Fujitsu MCJ3230AP User Manual

MCJ3230AP

OPTICAL DISK DRIVE

PRODUCT MANUAL

C156-E205-01EN

FOR SAFE OPERATION

Handling of This Manual

This manual contains important information for using this product. Read thoroughly before using
the product. Use this product only after thoroughly reading and understanding especially the
section "Important Alert Items" in this manual. Keep this manual handy, and keep it carefully.

FUJITSU makes every effort to prevent users and bystanders from being injured or from suffering
damage to their property. Use the product according to this manual.

This product is designed and manufactured for use in standard appl ic ations such as off ice work,
personal devices and household appliances. This product is not intended for special uses (atomic
controls, aeronautic or space systems, mass transport vehicle operating controls, medical devices for
life support, or weapons firing controls) where particularly high reliability requirements exist,
where the pertinent levels of safety are not guaranteed, or where a failure or operational error could
threaten a life or cause a physical injury (hereafter referred to as "mission-critical" use). Customers
considering the use of these products for miss ion-c rit ica l appl ica tio ns mus t have safe ty-ass u ran ce
measures in place beforehand. Moreover, they are requested to consult our sales representative
before embarking on such specialized use.

First Edition July 2001

The contents of this manual may be revised without prior notice.

The contents of this manual shall not be disclosed in any way or reproduced in any media without

the express written permission of Fujitsu Limited.

All Rights Reserved, Copyright ! FUJITSU LIMITED 2001

C156-E205-01EN

Revision History

(1/1)

Edition Date

01 2001.07.24 — —

Revised section (*1)

(Added/Deleted/Altered)

Details

*1 Section(s) with asterisk (*) refer to the previous edition when those were deleted.

C156-E205-01EN

This page is intentionally left blank.

This manual describes the MCJ3230AP 90 mm (3.5-in ch) optica l disk dri ve.
This manual provides an overview of the above optical disk drives, and explains

their specifications, the requ ir em ents and procedures for installing them in a
system, and how to clean them.

The manual is intended for users who have a basic understanding of optical disk
drives and their use in computer systems.

See "Manual Organization" for details of the organization of manuals related to
optical disk drives and the scope of this manual. Use the other manuals shown in
"Manual Organization" together with this manual when necessary.

The organization of this manual, related reference manual and conventions for
alert messages follow.

Overview of Manual

This manual consists of the following six chapters, glossary, and abbreviation:

Preface

Chapter 1 General Description

This chapter introduces the MCJ3230AP optical disk drive and describes its
features, drive configuration, and system configuration.

Chapter 2 Specifications

This chapter describes the specificat ions of the MCJ323 0AP optica l disk drive and
the specifications of optical disk cartridges.

Chapter 3 Installation Requirements

This chapter describes the basic environmen ta l, mount ing, power supp ly, and
connection requirements for insta lling the MCJ32 30AP optic al disk drive in a user
system.

Chapter 4 Host Interface

This chapter describes the host interface of the MCJ3230AP optical disk drive.

Chapter 5 Diagnostics and Maintenance

This chapter describes how to operate and clean the MCJ3230AP optical disk
drive. This chapter also describes how to operate and clean optical disk cartridges.

Chapter 6 Diagnostics and Maintenance

This chapter describes the self-dia gnos ti cs func tio ns and main tenance of the
MCJ3230AP optical disk drive.

C156-E205-01EN i

Preface

Glossary

The glossary describes the technical terms that need to be understood to read this
manual.

Acronyms and Abbreviations

This manual contains a list of the abbreviations used in this manual and their
meanings.

CONVENTIONS USED IN THIS MANUAL

Throughout this manual, the MCJ3230AP optical disk drive are described as an
"ODD," "drive," "unit," "target (TARG)," or "device."

Decimal values are indicated without any modifiers added.
Hexadecimal values are indicated as X'17B9', 17B9h, 17B9H, and 17B9H.
Binary values are indicated as "010" and 010b.

Conventions for Alert Messages

This manual uses the following conventions to show the alert messages. An alert
message consists of an alert signal and alert statements. The alert signal consists
of an alert symbol and a signal word or just a signal word.

The following are the alert signals and their meanings:

This indicates a hazardous situation likely to result in
serious personal injury if the user does not perform
the procedure correctly.

This indicates a hazardous situation could result in
serious personal injury if the user does not perform
the procedure correctly.

This indicates a hazardous situation could result in
minor or moderate personal injury if the user does
not perform the procedure correctly. This alert signal
also indicates that damages to the product or other
property, may occur if the user does not perform the
product correctly.

This indicates information that could hel p the user
use the product more efficiently.

In the text, the alert signal is centered, followed below by the indented message.
A wider line space precedes and follows the alert message to show where the alert
message begins and ends. The following is an example:

ii C156-E205-01EN

(Example)

Preface

Attention

Low temperature burns:

on the printed circuit board unit in the optical disk drive exceed
55°C while operating. Be careful of low tenperature burns.

The main alert messages in the text are also liste d in the “Important Alert Items.”

Please forward any comments you may have regarding this manual.
To make this manual easier for users to understand, opinions from readers are

needed. Please write your opinions or requests on the Comment at the back of this
manual and forward it to the address described in the sheet.

The surface temperatures of some ICs

C156-E205-01EN iii

DISCLAIMER

Failure of the MCJ3230AP optical disk drive is defined as a failure requiring
adjustment, repair, or replacement. Fujitsu is not responsible for failure due to
misuse, operation outside the specified environment conditions, power line
trouble, controller problems, cable failure, or other failure not caused by the
optical disk drive itself.

iv C156-E205-01EN

Important Alert Items

Important Alert Messages

The important alert messages in this manual are as follows:

A hazardous situation could result in minor or moderate personal
injury if the user does not perform the procedure correctly. Also,
damage to the product or other property, may occur if the user does not
perform the procedure correctly.

Task Alert message Page

Operation

Installation

Low temperature burns:

some ICs on the printed circuit board unit in the optical disk
drive exceed 55°C while operating. Be careful of low
tenperature burns.

Device damage:

1) Shock or vibration applied to the drive that exceeds the
values defined in the standard damage the drive. Use
care when unpacking.

2) Do not leave the drive in dirty or contaminated
environments.

3) Since static discharge may destroy the CMOS devices in
the drive, pay attention to the following points after
unpacking:

"

Use an antistatic mat and wrist strap when handling
the drive.

"

Hold the mounting frame when handling the
drive. Do not touch the PCA except when setting
the switches.

4) When handling the drive, hold both sides of the
mounting frame. When touching other than both sid es o f
the mounting frame, avoid putting force.

The surface temperatures of

3-1

3-18

5) Do not forcibly push up the end of the header pin of the
printed circuit board unit when handling or setting the
drive.

C156-E205-01EN v

Important Alert Items

Task Alert message Page

Installation

Cleaning cartridge

Device Damage:

Be sure to turn on the power supply
before inserting your cartridge for the first time. It releases
the device from transport protection and enables you to insert
the cartridge.

The device may be damaged if you insert the cartridge
without releasing the protection. From the next time, you
don't need to turn on the power supply beforehand.

Before moving the drive, remove the optical disk cartridge. If
the drive is moved with the optical disk cartridge loaded in it,
the head may move back and forth in the drive to damage the
head or disk and reading the data may fail.

1) Make sure that the system power is off.

2) Do not connect or disconnect any cable when the power

is on.

Device Damage:

Before demounting the optical disk drive,
turn off the system power. Do not remove screws securing
the cables and drive when the power is on.

Device Damage:

Be sure to use the dedicated head cleaner
described above.

Damage for disk medium:

Use the cleaning solution and
cleaning cloth specified in Table 5.2. If other than the
specified items is used, disk media surface may be damaged.

Damage for date medium:

Do not use this cleaning kit
for the floppy disk or the optical disk cartridge used for other
optical disk drive.

3-19

3-22

3-23

5-6

5-12

5-12

Maintenance and Repair

Damage for disk medium:

Clean the cartridge at clean
place. Put a disposable groves at cleaning so that the
fingerprint does not put on the disk media (recommendation).

Damage for disk medium:

At setting the cartridge to the

setting case, do not apply the heavy shock and push hardly.

Eye inflammation:

In case of contact with eyes,

immediately flush eyes with water.

Data loss:

In case of regular repair, the optical disk
cartridge should not be attached except where the cartridge
causes the error. And before having the drive repaired, save
the data in the cartridge. Fujitsu is not responsible for data
last during maintenance or repair.

5-12

5-13

5-14

6-3

vi C156-E205-01EN

MANUAL ORGANIZATION

OPTICAL DISK DRIVES
PRODUCT MANUAL
(C156-E205)

OPTICAL DISK DRIVES
MAINTENANCE MANUAL
(C156-F043)
<This manual>

1. GENERAL DESCRIPTION

2. SPECIFICATIONS

3. INSTALLATION REQUIREMENTS

4. HOST INTERFACE

5. OPERATION AND CLEANING

6. DIAGNOSTICS AND MAINTENANCE

1. MAINTENANCE AND DIAGNOSIS

2. FAULT ANALYSIS

3. REMOVAL AND REPLACEMENT
PROCEDURES

4. PRINCIPLES OF OPERATION

5. CLEANING

C156-E205-01EN vii

REFERENCED STANDARDS

The product specifications and functions described in this manual conform to the
following standards:

Specification

(document) number

X3T13/1321D
Revision 2

SFF-8070I
Revision 1.2

ISO/IEC 10090 90mm Optical Disk Cartridges, rewritable and

ISO/IEC 13963 Data Interchange on 90mm Optical Disk

ISO/IEC 15041 Data Interchange on 90mm Optical Disk

Cherry Book GIGAMO 1.3GB 90mm Magneto-Optical Disk

Cherry Book 2 GIGAMO 2.3GB 90mm Magneto-Optical Disk

AT Attachment with Packet Interface-5
(ATA/ATAPI-5)

ATAPI Rmovavle Rewritable Media Small From Factor

read only, for data interchange.

cartridges Capacity: 230 megabytes per
cartridges.

Cartridges Capacity: 640 megabytes per
cartridges.

System.

System.

Name Concerned organization

American National
Standards Institute
(ANSI)

Committee (SFF)
ISO/IEC (*1)

ISO/IEC (*1)

ISO/IEC JTC1 (*1)

FUJITSU LIMITED
SONY CORPORATION

FUJITSU LIMITED
SONY CORPORATION

*1 ISO= International Organization for Standardization

IEC= International Electrical for Commission
JTC1= Joint Technical Committee 1

viii C156-E205-01EN

Contents

CHAPTER 1 General Description.................................................................. 1-1

1.1 Features 1-1

1.1.1 Performance 1-2

1.1.2 Reliability 1-3

1.1.3 Maintainability/operability 1-3

1.1.4 Adaptability 1-4

1.1.5 Interface 1-4

1.2 Drive Configuration 1-6

1.2.1 Drive model 1-6

1.2.2 Configuration 1-7

1.2.3 Mechanical sections 1-7

1.2.4 Control circuit section 1-8

1.3 System Configuration 1-10

CHAPTER 2 Specifications............................................................................ 2-1

2.1 Optical Disk Drive Specifications 2-1

2.1.1 Model and product number 2-1

2.1.2 Drive specifications 2-2

2.1.3 Environmental and power requirements 2-4

2.1.4 Error rate 2-5

2.1.5 Reliability 2-6

2.2 Optical Disk Cartridge Specifications 2-7

2.2.1 Recommended optical disk cartridge specifications 2-7

2.2.2 Optical disk cartridge 2-8

2.2.3 Disk specifications 2-10

2.3 Defect Management 2-11

2.3.1 Defect management schematic diagram 2-11

CHAPTER 3 Installation Requirments.......................................................... 3-1

3.1 Environmental Requirements 3-1

C156-E205-01EN ix

Contents

3.1.1 Temperature measurement point 3-1

3.1.2 Temperature requirements and measuring method 3-3

3.1.3 Air flow 3-3

3.1.4 Temperature rise under several conditions 3-4

3.1.5 Air purity 3-4

3.2 Mounting Requirements 3-5

3.2.1 External dimensions 3-5

3.2.2 Installation direction 3-8

3.2.3 Centers of gravity 3-9

3.2.4 Notes on mounting 3-10

3.3 Power Supply Requirements 3-12

3.4 Cable Connections 3-13

3.4.1 Drive connectors 3-13

3.4.2 Cable connector specifications 3-14

3.4.3 Drive connection 3-14

3.5 Jumper Settings 3-15

3.5.1 Jumper settings at factory shipping 3-15

3.5.2 Mode setting 3-15

3.6 Notes on Drive Handling 3-18

3.7 Mounting 3-21

3.7.1 Checks before mounting the drive 3-21

3.7.2 Mounting procedure 3-21

3.8 Cable Connections 3-21

3.9 Operation Confirmation and Preparation for Use after Installation 3-22

3.9.1 Confirming initial operations 3-22

3.9.2 Connection check 3-23

3.10 Dismounting Drive 3-23

CHAPTER 4 Host Interface.............................................................................4-1

4.1 Pin Assignment 4-2

4.2 Signal Description 4-4

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x

4.3 Interface Registers 4-6

4.3.1 I/O registers 4-6

4.3.1.1 Alternate Status register 4-7

4.3.1.2 ATA Command register 4-7

4.3.1.3 Data register 4-7

4.3.1.4 Device Control register 4-7

4.3.1.5 Drive Address register 4-8

4.3.1.6 ATAPI Byte Count register 4-8

4.3.1.7 ATAPI Block Device Select register 4-9

4.3.1.8 Error register 4-9

4.3.1.9 ATA Features register 4-10

4.3.1.10 ATAPI Features register 4-10

4.3.1.11 ATA Sector Count register 4-10

4.3.1.12 ATAPI Interrupt Reason register 4-10

4.3.1.13 Sector Number register 4-11

4.3.1.14 ATAPI Status register 4-11

Contents

4.4 Various Processes 4-13

4.4.1 Reset response 4-13

4.4.2 Signature 4-14

4.4.3 Defect sector management 4-14

4.4.4 Automatic alternate sector assignment function 4-14

4.4.5 Cache function 4-15

4.4.5.1 Data buffer 4-15

4.4.5.2 Read cache 4-15

4.4.5.3 MO write cache 4-16

4.4.6 Media status notification function 4-16

4.4.7 Power management function 4-17

4.4.7.1 Power mode 4-17

4.4.7.2 Active mode 4-17

4.4.7.3 Pre-idle mode 4-17

4.4.7.4 Idle mode 4-18

4.4.7.5 Standby mode 4-18

4.4.7.6 Sleep mode 4-18

4.4.7.7 Standby timer 4-18

4.4.7.8 Power mode transition 4-19

4.4.8 Unsupported functions 4-19

4.4.9 LED Indications 4-20

4.5 ATA Commands 4-21

4.5.1 CHECK POWER MODE (E5h) 4-22

4.5.2 DEVICE RESET (80h) 4-23

4.5.3 EXECUTE DEVICE DIAGNOSTIC (90h) 4-23

C156-E205-01EN

i

Contents

4.5.4 FLUSH CACHE (E7h) 4-25

4.5.5 GET MEDIA STATUS (DAh) 4-25

4.5.6 IDENTIFY PACKET DEVICE (A1h) 4-26

4.5.7 IDLE IMMEDIATE (E1h) 4-33

4.5.8 NOP (00h) 4-33

4.5.9 PACKET (A0h) 4-34

4.5.10 SET FEATURES (Efh) 4-35

4.5.11 SLEEP (E6h) 4-37

4.5.12 STANDBY IMMEDIATE (E0h) 4-38

4.6 Packet Commands 4-39

4.6.1 ERASE command 4-40

4.6.2 FORMAT UNIT command 4-41

4.6.3 INQUIRY command 4-42

4.6.4 MODE SELECT (6) command 4-44

4.6.4.1 Read-Write error recovery page 4-46

4.6.4.2 Flexible disk page 4-48

4.6.4.3 Caching page 4-50

4.6.4.4 Power Condition page 4-51

4.6.4.5 Verify Control Page 4-52

4.6.5 MODE Select (10) command 4-53

4.6.6 MODE SENSE (6) command 4-55

4.6.7 MODE SENSE (10) command 4-57

4.6.8 PREVENT/ALLOW MEDIUM REMOVAL command 4-59

4.6.9 READ (10) command 4-60

4.6.10 READ CAPACITY command 4-60

4.6.11 READ FORMAT CAPACITIES command 4-61

4.6.12 READ DEFECT DATA (10) command 4-62

4.6.13 READ DEFECT DATA (12) command 4-64

4.6.14 READ LONG command 4-65

4.6.15 RECEIVE DIAGNOSTIC RESULTS command 4-66

4.6.16 REQUEST SENSE command 4-66

4.6.17 SEND DIAGNOSTIC command 4-71

4.6.18 SEEK command 4-71

4.6.19 START/STOP UNIT command 4-72

4.6.20 SYNCHRONIZE CACHE command 4-73

4.6.21 TEST UNIT READY command 4-73

4.6.22 VERIFY command 4-74

4.6.23 WRITE (10) command 4-74

4.6.24 WRITE AND VERIFY command 4-75

4.6.25 WRITE BUFFER command 4-76

4.6.26 WRITE LONG command 4-77

4.7 Timing 4-78

xii C156-E205-01EN

Contents

x

4.7.1 Register/PIO data transfer timing 4-78

4.7.2 Multiword DMA data transfer timing 4-80

4.7.3 Ultra DMA data in transfer (initialization timing) 4-82

4.7.4 Ultra DMA data in transfer (continuous transfer timing) 4-82

4.7.5 Ultra DMA data in transfer (host stop timing) 4-83

4.7.6 Ultra DMA data in transfer (device end timing) 4-83

4.7.7 Ultra DMA data in transfer (host end timing) 4-84

4.7.8 Ultra DMA data out transfer (initialization timing) 4-85

4.7.9 Ultra DMA data out transfer (continuous transfer timing) 4-85

4.7.10 Ultra DMA data out transfer (device stop timing) 4-86

4.7.11 Ultra DMA data out transfer (host suspend timing) 4-87

4.7.12 Ultra DMA data out transfer (device end timing) 4-88

4.7.13 Power-on and Reset Timing 4-90

CHAPTER 5 Operation and Cleaning ........................................................... 5-1

5.1 Operating Optical Disk Drive 5-1

5.1.1 Optical disk drive 5-2

5.1.2 Note 5-3

5.1.3 Inserting cartridge 5-3

5.1.4 Ejecting (removing) cartridge 5-5

5.2 Cleaning Drive 5-6

5.3 Optical Disk Cartridge Operation 5-7

5.3.1 Optical disk cartridge 5-7

5.3.2 Write protect tab 5-8

5.3.3 How to affix an index label on the MO cartridge (See figure 5.6) 5-9

5.3.4 Notes 5-9

5.4 Cleaning Optical Disk Cartridge 5-11

5.4.1 Cleaning tool 5-11

5.4.2 Cleaning procedure 5-12

CHAPTER 6 Diagnosis and Maintenance..................................................... 6-1

6.1 Diagnosis 6-1

6.1.1 Initial self-diagnosis 6-2

6.1.2 Diagnostic command 6-2

6.1.3 Test program 6-2

6.2 Maintenance Information 6-3

C156-E205-01EN

iii

Contents

6.2.1 Maintenance requirements 6-3

6.2.2 Revision number 6-4

Glossary .................................................................................................GL-1

Abbreviations .................................................................................................AB-1

Index ..................................................................................................IN-1

xiv C156-E205-01EN

x

Figures

Contents

Illustrations

Figure 1.1 Outer view (with panel) 1-6
Figure 1.2 Outer view (without panel) 1-6
Figure 1.3 Optical disk drive configuration 1-7
Figure 1.4 Control circuit section block diagram 1-8
Figure 1.5 System configuration with one optical disk drive 1-10
Figure 1.6 System configuration with two optical disk drives 1–10

Figure 2.1 Optical disk cartridge 2-8
Figure 2.2 Algorithms for alternate processing 2-11
Figure 2.3 Example of alternate processing 2–12

Figure 3.1 Surface temperature measurement points 3-2
Figure 3.2 Dimensions 3-6
Figure 3.3 Dimensions (without panel) 3-7
Figure 3.4 Installation directions 3-8
Figure 3.5 Centers of gravity 3-9
Figure 3.6 Mounting frame structure 3-10
Figure 3.7 Service clearance 3-11
Figure 3.8 Current waveform (+5 VDC) 3-12
Figure 3.9 Connector and terminal locations 3-13
Figure 3.10 Cable connection diagram 3-14
Figure 3.11 Jumper settings at factory shipping 3-15
Figure 3.12 Master device setting 3-15
Figure 3.13 Slave device setting 3-16
Figure 3.14 Cable select mode setting 3-16
Figure 3.15 Cable select examples 3-17
Figure 3.16 Individual packaging style 3-20

Figure 4.1 Power mode 4-19
Figure 4.2 Register/PIO data transfer 4-78
Figure 4.3 Multiword DMA data transfer 4-80
Figure 4.4 Ultra DMA data in transfer (initialization timing) 4-82
Figure 4.5 Ultra DMA data in transfer (continuous transfer timing) 4-82
Figure 4.6 Ultra DMA data in transfer (host stop timing) 4-83
Figure 4.7 Ultra DMA data in transfer (device end timing) 4-83
Figure 4.8 Ultra DMA data in transfer (host end timing) 4-84
Figure 4.9 Ultra DMA data out transfer (initialization timing) 4-85

C156-E205-01EN

v

Contents

Figure 4.10 Ultra DMA data out transfer (continuous transfer timing) 4-85
Figure 4.11 Ultra DMA data out transfer (device stop timing) 4-86
Figure 4.12 Ultra DMA data out transfer (host suspend timing) 4-87
Figure 4.13 Ultra DMA data out transfer (device end timing) 4-88
Figure 4.14 Power-on and reset timing 4–90

Figure 5.1 Optical disk drive front view (with panel) 5-2
Figure 5.2 Inserting cartridge 5-4
Figure 5.3 Removing cartridge 5-5
Figure 5.4 Optial disk cartridge 5-7
Figure 5.5 Write protect tab 5-8
Figure 5.6 How to stick an index label on the MO cartridge 5-9
Figure 5.7 Cleaning procedure (1) 5-12
Figure 5.8 Cleaning procedure (2) 5-13
Figure 5.9 Cleaning procedure (3) 5-13
Figure 5.10 Cleaning procedure (4) 5–14

Tables

Figure 6.1 Revision label 6-4
Figure 6.2 Revision number indication 6-4

Table 2.1 Model and order number 2-1
Table 2.2 Specifications 2-2
Table 2.3 Environmental and power requirements 2-4
Table 2.4 Recommended optical disk cartridge specifications 2-7
Table 2.5 Disk specifications 2–10

Table 3.1 Temperature requirements at measurement points 3-3
Table 3.2 Temperature at each measuring point (Reference) 3-4
Table 3.3 Cable connector specifications 3–13

Table 4.1 Connector pin assignments 4-2
Table 4.2 Signal description 4-4
Table 4.3 I/O port functions and mapping 4-6
Table 4.4 Bit definitions of Alternate Status register 4-7
Table 4.5 Bit definitions of Device Control register 4-7
Table 4.6 Bit definitions of Drive Address register 4-8
Table 4.7 Bit definitions of ATAPI Byte Count register 4-8
Table 4.8 Bit definitions of ATAPI Block Device Select register 4-9
Table 4.9 Bit definitions of Error register 4-9
Table 4.10 Bit definitions of ATAPI Features register 4-10
Table 4.11 Bit definitions of ATAPI Interrupt Reason register 4-10

xvi C156-E205-01EN

x

Table 4.12 IO and Cod 4-11
Table 4.13 Bit definitions of ATAPI Status register 4-11
Table 4.14
Table 4.15
Table 4.16 LED indications 4-20
Table 4.17 Command codes and parameters 4-21
Table 4.18 CHECK POWER MODE command 4-22
Table 4.19 Power mode indication 4-22
Table 4.20 DEVICE RESET command 4-23
Table 4.21 EXECUTE DEVICE DIAGNOSTIC command 4-23
Table 4.22 Self-diagnosis detailed code 4-24
Table 4.23 FLUSH CACHE command 4-25
Table 4.24 GET MEDIA STATUS command 4-25
Table 4.25 Error register 4-26
Table 4.26 IDENTIFY PACKET DEVICE command 4-26
Table 4.27 Device parameter informat ion (1/ 5) 4-27
Table 4.28 IDLE IMMEDIATE command 4-33
Table 4.29 NOP command 4-33
Table 4.30 PACKET command 4-34
Table 4.31 SET FEATURES command 4-35
Table 4.32 FR register setting value 4-35
Table 4.33 Transfer setting values in the SC register 4-36
Table 4.34 Cylinder Low register 4-36
Table 4.35 Cylinder High register 4-36
Table 4.36 SLEEP command 4-37
Table 4.37 STANDBY IMMEDIATE command 4-38
Table 4.38 Packet command codes and parameters 4-39
Table 4.39 ERASE command 4-40
Table 4.40 FORMAT UNIT command 4-41
Table 4.41 FORMAT UNIT parameter list 4-41
Table 4.42 Defect list header 4-41
Table 4.43 INQUIRY command 4-42
Table 4.44 INQUIRY data 4-43
Table 4.45 MODE SELECT (6) command 4-44
Table 4.46 Mode parameters 4-44
Table 4.47 Mode parameter list 4-45
Table 4.48 Mode parameter header 4-45
Table 4.49 Block descriptor 4-45
Table 4.50 Mode Page Format 4-46
Table 4.51 Read-Write error recovery page 4-46
Table 4.52 Changeable values in the read-write recovery page 4-47
Table 4.53 Default values for the read-write recovery page 4-47
Table 4.54 Flexible disk page 4-48

Contents

C156-E205-01EN

vii

Contents

Table 4.55 Changeable values in flexible disk page 4-49
Table 4.56 Default values in flexible disk page 4-49
Table 4.57 Caching page 4-50
Table 4.58 Changeable values in the caching page 4-50
Table 4.59 Default values for the caching page 4-50
Table 4.60 Power Condition Page 4-51
Table 4.61 Power Condition Page Variable 4-51
Table 4.62 Power Condition Page Default value 4-52
Table 4.63 Verify Control Page 4-52
Table 4.64 Verify Mode 4-52
Table 4.65 Verify Control Page variable 4-53
Table 4.66 Verify Control Page default value 4-53
Table 4.67 Mode Select (10) command 4-53
Table 4.68 Mode Parameter List 4-54
Table 4.69 Mode Parameter Header 4-54
Table 4.70 MODE SENSE (6) command 4-55
Table 4.71 Page Control field 4-55
Table 4.72 Mode parameter list 4-56
Table 4.73 Mode parameter header 4-56
Table 4.74 Block descriptor 4-57
Table 4.75 Mode Page Format 4-57
Table 4.76 MODE SENSE (10) command 4-57
Table 4.77 Mode Parameter List 4-58
Table 4.78 Mode Parameter Header 4-58
Table 4.79 PREVENT/ALLOW MEDIUM REMOVAL command 4-59
Table 4.80 Response to Prevent/Allow/Eject 4-59
Table 4.81 READ (10) command 4-60
Table 4.82 READ CAPACITY command 4-60
Table 4.83 READ CAPACITY data 4-61
Table 4.84 READ FORMAT CAPACITIES command 4-61
Table 4.85 READ FORMAT CAPACITIES data format 4-61
Table 4.86 Capacity list header 4-61
Table 4.87 Current/Maximum capacity descriptor 4-62
Table 4.88 Descriptor code definition 4-62
Table 4.89 READ DEFECT DATA (10) command 4-62
Table 4.90 Defect List Format - READ DEFECT DATA (10) 4-63
Table 4.91 Defect List Header - READ DEFECT DATA (10) 4-63
Table 4.92 Defect Descriptor 4-63
Table 4.93 Sector Address Format 4-64
Table 4.94 READ DEFECT DATA (12) command 4-64
Table 4.95 Defect List Format - READ DEFECT DATA (12) 4-64
Table 4.96 Defect List Header - READ DEFECT DATA (12) 4-65
Table 4.97 READ LONG command 4-65

xviii C156-E205-01EN

x

Table 4.98 RECEIVE DIAGNOSTIC RESULTS command 4-66
Table 4.99 REQUEST SENSE command 4-66
Table 4.100 Request sense data 4-67
Table 4.101 Error code 4-67
Table 4.102 Sense key 4-68
Table 4.103 Logical block address format 4-68
Table 4.104 ASC/ASCQ list (1/2) 4-69
Table 4.105 Format Progress Indication Bytes 4-70
Table 4.106 SEND DIAGNOSTIC command 4-71
Table 4.107 SEEK command 4-71
Table 4.108 START/STOP UNIT command 4-72
Table 4.109 START/STOP/EJECT processing 4-72
Table 4.110 SYNCHRONIZE CACHE command 4-73
Table 4.111 TEST UNIT READY command 4-73
Table 4.112 VERIFY command 4-74
Table 4.113 WRITE (10) command 4-74
Table 4.114 WRITE AND VERIFY command 4-75
Table 4.115 WRITE BUFFER command 4-76
Table 4.116 WRITE LONG command 4-77
Table 4.117 Register/PIO data transfer timing parameters 4-79
Table 4.118 Multiword DMA data transfer timing parameters 4-81
Table 4.119 Ultra DMA data out transfer parameter 4-89
Table 4.120 Power-on and reset timing 4–91

Contents

Table 5.1 Head cleaner 5-6
Table 5.2 Cleaning kit 5-11
Table 5.3 Packed items (cleaning kit) 5–11

Table 6.1 Self-diagnostic function 6-1

C156-E205-01EN

ix

This page is intentionally left blank.

CHAPTER 1 General Description

1.1 Features

1.2 Drive Configuration

1.3 System Configuration

This chapter describes the features and configuration of the optical disk drives.
The MCJ3230AP (hereafter, the optical disk drive) is the successor model to the

MCE3130AP. This optical disk drive, which maintains compatibility with the
MCE3130AP, offers high performance and high capacity. Supporting 2.3 GB of
storage capacity, this device delivers superior performance with a 5,455-rpm
rotational speed, and supports security functions.

The optical disk drive is high-performance, 90 mm (3.5-inch) commutative
rewritable optical disk drive which incorporates an ATAPI controller.

The interface connecting the optical disk drive to the host system complies with
the ATA/ATAPI-4.

The flexibility and expandability through ATAPI I/F, the high performance of the
optical disk drive, and the drive's commands set enable the user to construct high­reliability, high-performance disk subsystems with advanced functions and large­scale storage.

1.1 Features

This section describes the following driv e feat ure s:

!

!

!

!

!

Performance
Reliability
Maintainability/operability
Adaptability
Interface

C156-E205-01EN 1-1

General Description

1.1.1 Performance

(1) Half-height standard 90 mm (3.5-inch) size (25.4 mm height)

The ATAPI controller can be directly connected to the system EIDE bus. The
controller meets the specifications of the standard 25.4 mm height 90 mm
(3.5-inch) fixed disk drive form factor.

(2) 2.3 GB capacity

The optical disk drive conforms to the 2.3 GB GIGAMO standard. It also
supports read and write accesses to 128 MB, 230 MB, 540 MB, 640 MB, and 1.3
GB disks.

(3) High-speed data transfe r

The optical disk drive supports a disk media rotational speed of 3,637 rpm when
using 2.3 GB disks. The device supports a rotational speed of 5,455 rpm (ZCAV)
when using a 128 MB, 230 MB, 540 MB, or 640 MB disks. When using 1.3 GB
disks, the optical disk drive supports ZCAV mode with a rotational speed of 3,637
rpm, and ZCLV mode that controls the speed at three levels: 3,637/4, 138/4,801
rpm, in accordance with the position of the optical head.

In ZCLV mode, the optical disk drive speeds up by detecting continuous accessing
of inner disk tracks to prevent a reduction of inner disk rotation.

For random accesses, the optical disk drive switches to ZCAV mode that is fixed
to 3,637 rpm to prevent access performance degradation.

In the disk unit, high-speed data transfers at rates of 4.62 to 8.26 MB/s (2.3 GB)
are realized. The data transfer rate on the EIDE bus is 16.6 MB/s in PIO mode 4,

16.6 MB/s in Multi-word DMA mode, and 33.3 MB/s in Ultra DMA Mode 2.
The EIDE bus high-speed data transfer capacity can be used effectively through

the optical disk unit's large capacity data buffer.

(4) High-speed mean seek ti me

This drive features a linear voice-coil motor for high-speed head positioning. The
average seek time is the average of 1,000 random seeks and is 19 ms. (However,
this does not include command overhead or address check.)

(5) Compatible with international standards (media interchangeability)

90 mm (3.5 inch) type optical disks as well as ISO standards compatible 128 MB,
230 MB, 540 MB and 640 MB format optical disk media can be used in the optical
disk unit.

(6) Direct-overw ri te med iu m suppor t

The drive can use an optic modulation direct-overwrite disk that does not perform
an erase operation; 230-MB disk, 540-MB disk with the ISO standard.

1-2 C156-E205-01EN

(7) Dust resistance

The optical disk unit provides low-power consumption, eliminating the need for a
cooling fan. The top of the cartridge is sealed with film, and the bottom of the
optical disk unit is sealed with sheet metal, providing prot ect ion that is not
complicated.

The optical disk drive needs class 5 millions or less of the dust particles.

(8) Lower power consumption

The power consumption of the optical disk drive is 5.6 W (These power
consumption values are typical values during read and write operation.) These
drives do not use a fan.

The minimum power consumption is 0.7 W (typical value) during power save.

(9) Automatic spindle stop function

If access is not made within a certain time, this function stops disk rotation to
minimize dust accumulation on the disk. This function can be set that time by the
MODE SELECT command.

1.1 Features

1.1.2 Reliability

(1) Mean time between failu res (MT BF)

This drive features a 120,000 hour MTBF.

(2) Error recovery

For the error depending on the optical disk drive, recovery process is made by a
suitable retry. This drive features Reed-Solomon error correction (ECC) to assure
error-free operation.

(3) Automatic allocation of alternate data blocks

This drive features a function which automatically allocates alternate data blocks
to defective data blocks detected while data is being read from or written to an
optical disk.

1.1.3 Maintainability/operability

(1) Diagnostic function

This drive has a diagnostic function to check optical disk drive operations. The
diagnostic function facilitates test and restoration.

(2) Five-year service li fe (no overh aul )

This drive will not require overhaul within the first five years of installation if
appropriately handled, maintained, and cleaned as recommended.

C156-E205-01EN 1-3

General Description

1.1.4 Adaptability

(1) Wide operating environment

An LSI circuits reduce power consumption. This drive features a wide operating
environment (5 to 45°C, general office environment). Dust particles are class 5
millions or less.

(2) Vibration resistance (shock resistance)

Rubber vibration isolators protect the drive against external shock or vibration.

(3) Safety standards

!

UL1950 (U.S.A., safety)

!

CDRH class 1 (U.S.A., laser)

!

CSA C22.2 No. 950 (Canada, safety)

!

EN60950 (Europe, safety)

!

EN60825 Class 1 (Europe, laser)

(4) Various radio wave standards

This optical disk device is installed in a host system, and meets the following
standards:

!

EN55022 class B, EN55024 (European wave standards)

!

AS/NZS3548 class B (Australian wave standards)

!

CNS13438 (Taiwanese radio interference standard)

1.1.5 Interface

(1) ATA/ATAPI-4

This drive supports the basic ATA/ATAPI-4 specifications.
ATAPI commands enable operation using logical block addresses that are

independent of the physical attributes of the drive, enabling software flexibility in
terms of system expansion.

Supports PIO Mode 4 Multi-word DMA Mode 2, and Ultra DMA Mode 2.

(2) Continuous block processing

Logical block addresses are used for data block addressing. Withou t cons ide ration
of the physical attributes of track boundaries, the host can access data by
specifying a block number in logically continuous data space.

1-4 C156-E205-01EN

(3) Data buffer

7,600 KB buffer is used to transfer data between the EIDE bus and disk. Since
data is stored in this buffer, the host can execute input-ou tpu t proce ss ing
effectively by using the high-speed data transfer capability of the EIDE bus
without regard to the data transfer rate of the optical disk drive.

(4) Read-ahead cache feature

The read-ahead cache feature enables high-speed sequential data access as
follows:

After executing a command to read data from the disk, the drive automatically
reads the next data block and stores it in the data buffer (pre-reading). If the next
command requests this data, the data is transferred from the buffer without another
disk access.

(5) Write cache feature

When the host system issues the write command to the optical disk drive, a
command complete is usually responded after completion of the write and verify
operations. By using the write cache feature, a command complete is responded
after completion of the data transfer to the data buffer without waiting the
completion of the write and verify operations then the write and verify operations
are made asynchronously with the interface operation. Therefore, the apparent
write command processing time measured at the host system is reduced and the
I/O performance of the host system is improved.

1.1 Features

The write cache feature is enabled or disabled by MODE SELECT command.

When the write cache feature is enabled, a write error is reported at
the completion status of next command. At a system so that the host
retries the command, a retry process may be failed.

(6) Defective block slipping

When a disk is initialized, logical data blocks are reallocated in a physical
sequence by slipping defective data blocks. This enables high-speed continuous
data block processing without rotational delay due to defective data blocks.

(7) Device driver softwa re

The optical disk drive requires more extended processing time than conventional
optical device drives because of higher density. Consequently, a processing time
timeout when using the OS can occur and this requires special device driver
software.

C156-E205-01EN 1-5

General Description

1.2 Drive Configuration

1.2.1 Drive model

Figures 1.1 and 1.2 show the outer view.

Figure 1.1 Outer view (with panel)

Figure 1.2 Outer view (without panel)

1-6 C156-E205-01EN

1.2.2 Configuration

Figure 1.3 shows the drive configuration.
The drive consists of mechanical sections, a fixed optics section, actuator, and a

control circuit section. The mechanical sections include the spindle motor,
actuator section, bias magnet, and the cartridge folder vertical motion mechanism.

The fixed optics section consists of the optical components, position detector, and
LD controller.

The control circuit sections include the drive control circuit section and ATAPI
controller section.

1.2 Drive Configuration

Optical disk cartridge

Spindle motor

Figure 1.3 Optical disk drive configuration

1.2.3 Mechanical sections

(1) Optical disk cartridge load/eject

The system includes a cartridge mechanism which lowers the optical disk cartridge
and mounts (loads) it on the spindle motor automatically when the optical disk
cartridge is fully inserted in the optical dis k drive 's disk slo t, and a mechan is m
which automatically ejects the cartridge when the Eject button on the front panel is
pressed.

Control circuit section

Fixed optics sectionActuator section

(2) Spindle motor

Optical disk cartridge hubs are linked through magnetic clamps to minimize
slippage between the spindle motor shaft and disk. The spindle mo tor is the di rec t
drive type which rotates the disk at the same speed as the spindle motor shaft. A
DC brushless spindle motor is used. The spindle motor rotates at 5,455 rpm ±

0.1%.

(3) Actuator sectio n

The positioner moves (seeks) a head actuator radically across the disk surface.

C156-E205-01EN 1-7

General Description

A

H

B

C

The positioner is driven by a linear voice coil motor. A pulse-width modulation
(PWM) is adopted as a driving system and realizes low power consumption and
high-speed access.

(4) Separate optical section s

The optical head section is separated in such a way that the fixed optics section
is separated from the moving optics section to minimize seek time and positioning
error. (See Subsection 1.2.4 for the fixed optical section.) This reduces the weight
of the moving parts.

The fixed optics section consists of the laser diodes, collimator lens, and optical
detector.

The fixed optics section includes a laser diode for recording and playback, and
transmits one laser beam to the head actuator.

(5) Panel

The central part of the panel is hollowed out deeply to provide pushing finger
space for inserting the cartridge, thereby fa ci li tating the ins er tio n.

The panel is also simply designed by making the eject button and LED light
emitting part integral with each other.

1.2.4 Control circuit section

Figure 1.4 is the block diagram of the control circuit section.

Main control
MPU
ODC

ATAPI I/F

DSP
User Logic
LSI i/f

Drive
Read Amp
Power Amp
Filter
Sensor
Motor Driver

F-ROM

D-RAM

DE

ead
Laser Diode
Photo Diode
APC Amp
LPC Amp
Servo AGC

ctuator
Focus Act.
Track Act.
Spindle Motor
Temperature Sensor

ias Coil
Eject Motor

artridge Sensor

Figure 1.4 Control circuit section block diagram

1-8 C156-E205-01EN

The control circuit section is divided into two parts: an ATAPI controller section
which deals with control between the ATAPI interface and drive interface, and a
drive circuit section which controls the drive.

(1) ATAPI controller circuit section

The ATAPI controller circuit's reliability is improved by large-scale integrated
circuit technology. The high-speed microprocessor (MPU) handles ATAPI
interface control and drive control such as drive read-and-write control and single­beam control.

(2) Drive circuit sec tio n

The drive circuit section consists of the following circuits:

!

Laser diode control circuit

!

Signal reproduction circuit

!

Servo/seek control circuit

!

Rotation control circuit

1.2 Drive Configuration

!

Drive miscellaneous control ci rcu it

The DSP (digital signal processor) is used for the servo/seek control circuit to
reduce the circuit amount, therefore this circuit is a simple configuration.

The drive circuit section executes operations such as seek, erase, record, and

playback while the MPU controls the focus-tracking of the beam.

C156-E205-01EN 1-9

General Description

A

1.3 System Configuration

Figures 1.5 and 1.6 show the PC AT interface system configuration. The interface
can be directly connected to the 40-pin AT-compatible IDE interface.

Host system

T bus

(Host interface)

HA

(

Host adapter)

IDE interface

ODD

Figure 1.5 System configuration with one optical disk drive

Host system

HA

(Host adapter)

AT bus

(Host interface)

ODD

ODD

IDE interface

Figure 1.6 System configuration with two optical disk drives

The PC AT interface will not meet the specification if two optical
disk drives not conforming to the ATA are connected.

The host adapter (HA) consists of an address decoder, driver, and
receiver. ATA stands for AT Attachment. This drive supports the
ATA interface.

1-10 C156-E205-01EN

CHAPTER 2 Specifications

2.1 Optical Disk Drive Specifications

2.2 Optical Disk Cartridge Specifications

2.3 Defect Management

This chapter contains the specifications of the optical disk drive, and the optical
disk cartridge.

2.1 Optical Disk Drive Specifications

2.1.1 Model and product number

Table 2.1 lists the model and order number.

Table 2.1 Model and order number

Model Name Order No. Panel Panel Color Mounting Screws

MCJ3230AP CA05890-B501 with panel Light gray

(2.5Y 7.2/0.4)

CA05890-B701 without panel
CA05890-B601 with panel Light gray

Note: The panel colors (2.5Y 7.2/0.4) are indicated in Munsell symbols. (JIS

Z8721)

!

(2.5Y 7.2/0.4)

Metric screws (M3)

Metric screws (M3)
Metric screws (M3)

C156-E205-01EN 2-1

Specifications

2.1.2 Drive specifications

Table 2.2 lists MCJ3230AP drive specifications

Table 2.2 Specifi cati ons (1 of 2)

[MCJ3230AP]

Item Specifications

Optical disk ca rtridge 128 MB media 230 MB media 540 MB media 640 MB media 1.3 GB media 2.3 GB media
Total capacity Unformatted

Formatted

Capacity/track Unformatted

Formatted

Capacity/sector Unformatted

Formatted
Number of user tracks/side (*1)
Number of alternate sectors/side
Number of sectors/tr ac k
Data transfer rate

Random seek time (*2)
Average latency

Rotational speed

Heads
Positioner type
Servo tracking method

181 MB 325 MB 819 MB 818 MB 1.683 GB 2.901 GB

128 MB 230 MB 538 MB 643 MB 1.283 GB 2.261 GB

18,100 bytes 18,100 bytes

12,800 bytes 12,800 bytes

725 bytes 778 bytes 778 bytes 2,584 bytes 2,694 bytes 2,766 bytes

512 bytes 2,048 bytes

10,000 17,940 42,042 18,480 36,855 64,944

"

1,024

25 17

1.65 MB/s (max.)

0.39 MB/s
continuous
writing (effective)

1.16 MB/s
continuous
reading (effective)

19 ms (typ)

5.5 ms 8.2 ms

5.455 rpm 3,637 rpm

Positioner + Separete Optical Section

Linear voice coil motor

ISO continuous servo method

(logical track
capacity)

(logical track
capacity)

"

1,025

2.00 to 3.16 MB/s
(max.)

0.47 to 0.75 MB/s
continuous
writing (effective)

1.40 to 2.23 MB/s
continuous
reading (effective)

19,450 bytes
(logical track
capacity)

12,800 bytes
(logical track
capacity)

"

2,250

3.45 to 5.94 MB/s
(max.)

0.78 to 1.30 MB/s
continuous
writing (effective)

2.33 to 3.91 MB/s
continuous
reading(effective)

43,928 bytes
(logical track
capacity)

34,816 bytes
(logical track
capacity)

"

2,244

3.52 to 5.87 MB/s
(max.)

0.93 to 1.55 MB/s
continuous
writing (effective)

2.79 to 4.66 MB/s
continuous
reading (effective)

45,798 bytes
(logical track
capacity)

34,816 bytes
(logical track
capacity)

"

4,437

3.92 to 6.70 MB/s
(max.)

0.99 to 1.70 MB/s
continuous
writing (effective)

2.98 to 5.09 MB/s
continuous
reading (effective)

5.17 to 6.70 MB/s
(ZCLV max.)
continuous
writing
(ZCLV effective)

1.31 to 1.70 MB/s
continuous
reading
(ZCLV effective)

3.93 to 5.09 MB/s

7.2 ms (ZCLV)

6.3 ms (ZCLV)

4,138 rpm
(ZCLV)
4,801 rpm(ZCLV)

47,022 bytes
(logical track
capacity)

34,816 bytes
(logical track
capacity)

"

8,976

4.69 to 8.38 MB/s
(max.)

1.16 to 2.07 MB/s
continuous
writing (effective)

3.84 to 6.21 MB/s
continuous
reading (effective)

8.2 ms

3,637 rpm

2-2 C156-E205-01EN

2.1 Optical Disk Drive Specifications

Table 2.2 Specifi cati ons (2 of 2)

[MCJ3230AP]

Item Specifications

Optical disk ca rtridge 128 MB media 230 MB media 540 MB media 640 MB media 1.3 GB media 2.3 GB media
Density

Loading time (*3)
Unloading tim e (*4)
Load/unloa d lif e
Host interface
Data Transfer Mode l an d r ates

Data buffer
Error correction (*5)

24,424 bpi
(1.04µm/bit)
15,875 tpi

8 sec. (typ) 12 sec. (typ) 20 sec. (typ)

4 sec. (typ)

20,000

ATAPI (ATA/ATA PI-4 standard)

PIO Mode 4 16.6 MB/s
Multi-word DMA Mode 2 16.6 MB/s
Ultra DMA Mode 2 33.3 MB/s

7,600 KB

Correctable up to 8-byte/interlea ve
Bit error rate: 10

29,308 bpi
(0.87µm/bit)
18,275 tpi

-12

or less

52,900 bpi
(0.48µm/bit)
23,090 tpi

89,100 bpi
(0.285µm/bit)
28,200 tpi

112,474 bpi
(0.228µm/bit)
37,910 tpi

*1 The number of user tracks indicates the maximum user zone which includes

the spare area and slipping area.

*2 Mathematical average of 1,000 times of seek and does not include command

overhead nor track address recognition time. Furthermore, it may depend
on the quality of media and drive installation environment.

*3 Loading time is the time from when the optical disk cartridge is inserted to

when the optical disk drive is ready.

*4 Unloading time is the time from when th e eject bu tton is pre ssed or the eject

command is issued to when the optical disk cartridge is ejected.

-12

*5 The bit error rate must be 10

-4

or less is used.

10

or less when a disk whose raw error rate is

C156-E205-01EN 2-3

Specifications

2.1.3 Environmental and power requirements

Table 2.3 lists the environmental and power requirement s.

Table 2.3 Environmental and power requirements (1 of 2)

Item Specification

Power
requirements

Power
consumption
(Average)

Average +5 VDC±5%, 1.4 A (2.5 A Max.) (*1)

Ripple requirement 100mV P-P (DC-1 MHz)
Ready (active mode) 4.3 W (typical) (*2)
Random seek, read/ write 5.6 W (typical) (*2)
Physical Format 7.0 W (typical) (*2)
Power save mode

Dimensions
(W#D#H)

Pre-idle mode
Idle mode
Standby mode
Sleep mode

With panel
Without panel

3.8 W (typical) (*2)

1.3 W (typical) (*2)

0.7 W (typical) (*2)

0.7 W (typical) (*2)

101.6 # 150.0 # 25.4 mm

101.6 # 148.4 # 25.4 mm
Weight 480 g (with panel)
Environmental

requirements

Operating Temperature: 5 to 45°C (*3)

(gradient 15°C /h or less)
Relative humidity: 10 to 85% (Noncondensing)
Max. wet bulb temperature: 29°C or lower

Non Operating Temperature: 0 to 50°C

Relative humidity: 10 to 85% (Noncondensing)
Max. wet bulb temperature: 36°C or lower

Transport Temperature: -40 to 60°C (24 hours or less)

Temperature: -20 to 60°C (24 hours or more)
Relative humidity: 5 to 90% (Non condensing)

Max. wet bulb temperature: 41°C or lower
Installation Tilt angle -5° to +10° (*3)
Vibration/

shock

Operating 3.9 m/s2 (5 to 500 Hz, sine sweep)

1.96 m/s

Shock 19.6 m/s

Non Operating
No cartridge, power ON

9.8 m/s2 (5 to 500 Hz, sine sweep)

Shock 49 m/s

2

(5 to 500 Hz, sine sweep AV record/play)

2

(10ms, half-sine pulse)

2

(10 ms, half-sine pulse)

Transport Shock 490 m/s2 (10 ms, half-sine pulse)

Requirement: Packing conditions specified by

Fujitsu

2-4 C156-E205-01EN

2.1 Optical Disk Drive Specifications

Table 2.3 Environmental and power requirements (2 of 2)

Item Specification

Altitude Operating 3,000 m (10,000 ft) or less

Non Operating 12,000 m (40,000 ft) or less
Air flow Unused (*4)Ambient for

purity

Air purity General office environment or better

(dust perticles: Class 5 millions or less)

Note:
*1 At random seek or read/write. Excluding pulse waveform under 500 us or

less.

*2 It demonstrates in an installation environment of a temperature of 25°C,

voltage of 5 V.
See Section 4.4.8 for information on the power management function.

*3 The efficiency is specified in an environment of a temperature of 25°C and

0° horizontal level placement.

*4 For details, refer to section 3.1.3 'Air Flow'

1. Current limiter value for +5 VDC power: 5 A or less

2. Specifications under transporting condition are under the packaging specified
by Fujitsu.

3. A voltage drop may occur depending on the used power supply or power
cable.

2.1.4 Error rate

Data blocks to be accessed are evenly distributed on the disk. Errors due to disk
defects are not included.

(1) Bit error rate after ECC processing

The error rate after ECC processing must be 10
whose raw error rate is 10

(2) Positioning error ra te

The positioning error rate must be 10

-4

or less should be used.

-6

or less. (with retry)

-12

or less. An optical disk cartridge

C156-E205-01EN 2-5

Specifications

2.1.5 Reliability

(1) Mean time between failu res (MTBF)

The MTBF is 120,000 hours or more. Failure due to disk errors is not included.
Conditions

$

Power-on time: 200 hours/month or less

$

LD-on time: 20% or less of power-on time

$

Environment Temp.: 25°C

Note:

The MTBF is defined as follows:

total operating time in all fields (hours)
MTBF=
number of device failure in all fields

1) Operating time is the total time power is applied.

2) Device failures indicate that devic es requ ir e repai r, read jus t ment , or
replacement. Failure due to external factors such as minor defects during
device handling, operation outside environmental specifications, power
failure, host system errors, and interface cable errors are not included.

(2) Service Life

Under appropriate handling and operation, disk cleaning and optical head
cleaning, overhaul of the drive is not required for the first five years.

(3) Data security at power failure

Except for the data of the block to which write operation is in progress, all data on
the disk is secure from power failure. This does not apply if power failure occurs
during disk initialization (formatting) or defect processing (alternate block
allocation).

2-6 C156-E205-01EN

2.2 Optical Disk Cartridge Specifications

2.2 Optical Disk Cartridge Specifications

2.2.1 Recommended optical disk cartridge specifications

The following three disk types comply with the specifications.
Table 2.4 shows the specifications of the optical disk cartridge recommended for

this optical disk drive. The use of another disk cartridge may lower drive
performance.

Table 2.4 Recommended optical disk cartridge specifications

Model Order number Figure number

Optical disk cartridge (128 MB) 0242110 CA90002-C010
Optical disk cartridge (230 MB) 0242210 CA90002-C011
Optical disk cartridge (540 MB) 0242410 CA90002-C012
Optical disk cartridge (640 MB) 0242610 CA90002-C013
Optical disk cartridge (1.3 GB) 0242810 CA90002-C015
Optical disk cartridge (2.3 GB) 0242910 CA90002-C030
Overwrite optical disk cartridge (230 MB) 0242310 CA90002-C041
Overwrite optical disk cartridge (540 MB) 0242510 CA90002-C042
Overwrite optical disk cartridge (640 MB) 0242710 CA90002-C043

C156-E205-01EN 2-7

Specifications

2.2.2 Optical disk cartridge

Figure 2.1 shows an optical disk cartridge. The figure below shows the cartridge
with its shutter open.

$

Shutter closed

2) Shutter

1) Cartridge case

3) Write protect tab

$

Shutter open

4) Disk

5) Hub

Figure 2.1 Optical disk cartridge

2-8 C156-E205-01EN

2.2 Optical Disk Cartridge Specifications

The following explains the components of the optical disk drive shown in Figure

2.1:

1) Cartridge case
Covers the disk to protect it from damage when handled and facilita te s disk

replacement. The cartridge case is labeled and has a write protect tab.

2) Shutter
Protects the disk against dust. When the cartridge is inserted into the optical

disk drive, the shutter (metallic door) is opened.

3) Write protect tab
The write protect tab selects whether write is enabled or disabled.

4) Disk
Holds information which can be read by an optical beam.

5) Hub
The hub is placed at the center of the disk and is linked to the spindle of the

drive. The hub is used for radial centering and axial positioning.

C156-E205-01EN 2-9

Specifications

2.2.3 Disk specifications

(1) 128 MB disk

The ISO/IEC10090 defines 128 MB disk specification.

(2) 230 MB disk

The ISO/IEC13963 defines 230 MB disk specification.

(3) 540 MB/640 MB disk

The ISO/IEC15041 defines 540 MB/640 MB disk specification.

(4) 1.3 GB disk

The Cherry Book defines 1.3 GB disk specification.

(5) 2.3 GB disk

The Cherry Book 2 defines 2.3 GB disk specification.

Table 2.5 lists disk specifications.

Table 2.5 Disk specifications

Item Specification

Reliability Read cycle >10

Erase/write/read cycle >10
Load/unload cycle 25,000
Archival life (according to accele rat ion tes t resu lts) >10 years (*1)
Shelf life (according to acceleration test results) >10 years (*2)
Operating temperature 5 to 55°CEnvironmental

requirements

Operating relative humidity 3 to 85%RH (*3)
Storage temperature -20 to 55°C
Storage humidity 3 to 90% RH (*3)

8

6

*1 Archival life is the period in which recorded infor ma tion can be read.
*2 Shelf life is the period in which information to be recorded can be written.
*3 Maximum wet bulb temperature = 29°C.

Note:

Non-recommended disks must be checked for comp atibi l ity.

2-10 C156-E205-01EN

2.3 Defect Management

2.3.1 Defect management schematic diagram

Defective sectors on the disk shall be replaced by good sectors according to the
defect management scheme as follows: Defective sectors found during surface
certification are handled by a sector slipping algorithm. Defective sectors found
after initialization are handled by a linear replacement algorithm.

Figure 2.2 shows the algorithms for alternate processing.

2.3 Defect Management

(a) Sector slipping algorithm

(b) Linear replacement algorithm

Figure 2.2 Algorithms for alternate processing

The user area is divided into several groups during media initialization. Each
group contains data sectors and spare sectors. Spare sectors are used as
replacements for defective data sectors. Media initialization can include a
certification of the user area.

Figure 2.3 shows an example of alternate processing.

C156-E205-01EN 2-11

Specifications

Figure 2.3 Example of alternate processing

2-12 C156-E205-01EN

CHAPTER 3 Installation Requirements

3.1 Environmental Requirements

3.2 Mounting Requirements

3.3 Power supply Requirements

3.4 Cable Connections

3.5 Jumper Settings

3.6 Notes on Drive Handling

3.7 Mounting

3.8 Cable Connections

3.9 Operation Confirmation and Preparation for Use after Installation

3.10 Dismounting Drive

This chapter describes environmen ta l, moun ting , power supply, and connec ti on
requirements.

3.1 Environmental Requirements

The environment in which these drives are installed must comply with the ambient
environmental requirements defined in Subsection 2.1.3.

3.1.1 Temperature measurement point

When a drive is operating, the ambient temperature measured 3 cm from the base
surface of the optical disk drive and the PCA unit surface must satisfy the
environmental require men ts spec if ied in Subsec tio n 2.1.3. For the tempera ture of
each surface during operation, the contact temperature at each measurement point
shown in Figure 3.1 must satisfy the requirements specified in Subsection 3.1.2.

Low temperature burns:

on the printed circuit board unit in the optical disk drive exceed
55°C while operating. Be careful of low tenperature burns.

The surface temperatures of some ICs

C156-E205-01EN 3-1

Installation Requirements

(a) Inside optical disk cartridge

Operating of inner
partition wall

Hole for inserting thermocoup le

(b) IC (controller, read amp)

IC (controller)

Tip of thermocouple

IC (read amp)

IC (power amp)

Figure 3.1 Surface temperature measurement points

3-2 C156-E205-01EN

3.1 Environmental Requirements

3.1.2 Temperature requirements and measuring method

Table 3.1 shows the temperature requirement at each measurement point shown in
Figure 3.1.

Table 3.1 Temperature requirements at measurement points

Measurement point Maximum surface temperature

Cartridge inside 55°C (*)
IC (controller) surface 90 °C
IC (read amp.) surface 95 °C
IC (power amp.) surface 90 °C

Following procedure is for temperature measurement of inside cartridge.

1) Make a hole for the thermocouple as shown in Figure 3.1.

3.1.3 Air flow

2) Disassemble the cartridge disk.

3) Cut off a part of the partition wall for the optical media as shown in Figure

3.1. (Cut off width: 5 to 10 mm)

4) Fix the tip of the thermocouple to the cut portion of partition wall with an
adhesive agent.

5) Pass the thermocouple through the hole at the car tr idge case and asse mble th e
cartridge disk. When there is a gap between the hole and the thermocouple,
fill the gap with the adhesive agent.

Note:

The surface of the cartridge shown in Figure 3.1 has been cut away to make
the elements inside the case clearly visible. In reality the surface is not cut
away.

If the external environment temperature is higher than the specified value, the
device will automatically take an interval to respond to command, and then
take protective action to respond to the tempe ra ture incre ase.

It is recommended that this optical disk drive be installed in a fanless cabinet.
However, if the power supply is incorporated into the same cabinet, it is necessary
that it satisfy the "Temperature Conditions" in 3.1.2 and that the air flow rate
being drawn in by the device) at the cartridge loading slot be 0.3 m/s or lower.
Furthermore, if there is a system fan in a system where this drive is being installed,
the same conditions must be met.

C156-E205-01EN 3-3

Installation Requirements

3.1.4 Temperature rise under several conditions

Table 3.2 Temperature at each measuring point (Reference)

[Ambient atmospheric temperature of the optical disk drive: 45°C] (°C)

Measurement point Ready Random seek Criteria

Inside cartridge 47°C 54°C 55°C
IC (controller) surface 51°C 68°C 90°C
IC (read amp.) surface 48°C 90°C 95°C
IC (power amp.) surface 47°C 78°C 90°C
Thermal sensor 47°C 55°C

Notes:

3.1.5 Air purity

Air purity in the device environment is expressed by the number of dust particles
per unit area and must be class 5 millions (equivalent to 0.15 mg/m
(Class 5 millions: 5 millions dust particles of 0.5 um dia. or larger per cubic foot)

!

1. The above data are data estimated as they were measured where the
temperature surrounding the equipment was kept at 45 °C, using that at
25 °C. They are not the same as the data obtained from measurements
using the exclusive box in which the equipment is normally used.

2. When using the box, the ambient temperature around the equipment will
differ depending on the air circulation conditions of the box, and the
temperature rise inside the cartridge will differ because of this, so please
exercise caution.

3

) or less.

3-4 C156-E205-01EN

3.2 Mounting Requirements

3.2.1 External dimensions

Figures 3.2 to 3.3 show the dimensions of the drive and the positions of the
mounting holes.

3.2 Mounting Requirements

C156-E205-01EN 3-5

Installation Requirements

Unit: mm

Figure 3.2 Dimensions

3-6 C156-E205-01EN

3.2 Mounting Requirements

Unit: mm

Figure 3.3 Dimensions (without panel)

C156-E205-01EN 3-7

Installation Requirements

3.2.2 Installation direction

Figure 3.4 shows the permissible installation directions for this drive. The
mounting angle tolerance must be within -5 to 10 from the horizontal. (-) shows
that the insertion faces below.

"

Horizontal

"

Vertical
(Two orientations)

Disk insertion slot

Manual eject hole

Eject button / Busy LED

Figure 3.4 Installation directions

3-8 C156-E205-01EN

3.2.3 Centers of gravity

Figure 3.5 shows the centers of gravity of the drive.

3.2 Mounting Requirements

Figure 3.5 Centers of gravity

C156-E205-01EN 3-9

Installation Requirements

#

o

#

o

3.2.4 Notes on mounting

(1) Mounting frame structure and clearance

a) For vibration resistance and heat dissipation, this optical disk drive uses an

embossed structure as shown in Figure 3.6, as well as a frame which has a
construction similar to other frames which perform the same function.

b) As shown in Figure 3.6, the inward projection of the mounting screw from the

outer surface of the drive frame must not exceed 3 mm.

c) The clearance between the external surface of the drive frame and the user's

frame structure must be at least 1.5 mm.

d) The clearance between the top and bottom surfaces and the user's frame

structure must be at least 1.5 mm.

e) When mounting the optical disk drive, the screw tightening torque should be

0.4 to 0.45Nm (4 to 4.6kgcm).

f) When the optical disk drive (with panel) is mounted in a locker, there should

be no deformation of the mounting fittings provided and the optical disk
drive's panel should not be deformed. If the drive is used with the panel
deformed, ejection of the cartridge will be faulty. Check if the door will close
from any position whatever when the optical disk drive is installed.

15
r less

15
r less

Figure 3.6 Mounting frame structure

3-10 C156-E205-01EN

(2) Panel function processing

When installed in a cabinet, do not change the panel formal. The processing is
installation status and the disk insertion door can be closed from any locations.

(3) Service clearance

Figure 3.7 shows locations which must be accessed for installation and
maintenance. Be sure to leave sufficient service clearance.

P side

"

Cable connection

3.2 Mounting Requirements

R side

"

Mounting screw hole

Q side

"

Mounting screw hole

(4) External magnetic fields

Mount the optical disk drive away from powerful magnetic materials (e.g., a
speaker) to avoid influence from magnetic fields.

(5) Leak magnetic field

The VCM drive magnetic circuit may leak the magnetic field (Maximum 25 mT at
distance of 4 mm from the drive).

Do not place a device sensitive to a magnetic field near the optical
disk drive.

Figure 3.7 Service clearance

(6) External light source

Mount the optical disk drive away from strong light sources (e.g., camera flash).

C156-E205-01EN 3-11

Installation Requirements

(7) System ground

The optical disk drive should be grounded to the signal ground (SG) of the power
supply of the system. This SG line should be supplied with the system.

The Frame Ground is shorted in the optical disk drive by a metal strip attached to
the vibration isolation rubber between the frame (FG) and the base (SG).

When mounting the optical disk drive in the Device Bay 120mm (5
inch) of the PC chassis, there are two ways of choosing frames the
metal frame and the plastic (nonconducti ve mater ia l) fra me.

When using a plastic frame, there is not a short circuit between FG
of PC and FG of the optical disk drive. As a result, the static
electricity toleranc e decrea ses co mpar ed wi th me ta l frame.

It is recommended to use a metal frame to enhance the sta tic
electricity preven tion.

3.3 Power Supply Requirements

(1) Allowable input voltage and current

The DC power supply input voltage measured at the power supply connector pin
of the optical disk drive (receiving end) must satisfy the requirements in Section

2.1.3.

(2) Current waveform (reference)

Figure 3.8 shows the +5 VDC waveform at seek.

Figure 3.8 Current waveform (+5 VDC)

3-12 C156-E205-01EN

3.4 Cable Connections

2

C

C

3.4.1 Drive connectors

The optical disk drive (ODD) has connectors. Figure 3.9 shows the location of the
connectors.

"

AT interface connector (40-pin) and power supply connector (4-pin)

3.4 Cable Connections

4 pin1 pin

pin

N1

Figure 3.9 Connector and terminal locations

Power supply connector

1 +12 VDC or not connected
2 +12 VDC RETURN (GND) or not connected
3 +5 VDC RETURN (GND)
4 +5 VDC

1 pin

NH5

C156-E205-01EN 3-13

Installation Requirements

3.4.2 Cable connector specifications

Table 3.3 lists the recommended cable connector spec ifica ti ons.

Table 3.3 Cable connector specifications

Cable name Name Model name Vendor

AT interface Cable socket (Close end type) FCN-707B040-AU/B Fujitsu
cable (40-pin) Cable socket (Through-end type) FCN-707B040-AU/0 Fujitsu

Signal cable 445-248-40 SPECTRS

STRIP

Power cable Cable socket housing 1-480424-0 AMP

Contact 170121-4 AMP
Signal cable AWG18

The host interface cable must be a flat cable in terms of its overall
length. (Do not use a cable with a flat crimp terminal and loose
lines or twisted pairs.)

3.4.3 Drive connection

Figure 3.10 is a diagram showing cable connections between equipment.

Host system

ODD1

ODD2

DC power

Power

supply

Figure 3.10 Cable connection diagram

3-14 C156-E205-01EN

3.5 Jumper Settings

:

C

3

1

4

2

5

6

3.5.1 Jumper settings at factory shipping

Figure 3.11 shows jumper settings at factory shipping.

CNH5
31

5

6

42

5-6 short-circuited: Sets the master device.

3.5 Jumper Settings

Short

Figure 3.11 Jumper settings at factory shipping

3.5.2 Mode setting

(1) Setting master device mode

Figure 3.12 shows the setting for recognizing the master device (dev ice 0).

Figure 3.12 Master device setting

NH5

C156-E205-01EN 3-15

Installation Requirements

C

3

1

4

256

(2) Setting slave device mode

Figure 3.13 shows the setting for recognizing the slave device (device 1).

(3) Setting cable select mod e

Figure 3.14 shows the master device/slave device setting when the CSEL signal is
connected to the interface. In the example shown in Figure 3.15, this setting
requires a special interface connection.

NH5

Figure 3.13 Slave device setting

CNH5

5

31

6

42

Figure 3.14 Cable select mode setting

Figure 3.15 shows a cable select example using a special interface cable.
This example connects CSEL of the master device to the CSEL line (conductor) of

the cable, then grounds it so that the drive recognizes that it is the master. At this
time, the CSEL conductor of the slave device is removed and cannot be connected
to CSEL of the cable, so that the drive recognizes that it is the slave.

3-16 C156-E205-01EN

M

GND

S

O

3.5 Jumper Settings

CSEL conductor

Open

Host system

GND

Host system

aster device Slave device

Example

CSEL conductor

Example

1

pen

lave device Master device

2

Figure 3.15 Cable select examples

C156-E205-01EN 3-17

Installation Requirements

3.6 Notes on Drive Handling

(1) General notes

Note the following points to maintain drive performance and reliability:

Device damage:

1) Shock or vibration applied to the drive that exceeds the values
defined in the standard damage the drive. Use care when
unpacking.

2) Do not leave the drive in dirty or contaminated environments.

3) Since static discharge may destroy the CMOS devices in the
drive, pay attention to the following points after unpacking:

• Use an antistatic mat and wrist strap when handling the

drive.

• Hold the mounting frame when handling the drive. Do

not touch the Printed circuit board except when setting the
switches.

4) When handling the drive, hold both sides of the mounting
frame. When touching other than both sides of the mounting
frame, avoid putting force.

5) Do not forcibly push up the end of the header pin of the printed
circuit board unit when handling or setting the drive.

(2) Unpacking

a) Make sure that the UP label on the package is pointing upward and start

unpacking on a level surface. Handle the drive on a soft surface such as a
rubber mat, not on a hard surface such as a desk.

b) Use care to avoid exerting excessive pressure on the unit when removing the

cushions.

c) Use care to avoid exerting excessive pressure on the printed circuit board

surface and interface connectors when rem ovin g the drive fr om the ant is tatic
bag.

d) If the temperature differen ce between insta ll at ion locations is 10 degrees or

more, leave the drive in the new location for at least two hours befo re
unpackaging it.

3-18 C156-E205-01EN

(3) Installation

3.6 Notes on Drive Handling

a) Do not connect or disconnect the connectors or change the terminal settings

when the power is on.
b) Do not move the drive with the power on.
c) Eject the optical disk cartridge, lock the carriage securing the head, turn off

the power, then move the drive.

(4) Packing

Device damage:

inserting your cartridge for the first time. It releases the device from
transport protection and enables you to insert the cartridge.

The device may be damaged if you insert the cartridge without
releasing the protection. From the next time, you don't need to turn
on the power supply beforehand.

Before moving the drive, remove the optical disk cartridge. If the
drive is moved with the optical disk cartridge loaded in it, the head
may move back and forth in the drive to damage the head or disk
and reading the data may fail.

a) Before packing, remove the optical cartridge.
b) Store the drive in an antistatic plastic bag with desiccant (silica gel).
c) Use the same cushions and packaging supplied with the drive. If they are not

available, ensure that adequate shock absorbent material is used. In this case,

some method of protecting the printed circuit board surface and interface

connectors must be used.
d) Apply "UP" and "Handle With Care" labels to the outside of the package.
Figure 3.16 shows the single-unit packing style and the multiple-unit packing

style. (The form and material of the cushion may be changed.)

Be sure to turn on the power supply before

C156-E205-01EN 3-19

Installation Requirements

Desiccant

Conductive bag

Shipping Label (2)

Master carton
(12/24 units)

MCJ3230AP

Eject pin (use a sealing tape)

Support (Front, Rear)

Support (Middle)

Box

Eject pin (x 20)

Desiccant

Conductive bag

MCJ3230AP

Single-unit packing

(5) Transportation

a) Transport the optical disk drive packed in principle, with the UP sign upward.
b) After unpacking, minimize the transportation distance and use cushions to

(6) Storage

a) Use moistureproof packaging when storing the drive.
b) The storage environment must satisfy the requirements specified in

c) To prevent condensation, avoid sharp changes in temperature.

Multiple- un it packing

Figure 3.16 Packing style

avoid shock and vibration. Transport the drive in one of the orientations
described in Subsection 3.2.2 after unpacking. (The horizontal direction is
recommended.)

Subsection 2.1.3 when the drive is not operating.

3-20 C156-E205-01EN

3.7 Mounting

3.7.1 Checks before mounting the drive

Before mounting the optical disk drive in the system cabinet, check whether the
jumper settings are set correct ly.

3.7.2 Mounting procedure

How the drive is mounted depends on the system cabinet structure. Determine the
mounting procedure in consideration of the requirements of each system. This
section contains the general mounting procedure and check items.

See Section 3.2 for details on mounting drive.

1) Tighten four mounting screws to secure the drive in the system cabinet.

!

The drive has ten mounting holes (both sides: 3 $ 2, bottom: 4). Secure
the drive using the four mounting holes on both sides or the bottom.

3.8 Cable Connections

!

Use mounting screws whose lengths are 3 mm or less from the external
wall of the mounting frame of the drive when they are tightened. (See
Figure 3.6)

!

When mounting with screws, the screw tightening torque should be 0.4 to

0.45Nm (4 to 4.6kgfcm).

!

Be careful not to damage the parts on the PCA when mounting the drive.

2) After securing the drive, make sure that the drive does not touch the chassis of

the system cabinet. There must be at least 1.5 mm clearance between the

drive and chassis. (See Figure 3.6)

3.8 Cable Connections

Use the following cables to connect the drive to the system. See Subsection 3.4
for details on the connector positions and cable requirements.

"

Power supply cable

"

AT interface cable

"

DC ground cable (if required)
The general procedure for cable connection and notes on connecting cables are

given below. Pay attention to the insertion direction of each cable connector.

C156-E205-01EN 3-21

Installation Requirements

1) Make sure that the system power is off.

2) Do not connect or disconnect any cable when the power is on.

1) Connect the DC ground cable (only if required to decrease ground noise).

2) Connect the power cables.

3) Connect the AT interface cable.

4) After each cable connector is connected, secure the cable so that the cable
does not touch the drive or the parts on the PCA or obstruct the flow of
cooling air in the system cabinet.

3.9 Operation Confirmation and Pr eparation for Use after Installation

3.9.1 Confirming initial operations

This section provides the operation check procedures after the power is turned on.

(1) Initial operat ion when the power is tu rned on

"

When the power is turned on, the drive starts initial self-diagnosis. The LED
on the front panel is on for 1 second during initial self-diagnosis.

"

If an error is detected during initial self-diagnosis, the LED on the front panel
blinks.

"

In case of not inserted the cartridge, when the power is turned on, the eject
motor automatically turns once.

(2) Checks if errors occur at initial self-diagnosis

"

Make sure that the cables are connected correct ly.

"

Make sure that the supply voltage is correct. (Measure the voltage at the
power supply connector of the optical drive.)

"

Make sure that the settings of all termina ls are correc t.

"

If the LED on the front panel blinks continuously, an error was detected
during initial self-diagnosis. In this case, issue the REQUEST SENSE
command from the initiator (host system) to obtain sense data for error
analysis.

3-22 C156-E205-01EN

The BUSY LED is on while the optical disk drive is executing seek,
write, or read operations. The BUSY LED is on momentarily, so it
seems as if it blinked or is off.

The eject motor turns once when the power is turned on so that in
case the spindle motor position deviates due to shocks received by
the drive during transport the position is corrected to allow the
cartridge to be inserted normally. If the cartridge fails to be inserted,
remove the cartridge and turn on the drive power to turn the eject
motor once and reinsert the cartridge.

3.9.2 Connection check

When initial operation check terminates normally after the power is turned on,
check whether the drive is correctly connected by issuing command from the host
system. Checking procedure depends on the host system configuration.

If processing terminates abnorma ll y:

3.10 Dismounting Drive

a) If sense data has been obtained by the REQUEST SENSE command, analyze

the sense data. If the error is recoverable, retry the processing.

b) Check the following items for AT interface cable connection:

!

All connectors, including other devices, are connected correctly.

!

Make sure the correct cable is being used (whether it corresponds with
the cable selection mode).

c) Make sure again that the jumper settings are correct.

3.10 Dismounting Drive

How to demount an optical disk drive (for setting terminal checking, setting
change, or device replacement) depends on the system cabinet configuration.
Determine the demounting procedure in consideration of the requirements of each
system. This section describes the general demounting procedure and notes on
demounting drives.

Device damage:

off the system power. Do not remove screws securing the cables
and drive when the power is on.

Before demounting the optical disk drive, turn

1) Remove the power cable.

2) Remove the AT interface cable.

3) Remove the DC ground cable.

C156-E205-01EN 3-23

Installation Requirements

4) Remove the four screws securing the drive, then remove the drive from the
system cabinet.

5) When storing or transporting the drive, put the drive into an an tista t ic bag.
(See Section 3.6.)

3-24 C156-E205-01EN

CHAPTER 4 Host Interface

4.1 Pin Assignment

4.2 Signal Description

4.3 Interface Registers

4.4 Various Processes

4.5 ATA Commands

4.6 Packet Commands

4.7 Timing

This chapter describes host interface specification.

C156-E205-01EN 4-1

Host Interface

4.1 Pin Assignment

The table below lists pin assignments of the interface connector.

Table 4.1 Connector pin assignments (1/2)

Description PIN Signal name

Reset 1 RESET­Ground 2 Ground
Data bus bit 7 3 DD7
Data bus bit 8 4 DD8
Data bus bit 6 5 DD6
Data bus bit 9 6 DD9
Data bus bit 5 7 DD5
Data bus bit 10 8 DD10
Data bus bit 4 9 DD4
Data bus bit 11 10 DD11
Data bus bit 3 11 DD3
Data bus bit 12 12 DD12
Data bus bit 2 13 DD2
Data bus bit 13 14 DD13
Data bus bit 1 15 DD1
Data bus bit 14 16 DD14
Data bus bit 0 17 DD0
Data bus bit 15 18 DD15
Ground 19 Ground
(keypin) 20 Reserved
DMA Request 21 DMARQ
Ground 22 Ground
I/O Write

23 DIOW­Stop during Ultra DMA data bursts
Ground 24 Ground
I/O Read
DMA ready during Ultra DMA data in bursts
Data strobe during Ultra DMA data out bursts

4-2 C156-E205-01EN

STOP

25 DIOR-

HDMARDY­HSTROBE

4.1 Pin Assignment

Table 4.1 Connector pin assignments (2/2)

Ground 26 Ground
I/O Ready
DMA ready during Ultra DMA data out bursts
Data strobe during Ultra DMA data in bursts
Cable Select 28 CSEL
DMA Acknowledge 29 DMACK­Ground 30 Ground
Interrupt Request 31 INTRQ
16 Bit I/O 32 IOCS16­Device Address Bit 1 33 DA1
PASSED DIAGNOSTICS
Cable assembly type identifi er
Device Address Bit 0 35 DA0
Device Address Bit 2 36 DA2
Chip Select 0 37 CS0­Chip Select 1 38 CS1­Device Active or Slave (Device 1) Present 39 DASP-

27 IORDY

DDMARDY­DSTROBE

34 PDIAG-

CBLID-

Ground 40 Ground

C156-E205-01EN 4-3

Host Interface

4.2 Signal Description

Table 4.2 Signal description (1/2)

PIN Signal name I/O Description

1 RESET- I Reset signal
3, 5, 7, 9, 11,

13, 15, 17, 18,
16, 14, 12, 10,
8, 6, 4

21 DMARQ O Data request signal for DMA transfer
23 DIOW-

25 DIOR-

27 IORDY

DD7-0
DD15-8

STOP

HDMARDY­HSTROBE

DDMARDY­DSTROBE

I/O The low-order bus is a 8-bit bidirectional bus signal for

exchanging the status, data, and control data between
the host and ODD.
The high-order bus is used for 16-bit data transfers only.

I Write strobe sign al.

Indicates that transfer has ended at Ultra DMA transfer.

I Read strobe signal

Indicates that the host can receive Ultra DMA data at
Ultra DMA in transfer.

The ODD latches data at both edges of this signal at
Ultra data out transfer.

O This is the ready signal for the host computer. The ODD

uses this signal to request an extension of the transfer
cycle when it cannot prepare a response to a data
transfer request from the host computer in time.

Indicates that the ODD can receive Ultra DMA data at
Ultra DMA out transfer.

The host latches data at both edges of this signal at Ultra
data in transfer.

28 CSEL I Sets the ODD to the master (device 0) or slave (device

1).
Effective by jumpering.

29 DMACK- I Answer signal in response to DMARQ during DMA

transfer
31 INTRQ O Interrupt signal to the host
32 IOCS16- O Indicates that the ODD is ready for 16-bit transfer when

the host addresses the 16-bit data port during PIO

transfer.
36, 33, 35 DA2, 1, 0 O Address signal used by the host to address the ODD task

file register
34 PDIAG-

CBLID-

4-4 C156-E205-01EN

I/O Used by the slave (device 1) to notify the master (device

0) that diagnostics ended

4.2 Signal Description

Table 4.2 Signal description (2/2)

PIN Signal name I/O Description

37 CS0- O Select signal used to select the command block register
38 CS1- O Select signal used to select the control block register
39 DASP- I/O When reset, slave (device 1) output signal indicating

that the slave (device 1) exists. Otherwise, the signal
indicates that the master (device 0) and slave (device 1)
is performing mechanical operation or a failure
occurred.

2, 19, 22, 24,
26, 30, 40

Ground - Ground signal

C156-E205-01EN 4-5

Host Interface

4.3 Interface Registers

4.3.1 I/O registers

This section provides the I/O register functions and mapping. Definitions of each
register vary depending on which ATA or ATAPI commands are used.

Table 4.3 I/O port functi ons and mapping

Address signal Function

CS0- CS1- DA2 DA1 DA0 READ (DIOR-) WRITE (DIOW-)

N N x x x High impedance state Ineffective

Control block register
N A 0 x x High impedance state Ineffective
N A 1 0 x High impedance state Ineffective
N A 1 1 0 Alternate Status Device Control
N A 1 1 1 Drive Address Ineffective

Command block register
AN0 00 Data
A N 0 0 1 Error ATA Features (ATA)

ATAPI Features (ATAPI)

A N 0 1 0 Sector Count (ATA)

ATAPI Interrupt Reason

(ATAPI)
A N 0 1 1 Sector Number
A N 1 0 0 Cylinder Low (ATA)

ATAPI Byte Count (bits 0-7) (ATAPI)

A N 1 0 1 Cylinder High (ATA)

ATAPI Byte Count (bits8-15) (ATAPI)

AN1 10 Device/Head (ATA)

ATAPI Block Device Select (ATAPI)
A N 1 1 1 ATAPI Status ATA Command
A A x x x Ineffective Ineffective

Ineffective

The letter A indicates that the bit is asserted, N indicates that the bit is negated,
and X indicates that the bit is ignored.

C156-E205-01EN 4-6

4.3 Interface Register

4.3.1.1 Alternate Status register

This register contains the same information as that of the ATAPI Status register,
except that the ODD does not recognize interrupts when reading this register.
Therefore, the ODD does not clear the INTRQ signal and does not clear interrupts
during the pending.
For details of each bit, see Section 4.3.1.14.

Table 4.4 Bit definiti ons of Alternate Status register

76543210

BSY DRDY

Reserved

SERV DRQ

Reserved Reserved

CHK Read

4.3.1.2 ATA Command register

This register contains a command to be passed to the ODD. The ODD starts
executing a command immediat ely af ter the co mm and is writ ten in thi s registe r.
For executable commands and required parameters, see Table 4.38.

4.3.1.3 Data register

The data register is used for data transfer. The data width is always 16 bits.

4.3.1.4 Device Control register

This register's bits are defined as shown below.

Table 4.5 Bit defi niti ons of Device Control register

76543210

Reserved Reserved Reserved Reserved Reserved

SRST nIEN 0 Write

!

Bits 7 to 3 are reserved. The ODD ignores all value sets in these bits.

!

0 should be set for bit 0. The ODD ignores the value set in this bit.

!

SRST is a reset bit for host software.

!

nIEN is an enable bit for device interrupts to the host. When nIEN is 0 and
the device is selected, the INTRQ signal is enabled by the tri-state buffer.
When nIEN is 1 or the device is not selected, the INTRQ signal is in the high­impedance state.

C156-E205-01EN 4-7

Host Interface

4.3.1.5 Drive Address register

This register's bits are defined as shown below.

Table 4.6 Bit definitions of Drive Address register

76543210

HiZ nWTG nHS3 nHS2 NhS1 nHS0 nDS1 nDS0 Read

!

HiZ is always in the high-impedance state.

!

nWTG indicates the status of the ODD internal data write control signal
(Write Gate).

!

nHS3 indicates a binary complement of bits 3 to 0 of the drive select register.

!

nDS1 is the device select bit for device 1. It is 0 when device 1 is selected.

!

nDS0 is the device select bit for device 0. It is 0 when device 0 is selected.

4.3.1.6 ATAPI Byte Count register

This register's bits are defined as shown below.

Table 4.7 Bit defi niti ons of ATAPI Byte Count register

76543210

Byte Count (Bits 7-0) R/W

Byte Count (Bits 15-8) R/W

!

This register is used for PIO transfer only. The ODD sets the byte count to be
transferred by the host in this register and sets DRQ to 1. The ODD does not
update this register until transfer star ts.

4-8 C156-E205-01EN

4.3 Interface Register

4.3.1.7 ATAPI Block Device Select register

This register's bits are defined as shown below.

Table 4.8 Bit definiti ons of ATAPI Block Device Select register

76543210

Unused Unused Unused Dev Unused Unused R/W

!

Bits 7, 6, 5, 3, 2, 1, and 0 are not used. The ODD ignores all value sets in
these bits.

!

Dev indicates the device address. When Dev is 0, device 0 is selected and
when Dev is 1, device 1 is selected.

4.3.1.8 Error register

This register indicates the statu s of the final comm and.
The value of this register is effective when the ERR bit of the Status register is 1 at

completion of a command other than EXECUTE DEVICE DIAGNOSTIC.
The value of this register indicates the diagnostic code at power-on, reset, and

execution of the EXECUTE DEVICE DIAGNOSTIC command. For details on
diagnostic codes, see Section 4.5.3.

Table 4.9 Bit definitions of Error register

76543210

Sense Key MCR ABRT EOM ILI Read

!

For the Sense Key, see Table 4.102.

!

MCR (Media Change Requested) is not used. It is always 0.

!

ABRT (Aborted Command) indicates that the value of the ATA command
code or task file register is incorrect.

!

EOM (End of Media) is not used. It is always 0.

!

ILI (Illegal Length Indication) is not used. It is always 0.

C156-E205-01EN 4-9

Host Interface

4.3.1.9 ATA Features register

This register is used for the SET FEATURES command.

4.3.1.10 ATAPI Features register

This register's bits are defined as shown below.

Table 4.10 Bit definitions of ATAPI Features register

76543210

Reserved

!

All values in bits 7 to 2 are ignored.

!

OVERLAP is not used. The ODD ignores the value set in this bit.

OVERLAP

DMA Write

!

When DMA is 1, the ODD performs DMA transfer for data transfer.

4.3.1.11 ATA Sector Count register

This register is used for the SET FEATURES command.

4.3.1.12 ATAPI Interrupt Reason register

This register's bits are defined as shown below.

Table 4.11 Bit definitions of ATAPI Interrupt Reason register

76543210

Reserved Reserved Reserved Reserved Reserved

!

Bit 7 to 3 are reserved. It is always 0.

!

REL is not used. It is always 0.

!

I/O indicates the direction of data transfer. See Table 4.12.

REL I/O C/D Read

!

I/O indicates the type of transfer. See Table 4.12.

4-10 C156-E205-01EN

Table 4.12 I/O and C/D

I/O C/D Meaning

0 1 Packet command transfer
1 0 Data or parameter transfer (from the ODD to the host)
0 0 Data or parameter transfer (from the host to the ODD)
1 1 The completion status in the Sta tus reg ister is eff ec tiv e.

4.3.1.13 Sector Number register

This register is not used. The ODD ignores all specified values.

4.3.1.14 ATAPI Status register

4.3 Interface Register

This register indicates the status of the ODD. It is updated to reflect the current
ODD status and the progress of the current command. When the BSY bit is 0,
other bits of the register are effective and some other command block registers
may be set with significant information. When the BSY bit is 1, the other bits of
this register and all other command block registers are ineffective.

While the ODD is in sleep mode, the ATAPI Status register and all other
command block registers are ineffective.

If the host reads this register during interrupt pending, the interrupt is cleared.

Table 4.13 Bit definitions of ATAPI Status register

76543210

BSY DRDY

!

!

Reserved

SERV DRQ

Bit 5, 2, and 1 are reserved. They are always 0.
BSY (Busy) is set during command block register control. When BSY is 1,

Reserved Reserved

CHK Read

the ODD ignores all command block registers other than the Device Reset
command.

The ODD updates the DRQ and CHECK values only when BSY is 1. After the
final block of the PIO data-in command is transferred, the BSY bit setting is
canceled and the DRQ bit is cleared.

When BSY is 0, the ODD may update the SERVICE bit of the ATAPI Status
register and the Data register. The ODD does not update all other command block
registers and the ATAPI Status register bits.

C156-E205-01EN 4-11

Host Interface

The ODD sets BSY:

a) After RESET- is negated or within 400 ns of setting the SRST bit of the

Device Control Register
b) Within 400 ns of receiving a command when the DRQ bit is not set
c) Between data transfer blocks of the PIO data-in/PIO data-out command

when the DRQ bit is not set
d) After data block transfer with the PIO data-out command when the DRQ

bit is not set
e) During DMA transfer when the DRQ bit is not set

In all other cases, the ODD does not set BSY.
If BSY is set after RESET- is negated, the SRST bit is set, or a Device Reset

command is issued, it remains set until the ODD completes the internal reset
process.

!

DRDY (Device Ready) is always 1, except at the time af ter re set is ma de unti l
the next command is issued.

!

For SERV, set the same value as that of DRDY. The SERV bit should be
ignored from the standpoint of compatibility.

!

DRQ (Data Request) indicates that the ODD can transfer one byte or one
word to or from the host. When DRQ is 1, the ATAPI Interrupt Reason
register of the current packet command is effective.

!

CHK indicates that an error occurred in command processing. The Error
register contains additional information on the cause of the error. When the
ODD sets CHK to 1, the items below are not changed until a new command is
received or the ODD is reset.

"

CHK bit of the Status register

"

Error register

"

Device/Head register

4-12 C156-E205-01EN

4.4 Various Processes

4.4.1 Reset response

There are four types of resets.

!

Power-on reset

"

The ODD performs initialization such as initial diagnostics and default
setting. If any media is mounted, it also spins up media.

!

Hardware reset

"

The ODD is reset when the RESET- signal is asserted. The ODD
initializes the interface controller by setting default values.

"

UNIT ATTENTION is generated.

!

ATA software reset

4.4 Various Processes

"

The ODD is reset when the SRST bit of the Device Control register is set.

"

The device driver should not use the SRST bit to reset the ODD (except
for restore from sleep mode).

"

After ATA software reset, the ODD initializes the task file as shown
below.

Status = 00h
Error = (Depending on the SRST sequence)
Sector Count = 01h
Sector number = 01h
Cylinder Low = 14h
Cylinder High = EBh
Drive/Head = 00h

"

DRDY is set to 1 with the first command after ATA reset.

"

If ATA software reset is issued while the ODD is selected and a
command is being executed (BSY = 1 or DRQ = 1), the command is
interrupted. Otherwise, the ODD continues command processing.

"

The contents set with the MODE SELECT and Set Features commands
remain unchanged.

!

ATAPI reset

"

The ODD is reset with a DEVICE RESET command. The ODD
interrupts the current command.

C156-E205-01EN 4-13

Host Interface

4.4.2 Signature

The ODD specifies the following as signatures that indicate the support of the
PACKET command function in the task file.

The ODD sets signatures in the task file when any of the following occurs.

"

UNIT ATTENTION is not generated.

"

The contents set with the MODE SELECT and Set Feature commands

remain unchanged.

Sector Count = 01h
Sector Number = 01h
Cylinder Low = 14h
Cylinder High = EBh
Drive/Head = 00h or 10h

!

Power on reset

!

Hardware reset

!

Software reset

!

Reception of Device Reset command

!

Reception of Execute Device Diagnostic command

!

Reception of Identify Device command (command code ECh)

!

Reception of Read Sector(s) command (command code 20h)

When the Device Reset command, the Identify Device command, or the Read
Sector(s) command is received, the DEV bit is not changed.

4.4.3 Defect sector management

Sector mapping is executed based on the ISO/IEC 10090 standard for 128 MB
media, the ISO/IEC 13963 standard for 230 MB media, the ISO/IEC 15041
standard for 540 and 640 MB media, and Cherry Book for 1.3 GB media, the
Cherry Book 2 for 2.3GB media. Basically, possibly defective sector management
is not required for the host.

Defective sectors cannot be deleted from the host, except for certifying recordable
areas. Recordable areas can be certified with the FORMAT UNIT command.

4.4.4 Automatic alternate sector assignment function

The ODD automatically assigns an alternate sector if a verify error is detected in
the ID or data section during the WRITE (I0) command, or WRITE AND
VERIFY and ERASE command. Alternate sector information is registered in
SDL (Secondary Defect List) on media.

4-14 C156-E205-01EN

After automatic alternate assignment terminates successfully, the ODD does not
report any error.

4.4.5 Cache function

The ODD supports the read cache and MO write cache.
The read cache consists of the read ahead cache and the LRU cache that reads

write data remaining in the data buffe r.
The read ahead cache allows for data transfer at a near effective transfer speed

during continuous read operation without causing any delay owing to rotation
latency. LRU allows for data transfer with no mechanical operation if write and
read operations are executed frequently on the same sector.

The MO write cache writes data in batch mode during continuous write operation,
thus reducing positioning operations depending on the buffer size and recovering
the write throughput.

4.4.5.1 Data buffer

4.4 Various Processes

The ODD uses part of the buffer area as work memory for control firmware and
the remaining area as a buffer. The data buffer consists of plural segments and
contains write data of plural segments.

4.4.5.2 Read cache

The ODD enables the read ahead cache and LRU cache when the cache function is
enabled. When the read cache is enabled, the ODD contiguously pre-reads the
specified sector, then pre-reading the next sector when receiving a READ
command (called Read command in this document). While pre-reading the next
sector, the ODD transfers the data in the sector specified by the command.

When data in the sector specified by the host hits pre-read data, the ODD transfers
data directly from the buffer with out any mec hani ca l opera tion .

Pre-read stops under the following conditions:

!

!

!

Read error
When the data buffer is full (Pre-read may start again when the buffer

becomes sufficient.)
Media ejection instruction using the Eject switch

!

Power-off

!

When It is decided that the performance becomes better by stopping pre­reading and give priority to other processings.

When the cache is enabled, the buffer contains data transferred from the host with
a write command. If a read command is issued to the sector address at this time,
the ODD directly transfers data to the high-level equipment from the data buffer

C156-E205-01EN 4-15

Host Interface

without reading it from media. If the cache is hit with a read com mand, the ODD
makes the data in the hit segment being kept in the highest priority.

The data listed below cannot be stored in the read cache.

!

Data read before power-off

!

Data already stored before media is mounted

All buffer data is discarded under the following conditions:

!

Power-off

!

When media is ejected

!

When the FORMAT UNIT command is received

!

In standby mode

!

In sleep mode

Buffer data my be discarded under the following condition:

!

When the system receives the MODE SELECT and SET FEATURES
command that may change the reading mode

4.4.5.3 MO write cache

When the write cache is enabled, the ODD responds to the host with command
end. This occurs when the data transfer is done with the WRITE command or
WRITE AND VERIFY command (hereafter "Write command" in this document).

The ODD writes data kept in the buffer to media under the following conditions:

!

When the Eject switch is pressed

!

When the SYNCHRONIZE CACHE command is received

!

When the FLUSH CACHE command is received

Under the conditions given below, write data in the buffer may not be written
properly on media:

!

Power-off

!

Forced media ejection (mechanical ejection)

4.4.6 Media status notification function

The media status notification function notifies the host of various information on
the removable media device. The function is enabled or disabled with the SET
FEATURES command.

When the media status notification function is enab led, the functions bel ow will be
added or changed.

4-16 C156-E205-01EN

!

The GET MEDIA STATUS command is enabled.

!

The Eject switch is disabled.

The media status notification function is disabled at power-on reset, software reset,
when the DEVICE RESET command is received, or when the EXECUTE
DEVICE DIAGNOSTIC command is received.

4.4.7 Power management function

The ODD provides the power management function that minimizes the power
consumed. For this function, the ODD has some control commands and a timer.
The host uses the functions below to control the power management function.

1) Standby timer

2) Idle Immediate command

3) Sleep command

4) Standby Immediate command

4.4 Various Processes

4.4.7.1 Power mode

The ODD supports power modes shown below. The ODD uses a power mode
equivalent to standby mode, except that the DRDY bit is 0 while media is not
mounted.

!

Active mode

!

Pre-idle mode

!

Idle mode

!

Standby mode

!

Sleep mode

4.4.7.2 Active mode

In active mode, all circuits are enabled. The ODD requires the shortest time to
start processing a command.

4.4.7.3 Pre-idle mode

In pre-idle mode, the read/write circuits stop. The ODD can receive a command
from the host, but since some circuits stop, the command requires 20 ms to access
media.

The ODD automatically enters pre-idle mode if no command is issued within a
specified time (0.5 second) in active mode. When it receives an access command,
the ODD automatically enters active mode. The pre-idle mode cannot be
controlled from the host computer.

C156-E205-01EN 4-17

Host Interface

4.4.7.4 Idle mode

In idle mode, the servo and read/write circuits stop. The ODD can receive a
command from the host, but because some circuits stop, the ODD takes 1 s
seconds (standard) to access media.

If no command is issued within a specified time (180 s) in active mode, the ODD
automatically enters pre-idle mode, then enters idle mode. When it receives an
access command, the ODD automatically returns active mode. The Idle
Immediate command can shift the ODD from active mode or standby mode to idle
mode.

4.4.7.5 Standby mode

In standby mode, the spindle motor stops. The ODD can receive a command from
the host, but since the spindle motor stops, the reco very to acc ess med ia tak es 5 s
(standard).

The ODD automatically enters standby mode from active mode if no command is
issued within a specified time when the standby timer is enabled. When it receives
a command, the ODD automatically returns active mode. The Standby Immediate
command can also directly shift the ODD from active or idle mode to standby
mode.

4.4.7.6 Sleep mode

Sleep mode uses power consumption as standby mode. To set the ODD in sleep
mode, the host must issue the Sleep command. To restore the ODD from sleep
mode, hardware reset or software reset is required. The host must not issue any
command after the Sleep command. The ODD requires 15 s (standard) to respond.

4.4.7.7 Standby timer

The standby timer is used to count the time during which the host issues no
command.

The standby timer value is programmable with the Power Condition Page of the
MODE SELECT command. The default value is 32 minutes (including the
transition time to idle mode).

4-18 C156-E205-01EN

4.4.7.8 Power mode transition

(

(

The power mode transits as shown in Figure 4.1.

4.4 Various Processes

Media is

inserted.

(1)

(4)

Active

(4)

(3)

Reset

5)

(2)

Standby

Media is ejected.

(3)

(5)

5)

Sleep

(1) The ODD enters idle mode because it receives the Idle Immediate command

or because it receives no commands within a specified time.
(2) The ODD enters idle mode with the Idle Immediate command.
(3) The ODD enters standby mode with the Standby Immediate command and

standby timer.
(4) The ODD enters active mode because it receives a media access command.
(5) The ODD enters sleep mode with the Sleep command.

Figure 4.1 Power mode

4.4.8 Unsupported functions

The ODD does not support the following functions which are covered by the
ATA/ATAPI-5 standard.

!

Overlapped feature set

!

Queued feature set

!

Advance Power Management feature set

!

Security Mode feature set

!

Power-Up In Standby feature set

C156-E205-01EN 4-19

Host Interface

The ODD also does not support the following functions which are not supported
by ATAPI devices.

!

SMART feature set

!

Host Protected Area feature set

4.4.9 LED Indications

The ODD notifies the operator of a serious error by turning on or blinking the
LED lamp. Table 4.16 lists indication modes and operation.

Table 4.16 LED indications

LED blink cycle Operation

Off Command wait state
On Command processing

Seek operation

Blinking (on for 0.1 second and off
for 0.7 seconds repeatedly)

Blinking (on for 0.1 second and off
for 0.1 second repeatedly)

Blinking (on for 0.4 seconds and off
for 0.4 seconds repeatedly)

Blinking (on for 0.1 second and off
for 0.3 seconds repeatedly)

*1 The ODD control firmware is stored on the flash ROM and can be

downloaded from the host with the WRITE BUFFER command. However,
if any problem occurs during downloading, such as power failure,
downloading is interrupted and the microcodes in the control firmware may
be damaged. To download microcode data again in such a case, the ODD
starts the emergency download firmware that simply supports only the
WRITE BUFFER command and other basic commands.

Read/write processing (including cache processing)
Formatting
Power-on diagnostics
Spinning up (Including return from standby mode)
Spinning down (Including shifting to standby mode )
Starting the download only firmware (*1)

A power-on diagnostics error occurred.

A thermal alarm occurred.

An error occurred during writing to the WRITE cache (*2)

*2 The blinking of the LED for the error during writing to the WRITE cache is

cancelled by ejecting the media.

4-20 C156-E205-01EN

4.5 ATA Commands

4.5 ATA Commands

Table 4.17 lists supported ATA commands.
This section represents ODD registers as shown below.

Cylinders High/Low registers: CY

Sector register: SC

Device/Head register: DH

Sector Number register: SN

Features register: FR

Table 4.17 Command codes and parameters

Protocol Command name Command Parameters used Section

code

ND CHECK POWER MODE E5h y D 4.5.1
ND DEVICE RESET 08h D 4.5.2
ND EXECUTE DEVICE

DIAGNOSTIC
ND FLUSH CACHE E7h yyyD4.5.4
ND GET MEDIA STATUS DAh D 4.5.5
PI IDENTIFY PACKET DEVICE A1h D 4.5.6
ND IDLE IMMEDIATE E1h D 4.5.7
ND NOP 00h y 4.5.8

"

ND SET FEATURES EFh y y D 4.5.10
ND SLEEP E6h D 4.5.11
ND STANDBY IMMEDIATE E0h D 4.5.12

""

PACKET A0h yyyyD4.5.9

RESERVED: Other codes

90h D* 4.5.3

FR SC SN CY DH

Notes:

1. y - This register contains parameters effective to run the command.
D - Indicates that only the Device parameter is effective and the LUN

parameter is ineffective.

D* - Device 0 is addressed, but both devices execute the command.

2. The protocol above indicates the command protocol used.

C156-E205-01EN 4-21

Host Interface

ND - A non data command
PI - A PIO data-in command

4.5.1 CHECK POWER MODE (E5h)

Table 4.18 CHECK POWER MODE command

Bit

76543210

CM11100101

DHXXXDEVXXXX

CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX

The CHECK POWER MODE command sets the ODD power mode status in the
SC register, then notifies the host of the value in Table 4.19 When the drive is in
sleep mode, the interface is inactive and the ODD cannot receive this command.

Table 4.19 Power mode indication

Power mode status SC register

Standby mode 00h
Entering standby mode 00h
Returning from standby mode 00h
Idle mode 80h
Pre-idle mode FFh
Active mode FFh

4-22 C156-E205-01EN

4.5 ATA Commands

4.5.2 DEVICE RESET (08h)

Table 4.20 DEVICE RESET command

Bit

76543210
CM00001000
DHXXXDEVXXXX
CHXXXXXXXX

CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX

The DEVICE RESET command resets the ODD.
When the ODD receives the DEVICE RESET command, it sets the BSY bit to 1.

After reset is completed, the ODD sets the BUSY bit to 0. INTRQ is not asserted.

4.5.3 EXECUTE DEVICE DIAGNOSTIC (90h)

Table 4.21 EXECUTE DEVICE DIAGNOSTIC command

Bit

76543210
CM10010000
DHXXXXXXXX
CHXXXXXXXX

CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX

When the ODD receives this command, it recognizes self-diagnostics.

C156-E205-01EN 4-23

Host Interface

When no device 1 is connected

When device 1 is connected

When the ODD is device 1

When the ODD receives this command, it responds to the command regardless of
the DEV bit value; this means that the drive is unit 0 or 1.

When the ODD is device 0 (master), its response after the command is received
depends on whether device 1 (slave) is connected.

The ODD sets 01h in the Error register and terminates the command.

The ODD monitors the PDIAG- signal sent from device 1 for six seconds. If
device 1 asserts the PDIAG- signal within this time, the ODD recognizes that the
device 1 self-diagnostic test ends successfully. Otherwise, the ODD recognizes
that the device 1 self-diagnostic test ended abnormally and the ODD makes OR­operation to its self-diagnostics results of unit 0 (Device 0) with 80h and sets it in
the Error register. If device 1 ends abnormally, the ODD sets the CHECK bit of
the Status register.

The ODD asserts the PDIAG- signal within five seconds. It sets 01h in the Error
register and ends the command.

Table 4.22 Self-diagnosis detailed code

Detailed code Meaning

01h Normally end
02h-7Fh Hardware error

(For power-on and hardware reset only)

8xh Device 1 ended abnormally. (For device 0 only)

4-24 C156-E205-01EN

4.5 ATA Commands

4.5.4 FLUSH CACHE (E7h)

Table 4.23 FLUSH CACHE command

Bit

76543210
CM11100111
DHXXXDEVXXXX
CHXXXXXXXX

CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX

The FLUSH CACHE command writes unwritten data in the cache memory in the
data buffer to the media.

4.5.5 GET MEDIA STATUS (DAh)

Table 4.24 GET MEDIA STATUS command

Bit

76543210
CM11011010
DHXXXDEVXXXX
CHXXXXXXXX

CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX

The GET MEDIA STATUS command respond with the ODD status.
The command ends abnormally in either of the conditions given below and sets the

value shown in Table 4.25 in the Error register.

!

When no media is inserted

!

When media is exchanged

C156-E205-01EN 4-25

Host Interface

!

When the Eject switch is pressed

!

When media is write-protected

Otherwise, the command ends normally. If a hardware error by which the
command cannot be executed occurs, as is the case with other commands, the
command ends with Aborted Command.

Table 4.25 Error register

Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0

0WPMC0MCR0NM0

WP: Set to 1 when write-protected.
MC: Set to 1 when media is exchanged. Reported only once.
MCR: Set to 1 when the Eject switch is pressed. Reported only once.
NM: Set to 1 when no media is inserted.
If this command is received while the media status not if ica tion funct ion is

disabled, this command responds with the ODD status assuming that the media
status notification function is enabled. Subsequently, this command operates
assuming that the media status notification function is enabled until it is set to
disabled.

4.5.6 IDENTIFY PACKET DEVICE (A1h)

Table 4.26 IDENTIFY PACKET DEVICE command

Bit

76543210

CM10100001

DHXXXDEVXXXX

CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX

When the ODD receives this command, it transfers device parameter information
to the host. It accepts this command even if in standby mode.

Table 4.27 lists the transfer data format. The reserved word indicates a value of 0.

4-26 C156-E205-01EN

The transfer byte length is 512 bytes.
One-word information uses DD15 as MSB (Most Significant Bit) and DD0 as

LSB (Least Significant Bit).
For ASCII character information such as base serial number, firmware version

number, and product number, the first character code in the string uses word 1,
DD15 to 8; the second character code uses word 1, DD7 to 0; the third character
code uses word 2, DD15 to 8; and so on.

Table 4.27 Device parameter information (1/6)

Word Value Bits Description

0 80C0h General configuration information

15-14 Protocol type (10b = ATAPI device)

13 Reserved

12-8 Device type 00000b = Direct access unit

4.5 ATA Commands

7 Replaceable media device 1b
6-5 CMD DRQ type (10b = Accelerated DRQ)
4-2 Reserved
1-0 Command packet size (B'00' = 12 bytes)

1-9 0000h Reserved

10-19 "xxx...xxx" Base serial number

(Left justified, ASCII codes)
20-22 0000h Reserved
23-26 "aaab" Firmware version number

aaa: Major level version number (000 - 999)

b: Minor level version number (0 - 9, a - z, and A - Z)

(Left justified, ASCII codes, blank indicating space character)
27-46 “FUJITSU

MCJ3230AP”

Product number

(Left justified, ASCII codes, blank indicating space character)
47-48 0000h Reserved

49 0F00h 15 Interleave DMA transfer supported (0b)

14 Command queing supported (0b)
13 Overlap function supported (0b)
12 Reserved (0b)
11 IORDY supported (1b)
10 IORDY can be disabled (1b)

9 LBA mode supported (1b)
8 DMA transfer mode supported (1b)

7-0 Unused (0b)

C156-E205-01EN 4-27

Host Interface

Table 4.27 Device parameter information (2/6)

Word Value Bits Description

50 0000h Reserved
51 0200h 15-8 PIO data transfer cycle timing mode

7-0 Reserved
52 0000h 15-0 Reserved
53 0007h 15-3

Reserved

2

Information in word 88 is valid. (1b)

1

Information in words 64 to 70 is valid. (1b)

0

Information in words 54 to 58 is valid. (1b)

54-62 0000h Reserved

63 0407h 15-11Reserved (0b)

(Default value) 10 Multiword DMA transfer mode 2 is selected.

9 Multiword DMA transfer mode 1 is selected.
8 Multiword DMA transfer mode 0 is selected.

7-3 Reserved (0b)

2 Multiword DMA transfer modes 2 to1 are supported.(1b)
1 Multiword DMA transfer modes 1 and 0 are supported.(1b)
0 Multiword DMA transfer modes 0 is supported.(1b)

64 0003h 15-2 Reserved (0b)

1 PIO transfer modes 4 and under are supported.(1b)

0 PIO transfer modes 3 and under are supported.(1b)
65 0078h (120) Minimum multiword DMA transfer time per word (ns)
66 0078h (120) Recommended multiword DMA transfer time (ns)
67 0078h (120) Minimum PIO transfer cycle time when flow control is disabled

(ns)

68 0078h (120) Minimum PIO transfer cycle time when flow control using

IORDY is enabled (ns)

69-70 0000h Reserved

71 07D0h (2000) Required time after the PACKET command is received until the

bus is released (#s) (Typical)

72 0000h (0000) Required time after the SERVICE command is received until

BSY is cleared (#s) (Typical)

73-79 0000h Reserved

4-28 C156-E205-01EN