Fujitsu MCE3130AP, MCF3064AP, MCE3064AP User Manual
C156-E142-02EN
MCE3130AP, MCE3064AP,
MCF3064AP
OPTICAL DISK DRIVES
PRODUCT MANUAL
The contents of this manual is subject to change without prior notice.
All Rights Reserved. Copyright ! 2001 FUJITSU LIMITED
REVISION RECORD
Edition Date published Revised contents
01 February, 2000
02 March, 2001
Specification No. : C156-E142-**EN
C156-E142-02EN i
PREFACE
This manual describes the MCE3130AP, MCE3064AP and MCF3064AP 90mm(3.5-inch) optical disk
drives.
This manual explains the specifications of the above optical disk drive (ODD) and function of the ATAPI
that interfaces to the user's system.
The manual is intended for users who have a basic understanding of optical disk drives and their use in
computer systems.
See "Manual Organization" for details on the organization of manuals related to the optical disk drives and
the scope of this manual. Use the other manuals shown in "Manual Organization" as well as this manual if
necessary.
This manual is organized as follows:
Chapter 1 GENERAL DESCRIPTION
This chapter introduces the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives and describes
their standard features, system configuration, and drive configuration.
Chapter 2 SPECIFICATIONS
This chapter describes the specifications of the MCE3130AP, MCE3064AP and MCF3064AP optical disk
drives, ATAPI function specifications, and optical disk cartridge specifications.
Chapter 3 INSTALLATION REQUIREMENTS
This chapter describes basic installation requirements (environment, mounting, power supply, and
connection) for the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives.
Chapter 4 HOST INTERFACE
This chapter describes host interface of the MCE3130AP, MCE3064AP and MCF3064AP optical disk
drives.
Chapter 5 OPERATION AND CLEANING
This chapter describes the operation and cleaning of the MCE3130AP, MCE3064AP and MCF3064AP
optical disk drives, outlines optical disk cartridges, and describes how to clean the cartridges.
Chapter 6 DIAGNOSIS AND MAINTENANCE
This chapter describes the self-diagnostic functions and maintenance of the MCE3130AP, MCE3064AP
and MCF3064AP optical disk drives.
C156-E142-02EN iii
Conventions for Alert Messages
This manual uses the following conventions to show the alert messages. An alert message consists of an
alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a
signal word.
The following are the alert signals and their meanings:
This indicates a hazardous situation likely to result in serious personal
injury if the user does not perform the procedure correctly.
This indicates a hazardous situation could result in personal injury if the
user does not perform the procedure correctly.
This indicates a hazardous situation could result in minor or moderate
personal injury if the user does not perform the procedure correctly. This
alert signal also indicates that damages to the product or other property,
may occur if the user does not perform the procedure correctly.
This indicates information that could help the user use the product more
efficiently.
In the text, the alert signal is centered, followed below by the indented message. A wider line space
precedes and follows the alert message to show where the alert message begins and ends. The following is
an example:
(Example)
Before moving the drive, remove the optical disk cartridge to avoid
head or disk damage
The main alert messages in the text are also listed in the “Important Alert Items.”
iv C156-E142-02EN
DISCLAIMER
Failure of the MCE3130AP, MCE3064AP and MCF3064AP optical disk drives are defined as a failure
requiring adjustment, repair, or replacement. Fujitsu is not responsible for failure due to misuse, operation
outside the specified environment conditions, power line trouble, controller problems, cable failure, or other
failure not caused by the optical disk drive itself.
C156-E142-02EN v
Important Alert Items
Important Alert Messages
The important alert messages in this manual are as follows:
A hazardous situation could result in minor or moderate personal injury if the
user does not perform the procedure correctly. This alert signal also indicates
that damages to the product or other property, may occur if the user does not
perform the procedure correctly.
Task Alert message Page
Operation
Installation
Low temperature burns
The surface temperatures of some ICs on the printed circuit board
unit in the optical disk drive exceed 55°C while operating. Be
careful of low tenperature burns.
Device damage
1) Shock or vibration applied to the drive that exceeds the values
defined in the standard damage the drive. Use care when
unpacking.
2) Do not leave the drive in dirty or contaminated environments.
3) Since static discharge may destroy the CMOS devices in the
drive, pay attention to the following points after unpacking:
• Use an antistatic mat and wrist strap when handling the
drive.
• Hold the mounting frame when handling the drive. Do
not touch the PCA except when setting the switches.
4) When handling the drive, hold both sides of the mounting
frame. When touching other than both sides of the mounting
frame, avoid putting force.
5) Do not forcibly push up the end of the header pin of the printed
circuit board unit when handling or setting the drive.
3-1
3-17
vi C156-E142-02EN
Task Alert message Page
Installation
Cleaning cartridge Device Damage
Device Damage
Be sure to turn on the power supply before inserting your cartridge
for the first time. It releases the device from transport protection
and enables you to insert the cartridge.
The device may be damaged if you insert the cartridge without
releasing the protection. From the next time, you don’t need to
turn on the power supply beforehand.
Before moving the drive, remove the optical disk cartridge. If the
drive is moved with the optical disk cartridge loaded in it, the head
may move back and forth in the drive to damage the head or disk
and reading the data may fail.
1) Make sure that the system power is off.
2) Do not connect or disconnect any cable when the power is on.
Device Damage
Before demounting the optical disk drive, turn off the system power.
Do not remove screws securing the cables and drive when the
power is on.
Be sure to use the dedicated head cleaner described above.
Damage for disk medium
Use the cleaning solution and cleaning cloth specified in Table 5.2.
If other than the specified items is used, disk media surface may be
damaged.
3-18
3-20
3-22
5-6
5-10
Damage for date medium
Do not use this cleaning kit for the floppy disk or the optical disk
cartridge used for other optical disk drive.
Damage for disk medium
Clean the cartridge at clean place. Put a disposable groves at
cleaning so that the fingerprint does not put on the disk media
(recommendation).
Damage for disk medium
At setting the cartridge to the setting case, do not apply the heavy
shock and push hardly.
Eye inflammation
In case of contact with eyes, immediately flush eyes with water.
Maintenance and Repair Data loss
In case of regular repair, the optical disk cartridge should not be
attached except where the cartridge causes the error. And before
having the drive repaired, save the data in the cartridge. Fujitsu is
not responsible for data last during maintenance or repair.
5-11
5-12
6-3
C156-E142-02EN vii
MANUAL ORGANIZATION
MCE3130AP,
MCE3064AP and MCF3064AP
OPTICAL DISK DRIVE
PRODUCT MANUAL
(C156-E142)
<This manual>
MCE3130AP,
MCE3064AP and MCF3064AP
OPTICAL DISK DRIVE
MAINTENANCE MANUAL
• GENERAL DESCRIPTION
• SPECIFICATIONS
• INSTALLATION REQUIREMENTS
• HOST INTERFACE
• OPERATION AND CLEANING
• DIAGNOSIS AND MAINTENANCE
• MAINTENANCE AND DIAGNOSIS
• FAULT ANALYSIS
• REMOVAL AND REPLACEMENT PROCEDURES
• PRINCIPLES OF OPERATION
•CLEANING
viii C156-E142-02EN
REFERENCED STANDARDS
Item Number Name Organization
1 X3T13/1321D
Revision 2
2 SFF-8070I
Revision 1.2
3 ISO/IEC 10090 90 mm optical disk cartridges, rewritable
4 ISO/IEC 13963 Data interchange on 90 mm optical disk
5 ISO/IEC 15041 Data interchange on 90 mm optical disk
6 Cherry Book
Version 1.0
*Note: ISO = International Organization for Standardization
IEC = International Electrical Commission
JTC1 = Joint Technical Committee 1
AT Attachment with Packet Interface-5
(ATA/ATAPI-5)
ATAPI Removable Rewritable Media Small Form Factor
and read only, for data interchange
cartridges,
– Capacity: 230 megabytes per cartridge
cartridges,
– Capacity: 640 megabytes per cartridge
GIGAMO 1.3 GB 90 mm Magneto-
Optical Disk System
American National
Standards Institute
(ANSI)
Committee (SFF)
ISO/IEC
ISO/IEC
ISO/IEC JTC1*
FUJITSU LIMITED
SONY
CORPORATION
C156-E142-02EN ix
CONTENTS
page
CHAPTER 1 GENERAL DESCRIPTION................................................................................ 1 - 1
1.1 Features................................................................................................................................. 1 - 1
1.1.1 Performance .......................................................................................................................... 1 - 2
1.1.2 Reliability.............................................................................................................................. 1 - 3
1.1.3 Maintainability/operability.................................................................................................... 1 - 3
1.1.4 Adaptability........................................................................................................................... 1 - 3
1.1.5 Interface ................................................................................................................................1 - 4
1.2 Drive Configuration .............................................................................................................. 1 - 6
1.2.1 Drive model ..........................................................................................................................1 - 6
1.2.2 Configuration ........................................................................................................................1 - 7
1.2.3 Mechanical sections .............................................................................................................. 1 - 7
1.2.4 Control circuit section........................................................................................................... 1 - 8
1.3 System Configuration............................................................................................................ 1 - 10
CHAPTER 2 SPECIFICATIONS ..............................................................................................2 - 1
2.1 Optical Disk Drive Specifications......................................................................................... 2 - 1
2.1.1 Model and product number ...................................................................................................2 - 1
2.1.2 Drive specifications............................................................................................................... 2 - 3
2.1.3 Environmental and power requirements................................................................................ 2 - 7
2.1.4 Error rate ...............................................................................................................................2 - 8
2.1.5 Reliability.............................................................................................................................. 2 - 9
2.2 Optical Disk Cartridge Specifications................................................................................... 2 - 10
2.2.1 Recommended optical disk cartridge specifications..............................................................2 - 10
2.2.2 Optical disk cartridge ............................................................................................................ 2 - 11
2.2.3 Disk specifications ................................................................................................................ 2 - 13
2.3 Defect Management .............................................................................................................. 2 - 14
2.3.1 Defect management schematic diagram................................................................................ 2 - 14
CHAPTER 3 INSTALLATION REQUIREMENTS ................................................................3 - 1
3.1 Environmental Requirements................................................................................................ 3 - 1
3.1.1 Temperature measurement point........................................................................................... 3 - 1
3.1.2 Temperature requirements and measuring method................................................................3 - 3
C156-E142-02EN xi
3.1.3 Air flow................................................................................................................................. 3 - 3
3.1.4 Temperature rise under several conditions............................................................................ 3 - 4
3.1.5 Air purity............................................................................................................................... 3 - 4
3.2 Mounting Requirements........................................................................................................3 - 5
3.2.1 External dimensions.............................................................................................................. 3 - 5
3.2.2 Installation direction .............................................................................................................3 - 7
3.2.3 Centers of gravity.................................................................................................................. 3 - 8
3.2.4 Notes on mounting................................................................................................................ 3 - 9
3.3 Power Supply Requirements ................................................................................................. 3 - 11
3.4 Cable Connections ................................................................................................................ 3 - 12
3.4.1 Drive connectors ................................................................................................................... 3 - 12
3.4.2 Cable connector specifications.............................................................................................. 3 - 13
3.4.3 Drive connection................................................................................................................... 3 - 13
3.5 Jumper Settings..................................................................................................................... 3 - 14
3.5.1 Jumper settings at factory shipping .......................................................................................3 - 14
3.5.2 Mode setting.......................................................................................................................... 3 - 14
3.6 Notes on Drive Handling ......................................................................................................3 - 17
3.7 Mounting............................................................................................................................... 3 - 20
3.7.1 Checks before mounting the drive......................................................................................... 3 - 20
3.7.2 Mounting procedure.............................................................................................................. 3 - 20
3.8 Cable Connections ................................................................................................................ 3 - 20
3.9 Operation Confirmation and Preparation for Use after Installation ......................................3 - 21
3.9.1 Confirming initial operations ................................................................................................3 - 21
3.9.2 Connection check.................................................................................................................. 3 - 22
3.10 Dismounting Drive................................................................................................................ 3 - 22
CHAPTER 4 HOST INTERFACE............................................................................................. 4 - 1
4.1 Pin Assignment .....................................................................................................................4 - 2
4.2 Signal Description................................................................................................................. 4 - 4
4.3 Interface Registers.................................................................................................................4 - 5
4.3.1 I/O registers........................................................................................................................... 4 - 5
4.3.1.1 Alternate Status register ........................................................................................................ 4 - 6
4.3.1.2 ATA Command register........................................................................................................ 4 - 6
4.3.1.3 Data register..........................................................................................................................4 - 6
4.3.1.4 Device Control register ......................................................................................................... 4 - 6
4.3.1.5 Drive Address register...........................................................................................................4 - 7
C156-E142-02ENxii
4.3.1.6 ATAPI Byte Count register................................................................................................... 4 - 7
4.3.1.7 ATAPI Block Device Select register ....................................................................................4 - 8
4.3.1.8 Error register......................................................................................................................... 4 - 8
4.3.1.9 ATA Features register........................................................................................................... 4 - 9
4.3.1.10 ATAPI Features register ....................................................................................................... 4 - 9
4.3.1.11 ATA Sector Count register....................................................................................................4 - 9
4.3.1.12 ATAPI Interrupt Reason register ..........................................................................................4 - 9
4.3.1.13 Sector Number register ......................................................................................................... 4 - 10
4.3.1.14 ATAPI Status register ........................................................................................................... 4 - 10
4.4 Various Processes .................................................................................................................4 - 12
4.4.1 Reset response....................................................................................................................... 4 - 12
4.4.2 Defect sector management ....................................................................................................4 - 13
4.4.3 Automatic alternate sector assignment function.................................................................... 4 - 13
4.4.4 Data error detection criteria ..................................................................................................4 - 14
4.4.5 Cache function ......................................................................................................................4 - 15
4.4.5.1 Data buffer ............................................................................................................................ 4 - 15
4.4.5.2 Read cache ............................................................................................................................ 4 - 15
4.4.5.3 MO write cache.................................................................................................................... 4 - 16
4.4.6 Media status notification function.........................................................................................4 - 17
4.4.7 Power management function ................................................................................................. 4 - 17
4.4.7.1 Power mode ..........................................................................................................................4 - 18
4.4.7.2 Active mode ..........................................................................................................................4 - 18
4.4.7.3 Pre-idle mode........................................................................................................................ 4 - 18
4.4.7.4 Idle mode .............................................................................................................................. 4 - 18
4.4.7.5 Standby mode........................................................................................................................ 4 - 18
4.4.7.6 Sleep mode............................................................................................................................4 - 19
4.4.7.7 Standby timer ........................................................................................................................4 - 19
4.4.7.8 Power mode transition...........................................................................................................4 - 19
4.4.8 LED Indications ....................................................................................................................4 - 20
4.5 ATA Commands ...................................................................................................................4 - 21
4.5.1 IDENTIFY PACKET DEVICE (X'A1') ...............................................................................4 - 22
4.5.2 PACKET (X'A0') .................................................................................................................. 4 - 27
4.5.3 DEVICE RESET (X'80').......................................................................................................4 - 28
4.5.4 CHECK POWER MODE (X'98'/X'E5')................................................................................ 4 - 28
4.5.5 EXECUTE DEVICE DIAGNOSTIC (X'90')........................................................................ 4 - 29
4.5.6 GET MEDIA STATUS (X'DA') ...........................................................................................4 - 30
C156-E142-02EN xiii
4.5.7 IDLE IMMEDIATE (X'95'/X'E1')........................................................................................ 4 - 31
4.5.8 NOP (X'00')...........................................................................................................................4 - 32
4.5.9 SERVICE (X'A2') (Not supported)....................................................................................... 4 - 32
4.5.10 SET FEATURES (X'EF')......................................................................................................4 - 33
4.5.11 SLEEP (X'99'/X'E6') ............................................................................................................. 4 - 35
4.5.12 STANDBY IMMEDIATE (X'94'/X'E0') .............................................................................. 4 - 36
4.6 Packet Commands................................................................................................................. 4 - 37
4.6.1 Logical Unit Number ............................................................................................................4 - 38
4.6.2 ERASE command ................................................................................................................. 4 - 38
4.6.3 FORMAT UNIT command................................................................................................... 4 - 39
4.6.4 INQUIRY command ............................................................................................................. 4 - 40
4.6.5 MODE SELECT command................................................................................................... 4 - 42
4.6.5.1 Drive operation mode page ................................................................................................... 4 - 44
4.6.5.2 Read-Write error recovery page............................................................................................ 4 - 45
4.6.5.3 Flexible disk page .................................................................................................................4 - 47
4.6.5.4 Caching page......................................................................................................................... 4 - 49
4.6.5.5 Removable block access capabilities page............................................................................ 4 - 50
4.6.5.6 Timer & protect page............................................................................................................ 4 - 51
4.6.6 MODE SENSE command ..................................................................................................... 4 - 53
4.6.7 PREVENT/ALLOW MEDIUM REMOVAL command....................................................... 4 - 55
4.6.8 READ (10) command ...........................................................................................................4 - 56
4.6.9 READ (12) command ...........................................................................................................4 - 56
4.6.10 READ CAPACITY command .............................................................................................. 4 - 57
4.6.11 READ FORMAT CAPACITIES command.......................................................................... 4 - 58
4.6.12 READ DEFECT DATA command ....................................................................................... 4 - 59
4.6.13 READ LONG command ....................................................................................................... 4 - 61
4.6.14 RECEIVE DIAGNOSTIC RESULTS command.................................................................. 4 - 61
4.6.15 REQUEST SENSE command............................................................................................... 4 - 62
4.6.16 SEND DIAGNOSTIC command ..........................................................................................4 - 66
4.6.17 SEEK command.................................................................................................................... 4 - 67
4.6.18 START/STOP UNIT command............................................................................................ 4 - 67
4.6.19 SYNCHRONIZE CACHE command.................................................................................... 4 - 68
4.6.20 TEST UNIT READY command ........................................................................................... 4 - 69
4.6.21 VERIFY command................................................................................................................4 - 69
4.6.22 WRITE (10) command..........................................................................................................4 - 70
4.6.23 WRITE (12) command..........................................................................................................4 - 70
C156-E142-02ENxiv
4.6.24 WRITE AND VERIFY command ........................................................................................4 - 71
4.6.25 WRITE BUFFER command ................................................................................................. 4 - 72
4.6.26 WRITE LONG command ..................................................................................................... 4 - 74
4.7 Timing................................................................................................................................... 4 - 75
4.7.1 Register/PIO data transfer timing..........................................................................................4 - 75
4.7.2 Multiword DMA data transfer timing ...................................................................................4 - 77
4.7.3 Power-on and Reset Timing..................................................................................................4 - 79
CHAPTER 5 OPERATION AND CLEANING ........................................................................ 5 - 1
5.1 Operating Optical Disk Drive ............................................................................................... 5 - 1
5.1.1 Optical disk drive.................................................................................................................. 5 - 1
5.1.2 Note....................................................................................................................................... 5 - 2
5.1.3 Inserting cartridge ................................................................................................................. 5 - 2
5.1.4 Ejecting (removing) cartridge ............................................................................................... 5 - 4
5.2 Cleaning Drive...................................................................................................................... 5 - 6
5.3 Optical Disk Cartridge Operation ......................................................................................... 5 - 7
5.3.1 Optical disk cartridge ............................................................................................................ 5 - 7
5.3.2 Write protect tab ...................................................................................................................5 - 8
5.3.3 Notes ..................................................................................................................................... 5 - 9
5.4 Cleaning Optical Disk Cartridge........................................................................................... 5 - 9
5.4.1 Cleaning tool......................................................................................................................... 5 - 9
5.4.2 Cleaning procedure ............................................................................................................... 5 - 10
CHAPTER 6 DIAGNOSIS AND MAINTENANCE................................................................. 6 - 1
6.1 Diagnosis...............................................................................................................................6 - 1
6.1.1 Initial self-diagnosis .............................................................................................................. 6 - 2
6.1.2 Diagnostic command............................................................................................................. 6 - 2
6.1.3 Test program ......................................................................................................................... 6 - 2
6.2 Maintenance Information ......................................................................................................6 - 3
6.2.1 Maintenance requirements .................................................................................................... 6 - 3
6.2.2 Revision number ................................................................................................................... 6 - 4
GLOSSARY....................................................................................................................................... GL - 1
ABBREVIATIONS ...........................................................................................................................AB - 1
C156-E142-02EN xv
FIGURES
page
1.1 Outer view (with panel).........................................................................................................1 - 6
1.2 Outer view (without panel)....................................................................................................1 - 6
1.3 Optical disk drive configuration............................................................................................1 - 7
1.4 Control circuit section block diagram................................................................................... 1 - 8
1.5 System configuration with one optical disk drive .................................................................1 - 10
1.6 System configuration with two optical disk drives................................................................ 1 - 10
2.1 Optical disk cartridge............................................................................................................ 2 - 11
2.2 Algorithms for alternate processing ...................................................................................... 2 - 14
2.3 Example of alternate processing............................................................................................2 - 15
3.1 Surface temperature measurement points.............................................................................. 3 - 2
3.2 Dimensions............................................................................................................................3 - 5
3.3 Dimensions (without panel) .................................................................................................. 3 - 6
3.4 Installation directions............................................................................................................ 3 - 7
3.5 Centers of gravity.................................................................................................................. 3 - 8
3.6 Mounting frame structure...................................................................................................... 3 - 9
3.7 Service clearance...................................................................................................................3 - 10
3.8 Current waveform (+5 VDC) ................................................................................................3 - 11
3.9 Connector and terminal locations.......................................................................................... 3 - 12
3.10 Cable connection diagram..................................................................................................... 3 - 13
3.11 Jumper settings at factory shipping....................................................................................... 3 - 14
3.12 Master device setting.............................................................................................................3 - 14
3.13 Slave device setting............................................................................................................... 3 - 15
3.14 Cable select mode setting...................................................................................................... 3 - 15
3.15 Cable select examples ........................................................................................................... 3 - 16
3.16 Individual packaging style.....................................................................................................3 - 19
3.17 Gathered packaging style ...................................................................................................... 3 - 19
4.1 Power mode ..........................................................................................................................4 - 19
4.2 Register/PIO data transfer..................................................................................................... 4 - 75
4.3 Multiword DMA data transfer............................................................................................... 4 - 77
4.4 Power-on and reset timing..................................................................................................... 4 - 79
5.1 Optical disk drive front view (with panel).............................................................................5 - 1
5.2 Inserting cartridge .................................................................................................................5 - 4
C156-E142-02ENxvi
5.3 Removing cartridge............................................................................................................... 5 - 5
5.4 Optial disk cartridge.............................................................................................................. 5 - 7
5.5 Write protect tab ...................................................................................................................5 - 8
5.6 Cleaning procedure (1)..........................................................................................................5 - 11
5.7 Cleaning procedure (2)..........................................................................................................5 - 11
5.8 Cleaning procedure (3)..........................................................................................................5 - 12
5.9 Cleaning procedure (4)..........................................................................................................5 - 13
6.1 Revision label........................................................................................................................6 - 4
6.2 Revision number indication...................................................................................................6 - 4
C156-E142-02EN xvii
TABLES
page
2.1 Model and order number.......................................................................................................2 - 1
2.2 Specifications........................................................................................................................ 2 - 3
2.3 Environmental and power requirements................................................................................2 - 7
2.4 Recommended optical disk cartridge specifications..............................................................2 - 10
2.5 Disk specifications ................................................................................................................ 2 - 13
3.1 Temperature requirements at measurement points ................................................................3 - 3
3.2 Temperature at each measuring point (Reference)................................................................ 3 - 4
3.3 Cable connector specifications..............................................................................................3 - 13
4.1 Differences in Host Interface Specifications of Each Model. ............................................... 4 - 1
4.2 Connector pin assignments....................................................................................................4 - 2
4.3 Signal description..................................................................................................................4 - 4
4.4 I/O port functions and mapping.............................................................................................4 - 5
4.5 Bit definitions of Alternate Status register ............................................................................ 4 - 6
4.6 Bit definitions of Device Control register ............................................................................. 4 - 6
4.7 Bit definitions of Drive Address register...............................................................................4 - 7
4.8 Bit definitions of ATAPI Byte Count register....................................................................... 4 - 7
4.9 Bit definitions of ATAPI Block Device Select register ........................................................4 - 8
4.10 Bit definitions of Error register.............................................................................................4 - 8
4.11 Bit definitions of ATAPI Features register ...........................................................................4 - 9
4.12 Bit definitions of ATAPI Interrupt Reason register .............................................................. 4 - 9
4.13 IO and Cod............................................................................................................................ 4 - 10
4.14 Bit definitions of ATAPI Status register ............................................................................... 4 - 10
4.15 Alternate sector assignment criteria ...................................................................................... 4 - 13
4.16 ID error and read error detection criteria and error handling................................................4 - 14
4.17 LED indications .................................................................................................................... 4 - 20
4.18 Command codes and parameters........................................................................................... 4 - 21
4.19 IDENTIFY PACKET DEVICE command............................................................................4 - 22
4.20 Device parameter information (1/5)...................................................................................... 4 - 23
4.21 PACKET command ..............................................................................................................4 - 27
4.22 DEVICE RESET command .................................................................................................. 4 - 28
4.23 CHECK POWER MODE command..................................................................................... 4 - 28
4.24 Power mode indication..........................................................................................................4 - 29
xviii C156-E142-02EN
4.25 EXECUTE DEVICE DIAGNOSTIC command................................................................... 4 - 29
4.26 Self-diagnosis detailed code..................................................................................................4 - 30
4.27 GET MEDIA STATUS command ........................................................................................ 4 - 30
4.28 Error register......................................................................................................................... 4 - 31
4.29 IDLE IMMEDIATE command ............................................................................................. 4 - 31
4.30 NOP command...................................................................................................................... 4 - 32
4.31 SERVICE command .............................................................................................................4 - 32
4.32 SET FEATURES command.................................................................................................. 4 - 33
4.33 FR register setting value........................................................................................................ 4 - 33
4.34 Transfer setting values in the SC register.............................................................................. 4 - 34
4.35 Cylinder High register........................................................................................................... 4 - 35
4.36 SLEEP command.................................................................................................................. 4 - 35
4.37 STANDBY IMMEDIATE command ................................................................................... 4 - 36
4.38 Packet command codes and parameters ................................................................................4 - 37
4.39 ERASE command .................................................................................................................4 - 38
4.40 FORMAT UNIT command................................................................................................... 4 - 39
4.41 FORMAT UNIT parameter list............................................................................................. 4 - 39
4.42 Defect list header ..................................................................................................................4 - 39
4.43 Format descriptor.................................................................................................................. 4 - 40
4.44 INQUIRY command.............................................................................................................4 - 40
4.45 INQUIRY data...................................................................................................................... 4 - 41
4.46 MODE SELECT command...................................................................................................4 - 42
4.47 Mode parameters................................................................................................................... 4 - 42
4.48 Mode parameter list ..............................................................................................................4 - 43
4.49 Mode parameter header.........................................................................................................4 - 43
4.50 Page descriptor...................................................................................................................... 4 - 43
4.51 Drive operation mode page...................................................................................................4 - 44
4.52 Changeable values in drive operation mode page ................................................................. 4 - 44
4.53 Default values for the drive operation mode page.................................................................4 - 44
4.54 Read-Write error recovery page............................................................................................ 4 - 45
4.55 Changeable values in the read-write recovery page ..............................................................4 - 46
4.56 Default values for the read-write recovery page.................................................................... 4 - 46
4.57 Flexible disk page ................................................................................................................. 4 - 47
4.58 Changeable values in flexible disk page................................................................................4 - 48
4.59 Default values in flexible disk page ...................................................................................... 4 - 48
4.60 Caching page......................................................................................................................... 4 - 49
C156-E142-02EN xix
4.61 Changeable values in the caching page................................................................................. 4 - 49
4.62 Default values for the cashing page.......................................................................................4 - 49
4.63 Removable block access capabilities page............................................................................ 4 - 50
4.64 Changeable values in the removable block access capabilities page..................................... 4 - 50
4.65 Default values for the removable block access capabilities page.......................................... 4 - 50
4.66 Timer & protect page............................................................................................................ 4 - 51
4.67 Inactivity Time Multiplier value ...........................................................................................4 - 51
4.68 Changeable values for the timer & protect page ................................................................... 4 - 52
4.69 Default values for the timer & protect page ..........................................................................4 - 52
4.70 MODE SENSE command..................................................................................................... 4 - 53
4.71 Page Control field ................................................................................................................. 4 - 53
4.72 Mode parameter list ..............................................................................................................4 - 53
4.73 Mode parameter header.........................................................................................................4 - 54
4.74 Page descriptor...................................................................................................................... 4 - 54
4.75 PREVENT/ALLOW MEDIUM REMOVAL command.......................................................4 - 55
4.76 Response to Prevent/Allow/Eject.......................................................................................... 4 - 55
4.77 READ command ................................................................................................................... 4 - 56
4.78 READ command ................................................................................................................... 4 - 56
4.79 READ CAPACITY command ..............................................................................................4 - 57
4.80 READ CAPACITY data (PMI = 0) ......................................................................................4 - 57
4.81 READ CAPACITY data (PMI = 1, MO media, FROM media) ...........................................4 - 57
4.82 READ CAPACITY data (PMI = 1, PROM media) ..............................................................4 - 58
4.83 READ FORMAT CAPACITIES command.......................................................................... 4 - 58
4.84 READ FORMAT CAPACITIES data format ....................................................................... 4 - 58
4.85 Capacity list header............................................................................................................... 4 - 58
4.86 Current/Maximum capacity descriptor.................................................................................. 4 - 59
4.87 Descriptor code definition..................................................................................................... 4 - 59
4.88 READ DEFECT DATA command ....................................................................................... 4 - 59
4.89 Defect list formats................................................................................................................. 4 - 60
4.90 Defect descriptor................................................................................................................... 4 - 60
4.91 Defect list header ..................................................................................................................4 - 60
4.92 READ LONG command ....................................................................................................... 4 - 61
4.93 RECEIVE DIAGNOSTIC RESULTS command..................................................................4 - 61
4.94 REQUEST SENSE command............................................................................................... 4 - 62
4.95 Request sense data ................................................................................................................4 - 62
4.96 Error code .............................................................................................................................4 - 63
xx C156-E142-02EN
4.97 Sense key...............................................................................................................................4 - 63
4.98 Logical block address format ................................................................................................4 - 64
4.99 ASC/ASCQ list (1/2).............................................................................................................4 - 64
4.100 Format Progress Indication Bytes ......................................................................................... 4 - 66
4.101 SEND DIAGNOSTIC command .......................................................................................... 4 - 66
4.102 SEEK command.................................................................................................................... 4 - 67
4.103 START/STOP UNIT command............................................................................................ 4 - 67
4.104 START/STOP/EJECT processing ........................................................................................4 - 68
4.105 SYNCHRONIZE CACHE command....................................................................................4 - 68
4.106 TEST UNIT READY command ...........................................................................................4 - 69
4.107 VERIFY command................................................................................................................4 - 69
4.108 WRITE (10) command..........................................................................................................4 - 70
4.109 WRITE (12) command..........................................................................................................4 - 70
4.110 WRITE AND VERIFY command ........................................................................................4 - 71
4.111 WRITE BUFFER command .................................................................................................4 - 72
4.112 Code-ID ................................................................................................................................4 - 73
4.113 WRITE LONG command .....................................................................................................4 - 74
4.114 Register/PIO data transfer timing parameters .......................................................................4 - 76
4.115 Multiword DMA data transfer timing parameters................................................................. 4 - 78
4.116 Power-on and reset timing.....................................................................................................4 - 80
5.1 Head cleaner..........................................................................................................................5 - 6
5.2 Cleaning kit........................................................................................................................... 5 - 9
5.3 Packaged items (cleaning kit)................................................................................................5 - 10
6.1 Self-diagnostic function ........................................................................................................6 - 1
C156-E142-02EN xxi
CHAPTER 1 GENERAL DESCRIPTION
1.1 Features
1.2 Drive Configuration
1.3 System Configuration
This chapter describes the features and configuration of the optical disk drives.
The MCE3130AP, MCE3064AP, MCF3064AP (hereafter optical disk drives) is disk that maintain the
compatibility and intend high speed as the succeed drive of the MCE3130AP, MCE3064AP, MCF3064AP.
The MCE3130AP, MCE3064AP, MCF3064AP is high-performance, 90mm(3.5-inch) commutative
rewritable optical disk drive which incorporates an ATAPI controller.
The interface connecting the MCE3130AP, MCE3064AP, MCF3064AP drives to the host system complies
with the ATA/ATAPI-4.
The flexibility and expandability through ATAPI I/F, the high performance of the MCE3130AP,
MCE3064AP, MCF3064AP optical disk drives, and the drive's commands set enable the user to construct
high-reliability, high-performance disk subsystems with advanced functions and large-scale storage.
1.1 Features
This section describes the following drive features:
! Performance
! Reliability
! Maintainability/operability
! Adaptability
! Interface
C156-E142-02EN 1 - 1
1.1.1 Performance
(1) Half-height standard 90mm(3.5-inch) size (25.4 mm height)
The ATAPI controller can be directly connected to the system EIDE bus. The controller meets the
specifications of the standard 25.4 mm height 90mm(3.5-inch) fixed disk drive form factor.
(2) High-speed data transfer
The speed of the MCE3130AP disk medium is 3,214 rpm when a 1.3 GB disk medium is used.
When other media are used, the speed is 4,558 revolutions per minute.
The speed of the MCE3064AP disk medium is 3600 revolutions per minute.
In the disk unit, high-speed data transfers at rates of 3.46 to 5.92 MB/s (1.3 GB) are realized. The
data transfer rate on the EIDE bus is 16.6 MB/s in PIO mode 4 and 16.6 MB/s in Multi-word
DMA Mode 2.
The EIDE bus high-speed data transfer capacity can be used effectively through the optical disk
unit’s large capacity data buffer (with read-ahead cache).
(3) High-speed mean seek time
This drive features a linear voice-coil motor for high-speed head positioning. The average seek
time is the average of 1,000 random seeks and is 23 ms. (However, this does not include command
overhead or address check.)
(4) Compatible with international standards (media interchangeability)
90mm(3.5 inch) type 1.3 GB format optical disks as well as ISO standards compatible 128 MB,
230 MB, 540 MB and 640 MB format optical disk media can be used in the MCE3130AP Optical
Disk Unit.
ISO standards compatible 128 MB, 230 MB, 540 MB and 640 MB format optical disks can be
used in the MCE3064AP and MCF3064AP optical disk units.
(5) Direct-overwrite medium support
The drive can use an optic modulation direct-overwrite disk that does not read an erase operation;
230-MB disk, 540-MB disk with the ISO standard.
(6) Dust resistance
The optical disk drive needs class 5 millions or less of the dust particles.
(7) Lower power consumption
The power consumption of the MCE3130AP optical disk drive is 5.5 W and that of the
MCE3064AP, and MCF3064AF optical disk drives is 5.3 W. (These power consumption values
are typical values during read and write operation.) These drives do not use a fan.
The minimum power consumption is 0.65 W during power save.
1 - 2 C156-E142-02EN
(8) Automatic spindle stop function
If access is not made within a certain time, this function stops disk rotation to minimize dust
accumulation on the disk. This function can be set that time by the MODE SELECT command.
1.1.2 Reliability
(1) Mean time between failure (MTBF)
This drive features a 120,000 hour MTBF.
(2) Error recovery
For the error depending on the optical disk drive, recovery process is made by a suitable retry.
This drive features Reed-Solomon error correction (ECC) to assure error-free operation.
(3) Automatic allocation of alternate data blocks
This drive features a function which automatically allocates alternate data blocks to defective data
blocks detected while data is being read from or written to an optical disk.
1.1.3 Maintainability/operability
(1) Diagnostic function
This drive has a diagnostic function to check optical disk drive operations. The diagnostic
function facilitates test and restoration.
(2) Five year service life (no overhaul)
This drive will not require overhaul within the first five years of installation if appropriately
handled, maintained, and cleaned as recommended.
(3) Mean time to repair (MTTR)
The MTTR is 30 minutes or less, if repaired by a specialized maintenance staff member.
1.1.4 Adaptability
(1) Wide operating environment
An LSI circuits reduce power consumption to 5.3 W (read/write). This drive features a wide
operating environment (5 to 45°C, general office environment). Dust particles are class 5 millions
or less.
C156-E142-02EN 1 - 3
(2) Low noise and low vibration
This drive operates quietly 26 dB or less (A character) even during seek operations and will not
degrade the office environment. Rubber vibration isolators support the drive and minimize
vibration. (Low noise and low vibration features are available except while an MO cartridge is
being ejected.)
(3) Vibration resistance (shock resistance)
Rubber vibration isolators protect the drive against external shock or vibration.
(4) Safety standards
! UL1950 (U.S.A., safety)
! CDRH class 1 (U.S.A., laser)
! CSA C22.2 No. 950 (Canada, safety)
! EN60950 (Europe, safety)
! EN60825 Class 1 (Europe, laser)
(5) Various radio wave standards
This optical disk device is installed in a host system, and meets the following standards:
! EN55022 class B, EN55024 (European wave standards)
! AS/NZS3548 class B (Australian wave standards)
! CNS13438 (Taiwanese radio interference standard, except MCE3023AP)
1.1.5 Interface
(1) ATA/ATAPI-4
This drive supports the basic ATA/ATAPI-4 specifications.
ATAPI commands enable operation using logical block addresses that are independent of the
physical attributes of the drive, enabling software flexibility in terms of system expansion.
Supports PIO Mode 4 and Multi-word DMA Mode 2.
(2) Continuous block processing
Logical block addresses are used for data block addressing. Without consideration of the physical
attributes of track boundaries, the initiator can access data by specifying a block number in
logically continuous data space.
1 - 4 C156-E142-02EN
(3) Data buffer
1,844 KB buffer is used to transfer data between the EIDE bus and disk. Since data is stored in
this buffer, the host can execute input-output processing effectively by using the high-speed data
transfer capability of the EIDE bus without regard to the data transfer rate of the optical disk drive.
(4) Read-ahead cache feature
The read-ahead cache feature enables high-speed sequential data access as follows:
After executing a command to read data from the disk, the drive automatically reads the next data
block and stores it in the data buffer (pre-reading). If the next command requests this data, the data
is transferred from the buffer without another disk access.
(5) Write cache feature
When the host system issues the write command to the optical disk drive, a command complete is
usually responded after completion of the write and verify operations. By using the write cache
feature, a command complete is responded after completion of the data transfer to the data buffer
without waiting the completion of the write and verify operations then the write and verify
operations are made asynchronously with the interface operation. Therefore, the apparent write
command processing time measured at the host system is reduced and the I/O performance of the
host system is improved.
The write cache feature is enabled or disabled by MODE SELECT command.
When the write cache feature is enabled, a write error is reported at the
completion status of next command. At a system so that the host retries
the command, a retry process may be failed.
(6) Defective block slipping
When a disk is initialized, logical data blocks are reallocated in a physical sequence by slipping
defective data blocks. This enables high-speed continuous data block processing without
rotational delay due to defective data blocks.
(7) Device driver software (1.3 GB optical disk media)
The optical disk drive requires more extended processing time than conventional optical device
drives because of higher density. Consequently, a processing time timeout when using the OS can
occur and this requires special device driver software.
C156-E142-02EN 1 - 5
1.2 Drive Configuration
1.2.1 Drive model
Figures 1.1 and 1.2 show the outer view.
Figure 1.1 Outer view (with panel)
Figure 1.2 Outer view (without panel)
1 - 6 C156-E142-02EN
1.2.2 Configuration
Figure 1.3 shows the drive configuration.
The drive consists of mechanical sections, a fixed optics section, actuator, and a control circuit
section. The mechanical sections include the spindle motor, actuator section, bias magnet, and the
cartridge folder vertical motion mechanism.
The fixed optics section consists of the optical components, position detector, and LD controller.
The control circuit sections include the drive control circuit section and ATAPI controller section.
Optical disk cartridge
Spindle motor
Figure 1.3 Optical disk drive configuration
1.2.3 Mechanical sections
(1) Optical disk cartridge load/eject
The system includes a cartridge mechanism which lowers the optical disk cartridge and mounts
(loads) it on the spindle motor automatically when the optical disk cartridge is fully inserted in the
optical disk drive’s disk slot, and a mechanism which automatically ejects the cartridge when the
Eject button on the front panel is pressed.
Control circuit section
Fixed optics sectionActuator section
(2) Spindle motor
Optical disk cartridge hubs are linked through magnetic clamps to minimize slippage between the
spindle motor shaft and disk. The spindle motor is the direct drive type which rotates the disk at
the same speed as the spindle motor shaft. A DC brushless spindle motor is used. The spindle
motor rotates at 4,558 rpm ± 0.1%.
(3) Actuator section
The positioner moves (seeks) a head actuator radically across the disk surface.
The positioner is driven by a linear voice coil motor. A pulse-width modulation (PWM) is adopted
as a driving system and realizes low power consumption and high-speed access.
C156-E142-02EN 1 - 7
(4) Separate optical sections
ATAPI I/F
The optical head section is separated in such a way that the fixed optics section is separated from
the moving optics section to minimize seek time and positioning error. (See Subsection 1.2.4 for
the fixed optical section.) This reduces the weight of the moving parts.
The fixed optics section consists of the laser diodes, collimator lens, and optical detector.
The fixed optics section includes a laser diode for recording and playback, and transmits one laser
beam to the head actuator.
(5) Panel
The central part of the panel is hollowed out deeply to provide pushing finger space for inserting
the cartridge, thereby facilitating the insertion.
The panel is also simply designed by making the eject button and LED light emitting part integral
with each other.
1.2.4 Control circuit section
Figure 1.4 is the block diagram of the control circuit section.
Main control
MPU
ODC
DSP
User Logic
LSI i/f
F-ROM
D-RAM
Drive
Read Amp
Power Amp
Filter
Sensor
Motor Driver
Figure 1.4 Control circuit section block diagram
DE
Head
Laser Diode
Photo Diode
APC Amp
LPC Amp
Head Amp
Actuator
Focus Act.
Track Act.
Spindle Motor
Temperature Sensor
Bias Coil
Eject Motor
Cartridge Sensor
1 - 8 C156-E142-02EN
The control circuit section is divided into two parts: an ATAPI controller section which deals
with control between the ATAPI interface and drive interface, and a drive circuit section which
controls the drive.
(1) ATAPI controller circuit section
The ATAPI controller circuit's reliability is improved by large-scale integrated circuit technology.
The high-speed microprocessor (MPU) handles ATAPI interface control and drive control such as
drive read-and-write control and single-beam control.
(2) Drive circuit section
The drive circuit section consists of the following circuits:
! Laser diode control circuit
! Signal reproduction circuit
! Servo/seek control circuit
! Rotation control circuit
! Drive miscellaneous control circuit
The DSP (digital signal processor) is used for the servo/seek control circuit to reduce the circuit
amount, therefore this circuit is a simple configuration.
The drive circuit section executes operations such as seek, erase, record, and playback while the
MPU controls the focus-tracking of the beam.
C156-E142-02EN 1 - 9
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