
RMA	http://eRMA.lannerinc.com

Acknowledgement

Intel®, Pentium and Celeron are registered trademarks of Intel® Corp.

Microsoft Windows and MS-DOS are registered trademarks of Microsoft Corp.

All other product names or trademarks are properties of their respective owners.

Compliances and Certification

CE Certification

This product has passed the CE test for environmental specifications. Test conditions for passing included the equipment being operated within an industrial enclosure. In order to protect the product from being damaged by ESD (Electrostatic Discharge) and EMI leakage, we strongly recommend the use of CE-compliant industrial enclosure products.

FCC Class A Certification

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

EMC Notice

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case users will be required

Embedded Computing Platform

to correct the interference at their own expense.

Safety Guidelines

Follow these guidelines to ensure general safety:

Keep the chassis area clear and dust-free before, during and after installation.

Do not wear loose clothing or jewelry that could get caught in the chassis. Fasten your tie or scarf and roll up your sleeves.

Wear safety glasses/goggles if you are working under any conditions that might be hazardous to your eyes.

Do not perform any action that creates a potential hazard to people or makes the equipment unsafe.

Disconnect all power by turning off the power and unplugging the power cord before installing or removing a chassis or working near power supplies

Do not work alone if potentially hazardous conditions exist.

Never assume that power is disconnected from a circuit; always check the circuit.

LITHIUM BATTERY CAUTION:

Risk of explosion could occur if battery is replaced by an incorrect type. Please dispose of used batteries

according to the recycling instructions of your country.

Operating Safety

Electrical equipment generates heat. Ambient air temperature may not be adequate to cool equipment to acceptable operating temperatures without adequate circulation. Be sure that the room in which you choose to operate your system has adequate air circulation.

Ensure that the chassis cover is secure. The chassis design allows cooling air to circulate effectively. An open chassis permits air leaks, which may interrupt and redirect the flow of cooling air from internal components.

Electrostatic discharge (ESD) can damage equipment and impair electrical circuitry. ESD damage occurs when electronic components are improperly handled and can result in complete or intermittent failures. Be sure to follow ESD-prevention procedures when removing and replacing components to avoid these problems.

Wear an ESD-preventive wrist strap, ensuring that it makes good skin contact. If no wrist strap is available, ground yourself by touching the metal part of the chassis.

Periodically check the resistance value of the antistatic strap, which should be between 1 and 10 megohms (Mohms).

Installation only by a trained electrician or only by an electrically trained person who knows all the applied or related installation and device specifications..

Do not carry the handle of power supplies when moving to other place.

Embedded Computing Platform

The machine can only be used in a fixed location such as labs or computer facilities.

Mounting Installation Environment Precaution

1.Elevated Operating Ambient - If installed in a closed or multi-unit rack assembly, the operating ambient temperature of the rack environment may be greater than room ambient. Therefore, consideration should be given to installing the equipment in an environment compatible with the maximum ambient temperature (Tma) specified by the manufacturer.

2.Reduced Air Flow - Installation of the equipment in a rack should be such that the amount of air flow required for safe operation of the equipment is not compromised.

3.Mechanical Loading - Mounting of the equipment in the rack should be such that a hazardous condition is not achieved due to uneven mechanical loading.

4.Circuit Overloading - Consideration should be given to the connection of the equipment to the supply circuit and the effect that overloading of the circuits might have on over-current protection and supply wiring. Appropriate consideration of equipment nameplate ratings should be used when addressing this concern.

5.Reliable Earthing - Reliable earthing of rack-mounted equipment should be maintained. Particular attention should be given to supply connections other than direct connections to the branch circuit (e.g.

use of power strips).”

6. Warning: the unit must be installed indoors. The unit, AC power adapter, and its cables are not

designed for outdoor use.

Consignes de sécurité

Suivez ces consignes pour assurer la securite generale :

Laissez la zone du chassis propre et sans poussiere pendant et apres l’installation.

Ne portez pas de vetements amples ou de bijoux qui pourraient etre pris dans le chassis. Attachez votre cravate ou echarpe et remontez vos manches.

Portez des lunettes de securite pour proteger vosmyeux.

N’effectuez aucune action qui pourrait creer un dangermpour d’autres ou rendre l’equipement dangereux.

Coupez completement l’alimentation en eteignant l’alimentation et en debranchant le cordon d’alimentation avant d’installer ou de retirer un chassis ou de travailler a proximite de sources d’alimentation.

Ne travaillez pas seul si des conditions dangereuses sont presentes.

Ne considerez jamais que l’alimentation est coupee d’un circuit, verifiez toujours le circuit. Cet appareil genere, utilise et emet une energie radiofrequence et, s’il n’est pas installe et utilise conformement aux instructions des fournisseurs de composants sans fil, il risque de provoquer des

Embedded Computing Platform

interferences dans les communications radio.

Avertissement concernant la pile au lithium

Risque d’explosion si la pile est remplacee par une autre d’un mauvais type.

Jetez les piles usagees conformement aux instructions.

L’installation doit etre effectuee par un electricien forme ou une personne formee a l’electricite connaissant toutes les specifications d’installation et d’appareil du produit.

Ne transportez pas l’unite en la tenant par le cable d’alimentation lorsque vous deplacez l’appareil.

La machine ne peut etre utilisee qu’a un lieu fixe comme en laboratoire, salle d’ordinateurs ou salle de classe.

Sécurité de fonctionnement

L’equipement electrique genere de la chaleur. La temperature ambiante peut ne pas etre adequate pour refroidir l’equipement a une temperature de fonctionnement acceptable sans circulation adaptee. Verifiez que votre site propose une circulation d’air adequate.

Verifiez que le couvercle du chassis est bien fixe. La conception du chassis permet a l’air de refroidissement de bien circuler. Un chassis ouvert laisse l’air s’echapper, ce qui peut interrompre et rediriger le flux d’air frais destine aux composants internes.

Les decharges electrostatiques (ESD) peuvent endommager l’equipement et gener les circuits electriques. Des degats d’ESD surviennent lorsque des composants electroniques sont mal manipules et peuvent causer des pannes totales ou intermittentes. Suivez les procedures de prevention d’ESD lors du retrait et du remplacement de composants.

- Portez un bracelet anti-ESD et veillez a ce qu’il soit bien au contact de la peau. Si aucun bracelet n’est disponible, reliez votre corps a la terre en touchant la partie metallique du chassis. Verifiez regulierement la valeur de resistance du bracelet antistatique, qui doit etre comprise entre 1 et 10 megohms (Mohms).

Consignes de sécurité électrique

Avant d’allumer l’appareil, reliez le cable de mise a la terre de l’equipement a la terre.

Une bonne mise a la terre (connexion a la terre) est tres importante pour proteger l equipement contre les effets nefastes du bruit externe et reduire les risques d’electrocution en cas de foudre.

Pour desinstaller l’equipement, debranchez le cable de mise a la terre apres avoir eteint l’appareil.

Un cable de mise a la terre est requis et la zone reliant les sections du conducteur doit faire plus de 4 mm2 ou 10 AWG.

Procédure de mise à la terre pour source d’alimentation CC

•Desserrez la vis du terminal de mise a la terre.

•Branchez le cable de mise a la terre a la terre.

•L’appareil de protection pour la source d’alimentation

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CC doit fournir 30 A de courant. Cet appareil de protection doit etre branche a la source

d’alimentation avant l’alimentation CC.

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Table of Contents
Chapter 1: Introduction ......................................................................................................	9
Specifications ..............................................................................................................	9
Ordering Information ................................................................................................	10
Chapter 2: System Overview..............................................................................................	11
Mechanical Drawing...................................................................................................	11
Front I/Os ..................................................................................................................	12
Rear I/Os....................................................................................................................	13
Chapter 3: Board Layout ...................................................................................................	14
Jumper Settings & Connector Pinout (Motherboard) ..............................................	14
Chapter 4: Hardware Setup...............................................................................................	22
Installing SO-DIMM Memory ....................................................................................	23
Installing mSATA and Mini-PCIe Module...................................................................	24
Installing LTE Wireless Network Module ..................................................................	25
Installing Disk Drives ...............................................................................................	26
Wall Mounting ..........................................................................................................	28
Appendix 1: Watchdog Timer ...........................................................................................	29

Embedded Computing Platform

Chapter 1: Introduction

Thank you for choosing HVP300. This industrial embedded system is empowered by Intel® Core™ i7-6600U SoC processors (codenamed Skylake-U). The I/O features include four RS-232/422/485 serial ports, four USB 3.0, two USB 2.0 ports and two HDMI ports. For networking communications, the HVP300 comes with two 10/100/1000 Mbps Ethernet ports and four PoE ports for even greater flexibility.

Product Features:

Intel® Core™ i7-6600U SoC

2 x DDR3L 1333/1600MHz SO-DIMM sockets supporting up to 16GB

Intel® HD Graphics

2x HDMI display output ports

6x RJ45 (HVP300) or 2x RJ45 & 4x PoE (HVP300P)

4x USB 3.0 and 2x USB 2.0

2x 2.5” HDD/SSD with RAID 0/1

4x Serial Ports with RS-232/422/485 signals

0°C ~ +40°C Wide Operating Temperature Range

2 x mini-PCIe sockets (1 x full-size and 1 x half-size) with PCIe and USB signals (the full-size socket is compatible with LTE module)

1 x mSATA socket for internal storage

Please refer to the following table for detailed specifications

Specifications

Processor	Onboard Intel Skylake-U SoC processor options:
	Intel® Core™ i7-6600U (15W)

Memory	2x DDR3L 1333/1600MHz SO-DIMM sockets
	supporting up to 16GB

BIOS	AMI SPI Flash BIOS

Serial	4 x D-Sub9 COM ports with RS-232/422/485 signals

USB	4 x USB 3.0 Type-A ports in dual double-stacked form
	2 x USB 2.0 Type-A ports in double-stacked form

Display	Intel Integrated HD Graphic Engine
	2 x HDMI ports

Storage	1x mSATA mini socket
	1 x dual 2.5” SATA HDD/SSD drive bay

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