Fibocom Wireless M910GL Users Manual

M910-GL Series Hardware User Manual

Version: V1.0.1

Update date: Mar 21, 2018

M910-GL Hardware User Manual Page 1 of 45

No.

Product model

Description

1

M910-GL-00-00

MCP is 1G + 512M and supports MAIN_ANT and GNSS_ANT

Version

Update Date

Description

V1.0.0

2017-12-24

Initial version

V1.0.1

2018-03-21

Add VBUS feature description

Applicability Table

Copyright

Without the prior written permission of the copyright holder, any company or individual is

prohibited to excerpt, copy any part of or the entire document, or distribute the document in any

form.

Notice

The document is subject to update from time to time owing to the product version upgrade or

other reasons. Unless otherwise specified, the document only serves as the user guide. All the

statements, information and suggestions contained in the document do not constitute any explicit

or implicit guarantee.

Version Record

M910-GL Hardware User Manual Page 2 of 45

Contents

1 Foreword ................................................................................................... 5

1.1 Introduction ............................................................................................ 5

1.2 Safety Instruction .................................................................................... 5

1.3 Reference Standards ................................................................................ 6

1.4 Related Document ................................................................................... 6

1.5 EU Declaration of Conformity (DoC) ........................................................ 7

1.6 Federal Communication Commission Interference Statement ........................ 8

1.7 IC Statement ......................................................................................... 10

2 Product Overview ..................................................................................... 12

2.1 Product Introduction .............................................................................. 12

2.2 Product Specifications ............................................................................ 12

2.3 Hardware Diagram ................................................................................ 13

3 Application Interface ................................................................................ 15

3.1 LGA Interface ....................................................................................... 15

3.1.1 Pin Distribution ...................................................................................... 15

3.1.2 Pin definition .......................................................................................... 16

3.2 Power Supply ........................................................................................ 20

3.2.1 Power Supply .......................................................................................... 20

3.2.2 1.8V Output ............................................................................................ 20

3.2.3 Power consumption ................................................................................. 20

3.3 Control Signal ....................................................................................... 22

3.3.1 Module start-up....................................................................................... 23

3.3.2 Module shutdown .................................................................................... 24

3.3.3 Module reset ........................................................................................... 25

3.4 USB Interface ....................................................................................... 26

3.4.1 USB interface definition ........................................................................... 26

3.5 USIM Interface ..................................................................................... 27

3.5.1 USIM pin ................................................................................................ 27

3.5.2 USIM interface circuit ............................................................................. 27

3.5.3 USIM design requirements ....................................................................... 29

3.6 UART Interface ..................................................................................... 29

3.6.1 UART interface definition ........................................................................ 29

3.6.2 UART interface application ...................................................................... 30

M910-GL Hardware User Manual Page 3 of 45

3.7 Status Indicator ..................................................................................... 30

3.8 PCM/IIS ............................................................................................... 31

3.8.1 Digital voice interface definition .............................................................. 31

3.8.2 Interface description ................................................................................ 31

3.8.3 Signal description ................................................................................... 31

3.9 ADC function ....................................................................................... 31

4 Antenna Interface ..................................................................................... 32

4.1 Antenna design ..................................................................................... 32

4.1.1 Antenna RF connector ............................................................................. 32

4.1.2 RF output power of M910-GL .................................................................. 33

4.1.3 RF receiving sensitivity of M910-GL ......................................................... 34

4.1.4 Operating frequency of M910-GL supported bands (MHz) ......................... 35

4.2 Antenna Design ..................................................................................... 36

4.2.1 Antenna design requirements .................................................................... 36

5 Electrical Characteristics .......................................................................... 37

5.1 Limiting voltage range ........................................................................... 37

5.2 Environment temperature range ............................................................... 38

5.3 Electrical characteristics of the interface in operating status ........................ 38

5.4 Environmental reliability requirements ..................................................... 39

5.5 ESD characteristics ................................................................................ 40

6 Structure Specification.............................................................................. 41

6.1 Product Appearance ............................................................................... 41

6.2 Dimension of Structure .......................................................................... 42

6.3 SMT Patch ............................................................................................ 42

6.4 Storage ................................................................................................. 42

6.4.1 Storage life ............................................................................................. 42

6.4.2 Baking .................................................................................................... 43

6.5 Packaging ............................................................................................. 43

6.5.1 Tape packaging ....................................................................................... 44

6.5.2 Packaging list (TBD) ............................................................................... 44

M910-GL Hardware User Manual Page 4 of 45

1 Foreword

1.1 Introduction

This document describes the electrical characteristics, RF performance, structure size, application

environment, etc. of M910-GL module. With the assistance of the document and other instructions,

the developers can quickly understand the hardware functions of the M910-GL module and

develop products.

1.2 Safety Instruction

By following the safety guidelines below, you can protect the personal safety and help protect the

product and work environment from potential damage. Product manufacturers need to

communicate the following safety instructions to end users. In case of failure to comply with these

safety rules, Fibocom will not be responsible for the consequences caused by the user’s misuse.

Road safety first! When you drive, do not use the handheld devices even if it

has a hand-free feature. Please stop and call!

Please turn off the mobile device before boarding. The wireless feature of the

mobile device is not allowed on the aircraft to prevent interference with the

aircraft communication system. Ignoring this note may result in flight safety

issue or even breaking the law.

When in a hospital or health care facility, please be aware of restrictions on

the use of mobile devices. Radio frequency interference may cause medical

equipment to malfunction, so it may be necessary to turn off the mobile

device.

The mobile device does not guarantee that an effective connection can be

made under any circumstances, for example, when there is no prepayment for

the mobile device or the SIM is invalid. When you encounter the above

situation in an emergency, remember to use an emergency call, while keeping

your device turned on and in areas where signal is strong.

Your mobile device receives and transmits RF signals when it is powered on.

M910-GL Hardware User Manual Page 5 of 45

Radio interference occurs when it is near televisions, radios, computers, or

other electronic devices.

Keep the mobile device away from flammable gases. Turn off the mobile

device when near gas stations, oil depots, chemical plants or explosive

workplaces. There is a safety hazard in operating electronic equipment in any

potentially explosive environment.

1.3 Reference Standards

This design of the product complies with the following standards:

 3GPP TS 51.010-1 V10.5.0: Mobile Station (MS) conformance specification; Part 1:

Conformance specification

 3GPP TS 34.121-1 V10.8.0: User Equipment (UE) conformance specification; Radio

transmission and reception (FDD); Part 1: Conformance specification

 3GPP TS 34.122 V10.1.0: Technical Specification Group Radio Access Network; Radio

transmission and reception (TDD)

 3GPP TS 36.521-1 V10.6.0: User Equipment (UE) conformance specification; Radio

transmission and reception; Part 1: Conformance testing

 3GPP TS 21.111 V10.0.0: USIM and IC card requirements

 3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile

Equipment (SIM-ME) interface

 3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module

(USIM) application

 3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application

Toolkit(USAT)

 3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for

mobile terminals and ancillary equipment

 3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)

 3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating

Equipment (DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast

Service (CBS)

1.4 Related Document

FIBOCOM M910-GL LGA SMT Application Design Instruction

M910-GL Hardware User Manual Page 6 of 45

Name of manufacturer:

Fibocom Wireless Inc.

Address:

5/F,Tower A,Technology Building II,1057 Nanhai Avenue

Zip code & City:

Shenzhen

Country:

China

Telephone number:

+86 755 26525092

Product description:

LTE(CatM1, NB-IoT) Module

Type designation(s):

M910-GL

Trademark:

Fibocom

Batch / Serial number:

EN 301 489-1 V2.1.1; EN 301 489-19 V2.1.0;

EN 301 489-52 V1.1.0; EN 303 413 V1.1.1

EN 301 511 V12.5.1; EN 301 908-1 V11.1.1

EN 301 908-13 V11.1.2

EN 62311:2008

EN 60950-1：2006+ A11:2009 + A1:2010 + A12:2011 + A2:2013

1.5 EU Declaration of Conformity (DoC)

Hereby we,

declare that this DoC is issued under our sole responsibility and that this product:

Object of the declaration (further identification of the radio equipment allowing

traceability; it may include a color image for the identification of the radio equipment):

is in conformity with the relevant Union harmonization legislation:

Radio Equipment directive: 2014 / 53 / EU

with reference to the following standards applied:

The Notified Body SGS United Kingdom Limited, with Notified Body number 0890

performed:

Modules: B+C and issued the EU-type examination certificate.

Signed: Printed name: Yin Jixiong

Place and date of issue:2018-07-24

On behalf of Company name: Fibocom Wireless Inc.

Position within Company: Regulatory Principal Engineer

M910-GL Hardware User Manual Page 7 of 45

1.6 Federal Communication Commission Interference

Statement

Changes or modifications not expressly approved by the party responsible for compliance

could void the user’s authority to operate the equipment.

This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference in a residential installation. This

equipment generates, uses and can radiate radio frequency energy and, if not installed

and used in accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not occur in a

particular installation.

If this equipment does cause harmful interference to radio or television reception, which

can be determined by turning the equipment off and on, the user is encouraged to try to

correct the interference by one or more of the following measures:

-- Reorient or relocate the receiving antenna.

-- Increase the separation between the equipment and receiver.

-- Connect the equipment into an outlet on a circuit different from that to which the receiver

is connected.

-- Consult the dealer or an experienced radio/TV technician for help.

This device complies with FCC radiation exposure limits set forth for an uncontrolled

environment. In order to avoid the possibility of exceeding the FCC radio frequency

exposure limits, human proximity to the antenna shall not be less than 20cm (8 inches)

during normal operation.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following

two conditions: (1) this device may not cause harmful interference, and (2) this device

must accept any interference received, including interference that may cause undesired

operation.

This transmitter must not be co-located or operating in conjunction with any other antenna

or transmitter.

This device is intended only for OEM integrators under the following conditions:

1) The antenna must be installed such that 20 cm is maintained between the antenna and

users, and the Max allowed antenna gain is as following table showed:

M910-GL Hardware User Manual Page 8 of 45

Operating Band

Antenna Gain（dBi）

GSM850

5.46

GSM1900

3

LTE-M1 BAND 2

9.5

LTE-M1 BAND 4

6.5

LTE-M1 BAND 12

12.94

LTE-M1 BAND 13

13.42

LTE-M1 BAND 26(814-824)

11.65

LTE-M1 BAND 26(824-849)

14.46

LTE-NB1 BAND 2

9.5

LTE-NB1 BAND 4

6.5

LTE-NB1 BAND 12

12.95

LTE-NB1 BAND 13

13.42

LTE-NB1 BAND 26(814-824)

11.65

LTE-NB1 BAND 26(824-849)

14.46

2) The transmitter module may not be co-located with any other transmitter or antenna.

As long as 2 conditions above are met, further transmitter test will not be required.

However, the OEM

integrator is still responsible for testing their end-product for any additional compliance

requirements

required with this module installed

Host manufacturer is responsible for ensuring that the host continues to be compliant with the Part 15 subpart B unintentional radiator requirements after the module is installed and operational.

IMPORTANT NOTE: In the event that these conditions can not be met (for example

certain laptop configurations or co-location with another transmitter), then the FCC

authorization is no longer considered valid and the FCC ID can not be used on the final

product. In these circumstances, the OEM integrator will be responsible for re-evaluating

the end product (including the transmitter) and obtaining a separate FCC authorization.

End Product Labeling

This transmitter module is authorized only for use in device where the antenna may be

installed such that 20 cm may be maintained between the antenna and users. The final end product must be labeled in a visible area with the following: “

ZMOM910GL”

M910-GL Hardware User Manual Page 9 of 45

Contains FCC ID:

.The grantee's FCC ID can be used only when all FCC compliance

requirements are met.

Manual Information To the End User

The OEM integrator has to be aware not to provide information to the end user regarding

how to install or remove this RF module in the user’s manual of the end product which

integrates this module. The end user manual shall include all required regulatory

information/warning as show in this manual.

1.7 IC Statement

This device complies with Industry Canada license-exempt RSS standard(s). Operation is

subject to the following two conditions: (1) this device may not cause interference, and (2)

this device must accept any interference, including interference that may cause undesired

operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils

radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes : (1)

l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter

tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en

compromettre le fonctionnement.

Radiation Exposure Statement:

This equipment complies with IC radiation exposure limits set forth for an uncontrolled

environment. This equipment should be installed and operated with minimum distance

20cm between the radiator & your body.

Déclaration d'exposition aux radiations: Cet équipement est conforme aux limites d'exposition aux rayonnements IC établies pour un environnement non contrôlé. Cet équipement doit être installé et utilisé avec un

minimum de 20 cm de distance entre la source de rayonnement et votre corps.\

This Class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de la classe B est conforme à la norme NMB-003 du Canada.

The Innovation, Science and Economic Development Canada certification label of a

module shall be clearly visible at all times when installed in the host device; otherwise,

M910-GL Hardware User Manual Page 10 of 45

the host device must be labeled to display the Innovation, Science and Economic

Development Canada certification number for the module, preceded by the words

“Contains transmitter module IC: 21374-M910GL

M910-GL Hardware User Manual Page 11 of 45

Specification

Operating

frequency band LTE FDD : B1/B2/B3/B4/B5/B8/B12/B13/B18/B19/B20/B26/B28

LTE TDD : B39 (Cat.M1 only)

GSM : GSM850/GSM900/DCS1800/PCS1900

Data transmission

LTE features

Support Cat.M1 and Cat.NB1

Cat.M1: The maximum uplink rate 375kbps, the

maximum downlink rate 375kbps

Cat.NB1: The maximum uplink rate 70kbps, the

maximum downlink rate 32kbps

GSM features GPRS: the maximum downlink rate 107kbps, the

maximum uplink rate 85.6kbps

EDGE: The maximum downlink rate 296kbps, the

maximum uplink rate 236.8kbps

Power supply

voltage

3.3V～4.3V (3.8V recommended)

Temperature

Normal: -30°C～+75°C

Extended: -40°C ～+85°C

Storage: -40°C ～+85°C

Physical

characteristics Package: LGA 120Pin

Size: 27.6×25.4×2.3 mm

Weight: TBD

Interface

Antenna

Antenna:

Main x 1、GNSS x 1

2 Product Overview

2.1 Product Introduction

The M910-GL is a multi-mode (LTE Cat.M1, LTE Cat.NB1 and EGPRS) IoT wireless

communication module that supports half-duplex LTE and GSM. It can provide data connection in

LTE-FDD, LTE-TDD, GPRS and EGPRS networks, and also supports GNSS and VOLTE (LTE

Cat.M1).

2.2 Product Specifications

M910-GL Hardware User Manual Page 12 of 45

Functional

interface

USIM 3.0V/1.8V

USB 2.0 x 1

UART, SIM, PCM, I2C

System Indicator

Clock

ADC

Software

Protocol Stack

Support PPP/TCP/UDP/SSL/TLS/FTP(S)/HTTP(S) protocols

AT Command

3GPP TS 27.007 and 27.005, and proprietary FIBOCOM AT

Firmware update

FOTA

Voice service

Support

SMS

Text and PDU mode; point-to-point SMS; SMS broadcast

MMS service

TBD

Note:

When the temperature is beyond the normal operating temperature range (-30 °C to +

75 °C), the RF performance of the module may slightly exceed the 3GPP specifications.

2.3 Hardware Diagram

Figure 2-1 hardware diagram shows the main hardware features of the M910-GL module.

 PMIC

 MCP

 Clock

 Function interface

 Transceiver

 RF PA

 RF filter

 RF switch

M910-GL Hardware User Manual Page 13 of 45

PMIC

Baseband

Control

19.2M xo

Transceiver

NAND

DDR2

IQ

POWER

GPIO Uarts

PCM

IIS

USIMIICUSBV180

LED

EMG_

RST

ADC

A_ON

2G PA+SWITCH LTE PA

BATT+

TX RX TX

LNA

SAW

RF_OUT GNSS_OUT

Figure 2-1 Hardware Diagram

M910-GL Hardware User Manual Page 14 of 45

3 Application Interface

3.1 LGA Interface

M910-GL module adopts LGA packaging with a total of 120 pins. It can be applied to the client’s

wireless application platform. The function of interface:

 Power supply

 Power on/off, reset

 interface



 I2C interface

 Status indication interface

 Emergency download interface

3.1.1 Pin Distribution

Figure 3-1 Pin Distribution Diagram

M910-GL Hardware User Manual Page 15 of 45

Pin Name

I/O

Level

Description

1

DNC

-

- 2

DNC

-

3

GND

G - Ground

4

BATT+

I

3.8V

RF PA power input（3.3V-4.3V）

5

GND

G - Ground

6

ADC

I - Analog input

7

ON

I

1.8V

High level power-on control pin;

can be floating

8

GND

G - Ground

9

V180

O

1.8V

Module digital level, 1.8V

output, 80mA

10

RXD0

I

1.8V

Serial interface signal

11

CTS0

O

1.8V

Serial interface signal

12

TXD0

O

1.8V

Serial interface signal

13

RING0

O

1.8V

Serial interface signal

14

RTS0

O

1.8V

Serial interface signal

15

DNC

-

- 16

CCRST

O

1.8V or 3.0V

SIM reset signal line

17

CCIN

O

1.8V

SIM card hot plug detection

18

CCIO

O

1.8V or 3.0V

SIM data signal line

107

GPIO14

I/O

1.8V

GPIO

19

GPIO13

I/O

1.8V

GPIO

20

CCVCC

O

1.8V or 3.0V

SIM power supply

21

CCCLK

O

1.8V or 3.0V

SIM clock signal line

22

DNC

-

23

TXDDAI

O

1.8V

Digital voice interface

24

TFSDAI

IO

1.8V

Digital voice interface

25

RXDDAI

I

1.8V

Digital voice interface

Note: It is recommended that the heat sink pad is reserved for the PCB packaging and

welded.

3.1.2 Pin definition

The pin definitions are as shown in the following table:

M910-GL Hardware User Manual Page 16 of 45

Pin Name

I/O

Level

Description

26

SCLK

I/O

1.8V

Digital voice interface

27

I2CDAT

OD - I2C interface data signal

28

I2CCLK

OD - I2C interface clock signal

29

TXD1

O

1.8V

Serial interface signal

30

RXD1

I

1.8V

Serial interface signal

31

RTS1

O

1.8V

Serial interface signal

32

CTS1

O

1.8V

Serial interface signal

33

EMG_RST

I

1.8V

Module reset signal

34

GPIO12

I/O

1.8V

GPIO

108

GPIO11

I/O

1.8V

GPIO

35

GND

G - Ground

36

GNSS

I - GNSS antenna interface

37

GND

G - Ground

38

DNC

-

- 39

GND

G - Ground

40

DNC

-

- 41

DNC

-

- 42

DSR0

43

DCD0

O

1.8V

Serial interface signal

44

DTR0

I

1.8V

Serial interface signal

45

VBUS

I

1.8V

USB plug detect signal

46

USB_DP

I/O

USB 2.0

Specification

USB differential data positive signal

47

USB_DM

I/O

USB 2.0

Specification

USB differential data negative signal

48

DNC

-

- 49

DNC

-

50

GND

G - Ground

51

LED

OD - Network indicator

52

DNC

-

- 109

PWM1

O

1.8V

Adjustable pulse signal

110

GPIO8

I/O

1.8V

GPIO

53

BATT+

I

3.8V

PMIC power input（3.3V-4.3V）

M910-GL Hardware User Manual Page 17 of 45

Pin Name

I/O

Level

Description

54

GND

G - Ground

55

GND

G - Ground

56

GND

G - Ground

57

GND

G - Ground

58

GND

G - Ground

59

RF_OUT

I/O Main antenna interface

60

GND

G - Ground

61

GND

G - Ground

62

GND

G - Ground

63

GND

G - Ground

64

GND

G - Ground

65

DNC

-

- 66

DNC

-

111

DNC

-

- 112

GPIO15

I/O

1.8V

GPIO

67

DNC

-

- 68

DNC

-

- 69

DNC

-

- 70

DNC

-

71

DNC

-

72

A_ON

I

1.8V

Power on/off signal; low level

power on /off

73

DNC

-

- 74

DNC

-

75

DNC

-

- 76

DNC

-

77

DNC

-

78

DNC

-

79

A_ON

I

1.8V

Power on/off signal; low level

power on /off

80

DNC

-

81

GND

G - Ground

82

GND

G - Ground

M910-GL Hardware User Manual Page 18 of 45

Pin Name

I/O

Level

Description

83

GND

G - Ground

84

GND

G - Ground

85

GND

G - Ground

86

GND

G - Ground

87

DNC

-

- 88

GND

G - Ground

89

GND

G - Ground

90

GND

G - Ground

91

DNC

-

92

GND

G - Ground

93

GND

G - Ground

94

GND

G - Ground

95

GND

G - Ground

96

GND

G - Ground

97

GND

G - Ground

98

DNC

- - CLK

99

GND

G - Ground

100

GND

G - Ground

101

GND

G - Ground

102

GND

G - Ground

103

GND

G - Ground

104

DNC

- - MISO

105

DNC

- - MOSI

106

DNC

- - SSN

113

GND

G - Ground

114

DNC

-

- 115

DNC

-

116

DNC

-

- 117

DL I 1.8V

Emergency download point

118

GND

G - Ground

119

GND

G - Ground

120

GND

G - Ground

M910-GL Hardware User Manual Page 19 of 45

Pin Name

I/O

Description

BATT+

I

4,53

Module power supply, 3.3 ~

4.3, nominal value 3.8V

V180

O 9 Voltage Output, 1.8V, 80mA

GND

-

Ground

Parameter

Minimum

Typical

Maximum

Unit

V180

1.71

1.8

1.89

V

IH

1.3

1.8

1.89

V

IL

-0.3 0 0.5

V

Note:

DNC pins remain floating.

3.2 Power Supply

The power interfaces of M910-GL module are as shown in the following table:

3.2.1 Power Supply

The power supply range of the M910-GL module is 3.3V-4.3V.

While ensuring the sufficient BATT + power supply capacity (2A load), the design shall follow:

Connect a 100uF low-ESR (less than 0.5Ω) ceramic voltage-stabilizing capacitor near the BATT +

input. Since the price of small sized high-capacity ceramic capacitor is higher, it is recommended

to replace it with a 220uF tantalum capacitor, and then connect a 0.1uF ~ 1uF ceramic capacitor.

3.2.2 1.8V Output

The M910-GL outputs a 1.8V voltage using for the internal digital circuit of the module. The

voltage is the IO level voltage of the module and can be used to indicate that the module is on or

off, or for external low current (<80mA) circuit. If it is not in use, keep it in floating status. The

logic level of V180 is defined as follows:

3.2.3 Power consumption

In the case of 3.8V power supply , the power consumption of M910-GL module is shown in the

following table:

M910-GL Hardware User Manual Page 20 of 45

Parameter

Mode

Condition

Average

Typ.Current(m

A)

I

off

Power off

Module power off

0.008

Isleep PSM

0.01

e-DRX TBD

Iidle

RRC_Idle <5mA

RRC_Connect

<42 mA

I

GPRS-RMS

CS4

GPRS

GPRS Data transfer GSM850; PCL=5; 1Rx/4Tx

513

GPRS Data transfer GSM900; PCL=5; 1Rx/4Tx

510

GPRS Data transfer DCS1800; PCL=0;

1Rx/4Tx

409

GPRS Data transfer PCS1900; PCL=0; 1Rx/4Tx

381

I

EGPRS-RMS

MCS9

EDGE

EDGE Data transfer GSM850; PCL=8; 1Rx/4Tx

437

EDGE Data transfer GSM900; PCL=8; 1Rx/4Tx

468

EDGE Data transfer DCS1800; PCL=2;

1Rx/4Tx

400

EDGE Data transfer PCS1800; PCL=2;

1Rx/4Tx

383

I

LTE-RMS

LTE FDD

LTE FDD B1 @+23dBm

Cat.M1: 222

Cat.NB1: 272

LTE FDD B2 @+23dBm

Cat.M1: 223

Cat.NB1: 304

LTE FDD B3 @+23dBm

Cat.M1: 218

Cat.NB1: 336

LTE FDD B4 @+23dBm

Cat.M1: 216

Cat.NB1: 332

LTE FDD B5 @+23dBm

Cat.M1: 224

Cat.NB1: 267

LTE FDD B8 @+23dBm

Cat.M1: 241

Cat.NB1: 275

LTE FDD B12 @+23dBm

Cat.M1: 249

Cat.NB1: 308

LTE FDD B13 @+23dBm

Cat.M1: 229

Cat.NB1: 282

LTE FDD B17 @+23dBm @NB only

Cat.NB1: 306

LTE FDD B18 @+23dBm

Cat.M1: 221

Cat.NB1: 262

M910-GL Hardware User Manual Page 21 of 45

Parameter

Mode

Condition

Average

Typ.Current(m

A)

LTE FDD B19 @+23dBm

Cat.M1: 221

Cat.NB1: 263

LTE FDD B20@+23dBm

Cat.M1: 219

Cat.NB1: 253

LTE FDD B26@+23dBm

Cat.M1: 220

Cat.NB1: 279

LTE FDD B28@+23dBm

Cat.M1: 245

Cat.NB1: 298

LTE TDD

LTE TDD B39 @+23dBm @eMTC only

Cat.M1: TBD

Pin name

I/O

Description

EMG_RST

I 33

When the module is in work, give it a Tst (150 ~ 460ms) low level,

and then pull it high, the module is reset

Note:

PSM: The M910-GL module can further reduce its own power consumption by entering the

PSM. PSM is similar to switch off, but the module is still registered on the network. After

waking up from PSM mode, the module does not need to reattach or reestablish a PDN

connection. Therefore, after the module enters the PSM, it can not immediately respond to

user requests. When the module needs to use the PSM, it will request an activity time value

during each attach and TAU process. If the network side supports PSM and accepts the

module to use the PSM, then the network confirms PSM usage by assigning the module an

activity time value. If the module wants to change the activity time value, for example

when the conditions in the module change, the module will request the desired value during

the TAU.

If the network side supports PSM, PSM function can be enabled by AT command.

Wake up the module from the PSM state as follows:

1. Pull PWRKEY pin to low level to wake up the module;

2. Wait for the timer (T3412) overflow, the module will automatically wake up.

3.3 Control Signal

The M910-GL module provides two control signals for power on/off and reset operations. The pin

definitions are as follows:

M910-GL Hardware User Manual Page 22 of 45

A_ON

I 72\79

When pulling down the level to power on, the shortest duration of

low level is 100ms, and when pulling down the level to power off,

the minimum duration is 2s

3.3.1 Module start-up

3.3.1.1.1 Start-up circuit reference

When the M910-GL module is in shutdown mode, the module will start up by pulling down A_ON for

at least 100ms. It is recommended to use open-drain drive circuit for control. The reference circuit is

shown in Figure 3-2:

Figure 3-2 Open Set Reference Start-up Circuit

Another control method is to directly control through a button, and place a TVS near the button

for ESD protection. The reference circuit is shown in Figure 3-3:

Figure 3-3 Button Start-up Reference Circuit

M910-GL Hardware User Manual Page 23 of 45

Shutdown Mode

Shutdown Method

Applicable scenarios

Low-voltage

shutdown

When BATT + powers down,

the module will shut down

The module does not shut down through normal

process, i.e. logout process from the base station

Hardware

shutdown

Pull down A_ON (more

than1. 5s)

Normal shutdown

AT shutdown

TBD

3.3.1.2 Start-up timing

The start-up timing is shown in Figure 3-4:

Figure 3-4 Start-up Timing Control Diagram

Note:

Before pulling down the A_ON pin, make sure the BATT + voltage is stable. It is

recommended that the interval between powering up BATT + and pulling down A_ON pin

should not be less than 100ms.

3.3.2 Module shutdown

The module supports the following three shutdown modes:

Figure 3-5 Shutdown Timing Control Diagram

M910-GL Hardware User Manual Page 24 of 45

3.3.2.1 Shutdown Timing

1. When the module is working properly, do not cut off the power to the module immediately to

avoid damaging the internal Flash of the module. It is strongly recommended to shut down the

module by A_ON or AT command before disconnecting the power supply.

2. When using the AT command to shut down, make sure that the A_ON is in a high level state

after the shutdown command is executed, otherwise the module will start up again after the

shutdown is completed.

3.3.3 Module reset

M910-GL module can reset by hardware and AT command.

3.3.3.1 Reset circuit

Refer to Figure 3-6 and Figure 3-7. It is similar to the start-up/shutdown control circuit. The client

can control the EMG_RST pin using an open-drain drive circuit or push button.

Figure 3-6 EMG_RST Reset Open Reference Circuit

Figure 3-7 EMG_RST Reset Button Reference Circuit

M910-GL Hardware User Manual Page 25 of 45

3.3.3.2 RESET control timing

Pin Name

I/O

Description

USB_DN

I/O

47

USB differential data bus

USB_DP

I/O

46

USB differential data bus

VBUS

I

45

USB plug detection; 1.8V input level

Figure 3-8 Reset Control Timing

Note:

RESET is a sensitive signal, so it is recommended to add a filter capacitor close to the

module. In case of PCB layout, the RESET signal lines should keep away from the RF

interference and be protected by nice Ground. Also, the RESET signal lines shall be

neither near the PCB edge nor route on the surface planes to avoid module from reset

caused by ESD problems.

Software reset: TBD

3.4 USB Interface

The M910-GL provides a USB interface that conforms to the USB 2.0 specification and supports

high-speed (480Mbps) and full-speed (12Mbps) modes. The USB interface can be used for AT

command transmission, data transmission, software debugging and software upgrades.

For more information about the USB 2.0 specification, visit http://www.usb.org/home.

3.4.1 USB interface definition

We recommend that clients reserve USB interface for software upgrades.

M910-GL Hardware User Manual Page 26 of 45

Pin Name

I/O

Description

CCRST

I/O

15

RESET Signal

CCIN

(USIM_DET)

O

17

Detect USIM/SIM card

for Hot-swap

CCIO

O

18

Data Signal

CCVCC

O

20

Power

CCCLK

I

21

Clock Signal

In the design of USB interface circuit, in order to ensure the USB performance, the following

principles are recommended in circuit design:

1) The USB data lines need to be grounded, with 90Ω impedance differential cable;

2) Do not take the USB cable under the crystal, oscillator, magnetic device or RF signal. It is

recommended to take the inner differential cable and the cable shall be grounded at all directions;

3) The model selection for ESD protection of USB data cable requires special attention, and the

parasitic capacitance must not exceed 2pF;

4) ESD protector of USB should be placed close to the USB interface.

5) As a USB plug-in testing, the input level of VBUS does not exceed 1.8V, and VBUS connects

USB USB_VBUS pin through the partial pressure resistor.

3.5 USIM Interface

M910-GL module supports the USIM card interface (1.8V and 3.0V cards).

3.5.1 USIM pin

USIM pin is shown in the following table:

3.5.2 USIM interface circuit

3.5.2.1 SIM card slot with detection signal

USIM/SIM design requires the use of SIM card slot (Fibocom recommend: SIM016-8P-220P). We

recommend using hot plug holder with SIM_DECTECT feature.

M910-GL Hardware User Manual Page 27 of 45

Figure 3-9 SIM Card Slot Diagram SIM016-8P-220P

Figure 3-10 M910-GL USIM/SIM Interface with Detection Reference Design

M910-GL Hardware User Manual Page 28 of 45

Pin Name

I/O

Description

RXD0

I

10

Serial interface RXD

CTS0

DO

11

Serial interface CTS

TXD0

O

12

Serial interface TXD

RING0

DO

13

Serial interface RI

Principles of SIM card slot with detection signal are as follows:

SIM card is plugged, CCIN is high level

SIM card is unplugged, CCIN is low level

For SIM card slot without detection signal, CCIN remains floating.

Note:

SIM card hot plug feature can be enabled by AT command for logic level control. Please

refer to the AT command manual for the specific AT command.

3.5.3 USIM design requirements

SIM card circuit design shall meet EMC standards and ESD requirements, and at the same time, it

shall improve anti-interference ability to ensure that the SIM card can work stably. The design

needs to strictly observe the following rules:  SIM card slot is placed as close to the module as possible, away from the RF antenna, DCDC

power, clock signal lines and other strong interference sources;

 Adopt the SIM card slot with metal shield shell to improve anti-interference ability;  The length of cable from the module to the SIM card slot shall not exceed 100mm. Longer

cable reduces signal quality.

 CCCLK and CCIO signals are isolated to avoid mutual interference. If it is difficult to do so,

SIM signal needs to be protected as a set;

 The filter capacitor and ESD device of SIM card signal cable are placed close to the SIM

card slot. Select 22 ~ 33pF capacitor for ESD device equivalent capacitor.

3.6 UART Interface

3.6.1 UART interface definition

M910-GL module has two serial interfaces: serial interface 0 and serial interface 1. The following

describes the main features of these two serial interfaces:

Support 4800bps, 9600bps, 19200bps, 38400bps, 57600bps, 115200bps, 230400bps,

460800bps, 921600bps baud rate, and the default baud rate is 115200bps, used for data

transmission and AT command transmission.

The following table describes the serial interface 0 pin:

M910-GL Hardware User Manual Page 29 of 45

Pin Name

I/O

Description

RTS0

DI

14

Serial interface RTS

DSR0

DO

42

Serial interface DSR

DCD0

DO

43

Serial interface DCD

DTR0

DI

44

Serial interface DTR

Pin Name

I/O

Description

TXD1

DO

29

Serial interface TXD

RXD1

DI

30

Serial interface RXD

RTS1

DI

31

Serial interface RTS

CTS1

DO

32

Serial interface CTS

Pin Name

I/O

Description

LED

O

51

TBD

The following table describes the serial interface 1 pin:

3.6.2 UART interface application

The serial interface level of M910-GL module is 1.8V. If the level of the client host system is 3.3V

or other, a level shifter shall be added to the serial interface connection between the module and

the host. The following figure shows the reference circuit design using level shifter chip:

Figure 3-11 UART Signal Connection 1

3.7 Status Indicator

M910-GL module provides a signal to indicate the operating status of the module, and status

indicator pin is shown in the following table:

LED reference circuit is shown in Figure 3-12:

M910-GL Hardware User Manual Page 30 of 45

PIN Name

I/O

PIN Num.

Description

TXDDAI

I

23

Digital voice output signal

TFSDAI

O

24

Digital voice synchronization signal

RXDDAI

I

25

Digital voice input signal

SCLK

O

26

Digital voice clock signal

Figure 3-12: M910-GL LED Reference Design Diagram

3.8 PCM/IIS

The M910-GL provides a digital voice interface for communication with digital audio devices

such as external CODECs.

RXDDAI data sends the external CODEC MIC to the DSP code channel inside the module; the

TXDDAI signal is sent from the internal DSP code channel to the external CODEC Speaker.

M910-GL main chip provides PCM/IIS signal using the mainstream European E1 standard.

3.8.1 Digital voice interface definition

3.8.2 Interface description

TBD

3.8.3 Signal description

TBD

3.9 ADC function

TBD

M910-GL Hardware User Manual Page 31 of 45

4 Antenna Interface

M910-GL provides two antenna interfaces:

 MAIN Connector50Ω impedance

 GNSS Connector50Ω impedance

4.1 Antenna design

4.1.1 Antenna RF connector

M910-GL has two antennas, led by welding plate.

Antenna is a sensitive device, susceptible to the external environment. For example, the size of the

module, the location of the antenna, the space it occupies, and the surrounding ground all may

affect antenna performance. In addition, the RF cable connecting the antenna, and the location of

the fixed antenna also may affect the performance of the antenna.

The figure below shows the reference circuit design of the main antenna and GNSS antenna.

These matches need to be placed close to the antenna:

Figure 4-1 RF Reference Circuit Design

The module has no special requirements for the type of antenna. The user can adjust the antenna

M910-GL Hardware User Manual Page 32 of 45

Network

mode

Band

Max

Min

GSM

GSM850

32.5 dBm±1dB

5dBm±3.5dB

EGSM900

32.5 dBm±1dB

5dBm±3.5dB

DCS1800

29.5dBm±1dB

0dBm±3.5dB

PCS1900

29.5dBm±1dB

0dBm±3.5dB

gain, antenna size, shape, TRP, TIS, according to the actual structure of the whole machine,

combined with the net space environment.

Figure 4-2 ANT Reference layout Design

Make sure the characteristic impedance of the transmission line is 50 ohms.

Since the antenna loss should be less than 0.3dB, keep the PCB cable as short as possible.

PCB cable should have a good reference ground to avoid other signal cable near the antenna.

Recommend a complete ground, and use this complete ground as a reference ground.

4.1.2 RF output power of M910-GL

The RF output power of M910-GL is shown in the following table.

M910-GL Hardware User Manual Page 33 of 45

Network

mode

Band

Max

Min TDD-LTE

Band39

TBD

FDD-LTE

Band1

23dBm±1dB

<-44dBm

Band2

23dBm±1dB

<-44dBm

Band3

23dBm±1dB

<-44dBm

Band4

23dBm±1dB

<-44dBm

Band5

23dBm±1dB

<-44dBm

Band8

23dBm±1dB

<-44dBm

Band12

23dBm±1dB

<-44dBm

Band13

23dBm±1dB

<-44dBm

Band18

23dBm±1dB

<-44dBm

Band19

23dBm±1dB

<-44dBm

Band20

23dBm±1dB

<-44dBm

Band26

23dBm±1dB

<-44dBm

Band28

23dBm±1dB

<-44dBm

Network mode

Band

Sensitive(dbm)

GSM(8-PSK)

GSM850

-86

EGSM900

-86

DCS1800

-86

PCS1900

-86

Network

mode

Band

Cat.M1

Sensitive/3GPP(dbm)-5MHz

Nb-iot

Sensitive/3GPP(dbm)

TDD-LTE

Band39

TBD

no support

FDD-LTE

Band1

-99.8/-102.3

-116/-107.5

Band2

-100.3/-100.3

-115.6/-107.5

Band3

-100.6/-99.3

-114.5/-107.5

Band4

-99.6/-102.3

-115.8/-107.5

Band5

-100.6/-100.8

-117.4/-107.5

4.1.3 RF receiving sensitivity of M910-GL

M910-GL Hardware User Manual Page 34 of 45

Network

mode

Band

Cat.M1

Sensitive/3GPP(dbm)-5MHz

Nb-iot

Sensitive/3GPP(dbm)

Band8

-100.9/-99.8

-116.2/-107.5

Band12

-101.9/-99.3

-118.4/-107.5

Band13

-101.2/-99.3

-117.7/-107.5

Band18

-101.2/-102.3

-117.2/-107.5

Band19

-101/-102.3

-117.2/-107.5

Band20

-101.5/-99.8

-117.3/-107.5

Band26

-100.8/-100.3

-116.7/-107.5

Band28

-101.2/-100.8

-117.5/-107.5

Network mode

Band

Receive

Transmit

GSM

GSM850

869~894

824~849

EGSM900

925~960

880~915

DCS1800

1805~1880

1710~1785

PCS1900

1930~1990

1850~1910

TDD-LTE

Band39

1880~1920

FDD-LTE

Band1

2110~2170

1920~1980

Band2

1930~1990

1850~1910

Band3

1805~1880

1710~1785

Band4

2110~2155

1710~1755

Band5

869~894

824~849

Band8

925~955

880~910

Band12

728~746

699~716

Band13

746~757

777~787

Band18

860~874.9

815~829.9

Band19

875~889.9

830~844.9

Band20

791~821

832~862

Band26

859~893.9

814~848.9

Band28

758~803

703~748

4.1.4 Operating frequency of M910-GL supported bands (MHz)

M910-GL Hardware User Manual Page 35 of 45

M910-GL module main antenna requirements

Frequency range

It shall use the most suitable antenna to adapt

4.2 Antenna Design

4.2.1 Antenna design requirements

1) Antenna efficiency

Antenna efficiency is the ratio of antenna input power to radiated power. Due to the antenna return

loss, material loss, and coupling loss, the radiated power is always lower than the input power.

Recommend> 40% (-4dB).

2) S11 or VSWR

S11 shows that the matching degree of the antenna’s 50 ohm impedance, to a certain extent,

affects the antenna efficiency. VSWR test methods can be used to measure this parameter.

Recommend S11 <-10dB.

3) Polarization

Polarization is the rotation direction of the electric field in the maximum radiation direction of the

antenna.

It is recommended to use linear polarization.

4) Radiation pattern

Radiation pattern refers to the antenna’s electromagnetic field strength in the far field in all

directions. Half-wave dipole antenna is the most suitable terminal antenna. For built-in antenna,

PIFA antennas or IFA antennas are recommended:

Antenna area: 6mm high*10mm wide*100mm long.

Antenna radiation direction: Omni_directional.

5) Gain and directivity

Antenna directivity refers to the electromagnetic field strength of electromagnetic wave in all

directions. Gain is a collection of antenna benefits and antenna directivity.

Recommended antenna gain ≤2.5dBi.

6) Interference

In addition to the antenna performance, other interferences on the PCB also may affect the

performance of the module. In order to ensure the high performance of the module, interference

must be controlled. Suggestions: For example, LCD, CPU, FPC cable, audio circuit, power supply

should be as far as possible away from the antenna, and make the appropriate isolation and

shielding, or filtering on the path.

7) Antenna index requirements

M910-GL Hardware User Manual Page 36 of 45

M910-GL module main antenna requirements

to the relevant frequency band

Bandwidth (GPRS/EDGE

）

Bandwidth (LTE)

Impedance

50 ohms

Input power

Standing wave ratio recommended

Parameter

Description

Min

Typ

Max

Unit

5 Electrical Characteristics

5.1 Limiting voltage range

The limiting voltage range refers to the power voltage of the module and the maximum voltage

range that the digital and analog input/output interface can withstand. Working outside this range

may cause damage to the product.

The voltage range of M910-GL is shown in the following table.

M910-GL Hardware User Manual Page 37 of 45

Parameter

Description

Min

Typ

Max

Unit

BATT+

Power supply

3.3

3.8

4.3 V RMS average supply current

0 0.5

A

The IVBAT peak current may

reach 2A (power transmission

at each 4.6ms slot) at the

instantaneous voltage drop in

each time slot

400

mV GPIO Digital IO level supply

voltage

-0.3

1.8

2.0

V

Supply voltage in shutdown

mode

-0.25

0.25

V Temperature

Min

Typ

Max

Unit

Operating

temperature

-30

25

75 ℃ Limited operating

temperature

-40 85

℃

Storage temperature

-40 85

℃

Signal VL

VH

Unit Min

Max

Min

Max

5.2 Environment temperature range

M910-GL module is recommended to operate at -30~+75℃. It is recommended that the

application uses temperature control measures under harsh environmental conditions. At the same

time, the limited operating temperature range of the module should be provided. Under these

temperature conditions, some RF parameters may exceed the limit. It is recommended that the

module application terminal be stored in certain temperature conditions. Modules outside this

range may not operate or may be damaged.

5.3 Electrical characteristics of the interface in

operating status

VL: logic low level;

VH: logic high level;

M910-GL Hardware User Manual Page 38 of 45

Digital

input

-0.3

0.3*Vpin_min

0.3*Vpin_max

Vpin_max

V

Digital

output

GND

0.2

Vpin_min-0.2

Vpin

V Parameter

I/O

Min

Typ

Max

Unit

BATT+

I

3.3

3.8

4.3

V

CCVCC

O

1.7/2.75

1.8/2.85

1.9/2.95

V

Test items

Test conditions

Low

temperature

storage test

Temperature -40℃±3 ℃, 24 hours in shutdown state

High

temperature

storage test

Temperature +85℃±3 ℃, 24 hours in shutdown state

Temperature

shock test

In shutdown state, 0.5 hour at -40℃ and +85℃ environment respectively,

the temperature conversion time <3min, for 24 cycles

High

temperature

and humidity

test

Temperature +85℃±3 ℃, humidity 90 ~ 95% RH, 24 hours in shutdown state

Low

temperature

operating test

Temperature -30℃±3 ℃, 24 hours in operating state

High

temperature

operating test

Temperature +75℃±3 ℃, 24 hours in operating state

Vibration test

Conduct vibration test according to the requirements shown in the table

below:

Frequency

Random vibration ASD (Acceleration Spectral

Density)

5~20Hz

0.96m2/s

3

Note: Vpin_min = 1.45V, Vpin_max = 2.0V (Vpin is digital interface high level, Vpin = 1.8V)

5.4 Environmental reliability requirements

M910-GL Hardware User Manual Page 39 of 45

Test items

Test conditions

20~500Hz

0.96m2/s3(20Hz), other -3dB/octave

Connector life

test

50 times of insertion/removal for board to board connector interface; 30 times

of insertion/removal for RF antenna interface cable

ESD test

1 Test module antenna interface, power PAD and large ground area in call

state, ESD should meet the following conditions:

1) Contact discharge should pass ± 0.5KV test

2) Air discharge should pass ± 2KV test

2. Test EVB SIM card slot while the module is in shutdown state, ESD should

meet the following conditions:

1) Contact discharge should pass ± 0.5KV test

2) Air discharge should pass ± 2KV test

Part

Air discharge

Contact discharge

BATT+,GND

±2KV

±0.5KV

Antenna port

± 8KV

Other port

±2KV

±0.5KV

5.5 ESD characteristics

M910-GL is a consumer product. Although the design of the module has considered the ESD issue

and provided ESD protection, the ESD issue may occur in the transport and secondary

development, so developers should consider ESD protection for the final product. In addition to

considering anti-static treatment for packaging, please refer to recommended circuit for interface

design in the document for client’s application.

Refer to the following table for the ESD allowable discharge range of the M910-GL module.

M910-GL Hardware User Manual Page 40 of 45

6 Structure Specification

6.1 Product Appearance

The product appearance for M910-GL module is shown in Figure 6-1 and Figure 6-2:

Figure 6-1 Module Product Appearance (Top)

Figure 6-2 Module Product Appearance (Bottom)

M910-GL Hardware User Manual Page 41 of 45

6.2 Dimension of Structure

The structural dimension of the M910-GL module is shown in Figure 6-3:

Figure 6-3 Dimension of Structure (Unit: mm)

6.3 SMT Patch

For module steel net design, please refer to SMT Application Design Instructions for the solder

paste and furnace temperature control.

6.4 Storage

6.4.1 Storage life

M910-GL is shipped in a vacuum-sealed bag. The module storage should follow the following

conditions:

M910-GL Hardware User Manual Page 42 of 45

1. If the ambient temperature is below 40°C and the air humidity is less than 90%, the module can

be stored in a vacuum-sealed bag for 12 months.

2. When the vacuum-sealed bag is opened, if the following conditions are met, the module can be

directly re-soldered or go through other high temperature process:

Air humidity for module storage is less than 10%.

The module ambient temperature is below 30°C, air humidity less than 60%, and the factory

completes patch within 168 hours.

6.4.2 Baking

If the module is in the following conditions, it needs to be baked before patching:

1. When the ambient temperature is 23°C (±5°C allowed), the humidity indicator shows that the

humidity is more than 10%.

2. When the vacuum-sealed bag is opened, the module’s ambient temperature is below 30°C, air

humidity is less than 60%, but the factory failed to complete the patch within 168 hours

3. When the vacuum-sealed bag is opened, the air humidity for module storage is more than 10%.

4. If the baking is required, bake the module for 48 hours at 125°C (±5°C allowed).

Note:

The package of the module cannot withstand high temperature baking. Therefore, please

remove the module package before the module is baked.

6.5 Packaging

M910-GL module adopts tray sealed vacuum packaging, combined with the outer packaging

method using the hard carton box, so that the storage, transportation and the usage of modules can

be protected to the greatest extent.

Note:

The vacuum bag contains desiccant. The module is a moisture-sensitive device, with the

moisture sensitive level 3, and it is in line with the standards of the JEDEC. Please avoid

permanent damage to the product caused by moisture.

The module is a precision electronic product, and may suffer permanent damage if no

correct electrostatic protection measures are taken.

M910-GL Hardware User Manual Page 43 of 45

6.5.1 Tape packaging

No.

Name

Description

Quantit y

Confor

m to

RoHS

1

Module

Product module

2

M910-GL_Inne

r box label

Dimension (mm)

1 for each reel, 1 for each antistatic bag, 1

for each inner box

3

M910-GL_Oute

r box label

Dimension (mm), 1 for Outer box

4

Tape

1 for each inner box

5

Reel

Dimension of the reel centering hole must

match with SMT machine feeder area

6

Tape seal sticky

tape

1 for each inner box

7

Humidity card

Four-point humidity card, 1 for each reel

8

Silica desiccant

General silica desiccant, 3 bags per reel

Figure 6-4 Tape Packaging Flowchart

6.5.2 Packaging list (TBD)

M910-GL Hardware User Manual Page 44 of 45

No.

Name

Description

Quantit y

Confor

m to

RoHS

9

Anti-static bag

Anti-static vacuum bag, with silk anti-static

and moisture-sensitive warning signs

10

Inner box

Dimension: 340×340×75mm

11

Outer box

Dimension 365×330×365mm

12

Sealing label

1 for each inner box, 2 for outer box

13

Sealing tape

_BOPP_transparent

M910-GL Hardware User Manual Page 45 of 45

Fibocom Wireless M910GL Users Manual

Specifications and Main Features

Frequently Asked Questions

User Manual