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April 1, 2003
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Hitachi Single-Chip Microcomputer
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
H8/3062 Series
H8/3062 HD6433062
H8/3061 HD6433061
H8/3060 HD6433060
H8/3062B Series
H8/3064B HD6433064B
H8/3062B HD6433062B
H8/3061B HD6433061B
H8/3060B HD6433060B
H8/3062F-ZTAT™
HD64F3062, HD64F3062R, HD64F3062B
H8/3064F-ZTAT™
HD64F3064B
Hardware Manual
ADE-602-136D
Rev. 5.0
3/18/03
Hitachi, Ltd.
Cautions
1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s
patent, copyright, trademark, or other intellectual property rights for information contained in
this document. Hitachi bears no responsibility for problems that may arise with third party’s
rights, including intellectual property rights, in connection with use of the information
contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you
have received the latest product standards or specifications before final design, purchase or
use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability.
However, contact Hitachi’s sales office before using the product in an application that
demands especially high quality and reliability or where its failure or malfunction may directly
threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear
power, combustion control, transportation, traffic, safety equipment or medical equipment for
life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi
particularly for maximum rating, operating supply voltage range, heat radiation characteristics,
installation conditions and other characteristics. Hitachi bears no responsibility for failure or
damage when used beyond the guaranteed ranges. Even within the guaranteed ranges,
consider normally foreseeable failure rates or failure modes in semiconductor devices and
employ systemic measures such as fail-safes, so that the equipment incorporating Hitachi
product does not cause bodily injury, fire or other consequential damage due to operation of
the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document
without written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi
semiconductor products.
Preface
The H8/3062 Series is a high-performance single-chip microcomputer that integrates peripheral
functions necessary for system configuration with an H8/300H CPU featuring a 32-bit internal
architecture as its core.
The on-chip peripheral functions include ROM, RAM, 16-bit timers, 8-bit timers, a programmable
timing pattern controller (TPC), a watchdog timer (WDT), a serial communication interface (SCI),
a D/A converter, an A/D converter, and I/O ports, providing an ideal configuration as a
microcomputer for embedding in sophisticated control systems. Flash memory (F-ZTAT™*) and
mask ROM are available as on-chip ROM, enabling users to respond quickly and flexibly to
changing application specifications and the demands of the transition from initial to full-fledged
volume production.
Note: * F-ZTAT is a trademark of Hitachi, Ltd.
Intended Readership: This manual is intended for users undertaking the design of an application
system using the H8/3062 Series. Readers using this manual require a basic
knowledge of electrical circuits, logic circuits, and microcomputers.
Purpose: The purpose of this manual is to give users an understanding of the hardware
functions and electrical characteristics of the H8/3062 Series. Details of
execution instructions can be found in the H8/300H Series Programming
Manual, which should be read in conjunction with the present manual.
Using this Manual:
• For an overall understanding of the H8/3062 Series's functions
Follow the Table of Contents. This manual is broadly divided into sections on the CPU, system
control functions, peripheral functions, and electrical characteristics.
• For a detailed understanding of CPU functions
Refer to the separate publication H8/300H Series Programming Manual.
Note on bit notation: Bits are shown in high-to-low order from left to right.
Related Material: The latest information is available at our Web Site. Please make sure that
you have the most up-to-date information available.
(http://www.hitachisemiconductor.com/)
User's Manuals on the H8/3062:
Manual Title ADE No.
H8/3062 Hardware Manual This manual
H8/300H Series Programming Manual ADE-602-053
Users manuals for development tools:
Manual Title ADE No.
C/C++ Compiler, Assembler, Optimizing Linkage Editor User’s Manual ADE-702-247
H8S, H8/300 Series Simulator/Debugger User’s Manual ADE-702-037
Hitachi Embedded Workshop User’s Manual ADE-702-201
H8S, H8/300 Series Hitachi Embedded Workshop, Hitachi Debugging
Interface User’s Manual
ADE-702-231
Application Note:
Manual Title ADE No.
H8/300H for CPU Application Note ADE-502-033
H8/300H On-Chip Supporting Modules Application Note ADE-502-035
H8/300H Technical Q&A ADE-502-038
Comparison of H8/3062 Series Product Specifications
There are 11 members of the H8/3062 Series: the H8/3062F-ZTAT, H8/3062F-ZTAT R-mask
version, H8/3062F-ZTAT B-mask version, and H8/3064F-ZTAT B-mask version (all with on-chip
flash memory), and the H8/3062 mask ROM version, H8/3061 mask ROM version, H8/3060 mask
ROM version, H8/3064 mask ROM B-mask version, H8/3062 mask ROM B-mask version,
H8/3061 mask ROM B-mask version, and H8/3060 mask ROM B-mask version.
The specifications of these products are compared below.
H8/3064 Mask ROM
H8/3062 Mask
H8/3062F-ZTAT H8/3062F-ZTAT
Product
specifications
Product
code
Pin arrangement
RAM size 4 kbytes H8/3062:
On-chip singlepower-supply
flash memory
HD64F3062 HD64F3062R HD6433062
See figures 1.2 and 1.3, Pin Arrangement, in section 1 H8/3064F-ZTAT
R-Mask Version
H8/3062F-ZTAT
version with
address output
functions added
ROM Version,
H8/3061 Mask
ROM Version,
H8/3060 Mask
ROM Version
Mask ROM
version
HD6433061
HD6433060
4 kbytes
H8/3061:
4 kbytes
H8/3060:
2 kbytes
H8/3064F-ZTAT
B-Mask Version
On-chip largecapacity singlepower-supply
flash memory
Internal stepdown circuit
HD64F3064B HD64F3062B HD6433064B
B-mask version
has V
pin, and
CL
requires
connection of
external
capacitor
See figures 1.4
and 1.5, Pin
Arrangement, in
section 1
8 kbytes 4 kbytes H8/3064B:
H8/3062F-ZTAT
B-Mask Version
H8/3062F-ZTAT
high-speed
operation version
H8/3062F-ZTAT
B-mask version
has V
pin, and
CL
requires
connection of
external
capacitor
See figures 1.4
and 1.5, Pin
Arrangement, in
section 1
B-Mask Version,
H8/3062 Mask ROM
B-Mask Version,
H8/3061 Mask ROM
B-Mask Version,
H8/3060 Mask ROM
B-Mask Version
Mask ROM version
HD6433062B
HD6433061B
HD6433060B
H8/3064 mask ROM
B-mask version,
H8/3062 mask ROM
B-mask version,
H8/3061 mask ROM
B-mask version, and
H8/3060 mask ROM
B-mask version have
V
pin, and require
CL
connection of
external capacitor
See figures 1.4
and 1.5, Pin
Arrangement, in
section 1
8 kbytes
H8/3062B:
4 kbytes
H8/3061B:
4 kbytes
H8/3060B:
2 kbytes
H8/3062F-ZTAT H8/3062F-ZTAT
ROM size 128 kbytes H8/3062:
Address
output
functions
Flash
memory
Mask ROM — — See section 17,
Electrical
characteristics
(operating
frequency)
Compatible with
previous
H8/300H Series
See section 17, ROM — See 18.1.1,
See table 22.1, Comparison of H8/3062 Series Electrical Characteristics, in section 22
R-Mask Version
Address update mode 1 or 2 selectable
See 6.3.5, Address Output Method, in section 6
1 to 20 MHz 2 to 25 MHz
H8/3062 Mask
ROM Version,
H8/3061 Mask
ROM Version,
H8/3060 Mask
ROM Version
128 kbytes
H8/3061:
96 kbytes
H8/3060:
64 kbytes
ROM
H8/3064 Mask ROM
B-Mask Version,
H8/3062 Mask ROM
H8/3064F-ZTAT
B-Mask Version
256 kbytes 128 kbytes H8/3064B:
Differences
between
H8/3062F-ZTAT
and
H8/3062F-ZTAT
R-Mask Version,
in section 18
— — Mask ROM B-mask
H8/3062F-ZTAT
B-Mask Version
See 19.1.1,
Differences
between
H8/3062F-ZTAT
and
H8/3062F-ZTAT
R-Mask Version,
in section 19
B-Mask Version,
H8/3061 Mask ROM
B-Mask Version,
H8/3060 Mask ROM
B-Mask Version
256 kbytes
H8/3062B:
128 kbytes
H8/3061B:
96 kbytes
H8/3060B:
64 kbytes
—
version of H8/3064:
see section 18.
Mask ROM B-mask
versions of H8/3062,
H8/3061, and
H8/3060: see section
19.
H8/3062 Mask
H8/3062F-ZTAT H8/3062F-ZTAT
Registers See table B.1, Comparison of H8/3062 Series Internal I/O Register Specifications,
Usage
notes
in appendix B
See appendix
B.1, Address List
See 1.4, H8/3062F-ZTAT R-Mask Version Usage
Note, in section 1
R-Mask Version
See appendix
B.1, Address List
ROM Version,
H8/3061 Mask
ROM Version,
H8/3060 Mask
ROM Version
See appendix
B.1, Address List
H8/3064F-ZTAT
B-Mask Version
See appendix
B.2, Address List
See 1.5, H8/3064F-ZTAT B-Mask Version, and
H8/3062F-ZTAT B-Mask Version Usage Note, in section 1
H8/3062F-ZTAT
B-Mask Version
See appendix
B.3, Address List
H8/3064 Mask ROM
B-Mask Version,
H8/3062 Mask ROM
B-Mask Version,
H8/3061 Mask ROM
B-Mask Version,
H8/3060 Mask ROM
B-Mask Version
Mask ROM B-mask
version of H8/3064:
see appendix B.2,
Address List.
Mask ROM B-mask
versions of H8/3062,
H8/3061, and
H8/3060: see
appendix B.3,
Address List.
List of Items Revised or Added for This Version
Description
Section Page Item
All — All The H8/3064 mask ROM
1. Overview 18 1.3.3 Pin Assignments in
Each Mode
25 1.5.2 Product Type
Names and Markings
27 1.5.4 Notes on
Changeover to Mask
ROM Version or Mask
ROM B-Mask Version
6. Bus Controller 139 6.3.1 Area Division
(See Manual for Details)
B-mask version, H8/3062 mask
ROM B-mask version, H8/3061
mask ROM B-mask version,
and H8/3060 mask ROM Bmask version are added to the
product line-up.
Table 1.4 Pin Assignments in
Each Mode (FP-100B or
TFP-100B, FP-100A)
• (V
)* 4 is added to modes 2
CL
to 7 in the first row.
Table 1.7 Differences in
H8/3062F-ZTAT R-Mask
Version, H8/3062F-ZTAT
B-Mask Version, H8/3064FZTAT, and H8/3064F-ZTAT
B-Mask Version Markings
• The marking examples of
H8/3062F-ZTAT B-mask
version and H8/3064FZTAT B-mask version are
amended.
• Title is amended.
• Note (2) is added.
• Figure 6.3 Memory Map in
16-Mbyte Mode (H8/3060
Mask ROM Version,
H8/3060 Mask ROM
B-Mask Version) (2) is
added.
• The Memory Map in 16Mbyte Mode (H8/3064FZTAT B-Mask Version,
H8/3064 Mask ROM
B-Mask Version) is moved
from figure 6.3 (2) to figure
6.3 (3).
Description
Section Page Item
12. Serial Communication
Interface
14. A/D Converter 447 14.1.1 Features The high-speed conversion
17. ROM [H8/3062FZTAT, H8/3062F-ZTAT
R-Mask Version, On-Chip
Mask ROM Models]
18. H8/3064 Internal
Voltage Step-Down
Version ROM
[H8/3064F-ZTAT B-Mask
Version, H8/3064 Mask
ROM B-Mask Version]
19. H8/3062 Internal
Voltage Step-Down
Version ROM
[H8/3062F-ZTAT B-Mask
Version, Mask ROM
B-Mask Versions of
H8/3062, H8/3061, and
H8/3060]
394 12.3.2 Operation in
Asynchronous Mode
482 17.2.4 Register
Configuration
523 to 574 All The title of the section is
572 18.12 Mask ROM
(H8/3064 Mask ROM
B-Mask Version)
Overview
573 18.13 Notes on Ordering
Mask ROM Version Chips
574 18.14 Notes on
Converting the F-ZTAT
Application Software to
the Mask ROM Versions
575 to 626 All
594 19.5.1 Boot Mode The start address of the
(See Manual for Details)
Figure 12.4 Sample Flowchart
for SCI Initialization
• Note is added.
time is amended.
Note 3 is deleted.
changed from Flash Memory
[H8/3064F-ZTAT B-Mask
Version].
Newly added.
• The title of the section is
changed from Flash
Memory.
• Descriptions on the mask
ROM B-mask versions of
H8/3062, H8/3061, and
H8/3060 are added.
programming control program
is amended to H'FFF520.
Section Page Item
19. H8/3062 Internal
Voltage Step-Down
Version ROM
[H8/3062F-ZTAT B-Mask
Version, Mask ROM
B-Mask Versions of
H8/3062, H8/3061, and
H8/3060]
20. Clock Pulse
Generator
21. Power-Down State 644 21.4.3 Selection of
22. Electrical
Characteristics
624 19.12 Mask ROM
(H8/3062 Mask ROM BMask Version, H8/3061
Mask ROM B-Mask
Version, H8/3060 Mask
ROM B-Mask Version)
Overview
625 19.13 Notes on Ordering
Mask ROM Version Chips
626 19.14 Notes on
Converting the F-ZTAT
Application Software to
the Mask ROM Versions
628 20.2.1 Connecting a
Crystal Resonator
634 20.5.3 Usage Notes Table 20.7 Comparison of
Waiting Time for Exit from
Software Standby Mode
695 22.3 Electrical
Characteristics of
H8/3064F-ZTAT B-Mask
Version
22.3.1 Absolute
Maximum Ratings
696, 699 22.3.2 DC
Characteristics
Description
(See Manual for Details)
Newly added.
• Moved from 19.12.
• Table is amended.
Table 20.1 (1) Damping
Resistance Value
• Note is amended.
H8/3062 Series Operating
Frequency Ranges is
amended.
Table 21.3 Clock Frequency
and Waiting Time for Clock to
Settle
• The value 13.1 is specified
for the recommended
setting for DIV = 1, DIV0 =
1, and 32468 states
Table 22.21 Absolute
Maximum Ratings
The operating temperature
rating is amended
Table22.22 DC
Characteristics, and Table
22.23 Permissible Output
Currents
• A new condition is added.
Section Page Item
22. Electrical
Characteristics
701, 702,
703, 705
707 22.3.4 A/D Conversion
708 22.3.5 D/A Conversion
709 22.3.6 Flash Memory
711 to 723 22.4 Electrical
724 to 739 22.5 Electrical
724 22.5.1 Absolute
725 22.5.2 DC
730, 731,
732, 734
22.3.3 AC
Characteristics
Characteristics
Characteristics
Characteristics
Characteristics of
H8/3064 Mask ROM BMask Version
Characteristics of
H8/3062F-ZTAT B-Mask
Version
Maximum Ratings
Characteristics
22.5.3 AC
Characteristics
Description
(See Manual for Details)
Table 22.24 Clock Timing,
Table 22.25 Control Signal
Timing, Table 22.26 Bus
Timing, and Table 22.27
Timing of On-Chip Supporting
Modules
• A new condition is added.
Table 22.28 A/D Conversion
Characteristics
• A new condition is added.
Table 22.29 D/A conversion
Characteristics
• A new condition is added.
Table 22.30 Flash Memory
Characteristics
• A new condition is added.
Newly added
The section is moved from
22.4.
Table 22.40 Absolute
Maximum Ratings
The operating temperature
rating is amended
Table22.41 DC
Characteristics, and Table
22.42 Permissible Output
Currents
• A new condition is added.
Table 22.43 Clock Timing,
Table 22.44 Control Signal
Timing, Table 22.45 Bus
Timing, and Table 22.46
Timing of On-Chip Supporting
Modules
• A new condition is added.
Section Page Item
22. Electrical
Characteristics
736 22.5.4 A/D Conversion
Characteristics
737 22.5.5 D/A Conversion
Characteristics
738 22.5.6 Flash Memory
Characteristics
740 to 752 22.6 Electrical
Characteristics of
H8/3062 Mask ROM
B-Mask Version, H8/3061
Mask ROM B-Mask
Version, and H8/3060
Mask ROM B-Mask
Version
753 to 761 22.7 Operational Timing The section is moved from
Appendix 906 C.7 Port 7 Block
Diagram
Description
(See Manual for Details)
Table 22.47 A/D Conversion
Characteristics
• A new condition is added.
Table 22.48 D/A conversion
Characteristics
• A new condition is added.
Table 22.49 Flash Memory
Characteristics
• A new condition is added.
Newly added
22.5.
• Figure C.7(a) Port 7 Block
Diagram (Pins P7
to P75) is
0
amended.
• Figure C.7(b) Port 7 Block
Diagram (Pins P7
to P77) is
6
amended.
Contents
Section 1 Overview........................................................................................................... 1
1.1 Overview............................................................................................................................ 1
1.2 Block Diagram................................................................................................................... 7
1.3 Pin Description.................................................................................................................. 8
1.3.1 Pin Arrangement .................................................................................................. 8
1.3.2 Pin Functions........................................................................................................ 13
1.3.3 Pin Assignments in Each Mode............................................................................ 18
1.4 Notes on H8/3062F-ZTAT R-Mask Version .................................................................... 22
1.4.1 Pin Arrangement .................................................................................................. 22
1.4.2 Product Type Names and Markings ..................................................................... 23
1.4.3 Differences between H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version. 23
1.5 Notes on H8/3064F-ZTAT B-Mask Version, H8/3062F-ZTAT B-Mask Version,
H8/3064 Mask ROM B-Mask Version, H8/3062 Mask ROM B-Mask Version,
H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version ....... 24
1.5.1 Pin Arrangement.................................................................................................. 25
1.5.2 Product Type Names and Markings ..................................................................... 25
1.5.3 VCL Pin.................................................................................................................. 26
1.5.4 Notes on Changeover to On-Chip Mask ROM Versions and
On-Chip Mask ROM B-Mask Versions............................................................... 27
1.6 Setting Oscillation Settling Wait Time.............................................................................. 28
1.7 Caution on Crystal Resonator Connection........................................................................ 28
Section 2 CPU..................................................................................................................... 29
2.1 Overview............................................................................................................................ 29
2.1.1 Features ................................................................................................................ 29
2.1.2 Differences from H8/300 CPU............................................................................. 30
2.2 CPU Operating Modes ...................................................................................................... 31
2.3 Address Space.................................................................................................................... 31
2.4 Register Configuration ......................................................................................................3 2
2.4.1 Overview.............................................................................................................. 32
2.4.2 General Registers.................................................................................................. 33
2.4.3 Control Registers.................................................................................................. 34
2.4.4 Initial CPU Register Values...................................................................................... 35
2.5 Data Formats...................................................................................................................... 36
2.5.1 General Register Data Formats ............................................................................ 36
2.5.2 Memory Data Formats.......................................................................................... 37
2.6 Instruction Set.................................................................................................................... 39
2.6.1 Instruction Set Overview...................................................................................... 39
2.6.2 Instructions and Addressing Modes ..................................................................... 40
i
2.6.3 Tables of Instructions Classified by Function...................................................... 41
2.6.4 Basic Instruction Formats..................................................................................... 50
2.6.5 Notes on Use of Bit Manipulation Instructions.................................................... 51
2.7 Addressing Modes and Effective Address Calculation..................................................... 53
2.7.1 Addressing Modes................................................................................................ 53
2.7.2 Effective Address Calculation.............................................................................. 55
2.8 Processing States ............................................................................................................... 59
2.8.1 Overview.............................................................................................................. 59
2.8.2 Program Execution State...................................................................................... 59
2.8.3 Exception-Handling State .................................................................................... 60
2.8.4 Exception Handling Operation ............................................................................. 61
2.8.5 Bus-Released State............................................................................................... 62
2.8.6 Reset State............................................................................................................ 62
2.8.7 Power-Down State................................................................................................ 63
2.9 Basic Operational Timing.................................................................................................. 63
2.9.1 Overview.............................................................................................................. 63
2.9.2 On-Chip Memory Access Timing ........................................................................ 63
2.9.3 On-Chip Supporting Module Access Timing....................................................... 64
2.9.4 Access to External Address Space ....................................................................... 65
Section 3 MCU Operating Modes ................................................................................ 67
3.1 Overview............................................................................................................................ 67
3.1.1 Operating Mode Selection.................................................................................... 67
3.1.2 Register Configuration ......................................................................................... 68
3.2 Mode Control Register (MDCR)....................................................................................... 68
3.3 System Control Register (SYSCR).................................................................................... 69
3.4 Operating Mode Descriptions............................................................................................ 72
3.4.1 Mode 1.................................................................................................................. 72
3.4.2 Mode 2.................................................................................................................. 72
3.4.3 Mode 3.................................................................................................................. 72
3.4.4 Mode 4.................................................................................................................. 72
3.4.5 Mode 5.................................................................................................................. 72
3.4.6 Mode 6.................................................................................................................. 73
3.4.7 Mode 7.................................................................................................................. 73
3.5 Pin Functions in Each Operating Mode............................................................................. 73
3.6 Memory Map in Each Operating Mode............................................................................. 74
3.6.1 Comparison of H8/3062 Series Memory Maps.................................................... 74
3.6.2 Reserved Areas..................................................................................................... 75
Section 4 Exception Handling........................................................................................ 85
4.1 Overview............................................................................................................................ 85
4.1.1 Exception Handling Types and Priority ............................................................... 85
4.1.2 Exception Handling Operation ............................................................................. 85
ii
4.1.3 Exception Vector Table........................................................................................ 86
4.2 Reset.................................................................................................................................. 88
4.2.1 Overview.............................................................................................................. 88
4.2.2 Reset Sequence..................................................................................................... 88
4.2.3 Interrupts after Reset ............................................................................................ 91
4.3 Interrupts............................................................................................................................ 92
4.4 Trap Instruction ................................................................................................................. 92
4.5 Stack Status after Exception Handling.............................................................................. 93
4.6 Notes on Stack Usage........................................................................................................94
Section 5 Interrupt Controller........................................................................................ 97
5.1 Overview............................................................................................................................ 97
5.1.1 Features ................................................................................................................ 97
5.1.2 Block Diagram...................................................................................................... 98
5.1.3 Pin Configuration ................................................................................................. 99
5.1.4 Register Configuration ......................................................................................... 99
5.2 Register Descriptions......................................................................................................... 99
5.2.1 System Control Register (SYSCR) ...................................................................... 99
5.2.2 Interrupt Priority Registers A and B (IPRA, IPRB) ............................................. 100
5.2.3 IRQ Status Register (ISR) .................................................................................... 105
5.2.4 IRQ Enable Register (IER) .................................................................................. 106
5.2.5 IRQ Sense Control Register (ISCR)..................................................................... 107
5.3 Interrupt Sources................................................................................................................ 108
5.3.1 External Interrupts................................................................................................ 108
5.3.2 Internal Interrupts................................................................................................. 109
5.3.3 Interrupt Exception Handling Vector Table ......................................................... 109
5.4 Interrupt Operation............................................................................................................ 113
5.4.1 Interrupt Handling Process ................................................................................... 113
5.4.2 Interrupt Exception Handling Sequence .............................................................. 118
5.4.3 Interrupt Response Time ...................................................................................... 119
5.5 Usage Notes....................................................................................................................... 120
5.5.1 Contention between Interrupt and Interrupt-Disabling Instruction...................... 120
5.5.2 Instructions that Inhibit Interrupts........................................................................ 121
5.5.3 Interrupts during EEPMOV Instruction Execution.............................................. 121
Section 6 Bus Controller.................................................................................................. 123
6.1 Overview............................................................................................................................ 123
6.1.1 Features ................................................................................................................ 123
6.1.2 Block Diagram...................................................................................................... 124
6.1.3 Pin Configuration ................................................................................................. 125
6.1.4 Register Configuration ......................................................................................... 126
6.2 Register Descriptions......................................................................................................... 126
6.2.1 Bus Width Control Register (ABWCR) ............................................................... 126
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6.2.2 Access State Control Register (ASTCR).............................................................. 127
6.2.3 Wait Control Registers H and L (WCRH, WCRL).............................................. 128
6.2.4 Bus Release Control Register (BRCR) ................................................................ 132
6.2.5 Bus Control Register (BCR) ................................................................................ 133
6.2.6 Chip Select Control Register (CSCR).................................................................. 135
6.2.7 Address Control Register (ADRCR).................................................................... 136
6.3 Operation ........................................................................................................................... 137
6.3.1 Area Division........................................................................................................ 137
6.3.2 Bus Specifications................................................................................................ 141
6.3.3 Memory Interfaces................................................................................................ 142
6.3.4 Chip Select Signals............................................................................................... 142
6.3.5 Address Output Method ....................................................................................... 143
6.4 Basic Bus Interface............................................................................................................ 145
6.4.1 Overview.............................................................................................................. 145
6.4.2 Data Size and Data Alignment ............................................................................. 145
6.4.3 Valid Strobes........................................................................................................ 146
6.4.4 Memory Areas...................................................................................................... 147
6.4.5 Basic Bus Control Signal Timing......................................................................... 148
6.4.6 Wait Control......................................................................................................... 155
6.5 Idle Cycle........................................................................................................................... 157
6.5.1 Operation.............................................................................................................. 157
6.5.2 Pin States in Idle Cycle ........................................................................................ 159
6.6 Bus Arbiter ........................................................................................................................ 159
6.6.1 Operation.............................................................................................................. 160
6.7 Register and Pin Input Timing .......................................................................................... 162
6.7.1 Register Write Timing.......................................................................................... 162
6.7.2 BREQ Pin Input Timing....................................................................................... 163
Section 7 I/O Ports ............................................................................................................ 165
7.1 Overview............................................................................................................................ 165
7.2 Port 1.................................................................................................................................. 169
7.2.1 Overview.............................................................................................................. 169
7.2.2 Register Descriptions............................................................................................ 169
7.3 Port 2.................................................................................................................................. 172
7.3.1 Overview.............................................................................................................. 172
7.3.2 Register Descriptions............................................................................................ 173
7.4 Port 3.................................................................................................................................. 176
7.4.1 Overview.............................................................................................................. 176
7.4.2 Register Descriptions............................................................................................ 176
7.5 Port 4.................................................................................................................................. 178
7.5.1 Overview.............................................................................................................. 178
7.5.2 Register Descriptions............................................................................................ 179
7.6 Port 5.................................................................................................................................. 181
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7.6.1 Overview.............................................................................................................. 181
7.6.2 Register Descriptions............................................................................................ 182
7.7 Port 6.................................................................................................................................. 184
7.7.1 Overview.............................................................................................................. 184
7.7.2 Register Descriptions............................................................................................ 185
7.8 Port 7.................................................................................................................................. 188
7.8.1 Overview.............................................................................................................. 188
7.8.2 Register Description............................................................................................. 189
7.9 Port 8.................................................................................................................................. 190
7.9.1 Overview.............................................................................................................. 190
7.9.2 Register Descriptions............................................................................................ 191
7.10 Port 9.................................................................................................................................. 195
7.10.1 Overview.............................................................................................................. 195
7.10.2 Register Descriptions............................................................................................ 196
7.11 Port A................................................................................................................................. 200
7.11.1 Overview.............................................................................................................. 200
7.11.2 Register Descriptions............................................................................................ 202
7.12 Port B................................................................................................................................. 212
7.12.1 Overview.............................................................................................................. 212
7.12.2 Register Descriptions............................................................................................ 214
Section 8 16-Bit Timer..................................................................................................... 221
8.1 Overview............................................................................................................................ 221
8.1.1 Features ................................................................................................................ 221
8.1.2 Block Diagrams.................................................................................................... 223
8.1.3 Pin Configuration ................................................................................................. 226
8.1.4 Register Configuration ......................................................................................... 227
8.2 Register Descriptions......................................................................................................... 228
8.2.1 Timer Start Register (TSTR)................................................................................ 228
8.2.2 Timer Synchro Register (TSNC).......................................................................... 229
8.2.3 Timer Mode Register (TMDR) ............................................................................ 230
8.2.4 Timer Interrupt Status Register A (TISRA) ......................................................... 233
8.2.5 Timer Interrupt Status Register B (TISRB).......................................................... 235
8.2.6 Timer Interrupt Status Register C (TISRC).......................................................... 238
8.2.7 Timer Counters (16TCNT)................................................................................... 240
8.2.8 General Registers (GRA, GRB) ........................................................................... 241
8.2.9 Timer Control Registers (16TCR)........................................................................ 242
8.2.10 Timer I/O Control Register (TIOR) ..................................................................... 244
8.2.11 Timer Output Level Setting Register C (TOLR).................................................. 246
8.3 CPU Interface.................................................................................................................... 248
8.3.1 16-Bit Accessible Registers.................................................................................. 248
8.3.2 8-Bit Accessible Registers.................................................................................... 250
8.4 Operation ........................................................................................................................... 251
v
8.4.1 Overview.............................................................................................................. 251
8.4.2 Basic Functions .................................................................................................... 251
8.4.3 Synchronization.................................................................................................... 259
8.4.4 PWM Mode.......................................................................................................... 261
8.4.5 Phase Counting Mode .......................................................................................... 265
8.4.6 16-Bit Timer Output Timing ................................................................................ 267
8.5 Interrupts............................................................................................................................ 268
8.5.1 Setting of Status Flags.......................................................................................... 268
8.5.2 Timing of Clearing of Status Flags ...................................................................... 270
8.5.3 Interrupt Sources .................................................................................................. 271
8.6 Usage Notes....................................................................................................................... 272
Section 9 8-Bit Timers ..................................................................................................... 285
9.1 Overview............................................................................................................................ 285
9.1.1 Features ................................................................................................................ 285
9.1.2 Block Diagram...................................................................................................... 287
9.1.3 Pin Configuration ................................................................................................. 288
9.1.4 Register Configuration ......................................................................................... 289
9.2 Register Descriptions......................................................................................................... 290
9.2.1 Timer Counters (8TCNT)..................................................................................... 290
9.2.2 Time Constant Registers A (TCORA) ................................................................. 291
9.2.3 Time Constant Registers B (TCORB).................................................................. 292
9.2.4 Timer Control Register (8TCR) ........................................................................... 293
9.2.5 Timer Control/Status Registers (8TCSR) ............................................................ 296
9.3 CPU Interface.................................................................................................................... 301
9.3.1 8-Bit Registers...................................................................................................... 301
9.4 Operation ........................................................................................................................... 303
9.4.1 8TCNT Count Timing.......................................................................................... 303
9.4.2 Compare Match Timing ....................................................................................... 304
9.4.3 Input Capture Signal Timing................................................................................ 305
9.4.4 Timing of Status Flag Setting............................................................................... 306
9.4.5 Operation with Cascaded Connection .................................................................. 307
9.4.6 Input Capture Setting............................................................................................ 310
9.5 Interrupt ............................................................................................................................. 311
9.5.1 Interrupt Sources .................................................................................................. 311
9.5.2 A/D Converter Activation .................................................................................... 312
9.6 8-Bit Timer Application Example..................................................................................... 312
9.7 Usage Notes....................................................................................................................... 313
9.7.1 Contention between 8TCNT Write and Clear...................................................... 313
9.7.2 Contention between 8TCNT Write and Increment .............................................. 314
9.7.3 Contention between TCOR Write and Compare Match ...................................... 315
9.7.4 Contention between TCOR Read and Input Capture ........................................... 316
9.7.5 Contention between Counter Clearing by Input Capture and Counter Increment 317
vi
9.7.6 Contention between TCOR Write and Input Capture .......................................... 318
9.7.7 Contention between 8TCNT Byte Write and Increment in 16-Bit Count Mode
(Cascaded Connection) ........................................................................................ 319
9.7.8 Contention between Compare Matches A and B ................................................. 320
9.7.9 8TCNT Operation and Internal Clock Source Switchover .................................. 320
Section 10 Programmable Timing Pattern Controller (TPC).................................. 323
10.1 Overview............................................................................................................................ 323
10.1.1 Features ................................................................................................................ 323
10.1.2 Block Diagram...................................................................................................... 324
10.1.3 Pin Configuration ................................................................................................. 325
10.1.4 Register Configuration ......................................................................................... 326
10.2 Register Descriptions......................................................................................................... 327
10.2.1 Port A Data Direction Register (PADDR) ........................................................... 327
10.2.2 Port A Data Register (PADR) .............................................................................. 327
10.2.3 Port B Data Direction Register (PBDDR)............................................................ 328
10.2.4 Port B Data Register (PBDR)............................................................................... 328
10.2.5 Next Data Register A (NDRA) ............................................................................ 329
10.2.6 Next Data Register B (NDRB)............................................................................. 331
10.2.7 Next Data Enable Register A (NDERA).............................................................. 333
10.2.8 Next Data Enable Register B (NDERB) .............................................................. 334
10.2.9 TPC Output Control Register (TPCR) ................................................................. 335
10.2.10 TPC Output Mode Register (TPMR) ................................................................... 337
10.3 Operation ........................................................................................................................... 339
10.3.1 Overview.............................................................................................................. 339
10.3.2 Output Timing...................................................................................................... 340
10.3.3 Normal TPC Output ............................................................................................. 341
10.3.4 Non-Overlapping TPC Output ............................................................................. 343
10.3.5 TPC Output Triggering by Input Capture ............................................................ 345
10.4 Usage Notes....................................................................................................................... 346
10.4.1 Operation of TPC Output Pins ............................................................................. 346
10.4.2 Note on Non-Overlapping Output........................................................................ 346
Section 11 Watchdog Timer ............................................................................................. 349
11.1 Overview............................................................................................................................ 349
11.1.1 Features ................................................................................................................ 349
11.1.2 Block Diagram...................................................................................................... 350
11.1.3 Pin Configuration ................................................................................................. 350
11.1.4 Register Configuration ......................................................................................... 351
11.2 Register Descriptions......................................................................................................... 351
11.2.1 Timer Counter (TCNT) ........................................................................................ 351
11.2.2 Timer Control/Status Register (TCSR)................................................................ 352
11.2.3 Reset Control/Status Register (RSTCSR)............................................................ 354
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11.2.4 Notes on Register Rewriting ................................................................................ 355
11.3 Operation ........................................................................................................................... 357
11.3.1 Watchdog Timer Operation.................................................................................. 357
11.3.2 Interval Timer Operation...................................................................................... 358
11.3.3 Timing of Setting of Overflow Flag (OVF) ......................................................... 358
11.3.4 Timing of Setting of Watchdog Timer Reset Bit (WRST) .................................. 359
11.4 Interrupts............................................................................................................................ 360
11.5 Usage Notes....................................................................................................................... 360
Section 12 Serial Communication Interface................................................................ 361
12.1 Overview............................................................................................................................ 361
12.1.1 Features ................................................................................................................ 361
12.1.2 Block Diagram...................................................................................................... 363
12.1.3 Pin Configuration ................................................................................................. 364
12.1.4 Register Configuration ......................................................................................... 365
12.2 Register Descriptions......................................................................................................... 366
12.2.1 Receive Shift Register (RSR)............................................................................... 366
12.2.2 Receive Data Register (RDR) .............................................................................. 366
12.2.3 Transmit Shift Register (TSR).............................................................................. 367
12.2.4 Transmit Data Register (TDR)............................................................................. 367
12.2.5 Serial Mode Register (SMR)................................................................................ 368
12.2.6 Serial Control Register (SCR).............................................................................. 371
12.2.7 Serial Status Register (SSR)................................................................................. 375
12.2.8 Bit Rate Register (BRR)....................................................................................... 380
12.3 Operation ........................................................................................................................... 388
12.3.1 Overview.............................................................................................................. 388
12.3.2 Operation in Asynchronous Mode........................................................................ 391
12.3.3 Multiprocessor Communication........................................................................... 400
12.3.4 Synchronous Operation........................................................................................ 407
12.4 SCI Interrupts .................................................................................................................... 415
12.5 Usage Notes....................................................................................................................... 416
12.5.1 Notes on Use of SCI............................................................................................. 416
Section 13 Smart Card Interface...................................................................................... 421
13.1 Overview............................................................................................................................ 421
13.1.1 Features ................................................................................................................ 421
13.1.2 Block Diagram...................................................................................................... 422
13.1.3 Pin Configuration ................................................................................................. 422
13.1.4 Register Configuration ......................................................................................... 423
13.2 Register Descriptions......................................................................................................... 424
13.2.1 Smart Card Mode Register (SCMR) .................................................................... 424
13.2.2 Serial Status Register (SSR)................................................................................. 426
13.2.3 Serial Mode Register (SMR)................................................................................ 427
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13.2.4 Serial Control Register (SCR).............................................................................. 428
13.3 Operation ........................................................................................................................... 429
13.3.1 Overview.............................................................................................................. 429
13.3.2 Pin Connections.................................................................................................... 429
13.3.3 Data Format.......................................................................................................... 430
13.3.4 Register Settings................................................................................................... 432
13.3.5 Clock .................................................................................................................... 434
13.3.6 Transmitting and Receiving Data......................................................................... 436
13.4 Usage Notes....................................................................................................................... 443
Section 14 A/D Converter ................................................................................................. 447
14.1 Overview............................................................................................................................ 447
14.1.1 Features ................................................................................................................ 447
14.1.2 Block Diagram...................................................................................................... 448
14.1.3 Pin Configuration ................................................................................................. 449
14.1.4 Register Configuration ......................................................................................... 450
14.2 Register Descriptions......................................................................................................... 450
14.2.1 A/D Data Registers A to D (ADDRA to ADDRD).............................................. 450
14.2.2 A/D Control/Status Register (ADCSR)................................................................ 451
14.2.3 A/D Control Register (ADCR)............................................................................. 453
14.3 CPU Interface.................................................................................................................... 454
14.4 Operation ........................................................................................................................... 456
14.4.1 Single Mode (SCAN = 0)..................................................................................... 456
14.4.2 Scan Mode (SCAN = 1) ....................................................................................... 458
14.4.3 Input Sampling and A/D Conversion Time.......................................................... 460
14.4.4 External Trigger Input Timing ............................................................................. 461
14.5 Interrupts............................................................................................................................ 462
14.6 Usage Notes....................................................................................................................... 462
Section 15 D/A Converter ................................................................................................. 467
15.1 Overview............................................................................................................................ 467
15.1.1 Features ................................................................................................................ 467
15.1.2 Block Diagram...................................................................................................... 468
15.1.3 Pin Configuration ................................................................................................. 469
15.1.4 Register Configuration ......................................................................................... 469
15.2 Register Descriptions......................................................................................................... 470
15.2.1 D/A Data Registers 0 and 1 (DADR0, DADR1).................................................. 470
15.2.2 D/A Control Register (DACR)............................................................................. 470
15.2.3 D/A Standby Control Register (DASTCR).......................................................... 472
15.3 Operation ........................................................................................................................... 472
15.4 D/A Output Control ........................................................................................................... 474
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Section 16 RAM................................................................................................................... 475
16.1 Overview............................................................................................................................ 475
16.1.1 Block Diagram...................................................................................................... 476
16.1.2 Register Configuration ......................................................................................... 476
16.2 System Control Register (SYSCR).................................................................................... 477
16.3 Operation ........................................................................................................................... 478
Section 17 ROM [H8/3062F-ZTAT, H8/3062F-ZTAT ROM Version,
On-Chip Mask ROM Models]
17.1 Overview............................................................................................................................ 479
17.2 Overview of Flash Memory (H8/3062F-ZTAT, H8/3062F-ZTAT R-Mask Version)...... 480
17.2.1 Features ................................................................................................................ 480
17.2.2 Block Diagram...................................................................................................... 481
17.2.3 Pin Configuration ................................................................................................. 482
17.2.4 Register Configuration ......................................................................................... 482
17.3 Flash Memory Register Descriptions ................................................................................ 483
17.3.1 Flash Memory Control Register (FLMCR).......................................................... 483
17.3.2 Erase Block Register (EBR)................................................................................. 486
17.3.3 RAM Control Register (RAMCR) ....................................................................... 487
17.3.4 Flash Memory Status Register (FLMSR)............................................................. 489
17.4 On-Board Programming Mode.......................................................................................... 490
17.4.1 Boot Mode............................................................................................................ 493
17.4.2 User Program Mode ............................................................................................. 498
17.5 Flash Memory Programming/Erasing................................................................................ 500
17.5.1 Program Mode...................................................................................................... 501
17.5.2 Program-Verify Mode.......................................................................................... 502
17.5.3 Erase Mode........................................................................................................... 504
17.5.4 Erase-Verify Mode............................................................................................... 504
17.6 Flash Memory Protection.................................................................................................. 506
17.6.1 Hardware Protection............................................................................................. 506
17.6.2 Software Protection.............................................................................................. 508
17.6.3 Error Protection.................................................................................................... 508
17.6.4 NMI Input Disabling Conditions............................................................................ 510
17.7 Flash Memory Emulation in RAM.................................................................................... 511
17.8 Flash Memory PROM Mode ............................................................................................. 513
17.8.1 Socket Adapters and Memory Map...................................................................... 513
17.8.2 Notes on Use of PROM Mode.............................................................................. 514
17.9 Flash Memory Programming and Erasing Precautions ..................................................... 515
17.10 Mask ROM (H8/3062 Mask ROM Version, H8/3061 Mask ROM Version,
H8/3060 Mask ROM Version) Overview.......................................................................... 520
17.10.1 Block Diagram ..................................................................................................... 520
17.11 Notes on Ordering Mask ROM Version Chips.................................................................. 521
17.12 Notes when Converting the F-ZTAT Application Software to the Mask-ROM Versions 522
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.................................................................... 479
Section 18 H8/3064 Internal Voltage Step-Down Version ROM
[H8/3064F-ZTAT B-Mask Version,
H8/3064 Mask ROM B-Mask Version]
18.1 Overview............................................................................................................................ 523
18.1.1 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version....... 524
18.2 Features.............................................................................................................................. 525
18.2.1 Block Diagram...................................................................................................... 526
18.2.2 Pin Configuration ................................................................................................. 527
18.2.3 Register Configuration ......................................................................................... 527
18.3 Register Descriptions......................................................................................................... 528
18.3.1 Flash Memory Control Register 1 (FLMCR1)..................................................... 528
18.3.2 Flash Memory Control Register 2 (FLMCR2)..................................................... 531
18.3.3 Erase Block Register 1 (EBR1)............................................................................ 532
18.3.4 Erase Block Register 2 (EBR2)............................................................................ 532
18.3.5 RAM Control Register (RAMCR) ....................................................................... 533
18.4 Overview of Operation...................................................................................................... 535
18.4.1 Mode Transitions.................................................................................................. 535
18.4.2 On-Board Programming Modes ........................................................................... 537
18.4.3 Flash Memory Emulation in RAM....................................................................... 539
18.4.4 Block Configuration............................................................................................. 540
18.5 On-Board Programming Mode.......................................................................................... 541
18.5.1 Boot Mode............................................................................................................ 542
18.5.2 User Program Mode.............................................................................................. 547
18.6 Flash Memory Programming/Erasing................................................................................ 549
18.6.1 Program Mode...................................................................................................... 551
18.6.2 Program-Verify Mode.......................................................................................... 552
18.6.3 Erase Mode........................................................................................................... 556
18.6.4 Erase-Verify Mode............................................................................................... 556
18.7 Flash Memory Protection .................................................................................................. 558
18.7.1 Hardware Protection............................................................................................. 558
18.7.2 Software Protection.............................................................................................. 559
18.7.3 Error Protection.................................................................................................... 559
18.8 Flash Memory Emulation in RAM.................................................................................... 562
18.9 NMI Input Disabling Conditions....................................................................................... 564
18.10 Flash Memory PROM Mode............................................................................................. 565
18.10.1 Socket Adapters and Memory Map...................................................................... 565
18.10.2 Notes on Use of PROM Mode.............................................................................. 566
18.11 Flash Memory Programming and Erasing Precautions..................................................... 566
18.12 Mask ROM (H8/3064 Mask ROM B-Mask Version) Overview...................................... 572
18.12.1 Block Diagram...................................................................................................... 572
18.13 Notes on Ordering Mask ROM Version Chips.................................................................. 573
18.14 Notes when Converting the F-ZTAT Application Software to the Mask-ROM Version. 574
.................................................. 523
xi
Section 19 H8/3062 Internal Voltage Step-Down Version ROM
[H8/3062F-ZTAT B-Mask Version, Mask ROM B-Mask Versions
of H8/3062, H8/3061, and H8/3060]
19.1 Overview............................................................................................................................ 575
19.1.1 Differences from H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version......... 576
19.2 Features.............................................................................................................................. 577
19.2.1 Block Diagram...................................................................................................... 578
19.2.2 Pin Configuration ................................................................................................. 579
19.2.3 Register Configuration ......................................................................................... 579
19.3 Register Descriptions......................................................................................................... 580
19.3.1 Flash Memory Control Register 1 (FLMCR1)..................................................... 580
19.3.2 Flash Memory Control Register 2 (FLMCR2)..................................................... 583
19.3.3 Erase Block Register (EBR)................................................................................. 584
19.3.4 RAM Control Register (RAMCR) ....................................................................... 585
19.4 Overview of Operation...................................................................................................... 587
19.4.1 Mode Transitions.................................................................................................. 587
19.4.2 On-Board Programming Modes ........................................................................... 589
19.4.3 Flash Memory Emulation in RAM....................................................................... 591
19.4.4 Block Configuration............................................................................................. 592
19.5 On-Board Programming Mode.......................................................................................... 593
19.5.1 Boot Mode............................................................................................................ 594
19.5.2 User Program Mode ............................................................................................. 599
19.6 Flash Memory Programming/Erasing................................................................................ 601
19.6.1 Program Mode...................................................................................................... 603
19.6.2 Program-Verify Mode.......................................................................................... 604
19.6.3 Erase Mode........................................................................................................... 608
19.6.4 Erase-Verify Mode............................................................................................... 608
19.7 Flash Memory Protection .................................................................................................. 610
19.7.1 Hardware Protection............................................................................................. 610
19.7.2 Software Protection.............................................................................................. 611
19.7.3 Error Protection.................................................................................................... 611
19.8 Flash Memory Emulation in RAM.................................................................................... 614
19.9 NMI Input Disabling Conditions....................................................................................... 615
19.10 Flash Memory PROM Mode............................................................................................. 616
19.10.1 Socket Adapters and Memory Map...................................................................... 616
19.10.2 Notes on Use of PROM Mode.............................................................................. 617
19.11 Flash Memory Programming and Erasing Precautions..................................................... 618
19.12 Mask ROM (H8/3062 Mask ROM B-Mask Version, H8/3061 Mask ROM B-Mask
Version, H8/3060 Mask ROM B-Mask Version) Overview............................................. 624
19.12.1 Block Diagram...................................................................................................... 624
19.13 Notes on Ordering Mask ROM Version Chips.................................................................. 625
19.14 Notes when Converting the F-ZTAT Application Software to the Mask-ROM Versions 626
........................................................ 575
xii
Section 20 Clock Pulse Generator .................................................................................. 627
20.1 Overview............................................................................................................................ 627
20.1.1 Block Diagram...................................................................................................... 627
20.2 Oscillator Circuit ............................................................................................................... 628
20.2.1 Connecting a Crystal Resonator........................................................................... 628
20.2.2 External Clock Input ............................................................................................ 630
20.3 Duty Adjustment Circuit.................................................................................................... 632
20.4 Prescalers........................................................................................................................... 632
20.5 Frequency Divider............................................................................................................. 632
20.5.1 Register Configuration ......................................................................................... 633
20.5.2 Division Control Register (DIVCR) .................................................................... 633
20.5.3 Usage Notes.......................................................................................................... 634
Section 21 Power-Down State.......................................................................................... 635
21.1 Overview............................................................................................................................ 635
21.2 Register Configuration ...................................................................................................... 637
21.2.1 System Control Register (SYSCR) ...................................................................... 637
21.2.2 Module Standby Control Register H (MSTCRH)................................................ 639
21.2.3 Module Standby Control Register L (MSTCRL)................................................. 640
21.3 Sleep Mode........................................................................................................................ 642
21.3.1 Transition to Sleep Mode ..................................................................................... 642
21.3.2 Exit from Sleep Mode .......................................................................................... 642
21.4 Software Standby Mode .................................................................................................... 642
21.4.1 Transition to Software Standby Mode.................................................................. 642
21.4.2 Exit from Software Standby Mode....................................................................... 643
21.4.3 Selection of Waiting Time for Exit from Software Standby Mode...................... 643
21.4.4 Sample Application of Software Standby Mode.................................................. 645
21.4.5 Usage Note ........................................................................................................... 645
21.4.6 Cautions on Clearing the software Standby Mode of F-ZTAT Version.............. 646
21.5 Hardware Standby Mode ................................................................................................... 647
21.5.1 Transition to Hardware Standby Mode ................................................................ 647
21.5.2 Exit from Hardware Standby Mode ..................................................................... 647
21.5.3 Timing for Hardware Standby Mode ................................................................... 647
21.6 Module Standby Function.................................................................................................. 648
21.6.1 Module Standby Timing....................................................................................... 648
21.6.2 Read/Write in Module Standby............................................................................ 648
21.6.3 Usage Notes.......................................................................................................... 648
21.7 System Clock Output Disabling Function ......................................................................... 649
Section 22 Electrical Characteristics.............................................................................. 651
22.1 Electrical Characteristics of H8/3062 Mask ROM Version, H8/3061 Mask ROM Version,
and H8/3060 Mask ROM Version..................................................................................... 652
22.1.1 Absolute Maximum Ratings................................................................................. 652
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22.1.2 DC Characteristics................................................................................................ 653
22.1.3 AC Characteristics................................................................................................ 664
22.1.4 A/D Conversion Characteristics........................................................................... 670
22.1.5 D/A Conversion Characteristics........................................................................... 672
22.2 Electrical Characteristics of H8/3062F-ZTAT and H8/3062F-ZTAT R-Mask Version... 673
22.2.1 Absolute Maximum Ratings................................................................................. 673
22.2.2 DC Characteristics................................................................................................ 674
22.2.3 AC Characteristics................................................................................................ 682
22.2.4 A/D Conversion Characteristics........................................................................... 688
22.2.5 D/A Conversion Characteristics........................................................................... 690
22.2.6 Flash Memory Characteristics.............................................................................. 691
22.3 Electrical Characteristics of H8/3064F-ZTAT B-Mask Version ...................................... 695
22.3.1 Absolute Maximum Ratings................................................................................. 695
22.3.2 DC Characteristics................................................................................................ 696
22.3.3 AC Characteristics................................................................................................ 701
22.3.4 A/D Conversion Characteristics........................................................................... 707
22.3.5 D/A Conversion Characteristics........................................................................... 708
22.3.6 Flash Memory Characteristics.............................................................................. 709
22.4 Electrical Characteristics of H8/3064 Mask ROM B-Mask Version ................................ 711
22.4.1 Absolute Maximum Ratings................................................................................. 711
22.4.2 DC Characteristics................................................................................................ 712
22.4.3 AC Characteristics................................................................................................ 716
22.4.4 A/D Conversion Characteristics........................................................................... 722
22.4.5 D/A Conversion Characteristics........................................................................... 723
22.5 Electrical Characteristics of H8/3062F-ZTAT B-Mask Version ...................................... 724
22.5.1 Absolute Maximum Ratings................................................................................. 724
22.5.2 DC Characteristics................................................................................................ 725
22.5.3 AC Characteristics................................................................................................ 730
22.5.4 A/D Conversion Characteristics........................................................................... 736
22.5.5 D/A Conversion Characteristics........................................................................... 737
22.5.6 Flash Memory Characteristics.............................................................................. 738
22.6 Electrical Characteristics of H8/3062 Mask ROM B-Mask Version,
H8/3061 Mask ROM B-Mask Version, and H8/3060 Mask ROM B-Mask Version........ 740
22.6.1 Absolute Maximum Ratings................................................................................. 740
22.6.2 DC Characteristics................................................................................................ 741
22.6.3 AC Characteristics................................................................................................ 745
22.6.4 A/D Conversion Characteristics........................................................................... 751
22.6.5 D/A Conversion Characteristics........................................................................... 752
22.7 Operational Timing............................................................................................................ 753
22.7.1 Clock Timing........................................................................................................ 753
22.7.2 Control Signal Timing.......................................................................................... 754
22.7.3 Bus Timing........................................................................................................... 756
22.7.4 TPC and I/O Port Timing ..................................................................................... 760
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