HIT 2SK2927 Datasheet

2SK2927
e
Silicon N Channel MOS FET High Speed Power Switching
Features
Low on-resistance
RDS =0.055 typ.
High speed switching
4V gate drive device can be driven from 5V source
Outline
ADE-208-550D (Z)
5th. Edition
Jun 1998
TO–220AB
G
D
1
2
S
1. Gate
2. Drain(Flang
3. Source
3
2SK2927
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V Gate to source voltage V Drain current I Drain peak current I Body-drain diode reverse drain current I Avalanche current I Avalanche energy E Channel dissipation Pch
DSS
GSS
D
D(pulse)
DR
Note3
Note3
AR
Note1
Note2
Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg 50
60 V ±20 V 10 A 40 A 10 A 10 A
8.5 mJ 30 W
2
2SK2927
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V Gate to source breakdown voltage V Gate to source leak current I Zero gate voltege drain current I Gate to source cutoff voltage V Static drain to source on state R resistance R
(BR)DSS
(BR)GSS
GSS
DSS
GS(off)
DS(on)
DS(on)
60——V I ±20——V I ——±10 µAVGS = ±16V, VDS = 0 ——10µAVDS = 60 V, VGS = 0
1.5 2.5 V ID = 1mA, VDS = 10V — 0.055 0.075 ID = 5A, VGS = 10V
0.090 0.150 ID = 5A, VGS = 4V Forward transfer admittance |yfs|58—SI Input capacitance Ciss 350 pF VDS = 10V Output capacitance Coss 190 pF VGS = 0 Reverse transfer capacitance Crss 70 pF f = 1MHz Turn-on delay time t Rise time t Turn-off delay time t Fall time t Body–drain diode forward voltage V Body–drain diode reverse
t
d(on)
r
d(off)
f
DF
rr
10 ns ID = 5A, VGS = 10V
55 ns RL = 6
—60—ns
—70—ns
0.9 V IF = 10A, VGS = 0
50 ns IF = 10A, VGS = 0 recovery time
Note: 4. Pulse test
= 10mA, VGS = 0
D
= ±100µA, VDS = 0
G
= 5A, VDS = 10V
D
diF/ dt =50A/µs
Note4
Note4
Note4
3
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