Haier HTN19R12S, HTN19R12 Service Manual

HTN19R12/HTN19R12S

■ Features

 48cm super flat picture tube

Auto search 181 program presetting and memory



 CCD & V-CHIP

Haier Group

NO:M-MR-AE-HTN19R12-76814

COLOUR TELEVISION

Service Manual

HTN19R12/HTN19R12S

Edition:2004/4/17

MODEL :

(America)

CONTENT

1. Contents…………………………………………………………………….1

2. Product code illumination and series introduction…………………2 3．．．． Features…………………………………………………………………..3

4．．．． Safety Precaution……………………………………………………….4 5．．．． Warning and cautions…………………………………………………..5 6．．．． Net Dimension…………………………………………………………..11 7．．．． Parts and Functions……………………………………………………12 8．．．． Remote controller Functions…………………………………………13 9．．．． Program Diagram……………………………………………………….14

10. Maintenance Service and Trouble Shooting……………………15

11. Circuit Diagram…………………………………………………………21

12. Circuit Explanation……………………………………………………..24

13. Adjustment……………………………………………………………….31

14. Exploded View…………………………………………………………..33

15. List of Parts………………………………………………………………34

16. Damageable Parts List…………………………………………………49

17. Information of Resistors and Capacitors………………………….50

Product code illumination and series introduction

2. Product code illumination and series introduction HTN 19 R12

Color television appearance

CRT catercorner 20inch (51cm)

BRAND

3. FEATURES

序号

序号序号

FUNCTION

序号

序号序号

FEATURES

FUNCTION

1 Main IC 76814 2 CRT 3 Color system NTSC3.58

PIC

4 Audio system M 5 6 7 8 AV stereo

9 Super woofer 10 Surrounding sound 11 Treble/bass boost 12 Left/right balancer 13 14 15 Tone adjuster 16 MTS/SAP 17 18 AV input Y 19 AV output 20 DVD terminal 21 22 23 24 Digital curtain 25 Slow fading on & off 26 Semitransparent menu 27 Non-flshing channel changing 28 ZOOM 29 30 31 Calendar 32 Child-lock 33 Multi-functional lock Y 34 No-picture listening 35 Background light 36 Auto-timer on 37 CCD Y 38

NO.of channels 181 OSD language Multi-picture modes

AUDIO

NICAM Multi-audio modes

Auto-volume leveling

JIC

S-video jack Headphone socket SCART socket

16:9 mode

SOFTWARE

Games

V-CHIP

flat picture

ENGLISH、FRENCH SPANISH

39 NO. of built-in speakers 1 40 Audio output power(W) 2W 41 42 43 44 45 Net weight(KG) 21 46 Gross weight(KG) 23 47 Net dimension(MM) 48 Packaged dimension(MM) 49 Quantity for 20' container 50 Quantity for 40' container 51 52 53

PARAMETER

APPROVAL

Total power input（W） Voltage range（V） Power frequency（Hz） Time of sleep timer(MINS) 120MIN

Quantiry for 40' high container Acquired certificate Suitable market

70W 120V 60HZ

4. SAFETY PRECAUTIONS

SAFETY PRECAUTIONS

INPORTANT SAFETY NOTICE

These parts are identified by many electrical and mechanical parts in this chassis have special safety-related characteristics.

It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.

Do not modify the original design without permission of the manufacturer.

General Guidance

An Isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents that might result in personal injury caused by electrical shocks.

It will also protect the receiver and it’s components from being damaged by accidental shorts of the circuitry that might be inadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with a specified one. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the

resistor 10mm away from PCB. Keep wires away from high voltage or high temperature parts. Due to the high vacuum and large surface area of the picture tube, extreme care should be

taken in handling the Picture Tube. Do not lift the Picture Tube by its Neck. X-RAY Radiation

Warning:

The source of X-RAY RADIATION in this TV receiver is the High Voltage Section and the Picture Tube.

For continued X-RAY RADIATION protection, the replacement tube must be of the same type as specified in the Replacement Parts List.

Before returning the receiver to the customer, Always perform an AC leakage current check on the exposed metallic parts of the cabinet,

such as antennas, terminals, etc., to make sure that the set is safe to operate without any danger of electrical shock.

1. When you clean the TV set, please pull

out the power plug from AC outlet. Don't

In order to prolong the using life of the

5. Don't open the back cover, otherwise it is

Warning and Cautions

．．．．

clean the cabinet and the screen with benzene, petrol and other chemicals.

TV set, please place it on a ventilated place.

4. To prevent the TV set from firing and electric shock, don't make the TV set rain or moisture.

possible to damage the components in the TV set and harm you.

Don't place the TV set in the sunshine or near heat source.

6. When the TV set isn't going to be used for long time or it is in thunder and lightening, please pull out the plug from AC outlet and the antenna plug from the cover of the TV set.

Figure 1

Warning and Cautions

Explanation on the display tube

Generally, it is not needed to clean the tube surface. However, if necessary, its surface can be cleaned with a dry cotton cloth after cutting off the power. Don’t use any cleanser. If using hard cloth, the tube surface will be damaged.

CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS.

NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions, always follow the safety precautions.

Remember : Safety First. General Servicing Precautions

1. Always unplug the receiver AC power cord from the AC power source before: a. Removing or reinstalling any component, circuit board module or any other

assembly of the receiver.

b. Disconnecting or reconnecting any receiver electrical plug or other electrical

connection.

c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver.

CAUTION: A wrong substitution part or incorrect installation polarity of electrolytic capacitors may result in an explosion hazard.

d. Discharging the picture tube anode.

2. Test high voltage only by measuring it with an appropriate high voltage meter or other

voltage-measuring device (DVM, FETVOM, etc.) equipped with a suitable high voltage probe. Do not test high voltage by “drawing an arc”.

3. Discharge the picture tube anode only by (a) first connecting one end of an insulated

clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected, and then (b) touch the other end of the insulated clip lead to the picture tube anode button, using an insulating handle to avoid personal contact with high voltage.

4. Do not spray chemicals on or near this receiver or any of its assemblies.

5. Unless specified otherwise in this service manual, clean electrical contacts only by

applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable nonabrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength)

CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts is not required.

6. Do not defeat any plug / socket B+ voltage interlocks with which receivers covered by this service manual might be equipped.

7. Do not apply AC power to this instrument and/or any of its electrical assemblies unless

Warning and Cautions

all solid-state device heat sinks are correctly installed.

8. Always connect the test receiver ground lead to the receiver chassis ground before

connecting the test receiver positive lead. Always remove the test receiver ground lead last.

9. Use with this receiver only the test fixtures specified in this service manual.

CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver.

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components are usually called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-

equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ES devices, place the assembly

on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static type folder removal device. Some solder removal devices not

classified as “anti-static” can generate electrical charges sufficient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges

sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately

before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement

ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed.

CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices.

(Otherwise even some normally harmless motions such as mutual brushing of your clothes’ fabric or lifting of your foot from a carpeted floor might generate static electricity sufficient to damage an ES device.)

Warning and Cautions

General Soldering Guidelines

1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that

will maintain tip temperature within the range of 500 oF to 600 oF.

2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts

lead.

3. Keep the soldering iron tip clean and well tinned.

4. Thoroughly clean the surfaces to be soldered. Use a mall wire bristle (0.5 inch, or

1.25cm) brush with a metal handle. Do not use freon-propelled spay-on cleaners.

5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.(500 o F to 600o F) b. Heating the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction-type solder removal

device with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil.

6. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.(500 o F to 600o F ) b. First, hold the soldering iron tip and solder the strand against the component lead

until the solder melts.

c. Quickly move the soldering iron tip to the junction of the component lead and the

printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil.

CAUTION:

Work quickly to avoid overheating the circuit board printed foil.

d. Closely inspect the solder area and remove any excess or splashed solder with a

small wire-bristle brush.

Remove /Replacement

Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are of slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined .

Removal

Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts.

Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC.

Replacement

Carefully insert the replacement IC in the circuit board.

Warning and Cautions

Carefully bend each IC lead against the circuit foil pad and solder it. Clean the soldered areas with a small wire-bristle brush.(It is not necessary to reapply

acrylic coating to the areas).

“Small-Signal” Discrete Transistor Removal/Replacement

Remove the defective transistor by clipping its leads as close as possible to the component body.

Bend into a “U” shape the end of each of three leads remaining on the circuit board. Bend into a “U” shape the replacement transistor leads. Connect the replacement transistor leads to the corresponding leads extending from the

circuit board and crimp the “U” with long nose pliers to insure metal to metal contact then solder each connection.

Power Output, Transistor Device Removal/Replacement

Heat and remove all solder from around the transistor leads. Remove the heat sink mounting screw (if so equipped). Carefully remove the transistor from the heat sink of the circuit board. Insert new transistor in the circuit board. Solder each transistor lead, and clip off excess lead. Replace heat sink.

Diode Removal/Replacement

Remove defective diode by clipping its leads as close as possible to diode body. Bend the two remaining leads perpendicularly to the circuit board. Observing diode polarity, wrap each lead of the new diode round the corresponding lead

on the circuit board. Securely crimp each connection and solder it. Inspect (on the circuit board copper side) the solder joints of the two “original” leads. If they

are not shiny, reheat them and if necessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement

1. Clip each fuse or resistor lead at top of the circuit board hollow stake.

arning and Cautions

2. Securely crimp the leads of replacement component around notch at stake top.

3. Solder the connections

CAUTION:

components and the circuit board to prevent excessive component temperatures.

Circuit Board Foil Repair

Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds foil to the circuit board causing the foil to separate from or “lift-off” the board. The following guidelines and procedures should be followed whenever this condition is encountered.

At IC Connections

To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board.(Use this technique only on IC connections).

1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary).

2. Carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern.

3. Bend a small “U” in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection.

Maintain original spacing between the replaced component and adjacent

4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire.

At other connections

Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to insure that a hazardous condition will not exist if the jumper wire opens.

2. Trace along the copper pattern from both sides of the pattern break and locate the

nearest component that is directly connected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one

side of the pattern break to the lead of the nearest component on the other side.

Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so that it does not touch components or sharp edges.

6．．．．Net Dimension

Net Dimension

Figure 2

+ 28 hidden pages