ASSP For Po wer Management Applications (Mobile Phones)
Power Management IC
fo r GSM Mobile Phone
MB3891
DESCRIPTION
■■■■
MB3891 is intended to be used in future GSM-phones, Dual Band phones and Dual Mode phones. It contains all
the necessary functions to support all Digital, Analog and RF bloc ks in these phones. A Charge-pump including
a Logic Level Translation circuit is built in to support SIM-card (SmartCard) of both 3 and 5 Volt technology. The
circuit contains a charger for a rechargeable Lithium coin cell of a Real Time Clock.
A complex control circuit is built in to generate main reset and to turn on and off the different LDO’s.
FEATURES
■■■■
• Supply voltage range : 3 V to 5.5 V
• Low power consumption current during standby : 400 µA (MAX)
• 6-channel low-saturation voltage type series regulator
: 2.1 V/2 channels, 2.8 V/3 channels, 2.5 V/2.8 V switch
8, 9, 10, 11VBAT1Battery voltage input pin for LDO1 and LDO2.
12, 13OUT1OLDO1 output pin.
14CONT1IPower on input from keypad (Active low, Pulled up to VBAT2).
15CONT6I“CONT6” input from digital system µP (Active high).
16CONT2IExternal accessory supply voltage Enable (Active high).
17XPOWERGOODOGenerates the main reset. (Active low, when OUT1 is out of regulation).
18DELAYCAPTiming capacitor for XPOWERGOOD delay.
19GND1LDO1, LDO2, V-BACKUP, Reference and System ground pin.
20VBAT2
21V-BACKUPOSupply voltage for Charger for rechargeable Lithium coin cell.
22VREFOSupply voltage for Reference.
23VFILOReference voltage Filter.
24REF-OUTOReference output voltage (Present when BACKUP UVLO is high).
25VCC-VSIMInput voltage for charge pump. (Supplied by VBAT1).
26VSIM-ONIVSIM supply Enable (Active high).
27SIMPROGIVSIM programming: Low = 3 V SIM, High = 5 V SIM.
28OSCOscillator output pin.
29VSIMOUTOSupply voltage for 3 or 5 V SIM-Card (SmartCard).
30VCAP+Positive side of boost capacitor.
31VCAP−Negative side of boost capacitor.
32GND-VSIM3 or 5 V SIM-Card (SmartCard) ground pin.
33RESET-ININon level shifted SIM reset (µP side).
34CLK-ININon level shifted clock (µP side).
35µP-IOI/ONon level shifted bi-directional data input/output (µP side).
36RSTOLevel shifted SIM reset (SmartCard side).
37CLKOLevel shifted SIM clock (SmartCard side).
Battery voltage input pin for both UVLO’s, Reference and V-BACKUP
LDO.
44CONT4IOUT4 output voltage selection (“L”=2.8 V,“H”=2.5 V).
45SW1-OUTPUTOOutput of general purpose switch number 1 (Drain).
46SW1-INPUTIInput of general purpose switch number 1 (Source).
47SW3-OUTPUTOOutput of general purpose switch number 3 (Drain).
48SW3-INPUTIInput of general purpose switch number 3 (Source).
49, 50N.C.Non connection.
51SW2-OUTPUTOOutput of general purpose switch number 2 (Drain).
52SW2-INPUTIInput of general purpose switch number 2 (Source).
53SW1-ONIGeneral purpose switch number 1 Enable (Active high).
54SW2-ONIGeneral purpose switch number 2 Enable (Active high).
55SW3-ONIGeneral purpose switch number 3 Enable (Active high).
56CONT3IOUT3 and OUT4 supply voltage Enable (Active high).
57CONT5IOUT5 supply voltage Enable (Active high).
58OUT5OOutput terminal of LDO5.
59GND5LDO5 ground pin.
60, 61, 62VBAT3Supply voltage for LDO and LDO5.
63, 64N.C.Non connection.
4
BLOCK DIAGRAM
■■■■
VBAT2VBAT1
20
8 9 10 11
MB3891
CONT1
CONT6
CONT2
SW1-ON
SW2-ON
SW3-ON
CONT3
CONT5
CONT4
14
15
16
53
54
55
56
57
44
Main
UVLO
Over
Temp
Protection
SW1
SW2
SW3
LDO1
ON
LDO2
ON
LDO3
ON
OUT
OUT
OUT
POR
12
OUT1
13
XPOWERGOOD
17
DELAYCAP
18
GND1
19
6
OUT2
7
SW1-INPUT
46
SW1-OUTPUT
45
52
SW2-INPUT
51
SW2-OUTPUT
48
SW3-INPUT
47
SW3-OUTPUT
60
61
VBAT3
62
3
OUT3
4
VREF
VFIL
REF-OUT
RESET-IN
CLK-IN
µP-IO
RST
CLK
SIM-IO
VCC-VSIM
VSIM-ON
SIMPROG
OSC
22
23
24
33
34
35
36
37
38
25
26
27
28
VREF
GSM/SIM
Logic
Level
Translation
32
GND-VSIM
VREF-AMP
+
−
VSIMOUT
Charge-pump
29
VSIMOUT
BACKUP
UVLO
LDO4
OUT
ON
CONT4
LDO5
OUT
ON
LDO6
OUT
ON
N.C.
Pin : 1, 2, 49, 50, 63, 64
5
GND3
42
VBAT4
43
40
OUT4
41
GND4
39
58
OUT5
59
GND5
V-BACKUP
21
30
VCAP+
31
VCAP−
5
MB3891
ABSOLUTE MAXIMUM RATINGS
■■■■
ParameterSymbol Conditions
Unit
Min.Max.
VBAT−0.37V
Power supply voltage
VCC-VSIM−0.37V
Rating
I
OOUT1 pin120mA
IOOUT2 pin50mA
LDO regulator
I
OOUT3 pin100mA
I
OOUT4 pin100mA
IOOUT5 pin50mA
VSIMOUT chargepumpI
Power dissipationP
OVSIMOUT pin10mA
DTa ≤ +25 °C 800*mW
Storage temperatureTstg−55+125°C
* : The packages are mounted on the dual-sided epoxy board(10 cm × 10 cm)
WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current,
temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings.
WARNING: The recommended operating conditions are required in order to ensure the normal operation of the
semiconductor device. All of the device’s electrical characteristics are warranted when the device is
operated within these ranges.
Always use semiconductor devices within their recommended operating condition ranges. Operation
outside these ranges may adversely affect reliability and could result in device failure.
No warranty is made with respect to uses, operating conditions, or combinations not represented on
the data sheet. Users considering application outside the listed conditions are advised to contact their
FUJITSU representatives beforehand.
6
ELECTRICAL CHARACTERISTICS
■■■■
ParameterSymbol Pin No.Conditions
MB3891
(Ta = +25 °C, VBAT1 to VBAT4 = VCC-VSIM = 3.6 V)
Value
Unit
Min.Typ.Max.
General
Shutdown supply
current
Standby supply
current
Operating ground
current
UVLO threshold
voltage
BACKUP UVLO
threshold voltage
I
BAT1
I
BAT2
I
BAT3
I
GND
8, 9, 10, 11,
20, 42, 43,
60, 61, 62
8, 9, 10, 11,
20, 42, 43,
60, 61, 62
8, 9, 10, 11,
20, 42, 43,
60, 61, 62
4, 5, 19,
32, 59
UVLO = “L”,
BACKUP UVLO = “L”
UVLO = “L”,
BACKUP UVLO = “H”
All circuit’s = On
(No load)
All circuit’s -VSIM =
On Max. load on all
regulators