Fujitsu MCE3064SS, MCF3064SS User Manual

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MCE3064SS, MCF3064SS

OPTICAL DISK DRIVES

PRODUCT MANUAL

C156-E097-01EN

REVISION RECORD

Edition Date published Revised contents

01 May, 1999

Specification No.: C156-E097-**EN

The contents of this manual is subject to change without prior notice.

C156-E097-01EN i

This page is intentionally left blank.

PREFACE

This manual describes the MCE3064SS/MCF3064SS 3.5-inch optical disk drives. These drives are equipped with a small computer system interface (SCSI) controller

This manual explains the specifications of the above optical disk drive and function of the SCSI (Small Computer System Interface) that interfaces to the user's system.

The manual is intended for users who have a basic understanding of optical disk drives and their use in computer systems.

See "Manual Organization" for details on the organization of manuals related to the optical disk drives and the scope of this manual. Use the other manuals shown in "Manual Organization" as well as this manual if necessary.

This manual is organized as follows:

Chapter 1 GENERAL DESCRIPTION

This chapter introduces the MCE3064SS/MCF3064SS optical disk drives and describes their standard features, system configuration, and drive configuration.

Chapter 2 SPECIFICATIONS

This chapter describes the specifications of the MCE3064SS/MCF3064SS optical disk drives, SCSI function specifications, and optical disk cartridge specifications.

Chapter 3 INSTALLATION REQUIREMENTS

This chapter describes basic installation requirements (environment, mounting, power supply, and connection) for the MCE3064SS/MCF3064SS optical disk drives.

Chapter 4 INSTALLATION

This chapter describes installation of the MCE3064SS/MCF3064SS optical disk drives and includes:

• Notes on handling the drive

• Connection modes

• Settings

• Mounting

• Cable connections

• Operation, confirmation, and preparation for use after installation

• Notes on removing the installed drive

Chapter 5 OPERATION AND CLEANING

This chapter describes the operation and cleaning of the MCE3064SS/MCF3064SS optical disk drives, outlines optical disk cartridges, and describes how to clean the cartridges.

C156-E097-01EN iii

Chapter 6 DIAGNOSIS AND MAINTENANCE

This chapter describes the self-diagnostic functions and maintenance of the MCE3064SS/MCF3064SS optical disk drives.

Note: The MCE3064SS/MCF3064SS optical disk drives are called an ODD, drive, device or target

(TARG) in the explanations in this manual.

Chapter 7 SCSI BUS

This chapter describes in detail the configuration, physical/electrical conditions, interface protocol and operation of the SCSI (Small Computer System Interface), which is an interface for connecting the MCE3064SS/MCF3064SS optical disk drives and the user system to each other.

iv C156-E097-01EN

Conventions for Alert Messages

This manual uses the following conventions to show the alert messages. An alert message consists of an alert signal and alert statements. The alert signal consists of an alert symbol and a signal word or just a signal word.

The following are the alert signals and their meanings:

This indicates a hazarous situation likely to result in serious personal injury if the user does not perform the procedure correctly.

This indicates a hazarous situation could result in personal injury if the user does not perform the porocedure correctly.

This indicates a hazarous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. This alert signal also indicates that damages to the product or other property, may occur if the user oes not perform the procedure correctly.

This indicates information that could help the user use the product more efficiently.

In the text, the alert signal is centered, followed below by the indented message. A wider line space precedes and follows the alert message to show where the alert message begins and ends. The following is an example:

(Example)

Before moving the drive, remove the optical disk cartridge to avoid head or disk damage

The main alert messages in the text are also listed in the “Important Alert Items.”

C156-E097-01EN v

DISCLAIMER

Failure of the MCE3064SS/MCF3064SS optical disk drives are defined as a failure requiring adjustment, repair, or replacement. Fujitsu is not responsible for failure due to misuse, operation outside the specified environment conditions, power line trouble, controller problems, cable failure, or other failure not caused by the optical disk drive itself.

vi C156-E097-01EN

Important Alert Items

Important Alert Messages

The important alert messages in this manual are as follows:

A hazarous situation could result in minor or moderate personal injury if the user does not perform the procedure correctly. This alert signal also indicates that damages to the produt or other property, may occur if the user does not perform the procedure correctly.

Task Alert message Page

Operation

Installation

Low temperature burns: The surface temperatures of some ICs on the printed circuit board unit in the optical disk drive exceed 55°C while operating. Be careful of low tenperature burns.

Loss of data When the verify function is invalid, the write data quality is not guaranteed. This mode should not be used for storing important data. When using the mode for storing important data, a preventive system measure such as file duplication is required.

1) Shock or vibration applied to the drive that exceeds the values defined in the standard damage the drive. Use care when unpacking.

2) Do not leave the drive in dirty or contaminated environments.

3) Since static discharge may destroy the CMOS devices in the drive, pay attention to the following points after unpacking:

• Use an antistatic mat and wrist strap when handling the drive.

• Hold the mounting frame when handling the drive. Do not touch the PCA except when setting the switches.

4) When handling the drive, hold both sides of the mounting frame. When touching other than both sides of the mounting frame, avoid putting force.

3-1

3-26

4-1

5) Do not forcibly push up the end of the header pin of the printed circuit board unit when handling or setting the drive.

C156-E097-01EN vii

4-2

Task Alert message Page

Installation

1) The user must not change the settings of terminals not described in this section. The terminals must remain as set when shipped

2) Do not change terminal settings when the power is on.

3) To strap setting terminals, use the jumper shipped with the drive.

1) Make sure that the system power is off.

2) Do not connect or disconnect any cable when the power is on.

1) Be careful of the insertion directions of SCSI connectors. For a system in which the terminating resistor power is supplied via the SCSI cable, connecting connectors in the wrong direction may cause the following:

The overcurrent protection fuse of the terminating resistor power supply (SCSI device) may blow when power is turned on. The cable may burn if overcurrent protection is not provided.

2) Be careful of cable connector positions when connecting more than one SCSI device. The SCSI device having the terminating resitor must be connected to the end of the cable

4-5

4-13

4-14

3) The cables must be kept away from the rotating part of the spindle motor

Before demounting the optical disk drive, turn off the system power. Do not remove screws securing the cables and drive when the power is on.

Cleaning cartridge Use the cleaning solution and cleaning cloth specified in Table

5.2. If other than the specified items is used, disk media surface

may be damaged. Do not use this cleaning kit for the floppy disk or the optical disk

cartridge used for other optical disk drive. Clean the cartridge at clean place. Put a disposable groves at

cleaning so that the figureprint does not put on the disk media (recommendation).

At setting the cartridge to the setting case, do not apply the heavy shock and push hardly.

In case of contact with eyes, immediately flush eyes with water.

Maintenance and Repair Data loss

In case of regular repair, the optical disk cartridge should not be attached except where the cartridge causes the error. And before having the drive repaired, save the data in the cartiridge. Fujitsu is not responsible for data last during maintenance or repair.

4-17

5-10

5-11

5-12

6-3

MANUAL ORGANIZATION

viii C156-E097-01EN

MCE3064SS/MCF3064SS OPTICAL DISK DRIVES

PRODUCT MANUAL

(C156-E097)

• GENERAL DESCRIPTION

• SPECIFICATIONS

• INSTALLATION REQUIREMENTS

• INSTALLATION

• OPERATION AND CLEANING

• DIAGNOSIS AND MAINTENANCE

• SCSI BUS

MCE3064SS/MCF3064SS OPTICAL DISK DRIVES

SCSI Logical Specifications

(C156-E098)

MCE3064SS/MCF3064SS OPTICAL DISK DRIVES

MAINTENANCE MANUAL

(C156-F030)

• COMMAND PROCESSING

• DATA BUFFER MANAGEMENT

• COMMAND SPECIFICATIONS

• SENSE DATA AND ERROR RECOVERY PROCEDURE

• SCSI MESSAGES

• ERROR RECOVERY

• MAINTENANCE AND DIAGNOSIS

• FAULT ANALYSIS

• REMOVAL AND REPLACEMENT PROCEDURES

• PRINCIPLES OF OPERATION

• CLEANING

C156-E097-01EN ix

REFERENCED STANDARDS

Item Number Name Organization

1 ANSI X3.131-1986 American National Standard for

Information Systems—Small Computer

System Interface (SCSI)

2 ANSI X3.131-1994 American National Standard for

Information Systems—Small Computer

System Interface-2 (SCSI-2)

3 ISO/IEC 10090 90 mm optical disk cartridges,

rewritable and read only, for data

interchange

4 ISO/IEC 13963 Data interchange om 90 mm optical disk

cartridges,

– Capacity: 230 megabytes per

cartridge

5 ISO/IEC 15041 Data interchange om 90 mm optical disk

cartridges,

– Capacity: 640 megabytes per

cartridge

*Note: ISO = International Organization for Standardization

IEC = International Electrical Commission JTC1 = Joint Technical Commitee 1

American National

Standards Institute

(ANSI)

American National

Standards Institute

(ANSI)

ISO/IEC JTC1*

x C156-E097-01EN

page

CHAPTER 1 GENERAL DESCRIPTION................................................................................1 - 1

1.1 Features.................................................................................................................................1 - 1

1.1.1 Performance..........................................................................................................................1 - 2

1.1.2 Reliability .............................................................................................................................1 - 3

1.1.3 Maintainability/operability...................................................................................................1 - 3

1.1.4 Adaptability ..........................................................................................................................1 - 4

1.1.5 Interface ................................................................................................................................1 - 4

1.2 Drive Configuration..............................................................................................................1 - 6

1.2.1 Drive model ..........................................................................................................................1 - 6

1.2.2 Configuration........................................................................................................................1 - 7

1.2.3 Mechanical sections..............................................................................................................1 - 7

1.2.4 Control circuit section ..........................................................................................................1 - 8

1.3 System Configuration...........................................................................................................1 - 10

1.3.1 SCSI bus configuration.........................................................................................................1 - 10

1.3.2 Input-output device addressing.............................................................................................1 - 11

CHAPTER 2 SPECIFICATIONS..............................................................................................2 - 1

2.1 Optical Disk Drive Specifications........................................................................................2 - 1

2.1.1 Model and product number...................................................................................................2 - 1

2.1.2 Drive specifications..............................................................................................................2 - 2

2.1.3 Environmental and power requirements...............................................................................2 - 5

2.1.4 Error rate...............................................................................................................................2 - 6

2.1.5 Reliability .............................................................................................................................2 - 7

2.2 SCSI Function Specification ................................................................................................2 - 8

2.3 Optical Disk Cartridge Specifications..................................................................................2 - 15

2.3.1 Recommended optical disk cartridge specifications............................................................2 - 15

2.3.2 Optical disk cartridge............................................................................................................2 - 16

2.3.3 Disk specifications................................................................................................................2 - 18

2.4 Defect Management..............................................................................................................2 - 20

2.4.1 Defect management schematic diagram...............................................................................2 - 20

C156-E097-01EN xi

CHAPTER 3 INSTALLATION REQUIREMENTS................................................................3 - 1

3.1 Environmental Requirements...............................................................................................3 - 1

3.1.1 Temperature measurement point..........................................................................................3 - 1

3.1.2 Temperature requirements and measuring method..............................................................3 - 3

3.1.3 Air flow.................................................................................................................................3 - 3

3.1.4 Temperature rise under several conditions...........................................................................3 - 4

3.1.5 Air purity...............................................................................................................................3 - 4

3.2 Mounting Requirements .......................................................................................................3 - 5

3.2.1 External dimensions..............................................................................................................3 - 5

3.2.2 Installation direction.............................................................................................................3 - 7

3.2.3 Centers of gravity..................................................................................................................3 - 8

3.2.4 Notes on mounting................................................................................................................3 - 9

3.3 Power Supply Requirements.................................................................................................3 - 11

3.4 Connection Requirement......................................................................................................3 - 14

3.4.1 Connectors and terminals .....................................................................................................3 - 14

3.4.2 Cable connection requirements ............................................................................................3 - 17

3.4.3 External operator panel.........................................................................................................3 - 22

3.4.4 External operator panel setting (CNH2)...............................................................................3 - 25

CHAPTER 4 INSTALLATION..................................................................................................4 - 1

4.1 Notes on Drive Handling......................................................................................................4 - 1

4.2 Connection Modes................................................................................................................4 - 4

4.3 Settings..................................................................................................................................4 - 5

4.3.1 Setting switches (SW1).........................................................................................................4 - 7

4.3.2 Setting of supplying power to SCSI terminating resistor.....................................................4 - 10

4.3.3 SCSI terminating resistor mode............................................................................................4 - 10

4.4 Mounting...............................................................................................................................4 - 12

4.4.1 Checks before mounting the drive........................................................................................4 - 12

4.4.2 Mounting procedure..............................................................................................................4 - 13

4.5 Cable Connections................................................................................................................4 - 13

4.6 Operation Confirmation and Preparation for Use after Installation.....................................4 - 14

4.6.1 Confirming initial operations................................................................................................4 - 14

4.6.2 SCSI connection check.........................................................................................................4 - 15

4.7 Dismounting Drive ...............................................................................................................4 - 17

C156-E097-01ENxii

CHAPTER 5 OPERATION AND CLEANING........................................................................5 - 1

5.1 Operating Optical Disk Drive...............................................................................................5 - 1

5.1.1 Optical disk drive..................................................................................................................5 - 1

5.1.2 Note.......................................................................................................................................5 - 2

5.1.3 Inserting cartridge.................................................................................................................5 - 2

5.1.4 Ejecting (removing) cartridge..............................................................................................5 - 4

5.2 Cleaning Drive......................................................................................................................5 - 6

5.3 Optical Disk Cartridge Operation.........................................................................................5 - 7

5.3.1 Optical disk cartridge............................................................................................................5 - 7

5.3.2 Write protect tab ...................................................................................................................5 - 8

5.3.3 Notes................................................................................................ ................................ .....5 - 9

5.4 Cleaning Optical Disk Cartridge..........................................................................................5 - 9

5.4.1 Cleaning tool.........................................................................................................................5 - 9

5.4.2 Cleaning procedure...............................................................................................................5 - 10

CHAPTER 6 DIAGNOSIS AND MAINTENANCE................................ ................................6 - 1

6.1 Diagnosis...............................................................................................................................6 - 1

6.1.1 Initial self-diagnosis..............................................................................................................6 - 2

6.1.2 Diagnostic command ............................................................................................................6 - 2

6.1.3 Test program.........................................................................................................................6 - 2

6.2 Maintenance Information......................................................................................................6 - 3

6.2.1 Maintenance requirements....................................................................................................6 - 3

6.2.2 Revision number...................................................................................................................6 - 4

CHAPTER 7 SCSI BUS...............................................................................................................7 - 1

7.1 System Configuration...........................................................................................................7 - 1

7.2 Interface Signal Definition ...................................................................................................7 - 3

7.3 Electrical Requirements........................................................................................................7 - 6

7.3.1 SCSI interface.......................................................................................................................7 - 6

7.3.2 Power supply for terminating resistor ..................................................................................7 - 7

7.3.3 Signal driving conditions......................................................................................................7 - 8

7.4 Timing Rule..........................................................................................................................7 - 10

7.5 Bus Phases ............................................................................................................................7 - 13

7.5.1 BUS FREE phase..................................................................................................................7 - 13

7.5.2 ARBITRATION phase.........................................................................................................7 - 14

7.5.3 SELECTION phase ..............................................................................................................7 - 17

C156-E097-01EN xiii

7.5.4 RESELECTION phase .........................................................................................................7 - 19

7.5.5 INFORMATION TRANSFER phases.................................................................................7 - 21

7.5.6 COMMAND phase...............................................................................................................7 - 30

7.5.7 DATA phase .........................................................................................................................7 - 30

7.5.8 STATUS phase ................................................................................................ .....................7 - 33

7.5.9 MESSAGE phase..................................................................................................................7 - 33

7.5.10 Signal requirements concerning transition between bus phases..........................................7 - 34

7.5.11 Time monitoring feature.......................................................................................................7 - 36

7.6 Bus Conditions......................................................................................................................7 - 37

7.6.1 ATTENTION condition........................................................................................................7 - 37

7.6.2 RESET condition..................................................................................................................7 - 40

7.7 Bus Sequence........................................................................................................................7 - 42

Glossary..............................................................................................................................................GL - 1

Abbreviations................................................................................................................................ .....AB - 1

Index...................................................................................................................................................IN - 1

C156-E097-01ENxiv

FIGURES

page

1.1 MCE3064SS/MCF3064SS outer view (with panel).............................................................1 - 6

1.2 MCE3064SS/MCF3064SS outer view (without panel) .......................................................1 - 6

1.3 Optical disk drive configuration...........................................................................................1 - 7

1.4 Control circuit section block diagram ..................................................................................1 - 8

1.5 System configuration example ............................................................................................1 - 10

2.1 Optical disk cartridge............................................................................................................2 - 16

2.2 Algorithms for alternate processing ....................................................................................2 - 20

2.3 Example of alternate processing...........................................................................................2 - 21

3.1 Surface temperature measurement points.............................................................................3 - 2

3.2 Dimensions ...........................................................................................................................3 - 5

3.3 Dimensions (without panel)..................................................................................................3 - 6

3.4 Installation directions ...........................................................................................................3 - 7

3.5 Centers of gravity..................................................................................................................3 - 8

3.6 Mounting frame structure .....................................................................................................3 - 9

3.7 Service clearance..................................................................................................................3 - 10

3.8 Current waveform (+5 VDC)................................................................................................3 - 11

3.9 Power on/off sequence (1)....................................................................................................3 - 11

3.10 Power on/off sequence (2)....................................................................................................3 - 12

3.11 Power on/off sequence (3)....................................................................................................3 - 12

3.12 AC noise filter (recommended)............................................................................................3 - 13

3.13 Connector and terminal locations.........................................................................................3 - 14

3.14 Power supply connector........................................................................................................3 - 15

3.15 SCSI interface connector (drive side)...................................................................................3 - 15

3.16 Cable connection mode.........................................................................................................3 - 17

3.17 SCSI cable connector............................................................................................................3 - 19

3.18 SCSI cable connection..........................................................................................................3 - 21

3.19 External operator panel circuit example...............................................................................3 - 23

3.20 External operator panel interface connector.........................................................................3 - 24

4.1 Packaging style.....................................................................................................................4 - 3

4.2 SCSI bus connection modes ................................................................................................4 - 4

4.3 Positions of setting terminals and switches..........................................................................4 - 6

4.4 Setting switch (SW1)............................................................................................................4 - 7

C156-E097-01EN xv

4.5 SCSI connection check ........................................................................................................4 - 16

5.1 Optical disk drive front view (with panel) ...........................................................................5 - 1

5.2 Inserting cartridge.................................................................................................................5 - 4

5.3 Removing cartridge ..............................................................................................................5 - 5

5.4 Optial disk cartridge .............................................................................................................5 - 7

5.5 Write protect tab ..................................................................................................................5 - 8

5.6 Cleaning procedure (1) .........................................................................................................5 - 11

5.7 Cleaning procedure (2) .........................................................................................................5 - 11

5.8 Cleaning procedure (3) .........................................................................................................5 - 12

5.9 Cleaning procedure (4) .........................................................................................................5 - 13

6.1 Revision label ......................................................................................................................6 - 4

6.2 Revision number indication..................................................................................................6 - 4

7.1 Example of SCSI configuration............................................................................................7 - 2

7.2 Interface signals....................................................................................................................7 - 3

7.3 DATA BUS and SCSI ID.....................................................................................................7 - 4

7.4 SCSI termination circuit.......................................................................................................7 - 7

7.5 BUS FREE phase..................................................................................................................7 - 14

7.6 ARBITRATION phase.........................................................................................................7 - 16

7.7 SELECTION phase ..............................................................................................................7 - 18

7.8 RESELECTION phase .........................................................................................................7 - 20

7.9 INFORMATION TRANSFER phase (phase control) .........................................................7 - 22

7.10 Transfer in asynchronous mode............................................................................................7 - 24

7.11 Transfer in synchronous mode..............................................................................................7 - 28

7.12 Transfer in FAST SCSI mode...............................................................................................7 - 29

7.13 Data transfer rate in asynchronous mode .............................................................................7 - 31

7.14 Data transfer rate in synchronous mode...............................................................................7 - 33

7.15 Switching direction of transfer over the data bus.................................................................7 - 35

7.16 ATTENTION condition........................................................................................................7 - 39

7.17 RESET condition..................................................................................................................7 - 41

7.18 Bus phase sequence ..............................................................................................................7 - 43

7.19 Example of bus phase transition on execution of a single command ..................................7 - 45

C156-E097-01ENxvi

TABLES

page

2.1 Model and order number ......................................................................................................2 - 1

2.2 Specifications .......................................................................................................................2 - 2

2.3 Environmental and power requirements ..............................................................................2 - 5

2.4 SCSI function specifications ................................................................................................2 - 8

2.5 Recommended optical disk cartridge specifications............................................................2 - 15

2.6 Disk specifications ...............................................................................................................2 - 18

3.1 Temperature requirements at measurement points...............................................................3 - 3

3.2 Temperature at each measuring point (Reference) ..............................................................3 - 4

3.3 Signal assignment of SCSI connector ..................................................................................3 - 16

3.4 Recommended components for connection..........................................................................3 - 18

3.5 SCSI cable requirememts .....................................................................................................3 - 20

3.6 External operator panel interface..........................................................................................3 - 24

3.7 Device type mode setting .....................................................................................................3 - 25

3.8 SCAM mode setting .............................................................................................................3 - 25

3.9 Write verify mode setting.....................................................................................................3 - 26

3.10 Macintosh mode setting........................................................................................................3 - 26

3.11 Logical specification type setting.........................................................................................3 - 27

4.1 SCSI ID setting (SW1) .........................................................................................................4 - 8

4.2 SCSI data bus parity checking (SW1)..................................................................................4 - 8

4.3 Write cache mode setting .....................................................................................................4 - 9

4.4 Device type mode setting .....................................................................................................4 - 9

4.5 Spindle automatic stop mode setting....................................................................................4 - 10

4.6 SCSI terminating resistor power supply (CNH1).................................................................4 - 10

4.7 SCSI terminating resistor mode (CNH1) .............................................................................4 - 11

4.8 Setting checklist....................................................................................................................4 - 12

5.1 Head cleaner ........................................................................................................................5 - 6

5.2 Cleaning kit ..........................................................................................................................5 - 9

5.3 Packaged items (cleaning kit)...............................................................................................5 - 10

6.1 Self-diagnostic function........................................................................................................6 - 1

7.1 INFORMATION TRANSFER phase identification............................................................7 - 6

7.2 Requirements for terminating resistor power supply................................ ...........................7 - 7

7.3 Signal status..........................................................................................................................7 - 8

C156-E097-01EN xvii

7.4 Signal driving method...........................................................................................................7 - 8

7.5 Bus phases and signal sources..............................................................................................7 - 9

7.6 Timing specifications ...........................................................................................................7 - 10

7.7 FAST SCSI Timing specifications.......................................................................................7 - 12

7.8 Parameters used for synchronous data transfer ....................................................................7 - 32

7.9 Setting value of SCSI time monitoring ................................................................................7 - 36

xviii C156-E097-01EN

CHAPTER 1 GENERAL DESCRIPTION

1.1 Features

1.2 Drive Configuration

1.3 System Configuration

This chapter describes the features and configuration of the optical disk drives.

The MCE3064SS/MCF3064SS (hereafter optical disk drive) are disks that maintain the compatibility and intend high speed as the succeed drive of the the MCB3064SS/MCC3064SS.

The MCE3064SS/MCF3064SS are high-performance, 3.5-inch commutative rewritable optical disk drives which incorporate an SCSI controller.

The interface connecting the MCE3064SS/MCF3064SS drives to the host system complies with the Single-Ended SCSI-2 standard (ANSI X3T9.2/86-109: Small Computer System Interface-2).

The flexibility and expandability of the SCSI, the high performance of the MCE3064SS/MCF3064SS optical disk drives, and the drives' commands set enable the user to construct high-reliability, highperformance disk subsystems with advanced functions and large-scale storage.

1.1 Features

This section describes the following drive features:

• Performance

• Reliability

• Maintainability/operability

• Adaptability

• Interface

C156-E097-01EN 1 - 1

1.1.1 Performance

(1) Half-height standard 3.5-inch size (1-inch height)

The SCSI controller can be directly connected to the system SCSI bus. The controller meets the specifications of the standard 1-inch height 3.5-inch fixed disk drive form factor.

(2) High-speed data transfer

• The rpm of the MCE3064SS disk medium is 4558 rpm and MCF3064SS disk medium is

3600 rpm.

• The disk drive is capable of 2.94 to 4.9 MB/sec (640 MB) high-speed data transfer.

Note:

The maximum data transfer rate in asynchronous transfer mode may be limited by the initiator response time and SCSI bus cable length. The maximum data transfer rate through a single-ended SCSI bus in synchronous transfer mode is limited also by the SCSI bus cable length and transfer features.

(3) High-speed mean seek time

This drive features a linear voice-coil motor for high-speed head positioning. The average seek time is the average of 1,000 random seeks and is 23 ms (128 MB, 230 MB, 540 MB, and 640 MB). (However, this does not include SCSI overhead or address check.)

(4) ISO standard (medium compatibility)

3.5-inch, cartridge-type, 128-MB, 230-MB, 540-MB, and 640-MB rewritable disks that comply with the ISO standard can be used.

(5) Partial ROM/O-ROM optical media support

This drive can handle the partical ROM media, that means an ROM area is established as a part of rewritable area, and O-ROM media.

(6) Direct-overwrite medium support

An optical disk drive can use an optic modulation direct-overwritten medium that does not read an erase operation: 540-MB disk and 640-MB disk that comply with the ISO standard and 230MB disk.

1 - 2 C156-E097-01EN

(7) Dust resistance

Through low power consumption, a cooling fan is rendered unnecessary in the optical disk drive, and through the use of a film on the top and a metal plate on the bottom that excludes dust, a simple, protective sealed construction is realized. This device is compliant with standards for use in a Class 5 millions or lower dust environment.

(8) Lower power consumption

The power consumption of the optical disk drive is 4.9 W (at read/write). The minimum power consumption is 0.5 W during power save.

(9) Automatic spindle stop function

If access is not made within a certain time, this function stops disk rotation to minimize dust accumulation on the disk. This function can be set that time by the MODE SELECT command.

1.1.2 Reliability

(1) Mean time between failure (MTBF)

This drive features a 120,000 hour MTBF.

(2) Error recovery

For the error depending on the optical disk drive, an recovery process is made by a suitable retry. This drive features Reed-Solomon error correction (ECC) to assure error-free operation.

(3) Automatic allocation of alternate data blocks

This drive features a function which automatically allocates alternate data blocks to defective data blocks detected while data is being read from or written to an optical disk.

1.1.3 Maintainability/operability

(1) Diagnostic function

This drive has a diagnostic function to check optical disk drive operations. The diagnostic function facilitates test and restoration.

C156-E097-01EN 1 - 3

1.1.4 Adaptability

(1) Wide operating environment

An LSI circuits reduce power consumption to 4.9 W (read/write). This drive features a wide operating environment (drive envronment 5 to 45°C or larger than general office environment). Dust particles are class 5 millions or less.

(2) Low noise and low vibration

This drive operates quietly (26 dBA or less) even during seek operations and will not degrade the office environment. Rubber vibration isolators support the drive and minimize vibration.

(3) Vibration resistance (shock resistance)

Rubber vibration isolators protect the drive against external shock or vibration.

(4) Safety standards

• UL1950 (U.S.A., safety)

• CDRH class 1 (U.S.A., laser)

• CSA C22.2 No. 950 (Canada, safety)

• EN60950 (Europe, safety)

• EN60825 Class 1 (Europe, laser)

(5) Various radio wave standards

This optical disk device is installed in a host system, and meets the following standards:

• EN55022 class B, EN50082-1 (European wave standards)

• AS/NZS3548 class B (Australian wave standards)

1.1.5 Interface

(1) SCSI-2

This drive supports the basic SCSI-2 specifications.

SCSI commands enable operation using logical block addresses that are independent of the physical attributes of the drive, enabling software flexibility in terms of system expansion.

(2) Continuous block processing

Logical block addresses are used for data block addressing. Without consideration of the physical attributes of track boundaries, the initiator can access data by specifying a block number in logically continuous data space.

1 - 4 C156-E097-01EN

(3) Mass storage data buffer

2,016 KB buffer is used to transfer data between the SCSI bus and disk. Since data is stored in this buffer, the initiator can execute input-output processing effectively by using the high-speed data transfer capability of the SCSI bus without regard to the data transfer rate of the optical disk drive.

(4) Read-ahead cache feature

The read-ahead cache feature enables high-speed sequential data access as follows:

After executing a command to read data from the disk, the drive automatically reads the next data block and stores it in the data buffer (pre-reading). If the next command requests this data, the data is transferred from the buffer without another disk access.

(5) Write cache feature

When the host system issues the write command to the optical disk drive, a command complete is usally responded after completion of the write and verify operations. By using the write cache feature, a command complete is responded after completion of the data transfer to the data buffer without waiting the completion of the write and verify operations then the write and verify operations are made asychronouslly with the SCSI operation. Therefore, the apparent write command processing time measured at the host system is reduced and the I/O performance of the host system is improved.

The write cache teature is enabled or disabled by the setting swich.

Cautions When Using the Write Cache When the write cache function is activated, a write error is reported when the end status is indicated for a command different from and subsequent to the specified command. If the initiator executes only an error report command retry, the data in the block where the error occurred will not be written correctly, so caution is necessary..

(6) Reserve and release functions

Reserve and release functions permit exclusive access control in multihost or multi-initiator environments.

(7) Defective block slipping

When a disk is initialized, logical data blocks are reallocated in a physical sequence by slipping defective data blocks. This enables high-speed continuous data block processing without rotational delay due to defective data blocks.

C156-E097-01EN 1 - 5

1.2 Drive Configuration

1.2.1 Drive model

Figures 1.1 to 1.3 show the MCE3064SS/MCF3064SS outer view.

Figure 1.1 MCE3064SS/MCF3064SS outer view (With panel)

Figure 1.2 MCE3064SS/MCF3064SS outer view (Without panel)

1 - 6 C156-E097-01EN

1.2.2 Configuration

Figure 1.3 shows the drive configuration.

The drive consists of mechanical sections, a fixed optics section, actuator, and a control circuit section. The mechanical sections include the spindle motor, actuator section, bias magnet, and the cartridge folder vertical motion mechanism.

The fixed optics section consists of the optical components, position detector, and LD controller.

The control circuit sections include the drive control circuit section and SCSI controller section.

Optical disk cartridge

Spindle motor

Figure 1.3 Optical disk drive configuration

1.2.3 Mechanical sections

(1) Optical disk cartridge load/eject

The system includes a cartridge mechanism which lowers the optical disk cartridge and mounts (loads) it on the spindle motor automatically when the optical disk cartridge is fully inserted in the optical disk drive’s disk slot, and a mechanism which automatically ejects the cartridge when the Eject button on the front panel is pressed.

Control circuit section

Fixed optics sectionActuator section

(2) Spindle motor

The optical disk cartridge’s hub and the spindle motor’s shaft are connected magnetically. Therefore, if the spindle motor’s shaft is rotating, the disk medium is rotating at the same speed. A DC brushless motor is used for this spindle motor. It realizes high speed rotation at 4558 rpm for MCE3064SS and 3600 rpm for MCF3064SS, and a high precision rotating system (±0.1%).

(3) Actuator section

The positioner moves (seeks) a head actuator radially across the disk surface.

The positioner is driven by a linear voice coil motor. A pulse-width modulation (PWM) is adopted as a driving system and realizes low power consumption and high-speed access.

C156-E097-01EN 1 - 7

(4) Separate optical sections

The optical head section is separated in such a way that the fixed optics section is separated from the moving optics section to minimize seek time and positioning error. (See Subsection 1.2.4 for the fixed optical section.) This reduces the weight of the moving parts.

The fixed optical section consists of the laser diodes, collimator lens, and optical detector.

The laser diode for recording and playback, and transmits one laser beam to the actuator section.

(5) Panel

The central part of the panel is hollowed out deeply to provide pushing finger space for inserting the cartridge, thereby facilitating the insertion.

The panel is also simply designed by making the eject button and LED light emitting part integral with each other.

1.2.4 Control circuit section

Figure 1.4 is the block diagram of the control circuit section.

SCSI Interface

Main control MPU ODC DSP User Logic LSI i/f

F-ROM D-RAM

Drive Read Amp Power Amp Filter Sensor Motor Driver

Figure 1.4 Control circuit section block diagram

The control circuit section is divided into two parts: an SCSI controller section which deals with control between the SCSI interface and drive interface, and a drive circuit section which controls the drive.

Head Laser Diode Photo Diode APC Amp LPC Amp Head Amp

Actuator Focus Act. Track Act. Spindle Motor Temperature Sensor

Bias Coil Eject Motor Cartridge Sensor

1 - 8 C156-E097-01EN

(1) SCSI controller circuit section

The SCSI controller circuit's reliability is improved by large-scale integrated circuit technology. The high-speed microprocessor (MPU) handles SCSI interface control and drive control such as drive read-and-write control and single-beam control.

(2) Drive circuit section

The drive circuit section consists of the following circuits:

• Laser diode control circuit

• Signal reproduction circuit

• Servo/seek control circuit

• Rotation control circuit

• Drive miscellaneous control circuit

The DSP (digital signal processor) is used for the servo/seek control circuit to reduce the circuit amount, therefore this circuit is a simple configuration.

The drive circuit section executes operations such as seek, erase, record, and playback while the MPU controls the focus-tracking of the beam.

C156-E097-01EN 1 - 9

1.3 System Configuration

An optical disk drive connected to the system SCSI bus always operates as a target. Figure 1.5 is a system configuration example. Through the SCSI bus, the optical disk drive executes the input-output operation specified by the SCSI device that operates as the initiator.

Figure 1.5 System configuration example

1.3.1 SCSI bus configuration

A maximum of eight SCSI devices can be connected to the SCSI bus. The combination of an SCSI device operating as an initiator and an SCSI device operating as a target is arbitrary. A multihost system can be configured in which several host systems operate as initiators.

The disconnect or reconnect function enables input-output processing in parallel through more than one SCSI device.

1 - 10 C156-E097-01EN

1.3.2 Input-output device addressing

A unique device address (SCSI ID: #n in Figure 1.5) is assigned to each SCSI device. Inputoutput devices connected to or under an SCSI device operating as a target are accessed in logical units. A unique device address (LUN: logical unit number) is assigned to each logical unit.

An initiator specifies an SCSI ID to select an SCSI device operating as a target, then specifies an LUN to select the input-output device connected to or under the target.

An optical disk drive is constructed with all volumes as a single logical unit. Specifiable SCSI IDs and LUN are as follows:

• SCSI ID: #0 to #7 selectable (setting terminal or external input)

• LUN: #0 (fixed)

C156-E097-01EN 1 - 11

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CHAPTER 2 SPECIFICATIONS

2.1 Optical Disk Drive Specifications

2.2 SCSI Function Specification

2.3 Optical Disk Cartridge Specifications

2.4 Defect Management

This chapter contains the specifications of the optical disk drive, SCSI functions, and the optical disk cartridge.

2.1 Optical Disk Drive Specifications

2.1.1 Model and product number

The model names MCE3064SS/MCF3064SS represent optical disk drives using 128MB, 230MB, 540MB, and 640MB media.

These drives were designed for single-ended SCSI operation. Table 2.1 lists the model and order number.

Table 2.1 Model and order number

Model Order number Panel Panel color Mounting screw Cache size

MCE3064SS CA01747-B101 With panel Light gray

(2.5Y 7.2/0.4)

MCF3064SS CA05437-B101 With panel Light gray

(2.5Y 7.2/0.4)

Remarks: The panel colors (2.5Y 7.2/0.4) are indicated in Munsell symbols. (JIS28721)

Inch screw (32UNC)

2 MB

C156-E097-01EN 2 - 1

2.1.2 Drive specifications

Table 2.2 lists MCE3064SS/MCF3064SS drives specifications

Table 2.2 Specifications (1 of 4)

For MCE3064SS

Item Specifications Optical disk cartridge 128 MB media 230 MB media 540 MB media 640 MB media Total capacity Unformatted 181 MB 325 MB 819 MB 818 MB

Formatted 128 MB 230 MB 538 MB 643 MB

Capacity/track Unformatted 18,100 bytes 18,100 bytes

Formatted 12,800 bytes 12,800 bytes

Capacity/sector Unformatted 725 bytes 778 bytes 2,584 bytes

Formatted 512 bytes 2,048 bytes Number of user tracks/side (*1) 10,000 17,940 42,042 18,480 Number of alternate sectors/side Number of sectors/track 25 17 Data transfer rate 1.37 MB/s (max.)

Random seek time (*2) 23 ms typ Average latency 6.6 ms Rotational speed 4,558 rpm ±0.1% Heads One-head on the positioner Positioner type Linear voice coil motor Servo tracking method ISO continuous servo method Density 24,424 bpi

Loading time (*3) 7 sec. Unloading time (*4) 4 sec. Load/unload life 20,000 Host interface SCSI-2 (Single-ended)

Data transfer rate (*5) Synchronous mode: 20 MB/s (max.)

Data buffer 2,016 KB Error correction (*6) Correctable up to 8-byte/interleave

≤1,024 ≤1,025 ≤2,250 ≤2,244

0.32 MB/s continuous writing (execution)

0.97 MB/s continuous reading (execution)

(1.04µm/bit) 15,875 tpi

Unshielded 50-contact connector Terminating resistor provided

Asynchronous mode: 5 MB/s (max.)

Bit error rate: 10

(logical track capacity)

1.65 to 2.65 MB/s (max.)

0.39 to 0.62 MB/s continuous writing (execution)

1.16 to 1.86 MB/s continuous reading (execution)

29,308 bpi (0.87µm/bit) 18,275 tpi

-12

less

19,450 bytes (logical track capacity)

12,800 bytes (logical track capacity)

2.95 to 4.96 MB/s (max.)

0.64 to 1.08 MB/s continuous writing (execution)

1.92 to 3.26 MB/s continuous reading (execution)

52,900 bpi 23,090 tpi

43,928 bytes (logical track capacity)

34,816 bytes (logical track capacity)

2.94 to 4.90 MB/s (max.)

0.77 to 1.29 MB/s continuous writing (execution)

2.33 to 3.88 MB/s continuous reading (execution)

2 - 2 C156-E097-01EN

Table 2.2 Specifications (2 of 4)

For MCF3064SS

Item Specifications Optical disk cartridge 128 MB media 230 MB media 540 MB media 640 MB media Total capacity Unformatted 181 MB 325 MB 819 MB 818 MB

Formatted 128 MB 230 MB 538 MB 643 MB

Capacity/track Unformatted 18,100 bytes 18,100 bytes

Formatted 12,800 bytes 12,800 bytes

Capacity/sector Unformatted 725 bytes 778 bytes 2,584 bytes

Formatted 512 bytes 2,048 bytes Number of user tracks/side (*1) 10,000 17,940 42,042 18,480 Number of alternate sectors/side Number of sectors/track 25 17 Data transfer rate 1.09 MB/s (max.)

Random seek time (*2) 23 ms typ Average latency 8.3 ms Rotational speed 3,600 rpm ±0.1% Heads One-head on the positioner Positioner type Linear voice coil motor Servo tracking method ISO continuous servo method Density 24,424 bpi

Loading time (*3) 7 sec. Unloading time (*4) 4 sec. Load/unload life 20,000 Host interface SCSI-2 (Single-ended)

Data transfer rate (*5) Synchronous mode: 20 MB/s (max.)

Data buffer 2,016 KB Error correction (*6) Correctable up to 8-byte/interleave

≤1,024 ≤1,025 ≤2,250 ≤2,244

0.25 MB/s continuous writing (execution)

0.76 MB/s continuous reading (execution)

(1.04µm/bit) 15,875 tpi

Unshielded 50-contact connector Terminating resistor provided

Asynchronous mode: 5 MB/s (max.)

Bit error rate: 10

(logical track capacity)

1.3 to 2.1 MB/s (max.)

0.31 to 0.49 MB/s continuous writing (execution)

0.92 to 1.47 MB/s continuous reading (execution)

29,308 bpi (0.87µm/bit) 18,275 tpi

-12

less

19,450 bytes (logical track capacity)

12,800 bytes (logical track capacity)

2.33 to 3.92 MB/s (max.)

0.51 to 0.86 MB/s continuous writing (execution)

1.52 to 2.58 MB/s continuous reading (execution)

52,900 bpi 23,090 tpi

43,928 bytes (logical track capacity)

34,816 bytes (logical track capacity)

2.32 to 3.87 MB/s (max.)

0.61 to 1.02 MB/s continuous writing (execution)

1.84 to 3.07 MB/s continuous reading (execution)

C156-E097-01EN 2 - 3

Table 2.2 Specifications (3 of 4)

*1 The number of user tracks indicates the maximum user zone which includes the spare area

and slipping area.

*2 Mathematical average of 1,000 times of seek and does not include SCSI overhead nor track

address recognition time. Furthermore, it may reach a maximum of 35 ms depending on the quality of media and drive installation environment.

*3 Loading time is the time from when the optical disk cartridge is inserted to when the optical

disk drive is ready.

*4 Unloading time is the time from when the eject button is pressed or the eject command is

issued to when the optical disk cartridge is ejected.

*5 The maximum SCSI data transfer rate may be limited by the initiator response time, SCSI

bus transfer characteristics, or transfer distance.

*6 The bit error rate must be 10

-12

or less when a disk whose raw error rate is 10-4 or less is

used.

Table 2.2 Specifications (4 of 4)

Power save mode

Power save mode 1 2 3

Time for entering power save mode

2 sec. 5 min. 33 min. (continuous time without accessing from SCSI)

Power consumption (*7) 3.2 W 1.8 W 0.5 W Returning time to normal mode (*7) 20 ms 1.0 sec. 5.0 sec.

Power save mode 1: Read amp Power save mode 2: Servo off Power save mode 3: Spindle off, LD off

*7 Average values in case of environment of a temperature of 25°C, voltage of 5 V and with

terminating resistor turned off.

2 - 4 C156-E097-01EN

2.1.3 Environmental and power requirements

Table 2.3 lists the environmental and power requirements.

Table 2.3 Environmental and power requirements (1 of 2)

Item Specification

Power requirements

Power consumption

Average +5 VDC±5%, 1.1 A (2.5 A Max., excluded for

terminating resistor) (*1) Ready 3.9 W (*2) Random seek, read, or write

4.9 W (TYP) (*2)

(*2) Power save 0.5 W (MIN) (*2)

Dimensions (W×D×H)

With panel Without panel

101.6×150.0×25.4 mm

101.6×148.4×25.4 mm

Weight 470 g (with panel) Environmental

requirements

Operating Temperature: 5 to 45°C (*3)

(gradient 15°C /h or less)

Relative humidity: 10 to 85% (Noncondensing)

Max. wet bulb temperature: 29°C or lower Idle Temperature: 0 to 50°C

Relative humidity: 10 to 85% (Noncondensing)

Max. wet bulb temperature: 36°C or lower Transport Temperature: – 40 to 60°C (24 hours or less)

Temperature: – 20 to 60°C (24 hours or more)

Relative humidity: 5 to 90% (Noncondensing)

Max. wet bulb temperature: 41°C or lower

Requirement: Packing conditions specified by Fujitsu

Installation Tilt angle –5° to +10° Vibration/

shock

Operating 0.4 G (5 to 500 Hz, sine sweep)

Shock 2 G (10ms, half-sine pulse) Idle

No cartridge, power ON

1.0 G (5 to 500 Hz, sine sweep)

Shock 5 G (10 ms, half-sine pulse) Transport Shock 50 G (10 ms, half-sine pulse)

Requirement: Packing conditions specified by Fujitsu

Altitude Operating 3,000 m (10,000 ft) or less

Idle 12,000 m (40,000 ft) or less

C156-E097-01EN 2 - 5

Table 2.3 Environmental and power requirements (2 of 2)

Item Specification

Ambient for

Air flow (*3) Unused

purity

Air purity General office environment or better

Note:

1. Current limiter value for +5 VDC power: 5 A or less

2. Specifications under transporting condition are under the packaging specified by Fujitsu.

3. A voltage drop may occur depending on the used power supply or power cable.

*1 At random seek or read/write. Excluding pulse waveform under 500 µs or less. *2 It demonstrates a power of 5.3 W in an installation environment of a temperature of 25°C,

voltage of 5 V and with terminating resistor turned off.

*3 The efficiency is specified in an environment of a temperature of 25°C and 0° horizontal

level placement.

*4 For details, refer to section 3.1.3 ‘Air Flow’

2.1.4 Error rate

Data blocks to be accessed are evenly distributed on the disk. Errors due to disk defects are not included.

(dust perticles: Class 5 millions or less)

(1) Bit error rate after ECC processing

The error rate after ECC processing must be 10 error rate is 10

-4

or less should be used.

(2) Positioning error rate

The positioning error rate must be 10

-12

or less. An optical disk cartridge whose raw

-6

or less. (with retry)

2 - 6 C156-E097-01EN

2.1.5 Reliability

(1) Mean time between failures (MTBF)

The MTBF is 120,000 hours or more. Failure due to disk errors is not included.

Conditions

• Power-on time: 200 hours/month or less

• LD-on time: 20% or less of power-on time

• Environment Temp.: 25°C

Note:

The MTBF is defined as follows:

total operating time in all fields (hours)

MTBF=

number of device failure in all fields

1) Operating time is the total time power is applied.

2) Device failures indicate that devices require repair, readjustment, or replacement. Failure due to external factors such as minor defects during device handling, operation outside environmental specifications, power failure, host system errors, and interface cable errors are not included.

(2) Data security at power failure

Except for the data of the block to which write operation is in progress, all data on the disk is secure from power failure. This does not apply if power failure occurs during disk initialization (formatting) or defect processing (alternate block allocation).

C156-E097-01EN 2 - 7

2.2 SCSI Function Specification

Table 2.4 shows the SCSI functions of the optical disk drive. Refer to “SCSI Logical Interface Specifications” for details on each functions.

Table 2.4 SCSI function specifications (1 of 7)

Item Specification

×: Supported –: Not supported

Electrical requirement

Connector Nonshielded Data bus parity Bus arbitration function Disconnection/Reconnection function Addressing SCSI ID #0 to #7 Switch selectable

Data transfer Asynchronous mode

Data buffer 2,016 KB Data block length 512 bytes, 2,048 bytes SCSI-1

Single-ended TERMPWR signal supply/demand function Terminating resistor On/Off function

LUN (Logical unit number) #0 is Fixed

Synchronous mode

× ×Jumper selectable ×Jumper selectable ×(Protect key provided) ×Switch selectable × ×

×5 MB/s Max. ×20 MB/s Max.

SCSI-2

2 - 8 C156-E097-01EN

Table 2.4 SCSI function specifications (2 of 7)

Item Specification

×: Supported –: Not supported

1-byte message COMMAND COMPLETE X’00’

SAVE DATA POINTER X’02’ RESTORE POINTERS X’03’

DISCONNECT X’04’

INITIATOR DETECTED ERROR X’05’ ABORT X’06’ MESSAGE REJECT X’07’ NO OPERATION X’08’ MESSAGE PARITY ERROR X’09’ LINKED COMMAND COMPLETE X’0A’ LINKED COMMAND COMPLETE WITH

FLAG X’0B’ BUS DEVICE RESET X’0C’ CLEAR QUEUE X’0E’

(TARG → INIT) × (INIT → TARG)

× × ×

–

× × × × × × ×

× ×

INITIATE RECOVERY X’0F’ – TERMINATE I/O PROSESS X’11’ – IDENTIFY X’80 to ‘FF’ Disconnect Privilege (Disk Priv) Bit Logical Unit Target (LUNTAR) Bit –

2-byte message ABORT TAG X’0D’ –

SIMPLE QUEUE TAG X’20’ HEAD OF QUEUE TAG X’21’ ORDERED QUEUE TAG X’22’ IGNORE WIDE RESIDUE X’23’ –

× ×

× × ×

C156-E097-01EN 2 - 9

Table 2.4 SCSI function specifications (3 of 7)

Item Specification

×: Supported –: Not supported

Extended message

Command (group 0)

MODIFY DATA POINTER X’01’ to ’00’ – SYNCHRONUS DATA TRANSFER REQUEST X’01’ to ’01’ EXTENDED IDENTIFY X’01’ to ’02’ – WIDE DATA TRANSFER REQUEST X’01’ to ’03’ – TEST UNIT READY X’00’ REZERO UNIT X’01’ REQUEST SENSE X’03’ FORM UNIT X’04’ FmtData(Format Data) =0 Interleave factor Defect list by block address =0 Defect list by block address Defect list by byte length from Index =0 – Defect list by byte length from Index Defect list by physical sector address =0 –

≠0

× × × × × ×(Non-interleaved) ×

–

Defect list by physical sector address CmpLst (complete list) – FOV (format options valid) DPRY (disable primary) – DCRT (disable certification) STPF (stop format) – IP (initialize pattern) DSP (disable saving pattern) – Immed (immediate) –

≠0

–

2 - 10 C156-E097-01EN

Table 2.4 SCSI function specifications (4 of 7)

Item Specification

×: Supported –: Not supported

Command (group 0)

REASSIGM BLOCKS X’07’

READ X’08’

ERASE [VU]*1 X’09’

WRITE X’0A’

SEEK X’0B’

INQUIRY X’12’

EVPD (enable vital product data)

Standard inquiry data

MODE SELECT X’15’

PF (page format)

page X’01’ : Error recovery parameters

page X’20’ : Format parameters

SP (save page)

RESERVE X’16’

≠0

≠0 × (Non-interleaved)

× × × × × ×

–

× (64 bytes) ×

× × × ×

Extent Reservation Option –

RELEASE X’17’

Extent Reservation Option –

COPY X’18’ –

MODE SENSE X’1A’

DBD (disable block descriptor) –

START/STOP UNIT X’1B’

immed (immediate)

RECEIVE DIAGNOSTIC RESULTS X’1C’

SEND DIAGNOSTIC X’1D’

PREVENT/ALLOW MEDIUM REMOVAL X’1E’

*1 FUJITSU unique function

× × × × ×

C156-E097-01EN 2 - 11

Table 2.4 SCSI function specfications (5 of 7)

Item Specification

×: Supported –: Not supported

Command (group 1)

READ CAPACITY X’25’ RMI (partial medium indicator) READ X’28’ ERASE [VU]*1 X’29’ WRITE X’2A’ EBP (erase bypass) SEEK X’2B’ ERASE X’2C’ READ UPDATE BLOCK X’2D’ – WRITE AND VERIFY X’2E’ DPO (disable page out) – EBP (erase bypass) BytChk (byte check) – VERIFY X’2F’ SEARCH DATA HIGH X’30’ –

× × × × × × × ×

SEARCH DATA EQUAL X’31’ – SEARCH DATA LOW X’32’ – SET LIMITS X’33’ – PRE-FETCH X’34’ – SYNCHRONIZE CACHE X’35’ – LOCK/UNLOCK CACHE X’36’ – READ DEFECT DATA X’37’ PList GList Defect List Format

*1 FUJITSU unique function

× × ×

≠0 ×

2 - 12 C156-E097-01EN

Table 2.4 SCSI function specfications (6 of 7)

Item Specification

×: Supported –: Not supported

Command (group 1)

Command (group 2)

MEDIUM SCAN X’38’ –

COMPARE X’39’ –

COPY AND VERIFY X’3A’ –

WRITE BUFFER X’3B’

MODE [VU]*1 –

Buffer ID =0 –

READ BUFFER X’3C’

MODE [VU]*1 –

Buffer ID

UPDATE BLOCK X’3D’ –

READ LONG X’3E’

CORRECT

WRITE LONG X’3F’

CHANGE DIFINITION X’40’ –

LOG SELECT X’4C’

≠0

–

PCR (parameter code reset)

SP (save parameter)

PC (page control)

LOG SENSE X’4D’

PPC (parameter pointer control)

SP (save parameter)

PC (page control)

page X ’00’ (Suppoted Log Pages)

page X ’30’ (Statistics Log Pages) [VU]*1

*1 FUJITSU unique function

≠0 ≠01b

≠0 ≠0 ≠01b

– –

– – –

× ×

C156-E097-01EN 2 - 13

Table 2.4 SCSI function specfications (7 of 7)

Item Specification

×: Supported –: Not supported

Command (group 5)

MODE SELECT X’55’ –

MODE SENSE X’5A’ –

READ X’A8’ –

WRITE X’AA’ –

WRITE AND VERIFY X’AE’ –

VERIFY X’AF’ –

SEARCH DATA HIGH X’B0’ –

SEARCH DATA EQUAL X’B1’ –

SEARCH DATA LOW X’B2’ –

SET LIMITS X’B3’ –

READ DEFECT DATA X’B7’ –

Command link function

Relative block addressing function

Command stack function –

Read-ahead cache feature

× ×

Write cache feature

Cache control feature

× ×

2 - 14 C156-E097-01EN

2.3 Optical Disk Cartridge Specifications

2.3.1 Recommended optical disk cartridge specifications

Table 2.5 shows the specifications of the optical disk cartridge recommended for this optical disk drive. The use of another disk cartridge may lower drive performance.

Table 2.5 Recommended optical disk cartridge specifications

Model Order number Optical disk cartridge (128 MB) CA90002-C010 Optical disk cartridge (230 MB) CA90002-C011 Optical disk cartridge (540 MB) CA90002-C012 Optical disk cartridge (640 MB) CA90002-C013 Overwrite optical disk cartridge (230 MB) CA90002-C041 Overwrite optical disk cartridge (540 MB) CA90002-C042 Overwrite optical disk cartridge (640 MB) CA90002-C043

C156-E097-01EN 2 - 15

2.3.2 Optical disk cartridge

Figure 2.1 shows an optical disk cartridge. The figure below shows the cartridge with its shutter open.

• Shutter closed

• Shutter open

2) Shutter

1) Cartridge case

3) Write protect tab

4) Disk

Figure 2.1 Optical disk cartridge

5) Hub

2 - 16 C156-E097-01EN

The following explains the components of the optical disk drive shown in Figure 2.1:

1) Cartridge case

Covers the disk to protect it from damage when handled and facilitates disk replacement. The cartridge case is labeled and has a write protect tab.

2) Shutter

Protects the disk against dust. When the cartridge is inserted into the optical disk drive, the shutter (metallic door) is opened.

3) Write protect tab

The write protect tab selects whether write is enabled or disabled.

4) Disk

Holds information which can be read by an optical beam.

5) Hub

The hub is placed at the center of the disk and is linked to the spindle of the drive. The hub is used for radial centering and axial positioning.

C156-E097-01EN 2 - 17

2.3.3 Disk specifications

(1) 128 MB disk

The ISO/IEC10090 defines 128 MB disk specification.

(2) 230 MB disk

The ISO/IEC13963 defines 230 MB disk specification.

(3) 540 MB/640 MB disk

The ISO/IEC15041 defines 540 MB/640 MB disk specification.

Table 2.6 lists disk specifications.

Table 2.6 Disk specifications (1 of 2)

Item Specification

Disk media 128 MB 230 MB 540 MB 640 MB

Format User zone (radius) 24 to 40 mm 23.72 to

Track shape Spiral

Mechanical characteristics

Track pitch

Direction of rotation Counterclockwise (viewed from lens)

Number of zones – 10 18 11

Number of logical tracks/side – 17,940 42,042 18,480

Number of logical tracks/zone – 1,380 to 2,208 1,750 to 2,772 1,260 to 2,100

Number of physical tracks/side – 11,500 15,700 15,708

Number of physical tracks/zone – 1,150 875 (825) 1,428

Number of user tracks/side 10,000 17,940 42,042 18,480

Number of sectors/track 25 17

Data block length 512 bytes 2,048 bytes

Outer diameter of disk medium 86 mm

Outer diameter of hub 15 mm

Optical disk cartridge dimensions (W/L/H)

1.6±0.1µm 1.39±0.08 µm 1.10±0.05 µm

90/94/6 mm

40.99 mm

23.72 to

41.00 mm

2 - 18 C156-E097-01EN

Table 2.6 Disk specifications (2 of 2)

Item Specification

Mechanical characteristics

Disk weight, without cartridge case

Cartridge case weight, without

12 g or less

50 g or less

disk

Wrap and swing

Radial

50 µ m, p-p or less

–

(1,800 rpm)

Axial ±0.22 mm –

Acceleration (1,800 rpm)

Wrap and swing

Radial 3 m/s

Axial 10 m/s

Radial –

or less –

50 µm, p-p or less

(3,000 rpm)

Axial – ±0.15 mm

Acceleration (3,000 rpm)

Radial – 6.1 m/s

Axial – 22 m/s

or less

Tilt 5m rad or less

Top capacity Unformatted/side 181 MB 325 MB 819 MB 818 MB

Formatted/side 128 MB 230 MB 538 MB 643 MB

Usable side One side usable

Standard ISO/IEC 10090 ISO/IEC 13963 ISO/IEC 15041

Reliability Read cycle >10

Erase/write/read cycle >10

Environmental requirements

*1 Archival life is the period in which recorded information can be read. *2 Shelf life is the period in which information to be recorded can be written *3 Maximum wet bulb temperature = 29°C

Note:

Load/unload cycle 2,5000

Archival life (according to

>10 years (*1)

acceleration test results)

Shelf life (according to

>10 years (*2)

acceleration test results)

Operating temperature 5 to 55°C

Operating relative humidity 3 to 85%RH (*3)

Storage temperature –20 to 55°C

Storage humidity 3 to 90% RH (*3)

Non-recommended disks must be checked for compatibility.

C156-E097-01EN 2 - 19

2.4 Defect Management

2.4.1 Defect management schematic diagram

Defective sectors on the disk shall be replaced by good sectors according to the defect management scheme as follows: Defective sectors found during surface certification are handled by a sector slipping algorithm. Defective sectors found after initialization are handled by a linear replacement algorithm.

Figure 2.2 shows the algorithms for alternate processing.

(a) Sectorslippi ng algorithm

Figure 2.2 Algorithms for alternate processing

The user area is divided into several groups during media initialization. Each group contains data sectors and spare sectors. Spare sectors are used as replacements for defective data sectors. Media initialization can include a certification of the user area.

Figure 2.3 shows an example of alternate processing.

2 - 20 C156-E097-01EN

(b) Linear replacement algorithm

Figure 2.3 Example of alternate processing

C156-E097-01EN 2 - 21

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CHAPTER 3 INSTALLATION REQUIREMENTS

3.1 Environmental Requirements

3.2 Mounting Requirements

3.3 Power supply Requirements

3.4 Connection Requirement

This chapter describes environmental, mounting, power supply, and connection requirements.

3.1 Environmental Requirements

The environment in which these drives are installed must comply with the ambient environmental requirements defined in Subsection 2.1.3.

3.1.1 Temperature measurement point

When a drive is operating, the ambient temperature measured 3 cm from the base surface of the optical disk drive and the PCA unit surface must satisfy the environmental requirements specified in Subsection 2.1.3. For the temperature of each surface during operation, the contact temperature at each measurement point shown in Figure 3.1 must satisfy the requirements specified in Subsection 3.1.2.

Low temperature burns: The surface temperatures of some ICs on the printed circuit board unit in the optical disk drive exceed 55°C while operating. Be careful of low tenperature burns.

C156-E097-01EN 3 - 1

(a) Inside optical disk cartridge

Operating of inner partition wall

Hole for incerting thermo couple

(b) IC (controller, read map)

IC (controller)

Tip of thermo couple

IC (read amp)

Figure 3.1 Surface temperature measurement points

3 - 2 C156-E097-01EN

3.1.2 Temperature requirements and measuring method

Table 3.1 shows the temperature requirement at each measurement point shown in Figure 3.1.

Table 3.1 Temperature requirements at measurement points

Measurement point Maximum surface temperature Cartridge inside 55°C (*) IC (controller) surface 75 °C IC (read amp.) surface 85 °C

Note: * 60°C for the optical disk cartridge manufactured by Fujitsu.

Following procedure is for temperature measurement of inside cartridge.

1) Make a hole for the thermo couple as shown in Figure 3.1.

2) Disassemble the cartridge disk.

3) Cut off a part of the partition wall for the optical media as shown in Figure 3.1. (Cut off width: 5 to 10 mm)

4) Fix the tip of the thermo couple to the cut portion of partition wall with an adhesive agent.

5) Pass the thermo couple through the hole at the cartridge case and assemble the cartridge disk. When there is a gap between the hole and the thermo couple, fill the gap with the adhesive agent.

Note:

1. If the external environment temperature is higher than the specified value, the device

2. If the ambient temperature becomes higher than the measured temperature, the device

3.1.3 Air flow

It is recommended that this optical disk drive be installed in a fanless cabinet. However, if the power supply is incorporated into the same cabinet, it is recommended that it satisfy the “Temperature Conditions” in 3.1.2 and that the air flow rate being drawn in by the device) at the cartridge loading slot be 0.02 m3/min, 0.3 m/s or lower. Furthermore, if there is a system fan in a system where this drive is being installed, the same conditions must be met.

will automatically take an interval to respond to command, and then take protective action to respond to the temperature increase.

automatically operates to protect itself from rising temperatures.

C156-E097-01EN 3 - 3

3.1.4 Temperature rise under several conditions

Table 3.2 Temperature at each measuring point (Reference)

[Ambient atmospheric temperature of the optical disk drive: 45°C] (°C)

Measurement point Ready Random seek Criteria Inside cartridge 49°C 52°C 55°C IC (controller) surface 50°C 61°C 75°C IC (read amp.) surface 48°C 60°C 85°C Thermal sensor 47°C 52°C —

Notes:

1. The above data are data measured in a constant temperature chamber in which the temperature surrounding the equipment was kept at 45°C. They are not the same as the data obtained from measurements using the exclusive box in which the equipment is normally used.

2. When using the box, the ambient temperature around the equipment will differ depending on the air circulation conditions of the box, and the temperature rise inside the cartridge will differ because of this, so please exercise caution.

3.1.5 Air purity

The cleanness of the environment where this device is installed is expressed as the number of dust particles, and it is recommended that it be used in an environment with a Class 5 million or lower dust count. (Class 5 Million: There should be 5 million or fewer dust particles measuring

0.5 µm or larger in one cubic foot of air space. Using the gravimetric method, this corresponds to 0.15 mg/m3.)

3 - 4 C156-E097-01EN

3.2 Mounting Requirements

3.2.1 External dimensions

Figures 3.2 to 3.3 show the dimensions of the drive and the positions of the mounting holes.

Unit: mm

Note: The height length is 25.4 ± 0.8 besides the panel size.

Figure 3.2 Dimensions

C156-E097-01EN 3 - 5

Unit: mm

Note: Those enclosed in parentheses are inch screws.

Figure 3.3 Dimensions (without panel)

3 - 6 C156-E097-01EN

3.2.2 Installation direction

Figure 3.4 shows the permissable installation directions for this drive. The mounting angle tolerance must be within –5° to 10° from the horizontal. (–) shows that the insertion faces below.

• Horizontal

• Vertical

(Two orientations)

Figure 3.4 Installation directions

C156-E097-01EN 3 - 7

3.2.3 Centers of gravity

Figure 3.5 shows the centers of gravity of the drive.

Figure 3.5 Centers of gravity

3 - 8 C156-E097-01EN

Unit: mm

3.2.4 Notes on mounting

φ15

(1) Mounting frame structure and clearance

a) For vibration resistance and heat dissipation, this optical disk drive uses an embossed

structure as shown in Figure 3.6, as well as a frame which has a construction similar to other frames which perform the same function.

b) As shown in Figure 3.6, the inward projection of the mounting screw from the outer surface

of the drive frame must not exceed 3 mm.

c) The clearance between the external surface of the drive frame and the user's frame structure

must be at least 1.5 mm.

d) The clearance between the top and bottom surfaces and the user's frame structure must be at

least 1.5 mm.

e) When mounting the optical disk drive, the screw tightening torque should be 0.4 to 0.45Nm

(4 to 4.6kgcm).

f) When the optical disk drive (with panel) is mounted in a locker, there should be no

deformation of the mounting fittings provided and the optical disk drive's panel should not be deformed. If the drive is used with the panel deformed, ejection of the cartridge will be faulty. Check if the door will close from any position whatever when the optical disk drive is installed.

or less

Figure 3.6 Mounting frame structure

C156-E097-01EN 3 - 9

(2) Service clearance

Figure 3.7 shows locations which must be accessed for installation and maintenance. Be sure to leave sufficient service clearance.

P side

• Cable connection

R side

• Mounting screw hole

(3) External magnetic fields

Mount the optical disk drive away from powerful magnetic materials (e.g., a speaker) to avoid influence from the front side of magnetic fields.

S side

• SCSI terminating resistor

• SCSI terminal, test pin

• External operator panel connection

Q side

• Mounting screw hole

Figure 3.7 Service clearance

(4) Leak magnetic field

The VCM drive magnetic circuit may leak the magnetic field (Maximum 25 Gauss at distance of 4 mm from the drive).

Do not place a device sensitive to a magnetic field near the optical disk drive.

(5) External light source

Mount the optical disk drive away from strong light sources (e.g., camera flash).

(6) System ground

The optical disk drive should be grounded to the signal ground (SG) of the power supply of the system. This SG line should be supplied with the system.

3 - 10 C156-E097-01EN

The Frame Ground is shorted in the optical disk drive by a metal strip attached to the vibration

isolation rubber between the frame (FG) and the base (SG).

3.3 Power Supply Requirements

(1) Allowable input voltage and current

The DC power supply input voltage measured at the power supply connector pin of the optical disk drive (receiving end) must satisfy the requirements in Section 2.1.3. (For other requirements, see items (4) and (5) below.)

(2) Current waveform (reference)

Figure 3.8 shows the +5 VDC waveform at start of spindle motor rotation.

(A)

(3) Power on/off sequence

a) In a system which uses the terminating resistor power supply signal (TERMPWR) of the

SCSI bus, the requirements for +5 VDC given in Figure 3.9 must be satisfied between the drive and at least one of the SCSI devices supplying power to that signal.

[ms]5040302010

Figure 3.8 Current waveform (+5 VDC)

Figure 3.9 Power on/off sequence (1)

C156-E097-01EN 3 - 11

b) In a system which does not use the terminating resistor power supply signal (TERMPWR) of

the SCSI bus, the requirements for +5 VDC given in Figure 3.10 must be satisfied between the drive and the SCSI device with the terminating resistor circuit.

Figure 3.10 Power on/off sequence (2)

c) Between the drive and other SCSI devices on the SCSI bus, the +5 VDC power on/off

sequence is as follows:

• In a system with all its SCSI devices designed to prevent noise leakage to the SCSI bus

when the power is turned on or off, the power sequence does not matter if the requirement in (a) or (b) is satisfied.

• In a system containing an SCSI device which is not designed to prevent noise leakage to

the SCSI bus, the requirement given in Figure 3.11 must be satisfied between the SCSI device and the drive.

4.75V

0.5V

Figure 3.11 Power on/off sequence (3)

(4) Power supply to SCSI terminating resistor

If the power for the terminating resistor is supplied from the drive to other SCSI devices through the SCSI bus, the current-carrying capacity of the +5 VDC power supply line to the optical disk drive must be designed with consideration of an increase of up to 900 mA.

Select a method of power supply to the drive in accordance with the setting terminal of the optical disk drive. See Subsection 4.3.3.

4.75V

0.5V

3 - 12 C156-E097-01EN

(5) Noise filter

To eliminate AC line noise, a noise filter should be installed at the AC input terminal on the power supply unit of the drive. The noise filter specifications are as follows:

• Attenuation: 40 dB or more at 10 MHz

• Circuit configuration: The T-configuration shown in Figure 3.12.

Figure 3.12 AC noise filter (recommended)

C156-E097-01EN 3 - 13

3.4 Connection Requirement

3.4.1 Connectors and terminals

This drive is equipped with the connectors and terminals shown below for external connection. Figure 3.13 shows their locations.

• Power supply connector

• SCSI connector

• External operator panel terminal (CNH2)

External operator panel terminal (CNH2)

Figure 3.13 Connector and terminal locations

3 - 14 C156-E097-01EN

(1) Power supply connector

Figure 3.14 shows the shape and pin assignment of the DC power supply input connector.

(2) SCSI connector

The connector for the SCSI bus is an unshielded standard connector with two rows of 25 pins on 2.54 mm (0.1 inch) centers. Figure 3.15 shows the SCSI interface connector. Table 3.3 shows the signal assignment of the SCSI bus connector.

See Chapter 7 for details on the electrical requirements of the interface signals.

1 +12 VDC or N.C. 2 +12 VDC RETURN (GND) or N.C. 3 +5 VDC RETURN (GND) 4 +5 VDC

Figure 3.14 Power supply connector

Symbol mm Inch Remark

Note:

Tolerance is ±0.127 mm (0.005 inch) unless otherwise specified.

Figure 3.15 SCSI interface connector (drive side)

C156-E097-01EN 3 - 15

Table 3.3 Signal assignment of SCSI connector

Pin number Signal Signal Pin number

01 GND –DB0 02 03 GND –DB1 04 05 GND –DB2 06 07 GND –DB3 08 09 GND –DB4 10 11 GND –DB5 12 13 GND –DB6 14 15 GND –DB7 16 17 GND –DBP 18 19 GND GND 20 21 GND GND 22 23 GND GND 24 25 (Open) TERMPWR (*1) 26 27 GND GND 28 29 GND GND 30 31 GND –ATN 32 33 GND GND 34 35 GND –BSY 36 37 GND –ACK 38 39 GND –RST 40 41 GND –MSG 42 43 GND –SEL 44 45 GND –C/D 46 47 GND –REQ 48 49 GND –I/O 50

*1 Terminating resistor power supply (jumper selectable: input only, both input and output, or open)

3 - 16 C156-E097-01EN

For cables using pin 01 as shield ground, note that the shield of the connector on the drive is not connected to ground.

3.4.2 Cable connection requirements

Figure 3.16 shows the cable connection mode between the drive, host system, and power supply unit. Table 3.4 lists recommended components for the connection.

Figure 3.16 Cable connection mode

C156-E097-01EN 3 - 17

CN01CN01

Table 3.4 Recommended components for connection

Category Name Model Manufacturer Symbol in Figure

SCSI cable Cable socket

(closed-end type)

Cable socket (through-end type)

Signal cable UL20184-

Power supply cable Housing for cable

socket

Contact 170121-4 AMP

Cable AWG18 — —

External operator panel Housing for cable

socket

Receptacle LPC-F104N Honda-Tsushin

Cable AWG28 — —

FCN-707B050-AU/B Fujitsu Ltd. S01

FCN-707B050-AU/O Fujitsu Ltd.

Hitachi Cable, Ltd. —

LT25PX28AWG

455-248-50 SPECTRA-STRIP

1-480424-0 AMP S2

LPC-16F02 Honda-Tsushin SH2

(1) SCSI cable

3.19

All SCSI devices on one bus are daisy-chained with an SCSI cable. A terminating resistor must be mounted in the SCSI device at each end of the SCSI cable.

A terminating resistor is mounted on the drive when the drive is shipped. A terminating resistor must be disconnected when the drive is not connected to an end of the SCSI cable. Select a method of power supply to the terminating resistor circuit according to the setting pins on the drive. See Section 4.3 for details.

Up to eight SCSI devices can be connected to the SCSI bus. SCSI devices include the host adapter, the optical disk drive, and other SCSI equipment.

The connector (socket) for the SCSI cable must be an unshielded 50-contact socket with two rows of 25 contacts on 2.54 mm (0.1 inch) centers. The connector should also be polarized or keyed to prevent misinsertion. (See Figure 3.17.)

3 - 18 C156-E097-01EN

Figure 3.17 SCSI cable connector

C156-E097-01EN 3 - 19

The maximum length of the SCSI cable is as follows. If more than one SCSI device is connected, the total length must not exceed 6 m.

A 25-pair twisted-pair cable satisfying the following requirements is recommended for the SCSI cable:

Table 3.5 SCSI cable requirements

Item Single-Ended type Conductor size 28 AWG or larger Characteristic impedance

Each pair of wires must be connected to pins n and n + 1 (where n is an odd number) on the interface connector. All cables used on the same SCSI must have the same characteristic impedance to reduce signal reflection and to maintain transmission characteristics.

When an SCSI device is not connected to an end of the SCSI cable, connection to the SCSI connector must be at a branching point of the cable. If an SCSI device is connected to an end of the SCSI bus, any excess cable length after the last SCSI device must be terminated with a resistor. (See Figure 3.18.)

100 to 132 Ω

3 - 20 C156-E097-01EN

(a) Connection to a point along the cable

SCSI

conne ctor

(b) Connection to a point along the cable

Link

cable

Link

connec tor

Figure 3.18 SCSI cable connection

C156-E097-01EN 3 - 21

(2) Power supply cable

The drive must be star-chain-connected to the DC power supply unit (one-to-one connection) to reduce the influence of load variations.

(3) DC ground

A DC ground cable may or may not be installed depending on the system requirements (system installation environment, cabinet structure, and power supply system). This cable is generally connected to the ground of the power supply unit. Connection between more than one optical disk drive may be in a daisy chain.

3.4.3 External operator panel

Some set switch settings can be manipulated through the external operator panel interface.

Figure 3.19 shows a recommended circuit for the external operator panel. Since an external operator panel is not provided as an option, the user must design one based on the system requirements and the recommended circuit.

Provide switches and LEDs (required for the system) on the external operator panel. See the recommended circuit shown in Figure 3.21.

A signal which is not set on the external operator panel connected to CNH2 must be set using SW1. The SW1, and CNH1 corresponding to the signal set on the external operator panel must be set to OFF position.

For details, see Subsection 4.3.1.

Figure 3.20 shows the external operator panel connector and Table 3.6 shows the specification of the external operator panel connector interface.

3 - 22 C156-E097-01EN

*EJSW*

SCAM mode

Write verify mode

Macintosh mode

Logical type 0

Figure 3.19 External operator panel circuit example

C156-E097-01EN 3 - 23

Figure 3.20 External operator panel interface connector

Table 3.6 External operator panel interface (1 of 2)

Signal Pin Reference

setting

signal

SCSI-ID 4 2 SW1-01 Equivalent to ON position of SW1-01 by

shorting with 0 V.

SCSI-ID 2 4 SW1-02 Equivalent to ON position of SW1-02 by

shorting with 0 V.

SCSI-ID 1 6 SW1-03 Equivalent to ON position of SW1-03 by

shorting with 0 V.

Device type mode 9 SW1-06 Equivalent to ON position of SW1-06 by

shorting with 0 V. See 3.4.4 (1) SCAM mode 10 – See 3.4.4 (2) Verify mode 11 – See 3.4.4 (3) Macintosh mode 13 – See 3.4.4 (4) SCSI type-0 14 – See 3.4.4 (5) SCSI terminating resistor mode 15 CNH1(5-6)Equivalent to shorting CNH1 05-06 by shorting

with 0 V. +LED 3 – LED+terminal for external connection

Function

–LED 5 – LED–terminal for external connection *EJSW 7 – External eject instruction input (TTL-IC level)

L level: Equivalent to pushing eject switch

H level: Equivalent to not pushing eject switch

3 - 24 C156-E097-01EN

Table 3.6 External operator panel interface (2 of 2)

Signal Pin Reference

setting

signal

CTRGIN 1 – External cartridge sensor output (TTL-IC level)

L level: No cartridge in drive

H level: Cartridge in drive 0 V (GND) 8, 12, 16 – 0 V

3.4.4 External operator panel settings (CNH2)

(1) Device type mode

Table 3.7 shows the device type settings which are returned when the INQUIRY command is issued to the optical disk drive.

Table 3.7 Device type mode setting

Device Type CNH 2/Pin 9 - GND

X'07' (Optical memory device) Open*

X'00' (Direct access device) Shorted

* Setting when delivered

Function

(2) SCAM mode

Table 3.8 shows the settings which determine whether to use SCAM mode.

The optical disk drive uses SCAM mode. Shorted The optical disk drive does not use SCAM mode. Open*

* : Setting when delivered

Table 3.8 SCAM mode setting

SCAM mode CNH 2/Pin 10 - GND

C156-E097-01EN 3 - 25

(3) Write verify mode

The default setting of the verify function is specified. When the verify mode is invalid, verification is not performed when the WRITE command is issued. With the verification invalid, the writing speed is increased by about 20% (depending on the situation). Table 3.9 shows the verify mode settings. The verification can also be specified as valid or invalid by the MODE SELECT command.

Table 3.9 Write verify mode setting

Write verify mode CNH 2/Pin 11 - GND

Does not perform verification for the WRITE command (invalid)

Performs verification for the WRITE command (valid).

* : Setting when delivered

Loss of data

When the verify function is invalid, the write data quality is not guaranteed. This mode should not be used for storing important data. When using the mode for storing important data, a preventive system measure such as file duplication is required.

(4) Macintosh mode

The SCSI operation of the optical disk drive is changed so as to be connectable to the Macintosh. Table 3.10 shows the Macintosh mode settings.

Shorted

Open*

NOTICE

The mode should be off when connecting to other than the Macintosh.

Table 3.10 Macintosh mode setting

Macintosh mode CNH 2/Pin 13 - GND

Connectable to Macintosh Shorted

Not connectable to Macintosh Open*

* Setting when delivered

3 - 26 C156-E097-01EN

(5) Logical specification type 0

The command specification and message specification are specified. The SCSI-1 specification is compatible with that of the old unit (M2511A). Table 3.11 shows the command and message specification settings.

Table 3.11 Logical specification type setting

Command specification and message specification

SCSI-2 specification Open* SCSI-1 specification Shorted

* Setting when delivered

CNH 2/Pin 14 - GND

C156-E097-01EN 3 - 27

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CHAPTER 4 INSTALLATION

4.1 Notes on Drive Handling

4.2 Connection Modes

4.3 Settings

4.4 Mounting

4.5 Cable Connections

4.6 Operation Confirmation and Preparation for Use after Installation

4.7 Dismounting Drive

This chapter describes notes on handling the drives, connection modes, settings, mounting the drives, cable connections, and operation confirmation and preparation for use after installation, and notes on demounting the drives.

4.1 Notes on Drive Handling

(1) General notes

Note the following points to maintain drive performance and reliability:

1) Shock or vibration applied to the drive that exceeds the values defined in the standard damage the drive. Use care when unpacking.

2) Do not leave the drive in dirty or contaminated environments.

3) Since static discharge may destroy the CMOS devices in the drive, pay attention to the following points after unpacking:

• Use an antistatic mat and wrist strap when handling the drive.

• Hold the mounting frame when handling the drive. Do not touch the PCA except when setting the switches.

4) When handling the drive, hold both sides of the mounting frame. When touching other than both sides of the mounting frame, avoid putting force.

C156-E097-01EN 4 - 1

5) Do not forcibly push up the end of the header pin of the printed

(2) Unpackaging

a) Make sure that the UP label on the package is pointing upward and start unpacking on a level

surface. Handle the drive on a soft surface such as a rubber mat, not on a hard surface such as a desk.

b) Use care to avoid exerting excessive pressure on the unit when removing the cushions.

c) Use care to avoid exerting excessive pressure on th e PCA surface and interface connectors

when removing the drive from the antistatic bag.

d) If the temperature difference between installation locations is 10 degrees or more, leave the

drive in the new location for at least two hours before unpackaging it.

(3) Installation

a) Do not connect or disconnect the connectors or change the terminal settings when the power

is on.

b) Do not move the drive with the power on.

circuit board unit when handling or setting the drive.

(4) Packaging

a) Before packaging, remove the optical cartridge.

b) Store the drive in an antistatic vinyl bag with desiccant (silica gel).

c) Use the same cushions and packaging supplied with the drive. If they are not available,

ensure that adequate shock absorbent material is used. In this case, some method of protecting the PCA surface and interface connectors must be used.

d) Apply "UP" and "Handle With Care" labels to the outside of the package.

Figure 4.1 shows the packaging stile. (The form and material of the cushion may be changed.)

4 - 2 C156-E097-01EN

Ejecting jig

MCE3064SS MCF3064SS

Cushion (2 pcs)

Packaging box

Figure 4.1 Packaging style

(5) Transportation

a) Transport the package with the UP sign upward.

b) After unpacking, minimize the transportation distance and use cushions to avoid shock and

vibration. Transport the drive in one of the orientations described in Subsection 3.2.2 after unpacking. (The horizontal direction is recommended.)

(6) Storage

a) Use moistureproof packaging when storing the drive.

b) The storage environment must satisfy the requirements specified i n Subsection 2.1.3 when

the drive is not operating.

c) To prevent condensation, avoid sharp changes in temperature.

C156-E097-01EN 4 - 3

4.2 Connection Modes

Figure 4.2 shows examples of connections between the host system and the optical disk drive. Up to eight devices including the host adapter, optical disk drive, and other SCSI equipment can be connected to the SCSI bus in arbitrary combinations. Install a terminating resistor on the SCSI devices connected to either end of the SCSI cable.

See Section 3.4 for the cable connection requirements and power cable connections.

(a) Connecting one optical disk drive

(b) Connecting more than one optical disk drive (single host)

Figure 4.2 SCSI bus connection modes (1 of 2)

4 - 4 C156-E097-01EN

4.3 Settings

Before installing the drive in the system, set the following setting terminal, setting switches, and SCSI terminating resistors:

• Setting terminal : CNH1

• Setting switches : SW1

Figure 4.3 shows the positions of the setting terminal and switch.

Figure 4.2 SCSI bus connection modes (2 of 2)

1) The user must not change the settings of terminals not described in this section. The terminals must remain as set when shipped.

2) Do not change terminal settings when the power is on.

3) To strap setting terminals, use the jumper shipped with the drive.

C156-E097-01EN 4 - 5

SCSI

015004

Power

connec-

tor

connec-

tor

CNH1

060402

050301

Figure 4.3 Positions of setting terminals and switches

Setting items are as follows:

• SW1

• SCSI ID

• SCSI data bus parity check

• Write cache mode

• Device type mode

• Spindle automatic stop mode

• Factory test mode (user setting inhibited)

• CNH1

• SCSI terminating resistor power supply

• SCSI terminating resistor

• CNH2

• SCSI ID

• Device type mode

• SCAM mode

• Verify mode

• Macintosh mode

• SCSI type

• SCSI connector

• SCSI signal

• Power connector

• +5VDC

• GND

(Mounting area)

SW1

CNH2

Front

4 - 6 C156-E097-01EN

4.3.1 Setting switches (SW1)

Board

Setting

Figure 4.4 shows the types of switches and their settings when the drive was shipped.

• SW1

Switch number Signal name At shipment

SW1 01

02 03

04 SCSI data bus parity check ON 05 Write cache mode OFF 06 Device type mode ON

SCSI ID OFF SCSI ID

SCSI ID

1 2 3

4 5 6 7 8

switch

SCSI ID OFF

OFF OFF

07 Spindle automatic stop mode OFF 08 Factory test mode (user setting inhibited) OFF

Figure 4.4 Setting switch (SW1)

C156-E097-01EN 4 - 7

(1) SCSI ID

Table 4.1 shows the SCSI ID settings of the drive.

Table 4.1 SCSI ID setting (SW1)

SCSI ID SW1-01 SW1-02 SW1-03

0 (*1) OFF OFF OFF

1 OFF OFF ON 2 OFF ON OFF 3 OFF ON ON 4 ON OFF OFF 5 ON OFF ON 6 ON ON OFF 7 ON ON ON

*1 Setting when delivered

1) Each SCSI device connected to the same SCSI bus must have a unique SCSI ID.

2) If contention occurs in the ARBITRATION phase, the priority of the SCSI use authority depends on SCSI IDs as follows:

7 >> 6 >> 5 >> 4 >> 3 >> 2 >> 1 >> 0

(2) SCSI data bus parity checking

Table 4.2 shows the settings which determine whether to check the SCSI bus parity bit. Regardless of the settings, the parity bit is ensured for data transmitted by the drive.

Table 4.2 SCSI data bus parity checking (SW1)

SCSI data bus parity checking by drive SW1-04

Checked ON (*1)

Not checked OFF

*1 Setting when delivered

4 - 8 C156-E097-01EN

(3) Write cache mode

The write cache mode can be set. The write cache mode can also be enabled or disabled by the MODE SELECT command.

When the write cache mode is enabled, the cache control page is added to the code page of the mode parameter even if the SCSI-1 is set. Table 4.3 shows the settings of the write cache mode.

Table 4.3 Write cache mode setting

Write cache mode SW1-05

Write cache is enabled at executing the WRITE/WRITE AND VERIFY command.

Write cache is disabled at executing the WRITE/WRITE AND VERIFY command

*1 Setting when delivered

(4) Device type mode

Table 4.4 shows Device type mode setting.

Table 4.4 Device type mode setting

Device type mode SW1-06 ‘0x07’ optical memory drive ON (*1) ‘0x00’ direct access drive OFF

*1 Setting when delivered

(5) Spindle automatic stop mode

OFF (*1)

Normally, with the cartridge loaded, the spindle rotation is maintained until the spindle is instructed to stop by the START/STOP UNIT command. The spindle auto stop function automatically stops the spindle after the command has not been issued from the host for about 30 minutes (default value). When the command is issued from the host with the spindle automatically stopped, the optical disk derive turns the spindle again and performs processing in the same manner as in a ready state without posting a not ready state.

The access supervision time from the host is about 33 minutes as the default. However, it can be changed by the MODE SELECT command.

The spindle auto stop mode can also be changed by the MODE SELECT command.

Table 4.5 shows spindle auto stop mode setting.

C156-E097-01EN 4 - 9

Table 4.5 Spindle automatic stop mode setting

Spindle auto stop SW1-07 The spindle motor automatically stops. ON The spindle motor does not automatically stop. OFF (*1)

*1 Setting when delivered.

The characteristic of the spindle auto stop function are as follows:

Reduces the deposition of dust which could cause a cartridge error.

Not suitable for a system requiring quick response because it takes a few seconds to start the spindle.

4.3.2 Setting of supplying power to SCSI terminating resistor

Table 4.6 shows how to supply power to the SCSI terminating resistor module on the drive and how to use TERMPWR lines on the SCSI bus.

Table 4.6 SCSI terminating resistor power supply (CNH1)

SCSI terminating resistor power supply CNH1 01-02 CNH1 03-04

Power is supplied from both of the drive and TERMPWR pin.

Power is supplied from the drive only. (TERMPWR pin is not used)

Power is supplied from TEMPWR pin only. (Drive’s power supply is not used)

No power is supplied. Open Open

*1 Setting when delivered

4.3.3 SCSI terminating resistor mode

Enabling or disabling the SCSI terminating resistor, module on the PCA can be set.

When the drive positions at other than the end of the SCSI bus, the SCSI terminating resistor should be disabled. Table 4.7 shows the SCSI terminating resistor mode setting.

Short (*1) Short (*1)

Short Open

Open Short

4 - 10 C156-E097-01EN

Table 4.7 SCSI terminating resistor mode (CNH1)

SCSI terminating resistor mode CNH 1 05-06 SCSI terminating resistor module on the PCA is enabled. Short (*1) SCSI terminating resistor module on the PCA is disabled. Open

*1 Setting when delivered

Open CNH1 5-6 pins when the SCSI terminating resistor set by CHN 2-15 pin.

C156-E097-01EN 4 - 11

4.4 Mounting

4.4.1 Checks before mounting the drive

Before mounting the optical disk drive in the system cabinet, check whether the setting switches and terminals are set correctly.

Table 4.8 shows the checklist.

Table 4.8 Setting checklist

Setting item Setting on: Default Check

t t i

1 SCSI ID

SW1-01 SW1-02 SW1-03

OFF OFF OFF

(SCSI ID= )

OFF ON OFF ON OFF ON

n g

t c h

2 SCSI data bus parity check SW1-04 ON 3 Write cache mode SW1-05 OFF 4 Device type mode SW1-06 ON 5 Spindle automatic stop mode SW1-07 OFF 6 Factory test mode

SW1-08 OFF

OFF ON

(user setting inhibited)

Setting item Setting on: Default Check

TERMPWR pin.

1 Supplied from both ODD and

CNH1 1-2 CNH1 3-4

Short Short

Short Open Short Open

N H

2 Supplied from ODD CNH1 1-2

CNH1 3-4

3 Supplied from TERMPWR pin. CNH1 1-2

CNH1 3-4

Short Short

Short Open Short Open

Check item Check

e r

1 Drive location on SCSI bus Other Either

than end end

2 SCSI terminating resistor mode (CNH1 5-6)

Open Short

4 - 12 C156-E097-01EN

4.4.2 Mounting procedure

How the drive is mounted depends on the system cabinet structure. Determine the mounting procedure in consideration of the requirements of each system. This section contains the general mounting procedure and check items.

See Section 3.2 for details on mounting drive.

1) For a system with an external operator panel mounted, connect the external operator panel cable before mounting the drive in the system cabinet because it is difficult to access the connector after the drive is mounted.

2) Tighten four mounting screws to secure the drive in the system cabinet.

• The drive has ten mounting holes (both sides: 3×2, bottom: 4). Secure the drive using the

four mounting holes on both sides or the bottom.

• Use mounting screws whose lengths are 3 mm or less from the external wall of the mounting

frame of the drive when they are tightened. (See Figure 3.6)

• When mounting with screws, the screw tightening torque should be 0.4 to 0.45Nm (4 to

4.6kgcm).

• Be careful not to damage the parts on the PCA when mounting the drive.

3) After securing the drive, make sure that the drive does not touch the chassis of the system cabinet. There must be at least 1.5 mm clearance between the drive and chassis. (See Figure

3.6)

4.5 Cable Connections

Use the following cables to connect the drive to the system. See Subsection 3.4.2 for details on the connector positions and cable requirements.

• Power supply cable

• SCSI cable

• DC ground cable (if required)

• External operator panel cable (if required)

The general procedure for cable connection and notes on connecting cables are given below. Pay attention to the insertion direction of each cable connector.

1) Make sure that the system power is off.

2) Do not connect or disconnect any cable when the power is on.

1) Connect the DC ground cable (only if required to decrease ground noise).

2) Connect the power cables.

3) Connect the external operator panel (only if required for the system).

C156-E097-01EN 4 - 13

4) Connect the SCSI cable.

5) After each cable connector is connected, secure the cable so that the cable does not touch the drive or the parts on the PCA or obstruct the flow of cooling air in the system cabinet.

The overcurrent protection fuse of the terminating resistor power supply (SCSI device) may blow when power is turned on. The cable may burn if overcurrent protection is not provided.

2) Be careful of cable connector positions when connecting more than one SCSI device. The SCSI device having the terminating resitor must be connected to the end of the cable.

3) The cables must be kept away from the rotating part of the spindle motor.

4.6 Operation Confirmation and Preparation for Use after Installation

4.6.1 Confirming initial operations

This section provides the operation check procedures after the power is turned on.

(1) Initial operation when the power is turned on

• When the power is turned on, the drive starts initial self-diagnosis. The LED on the front

panel is on for 3 seconds during initial self-diagnosis.

• If an error is detected during initial self-diagnosis, the LED on the front panel blinks.

• In case of not inserted the cartridge, when the power is turned on, the eject motor

automatically turns once.

(2) Checks if errors occur at initial self-diagnosis

• Make sure that the cables are connected correctly.

• Make sure that the supply voltage is correct. (Measure the voltage at the power supply

connector of the optical drive.)

• Make sure that the settings of all terminals are correct.

4 - 14 C156-E097-01EN

• If the LED on the front panel blinks continuously, an error was detected during initial self-

diagnosis. In this case, issue the REQUEST SENSE command from the initiator (host system) to obtain sense data for error analysis.

The BUSY LED is on while the optical disk drive is executing seek, write, or read operations. The BUSY LED is on momentarily, so it seems as if it blinked or is off.

If the cartridge fails to be inserted, remove the cartridge and turn on the drive power to turn the eject motor once and reinsert the cartridge.

4.6.2 SCSI connection check

When initial operation checks out normally after the power is turned on, check whether the drive is correctly connected to the SCSI bus from the host system. Checking the SCSI connection depends on the host system configuration. This section describes the general procedure.

(1) Procedure

Figure 4.5 shows the recommended checking procedure.

Note:

Steps a) to c) correspond to a) to c) in Figure 4.5.

a) Issue the TEST UNIT READY command and check that the drive is connected correctly to

the SCSI bus.

b) Use the WRITE BUFFER and READ BUFFER commands to check whether the SCSI bus

operates normally. Use data whose bits change to 0 or 1 at least once. (Example: A X'00' to X'FF'increment pattern)

c) Check whether the settings are correct. Also, make sure that the controller and drive operate

normally.

C156-E097-01EN 4 - 15

Figure 4.5 SCSI connection check

4 - 16 C156-E097-01EN

(2) If processing terminates abnormally:

a) If sense data has been obtained by the REQUEST SENSE command, analyze the sense data.

If the error is recoverable, retry the processing.

b) Check the following items for SCSI cable connection:

• All connectors, including other SCSI devices, are connected correctly.

• A terminating resistor is correctly mounted at both ends of the cable.

• Power is supplied to the terminating resistors correctly.

c) Check the settings of all terminals are correct. Note that the procedure of checking the SCSI

connection depends on the setting of "spindle automatic stop".

4.7 Dismounting Drive

How to demount an optical disk drive (for setting terminal checking, setting change, or device replacement) depends on the system cabinet configuration. Determine the demounting procedure in consideration of the requirements of each system. This section describes the general demounting procedure and notes on demounting drives.

Before demounting the optical disk drive, turn off the system power. Do not remove screws securing the cables and drive when the power is on.

1) Remove the power cable.

2) Remove the SCSI cable.

3) When an external operator panel is mounted, remove its cable. If it is difficult to access the connector, remove the cable after step e).

4) Remove the DC ground cable.

5) Remove the four screws securing the drive, then remove the drive from the system cabinet.

6) When storing or transporting the drive, put the drive into an antistatic bag. (See Section 4.1.)

C156-E097-01EN 4 - 17

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CHAPTER 5 OPERATION AND CLEANING

5.1 Operating Optical Disk Drive

5.2 Cleaning Drive

5.3 Optical Disk Cartiridge Operation

5.4 Cleaning Optical Disk Cartiridge

This chapter describes how to operate and clean the drive and the optical disk cartridges.

5.1 Operating Optical Disk Drive

The drive has an automatic load function. All the operator must do is to insert the optical disk cartridge and operate the eject button.

This section explains loading and ejection methods, assuming that the drive is mounted horizontally. (When mounted vertically, the drive is operated in the same manner as when mounted horizontally.)

Figure 5.1 shows the front view of the optical disk drive. For operation, users should be familiar with the parts in the figure and their function. Loading and ejection methods are described below.

5.1.1 Optical disk drive

1) Disk insertion slot

Figure 5.1 Optical disk drive front view (with panel)

The following explains the parts and functions of the optical disk drive (the following numbers correspond to the numbers in Figures 5.1):

2) Eject button/ BUSY LED

3) Manual eject hole

C156-E097-01EN 5 - 1

Fujitsu MCE3064SS, MCF3064SS User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

PREFACE

CONTENTS

FIGURES

TABLES

CHAPTER 1 GENERAL DESCRIPTION

1.1 Features

1.1.1 Performance

1.1.2 Reliability

1.1.3 Maintainability/operability

1.1.4 Adaptability

1.1.5 Interface

1.2 Drive Configuration

1.2.1 Drive model

1.2.2 Configuration

1.2.3 Mechanical sections

1.2.4 Control circuit section

1.3 System Configuration

1.3.1 SCSI bus configuration

1.3.2 Input-output device addressing

CHAPTER 2 SPECIFICATIONS

2.1 Optical Disk Drive Specifications

2.1.1 Model and product number

2.1.2 Drive specifications

2.1.3 Environmental and power requirements

2.1.4 Error rate

2.1.5 Reliability

2.2 SCSI Function Specification

2.3 Optical Disk Cartridge Specifications

2.3.1 Recommended optical disk cartridge specifications

2.3.2 Optical disk cartridge

2.3.3 Disk specifications

2.4 Defect Management

2.4.1 Defect management schematic diagram

CHAPTER 3 INSTALLATION REQUIREMENTS

3.1 Environmental Requirements

3.1.1 Temperature measurement point

3.1.2 Temperature requirements and measuring method

3.1.3 Air flow

3.1.4 Temperature rise under several conditions

3.1.5 Air purity

3.2 Mounting Requirements

3.2.1 External dimensions

3.2.2 Installation direction

3.2.3 Centers of gravity

3.2.4 Notes on mounting

3.3 Power Supply Requirements

3.4 Connection Requirement

3.4.1 Connectors and terminals

3.4.2 Cable connection requirements

3.4.3 External operator panel

3.4.4 External operator panel settings (CNH2)

CHAPTER 4 INSTALLATION

4.1 Notes on Drive Handling

4.2 Connection Modes

4.3 Settings

4.3.1 Setting switches (SW1)

4.3.2 Setting of supplying power to SCSI terminating resistor

4.3.3 SCSI terminating resistor mode

4.4 Mounting

4.4.1 Checks before mounting the drive

4.4.2 Mounting procedure

4.5 Cable Connections

4.6 Operation Confirmation and Preparation for Use after Installation

4.6.1 Confirming initial operations

4.6.2 SCSI connection check

4.7 Dismounting Drive

CHAPTER 5 OPERATION AND CLEANING

5.1 Operating Optical Disk Drive

5.1.1 Optical disk drive