Fibocom Wireless SC806AM Users Manual

SC806 Hardware User Manual

Version: V2.0.0 Update date: April 27, 2018

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SC806Hardware User ManualPage2 of 70

Version history

Version

Update date

Description

V1.0.0

02-23-2017

Initial version

V1.0.1

06-19-2017

1. Modify SD card power L12 description

2. Modify the PMU_GPIO voltage description

3. Modify the LED charging indicator pin description

4. Modify motor drive pin description

5. Modify the mandatory download pin description

6. Modify WIFI reception sensitivity 802.11g rate

7. Add SC806-CN-02 product description

V1.0.2

01-12-2018

Add headphone MIC design note

V2.0.0

04-27-2018

Optimized version

Add supported band descriptions of other sc806 models

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SC806Hardware User ManualPage3 of 70

Copyright© 2017 Fibocom Wireless Inc. All rights reserved. Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or distribute the document in any form.

Notice

The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee.

The statements should be displayed in the user manual:

changes or modifications not expressly approved by the party responsible for compliance could void the user’s

authority to operate the equipment.

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

-- Reorient or relocate the receiving antenna.

-- Increase the separation between the equipment and receiver.

-- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

-- Consult the dealer or an experienced radio/TV technician for help. This device complies with FCC radiation exposure limits set forth for an uncontrolled environment. In order to avoid the possibility of exceeding the FCC radio frequency exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches) during normal operation. This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

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SC806Hardware User ManualPage4 of 70

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and users, and the Max allowed antenna gain is as following table showed:

Operating Band

Antenna Gain（dBi）

WCDMA BAND II

8.05

WCDMA BAND IV

5.50

WCDMA BAND V

12.1

LTE BAND 2

8.55

LTE BAND 4

6.00

LTE BAND 5

12.6

LTE BAND 12

12.6

LTE BAND 13

12.6

LTE BAND 17

12.6

BT/WIFI Test Gain

Antenna Gain（dBi）

2.4G WiFi

2.5

WIFI 5G

2.1

2) The transmitter module may not be co-located with any other transmitter or antenna. As long as 2 conditions above are met, further transmitter test will not be required. However, the OEM integrator is still responsible for testing their end-product for any additional compliance requirements required with this module installed

Host manufacturer is responsible for ensuring that the host continues to be compliant with the Part 15 subpart B unintentional radiator requirements after the module is installed and operational.

IMPORTANT NOTE: In the event that these conditions can not be met (for example certain laptop configurations or co-location with another transmitter), then the FCC authorization is no longer considered valid and the FCC ID can not be used on the final product. In these circumstances, the OEM integrator will be responsible for re-evaluating the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “Contains FCC ID: ZMOSC806AM”.The grantee's FCC ID can be used only when all FCC compliance requirements are met.

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SC806Hardware User ManualPage5 of 70

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or remove this RF module in the user’s manual of the end product which integrates this module. The end user manual shall include all required regulatory information/warning as show in this manual.

Trademark

The trademark is registered and owned by Fibocom Wireless Inc.

Applicable model

S/N

Product model

Description

SC806-CN-00

SC806-CN-02

Do not support LTE diversity reception. Others are the same as SC806-CN-00.

SC806-AM-00

support 5G WIFI

SC806-AB-00

support 5G WIFI

SC806-AE-00

support 5G WIFI

SC806-CN-01

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SC806Hardware User ManualPage6 of 70

Contents

Version history ................................................................................................................................................ 2

Applicable model ............................................................................................................................................ 5

Contents ......................................................................................................................................................... 6

Table index ..................................................................................................................................................... 9

Figure index ..................................................................................................................................................11

1 Foreword .............................................................................................................................................. 12

1.1 Introduction ............................................................................................................................ 12

1.2 Reference Standards ................................................................................................................ 12

1.3 Related documents .................................................................................................................. 12

2 Product Overview .................................................................................................................................. 13

2.1 Description ............................................................................................................................. 13

2.2 Main Performance ................................................................................................................... 13

2.3 Hardware Diagram .................................................................................................................. 15

3 Application Interface ............................................................................................................................. 16

3.1 LCC+LGA Interface ................................................................................................................ 16

3.1.1 Pin Distribution ............................................................................................................... 17

3.1.2 Pin Definition .................................................................................................................. 17

3.2 Power ..................................................................................................................................... 26

3.2.1 Power Supply .................................................................................................................. 26

3.2.2 Lithium Battery Charge and Battery Management .............................................................. 28

3.2.3 RTC Power...................................................................................................................... 28

3.2.4 Power Output .................................................................................................................. 29

3.3 Control Signal......................................................................................................................... 30

3.3.1 Module Startup ................................................................................................................ 30

3.3.2 Module Shutdown and Restart .......................................................................................... 31

3.3.3 Sleep/wakeup .................................................................................................................. 32

3.3.4 Reset............................................................................................................................... 32

3.4 USB Interface ......................................................................................................................... 32

3.5 UART Interface ...................................................................................................................... 34

3.6 USIM Interface ....................................................................................................................... 34

3.7 SDIO Interface........................................................................................................................ 36

3.8 GPIO Interface........................................................................................................................ 37

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3.9 I2C Interface ........................................................................................................................... 38

3.10 ADC Interface ........................................................................................................................ 39

3.11 Motor Drive Interface .............................................................................................................. 39

3.12 LCM Interface ........................................................................................................................ 39

3.13 Touch Screen Interface ............................................................................................................ 40

3.14 Camera Interface ..................................................................................................................... 41

3.14.1 Front camera ................................................................................................................... 41

3.14.2 Rear camera .................................................................................................................... 42

3.14.3 Design note ..................................................................................................................... 42

3.15 Sensor Design ......................................................................................................................... 44

3.16 Audio ..................................................................................................................................... 44

3.16.1 Audio interface definition ................................................................................................. 44

4 Antenna Interface .................................................................................................................................. 45

4.1 MAIN/DRX Antenna .............................................................................................................. 45

4.1.1 Operating bands ............................................................................................................... 45

4.1.2 Reference Design ............................................................................................................. 46

4.2 WIFI/BT Antenna ................................................................................................................... 47

4.2.1 Operating band ................................................................................................................ 47

4.2.2 Reference design ............................................................................................................ 47

4.3 GNSS Antenna........................................................................................................................ 48

4.3.1 Operating band ................................................................................................................ 48

4.3.2 Reference design ............................................................................................................. 48

4.4 Antenna Requirement .............................................................................................................. 49

5 Other Interfaces ..................................................................................................................................... 50

6 RF PCB Layout Design Guide ................................................................................................................ 50

7 WIFI and Bluetooth ............................................................................................................................... 52

7.1.1 WIFI overview ................................................................................................................ 52

7.1.2 WIFI performance parameters .......................................................................................... 52

7.1.3 Bluetooth overview .......................................................................................................... 54

7.1.4 Bluetooth performance parameters .................................................................................... 54

8 GNSS ................................................................................................................................................... 55

8.1.1 Overview ........................................................................................................................ 55

8.1.2 Performance parameters ................................................................................................... 55

9 Electrical Characteristics and Reliability ................................................................................................. 55

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9.1 Recommended Parameters ....................................................................................................... 55

9.2 Charge Parameters .................................................................................................................. 56

9.3 Operating Current ................................................................................................................... 56

9.4 RF Transmitting Power ............................................................................................................ 57

9.5 RF Receiver Sensitivity ........................................................................................................... 58

9.6 Electrostatic Protection ............................................................................................................ 58

10 Structural specification ................................................................................................................... 59

10.1 Product appearance ................................................................................................................. 59

10.2 Structural Dimension ............................................................................................................... 60

10.3 Recommended PCB Welding Plate Design ................................................................................ 61

10.4 SMT Patch ............................................................................................................................. 61

10.5 Storage ................................................................................................................................... 61

10.5.1 Storage life ...................................................................................................................... 61

10.5.2 Workshop life .................................................................................................................. 62

10.5.3 Baking ............................................................................................................................ 62

10.6 Packaging ............................................................................................................................... 62

10.6.1 Tray packaging ................................................................................................................ 62

10.6.2 Tray dimension ................................................................................................................ 64

11 Appendix A Term Abbreviations ............................................................................................................. 65

12 Appendix B GPRS Encoding Scheme .............................................................................................. 68

13 Appendix C GPRS Multislot ........................................................................................................... 69

14 Appendix D EDGE Modulation and Encoding Method ..................................................................... 70

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Table index

Table 4 SC806-AM-00 Supported band ................................................................................................... 13

Table 7 Main performance parameters ..................................................................................................... 13

Table 8 I/O parameter definition ............................................................................................................. 17

Table 9 Pin description ........................................................................................................................... 18

Table 10 Power supply parameters .......................................................................................................... 26

Table 11 Power supply filter capacitor design .......................................................................................... 27

Table 12 VRTC parameters ..................................................................................................................... 29

Table 13 Power description..................................................................................................................... 29

Table 14 startup/shutdown pin definition ................................................................................................. 30

Table 15 USB pin definition ................................................................................................................... 32

Table 16 module internal USB trace length .............................................................................................. 33

Table 17 UART interface pin definition ................................................................................................... 34

Table 18 USIM pin definition ................................................................................................................. 34

Table 19 SDIO pin definition .................................................................................................................. 36

Table 20 GPIO list ................................................................................................................................. 37

Table 21 I2C pin definition ..................................................................................................................... 38

Table 22 ADC pin definition ................................................................................................................... 39

Table 23 Motor pin definition ................................................................................................................. 39

Table 24 LCM pin definition .................................................................................................................. 40

Table 25 TP pin definition ...................................................................................................................... 40

Table 26 Front camera pin definition ....................................................................................................... 41

Table 27 Rear camera pin definition ................................................................................................... 42

Table 28 Module internal MIPI trace length ............................................................................................. 43

Table 29 Sensor control pin description ................................................................................................... 44

Table 30 Audio interface definition ......................................................................................................... 44

Table 31 MAIN/DRX antenna interface definition.................................................................................... 45

Table 32 Module operating band ............................................................................................................. 45

Table 33 WIFI/BT antenna interface definition......................................................................................... 47

Table 34 WIFI/BT operating band ........................................................................................................... 47

Table 35 GNSS antenna interface definition ............................................................................................. 48

Table 36 GNSS operating band ............................................................................................................... 48

Table 37 Module antenna requirement ..................................................................................................... 49

Table 38 WIFI transmission power table ............................................................................................. 52

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Table 39 WIFI reception sensitivity ........................................................................................................ 53

Table 40 BT rate and version information ................................................................................................ 54

Table 41 BT performance parameters ...................................................................................................... 54

Table 42 GNSS positioning performance ................................................................................................. 55

Table 43 Recommended parameters ........................................................................................................ 55

Table 44 Charge parameters .................................................................................................................... 56

Table 45 Operating current ..................................................................................................................... 56

Table 46 Module RF transmitting power .................................................................................................. 57

Table 47 Module RF receiver sensitivity .................................................................................................. 58

Table 48 ESD performance ..................................................................................................................... 59

Table 49 GPRS encoding scheme ............................................................................................................ 68

Table 50 Multilevel multislot allocation ................................................................................................... 69

Table 51 EDGE modulation and encoding method ................................................................................... 70

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Figure index

Figure 1 Hardware Block Diagram .......................................................................................................... 16

Figure 2 Pin Distribution (TOP perspective) ............................................................................................ 17

Figure 3 Power Design ........................................................................................................................... 27

Figure 4 Power Voltage Drop Example .................................................................................................... 28

Figure 5 VRTC Reference Design Circuit Diagram .................................................................................. 29

Figure 6 Button Startup Circuit ............................................................................................................... 30

Figure 7 Drive Circuit Startup ................................................................................................................. 31

Figure 8 Startup Time Slot ...................................................................................................................... 31

Figure 9 Shutdown Time Slot ................................................................................................................. 32

Figure 10 USB Interface Circuit Diagram ................................................................................................ 33

Figure 11 USIM Card Interface Circuit Diagram ...................................................................................... 35

Figure 12 MAIN/DRX Antenna Connection ............................................................................................ 46

Figure 13 WIFI/BT Antenna Connection ................................................................................................. 47

Figure 14 GNSS Antenna Connection ..................................................................................................... 49

Figure 15 Two-layer PCB Microstrip Structure ........................................................................................ 50

Figure 16 Two-layer PCB Coplanar Waveguide Structure ......................................................................... 51

Figure 17 Four-layer PCB Coplanar Waveguide Structure (reference ground layer3) ................................... 51

Figure 18 Four-layer PCB Coplanar Waveguide Structure (reference ground layer4) ................................... 51

Figure 19 Module Product Appearance .................................................................................................... 59

Figure 20 Structural Dimension .............................................................................................................. 60

Figure 21 Recommended PCB Welding Plate Design (Unit: mm) .............................................................. 61

Figure 22 Tray Packaging ....................................................................................................................... 63

Figure 23 Tray Dimension ...................................................................................................................... 64

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1 Foreword

1.1 Introduction

This document describes the electrical characteristics, RF performance, structure size, application environmentand other information ofSC806 module. With the help of this document and other related documents, application developers can quickly understand the hardware functions of SC806 module and implement the hardware development of products..

1.2 Reference Standards

This design of the product complies with the following standards:  3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1: Conformance

specification

 3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification;Radio transmission and

reception (FDD);Part 1: Conformance specification

 3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio transmission and

reception (TDD)

 3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio transmission and

reception; Part 1: Conformance testing

 3GPP TS 21.111 V10.0.0: USIM and IC card requirements  3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment (SIM-ME)

interface

 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

application

 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT)  3GPP TS 36.124V10.3.0: ElectroMagnetic Compatibility (EMC) requirements for mobile terminals and

ancillary equipment

 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)  3GPPTS27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment (DTE -

DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

1.3 Related documents

N/A

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2 Product Overview

2.1 Description

Fibocom’s SC806 module is a smart module based on the Qualcomm MSM8909 platform. The SC806 integrates

core components such as Baseband, EMCP, PMU, Transceiver, and PA to support multi-standard long-distance communication modes such as FDD/TDD-LTE, WCDMA, TD-SCDMA, CDMA, CDMA2000-EVDO, GSM, and WIFI/BT short-distance wireless transmission technology. It supports GNSS wireless positioning technology. SC806 is embedded with Android operating system, and has various interfaces such as MIPI/USB/UART/SPI/I2C. It is the optimal solution for the core system of wireless smart products. The SC806 module supports multiple formats and frequency bands. The corresponding standard and frequency band are as follows:

Table1SC806-AM-00 Supported band

Mode

Band

WCDMA

Band 2/4/5

FDD-LTE

Band2/4/5/12/13/17

WIFI802.11 a/b/g/n

2412-2462 MHz，5180-5825 MHz

BT4.1 LE

2402-2480 MHz

GNSS

GPS /GLONASS /BeiDou

The SC806 is a module with 210 pins, including 146 LCC pins and 64 LGA pins. The size is 40.5mm × 40.5mm ×

2.8mm. It can be embedded in various M2M products through welding plate. It is very suitable for the development of mobile devices such as on-board computers, multimedia devices, smart homes, and Internet of Things devices.

2.2 Main Performance

The following table describes the detailed performance parameters of the SC806 Table2Main performance parameters

Performance

Description

Power

DC 3.3-4.5V, typical voltage: 3.8V

Application CPU

Qualcomm’s® MSM8909:Quad-ARM®Cortex™-A7application processors up to 1.1GHz + 512KB L2 cache

Multimedia CPU

QDSP6 v5 Core Operating frequency691.2MHz 768KB L2

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Memory

8Gb LPDDR3+ 8 GB eMMC Flash

Operating system

Android Lollipop

Power class

Class 3 (24dBm+1/-3dB) for WCDMA bands Class 3 (23dBm±2dB) for LTE FDD bands

GSM/GPRS/EDGE characteristics

R99：

CSD transmission rate: 9.6kbps, 14.4kbps

GPRS：

Support GPRS multi-slot class 33 Coding formats: CS-1/CS-2/CS-3 and CS-4 frame maximum 5Rx time slots

EDGE：

Support EDGE multi-slot class 33 Support GMSK and 8-PSK Uplink encoding format:CS 1-4 and MCS 1-9

Downlink encoding format:CS 1-4 and MCS 1-9

WCDMAcharacteristics

Support3GPP R8 DC-HSPA+ Support16-QAM，64-QAM and QPSK modulation 3GPP R6 CAT6 HSUPA: Maximum uplink rate 5.76Mbps 3GPP R8 CAT24 DC-HSPA+: Maximum downlink rate 42Mbps

CDMA/EVDOcharacteristics

Support CDMA 1X Advanced，1XEV-DOr0/-DOrA Maximum uplink rate 1.8Mbps, maximum downlink rate3.1Mbps

TD-SCDMAcharacteristics

Support CCSA Release 4 Maximum uplink rate 2.2Mbps, maximum downlink rate 4.2Mbps

LTEcharacteristics

Support FDD/TDD CAT4 Support 1.4-20MRF bandwidth Downlink support multi-userMIMO Maximum uplink rate50Mbps, maximum downlink rate 150Mbps

WLANcharacteristics

2.4G wifiSupport802.11b/g/n，5G wifiSupport802.11a/n Maximum rate 150Mbps

Support AP mode

Bluetoothcharacteristics

BT4.1（BR/EDR+BLE)

Satellite positioning

GPS/GLONASS/BeiDou

Short Message（SMS）

Text and PDU modes Point to point MO and MT SMS cell broadcast SMS storage: stored by default in the module

LCMinterface

4 sets MIPI_DSI, each set supports up to 1.5Gbps SupportWVGA（2 sets MIPI_DSI）, up to 720P (4 sets MIPI_DSI) 24bit color depth

Camera interface

Use MIPI_CSI, each set supports up to 1.5Gbps and supports 2 cameras Rear camera uses 2 sets MIPI_CSI, up to 8MP pixels

Front camera uses 1 set MIPI_CSI, up to 5MP pixels

Audio Interface

Audio Input: 3 analog microphone inputs with integrated internal bias

Audio output: Class AB stereo headphone output Class AB differential handset output

Class D differential speaker amplifier output

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USBinterface

Support USB2.0 high speed mode, data transmission rate up to 480 Mbps Support USB OTG (add 5V power supply chip)

SIMinterface

2 sets USIM card interface Support USIM/SIM card: 1.8V and 2.95V

Support dual card dual standby (software support required)

UARTinterface

2 sets serial ports A set four-wire serial port supporting RTS and CTS hardware flow control A set two-wire serial port for Debug

Maximum speed to 4Mbps

SDIOinterface

Support SD3.0, 4bit SDIO; SD card supports hot plug

I2Cinterface

3 sets I2C, high speed up to 3.4Mbps for TP, Camera, Sensor and other peripherals

ADCinterface

3 sets for input voltage detection, battery temperature detection, and universal ADC

Real-time clock

Support

Antennainterface

MAIN antenna, DRX antenna, GNSS antenna, WIFI/BT antenna interface

Physical characteristics

Size: 40.5mm * 40.5mm * 2.85mm Package: 146 LCC pin + 64 LGA pin

Weight: about 9.2g

Temperature range

Operating temperature: -30°C - 70°C 1) Storage temperature: -40°C - 85°C

Software update

Via USB/OTA/SD

RoHS

RoHS Compliant

Note: 1） When the module is operating in this temperature range, the functions of the module are normal, and the

relevant performance of the module meets the 3GPP standard.

2.3 Hardware Diagram

The following hardware diagram shows the main hardware functions of the SC806 module, including the following:

 Baseband  Wireless transceiver  PMU  Storage  Peripheral interface

-- Communication expansion interface (USB/UART/I2C/SDIO)

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--USIM card interface

--MIPI DSI interface

--MIPI CSI interface

-- Analog audio interface

Figure1Hardware Block Diagram

3 Application Interface

3.1 LCC+LGAInterface

SC806module adopts LCC+LGA packaging, with a total of 210 pins, including 146 LCC pins and 64 LGA pins.

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3.1.1 Pin Distribution

Figure2Pin Distribution (TOP perspective)

Note: The pin “NC” stands for No connect, ie the pin for this position is a reserved pin and does not need to be connected.

3.1.2 Pin Definition

Table3I/O parameter definition

Type

Description

input/output

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Digital input

Digital output

Power input

Power output

Analog input

Analog output

Open drain

The SC806’s pin functions and electrical characteristics are described in the following table: Table4Pin description

Power

Pin Name

Pin No.

I/O

Pin Description

Note

VBAT_BB

1,2

Baseband power input

Input voltage range: 3.3 ~ 4.5V, recommend

3.8V

VBAT_RF

145,146

RF power input

Voltage range: 3.3 ~ 4.5V, recommend 3.8V

VDD_1V8_L5

111

1.8Vvoltage output

Drive current200mA

VDD_1V8_L6

125

1.8V voltage output

Drive current200mA

VDD_2V85_L17

129

2.85V voltage output

Drive current420mA

VDD_SD_L12

SD card pull-up resistor power supply, 2.95V

Drive current50mA

VDD_SD_L11

SD card power supply,

2.95V

Drive current600mA VDD_USIM1_L14

SIM card 1 power supply

2.95/1.8 Vadjustable, 55mA

VDD_ USIM2_L15

SIM card 2 power supply

2.95/1.8 Vadjustable, 55mA

VRTC

126

I/O

RTC clock power supply pin

Voltage range: 2.0 ~3.25V, recommend 3.0 V GND

3,7,12,15,27,51,62,

Ground

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SC806Hardware User ManualPage19 of 70

69,76,78,85,86,88, 89,120,122,130, 132,135,140,143, 144,147,148,149, 150,160,161,162, 163,164,165,166, 167,168,169,170, 171,172,173,174, 175,176,177,178, 180,181,182,184, 185,186,188,189, 192,193,198,200, 201,208,209

Battery

Pin Name

Pin No.

I/O

Pin Description

Note

BATT_CON_TEMP

134

Battery temperature detection pin

NTC resistor connected to battery

VBAT_ SNS

133

Battery voltage detection pin

BATT_ID

194

Battery position detection

CHARGE_SEL

127

Charge scheme selection pin

Grounding uses the module’s external charge

scheme, and floating uses the module’s

built-in charge scheme. Default is floating

VREF_BATT_THERM

187

Battery temperature detection circuit reference voltage

LED_CHARGE_N

191

Charge status indicator pin

Connect indicator negative

Button Pin Name

Pin No.

I/O

Pin Description

Note

KEY_ON/OFF

114

Analog switch button

Low effect

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SC806Hardware User ManualPage20 of 70

KEY_VOL_UP

Volume +

Low effect

KEY_VOL_DOWN

Volume -

Low effect

KEY_RST_N

179

Reset pin

PMIC reset input, low effect

USIM interface

Pin Name

Pin No.

I/O

Pin Description

Note

USIM1_DIO

I/O

SIM card 1 data signal

USIM1_CLK

SIM card 1 clock signal

USIM1_RST

SIM card 1 reset signal

USIM1_ DET

SIM card 1 plug detection

Fixed level when not in use

USIM2_DIO

I/O

SIM card 2 data signal

USIM2_CLK

SIM card 2 clock signal

USIM2_RST

SIM card 2 reset signal

USIM2_ DET

SIM card 2 plug detection

Fixed level when not in use

SDcard interface

Pin Name

Pin No.

I/O

Pin Description

Note

SD_D3

I/O

SD card data interface

SD_D2

I/O

SD card data interface

SD_D1

I/O

SD card data interface

SD_D0

I/O

SD card data interface

SD_CLK

SD card clock

SD_CMD

I/O

SD cardcommand interface

SD_DET

SD card detection

Low level is effective

I2Cinterface

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Pin Name

Pin No.

I/O

Pin Description

Note

I2C_SCL_EXT

I/O

I2Cclock

Sensor or other peripherals use

I2C_SDA_EXT

I/O

I2C data trace

Sensor or other peripherals use

I2C_SCL_TP

I/O

I2C clock

Default TP use

I2C_SDA_TP

I/O

I2C data trace

Default TP use

I2C_SCL_CAM

I/O

I2C clock

Default camera use

I2C_SDA_CAM

I/O

I2C data trace

Default camera use

USBinterface

Pin Name

Pin No.

I/O

Pin Description

Note

VBUS_5V

141,142

Device mode, 5V input USB_DM

I/O

USB signal -

USB_DP

I/O

USB signal +

USB_ID

USB OTG detection pin

UARTinterface

Pin Name

Pin No.

I/O

Pin Description

Note

UART2_TX

UART2 data transmission

UART2_RX

UART2 data reception

UART2_CTS

UART2clear transmission

UART2_RTS

UART2request

UART1_TX

UART1 data transmission

Debug port

UART1_RX

UART1 data reception

Debugport

MIPI-DSIinterface

Pin Name

Pin No.

I/O

Pin Description

Note

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Fibocom Wireless SC806AM Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual