HANTRONIX HT1616C Datasheet

Timer with Dialer Interface
Patent Number: 84545 (R.O.C.)

Features

·
Operating voltage: 1.2V~1.7V
·
Low operating current: 4mA typ.
·
·
Conversation timer (59 mins and 59 secs max.)
·
12 or 16 digits LCD display driver; 3V, 1/2 bias, 1/3 duty
·
Real time clock

Applications

·
Timers, clocks and watches
·
LCD display drivers

General Description

The HT1616C is a CMOS chip designed for dialer inter faces driving 12 or 16-digit LCDs. Various functions, such as real time clock, dialing number and conversa tion time display are provided.
For HT1616C the real time is displayed by default. When answering a telephone call, the timer is activated to tell users how long the conversation has taken. After the telephone is hung up, the total conversation time is
Patent Pending: 08/214, 079 (U.S.A.)
HT1616C
·
Stop watch
·
Built-in dialer interface
·
12-hour or 24-hour format
·
Two-button sequential operation for real time clock setting
·
Uses 32768Hz crystal
·
Telephone display interface
·
Instrument display
shown for about 5 seconds and the real time is dis
­played again. When making a phone call, the HT1616C receives dialing data from the dialer and displays the
­phone number from left to right on the LCD. However, if there is no dialing action within 10 seconds, it restarts the timer again. By adding a TIMER key, the IC can pro­vide stopwatch and timer reset/hold functions. Refer to the functional description for details.
-

Block Diagram

SK
TIM ER
12/24
HK
X1
X2
T1
T2
S2
S1
DI
Tim e Base
Tim er
Shift
R egister
State
C ontrol
C ontrol
Circuit
RES
Com m on
Circuit
D ecoder
&
MUX
Scan
CKT
Voltage D oubler
Segm ent
Latch
&
Select
IN T
COM 1
COM 2
COM 3
VA
VB
VC
SEG1
SEG 48
Rev. 1.10 1 September 13, 2001

Pad Assignment

HT1616C
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10
SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
COM 3
COM 1
HK
S1
CLR
MODE
12/24
S2
CLK
DI
70
69
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
205521562257235824
VB
VA
VSS
IN T
RESET
X2
X1
T2
T1
Chip size: 140.1 ´ 137.2 (mil)
592560
(0 ,0 )
2661276228632964306531663267336834
SEG 45
SEG 46
SEG 47
SEG 48
COM 2
VDD
VC
2
35
SEG 42
SEG 43
SEG 44
* The IC substrate should be connected to VDD in the PCB layout artwork.
51175218531954
50
SEG27
SEG28
49
SEG29
48
47
SEG30
46
SEG31
45
SEG32
44
SEG33
43
SEG34
42
SEG35
SEG36
41
SEG37
40
39
SEG38
38
SEG39
SEG40
37
36
SEG 41

Pad Coordinates Unit: mil

Pad No. X Y Pad No. X Y Pad No. X Y
10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
1 2 3 4 5 6 7 8 9
-64.47
-64.47
-64.47
-64.47
-64.47
-64.47
-64.47
-64.47
-64.47 -2.03
-64.47 -8.72
-64.47 -15.99
-64.47 -22.68
-64.47 -29.99
-64.47 -37.67
-64.47 -43.99
-64.47 -50.37
-58.69 -61.01
-52.65 -61.01
-46.53 -61.01
-40.41 -61.01
-33.79 -61.01
-27.41 -61.01
-18.80 -61.01
-12.60 -61.01
61.01 25
-4.11 -61.01
50.26 26 4.03
44.29 27 10.00
38.33 28 16.01
32.36 29 22.59
26.01 30 28.63
19.55 31 34.63
13.50 32 40.60 33 46.57 34 52.54 35 58.50 36 64.47 37 64.47 38 64.47 39 64.47 40 64.47 41 64.47 42 64.47 43 64.47 44 64.47 3.79 68 45 64.47 10.29 69 46 64.47 16.41 70 47 64.47 22.91 48 64.47 29.03
-61.01
-61.01
-61.01
-61.01
-61.01
-61.01
-61.01
-61.01
-61.01
-61.01
-61.01
-40.20
-34.08
-27.58
-21.46
-14.95
-8.84
-2.33
49 64.47 35.53 50 64.47 41.65 51 61.60 61.01 52 55.48 61.01 53 48.98 61.01 54 42.86 61.01 55 36.36 61.01 56 30.25 61.01 57 23.73 61.01 58 17.61 61.01 59 11.11 61.01 60 4.99 61.01 61 62 63 64 65 66 67
-1.51
-7.63
-14.13
-20.25
-26.75
-32.88
-39.38
-45.50
-52.00
-58.12
61.01
61.01
61.01
61.01
61.01
61.01
61.01
61.01
61.01
61.01
Rev. 1.10 2 September 13, 2001

Pad Description

Pad Name I/O
SEG1~SEG48 O CMOS OUT LCD segment signal output pads
COM1~COM3 O CMOS OUT LCD common signal output pads
HK
I
S1 I
RES
I
MODE I
12/24
I
S2 I
DI
SK
I
I
T1 I
T2
I
X1 I
X2 O 32768Hz crystal oscillator output
TIMER I
INT
O NMOS OUT Interrupt output, 16Hz (default) or 2Hz (by mask option)
VA O CMOS OUT Voltage doubler, connected to the external capacitor
VB O CMOS OUT Voltage doubler, connected to the external capacitor
VC O CMOS OUT Voltage doubler, connected to the external capacitor
VDD
VSS
¾¾
¾¾
Internal
Connection
CMOS IN
Pull-high
CMOS IN
Pull-low
CMOS IN
Pull-high
CMOS IN
Pull-low
CMOS IN
Pull-low
CMOS IN
Pull-low
CMOS IN
Pull-high
CMOS IN
Pull-high
CMOS IN
Pull-high
CMOS IN
Pull-high
OSCILLATOR
CMOS IN
Pull-low
Description
Hook switch detector input
Clock setting switch Hour or minute can be selected for S2 adjustment
System initialization pin, active low The pull-high resistance is 200kW typ.
4 or 5 bits pattern selection pad VDD: 5 bits pattern Floating: 4 bits pattern
12-hour or 24-hour format option pad VDD: 12-hour format Floating: 24-hour format
Clock adjusting switch Hour or minutedigits can be adjusted depending upon the S1 selection
Serial data input pad Data should be valid atthe fallingedge of SK
(connected to the dialer)
Clock input pad (connected to the dialer), active low Input data is latched at the falling edge of SK
Test pad (connected to VSS for production test)
Test pad (connected to VSS for production test)
32768Hz crystal oscillator input
Timer reset-and-start/hold toggle control input pad
Positive power supply
Negative power supply, ground
HT1616C
Approximate internal connection circuits
CMOS IN
Pull-low
CMOS IN
Pull-high
V
DD
NMOS OUT
CMOS OUT
V
DD
OSCILLATOR
X1
12pF
10M
X2
W
15pF
Rev. 1.10 3 September 13, 2001
HT1616C

Absolute Maximum Ratings

Supply Voltage ...........................................-0.3V to 5V
Input Voltage ............................ V
-0.3V to VDD+0.3V
SS
Note: These are stress ratings only. Stresses exceeding the range specified under ²Absolute Maximum Ratings² may
cause substantial damage to the device. Functional operation of this device at other conditions beyond those listed in the specification is not implied and prolonged exposure to extreme conditions may affect device reliabil ity.
Storage Temperature ...........................-50°Cto125°C
Operating Temperature ..........................-20°Cto75°C
-

Electrical Characteristics

Symbol Parameter
V
V
V
I
I
I
t
t
t
t
R
R
f
Operating Voltage
DD
Input Low Voltage
IL
Input High Voltage
IH
Standby Current 1.5V
STB
Operating Current 1.5V No load
DD
Output Sink Current of INT 1.5V
OL
Data Setup Time 1.5V
A
Data Hold On Time 1.5V
B
Inter Digit Time 1.5V
C
Input Debounce Time(S1, S2, TIMER) 1.5V
DB
Pull-high Resistance (HK,DI,SK) 1.5V
HI
Pull-low Resistance (TIMER) 1.5V
LO
System Frequency 1.5V Crystal=32768Hz
OSC
Test Conditions
V
DD
Conditions
¾¾
¾¾
¾¾
=Floating (or V
V
V
HK
=0.3V
O
DD)
¾
¾
¾
¾¾
=0V
V
IN
=1.5V
V
TIMER
f
=32768Hz, Ta=25°C
OSC
Min. Typ. Max. Unit
1.2 1.5 1.7 V
V
SS
0.8V
DD
¾
¾
500 1000
1
2
5
¾
¾
¾
31.25
32768
0.2V
¾
¾
DD
V
DD
0.1 1
410
¾mA
¾¾ms
¾¾ms
¾¾ms
¾
1
5
¾ MW
¾ MW
¾
V
mA
mA
ms
Hz
Rev. 1.10 4 September 13, 2001
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