BECAUSE THIS PRODUCTIS RoHS LEAD-FREE COMPLIANT, USE THE DESIG-
NATED AFTER-SELES PARTS AND THE DESIGNATED LEAD-FREE SOLDER WHEN
PERFORMING REPAIRS. (Refer to page 3 to page 5)
WARNING
THE COMPONENTS IDENTIFIED WITH THE MARK “ ” ON THE SCHEMATIC
DIAGRAM AND IN THE PARTS LIST ARE CRITICAL FOR SAFETY.
PLEASE REPLACE ONLY WITH THE COMPONENTS SPECIFIED ON THE SCHEMATIC
DIAGRAM AND IN THE PARTS LIST.
IF YOU USE PARTS NOT SPECIFIED, IT MAY RESULT IN A FIRE AND AN
ELECTRICAL SHOCK.
FUJI PHOTO FILM CO., LTD.
Ref.No.:ZM00641-100
Printed in Japan 2006.06
FinePix F650 Service Manual
SAFETY CHECK-OUT
After correcting the original problem, perform the following
safety check before return the product to the customer.
1. Check the area of your repair for unsoldered or poorly
soldered connections. Check the entire board surface
for solder splasher and bridges.
2. Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair.
Point them out to the customer and recommend their
replacement.
4. Look for parts which, though functioning, show obvious
signs of deterioration. Point them out to the customer
and recommend their replacement.
5. Check the B + voltage to see it is at the values
specified.
6. Make leakage - current measurements to determine
that exposed parts are acceptably insulated from the
supply circuit before returning the product to the
customer.
7.CAUTION: FOR CONTINUED
PROTECTION AGAINST FIRE
HAZARD, REPLACE ONLY WITH
SAME TYPE 2.5 AMPERES 125V
FUSE.
2.5A 125V
2.5A 125V
8.WARNING:
RISK OF FIREREPLACE FUSE
AS MARKED
ATTENTION: AFIN D'ASSURER
UNE PROTECTION
PERMANENTE CONTRE LES
RISQUES D'INCENDIE,
REMPLACER UNIQUEMENT
PAR UN FUSIBLE DE MEME,
TYPE 2.5 AMPERES, 125 VOLTS.
TO REDUCE THE ELECTRIC
SHOCK, BE CAREFUL TO
TOUCH THE PARTS.
WARNING!
HIGH VOLTAGE
2
FinePix F650 Service Manual
RoHS lead-free compliance
Because this product is RoHS lead-free compliant, use the designated after-sales parts and the designated lead-free solder
when performing repairs.
<Background & Overview>
With the exception of parts and materials expressly excluded from the RoHS directive (*1), all the internal connections and
component parts and materials used in this product are lead-free compliant (*2) under the European RoHS directive.
*1: Excluded items (list of the main lead-related items)
• Lead included in glass used in fluorescent tubes, electronic components and cathode-ray tubes
• Lead in high-melting-point solder (i.e. tin-lead solder alloys that contain 85% lead or more)
• Lead in ceramic electronic parts (piezo-electronic devices)
• Mercury contained in fluorescent tubes is also excluded.
*2: Definition of lead-free
A lead content ratio of 0.1 wt% or less in the applicable locations (solder, terminals, electronic components, etc.)
<Reference>
RoHS:The name of a directive issued by the European Parliament aimed at restricting the use of
certain designated hazardous substances included in electrical and electronic equipment.
When carrying out repairs, use a designated lead-free solder, bearing in mind the differing work practices for conventional
solder (eutectic) and lead-free solder.
Differences in the soldering work for lead-free and eutectic solder
When the soldering work practices for eutectic solder and lead-free solder are compared, the main differences are as shown
below. In particular, when lead-free solder is used, the solder tends to be less workable than when eutectic solder is used.
Accordingly, the soldering techniques used must take that into account.
Difference
The solder starts melting later.
1
Poor wetting
2
Solder feed rate is difficult to control.
3
Wetting the insides of through holes is especially
4
difficult.
5
During repairs (or modifications) removing solder
from inside through holes is difficult.
6
There is serious carbonization of the soldering iron.
The surface is not glossy.
7
The initial melting point of lead-free solder is high, so you
have to get used to it.
Move the tip of the soldering iron around to heat the entire
connection to the melting temperature and assist wetting.
Use the solder (wire) diameter and soldering iron that are
best suited to connection being soldered.
First apply solder to the area immediately around the
through hold and then feed the solder into the hole.
Use a suitable wicking wire (with a suitable method and
heating) and a suction tool.
Either put solder onto the soldering iron tip after completing
the work, or turn the iron off frequently.
Learn to recognize the appearance of the surface.
Countermeasure
3
FinePix F650 Service Manual
Setting temperature during lead-free soldering
• Lead-free solder melting temperature
The melting point of eutectic (Sn-Pb) solder is 183°C, while the melting point of lead-free solder (Sn-Ag-Cu) is 30°C higher
at 220°C.
• Soldering iron tip temperature
The temperature setting for the soldering iron used should be such that the tip of the soldering iron is at the correct
bonding temperature for the connection. This temperature is normally set at around 100°C higher than the melting point of
the solder.
However, the actual temperature should take into account the shape and size of the soldering iron tip, the heat tolerance
of the connection and the workability of that temperature.
• Correct bonding temperature
The correct bonding temperature refers not to the temperature of the heat source, but to the bonding temperature that will
give the best bond strength.
Precautions when soldering with lead-free solder
• Soldering iron maintenance
Because of the high soldering iron temperature in lead-free soldering, there is rapid carbonization of the flux adhering to
the tip of the soldering iron.
(1) Always cover the tip of the soldering iron with solder when it is not being used.
(2) If the tip is black from carbonization, wipe it gently with a paper towel soaked in alcohol until the solder will wet.
• Uniform heating of the board and components
To ensure that the lead-free solder wets the entire surface of the pattern and the lands despite its poor wetting
characteristics, you must move the tip of the soldering iron over a wide area to raise the temperature of the entire
connection.
Soldering iron
A soldering iron with a temperature control is best.
4
FinePix F650 Service Manual
Solder wire (thread)
Use the lead-free solders specified below.
Solder type: Sn96.5Ag3Cu0.5 (Displayed symbol: SnAgCu)
Wire diameter: 0.6, 0.8 or 1.0 mm
DC IN 5V socket
A/V OUT
(Audio/Visual output)
socket
USB socket
Strap mount
12
FinePix F650 Service Manual
2.Disassembly
2-1.Names of internal Components
2. Disassembly
OPERATION BUTTON
FLASH PWB ASSY
CABI R ASSY
KEY UNIT
MAIN PWB ASSY
LCD
SPEAKER
BATTERY
HOLDER ASSY
MICROPHONE
MONITOR HOLDER
LENS ASSY
CABI F ASSY
13
2. Disassembly
2-2.Removing the CABI REAR ASSY
FinePix F650 Service Manual
(1) Remove the 2 special screws (M1.7 x 4.0).
(2) Remove the 2 screws (M1.7 x 3.0).
(3) Remove the 2 screws (M1.7 x 2.5).
(4) Set the mode dial to the "SP" position and disengage
the 3 hooks as you remove the CABI REAR ASSY in
the direction of the arrow. (Set the mode dial to "SP" for
re-assembly also.)
3
1
2
HOOK
SP
(5) Unlock the connector and remove the KEY UNIT FPC.
[Assembly]
Assemble by performing the removing procedure in
reverse.
4
5
14
FinePix F650 Service Manual
HOOK
1
2
3
2-3.Disassembling the CABI REAR ASSY
(1) Remove the 4 screws (M1.4 x 2.0).
(2) Disengage the 2 hooks as you remove the KEY UNIT.
2. Disassembly
(3) Remove the OPERATION BUTTON.
[Assembly]
Assemble by performing the disassembly procedure in
reverse.
15
2. Disassembly
2-4.Removing the LCD monitor
FinePix F650 Service Manual
(1) Remove the LCD monitor in the direction of the arrow.
(2) Remove the connector and then remove the LCD FPC.
(3) Remove the LCD wire harness.
[Assembly]
Assemble by performing the removing procedure in
reverse.
1
2
3
16
FinePix F650 Service Manual
2-5.Removing the LENS ASSY
2. Disassembly
(1) Remove the 3 screws (M1.7 x 4.0).
(2) Remove the MONITOR HOLDER.
(3) Remove the LENS connector.
(4) Remove the connector and then remove the CCD FPC.
(5) Remove the LENS ASSY in the direction of the arrow.
1
2
5
3
[Assembly]
Assemble by performing the removing procedure in
reverse.
4
17
2. Disassembly
2-6.Removing the MAIN PWB ASSY
FinePix F650 Service Manual
(1) Remove the solder at 5 points.
(2) Remove the screw (M1.7 x 4.0).
(3) Open the BATTERY COVER.
(4) Remove the MAIN PWB ASSY in the direction of the
arrow.
[Notes on Assembly]
(1) Run the MIC wire harness as shown in the figure on the
right.
2
4
1
3
1
1
(2) Install the MAIN PWB ASSY with the BATTERY
COVER open, (to prevent damage to the BATTERY
COVER detector switch).
[Assembly]
Assemble by performing the removing procedure in
reverse.
18
FinePix F650 Service Manual
1
2
3
2-7.Removing the BATTERY HOLDER
(1) Remove the 2 screws (M1.7 x 4.0).
(2) Raise the BATTERY HOLDER in the direction of the
arrow.
(3) Open the right side of the CABI at the strap mount
outwards slightly and remove the BATTERY HOLDER.
[Assembly]
Assemble by performing the removing procedure in
reverse.
2. Disassembly
2-8.Removing the FLASH PWB ASSY
(1) Peel off the FLASH PWB SPACER.
(2) Discharge the current across the (+) RD and (-) BK
terminals.
Take care not to touch the FLASH PWB ASSY before
discharging.
(3) Remove the solder at 4 points.
(4) Remove the 2 screws (M1.7 x 4.0).
(5) Remove the FLASH PWB ASSY in the direction of the
arrow.
(6) Remove the trigger coil solder.
4
1
5
3
2
6
[Assembly]
Assemble by performing the removing procedure in
reverse.
19
3. Schematics
FinePix F650 Service Manual
3.Schematics
3-1.Description of CCD circuit
Ø7B
Ø8
V
V
14
13
12
Ø7A
V
ØHLD
Ø6
V
V
10
11
Ø4
Ø5A
Ø5B
V
V
V
7
8
9
Ø3A
Ø3B
ØST
V
V
V
6
4
5
Ø1A
Ø1B
Ø2
V
V
V
1
3
2
operation
3-1-1.Outline
The CCD peripheral circuit block is primarily composed of
the following ICs:
IC903 (ICX624FQN) CCD imager
IC905 (AD9949AKCPZ) H driver, CDS, AGC, A-D conversion
IC901 (CXD3443GA), V drivers
1VØ1AVertical register transfer clock
2VØ1BVertical register transfer clock
3VØ2Vertical register transfer clock
4VØ3AVertical register transfer clock
5VØ3BVertical register transfer clock
6VØSTHorizontal addition control clock
7VØ4Vertical register transfer clock
8VØ5AVertical register transfer clock
9VØ5BVertical register transfer clock
10VØ
11VØ
12VØ
13VØ
14VØ
HLD
7A
7B
Horizontal addition control clock
6
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Protective transistor bias
Horizontal register transfer clock
Horizontal register transfer clock
<Table 3-1. Explanation of the CCD terminals>
B
G
G
R
B
G
G
R
B
G
G
R
B
G
G
R
B
G
G
R
B
G
(Note)
G
R
25
26
24
SUB
C
(Note): Photosensor
NC
27
L
V
Ø1A
H
28
Ø2A
H
3-1-3.IC901 (V driver) and IC905 (H driver)
The H driver and V driver are necessary to generate the
clocks that drive the CCD (vertical register transfer clock,
horizontal register transfer clock and electronic shutter
clock). IC 901 comprise the V driver, XV1-XV6 output from
IC101 comprises the vertical register transfer clock, and XSG
is superposed in IC901 to generate a 3-value pulse. The
XSUB output by IC101 serves as the clearing pulse for the
electronic shutter. The H driver is built into IC905 and the
clocks for H1, H2 and RG are created by IC905.
3-1-4.IC905 (CDS, AGC, A-D conversion)
Video signals output from the CCD are input via pin 27 on
IC905. Inside the IC are a sampling hold block, AGC block
and A-D conversion block. The sampling phase and AGC
amplifier settings are specified using serial data to pin 32.
The video signals are A-D converted and output as 12-bit
data.
20
CCDIN
RG
H1-H4
VRB
VRT
VREF
2~36 dB
VGA
PxGA
CDS
HORIZONTAL
4
DRIVERS
CLAMP
INTERNAL
CLOCKS
PRECISION
TIMING
CORE
SYNC
GENERATOR
VD
HD
<Fig 3-2. IC905 block diagram>
ADC
CLAMP
INTERNAL
REGISTERS
SL
SCK
12
SD ATA
DOUT
CLI
FinePix F650 Service Manual
3. Schematics
3-2.Description of CP1 circuit
operation
3-2-1.Circuit Description
Digital clamp
The black levels for the CCD output data are evened up
across the line by subtracting the averaged value for the
optical black sections of the CCD from the subsequent data.
The average value for the optical black sections of the CCD
is obtained by multiplying the value for the previous line by a
coefficient k and multiplying the value for the current line by a
coefficient k-1 and then taking the sum of the multiples.
Signal processor
γγ
γ (gamma) correction circuit: γ (gamma) correction is
γγ
performed to ensure that there is a linear relationship
between the optical input to the camera and the optical
output of the screen receiving the image.
Color signal generation circuit: This circuit converts the
CCD data to R, G and B signals.
Matrix circuit: This circuit uses the R, G and B signals to
generate Y, R-G and B-G signals.
Horizontal/vertical aperture circuit: This circuit generates
the aperture signal.
3-2-2.Outline of Operation
When the shutter is released, the microprocessor sends a
reset signal and a serial signal (TAKE A PICTURE
instruction) to the ASIC and CPU and operation begins.
When the TG/SG drives the CCD, the image data passes
through A-D conversion and CDS and is sent to the ASIC as
12-bit data. The received (input) data is then input to SDRAM
via the digital clamp.
This data is used to calculate the AF, AE, AWB, shutter and
AGC values, and then 3 exposures are normally taken to
obtain the best possible image. The data for the images
stored in SDRAM is loaded into the CPU and the colors are
generated. Each pixel in the R, G and B data is interpolated
from the surrounding data to generate the R, G and B pixel
data. After AWB and γ (gamma) correction, a matrix is
generated and aperture compensation is applied for the Y
signal. The resulting data is then subjected to JPEG
compression and recorded onto card memory (xD-Picture
card). When the data is output to an external device, the data
is fetched from memory and output serially via USART. When
the image is played back on an LCD or monitor, the data is
transferred from memory to SDRAM, expanded into the
SDRAM display area and then displayed.
AE/AWB/AF calculation circuit
This circuit calculates the AE and AWB values by dividing the
screen into 64 zones and calculates the AF value by dividing
the screen into 6 zones.
SDRAM controller circuit
This circuit outputs the address, RAS, CAS and AS used for
SDRAM control. This circuit also refreshes the SDRAM.
Communication control
SIO: This is the interface with the 8-bit microprocessor.
SIO for LCD, PWM and PIO: This makes it possible to
switch between PWM output and individual I/O in 8-bit
parallel I/O.
TG/SG
This controls and generates timing for the 6-megapixel CCD.
Digital encoder
This generates chroma signals from the color difference
signals.
3-2-3.LCD Block
The LCD display circuit is located on the CP1 PWB and
consists of the LCD driver IC (IC171) and its peripheral
circuits.
Signals from the ASIC, consisting of 8-bit digital signals,
serial control signals and synchronization control signals, are
input to the LCD driver IC.
These signals are then converted to RGB signals by the LCD
driver IC. The serial control signals are used to control
factors such as brightness and image quality.
The larger the potential differences between the COM
signals (common electrode voltage: AC fixed) and the R, G
and B signals, the greater the LCD pixel closure and the
darker the display. Conversely, the smaller the potential
difference, the less the LCD pixel closure and the brighter the
display.
21
3. Schematics
FinePix F650 Service Manual
3-2-4.Lens Drive Block
Focus drive
The 8-bit serial data signals (L_DATA along with L_STB,
FCLK, L_ST and L_SCLK) output from the ASIC (IC 101) are
driven by the motor driver (IC951) and in turn drive the
stepping motor used for focusing (AF_M0, AF_M1, AF_M2
and AF_M3).
The focus reference position is detected by a photointerrupter (AF_HOME) in the lens block.
Zoom drive
The signals (ZIN1 and ZIN2) output from the ASIC (IC101)
are subjected to a constant-current drive (ZM(+) and ZM(-))
from the motor driver (IC 951) and in turn drive the DC motor
for the zoom.
The zoom reference position is detected by a photo-reflector
(ZM_HOME) in the lens block. To ascertain the zoom
position, the ASIC (IC101) counts the output from a photointerrupter (ZM_ENC) in the lens block.
Shutter drive
The shutter drive signals (SIN1 and SIN2) output from the
ASIC (IC101) are subjected to a constant-current drive (SD1
and SD2) from the motor driver (IC 951) and in turn open
and close the mechanical shutter.
Aperture drive
The 8-bit serial data signals (L_DATA along with L_STB,
ICLK, L_ST and L_SCLK) output from the ASIC (IC 101) are
driven by the motor driver (IC951) and in turn widen or
narrow the aperture (ST1, ST2, ST3 and ST4).
3-3.Description of PWA power
circuit operation
3-3-1.Outline
The power circuit consists primarily of the following blocks:
• Switching power controller (IC501)
• Analog 12V (A) power output (L5003, Q5001)
• Analog -7.5V (A) power output (L5005, Q5005, IC502)
• Digital VDD 3V power output (L5001)
• Digital VDD 1.2V power output (L5002)
• Backlight power output (L5006, Q5006)
• Lens, Microcomputer power output (L5301)
• Analog 3.45V (A) power output (IC503)
• LCD 3.0V (L) power output (IC505)
Switching power controller (IC501)
The basic circuitry required to control the PWM switching
regulator power supply has 7 internal channels, of which 6
are used. One more channel is built into the linear regulator,
and this channel is also used.
These are CH1 (BOOST 5.0V), CH2 (digital VDD 3V), CH3
(digital VDD 1.2V), CH4 (analog -7.5V), CH5 (analog 12V
(A)) and CH7 (backlight).
The power supply output feedback from CH1 (BOOST 5.0V),
CH2 (digital VDD 3V), CH3 (digital VDD 1.2V), CH4 (analog -
7.5V) and CH5 (analog 12V (A)) is received and used to vary
the PWM duty so that the respective set voltages are
maintained.
For the backlight power supply (CH7), the end-to-end voltage
for the output resistance is used as feedback to regulate the
constant current so that the set current is maintained.
Short-circuit protection
If output is short-circuited for an interval determined by the
capacitor connected to IC501 (pin 1), all output is turned off.
To recover operation, resend the control signal (P ON).
Analog power output
+12V (A) is output.
+12V (A) is fed back to the switching controller (IC501 (pin
39)) for PWM control.
Analog -7.5V power output
-7.5V (A) is output.
-7.5V (A) is fed back to the switching controller (IC501 (pin
38)) for PWM control.
Digital VDD3 power output
VDD 3 is output.
VDD 3 is fed back to the switching controller (IC501 (pin 45))
for PWM control.
22
FinePix F650 Service Manual
3. Schematics
Digital VDD 1.2V power output
VDD 1.2 is output.
VDD 1.2 is fed back to the switching controller (IC501 (pin
44)) for PWM control.
Backlight power output
A constant current flows to the LCD backlight LED. The endto-end voltage for the resistance connected in series with the
LED is fed back to the switching controller (IC501 (pin 42))
for PWM control.
Lens, microcomputer power output
5.0 V is output.
The 5.0V output is fed back to the switching controller (IC501
(pin 36)) for PWM control. This 5.0V output is the source for
the analog 3.45V supply.
Analog 3.45V power output
3.45V (A) is output.
Obtained from the BOOST 5.0V via IC503.
Digital LCD 3.0V power output
3.0V (L) is output.
Obtained from the VDD3 via IC505.
3-4.Description of ST1 flash
circuit operation
3-4-1.Charging circuit
When UNREG power is supplied to the charging circuit and
the CHG signal from the microprocessor is Hi (3.3 volt), the
charging circuit starts operating and charges the main
electrolytic capacitor with direct current at high voltage. If the
CHG signal is Lo (0 volt), the charging circuit does not
operate.
Power switch
When the CHG signal is Hi, IC542 is set to ON and charging
starts.
Power filter
C5407 acts as a power filter that smoothes out current
ripples caused by oscillation transformer switching.
Oscillation circuit
This circuit generates an AC voltage (pulses) for stepping up
the DC low-voltage UNREG power supply. The oscillation
circuit generates drive pulses with frequencies from
approximately 50 KHz to 100 KHz. Because the circuit is
self-oscillating, the oscillation frequency varies depending on
the drive conditions.
Oscillation transformer
The oscillation transformer converts the low-voltage AC
current generated by the oscillation control circuit to a highvoltage AC current.
Rectifier circuit
This circuit rectifies high-voltage AC current occurring on the
secondary side of T5401 so that it becomes high-voltage DC
current and stores the charge in the main electrolytic
capacitor (C5412).
Voltage monitor circuit
This circuit is used to maintain the voltage stored in C5412 at
a set level. Once the charging voltage has been divided and
reduced by R5402, R5405, R5406 and R5412, it is output as
the monitor voltage VMONIT.
When the VMONIT voltage reaches the stipulated value, the
CHG signal is set to Lo and charging stops.
23
3. Schematics
3-4-2.Flash Circuit
When an FLCLT signal is input to this circuit from the ASIC
expansion board, the flash fires.
Flash control circuit
When the FLCLT signal input to the flash control circuit is
"Hi", Q5409 is set to ON and flash firing commences. When
the FLCLT signal is "Lo", flash firing stops.
Trigger circuit
When Q5409 is set to ON by the FLCLT signal and the flash
is ready to fire, at the same time a high-voltage pulse of
several kilovolts is generated by the trigger coil and applied
to the flash unit.
Flash element
When the high-voltage pulse from the trigger circuit is
applied to the flash unit, the current flows into the flash
element and the flash fires.
FinePix F650 Service Manual
* Beware of electric shocks.
24
FinePix F650 Service Manual
3. Schematics
3-5.Description of SYA circuit operation
3-5-1.Configuration and Functions
Refer to the block diagram for the overall configuration of the SYA block. At the core of the SYA block is an 8-bit
microprocessor (IC301). The functions handled by the 8-bit microprocessor are: 1. Operation key input; 2. Clock management
and backup; 3. Power ON/OFF; and 4. Flash charging control.
<Table 3-2. 8-bit microprocessor port specifications>
PinSignal nameI/ODescription
1BAT OFFIBattery OFF detection signal
2SET VDDO3.2V/2.6V output switching signals
3VF.LED (g)OVF. LED (green) (H = lit)
4NOT USED-5SW 3.2 ONOSW 3.2V control signal (L = ON)
6RESETIReset input
7XCOUTOClock oscillation terminal
8XCINIClock oscillation terminal (32.768kHz)
9IC (FLMD0)IPower supply for program writing
10NOT USED--
11NOT USED-12REGC-Stable-capacity connection terminal for regulator output (2.5V) for internal operations
13VSS-GND
14VSS-GND
15VDD-VDD
16VDD-VDD
17MAIN RESETOSystem reset (MRST)
18NOT USED-19VF.LED (R)OVF. LED (red) (L = lit)
20SELF LEDOSELF LED (red) (L = lit)
21S2IShutter 2nd detection
22COMREQIASIC serial communication request signal
23NOT USED-24PLLENOPLL operation mode control signal (H = oscillation)
25S2ICard cover SW detection
26BACKUP_CTROBackup battery charging control
27NOT USED-28SCAN IN1IKey matrix input
29SCAN IN0IKey matrix input
30P ONOD-D converter (digital) control signal (H = ON)
31NAND RESETONAND Reset
32USB CONNECTIUSB power detection terminal
33P31-On-chip debugging port
34SCAN OUT0OKey matrix output
35SCAN OUT1OKey matrix output
36SCAN OUT2OKey matrix output
37SCAN OUT3OKey matrix output
38SREQISerial communication request signal
39AL3.2 ONOAL3.2V Power ON/OFF control signal
40LCD PWMCLCD backlight brightness current control
25
3. Schematics
PinSignal nameI/ODescription
41NOT USED-42LCD ONOD-D converter control signal (H = ON)
43BL ONOLCD backlight control signal (H = ON)
44PRG SO/SCAN IN2O/ISerial data output for the flash/key matrix input
45PRG SO/SCAN IN3I/ISerial data input for the flash/key matrix input
46PRG SO/SCAN IN4O/ISerial rock output for the flash/key matrix input
47AVREF-Analog reference voltage input terminal
48AVSS-GND
49BATTERYIBattery voltage monitoring
50VMONITIMain capacitor charging voltage monitoring
51TEMPICamera body temperature monitoring
52THOUTI_AD54DC INIDC JACK detection (L = attached)
55AV JACKIAV JACK detection (L = attached)
56xD CARDIExpansion memory card installation detection signal (L = installed)
57NOT USED-58SCKOSerial clock output
59SIISerial data input
60SOOSerial data output
61CHG ONOFlash charging control circuit (H = ON)
62FLMD0_SYOPort for writing to the microprocessor card
63PW_ONI intPW_ON key input
64S1I intS1 detection
FinePix F650 Service Manual
3-5-2.Internal Communications Paths
The SYA block is used for detecting the status of the camera circuits and input from operation keys, and for controlling the
entire camera. The 8-bit microprocessor loads signals from the various detection sensors as input data and then outputs the
results to the camera circuit (ASIC) as operation mode settings data.
Figure 5-1 shows the connections between the 8-bit microprocessor and the ASIC.
MAIN RESET
PLL EN
8-bit
microprocessor
<Fig 3-3. Internal communication path connections>
SREQ
SDO
SDI
SCK
COMREQ
ASIC
3-5-3.Key Operations
Refer to the Instruction Manual for information on how to use the camera’s keys.
An 8-bit microprocessor controls power to the entire system. This description covers the starting and stopping of the power
supply.
When the battery is installed, IC501 is activated and generates 5.0 volts. This power supply is regulated to 3.2 V by IC302 and
supplied to a microprocessor (IC301). Even when the power switch is set to OFF, clock counting and key scanning continues
in readiness for the next activation.
When the power is turned off, the microprocessor stops the main clock (4 MHz) and runs on the sub-clock (32.768 kHz).
When the power is turned off, the supply voltage switching function for the IC302 microprocessor runs the microprocessor in
power-saving mode.
When the battery supplying power is removed, IC302 switches the power supply for the 8-bit microprocessor to the backup
battery and the microprocessor runs in low-power mode. In this situation, the microprocessor stops the main clock and runs
the clock only using the sub-clock used for keeping the time.
(The backup battery is charged for 10 hours after the battery is fitted.) When the power switch is set to ON, the
microprocessor performs activation processing. First, it sets PON (pin 30) to High to activate the power circuit. Roughly 97.6
ms after setting PON to High, it specifies the external port setting for the ASIC. This external port setting is then used to set
the ASIC internal operating frequency and control oscillation. The microprocessor also initiates communication with the ASIC
and checks that the system is capable of running.
When the LCD panel lights, LCDON (pin 42) is set to High and the panel power supply is activated. BLON (pin 43) is then set
to High to activate the backlight power supply.
When the power is turned off, the lens retracts, PON, LCDON and BLON are all set to Low and the power supply to the
system stops. The microprocessor stops main clock oscillation and the operation mode switches to clock oscillation.
ASIC, memoryCCD8bit CPULCD MONITOR
Power supply voltage1.2V, 3.25V12.0V, -7.5V, 3.4V3.2V3.0V
At PW_OFFOFFOFF32KHzOFF
In live imageONON4MHzON
In playback modeONOFF4MHzON
<Table 3-4. Power supply control>
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