Fibocom Wireless N510GL User Manual

FIBOCOM N510-GL Hardware User Manual

Version: V1.0.0 Date: 2019-06-13

FIBOCOM N510-GL Hardware User Manual Page 2 of 56

Applicability type

No.

Product model

Description

N510-GL

The manual is suitable for N510-GL series products.

FIBOCOM N510-GL Hardware User Manual Page 3 of 56

Without the prior written permission of the copyright holder, any company or individual is prohibited to excerpt, copy any part of or the entire document, or transmit the document in any form.

Notice

The document is subject to update from time to time owing to the product version upgrade or other reasons. Unless otherwise specified, the document only serves as the user guide. All the statements, information and suggestions contained in the document do not constitute any explicit or implicit guarantee.

Trademark

The trademark is registered and owned by Fibocom Wireless Inc.

FIBOCOM N510-GL Hardware User Manual Page 4 of 56

Versions

Version

Author

Assessor

Approver

Update Date

Description

V1.0.0

Wang yuanguang

Liuke

Chenguojiang

2019-06-13

Initial Version

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Contents

Contents .................................................................................................................................................... 5

Table Index ................................................................................................................................................ 9

1 Foreword .......................................................................................................................................... 10

1.1 Introduction ........................................................................................................................ 10

1.2 Safety Instructions .............................................................................................................. 11

2 Product Overview ................................................................................................ ............................. 12

2.1 Product Introduction ........................................................................................................... 12

2.2 Application Diagram ........................................................................................................... 16

2.3 Development Board ........................................................................................................... 16

3 Pin Distribution ................................................................................................................................. 17

3.1 Pin Distribution Chart ......................................................................................................... 17

3.2 Pin Function Description .................................................................................................... 17

4 Work Mode ....................................................................................................................................... 22

4.1 Off Mode ............................................................................................................................ 22

4.2 Standby Mode .................................................................................................................... 22

4.3 Data Service ...................................................................................................................... 23

4.4 Low power mode................................................................................................................ 23

5 Electrical Characteristics .................................................................................................................. 24

5.1 Power Supply ..................................................................................................................... 24

5.1.1 Description of Power Pin ............................................................................................ 24

5.1.2 Power Supply Design Requirements .......................................................................... 24

5.2 Electrostatic Protection Capability ...................................................................................... 25

5.3 Mode Power Consumption ................................................................................................. 26

6 Functional Interface .......................................................................................................................... 30

6.1 Control Interface ................................................................................................................ 30

6.1.1 Module Startup ............................................................................................................ 30

6.1.1.1 Explanation of switch pin .............................................................................. 30

6.1.1.2 Startup Operation Requirements .................................................................. 30

6.1.1.3 Boot Time Sequence .................................................................................... 31

6.1.2 Module Shutdown ....................................................................................................... 31

6.1.2.1 Shutdown Operation Requirements .............................................................. 31

6.1.2.2 Shutdown Mode ............................................................................................ 32

6.1.2.3 Shutdown Time ............................................................................................. 32

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6.1.3 Reset .......................................................................................................................... 33

6.1.3.1 Reposition Pin Description ........................................................................... 33

6.1.3.2 Instructions for the Use of Reset .................................................................. 33

6.1.4 Flight Mode ................................................................................................................. 34

6.2 Indicator Interface .............................................................................................................. 34

6.2.1 Pin Description ............................................................................................................ 34

6.2.2 Working State Indication ............................................................................................. 34

6.3 Low Power Design ............................................................................................................. 40

6.3.1 DRX ............................................................................................................................ 40

6.3.2 eDRX ................................................................................................ .......................... 40

6.3.3 PSM ............................................................................................................................ 41

6.4 SIM Card Interface ............................................................................................................. 35

6.4.1 SIM Pin Description .................................................................................................... 35

6.4.2 SIM Interface Circuit ................................................................................................... 35

6.4.3 SIM Card Circuit Design Requirements ...................................................................... 36

6.5 UART ................................................................................................................................. 36

6.5.1 UART Pin Description ................................................................................................. 36

6.5.2 UART Interface Application ......................................................................................... 37

6.6 I2C ..................................................................................................................................... 38

6.7 ADC ................................................................................................................................... 38

6.7.1 ADC Pin Description ................................................................................................... 38

6.7.2 ADC Instructions for Use ............................................................................................ 39

7 RF Specifications ............................................................................................................................. 43

7.1 operating Frequency Band ................................................................................................. 43

7.2 Transmission Power .......................................................................................................... 43

7.3 Reception Sensitivity ................................................................ .......................................... 44

7.4 Communication Antenna .................................................................................................... 45

7.4.1 Antenna Interface ....................................................................................................... 45

7.4.2 Antenna Design Requirements ................................................................................... 45

7.5 RF PCB Design ................................................................................................................. 46

7.5.1 Route Principle ........................................................................................................... 46

7.5.2 Impedance Design ...................................................................................................... 47

8 Reliability .......................................................................................................................................... 48

8.1 Ambient Temperature Range ............................................................................................. 48

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8.2 Environmental Reliability Requirements............................................................................. 48

8.3 ESD Design Requirements ................................................................................................ 49

9 Structural Specifications ................................................................................................................... 50

9.1 Product Appearance .......................................................................................................... 50

9.2 Structure Size .................................................................................................................... 50

9.3 Packing .............................................................................................................................. 51

10 Certification ................................................................................................ ............................... 52

11 Default Setting .......................................................................................................................... 53

11.1 Default Settings of UART ................................................................ ................................... 53

11.2 Default Settings for Low Power Mode ................................................................................ 53

11.3 Inspection Function Default Setting of Plug-In SIM Card ................................................... 53

11.4 USB Default Settings ......................................................................................................... 53

12 Order Information ...................................................................................................................... 54

13 Appendix ................................................................................................................................... 55

13.1 Terminology ....................................................................................................................... 55

13.2 Relevant Documents ................................................................ .......................................... 55

13.3 Reference Standard ........................................................................................................... 56

13.4 Contact Information ............................................................................................................ 56

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Figure Index

Figure2-1 Application diagram ........................................................................................................ 16

Figure2-2 Hardware block diagram ................................................................................................ 16

Figure3-1 Pin Distribution Map (TOP Plane Perspective) ............................................................... 17

Figure5-1 Capacitance Combination Design of Power Supply Input ................................................ 24

Figure5-2 Power Supply Limitation ................................................................................................... 25

Figure6-1 OC/OD Driver Reference Switch-on Circuit ..................................................................... 30

Figure6-2 Key Boot Reference Circuit .............................................................................................. 31

Figure6-3 Bootup Sequence Diagram .............................................................................................. 31

Figure6-4 Hardware shutdown control sequence ............................................................................. 32

Figure6-5 Reset control timing ......................................................................................................... 33

Figure6-6 SIM Card Reference Circuit with Detection Signal ........................................................... 35

Figure6-7 Diagram of UART Signal Connection between Module and MCU ................................... 37

Figure6-8 Module and MCU UART Level Conversion Circuit ............................................................ 38

Figure7-1 Current Diagram of PSM Working Time ........................................................................... 41

Figure7-2 AT instruction description entering PSM mode .................................................................. 41

Figure8-1 Modular Antenna Pi Circuit ............................................................................................... 46

Figure10-1 Module Appearance Diagram ......................................................................................... 50

Figure10-2 N510-GL structural dimensions ....................................................................................... 50

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Table Index

Table2-1 Product Specifications ...................................................................................................... 12

Table3-1 N510-GL Pin Definitions ................................................................................................... 17

Table3-2 I/O parameter description ................................................................................................ 20

Table4-1 N510-GL Mode of Work ................................................................................................... 22

Table5-1 Definition of External Power Supply Interface Pin for Module ........................................... 24

Table5-2 Capacitance Design Description of External Power Supply Circuit ................................... 24

Table5-5 Explanation of electrostatic protection capability of module pins (temperature: 25℃,

humidity: 45%) .......................................................................................................................... 26

Table5-6 Module Power Statistics Table ............................................................................................ 26

Table6-1 Definition of Switch Interface Pin ....................................................................................... 30

Table6-2 Shutdown Mode ................................................................................................................. 32

Table6-3 Reposition pin description ................................................................................................. 33

Table6-4 Instructions for Interface Pins of Indicators ........................................................................ 34

Table6-5 Description of the Working State of Indicator Lamp ........................................................... 34

Table6-6 PSM Timer Configuration Correspondence Table .............................................................. 42

Table6-7 Module SIM Card Pin Description ....................................................................................... 35

Table8-1 Description of working frequency band of module ........................................................... 43

Table8-2 Explanation of Transmitting Power of Modules in Each Frequency Band ........................ 43

Table8-3 Description of Line Interface Pins .................................................................................... 45

Table8-4 Modular Antenna Design Requirements .......................................................................... 45

Table9-1 Ambient Temperature Range for Module Operation ......................................................... 48

Table9-2 Environmental Reliability Requirements for Module Work ............................................... 48

Table13-1 Order Information Table for N510-GL Products .............................................................. 54

Table14-1 Documents on Terminology ............................................................................................ 55

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1 Foreword

This paper describes the electrical characteristics, RF performance, structure size and application environment of N510-GL module. With the help of this document and other related documents, developers can quickly understand the hardware functions of N510-GL module and develop products.

1.1 Introduction

This product is designed with reference to the following criteria:

 3GPP TS 36.521-1 R13: User Equipment (UE) conformance specification; Radio transmission

and reception; Part 1: Conformance testing  3GPP TS 36.521-1 V14.5.0 *R14: User Equipment (UE) conformance specification; Radio

transmission and reception; Part 1: Conformance testing

 3GPP TS 21.111 V10.0.0: USIM and IC card requirements  3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment

(SIM-ME) interface  3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

application  3GPP TS102.223 V07.06.0: Universal Subscriber Identity Module (USIM) Application

Toolkit(USAT)

Cooperating with the following documents will help us to better understand and use this product:

 N510-GL Family AT Command Manual  Fibocom N510-GL LCC+LGA SMT Application Design Description  ADP-N510 Instruction Manual

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1.2 Safety Instructions

By following the following safety principles, personal safety can be ensured and products and work environments can be protected from potential damage. The product manufacturer needs to communicate the following safety instructions to the end user. If these safety rules are not complied with, Fibocom will not bear any responsibility for the consequences of user misuse.

Road safety first! When you drive, do not use handheld mobile devices, even if they have hands-free functions. Please stop before you call!

Please close the mobile terminal before boarding. The wireless function of the mobile terminal is prohibited from opening on the aircraft to prevent interference to the aircraft communication system. Ignorance of this prompt may lead to flight safety and even violation of the law.

When in hospitals or health care settings, please pay attention to whether there are restrictions on the use of mobile devices. Radio frequency interference may cause malfunction of medical equipment, so it may be necessary to turn off mobile terminal equipment.

Mobile terminal devices do not guarantee effective connection under any circumstances, such as when mobile terminal devices are not charged or (U) SIM is invalid. When you encounter these situations in an emergency, remember to use emergency calls, while ensuring that your device is on and in an area with sufficient signal strength.

Your mobile terminal device receives and transmits radio frequency signals at boot time. Radio Frequency Interference (RFI) occurs when it is close to TV, radio, computer or other electronic devices.

Please keep mobile terminal equipment away from flammable gas. Close the mobile terminal when you are near the gas station, oil depot, chemical plant or explosion workplace. Operating electronic equipment in any potentially explosive dangerous place has potential safety hazards.

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2 Product Overview

2.1 Product Introduction

N510-GL is a highly integrated NB-IoT wireless communication module, which supports the R13 standard of NB-IoT specification. The product specifications of N510-GL are as follows:

Table2-1 Product Specifications

Specifications

Operating Band

Band 1,2,3,4,5,8,12,13,17,18,19,20,25,26*,28,66,71,85

Data Transmission R13

Single-tone UL：15.6kbps

Multi-tone UL：62.5kbps，DL：26.15kbps

R14*

Single-tone UL：18.1kbps

Multi-tone UL:158.5Kbps DL/126.8Kbps UL

Power

DC:3.3V~5V (3.8V DC power supply is recommended)

Temperature Operating temperature：-30°C~+75°C①

Extended temperature：-40°C~+85°C②

Storage: -40°C~+90°C

Physical Characteristics

Package: LCC 42pin+LGA 28pin

Dimension: 22.2 x 20.2 x 2.1 mm

Weight:1.6g

Interface

Antenna

Antenna x 1

Functional Interface

USIM 1.8V/3.0V

2 wire UART x 2，4 wire UART x 1

EINT、I2C、GPIO、System Indicator、ADC

Software

Protocol Stack

Embedded TCP/IP and UDP/IP protocol stack

AT Command

3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT

Firmware update

UART

Remarks:

1.①It represents that the module can work normally in this temperature range, and the related

performance meets the requirements of 3GPP standard.

2.②It indicates that the module can work normally in this temperature range and the baseband

RF function is normal, but individual RF indicators may exceed the standard range of 3GPP.

When the temperature returns to the normal working range of the module, the indicators of the

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module will still meet the standard of 3GPP.

3.* B26 software is closed

NB1 Band: 1/2/3/4/5/8/12/13/17/18/19/20/25/26*/28/66/71/85 Max power 23dBm

Restriction of Hazardous Substances Directive (RoHS)

European Union

FIBOCOM products sold in the European Union, on or

after 3 January 2013 meet the requirements of

Directive 2011/65/EU on the restriction of the use of

certain hazardous substances in electrical and

electronic equipment (“RoHS recast” or “RoHS 2”).

uropean Union compliance statement

European Union conformity

The following information is

applicable to mobile devices

that carry a CE mark.

EU Regulatory Conformance

Hereby, We, Manufacturer （Fibocom Wireless Inc.）declares that the radio equipment type N510-GL is in

compliance with

the Directive 2014/53/EU.

In all cases assessment of the final product must be mass against the Essential requirements of the Directive

2014/53/EU Articles 3.1(a) and (b), safety and EMC respectively, as well as any relevant Article

RF exposure

This product meets the applicable national or international RF exposure guidance

( EN62133) At normal use, the device is at least 20cm away from the human body. The RF exposure

guidance includes a considerable safety margin designed to assure the safety of all persons, regardless of

age and health.

FCC Certification Requirements.

According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a

mobile device.

And the following conditions must be met:

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1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna

installation and operating configurations of this transmitter, including any applicable source-based

timeaveraging

duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion Requirements

of 2.1091.

2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s body

and must not transmit simultaneously with any other antenna or transmitter.

3.A label with the following statements must be attached to the host end product: This device contains

FCC ID: ZMON510GL

4.To comply with FCC regulations limiting both maximum RF output power and human exposure to RF

radiation, maximum antenna gain (including cable loss) must not exceed:

Operating Band

FCC Max Antenna Gain（dBi） LTE NB1 BAND 2

9.00

LTE NB1 BAND 4

6.00

LTE NB1 BAND 5

10.41

LTE NB1 BAND 12

9.69

LTE NB1 BAND 13

10.15

LTE NB1 BAND 17

9.72

LTE NB1 BAND 25

9.00

LTE NB1 BAND 66

LTE NB1 BAND 71

9.46

LTE NB1 BAND 85

9.69

5. This module must not transmit simultaneously with any other antenna or transmitter

6. The host end product must include a user manual that clearly defines operating requirements and

conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.

For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is

required to satisfy the SAR requirements of FCC Part 2.1093

If the device is used for other equipment that separate approval is required for all other operating

configurations, including portable configurations with respect to 2.1093 and different antenna

configurations.

For this device, OEM integrators must be provided with labeling instructions of finished products.

Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:

A certified modular has the option to use a permanently affixed label, or an electronic label. For a

FIBOCOM N510-GL Hardware User Manual Page 15 of 56

permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2

Certification (labeling requirements) above). The OEM manual must provide clear instructions

explaining to the OEM the labeling requirements, options and OEM user manual instructions that are

required (see next paragraph).

For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible

when installed in the host, or (2) if the host is marketed so that end users do not have straightforward

commonly used methods for access to remove the module so that the FCC ID of the module is visible;

then an additional permanent label referring to the enclosed module:“Contains Transmitter Module FCC

ID: ZMON510GL” or “Contains FCC ID: ZMON510GL” must be used. The host OEM user

manual must also contain clear instructions on how end users can find and/or access the module and

the FCC ID.

The final host / module combination may also need to be evaluated against the FCC Part 15B criteria

for unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.

The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the

user that changes or modifications not expressly approved by the party responsible for compliance

could void the user's authority to operate the equipment. In cases where the manual is provided only in

a form other than paper, such as on a computer disk or over the Internet, the information required by

this section may be included in the manual in that alternative form, provided the user can reasonably be

expected to have the capability to access information in that form.

This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) This device may not cause harmful interference, and (2) this device must accept any interference

received, including interference that may cause undesired operation.

Changes or modifications not expressly approved by the manufacturer could void the user’s authority to

operate the equipment.

To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring

compliance with the module(s) installed and fully operational. For example, if a host was previously

authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without

a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring

that the after the module is installed and operational the host continues to be compliant with the Part 15B

unintentional radiator requirements.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding how to install or

remove this RF module in the user’s manual of the end product which integrates this module. The end user

manual shall include all required regulatory information/warning as show in this manual.

FIBOCOM N510-GL Hardware User Manual Page 16 of 56

2.2 Application Diagram

The peripheral application of the N510-GL module is shown in Figure 2-1:

Figure2-1 Application diagram

The hardware diagram in figure 2-2 shows the major hardware functions of the N510-GL module, including baseband and RF function.

Baseband includes:

 BB  Power supply  Application interface

RF includes:

 RF Power  RF Front end

Figure2-2 Hardware block diagram

2.3 Development Board

ADP-N510 is a development board for debugging of N510-GL module. With this development board, we can quickly master module functions and complete basic function testing. Refer to ADP-N510 Instructions for the Specific Use of Development Board.

FIBOCOM N510-GL Hardware User Manual Page 17 of 56

3 Pin Distribution

3.1 Pin Distribution Chart

The N510-GL module is encapsulated by LCC+LGA with 70 pins. There are 42 pins encapsulated by LCC around the module and 28 pins encapsulated by LGA at the bottom. The pin distribution and definition are shown in the following figure:

Figure3-1 Pin Distribution Map (TOP Plane Perspective)

3.2 Pin Function Description

The pin definitions of the N510-GL module are as follows:

Table3-1 N510-GL Pin Definitions

PIN Name

I/O

PIN Description

DC Characteristics

Note

GND

- 2

GND

- 3

RF_ANT

I/O

Antenna

- 4

GND

- 5

GND

- 6

NC - -

keep it open

GND

- 8

GND

VBAT

Power supply for module

3.8V(3.3V-5V)

VBAT

Power supply for module

3.8V(3.3V-5V) 11-12

NC - -

keep it open

VDD

Power supply for

external GPIO’s pull

up circuits

2.8V

If the pin is unused, keep it open

POWER_ON_N

POWER_ON

3.3V

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