HIT 2SK2930 Datasheet
2SK2930
e
Silicon N Channel MOS FET
High Speed Power Switching
Features
• Low on-resistance
RDS =0.020 Ω typ.
• High speed switching
• 4V gate drive device can be driven from 5V source
Outline
ADE-208-553C (Z)
4th. Edition
Jun 1998
TO–220AB
G
D
1
2
S
1. Gate
2. Drain(Flang
3. Source
3
2SK2930
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
Gate to source voltage V
Drain current I
Drain peak current I
Body-drain diode reverse drain current I
Avalanche current I
Avalanche energy E
Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note3
AP
Note3
AR
Note1
Note2
Channel temperature Tch 150 °C
Storage temperature Tstg –55 to +150 °C
Note: 1. PW ≤ 10µs, duty cycle ≤ 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg ≥ 50Ω
60 V
±20 V
35 A
140 A
35 A
35 A
105 mJ
50 W
2
2SK2930
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
Gate to source breakdown voltage V
Gate to source leak current I
Zero gate voltege drain current I
Gate to source cutoff voltage V
Static drain to source on state R
resistance R
(BR)DSS
(BR)GSS
GSS
DSS
GS(off)
DS(on)
DS(on)
60——V I
±20——V I
——±10 µAVGS = ±16V, VDS = 0
——10µAVDS = 60 V, VGS = 0
1.5 — 2.5 V ID = 1mA, VDS = 10V
— 0.020 0.026 Ω ID = 15A, VGS = 10V
— 0.032 0.050 Ω ID = 15A, VGS = 4V
Forward transfer admittance |yfs|1423—S ID = 15A, VDS = 10V
Input capacitance Ciss — 1100 — pF VDS = 10V
Output capacitance Coss — 540 — pF VGS = 0
Reverse transfer capacitance Crss — 200 — pF f = 1MHz
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
Body–drain diode forward voltage V
Body–drain diode reverse
t
d(on)
r
d(off)
f
DF
rr
— 15 — ns ID = 15A, VGS = 10V
— 180 — ns RL = 2Ω
— 175 — ns
— 195 — ns
— 0.95 — V IF = 35A, VGS = 0
— 40 — ns IF = 35A, VGS = 0
recovery time
Note: 4. Pulse test
= 10mA, VGS = 0
D
= ±100µA, VDS = 0
G
diF/ dt =50A/µs
Note4
Note4
Note4
3
Loading...