The information in this guide is subject to change without notice.
There are no representations or warranties, either expressed or implied, with respect to the
contents hereof and specifically disclaims any warranties of merchantability or fitness for any
particular purpose. The software described in this manual is sold or licensed "as is". Should
the programs prove defective following th eir pur ch as e, th e bu ye r (n ot the ma n uf ac tur e r,
distributor, or its dealer) assumes the entire cost of all necessary servicing, repair, and any
incidental or consequential damages resulting from any defect in the software.
ii
Page 3
Conventions
WARNING:
!
CAUTION:
!
IMPORTANT:
+
NOTE:
NOTE:
The following conventions are used in this manual:
Indicates a potential for personal injury.
Indicates a potential loss of data or damage to equipment.
Indicates information that is important to know for the proper completion of a
procedure, choice of an option, or completing a task.
N/A: Indicates that a component or a procedure is not applicable to this model.
Follow local regulations for battery and circuit board disposal. Batteries and Circuit
Boards >10 cm² have been highlighted with a yellow rectangle.
The following typographical conventions are used in this document:
Book titles, directory names, file names, path names, and program/process names are
shown in italics.
Example:
the DRS5 User's Guide
/usr/local/bin/fd
the /TPH15spool_M program
Computer output (text that represents information displayed on a computer screen,
such as menus, prompts, responses to input, and error messages) are shown in
constant width.
Example:
[01] The server has been stopped
User input (text that represents information entered by a computer user, such as
command names, option letters, and words) are shown in constant width bold.
Variables contained within user input are shown in angle brackets (< >).
Example:
At the prompt, type run <file name> -m
Keyboard keys are shown in bold italics.
Example:
After entering data, press Enter.
iii
Page 4
General Information0
This service guide provides all technical information relating to the basic configuration for
Gateway global product offering. To better fit local market requirements and enhance product
competitiveness, your regional office may have decided to extend the functionality of a
machine (such as add-on cards, modems, or extra memory capabilities). These localized
features are not covered in this generic service guide. In such cases, contact your regional
offices or the responsible personnel/channel to provide further technical details.
When ordering FRU parts:
Check the most up-to-date information available on your regional Web or channel. If, for
whatever reason, a part number change is made, it may not be noted in this printed service
guide.
Acer-authorized Service Providers:
Your Acer office may have a different part number code than those given in the FRU list in this
service guide. The list provided by your regional Acer office must be used to order FRU parts
for repair and service of customer machines.
drive, flash drive, and battery)
Weight (equipped with optical
740g (WiFi)
750g (3G)
1.63lb (WiFi)
1.65lb (3G)
Build-in batteryBuild-in battery
drive, flash drive, and without
battery)
Input power
Operating voltage12.0 V dc @ 1.5 A - 18 W
Operating current1.5 A
Temperature
Operating (not writing to
0°C to 50°C32°F to 122°F
optical disc)
Operating (writing to optical
0°C to 50°C32°F to 122°F
disc)
Nonoperating-20°C to 60°C-4°F to 140°F
Relative humidity
Operating10% to 90%
Nonoperating5% to 95%
Maximum altitude (unpressurized)
Operating-15 m to 3,048 m-50 ft to 10,000 ft
Nonoperating-15 m to 12,192 m-50 ft to 40,000 ft
Shock
Operating125 g, 2 ms, half-sine
Nonoperating200 g, 2 ms, half-sine
Random vibration
Operating0.75 g zero-to-peak, 10 Hz to 500 Hz, 0.25 oct/min sweep rate
Nonoperating1.50 g zero-to-peak, 10 Hz to 500 Hz, 0.25 oct/min sweep rate
Applicable product safety standards specify thermal limits for plastic surfaces. The computer
operates well within this range of temperatures.
1-14Hardware Specifications and Configurations
Page 23
System Board Major Chips
ItemSpecification
Core logicTegra 250 Dual cortex A9, 1GHz
GraphicsIntegrated in Tegra 250 CPU (ULP GeFor ce )
LANN/A
USB 2.0 Integrated in Tegra 250 CPU (ULP GeForce)
Super I/O controllerN/A
Bluetooth Broadcom BCM4329
Wireless Broadcom BCM4329
PCMCIAN/A
Audio codecWolfson WM8903
Card readerSD 2.0 Integrated in Tegra 250 CPU
LVDS transmitterSN75LVDS83B
PMUTI TPS658621C
LDDR2 Elpida EDB8132B2PB 1GB
ULPI Phy for USB SMSC USB3315
GPSBroadcom BCM4751
TOUCH controllerAtmel ATMXT 1386-CHIPSET1PJA101
eMMCHynix H26M32001DAR
CAMERA
BIOS vendor
BIOS Version
BIOS ROM type
BIOS ROM size
Features
LAN Interface (N/A)
ItemSpecification
LAN Chipset
LAN connector type
LAN connector location
Features
Keyboard (N/A)
ItemSpecification
Type
Total number of keypads
Windows logo key
Internal & external keyboard
work simultaneously
Features
1-18Hardware Specifications and Configurations
Page 27
Hard Disk Drive (AVL components) (N/A)
NOTE:
ItemSpecification
Vendor & Model
Name
Capacity (GB)
Bytes per sector
Data heads
Drive Format
Disks
Spindle speed
(RPM)
Performance Specifications
Buffer size
Interface
Fast data transfer
rate (Mbits / sec,
max)
Media data transfer
rate
(Mbytes/sec max)
DC Power Requirements
Voltage tolerance
Hardware Specifications and Configurations1-19
Page 28
Embedded MultiMediaCard (AVL components)
ItemSpecification
Vendor & Model
Name
Capacity (GB)
Sandisk
SDIN4C2-16G
Samsung
KLMAG4EEHM
16G16G32G32G
DC Power Requirements
Voltage tolerance1.8 V
Super-Multi Drive (N/A)
ItemSpecification
Vendor & Model name
Performance Specification
Transfer rate (KB/sec)
Buffer Memory
Interface
Applicable disc format
Loading mechanism
Power Requirement
Sandisk
SDIN4E2-32G
Samsung
KLMBG8FEJA
Input Voltage
BD Drive (N/A)
ItemsSpecifications
Vendor & Model
name
Performance
Specification
Transfer rate
(KB/sec)
Buffer Memory
Interface
Applicable disc
format
Loading mechanism
Power Requirement
Input Voltage
1-20Hardware Specifications and Configurations
Page 29
LED 10.1”
ItemSpecification
Vendor/Model nameAUO/B101EW05 V1
Screen Diagonal (mm)255.85 mm
Active Area (mm)216.96 mm x 135.6 mm
Display resolution (pixels)1280 x 3(RGB) x 800
Pixel Pitch (mm)0.1695mm x 0.1695mm
Typical White Lumina nce
2
(cd/m
) also called Brightness
300 cd/m
2
Contrast Ratio1000 min / 1300 type
Response Time (Optical Rise
25 ms / 35 ms
Time/Fall Time) msec
Typical Power Consumption
3.4 W
(watt)
Weight (without inverter)180 max
Physical Size (mm)229.46 mm x 149.1mm x 5.2 max
Electrical Interface1 channel LVDS
Viewing Angle (degree)
Vendor & Model name
Brightness conditions
Input voltage (v)
Input current (mA)
Output voltage (V, RMS)
Output current (mA, RMS)
Output voltage frequency
(KHz)
Hardware Specifications and Configurations1-21
Page 30
Display Supported Resolution (LCD)
NOTE:
NOTE:
Resolution16 bits32 bits36 bits48 bitsothers
1280x 3(RGB) x 800XXXVX
Legend: V = Supported; X = Not supported
Resolution fixed at 1280 x 800. Not adjustable by end user.
Graphics Controller
ItemSpecification
VGA ChipULP GeForce
Supports
Fully Programmable Yes
OpenGL ES Version 2
OpenVG 1.1
EGL 1.4
Display Supported Resolution (GPU)
Resolution16 bits32 bits36 bits48 bitsothers
1280x 3(RGB) x 800XXXVX
Legend: V = Supported; X = Not supported
Resolution fixed at 1280 x 800. Not adjustable by end user.
Bluetooth Interface
ItemSpecifications
ChipsetAzurewave AW-NH611- Broadcom 4329 SIP
Data throughput
TX 1.2Mbits/sec
RX 1.2Mbits/sec
Protocol2.1 + EDR 3.0 upgradable
InterfaceSIP
Connector typeSIP
Supported protocol(Add BT supported protocol here such as A2DP)
Bluetooth Module
ItemSpecifications
ControllerAzurewave AW-NH611 - Broadcom BCM4329 SoC
Features
1-22Hardware Specifications and Configurations
Fully support BT 2.1 +EDR
UART Interface
Page 31
Front Camera
ItemSpecification
Vendor and Model Chicony / Aptina 2031
Type2M
Rear Camera
ItemSpecification
Vendor and Model
Liteon / OV5650 CSI
Liteon / Aptina 5140
Type5M
Mini Card
ItemSpecification
Number supported1
Features1 mini card slot (for WWAN)
3G Card
ItemSpecification
Features3G Module with Ericsson 5521gw
Hardware Specifications and Configurations1-23
Page 32
Audio Codec and Amplifier
ItemSpecification
Audio ControllerWolfson WM8903
Features
4.5mW Power consumption for DAC to headphone playback
DAC SNR 96dB typical, THD -86dB typical
ADC SNR 92dB typical, THD -80dB typical
Control sequencer for pop minimized start-up and shut-down
Single register write for default start-up sequence
Stereo digital microphone input
3 single ended inputs per stereo channel
2 pseudo differential inputs per stereo channel
1 fully differential mic inputs per stereo channel
Digital Dynamic Range Controller
Digital sidetone mixing
Ground-referenced headphone driver
Ground-referenced line input
Stereo differential line driver for direct interface to WM9001
40-pin5x5mm QFN package
AmplifierN/A
FeaturesN/A
Audio Interface
speaker driver
ItemSpecification
Audio ControllerWolfson WM8903
Audio onboard or optionalOn board
Mono or StereoStereo
ResolutionSupport 24bit
CompatibilityI2S audio Interface
Sampling rateSample rate up to 44.1KHz
Internal microphoneYes
Internal speaker/quantityYes/(1W speakers x2)
1-24Hardware Specifications and Configurations
Page 33
Wireless Module 802.11b/g/n
ItemSpecification
ChipsetAzurewave AW-NH611 - Broadcom BCM4329 SoC
Data throughput
The Gateway TP-A60W/ TP-A60G has a set of software tools designed to diagnose pr oblems
with its hardware components.
NGA EUU Installation Procedure0
Before installing EEU software, make sure the TP-A60W/ TP-A60G tablet is not
connected to a computer.
1.Install EUU software on a PC. When the following dialog is shown, click OK to continue.
Figure 2-1.Starting Installation
2.Select installation procedure language from drop-down list. Click Next to continue or
Cancel to exit program.
Figure 2-2.Installation Procedure Language
3.Install USB driver. (Figure 2-3)
Diagnostic Utilities2-3
Page 42
Figure 2-3.USB Driver Installation
4.To enable USB debugging, on the device, go to the Settings/Applications/Development
menu and click the USB debugging checkbox. (Figure 2-4.)
Figure 2-4.USB Debugging
2-4Diagnostic Utilities
Page 43
5.Follow the instructions shown in Figure 2-5 to find OS image version.
Figure 2-5.Finding OS Image Version
6.If image version is not available, follow instructions in Figure 2-6 to manually reset device.
When procedure is complete, go to Step 1 of this procedure.
Figure 2-6.Device Reset Instructions
Diagnostic Utilities2-5
Page 44
7.If image version is available, current and new version information is shown. Click Next to
NOTE:
NOTE:
continue. (Figure 2-7)
Figure 2-7.Image Versions
8.Enter CPU ID of device. Click Next to continue. (Figure 2-8)
Maximum number of characters for ID is sixteen (16).
Figure 2-8.CPU ID
2-6Diagnostic Utilities
Page 45
9.Upgrade process begins as shown in Figure 2-9
IMPORTANT:
+
Upgrade process will not complete if USB cable is unplugged.
Figure 2-9.Upgrade Process
10. If upgrade process is successful, Figure 2-10 is shown.If an upgrade error is shown, go to
step 12, If a CPU ID value error is identified, go to step 19.
Figure 2-10.Upgrade Process Success
11. Click Finish to exit.
Diagnostic Utilities2-7
Page 46
12. If CPU ID is correct but upgrade process is not successful, Figure 2-11 is shown.
Figure 2-11.Upgrade Process Failure
13. Click Retry to start upgrade process. Go to Step 8.
14. Click Exit to cancel upgrade process.
15. If upgrade process is cancelled, a confirmation dialog is shown. (Figure 2-12)
Figure 2-12.Upgrade Process Cancellation Confirmation Dialog
16. Click No to return to Retry dialog in Step 12.
17. Click Yes to confirm cancellation.
2-8Diagnostic Utilities
Page 47
18. Click OK to exit the program. (Figure 2-13)
Upgrade process failed because wrong CPU ID
value was entered. Follow instructions for
recovery.
Figure 2-13.Final Cancellation Dialog
19. If CPU ID value is not correct, Figure 2-14 is shown.
Figure 2-14.Wrong CPU ID
20. Click Retry to start upgrade process. Go to Step 8.
21. Click Exit to cancel upgrade process.
Diagnostic Utilities2-9
Page 48
22. If upgrade process is cancelled, a confirmation dialog is shown. (Figure 2-15)
Figure 2-15.Upgrade Process Cancellation Confirmation Dialog
23. Click No to return to Retry dialog in Step 19.
24. Click Yes to confirm cancellation.
25. Click OK to exit progra m. (Figure 2-16)
Figure 2-16.Final Cancellation Dialog
2-10Diagnostic Utilities
Page 49
Q
&
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20 11
ICONIA tab A500
Diagnostic Tool SOP
Release date : Apr. 14, 2011
Page 50
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Preparation
Diagnostic tool - A500 Diagnostic Tool.zip
USB Driver of A500 for PC
USB cable
Micro SD card
Page 51
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Tool installation
1.Install USB driver in PC/NB.
2.Connect A500 device to PC/NB via USB cable
3.Enable “USB debugging” in A500 (Settings Applications USB
debugging)
Page 52
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20 11
Tool installation
4.Unzip file “A500 Diagnostic Tool.zip”. There are four files in the folder.
5.Run “Install_A500_DiagTool.bat”.
Page 53
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Tool installation
6.On the “All” apps screen, look for the application called “ACTP”. This
is the diagnostic tool.
7.Tap the icon to start the testing process.
Page 54
Q
&
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20 11
Main Menu
The diagnostic tool tests the Touch Panel, Display, Buttons, Speaker, MIC,
Camera, SD and Vibrator functionality. Select the function(s) you want to
test. Tap “OK” to start.
Step 1 –
Select item(s)
Step 2 –
Click “OK” to start testing
Page 55
Q
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20 11
1. Multi-touch Test (Touch Panel)
Draw your finger along the yellow squares. The result is a pass if you fill
all yellow squares and fail if you do not. The program returns to the main
menu after the test is finished.
Page 56
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2. Touch Linearity Test (Touch Panel)
Draw your finger along the yellow squares. The result is a pass if you fill
all yellow squares and fail if you do not. The program returns to the main
menu after the test is finished.
Page 57
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3. RGB (Display)
Continue to tap screen to display changes. Use this test to verify
abnormal lines or dead pixels on LCD screen.
Finish
Page 58
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4. Hardware Keys Test (Keys)
Press volume up, volume down and lock keys to verify if all keys work.
A color change to green means key function works.
Page 59
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5. Rear Camera
Point rear side of device at an object. Tap “Photograph” icon to test
picture taking functionality.
Page 60
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6. Speaker
Loud tone sounds in left speaker then switches to right speaker.
Page 61
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7. Front Microphone
Tap screen to start the test. When “Recording” screen appears, speak into
front side of device. Check if voice recorded when screen switches to
“Playing” screen.
Page 62
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8. Rear Microphone
Tap screen to start the test. When “Recording” screen appears, speak into
front side of device. Check if voice recorded when screen switches to
“Playing” screen.
Page 63
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9. Front Camera
Point front side of device at an object. Tap “Photograph” icon to test
picture taking functionality.
Page 64
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I
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10. SD Card (SD read/write test)
Insert a micro SD card into device. Start the SD read and write test. The
screen shows success if the test is passed.
System requests to insert a micro SD if you forget to insert a card.
Page 65
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11. Vibrator
It starts vibrating for two seconds then switches to success screen if test is
passed.
Page 66
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Un-installation procedure
The diagnostic tool MUST be uninstalled once testing is done. DO NOT
distribute this tool outside of the service center.
This chapter contains general info rmation about the notebook, a list o f tools needed to perform
the required maintenance and step by step procedures on how to remove and install
components from the notebook computer.
General Information0
The product previews seen in the following procedures may not represent the final product
color or configuration. Cable paths and positioning may also differ from the actual model.
During the removal and installation of components, make sure all available cable channels
and clips are used and that the cables are installed in the same position.
All prerequisites must be performed prior to performing maintenan ce.
Recommended Equipment0
The following tools are required to perform maintenance on the notebook:
Wrist grounding strap and conductive mat
Flat screwdriver
Philips screwdriver
Screw NameQuantity
M1.6x5.0 Ni4
M2.0x4.0 Ni16
M2.0x3.09
Machine Maintenance Procedures3-3
Page 75
Maintenance Flowchart0
The flowchart in Figure 3-1 provides a graphic representation of the module removal and
installation sequences. It provides information on what componen ts need to be removed and
installed during servicing.
Figure 3-1.Maintenance Flow
3-4Machine Maintenance Procedures
Page 76
Getting Started0
A
The flowchart (Figure 3-1) identifies sections illustrating the entire removal and install
sequence. Observe the order of the sequence to avoid damage to any of the hardware
components.
Perform the following prior to performing any maintenance procedures:
1.Place system on a flat work surface.
2.Disconnect AC Adapter and remove all cables from system and peripherals.
3.Make sure system is completely powered down.
4.To make sure system is completely powered down, press and hold power button (A) for 4
seconds. (Figure 3-2)
a.If the device is in powered down mode, allow device to complete boot process
(approx. 10 sec.). Then power down normally.
b.If device is in sleep mode, wait for Home Screen to clear. Then power down
normally.
Figure 3-2.Device Overview with Power Button
5.Press and hold Power button for 4 seconds to show Tablet Options dialog.
6.Select Power Off to power down device.
7.From Power Off dialog, select OK.
Machine Maintenance Procedures3-5
Page 77
SIM/Micro-SD Card Removal0
1.Open SIM/Micro-SD card cover. (Figure 3-3)
Figure 3-3.Opening SIM/Micro-SD Card Cover
2.Remove SIM card from spring locking mechanism. (Figure 3-4)
Figure 3-4.Removing SIM Card
3.Remove Micro-SD card from spring locking mechanism. (Figure 3-5)
3-6Machine Maintenance Procedures
Page 78
Figure 3-5.Removing Micro-SD Card
4.Secure SIM/Micro-SD card cover. (Figure 3-6)
Figure 3-6.Securing SIM/Micro-SD Card Cover
Machine Maintenance Procedures3-7
Page 79
SIM/Micro-SD Card Installation0
1.Open SIM/Micro-SD card cover. (Figure 3-3)
2.Install and secure SIM card. (Figure 3-4)
3.Install and secure Micro-SD card. (Figure 3-5)
4.Close and secure SIM/Micro-SD card cover. (Figure 3-6)
3-8Machine Maintenance Procedures
Page 80
Lower Case Removal0
A
A
Prerequisite:
SIM/Micro-SD Card Removal
1.Remove screws (A) from the top and bottom caps. (Figure 3-7 and Figure 3-8)
Figure 3-7.Top and Bottom Cap Screws (1 of 2)
Figure 3-8.Top and Bottom Cap Screws (2 of 2)
2.Release the corner of the top cap from the locking latches of the bezel as shown in
Figure 3-9.
Figure 3-9.Removing the Top Cap (1 of 3)
Machine Maintenance Procedures3-9
Page 81
3.Release the top cap from the remaining locking latches of the bezel. (Figure 3-10)
Figure 3-10.Removing the Top Cap (2 of 3)
4.Remove the top cap from the bezel. (Figure 3-11)
Figure 3-11.Removing Top Cap (3 of 3)
3-10Machine Maintenance Procedures
Page 82
5.Release the corner of the bottom cap from the locking latches of the bezel as shown in
Figure 3-12.
Figure 3-12.Removing the Bottom Cap (1 of 3)
6.Release the bottom cap from the remaining locking latches of the bezel. (Figure 3-13)
Figure 3-13.Removing the Bottom Cap (2 of 3)
Machine Maintenance Procedures3-11
Page 83
7.Remove the bottom cap from the bezel. (Figure 3-14)
B
B
Figure 3-14.Removing the Bottom Cap (3 of 3)
8.Remove screws (B) from the bezel. (Figure 3-15)
Figure 3-15.Bezel Screws
3-12Machine Maintenance Procedures
Page 84
9.Release the lower case from the two locking latches (C) on the bottom side of the bezel.
C
(Figure 3-16)
Figure 3-16.Bezel Locking Latches: Bottom Side
10. Rele ase the right, left and top sides of the lower case from the locking latche s of the bezel.
(Figure 3-17)
Figure 3-17.Releasing the Remaining Latches
11. Remove the lower case from the bezel.
Machine Maintenance Procedures3-13
Page 85
Lower Case Installation0
D
E
1.Make sure the SD card cover (D) is in the open position before installing the lower case.
(Figure 3-18)
Figure 3-18.Installing the Lower Case (1 of 3)
1.Align the bottom edge of the lower case with the guides (E) on the bezel. (Figure 3-19)
Figure 3-19.Installing the Lower Case (2 of 3)
3-14Machine Maintenance Procedures
Page 86
2.Secure the lower case to the two locking latches (C) on the bottom side of the bezel.
(Figure 3-16)
3.Secure the remaining sides of the lower case to the locking latches of the bezel.
(Figure 3-20)
Figure 3-20.Installing the Lower Case (3 of 3)
4.Install and secure the screws (B) to the bezel. (Figure 3-15)
5.Install and secure the bottom cap to the bezel locking latches. (Figure 3-14 to Figure 3-12)
6.Install and secure the top cap to the bezel locking latches. (Figure 3-11 to Figure 3-9)
7.Install and secure the top and bottom cap screws. (Figure 3-7 and Figure 3-8)
8.Install SIM/Micro-SD card.
IDSizeQuantityScrew Type
AM1.6x5.0 Ni4
BM2.0x4.0 Ni5
Machine Maintenance Procedures3-15
Page 87
DC-In Cable Removal0
A
B
b
Prerequisite:
Lower Case Removal
1.Remove tape (A) covering DC-In and antenna cables. (Figure 3-21)
Figure 3-21.Removing Protective Tape
2.Disconnect DC-In cable (B) from mainboard connector (b). (Figure 3-22)
Figure 3-22.Disconnecting DC-In Cable
3-16Machine Maintenance Procedures
Page 88
3.Remove DC-In cable from the LCD support plate (C) and bezel (D) guides. (Figure 3-23)
C
D
Figure 3-23.Removing DC-In Cable
4.Remove DC-In jack from bezel. (Figure 3-24)
Figure 3-24.Removing DC-In Jack
Machine Maintenance Procedures3-17
Page 89
DC-In Cable Installation0
1.Install and secure DC-In jack on bezel. (Figure 3-24)
2.Connect DC-In cable (B) to mainboard connector (b). (Figure 3-22)
3.Install and secure DC-In cable to bezel (D) an d LCD support plate (C) guides.
(Figure 3-23)
4.Install and secure tape (A) covering DC-In and antenna cables. (Figure 3-21)
5.Install lower case.
3-18Machine Maintenance Procedures
Page 90
Battery Removal0
A
A
A
A
B
b
Prerequisite:
DC-In Cable Removal
1.Remove screws (A) from LCD support plate. (Figure 3-25)
Figure 3-25.Removing Battery Screws
2.Disconnect battery cable (B) from mainboard connector (b). (Figure 3-26)
Figure 3-26.Disconnecting Battery Cable
Machine Maintenance Procedures3-19
Page 91
3.Remove battery (C). (Figure 3-27)
C
Figure 3-27.Removing Battery
Battery Installation0
1.Install battery (C) on LCD support plate. (Figure 3-27)
2.Connect battery cable (B) to mainboard connector (b). (Figure 3-26)
3.Install and secure screws (A) to LCD support plate. (Figure 3-25)
4.Install DC-In cable.
IDSizeQuantityScrew Type
AM2.0x4.0 Ni4
3-20Machine Maintenance Procedures
Page 92
3G Module Removal0
A
Prerequisite:
Battery Removal
1.Locate 3G module (A) on LCD support plate. (Figure 3-28)
Figure 3-28.3G Module on LCD Support Plate
2.Disconnect auxiliary (blue) and main (black) cables from 3G module connectors.
(Figure 3-29)
Figure 3-29.Disconnecting 3G Cables
Machine Maintenance Procedures3-21
Page 93
3.Remove screws (B) from LCD support plate. (Figure 3-30)
B
C
c
Figure 3-30.Removing 3G Module Screws
4.Remove 3G module (C) from mainboard connector (c). (Figure 3-31)
Figure 3-31.Removing 3G Module
3-22Machine Maintenance Procedures
Page 94
3G Module Installation0
1.Install and connect 3G module (C) to mainboard connector (c). (Figure 3-31)
2.Install and secure screws (B) to LCD support plate. (Figure 3-30)
3.Connect main 3G antenna cable (black) to 3G module connector labeled M. (Figure 3-29)
4.Connect auxiliary 3G antenna cable (blue) to 3G module connector labeled A.