C156-E142-02EN
MCE3130AP, MCE3064AP,
MCF3064AP
OPTICAL DISK DRIVES
PRODUCT MANUAL
The contents of this manual is subject to change without prior notice.
All Rights Reserved. Copyright ! 2001 FUJITSU LIMITED
REVISION RECORD
Edition Date published Revised contents
01 February, 2000
02 March, 2001
Specification No. : C156-E142-**EN
C156-E142-02EN i
PREFACE
This manual describes the MCE3130AP, MCE3064AP and MCF3064AP 90mm(3.5-inch) optical disk
drives.
This manual explains the specifications of the above optical disk drive (ODD) and function of the ATAPI
that interfaces to the user's system.
The manual is intended for users who have a basic understanding of optical disk drives and their use in
computer systems.
See "Manual Organization" for details on the organization of manuals related to the optical disk drives and
the scope of this manual. Use the other manuals shown in "Manual Organization" as well as this manual if
necessary.
This manual is organized as follows:
Chapter 1 GENERAL DESCRIPTION
This chapter introduces the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives and describes
their standard features, system configuration, and drive configuration.
Chapter 2 SPECIFICATIONS
This chapter describes the specifications of the MCE3130AP, MCE3064AP and MCF3064AP optical disk
drives, ATAPI function specifications, and optical disk cartridge specifications.
Chapter 3 INSTALLATION REQUIREMENTS
This chapter describes basic installation requirements (environment, mounting, power supply, and
connection) for the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives.
Chapter 4 HOST INTERFACE
This chapter describes host interface of the MCE3130AP, MCE3064AP and MCF3064AP optical disk
drives.
Chapter 5 OPERATION AND CLEANING
This chapter describes the operation and cleaning of the MCE3130AP, MCE3064AP and MCF3064AP
optical disk drives, outlines optical disk cartridges, and describes how to clean the cartridges.
Chapter 6 DIAGNOSIS AND MAINTENANCE
This chapter describes the self-diagnostic functions and maintenance of the MCE3130AP, MCE3064AP
and MCF3064AP optical disk drives.
C156-E142-02EN iii
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert message consists of an
alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a
signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation likely to result in serious personal
injury if the user does not perform the procedure correctly.
This indicates a hazardous situation could result in personal injury if the
user does not perform the procedure correctly.
This indicates a hazardous situation could result in minor or moderate
personal injury if the user does not perform the procedure correctly. This
alert signal also indicates that damages to the product or other property,
may occur if the user does not perform the procedure correctly.
This indicates information that could help the user use the product more
efficiently.
In the text, the alert signal is centered, followed below by the indented message. A wider line space
precedes and follows the alert message to show where the alert message begins and ends. The following is
an example:
(Example)
Before moving the drive, remove the optical disk cartridge to avoid
head or disk damage
The main alert messages in the text are also listed in the “Important Alert Items.”
iv C156-E142-02EN
DISCLAIMER
Failure of the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives are defined as a failure
requiring adjustment, repair, or replacement. Fujitsu is not responsible for failure due to misuse, operation
outside the specified environment conditions, power line trouble, controller problems, cable failure, or other
failure not caused by the optical disk drive itself.
C156-E142-02EN v
Important Alert Items
Important Alert Messages
The important alert messages in this manual are as follows:
A hazardous situation could result in minor or moderate personal injury if the
user does not perform the procedure correctly. This alert signal also indicates
that damages to the product or other property, may occur if the user does not
perform the procedure correctly.
Task Alert message Page
Operation
Installation
Low temperature burns
The surface temperatures of some ICs on the printed circuit board
unit in the optical disk drive exceed 55°C while operating. Be
careful of low tenperature burns.
Device damage
1) Shock or vibration applied to the drive that exceeds the values
defined in the standard damage the drive. Use care when
unpacking.
2) Do not leave the drive in dirty or contaminated environments.
3) Since static discharge may destroy the CMOS devices in the
drive, pay attention to the following points after unpacking:
• Use an antistatic mat and wrist strap when handling the
drive.
• Hold the mounting frame when handling the drive. Do
not touch the PCA except when setting the switches.
4) When handling the drive, hold both sides of the mounting
frame. When touching other than both sides of the mounting
frame, avoid putting force.
5) Do not forcibly push up the end of the header pin of the printed
circuit board unit when handling or setting the drive.
3-1
3-17
vi C156-E142-02EN
Task Alert message Page
Installation
Cleaning cartridge Device Damage
Device Damage
Be sure to turn on the power supply before inserting your cartridge
for the first time. It releases the device from transport protection
and enables you to insert the cartridge.
The device may be damaged if you insert the cartridge without
releasing the protection. From the next time, you don’t need to
turn on the power supply beforehand.
Before moving the drive, remove the optical disk cartridge. If the
drive is moved with the optical disk cartridge loaded in it, the head
may move back and forth in the drive to damage the head or disk
and reading the data may fail.
1) Make sure that the system power is off.
2) Do not connect or disconnect any cable when the power is on.
Device Damage
Before demounting the optical disk drive, turn off the system power.
Do not remove screws securing the cables and drive when the
power is on.
Be sure to use the dedicated head cleaner described above.
Damage for disk medium
Use the cleaning solution and cleaning cloth specified in Table 5.2.
If other than the specified items is used, disk media surface may be
damaged.
3-18
3-20
3-22
5-6
5-10
Damage for date medium
Do not use this cleaning kit for the floppy disk or the optical disk
cartridge used for other optical disk drive.
Damage for disk medium
Clean the cartridge at clean place. Put a disposable groves at
cleaning so that the fingerprint does not put on the disk media
(recommendation).
Damage for disk medium
At setting the cartridge to the setting case, do not apply the heavy
shock and push hardly.
Eye inflammation
In case of contact with eyes, immediately flush eyes with water.
Maintenance and Repair Data loss
In case of regular repair, the optical disk cartridge should not be
attached except where the cartridge causes the error. And before
having the drive repaired, save the data in the cartridge. Fujitsu is
not responsible for data last during maintenance or repair.
5-11
5-12
6-3
C156-E142-02EN vii
MANUAL ORGANIZATION
MCE3130AP,
MCE3064AP and MCF3064AP
OPTICAL DISK DRIVE
PRODUCT MANUAL
(C156-E142)
<This manual>
MCE3130AP,
MCE3064AP and MCF3064AP
OPTICAL DISK DRIVE
MAINTENANCE MANUAL
• GENERAL DESCRIPTION
• SPECIFICATIONS
• INSTALLATION REQUIREMENTS
• HOST INTERFACE
• OPERATION AND CLEANING
• DIAGNOSIS AND MAINTENANCE
• MAINTENANCE AND DIAGNOSIS
• FAULT ANALYSIS
• REMOVAL AND REPLACEMENT PROCEDURES
• PRINCIPLES OF OPERATION
•CLEANING
viii C156-E142-02EN
REFERENCED STANDARDS
Item Number Name Organization
1 X3T13/1321D
Revision 2
2 SFF-8070I
Revision 1.2
3 ISO/IEC 10090 90 mm optical disk cartridges, rewritable
4 ISO/IEC 13963 Data interchange on 90 mm optical disk
5 ISO/IEC 15041 Data interchange on 90 mm optical disk
6 Cherry Book
Version 1.0
*Note: ISO = International Organization for Standardization
IEC = International Electrical Commission
JTC1 = Joint Technical Committee 1
AT Attachment with Packet Interface-5
(ATA/ATAPI-5)
ATAPI Removable Rewritable Media Small Form Factor
and read only, for data interchange
cartridges,
– Capacity: 230 megabytes per cartridge
cartridges,
– Capacity: 640 megabytes per cartridge
GIGAMO 1.3 GB 90 mm Magneto-
Optical Disk System
American National
Standards Institute
(ANSI)
Committee (SFF)
ISO/IEC
ISO/IEC
ISO/IEC JTC1*
FUJITSU LIMITED
SONY
CORPORATION
C156-E142-02EN ix
CONTENTS
page
CHAPTER 1 GENERAL DESCRIPTION................................................................................ 1 - 1
1.1 Features................................................................................................................................. 1 - 1
1.1.1 Performance .......................................................................................................................... 1 - 2
1.1.2 Reliability.............................................................................................................................. 1 - 3
1.1.3 Maintainability/operability.................................................................................................... 1 - 3
1.1.4 Adaptability........................................................................................................................... 1 - 3
1.1.5 Interface ................................................................................................................................1 - 4
1.2 Drive Configuration .............................................................................................................. 1 - 6
1.2.1 Drive model ..........................................................................................................................1 - 6
1.2.2 Configuration ........................................................................................................................1 - 7
1.2.3 Mechanical sections .............................................................................................................. 1 - 7
1.2.4 Control circuit section........................................................................................................... 1 - 8
1.3 System Configuration............................................................................................................ 1 - 10
CHAPTER 2 SPECIFICATIONS ..............................................................................................2 - 1
2.1 Optical Disk Drive Specifications......................................................................................... 2 - 1
2.1.1 Model and product number ...................................................................................................2 - 1
2.1.2 Drive specifications............................................................................................................... 2 - 3
2.1.3 Environmental and power requirements................................................................................ 2 - 7
2.1.4 Error rate ...............................................................................................................................2 - 8
2.1.5 Reliability.............................................................................................................................. 2 - 9
2.2 Optical Disk Cartridge Specifications................................................................................... 2 - 10
2.2.1 Recommended optical disk cartridge specifications..............................................................2 - 10
2.2.2 Optical disk cartridge ............................................................................................................ 2 - 11
2.2.3 Disk specifications ................................................................................................................ 2 - 13
2.3 Defect Management .............................................................................................................. 2 - 14
2.3.1 Defect management schematic diagram................................................................................ 2 - 14
CHAPTER 3 INSTALLATION REQUIREMENTS ................................................................3 - 1
3.1 Environmental Requirements................................................................................................ 3 - 1
3.1.1 Temperature measurement point........................................................................................... 3 - 1
3.1.2 Temperature requirements and measuring method................................................................3 - 3
C156-E142-02EN xi
3.1.3 Air flow................................................................................................................................. 3 - 3
3.1.4 Temperature rise under several conditions............................................................................ 3 - 4
3.1.5 Air purity............................................................................................................................... 3 - 4
3.2 Mounting Requirements........................................................................................................3 - 5
3.2.1 External dimensions.............................................................................................................. 3 - 5
3.2.2 Installation direction .............................................................................................................3 - 7
3.2.3 Centers of gravity.................................................................................................................. 3 - 8
3.2.4 Notes on mounting................................................................................................................ 3 - 9
3.3 Power Supply Requirements ................................................................................................. 3 - 11
3.4 Cable Connections ................................................................................................................ 3 - 12
3.4.1 Drive connectors ................................................................................................................... 3 - 12
3.4.2 Cable connector specifications.............................................................................................. 3 - 13
3.4.3 Drive connection................................................................................................................... 3 - 13
3.5 Jumper Settings..................................................................................................................... 3 - 14
3.5.1 Jumper settings at factory shipping .......................................................................................3 - 14
3.5.2 Mode setting.......................................................................................................................... 3 - 14
3.6 Notes on Drive Handling ......................................................................................................3 - 17
3.7 Mounting............................................................................................................................... 3 - 20
3.7.1 Checks before mounting the drive......................................................................................... 3 - 20
3.7.2 Mounting procedure.............................................................................................................. 3 - 20
3.8 Cable Connections ................................................................................................................ 3 - 20
3.9 Operation Confirmation and Preparation for Use after Installation ......................................3 - 21
3.9.1 Confirming initial operations ................................................................................................3 - 21
3.9.2 Connection check.................................................................................................................. 3 - 22
3.10 Dismounting Drive................................................................................................................ 3 - 22
CHAPTER 4 HOST INTERFACE............................................................................................. 4 - 1
4.1 Pin Assignment .....................................................................................................................4 - 2
4.2 Signal Description................................................................................................................. 4 - 4
4.3 Interface Registers.................................................................................................................4 - 5
4.3.1 I/O registers........................................................................................................................... 4 - 5
4.3.1.1 Alternate Status register ........................................................................................................ 4 - 6
4.3.1.2 ATA Command register........................................................................................................ 4 - 6
4.3.1.3 Data register..........................................................................................................................4 - 6
4.3.1.4 Device Control register ......................................................................................................... 4 - 6
4.3.1.5 Drive Address register...........................................................................................................4 - 7
C156-E142-02ENxii
4.3.1.6 ATAPI Byte Count register................................................................................................... 4 - 7
4.3.1.7 ATAPI Block Device Select register ....................................................................................4 - 8
4.3.1.8 Error register......................................................................................................................... 4 - 8
4.3.1.9 ATA Features register........................................................................................................... 4 - 9
4.3.1.10 ATAPI Features register ....................................................................................................... 4 - 9
4.3.1.11 ATA Sector Count register....................................................................................................4 - 9
4.3.1.12 ATAPI Interrupt Reason register ..........................................................................................4 - 9
4.3.1.13 Sector Number register ......................................................................................................... 4 - 10
4.3.1.14 ATAPI Status register ........................................................................................................... 4 - 10
4.4 Various Processes .................................................................................................................4 - 12
4.4.1 Reset response....................................................................................................................... 4 - 12
4.4.2 Defect sector management ....................................................................................................4 - 13
4.4.3 Automatic alternate sector assignment function.................................................................... 4 - 13
4.4.4 Data error detection criteria ..................................................................................................4 - 14
4.4.5 Cache function ......................................................................................................................4 - 15
4.4.5.1 Data buffer ............................................................................................................................ 4 - 15
4.4.5.2 Read cache ............................................................................................................................ 4 - 15
4.4.5.3 MO write cache.................................................................................................................... 4 - 16
4.4.6 Media status notification function.........................................................................................4 - 17
4.4.7 Power management function ................................................................................................. 4 - 17
4.4.7.1 Power mode ..........................................................................................................................4 - 18
4.4.7.2 Active mode ..........................................................................................................................4 - 18
4.4.7.3 Pre-idle mode........................................................................................................................ 4 - 18
4.4.7.4 Idle mode .............................................................................................................................. 4 - 18
4.4.7.5 Standby mode........................................................................................................................ 4 - 18
4.4.7.6 Sleep mode............................................................................................................................4 - 19
4.4.7.7 Standby timer ........................................................................................................................4 - 19
4.4.7.8 Power mode transition...........................................................................................................4 - 19
4.4.8 LED Indications ....................................................................................................................4 - 20
4.5 ATA Commands ...................................................................................................................4 - 21
4.5.1 IDENTIFY PACKET DEVICE (X'A1') ...............................................................................4 - 22
4.5.2 PACKET (X'A0') .................................................................................................................. 4 - 27
4.5.3 DEVICE RESET (X'80').......................................................................................................4 - 28
4.5.4 CHECK POWER MODE (X'98'/X'E5')................................................................................ 4 - 28
4.5.5 EXECUTE DEVICE DIAGNOSTIC (X'90')........................................................................ 4 - 29
4.5.6 GET MEDIA STATUS (X'DA') ...........................................................................................4 - 30
C156-E142-02EN xiii
4.5.7 IDLE IMMEDIATE (X'95'/X'E1')........................................................................................ 4 - 31
4.5.8 NOP (X'00')...........................................................................................................................4 - 32
4.5.9 SERVICE (X'A2') (Not supported)....................................................................................... 4 - 32
4.5.10 SET FEATURES (X'EF')......................................................................................................4 - 33
4.5.11 SLEEP (X'99'/X'E6') ............................................................................................................. 4 - 35
4.5.12 STANDBY IMMEDIATE (X'94'/X'E0') .............................................................................. 4 - 36
4.6 Packet Commands................................................................................................................. 4 - 37
4.6.1 Logical Unit Number ............................................................................................................4 - 38
4.6.2 ERASE command ................................................................................................................. 4 - 38
4.6.3 FORMAT UNIT command................................................................................................... 4 - 39
4.6.4 INQUIRY command ............................................................................................................. 4 - 40
4.6.5 MODE SELECT command................................................................................................... 4 - 42
4.6.5.1 Drive operation mode page ................................................................................................... 4 - 44
4.6.5.2 Read-Write error recovery page............................................................................................ 4 - 45
4.6.5.3 Flexible disk page .................................................................................................................4 - 47
4.6.5.4 Caching page......................................................................................................................... 4 - 49
4.6.5.5 Removable block access capabilities page............................................................................ 4 - 50
4.6.5.6 Timer & protect page............................................................................................................ 4 - 51
4.6.6 MODE SENSE command ..................................................................................................... 4 - 53
4.6.7 PREVENT/ALLOW MEDIUM REMOVAL command....................................................... 4 - 55
4.6.8 READ (10) command ...........................................................................................................4 - 56
4.6.9 READ (12) command ...........................................................................................................4 - 56
4.6.10 READ CAPACITY command .............................................................................................. 4 - 57
4.6.11 READ FORMAT CAPACITIES command.......................................................................... 4 - 58
4.6.12 READ DEFECT DATA command ....................................................................................... 4 - 59
4.6.13 READ LONG command ....................................................................................................... 4 - 61
4.6.14 RECEIVE DIAGNOSTIC RESULTS command.................................................................. 4 - 61
4.6.15 REQUEST SENSE command............................................................................................... 4 - 62
4.6.16 SEND DIAGNOSTIC command ..........................................................................................4 - 66
4.6.17 SEEK command.................................................................................................................... 4 - 67
4.6.18 START/STOP UNIT command............................................................................................ 4 - 67
4.6.19 SYNCHRONIZE CACHE command.................................................................................... 4 - 68
4.6.20 TEST UNIT READY command ........................................................................................... 4 - 69
4.6.21 VERIFY command................................................................................................................4 - 69
4.6.22 WRITE (10) command..........................................................................................................4 - 70
4.6.23 WRITE (12) command..........................................................................................................4 - 70
C156-E142-02ENxiv
4.6.24 WRITE AND VERIFY command ........................................................................................4 - 71
4.6.25 WRITE BUFFER command ................................................................................................. 4 - 72
4.6.26 WRITE LONG command ..................................................................................................... 4 - 74
4.7 Timing................................................................................................................................... 4 - 75
4.7.1 Register/PIO data transfer timing..........................................................................................4 - 75
4.7.2 Multiword DMA data transfer timing ...................................................................................4 - 77
4.7.3 Power-on and Reset Timing..................................................................................................4 - 79
CHAPTER 5 OPERATION AND CLEANING ........................................................................ 5 - 1
5.1 Operating Optical Disk Drive ............................................................................................... 5 - 1
5.1.1 Optical disk drive.................................................................................................................. 5 - 1
5.1.2 Note....................................................................................................................................... 5 - 2
5.1.3 Inserting cartridge ................................................................................................................. 5 - 2
5.1.4 Ejecting (removing) cartridge ............................................................................................... 5 - 4
5.2 Cleaning Drive...................................................................................................................... 5 - 6
5.3 Optical Disk Cartridge Operation ......................................................................................... 5 - 7
5.3.1 Optical disk cartridge ............................................................................................................ 5 - 7
5.3.2 Write protect tab ...................................................................................................................5 - 8
5.3.3 Notes ..................................................................................................................................... 5 - 9
5.4 Cleaning Optical Disk Cartridge........................................................................................... 5 - 9
5.4.1 Cleaning tool......................................................................................................................... 5 - 9
5.4.2 Cleaning procedure ............................................................................................................... 5 - 10
CHAPTER 6 DIAGNOSIS AND MAINTENANCE................................................................. 6 - 1
6.1 Diagnosis...............................................................................................................................6 - 1
6.1.1 Initial self-diagnosis .............................................................................................................. 6 - 2
6.1.2 Diagnostic command............................................................................................................. 6 - 2
6.1.3 Test program ......................................................................................................................... 6 - 2
6.2 Maintenance Information ......................................................................................................6 - 3
6.2.1 Maintenance requirements .................................................................................................... 6 - 3
6.2.2 Revision number ................................................................................................................... 6 - 4
GLOSSARY....................................................................................................................................... GL - 1
ABBREVIATIONS ...........................................................................................................................AB - 1
C156-E142-02EN xv
FIGURES
page
1.1 Outer view (with panel).........................................................................................................1 - 6
1.2 Outer view (without panel)....................................................................................................1 - 6
1.3 Optical disk drive configuration............................................................................................1 - 7
1.4 Control circuit section block diagram................................................................................... 1 - 8
1.5 System configuration with one optical disk drive .................................................................1 - 10
1.6 System configuration with two optical disk drives................................................................ 1 - 10
2.1 Optical disk cartridge............................................................................................................ 2 - 11
2.2 Algorithms for alternate processing ...................................................................................... 2 - 14
2.3 Example of alternate processing............................................................................................2 - 15
3.1 Surface temperature measurement points.............................................................................. 3 - 2
3.2 Dimensions............................................................................................................................3 - 5
3.3 Dimensions (without panel) .................................................................................................. 3 - 6
3.4 Installation directions............................................................................................................ 3 - 7
3.5 Centers of gravity.................................................................................................................. 3 - 8
3.6 Mounting frame structure...................................................................................................... 3 - 9
3.7 Service clearance...................................................................................................................3 - 10
3.8 Current waveform (+5 VDC) ................................................................................................3 - 11
3.9 Connector and terminal locations.......................................................................................... 3 - 12
3.10 Cable connection diagram..................................................................................................... 3 - 13
3.11 Jumper settings at factory shipping....................................................................................... 3 - 14
3.12 Master device setting.............................................................................................................3 - 14
3.13 Slave device setting............................................................................................................... 3 - 15
3.14 Cable select mode setting...................................................................................................... 3 - 15
3.15 Cable select examples ........................................................................................................... 3 - 16
3.16 Individual packaging style.....................................................................................................3 - 19
3.17 Gathered packaging style ...................................................................................................... 3 - 19
4.1 Power mode ..........................................................................................................................4 - 19
4.2 Register/PIO data transfer..................................................................................................... 4 - 75
4.3 Multiword DMA data transfer............................................................................................... 4 - 77
4.4 Power-on and reset timing..................................................................................................... 4 - 79
5.1 Optical disk drive front view (with panel).............................................................................5 - 1
5.2 Inserting cartridge .................................................................................................................5 - 4
C156-E142-02ENxvi
5.3 Removing cartridge............................................................................................................... 5 - 5
5.4 Optial disk cartridge.............................................................................................................. 5 - 7
5.5 Write protect tab ...................................................................................................................5 - 8
5.6 Cleaning procedure (1)..........................................................................................................5 - 11
5.7 Cleaning procedure (2)..........................................................................................................5 - 11
5.8 Cleaning procedure (3)..........................................................................................................5 - 12
5.9 Cleaning procedure (4)..........................................................................................................5 - 13
6.1 Revision label........................................................................................................................6 - 4
6.2 Revision number indication...................................................................................................6 - 4
C156-E142-02EN xvii
TABLES
page
2.1 Model and order number.......................................................................................................2 - 1
2.2 Specifications........................................................................................................................ 2 - 3
2.3 Environmental and power requirements................................................................................2 - 7
2.4 Recommended optical disk cartridge specifications..............................................................2 - 10
2.5 Disk specifications ................................................................................................................ 2 - 13
3.1 Temperature requirements at measurement points ................................................................3 - 3
3.2 Temperature at each measuring point (Reference)................................................................ 3 - 4
3.3 Cable connector specifications..............................................................................................3 - 13
4.1 Differences in Host Interface Specifications of Each Model. ............................................... 4 - 1
4.2 Connector pin assignments....................................................................................................4 - 2
4.3 Signal description..................................................................................................................4 - 4
4.4 I/O port functions and mapping.............................................................................................4 - 5
4.5 Bit definitions of Alternate Status register ............................................................................ 4 - 6
4.6 Bit definitions of Device Control register ............................................................................. 4 - 6
4.7 Bit definitions of Drive Address register...............................................................................4 - 7
4.8 Bit definitions of ATAPI Byte Count register....................................................................... 4 - 7
4.9 Bit definitions of ATAPI Block Device Select register ........................................................4 - 8
4.10 Bit definitions of Error register.............................................................................................4 - 8
4.11 Bit definitions of ATAPI Features register ...........................................................................4 - 9
4.12 Bit definitions of ATAPI Interrupt Reason register .............................................................. 4 - 9
4.13 IO and Cod............................................................................................................................ 4 - 10
4.14 Bit definitions of ATAPI Status register ............................................................................... 4 - 10
4.15 Alternate sector assignment criteria ...................................................................................... 4 - 13
4.16 ID error and read error detection criteria and error handling................................................4 - 14
4.17 LED indications .................................................................................................................... 4 - 20
4.18 Command codes and parameters........................................................................................... 4 - 21
4.19 IDENTIFY PACKET DEVICE command............................................................................4 - 22
4.20 Device parameter information (1/5)...................................................................................... 4 - 23
4.21 PACKET command ..............................................................................................................4 - 27
4.22 DEVICE RESET command .................................................................................................. 4 - 28
4.23 CHECK POWER MODE command..................................................................................... 4 - 28
4.24 Power mode indication..........................................................................................................4 - 29
xviii C156-E142-02EN
4.25 EXECUTE DEVICE DIAGNOSTIC command................................................................... 4 - 29
4.26 Self-diagnosis detailed code..................................................................................................4 - 30
4.27 GET MEDIA STATUS command ........................................................................................ 4 - 30
4.28 Error register......................................................................................................................... 4 - 31
4.29 IDLE IMMEDIATE command ............................................................................................. 4 - 31
4.30 NOP command...................................................................................................................... 4 - 32
4.31 SERVICE command .............................................................................................................4 - 32
4.32 SET FEATURES command.................................................................................................. 4 - 33
4.33 FR register setting value........................................................................................................ 4 - 33
4.34 Transfer setting values in the SC register.............................................................................. 4 - 34
4.35 Cylinder High register........................................................................................................... 4 - 35
4.36 SLEEP command.................................................................................................................. 4 - 35
4.37 STANDBY IMMEDIATE command ................................................................................... 4 - 36
4.38 Packet command codes and parameters ................................................................................4 - 37
4.39 ERASE command .................................................................................................................4 - 38
4.40 FORMAT UNIT command................................................................................................... 4 - 39
4.41 FORMAT UNIT parameter list............................................................................................. 4 - 39
4.42 Defect list header ..................................................................................................................4 - 39
4.43 Format descriptor.................................................................................................................. 4 - 40
4.44 INQUIRY command.............................................................................................................4 - 40
4.45 INQUIRY data...................................................................................................................... 4 - 41
4.46 MODE SELECT command...................................................................................................4 - 42
4.47 Mode parameters................................................................................................................... 4 - 42
4.48 Mode parameter list ..............................................................................................................4 - 43
4.49 Mode parameter header.........................................................................................................4 - 43
4.50 Page descriptor...................................................................................................................... 4 - 43
4.51 Drive operation mode page...................................................................................................4 - 44
4.52 Changeable values in drive operation mode page ................................................................. 4 - 44
4.53 Default values for the drive operation mode page.................................................................4 - 44
4.54 Read-Write error recovery page............................................................................................ 4 - 45
4.55 Changeable values in the read-write recovery page ..............................................................4 - 46
4.56 Default values for the read-write recovery page.................................................................... 4 - 46
4.57 Flexible disk page ................................................................................................................. 4 - 47
4.58 Changeable values in flexible disk page................................................................................4 - 48
4.59 Default values in flexible disk page ...................................................................................... 4 - 48
4.60 Caching page......................................................................................................................... 4 - 49
C156-E142-02EN xix
4.61 Changeable values in the caching page................................................................................. 4 - 49
4.62 Default values for the cashing page.......................................................................................4 - 49
4.63 Removable block access capabilities page............................................................................ 4 - 50
4.64 Changeable values in the removable block access capabilities page..................................... 4 - 50
4.65 Default values for the removable block access capabilities page.......................................... 4 - 50
4.66 Timer & protect page............................................................................................................ 4 - 51
4.67 Inactivity Time Multiplier value ...........................................................................................4 - 51
4.68 Changeable values for the timer & protect page ................................................................... 4 - 52
4.69 Default values for the timer & protect page ..........................................................................4 - 52
4.70 MODE SENSE command..................................................................................................... 4 - 53
4.71 Page Control field ................................................................................................................. 4 - 53
4.72 Mode parameter list ..............................................................................................................4 - 53
4.73 Mode parameter header.........................................................................................................4 - 54
4.74 Page descriptor...................................................................................................................... 4 - 54
4.75 PREVENT/ALLOW MEDIUM REMOVAL command.......................................................4 - 55
4.76 Response to Prevent/Allow/Eject.......................................................................................... 4 - 55
4.77 READ command ................................................................................................................... 4 - 56
4.78 READ command ................................................................................................................... 4 - 56
4.79 READ CAPACITY command ..............................................................................................4 - 57
4.80 READ CAPACITY data (PMI = 0) ......................................................................................4 - 57
4.81 READ CAPACITY data (PMI = 1, MO media, FROM media) ...........................................4 - 57
4.82 READ CAPACITY data (PMI = 1, PROM media) ..............................................................4 - 58
4.83 READ FORMAT CAPACITIES command.......................................................................... 4 - 58
4.84 READ FORMAT CAPACITIES data format ....................................................................... 4 - 58
4.85 Capacity list header............................................................................................................... 4 - 58
4.86 Current/Maximum capacity descriptor.................................................................................. 4 - 59
4.87 Descriptor code definition..................................................................................................... 4 - 59
4.88 READ DEFECT DATA command ....................................................................................... 4 - 59
4.89 Defect list formats................................................................................................................. 4 - 60
4.90 Defect descriptor................................................................................................................... 4 - 60
4.91 Defect list header ..................................................................................................................4 - 60
4.92 READ LONG command ....................................................................................................... 4 - 61
4.93 RECEIVE DIAGNOSTIC RESULTS command..................................................................4 - 61
4.94 REQUEST SENSE command............................................................................................... 4 - 62
4.95 Request sense data ................................................................................................................4 - 62
4.96 Error code .............................................................................................................................4 - 63
xx C156-E142-02EN
4.97 Sense key...............................................................................................................................4 - 63
4.98 Logical block address format ................................................................................................4 - 64
4.99 ASC/ASCQ list (1/2).............................................................................................................4 - 64
4.100 Format Progress Indication Bytes ......................................................................................... 4 - 66
4.101 SEND DIAGNOSTIC command .......................................................................................... 4 - 66
4.102 SEEK command.................................................................................................................... 4 - 67
4.103 START/STOP UNIT command............................................................................................ 4 - 67
4.104 START/STOP/EJECT processing ........................................................................................4 - 68
4.105 SYNCHRONIZE CACHE command....................................................................................4 - 68
4.106 TEST UNIT READY command ...........................................................................................4 - 69
4.107 VERIFY command................................................................................................................4 - 69
4.108 WRITE (10) command..........................................................................................................4 - 70
4.109 WRITE (12) command..........................................................................................................4 - 70
4.110 WRITE AND VERIFY command ........................................................................................4 - 71
4.111 WRITE BUFFER command .................................................................................................4 - 72
4.112 Code-ID ................................................................................................................................4 - 73
4.113 WRITE LONG command .....................................................................................................4 - 74
4.114 Register/PIO data transfer timing parameters .......................................................................4 - 76
4.115 Multiword DMA data transfer timing parameters................................................................. 4 - 78
4.116 Power-on and reset timing.....................................................................................................4 - 80
5.1 Head cleaner..........................................................................................................................5 - 6
5.2 Cleaning kit........................................................................................................................... 5 - 9
5.3 Packaged items (cleaning kit)................................................................................................5 - 10
6.1 Self-diagnostic function ........................................................................................................6 - 1
C156-E142-02EN xxi
CHAPTER 1 GENERAL DESCRIPTION
1.1 Features
1.2 Drive Configuration
1.3 System Configuration
This chapter describes the features and configuration of the optical disk drives.
The MCE3130AP, MCE3064AP, MCF3064AP (hereafter optical disk drives) is disk that maintain the
compatibility and intend high speed as the succeed drive of the MCE3130AP, MCE3064AP, MCF3064AP.
The MCE3130AP, MCE3064AP, MCF3064AP is high-performance, 90mm(3.5-inch) commutative
rewritable optical disk drive which incorporates an ATAPI controller.
The interface connecting the MCE3130AP, MCE3064AP, MCF3064AP drives to the host system complies
with the ATA/ATAPI-4.
The flexibility and expandability through ATAPI I/F, the high performance of the MCE3130AP,
MCE3064AP, MCF3064AP optical disk drives, and the drive's commands set enable the user to construct
high-reliability, high-performance disk subsystems with advanced functions and large-scale storage.
1.1 Features
This section describes the following drive features:
! Performance
! Reliability
! Maintainability/operability
! Adaptability
! Interface
C156-E142-02EN 1 - 1
1.1.1 Performance
(1) Half-height standard 90mm(3.5-inch) size (25.4 mm height)
The ATAPI controller can be directly connected to the system EIDE bus. The controller meets the
specifications of the standard 25.4 mm height 90mm(3.5-inch) fixed disk drive form factor.
(2) High-speed data transfer
The speed of the MCE3130AP disk medium is 3,214 rpm when a 1.3 GB disk medium is used.
When other media are used, the speed is 4,558 revolutions per minute.
The speed of the MCE3064AP disk medium is 3600 revolutions per minute.
In the disk unit, high-speed data transfers at rates of 3.46 to 5.92 MB/s (1.3 GB) are realized. The
data transfer rate on the EIDE bus is 16.6 MB/s in PIO mode 4 and 16.6 MB/s in Multi-word
DMA Mode 2.
The EIDE bus high-speed data transfer capacity can be used effectively through the optical disk
unit’s large capacity data buffer (with read-ahead cache).
(3) High-speed mean seek time
This drive features a linear voice-coil motor for high-speed head positioning. The average seek
time is the average of 1,000 random seeks and is 23 ms. (However, this does not include command
overhead or address check.)
(4) Compatible with international standards (media interchangeability)
90mm(3.5 inch) type 1.3 GB format optical disks as well as ISO standards compatible 128 MB,
230 MB, 540 MB and 640 MB format optical disk media can be used in the MCE3130AP Optical
Disk Unit.
ISO standards compatible 128 MB, 230 MB, 540 MB and 640 MB format optical disks can be
used in the MCE3064AP and MCF3064AP optical disk units.
(5) Direct-overwrite medium support
The drive can use an optic modulation direct-overwrite disk that does not read an erase operation;
230-MB disk, 540-MB disk with the ISO standard.
(6) Dust resistance
The optical disk drive needs class 5 millions or less of the dust particles.
(7) Lower power consumption
The power consumption of the MCE3130AP optical disk drive is 5.5 W and that of the
MCE3064AP, and MCF3064AF optical disk drives is 5.3 W. (These power consumption values
are typical values during read and write operation.) These drives do not use a fan.
The minimum power consumption is 0.65 W during power save.
1 - 2 C156-E142-02EN
(8) Automatic spindle stop function
If access is not made within a certain time, this function stops disk rotation to minimize dust
accumulation on the disk. This function can be set that time by the MODE SELECT command.
1.1.2 Reliability
(1) Mean time between failure (MTBF)
This drive features a 120,000 hour MTBF.
(2) Error recovery
For the error depending on the optical disk drive, recovery process is made by a suitable retry.
This drive features Reed-Solomon error correction (ECC) to assure error-free operation.
(3) Automatic allocation of alternate data blocks
This drive features a function which automatically allocates alternate data blocks to defective data
blocks detected while data is being read from or written to an optical disk.
1.1.3 Maintainability/operability
(1) Diagnostic function
This drive has a diagnostic function to check optical disk drive operations. The diagnostic
function facilitates test and restoration.
(2) Five year service life (no overhaul)
This drive will not require overhaul within the first five years of installation if appropriately
handled, maintained, and cleaned as recommended.
(3) Mean time to repair (MTTR)
The MTTR is 30 minutes or less, if repaired by a specialized maintenance staff member.
1.1.4 Adaptability
(1) Wide operating environment
An LSI circuits reduce power consumption to 5.3 W (read/write). This drive features a wide
operating environment (5 to 45°C, general office environment). Dust particles are class 5 millions
or less.
C156-E142-02EN 1 - 3
(2) Low noise and low vibration
This drive operates quietly 26 dB or less (A character) even during seek operations and will not
degrade the office environment. Rubber vibration isolators support the drive and minimize
vibration. (Low noise and low vibration features are available except while an MO cartridge is
being ejected.)
(3) Vibration resistance (shock resistance)
Rubber vibration isolators protect the drive against external shock or vibration.
(4) Safety standards
! UL1950 (U.S.A., safety)
! CDRH class 1 (U.S.A., laser)
! CSA C22.2 No. 950 (Canada, safety)
! EN60950 (Europe, safety)
! EN60825 Class 1 (Europe, laser)
(5) Various radio wave standards
This optical disk device is installed in a host system, and meets the following standards:
! EN55022 class B, EN55024 (European wave standards)
! AS/NZS3548 class B (Australian wave standards)
! CNS13438 (Taiwanese radio interference standard, except MCE3023AP)
1.1.5 Interface
(1) ATA/ATAPI-4
This drive supports the basic ATA/ATAPI-4 specifications.
ATAPI commands enable operation using logical block addresses that are independent of the
physical attributes of the drive, enabling software flexibility in terms of system expansion.
Supports PIO Mode 4 and Multi-word DMA Mode 2.
(2) Continuous block processing
Logical block addresses are used for data block addressing. Without consideration of the physical
attributes of track boundaries, the initiator can access data by specifying a block number in
logically continuous data space.
1 - 4 C156-E142-02EN
(3) Data buffer
1,844 KB buffer is used to transfer data between the EIDE bus and disk. Since data is stored in
this buffer, the host can execute input-output processing effectively by using the high-speed data
transfer capability of the EIDE bus without regard to the data transfer rate of the optical disk drive.
(4) Read-ahead cache feature
The read-ahead cache feature enables high-speed sequential data access as follows:
After executing a command to read data from the disk, the drive automatically reads the next data
block and stores it in the data buffer (pre-reading). If the next command requests this data, the data
is transferred from the buffer without another disk access.
(5) Write cache feature
When the host system issues the write command to the optical disk drive, a command complete is
usually responded after completion of the write and verify operations. By using the write cache
feature, a command complete is responded after completion of the data transfer to the data buffer
without waiting the completion of the write and verify operations then the write and verify
operations are made asynchronously with the interface operation. Therefore, the apparent write
command processing time measured at the host system is reduced and the I/O performance of the
host system is improved.
The write cache feature is enabled or disabled by MODE SELECT command.
When the write cache feature is enabled, a write error is reported at the
completion status of next command. At a system so that the host retries
the command, a retry process may be failed.
(6) Defective block slipping
When a disk is initialized, logical data blocks are reallocated in a physical sequence by slipping
defective data blocks. This enables high-speed continuous data block processing without
rotational delay due to defective data blocks.
(7) Device driver software (1.3 GB optical disk media)
The optical disk drive requires more extended processing time than conventional optical device
drives because of higher density. Consequently, a processing time timeout when using the OS can
occur and this requires special device driver software.
C156-E142-02EN 1 - 5
1.2 Drive Configuration
1.2.1 Drive model
Figures 1.1 and 1.2 show the outer view.
Figure 1.1 Outer view (with panel)
Figure 1.2 Outer view (without panel)
1 - 6 C156-E142-02EN
1.2.2 Configuration
Figure 1.3 shows the drive configuration.
The drive consists of mechanical sections, a fixed optics section, actuator, and a control circuit
section. The mechanical sections include the spindle motor, actuator section, bias magnet, and the
cartridge folder vertical motion mechanism.
The fixed optics section consists of the optical components, position detector, and LD controller.
The control circuit sections include the drive control circuit section and ATAPI controller section.
Optical disk cartridge
Spindle motor
Figure 1.3 Optical disk drive configuration
1.2.3 Mechanical sections
(1) Optical disk cartridge load/eject
The system includes a cartridge mechanism which lowers the optical disk cartridge and mounts
(loads) it on the spindle motor automatically when the optical disk cartridge is fully inserted in the
optical disk drive’s disk slot, and a mechanism which automatically ejects the cartridge when the
Eject button on the front panel is pressed.
Control circuit section
Fixed optics sectionActuator section
(2) Spindle motor
Optical disk cartridge hubs are linked through magnetic clamps to minimize slippage between the
spindle motor shaft and disk. The spindle motor is the direct drive type which rotates the disk at
the same speed as the spindle motor shaft. A DC brushless spindle motor is used. The spindle
motor rotates at 4,558 rpm ± 0.1%.
(3) Actuator section
The positioner moves (seeks) a head actuator radically across the disk surface.
The positioner is driven by a linear voice coil motor. A pulse-width modulation (PWM) is adopted
as a driving system and realizes low power consumption and high-speed access.
C156-E142-02EN 1 - 7
(4) Separate optical sections
ATAPI I/F
The optical head section is separated in such a way that the fixed optics section is separated from
the moving optics section to minimize seek time and positioning error. (See Subsection 1.2.4 for
the fixed optical section.) This reduces the weight of the moving parts.
The fixed optics section consists of the laser diodes, collimator lens, and optical detector.
The fixed optics section includes a laser diode for recording and playback, and transmits one laser
beam to the head actuator.
(5) Panel
The central part of the panel is hollowed out deeply to provide pushing finger space for inserting
the cartridge, thereby facilitating the insertion.
The panel is also simply designed by making the eject button and LED light emitting part integral
with each other.
1.2.4 Control circuit section
Figure 1.4 is the block diagram of the control circuit section.
Main control
MPU
ODC
DSP
User Logic
LSI i/f
F-ROM
D-RAM
Drive
Read Amp
Power Amp
Filter
Sensor
Motor Driver
Figure 1.4 Control circuit section block diagram
DE
Head
Laser Diode
Photo Diode
APC Amp
LPC Amp
Head Amp
Actuator
Focus Act.
Track Act.
Spindle Motor
Temperature Sensor
Bias Coil
Eject Motor
Cartridge Sensor
1 - 8 C156-E142-02EN
The control circuit section is divided into two parts: an ATAPI controller section which deals
with control between the ATAPI interface and drive interface, and a drive circuit section which
controls the drive.
(1) ATAPI controller circuit section
The ATAPI controller circuit's reliability is improved by large-scale integrated circuit technology.
The high-speed microprocessor (MPU) handles ATAPI interface control and drive control such as
drive read-and-write control and single-beam control.
(2) Drive circuit section
The drive circuit section consists of the following circuits:
! Laser diode control circuit
! Signal reproduction circuit
! Servo/seek control circuit
! Rotation control circuit
! Drive miscellaneous control circuit
The DSP (digital signal processor) is used for the servo/seek control circuit to reduce the circuit
amount, therefore this circuit is a simple configuration.
The drive circuit section executes operations such as seek, erase, record, and playback while the
MPU controls the focus-tracking of the beam.
C156-E142-02EN 1 - 9
1.3 System Configuration
Host system
HA
(Host adapter)
ODD
AT bus
(Host interface)
EIDE interface
Host system
HA
(Host adapter)
ODD
AT bus
(Host interface)
EIDE interface
ODD
Figures 1.5 and 1.6 show the PC AT interface system configuration. The interface can be directly
connected to the 40-pin AT-compatible EIDE interface.
Figure 1.5 System configuration with one optical disk drive
Figure 1.6 System configuration with two optical disk drives
The PC AT interface will not meet the specification if two optical disk drives not conforming to
the ATA are connected.
The host adapter (HA) consists of an address decoder, driver, and receiver. ATA stands for AT
Attachment. This drive supports the ATA interface.
1 - 10 C156-E142-02EN
CHAPTER 2
SPECIFICATIONS
2.1 Optical Disk Drive Specifications
2.2 Optical Disk Cartridge Specifications
2.3 Defect Management
This chapter contains the specifications of the optical disk drive, and the optical disk cartridge.
2.1 Optical Disk Drive Specifications
2.1.1 Model and product number
Table 2.1 lists the model and order number.
Table 2.1 Model and order number (1 of 2)
Model Name Order No. Panel Panel Color Mounting Screws
MCE3130AP CA05696-B501
CA05696-B531
CA05696-B631 with panel Light gray (2.5Y 7.2/0.4) Inch screws (32 UNC)
CA05696-B701
CA05696-B731
CA05696-B831 without panel – – – Inch screws (32 UNC)
MCE3064AP CA01747-B501
CA01747-B531
CA01747-B631 with panel Light gray (2.5Y 7.2/0.4) Inch screws (32 UNC)
CA01747-B701
CA01747-B731
CA01747-B831 without panel – – – Inch screws (32 UNC)
with panel Light gray (2.5Y 7.2/0.4) Metric screws (M3)
without panel – – – Metric screws (M3)
with panel Light gray (2.5Y 7.2/0.4) Metric screws (M3)
without panel – – – Metric screws (M3)
C156-E142-02EN 2 - 1
Table 2.1 Model and order number (2 of 2)
Model Name Order No. Panel Panel Color Mounting Screws
MCF3064AP CA05437-B501
The panel colors (2.5Y 7.2/0.4) are indicated in Munsell symbols. (JIS Z8721)
Note:
CA05437-B531
CA05437-B631 with panel Light gray (2.5Y 7.2/0.4) Inch screws (32 UNC)
CA05437-B701
CA05437-B731
CA05437-B831 without panel – – – Inch screws (32 UNC)
with panel Light gray (2.5Y 7.2/0.4) Metric screws (M3)
without panel – – – Metric screws (M3)
2 - 2 C156-E142-02EN
2.1.2 Drive specifications
Table 2.2 lists MCE3130AP, MCE3064AP, MCF3064AP drives specifications
Table 2.2 Specifications (1 of 4)
[MCE3130AP]
Item Specifications
Optical disk cartridge 128 MB media 230 MB media 540 MB media 640 MB media 1.3 GB media
Total capacity Unformatted 181 MB 325 MB 819 MB 818 MB 1.683 GB
Formatted 128 MB 230 MB 538 MB 643 MB 1.283 GB
Capacity/track Unformatted 18,100 bytes 18,100 bytes
Formatted 12,800 bytes 12,800 bytes
Capacity/sector Unformatted 725 bytes 778 bytes 2,584 bytes 2,631 bytes
Formatted 512 bytes 2,048 bytes
Number of user tracks/side (*1) 10,000 17,940 42,042 18,480 36,855
Number of alternate sectors/side!1,024
Number of sectors/track 25 17
Data transfer rate 1.37 MB/s (max.)
0.32 MB/s
continuous
writing
(execution)
0.97 MB/s
continuous
reading
(execution)
Random seek time (*2) 23 ms (typ)
Average latency 6.6 ms 9.3 ms
Rotational speed 4,558 rpm ±0.1% 3,214 rpm ±0.1%
Heads One-head on the positioner
Positioner type Linear voice coil motor
Servo tracking method ISO continuous servo method
Density 24,424 bpi
(1.04µm/bit)
15,875 tpi
Loading time (*3) 8 sec. (typ) 12 sec. (typ)
Unloading time (*4) 4 sec. (typ)
Load/unload life 20,000
Host interface ATAPI (ATA/ATAPI-4 standard)
Data Transfer Modes PIO Mode 4 and Multi-word DMA Mode 2
Data transfer rate PIO Mode 4 16.6 MB/s
Multi-word DMA Mode 2 16.6 MB/s
Data buffer 1,844 KB
Error correction (*5) Correctable up to 8-byte/interleave
Bit error rate: 10
(logical track
capacity)
(logical track
capacity)
1,025
!
1.65 to 2.65 MB/s
(max.)
0.39 to 0.62 MB/s
continuous
writing
(execution)
1.16 to 1.86 MB/s
continuous
reading
(execution)
29,308 bpi
(0.87µm/bit)
18,275 tpi
-12
less
19,450 bytes
(logical track
capacity)
12,800 bytes
(logical track
capacity)
2,250
!
2.95 to 4.96 MB/s
(max.)
0.64 to 1.08 MB/s
continuous
writing
(execution)
1.92 to 3.26 MB/s
continuous
reading
(execution)
52,900 bpi
(0.48µm/bit)
23,090 tpi
43,928 bytes
(logical track
capacity)
34,816 bytes
(logical track
capacity)
2,244
!
2.94 to 4.90 MB/s
(max.)
0.77 to 1.29 MB/s
continuous
writing
(execution)
2.33 to 3.88 MB/s
continuous
reading
(execution)
45,798 bytes
(logical track
capacity)
34,816 bytes
(logical track
capacity)
4,437
!
3.46 to 5.92 MB/s
(max.)
0.88 to 1.50 MB/s
continuous
writing
(execution)
2.63 to 4.50 MB/s
continuous
reading
(execution)
89,100 bpi
(0.285µm/bit)
28,200 tpi
C156-E142-02EN 2 - 3
Table 2.2 Specifications (2 of 4)
[MCE3064AP]
Item Specifications
Optical disk cartridge 128 MB media 230 MB media 540 MB media 640 MB media
Total capacity Unformatted 181 MB 325 MB 819 MB 818 MB
Formatted 128 MB 230 MB 538 MB 643 MB
Capacity/track Unformatted 18,100 bytes 18,100 bytes
Formatted 12,800 bytes 12,800 bytes
Capacity/sector Unformatted 725 bytes 778 bytes 2,584 bytes
Formatted 512 bytes 512 bytes 2048 byte
Number of user tracks/side (*1) 10,000 17,940 42,042 18,480
Number of alternate sectors/side!1,024
Number of sectors/track 25 25 17
Data transfer rate 1.37 MB/s (max.)
0.32 MB/s continuous
writing (execution)
0.97 MB/s continuous
reading (execution)
Random seek time (*2) 23 ms (typ)
Average latency 6.6 ms
Rotational speed 4,558 rpm ±0.1%
Heads One-head on the positioner
Positioner type Linear voice coil motor
Servo tracking method ISO continuous servo method
Density 24,424 bpi
(1.04µm/bit)
15,875 tpi
Loading time (*3) 7 sec. (typ)
Unloading time (*4) 4 sec. (typ)
Load/unload life 20,000
Host interface ATAPI (ATA/ATAPI-4 standard)
Data Transfer Modes PIO Mode 4 and Multi-word DMA Mode 2
Data transfer rate PIO Mode 4 16.6 MB/s
Multi-word DMA Mode 2 16.6 MB/s
Data buffer 1,844 KB
Error correction (*5) Correctable up to 8-byte/interleave
Bit error rate: 10
-12
less
(logical track
capacity)
(logical track
capacity)
1,025
!
1.65 to 2.65 MB/s
(max.)
0.39 to 0.62 MB/s
continuous
writing (execution)
1.16 to 1.86 MB/s
continuous reading
(execution)
29,308 bpi
(0.87µm/bit)
18,275 tpi
19,450 bytes
(logical track
capacity)
12,800 bytes
(logical track
capacity)
2,250
!
2.95 to 4.96 MB/s
(max.)
0.64 to 1.08 MB/s
continuous
writing (execution)
1.92 to 3.26 MB/s
continuous reading
(execution)
52,900 bpi
(0.48µm/bit)
23,090 tpi
43,928 bytes
(logical track
capacity)
34,816 bytes
(logical track
capacity)
2,244
!
2.94 to 4.90 MB/s
(max.)
0.77 to 1.29 MB/s
continuous
writing (execution)
2.33 to 3.88 MB/s
continuous reading
(execution)
2 - 4 C156-E142-02EN
Table 2.2 Specifications (3 of 4)
[MCF3064AP]
Item Specifications
Optical disk cartridge 128 MB media 230 MB media 540 MB media 640 MB media
Total capacity Unformatted 181 MB 325 MB 819 MB 818 MB
Formatted 128 MB 230 MB 538 MB 643 MB
Capacity/track Unformatted 18,100 bytes 18,100 bytes
Formatted 12,800 bytes 12,800 bytes
Capacity/sector Unformatted 725 bytes 778 bytes 2,584 bytes
Formatted 512 bytes 512 bytes 2,048 bytes
Number of user tracks/side (*1) 10,000 17,940 42,042 18,480
Number of alternate sectors/side!1,024
Number of sectors/track 25 25 17
Data transfer rate 1.09 MB/s (max.)
0.256 MB/s continuous
writing (execution)
0.768 MB/s continuous
reading (execution)
Random seek time (*2) 23 ms (typ)
Average latency 8.3 ms
Rotational speed 3,600 rpm ±0.1%
Heads One-head on the positioner
Positioner type Linear voice coil motor
Servo tracking method ISO continuous servo method
Density 24,424 bpi
(1.04µm/bit)
15,875 tpi
Loading time (*3) 7 sec. (typ)
Unloading time (*4) 4 sec. (typ)
Load/unload life 20,000
Host interface ATAPI (ATA/ATAPI-4 standard)
Data Transfer Modes PIO Mode 4 and Multi-word DMA Mode 2
Data transfer rate PIO Mode 4 16.6 MB/s
Multi-word DMA Mode 2 16.6 MB/s
Data buffer 1,844 KB
Error correction (*5) Correctable up to 8-byte/interleave
Bit error rate: 10
-12
less
(logical track
capacity)
(logical track
capacity)
1,025
!
1.3 to 2.1 MB/s
(max.)
0.31 to 0.49 MB/s
continuous
writing (execution)
0.92 to 1.47 MB/s
continuous reading
(execution)
29,308 bpi
(0.87µm/bit)
18,275 tpi
19,450 bytes
(logical track
capacity)
12,800 bytes
(logical track
capacity)
2,250
!
2.33 to 3.92 MB/s
(max.)
0.51 to 0.86 MB/s
continuous
writing (execution)
1.52 to 2.58 MB/s
continuous reading
(execution)
52,900 bpi
(0.48µm/bit)
23,090 tpi
43,928 bytes
(logical track
capacity)
34,816 bytes
(logical track
capacity)
2,244
!
2.32 to 3.87 MB/s
(max.)
0.61 to 1.02 MB/s
continuous
writing (execution)
1.84 to 3.07 MB/s
continuous reading
(execution)
C156-E142-02EN 2 - 5
Table 2.2 Specifications (4 of 4)
*1 The number of user tracks indicates the maximum user zone which includes the spare area and
slipping area.
*2 Mathematical average of 1,000 times of seek and does not include command overhead nor
track address recognition time. Furthermore, it may reach a maximum of 35 ms depending on
the quality of media and drive installation environment.
*3 Loading time is the time from when the optical disk cartridge is inserted to when the optical
disk drive is ready.
*4 Unloading time is the time from when the eject button is pressed or the eject command is
issued to when the optical disk cartridge is ejected.
*5 The bit error rate must be 10
-12
or less when a disk whose raw error rate is 10-4 or less is used.
2 - 6 C156-E142-02EN
2.1.3 Environmental and power requirements
Table 2.3 lists the environmental and power requirements.
Table 2.3 Environmental and power requirements (1 of 2)
Item Specification
Power
requirements
Power
consumption
Average +5 VDC±5%, 1.1 A (2.5 A Max.) (*1)
Ripple requirement 100mV P-P (DC-1 MHz)
MCE3130AP MCE3064AP, MCF3064AP
Ready 3.9 W (typical) (*2) 3.9 W (typical) (*2)
Random seek, read/ or write 5.5 W (typical) (*2) 5.3 W (typical) (*2)
Power save mode
3.40 W (typical) (*2)
2.00 W (typical) (*2)
0.65 W (typical) (*2)
0.65 W (typical) (*2)
101.6"150.0"25.4 mm
101.6"148.4"25.4 mm
Dimensions
(W"D"H)
Pre-idle mode
Idle mode
Standby mode
Sleep mode
With panel
Without panel
Weight 480 g (with panel)
Environmental
requirements
Operating Temperature: 5 to 45°C (*3)
(gradient 15°C /h or less)
Relative humidity: 10 to 85% (Noncondensing)
Max. wet bulb temperature: 29°C or lower
Idle Temperature: 0 to 50°C
Relative humidity: 10 to 85% (Noncondensing)
Max. wet bulb temperature: 36°C or lower
3.40 W (typical) (*2)
2.00 W (typical) (*2)
0.65 W (typical) (*2)
0.65 W (typical) (*2)
Transport Temperature: –40 to 60°C (24 hours or less)
Temperature: –20 to 60°C (24 hours or more)
Relative humidity: 5 to 90% (Noncondensing)
Max. wet bulb temperature: 41°C or lower
Requirement: Packing conditions specified by Fujitsu
Installation Tilt angle –5° to +10° (*3)
Vibration/
shock
Operating 3.92 m/s2 (0.4 G [5 to 500 Hz, sine sweep])
Shock 19.6 m/s
Idle
No cartridge, power ON
9.8 m/s2 (1.0 G [5 to 500 Hz, sine sweep])
Shock 49 m/s
2
(5 G [10 ms, half-sine pulse])
Transport Shock 490 m/s2 (50 G [10 ms, half-sine pulse])
Requirement: Packing conditions specified by Fujitsu
C156-E142-02EN 2 - 7
2
(2 G [10ms, half-sine pulse])
Table 2.3 Environmental and power requirements (2 of 2)
Item Specification
Altitude Operating 3,000 m (10,000 ft) or less
Idle 12,000 m (40,000 ft) or less
Ambient for
Air flow Unused (*4)
purity
Air purity General office environment or better
Note:
1. Current limiter value for +5 VDC power: 5 A or less
2. Specifications under transporting condition are under the packaging specified by Fujitsu.
3. A voltage drop may occur depending on the used power supply or power cable.
*1 At random seek or read/write. Excluding pulse waveform under 500 #s or less.
*2 It demonstrates a power of 5.3 W in an installation environment of a temperature of 25°C,
voltage of 5 V.
*3 The efficiency is specified in an environment of a temperature of 25°C and 0° horizontal level
placement.
*4 For details, refer to section 3.1.3 ‘Air Flow’
2.1.4 Error rate
Data blocks to be accessed are evenly distributed on the disk. Errors due to disk defects are not
included.
(dust perticles: Class 5 millions or less)
(1) Bit error rate after ECC processing
The error rate after ECC processing must be 10
error rate is 10
-4
or less should be used.
-12
(2) Positioning error rate
-6
The positioning error rate must be 10
or less. (with retry)
2 - 8 C156-E142-02EN
or less. An optical disk cartridge whose raw
2.1.5 Reliability
(1) Mean time between failures (MTBF)
The MTBF is 120,000 hours or more. Failure due to disk errors is not included.
Conditions
$ Power-on time: 200 hours/month or less
$ LD-on time: 20% or less of power-on time
$ Environment Temp.: 25°C
Note:
The MTBF is defined as follows:
total operating time in all fields (hours)
MTBF=
number of device failure in all fields
1) Operating time is the total time power is applied.
2) Device failures indicate that devices require repair, readjustment, or replacement. Failure due
to external factors such as minor defects during device handling, operation outside
environmental specifications, power failure, host system errors, and interface cable errors are
not included.
(2) Service Life
Under appropriate handling and operation, disk cleaning and optical head cleaning, overhaul of the
drive is not required for the first five years.
(3) Data security at power failure
Except for the data of the block to which write operation is in progress, all data on the disk is
secure from power failure. This does not apply if power failure occurs during disk initialization
(formatting) or defect processing (alternate block allocation).
C156-E142-02EN 2 - 9
2.2 Optical Disk Cartridge Specifications
2.2.1 Recommended optical disk cartridge specifications
Specifications comply with the ISO/IEC 10090 standard for 128 MB disk, ISO/IEC 13963
standard for 230 MB disk, and ISO/IEC 15041 standard for 540 MB disk, and 640 MB disk. The
following three disk types comply with the specifications.
Table 2.4 shows the specifications of the optical disk cartridge recommended for this optical disk
drive. The use of another disk cartridge may lower drive performance.
Table 2.4 Recommended optical disk cartridge specifications
Model Order number
Optical disk cartridge (128 MB) CA90002-C010
Optical disk cartridge (230 MB) CA90002-C011
Optical disk cartridge (540 MB) CA90002-C012
Optical disk cartridge (640 MB) CA90002-C013
Optical disk cartridge (1.3 GB) CA90002-C015
Overwrite optical disk cartridge (230 MB) CA90002-C041
Overwrite optical disk cartridge (540 MB) CA90002-C042
Overwrite optical disk cartridge (640 MB) CA90002-C043
2 - 10 C156-E142-02EN
2.2.2 Optical disk cartridge
Figure 2.1 shows an optical disk cartridge. The figure below shows the cartridge with its shutter
open.
$ Shutter closed
$ Shutter open
2) Shutter
1) Cartridge case
3) Write protect tab
4) Disk
Figure 2.1 Optical disk cartridge
5) Hub
C156-E142-02EN 2 - 11
The following explains the components of the optical disk drive shown in Figure 2.1:
1) Cartridge case
Covers the disk to protect it from damage when handled and facilitates disk replacement. The
cartridge case is labeled and has a write protect tab.
2) Shutter
Protects the disk against dust. When the cartridge is inserted into the optical disk drive, the
shutter (metallic door) is opened.
3) Write protect tab
The write protect tab selects whether write is enabled or disabled.
4) Disk
Holds information which can be read by an optical beam.
5) Hub
The hub is placed at the center of the disk and is linked to the spindle of the drive. The hub is
used for radial centering and axial positioning.
2 - 12 C156-E142-02EN
2.2.3 Disk specifications
(1) 128 MB disk
The ISO/IEC10090 defines 128 MB disk specification.
(2) 230 MB disk
The ISO/IEC13963 defines 230 MB disk specification.
(3) 540 MB/640 MB disk
The ISO/IEC15041 defines 540 MB/640 MB disk specification.
(4) 1.3 GB disk
The Cherry Book version 1.0 defines 1.3 GB disk specification.
Table 2.5 lists disk specifications.
Table 2.5 Disk specifications
Item Specification
Reliability Read cycle >10
Erase/write/read cycle >10
8
6
Load/unload cycle 2,5000
Archival life (according to
>10 years (*1)
acceleration test results)
Shelf life (according to
>10 years (*2)
acceleration test results)
Environmental
requirements
Operating temperature 5 to 55°C
Operating relative humidity 3 to 85%RH (*3)
Storage temperature –20 to 55°C
Storage humidity 3 to 90% RH (*3)
*1 Archival life is the period in which recorded information can be read.
*2 Shelf life is the period in which information to be recorded can be written.
*3 Maximum wet bulb temperature = 29°C.
Note:
Non-recommended disks must be checked for compatibility.
C156-E142-02EN 2 - 13
2.3 Defect Management
2.3.1 Defect management schematic diagram
Defective sectors on the disk shall be replaced by good sectors according to the defect
management scheme as follows: Defective sectors found during surface certification are handled
by a sector slipping algorithm. Defective sectors found after initialization are handled by a linear
replacement algorithm.
Figure 2.2 shows the algorithms for alternate processing.
(a) Sector slipping algorithm
Figure 2.2 Algorithms for alternate processing
The user area is divided into several groups during media initialization. Each group contains data
sectors and spare sectors. Spare sectors are used as replacements for defective data sectors. Media
initialization can include a certification of the user area.
Figure 2.3 shows an example of alternate processing.
2 - 14 C156-E142-02EN
(b) Linear replacement algorithm
Figure 2.3 Example of alternate processing
C156-E142-02EN 2 - 15
CHAPTER 3
INSTALLATION REQUIREMENTS
3.1 Environmental Requirements
3.2 Mounting Requirements
3.3 Power supply Requirements
3.4 Cable Connections
3.5 Jumper Settings
3.6 Notes on Drive Handling
3.7 Mounting
3.8 Cable Connections
3.9 Operation Confirmation and Preparation for Use after
Installation
3.10 Dismounting Drive
This chapter describes environmental, mounting, power supply, and connection requirements.
3.1 Environmental Requirements
The environment in which these drives are installed must comply with the ambient environmental
requirements defined in Subsection 2.1.3.
3.1.1 Temperature measurement point
When a drive is operating, the ambient temperature measured 3 cm from the base surface of the
optical disk drive and the PCA unit surface must satisfy the environmental requirements specified
in Subsection 2.1.3. For the temperature of each surface during operation, the contact temperature
at each measurement point shown in Figure 3.1 must satisfy the requirements specified in
Subsection 3.1.2.
Low temperature burns
The surface temperatures of some ICs on the printed circuit board unit
in the optical disk drive exceed 55°C while operating. Be careful of
low tenperature burns.
C156-E142-02EN 3 - 1
(a) Inside optical disk cartridge
IC (controller)
IC (read amp)
Operating of inner
partition wall
Hole for inserting thermocouple
(b) IC (controller, read map)
Tip of thermocouple
Figure 3.1 Surface temperature measurement points
3 - 2 C156-E142-02EN
3.1.2 Temperature requirements and measuring method
Table 3.1 shows the temperature requirement at each measurement point shown in Figure 3.1.
Table 3.1 Temperature requirements at measurement points
Measurement point Maximum surface temperature
Cartridge inside 55°C (*)
IC (controller) surface 95 °C
IC (read amp.) surface 85 °C
Note: * 60°C for the optical disk cartridge (1.3 GB excluded) manufactured by Fujitsu.
Following procedure is for temperature measurement of inside cartridge.
1) Make a hole for the thermocouple as shown in Figure 3.1.
2) Disassemble the cartridge disk.
3) Cut off a part of the partition wall for the optical media as shown in Figure 3.1. (Cut off width:
5 to 10 mm)
4) Fix the tip of the thermocouple to the cut portion of partition wall with an adhesive agent.
5) Pass the thermocouple through the hole at the cartridge case and assemble the cartridge disk.
When there is a gap between the hole and the thermocouple, fill the gap with the adhesive
agent.
Note:
The surface of the cartridge shown in Figure 3.1 has been cut away to make the elements inside
the case clearly visible. In reality the surface is not cut away.
If the external environment temperature is higher than the specified value, the device will
automatically take an interval to respond to command, and then take protective action to
respond to the temperature increase.
3.1.3 Air flow
It is recommended that this optical disk drive be installed in a fanless cabinet. However, if the
power supply is incorporated into the same cabinet, it is necessary that it satisfy the “Temperature
Conditions” in 3.1.2 and that the air flow rate being drawn in by the device) at the cartridge
loading slot be 0.02 m
where this drive is being installed, the same conditions must be met.
3
/min, 0.3 m/s or lower. Furthermore, if there is a system fan in a system
C156-E142-02EN 3 - 3
Note:
Air flow temperature is 40°C and below.
3.1.4 Temperature rise under several conditions
Table 3.2 Temperature at each measuring point (Reference)
[Ambient atmospheric temperature of the optical disk drive: 45°C] (°C)
Measurement point Ready Random seek Criteria
Inside cartridge 49°C 54°C 55°C
IC (controller) surface 50°C 70°C 95°C
IC (read amp.) surface 48°C 70°C 85°C
Thermal sensor 47°C 55°C —
Notes:
1. The above data are data measured in a constant temperature chamber in which the
temperature surrounding the equipment was kept at 45°C. They are not the same as the
data obtained from measurements using the exclusive box in which the equipment is
normally used.
2. When using the box, the ambient temperature around the equipment will differ depending
3.1.5 Air purity
Air purity in the device environment is expressed by the number of dust particles per unit area and
must be class 5 millions (equivalent to 0.15 mg/m
particles of 0.5 !m dia. or larger per cubic foot)
on the air circulation conditions of the box, and the temperature rise inside the cartridge
will differ because of this, so please exercise caution.
3
) or less. (Class 500 millions: 500 millions dust
3 - 4 C156-E142-02EN
3.2 Mounting Requirements
3.2.1 External dimensions
Figures 3.2 to 3.3 show the dimensions of the drive and the positions of the mounting holes.
Unit: mm
Note: The height length is 25.4 ± 0.8 besides the panel size.
Figure 3.2 Dimensions
C156-E142-02EN 3 - 5
Unit: mm
Note: Those enclosed in parentheses are inch screws.
Figure 3.3 Dimensions (without panel)
3 - 6 C156-E142-02EN
3.2.2 Installation direction
Figure 3.4 shows the permissible installation directions for this drive. The mounting angle tolerance must
be within –5" to 10" from the horizontal. (–) shows that the insertion faces below.
# Horizontal
# Vertical
(Two orientations)
Figure 3.4 Installation directions
C156-E142-02EN 3 - 7
3.2.3 Centers of gravity
Figure 3.5 shows the centers of gravity of the drive.
Figure 3.5 Centers of gravity
3 - 8 C156-E142-02EN
Unit: mm
3.2.4 Notes on mounting
$
15
$
15
(1) Mounting frame structure and clearance
a) For vibration resistance and heat dissipation, this optical disk drive uses an embossed structure
as shown in Figure 3.6, as well as a frame which has a construction similar to other frames
which perform the same function.
b) As shown in Figure 3.6, the inward projection of the mounting screw from the outer surface of
the drive frame must not exceed 3 mm.
c) The clearance between the external surface of the drive frame and the user's frame structure
must be at least 1.5 mm.
d) The clearance between the top and bottom surfaces and the user's frame structure must be at
least 1.5 mm.
e) When mounting the optical disk drive, the screw tightening torque should be 0.4 to 0.45Nm (4
to 4.6kgcm).
f) When the optical disk drive (with panel) is mounted in a locker, there should be no
deformation of the mounting fittings provided and the optical disk drive's panel should not be
deformed. If the drive is used with the panel deformed, ejection of the cartridge will be faulty.
Check if the door will close from any position whatever when the optical disk drive is installed.
or less
or less
Figure 3.6 Mounting frame structure
C156-E142-02EN 3 - 9
(2) Panel function processing
When installed in a cabinet, do not change the panel formal. The processing is installation status
and the disk insertion door can be closed from any locations.
(3) Service clearance
Figure 3.7 shows locations which must be accessed for installation and maintenance. Be sure to
leave sufficient service clearance.
P side
# Cable connection
R side
# Mounting screw hole
(4) External magnetic fields
Mount the optical disk drive away from powerful magnetic materials (e.g., a speaker) to avoid
influence from magnetic fields.
(5) Leak magnetic field
The VCM drive magnetic circuit may leak the magnetic field (Maximum 25 Gauss at distance of 4
mm from the drive).
Do not place a device sensitive to a magnetic field near the optical disk
drive.
Q side
# Mounting screw hole
Figure 3.7 Service clearance
(6) External light source
Mount the optical disk drive away from strong light sources (e.g., camera flash).
3 - 10 C156-E142-02EN
(7) System ground
The optical disk drive should be grounded to the signal ground (SG) of the power supply of the
system. This SG line should be supplied with the system.
The Frame Ground is shorted in the optical disk drive by a metal strip attached to the vibration
isolation rubber between the frame (FG) and the base (SG).
When mounting the optical disk drive in the Device Bay 120mm (5
inch) of the PC chassis, there are two ways of choosing frames the
metal frame and the plastic (nonconductive material) frame.
When using a plastic frame, there is not a short circuit between FG of
PC and FG of the optical disk drive. As a result, the static electricity
tolerance decreases compared with metal frame.
It is recommended to use a metal frame to enhance the static electricity
prevention.
3.3 Power Supply Requirements
(1) Allowable input voltage and current
The DC power supply input voltage measured at the power supply connector pin of the optical disk
drive (receiving end) must satisfy the requirements in Section 2.1.3. (For other requirements, see
items (4) and (5) below.)
(2) Current waveform (reference)
Figure 3.8 shows the +5 VDC waveform at start of spindle motor rotation.
(A)
2.0
1.5
1.0
0.5
0
0
Figure 3.8 Current waveform (+5 VDC)
[ms]
10080604020
C156-E142-02EN 3 - 11
3.4 Cable Connections
1 pin
2 pin
CN1
1 pin
3.4.1 Drive connectors
The optical disk drive (ODD) has connectors. Figure 3.9 shows the location of the connectors.
# AT interface connector (40-pin) and power supply connector (4-pin)
Power supply connector
4 pin
Figure 3.9 Connector and terminal locations
1 +12 VDC or not connected
2 +12 VDC RETURN (GND) or not connected
3 +5 VDC RETURN (GND)
4 +5 VDC
3 - 12 C156-E142-02EN
3.4.2 Cable connector specifications
Host system
ODD1
DC power
ODD2
Power
supply
Table 3.3 lists the recommended cable connector specifications.
Table 3.3 Cable connector specifications
Cable name Name Model name Vendor
AT interface Cable socket (Close end type) FCN-707B040-AU/B Fujitsu
cable (40-pin) Cable socket (Through-end type) FCN-707B040-AU/0 Fujitsu
Signal cable 445-248-40 SPECTRS
STRIP
Power cable
The host interface cable must be a flat cable in terms of its overall
length. (Do not use a cable with a flat crimp terminal and loose lines
or twisted pairs.)
3.4.3 Drive connection
Figure 3.10 is a diagram showing cable connections between equipment.
Cable socket housing 1-480424-0 AMP
Contact 170121-4 AMP
Signal cable AWG18
Figure 3.10 Cable connection diagram
C156-E142-02EN 3 - 13
3.5 Jumper Settings
CNH1
31: Short
5-6 short-circuited: Sets the master device.
425
6
CNH1
3
1
4
2
5
6
3.5.1 Jumper settings at factory shipping
Figure 3.11 shows jumper settings at factory shipping.
CNH5
Figure 3.11 Jumper settings at factory shipping
3.5.2 Mode setting
(1) Setting master device mode
Figure 3.12 shows the setting for recognizing the master device (device 0).
CNH5
Figure 3.12 Master device setting
3 - 14 C156-E142-02EN
(2) Setting slave device mode
CNH1
3
1
4
256
CNH5
3
1
4
256
Figure 3.13 shows the setting for recognizing the slave device (device 1).
(3) Setting cable select mode
Figure 1.14 shows the master device/slave device setting when the CSEL signal is connected to the
interface. In the example shown in Figure 3.16, this setting requires a special interface connection.
CNH5
Figure 3.13 Slave device setting
Figure 3.14 Cable select mode setting
Figure 3.15 shows a cable select example using a special interface cable.
This example connects CSEL of the master device to the CSEL line (conductor) of the cable, then
grounds it so that the drive recognizes that it is the master. At this time, the CSEL conductor of the
slave device is removed and cannot be connected to CSEL of the cable, so that the drive
recognizes that it is the slave.
C156-E142-02EN 3 - 15
Host system
Master device
Slave device
CSEL conductor
Open
GND
Host system
Slave device
Master device
CSEL conductor
Open
GND
Example
1
Example
Figure 3.15 Cable select examples
2
3 - 16 C156-E142-02EN
3.6 Notes on Drive Handling
(1) General notes
Note the following points to maintain drive performance and reliability:
Device damage
1) Shock or vibration applied to the drive that exceeds the values defined in
the standard damage the drive. Use care when unpacking.
2) Do not leave the drive in dirty or contaminated environments.
3) Since static discharge may destroy the CMOS devices in the drive,
pay attention to the following points after unpacking:
• Use an antistatic mat and wrist strap when handling the drive.
• Hold the mounting frame when handling the drive. Do not
touch the PCA except when setting the switches.
4) When handling the drive, hold both sides of the mounting frame.
When touching other than both sides of the mounting frame, avoid
putting force.
5) Do not forcibly push up the end of the header pin of the printed
(2) Unpackaging
a) Make sure that the UP label on the package is pointing upward and start unpacking on a level
surface. Handle the drive on a soft surface such as a rubber mat, not on a hard surface such as
a desk.
b) Use care to avoid exerting excessive pressure on the unit when removing the cushions.
c) Use care to avoid exerting excessive pressure on the PCA surface and interface connectors
when removing the drive from the antistatic bag.
d) If the temperature difference between installation locations is 10 degrees or more, leave the
drive in the new location for at least two hours before unpackaging it.
circuit board unit when handling or setting the drive.
C156-E142-02EN 3 - 17
(3) Installation
a) Do not connect or disconnect the connectors or change the terminal settings when the power is
on.
b) Do not move the drive with the power on.
c) Eject the optical disk cartridge, lock the carriage securing the head, turn off the power, then
move the drive.
Device damage
Be sure to turn on the power supply before inserting your cartridge for
the first time. It releases the device from transport protection and
enables you to insert the cartridge.
The device may be damaged if you insert the cartridge without
releasing the protection. From the next time, you don’t need to turn on
the power supply beforehand.
Before moving the drive, remove the optical disk cartridge. If the drive
is moved with the optical disk cartridge loaded in it, the head may
move back and forth in the drive to damage the head or disk and
reading the data may fail.
(4) Packaging
a) Before packaging, remove the optical cartridge.
b) Store the drive in an antistatic plastic bag with desiccant (silica gel).
c) Use the same cushions and packaging supplied with the drive. If they are not available, ensure
that adequate shock absorbent material is used. In this case, some method of protecting the
PCA surface and interface connectors must be used.
d) Apply "UP" and "Handle With Care" labels to the outside of the package.
Figure 3.16 shows the individual packaging style and Figure 3.17 shows the gathered packaging
style. (The form and material of the cushion may be changed.)
3 - 18 C156-E142-02EN
Use a sealing tape
Desiccant
Conductive bag
Eject pin (Use a sealing tape)
Desiccant
Eject Pin (% 20)
MCE3130AP,
MCE3064AP, MCF3064AP
Shipping Label (2)
Master carton
(12/24 units)
Figure 3.16 Individual packaging style
(5) Transportation
Support (Front, Rear)
Support (Middle)
box
Figure 3.17 Gathered packaging style
a) Transport the package with the UP sign upward.
b) After unpacking, minimize the transportation distance and use cushions to avoid shock and
vibration. Transport the drive in one of the orientations described in Subsection 3.2.2 after
unpacking. (The horizontal direction is recommended.)
(6) Storage
a) Use moistureproof packaging when storing the drive.
b) The storage environment must satisfy the requirements specified in Subsection 2.1.3 when the
drive is not operating.
c) To prevent condensation, avoid sharp changes in temperature.
C156-E142-02EN 3 - 19
3.7 Mounting
3.7.1 Checks before mounting the drive
Before mounting the optical disk drive in the system cabinet, check whether the jumper settings are
set correctly.
3.7.2 Mounting procedure
How the drive is mounted depends on the system cabinet structure. Determine the mounting
procedure in consideration of the requirements of each system. This section contains the general
mounting procedure and check items.
See Section 3.2 for details on mounting drive.
1) Tighten four mounting screws to secure the drive in the system cabinet.
# The drive has ten mounting holes (both sides: 3%2, bottom: 4). Secure the drive using the
four mounting holes on both sides or the bottom.
# Use mounting screws whose lengths are 3 mm or less from the external wall of the mounting
frame of the drive when they are tightened. (See Figure 3.6)
# When mounting with screws, the screw tightening torque should be 0.4 to 0.45Nm (4 to
4.6kgfcm).
# Be careful not to damage the parts on the PCA when mounting the drive.
2) After securing the drive, make sure that the drive does not touch the chassis of the system
cabinet. There must be at least 1.5 mm clearance between the drive and chassis. (See Figure
3.6)
3.8 Cable Connections
Use the following cables to connect the drive to the system. See Subsection 3.4.2 for details on the
connector positions and cable requirements.
# Power supply cable
# AT interface cable
# DC ground cable (if required)
The general procedure for cable connection and notes on connecting cables are given below. Pay
attention to the insertion direction of each cable connector.
1) Make sure that the system power is off.
2) Do not connect or disconnect any cable when the power is on.
1) Connect the DC ground cable (only if required to decrease ground noise).
2) Connect the power cables.
3 - 20 C156-E142-02EN
3) Connect the AT interface cable.
4) After each cable connector is connected, secure the cable so that the cable does not touch the
drive or the parts on the PCA or obstruct the flow of cooling air in the system cabinet.
3.9 Operation Confirmation and Preparation for Use after Installation
3.9.1 Confirming initial operations
This section provides the operation check procedures after the power is turned on.
(1) Initial operation when the power is turned on
# When the power is turned on, the drive starts initial self-diagnosis. The LED on the front
panel is on for 1 second during initial self-diagnosis.
# If an error is detected during initial self-diagnosis, the LED on the front panel blinks.
# In case of not inserted the cartridge, when the power is turned on, the eject motor
automatically turns once.
(2) Checks if errors occur at initial self-diagnosis
# Make sure that the cables are connected correctly.
# Make sure that the supply voltage is correct. (Measure the voltage at the power supply
connector of the optical drive.)
# Make sure that the settings of all terminals are correct.
# If the LED on the front panel blinks continuously, an error was detected during initial self-
diagnosis. In this case, issue the REQUEST SENSE command from the initiator (host system)
to obtain sense data for error analysis.
The BUSY LED is on while the optical disk drive is executing seek,
write, or read operations. The BUSY LED is on momentarily, so it
seems as if it blinked or is off.
The eject motor turns once when the power is turned on so that in case
the spindle motor position deviates due to shocks received by the drive
during transport the position is corrected to allow the cartridge to be
inserted normally. If the cartridge fails to be inserted, remove the
cartridge and turn on the drive power to turn the eject motor once and
reinsert the cartridge.
C156-E142-02EN 3 - 21
3.9.2 Connection check
When initial operation check terminates normally after the power is turned on, check whether the
drive is correctly connected by issuing command from the host system. Checking procedure
depends on the host system configuration.
If processing terminates abnormally:
a) If sense data has been obtained by the REQUEST SENSE command, analyze the sense data. If
the error is recoverable, retry the processing.
b) Check the following items for AT interface cable connection:
# All connectors, including other devices, are connected correctly.
# Make sure the correct cable is being used (whether it corresponds with the cable selection
mode).
c) Make sure again that the jumper settings are correct.
3.10 Dismounting Drive
How to demount an optical disk drive (for setting terminal checking, setting change, or device
replacement) depends on the system cabinet configuration. Determine the demounting procedure
in consideration of the requirements of each system. This section describes the general
demounting procedure and notes on demounting drives.
Device damage
Before demounting the optical disk drive, turn off the system power.
Do not remove screws securing the cables and drive when the power is
on.
1) Remove the power cable.
2) Remove the AT interface cable.
3) Remove the DC ground cable.
4) Remove the four screws securing the drive, then remove the drive from the system cabinet.
5) When storing or transporting the drive, put the drive into an antistatic bag. (See Section 3.6.)
3 - 22 C156-E142-02EN
CHAPTER 4 HOST INTERFACE
4.1 Pin Assignment
4.2 Signal Description
4.3 Interface Registers
4.4 Various Processes
4.5 ATA Commands
4.6 Packet Commands
4.7 Timing
The differences in host interface specifications between the MCE3130AP, MCE3064AP and
MCF3064AP are shown in Table 4.1, Differences in Host Interface Specifications of Each Model.
In this chapter, even if there are no special explanatory notes in the text, please refer to this table to
make the appropriate substitutions for each model.
Table 4.1 Differences in Host Interface Specifications of Each Model
Support Item MCE3130AP MCE3064AP/ MCF3064AP
Media Capacity 128MB to 1.3GB 128MB to 640MB
Host Interface
! PIO
! Multiword DMA
! PIO
! Multiword DMA
C156-E142-02EN 4 - 1
4.1 Pin Assignment
The table below lists pin assignments of the interface connector.
Reset 1 RESET-
Ground 2 Ground
Data bus bit 7 3 DD7
Data bus bit 8 4 DD8
Data bus bit 6 5 DD6
Data bus bit 9 6 DD9
Data bus bit 5 7 DD5
Data bus bit 10 8 DD10
Data bus bit 4 9 DD4
Data bus bit 11 10 DD11
Data bus bit 3 11 DD3
Data bus bit 12 12 DD12
Data bus bit 2 13 DD2
Data bus bit 13 14 DD13
Data bus bit 1 15 DD1
Data bus bit 14 16 DD14
Data bus bit 0 17 DD0
Data bus bit 15 18 DD15
Ground 19 Ground
(keypin) 20 Reserved
DMA Request 21 DMARQ
Ground 22 Ground
I/O Write 23 DIOW-
Ground 24 Ground
I/O Read 25 DIOR-
Ground 26 Ground
I/O Ready 27 IORDY
Cable Select 28 CSEL
Table 4.2 Connector pin assignments (1/2)
Description PIN Signal name
4 - 2 C156-E142-02EN
Table 4.2 Connector pin assignments (2/2)
Description PIN Signal name
DMA Acknowledge 29 DMACK-
Gound 30 Ground
Interrupt Request 31 INTRQ
16 Bit I/O 32 IOCS16-
Device Address Bit 1 33 DA1
PASSED DIAGNOSTICS 34 PDIAG-
Device Address Bit 0 35 DA0
Device Address Bit 2 36 DA2
Chip Select 0 37 CS0-
Chip Select 1 38 CS1-
Device Active or Slave (Device 1) Present 39 DASP-
Ground 40 Ground
C156-E142-02EN 4 - 3
4.2 Signal Description
Table 4.3 Signal description
PIN Signal name I/O Description
1 RESET- I Reset signal
3, 5, 7, 9, 11,
13, 15, 17, 18,
16, 14, 12, 10,
8, 6, 4
21 DMARQ O Data request signal for DMA transfer
23 DIOW- I Write strobe signal.
25 DIOR- I Read strobe signal
27 IORDY O This is the ready signal for the host computer. The ODD
28 CSEL I Sets the ODD to the master (device 0) or slave (device 1).
29 DMACK- I Answer signal in response to DMARQ during DMA transfer
31 INTRQ O Interrupt signal to the host
32 IOCS16- O Indicates that the ODD is ready for 16-bit transfer when the
36, 33, 35 DA2, 1, 0 O Address signal used by the host to address the ODD task file
34 PDIAG- I/O Used by the slave (device 1) to notify the master (device 0)
DD7-0
DD15-8
I/O The low-order bus is a 8-bit bidirectional bus signal for
exchanging the status, data, and control data between the
host and ODD.
The high-order bus is used for 16-bit data transfers only.
uses this signal to request an extension of the transfer cycle
when it cannot prepare a response to a data transfer request
from the host computer in time.
Effective by jumpering.
host addresses the 16-bit data port during PIO transfer.
register
that diagnostics ended
37 CS0- O Select signal used to select the command block register
38 SC1- O Select signal used to select the control block register
39 DASP- I/O When reset, slave (device 1) output signal indicating that the
slave (device 1) exists. Otherwise, the signal indicates that
the master (device 0) and slave (device 1) is performing
mechanical operation or a failure occurred.
2, 19, 22, 24,
26, 30, 40
4 - 4 C156-E142-02EN
Ground - Ground signal
4.3 Interface Registers
4.3.1 I/O registers
This section provides the I/O register functions and mapping. Definitions of each register vary
depending on which ATA or ATAPI commands are used.
Table 4.4 I/O port functions and mapping
Address signal Function
CS0- CS1- DA2 DA1 DA0 READ (DIOR-) WRITE (DIOW-)
N N x x x High impedance state Ineffective
Control block register
N A 0 x x High impedance state Ineffective
N A 1 0 x High impedance state Ineffective
N A 1 1 0 Alternate Status Device Control
N A 1 1 1 Device Address Ineffective
Command block register
AN0 0 0 Data
A N 0 0 1 Error ATA Features (ATA)
ATAPI Features (ATAPI)
A N 0 1 0 Sector Count (ATA)
ATAPI Interrupt Reason
(ATAPI)
A N 0 1 1 Sector Number
A N 1 0 0 Cylinder Low (ATA)
ATAPI Byte Count (bits 0-7) (ATAPI)
A N 1 0 1 Cylinder High (ATA)
ATAPI Byte Count (bits8-15) (ATAPI)
A N 1 1 0 Device/Head (ATA)
ATAPI Block Device Select (ATAPI)
A N 1 1 1 ATAPI Status ATA Command
A A x x x Ineffective Ineffective
The letter A indicates that the bit is asserted, N indicates that the bit is negated, and X indicates
that the bit is ignored.
Ineffective
C156-E142-02EN 4 - 5
4.3.1.1 Alternate Status register
This register contains the same information as that of the ATAPI Status register, except that the
ODD does not recognize interrupts when reading this register. Therefore, the ODD does not clear
the INTRQ signal and does not clear interrupts during the pending.
Table 4.5 Bit definitions of Alternate Status register
76543210
BSY DRDY Reserved
(0b)
4.3.1.2 ATA Command register
This register contains a command to be passed to the ODD. The ODD starts executing a command
immediately after the command is written in this register. For executable commands and required
parameters, see Table 4.39.
4.3.1.3 Data register
The data register is used for data transfer. The data width is always 16 bits.
4.3.1.4 Device Control register
This register's bits are defined as shown below.
Table 4.6 Bit definitions of Device Control register
76543210
SERVICE DRQ CORR
(0b)
Reserved
(0b)
CHECK Read
Reserved Reserved Reserved Reserved Reserved SRST nIEN 0 Write
! Bits 7 to 3 are reserved. The ODD ignores all value sets in these bits.
! SRST is a reset bit for host software.
! nIEN is an enable bit for device interrupts to the host. When nIEN is 0 and the device is
selected, the INTRQ signal is enabled by the tri-state buffer. When nIEN is 1 or the device is
not selected, the INTRQ signal is in the high-impedance state.
4 - 6 C156-E142-02EN
4.3.1.5 Drive Address register
This register's bits are defined as shown below.
Table 4.7 Bit definitions of Drive Address register
76543210
HiZ nWTG nHS3 nHS2 nHS1 nHS0 nDS1 nDS0 Read
! HiZ is always in the high-impedance state.
! nWTG indicates the status of the ODD internal data write control signal (Write Gate).
! nHS3 indicates a binary complement of bits 3 to 0 of the drive select register.
! nDS1 is the device select bit for device 1. It is 0 when device 1 is selected.
! nDS0 is the device select bit for device 0. It is 0 when device 0 is selected.
4.3.1.6 ATAPI Byte Count register
This register's bits are defined as shown below.
Table 4.8 Bit definitions of ATAPI Byte Count register
76543210
Byte Count (Bits 0-7) R/W
Byte Count (Bits 8-15) R/W
! This register is used for PIO transfer only. The ODD sets the byte count to be transferred by
the host in this register and sets DRQ to 1. The ODD does not update this register until
transfer starts.
C156-E142-02EN 4 - 7
4.3.1.7 ATAPI Block Device Select register
This register's bits are defined as shown below.
Table 4.9 Bit definitions of ATAPI Block Device Select register
76543210
Unused Unused Unused Dev Unused LUN R/W
! Bits 7, 6, 5, and 3 are not used. The ODD ignores all value sets in these bits.
! Dev indicates the device address. When Dev is 0, device 0 is selected and when Dev is 1,
device 1 is selected.
! LUN (Logical Unit Number) is not supported. The ODD ignores all values in these bits.
4.3.1.8 Error register
This register indicates the status of the final command.
The value of this register is effective when the ERR bit of the Status register is 1 at completion of a
command other than EXECUTE DEVICE DIAGNOSTIC.
The value of this register indicates the diagnostic code at power-on, reset, and execution of the
EXECUTE DEVICE DIAGNOSTIC command. For details on diagnostic codes, see Section 4.5.5.
Table 4.10 Bit definitions of Error register
76543210
Sense Key MCR
(0b)
! For the Sense Key, see Table 4.96.
! MCR (Media Change Requested) is not used. It is always 0.
! ABRT (Aborted Command) indicates that the value of the ATA command code or task file
register is incorrect.
! EOM (End of Media) is not used. It is always 0.
ABRT EOM
(0b)
ILI
(0b)
Read
! ILI (Illegal Length Indication) is not used. It is always 0.
4 - 8 C156-E142-02EN
4.3.1.9 ATA Features register
This register is used for the SET FEATURES command.
4.3.1.10 ATAPI Features register
This register's bits are defined as shown below.
Table 4.11 Bit definitions of ATAPI Features register
76543210
Reserved
OVERLAP
! All values in bits 7 to 2 are ignored.
! OVERLAP is ignored.
! When DMA is 1, the ODD performs DMA transfer for data.
4.3.1.11 ATA Sector Count register
This register is used for the SET FEATURES command.
4.3.1.12 ATAPI Interrupt Reason register
This register's bits are defined as shown below.
Table 4.12 Bit definitions of ATAPI Interrupt Reason register
76543210
DMA Write
Reserved
(0b)
Reserved
(0b)
Reserved
(0b)
Reserved
(0b)
Reserved
(0b)
RELEASE
IO CoD Read
! A value of 1 in RELEASE indicates that the ODD released the ATA bus before completion of
the current command.
! IO indicates the direction of data transfer. See Table 4.13.
! CoD indicates the type of transfer. See Table 4.13.
C156-E142-02EN 4 - 9
Table 4.13 IO and Cod
IO CoD Meaning
0 1 Packet command transfer
1 0 Data or parameter transfer (from the ODD to the host)
0 0 Data or parameter transfer (from the host to the ODD)
1 1 The completion status in the Status register is effective.
4.3.1.13 Sector Number register
This register is not used. The ODD ignores all specified values.
4.3.1.14 ATAPI Status register
This register indicates the status of the ODD. It is updated to reflect the current ODD status and
the progress of the current command. When the BSY bit is 0, other bits of the register are effective
and some other command block registers may be set with significant information. When the BSY
bit is 1, the other bits of this register and all other command block registers are ineffective.
While the ODD is in sleep mode, the ATAPI Status register and all other command block registers
are ineffective.
If the host reads this register during interrupt pending, the interrupt is cleared.
Table 4.14 Bit definitions of ATAPI Status register
76543210
BSY DRDY Reserved
(0b)
SERVICE
DRQ CORR
(0b)
Reserved
(0b)
CHECK Read
! BSY (Busy) is set during command block register control. When BSY is 1, the ODD ignores
all command block registers other than the Device Reset command.
The ODD updates the DRQ and CHECK values only when BSY is 1. After the final block of
the PIO data-in command is transferred, the BSY bit setting is canceled and the DRQ bit is
cleared.
When BSY is 0, the ODD may update the SERVICE bit of the ATAPI Status register and the
Data register. The ODD does not update all other command block registers and the ATAPI
Status register bits.
The ODD sets BSY:
a) After RESET- is negated or within 400 ns of setting the SRST bit of the Device
Control Register
4 - 10 C156-E142-02EN
b) Within 400 ns of receiving a command when the DRQ bit is not set
c) Between data transfer blocks of the PIO data-in/PIO data-out command when the
DRQ bit is not set
d) After data block transfer with the PIO data-out command when the DRQ bit is not
set
e) During DMA transfer when the DRQ bit is not set
In all other cases, the ODD does not set BSY.
If BSY is set after RESET- is negated, the SRST bit is set, or a Device Reset command is
issued, it remains set until the ODD completes the internal reset process.
! DRDY (Device Ready) is always 1, except at the time after reset is made until the next
command is issued.
! For SERVICE, set the same value as that of DRDY. The SERVICE bit should be ignored
from the standpoint of compatibility.
! DRQ (Data Request) indicates that the ODD can transfer one byte or one word to or from the
host. When DRQ is 1, the ATAPI Interrupt Reason register of the current packet command is
effective.
! CORR (Corrected Data) is always 0.
! CHECK indicates that an error occurred in command processing. The Error register contains
additional information on the cause of the error. When the ODD sets CHECK to 1, the items
below are not changed until a new command is received or the ODD is reset.
! CHECK bit of the Status register
! Error register
! Device/Head register
C156-E142-02EN 4 - 11
4.4 Various Processes
4.4.1 Reset response
There are four types of resets.
! Power-on reset
! The ODD performs initialization such as initial diagnostics and default setting. If any
media is mounted, it also spins up media.
! Hardware reset
! The ODD is reset when the RESET- signal is asserted. The ODD initializes the interface
controller by setting default values.
! ATA reset (Software reset)
! The ODD is reset when the SRST bit of the Device Control register is set.
! The device driver should not use the SRST bit to reset the ODD (except for restore from
sleep mode).
! After ATA reset, the ODD initializes the task file as shown below.
Status = X'00'
Error = (Depending on the SRST sequence)
Sector Count = X'01'
Sector number = X'01'
Cylinder Low = X'14'
Cylinder High = X'EB'
Drive/Head = X'00'
! RDBY is set to 1 with the first command after ATA reset.
! If ATA reset is issued while the ODD is selected and a command is being executed (BSY
= 1 or DRQ = 1), the command is interrupted. Otherwise, the ODD continues command
processing.
! The contents set with the MODE SELECT and Set Features commands remain
unchanged.
! ATAPI reset
! The ODD is reset with a DEVICE RESET command. The ODD interrupts the current
command.
4 - 12 C156-E142-02EN
4.4.2 Defect sector management
Sector mapping is executed based on the ISO/IEC 10090 standard for 128 MB media, the ISO/IEC
13963 standard for 230 MB media, the ISO/IEC 15041 standard for 540 and 640 MB media, and
the GIGAMO 90 mm Magneto-optical Disk System - System Description standard for 1.3 GB .
Basically, possibly defective sector management is not required for the host.
Defective sectors cannot be deleted from the host, except for certifying recordable areas.
Recordable areas can be certified with the FORMAT UNIT command.
4.4.3 Automatic alternate sector assignment function
The ODD automatically assigns an alternate sector if a verify error is detected in the ID or data
section during the WRITE (I0) command, WRITE (12) command or WRITE AND VERIFY and
ERASE command. Alternate sector information is registered in SDL (Secondary Defect List) on
media.
After automatic alternate assignment terminates successfully, the ODD does not report any error.
Table 4.15 lists criteria used to execute alternate sector assignment.
Table 4.15 Alternate sector assignment criteria
Process Alternate sector assignment criteria Remarks
ID read error 128 MB/230 MB media:
3 read errors in 3 sectors
540 MB/640 MB/1.3 GB media:
2 read errors in 2 sectors
Data error Error in five bytes or more per interleaving Not checked if verify check is
-
disabled. (Except ERASE command)
C156-E142-02EN 4 - 13
4.4.4 Data error detection criteria
Table 4.16 lists criteria used to detect ID errors and data errors for data access commands and
error handling.
Table 4.16 ID error and read error detection criteria and error handling
Command ID read error Data error Error handling
FORMAT UNIT 128 MB/230 MB media:
3 read errors in 3 sectors
540 MB/640 MB/1.3 GB media:
2 read errors in 2 sectors
WRITE (10)
WRITE (12)
WRITE AND
VERIFY and
ERASE
READ (10)
READ (12)
WRITE LONG 128 MB/230 MB media:
128 MB/230 MB media:
3 read errors in 3 sectors
540 MB/640 MB/1.3 GB media:
2 read errors in 2 sectors
Error free (If no ID can be read,
reassignment is executed.)
3 read errors in 3 sectors
540 MB/640 MB/1.3 GB media:
2 read errors in 2 sectors
Error in 4 bytes or
more per interleaving
section
Error in 5 bytes or
more per interleaving
(Except ERASE
command)
Error in 9 bytes or
more per interleaving
section
No check Respond with
Register error
sectors in the PDL
(Primary Defect
List). If there are
many defect sectors,
they are also
registered in the
SDL (Secondary
Defect List).
Register error
sectors in SDL.
Respond with
Check Condition.
Sense Key indicates
a medium error.
Check Condition.
Sense Key indicates
a medium error.
READ LONG Error free
(If no ID can be read, the ODD
tries to read from the sector
before and after the possibly
faulty location and performs
reassignment.)
VERIFY 128 MB/230 MB media:
3 read errors in 3 sectors
540 MB/640 MB/1.3 GB media:
2 read errors in 2 sectors
4 - 14 C156-E142-02EN
No check Respond with
Check Condition.
Sense Key indicates
a medium error.
Error in 9 bytes or
more per interleaving
section
Respond with
Check Condition.
Sense Key indicates
a medium error.
4.4.5 Cache function
The ODD supports the read cache and MO write cache.
The read cache consists of the read ahead cache and the LRU cache that reads write data remaining
in the data buffer.
The read ahead cache allows for data transfer at a near effective transfer speed during continuous
read operation without causing any delay owing to rotation latency. LRU allows for data transfer
with no mechanical operation if write and read operations are executed frequently on the same
sector.
The MO write cache writes data in batch mode during continuous write operation, thus reducing
positioning operations depending on the buffer size and recovering the write throughput.
4.4.5.1 Data buffer
The ODD uses part of the buffer area as work memory for control firmware and the remaining area
as a buffer. The data buffer consists of plural segments and contains write data of plural segments.
4.4.5.2 Read cache
The ODD enables the read ahead cache and LRU cache when the cache function is enabled. When
the read cache is enabled, the ODD contiguously prereads the specified sector, then prereading the
next sector when receiving a READ (10) or READ (12) command (called Read command in this
document). While prereading the next sector, the ODD transfers the data in the sector specified by
the command.
When data in the sector specified by the host hits preread data, the ODD transfers data directly
from the buffer without any mechanical operation.
Preread stops under the following conditions:
! Access to the alternate sector
! Read error and retry
! Logical zone boundary of media
! When a read command is received for a sector not continuous from the sector specified by the
previous read command
! When a command other than Read is received
! When the data buffer is full
! Media ejection instruction using the Eject switch
! Hardware reset, software reset, DEVICE RESET command is received, or power-off
C156-E142-02EN 4 - 15
When the cache is enabled, the buffer contains data transferred from the host with a write
command. If a read command is issued to the sector address at this time, the ODD directly
transfers data to the high-level equipment from the data buffer without reading it from media. If
the cache is hit with a read command, the ODD makes the data in the hit segment being kept in the
highest priority.
The data listed below cannot be stored in the read cache.
! Data once transferred to the host during prereading
! Data read before hardware reset, software reset, DEVICE RESET command is received, or
power-off
! Data already stored before media is mounted
All buffer data is discarded under the following conditions:
! Hardware reset, software reset, DEVICE RESET command is received, or power-off
! When media is ejected
! When the FORMAT UNIT command is received
! In standby mode
! In sleep mode
! When the system receives a command (such as MODE SELECT and SET FEATURES) that
may change the operating mode
4.4.5.3 MO write cache
When the write cache is enabled, the ODD responds to the host with command end. This occurs
when the data transfer is done with the WRITE (10), WRITE (12), or WRITE AND VERIFY
command (hereafter "Write command" in this document). If Write commands are continuously
issued, the ODD responds to the host with command end when the data transfer is completed. This
occurs if the specified sector is continuous from the sector specified by the previous command.
The ODD writes data kept in the buffer to media under the following conditions:
! When data can be written on media during data transfer with a Write command or while the
ODD is waiting for a command
! When a command that requires a new segment is received while all segments in the data buffer
are used
! When the Eject switch is pressed
! When the SYNCHRONIZE CACHE command is received/DEVICE RESET command is
received
4 - 16 C156-E142-02EN
! Software reset
Particularly under the condition described below, a command end response or data transfer to the
host may be delayed until the write operation to media is completed.
! When a command that requires a new segment is received while all segments in the data buffer
are used
Under the conditions given below, write data in the buffer may not be written properly on media:
! Power-off
! Hardware reset
! Forced media ejection (mechanical ejection)
4.4.6 Media status notification function
The media status notification function notifies the host of various information on the removable
media device. The function is enabled or disabled with the SET FEATURES command.
When the media status notification function is enabled, the functions below will be added or
changed.
! The GET MEDIA STATUS command is enabled.
! The Eject switch is disabled.
The media status notification function is disabled at power-on reset, software reset, ATAPI reset,
or when the EXECUTE DEVICE DIAGNOSTIC command is received.
4.4.7 Power management function
The ODD provides the power management function that minimizes the power consumed. For this
function, the ODD has some control commands and a timer. The host uses the functions below to
control the power management function.
1) Standby timer
2) Idle Immediate command
3) Sleep command
4) Standby Immediate command
C156-E142-02EN 4 - 17
4.4.7.1 Power mode
The ODD supports power modes shown below. The ODD uses a power mode equivalent to
standby mode, except that the DRDY bit is 0 while media is not mounted.
! Active mode
! Pre-idle mode
! Idle mode
! Standby mode
! Sleep mode
4.4.7.2 Active mode
In active mode, all circuits are enabled. The ODD requires the shortest time to start processing a
command.
4.4.7.3 Pre-idle mode
In pre-idle mode, the read/write circuits stop. The ODD can receive a command from the host, but
since some circuits stop, the command requires 20 ms to access media.
The ODD automatically enters pre-idle mode if no command is issued within a specified time (0.5
second) in active mode. When it receives an access command, the ODD automatically enters
active mode. The pre-idle mode cannot be controlled from the host computer.
4.4.7.4 Idle mode
In idle mode, the servo and read/write circuits stop. The ODD can receive a command from the
host, but because some circuits stop, the ODD takes 1.0 seconds (standard) to access media.
If no command is issued within a specified time (180 seconds) in active mode, the ODD
automatically enters pre-idle mode, then enters idle mode. When it receives an access command,
the ODD automatically returns active mode. The Idle Immediate command can shift the ODD
from active mode or standby mode to idle mode.
4.4.7.5 Standby mode
In standby mode, the spindle mode stops. The ODD can receive a command from the host, but
since the spindle motor stops, the recovery to access media takes 5 seconds (standard).
The ODD automatically enters standby mode from active mode if no command is issued within a
specified time when the standby timer is enabled. When it receives a command, the ODD
automatically returns active mode. The Standby Immediate command can also directly shift the
ODD from active or idle mode to standby mode.
4 - 18 C156-E142-02EN
4.4.7.6 Sleep mode
Media is inserted.
Active
Reset
Standby mode
Idle
Sleep
Media is ejected.
(5)
(5)
(3)
Sleep mode uses power consumption as standby mode. To set the ODD in sleep mode, the host
must issue the Sleep command. To restore the ODD from sleep mode, hardware reset or software
reset is required. The host must not issue any command after the Sleep command. The ODD
requires 15 seconds (standard) to respond.
4.4.7.7 Standby timer
The standby timer is used to count the time during which the host issues no command.
The standby timer value is programmable with the MODE SELECT command. The default value
is 32 minutes.
4.4.7.8 Power mode transition
The power mode transits as shown in Figure 4.1.
(1)
(4)
(2)
(1) The ODD enters idle mode because it receives the Idle Immediate command or because it receives
no commands within a specified time.
(2) The ODD enters idle mode with the Idle Immediate command.
(3) The ODD enters standby mode with the Standby Immediate command and standby timer.
(4) The ODD enters active mode because it receives a media access command.
(5) The ODD enters sleep mode with the Sleep command.
Figure 4.1 Power mode
(4)
(3)
(5)
C156-E142-02EN 4 - 19
4.4.8 LED Indications
The ODD notifies the operator of a serious error by turning on or blinking the LED lamp. Table
4.17 lists indication modes and operation.
Table 4.17 LED indications
LED blink cycle Operation
Off Command wait state
On Command processing
Seek operation
Read/write processing (including cache processing)
Formatting
Power-on diagnostics
Spinning up (Including return from standby mode)
Spinning down (Including shifting to standby mode)
Blinking (on for a second and off for a
second repeatedly)
Blinking (on for 0.25 second and off
for 0.25 second repeatedly)
Blinking (on for 0.5 second and off for
0.5 second repeatedly)
*1 The ODD control firmware is stored on the flash ROM and can be downloaded from the host with
the WRITE BUFFER command. However, if any problem occurs during downloading, such as
power failure, downloading is interrupted and the microcodes in the control firmware may be
damaged. To download microcode data again in such a case, the ODD starts the emergency
download firmware that simply supports only the WRITE BUFFER command and other basic
commands.
Starting the download only firmware (*1)
A power-on diagnostics error occurred.
A thermal alarm occurred.
4 - 20 C156-E142-02EN
4.5 ATA Commands
Table 4.18 lists supported ATA commands.
This section represents ODD registers as shown below.
Cylinders High/Low registers: CY
Sector register: SC
Device/Head register: DH
Sector Number register: SN
Features register: FR
Table 4.18 Command codes and parameters
Protocol
Command name Command Parameters used Section
code FR SC SN CY DH
PI IDENTIFY PACKET DEVICE A1h D 4.5.1
- PACKET A0h y y y D 4.5.2
ND DEVICE RESET 08h D 4.5.3
ND CHECK POWER MODE 98h E5h y D 4.5.4
ND EXECUTE DEVICE DIAGNOSTIC 90h D* 4.5.5
ND GET MEDIA STATU DAh D 4.5.6
ND IDLE IMMEDIATE 98h E5h D 4.5.7
ND NOP 00h y 4.5.8
ND SERVICE (Not supported) A2h D 4.5.9
ND SET FEATURES EFh y y D 4.5.10
ND SLEEP 99h E6h D 4.5.11
ND STANDBY IMMEDIATE 94h E0h D 4.5.12
-- RESERVED: Other codes
C156-E142-02EN 4 - 21
Note:
1. CY = Cylinder register
SC = Sector register
DH = Device/Head register
SN = Sector Number register
FR = Features register
y - This register contains parameters effective to run the command.
D - Indicates that only the Device parameter is effective and the LUN parameter is ineffective.
D* - Device 0 is addressed, but both devices execute the command.
2. The protocol above indicates the command protocol used.
ND - A non data command
PI - A PIO data-in command
4.5.1 IDENTIFY PACKET DEVICE (X'A1')
Table 4.19 IDENTIFY PACKET DEVICE command
Bit
76543210
CM10100001
DHXXXDRVXXXX
CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX
When the ODD receives this command, it transfers device parameter information to the host. It
accepts this command even if in standby mode.
Table 4.20 lists the transfer data format. The reserved word indicates a value of 0.
The transfer byte length is 512 bytes.
One-word information uses DD15 as MSB (Most Significant Bit) and DD0 as LSB (Least
Significant Bit).
For ASCII character information such as base serial number, firmware version number, and
product number, the first character code in the string uses word 1, DD15 to 8; the second character
code uses word 1, DD7 to 0; the third character code uses word 2, DD15 to 8; and so on.
4 - 22 C156-E142-02EN
Table 4.20 Device parameter information (1/5)
Word Value Bits Description
0 87c0h General configuration information
15-14 Protocol type (B'10' = ATAPI device)
13 Reserved
12-8 Device type B'00111' = Optical disk unit
7 Replaceable media device (B'1')
6-5 CMD DRQ type (B'10' = Accelerated DRQ)
4-2 Reserved
1-0 Command packet size (B'00' = 12 bytes)
1-9 0000h Reserved
10-19 "xxx...xxx" Base serial number
(Left justified, ASCII codes)
20-22 0000h Reserved
23-26 "aaab" Firmware version number
aaa: Major level version number (000 - 999)
b: Minor level version number (0 - 9, a - z, and A - Z)
(Left justified, ASCII codes, blank indicating space character)
27-46 In the case of the
MCE3130AP,
“FUJITSU
MCE3130AP”
In the case of the
MCE3064AP,
“FUJITSU
MCE3064AP”
In the case of the
MCF3064AP,
“FUJITSU
MCF3064AP”
47-48 0000h Reserved
49 0F00h 15-14 Reserved (B'0')
Product number
(Left justified, ASCII codes, blank indicating space character)
13 Overlap function supported (B'0')
12 Reserved (B'0')
11 IORDY supported (B'1')
10 IORDY can be disabled (B'1')
9 LBA mode supported (B'1')
8 DMA transfer mode supported (B'1')
7-0 Reserved (B'0')
50 0000h Reserved
C156-E142-02EN 4 - 23
Table 4.20 Device parameter information (2/5)
Word Value Bits Description
51 0200h 15-8 PIO data transfer cycle timing mode
7-0 Reserved
52 0000h 15-0 Reserved
53 0003h 15-3
54-62 0000h Reserved
63 0407h Multiword DMA transfer mode
(Default value) Active mode
15-11 Reserved (B'0')
Reserved
2
88 word information is valid.
(In the case of models which do not support Ultra-DMA transfers,
B'0'.)
Information in words 64 to 70 is valid. (B'1')
1
Information in words 54 to 58 is valid. (B'1')
0
10 1 is shown when Mode 2 is selected.
9 1 is shown when Mode 1 is selected.
8 1 is shown when Mode 0 is selected.
Multiword DMA transfer mode supported
7-3 Reserved (B'0')
2 Mode 2 (B'1')
1 Mode 1 (B'1')
0 Mode 0 (B'1')
64 0003h Flow control PIO transfer mode
15-8 Reserved
PIO transfer mode supported
7-2 Reserved (B'0)
1 Mode 4 (B'1')
0 Mode 3 (B'1')
65 0078h (120) Minimum multiword DMA transfer time per word (ns)
66 0078h (120) Recommended multiword DMA transfer time (ns)
67 017Fh (383) Minimum PIO transfer cycle time when flow control is disabled (ns)
68 0078h Minimum PIO transfer cycle time when flow control using IORDY
is enabled (ns)
4 - 24 C156-E142-02EN
Table 4.20 Device parameter information (3/5)
Word Value Bits Description
69-70 0000h Reserved
71 07D0h (2000) Required time after the PACKET command is received until the bus
is released ("s) (Typical)
72 03E8h
(1000)
73-79 0000h Reserved
80 0010h Major Version number (ATA/ATAPI-4)
81 0000h Minor Version number (unused)
82 4278h Command set supported
Required time after the SERVICE command is received until BSY
is cleared ("s) (Typical)
(A value of less than 1 indicates that the command is supported.)
15 IDENTIFY DEVICE DMA command (B'0')
14 NOP command (B'1')
13 READ BUFFER command (B'0')
12 WRITE BUFFER command (B'0')
11 WRITE VERIFY command (B'0')
10 Host protect area function (B'0')
9 DEVICE RESET command (B'1')
8 SERVICE command interrupt (B'0')
7 Interrupt at release (B'0')
6 Read ahead cache (B'1')
5 Write cache (B'1')
4 Packet command function (B'1')
3 Power management function (B'1')
2 Removable media function (B'0')
1 Security mode (B'0')
0 SMART function (B'0')
83 4000h Command set supported
(A value of less than 1 indicates that the command is supported.)
15 Always B'0'.
14 Always B'1'.
13-1 Reserved
1 DOWNLOAD MICROCODE command supported (B'0')
C156-E142-02EN 4 - 25
Table 4.20 Device parameter information (4/5)
Word Value Bits Description
84 4000h Command set supported
15 Always B'0'.
14 Always B'1'.
13-0 Reserved
85 4278h
(Default value)
Command set supported and whether the function is enabled or
disabled
(A value of less than 1 indicates that the command is supported and
enabled.)
15 IDENTIFY DEVICE DMA command support (B'0')
14 NOP command support (B'1')
13 READ BUFFER command support (B'0')
12 WRITE BUFFER command support (B'0')
11 WRITE VERIFY command support (B'0')
10 Host protect area function support (B'0')
9 DEVICE RESET command support (B'1')
8 SERVICE command interrupt is enabled (B'0': Default value)
7 Interrupt at release is enabled (B'0': Default value)
6 Read ahead cache is enabled (B'1': Default value)
5 Write cache is enabled (B'1': Default value)
4 Packet command function support (B'1')
3 Power management function support (B'1')
2 Removable media function support (B'0')
1 Security mode enabled (B'0')
0 SMART function is enabled (B'0')
86 0000h Command set supported and whether the function is enabled or disabled
(A value of less than 1 indicates that the command is supported and
enabled.)
15-1 Reserved (B'0')
0 DOWNLOAD MICROCODE command supported (B'0')
87 4000h Command set supported and whether the function is enabled or disabled
(A value of less than 1 indicates that the command is supported and
enabled.)
15 Always B'0'.
14 Always B'1'.
13-0 Reserved
4 - 26 C156-E142-02EN
Table 4.20 Device parameter information (5/5)
88 0000h 15-0 Reserved.
89-
126
127 0001h 15-9 Reserved
128-
255
4.5.2 PACKET (X'A0')
0000h Reserved
8 Device write protected
A value of 1 indicates device write protected.
See 9.5.5 Timer & Protect Page
7-2 Reserved
1-0 Media status notification function supported (B'01')
0000h Reserved
Table 4.21 PACKET command
76543210
Bit
CM10100000
DHXXXDRVXXXX
CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX
The PACKET command issues an ATAPI packet command.
C156-E142-02EN 4 - 27
4.5.3 DEVICE RESET (X'80')
Table 4.22 DEVICE RESET command
Bit
76543210
CM00001000
DHXXXDRVXXXX
CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX
The DEVICE RESET command resets the ODD.
When the ODD receives the DEVICE RESET command, it sets the BUSY bit to 1. After reset is
completed, the ODD sets the BUSY bit to 0. INTRQ is not asserted.
4.5.4 CHECK POWER MODE (X'98'/X'E5')
Table 4.23 CHECK POWER MODE command
Bit
76543210
CM10011000
11100101
DHXXXDRVXXXX
CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX
The CHECK POWER MODE command sets the ODD power mode status in the SC register, then
notifies the host of the value in Table 4.24 When the drive is in sleep mode, the interface is
inactive and the ODD cannot receive this command.
4 - 28 C156-E142-02EN
Table 4.24 Power mode indication
Power mode status SC register
Standby mode 00h
Entering standby mode 00h
Returning from standby mode 00h
Idle mode FFh
Active mode FFh
4.5.5 EXECUTE DEVICE DIAGNOSTIC (X'90')
Table 4.25 EXECUTE DEVICE DIAGNOSTIC command
Bit
76543210
CM10010000
DHXXXXXXXX
CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX
When the ODD receives this command, it recognizes self-diagnostics.
When the ODD receives this command, it responds to the command regardless of the DRV bit
value; this means that the drive is unit 0 or 1.
When the ODD is device 0 (master), its response after the command is received depends on
whether device 1 (slave) is connected.
When no device 1 is connected
The ODD sets X'01' in the Error register and terminates the command.
When device 1 is connected
The ODD monitors the PDIAG- signal sent from device 1 for six seconds. If device 1 asserts the
PDIAG- signal within this time, the ODD recognizes that the device 1 self-diagnostic test ends
successfully. Otherwise, the ODD recognizes that the device 1 self-diagnostic test ended
C156-E142-02EN 4 - 29
abnormally and the ODD makes OR-operation to its self-diagnostics results of unit 0 (Device 0)
with X'80' and sets it in the Error register. If device 1 ends abnormally, the ODD sets the CHECK
bit of the Status register.
When the ODD is device 1
The ODD asserts the PDIAG- signal within five seconds. It sets X'01' in the Error register and
ends the command.
Table 4.26 Self-diagnosis detailed code
Detailed code Meaning
01h Normally end
02h-7Fh Hardware error
(For power-on and hardware reset only)
8xh Device 1 ended abnormally. (For device 0 only)
4.5.6 GET MEDIA STATUS (X'DA')
Table 4.27 GET MEDIA STATUS command
Bit
76543210
CM11011010
DHXXXDRVXXXX
CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX
The GET MEDIA STATUS command respond with the ODD status.
The command ends abnormally in either of the conditions given below and sets the value shown in
Table 4.28 in the Error register.
! When no media is inserted
! When media is exchanged
! When the Eject switch is pressed
! When media is write-protected
4 - 30 C156-E142-02EN
Otherwise, the command ends normally. If a hardware error by which the command cannot be
executed occurs, as is the case with other commands, the command ends with Aborted Command.
Table 4.28 Error register
Bit7 Bit6 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0
0 WRT_PT MC 0 MCR 0 NOMED 0
WRT_PT: Set to 1 when write-protected.
MC: Set to 1 when media is exchanged. Reported only once.
MCR: Set to 1 when the Eject switch is pressed. Reported only once.
NOMED: Set to 1 when no media is inserted.
4.5.7 IDLE IMMEDIATE (X'95'/X'E1')
Table 4.29 IDLE IMMEDIATE command
Bit
76543210
CM10010101
11100001
DHXXXDRVXXXX
CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX
The ODD sets the power mode to idle mode.
C156-E142-02EN 4 - 31
4.5.8 NOP (X'00')
Table 4.30 NOP command
Bit
76543210
CM00000000
DHXXXDRVXXXX
CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX
The NOP command enables 16-bit access for Status register checking. The ODD judges an
unsupported command. The command ends with Aborted Command.
4.5.9 SERVICE (X'A2') (Not supported)
Table 4.31 SERVICE command
Bit
76543210
CM10100010
DHXXXDRVXXXX
CHXXXXXXXX
CLXXXXXXXX
SNXXXXXXXX
SCXXXXXXXX
FRXXXXXXXX
4 - 32 C156-E142-02EN
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