FUJITSU MICROELECTRONICS (SHANGHAI) CO., LTD.
Modified:
1. System Feature;
2. MCU Pin Assignment;
3. IGBT Feature;
4. Power Module;
5. IGBT Driver Module;
6. Pad Driver Module;
7. Main Board SCH;
Update operation description
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Induction Heater Hardware
Revision History
User Manual
Induction Heater C Library User Manual Version 1.2
Contents
Revision History ................................................................................................................................... 1
1. Introduction........................................................................................................................................... 3
2. System Features .................................................................................................................................... 4
3. System Introduce .................................................................................................................................. 5
3.1. Hardware Block Diagram ............................................................................................................................................. 5
3.2. MCU Resource Usage .................................................................................................................................................. 5
3.3. MCU Pin Assignment ................................................................................................................................................... 6
3.4. IGBT Features .............................................................................................................................................................. 7
4. System Hardware .................................................................................................................................. 8
4.1. System Connect Diagram ........................................................................................................................................ 8
4.2. Front Board .............................................................................................................................................................. 9
4.3. Main Board ............................................................................................................................................................ 10
5. Module Description ............................................................................................................................ 11
5.1. Power Module ....................................................................................................................................................... 11
5.2. IGBT Driver Module ............................................................................................................................................. 11
5.3. Pad Driver Module ................................................................................................................................................ 12
6. System Operate ................................................................................................................................... 13
6.1. Key & Led Definition ............................................................................................................................................ 13
6.2. Operate Descript ................................................................................................ ................................ .................... 14
7. Debug and Programming .................................................................................................................... 15
7.1. Debug Environment and Tools .............................................................................................................................. 15
7.2. Hardware Setup ..................................................................................................................................................... 15
7.3. MCU Programming ............................................................................................................................................... 15
8. Appendix ............................................................................................................................................. 16
8.1. Front Board SCH and BOM-List ........................................................................................................................... 16
8.2. Main Board SCH and BOM-List ........................................................................................................................... 17
MCU-AN-500087-E-12
Induction Heater C Library User Manual Version 1.2
1. Introduction
This document has introduced how to use the electromagnetic oven hardware.
The hardware includes two PCB boards (main board and front board), a fan and a pad.
MCU-AN-500087-E-12
Induction Heater C Library User Manual Version 1.2
2. System Features
Power Control
Fan Control
Fan Delay Off
Buzz Control
Led Display
Keyboard
Kettle Detect
Kettle Empty Detect
Timing Power Off(3Hours)
Constant Power Heating
Constant Temperature Heating
IGBT Temp Detect
Plate Temp Detect
IGBT Temp Higher Protect(120℃)
Plate Temp Higher Protect(300℃)
Kettle Empty Protect(300℃)
Sensor Open/Short Detection
Over Current Protect(18A)
Over Voltage Protect(260V)
Lower Voltage Protect(150V)
Surge Protect(1000V)
No Operation for 2 Hours, auto turn off,if no timer
In the system design, we will use some feedback signals to protect system or calculate
watt. The protect signal include over current, over voltage, surge voltage and kettle detect.
Anyone of them appears, the system must stop work. If the IGBT temperature is raise over
60℃, the fan must turn on. If the IGBT temperature is raise over 120℃, the system must stop
work. If the kettle is empty, the plate temp will raise. If the temp raise up to 300℃, the system
must stop work.
MCU-AN-500087-E-12
Induction Heater C Library User Manual Version 1.2
Figure-1 Hardware Block Diagram
3. System Introduce
3.1. Hardware Block Diagram
The electromagnetic eddy current heating is our system theory. We use the PWM to control
the IGBT to generate the heating eddy current. The fan is use to cool the IGBT. The feedback
signal is used to protect the system and calculate power.
3.2. MCU Resource Usage
MCU-AN-500087-E-12
Induction Heater C Library User Manual Version 1.2
PG1/TRG0/ADTG/X0A/BZ/OUT0
OverCurrent Reference
Input
OverCurrent Compare
Input
OverVoltage Reference
Input
OverVoltage Compare
Input
3.3. MCU Pin Assignment
MCU-AN-500087-E-12