Personal Audio Company
Published by Sony Engineering Corporation
Page 2
NW-HD1
Ver 1.1
Notes on the AC power adaptor
Use only the AC power adaptor and USB
cradle supplied with the player. Do not use
any other AC power adaptor since this may
cause the player to malfunction.
The player is not disconnected from the
AC power source (mains) as long as it is
connected to the wall outlet, even if the
player itself has been turned off.
If you are not going to use the player for a
long time, be sure to disconnect the power
supply. To remove the AC power adaptor
from the wall outlet, grasp the adaptor plug
itself; never pull the cord.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 ˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE
WITH MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.
REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE
PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR
IN SUPPLEMENTS PUBLISHED BY SONY.
7.ELECTRICAL PARTS LIST................................ 43
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFIÉS P AR UNE MARQ UE 0 SUR
LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
FONCTIONNEMENT. NE REMPLACER CES COM- POSANTS
QUE PAR DES PIÈCES SONY DONT LES NUMÉROS SONT
DONNÉS DANS CE MANUEL OU D ANS LES SUPPLÉMENTS
PUBLIÉS PAR SONY.
2
Page 3
SECTION 1
SERVICING NOTES
NW-HD1
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the leadfree mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 ˚C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 ˚C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
• Replacement of CXR704060-201GA (IC1003),
MBM29SL800BE-90PBT (IC1101), S1R72003BOOA100
(IC2001), CXR710160-211GH (IC3001), CXD1616GH
(IC7001) and EDL1216CASA-10L-E (IC7002) used in this
set requires a special tool.
System requirements
Computer
Operating System
Display
Others
Notes
•
SonicStage is not supported by the following environments:
– Operating systems other than those the indicated above
– Personally constructed PCs or operating systems
– An environment that is an upgrade of the original manufacturer-installed operating system
– Multi-boot environment
– Multi-monitor environment
– Macintosh
•
We do not guarantee trouble-free operation on all computers that satisfy the system requirement.
•
The NTFS format of Windows XP/Windows 2000 Professional can be used only with the standard (factory)
settings.
•
For Windows 2000 Professional users, install Service Pack 3 or later version before using the software.
•
We do not guarantee trouble-free operation of the system suspend, sleep, or hibernation function on the
computers.
IBM PC/AT or Compatible
• CPU: Pentium II 400 MHz or higher (Pentium III 450 MHz or higher is
recommended.)
• Hard disk drive space: 200 MB or more (1.5 GB or more is recommended.) (The
amount of space will vary according to the Windows version and the number of
music les stored on the hard disk.)
• RAM: 64 MB or more (128 MB or more is recommended.)
Others• CD drive (capable of digital playback by WDM)
• Sound Board
• USB port (Hi-Speed USB is supported.)
Factory installed:
Windows XP Media Center Edition 2004/Windows XP Media Center Edition/
Windows XP Professional/Windows XP Home Edition/Windows 2000 Professional/
Windows Millennium Edition/Windows 98 Second Edition
High Color (16 bit) or higher, 800 600 dots or better (1024 × 768 dots or better is
recommended.)
• Internet access: for Web registration, EMD services and CDDB
• Windows Media Player (version 7.0 or higher) installed for playing WMA les
3
Page 4
NW-HD1
SECTION 2
GENERAL
Guide to Parts and
Controls
Player
1234567
q;
8
9
1 i
(headphones)/LINE OUT jack
2 M, m, ., >
3
MENU button
4
MODE button
5
VOLUME +*/– buttons
6 Nx
(play/stop) button
7
Hole for hand strap**
8
USB cradle connector
9
BUILT-IN BATTERY switch
q;
HOLD switch
* This button has a tactile dot.
** You can attach your own hand strap.
buttons
This section is extracted from
instruction manual.
Player display
qaqs
qf qgqh qjqkw;ql
qa
Track number indicator
qs
Character information display
qd
Bookmark indicator
qf
Playback progress bar
qg
Playback indicator
qh
Playing time
qj
Repeat indicator
qk
Play mode indicator
Sound indicator
ql
Battery indicator
w;
Bit rate
qd
About the serial number
The serial number provided for this player is
required for the customer registration. The
number is on a label on the rear of the player.
4
Page 5
• This set can be disassembled in the order shown below.
3-1. DISASSEMBLY FLOW
SET
3-2. CABINET (UPPER) SUB ASSY
(Page 5)
3-3. CABINET (LOWER) ASSY
(Page 6)
3-4. BATTERY BLOCK SUB ASSY
(Page 6)
3-5. MAIN BOARD
(Page 7)
NW-HD1
SECTION 3
DISASSEMBLY
3-6. LCD BLOCK SUB ASSY
(Page 7)
Note: Follow the disassembly procedure in the numerical order given.
3-7. HDD UNIT, HDD BOARD
3-2. CABINET (UPPER) SUB ASSY
6
cabinet (upper) sub assy
3
(Page 8)
2
screw (M1.4)
5
flexible board
(CN5002)
1
screw (M1.4)
4
escutcheon (cradle)
5
Page 6
NW-HD1
)
3-3. CABINET (LOWER) ASSY
Note :When install the cabinet (lower) assy,
adjust the position of two switches (S5009, S9501)
and knob (batt, hold).
S9501
S5009
1
Remove the cabinet (lower)
assy in the direction of arrow.
knob (hold)
knob (batt)
3-4. BATTERY BLOCK SUB ASSY
2
toothed lock screw (M1.4)
3
battery block sub assy
1
connector (CN9501
6
Page 7
3-5. MAIN BOARD
3
sheet (insulating HDD flexible)
4
flexible board
(CN100)
2
7
sheet
(SHIELD HDD)
MAIN board
6
three toothed screws (M1.4)
5
flexible board
(CN5003)
NW-HD1
3-6. LCD BLOCK SUB ASSY
3
1
Remove two solders.
claw
1
sheet (damper)
4
LCD block sub assy
2
claw
5
flexible board
(CN5001)
7
Page 8
NW-HD1
3-7. HDD UNIT, HDD BOARD
1
Remove the HDD unit in the direction of arrow.
2
HDD board
Note : Extraction and insertion of a HDD board is
performed perpendicularly.
8
Page 9
SECTION 4
TEST MODE
NW-HD1
Ver 1.1
1. OUTLINE
For the LCD display, the LCD on the main unit is shown, but the
contents of LCD display on the remote commander are same.
Operation in the test mode is performed with the main unit. A key
having no particular description in the text, indicates a main unit key.
Power supply voltage : 3.65 to 3.75 V
Volume: 24
SOUND EQ: OFF
AVLS: OFF
[HOLD] switch: OFF
Set states: horizontal states
2. SETTING THE TEST MODE
1. Supply power to the set.
2. Switch-on the [HOLD] switch on the main unit.
3. Operate as follows.
• When use only main unit
While pressing the [MODE] key on the main unit, press the key on
the main unit as following order.
> → > → . → . → > → . → > → .
→ M → m
• When use the main unit and remote commander
While pressing the [MODE] key on the main unit, press the key on
the remote commander as following order.
> → > → . → . → > → . → > → .
→ + → –
4. Switch-off the [HOLD] switch on the main unit and enter the
test mode.
5. OPERATION OF THE TEST MODE
5-1. Power
5-1-1. Power supply voltage check
This mode is used in case power supply voltage in the state where
all power supply lines (1.2 V/1.5 V/1.8 V/2.0 V/2.4 V/3.3 V/VSTBY/
VDC) are starting is checked.
Checking method:
1. Enter the test mode.
2. Press the , key to display major item, and press the M m
key to select the “POWER”.
LCD display
POWER
3. Press the , key to display minor item, and press the M m
key to select the “V CHK”.
LCD display
V CHK
4. Press the Bx ke y, “START” is displayed and all power supply
lines are started.
LCD display
START
5. Press the [MODE] key, “HD OFF/ON” is displayed. Each time
[MODE] key is pressed, hard disk drive power supply ON/OFF
switch is performed.
LCD display
HD OFF/ON
3. RELEASING THE TEST MODE
Press the [SET UP] key on the main unit or x key on the remote
commander for 1.5 seconds or more, turn off the power and release
the test mode.
4. CONFIGURATION OF THE TEST MODE
Flow of the test mode:
F/W version display
,
,
Bx
key
Start
Automatic
Finish
Result
key
Major item
key
Minor item
or
key
<
key
<
[SET UP]
Major item switching: key
Minor item switching: key
key
M m
M m
6. Press the [SET UP] key, return to minor item selection screen.
5-1-2. Consumption current (read state) check
This mode is used in case consumption current (read state) in the
state where the hard disk drive has booted is checked.
Checking method:
1. Enter the test mode.
2. Press the
key to select the “POWER”.
, key to display major item, and press the M m
LCD display
POWER
3. Press the , key to display minor item, and press the M m
key to select the “A RD”.
LCD display
A RD
4. Press the Bx key, “READY?” is displayed. In this state, Each
time [MODE] key is pressed, EL back light ON/OFF switch is
performed.
LCD display
READY?
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NW-HD1
Ver 1.1
5. Press the Bx key, “READ” is displayed and h ard disk drive
becomes read state.
After 10 seconds, “FIN” is displayed automatically and read
state is completed.
LCD display
READ
r
FIN
6. Press the [SET UP] key, return to minor item selection screen.
5-1-3. Consumption current (write state) check
This mode is used in case consumption current (write state) in the
state where the hard disk drive has booted is checked.
Checking method:
1. Enter the test mode.
2. Press the , key to display major item, and press the M m
key to select the “POWER”.
LCD display
POWER
3. Press the , key to display minor item, and press the M m
key to select the “A WR”.
LCD display
A WR
4. Press the Bx key, “READY?” is displayed. In this state, Each
time [MODE] key is pressed, EL back light ON/OFF switch is
performed.
LCD display
READY?
5. Press the
becomes write state.
After 10 seconds, “FIN” is displayed automatically and write
state is completed.
Bx key, “WRITE” is displayed and hard disk drive
LCD display
WRITE
r
FIN
6. Press the [SET UP] key, return to minor item selection screen.
5-2. Audio
The VOLUME + ke y on the main unit or [PLAY MODE] on the remote
commander performs switch of HP/LINE.
While playing the audio track, it's in a repeat state. If Bx key is
pressed, it’s stopped.
Setting method of the audio test mode:
1. The data for audio test mode is copied to hard disk drive.
2. Enter the test mode.
3. Press the , key to display major item, and press the M m
key to select the “AUDIO”.
LCD display
AUDIO
4. Press the
key to select the “TESTLD”.
, key to display minor item, and press the M m
LCD display
TESTLD
5. Press the Bx key, “START” is displayed. Then automatically
reboot.
LCD display
START
6. After reboot, narrowing-down screen “Artist” is checked and
enter the test mode.
Audio test mode (5-2-1 to 5-2-8) is performed in this state.
5-2-1. Output check
“1 kHz 0 dBs L-ch/R-ch” audio signal is outputted.
Checking method:
1. Enter the audio test mode.
2. Press the , key to display major item, and press the M m
key to select the “AUDIO”.
LCD display
AUDIO
3. Press the , key to display minor item, and press the M m
key to select the “OUTPUT”.
LCD display
OUTPUT
4. Press the
L-ch/R-ch” audio signal is outputted. In this state, Each time
[MODE] key is pressed, MUTE ON/OFF switch is performed.
Bx key, “START” is displayed and “1 kHz 0 dBs
LCD display
START
5. Press the [SET UP] key , return to minor item selection screen.
5-2-2. S/N check
“Infinity Zero” audio signal is outputted.
Checking method:
1. Enter the audio test mode.
2. Press the
key to select the “AUDIO”.
, key to display major item, and press the M m
LCD display
AUDIO
3. Press the , key to display minor item, and press the M m
key to select the “SN”.
LCD display
SN
4. Press the Bx key, “START” is displayed and “Infinity Zero”
audio signal is outputted.
LCD display
START
5. Press the [SET UP] key , return to minor item selection screen.
10
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NW-HD1
Ver 1.1
5-2-3. Frequency characteristic check
“20 Hz/20 kHz/100 Hz/10 kHz 0 dBs L-ch/R-ch” audio signal is
outputted.
Checking method:
1. Enter the audio test mode.
2. Press the , key to display major item, and press the M m
key to select the “AUDIO”.
LCD display
AUDIO
3. Press the , key to display minor item, and press the M m
key to select the “F 1”.
LCD display
F 1
4. Press the Bx key, “START” is displayed and “20 Hz 0 d Bs
L-ch/R-ch” audio signal is outputted.
LCD display
START
5. Press the [SET UP] key, return to minor item selection screen.
6. Press the M m key to select the “F 2”.
LCD display
5-2-4. Channel separation check
“1 kHz 0 dBs L-ch/1 kHz 0 dBs R-ch” audio signal is outputted.
Checking method:
1. Enter the audio test mode.
2. Press the , key to display major item, and press the M m
key to select the “AUDIO”.
LCD display
AUDIO
3. Press the , key to display minor item, and press the M m
key to select the “SEP LR”.
LCD display
SEP LR
4. Press the Bx key, “START” is displayed and “1 kHz 0 dBs
L-ch” audio signal is outputted. In this state, Each time [MODE]
key is pressed, V-SUR switch is performed.
LCD display
START
5. Press the [SET UP] key, return to minor item selection screen.
6. Press the M m key to select the “SEP RL”.
LCD display
F 2
7. Press the Bx key, “START” is displayed and “20 kHz 0 dBs
L-ch/R-ch” audio signal is outputted.
LCD display
START
8. Press the [SET UP] key, return to minor item selection screen.
9. Press the M m key to select the “F 3”.
LCD display
F 3
10. Press the
L-ch/R-ch” audio signal is outputted.
Bx key, “START” is displayed and “100 Hz 0 dBs
LCD display
START
11. Press the [SET UP] key, return to minor item selection screen.
12. Press the M m key to select the “F 4”.
LCD display
F 4
13. Press the Bx ke y, “ST ART” is displayed and “10 kHz 0 dBs
L-ch/R-ch” audio signal is outputted.
LCD display
START
14. Press the [SET UP] key, return to minor item selection screen.
SEP RL
7. Press the Bx key, “START” is displayed and “1 kHz 0 dBs
R-ch” audio signal is outputted. In this state, Each time [MODE]
key is pressed, V-SUR switch is performed.
LCD display
START
8. Press the [SET UP] key, return to minor item selection screen.
5-2-5. Maximum output check
“1 kHz 0 dBs L-ch/R-ch VOLUME: 30” audio signal is outputted.
Checking method:
1. Enter the audio test mode.
2. Press the
key to select the “AUDIO”.
, key to display major item, and press the M m
LCD display
AUDIO
3. Press the , key to display minor item, and press the M m
key to select the “MAXOUT”.
LCD display
MAXOUT
4. Press the Bx key, “START” is displayed and “1 kHz 0 dBs
L-ch/R-ch VOLUME: 30” audio signal is outputted. In this
state, Each time [MODE] key is pressed, AVLS ON/OFF switch
is performed.
LCD display
START
5. Press the [SET UP] key, return to minor item selection screen
11
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NW-HD1
Ver 1.1
5-2-6. SOUND EQ check
“100 Hz/250 Hz/630 Hz/1.6 kHz/4 kHz/10 kHz –20 dBs L-ch/Rch” audio signal is outputted.
Checking method:
1. Enter the audio test mode.
2. Press the , key to display major item, and press the M m
key to select the “AUDIO”.
LCD display
AUDIO
3. Press the , key to display minor item, and press the M m
key to select the “EQ 1”.
LCD display
EQ 1
4. Press the Bx key, “START” is displayed and “100 Hz –20 dBs
L-ch/R-ch” audio signal is outputted. In this state, Each time [MODE]
key is pressed, EQ MAX/MIN switch is performed.
LCD display
START
5. Press the [SET UP] key, return to minor item selection screen.
6. Press the M m key to select the “EQ 2”.
LCD display
EQ 2
7. Press the Bx key, “START” is displayed and “250 Hz –20 dBs
L-ch/R-ch” audio signal is outputted. In this state, Each time [MODE]
key is pressed, EQ MAX/MIN switch is performed.
LCD display
START
8. Press the [SET UP] key, return to minor item selection screen.
9. Press the M m key to select the “EQ 3”.
LCD display
EQ 3
10. Press the
L-ch/R-ch” audio signal is outputted. In this state, Each time [MODE]
key is pressed, EQ MAX/MIN switch is performed.
Bx key, “STAR T” is displayed and “630 Hz –20 dBs
LCD display
LCD display
EQ 5
16. Press the
ch/R-ch” audio signal is outputted. In this state, Each time [MODE]
key is pressed, EQ MAX/MIN switch is performed.
Bx key, “ST AR T” is displayed and “4 kHz –20 dBs L-
LCD display
START
17. Press the [SET UP] key, return to minor item selection screen.
18. Press the M m key to select the “EQ 6”.
LCD display
EQ 6
19. Press the Bx key, “START” is displayed and “10 kHz –20 dBs
L-ch/R-ch” audio signal is outputted. In this state, Each time [MODE]
key is pressed, EQ MAX/MIN switch is performed.
LCD display
START
20. Press the [SET UP] key, return to minor item selection screen.
5-2-7. BEEP check
BEEP sound is outputted.
Checking method:
1. Enter the audio test mode.
2. Press the
key to select the “AUDIO”.
, key to display major item, and press the M m
LCD display
AUDIO
3. Press the , key to display minor item, and press the M m
key to select the “BEEP”.
LCD display
BEEP
4. Press the Bx key, “START” is displayed and BEEP sound is
outputted.
LCD display
START
START
11. Press the [SET UP] key, return to minor item selection screen.
12. Press the M m key to select the “EQ 4”.
LCD display
EQ 4
13. Press the Bx key, “START” is displayed and “1.6 kHz –20
dBs L-ch/R-ch” audio signal is outputted. In this state, Each
time [MODE] key is pressed, EQ MAX/MIN switch is performed.
LCD display
START
14. Press the [SET UP] key, return to minor item selection screen.
15. Press the M m key to select the “EQ 5”.
12
5. Press the [SET UP] key , return to minor item selection screen.
5-2-8. Sound pressure regulation level check
“1 kHz 0 dBs L-ch/R-ch” audio signal is outputted.
Checking method:
1. Enter the audio test mode.
2. Press the
key to select the “AUDIO”.
, key to display major item, and press the M m
LCD display
AUDIO
3. Press the , key to display minor item, and press the M m
key to select the “SPL”.
LCD display
SPL
Page 13
NW-HD1
Ver 1.1
4. Press the Bx key, “START” is displayed and “1 kHz 0 dBs
L-ch/R-ch” audio signal is outputted.
LCD display
START
5. Press the [SET UP] key, return to minor item selection screen.
5-3. Others
5-3-1. G-sensor check
X/Y/Z-axis direction is checked.
Checking method:
1. Enter the test mode.
2. Press the , key to display major item, and press the M m
key to select the “OTHERS”.
LCD display
OTHERS
3. Press the , key to display minor item, and press the M m
key to select the “G TEST”.
LCD display
G TEST
4. Press the Bx key, X-axis direction is displayed.
LCD display
3. Press the , key to display minor item, and press the M m
key to select the “CLOCK”.
LCD display
CLOCK
4. Press the Bx key, “START” is displayed. Then “OK” or “NG”
is displayed automatically.
LCD displa
START
r
OK
5. Press the [SET UP] key, return to minor item selection screen.
5-3-3. Key check
LCD display corresponding to the pushed key is performed.
Checking method:
1. Enter the test mode.
2. Press the , key to display major item, and press the M m
key to select the “OTHERS”.
LCD display
OTHERS
X: ***
***
: A/D value (hexadecimal)
Note: “NG” is displayed when the G-sensor has broken (press the [SET
UP] key, return to minor item selection screens).
LCD display
NG
5. Press the Bx key, Y-axis direction is displayed (press the [SET
UP] key, return to minor item selection screens).
LCD display
Y: ***
***
: A/D value (hexadecimal)
6. Press the Bx key, Z-axis direction is displayed (press the [SET
UP] key, return to minor item selection screens).
LCD display
Z: ***
***
: A/D value (hexadecimal)
7. Press the [SET UP] key, return to minor item selection screen.
5-3-2. Clock check
Clock operation is checked.
Checking method:
1. Enter the test mode.
2. Press the
key to select the “OTHERS”.
, key to display major item, and press the M m
LCD display
OTHERS
3. Press the , key to display minor item, and press the M m
key to select the “KEY CH”.
LCD display
KEY CH
4. Press the
corresponding to the pushed key is performed.
Press on all the keys of main unit displays “SET OK”.
Press on all the keys of remote commander displays “RMC OK”.
Key ofLCDKey ofLCD
main unitdisplayremote commanderdisplay
BxPLAYuR PLAY
SET UPSETUPxR STOP
MODEMODE>R FR
>FF.R REW
.REWP MODER PMD
MUPSOUNDR SND
mDOWNDISPLAYR DISP
VOLUME +VOL+VOL +R VOL+
VOLUME –VOL–VOL –R VOL–
5. Switch-on the [HOLD] switch on the main unit. Then Switch-off
the [HOLD] switch on the main unit, “FMTOK?” is displayed.
Bx key, “START” is displayed and LCD display
+R FDUP
–R FDDW
LCD display
FMTOK?
6. Press the Bx key, format of hard disk drive is performed (press
the [SET UP] key, return to minor item selection screens). Then
“OK” or “NG” is displayed automatically.
7. Press the [SET UP] key, return to minor item selection screen.
13
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NW-HD1
Ver 1.1
5-3-4. LCD display check
LCD display is checked.
Checking method:
1. Enter the test mode.
2. Press the , key to display major item, and press the M m
key to select the “OTHERS”.
LCD display
OTHERS
3. Press the , key to display minor item, and press the M m
key to select the “LCD 1”.
LCD display
LCD 1
4. Press the Bx key, LCD all segments of main unit and remote
commander are turned on.
5. Press the [SET UP] key to display minor item, and press the Mm key to select the “LCD 2”.
LCD display
LCD 2
6. Press the Bx key, LCD all segments of main unit and remote
commander are turned off.
7. Press the [SET UP] key to display minor item, and press the Mm key to select the “LCD 3”.
LCD display
5. “–X” is displayed. Main unit is fixed so that 2 of fig.1 may
become downward and press the Bx key.
LCD display
-X
6. “+Y” is displayed. Main unit is fixed so that 3 of fig.1 may
become downward and press the Bx key.
LCD display
+Y
7. “–Y” is displayed. Main unit is fixed so that 4 of fig.1 may
become downward and press the Bx key.
LCD display
-Y
8. “+Z” is displayed. Main unit is fixed so that 5 of fig.1 may
become downward and press the Bx key.
LCD display
+Z
9. “–Z” is displayed. Main unit is fixed so that 6 of fig.1 may
become downward and press the Bx key.
LCD display
-Z
LCD 3
8. Press the
of main unit.
9. Press the [SET UP] key to display minor item, and press the Mm key to select the “LCD 4”.
Bx key, monochrome lattice is displayed on the LCD
LCD display
LCD 4
10. Press the Bx key, monochrome lattice (reverse version of step
8) is displayed on the LCD of main unit.
11. Press the [SET UP] key, return to minor item selection screen.
5-3-5. G-sensor adjustment
X/Y/Z-axis direction is adjusted.
Adjustment method:
1. Enter the test mode.
2. Press the , key to display major item, and press the M m
key to select the “OTHERS”.
LCD display
OTHERS
3. Press the , key to display minor item, and press the M m
keyÍ to select the “G CLB”.
LCD display
G CLB
4. Press the Bx key, “+X” is displayed. Main unit is fixed so that1 of fig.1 may become downward and p ress the Bx key.
LCD display
10. “CALIB” is displayed . P r ess the Bx key, G-sensor is adjusted.
Then “FIN”, “DAT NG” or “SEN NG” is displayed automatically.
LCD display
CALIB
r
FIN
FIN: adjusted normally.
DAT NG : The data for performing a calibration is faulty.
SEN NG : The value acquired from the G-sensor is faulty.
11. Press the [SET UP] key, return to minor item selection screen.
Fig.1 Axis direction of G-sensor adjustment
4
6
2
1
5
3
14
+X
Page 15
NW-HD1
Ver 1.1
5-3-6. G-sensor adjustment check
this mode checks that G-sensor adjustment is performed or not
performed.
Checking method:
1. Enter the test mode.
2. Press the
key to select the “OTHERS”.
, key to display major item, and press the M m
LCD display
OTHERS
3. Press the , key to display minor item, and press the M m
key to select the “G CHK”.
LCD display
G CHK
4. Press the Bx key , “ST AR T” is displayed. Then “OK” or “YET”
is displayed automatically.
LCD display
START
r
OK
5. Press the [SET UP] key, return to minor item selection screen.
5-3-7. Hard disk drive format
This mode is used when performing the format of hard disk drive.
Checking method:
1. Enter the test mode.
2. Press the
key to select the “OTHERS”.
, key to display major item, and press the M m
LCD display
OTHERS
3. Press the , key to display minor item, and press the M m
key to select the “SC RD1”
LCD display
SC RD1
4. Press the Bx key, “READY?” is displayed .
LCD display
READY?
5. Press the Bx key, “READ” is displayed and first 1/3 sector of
hard disk drive is read. This operation takes about 50 minutes.
Then the number of error sector is displayed automatically .
LCD display
READ
r
******
******
6. Press the [SET UP] key to display minor item, and press
the M m key to select the “SC RD2”
LCD display
: number of error sector
SC RD2
7. Press the Bx key, “READY?” is displayed .
LCD display
READY?
8. Press the
hard disk drive is read. This operation takes about 100 minutes.
Then the number of error sector is displayed automatically .
Bx key, “READ” is displayed and last 2/3 sector of
LCD display
Press the [SET UP] key when canceling.
5-3-10. Language setting
Setting the language.
Checking method:
1. Enter the test mode.
2. Press the , key to display major item, and press the M m
key to select the “OTHERS”.
LCD display
OTHERS
3. Press the , key to display minor item, and press the M m
key to select the “LANG”.
LCD display
LANG
4. Press the Bx key. Press the [MODE] key, language (JAP/ENG/
FRE/GER/ITA/SPA) is selected.
Press the Bx key, destination is entered.
Press the [SET UP] key when canceling.
5-3-11. Sound pressure regulation setting
Setting the sound pressure regulation.
Checking method:
1. Enter the test mode.
2. Press the
key to select the “OTHERS”.
, key to display major item, and press the M m
LCD display
OTHERS
3. Press the , key to display minor item, and press the M m
key to select the “SP SET”.
LCD display
SP SET
5. Press the [SET UP] key, return to minor item selection screen.
5-3-13. SDRAM check
This mode is used for the check of SDRAM.
Checking method:
1. Enter the test mode.
2. Press the , key to display major item, and press the M m
key to select the “OTHERS”.
LCD display
OTHERS
3. Press the , key to display minor item, and press the M m
key to select the “RAMCHK”.
LCD display
RAMCHK
4. Press the Bx key , “ST ART” is displayed and SDRAM is checked.
This operation takes about 20 seconds. After chec ked, “OK” or
“NG” is displayed automatically.
LCD display
START
r
OK
5. Press the [SET UP] key, return to minor item selection screen.
NW-HD1
3. Press the , key to display minor item, and press the M m
key to select the “FORMAT”.
LCD display
FORMAT
4. Press the Bx key, “START” is displayed and format of hard
disk drive is performed. After performing format, “OK” or “NG”
is displayed automatically.
LCD display
START
r
OK
5. Press the [SET UP] key, return to minor item selection screen.
5-3-8. Hard disk drive all sector read
All sector of hard disk drive is read.
Checking method:
1. Enter the test mode.
2. Press the , key to display major item, and press the M m
key to select the “OTHERS”.
LCD display
OTHERS
READ
r
******
******
9. Press the [SET UP] key, return to minor item selection screen.
5-3-9. Destination setting
Setting the destination.
Checking method:
1. Enter the test mode.
2. Press the
key to select the “OTHERS”.
LCD display
: number of error sector
, key to display major item, and press the M m
OTHERS
3. Press the , key to display minor item, and press the M m
key to select the “DEST”.
LCD display
DEST
4. Press the Bx key. Press the [MODE] key, destination (J1/U2/
CEX/CEK) is selected.
Press the Bx key, destination is entered.
4. Press the Bx key. Press the [MODE] key, sound pressure
regulation ON/OFF is selected. Press the Bx key, destination
is entered.
Press the [SET UP] key when canceling.
5-3-12. Factory setting
Factory setting is performed.
Checking method:
1. Enter the test mode.
2. Press the
key to select the “OTHERS”.
, key to display major item, and press the M m
LCD display
OTHERS
3. Press the , key to display minor item, and press the M m
key to select the “SHIP”.
LCD display
SHIP
4. Press the Bx key , factory setting is performed. After the setting,
“FIN” is displayed.
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•f: internal component.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:Parts on the pattern face side seen from
(Conductor Side)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN and HDD boards are multi-layer printed board.
However, the patterns of intermediate-layer have not been included in diagram.
*Replacement of IC1003, 1101, 2001, 3001, 7001 and 7002
used in this set requires a special tool.
• Lead Layouts
surfac
Lead layout of conv entional ICCSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
•f: internal component.
• C : panel designation.
Note:
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part
number specified.
• A : B+ Line.
• Power voltage is dc 4.2 V and fed with regulated dc pow er
supply from CN9501.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: AUDIO
*Replacement of IC1003, 1101, 2001, 3001, 7001 and 7002
used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
4
W or less unless otherwise
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro
spécifié.
Ground terminal
Not used
Not used
Not used
Power supply terminal (for NAND flash memory interface) Not used
Not used
Not used
Not used
Not used
Not used
Not used
Not used
Wake up signal output to the sub system controller
Communication request signal output to the sub system controller
Power supply terminal (+1.2V) (for core)
Ground terminal
Power supply terminal (+1.8V) (for I/O interface)
Two-way data bus with the flash memory and multi interface
Not used
Not used
Not used
Serial clock signal input from the sub system controller
Serial data output to the sub system controller
Serial data input from the sub system controller
Chip select signal output to the sub system controller
Ground terminal
Power supply terminal (+1.8V) (for I/O interface)
Not used
Not used
Not used
Not used
Not used
Input terminal for the test mode setting
Data output terminal Not used
Data input terminal Not used
Strobe signal output to the power control
Data input terminal Not used
Serial clock signal output to the power control and real time clock
Serial data output to the power control and real time clock
Serial data input from the real time clock
Chip enable signal output to the real time clock
Clock signal (176 kHz) output to the multi interface
Power supply terminal (+1.2V) (for core)
Ground terminal
Power supply terminal (+1.8V) (for I/O interface)
Interrupt request signal input from the sub system controller
Shut down signal output to the DC/DC converter
Interrupt request signal input from the multi interface
Clock signal (176 kHz) output to the power control
Beep signal output to the headphone amplifier
Ready/busy selection signal input from the flash memory “L”: busy, “H”: ready
I
Interrupt request signal input from the sub system controller
I
Interrupt request signal input from the multi interface
I
Interrupt request signal input from the multi interface
I
Input terminal for the test mode setting
Bus response signal output terminal Not used
EVA mode selection signal input terminal Not used
Ground terminal (for A/D converter)
Power supply terminal (+2.4V) (for A/D converter)
Battery voltage monitor input terminal (A/D input)
Not used
Acceleration detection signal of X shaft direction input from the acceleration sensor
Acceleration detection signal of Y shaft direction input from the acceleration sensor
Acceleration detection signal of Z shaft direction input from the acceleration sensor
Set key input terminal (A/D input)
Remote commander key input terminal (A/D input)
Reset signal input from the power control
RAM back up control signal input terminal Not used
Power supply terminal (+1.2V) (for RAM back up)
Data input terminal (for JTAG) Not used
Test mode control signal input terminal (for JTAG) Not used
Clock signal input terminal (for JTAG) Not used
Reset signal input terminal (for JTAG) Not used
Data output terminal (for JTAG) Not used
Power supply terminal (+1.8V) (for JTAG)
Power supply terminal (+1.2V) (for core)
Ground terminal
Power supply terminal (+1.8V) (for I/O interface)
Test terminal for debug Not used
Test terminal for debug Not used
Test terminal for debug Not used
Test terminal for debug Not used
Test terminal for debug Not used
Test terminal for debug Not used
Test terminal for debug Not used
Test terminal for debug Not used
Not used
Power supply terminal (for USB transceiver) Not used
Not used
Not used
Not used
Ground terminal (for internal D/A converter)
Reference voltage output terminal (R-ch)
Analog audio signal output to the headphone amplifier (R-ch)
Analog audio signal output to the headphone amplifier (L-ch)
Reference voltage output terminal (L-ch)
Power supply terminal (+2.4V) (for internal D/A converter)
Main system clock output terminal (22.5792 MHz)
Main system clock input terminal (22.5792 MHz)
Power supply terminal (+2.4V) (for main system clock oscillator)
Ground terminal (for main and sub system clock oscillator)
Sub system clock output terminal (16 MHz)
Sub system clock input terminal (16 MHz)
Power supply terminal (+2.4V) (for sub system clock oscillator)
Ground terminal (for PLL)
Power supply terminal (+3.3V) (for PLL analog system)
Sleep signal output to the power control
Starting factor clear signal output to the power control
Charge progress signal input from the charge control
Charge completion signal input from the charge control
Power good signal input from the power switch
Sleep signal output to the multi interface
Reset signal output to the sub system controller
Reset signal output to the multi interface
Ground terminal
Power supply terminal (+1.8V) (for I/O interface)
Battery voltage monitor on/off control signal output terminal
Not used
Headphone/line selection signal output to the headphone amplifier
Muting on/off control signal output to the headphone amplifier
Ground terminal
Power supply terminal (+3.3V) (for memory stick interface) Not used
Two-way data bus with the memory stick interface Not used
Bus state signal output to the memory stick interface Not used
Clock signal output to the memory stick interface Not used
Card detection signal input from the memory stick interface Not used
HOLD key detection signal input terminal “L”: hold
Audio data input from the memory stick interface Not used
Audio data input from the sub system controller
L/R sampling clock signal input from the sub system controller
Bit clock signal input from the sub system controller
Clock signal (11.2896 MHz) output to the multi interface
Not used
Not used
Power supply terminal (+1.2V) (for core)
Ground terminal
Power supply terminal (+1.8V) (for I/O interface)
Wait signal input from the multi interface
Read signal output to the multi interface
Write strobe signal output to the multi interface (lower byte)
Write strobe signal output to the multi interface (upper byte)
Write signal output to the multi interface
Chip select signal output to the multi interface
Chip select signal output terminal Not used
Boot mode selection signal input terminal Not used
Boot mode selection signal input terminal Not used
Not used
Chip select signal input from the multi interface
Chip select signal input from the multi interface
Chip select signal input from the multi interface
Ground terminal
Power supply terminal (+1.8V) (for I/O interface)
O
Address signal output to the flash memry and mullet interface
Ground terminal
NW-HD1
37
Page 38
NW-HD1
MAIN BOARD IC2001 1S1R72003BOOA100 (USB CONTROLLER)
Internal operation setting terminal
Not used
Ground terminal (analog system)
Power supply terminal (+3.3V) (analog system)
Ground terminal (analog system)
Power supply terminal (+3.3V) (analog system)
Ground terminal (analog system)
I/OUSB data (+) input/output terminal
Ground terminal (analog system)
Ground terminal (analog system)
Power supply terminal (+3.3V) (analog system)
Input terminal for the test mode setting
USB bus detection signal input terminal
Reset signal input from the multi interface
Sleep signal input from the multi interface
Address signal input from the multi interface
Ground terminal (logic system)
Power supply terminal (+3.3V) (logic system)
Chip select signal input from the multi interface
Read signal input from the multi interface
Wait signal output to the multi interface
Write signal input from the multi interface
Interrupt request signal output to the multi interface
Two-way data bus with the multi interface and liquid crystal display unit
Ground terminal (logic system)
Two-way data bus with the multi interface and liquid crystal display unit
Power supply terminal (+3.3V) (logic system)
Input terminal for the test mode setting
Input terminal for the test mode setting
I/O
Input/output terminal for the test mode setting
Input terminal for the test mode setting
Ground terminal (logic system)
Clock signal output terminal Not used
Ground terminal (logic system)
Power supply terminal (+3.3V) (logic system)
Reset signal input terminal Not used
Two-way data bus with the multi interface and hard disk drive unit
Ground terminal (logic system)
I/O
Two-way data bus with the multi interface and hard disk drive unit
Power supply terminal (+3.3V) (logic system)
DMA request signal input from the hard disk drive unit
Write signal output to the hard disk drive unit
Read signal output to the hard disk drive unit
Wait signal input from the hard disk drive unit
Ground terminal (logic system)
Power supply terminal (+3.3V) (logic system)
DMA acknowledge signal output to the hard disk drive unit
Interrupt request signal input from the hard disk drive unit
Address signal output to the multi interface and hard disk drive unit
Diagnosis sequence compression signal input from the hard disk drive unit
Address signal output to the multi interface and hard disk drive unit
Chip select signal output to the hard disk drive unit
Drive valid signal and slave drive detection signal input from the hard disk drive unit
Ground terminal (logic system)
I
Input terminal for oscillation frequency setting Fixed at 12 MHz in this set
Ground terminal (logic system)
Ground terminal (logic system)
Power supply terminal (+3.3V) (logic system)
Power supply terminal (+3.3V) (logic system)
Power supply terminal (+3.3V) (for PLL)
Power supply terminal (+3.3V) (logic system)
Ground terminal (for PLL)
Not used
Sub system clock input terminal (12MHz)
Sub system clock output terminal (12MHz)
120XUINTREQI
121 to 123HA0 to HA2I
124 to 139 HD0 to HD15I/O
140, 141 XHCS0, XHCS1O
142XHIORO
143XHIOWO
UA1 to UA7O
UD0 to UD7I/O
Sub system clock input terminal Not used
Sub system clock output terminal Not used
Clock signal (22.5792 MHz) output to the sub system controller
Clock signal (22.5792 MHz) inversion output to the sub system controller
Oscillation stop signal input terminal Not used
Reset signal input from the main system controller
Clock signal (176 kHz) input from the main system controller
Address signal input from the main system controller
Two-way data bus with the main system controller and flash memory
Chip select signal input from the main system controller
Read signal input from the main system controller
Write signal input from the main system controller
Write strobe signal input from the main system controller (lower byte)
Write strobe signal input from the main system controller (upper byte)
Wait signal input from the main system controller
Not used
Interrupt request signal output to the main system controller
Interrupt request signal output to the main system controller
Interrupt request signal output to the main system controller
Address signal output to the SD-RAM
Bank selection address signal output to the SD-RAM
Two-way data bus with the SD-RAM
Chip select signal output to the SD-RAM
Row address strobe signal output to the SD-RAM
Column address strobe signal output to the SD-RAM
Write enable signal output to the SD-RAM
I/O mask signal output to the SD-RAM (lower byte)
I/O mask signal output to the SD-RAM (upper byte)
Clock signal output to the SD-RAM
Clock enable signal output to the SD-RAM
Address signal output to the USB controller and liquid crystal display unit
Address signal output to the USB controller
Two-way data bus with the USB controller and liquid crystal display unit
Chip select signal output to the USB controller
Chip select signal output to the liquid crystal display unit
Read signal output to the USB controller and liquid crystal display unit
Write signal output to the USB controller and liquid crystal display unit
Wait signal output to the USB controller
Interrupt request signal output to the USB controller
Address signal input from the USB controller
Two-way data bus with the USB controller and hard disk drive unit
Chip select signal output to the hard disk drive unit
Read signal output to the hard disk drive unit
Write signal output to the hard disk drive unit
175 to 19
191 to 20
201 to 20
207 to 223GND—
224 to 228NC—
TEST0 to TEST2I
173XICKSTPI
174NC—
VDE33—
VDE33—
VDE33—
Wait signal input from the hard disk drive unit
DMA acknowledge signal output to the hard disk drive unit
DMA request signal input from the hard disk drive unit
Interrupt request signal input from the hard disk drive unit
Reset signal output to the hard disk drive unit
L/R sampling clock signal output to the sub system controller
Bit clock signal output to the sub system controller
Transmission data output to the sub system controller
Transmission enabling signal output to the sub system controller
Clock signal (11.2896 MHz) input from the main system controller
Two-way TSB communication data bus with the remote commander
Reset signal output to the USB controller
Sleep signal output to the USB controller
Power supply on/off control signal output terminal for hard disk drive unit Not used
O
Power supply on/off control signal output terminal for acceleration sensor
Power supply on/off control signal output terminal for liquid crystal display back light
Power supply on/off control signal output to the DC/DC converter for +3.3V power supply
Reset signal output to the liquid crystal display unit
Not used
Not used
Sync/non-sync mode selection signal input terminal Not used
Data input terminal (for JTAG) Not used
Test mode control signal input terminal (for JTAG) Not used
Clock signal input terminal (for JTAG) Not used
Reset signal input terminal (for JTAG) Not used
Data output terminal (for JTAG) Not used
Input terminal for the test mode setting
Sleep signal input from the main system controller
Not used
Power supply terminal (+1.2V)
Power supply terminal (+1.8V)
Power supply terminal (+3.3V)
Ground terminal
Not used
NW-HD1
41
Page 42
NW-HD1
Ver 1.1
SECTION 6
EXPLODED VIEW
NOTE:
• -XX and -X mean standardized parts, so they
may have some difference from the original
one.
• Color Indication of Appearance Parts
Example:
KNOB, BALANCE (WHITE) . . . (RED)
↑↑
Parts Color Cabinet's Color
1
2
3
5
32
6
31
• Items marked “*” are not stocked since they
are seldom required for routine service. Some
delay should be anticipated when ordering
these items.
• The mechanical parts with no reference
number in the exploded views are not supplied.
• Accessories are given in the last of the
electrical parts list.
2
9
20 21
35
24
4
30
27
26
29
33
3
10
11
14
13
12
19
25
28
7
8
Ref. No.Part No.DescriptionRemark
1X-2022-998-1 CABINET (UPPER) (S) SUB ASSY (SILVER)
(France, UK)
1X-2022-999-1 CABINET (UPPER) (B) SUB ASSY (BLACK)
1X-2023-000-1 CABINET (UPPER) (S) SUB ASSY (SILVER)
1X-2023-001-1 CABINET (UPPER) (B) SUB ASSY (BLACK)
23-234-449-09 SCREW (M1.4) (for BLACK)
23-234-449-11 SCREW (M1.4) (for SILVER)
33-238-876-04 SCREW (M1.4), TOOTHED LOCK
4X-2023-758-1 BATTERY BLOCK SUB ASSY (US, Canadian)
4X-2023-759-1 BATTERY BLOCK SUB ASSY (France, UK)
5X-2023-003-1 LCD BLOCK SUB ASSY
* IC1001 6-703-107-01 IC SN74LVC2G66DCUR
* IC1002 6-703-107-01 IC SN74LVC2G66DCUR
@ IC1003 8-752-933-96 IC CXR704060-201GA
@ IC1101 (Not supplied) IC MBM29SL800BE-90PBT
@ IC2001 6-706-311-01 IC S1R72003BOOA100
@ IC3001 8-753-224-63 IC CXR710160-211GH
IC4301 6-700-662-01 IC AN17020A-VB
IC4302 6-705-495-01 IC R1180Q241B-TR-FA
IC5001 8-759-830-70 IC SM8142BD-G-EL
@ IC7001 8-753-218-21 IC CXD1616GH
@ IC7002 6-706-561-01 IC EDL1216CASA-10L-E
IC8000 6-706-558-01 IC HAAM-301BS
IC8001 6-704-350-01 IC SN74LVC1G66DCKR
IC9001 6-705-577-01 IC LTC3441EDE#TR
IC9002 6-704-997-01 IC SC901584EPR2
IC9003 6-703-802-01 IC TPS62200DBVR
IC9501 6-704-354-01 IC BQ24010ADRCR
IC9502 6-703-011-01 IC TC7SZ126AFE
IC9503 6-703-012-01 IC R2061K01-E2
IC9504 6-706-575-01 IC TPS2113PWR
R10221-218-990-11 SHORT CHIP0
R10231-218-990-11 SHORT CHIP0
R10251-218-990-11 SHORT CHIP0
R10261-218-990-11 SHORT CHIP0
R10271-218-985-11 RES-CHIP470K5%1/16W
R30041-218-945-11 RES-CHIP2205%1/16W
R30051-218-990-11 SHORT CHIP0
R30061-218-985-11 RES-CHIP470K5%1/16W
R30101-218-985-11 RES-CHIP470K5%1/16W
R30141-218-990-11 SHORT CHIP0
R30151-218-990-11 SHORT CHIP0
R30191-218-990-11 SHORT CHIP0
R30201-218-990-11 SHORT CHIP0
R30211-218-990-11 SHORT CHIP0
R30221-218-990-11 SHORT CHIP0
R30231-218-990-11 SHORT CHIP0
R30241-218-990-11 SHORT CHIP0
R30251-218-990-11 SHORT CHIP0
R40021-218-989-11 RES-CHIP1M5%1/16W
R41011-218-967-11 RES-CHIP15K5%1/16W
R50051-218-990-11 SHORT CHIP0
R50081-208-703-11 METAL CHIP6.8K0.5%1/16W
R50091-208-703-11 METAL CHIP6.8K0.5%1/16W
R50101-208-695-11 METAL CHIP3.3K0.5%1/16W
R50111-208-695-11 METAL CHIP3.3K0.5%1/16W
R50121-218-989-11 RES-CHIP1M5%1/16W
R50131-218-989-11 RES-CHIP1M5%1/16W
R50141-208-687-11 METAL CHIP1.5K0.5%1/16W
R50151-208-687-11 METAL CHIP1.5K0.5%1/16W
R50161-208-683-11 METAL CHIP1K0.5%1/16W
R50171-208-683-11 METAL CHIP1K0.5%1/16W
R50181-218-985-11 RES-CHIP470K5%1/16W
R50191-208-679-11 METAL CHIP6800.5%1/16W
R50201-208-679-11 METAL CHIP6800.5%1/16W
R50211-208-699-11 METAL CHIP4.7K0.5%1/16W
R50221-208-699-11 METAL CHIP4.7K0.5%1/16W
R50231-218-985-11 RES-CHIP470K5%1/16W
R50241-208-635-11 METAL CHIP100.5%1/16W
R70011-218-953-11 RES-CHIP1K5%1/16W
R80011-218-985-11 RES-CHIP470K5%1/16W
R80021-208-635-11 METAL CHIP100.5%1/16W
R80051-208-943-11 METAL CHIP220K0.5%1/16W
R80061-208-943-11 METAL CHIP220K0.5%1/16W
R80071-208-943-11 METAL CHIP220K0.5%1/16W
R80081-208-927-11 METAL CHIP47K0.5%1/16W
R80091-208-927-11 METAL CHIP47K0.5%1/16W
R80101-208-927-11 METAL CHIP47K0.5%1/16W
R90001-218-973-11 RES-CHIP47K5%1/16W
R90011-208-707-11 METAL CHIP10K0.5%1/16W
R90071-208-943-11 METAL CHIP220K0.5%1/16W
R90081-218-985-11 RES-CHIP470K5%1/16W
R90091-218-985-11 RES-CHIP470K5%1/16W
R90101-218-967-11 RES-CHIP15K5%1/16W
R90111-208-947-11 METAL CHIP330K0.5%1/16W
R90121-244-161-11 RES-CHIP2.25%1/16W
R90131-218-989-11 RES-CHIP1M5%1/16W
R90141-208-939-11 METAL CHIP150K0.5%1/16W
R90151-208-707-11 METAL CHIP10K0.5%1/16W
R90161-218-977-11 RES-CHIP100K5%1/16W
R90181-218-985-11 RES-CHIP470K5%1/16W
R90191-208-707-11 METAL CHIP10K0.5%1/16W
R90201-218-970-11 RES-CHIP27K5%1/16W
R90211-208-894-11 METAL CHIP2K0.5%1/16W
Ref. No.Part No.DescriptionRemark
R90221-208-720-11 METAL CHIP36K0.5%1/16W
R90231-208-720-11 METAL CHIP36K0.5%1/16W
R90241-208-720-11 METAL CHIP36K0.5%1/16W
R90271-218-985-11 RES-CHIP470K5%1/16W
R90281-202-974-11 RES-CHIP3.3M5%1/16W
R90291-208-715-11 METAL CHIP22K0.5%1/16W
R90301-208-939-11 METAL CHIP150K0.5%1/16W
R90311-218-990-11 SHORT CHIP0
R90321-208-942-11 METAL CHIP200K0.5%1/16W
R90331-218-957-11 RES-CHIP2.2K5%1/16W
R90341-208-713-11 METAL CHIP18K0.5%1/16W
R90411-218-989-11 RES-CHIP1M5%1/16W
R95011-208-697-11 METAL CHIP3.9K0.5%1/16W
R95021-208-703-11 METAL CHIP6.8K0.5%1/16W
R95031-208-699-11 METAL CHIP4.7K0.5%1/16W
R95041-218-977-11 RES-CHIP100K5%1/16W
• Note for Printed Wiring Boards and Schematic Diagrams
Note on Printed Wiring Board:
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
•f: internal component.
•: Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
Caution:
Pattern face side:Parts on the pattern face side seen from
(Conductor Side)the pattern face are indicated.
Parts face side:Parts on the parts face side seen from
(Component Side) the parts face are indicated.
• MAIN and HDD boards are multi-layer printed board.
However, the patterns of intermediate-layer have not been included in diagram.
*Replacement of IC1003, 1101, 2001, 3001, 7001 and 7002
used in this set requires a special tool.
• Lead Layouts
surfac
Lead layout of conv entional ICCSP (chip size package)
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. (p: pF)
50 WV or less are not indicated except for electrolytics
and tantalums.
• All resistors are in Ω and 1/
specified.
•f: internal component.
• C : panel designation.
Note:
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
Replace only with part
number specified.
• A : B+ Line.
• Power voltage is dc 4.2 V and fed with regulated dc pow er
supply from CN9501.
• Voltages and waveforms are dc with respect to ground
under no-signal conditions.
no mark : PLAYBACK
• Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production tolerances.
• Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production tolerances.
• Circled numbers refer to waveforms.
• Signal path.
F: AUDIO
*Replacement of IC1003, 1101, 2001, 3001, 7001 and 7002
used in this set requires a special tool.
• The voltage and waveform of CSP (chip size package)
cannot be measured, because its lead layout is different
form that of conventional IC.
4
W or less unless otherwise
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
pièce portant le numéro
spécifié.
2
Page 51
1-1. SCHEMATIC DIAGRAM – MAIN Section (1/7) –
(1/7)
U_A
U_D
USB_CNT
RMC_DTCK
(Page 9)
(Page 9)
BACKLIGHT_PWR
XRESET_LCD
D33_MODE
R7001
1k
R7002
100k
S_GOHAN
C7001
0.1
C7002
0.1
C7003
0.1
C7004
0.1
C7005
0.1
C7006
0.1
C7007
0.1
C7008
0.1
C7009
0.1
C7010
0.1
FB7001
FB7002
FB7003
VDR7001
100p
C7011
470k
R7006
3.3V
0
R7005
1.2V
1.8V
GND
VDR7002
(Page 5)
R7003R7004R7008
1k1k0
S
TDI
TCK
TDO
TM
TRST
TEST0
TEST1
TEST2
XICKSTP
NC
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDD12
VDE18
VDE18
VDE18
VDE18
VDE18
VDE18
VDE18
VDE18
VDE18
VDE18
VDE33
VDE33
VDE33
VDE33
VDE33
VDE33
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
NC
NC
NC
NC
NC
XRESET
EXCLKIN
XOSCSTP
CLK2250X
CLK2250A
EXTAL
XTAL
EXT_CLK
XEXT_CLK
1
A
T
G
U
O
X
XRESET_GOHAN
ODE
SYNCM
A1
NW-HD1
470k470k
T
N
E
S
G
X
R
ODE
GPIO8
R_CTL
R_CTL
D33_M
RESET_LCD
BACKLIT_PW
XEL_PW
GSEN_PW
A6A7A8
A5
A4
A3
A2
2
3
4
5
6
A
G
7
A
A
A
A
A
G
G
G
G
G
8
A
G
E
E
L
S
U
X
R_CTL
HDD_PW
9
A
G
USLEEP
A9
56
E
D
2
S
R
S
E
F
R
_X
U
IF
X
D
C
DTCK
FS256
URESET
A12
A11
A10
0
1
2
3
1
1
1
1
A
A
A
A
G
G
G
G
E
P
T
K
K
D
E
C
C
M
S
B
R
Q
C
P
IF_
D
C
DATA
XRDE
A14
A13
4
1
A
G
Q
E
L
E
E
R
_
IF_
R
R
H
IF
D
T
A
X
D
C
M
IN
C
D
H
H
BCK
LRCK
HINTREQ
HDMARQ
XHRESET
CSP(Chip Size Package)
A19
A18
A16
A17
A15
5
6
7
8
9
1
1
1
1
1
A
A
A
A
A
G
G
G
G
G
K
Y
C
D
A
R
M
IO
D
H
H
X
X
ACK
HIORDY
XHDM
MULTI INTERFACE
IC7001
CXD1616GH
A21
A20
0
1
2
2
A
A
G
G
W
IO
H
X
2
2
A
G
XHIOW
∗
A22
1
R
S
IO
C
H
H
X
X
XHIOR
A23D0D1
0
D
3
G
2
A
G
XHCS1
0
S
C
4
5
H
1
1
X
D
D
H
H
HD14
HD15
XHCS0
2
D
D3
1
2
3
D
D
D
G
G
G
9
0
1
2
3
1
1
1
1
D
D
D
D
D
H
H
H
H
H
11
13
HD10
HD
HD12
HD
5
D
D4
D7
D6
4
5
6
7
8
D
D
D
D
D
G
G
G
G
G
5
6
7
8
D
D
D
D
H
H
H
H
HD5
HD6
HD9
HD7
HD8
11
8
D
D
D10
D9
D12
1
2
9
10
1
1
D
D
D
D
G
G
G
G
0
1
2
3
4
D
D
D
D
D
H
H
H
H
H
HD3
HD4
D14
D13
3
4
1
1
D
D
G
G
1
2
A
A
H
H
DO
HA2
HD1
HD2
H
XCS3
XCS1
XCS2
D15
6
7
D
S5
S
S
C
C
C
R
5
X
X
X
X
1
D
G
R7010R7009
HDD_CNT
H_D
SD-RAM
IC7002
H_A
XGSEN_PWR_CTL
XUSLEEP
XURESET
USB_CNT
U_D
U_A
∗
-E
FS256
GANDHI_CNT
GAND_D
GAND_A
XRESET_GOHAN
SLEEP_GOHAN
XOUT
XINTREQU
XINTREQH
XINTREQG
XEXT_CLK
EXT_CLK
CDIF_XRDE
CDIF_PCMD
CDIF_BCK
CDIF_LRCK
GANDHI_CNT
GAND_D
GAND_A
(Page 7)
SD15
SD14
SD13
SD12
SD11
SD10
SD9
UDQM
SDCLK
SDCKE
SA12
SA11
SA9
SA8
SA7
SA6
SA5
(Page 6)
(Page 4)
0
A
H
EQ
R
T
IN
U
X
HA0
HA1
XUINTREQ
R
XW
XRD
XLB
R
B
W
L
X
X
0
1
R
D
IT
S
R
A
W
CS
C
U
U
W
U
U
X
X
U
X
X
X
AIT
XURD
XUWR
XUCS1
XUW
XUB
B
U
X
XUCS0
UD7
UD6
UD5
UD4
UD3
UD2
UD1
UD0
UA7
UA6
UA5
UA4
UA3
UA2
UA1
UA0
SDCKE
SDCLK
UDQM
LDQM
XSWE
XCAS
XRAS
XSCS
SD15
SD14
SD13
SD12
SD11
SD10
SD9
SD8
SD7
SD6
SD5
SD4
SD3
SD2
SD1
SD0
BA1
BA0
SA12
SA11
SA10
SA9
SA8
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
XINTREQU
XINTREQH
AIT
C
XINTREQG
N
NC
XW
IT
A
W
X
UD7
UD6
UD5
UD4
UD3
UD2
UD1
UD0
XINTREQU
XINTREQH
XINTREQG
UA7
UA6
UA5
UA4
UA3
UA2
UA1
UA0
SDCKE
SDCLK
UDQM
LDQM
XWE
XCAS
XRAS
XCS
SD15
SD14
SD13
SD12
SD11
SD10
SD9
SD8
SD7
SD6
SD5
SD4
SD3
SD2
SD1
SD0
BA1
BA0
SA12
SA11
SA10
SA9
SA8
SA7
SA6
SA5
SA4
SA3
SA2
SA1
SA0
FB7004
C7012
C7013
C7014
C7015
C7016
C7017
C7018
0.1
0.1
0.1
0.1
0.1
0.1
0.1
XGSEN
XUSLEEP
XURESET
EDL1216CASA-10L
CSP(Chip Size Package)
SD0
SD1
SD2
SD3
SD4
SD5
SD6
SD7SD8
LDQM
XWE
XCAS
XRAS
XCS
BA0
BA1
SA10
SA0
SA1
SA2
SA3SA4
FS256
XRESET_GOHAN
S_GOHAN
XOUT
XINTREQU
XINTREQH
XINTREQG
22
XEXT_CLK
EXT_CLK
CDIF_XRDE
CDIF_PCMD
CDIF_BCK
CDIF_LRCK
R7012
R7011
22
NW-HD1
33
Page 52
NW-HD1
1-2. SCHEMATIC DIAGRAM – MAIN Section (2/7) –
(Page 3)
GANDHI_CNT
XEXT_CLK
GAND_D
GAND_A
EXT_CLK
(2/7)
XRE
XUWR
GA1
GA17
R1102
0
GA16
GA15
GA14
GA13
GA12
GA11
GA10
GA9
GA20
C1101
100p
GA19
R1103
GA18
100k
GA8
GA7
GA6
GA5
GA4
GA3
GA2
0.1
0.1
08
07
C30
C30
L3001 100µH
100µH
L3002
FLASH MEMORY
IC1101
MBM29SL800BE
-90PT
CSP(Chip Size Package)
(NOT SUPPLIED)
A15
A14
A13
A12
A11
A10
A9
A8
NC
NC
XWE
XRST
NC
NC
R/XB
A18
A17
A7
A6
A5
A4
A3
A2
A1
∗
A16
XBYTE
VSS
DQ15
DQ7
DQ14
DQ6
DQ13
DQ5
DQ12
DQ4
VCC
DQ11
DQ3
DQ10
DQ2
DQ9
DQ1
DQ8
DQ0
XOE
VSS
XCE
A0
GD15
GD7
GD14
GD6
GD13
GD5
GD12
GD4
GD11
GD3
GD10
GD2
GD9
GD1
GD8
GD0
C3010
0.1
XCS0
C1103
0.1
101
FB1
RDY_XBUSY
XRESET_1.8V
DENDE_COMAND
(Page 9)
CDIF_LRCK
CDIF_BCK
CDIF_PCMD
CDIF_XRDE
VDR3001
VDR3002
C3012
C3003
100p
R3004
R3006
220
XRESET_D
WAKEUP_D
DATA_R
DENDE_S
XINT_D
R3002 R3010
470k 470k
GND
1.5V
3.3V
1.8V
470k
DENDE_SCLK
DENDE_SI
DENDE_SO
DENDE_SS
VDR3003
C3001
0.1
C3002
1
C3004
0.1
VDR3004
0
R3005
R3014
0
R3015
0
NRST
PF0
PF1
PF2
PF3
PC0
VDIOCD2
PC1
PC2
PC3
DVDD2
DVSS2
PE0
PE1
PE2
PE3
OSSEL
VDIO2
C3005
C3006
0.1
XIN
XTAL
XOUT(TEST5)
TACK(TEST6)
1
EXTAL
AVDMO
CSP(Chip Size Package)
TRST(TEST4)
TEST3
AVSPLL
AVDPLL
AVSOSC
SUB SYSTEM
CONTROLLER
IC3001
CXR710160-211GH
TEST1
DVDD3
TEST2
KDI
KCS
KRB
KDO
KCLK
DVDD1
TEST0
VDIO1
EVA
PI0/PCMDO
P12/LRCKO
PI3/BCKO
PF4/XRDE
VDIOCD1
VDIO0
DVSS0
DVDD0
TEST7
TEST8
DVDD4
PCMD
VDIOCD0
BCK
LRCK
TDO
NTRST
TMS
VDIO3
TDI
TCK
C3011
0.1
C3009
C3015
0.1
0.1
R3025
0
DVSS3
∗
DVSS1
0.1
C3013
R3019
R3020
R3021
R3022
R3023
R3024
1
0
0
0
0
0
0
C3018
0.1
C3017
0.1
XINT_D
DATA_R
DENDE_S
WAKEUP_D
XRESET_D
XINT_DENDE
DATA_READY
DENDE_SREQ
WAKEUP_DENDE
XRESET_DENDE
GDAC_PCMD
GDAC_LRCK
GDAC_BCK
(Page 6)
NW-HD1
44
Page 53
1-3. SCHEMATIC DIAGRAM – MAIN Section (3/7) –
NW-HD1
LIQUID
CRYSTAL
DISPLAY
UNIT
EL
BACK LIGHT UNIT
DB15
DB14
DB13
DB12
DB11
DB10
DB9
DB8
RESET
CS
RS
WR
RD
GND
OSC2
OSC1
VCC
VCI
VREG
C6+
C6-
C5+
C5-
C4+
C4-
C3+
C3-
C2+
C2-
C1+
C1-
VLOUT
VLPS
VLREF
V1OUT
V2OUT
V3OUT
V4OUT
V5OUT
SET_KEY
AD_RMCKEY
SP5002
SP5001
CN5001
(3/7)
OFF ON
39P
UD7
UD6
UD5
UD4
UD3
UD2
UD1
UD0
XUCS1
UA0
XUWR
XURD
C5007
C5008
C5009
C5010
C5011
C5012
R5001
C5014
1000p
200k
C5016
0.1
C5001
1
C5002
1
C5003
1
C5004
1
C5005
1
C5006
1
C5013
1
0.1
0.47
0.47
0.47
0.47
0.47
S5009
HOLD
C5017 D5001
0.01 MA2S728-TX
R5010 R5014R5008R5016
3.3k 1.5k6.8k1k
C5018 D5002
0.01 MA2S728-TX
R5009 R5011
6.8k 3.3k
R5002
120k
R5018
470k
R5012
1M
R5013
1M
R5015 R5017
1.5k 1k
BACK LIGHT DRIVER
IC5001
SM8142BD-G-EL
VSS
OSC
ENA
VDD
TP5003
TP5002
R5019
680
4.7k
6.3V
10
C5019
R5024
R5021
R5022
4.7k
10
1k
R4313
R5020
680
L5001
D5003
1SS370
220µH
0.1
C5020
LDR
CHV
OUT1
OUT2
R5003
R5004
R5005
18k
0
C5015
0.1
0
250V
R5023
470k
HOLD_KEY
AD_KEY2
AD_KEY1
CN5002
CN5003
BACKLIGHT_PWR
RMC_DTCK
XRESET_LCD
U_D
USB_CNT
U_A
6P
REPEAT
PLAY/STOP
DOWN
UP
SKIP
GND
5P
GND
SETUP
DISPLAY
VOL-
VOL+
(Page 3)
SET UP
MODE
VOLUME+/-
(Page 9)
(Page 6)
(Page 9)
AD_RMCKEY
HP_MUTE
HP_LINE_SEL
HOLD_KEY
AD_KEY1
AD_KEY2
AOUTR
AOUTL
3.3V_A
VSTBY
R4309
BEEP
HOLD_KEY
AD_KEY1
AD_KEY2
C4202
2200p
R4202
12k
R4201
C4201
15k
1
C4101
1
R4101
15k
R4102
12k
C4102
L4301
100µH
2200p
R4301
10
R4305
1
2.4V
GND
1.2V
3.3V
0
10k
150k
10 6.3V
1 6.3V
C4306
D4301
MA2S728-TX
0.01
R4308
R4307
C4301
C4302
C4303
1
C4203
470p
C4103
470p
C4304
22
4V
C4316 C4317C4307
47
6.3V476.3V
HP/L
R-IN
GNDGND
HEADPHONE AMP
L-IN
RIP-F1
CR
47
6.3V
BEEP
MUTE
4301
AN17020A-VB
RIP-F2
VCC1
C4308 C4309
224V47
GA-R
ROUT
LOUT
VCC2
4V
C4205
2.2
6.3V
C4204
220 2.5V
C4104
220 2.5V
C4105
GA-L
C4318
2.2 6.3V
C4206 C4106
0.01 0.01
0.1
VDD
VOUT
+2.4V REGULATOR
IC4302
R1180Q241B-TR-FA
GND
CE
R4105
0
R4103R4203
10k
10k
2222
R4104
R4204
R4316
22
C4320
C4319
10
0.1
6.3V
R4205
D4445
MA2S728-TX
F4301
R4002
250mA
1M
125V
0
0
R4303
0.01
C4313
1000p
C4315
FB4301
100
FB4302
FB4303
FB4304
FB4305
D4101D4201
MA2S111-TXMA2S111-TX
MAZW068H0LS0MAZW068H0LS0MAZW068H0LS0
FB4101
FB4201
D4302D4303D4304
C4305
47p
TP4308
TP4312
TP4313
TP4314
RM_VDD
RM_TSB
RM_KEY
RM_GND
J4301
/LINE OUT
2.4V_AD
2.4V_DAC
(Page 6)
GND_A
NW-HD1
The components identified by mark 0 or dotted
line with mark 0 are critical for safety.
55
Replace only with part number specified.
Les composants identifiés par une marque 0 sont
critiques pour la sécurité. Ne les remplacer que
par une pièce portant le numéro spécifié.
* IC1001 6-703-107-01 IC SN74LVC2G66DCUR
* IC1002 6-703-107-01 IC SN74LVC2G66DCUR
@ IC1003 8-752-933-96 IC CXR704060-201GA
@ IC1101 (Not supplied) IC MBM29SL800BE-90PBT
@ IC2001 6-706-311-01 IC S1R72003BOOA100
@ IC3001 8-753-224-63 IC CXR710160-211GH
IC4301 6-700-662-01 IC AN17020A-VB
IC4302 6-705-495-01 IC R1180Q241B-TR-FA
IC5001 8-759-830-70 IC SM8142BD-G-EL
@ IC7001 8-753-218-21 IC CXD1616GH
@ IC7002 6-706-561-01 IC EDL1216CASA-10L-E
IC8000 6-706-558-01 IC HAAM-301BS
IC8001 6-704-350-01 IC SN74LVC1G66DCKR
IC9001 6-705-577-01 IC LTC3441EDE#TR
IC9002 6-704-997-01 IC SC901584EPR2
IC9003 6-703-802-01 IC TPS62200DBVR
IC9501 6-704-354-01 IC BQ24010ADRCR
IC9502 6-703-011-01 IC TC7SZ126AFE
IC9503 6-703-012-01 IC R2061K01-E2
IC9504 6-706-575-01 IC TPS2113PWR
R10221-218-990-11 SHORT CHIP0
R10231-218-990-11 SHORT CHIP0
R10251-218-990-11 SHORT CHIP0
R10261-218-990-11 SHORT CHIP0
R10271-218-985-11 RES-CHIP470K5%1/16W
R30041-218-945-11 RES-CHIP2205%1/16W
R30051-218-990-11 SHORT CHIP0
R30061-218-985-11 RES-CHIP470K5%1/16W
R30101-218-985-11 RES-CHIP470K5%1/16W
R30141-218-990-11 SHORT CHIP0
R30151-218-990-11 SHORT CHIP0
R30191-218-990-11 SHORT CHIP0
R30201-218-990-11 SHORT CHIP0
R30211-218-990-11 SHORT CHIP0
R30221-218-990-11 SHORT CHIP0
R30231-218-990-11 SHORT CHIP0
R30241-218-990-11 SHORT CHIP0
R30251-218-990-11 SHORT CHIP0
R40021-218-989-11 RES-CHIP1M5%1/16W
R41011-218-967-11 RES-CHIP15K5%1/16W
R50041-218-990-11 SHORT CHIP0
R50051-218-990-11 SHORT CHIP0
R50081-208-703-11 METAL CHIP6.8K0.5%1/16W
R50091-208-703-11 METAL CHIP6.8K0.5%1/16W
R50101-208-695-11 METAL CHIP3.3K0.5%1/16W
R50111-208-695-11 METAL CHIP3.3K0.5%1/16W
R50121-218-989-11 RES-CHIP1M5%1/16W
R50131-218-989-11 RES-CHIP1M5%1/16W
R50141-208-687-11 METAL CHIP1.5K0.5%1/16W
R50151-208-687-11 METAL CHIP1.5K0.5%1/16W
R50161-208-683-11 METAL CHIP1K0.5%1/16W
R50171-208-683-11 METAL CHIP1K0.5%1/16W
R50181-218-985-11 RES-CHIP470K5%1/16W
R50191-208-679-11 METAL CHIP6800.5%1/16W
R50201-208-679-11 METAL CHIP6800.5%1/16W
R50211-208-699-11 METAL CHIP4.7K0.5%1/16W
R50221-208-699-11 METAL CHIP4.7K0.5%1/16W
R50231-218-985-11 RES-CHIP470K5%1/16W
R50241-218-929-11 RES-CHIP105%1/16W
R70011-218-953-11 RES-CHIP1K5%1/16W
R80011-218-985-11 RES-CHIP470K5%1/16W
R80021-218-929-11 RES-CHIP105%1/16W
R80051-208-943-11 METAL CHIP220K0.5%1/16W
R80061-208-943-11 METAL CHIP220K0.5%1/16W
R80071-208-943-11 METAL CHIP220K0.5%1/16W
R90181-218-985-11 RES-CHIP470K5%1/16W
R90191-208-911-11 METAL CHIP10K0.5%1/16W
R90201-218-970-11 RES-CHIP27K5%1/16W
R90211-208-894-11 METAL CHIP2K0.5%1/16W
R90221-208-720-11 METAL CHIP36K0.5%1/16W
R90231-208-720-11 METAL CHIP36K0.5%1/16W
R90241-208-720-11 METAL CHIP36K0.5%1/16W
R90271-218-985-11 RES-CHIP470K5%1/16W
R90281-202-974-11 RES-CHIP3.3M5%1/16W
R90291-208-715-11 METAL CHIP22K0.5%1/16W
R90301-208-939-11 METAL CHIP150K0.5%1/16W
R90311-218-990-11 SHORT CHIP0
R90321-208-942-11 METAL CHIP200K0.5%1/16W
R90331-218-957-11 RES-CHIP2.2K5%1/16W
R90341-208-713-11 METAL CHIP18K0.5%1/16W
R90411-218-989-11 RES-CHIP1M5%1/16W
R95011-208-697-11 METAL CHIP3.9K0.5%1/16W
R95021-208-703-11 METAL CHIP6.8K0.5%1/16W
R95031-208-699-11 METAL CHIP4.7K0.5%1/16W
R95041-218-977-11 RES-CHIP100K5%1/16W
R80081-208-927-11 METAL CHIP47K0.5%1/16W
R80091-208-927-11 METAL CHIP47K0.5%1/16W
R80101-208-927-11 METAL CHIP47K0.5%1/16W
R90001-218-973-11 RES-CHIP47K5%1/16W
R90011-208-911-11 METAL CHIP10K0.5%1/16W
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Ver.DateDescription of Revision
1.02004.07New
1.12004.09Addition of Canadian model
Printed Wiring Boards Modification (Suffix-12)
Correction of TEST MODE(ECN-ECA41257/ECA45073/SPM-04099)
2
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