HIT 2SK2937 Datasheet

2SK2937
Silicon N Channel MOS FET High Speed Power Switching
Features
Low on-resistance
RDS =0.026 typ.
High speed switching
4V gate drive device can be driven from 5V source
Outline
ADE-208-560C (Z)
4th. Edition
Jun 1998
TO–220FM
G
D
1. Gate
2. Drain
1
2
3
S
3. Source
2SK2937
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body-drain diode reverse drain current I Avalanche current I Avalanche energy E Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note3
Note3
AR
Note1
Note2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg 50
60 V ±20 V 25 A 100 A 25 A 20 A 34 mJ 25 W
2
2SK2937
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V Gate to source breakdown voltage V Gate to source leak current I Zero gate voltege drain current I Gate to source cutoff voltage V Static drain to source on state R resistance R
(BR)DSS
(BR)GSS
GSS
DSS
GS(off)
DS(on)
DS(on)
60——V I ±20——V I ——±10 µAVGS = ±16V, VDS = 0 ——10µAVDS = 60 V, VGS = 0
1.5 2.5 V ID = 1mA, VDS = 10V — 0.026 0.034 ID = 15A, VGS = 10V
0.045 0.070 ID = 15A, VGS = 4V Forward transfer admittance |yfs|1117—S ID = 15A, VDS = 10V Input capacitance Ciss 740 pF VDS = 10V Output capacitance Coss 380 pF VGS = 0 Reverse transfer capacitance Crss 140 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body–drain diode forward voltage V Body–drain diode reverse
t
d(on)
r
d(off)
f
DF
rr
10 ns ID = 15A, VGS = 10V
160 ns RL = 2
100 ns
150 ns
0.95 V IF = 25A, VGS = 0
40 ns IF = 25A, VGS = 0 recovery time
Note: 4. Pulse test
= 10mA, VGS = 0
D
= ±100µA, VDS = 0
G
diF/ dt =50A/µs
Note4
Note4
Note4
3
Loading...
+ 7 hidden pages