HIT 2SK2925-S, 2SK2925-L Datasheet

2SK2925(L),2SK2925(S)
Silicon N Channel MOS FET High Speed Power Switching
ADE-208-549C (Z)
4th. Edition
Jun 1998
Features
RDS =0.060 typ.
High speed switching
4V gate drive device can be driven from 5V source
Outline
1
2
3
4
4
1
2
3
1. Gate
2. Drain
3. Source
4. Drain
DPAK–2
D
G
S
2SK2925(L),2SK2925(S)
2
Absolute Maximum Ratings (Ta = 25°C)
Item Symbol Ratings Unit
Drain to source voltage V
DSS
60 V
Gate to source voltage V
GSS
±20 V
Drain current I
D
10 A
Drain peak current I
D(pulse)
Note1
40 A
Body-drain diode reverse drain current I
DR
10 A
Avalanche current I
AP
Note3
10 A
Avalanche energy E
AR
Note3
8.5 mJ
Channel dissipation Pch
Note2
20 W Channel temperature Tch 150 °C Storage temperature Tstg –55 to +150 °C
Note: 1. PW 10µs, duty cycle 1 %
2. Value at Tc = 25°C
3. Value at Tch = 25°C, Rg 50
2SK2925(L),2SK2925(S)
3
Electrical Characteristics (Ta = 25°C)
Item Symbol Min Typ Max Unit Test Conditions
Drain to source breakdown voltage V
(BR)DSS
60——V I
D
= 10mA, VGS = 0
Gate to source breakdown voltage V
(BR)GSS
±20——V I
G
= ±100µA, VDS = 0
Gate to source leak current I
GSS
——±10 µAVGS = ±16V, VDS = 0
Zero gate voltege drain current I
DSS
——10µAVDS = 60 V, VGS = 0
Gate to source cutoff voltage V
GS(off)
1.5 2.5 V ID = 1mA, VDS = 10V
Static drain to source on state R
DS(on)
0.060 0.080 ID = 5A, VGS = 10V
Note4
resistance R
DS(on)
0.095 0.160 ID = 5A, VGS = 4V
Note4
Forward transfer admittance |yfs|58—SI
D
= 5A, VDS = 10V
Note4
Input capacitance Ciss 350 pF VDS = 10V Output capacitance Coss 190 pF VGS = 0 Reverse transfer capacitance Crss 70 pF f = 1MHz Turn-on delay time t
d(on)
10 ns ID = 5A, VGS = 10V
Rise time t
r
55 ns RL = 6
Turn-off delay time t
d(off)
—60—ns
Fall time t
f
—70—ns
Body–drain diode forward voltage V
DF
0.9 V IF = 10A, VGS = 0
Body–drain diode reverse recovery time
t
rr
50 ns IF = 10A, VGS = 0
diF/ dt =50A/µs
Note: 4. Pulse test
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